Composition for heat transfer fluid, heat transfer device, and heat transfer method

Abstract

To provide a composition for heat transfer fluid as a novel mixture.SOLUTION: The present invention provides a composition for heat transfer fluid containing a hexafluoropropene trimer represented by C9F18, (i) CmF2m and / or CnF(2n-2) (in the formula, m is an integer from 4 to 12 other than 9. n is an integer from 4 to 12), (ii) water (the content of water is 0.0001-0.1 pt.mass relative to 100 pts.mass of the total amount of the hexafluoropropene trimer represented by C9F18), and / or (iii) fluoride ions (the content of the fluoride ions is 0.0000001 to 5 pts.mass relative to 100 pts.mass of the total amount of the hexafluoropropene trimer represented by C9F18).SELECTED DRAWING: None

Description

[Technical field]

[0001] FIELD OF THE DISCLOSURE The present disclosure relates to heat transfer fluid compositions, devices for heat transfer, and methods of heat transfer. [Background technology]

[0002] It is known that a trimer of hexafluoropropene (HFP) can be used as a composition for a heat transfer fluid (Patent Document 1).

[0003] HFP trimers have attracted attention as an alternative to chlorofluorocarbons (CFCs) and hydrochlorofluorocarbons (HCFCs) because of their low global warming potential (GWP) and low toxicity. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2018 / 172919 Summary of the Invention [Problem to be solved by the invention]

[0005] In view of the above circumstances, an object of the present disclosure is to provide a heat transfer fluid composition in the form of a novel mixture. [Means for solving the problem]

[0006] As a result of extensive research aimed at solving the above problems, the inventors have found that a heat transfer fluid composition can be provided in the form of a novel mixture by allowing a predetermined fluorocarbon to coexist with an HFP trimer, a predetermined amount of water, and / or a predetermined amount of fluoride ions.

[0007] That is, the present disclosure includes the following aspects. [Section 1] C9F 18(i) a hexafluoropropene trimer represented by C m F 2m and / or C. n F (2n-2) (wherein m is an integer of 4 or more and 12 or less, other than 9; and n is an integer of 4 or more and 12 or less); (ii) water (wherein the content of such water is determined by the above-mentioned C9F 18 (iii) fluoride ions (the content of such fluoride ions is 0.0001 to 0.1 parts by mass relative to 100 parts by mass of the total amount of the hexafluoropropene trimer represented by 18 (0.0000001 to 5 parts by mass per 100 parts by mass of the total amount of the hexafluoropropene trimer represented by the formula: [Section 2] Item 2. The heat transfer fluid composition according to item 1, wherein the hexafluoropropene trimer comprises at least one compound selected from the group consisting of compounds represented by the following formulas (I) to (III): [C1] TIFF2025021464000001.tif154101[Section 3] Item 3. The heat transfer fluid composition according to item 2, wherein the compound represented by formula (I) is present in an amount of 85 mass % or more based on the total amount of the hexafluoropropene trimer. [Section 4] Item 3. The heat transfer fluid composition according to item 2, wherein the compound represented by formula (I) is contained in an amount of less than 85 mass% based on the total amount of the hexafluoropropene trimer. [Section 5] Item 3. The heat transfer fluid composition according to item 2, wherein the compound represented by formula (I) is present in an amount of 50% by mass or more and less than 85% by mass based on the total amount of the hexafluoropropene trimer. [Section 6] C9F 18 (i) a hexafluoropropene trimer represented by C m F 2m and / or C. n F (2n-2) (wherein m is an integer of 4 or more and 12 or less except 9; and n is an integer of 4 or more and 12 or less). [Section 7] Item 2. The heat transfer fluid composition according to item 1, wherein m is an integer of 6 to 11, except for 9, and n is an integer of 6 to 11. [Section 8] C m F 2m and / or C. n F (2n-2) The content of C9F 18 Item 2. The heat transfer fluid composition according to item 1, wherein the amount of the hexafluoropropene trimer represented by the formula (1) is 0.0001 to 10 parts by mass relative to 100 parts by mass of the total amount of the hexafluoropropene trimer represented by the formula (1). [Section 9] C9F 18 Item 1. The heat transfer fluid composition according to item 1, comprising a hexafluoropropene trimer represented by the formula: [Section 10] C9F 18 Item 1. The heat transfer fluid composition according to item 1, comprising a hexafluoropropene trimer represented by the formula: and (iii) a fluoride ion. [Section 11] C 12 F 24 Item 2. The heat transfer fluid composition according to item 1, further comprising a hexafluoropropene tetramer represented by the formula: [Section 12] Item 12. The heat transfer fluid composition according to item 11, wherein the content of the hexafluoropropene trimer is 90% by mass or more and 99.99% by mass or less based on the total content of the hexafluoropropene trimer and the hexafluoropropene tetramer. [Section 13] Item 12. The heat transfer fluid composition according to item 11, wherein the hexafluoropropene tetramer comprises 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene. [Section 14] Item 2. The heat transfer fluid composition according to item 1, further comprising a conductive material, the content of the conductive material being 100 ppm by mass or less. [Section 15] Item 2. The heat transfer fluid composition according to item 1, further comprising a conductive substance, and having a content of insoluble matter of 5 μm or more of 10 particles / mL or less. [Section 16] Item 3. A heat transfer fluid comprising the heat transfer fluid composition according to item 1 or 2. [Section 17] Item 3. Use of the heat transfer fluid composition according to item 1 or 2 as a heat transfer fluid. [Section 18] Item 3. A heat transfer apparatus comprising a device and a mechanism for transferring heat to or from the device, the mechanism comprising the heat transfer fluid composition according to item 1 or 2. [Section 19] Item 3. A heat transfer method comprising the steps of: preparing a device; and transferring heat to or from the device using the heat transfer fluid composition according to item 1 or 2. Effect of the Invention

[0008] The composition according to the present disclosure thus prepared can provide a heat transfer fluid composition in the form of a novel mixture. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] In this specification, "containing" is a concept that encompasses all of "comprise," "consist essentially of," and "consist only of." In addition, in this specification, when a numerical range is shown as "A to B," it means A or more and B or less.

[0010] (1. Compositions for heat transfer fluids) The heat transfer fluid composition of the present disclosure comprises: m F 2m and / or C. n F (2n-2) (wherein m is an integer of 4 or more and 12 or less, other than 9; and n is an integer of 4 or more and 12 or less); (ii) water (wherein the content of such water is determined by the above-mentioned C9F 18(iii) fluoride ions (the content of such fluoride ions is 0.0001 to 0.1 parts by mass relative to 100 parts by mass of the total amount of the hexafluoropropene trimer represented by 18 The amount of the hexafluoropropene trimer represented by the formula (I) is 0.0000001 to 5 parts by mass relative to 100 parts by mass of the total amount of the hexafluoropropene trimer represented by the formula (I).

[0011] Hexafluoropropene trimer is C9F 18 Any known material represented by the following formula can be widely used, and there is no particular limitation.

[0012] Specific examples of such hexafluoropropene trimers include trimers containing at least one compound selected from the group consisting of compounds represented by the following formulas (I) to (III).

[0013] [ka]

[0014] In this specification, the compound represented by the above formula (I) includes both E and Z diastereomers, unless otherwise specified.

[0015] The hexafluoropropene trimer contained in the heat transfer fluid composition of the present disclosure may contain only one of the compounds represented by the above formulas (I) to (III), or may be a mixture containing two or three of these compounds.

[0016] The compounding ratio of the compound represented by the above formula (I) in the total amount of the HFP trimer (that is, the total of the compounds represented by formulas (I), (II) and (III)) is preferably 1% by mass or more, more preferably 10% by mass or more, even more preferably 30% by mass or more, even more preferably 40% by mass or more, particularly preferably 45% by mass or more, and particularly preferably 50% by mass or more, based on the total amount of the HFP trimer. The compound represented by formula (I) may be 85% by mass or more based on the total amount of the HFP trimer. In this case, the viscosity of the HFP trimer mixture is reduced. The compound represented by formula (I) is preferably 99% by mass or less, more preferably 90% by mass or less, even more preferably 85% by mass or less (or less), even more preferably 80% by mass or less, particularly preferably 70% by mass or less, and most preferably 60% by mass or less. The blending ratio of the compound represented by the above formula (I) relative to the total amount of the HFP trimer is, for example, 10% by mass or more and 90% by mass or less, 30% by mass or more and 90% by mass or less, 10% by mass or more and 85% by mass or less, 35% by mass or more and 85% by mass or less, 10% by mass or more and less than 85% by mass, 20% by mass or more and less than 85% by mass, 30% by mass or more and less than 85% by mass, 40% by mass or more and less than 85% by mass, 50% by mass or more and less than 85% by mass, 40% by mass or more and less than 80% by mass, 55% by mass or more and less than 85% by mass, 60% by mass or more and less than 85% by mass, 70% by mass or more and less than 85% by mass, 80% by mass or more and less than 85% by mass, 90% by mass or more and less than 95% by mass, 100% by mass or more and less than 8 ... The content may be from 30% to 90% by mass, preferably from 40% to less than 85% by mass, more preferably from 40% to 80% by mass, even more preferably from 45% to 70% by mass, and even more preferably from 50% to 60% by mass.

[0017] Similarly, the compounding ratio of the compound represented by formula (II) is preferably 1% by mass or more, more preferably 5% by mass or more, and particularly preferably 10% by mass or more, based on the total amount of the HFP trimer. The compound represented by formula (II) is preferably 70% by mass or less, more preferably 50% by mass or less, even more preferably 30% by mass or less, and particularly preferably 20% by mass or less, based on the total amount of the HFP trimer.

[0018] Similarly, the content of each compound represented by formula (III) is preferably 1% by mass or more, more preferably 5% by mass or more, and particularly preferably 10% by mass or more, based on the total amount of the HFP trimer. The content of the compound represented by formula (III) is preferably 70% by mass or less, more preferably 50% by mass or less, even more preferably 30% by mass or less, and particularly preferably 20% by mass or less, based on the total amount of the HFP trimer (100% by mass).

[0019] In the heat transfer fluid composition of the present disclosure, the mass ratio of the compound represented by formula (II) and the compound represented by formula (III) is not particularly limited, and may be, for example, 1:9 to 9:1, 2:8 to 8:2, 3:7 to 7:3, 4:6 to 6:4, or 4.5:5.5 to 5.5:4.5.

[0020] The compounds represented by the above formulas (I) to (III) may be produced by a conventional method, for example, by the method described in International Publication No. 2018 / 172919, and of course, are not limited thereto. They may also be obtained by trimerization using HFP as a raw material, and are not limited thereto, and may be obtained by widely adopting known methods.

[0021] The heat transfer fluid composition of the present disclosure is a compound represented by formulas (I) to (III) other than C9F 18 The hexafluoropropene may contain a hexafluoropropene trimer represented by the following formula:

[0022] The heat transfer fluid composition of the present disclosure may include a hexafluoropropene dimer.

[0023] The hexafluoropropene dimer may include (E)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, (Z)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, or 1,1,3,4,4,5,5-nonafluoro-2-(trifluoromethyl)-2-pentene.

[0024] In one embodiment, the heat transfer fluid composition of the present disclosure may include hexafluoropropene tetramer.

[0025] The hexafluoropropene tetramer can include 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

[0026] In the heat transfer fluid composition of the present disclosure, the content of the hexafluoropropene trimer can be 80 mass % or more, preferably 85 mass % or more, more preferably 90 mass % or more, for example 95 mass % or more, 98 mass % or more, 99 mass % or more, or 99.9 mass % or more, based on the total of the hexafluoropropene trimer and hexafluoropropene tetramer.

[0027] In the heat transfer fluid composition of the present disclosure, the content of hexafluoropropene trimer may be preferably 99.999% by mass or less, more preferably 99.99% by mass or less, for example 99.9% by mass or less, 99% by mass or less, 95% by mass or less, 90% by mass or less, or 85% by mass or less, based on the total of hexafluoropropene trimer and hexafluoropropene tetramer.

[0028] In the heat transfer fluid composition of the present disclosure, the content of the hexafluoropropene trimer may be, based on the total amount of the hexafluoropropene trimer and the hexafluoropropene tetramer, preferably from 80% by mass to 99.999% by mass, more preferably from 85% by mass to 99.99% by mass, for example, from 90% by mass to 99.99% by mass, from 95% by mass to 99.99% by mass, from 99% by mass to 99.99% by mass, or from 99% by mass to 99.9% by mass.

[0029] The total amount of the hexafluoropropene trimer and the hexafluoropropene tetramer in the heat transfer fluid composition may be preferably 80% by mass or more, more preferably 85% by mass or more, even more preferably 90% by mass or more, and even more preferably 95% by mass or more, for example 98% by mass or more, 99% by mass or more, or 99.9% by mass or more. The total amount of the hexafluoropropene trimer and the hexafluoropropene tetramer in the heat transfer fluid composition may be substantially 100% by mass. In other words, the heat transfer fluid composition of the present disclosure may be a mixture of the hexafluoropropene trimer and the hexafluoropropene tetramer.

[0030] (1-1.C m F 2m and / or C. n F (2n-2) ) In one embodiment, the heat transfer fluid composition of the present disclosure is 18 Hexafluoropropene (HFP) trimer represented by C m F 2m and / or C. n F (2n-2) (In the formula, m is an integer of 4 or more and 12 or less except 9, and n is an integer of 4 or more and 12 or less.)

[0031] m is an integer of 4 or more, preferably an integer of 5 or more, and more preferably an integer of 6 or more. Furthermore, n is an integer of 12 or less, preferably an integer of 11 or less, and more preferably an integer of 10 or less, with the proviso that m does not include 9. Furthermore, it is particularly preferable that m is 8.

[0032] n is an integer of 4 or more, preferably an integer of 5 or more, and more preferably an integer of 6 or more. Also, n is an integer of 12 or less, preferably an integer of 11 or less, and more preferably an integer of 10 or less. Furthermore, n is particularly preferably 9.

[0033] C m F 2m may be a chain compound or a cyclic compound which may have a substituted structure. The chain compound may be a so-called alkene, and may be a straight chain or a branched chain.

[0034] C n F (2n-2) may be a chain compound or a cyclic compound which may have a substituted structure. The chain compound may be a so-called diene or alkyne, and may be a straight chain or a branched chain.

[0035] This disclosure relates to m F 2m and / or C. n F (2n-2) The present invention is based on the discovery that a composition in which HFP trimer is coexisted with C surprisingly functions as a heat transfer fluid. m F 2m and / or C. n F (2n-2) The inclusion of improves the stability of the HFP trimer.

[0036] Also, C m F 2m and / or C. n F (2n-2) The content of is preferably 0.0001 mass % or more based on the entire heat transfer fluid composition of the present disclosure.

[0037] On the other hand, C m F 2m and / or C. n F (2n-2)The content of is preferably 10 mass % or less, more preferably 5 mass % or less, and further preferably 1 mass % or less, based on the entire heat transfer fluid composition of the present disclosure.

[0038] In one embodiment, in the heat transfer fluid composition, m F 2m and / or C. n F (2n-2) The content of is preferably 0.0001 part by mass or more, more preferably 0.01 part by mass or more, and even more preferably 0.1 part by mass or more, based on 100 parts by mass of the total of the HFP trimer.

[0039] On the other hand, in the heat transfer fluid composition, m F 2m and / or C. n F (2n-2) The content of is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 1 part by mass or less, relative to 100 parts by mass of the total of the HFP trimer.

[0040] In addition, C m F 2m and / or C. n F (2n-2) When a plurality of kinds are contained, the above content means the total amount of these.

[0041] C m F 2m and / or C. n F (2n-2) By setting the content of C9F in the above range, 18 This makes it possible to suppress the decomposition of the HFP trimer represented by the following formula (1): and thus makes it possible to suppress an increase in fluoride ions and an increase in acidity.

[0042] (1-2.Wed) In one embodiment, the heat transfer fluid composition of the present disclosure may contain water. The content of water in the heat transfer fluid composition may be 1 ppm by mass or more, and is preferably 5 ppm by mass or more. By making the water content at a certain level or more, for example 1 ppm by mass or more, it is possible to suppress the charging of the composition due to a decrease in the stability of the heat transfer fluid composition. In addition, the content of water in the heat transfer fluid composition is 1000 ppm by mass or less, preferably 500 ppm by mass or less, more preferably 100 ppm by mass or less, and even more preferably 20 ppm by mass or less. By making the water content at a certain level or less, for example 1000 ppm by mass or less, it is possible to suppress the charging of the composition due to a decrease in the stability of the heat transfer fluid composition. 18 Therefore, it is possible to suppress the decomposition of the HFP trimer represented by the following formula (1), and thus it is possible to suppress an excessive increase in fluoride ions and an increase in acidity.

[0043] In one embodiment, the water content is C9F 18 The amount is preferably 0.0001 part by mass or more, more preferably 0.0005 part by mass or more, and even more preferably 0.001 part by mass or more, relative to 100 parts by mass of the total of the compounds represented by the formula:

[0044] On the other hand, the water content is C9F 18 The amount is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 1 part by mass or less, relative to 100 parts by mass of the total of the compounds represented by the formula:

[0045] The heat transfer fluid composition of the present disclosure contains a predetermined amount of water, thereby improving the dielectric strength. The dielectric strength of the heat transfer fluid composition of the present disclosure may be preferably 40 kV or more, preferably 50 kV or more, and more preferably 60 kV or more.

[0046] (1-3. Fluoride ion) In one embodiment, the heat transfer fluid composition of the present disclosure may contain fluoride ions in an amount of 0.0000001 mass% or more relative to the entire composition. The amount of fluoride ions is preferably 0.000001 mass% or more relative to the entire composition, more preferably 0.0001 mass% or more, and even more preferably 0.001 mass% or more. By making the fluoride ion concentration 0.0000001 mass% or more, the stability of the heat transfer fluid composition can be maintained and the composition can be prevented from being charged.

[0047] The amount of fluoride ions contained in the heat transfer fluid composition of the present disclosure is 5% by mass or less, preferably 1% by mass or less, and more preferably 0.1% by mass or less, based on the entire composition. By keeping the amount of fluoride ions at 5% by mass or less, the fluoride ions can be easily obtained even when heated. 18 It is possible to suppress the decomposition of the compound represented by the formula:

[0048] In one embodiment, the amount of fluoride ions is C9F 18

[0041] The amount of the compound represented by the formula (I) is preferably 0.0000001 parts by mass or more, more preferably 0.000001 parts by mass or more, even more preferably 0.0001 parts by mass or more, and still more preferably 0.001 parts by mass or more, relative to 100 parts by mass of the total of the compounds represented by the formula (I).

[0049] On the other hand, the amount of fluoride ions in water is C9F 18 The amount is preferably 5 parts by mass or less, more preferably 1 part by mass or less, and even more preferably 0.1 parts by mass or less, relative to 100 parts by mass of the total of the compounds represented by the formula:

[0050] The amount of fluoride ions can be measured, for example, by adding 1 volume (weight) of distilled water to the sample, shaking for about 20 seconds to extract F ions into the aqueous layer, then extracting 2.5 to 3.0 mL of the aqueous layer with a dropper and mixing it with twice the volume of TISAB solution (total ionic strength adjustment buffer solution) to obtain a sample, which can then be measured with a fluoride ion meter.

[0051] As the fluoride ion source, a wide variety of known fluoride ion sources can be used, and there is no particular limitation.Specific examples include hydrogen fluoride, sodium fluoride, sodium hydrogen fluoride, potassium fluoride, potassium hydrogen fluoride, lithium fluoride, cesium fluoride, calcium fluoride, magnesium fluoride, aluminum fluoride, zinc fluoride, silver fluoride, and iron fluoride ions.These may contain only one type or may contain multiple types.Preferably, the fluoride ion source is hydrogen fluoride.

[0052] (1-4. Other ingredients) The heat transfer fluid composition of the present disclosure may contain perfluorotripropylamine in addition to the hexafluoropropene trimer. The heat transfer fluid composition containing the hexafluoropropene trimer and perfluorotripropylamine may be a pseudoazeotropic liquid. By the heat transfer fluid composition being a pseudoazeotropic liquid, even if the heat transfer fluid composition is vaporized, the composition undergoes little change, making it easy to handle.

[0053] Here, the pseudo-azeotropic liquid means a liquid in which the difference in molar fraction of each component contained in the pseudo-azeotropic liquid between the gas phase and the liquid phase is within 10%.

[0054] Perfluorotripropylamine, also known as tris(heptafluoropropyl)amine or N,N-bis(heptafluoropropyl)amine, has the general formula: N(CF2CF2CF3) a (CF(CF3)CF3) 3-a (a is an integer of 0 to 3). Perfluorotripropylamine may contain only one type of compound represented by the above general formula, or may contain multiple types. N(CF2CF2CF3)3 is preferred, but N(CF2CF2CF3) may also be used as an impurity. a (CF(CF3)CF3) 3-a (wherein a is an integer of 0 to 2). Specific examples include the product name "Fluorinert (registered trademark)" (manufactured by 3M) (FC-3283).

[0055] The heat transfer fluid composition of the present disclosure may further include perfluoropolyethers, and methoxytridecafluoroheptene isomer mixtures, perfluorotributylamine, and the like.

[0056] The perfluoropolyether is preferably General formula: RO-Rf 1 -R' It is expressed as During the ceremony, R and R' may be the same or different and are -C m F 2m+1 where m is an integer from 1 to 8; and Rf 1 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeat units, said repeat units being: (i) -CFXO-, where X is F or CF; (ii) -CF2CFXO- (wherein X is F or CF3); (iii) -CFXCF2O- (wherein X is F or CF3); (iv) -CF2CF2CF2O-; or (v) -CF2CF2CF2CF2O- or Rf 1 teeth, (vi) -(CF2) n -CFY-O- (wherein n is an integer of 0 to 3, and Y is a group represented by the general formula -ORf 2 A monovalent group represented by Z, where Rf 2 is a divalent fluoropolyoxyalkylene group having 2 to 20 repeating units represented by -CFXO-, -CF2CFXO-, -CF2CF2CF2O-, or -CF2CF2CF2CF2O-, where each X is the same or different and is F or CF3, and Z is a monovalent C 1-5 It is a divalent group represented by the formula (I) (a perfluoroalkyl group).

[0057] Specific examples of perfluoropolyethers include those with the product names GALDEN (registered trademark) "HT135" and GALDEN (registered trademark) "HT110" (both manufactured by Solvay).

[0058] The methoxytridecafluoroheptene isomer mixture is specifically methyl-perfluoroheptene ether (MPHE) (CF 13 OCH3). A specific example is the product name "Opteon SF10" (manufactured by Chemours).

[0059] When the heat transfer fluid composition of the present disclosure includes perfluorotripropylamine, perfluoropolyether, and a mixture of methoxytridecafluoroheptene isomers, these and C9F 18 Since the heat transfer fluid properties of the heat transfer fluid composition as a whole are similar to those of the compound represented by the formula (I), regardless of the content ratio of these compounds, the heat transfer fluid properties of the heat transfer fluid composition as a whole are basically unchanged. Therefore, in this case, the heat transfer fluid composition of the present disclosure contains C9F 18 The compound represented by the formula (I) is preferably contained in an amount of 40% by mass to 99.9% by mass, more preferably 60% by mass to 99.9% by mass, and further preferably 80% by mass to 99.9% by mass.

[0060] (1-5. Impurities)

[0061] The heat transfer fluid composition of the present disclosure may contain a conductive substance. The content of the conductive substance is 100 mass ppm or less, preferably 75 mass ppm or less, more preferably 50 mass ppm or less, and even more preferably 10 mass ppm or less. In particular, metals and metal ions may cause a short circuit when a conductive substance penetrates through a gap in a device, so the content of the conductive substance in the present disclosure may be considered with a focus on "at least one of metals and metal ions" as necessary.

[0062] In another aspect, the heat transfer fluid composition of the present disclosure has a content of insoluble matter of 5 μm or more (including solid matter such as resin pieces from the container, dust and dirt mixed in from the air, regardless of whether they are conductive or not) of preferably 10 pieces / mL or less, more preferably 5 pieces / mL or less, and even more preferably 3 pieces / mL or less.

[0063] (1-6. Method for producing heat transfer fluid composition with reduced impurities) The present disclosure provides a method for producing a heat transfer fluid composition having reduced impurities. The method for producing a heat transfer fluid composition of the present disclosure includes a step of purifying a composition containing a heat transfer fluid compound and a conductive material to obtain a heat transfer fluid composition having reduced impurities from the composition, (1) The heat transfer fluid compound is C9F 18 The composition contains at least one selected from the group consisting of a compound represented by the formula: (2) The purification treatment is a treatment using at least one selected from the group consisting of a filtration filter, an ion exchange resin, a metal ion removal filter, a metal ion removal agent, distillation, rectification, centrifugation, and electrostatic adsorption. In the present disclosure, the term "reduction" in the purification refers to decreasing the content of the conductive substance in the composition.

[0064] According to the research of the present inventors, the conventionally known so-called heat transfer fluids contain conductive substances (metals, metal ions, carbon, conductive polymers, superconducting ceramics, etc.). These conductive substances include not only those that are inevitably mixed in due to the process during the production of the heat transfer fluid, but also those that are mixed in after the fact during use after production. When these heat transfer fluids are used for the purpose of transferring heat to or from a device, the conductive substances may enter through gaps in the device and cause a short circuit. In addition, when the heat transfer fluid is used repeatedly, there is a possibility that the blockage of the pipes circulating the heat transfer fluid may occur. The conventionally known heat transfer fluids can also be described as "compositions containing a heat transfer fluid and a conductive substance" because they contain a conductive substance. The method for producing a composition for a heat transfer fluid disclosed herein is characterized in that a composition containing a heat transfer fluid and a conductive substance (hereinafter also referred to as a "pre-purification composition") is subjected to a specific purification treatment to obtain a composition for a heat transfer fluid in which the conductive substance is reduced.

[0065] (1-6-1) Composition containing a heat transfer fluid compound and a conductive material (pre-purification composition) The pre-purification composition may contain a heat transfer fluid compound and an electrically conductive material. 18 The composition contains at least one selected from the group consisting of a compound represented by the formula (I) below, a perfluoroalkene ether, and a perfluoropolyether.

[0066] (1-6-2)C9F 18 A compound represented by C9F 18 The compound represented by the formula (I) is the hexafluoropropene trimer described above.

[0067] (1-6-3) Perfluoroalkene ether The perfluoroalkene ether preferably has the following formula (V): C7F 13 OR (V) (wherein R is Me or Et.) Any known material represented by the following formula can be widely used.

[0068] The perfluoroalkene ether represented by the above formula (V) is, for example, CF3(CF2) x CF=CFCF(OR)(CF2) y CF3, CF3(CF2) x C(OR)=CFCF2(CF2) y CF3, CF3CF = CFCF(OR)(CF2) x (CF2) y CF3 and CF3(CF2) x CF=C(OR)CF2(CF2) y CF3, (wherein R is Me or Et, x and y are independently 0, 1, 2 or 3, and x+y=1, 2 or 3).

[0069] Specific examples of perfluoroalkene ethers represented by the above formula (V) include 5-methoxyperfluoro-3-heptene, 3-methoxyperfluoro-3-heptene, 4-methoxyperfluoro-2-heptene, 3-methoxyperfluoro-2-heptene, 4-methoxyperfluoro-2-pentene, 2-methoxyperfluoro-2-pentene, 3-methoxyperfluoro-2-pentene, 2-methoxyperfluoro-3-pentene, cis- and trans-2-methoxyperfluoro-2-octene, and 2-methoxyperfluoro-3-octene.

[0070] A preferred structure of the perfluoroalkene ether represented by the above formula (V) is methyl perfluoroheptene ether. This methyl perfluoroheptene ether may contain a mixture of two or more structures and / or stereoisomers. Specific examples of methyl perfluoroheptene ether include a mixture of about 48 to about 52% by mass of 5-methoxyperfluoro-3-heptene, about 18 to about 22% by mass of 3-methoxyperfluoro-3-heptene, about 18 to about 22% by mass of 4-methoxyperfluoro-2-heptene, and about 6 to about 10% by mass of 4-methoxyperfluoro-3-heptene.

[0071] The perfluoroalkene ether is specifically methyl-perfluoroheptene ether (MPHE) (CF 13 OCH3) is included. A specific example is the product name "Opteon SF10" (manufactured by Chemours).

[0072] (1-6-4) Perfluoropolyether The perfluoropolyether (PFPE) is preferably represented by the following formula (IV): RO-Rf 1 -R' (IV) It is expressed as During the ceremony, R and R' may be the same or different and are -C m F 2m +1, where m is an integer from 1 to 8; and Rf 1 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeat units, said repeat units being: (i) -CFXO-, where X is F or CF; (ii) -CF2CFXO- (wherein X is F or CF3); (iii) -CFXCF2O- (wherein X is F or CF3); (iv) -CF2CF2CF2O-; or (v) represented by -CF2CF2CF2CF2O-, or Rf 1 teeth, (vi) -(CF2) n -CFY-O- (wherein n is an integer of 0 to 3, and Y is a group represented by the general formula -ORf 2 A monovalent group represented by Z, where Rf 2 is a divalent fluoropolyoxyalkylene group having 2 to 20 repeating units represented by -CFXO-, -CF2CFXO-, -CF2CF2CF2O-, or -CF2CF2CF2CF2O-, where each X is the same or different and is F or CF3, and Z is a monovalent C 1-5A divalent group represented by the formula (IV) is a perfluoroalkyl group. Here, as the PFPE represented by the formula (IV), a wide variety of known PFPEs can be used.

[0073] A preferred structure of the PFPE represented by the above formula (IV) is one in which m is an integer of 1 to 3 and Rf is selected from the following: (1)-(CF2O) a -(CF2CF2O) b -(CF2-(CF2) z’ -CF2O) c (In the formula, a, b, and c are integers of 100 or less. z' is an integer of 1 or 2. a≧0, b≧0, c≧0, and a+b>0. Among these conditions, it is particularly preferable that a, b, and c are integers of 50 or less, a and b are each >0, and b / a is between 0.1 and 10.); (2)-(C3F6O) c’ -(C2F4O) b -(CFXO) t - (wherein, each occurrence of X is independently selected from -F and -CF3; b, c' and t are integers of 100 or less, with c'>0, b≧0 and t≧0. Among these conditions, it is particularly preferred that b and t>0, c' / b is between 0.2 and 5.0, and (c'+b) / t is between 5 and 50); or (3)-(C3F6O) c’ -(CFXO) t - (wherein, each occurrence of X is independently selected from -F and -CF3; c' and t are integers of 100 or less, c'>0, t≧0. Among these conditions, it is particularly preferable that t>0, and c' / t is preferably within the range of 5 to 50.)

[0074] Specific examples of perfluoropolyethers include those with the product names GALDEN (registered trademark) "HT135" and GALDEN (registered trademark) "HT110" (both manufactured by Solvay).

[0075] (1-6-5) Additional heat transfer fluid compounds that may be included The heat transfer fluid in this disclosure is the aforementioned three-component (C9F 18 The at least one selected from the group consisting of a compound represented by the formula (I), a perfluoroalkene ether, and a perfluoropolyether, which are also collectively referred to as the "three components of the present disclosure.") may also include an additional heat transfer fluid compound different from the three components (I), which is also referred to as the "additional component.") The additional component may be one or more types, and examples of the additional component include hexafluoropropene dimer, hexafluoropropene tetramer, perfluorotripropylamine, and perfluorotributylamine.

[0076] The hexafluoropropene dimer may include (E)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, (Z)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, or 1,1,3,4,4,5,5-nonafluoro-2-(trifluoromethyl)-2-pentene.

[0077] The hexafluoropropene tetramer can include 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

[0078] Perfluorotripropylamine, also known as tris(heptafluoropropyl)amine or N,N-bis(heptafluoropropyl)amine, has the general formula: N(CF2CF2CF3) n (CF(CF3)CF3) 3-n (n is an integer of 0 to 3). Perfluorotripropylamine may contain only one type of compound represented by the above general formula, or may contain multiple types. N(CF2CF2CF3)3 is preferred, but N(CF2CF2CF3) may also be used as an impurity. n (CF(CF3)CF3) 3-n(n is an integer of 0 to 2). Specific examples include the product name "Fluorinert (registered trademark)" (manufactured by 3M) (FC-3283).

[0079] When the heat transfer fluid composition of the present disclosure contains the three components of the present disclosure and the additional component, it is preferable that the heat transfer fluid composition contains 80% by mass or more of the three components of the present disclosure, more preferably 85% by mass or more, even more preferably 90% by mass or more, and most preferably 95% by mass or more, based on the entire heat transfer fluid. In the manufacturing method of the present disclosure, the properties of the kinetic viscosity, freezing point, and boiling point of the composition (pre-purification composition) containing the heat transfer fluid compound and the conductive substance affect the efficiency of removing the conductive substance from the pre-purification composition in relation to a predetermined purification treatment (treatment using at least one selected from the group consisting of a filtration filter, an ion exchange resin, a metal ion removal filter, a metal ion removal agent, distillation, rectification, centrifugation, and electrostatic adsorption), so that the heat transfer fluid compound is preferably substantially composed of only the three components of the present disclosure, but when the additional component is contained, it is preferable that the heat transfer fluid composition contains 80% by mass or more of the three components of the present disclosure based on the entire heat transfer fluid as described above.

[0080] In both cases where an additional component is included in addition to the three components of the present disclosure, and in both cases where an additional component is not included, for example, as a composition (pre-purification composition) containing a heat transfer fluid compound and a conductive substance, a wide variety of synthetic or commercially available products of each of the three components of the present disclosure as described above, and / or products in which a conductive substance is subsequently mixed in by using them as a heat transfer fluid for a certain period of time, can be used.

[0081] (1-6-6) Conductive material The conductive material may be at least one selected from the group consisting of metals, metal ions, metal oxides, metal nitrides, carbon, conductive polymers, and superconducting ceramics. When a heat transfer fluid containing a conductive material is used for transferring heat to or from a device, the conductive material may infiltrate through gaps in the device, causing a short circuit. In addition, when the heat transfer fluid is used repeatedly, the conductive material may cause blockage of the pipes circulating the heat transfer fluid. Therefore, in order to improve the performance of the heat transfer fluid, it is important to reduce the content of these conductive materials. The shape and size of the conductive material vary depending on the type of conductive material, but are generally about 0.001 to 10 μm.

[0082] Examples of metal species in the metals, metal ions, metal oxides, and metal nitrides serving as conductive substances include Al, Ba, Be, Bi, Ca, Co, Cr, Cu, Fe, Ga, K, Li, Mg, Mn, Na, Ni, Pb, Sr, V, and Zn.

[0083] The metal as the conductive material may be a simple substance or an alloy, and is typically contained in the form of fine particles.

[0084] The ions as the conductive substance include all ionic forms that each metal species can take. The ions as the conductive substance may be present in a dissolved form as ions having any valence, or may be present in a form in which the ions exist as ions in a substance, for example, in a coordinated form.

[0085] The metal oxide serving as the conductive material may be an oxide of one type of metal, or an oxide of multiple types of metals (that is, a composite oxide).

[0086] The metal nitride serving as the conductive material may be a nitride of one type of metal, or may be a nitride of multiple types of metals (that is, a composite nitride).

[0087] An example of carbon as a conductive material is carbon black.

[0088] Examples of conductive polymers that serve as conductive substances include polyacetylene and polythiophene.

[0089] The content of the conductive substance contained in the pre-purification composition is not limited, but for example, if it is 150 mass ppm or more (even more preferably 500 mass ppm or more), the content of the conductive substance can be effectively reduced in the production method of the present disclosure. The content of the conductive substance can be measured using an inductively coupled plasma mass spectrometer (ICP-MS) as described in the Examples.

[0090] In addition, the pre-purification composition may contain insoluble matter, including solid matter such as resin pieces from the container, dust and dirt mixed in from the air, regardless of whether it is conductive or not, but if the content of insoluble matter of 5 μm or more is 50 pieces / mL or more (even 100 pieces / mL or more), the content of insoluble matter can be effectively reduced at the same time in the purification process of the present disclosure that reduces the content of conductive substances. The number of insoluble matter (fine particles) of conductive substances contained in the composition can be measured using a liquid particle counter as described in the examples.

[0091] (1-6-7) Physical properties of pre-purified composition The pre-purification composition is a composition containing a heat transfer fluid and a conductive substance, and in the production method disclosed herein, is subjected to a purification treatment using at least one selected from the group consisting of a filtration filter, an ion exchange resin, a metal ion removal filter, a metal ion removal agent, distillation, rectification, centrifugation, and electrostatic adsorption.

[0092] When the content of the conductive material in the pre-purification composition is reduced by the above-mentioned purification treatment, it is preferable from the viewpoint of purification efficiency that the pre-purification composition has a low kinetic viscosity, a low freezing point, and a high boiling point. By using the heat transfer fluid as the main component (preferably 80 mass% or more) of the above-mentioned three components of the present disclosure, the pre-purification composition is likely to have the physical properties of a low kinetic viscosity, a low freezing point, and a high boiling point.

[0093] The kinematic viscosity of the pre-purification composition at -40°C is preferably 15 cSt or less, more preferably 10 cSt or less, and even more preferably 7 cSt or less. The low kinematic viscosity of 15 cSt or less improves filterability, and therefore the efficiency of the purification process using a filtration filter, a metal ion removal filter, etc. can be improved. The method for measuring the kinematic viscosity at -40°C in the present disclosure is the method described in the Examples.

[0094] The freezing point of the pre-purification composition is preferably -35°C or lower, more preferably -50°C or lower, even more preferably -70°C or lower, and most preferably -100°C or lower. A freezing point of -35°C or lower allows purification treatment at low temperatures, reducing loss of heat transfer fluid due to evaporation and the like and improving the efficiency of the purification treatment. The method for measuring the freezing point in the present disclosure is the method described in the Examples.

[0095] The boiling point of the pre-purification composition is preferably 90° C. or higher, more preferably 95° C. or higher, and even more preferably 105° C. or higher. By having a boiling point of 90° C. or higher, for the same reason as a low freezing point, loss of heat transfer fluid due to evaporation or the like can be reduced, and the efficiency of the purification process can be improved. Note that the method for measuring the boiling point in this disclosure is the method described in the Examples.

[0096] (1-6-8) Purification treatment of raw composition In the production method of the present disclosure, the pre-purified composition is subjected to a purification treatment using at least one selected from the group consisting of a filtration filter, an ion exchange resin, a metal ion removal filter, a metal ion removal agent, distillation, rectification, centrifugation, and electrostatic adsorption.

[0097] These purification means may be applied according to conventional methods, but in the manufacturing method of the present disclosure, purification treatment using a filter is particularly preferred. When using a filter, the upper and lower limits of the filter pore size are not limited, but for example, the upper limit can be set to 5 μm or less, 1 μm or less, 0.5 μm or less, or 0.1 μm or less. In addition, for example, the lower limit can be set to 1.0 nm or more, 0.5 nm or more, 0.2 nm or more, or 0.1 nm or more.

[0098] The ion exchange resin may be either a cation exchange resin or an anion exchange resin. For example, an ion exchange resin having an amino group and / or a quaternary ammonium group as a functional group can be used as the anion exchange resin. The ion exchange resin is preferably a strongly basic anion exchange resin. The basicity of the anion exchange resin can be set variously depending on the type of polymer skeleton and / or functional group. The anion exchange resin may be a commercially available product, such as the "Diaion (registered trademark) SA" series manufactured by Mitsubishi Chemical Corporation, the "A200" manufactured by Purolite Co., Ltd., or the "Amberlite (registered trademark)" series manufactured by Organo Co., Ltd. can be used. For example, an ion exchange resin having a carboxylic acid group and / or a sulfonic acid group as a functional group can be used as the cation exchange resin. The acidity of the cation exchange resin can be set variously depending on the type of polymer skeleton and / or functional group. The cation exchange resin may be a commercially available product, such as the "Diaion (registered trademark) SK" series manufactured by Mitsubishi Chemical Corporation, "C100" manufactured by Purolite Corporation, or the "Amberlite (registered trademark)" series manufactured by Organo Corporation.

[0099] Examples of the metal ion remover include chelating agents, activated carbon, etc. Examples of the chelating agent that can be used include CRB03, CRB05, CR20 (all manufactured by Mitsubishi Chemical Corporation), Si-Thiol, Si-Thiourea, Si-TMT, Si-DMT, Si-SCX-2, Si-Amine, Si-Trisamine, Si-Imidazole, Si-TBD, Si-PHI (all manufactured by SiliCycle), MuromacXMS-5418 (manufactured by Muromachi Chemical Co., Ltd.), IRC76-HG, IRC748, IRC747UPS (all manufactured by Organo Corporation), S910 (manufactured by Purolite Co., Ltd.), MPA (manufactured by Reaxa QuadraPure Co., Ltd.), etc. Examples of activated carbon include "Shirasagi (registered trademark)" manufactured by Osaka Gas Chemicals Co., Ltd., "Filtrasorb (registered trademark) CAL," "Diahope (registered trademark)," "Diasorb (registered trademark)" manufactured by Calgon Carbon Japan Co., Ltd., and the "Evadia (registered trademark)" series manufactured by Suing Corporation.

[0100] By undergoing the above purification treatment, a heat transfer fluid composition (purified composition) having a reduced content of conductive substances can be obtained.

[0101] The above-mentioned production method includes the purification step, but may also include other steps, such as a step of adding an additive such as a stabilizer to the heat transfer fluid composition.

[0102] (2. Heat Transfer Fluid) The heat transfer fluid composition of the present invention can be used in combination with components other than the heat transfer fluid composition (hereinafter, a fluid containing a heat transfer fluid composition and components other than the heat transfer fluid composition is referred to as a heat transfer fluid). The heat transfer fluid of the present disclosure comprises the compounds represented by the above formulas (I) to (III), as well as C m F 2m and / or C. n F (2n-2) In addition to water and / or fluoride ions, the heat transfer fluid composition may contain any additive other than the heat transfer fluid composition, as long as the additive does not impair its effect and purpose. Examples of such optional additives include stabilizers.

[0103] The stabilizer exerts a stabilizing effect, thereby functioning as a so-called acid acceptor or antioxidant. The main stabilizing effects include the effect of preventing the decomposition of the HFP trimer by capturing radicals generated in the system, and the acid-accepting effect of preventing further decomposition of the HFP trimer by the acid by capturing the acid generated in the system.

[0104] As the stabilizer, a wide variety of known stabilizers can be used. Among them, it is preferable to use one or more stabilizers selected from the group consisting of unsaturated alcohol stabilizers, nitro stabilizers, amine stabilizers, phenol stabilizers, and epoxy stabilizers, because they can effectively suppress the occurrence of metal corrosion caused by the composition.

[0105] As the unsaturated alcohol-based stabilizer, a wide variety of known ones can be used. For example, one or more selected from the group consisting of 3-buten-2-ol, 2-buten-1-ol, 4-propen-1-ol, 1-propen-3-ol, 2-methyl-3-buten-2-ol, 3-methyl-3-buten-2-ol, 3-methyl-2-buten-1-ol, 2-hexen-1-ol, 2,4-hexadiene-1-ol and oleyl alcohol can be used.

[0106] As the nitro stabilizer, a wide variety of known stabilizers can be used. As the aliphatic nitro compound, for example, nitromethane, nitroethane, 1-nitropropane, 2-nitropropane, etc. can be mentioned. As the aromatic nitro compound, for example, one or more selected from the group consisting of nitrobenzene, o-, m- or p-dinitrobenzene, o-, m- or p-nitrotoluene, dimethylnitrobenzene, m-nitroacetophenone, o-, m- or p-nitrophenol, o-nitroanisole, m-nitroanisole, and p-nitroanisole can be used.

[0107] As the amine-based stabilizer, it is possible to widely adopt known ones. For example, it is possible to use one or more selected from the group consisting of pentylamine, hexylamine, diisopropylamine, diisobutylamine, di-n-propylamine, diallylamine, triethylamine, N-methylaniline, pyridine, morpholine, N-methylmorpholine, triallylamine, allylamine, α-methylbenzylamine, dimethylamine, trimethylamine, ethylamine, diethylamine, triethylamine, propylamine, isopropylamine, dipropylamine, tripropylamine, butylamine, isobutylamine, dibutylamine, tributylamine, dipentylamine, tribenzylamine, 2-ethylhexylamine, aniline, N,N-dimethylaniline, N,N-diethylaniline, ethylenediamine, propylenediamine, diethylenetriamine, tetraethylenepentamine, benzylamine, dibenzylamine, diphenylamine and diethylhydroxylamine.

[0108] As the phenol-based stabilizer, a wide variety of known stabilizers can be used, for example, one or more selected from the group consisting of 2,6-ditertiarybutyl-4-methylphenol, 3-cresol, phenol, 1,2-benzenediol, 2-isopropyl-5-methylphenol, and 2-methoxyphenol can be used.

[0109] As the epoxy stabilizer, a wide variety of known ones can be used, for example, one or more selected from the group consisting of butylene oxide, 1,2-propylene oxide, 1,2-butylene oxide, butyl glycidyl ether, diethylene glycol diglycidyl ether, and 1,2-epoxy-3-phenoxypropane can be used.

[0110] The combination of stabilizers having different stabilizing effects more effectively prevents decomposition of the HFP trimer, which may occur for various reasons. For this reason, the stabilizer is preferably one or more selected from the group consisting of the above-mentioned epoxy-based stabilizer, as well as unsaturated alcohol-based stabilizers, nitro-based stabilizers, and phenol-based stabilizers.

[0111] From the viewpoint of effectively suppressing acid liberation from the HFP trimer and suppressing metal corrosion caused by the liquid composition, the content of the stabilizer in the entire heat transfer fluid is preferably 0.0001% by mass or more, and more preferably 0.01% by mass or more. On the other hand, in consideration of avoiding undesirable changes in the physical properties of the liquid composition due to excessive addition of the stabilizer, the content of the stabilizer in the entire heat transfer fluid is preferably 10% by mass or less, and more preferably 5% by mass or less.

[0112] (3. Use of heat transfer fluid composition or heat transfer fluid) The heat transfer fluid composition or heat transfer fluid of the present disclosure is used to remove heat from or supply heat to various heat transfer objects. The heat transfer objects in the present disclosure are items, devices, and atmospheres that are cooled, heated, or maintained at a temperature to be controlled. Such heat transfer objects include electrical components, mechanical components, and optical components, as well as processed products and assemblies thereof. Specific examples of heat transfer objects in the present disclosure include, but are not limited to, wafers used to manufacture semiconductor devices, microprocessors, power control semiconductors, electric branch switches, power transformers, circuit boards, multi-chip modules, mounted and unmounted semiconductor devices, chemical reactors, nuclear reactors, fuel cells, lasers, missile parts, and the like.

[0113] The heat transfer fluid composition or heat transfer fluid of the present disclosure can also be utilized as a two-phase immersion cooling, chiller fluid, Rankine cycle working fluid.

[0114] The heat transfer fluid composition or heat transfer fluid of the present disclosure can be used in devices that are designed to use them to transfer heat, replacing the heat transfer fluid currently used in the device.

[0115] The heat transfer fluid composition or heat transfer fluid of the present disclosure can be a drop-in replacement, a near drop-in replacement, or a retrofit replacement for a heat transfer fluid currently in use. The term "drop-in replacement" means that the replacement can be made without any changes to the equipment. The term "near drop-in replacement" means that the replacement can be made with almost no changes to the equipment. The term "retrofit replacement" means that the replacement can be made with minimal changes (without significant changes) to the equipment. The heat transfer fluid composition or heat transfer fluid of the present disclosure is preferably a drop-in replacement or a near drop-in replacement for the above-mentioned heat transfer fluid.

[0116] Whether or not a drop-in substitution, near drop-in substitution, or retrofit substitution is possible can be determined by whether or not all of the following conditions are met. (i) The boiling point of the heat transfer fluid is at least about 80% or more, and preferably at least about 85% or more, of the boiling point of the heat transfer fluid prior to the exchange. (ii) The pour point of the heat transfer fluid is equal to or lower than the pour point of the heat transfer fluid before replacement. (iii) The kinematic viscosity of the heat transfer fluid is at least about 200% or less, and preferably at least about 150% or less, of the kinematic viscosity of the heat transfer fluid prior to the exchange. (iv) The heat transfer fluid is compatible with the heat transfer fluid before replacement in any proportion.

[0117] By setting the boiling point of the heat transfer fluid composition or heat transfer fluid of the present disclosure to at least about 80% or more, preferably at least about 85% or more, of the boiling point of the heat transfer fluid before replacement, it is possible to suppress the occurrence of cavitation and leakage from the device. The upper limit of the boiling point of the heat transfer fluid is not particularly limited, but may be, for example, at least about 130% or less of the boiling point of the heat transfer fluid before replacement.

[0118] By making the pour point of the heat transfer fluid composition or heat transfer fluid of the present disclosure equal to or lower than the pour point of the heat transfer fluid before replacement, it becomes possible to use it at temperatures lower than the conventional use temperature, and the use temperature range can be expanded. The upper limit of the pour point of the heat transfer fluid is not particularly limited, but may be, for example, a temperature 30°C higher than the pour point of the heat transfer fluid before replacement.

[0119] By setting the kinetic viscosity of the heat transfer fluid composition or heat transfer fluid of the present disclosure to at least about 200% or less, preferably at least about 150% or less, of the kinetic viscosity of the heat transfer fluid before replacement, it is possible to suppress an increase in power consumption or reduce power consumption. The kinetic viscosity is preferably compared at the kinetic viscosity at the operating temperature, but is not limited thereto, and can be compared at any temperature of, for example, -20°C to -40°C, specifically at -20°C.

[0120] The heat transfer fluid composition or heat transfer fluid of the present disclosure is compatible with the heat transfer fluid before replacement in any desired ratio, making replacement work easy.

[0121] Furthermore, the heat transfer fluid composition or heat transfer fluid of the present disclosure satisfies the following conditions, making it more suitable as a drop-in replacement, a near drop-in replacement, or a retrofit replacement. (v) The heat transfer fluid composition or heat transfer fluid of the present disclosure has a dielectric constant that is 120% or less of the heat transfer fluid prior to replacement. (vi) The heat transfer fluid composition or heat transfer fluid of the present disclosure has a dielectric strength of 90% or more of the heat transfer fluid prior to replacement. (vii) The heat transfer fluid composition or heat transfer fluid of the present disclosure has a specific heat of 90% or more of the heat transfer fluid prior to replacement. (viii) The heat transfer fluid composition or heat transfer fluid of the present disclosure has a thermal conductivity of 90% or more of the heat transfer fluid before replacement.

[0122] The dielectric constant of the heat transfer fluid composition or heat transfer fluid of the present disclosure is set to 120% or less of the dielectric constant of the heat transfer fluid before replacement, so that the composition or the heat transfer fluid can be suitably used as a replacement composition. The lower limit of the dielectric constant of the heat transfer fluid is not particularly limited, but may be, for example, 80% or more of the dielectric constant of the heat transfer fluid before replacement.

[0123] The heat transfer fluid composition or heat transfer fluid of the present disclosure can be suitably used as a replacement composition by making the dielectric strength of the heat transfer fluid 90% or more of the dielectric strength of the heat transfer fluid before replacement. The upper limit of the dielectric strength of the heat transfer fluid is not particularly limited, but may be, for example, 120% or less of the dielectric strength of the heat transfer fluid before replacement.

[0124] The heat transfer fluid composition or heat transfer fluid of the present disclosure can be suitably used as a replacement composition by making the specific heat of the heat transfer fluid 90% or more of the specific heat of the heat transfer fluid before replacement. The upper limit of the specific heat of the heat transfer fluid is not particularly limited, but may be, for example, 120% or less of the specific heat of the heat transfer fluid before replacement.

[0125] The heat transfer fluid composition or heat transfer fluid of the present disclosure can be suitably used as a replacement composition by making the thermal conductivity of the heat transfer fluid 90% or more of the thermal conductivity of the heat transfer fluid before replacement. The upper limit of the thermal conductivity of the heat transfer fluid is not particularly limited, but may be, for example, 120% or less of the thermal conductivity of the heat transfer fluid before replacement.

[0126] The boiling point of the heat transfer fluid composition or heat transfer fluid of the present disclosure may be preferably 105° C. or higher, more preferably 108° C. or higher. The upper limit of the boiling point of the heat transfer fluid composition or heat transfer fluid of the present disclosure is not particularly limited, but may be, for example, 150° C. or lower, 130° C. or lower, or 120° C. or lower.

[0127] The pour point of the heat transfer fluid composition or heat transfer fluid of the present disclosure may be preferably −80° C. or lower, more preferably −100° C. or lower, and even more preferably −110° C. or lower. The lower limit of the pour point of the heat transfer fluid composition or heat transfer fluid of the present disclosure is not particularly limited, and may be, for example, −180° C. or higher, or −160° C. or higher.

[0128] The kinematic viscosity of the heat transfer fluid composition or heat transfer fluid of the present disclosure may be preferably 6.0 cSt or less, more preferably 5.0 cSt or less, even more preferably 4.0 cSt or less, and even more preferably 3.5 cSt or less at −20° C. In addition, the lower limit of the kinematic viscosity of the heat transfer fluid composition or heat transfer fluid of the present disclosure is not particularly limited, but may be, for example, 1.0 cSt or more.

[0129] The dielectric constant of the heat transfer fluid composition or heat transfer fluid of the present disclosure may be preferably 3.0 or less, more preferably 2.5 or less, and even more preferably 2.0 or less. The lower limit of the dielectric constant of the heat transfer fluid composition or heat transfer fluid of the present disclosure is not particularly limited, but may be, for example, 1.1 or more.

[0130] The dielectric strength of the heat transfer fluid composition or heat transfer fluid of the present disclosure may be preferably 40 kV or more, more preferably 50 kV or more. The upper limit of the dielectric strength of the heat transfer fluid composition or heat transfer fluid of the present disclosure is not particularly limited, but may be, for example, 150 kV or less, or 100 kV or less.

[0131] The specific heat of the heat transfer fluid composition or heat transfer fluid of the present disclosure may be preferably 800 J / kg·K or more, more preferably 900 J / kg·K or more, and even more preferably 1000 J / kg·K or more at 30° C. In addition, the upper limit of the specific heat of the heat transfer fluid composition or heat transfer fluid of the present disclosure is not particularly limited, but may be, for example, 2000 J / kg·K or less, or 1500 J / kg·K or less.

[0132] The thermal conductivity of the composition for heat transfer fluid or the heat transfer fluid of the present disclosure may be preferably 0.055 W / mK or more, more preferably 0.060 W / mK or more, and even more preferably 0.065 W / mK or more at 30° C. In addition, the upper limit of the thermal conductivity of the composition for heat transfer fluid or the heat transfer fluid of the present disclosure is not particularly limited, but may be, for example, 0.090 W / mK or less, or 0.080 W / mK or less.

[0133] The boiling point of the heat transfer fluid composition or heat transfer fluid of the present disclosure is the temperature at which a peak due to endothermic heat is observed when the temperature is increased from 25° C. at 5° C. / min using DSC (differential scanning calorimetry).

[0134] The pour point of the heat transfer fluid composition or heat transfer fluid of the present disclosure is the temperature at which an endothermic peak is observed when the composition is cooled to below its freezing point with liquid nitrogen and then heated at a rate of 5°C / min using DSC.

[0135] The dielectric constant of the heat transfer fluid composition or heat transfer fluid of the present disclosure is a value observed at a frequency of 1 kHz in an environment of a temperature of 25° C. and a humidity of 60% using a capacitance method.

[0136] The kinematic viscosity and density of the heat transfer fluid composition or heat transfer fluid of the present disclosure are values ​​measured using a kinematic viscometer SVM3001 manufactured by Anton Paar.

[0137] The dielectric strength of the heat transfer fluid composition or heat transfer fluid of the present disclosure is the dielectric breakdown voltage when a liquid sample is immersed between spherical electrodes adjusted to a predetermined distance and the voltage is increased at a constant rate. The measurement conditions are as follows: Electrode shape: Spherical (φ12.5mm) Electrode spacing: 2.5mm Boost speed: 2kV / sec Measurement atmosphere: In air (22°C, 57% RH)

[0138] The specific heat of the heat transfer fluid composition or heat transfer fluid of the present disclosure is a value obtained by using DSC under the following conditions. Measurement equipment: Perkin-Elmer differential scanning calorimeter DSC8500 Heating rate: 10℃ / min Standard sample: Sapphire (-Al2O3) Atmosphere: Dry nitrogen gas flow Sample container: Aluminum airtight container

[0139] The thermal conductivity of the heat transfer fluid composition or heat transfer fluid of the present disclosure is a value that can be obtained by the unsteady thin wire method.

[0140] The compatibility of the heat transfer fluid composition or heat transfer fluid of the present disclosure is determined by whether or not it is compatible with a target solvent when mixed with the composition or the heat transfer fluid. Here, compatibility means that when the two are mixed together, they become homogeneous, i.e., there is no phase separation.

[0141] (4. Heat Transfer Devices) The present disclosure further discloses an apparatus for heat transfer comprising a device and a mechanism for transferring heat to or from the device, the mechanism comprising the heat transfer fluid composition described above.

[0142] Devices include, for example, computers, servers including server computers and blade servers; disk arrays / storage systems; storage area networks; network attached storage; storage communication systems; workstations; routers; telecommunications infrastructure / switches; wired, optical and wireless communication equipment; cell processing equipment; printers; power supplies; displays; optical devices; measurement systems including handheld systems; military electronics, and the like.

[0143] A semiconductor element is a heat-generating element mounted on a device, and examples of such elements include a CPU, a GPU, and an SSD. The semiconductor element is composed of, for example, single elements such as silicon and germanium, and compound semiconductors such as gallium arsenide (GaAs), gallium phosphide (GaP), indium phosphide (InP), gallium nitride (GaN), and silicon carbide (SiC).

[0144] When the device is a server computer, a logic board or multiple logic boards are disposed within the interior space. The logic board includes a number of heat-generating electronic components, including at least one processor, such as a CPU, GPU, etc. In addition, other heat-generating computer components may be used, such as chipsets; memory, graphics chips, network chips, RAM, power supplies, daughter cards; storage drives, such as solid state drives, mechanical hard disks, etc.

[0145] The heat transfer device is a heat transfer device for transferring heat between an object to which heat is transferred using the above-mentioned heat transfer fluid, and transfers heat by thermal contact with the object to which heat is transferred. For example, cooling is used when removing heat from the object to which heat is transferred, and heating is used when supplying heat. Different mechanisms may be used depending on the case, but one heat transfer device may be used for both cooling and heating.

[0146] Examples of heat transfer devices include, but are not limited to, pumps, valves, fluid containment systems, pressure control systems, coolers, heat exchangers, heat sources, heat sinks, refrigeration systems, active temperature control systems, and passive temperature control systems.

[0147] More specifically, these include temperature controlled wafer chucks in plasma enhanced chemical vapor deposition (PECVD) tools, temperature controlled test heads for die performance testing, temperature controlled work areas in semiconductor processing equipment, thermal shock test bath fluid reservoirs, thermostatic chambers, etc.

[0148] The heat transfer target object that is brought into thermal contact with the heat transfer device is an article, device, or atmosphere that is to be cooled, heated, or maintained at a temperature to be controlled. Such heat transfer target objects include electrical components, mechanical components, and optical components, as well as processed products and assemblies thereof. Specific examples of heat transfer target objects in the present disclosure include, but are not limited to, microprocessors, wafers used to manufacture semiconductor devices, power control semiconductors, electric branch switches, power transformers, circuit boards, multi-chip modules, mounted and unmounted semiconductor devices, chemical reactors, nuclear reactors, fuel cells, lasers, and missile parts.

[0149] (5. Heat Transfer Methods) The present disclosure further discloses a method of heat transfer comprising the steps of providing a device and transferring heat to or from said device using the heat transfer fluid composition described above, where heat can be transferred by placing a heat transfer apparatus in thermal contact with the device. When placed in thermal contact with the device, the heat transfer apparatus removes heat from or supplies heat to the device, or maintains the device at a selected temperature or temperature range. The direction of heat flow (from or to the device) is determined by the relative temperature difference between the device and the heat transfer apparatus.

[0150] Although the embodiment of the present invention has been described above, the present invention is not limited to these examples, and it is needless to say that the present invention can be embodied in various forms without departing from the gist of the present invention. EXAMPLES

[0151] Hereinafter, the embodiments of the present invention will be described more specifically based on examples, but the present invention is not limited to these.

[0152] (Production Example 1) HFP trimer was obtained based on the method described in Chem Bar (1973), Vol. 106, pp2950-2959. The obtained HFP trimer was purified by distillation to remove impurities such as hexafluoropropene dimers and tetramers. Furthermore, the purified HFP trimer was separated into compounds represented by formulas (I), (II), and (III) by distillation. Each of the separated HFP trimers was dehydrated using silica gel.

[0153] The compounds represented by formulas (I), (II), and (III) obtained above were mixed so that the ratios of the compounds represented by formulas (I), (II), and (III) were as shown in the table below, to obtain trimer mixtures 1 to 4.

[0154] [Table 1]

[0155] (Production Example 2) Based on the method described in Journal of the Chemical Society, Perkin Transactions 1: Organic and Bio-Organic Chemistry (1981), Vol. 4, pp1064-1067, C9F 16 was synthesized.

[0156] (Production Example 3) C8F 16 was purchased as a reagent from Wako Pure Chemical Industries, Ltd.

[0157] (Examples 1 to 43) Trimer mixtures 1 to 4 and C9F of Production Example 2 as an additive 16 Or C8F in Manufacturing Example 3 16 These were mixed in the ratios shown in the table below to obtain the heat transfer fluid compositions of Examples 1-43.

[0158] (Stability test) The obtained heat transfer fluid composition was placed in a SUS autoclave, which was then sealed and heated and maintained under the conditions shown in the table below.

[0159] (Fluoride ion concentration measurement) One volume (weight) of distilled water was added to the sample, and the sample was shaken for about 20 seconds to extract F ions into the aqueous layer. Next, 2.5 to 3.0 mL of the aqueous layer was extracted with a dropper, and the liquid was mixed with twice the volume of TISAB solution (total ionic strength adjustment buffer solution: manufactured by HORIBA) to obtain a sample, which was then measured with a fluoride ion meter (manufactured by HORIBA). Note that because the sample was diluted with TISAB solution, the measured value was three times the fluoride ion concentration. The results are shown in the table below.

[0160] [Table 2]

[0161] [Table 3]

[0162] From the above results, C9F 16 or C8F 16 It was confirmed that Examples 1 to 43 containing the above compound showed no increase in fluorine concentration even after long-term storage at high temperature and were stable.

[0163] <Boiling point, pour point and dielectric constant measurement> The boiling point of the trimer mixture was measured using differential scanning calorimetry (DSC), and was taken as the temperature at which a peak due to endothermic heat was observed when the mixture was heated from 25°C at 5°C / min. The pour point was measured using differential scanning calorimetry (DSC), and was taken as the temperature at which a peak due to endothermic heat was observed when the mixture was cooled below the freezing point with liquid nitrogen and then heated at 5°C / min. The dielectric constant was measured at a frequency of 1 kHz using the capacitance method in an environment of 25°C and 60% humidity.

[0164] <Kinematic viscosity and density measurement> The kinematic viscosity and density of the trimer mixture were measured using an Anton Paar SVM3001 kinematic viscometer.

[0165] <Specific heat measurement> The specific heat of the trimer mixture was measured using DSC under the following conditions: Measurement equipment: Perkin-Elmer differential scanning calorimeter DSC8500 Heating rate: 10℃ / min Standard sample: Sapphire (-Al2O3) Atmosphere: Dry nitrogen gas flow Sample container: Aluminum airtight container

[0166] <Thermal conductivity measurement> The thermal conductivity of the trimer mixture was measured by the transient hot-wire method.

[0167] <compatibility> The compatibility of the trimer mixtures was evaluated by mixing the trimer mixtures with the following three solvents in equal amounts. Galden HT135 (Solvay) SF-10 (manufactured by Chemours) FC3283 (3M)

[0168] [Table 4]

[0169] (Examples 44 to 59) Trimer mixtures 1 to 4 and water were mixed in the amounts shown in the table below to obtain compositions of Examples 44 to 59.

[0170] [Table 5]

[0171] (Stability test) The compositions of Examples 44 to 59 and Comparative Examples 3 to 6 were placed in a SUS autoclave, which was then sealed and heated and maintained under the conditions shown in the table below.

[0172] (Dielectric strength measurement) The liquid sample was immersed between spherical electrodes adjusted to a specified distance, and the dielectric strength was measured as the dielectric breakdown voltage when the voltage was increased at a constant rate. The detailed measurement conditions were as follows: Electrode shape: Spherical (φ12.5mm) Electrode spacing: 2.5mm Boost speed: 2kV / sec Measurement atmosphere: In air (22°C, 57% RH)

[0173] [Table 6]

[0174] From the above results, it was confirmed that Examples 44 to 59, which contain a predetermined amount of water, are stable and do not show an increase in fluorine concentration even after long-term storage at high temperatures. It was also confirmed that Examples 44 to 59 have high dielectric strength.

[0175] (Examples 60 to 83) Anhydrous hydrofluoric acid was added to trimer mixtures 1 to 4 to prepare standard solutions, which were then diluted with each trimer mixture to obtain compositions of Examples 60 to 83 having fluoride ion concentrations as shown in the table below.

[0176] (Stability test) The sample was placed in a SUS autoclave, which was then sealed and heated and maintained under the conditions shown in the table below.

[0177] (Measurement of Purity of Hexafluoropropene Trimer) The purity of the hexafluoropropene trimer was measured by gas chromatography before and after the stability test.

[0178] [Table 7]

[0179] [Table 8]

[0180] From the above results, it was confirmed that in Examples 60 to 83 containing a predetermined amount of fluoride ions, the purity of the hexafluoropropene trimer was maintained at a high level even after long-term storage at high temperature.

[0181] The compounds represented by formulas (I), (II), and (III) obtained above were mixed so that the ratios of the compounds represented by formulas (I), (II), and (III) were as shown in the table below, to obtain trimer mixtures 5 and 6.

[0182] [Table 9]

[0183] (Production of hexafluoropropene tetramer) (Production Example 4) Hexafluoropropene tetramer was obtained based on the method described in Tetrahedron Lett. 1974, 24, 2129-2132.

[0184] By mixing trimer mixture 5 or 6 with the hexafluoropropene tetramer obtained in Preparation Example 4, the heat transfer fluid of the present disclosure can be obtained.

[0185] <Evaluation method> (boiling point) The boiling point was measured by DSC as the temperature at which an endothermic peak was observed when the temperature was raised from 25° C. at 5° C. / min.

[0186] (Kinematic viscosity) The kinetic viscosity was measured at 25° C. using an Ubbelohde viscometer based on JIS K 2283.

[0187] (Dielectric constant) The dielectric constant was measured at a frequency of 1 kHz by a capacitance method in an environment of a temperature of 25° C. and a humidity of 60%.

[0188] (Examples 84 to 85) The weight ratio of trimer mixture 5:hexafluoropropene tetramer was 91:9 (Example 84), and the weight ratio of trimer mixture 6:hexafluoropropene tetramer was 91:9 (Example 85). Each physical property was measured, and the results are shown in Table 2.

[0189] [Table 10]

[0190] <Examples 86 to 87> A pre-purification composition (composition 1 containing a heat transfer fluid and a conductive material; 6FT) to be subjected to the purification step in Examples 86 to 87 was prepared. Specifically, 750 g of DMF and 7.2 g of cesium fluoride were placed in a SUS autoclave and sealed. After the autoclave was vacuum degassed, 2268 g of hexafluoropropylene was added over 4.5 hours while maintaining the temperature in the autoclave at 70 to 110°C. The lower layer was separated from the resulting reaction solution and washed with ultrapure water to obtain 2219 g of a composition containing an HFP trimer (composition 1, which is a pre-purification composition). GCFID and GC-MS analysis were performed, and it was confirmed that the HFP trimer was contained in 87% by mass of the total amount of the composition (100% by mass) by the area percentage method, and that the compounds represented by formulas (I), (II), and (III) described in this specification were contained in 78% by mass, 9% by mass, and 13% by mass, respectively, of the total amount of the HFP trimer (100% by mass).

[0191] <Example 88> The same operations as in Examples 86 to 87 were carried out to isolate the compounds represented by formulae (I), (II), and (III), and the compounds represented by formulae (I), (II), and (III) were mixed so that their concentrations were 55 mass%, 15 mass%, and 30 mass%, respectively, to prepare 2200 g of a composition.

[0192] <Example 89> The same operations as in Examples 86 to 87 were carried out to isolate the compounds represented by formulae (I), (II), and (III), and the compounds represented by formulae (I), (II), and (III) were mixed so that their concentrations were 3% by mass, 33% by mass, and 64% by mass, respectively, to prepare 2,200 g of a composition.

[0193] <Example 90> The same operations as in Examples 86 to 87 were carried out to isolate the compounds represented by formulae (I), (II), and (III), and the compounds represented by formulae (I), (II), and (III) were mixed to be 90% by mass, 5% by mass, and 5% by mass, respectively, to prepare 2200 g of a composition.

[0194] (Measurement of metal and metal ion content in pre-purification composition) The content of conductive substances (particularly the content of metals and metal ions in this example) in the composition before purification was determined by the following procedure using an inductively coupled plasma mass spectrometer (ICP-MS) (the same procedure was followed for the composition after purification.) The measured values ​​were as shown in Table 1 below. (1) 2000 g of the pre-purification composition was poured into a polytetrafluoroethylene (PTFE) beaker, and the beaker was placed on a hot plate at 250° C. to volatilize the volatile components. (2) Nitric acid for ultra-trace precision analysis with a concentration of 70% (manufactured by Wako Pure Chemical Industries, Ltd.) was diluted with ultra-pure water to obtain nitric acid with a concentration of approximately 4% by mass, and then approximately 50 mL of this was placed in a PTFE beaker. (3) The PTFE beaker was placed on a hot plate at 150°C for one hour to dissolve any metal remaining in the beaker. (4) The amount of metal ions dissolved in nitric acid was measured using ICP-MS. The amount of metal and metal ions in the solution was calculated using the amount of metal ions in nitric acid, the amount of nitric acid, and the amount of evaporated solution. (5) All of the work related to the above measurements was carried out in a class 10,000 clean room equipped with a table coach manufactured by Koken Co., Ltd., and the working environment was equivalent to class 1.

[0195] (Measurement of the number of insoluble matters (fine particles) in the composition before purification) The number of particles with a particle size of 5.0 μm or more, the number of particles with a particle size of 1.0 μm or more and less than 5.0 μm, the number of particles with a particle size of 0.5 μm or more and less than 1.0 μm, and the number of particles with a particle size of 0.3 μm or more and less than 0.5 μm in the composition before purification was measured at a temperature of 23° C. using a liquid particle counter ("KL-22" manufactured by RION Corporation) (the same applies to the composition after purification). All work related to the measurement was carried out in a class 10,000 clean room, with a table coach manufactured by Koken Co., Ltd. installed, and the work environment was equivalent to class 1.

[0196] (Measurement of boiling point, freezing point and dynamic viscosity of pre-refined composition) The boiling point was measured using DSC, and the temperature at which a peak due to endothermic heat was observed when the temperature was raised from 25°C at 5°C / min was used. The freezing point was measured using DSC, and the temperature at which a peak due to endothermic heat was observed when the material was cooled to -150°C or lower (the temperature at which it was confirmed that the material became solid) with liquid nitrogen and then heated at 5°C / min was used. The kinetic viscosity was measured using an Ubbelohde viscometer based on JIS K 2283. The measured values ​​were as shown in Table 1 below.

[0197] (Refining process) As a filtration apparatus, a unit in which one filter was packed in one container was prepared for each filter, and a multi-stage filtration apparatus was prepared in which the required number of such units were connected in series.

[0198] The pre-purification composition was placed in a pressure vessel and cooled to below -5°C, and then filtered under high-purity argon atmosphere at a pressure of 0.02 MPa using the filtration device to obtain a purified composition. Filter A (Ion Clean SL, made by Nippon Pole Corporation, filtration area: 0.58 m2), Filter B ("Wurtz Pleats P-Nylon" manufactured by Nippon Pall Co., Ltd., pore size: 0.15 μm, filtration area: 1.2 m2), and Filter C ("Wurtz Pleats P-Nylon" manufactured by Nippon Pall Corporation, pore size: 40 nm, filtration area: 1.2 m2) was used as described in Table 1. The results are shown in Table 1.

[0199] The results in Table 1 show that the content of conductive substances (particularly metals and metal ions) can be reduced by subjecting the pre-purification composition to a specified purification treatment.

[0200] [Table 11]

[0201] [Table 12]

Claims

1. C ９ F １８ (i) a hexafluoropropene trimer represented by C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） [wherein m is an integer of 4 or more and 12 or less, other than 9; and n is an integer of 4 or more and 12 or less], (ii) water (wherein the content of such water is determined by the above-mentioned C ９ F １８ and / or (iii) fluoride ions (wherein the content of such fluoride ions is within the range of C ９ F １８ and 0.0000001 to 5 parts by mass per 100 parts by mass of the total amount of the hexafluoropropene trimer represented by the formula:

2. The heat transfer fluid composition according to claim 1, wherein the hexafluoropropene trimer comprises at least one compound selected from the group consisting of compounds represented by the following formulas (I) to (III): 【Chemistry 1】

3. 3. The heat transfer fluid composition according to claim 2, wherein the compound represented by formula (I) is present in an amount of 85 mass % or more based on the total amount of the hexafluoropropene trimer.

4. 3. The heat transfer fluid composition according to claim 2, wherein the compound represented by formula (I) is contained in an amount of less than 85 mass % based on the total amount of the hexafluoropropene trimer.

5. 3. The heat transfer fluid composition according to claim 2, wherein the compound represented by formula (I) is present in an amount of 50% by mass or more and less than 85% by mass based on the total amount of the hexafluoropropene trimer.

6. C ９ F １８ (i) a hexafluoropropene trimer represented by C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） 2. The heat transfer fluid composition of claim 1, comprising: wherein m is an integer between 4 and 12, inclusive, except for 9; and n is an integer between 4 and 12, inclusive.

7. 2. The heat transfer fluid composition of claim 1, wherein m is an integer between 6 and 11, inclusive, other than 9, and n is an integer between 6 and 11, inclusive.

8. C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） The content of C ９ F １８ The heat transfer fluid composition according to claim 1, wherein the amount of the hexafluoropropene trimer represented by the formula (1) is 0.0001 to 10 parts by mass per 100 parts by mass of the total amount of the hexafluoropropene trimer represented by the formula (1).

9. C ９ F １８ 2. The heat transfer fluid composition of claim 1, comprising: (i) a hexafluoropropene trimer represented by the formula:

10. C ９ F １８ 2. The heat transfer fluid composition of claim 1, comprising a hexafluoropropene trimer represented by the formula:

11. C １２ F ２４ 2. The heat transfer fluid composition according to claim 1, further comprising a hexafluoropropene tetramer represented by the formula:

12. The heat transfer fluid composition according to claim 11, wherein the content of the hexafluoropropene trimer is 90% by mass or more and 99.99% by mass or less based on the total content of the hexafluoropropene trimer and the hexafluoropropene tetramer.

13. The heat transfer fluid composition of claim 11, wherein the hexafluoropropene tetramer comprises 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

14. The heat transfer fluid composition according to claim 1 , further comprising a conductive material, the content of the conductive material being 100 ppm by mass or less.

15. The heat transfer fluid composition according to claim 1 , further comprising a conductive material, and a content of insoluble matter having a size of 5 μm or more being 10 pieces / mL or less.

16. A heat transfer fluid comprising the heat transfer fluid composition according to claim 1 or 2.

17. Use of the heat transfer fluid composition according to claim 1 or 2 as a heat transfer fluid.

18. 3. An apparatus for heat transfer comprising a device and a mechanism for transferring heat to or from said device, said mechanism comprising the heat transfer fluid composition of claim 1 or 2.

19. 3. A method of heat transfer comprising the steps of providing a device and transferring heat to or from said device using the heat transfer fluid composition of claim 1 or 2.

Images