Control unit, control system, and control program

Abstract

To provide a control unit, a control system, and a control program that enable data management in consideration of a state of each wafer and a secular change of each unit.SOLUTION: A control unit 100 for controlling operations of a plurality of semiconductor wafer production units A for each target wafer, includes a storage section 10, an instruction data generating section 20, a reception data generating section 30, and a communication section 50. The instruction data generating section 20 associates a destination address with an operating recipe and generates instruction data representing operating conditions of one semiconductor wafer production unit A before or during operation. The reception data generating section 30 obtains log data LD at predetermined time intervals from the semiconductor wafer production units A via the communication section 50, associates the log data LD with a second step of log items sequentially, and generates reception data D4 representing at least one of an operating state of the one semiconductor wafer production unit A during operation and a state of the wafer.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a control device, a control system, and a control program for controlling the operation of a plurality of semiconductor wafer production devices. [Background technology]

[0002] In a semiconductor production line where multiple types of semiconductor production equipment are installed, a data management method is known that collectively manages device driving data for driving each driving unit of each semiconductor production equipment (e.g., die bonding equipment, wire bonding equipment, dispenser, etc.). In the data management method in Patent Document 1 (JP Patent Publication 5-94448 A), a technique is proposed for dividing the device driving data into multiple files. The specific data management method is briefly described as follows.

[0003] First, the equipment drive data is divided into four data files: an equipment name file for each semiconductor production equipment, a unit name file for each drive unit, an operation item name file for each drive unit, and a setting data file, and these are stored in the data storage unit of the management computer independently of the data management program.The equipment number, unit number, and operation item number are then read from the corresponding files, and the data that matches each number is specified from the setting data file to send data to each semiconductor production equipment or change the data.This improves processing speed and makes it easier to edit data. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 5-94448 Summary of the Invention [Problem to be solved by the invention]

[0005] The data management method disclosed in Patent Document 1 can also be applied to a semiconductor production line in which multiple types or multiple units of each device (which may be referred to as "semiconductor wafer production devices" in the present invention) in the wafer manufacturing process (including polishing, measuring, cleaning, etc.) are arranged. However, the device driving data disclosed in Patent Document 1 does not manage data for each wafer, so there is a problem in that each device cannot be operated while taking into account the state of each wafer.

[0006] Furthermore, the data management method disclosed in Patent Document 1 does not take into account changes over time, such as deterioration of each component of the semiconductor wafer production equipment, and therefore another problem arises in that data cannot be managed based on such changes over time. [Means for solving the problem]

[0007] The present invention has been made in consideration of the above circumstances, and aims to provide a control device, control system, and control program that controls the operation of multiple semiconductor wafer production devices, and that is capable of managing data taking into account the state of each wafer and changes over time of each device.

[0008] The present invention solves the above problems by the solution means described below as one embodiment.

[0009] A control device that controls the operation of a plurality of semiconductor wafer production devices for each target wafer, the control device comprising a storage unit, a command data generation unit, a received data generation unit, and a communication unit, the storage unit stores a first configuration file, a setting value file, and a second configuration file, the first configuration file stores a first identifier of the semiconductor wafer production device, a second identifier of the wafer, an operation item of the semiconductor wafer production device, a first step number of the operation item, and a destination address associated with the operation item and the first step, the setting value file stores an operation recipe that is associated with the first identifier, the second identifier, the operation item, and the first step and indicates an operation condition for each semiconductor wafer production device, or an operation recipe that is associated with the second identifier, the operation item, and the first step and indicates an operation condition for each semiconductor wafer production device, The second configuration file stores the first identifier, the second identifier, the log items of the semiconductor wafer production apparatus, the second step number of the log items, a predetermined time interval, and a source address associated with the log items, the command data generation unit is configured to associate the destination address with the operation recipe, generate command data indicating operating conditions of one of the semiconductor wafer production apparatuses before or during operation, and output the command data from the communication unit to the one of the semiconductor wafer production apparatuses, and the received data generation unit is configured to acquire log data from the one of the semiconductor wafer production apparatuses via the communication unit at the predetermined time intervals, sequentially associate the log data with the second steps, generate received data indicating at least one of the operating state of the one of the semiconductor wafer production apparatuses during operation and the state of the wafer, and store the received data in the memory unit.

[0010] Also, a control system for controlling the operation of a plurality of semiconductor wafer production apparatuses for each target wafer includes a control device having a command data generation unit, a received data generation unit, and a communication unit, and a storage unit, wherein the storage unit stores a first configuration file, a setting value file, and a second configuration file, wherein the first configuration file stores a first identifier of the semiconductor wafer production apparatus, a second identifier of the wafer, an operation item of the semiconductor wafer production apparatus, a first step number of the operation item, and a destination address associated with the operation item and the first step, and the setting value file stores an operation recipe associated with the first identifier, the second identifier, the operation item, and the first step and indicating an operation condition for each semiconductor wafer production apparatus, or an operation recipe associated with the second identifier, the operation item, and the first step and indicating an operation condition for each semiconductor wafer production apparatus. the second configuration file stores the first identifier, the second identifier, the log items of the semiconductor wafer production apparatus, the second step number of the log items, a predetermined time interval, and a receiver address associated with the log items; the command data generation unit is configured to associate the destination address with the operation recipe, generate command data indicating operating conditions of the one of the semiconductor wafer production apparatuses before or during operation, and output the command data from the communication unit to the one of the semiconductor wafer production apparatuses; and the received data generation unit is configured to acquire log data from the one of the semiconductor wafer production apparatuses via the communication unit at the predetermined time intervals, sequentially associate the log data with the second steps, generate received data indicating at least one of an operating state of the one of the semiconductor wafer production apparatuses during operation and a state of the wafer, and store the received data in the storage unit.

[0011] Also, a control program is readable by a computer and controls the operation of a plurality of semiconductor wafer production apparatuses for each target wafer, the control program associating a destination address corresponding to a first identifier of the semiconductor wafer production apparatus, a second identifier of the wafer, an operation item of the semiconductor wafer production apparatus, and a first step of the operation item with an operation recipe corresponding to the first identifier, the second identifier, the operation item, and the first step and indicating an operation condition for each of the semiconductor wafer production apparatuses, or an operation recipe corresponding to the second identifier, the operation item, and the first step and indicating an operation condition for each of the semiconductor wafer production apparatuses, and the requirements are that the computer execute a command data generation process that generates command data indicating operating conditions of one of the semiconductor wafer production apparatuses in operation; a command data output process that outputs the command data from a communication unit to the one of the semiconductor wafer production apparatuses; a received data generation process that acquires log data from the one of the semiconductor wafer production apparatuses via the communication unit at predetermined time intervals, sequentially associating the log data with second steps of log items, and generates received data indicating at least one of the operating state of the one of the semiconductor wafer production apparatuses in operation and the state of the wafer; and a received data storage process that stores the received data in a storage unit. Effect of the Invention

[0012] According to the above configuration, it is possible to generate command data that takes into account the state of each wafer for a plurality of different types of semiconductor wafer production equipment, and to transmit the command data. Also, according to the above configuration, it is possible to acquire log data for each wafer and equipment from a plurality of different types of semiconductor wafer production equipment, and generate received data based on the log data. Furthermore, by performing both the generation of command data and the generation of received data, it is possible to realize a semiconductor production line that is capable of data management that takes into account the state of each wafer and the changes over time of each equipment. [Brief description of the drawings]

[0013] [Figure 1]1 is a block diagram of a control device according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is an explanatory diagram showing the data structure of a first configuration file according to each embodiment of the present invention. [Diagram 3] FIG. 4 is an explanatory diagram showing a data structure of a setting value file according to each embodiment of the present invention. [Figure 4] FIG. 4 is an explanatory diagram showing the data structure of a second configuration file according to each embodiment of the present invention. [Diagram 5] FIG. 2 is an explanatory diagram showing a data structure of received data according to each embodiment of the present invention. [Figure 6] FIG. 5 is a block diagram of a control system according to a second embodiment of the present invention. [Figure 7] FIG. 11 is a block diagram of a control device according to a third embodiment of the present invention. [Figure 8] FIG. 13 is a block diagram of a control device according to a fifth embodiment of the present invention. [Figure 9] FIG. 13 is a block diagram of a control device according to a seventh embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, each embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a block diagram of a control device 100 according to a first embodiment of the present invention. FIG. 2 is an explanatory diagram showing the data structure of a first configuration file D1 according to each embodiment of the present invention. FIG. 3 is an explanatory diagram showing the data structure of a setting value file D2 according to each embodiment of the present invention. FIG. 4 is an explanatory diagram showing the data structure of a second configuration file D3 according to each embodiment of the present invention. FIG. 5 is an explanatory diagram showing the data structure of received data D4 according to each embodiment of the present invention. FIG. 6 is a block diagram of a control system S according to a second embodiment of the present invention. In all the drawings for explaining each embodiment, members having the same function are given the same reference numerals, and repeated explanations thereof may be omitted.

[0015] (Semiconductor wafer production equipment) First, the semiconductor wafer production apparatus A according to the present invention includes each device in the front-end process among the processes roughly divided into a front-end process for manufacturing a wafer and a back-end process for manufacturing a chip. Specifically, it includes a cutting device for cutting a wafer from an ingot, a polishing device (single-sided polishing device, double-sided polishing device, edge polishing device, etc.) for polishing the surface and end surface of the wafer, a sputtering device for forming a film on the surface of the wafer, etc. In addition to these, it also includes a wafer cleaning device, various measuring devices, various inspection devices, etc. In addition, each semiconductor wafer production apparatus A according to each embodiment is assumed to be a known single-sided polishing apparatus A having a surface plate with a polishing pad attached to its upper surface and a polishing head capable of holding a wafer, as an example. Therefore, the first configuration file D1, the setting value file D2, the second configuration file D3, the received data D4, the command data OD, and the log data LD described later also include various parameters for the single-sided polishing apparatus A.

[0016] Moreover, each semiconductor wafer production apparatus (single-sided polishing apparatus) A according to the first embodiment includes a communication unit 70 (70a-70c) and a control unit 80 (80a-80c), and is configured to operate each unit of the apparatus based on input of command data OD. Each semiconductor wafer production apparatus (single-sided polishing apparatus) A according to the second embodiment includes a communication unit 170 (170a-170c) and a control unit 180 (180a-180c), and is configured to operate each unit of the apparatus based on input of command data OD.

[0017] Furthermore, the control device 100, control system S, and control program PGM according to the present invention will be described in the case where three semiconductor wafer production devices (single-sided polishing devices) A1 to A3 are installed, but the number of semiconductor wafer production devices A is not limited to this. Note that the above-mentioned multiple types of semiconductor wafer production devices A may be installed.

[0018] (First embodiment) (Control device 100) Next, the overall configuration of the control device 100 according to the first embodiment will be described. The control device 100 is realized by an information processing device such as a personal computer or a workstation, for example. That is, the control device 100 includes a CPU, memories such as RAM and ROM, and a communication unit, and operates based on a preset control program PGM and setting signals input from an editing unit 60.

[0019] 1, the control device 100 according to this embodiment includes a storage unit 10, a command data generating unit 20, a received data generating unit 30, a temporary storage unit 40, one or more communication units 50, and an editing unit 60. The control device 100 includes three communication units 50a to 50c to control the three single-sided polishing devices A1 to A3.

[0020] Next, the storage unit 10 according to the present embodiment corresponds to a ROM, which is a non-volatile memory, as an example. The storage unit 10 stores a first configuration file D1, a setting value file D2, a second configuration file D3, and a control program PGM for causing the command data generating unit 20 and the reception data generating unit 30 to execute the operation of the control device 100. The storage unit 10 also stores reception data D4, which will be described later.

[0021] The command data generating unit 20 according to this embodiment corresponds to a CPU, and is configured to call the control program PGM from the storage unit 10 and sequentially execute the processes of generating command data OD and outputting the command data OD.

[0022] In addition, the reception data generation unit 30 in this embodiment corresponds to a CPU, and is configured to call up the control program PGM from the memory unit 10 and sequentially execute each process of generating the reception data D4 and storing the reception data D4 in the memory unit 10.

[0023] The temporary storage unit 40 according to the present embodiment corresponds to a RAM, which is a volatile memory, for example. The temporary storage unit 40 is configured to temporarily store the command data OD generated by the command data generating unit 20 and the log data LD received by each communication unit 50 (50a to 50c), which will be described later.

[0024] In addition, the communication unit 50 (50a to 50c) in this embodiment has a function of performing predetermined communication (sending or receiving data) with each communication unit 70 (70a to 70c) of the semiconductor wafer production equipment A (A1 to A3) via wired LAN or wireless LAN.

[0025] The control devices 100 may be configured to have a single common communication unit 50.

[0026] The editing unit 60 according to this embodiment includes a display unit 60a and an operation unit 60b. The display unit 60a is a display that displays the files D1 to D3 stored in the storage unit 10. The operation unit 60b may be, for example, a mouse, a keyboard, or a touch panel. The editing unit 60 allows an operator to edit the setting value file D2.

[0027] Next, the first configuration file D1 and the setting value file D2 according to this embodiment will be described in detail.

[0028] (First configuration file) The first configuration file D1 according to this embodiment has a data structure in which a first identifier for identifying the semiconductor wafer production device A, a second identifier for identifying each wafer, an operation item of the semiconductor wafer production device A, a first step number Q1 of the operation item, and a destination address associated with the operation item and the first step are stored. More specifically, as shown in Fig. 2, the first configuration file D1 has a data structure having summary data D11, wafer data D12 which is a layer below the summary data D11, destination address data D13 which is a layer below the wafer data D12, and definition data D14 which is a layer below the wafer data D12.

[0029] The summary data D11 has a data structure whose elements are an equipment name (first identifier), a wafer list (second identifier), an IP address, and a port number. More specifically, the summary data D11 has a data structure in which one first identifier and each second identifier associated with the first identifier are stored. In other words, the storage unit 10 stores the first configuration file D1 for each semiconductor wafer production equipment A. The IP address and port number identify the destination of transmission to the semiconductor wafer production equipment A.

[0030] Moreover, the wafer data D12 is divided for each N wafers, and has a data structure including M divided operation items, a pattern stock number P, and a first step number Q1 as elements. The operation items are items indicating the operation of each part of the semiconductor wafer production apparatus A, and in the case of the single-sided polishing apparatus A, examples of the operation items include polishing time, platen rotation number, head rotation number, head pressure, etc. The pattern stock corresponds to various operations of one semiconductor wafer production apparatus A, and in the case of the single-sided polishing apparatus A, the pattern stock number P is three, for example, rough polishing, medium polishing, and finish polishing. Furthermore, the first step number Q1 is a number that specifies how many steps the operation of the semiconductor wafer production apparatus A is performed in. In addition, when the operation items include time (polishing time in this embodiment), each step is configured to operate for the relevant time (polishing time).

[0031] Furthermore, when multiple wafers (for example, 5 wafers) are treated as one batch and processed (including processing, inspection, and cleaning) at one time, the wafer data D12 may be divided for each N batch instead of for each N wafers. As an example, the semiconductor wafer production apparatus A is a polishing apparatus (single-sided polishing apparatus or double-sided polishing apparatus) A that can polish multiple wafers simultaneously.

[0032] The destination address data D13 is divided into N wafers, and has a data structure with P pattern stocks, Q1 first steps, and M operation items as elements of destination addresses. More specifically, destination addresses are stored in each matrix of Q1 rows and M columns, and the destination address data D13 has a data structure of P data of Q1 rows and M columns.

[0033] The definition data D14 is divided into N wafers and has a data structure in which the elements are the type, maximum value, and minimum value of each of the M operation items. As an example, the definition data D14 is referred to when the editing unit 60 edits the setting value file D2.

[0034] As described above, the first configuration file D1 has a hierarchical data structure, but may be divided into each piece of data D11 to D14.

[0035] (settings file) Next, the setting value file D2 according to this embodiment has a data structure including elements of a first identifier, a second identifier, an operation item, and an operation recipe that is associated with each first step and indicates the operating conditions for each semiconductor wafer production device. More specifically, as shown in Fig. 3, the setting value file D2 has a data structure in which each file name is classified by a second identifier, and an operation recipe is stored in each matrix of Q1 rows x M columns associated with the second identifier, and has P pieces of data (CSV files, for example) of Q1 rows x M columns. By configuring the setting value file D2 as described above, the setting value file D2 can be shared between devices A of the same type.

[0036] In addition, when the setting value file D2 is a CSV file, as an example, the file name includes the first identifier and the second identifier, or the second identifier, but it may have a data structure having the first identifier and the second identifier, or the second identifier at a higher level, like the first configuration file D1.

[0037] By having each of the files D1 and D2 for each semiconductor wafer production device A and each wafer, it is possible for a single control device (computer) 100 to generate command data OD for each wafer and output the command data OD to a plurality of different types of semiconductor wafer production devices A. Also, by making the first configuration file D1 and the setting value file D2 separate files, for example, editing of the operation recipe by the editing unit 60 becomes easy.

[0038] (Command data generation unit) Next, the specific processing of the command data generating unit 20 will be described in detail.

[0039] The command data generating unit 20 is configured to generate command data OD indicating the operating conditions of one semiconductor wafer production device A before or during operation by associating the destination address with the operation recipe stored in the setting value file D2 based on the first configuration file D1 (command data generating process). That is, the command data generating unit 20 generates command data OD based on the type of wafer set in advance, the type of semiconductor wafer production device A set in advance, and the type of pattern stock set in advance corresponding to the operating pattern of the semiconductor wafer production device A. More specifically, a case is assumed in which one wafer is surface-polished in one pattern by the single-sided polishing device A1. The command data generating unit 20 reads the destination address data D13 and the setting value file D2 corresponding to the single-sided polishing device A1, the wafer, and the pattern from the storage unit 10. Next, the command data OD is generated by associating each element of the destination address data D13 with each element of the setting value file D2 corresponding to the matrix of each element (i.e., in the same row and column), and the command data OD is stored in the temporary storage unit 40. Next, the command data generating unit 20 outputs the command data OD from the temporary storage unit 40 to the communication unit 70a via the communication unit 50a (command data output process). Since each operation recipe in the command data OD is associated with a destination address, the operation recipe is output to each control unit 80 (80a) of the single-sided polishing apparatus A1, and the specified surface polishing (operation of the semiconductor wafer production apparatus A) can be performed.

[0040] (Second configuration file) Next, the second configuration file D3 according to this embodiment will be described in detail.

[0041] The second configuration file D3 according to this embodiment has a data structure including, as elements, a first identifier, a second identifier, a log item of a semiconductor wafer production device, a second step number Q2 of the log item, a predetermined time interval T, and a receiver address associated with the log item. More specifically, as shown in Fig. 4, the data structure has summary data D31, wafer data D32 which is a lower hierarchical level than the summary data D31, and receiver address data D33 which is a lower hierarchical level than the wafer data D32.

[0042] The summary data D31 has the same data structure as the summary data D11. That is, the summary data D31 stores a first identifier of one semiconductor wafer production device A, and the storage unit 10 stores second configuration files D3 for the number of the semiconductor wafer production devices A.

[0043] The wafer data D32 is divided for each N wafers, and has a data structure including elements of a log item divided into L pieces, a pattern stock number P, a second step number Q2, and a predetermined time interval T. The log items are items (i.e., log data LD items) indicating at least one of various measurement items during or after the operation of the semiconductor wafer production device A (including a state in which the semiconductor wafer production device A is stopped or a state after the stop) and various measurement items of the wafer during or after the operation (including a state in which the semiconductor wafer production device A is stopped or a state after the stop). In the case of the single-sided polishing device A, examples include the wafer shape (e.g., wafer thickness), device temperature, driving torque, head pressure, etc. The second step number Q2 is a number that specifies how many steps the measurement of the semiconductor wafer production device A is performed. Furthermore, the received data generating unit 30 acquires the log data LD communicated in real time during the operation of the semiconductor wafer production device A at each time interval T. That is, the second step is divided at each predetermined time interval T.

[0044] The receiver address data D33 is divided into N wafers and has a data structure including P pattern stocks and receiver addresses for L log items as elements. Unlike the first configuration file D1, the second configuration file D3 has a data structure having P receiver address data D33 in which L receiver addresses are stored.

[0045] As described above, the second configuration file D3 has a hierarchical data structure, but may be divided into each of the data D31 to D33.

[0046] (Received data generation unit) Next, specific processing by the reception data generating unit 30 will be described in detail.

[0047] The received data generating unit 30 acquires log data LD from one semiconductor wafer production device A at a predetermined time interval T via each communication unit 50 (50a to 50c), and sequentially associates the log data LD with the second step to generate received data D4 indicating at least one of the operating state of the one semiconductor wafer production device A during operation of the semiconductor wafer production device A and the state of one wafer during operation of the semiconductor wafer production device A (received data generating process). Then, the received data D4 is stored in the storage unit 10 (received data storing process). More specifically, it is assumed that one wafer is surface-polished in one pattern by the single-sided polishing device A1. The received data generating unit 30 reads the second configuration file D3 from the storage unit 10. Also, the log data LD stored in the temporary storage unit 40 is read at a predetermined time interval T. Next, based on the receiver address data D33, the log data LD for each time interval T is associated with the second step in order to generate Q2 rows × (L+1) columns of received data D4 as shown in Fig. 5. Each row is in the chronological order in which the log data LD is read (i.e., in the second step order). Next, the generated received data D4 is stored in the storage unit 10.

[0048] Note that each row of the received data D4 may be in the order in which the log data LD was read at each predetermined time interval T (second step order), and thus the received data D4 may not have a second step in the first column and may be Q2 rows x L columns. Also, each row of the received data D4 may be in the order in which the log data LD was read at each predetermined time interval T (second step order), and thus the value of the second step number Q2 may not be set in advance, and the second step number Q2 may be set according to the number of log data LD. Furthermore, the second step number Q2 and the time interval T may be set individually for each log item.

[0049] Also, while semiconductor wafer production equipment A is in operation, command data OD may be generated based on setting value file D2 changed by editing unit 60 to update the operating conditions of the same semiconductor wafer production equipment A in operation. That is, by combining the processes of command data generating unit 20 and received data generating unit 30, the operating conditions of semiconductor wafer production equipment A in operation can be changed in real time.

[0050] With the above configuration, it is possible to acquire log data LD from a plurality of different types of semiconductor wafer production devices A, generate reception data D4 for each wafer based on the log data LD, and store the reception data D4.

[0051] Furthermore, the above configuration makes it possible to realize a semiconductor production line that allows data management that takes into account the state of the wafer and changes over time in each piece of equipment A. As an example, when the thickness of the wafer in one piece of received data D4 is equal to or greater than a predetermined value, the platen rotation speed, head rotation speed, and head pressure in the setting value file D2 corresponding to the semiconductor wafer production equipment (single-sided polishing equipment) A to be operated next can be increased.

[0052] Second embodiment The configuration of the control device 100 and each data has been described above. Next, a control system S according to the second embodiment will be described. The control system S according to the second embodiment is configured to include a control device 200 having a command data generating unit 120, a received data generating unit 130, and a communication unit 150 (150a to 150c), and a storage unit 210. That is, the configuration of the storage unit 10 in the first embodiment is different from that of the storage unit 210 in the second embodiment. The differences from the first embodiment will be described below.

[0053] 6, the storage unit 210 according to the present embodiment is provided in a server 300 separate from the control device 200. A communication unit 190 of the control device 200 and a communication unit 290 of the server 300 have a function of performing predetermined communication (transmission or reception of data) via a network NW.

[0054] The server 300 according to the present embodiment is realized, for example, by an information processing device such as a personal computer, a workstation, etc. That is, the server 300 includes a CPU, memories such as RAM and ROM, and a communication unit, and operates based on preset programs and external inputs.

[0055] The network NW is a network of any configuration that connects the control device 200 and the server 300, and may be any of a wireless network, a dedicated line network, and a public line network.

[0056] The configuration is the same as that of the first embodiment, except that the storage unit 210 is provided in the server 300, and the communication units 190 and 290 perform predetermined communication via the network NW. That is, the command data generation unit 20 is replaced with the command data generation unit 120, the reception data generation unit 30 is replaced with the reception data generation unit 130, the temporary storage unit 40 is replaced with the temporary storage unit 140, the communication unit 50 is replaced with the communication unit 150, the editing unit 60 (display unit 60a, operation unit 60b) is replaced with the editing unit 160 (display unit 160a, operation unit 160b), the communication units 70 (70a to 70c) are replaced with the communication units 170 (170a to 170c), and the control units 80 (80a to 80c) are replaced with the control units 180 (180a to 180c).

[0057] Third embodiment Next, the control device 100 according to the third embodiment will be described. In the control device 100 according to the third embodiment, the first configuration file D1 and the second configuration file D3 are encrypted by a predetermined encryption process. The following describes the differences from the first embodiment.

[0058] The first configuration file D1 and the second configuration file D3 according to this embodiment are encrypted by a known encryption method. Specifically, the character strings of the data D11, D12, D13, D14, D31, D32, and D33 of each layer are configured as ciphertext. As an example, the first configuration file D1 and the second configuration file D3 may be configured to be encrypted by a common key encryption method using an encryption algorithm such as DES (Data Encryption Standard), RC4 (Rivest Cipher 4), or AES (Advanced Encryption Standard). As another example, the first configuration file D1 and the second configuration file D3 may be configured to be encrypted by a public key encryption method using an encryption algorithm such as RSA. As yet another example, the first configuration file D1 and the second configuration file D3 may be configured to be encrypted by a hybrid encryption method.

[0059] The above configuration can prevent problems caused by inadvertent changes to the files D1 and D3, and can also prevent information leaks from the files D1 and D3.

[0060] Since the first configuration file D1 and the second configuration file D3 are encrypted, the control device 100 of the third embodiment may be configured to include an input unit 90, an encryption unit 92, and a decryption unit 94, as shown in FIG. 7.

[0061] The encryption unit 92 according to this embodiment corresponds to a CPU, and is configured to call the control program PGM from the storage unit 10 and encrypt the first configuration file D1 and the second configuration file D3 input to the input unit 90 by the above-mentioned publicly known encryption method. More specifically, in the case of a common key encryption method, the control program PGM is configured to include an encryption key (which is also the decryption key) for encrypting and decrypting the first configuration file D1 and the second configuration file D3 within the program code.

[0062] The encryption key and decryption key are not limited to being included in the program code of the control program PGM, and may be data independent of the program code.

[0063] Furthermore, the encryption key and decryption key may be common to the first configuration file D1 and the second configuration file D3, or may be provided separately.

[0064] The input unit 90 according to the present embodiment is, for example, a USB port 90. The first configuration file D1 and the second configuration file D3 are input to the storage unit 10 via the USB port 90 from a USB flash memory or an external terminal.

[0065] The input unit 90 is not limited to the USB port 90. As another example, the first configuration file D1 and the second configuration file D3 may be input to the storage unit 10 via a communication unit (not shown) instead of the USB port 90. The communication unit has a function of performing predetermined communication (transmission or reception of data) between the control device 100 and an external terminal or the like via a wired LAN or a wireless LAN.

[0066] With the above configuration, the first configuration file D1 and the second configuration file D3 input to the control device 100 are encrypted and stored in the storage unit 10, so that the confidentiality of the files D1 and D3 can be improved.

[0067] In addition, the control device 100 may be configured not to have an encryption unit 92, in which case the first configuration file D1 and the second configuration file D3 input to the input unit 90 may be configured to be encrypted in advance using the publicly known encryption method described above.

[0068] The decoding unit 94 in this embodiment corresponds to a CPU, and is configured to call up the control program PGM from the memory unit 10, decode the first configuration file when the command data generation unit 20 generates command data OD, and decode the second configuration file D3 when the received data generation unit 30 generates received data D4.

[0069] With the above configuration, the constituent files D1, D3 are decrypted only when the command data OD and the received data D4 are generated, so that the confidentiality of the files D1, D3 can be improved.

[0070] The control device 100 may not include the decoding unit 94 .

[0071] The encryption unit 92 and / or the decryption unit 94 may be provided in an external server (not shown). The decryption unit 94 may be provided in the semiconductor wafer production equipment A.

[0072] (Fourth embodiment) Next, a control system S according to the fourth embodiment will be described. In the control system S according to the fourth embodiment, the first configuration file D1 and the second configuration file D3 are configured to be encrypted by a predetermined encryption process, similar to the third embodiment. For this reason, the control device 200 according to the fourth embodiment may be configured to include a decryption unit, and the server 300 may be configured to include an input unit and an encryption unit (all not shown). The input unit, encryption unit, and decryption unit have the same configurations as the third embodiment.

[0073] The above configuration can prevent problems caused by inadvertent changes to the files D1 and D3, and can also prevent information leaks from the files D1 and D3.

[0074] Fifth embodiment Next, the control device 100 according to the fifth embodiment will be described. In the control device 100 according to the fifth embodiment, the first configuration file D1 and the second configuration file D3 are encrypted by a predetermined encryption process when data is output to the outside of the control device 100 (particularly to a user device such as an external terminal or a USB memory) and when data is output to the semiconductor wafer production device A. The configuration other than the above is the same as that of the first embodiment. Therefore, the control device 100 according to this embodiment may be configured to include an input / output unit 91 and an encryption / decryption unit 96 as shown in FIG. 8.

[0075] The encryption / decryption unit 96 corresponds to a CPU and has the functions of both the encryption unit 92 and the decryption unit 94 .

[0076] The above configuration can prevent problems caused by inadvertently changing the first configuration file D1 and the second configuration file D3 outside the control device 100. In addition, it can prevent information leakage of the files D1 and D3, the setting value file D2, and the received data D4.

[0077] Furthermore, each of the semiconductor wafer production apparatuses A (A1 to A3) according to this embodiment may be configured to include an encryption / decryption unit 98 (98a to 98c).

[0078] With the above configuration, outside the control system including the semiconductor wafer production equipment A, malfunctions and information leakage caused by inadvertent changes to the first configuration file D1 and the second configuration file D3 can be prevented, and information leakage of the setting value file D2 and the received data D4 can be prevented.

[0079] Also, the control device 100 may be configured to limit the semiconductor wafer production devices A to which data is to be sent and received so that data cannot be sent and received from semiconductor wafer production devices A that do not include the encryption / decryption unit 98 .

[0080] With the above configuration, information leakage can be prevented.

[0081] Next, a control system S according to the sixth embodiment will be described. In the control system S according to this embodiment, as in the fifth embodiment, the first configuration file D1 and the second configuration file D3 are encrypted by a predetermined encryption process when data is output to the outside of the control system (particularly to a user device such as an external terminal or a USB memory), when data is input / output between the control device 200 and the server 300, and when data is output to the semiconductor wafer production device A. The configuration other than the above is the same as that of the second embodiment. For this reason, the control device 200 and the server 300 according to the sixth embodiment may be configured to include an input / output unit 91 and an encryption / decryption unit 96 (both not shown).

[0082] The above configuration can prevent problems caused by inadvertently changing the first configuration file D1 and the second configuration file D3 outside the control system S. Also, it can prevent information leakage of the files D1 and D3, the setting value file D2, and the received data D4.

[0083] Similarly to the fifth embodiment, each of the semiconductor wafer production equipment A (A1 to A3) may be configured to include an encryption / decryption unit 98 (98a to 98c) (not shown).

[0084] Next, the control device 100 according to the seventh embodiment will be described. In the control device 100 according to this embodiment, the first configuration file D1 and the second configuration file D3 are configured to have a predetermined protection process that prohibits at least one of deletion and rewriting. Below, the differences from the first embodiment will be described.

[0085] As an example, the first configuration file D1 and the second configuration file D3 are protected by a protection processing unit 402, which corresponds to a CPU in the external terminal 400. In order to release the protection, a specific key may be used.

[0086] The protection processing unit 402 may be provided in the control device 100 .

[0087] The first configuration file D1 and the second configuration file D3 that have been subjected to the protection process are input to the storage unit 10 of the control device 100 via a communication unit (not shown).

[0088] With the above configuration, only authorized users can delete or edit, and problems caused by changing the first configuration file D1 and the second configuration file D3 can be prevented.

[0089] Next, a control system S according to the eighth embodiment will be described. In the control device 200 and the server 300 according to this embodiment, the first configuration file D1 and the second configuration file D3 are configured to have a predetermined protection process that prohibits at least one of deletion and rewriting. The following describes the differences from the second embodiment.

[0090] As an example, the first configuration file D1 and the second configuration file D3 are protected by a protection processing unit 402, which corresponds to a CPU in an external terminal 400 connected to the server 300 (both not shown). In order to release the protection, a specific key may be used.

[0091] The protection processing unit 402 may be provided in the control device 200 or the server 300 .

[0092] The first configuration file D1 and the second configuration file D3 that have been subjected to the protection process are input to the storage unit 210 of the server 300 via a communication unit (not shown).

[0093] With the above configuration, only authorized users can delete or edit, and problems caused by changing the first configuration file D1 and the second configuration file D3 can be prevented.

[0094] As described above, the control device 100, control system S, and control program PGM according to each embodiment can realize a semiconductor production line capable of managing data taking into consideration the state of each wafer and the change over time of each device. In particular, the present invention can be applied not only to the above-mentioned front-end process, but also to a semiconductor production line that combines various semiconductor production devices in the back-end process.

[0095] The present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the scope of the present invention.

[0096] As an example, the first configuration file D1 may have a data structure having wafer data D12 corresponding to a plurality of semiconductor wafer production devices A. More specifically, the data structure may have wafer data on measuring devices and inspection devices in addition to single-sided polishing devices in a hierarchy below the summary data D11. Similarly, the second configuration file D3 may have a data structure having wafer data D32 corresponding to a plurality of semiconductor wafer production devices A. More specifically, the data structure may have wafer data on measuring devices and inspection devices in addition to single-sided polishing devices in a hierarchy below the summary data D31.

[0097] As another example, a data updating unit (not shown) can be used instead of the editing units 60 and 160 according to the respective embodiments. The data updating unit is configured to compare a predetermined value in the received data D4 with a preset threshold value, and update the setting value file D2 with a preset optimum value.

[0098] As another example of the data updating section, a configuration is provided in which, based on a predetermined value of the received data D4 and correlation data, a predetermined value obtained from the correlation data is updated as a value in the setting value file D2. [Explanation of symbols]

[0099] 10 Storage section 20 Command data generator 30 Received data generation unit 50 Communications Department 100 Control device 120 Command data generator 130 Received data generation unit 150 Communications Department 200 Control device 210 Storage section S Control System D1 First configuration file D2 Settings File D3 2nd configuration file D4 Received data OD command data LD Log Data Q1 First step number Q2 2nd step number T Time interval PGM Control Program

Claims

1. A control device that controls the operation of a plurality of semiconductor wafer production devices for each target wafer, The device includes a storage unit, a command data generating unit, a reception data generating unit, and a communication unit, The storage unit includes: A first configuration file, a setting value file, and a second configuration file are stored; The first configuration file a first identifier of the semiconductor wafer production device, a second identifier of the wafer, an operation item of the semiconductor wafer production device, a first step number of the operation item, and a destination address associated with the operation item and the first step are stored; The setting value file is an operation recipe corresponding to the first identifier, the second identifier, the operation item, and the first step and indicating an operation condition for each of the semiconductor wafer production equipment; or an operation recipe is stored which indicates an operation condition for each of the semiconductor wafer production apparatuses in association with the second identifier, the operation item, and the first step; The second configuration file the first identifier, the second identifier, a log item of the semiconductor wafer production device, a second step number of the log item, a predetermined time interval, and a receiver address associated with the log item are stored; the command data generation unit generates command data indicating operating conditions of one of the semiconductor wafer production apparatuses before or during operation by associating the destination address with the operation recipe, The command data is output from the communication unit to the one of the semiconductor wafer production apparatuses, the received data generating unit acquires log data from one of the semiconductor wafer production devices via the communication unit at the predetermined time intervals, Correlating the log data with the second step in sequence, and generating received data indicating at least one of an operating state of the one semiconductor wafer production apparatus in operation and a state of the wafer; The received data is stored in the storage unit. A control device comprising:

2. The first configuration file and the second configuration file are encrypted by a predetermined encryption process.

2. The control device according to claim 1,

3. The first configuration file and the second configuration file are protected by a predetermined process for prohibiting at least one of deletion and rewriting.

2. The control device according to claim 1,

4. A control system for controlling the operation of a plurality of semiconductor wafer production devices for each target wafer, comprising: The control device includes a command data generating unit, a reception data generating unit, and a communication unit, and a storage unit. The storage unit includes: A first configuration file, a setting value file, and a second configuration file are stored; The first configuration file a first identifier of the semiconductor wafer production device, a second identifier of the wafer, an operation item of the semiconductor wafer production device, a first step number of the operation item, and a destination address associated with the operation item and the first step are stored; The setting value file is an operation recipe corresponding to the first identifier, the second identifier, the operation item, and the first step and indicating an operation condition for each of the semiconductor wafer production equipment; or an operation recipe is stored which indicates an operation condition for each of the semiconductor wafer production apparatuses in association with the second identifier, the operation item, and the first step; The second configuration file the first identifier, the second identifier, a log item of the semiconductor wafer production device, a second step number of the log item, a predetermined time interval, and a receiver address associated with the log item are stored; the command data generation unit generates command data indicating operating conditions of one of the semiconductor wafer production apparatuses before or during operation by associating the destination address with the operation recipe, The command data is output from the communication unit to the one of the semiconductor wafer production apparatuses, the received data generating unit acquires log data from one of the semiconductor wafer production devices via the communication unit at the predetermined time intervals, Correlating the log data with the second step in sequence, and generating received data indicating at least one of an operating state of the one semiconductor wafer production apparatus in operation and a state of the wafer; The received data is stored in the storage unit. A control system comprising:

5. The first configuration file and the second configuration file are encrypted by a predetermined encryption process.

5. The control system according to claim 4,

6. The first configuration file and the second configuration file are protected by a predetermined process for prohibiting at least one of deletion and rewriting.

5. The control system according to claim 4,

7. A control program readable by a computer for controlling the operation of a plurality of semiconductor wafer production devices for each target wafer, a destination address associated with a first identifier of the semiconductor wafer production equipment, a second identifier of the wafer, an operation item of the semiconductor wafer production equipment, and a first step of the operation item; an operation recipe corresponding to the first identifier, the second identifier, the operation item, and the first step and indicating an operation condition for each of the semiconductor wafer production equipment; or a command data generation process for generating command data indicating operating conditions of one of the semiconductor wafer production apparatuses before or during operation by associating the second identifier, the operation item, and an operation recipe that is associated with the first step and indicates operating conditions for each of the semiconductor wafer production apparatuses; a command data output process for outputting the command data from a communication unit to the one of the semiconductor wafer production apparatuses; a received data generation process for acquiring log data from one of the semiconductor wafer production apparatuses via the communication unit at predetermined time intervals, sequentially associating the log data with second steps of log items, and generating received data indicating at least one of an operating state of the one of the semiconductor wafer production apparatuses during operation and a state of the wafer; and a received data storage process for storing the received data in a storage unit. A control program comprising:

8. The first configuration file and the second configuration file are encrypted by a predetermined encryption process.

8. The control program according to claim 7,

9. The first configuration file and the second configuration file are protected by a predetermined process for prohibiting at least one of deletion and rewriting.

8. The control program according to claim 7,

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