Liquid discharge head and manufacturing method for the same

Abstract

To provide a liquid discharge head that secures a flexible area necessary for a flexible film to function as a damper and also has adhesiveness between a substrate and the flexible film, and a manufacturing method for the same.SOLUTION: A liquid discharge head 10 comprises a discharge port 22, a pressure generating element 19, a pressure chamber 23, a damper film 13, and a damper substrate 11 having a concave part 15. The damper film 13 is made to adhere to the damper substrate 11 by an adhesive 14 to cover the concave part 15. The adhesive 14 protrudes from an adhesive surface between the damper film 13 and the damper substrate 11 into the concave part 15. A width of the adhesive protruding into a long side of the damper film 13, of the adhesive 14 protruding into the concave part 15 is smaller than a width of the adhesive protruding into a short side of the damper film 13.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a liquid ejection head and a manufacturing method thereof. [Background technology]

[0002] As a liquid ejection device, for example, an inkjet recording device is a device that ejects liquid (ink) from the ejection ports of a liquid ejection head to print on a medium. For example, a piezoelectric liquid ejection device displaces a vibration plate by a piezoelectric element installed via a vibration plate at a position facing a pressure chamber communicating with the ejection port, and ejects liquid from the ejection port by varying the volume of the pressure chamber. The vibration of this vibration plate is transmitted to adjacent ejection ports through the liquid in the liquid flow path, which is called crosstalk, and this may cause liquid ejection failure from adjacent ejection ports. In order to reduce the effect of crosstalk, there are methods that use a damper and methods that perform delay control to shift the timing of ejection. For example, Patent Document 1 proposes a liquid ejection head with a damper structure. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2006-095725 A Summary of the Invention [Problem to be solved by the invention]

[0004] Patent Document 1 discloses a damper structure in which a flexible film is bonded onto an opening with an adhesive. When considering the case where the adhesive overflows into the opening, the overflowing end of the adhesive becomes the fixed end of the flexible film, and determines the flexible area of ​​the flexible film. When the damper area is reduced in accordance with the high density of the discharge port arrangement of the liquid discharge head, there is a problem that the flexible area of ​​the flexible film becomes narrower due to the overflowing part of the adhesive. In particular, the shorter side of the damper recess width is more susceptible to the effect of adhesive overflow because the ratio of the overflow width of the adhesive to the recess width is larger on the shorter side than on the longer side.

[0005] On the other hand, because the flexible film vibrates up and down as a damper, if there is no overflow of the adhesive, the contact area between the substrate and the flexible film via the adhesive decreases. For this reason, there are concerns about the adhesion between the substrate and the flexible film, especially when there is no structure to hold down the flexible film on the opposite side to the opening of the damper structure.

[0006] In view of the above problems, the present invention has an object to provide a liquid ejection head that ensures a flexible area necessary for the flexible film to function as a damper while also providing adhesion between the substrate and the flexible film, and a method for manufacturing the same. [Means for solving the problem]

[0007] In order to solve the above problems, the present invention provides a liquid ejection head having an ejection port for ejecting liquid, a pressure generating element that generates pressure for ejecting liquid from the ejection port, a pressure chamber on which the pressure of the pressure generating element acts, a damper membrane for suppressing vibration of the liquid in the pressure chamber, and a damper substrate having a recess for allowing the damper membrane to flex, wherein the damper membrane is adhered to the damper substrate with an adhesive so as to cover the recess, the adhesive protrudes into the recess from the bonding surface between the damper membrane and the damper substrate, and the width of the adhesive protruding into the recess on the long side of the damper membrane is smaller than the width of the adhesive protruding on the short side of the damper membrane. Effect of the Invention

[0008] According to the present invention, it is possible to provide a liquid ejection head that ensures a flexible area required for the flexible film to function as a damper while also providing adhesion between the substrate and the flexible film, and a method for manufacturing the same. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view showing a liquid ejection head according to a first embodiment. [Diagram 2] 1 is a cross-sectional view of a liquid ejection head according to a first embodiment. [Diagram 3] 1 is a plan view of a flexible film of a liquid ejection head according to a first embodiment, viewed from the ejection port side. [Figure 4] 1 is a plan view of a flexible film of a liquid ejection head according to a first embodiment, viewed from the ejection port side. [Diagram 5] 5 is a cross-sectional view of an adhesive protruding from an inner end of a first recess of the liquid ejection head according to the first embodiment. FIG. [Figure 6] 11A and 11B are a plan view and a cross-sectional view of a method for manufacturing a liquid ejection head substrate according to a second embodiment. [Figure 7] 10A to 10C are diagrams illustrating an adhesive transfer step in a manufacturing method for a liquid ejection head substrate according to a second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the present invention will be described in detail.

[0011] (First embodiment) A liquid ejection head according to the first embodiment will be described with reference to the perspective view of FIG. 1. The liquid ejection head 10 has a plurality of pressure chambers 23 each communicating with a plurality of ejection ports 22, and a plurality of individual flow paths 17 each communicating with each of the pressure chambers. The pressure chamber is a space in which the pressure of a pressure generating element that generates a pressure for ejecting liquid acts. The individual flow paths 17 are formed in a pressure generating substrate 35. On the opposing surfaces of the individual flow paths 17, a flexible film (also called a damper film) 13 is bonded via an adhesive (not shown) so as to cover the first recessed portion 15 extending along the row direction of the individual flow paths 17, sandwiching a common flow path 18 communicating with the individual flow paths 17. The damper film is for suppressing vibration of the liquid in the pressure chamber. The recessed portion is arranged to face the common flow path 18. That is, the damper film suppresses vibration of the liquid in the pressure chamber by suppressing vibration of the liquid in the common flow path. The liquid discharged from the liquid discharge head 10 is supplied to the pressure chamber 23 through the individual flow path 17 from the liquid supply flow path 24 through the common flow path 18. The liquid discharge head 10 displaces the vibration plate 20 by a piezoelectric element 19 installed via the vibration plate 20 at a position facing the pressure chamber 23, and discharges the liquid from the discharge port 22 by varying the volume of the pressure chamber 23. A discharge port array consisting of a plurality of discharge ports 22 arranged in the Y direction is formed on the discharge port substrate 21. The flexible film 13 functions as a damper for suppressing the vibration of the vibration plate 20 from being transmitted to the adjacent pressure chamber 23 through the liquid in the common flow path 18 when discharging the liquid. As shown in FIG. 1, the recess is formed along the arrangement direction of the discharge ports. In addition, the recess is formed over the entire area of ​​the common flow path. In the description of this embodiment, a piezoelectric element is used as an example of a pressure generating element that generates pressure for discharging the liquid from the discharge port, but a heating element (heater) that heats the liquid may also be used.

[0012] FIG. 2 is a schematic cross-sectional view of the liquid ejection head 10 of FIG. 1, in which (a) shows an XZ cross section in a direction approximately perpendicular to the row direction of the ejection ports 22 (ejection port row direction) and the row direction of the individual flow paths 17, and (b) shows a YZ cross section in a direction approximately parallel to the row direction of the individual flow paths 17.

[0013] FIG. 2(a) shows a cross section in the short direction of the first recess 15 as a recess for the damper to bend, and the first recess 15 has an inner end portion to which the flexible film 13 is bonded via the adhesive 14 so as to cover the first recess 15, and has an overflowing portion 16 of the adhesive 14. The overflowing portion 16 is the adhesive that overflows into the recess from the bonding surface between the damper substrate and the damper film. The overflowing portion 16 is in contact with the flexible film 13 and the inner wall of the first recess 15. FIG. 2(b) shows a cross section in the long direction of the first recess 15, and the first recess 15 has an inner end portion to which the flexible film 13 is bonded via the adhesive 14 so as to cover the first recess 15, and has an overflowing portion 25 of the adhesive 14. The overflowing portion 25 is in contact with the flexible film 13 and the inner wall of the first recess 15. Comparing the widths of the protruding portions 16 and 25 that contact the flexible film 13, the protruding portion 25 is formed to be larger.

[0014] In the short-side direction of the first recess 15 in FIG. 2(a), the width of the protruding portion 16 is narrowed to ensure the necessary flexible region 12, while the protruding portion 16 is long in the extension direction of the first recess 15, so that the adhesion between the substrate 11 and the flexible film 13 can be ensured. In other words, the width of the adhesive protruding to the long side of the flexible film 13 is narrowed. On the other hand, in the long-side direction of the first recess 15 in FIG. 2(b), the width of the flexible region 12 is long, so that the width of the protruding portion 25 is widened compared to the short-side direction to ensure the adhesion between the substrate 11 and the flexible film 13. In other words, the width of the adhesive protruding to the short side of the flexible film 13 is widened. That is, in this embodiment, the width of the adhesive protruding to the long side of the flexible film 13 is narrowed smaller than the width of the adhesive protruding to the short side of the flexible film 13.

[0015] 3 is a plan view of the flexible film 13 of the liquid ejection head 10 as seen from the ejection port 22 side. The flexible film 13 is adhered via an adhesive (not shown) so as to straddle the first recess 15, and has adhesive protrusions 16, 25 on the inside of the first recess 15 at the short-side and long-side ends of the first recess 15, respectively. The adhesive protrusions 16, 25 become fixed ends of the flexible film 13 and determine the flexible region 12.

[0016] The width 26 of the adhesive protrusion 16 in the short side direction inside the first recess 15 is smaller than the width 27 of the protrusion 25 in the long side direction. S The width of the protruding portion 16 in the short side direction (the width of the adhesive protruding on the long side of the flexible film) is H S When this is done, 2H S / M S It is preferable that 2H be 0.2 or less. This is because the flexible region 12 of the flexible film 13 can be sufficiently secured by doing so. S / M S It is more preferable that 2Hs / Ms is 0.1 or less. Even if the protruding portion 16 in the short-side direction of the first recess 15 is different at both ends, the average of the protruding widths at both ends is Hs, and it is more preferable that 2Hs / Ms is 0.2 or less, and it is even more preferable that 2Hs / Ms is 0.1 or less. In addition, when the flexible region width 29 of the flexible film 13 in the short-side direction of the first recess 15 is D S (=Ms-2Hs), the width of the protruding portion 16 of the first recess 15 in the short side direction is H S Then, D S Ds / Ms of 0.8 or more is preferable because this ensures a sufficient flexible region 12 of flexible film 13. Furthermore, Ds / Ms of 0.9 or more is even more preferable. Even when protruding portion 16 in the short-side direction of first recess 15 is different at both ends, for example, Ds / Ms is preferably 0.8 or more, and more preferably 0.9 or more, where Hs is the average of the protruding widths at both ends.

[0017] FIG. 4 is a plan view of the flexible film 13 of the liquid ejection head 10 seen from the ejection port 22 side, and shows a wider area than the plan view shown in FIG. 3. The first recess 15 has a second recess 30 adjacent thereto in a direction substantially parallel to the longitudinal direction, and a third recess 31 adjacent thereto in a direction substantially perpendicular to the longitudinal direction. Comparing the interval 32 between the first recess 15 and the second recess with the interval 33 between the first recess 15 and the third recess 30, the interval 33 is formed larger. When the flexible film 13 is bonded to the first recess 15 via an adhesive (not shown), the adhesive is crushed and a protruding portion is formed inside the first recess 15. The amount of adhesive on the interval between the recesses before being crushed is greater in the interval 33 where the interval between the recesses is wider. Therefore, the width of the overflow portion formed by squeezing the adhesive is greater in width 27 of the overflow portion 25 in the longitudinal direction than in width 26 of the overflow portion 16 in the lateral direction of the first recess 15. Thus, the adhesive overflow width is reduced at the lateral end of the damper recess, ensuring the necessary flexible region 12, while the adhesive overflow portion is long in the extension direction of the recess, ensuring adhesion between the substrate and the flexible film. On the other hand, the longitudinal end of the damper recess is less sensitive to damping performance than the lateral side, so the adhesive overflow width is increased to ensure adhesion between the substrate and the flexible film, while ensuring the necessary flexible region 12.

[0018] 5 shows a schematic cross-sectional view of the adhesive protruding to the inside of one end of the first recess 15 for the flexible film 13 adhered to the first recess 15 via the adhesive, with FIG. 5(a) showing the end in the short direction and FIG. 5(b) showing the end in the long direction. The protruding parts 16, 25 of the adhesive are rounded so that a substantially circular shape is inscribed in the inside of the first recess 15, straddling the side wall of the first recess 15 and the flexible film 13. In other words, the protruding adhesive has a curved surface. Regarding the radius of this inscribed circle, the radius of curvature in the short direction of the first recess 15 shown in FIG. 5(a) (the adhesive protruding to the long side of the damper film) is defined as R S , the radius of curvature in the longitudinal direction (adhesive protruding onto the short side of the damper membrane) is R L Then, R L / R S>1. By having the cross-sectional shape of the overflow of the adhesive 14 as described above, the short ends of the damper recess can ensure the necessary flexible area by reducing the adhesive overflow width, while the adhesive overflow is long in the extension direction of the recess, so that the adhesion between the substrate and the flexible film can be ensured. On the other hand, the long ends of the damper recess are less sensitive to damping performance than the short sides, so the adhesive overflow width can be increased to ensure adhesion between the substrate and the flexible film, while the necessary flexible area can be ensured.

[0019] The substrate constituting the liquid ejection head 10 may be, for example, a single crystal silicon substrate. The means for forming the recesses and openings in the substrate may be, for example, dry etching. The first recesses 15 may be formed with a communication port that communicates with the lower surface side of the substrate 11. A protective film (not shown) may be formed on the surface of the liquid ejection head 10 that comes into contact with the liquid. The flexible film 13 may be made of a resin material such as polyimide, polyamide, polyamideimide, or epoxy. The means for forming the openings in the flexible film 13 may be dry etching, or when the flexible film 13 is made of a photosensitive resin, the openings may be formed by photolithography.

[0020] The adhesive may be, for example, epoxy, acrylic, urethane, silicone, benzocyclobutene, polyimide, polyamide, polyamideimide, cyanoacrylate, phenol, melamine, styrene, cyclized rubber, or a mixture of these.

[0021] As described above, according to this embodiment, the liquid ejection head can ensure a necessary flexible area while also providing adhesion between the substrate (flow path substrate) and the flexible film.

[0022] Second embodiment A method for manufacturing a liquid ejection head substrate according to the second embodiment will be described with reference to Fig. 6. As shown in Fig. 6(a), a substrate 11 is prepared on which a first recess 15, a second recess 30, and a third recess 31 are formed. The thickness of the substrate 11 is, for example, 400 to 725 µm. Note that the recess 15 may have a through hole (not shown) formed therein that communicates with the lower surface side of the substrate 11.

[0023] As shown in FIG. 6(b), the adhesive 14 is applied to the upper surface of the substrate 11, such as the beam portion between the first recess 15 and the second recess 30 of the substrate 11 and the beam portion between the first recess 15 and the third recess 31. The adhesive 14 is formed, for example, by the adhesive transfer method shown in FIG. 7. In the adhesive transfer method, the adhesive 14 formed on the film 35 is brought into contact with the surface of the substrate 11 on which the first recess 15 is formed by a roller 37, and then the film 35 is peeled off from the surface of the substrate 11 in the direction of the arrow 36. Then, the adhesive is transferred so that a part of the adhesive remains on the substrate surface. According to this method, the adhesive is not transferred onto the recess 15, but is transferred only to the surface of the substrate 11 including the beam portion around the recess 15. According to this method, the adhesive 14 can be formed up to the end of the recess 15, so that in the process of laminating the flexible film 13 shown in FIG. 6(c), the adhesive 14 can be crushed to form a protruding portion of the adhesive 14 inside the first recess 15. In addition, when comparing the amount of adhesive transferred onto the beam portion between the first recess 15 and the second recess 30 and the beam portion between the first recess 15 and the third recess 31, the amount of adhesive transferred onto the beam portion between the first recess 15 and the third recess 31, where the beam width is wider, is relatively greater because the average film thickness is approximately the same. In addition, the adhesive shown in the first embodiment can be used.

[0024] As shown in FIG. 6(c), the flexible film 13 is laminated (attached) to the substrate 11 via the adhesive 14. The scanning direction 34 of the laminating roller (not shown) is a direction substantially parallel to the longitudinal direction of the first recess 15. At this time, the substrate stage (not shown) that holds the substrate 11 and the laminating roller are heated to soften the adhesive 14, and the flexible film 13 is laminated to the substrate 11 while applying a load to the laminating roller. The laminating atmosphere may be a vacuum or may be in the air. In the softened state, the adhesive 14 flows while being pushed out by the laminating roller through the flexible film 13, so that the flowed adhesive 14 overflows into the first recess 15. At this time, the overflow width of the adhesive 14 is larger in the longitudinal direction of the first recess 15, which is substantially parallel to the scanning direction 34 of the laminating roller, than in the transverse direction, because the adhesive is pushed out in that direction. Furthermore, as described above, due to the relationship of the volume of the adhesive depending on the interval between the second recess 30 and the third recess 31 relative to the first recess 15, the adhesive overflow width can be made wider in the longitudinal direction of the first recess, which is approximately parallel to the scanning direction 34 of the laminating roller, than in the lateral direction. Therefore, in the lateral direction of the damper recess, the necessary flexible area can be secured by reducing the width 26 of the overflowing part of the adhesive 14, while the overflowing part of the adhesive 14 is long in the extension direction of the first recess 15, so that the adhesion between the substrate and the flexible film can also be secured. On the other hand, since the longitudinal end of the damper recess is less sensitive to the damping performance than the lateral side, the width of the overflow 27 of the adhesive 14 can be increased to secure the adhesion between the substrate 11 and the flexible film 13 while also securing the necessary flexible area.

[0025] In the case where the flexible film 13 is a film having different linear expansion coefficients in a plane, the planar direction in which the flexible film 13 has a larger linear expansion coefficient may be laminated approximately parallel to the stretching direction of the first recess 15. For example, in the case where the linear expansion coefficient of the flexible film 13 is larger in the MD (machine direction) direction than in the TD (transverse) direction, the flexible film 13 may be laminated approximately parallel to the scanning direction 34 of the tenting roller. When laminating the flexible film, the tenting roller to which heat and load are applied slightly stretches the flexible film in the scanning direction of the tenting roller. Then, in the process of returning the flexible film to room temperature after lamination, the flexible film shrinks according to the linear expansion coefficient. Therefore, the adhesive protrudes into the inside of the first recess according to the contraction of the flexible film. Therefore, the protruding width of the adhesive in the first recess 15 can be made larger in the longitudinal direction of the first recess, which is the scanning direction of the laminating roller, than in the transverse direction. Therefore, in the short-side direction of the damper recess, the width of protruding portion 16 of adhesive 14 is reduced to ensure the necessary flexible region, while the adhesion between the substrate and the flexible film is also ensured because protruding portion 16 of adhesive 14 is long in the extension direction of first recess 15. On the other hand, the long-side end of the damper recess is less sensitive to damping performance compared to the short-side side, so the width 27 of protruding portion of adhesive 14 is increased to ensure the adhesion between substrate 11 and flexible film 13, while also ensuring the necessary flexible region.

[0026] As described above, according to the above-mentioned manufacturing method, the adhesive overflow width can be made smaller in the short direction than in the long direction at the inner end of the first recess, which makes it possible to provide a manufacturing method for a liquid ejection head substrate that can ensure the necessary flexible area while ensuring the adhesion between the flow path substrate and the flexible film.

[0027] A liquid discharge head using the liquid discharge head substrate manufactured by the above manufacturing method is manufactured by a general method. EXAMPLES

[0028] The liquid ejection head according to the first embodiment will be described with reference to FIG.

[0029] The liquid ejection head 10 has a plurality of ejection ports 22, a plurality of pressure chambers 23 each communicating with the plurality of ejection ports 22, and a plurality of individual flow paths 17 each communicating with the plurality of pressure chambers 23. The widths of the overflowing portions 16, 25 of the adhesive 14 were measured at a plurality of locations and averaged to find that the lengthwise end of the first recess 15 was 60 um wide and the widthwise end was 30 um wide, meaning that the overflow width at the widthwise end was smaller.

[0030] Therefore, according to the present invention, it is possible to provide a liquid ejection head that can ensure the necessary flexible area while ensuring the close contact between the flow path substrate and the flexible film. EXAMPLES

[0031] A method for manufacturing a liquid ejection head substrate according to the second embodiment will be described with reference to FIG.

[0032] A liquid ejection head substrate 11 was manufactured by a method similar to that shown in the second embodiment. A substrate having a first recess 15 was prepared. The substrate 11 was made of single crystal silicon, had a substrate thickness of 625 um, and had a width in the short side direction of the first recess 15 of 800 um. The process of transferring the adhesive to the surface of the first recess 15 was formed by using the transfer method shown in the second embodiment. In the lamination process of the flexible film 14, the scanning direction of the lamination roller was aligned with a direction approximately parallel to the longitudinal direction of the first recess. The widths of the adhesive overflowing portions 16 and 25 overflowing inside the first recess 15 of the liquid ejection head substrate 11 were measured at multiple points and the average value was calculated. The width of the adhesive overflowing portion was 80 um at the end in the long side direction of the first recess 15 and 40 um at the end in the short side direction, and the overflow width to the end in the short side direction was smaller.

[0033] Therefore, according to the present invention, the overflow width of the adhesive can be made smaller in the short direction of the inner end of the first recess than in the long direction, so that a manufacturing method for a substrate for a liquid ejection head can be provided that can ensure the necessary flexible area while ensuring adhesion between the flow path substrate and the flexible film.

[0034] The present invention includes the following configurations.

[0035] (Configuration 1) A discharge port for discharging liquid; a pressure generating element that generates pressure for ejecting liquid from the ejection port; a pressure chamber to which the pressure of the pressure generating element acts; a damper film for suppressing vibration of the liquid in the pressure chamber; a damper substrate having a recess for allowing the damper film to flex; In a liquid ejection head having the damper film is bonded to the damper substrate with an adhesive so as to cover the recess; the adhesive protrudes into the recess from an adhesive surface between the damper film and the damper substrate, A liquid ejection head, characterized in that, of the adhesive that protrudes into the recess, a width of the adhesive that protrudes onto a longer side of the damper film is smaller than a width of the adhesive that protrudes onto a shorter side of the damper film.

[0036] (Configuration 2) an ejection port substrate having a plurality of the ejection ports and a plurality of the pressure chambers; a pressure generating substrate having the pressure generating element; and The pressure generating substrate is provided with individual flow paths formed for each of the pressure chambers, and a common flow path communicating with the individual flow paths; the damper substrate is disposed on a side of the pressure generating substrate where the common flow path is formed, such that the recess faces the common flow path, 2. The liquid ejection head according to configuration 1, wherein the damper film faces the common flow path.

[0037] (Configuration 3) 3. The liquid ejection head according to configuration 2, wherein the damper film suppresses vibration of the liquid in the common flow channel, thereby suppressing vibration of the liquid in the pressure chamber.

[0038] (Configuration 4) The liquid ejection head according to any one of configurations 1 to 3, wherein the recesses are formed along the arrangement direction of the ejection ports.

[0039] (Configuration 5) 3. The liquid ejection head according to configuration 2, wherein the recess is formed over the entire area of ​​the common flow path.

[0040] (Configuration 6) The width of the short side of the recess is M S The width of the adhesive protruding from the long side of the damper film is H S Then, 2H S / M S 6. The liquid ejection head according to any one of configurations 1 to 5, wherein is 0.2 or less.

[0041] (Configuration 7) The width of the short side of the recess is M S The width of the adhesive protruding from the long side of the damper film is H S Then, 2H S / M S 6. The liquid ejection head according to any one of configurations 1 to 5, wherein is 0.1 or less.

[0042] (Configuration 8) The width of the short side of the recess is M S , the width of the flexible region in the short direction of the damper film is D S Then, D S / M S 8. The liquid ejection head according to any one of configurations 1 to 7, wherein is 0.8 or more.

[0043] (Configuration 9) The width of the short side of the recess is M S , the width of the flexible region in the short direction of the damper film is D S Then, D S / M S 8. The liquid ejection head according to any one of configurations 1 to 7, wherein is 0.9 or more.

[0044] (Configuration 10) The adhesive protruding into the recess has a curved surface, The radius of curvature of the adhesive protruding from the long side of the damper film is R. S The radius of curvature of the adhesive protruding from the short side of the damper film is R L Then, R L / R S 10. The liquid ejection head according to any one of configurations 1 to 9, wherein >1.

[0045] (Configuration 11) A damper film for suppressing vibration of the liquid; a damper substrate having a recess for allowing the damper film to flex; A method for manufacturing a liquid ejection head substrate comprising: applying an adhesive to the damper substrate; attaching the damper film to the damper substrate so as to cover the recess; having In the attaching step, the damper film is attached to the damper substrate by scanning a laminating roller; A method for manufacturing a substrate for a liquid ejection head, wherein the laminating roller scans along the longitudinal direction of the damper film.

[0046] (Configuration 12) A method for manufacturing a liquid ejection head according to configuration 11, in which, when the linear expansion coefficient of the damper film varies within the plane of the damper film, the laminating roller is scanned in a state in which the direction of the larger linear expansion coefficient of the damper film is aligned with the longitudinal direction of the recess.

[0047] (Configuration 13) A discharge port for discharging liquid; a pressure generating element that generates pressure for ejecting liquid from the ejection port; a pressure chamber to which the pressure of the pressure generating element acts; a damper film for suppressing vibration of the liquid in the pressure chamber; a damper substrate having a recess for allowing the damper film to flex; A method for manufacturing a liquid ejection head comprising the steps of: applying an adhesive to the damper substrate; attaching the damper film to the damper substrate so as to cover the recess; having In the attaching step, the damper film is attached to the damper substrate by scanning a laminating roller; The method for manufacturing a liquid ejection head, wherein the laminating roller scans along the longitudinal direction of the damper film.

[0048] (Configuration 14) A method for manufacturing a liquid ejection head according to configuration 13, in which, when the linear expansion coefficient of the damper film varies within the plane of the damper film, the laminating roller is scanned in a state in which the direction of the larger linear expansion coefficient of the damper film is aligned with the longitudinal direction of the recess. [Explanation of symbols]

[0049] 10 Liquid ejection head 11 Damper board 13 Damper membrane 14 Adhesive 15 Recess 19 Pressure generating element 22 Outlet 23 Pressure Chamber

Claims

1. A discharge port for discharging liquid; a pressure generating element that generates pressure for ejecting liquid from the ejection port; a pressure chamber to which the pressure of the pressure generating element acts; a damper film for suppressing vibration of the liquid in the pressure chamber; a damper substrate having a recess for allowing the damper film to flex; In a liquid ejection head having the damper film is bonded to the damper substrate with an adhesive so as to cover the recess; the adhesive protrudes into the recess from an adhesive surface between the damper film and the damper substrate, A liquid ejection head, characterized in that, of the adhesive that protrudes into the recess, a width of the adhesive that protrudes onto the longer side of the damper film is smaller than a width of the adhesive that protrudes onto the shorter side of the damper film.

2. an ejection port substrate having a plurality of the ejection ports and a plurality of the pressure chambers; a pressure generating substrate having the pressure generating element; and The pressure generating substrate is provided with individual flow paths formed for each of the pressure chambers, and a common flow path communicating with the individual flow paths; the damper substrate is disposed on a side of the pressure generating substrate on which the common flow path is formed, and the recess is disposed opposite the common flow path, The liquid ejection head according to claim 1 , wherein the damper film faces the common flow path.

3. The liquid ejection head according to claim 2 , wherein the damper film suppresses vibrations of the liquid in the common flow channel, thereby suppressing vibrations of the liquid in the pressure chamber.

4. The liquid ejection head according to claim 1 , wherein the recesses are formed along a direction in which the ejection ports are arranged.

5. The liquid ejection head according to claim 2 , wherein the recess is formed over the entire area of ​​the common flow path.

6. The width of the short side of the recess is M Ｓ The width of the adhesive protruding from the damper film on the long side is H Ｓ Then, 2H Ｓ / M Ｓ 2. The liquid ejection head according to claim 1, wherein:

7. The width of the short side of the recess is M Ｓ The width of the adhesive protruding from the damper film on the long side is H Ｓ Then, 2H Ｓ / M Ｓ 2. The liquid ejection head according to claim 1, wherein:

8. The width of the short side of the recess is M Ｓ The width of the flexible region in the short direction of the damper film is D Ｓ When this is done, D Ｓ / M Ｓ 2. The liquid ejection head according to claim 1, wherein:

9. The width of the short side of the recess is M Ｓ The width of the flexible region in the short direction of the damper film is D Ｓ When this is done, D Ｓ / M Ｓ 2. The liquid ejection head according to claim 1, wherein:

10. The adhesive protruding into the recess has a curved surface, The radius of curvature of the adhesive protruding from the long side of the damper film is R Ｓ The radius of curvature of the adhesive protruding from the short side of the damper film is R Ｌ Then, R Ｌ / R Ｓ 2. The liquid ejection head according to claim 1, wherein the ratio of the surface area of ​​the liquid ejection head to the surface area of ​​the liquid ejection head is 1.

11. A damper film for suppressing vibration of the liquid; a damper substrate having a recess for allowing the damper film to flex; A method for manufacturing a liquid ejection head substrate comprising: applying an adhesive to the damper substrate; attaching the damper film to the damper substrate so as to cover the recess; having In the attaching step, the damper film is attached to the damper substrate by scanning a laminating roller; A method for manufacturing a substrate for a liquid ejection head, wherein the laminating roller scans along the longitudinal direction of the damper film.

12. A method for manufacturing a liquid ejection head as described in claim 11, wherein, when the linear expansion coefficient of the damper film varies within the plane of the damper film, the laminating roller is scanned in a state in which the direction of the larger linear expansion coefficient of the damper film is aligned with the longitudinal direction of the recess.

13. A discharge port for discharging liquid; a pressure generating element that generates pressure for ejecting liquid from the ejection port; a pressure chamber to which the pressure of the pressure generating element acts; a damper film for suppressing vibration of the liquid in the pressure chamber; a damper substrate having a recess for allowing the damper film to flex; A method for manufacturing a liquid ejection head comprising the steps of: applying an adhesive to the damper substrate; attaching the damper film to the damper substrate so as to cover the recess; having In the attaching step, the damper film is attached to the damper substrate by scanning a laminating roller; The method for manufacturing a liquid ejection head, wherein the laminating roller scans along the longitudinal direction of the damper film.

14. A method for manufacturing a liquid ejection head as described in claim 13, wherein, when the linear expansion coefficient of the damper film varies within the plane of the damper film, the laminating roller is scanned in a state in which the direction of the larger linear expansion coefficient of the damper film is aligned with the longitudinal direction of the recess.

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