Multilayered vacuum electronic device and method for manufacturing the same

Abstract

SOLUTION: To joint vacuum electronic devices (VEDs) having a plurality of two-dimensional layers formed of different materials and create at least one VED at the same time, a two-dimensional material layer being mechanically processed to include features necessary for device operations to form features of a three-dimension when the two-dimensional material layer is assembled and is joined and becomes a three-dimensional structure and the two-dimensional layers being joined together to have a structure similar to a sandwich.EFFECT: This manufacturing step makes it possible to built in a metal material, a magnetic material, a ceramic material, and other materials which are necessary to manufacture a VED while maintaining a required positional accuracy and a large number of devices for a batch capacity.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] (CROSS REFERENCE TO RELATED APPLICATIONS) This application is incorporated herein by reference in its entirety as if fully set forth herein. The "Multi-layered multi-materi al manufacturing process for vacuum elec "Multi-layer, multi-material manufacturing process for vacuum electronic devices" The present application is jointly owned by inventor Diana Gamzina Daugherty. U.S. Provisional Patent Application No. 63 / 198,817, filed November 15, 2020; and (2) the contents of which are incorporated herein by reference as if fully set forth herein. The Electronic Magneto-Electrostatic atic sensing, focusing, and steering of electron beams in microwave, millimeter wave, and near-terahertz vacuum electron ic devices (microwave, millimeter wave, and near terahertz vacuum electronics "Electronic, magnetic, electrostatic detection, focusing, and steering of electron beams in a device," inventor Shared under the name Diana Gamzina Daugherty, 2020 Priority is given to U.S. Provisional Patent Application No. 63 / 198,915, filed November 21st. Assert your rights and interests.

[0002] The present application also relates to (1) "Multi-layered multi-materia l manufacturing process for vacuum elect "Multi-layer, multi-material manufacturing process for vacuum electronic devices" , inventor Diana Gamzina Daugherty, co-owned with the present application; U.S. Provisional Patent Application No. 63 / 198,817, filed November 15, 2020; Rabini (2) “Electronic magneto-electrostatic sensing, focusing, and steering of elect ron beams in microwave, millimeter wave, and near-terahertz vacuum electronic de vices (microwave, millimeter wave, and near terahertz vacuum electronic devices) "Electronic, Magnetic, and Electrostatic Detection, Focusing, and Steering of Electron Beams of 100 GHz" by inventor Diana Shared under the name Gamzina Daugherty on November 21, 2020 The present application claims the benefit of priority to U.S. Provisional Patent Application No. 63 / 198,915, filed on Another patent application filed on November 12, 2020, alleges inventor Diana "Magneto -Electrostatic Sensing, Focusing, and St eering of Electron Beams in Vacuum Elect ron Devices (Electronic, magnetic, electrostatic detection, focusing of electron beams in vacuum electron devices) "U.S. Provisional Patent Application No. 17 / 525,698, entitled 'U.S. Provisional Patent Application No. 17 / 525,698,' which is hereby incorporated by reference in its entirety. It may be considered that the contents of the specification of U.S. Provisional Patent Application No. 17 / 525,698 are as if No. 6,399,413, which is incorporated herein by reference as if fully set forth herein. [Background technology]

[0003] The present disclosure generally relates to one or more vacuum electron devices. Various materials bonded together to form a simultaneous The present invention relates to a manufacturing process used to fabricate a VED having multiple two-dimensional layers comprising: Two-dimensional material layers acquire three-dimensional features when assembled and joined into three-dimensional structures. The device is machined to include features necessary for device operation to form a 2-D The layers are bonded together to form a sandwich-like structure. This manufacturing process allows for VED fabrication while maintaining the required positional accuracy and large number of devices per batch capability Incorporate metallic, magnetic, ceramic and other materials as required It becomes possible.

[0004] A vacuum electron device (VED) operates in a vacuum environment and consists of one or more electron beams and a VE The interaction between the electromagnetic field generated in the interaction region of the D is utilized. is the passage of electrons from the cathode (electron emitter) to the collector (electron acceptor) of a vacuum electron device. A single assembly that may be vacuum-held or vacuum-sealed so as not to prevent the A vacuum region is also a region in which a metal, magnetic, or other material must be incorporated. Chamber, or cavity, or tunnel (electron beam tunnel), or RF interfacing Also called the region of action, this is the area of ​​interaction between one or more electron beams and one or more electromagnetic waves. Examples of such VEDs in the prior art are particle accelerators, gyrotron, gyroklystron, gyro amplifier, traveling wave tube (trav TWT, gyro TWT, backward wave oscillator, induction inductive output tubes (IOTS), magnetrons, cross-field amplifier, free electron laser, ubiquitous This includes tubes such as ubitrons, masers, diodes, triodes, tetrodes, pentodes, etc. (but (including but not limited to) some gas-ion lasers operate strictly in a vacuum. They operate at very low pressures rather than at high pressures and generally lack an RF interaction region, but It works the same way. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] U.S. Provisional Patent Application No. 63 / 198,817 [Patent Document 2] U.S. Provisional Patent Application No. 63 / 198,915 [Patent Document 3] U.S. Provisional Patent Application No. 17 / 525,698 Summary of the Invention [Problem to be solved by the invention]

[0006] Previous VEDs have generally used individual 2D and 3D subcomponents to The components are formed into an assembly and the assembly is joined to the enclosure to provide structural support and a vacuum enclosure. and then undergoing conventional vacuum processing and sealing procedures to produce a fabricated, functional VED. Such procedures may take several minutes to complete a single device, depending on the complexity of the device. It can take weeks or more and requires many highly skilled workers and large Today, the ground stations, base stations, and local Wi-Fi are Explosive demand for wireless broadband data communications on i-systems and terrestrial backbone systems As the number of such devices used increases dramatically, there is a significant need for cheaper, higher volume such devices. [Means for solving the problem]

[0007] The subject matter described herein generally relates to a method of manufacturing a laminate of materials assembled and bonded together. Fabrication of Vacuum Electron Devices (VEDs) using parallel sheets to form three-dimensional VEDs The advantage of this approach is that multiple VEDs can be fabricated simultaneously with the same structure, and the semiconductor When completed, they can be easily assembled for individual use, much like is commonly done in vice construction. This allows the devices to be easily separated, thus significantly reducing the manufacturing cost per device.

[0008] The foregoing summary is a summary and, as a result, may contain simplifications, generalizations, and omissions of detail. As a result, those skilled in the art will understand that the Summary is illustrative only and is in no way intended to be limiting. Please be aware that this is not a plot.

[0009] The accompanying drawings, which are incorporated in and constitute a part of this specification, show one or more representative The present invention will be described in detail with reference to the accompanying drawings, in which: Helps to explain. [Brief description of the drawings]

[0010] [Figure 1]1 is an exploded perspective view of a multi-layer, multi-material assembly for a VED according to one embodiment that incorporates a conductive magnetic material layer while creating a three-dimensional aperture for electron beam propagation and electromagnetic wave interaction. [Diagram 2] 1 is an exploded perspective view of a multi-layer, multi-material assembly for a VED according to another embodiment that incorporates not only conductive magnetic material layers but also insulating layers while creating a three-dimensional aperture for electron beam propagation and electromagnetic wave interaction. [Diagram 3] FIG. 1 is a perspective cross-sectional view of a multi-layer, multi-material assembly for a VED that incorporates a conductive magnetic material layer while creating a three-dimensional aperture for electron beam propagation and electromagnetic wave interaction. [Figure 4] 1A-1D are top plan views of a series of three multi-layer, multi-material assemblies for VEDs that incorporate conductive magnetic material layers while creating a three-dimensional aperture for electron beam propagation and electromagnetic wave interaction. [Diagram 5] 5 is a cross-sectional view taken along line 5-5 of FIG. 4 illustrating the internal structure of a single multi-layer, multi-material assembly for a VED incorporating conductive magnetic material layers while creating a three-dimensional aperture for electron beam propagation and electromagnetic wave interaction. [Figure 6] 1A-1D are top plan views of a series of three multi-layer, multi-material assemblies for VEDs that incorporate conductive magnetic material layers while creating a three-dimensional aperture for electron beam propagation and electromagnetic wave interaction. [Figure 7] FIG. 7 is a cross-sectional view taken along line 7-7 in FIG. 6 illustrating the internal structure of a single multi-layer, multi-material assembly for a VED that incorporates conductive magnetic material layers while creating a three-dimensional aperture for electron beam propagation and electromagnetic wave interaction. [Figure 8] FIG. 13 is a top plan view of a multi-layer, multi-material assembly for a series of three VEDs that incorporates a conductive magnetic material layer while creating a three-dimensional aperture for electron beam propagation and electromagnetic wave interaction, shown after gaps have been carved or otherwise created between the substrate assembly and the individual VEDs. [Figure 9] 9 is a cross-sectional view taken along line 9-9 of FIG. 8 illustrating the internal structure of a single multi-layer, multi-material assembly for a VED incorporating conductive magnetic material layers while creating a three-dimensional aperture for electron beam propagation and electromagnetic wave interaction. [Figure 10] 1 is a flow diagram illustrating a process or method for manufacturing a vacuum electronic device according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Such as a TWT (commonly used for RF signal amplification in broadband data communication systems). Exemplary embodiments are described herein with respect to a VED. The following description is exemplary. Those skilled in the art will recognize that this is merely an example and is not intended to be limiting in any way. will readily occur to such skilled artisans having the benefit of this disclosure. Reference will now be made in detail to exemplary embodiment implementations as illustrated in the drawings and the following description. Wherever possible, the same reference numbers will be used throughout to refer to the same or similar items. .

[0012] For clarity, not all of the routine features of the implementations described herein are illustrated. It is understood that any such practical implementation may be developed. To achieve the developer's specific goals, such as adhering to application-related and business-related constraints, Many implementation-specific decisions must be made to achieve this goal, and these specific goals are It will be recognized that implementations and developers will vary. Development efforts can be complex and time-consuming, but nonetheless, this It will be appreciated that this is a routine undertaking for those of ordinary skill in the art having the benefit of the present teachings.

[0013] As used herein, the terms "one embodiment" or "an embodiment" or "one implementation" or "an embodiment" may refer to References to "an implementation" or the like refer to particular features described in connection with representative embodiments. , a structure, part, feature, or characteristic may be included in at least one representative embodiment. In various places within this specification, the terms "in one embodiment" and "in one embodiment" may be used interchangeably. The appearance of phrases such as "in one embodiment" or "in another embodiment" does not necessarily refer to the same embodiment or implementation. The embodiments are not necessarily mutually exclusive of each other. It is not an alternative embodiment of the above.

[0014] In accordance with the present disclosure, the components and process steps described herein are may be implemented using a variety of techniques without departing from the spirit and scope of the inventive concept. That's fine.

[0015] What is described herein includes examples of embodiments of the present invention. Any possible combination of components or methodologies for the purpose of describing the subject matter sought. It is not possible to describe all of the above, but other combinations and permutations of the subject innovation are also possible. It should be recognized that claimed subject matter is accordingly defined in the appended claims. All such alternatives, modifications, and variations that fall within the spirit and scope of the present invention. Moreover, the disclosure of the subject matter, including that described in the Abstract, is intended to be illustrative and not restrictive. The above description of the embodiments is neither exclusive nor intended to limit the scope of the disclosed embodiments. Further, it is not intended to be limiting to the specific embodiments, examples, and aspects described herein. Implementations are described herein, but as those skilled in the art will recognize, such implementations may Various modifications are possible that would fall within the scope of the embodiments and examples.

[0016] In particular, the various functions performed by the components, devices, systems, etc. described above The terminology used to describe such components with respect to functionality is not specifically indicated. As long as the claimed subject matter performs its functions in the exemplary manner illustrated herein, Even if they are not structurally equivalent to the disclosed structures, they may still perform the designated functions of the described components. It is intended to correspond to any component (e.g., functional equivalent) that performs the functions described herein.

[0017] In addition, certain features of the invention may be described with reference to only one of several implementations. Although some features have been disclosed herein, such features may vary in any given application or particular suitability. Any one or more of such other implementations may be desirable or advantageous in the field of application. The term "includes" or "includes" may be used interchangeably with any of the other features of the present invention. "including," "has," "contains" The terms, variations thereof, and other similar terms are used in the detailed description and claims. to the extent that it is used in accordance with the principles of It is used in a similar way to the term "comprising" as a transitional word that is not unique. It is intended to be comprehensive.

[0018] Moreover, the words "example" or "exemplary" are used herein to mean examples, instances, or illustrations. Any of the terms described herein as "representative" are used to mean "useful" in any manner. No aspect or design is necessarily to be construed as preferred or advantageous over other aspects or designs. Rather, the use of the words "example" or "representative" should not be construed as implying or indicating that It is intended to present concepts in a concrete manner. As used in this application, the term "or" refers to "or" is intended to mean an inclusive "or" rather than an exclusive "or." That is, unless otherwise specified or clear from the context, "X is A" is or with B" is intended to mean any of the natural inclusive permutations, i.e. If X uses A, X uses B, or X uses both A and B, then "X uses either A or B" "Using the article "a" and "b" is satisfied under any of the preceding examples. As used in this application and the appended claims, unless otherwise specified, the terms "an" and "an" refer to the same or similar terms. or "one or more" generally, unless the context clearly directs to the singular form. "number" should be interpreted as meaning "number of

[0019] In the figures, when a callout number or reference designation is used in more than one figure, Unless otherwise expressly intended by the context, the same or similar parts, components, or a step.

[0020] The devices and methods described herein are applicable to pencil beams, sheet beams, rectangular beams, and For VEDs utilizing elliptical, hollow, diverging, and multiple beams It can be used.

[0021] Most of the following description assumes that the plate is in contact with the electron beam from below to above the electron beam. The present invention addresses the creation of VEDs in the form of parallel aligned layers, and furthermore, the present invention addresses the creation of VEDs in the form of parallel aligned layers, The chair can be constructed perpendicular to the electron beam in a relatively simple manner as shown in the teachings herein. It is contemplated that such a device may also be used in conjunction with, for example, a distributed beam detector, if desired. The device may be constructed at any angle to the electron beam, such as a vise.

[0022] A significant advantage of the present invention is that it is possible to build even a single prototype device using the present invention without using prior art has been shown to be much more cost-effective than multiple VEDs in a single batch. The ability of the present invention to simultaneously fabricate multiple VEDs and then cut them into individual components. It's in power.

[0023] Typically, magnets are used to perform some of the functions of shaping and aiming the electron beam in a VED. The electron beam cannot be properly guided from the cathode to the collector. may collide with some other part of the VED structure, causing damage and destroying the vacuum area. The ability to incorporate a variety of magnet material types is beneficial in the construction of VEDs. Halbach, i.e., the quadrupole array, is often placed some distance away from the electron beam. A solenoid is introduced around the electron beam to focus the electron beam. Another important advantage of the present invention is that it eliminates the need to place magnets inside the vacuum chamber. This allows the magnet to be brought much closer to the electron beam (electromagnetic provide a higher magnetic field strength at the electron beam for a given magnet (either axial or fixed) The magnetic field available from a magnet decreases as the square of the distance from the magnet. Therefore, the magnets can be brought closer together, resulting in a smaller magnet size with the present invention. Magnetic steering is not just about actual magnets, but also about magnets in combination with magnets inside the VED. A magnetically susceptible material that establishes a desired magnetic field at the This can also be accomplished using a combination with a magnet. The electromagnetic circuit is typically concentrated far away from the electron beam because the materials that From materials such as copper (or tungsten for helix-type devices) that drive the bundle structure Magnets and / or materials containing iron and nickel are made from highly conductive materials such as copper. Materials with a high rate of deposition can be used to alleviate this problem, however. However, such an arrangement is not recommended as such materials may degrade over time within the VED. This could create potential vacuum purity issues for the VED. High quality nickel plated vacuum double melted iron is available. In most cases In this case, heating a permanent magnet above its Curie point causes it to lose its magnetism. Adding permanent magnet materials such as SmCo and NbFeB to the outside of the vacuum enclosure and low-temperature bonding techniques (adhesives or solid-state ultrasonics) must be used to bond such materials. It must be fixed in place.

[0024] In one embodiment, magnets may be added to the circuit of the present invention as follows: To be combined to create (for example) a TWT circuit, each sheet is made of a few hundred nanometers of The plate is sputter-coated with a 1000-millimeter thick layer of gold or silver and then heated to approximately 1000° C. under a weight of about 50 pounds. The layers are bonded to adjacent layers in a hydrogen furnace or in fixtures that hold the layers in place. To add a magnetic assembly to the layered copper circuit assembly, one or more (vacuum double layer) A layer of molten iron or stainless steel is nickel-plated with pockets for magnet pieces and then filtered. A copper-gold or copper-silver brazing sheet (approximately 25 microns thick) is used to create the solder joint. A layer of iron / stainless steel is then brazed to a copper circuit assembly. The magnet pieces are then inserted into the assembly, and remain outside the vacuum area of ​​the VED by the brazed shims. The magnet is inserted into a prefabricated pocket in the magnet holder, and another layer of material is placed over the entire surface of the magnet. The magnets are then added and secured in place using low temperature adhesive to hold the magnets in place.

[0025] Electrostatic focusing also provides some of the electron beam shaping and aiming functions in VEDs. The ability of the present invention to introduce electrical conductors into a vacuum structure may then be used to A vacuum is created by applying a voltage across two or more plates placed around the electron beam. Allows for precise electrostatic focusing within the structure, as desired for specific applications, and If required, several sets of such plates may be used.

[0026] The manufacturing approach described herein is suitable for manufacturing VEDs at a variety of frequencies. It can be used for many applications, but is particularly useful for VEDs operating between about 25 GHz and about 1 THz. The manufacture of such devices using conventional device assembly by hand (in some cases) Some are difficult due to the small feature scale (micrometers to millimeters). be.

[0027] Turning now to the figures, Figure 1 shows a three-dimensional (3D) system for electron beam propagation and electromagnetic wave interactions. A multi-layered multilayered photodiode for a VED according to one embodiment incorporating a conductive magnetic material layer during the creation of an aperture FIG.

[0028] In the embodiment illustrated in FIG. 1, the VED 100 includes a first A first planar non-magnetic conductive plate 102 and a second planar non-magnetic conductive plate 103 made of a conductive material such as copper. A planar non-magnetic conductive plate 104, a first planar non-magnetic conductive plate 102 and a second A plurality of planar non-magnetic interacting structures disposed between the planar non-magnetic conductive plates 104. The assembly 101 includes forming plates 106a, 106b, and 106c. If an external fixed magnetic field is to be used for the electron beam control, the assembly 101 may be made of iron, nickel, etc. A first planar magnetic plate formed of any magnetic material and a may be placed facing one or more permanent magnets, including those embedded in or Instead, the assembly 101 includes a first planar magnetic plate 108 and a second planar magnetic plate 109. Two such plates 108 and 110 are arranged between the gate 110. The alignment features 112 (discussed in more detail below) may form a sandwich structure. In addition, a simple mechanism for aligning the parallel plates may be provided. Also, the magnet layer is a solid, planar permanent magnet rather than being made up of multiple smaller magnets. It is contemplated that the magnet may be provided as a planar "solenoid." If desired, the conductive plate may be made of sputtered alumina. (Al2O3), or in the presence of an electron beam to create more complex circuits. A vacuum-compatible insulator, such as another conventional insulator that does not outgas into a heated vacuum environment The material may be coated on one or both sides.

[0029] Figure 2 shows the propagation path during the creation of a three-dimensional aperture for electron beam propagation and electromagnetic wave interaction. Multi-layered composite for VEDs according to another embodiment incorporating not only a conductive magnetic material layer but also an insulating layer FIG.

[0030] In the embodiment illustrated in FIG. 2, the VED 200 includes a first A first planar non-magnetic conductive plate 202 and a second planar non-magnetic conductive plate 203 formed of a conductive material such as copper. A planar non-magnetic conductive plate 204, a first planar non-magnetic conductive plate 202 and a second A plurality of planar non-magnetic interacting structures disposed between the planar non-magnetic conductive plates 204. forming plates 206a, 206b, 206c, 206d, and 206e; If an external fixed magnetic field is to be used for electron beam control, the assembly 20 1, placed on or embedded in one or more permanent A first planar magnetic plate formed of a magnetic material such as iron, nickel, etc., containing a magnet. Alternatively, the assembly 201 may be positioned facing the first plane as shown in FIG. The two magnetic plates 108 and 110 are arranged between the first magnetic plate 108 and the second magnetic plate 110. A sandwich structure may be formed from such plates 108 and 110 (hereinafter The alignment features 112 (discussed in more detail in ) provide a simple method for aligning multiple parallel plates. According to the embodiment of FIG. 2, a plate 202 and The "inner" side of 204 (i.e., the inner side labeled 202a and 204a) is a plate The assembly consisting of 206a, 206b, 206c, 206d, and 206e is plate 2 02 and 204 to provide an insulating surface so that they can be floating. In this method, a voltage is applied to both ends of the plates 202 and 204. The electrostatic fields generated by the applied voltage differences are used together with the magnetic beam control, as discussed above, can be used for electron beam control separately from magnetic beam control. In addition, electrical insulators The overlying conductors can deliver electrical current to specific locations within the assembly as desired. For example, such a conductor may deliver an RF signal to the interaction region and from the interaction region. Such conductors may also control other components within the VED in a similar manner. The inverter may be used to deliver a fixed or variable voltage for control.

[0031] In the embodiment of FIG. 2, a pair of electrical conductors 208a, 208b are disposed on an insulating surface 202a. Not shown is that the same arrangement is provided on insulating surface 204a. The conductors 208a, 208b may be deposited or placed. 08b should be suitable for a vacuum environment, i.e., for the high temperatures expected in a VED. The plates 206a and 206e are spaced apart from each other as shown. conductors, e.g. 208a, 208b, from the contacts of plates 206a and 206e Plates 206b and 206d each include an insulating opening. 210 and upper interaction region 212, and plate 206c includes a lower interaction region 210 and an electron beam tunnel 214 surrounded by an upper interaction region 212. Includes.

[0032] Figure 3 shows the propagation of electron beams while creating a three-dimensional aperture for electromagnetic wave interaction. FIG. 3 is a transparent cross-sectional view of a multi-layered multi-material assembly for a VED incorporating a conductive magnetic material layer. FIG. 3 is a schematic diagram of the structure formed when the components of FIG. 2 are joined together as intended. be.

[0033] Figure 4 shows the propagation of electron beams while creating a three-dimensional aperture for electromagnetic wave interaction. A top plan view of a series of three multi-layered multi-material assemblies for the VED400 incorporating layers of conductive magnetic material. be.

[0034] Figure 5 shows the propagation of electron beams while creating a three-dimensional aperture for electromagnetic wave interaction. 1 illustrates the internal structure of a single multi-layer multi-material assembly for a VED 400 incorporating a conductive magnetic material layer; FIG. 5 is a cross-sectional view taken along line 5-5 of FIG. 4.

[0035] In the embodiment illustrated in FIGS. 4 and 5, the VED 400 is formed from a conductive material such as copper. A first planar non-magnetic conductive plate 402 formed of a conductive material such as copper. The second planar non-magnetic conductive plate 404 and the first planar non-magnetic conductive plate 40 A plurality of planar non-magnetic phases are disposed between the first and second planar non-magnetic conductive plates 402 and 404. The assembly 401 includes interacting structure forming plates 406a, 406b, and 406c. In this embodiment, an external fixed magnetic field should be used to control the electron beam. Therefore, the assembly 401 (also known as the "circuit assembly") is made of iron, nickel, etc. A first planar magnetic plate 408 formed from such a magnetic material and a 4. The magnet 410 is disposed between the magnet 410 and one or more permanent magnets 412, including those embedded therein. Instead, the assembly 401 includes a first planar magnetic plate 408 and a second planar magnetic plate The sample is then taken from two such plates 408 and 410 so as to be placed between the plates 408 and 410. The alignment features (discussed in more detail below) may form multiple A simple mechanism for aligning the parallel plates may be provided.

[0036] Figure 6 shows the propagation of electron beams while creating a three-dimensional aperture for electromagnetic wave interaction. A top plan view of a series of three multi-layered multi-material assemblies for the VED600 incorporating layers of conductive magnetic material. be.

[0037] Figure 7 shows the propagation of electron beams while creating a three-dimensional aperture for electromagnetic wave interaction. 6 illustrates the internal structure of a single multi-layer, multi-material assembly 600 for a VED incorporating a conductive magnetic material layer; FIG. 7 is a cross-sectional view taken along line 7-7 of FIG. 6.

[0038] In the embodiment illustrated in FIGS. 6 and 7, the VED 600 is formed from a conductive material such as copper. A first planar non-magnetic conductive plate 602 formed of a conductive material such as copper. The second planar non-magnetic conductive plate 604 and the first planar non-magnetic conductive plate 60 6. A plurality of planar non-magnetic phases disposed between the first and second planar non-magnetic conductive plates 602 and 604. Interacting structure forming plates 606a, 606b, 606c, 606d, and 606e In this embodiment, an assembly 601 having an external fixation mechanism is provided to control the electron beam. A magnetic field should be used, and therefore the assembly 601 (also known as the "circuit assembly") a first planar magnetic plate 608 formed of a magnetic material such as iron, nickel, etc.; and one or more permanent magnets 6, including those disposed on or embedded within the 12. Instead, the assembly 601 is arranged opposite the first planar magnetic plate 60 8 and a second planar magnetic plate 610. The layers 608 and 610 may form a sandwich structure (discussed in more detail below). ) Alignment features 112 provide a simple mechanism for aligning multiple parallel plates during fabrication. According to the embodiment of Figs. 6 and 7, a plate 602 and The "inside" of 604 (i.e., the inside labeled 602a and 604a) is a plate The assembly consisting of 606a, 606b, 606c, 606d, and 606e is plate 6 Form an insulating surface so that it can be floating relative to 02 and 604 In this method, a voltage is applied to both ends of the plates 202 and 204. The electrostatic fields generated by the applied voltage differences are used together with the magnetic beam control, as discussed above, can be used separately for electron beam control. In addition (as shown in this figure) Conductors 614a, 614b, 614c, and 614d, which are placed on electrical insulators, are assembled. Electric current can be delivered to specific locations inside the body as desired. For example, such conductors may deliver an RF signal to the interaction region and may extract an RF signal from the interaction region. Such conductors may also carry fixed voltages or currents to control other components within the VED as well. may be used to deliver a varying voltage.

[0039] Figure 8 shows the propagation of electron beams while creating a three-dimensional aperture for electromagnetic wave interaction. A top plan view of a series of three multi-layered multi-material assemblies for the VED600 incorporating layers of conductive magnetic material. This figure shows a circuit board assembly 804 with gaps 802 between the individual VEDs 806. or after it has been created in some other way.

[0040] Figure 9 shows the conduction between the electron beam and the 3D aperture for electromagnetic wave interaction. FIG. 8 illustrates the internal structure of a single multi-layer, multi-material assembly 800 for a VED 806 incorporating a layer of reflective magnetic material. 9 is a cross-sectional view taken along line 9-9 of FIG. 8.

[0041] The gap 802 may be formed by any conventional method suitable for cutting such materials, for example. Even if it is cut with a laser, high pressure water, or a diamond blade saw, it can still be cut with a die. The gap may be machined, drilled, or otherwise created. Once group 802 is formed, the individual VEDs 806 are connected in a conventional manner, as known to those skilled in the art. They may be removed and individually packaged for use.

[0042] FIG. 10 illustrates a process for manufacturing a vacuum electronic device according to an embodiment of the present invention. 10 is a flow diagram illustrating a method 1000. The process steps described in conjunction with FIG. may be performed, or some or all at once.

[0043] Step 1002 is a first step in which a first planar non-magnetic conductive material is formed from a non-magnetic conductive material. A conductor plate is formed.

[0044] Step 1004 is a second step in which a second planar non-magnetic conductive material is formed from the non-magnetic conductive material. A conductor plate is formed.

[0045] Step 1006 is the third step, which comprises forming a plurality of conductive non-magnetic layers arranged parallel to each other. From the conductive non-magnetic interaction structure forming plate, An interaction structure is formed with a portion of the interaction zone embedded therein.

[0046] Step 1008 is a fourth step, which comprises: The first planar non-magnetic conductive plate is placed on the outside of the lamination. The port, the interacting structure, and a second planar non-magnetic conductive plate are arranged in a stack.

[0047] Step 1010 is the fifth step, which comprises forming a first planar non-magnetic conductive plate, The support structure, and a second planar non-magnetic conductive plate are joined together.

[0048] Step 1012 is the sixth step, which comprises forming a first planar magnetic plate from a magnetic material. and disposing at least one magnet on the first planar magnetic plate.

[0049] Step 1014 is a seventh step, which comprises: On the side of the opposing first planar non-magnetic conductive plate, a A first planar magnetic plate is placed in the row.

[0050] Step 1016 is an eighth step, which comprises applying a first A planar magnetic plate is bonded.

[0051] Step 1018 is the ninth step, which comprises forming a second planar magnetic plate from the magnetic material. and disposing at least one magnet on the second planar magnetic plate.

[0052] Step 1020 is a tenth step, comprising forming a plurality of non-magnetic interactive structure-forming plates. On the side of the second planar non-magnetic conductive plate facing the A second planar magnetic plate is placed in parallel.

[0053] Step 1022 is an eleventh step, which comprises attaching a second non-magnetic conductive plate to a second planar non-magnetic conductive plate. A planar magnetic plate is joined to the magnet.

[0054] It will now be appreciated by those skilled in the art that these steps can be performed in the order most convenient for manufacturing and fixing. It will be appreciated that the steps of joining do not necessarily have to be performed in a set order. The forming step can be performed in one step to produce a part for later assembly. For example, it can be carried out with

[0055] The step of joining the two-dimensional sheets together can be performed by brazing, diffusion bonding, or assisted diffusion bonding (a ssisted diffusion bonding, solid state bonding ate bonding), cold welding, ultrasonic welding, or a combination of one or more of the above. The joint formed between two adjacent sheets may be a 1×1 0 -6 The vacuum environment should be maintained at 300 K or better. Bonding should be done with hydrogen, nitrogen, vacuum, etc. Before bonding, the corresponding layers should be cleaned or pre-treated. The surface oxide layer should be removed by Zuma etching, which helps to form a good leak-tight joint. To achieve this, the corresponding layers should be maintained in a vacuum environment before bonding. In this case, the corresponding layers are arranged in a vacuum-compatible field between the two corresponding layers (which may be of different materials). Coating with vacuum compatible materials (sputtering, electroplating, metallization, etc.) to enhance surface creation and / or painted). Coatings include nickel, gold, silver, molybdenum-manum, Gun, copper, copper-gold, copper-silver, titanium-nickel, gold-copper-titanium, copper-silver-titanium, copper- Silver-titanium-aluminum, titanium-nickel-copper, gold-copper-titanium-aluminum, silver -Copper-Indium-Titanium, Copper-Germanium, Palladium-Nickel-Copper-Silver, Gold-Palladium Radium-magnesium, silver-palladium, gold-copper-nickel, gold-copper-indium, silver -Containing one or more of the following: copper-indium, gold-nickel, gold-nickel-chromium, etc. In this manner, the bonded layers form a high strength assembly, resulting in a relatively high yield. The force handling capability and high gradient capability of the VED are obtained.

[0056] The layers are also electrically insulating to manage the heat flow as well as the electrical potential within the VED. coated with conductive or electrically conductive materials (sputtered, electroplated, metallized, and / or painted) ) The coating may also reduce the flow of heat into and away from the VED. To better manage this, materials designed to conduct heat (e.g. diamond) The layers may then include electrodes, and and an insulator that is plated with conductive paths to form an electrical path to bias the electrodes. (e.g. Al2O3).

[0057] Cutouts or pockets are milled, turned, eroded, lithographed Using techniques such as etching, laser cutting, electron beam cutting, water jet cutting, etc. The cutouts or pockets so formed may be formed in the conductive sheet of the VED. The materials used are ceramic materials, vacuum windows, and circuit-disconnecting materials (used to improve device stability). attenuators for use in detecting electrons, electron emitting materials, vacuum pumping materials, getter materials, Components such as magnets, iron pieces, shielding materials, isolation materials, conductors, connectors, waveguides, couplers, etc. It may be populated by elements.

[0058] Incorporating ceramic materials for focusing, propagation, guidance, steering, and finally the cathode Electrostatic beam forming lenses or electrostatic beam forming lenses that help improve the electron beam propagation between the detector and the collector. This allows the addition of a room-forming area inside the VED. Provide this capability outside the vacuum region of the VED. By incorporating this capability within the VED itself rather than using a This enables more precise control with lower power consumption.

[0059] Aligning adjacent layers or sheets of material within the VED during the manufacturing process is This may be accomplished using column features 112. Such features are discussed elsewhere herein. Such alignment holes, alignment pins, rectangular features, combinations thereof, and optical features suitable for robotic assembly techniques The assembly of the seat can be done by hand, robot, or Translation stages, automated translation, robotic placement, video from microscale to nanoscale It may be affected by alignment, banya, etc.

[0060] The aforementioned approach uses purely electrostatic focusing without any magnets to generate VE Note that this allows the construction of D.

[0061] Having shown and described exemplary embodiments and applications, it is understood that those skilled in the art will appreciate that, having the benefit of this disclosure, Those skilled in the art will appreciate that, without departing from the scope of the invention as defined by the appended claims, The various exemplary embodiments described herein may include numerous modifications not specifically mentioned above. It will be apparent that corrections, modifications and adaptations may be made.

Claims

1. A vacuum electron device, comprising: a first planar non-magnetic conductive plate; a second planar non-magnetic conductive plate; A magnetic field is formed between the first planar non-magnetic conductive plate and the second planar non-magnetic conductive plate. A plurality of planar non-magnetic interaction structure forming plates are placed on the substrate. Equipped with the first planar non-magnetic conductive plate, the second planar non-magnetic conductive plate, and The plurality of non-magnetic interactive structure forming plates are arranged in parallel and joined together, The number of non-magnetic interaction structures forming plates includes an RF interaction region of a vacuum electron device.

2. A first planar magnetic plate having at least one magnet formed from a magnetic material. The first planar magnetic plate is provided with a plurality of non-magnetic interaction structure forming plates. The first planar non-magnetic conductive plate is disposed on a side of the first planar non-magnetic conductive plate facing the port.

10. The vacuum electron device of claim 1 , wherein the vacuum electron device is arranged parallel to the body plate.

3. a second planar magnetic plate formed from a magnetic material and having at least one magnet; The second planar magnetic plate is provided with a plurality of non-magnetic interaction structure forming plates. The second planar non-magnetic conductive plate is disposed on a side of the second planar non-magnetic conductive plate facing the port.

3. The vacuum electron device of claim 2 , wherein the vacuum electron device is arranged parallel to the body plate.

4. forming one or more pockets in said first planar non-magnetic conductive plate; 3. The vacuum electron device according to claim 2.

5. 5. The vacuum of claim 4, wherein at least one of the pockets contains a getter material. Electronic devices.

6. 5. The device of claim 4, wherein at least one of the pockets contains an electronically emissive material. Blank electronic device.

7. 5. The vacuum of claim 4, wherein at least one of the pockets contains a circuit-disconnecting material. Electronic devices.

8. 1. A method of fabricating a vacuum electronic device, comprising the steps of: forming a first planar non-magnetic conductive plate from a non-magnetic conductive material; forming a second planar non-magnetic conductive plate from a non-magnetic conductive material; A plurality of conductive non-magnetic interactive structure forming plates arranged parallel to each other are provided, A portion of the interaction zone is embedded in the conductive non-magnetic interaction structure forming plate. forming an interaction structure; The first planar non-magnetic conductive plate and the second planar non-magnetic conductive plate are stacked. The first planar non-magnetic conductive plate, the interacting structure, and and disposing said second planar non-magnetic conductive plate in said stack; The first planar non-magnetic conductive plate, the interacting structure, and the second planar non-magnetic conductive plate. joining the magnetic conductor plates together; A method for providing the above.

9. forming a first planar magnetic plate from a magnetic material; and disposing at least one magnet; The first planar non-magnetic conductive plate facing the plurality of non-magnetic interaction structure forming plates The first planar magnetic plate is disposed on the side of the plate in parallel with the first planar non-magnetic conductive plate. Steps for placing the The method of claim 8 further comprising:

10. joining the first planar magnetic plate to a first planar non-magnetic conductive plate; The method of claim 9 further comprising:

11. forming a second planar magnetic plate from a magnetic material; and disposing at least one magnet; The second planar non-magnetic conductive plate faces the plurality of non-magnetic interaction structure forming plates. The second planar magnetic plate is disposed on the side of the plate in parallel with the second planar non-magnetic conductive plate. Steps for placing the The method of claim 10 further comprising:

12. A step of joining the second planar magnetic plate to the second planar non-magnetic conductive plate. Top The method of claim 11 further comprising:

13. forming one or more pockets formed in the first planar non-magnetic conductive plate; The method of claim 12 , further comprising the step of:

14. further comprising placing a getter material in at least one of the pockets. The method according to claim 13.

15. placing an electron emissive material in at least one of the pockets. The method of claim 12 .

16. further comprising placing a circuit-disconnecting material in at least one of the pockets. The method according to claim 12.

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