Magneto-electrostatic sensing, focusing, and steering of electron beams in vacuum electronic device

Abstract

To create a VED having a plurality of two-dimensional layers formed of different materials which are joined together to form at least one vacuum electronic device (VED) at the same time.SOLUTION: A two-dimensional material layer is mechanically processed to include features necessary for device operations to form features of a three-dimension when the two-dimensional material is assembled and is joined and becomes a three-dimensional structure. The two-dimensional layers are joined together using techniques such as brazing, diffusion bonding, assisted diffusion bonding, solid-state bonding, cold welding, and ultrasonic welding. This manufacturing step makes it possible to built in a metal material, a magnetic material, and a ceramic material which are necessary to manufacture a VED while maintaining a required positional accuracy and a large number of devices for a batch capacity. The thus formed VED includes a combination of a magnetic lens and an electrostatic lens for controlling electron beams.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] (CROSS REFERENCE TO RELATED APPLICATIONS) This application is incorporated herein by reference in its entirety as if fully set forth herein. The "Multi-layered multi-materi al manufacturing process for vacuum elec "Multi-layer, multi-material manufacturing process for vacuum electronic devices" The present application is jointly owned by inventor Diana Gamzina Daugherty. U.S. Provisional Patent Application No. 63 / 198,817, filed November 15, 2020; and (2) the contents of which are incorporated herein by reference as if fully set forth herein. The Electronic Magneto-Electrostatic atic sensing, focusing, and steering of electron beams in microwave, millimeter wave, and near-terahertz vacuum electron ic devices (microwave, millimeter wave, and near terahertz vacuum electronics "Electronic, magnetic, electrostatic detection, focusing, and steering of electron beams in a device," inventor Shared under the name Diana Gamzina Daugherty, 2020 Priority is given to U.S. Provisional Patent Application No. 63 / 198,915, filed November 21st. Assert your rights and interests.

[0002] The present application also relates to (1) "Multi-layered multi-materia l manufacturing process for vacuum elect "Multi-layer, multi-material manufacturing process for vacuum electronic devices" , inventor Diana Gamzina Daugherty, co-owned with the present application; U.S. Provisional Patent Application No. 63 / 198,817, filed November 15, 2020; Rabini (2) “Electronic magneto-electrostatic sensing, focusing, and steering of elect ron beams in microwave, millimeter wave, and near-terahertz vacuum electronic de vices (microwave, millimeter wave, and near terahertz vacuum electronic devices) "Electronic, Magnetic, and Electrostatic Detection, Focusing, and Steering of Electron Beams of 100 GHz" by inventor Diana Shared under the name Gamzina Daugherty on November 21, 2020 The present application claims the benefit of priority to U.S. Provisional Patent Application No. 63 / 198,915, filed on Another patent application filed on the same date herewith claims inventor Diana G. "Multi-lay" er Vacuum Electron Device and Method of The U.S. Provisional Patent Application No. 2006 / 010621 entitled "Multilayer Vacuum Electron Devices and Manufacturing" This application may be considered related to U.S. Provisional Patent Application No. 17 / 525,658. The contents of Serial No. 17 / 525,658 are incorporated herein by reference as if fully set forth herein. No. 6,399,433, which is incorporated herein by reference as if fully set forth herein. [Background technology]

[0003] The present disclosure generally relates to one or more vacuum electron devices. Various materials bonded together to form a simultaneous The present invention relates to a manufacturing process used to fabricate a VED having multiple two-dimensional layers comprising: Two-dimensional material layers acquire three-dimensional features when assembled and joined into three-dimensional structures. The device is machined to include features necessary for device operation to form a 2-D The layers are brazed, diffused, and assisted diffusion bonded. onding, solid state bonding, cold welding, ultra The parts are joined using ultrasonic welding or similar techniques. This manufacturing process allows for the required positional accuracy and The metal materials required for VED fabrication while maintaining a large number of devices per switch capacity It is possible to incorporate metals, magnetic materials, ceramic materials, and other materials. The VED, developed in this way, uses a combination of magnetic and electrostatic lenses for electron beam control. include.

[0004] A vacuum electron device (VED) operates in a vacuum environment and consists of one or more electron beams and a VE The interaction between the electromagnetic field generated in the interaction region of the D is utilized. is the passage of electrons from the cathode (electron emitter) to the collector (electron acceptor) of a vacuum electron device. A single assembly that may be vacuum-held or vacuum-sealed so as not to prevent the A vacuum region is also a region in which a metal, magnetic, or other material must be incorporated. Also called a chamber, cavity, tunnel, or RF interaction region, 1 A place where interaction takes place between one or more electron beams and one or more electromagnetic waves. Prior art examples of such VEDs are particle accelerators, klystrons, gyrotrons, Gyroklystron, gyro amplifier, traveling wave tube tube, TWT), gyro TWT, backward wave oscillator, inductive output tube e output tubes (IOTS), magnetrons, cross-field amplifiers (cross -field amplifier, free electron laser, ubitron , masers, diodes, triodes, tetrodes, pentodes, etc. Some gas ion lasers do not operate strictly in a vacuum but at very low pressures. They operate on forces and generally lack an RF interaction region, but operate in much the same way.

[0005] Conventionally, electron beam propagation through the electron beam tunnel of a VED is performed by This is accomplished by using a magnetic or electrostatic field that encapsulates the electron beam. That is, the effect of negatively charged electrons compressed into a narrow beam is that the electrons all have the same charge. Because of the loads they tend to repel each other, tending to spread the beams outwards. In order to obtain higher efficiency and performance for the VED, the RF signal and the electronic Bundle the beams for longer periods and distances so that the beams can interact longer Therefore, containment techniques are necessary.

[0006] Permanent magnets, electromagnets, and periodic arrays of permanent magnets and electromagnets are usually used in beam tunnels. The VED is assembled and operated using a When preparing a VED for this purpose, two challenges arise: (1) the beam tunnel and the magnetic The centerline and injection location of the beam are often prominent, especially in higher frequency devices. (2) the quality of the magnetic material is not as good as required; It is suitable for ensuring that the magnetic domains of individual magnets are aligned according to design targets with a precision that is As a result, after the VED is manufactured, technical experts usually When adjusting or fine-tuning the magnetic field around the VED to achieve optimal electron beam transmission This fine-tuning is typically done by manually attaching the VED structure to the outside with an adhesive. This is accomplished by applying fine tuning magnets in the process. This process is related to the transmission optimization process. The power for guidance is limited and in most cases the comparison of cathode current and beam delivery is Results are only available in the NI 8110A, whereas additional fine-tuning magnets can be added to optimize VED performance. This process is lengthy and can take several hours to complete depending on the complexity of the VED. It may take several weeks to complete the process. Stereoscopy has recently incorporated quadrupole alignment magnets for this purpose, but the alignment process has been gradually augmented. This only accelerates the wavelengths slightly, and still does not meet the requirements for near-THz devices. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] U.S. Provisional Patent Application No. 63 / 198,817 [Patent Document 2] U.S. Provisional Patent Application No. 63 / 198,915 [Patent Document 3] U.S. Provisional Patent Application No. 17 / 525,658 Summary of the Invention [Problem to be solved by the invention]

[0008] Previous VEDs have generally used individual 2D and 3D subcomponents to The components are formed into an assembly and the assembly is joined to the enclosure to provide structural support and a vacuum enclosure. and then undergoing conventional vacuum processing and sealing procedures to produce a fabricated, functional VED. Such procedures may take several minutes to complete a single device, depending on the complexity of the device. It can take weeks or more and requires many highly skilled workers and large Today, the ground stations, base stations, and local Wi-Fi are Explosive demand for wireless broadband data communications on i-systems and terrestrial backbone systems As the number of such devices used increases dramatically, there is a significant need for cheaper, higher volume such devices. [Means for solving the problem]

[0009] The subject matter described herein generally relates to a method of manufacturing a laminate of materials assembled and bonded together. Fabrication of Vacuum Electron Devices (VEDs) using parallel sheets to form three-dimensional VEDs The advantage of this approach is that multiple VEDs can be fabricated simultaneously with the same structure, and the semiconductor When completed, they can be easily assembled for individual use, much like is commonly done in vice construction. This allows the devices to be easily separated, thus significantly reducing the manufacturing cost per device. The VED so produced uses a combination of magnetic and electrostatic lenses for electron beam control. Includes combinations.

[0010] The foregoing summary is a summary and, as a result, may contain simplifications, generalizations, and omissions of detail. As a result, those skilled in the art will understand that the Summary is illustrative only and is in no way intended to be limiting. Please be aware that this is not a plot.

[0011] The accompanying drawings, which are incorporated in and constitute a part of this specification, show one or more representative The present invention will be described in detail with reference to the accompanying drawings, in which: Helps to explain. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a front right perspective view of a VED according to one embodiment. [Diagram 2] 2 is a rear left perspective view of the VED of FIG. 1 in accordance with one embodiment. [Diagram 3] 2 is a right-side front view of the VED of FIG. 1 according to one embodiment. [Figure 4] 2 is a partially cutaway perspective view of the front right side of the VED of FIG. 1 according to one embodiment. [Diagram 5] 2 is a partial cutaway perspective view of the front right interior of the VED of FIG. 1 according to one embodiment. [Figure 6] 6 is a cross-sectional view taken along line 6-6 of a portion of the interior of the VED of FIG. 1 according to one embodiment. [Figure 7] FIG. 1 is a front right perspective view of one VED cut out from an assembly according to one embodiment. [Figure 8] 1 is a cross-sectional view of a portion of the interior of a VED according to one embodiment. [Figure 9] 9 is a partial cutaway perspective view of the interior front left side of the VED of FIG. 8 according to one embodiment. [Figure 10] FIG. 2 is a partially cutaway perspective view of the interior front left side of a VED according to one embodiment. [Figure 11] 11 is a partially cutaway exploded perspective view of the interior, front left side, of section 11 of the VED of FIG. 10 according to one embodiment. [Figure 12A]11A-11C illustrate various control plates that may be used with embodiments to provide beam steering and focusing functions. [Figure 12B] 11A-11C illustrate various control plates that may be used with embodiments to provide beam steering and focusing functions. [Figure 12C] 11A-11C illustrate various control plates that may be used with embodiments to provide beam steering and focusing functions. [Figure 12D] 11A-11C illustrate various control plates that may be used with embodiments to provide beam steering and focusing functions. [Figure 13] 1 is a flow diagram illustrating a process or method for manufacturing a vacuum electronic device according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Representative embodiments are described herein in the context of a VED, such as a TWT. Those skilled in the art will recognize that the description is representative only and is not intended to be limiting in any way. Other embodiments will readily suggest themselves to such skilled artisans having the benefit of this disclosure. Reference will now be made in detail to exemplary embodiment implementations, as illustrated in the accompanying drawings. To the extent possible, the same reference numbers have been used throughout the following description to refer to the same or similar items. This refers to the item.

[0014] For clarity, not all of the routine features of the implementations described herein are illustrated. It is understood that any such practical implementation may be developed. To achieve the developer's specific goals, such as adhering to application-related and business-related constraints, Many implementation-specific decisions must be made to achieve this goal, and these specific goals are It will be recognized that implementations and developers will vary. Development efforts can be complex and time-consuming, but nonetheless, this It will be appreciated that this is a routine undertaking for those of ordinary skill in the art having the benefit of the present teachings.

[0015] As used herein, the terms "one embodiment" or "an embodiment" or "one implementation" or "an embodiment" may refer to References to "an implementation" or the like refer to particular features described in connection with representative embodiments. , a structure, part, feature, or characteristic may be included in at least one representative embodiment. In various places within this specification, the terms "in one embodiment" and "in one embodiment" may be used interchangeably. The appearance of phrases such as "in one embodiment" or "in another embodiment" does not necessarily refer to the same embodiment or implementation. The embodiments are not necessarily mutually exclusive of each other. It is not an alternative embodiment of the above.

[0016] In accordance with the present disclosure, the components and process steps described herein are may be implemented using a variety of techniques without departing from the spirit and scope of the inventive concept. That's fine.

[0017] What is described herein includes examples of embodiments of the present invention. Any possible combination of components or methodologies for the purpose of describing the subject matter sought. It is not possible to describe all of the above, but other combinations and permutations of the subject innovation are also possible. It should be recognized that claimed subject matter is accordingly defined in the appended claims. All such alternatives, modifications, and variations that fall within the spirit and scope of the present invention. Moreover, the disclosure of the subject matter, including that described in the Abstract, is intended to be illustrative and not restrictive. The above description of the embodiments is neither exclusive nor intended to limit the scope of the disclosed embodiments. Further, it is not intended to be limiting to the specific embodiments, examples, and aspects described herein. Implementations are described herein, but as those skilled in the art will recognize, such implementations may Various modifications are possible that would fall within the scope of the embodiments and examples.

[0018] In particular, the various functions performed by the components, devices, systems, etc. described above The terminology used to describe such components with respect to functionality is not specifically indicated. As long as the claimed subject matter performs its functions in the exemplary manner illustrated herein, Even if they are not structurally equivalent to the disclosed structures, they may still perform the designated functions of the described components. It is intended to correspond to any component (e.g., functional equivalent) that performs the functions described herein.

[0019] In addition, certain features of the invention may be described with reference to only one of several implementations. Although some features have been disclosed herein, such features may vary in any given application or particular suitability. Any one or more of such other implementations may be desirable or advantageous in the field of application. The term "includes" or "includes" may be used interchangeably with any of the other features of the present invention. "including," "has," "contains" The terms, variations thereof, and other similar terms are used in the detailed description and claims. to the extent that it is used in accordance with the principles of It is used in a similar way to the term "comprising" as a transitional word that is not unique. It is intended to be comprehensive.

[0020] Moreover, the words "example" or "exemplary" are used herein to mean examples, instances, or illustrations. Any of the terms described herein as "representative" are used to mean "useful" in any manner. No aspect or design is necessarily to be construed as preferred or advantageous over other aspects or designs. Rather, the use of the words "example" or "representative" should not be construed as implying or indicating that It is intended to present concepts in a concrete manner. As used in this application, the term "or" refers to "or" is intended to mean an inclusive "or" rather than an exclusive "or." That is, unless otherwise specified or clear from the context, "X is A" is or with B" is intended to mean any of the natural inclusive permutations, i.e. If X uses A, X uses B, or X uses both A and B, then "X uses either A or B" "Using the article "a" and "b" is satisfied under any of the preceding examples. As used in this application and the appended claims, unless otherwise specified, the terms "an" and "an" refer to the same or similar terms. or "one or more" generally, unless the context clearly directs to the singular form. "number" should be interpreted as meaning "number of

[0021] In the figures, when a callout number or reference designation is used in more than one figure, Unless otherwise expressly intended by the context, the same or similar parts, components, or a step.

[0022] The devices and methods described herein are applicable to pencil beams, sheet beams, rectangular beams, and For VEDs utilizing elliptical, hollow, diverging, and multiple beams It can be used.

[0023] Most of the following description assumes that the plate is in contact with the electron beam from below to above the electron beam. The present invention addresses the creation of VEDs in the form of parallel aligned layers, and furthermore, the present invention addresses the creation of VEDs in the form of parallel aligned layers, The chair can be constructed perpendicular to the electron beam in a relatively simple manner as shown in the teachings herein. It is contemplated that such a device may also be used in conjunction with, for example, a distributed beam detector, if desired. The device may be constructed at any angle to the electron beam, such as a vise.

[0024] A significant advantage of the present invention is that it is possible to build even a single prototype device using the present invention without using prior art has been shown to be much more cost-effective than multiple VEDs in a single batch. The ability of the present invention to simultaneously fabricate multiple VEDs and then cut them into individual components. It's in power.

[0025] Typically, magnets are used to perform some of the functions of shaping and aiming the electron beam in a VED. If the electron beam is not properly guided from the cathode to the anode, V It may collide with any other part of the ED structure, causing damage and contaminating the vacuum area. The ability to incorporate a variety of magnet material types is beneficial in the construction of VEDs. The lbach, or quadrupole array, is often placed some distance away from the electron beam. A solenoid is introduced around the electron beam, which is used to focus the electron beam. Another important advantage of the present invention is that it allows the electric field to be generated without placing magnets inside the vacuum chamber. This allows the magnet to be brought much closer to the child beam (electromagnetic solenoids) To provide a higher magnetic field strength at the electron beam for a given magnet (either a fixed or a fixed magnet) The advantage of this invention is that the magnetic field available from a magnet decreases with the square of the distance from the magnet. This allows the magnets to be brought closer together and the invention allows the magnets to be made smaller. Magnetic steering is not just about using actual magnets, but also about creating the desired magnetic field inside the VED in conjunction with magnets. A combination of magnetically susceptible material and magnets to establish a magnetic field and properly steer the electron beam. Magnetic materials and / or materials containing iron and nickel are well suited. Since the electron beam is not a good conductor, the electromagnetic circuit typically moves the focusing structure away from the electron beam. Made from materials such as copper (or tungsten for helix-type devices). and / or iron and nickel containing materials should be electrically welded with a highly conductive material such as copper. can be developed and used to alleviate this problem, however, The arrangement is intended to be consistent with respect to the VED, as such materials may degrade over time within the VED. This can create potential vacuum purity issues.

[0026] Electrostatic focusing also provides some of the electron beam shaping and aiming functions in VEDs. The ability of the present invention to introduce electrical conductors into a vacuum structure may then be used to A vacuum is created by applying a voltage across two or more plates placed around the electron beam. Allows for precise electrostatic focusing within the structure, as desired for specific applications, and If required, several sets of such plates may be used.

[0027] The manufacturing approach described herein is suitable for manufacturing VEDs at a variety of frequencies. It can be used for many applications, but is particularly useful for VEDs operating between about 25 GHz and about 1 THz. The manufacture of such devices using conventional device assembly by hand (in some cases) Some are difficult due to the small feature scale (micrometers to millimeters). be.

[0028] The embodiments described herein generally relate to improved electron beam current detection within a VED. , electron beam focusing, and electron beam steering. It uses conductors (electrodes) to apply an electrostatic field onto the electron beam in the vicinity of the to electronically detect and control electron beam propagation within a confining magnetic field. The electrodes are used to precisely control the beam transmission and losses along the VED circuit structure. In addition to detecting the electron beam, a potential is applied to the area around the electron beam (typically a single potential element). By using electrostatic lenses, which are elements of electron beams, or by focusing the electron beam (typically 2 To steer the beam (by using electrostatic deflectors, which are four or four potential elements) In this case, an electronic control system of conventional design may be employed to control the It detects the resulting current and consumes much less time than previous approaches. It is a relatively simple technique that uses little energy to adjust the potentials of the various electrodes to maximize the current passing through the electron beam. This allows the current entering the body of the VED to be minimized.

[0029] Turning now to the figures, FIG. 1 is a front right perspective view of a VED 100 in accordance with one embodiment. The VED 100 in FIG. 1 may be, for example, a sheet beam TWT. D100 is fabricated in the form of several layers that are stacked and bonded together according to one embodiment. The layers are parallel to the electron (sheet) beam axis (one end of the axis is called 102). The axial alignment of the slits may be parallel, or may be perpendicular to the axis, or may be aligned in any direction, if desired. The elements 104, 106, 108, 110 may be arranged at other angles. , and 112, with elements 108 also being permanent magnets, or or by elements 106 and 110 which may be formed from a magnetic material such as iron or nickel. The sandwich is made up of two permanent magnets sandwiched together on either side. The elements 104 and 112 are insulating materials (e.g., alumina). Electrical signals, such as bias signals (discussed in more detail below) and / or RF input / output signals, The terminals are carried by terminals 114, 116, 118, and 120. These terminals are as shown 12, 124, 126, and 128, respectively, and conductor insulation It is insulated from the rest of the structure by bodies 130, 132, 134, and 136. To the right of 100 is shown a four-pole (quadrupole) electrostatic steering / focusing assembly 138. Assembly 138 has four The electrode terminals 140, 142, 144, and 146 each include an insulating piece 148, 150, 152, and 154 provide insulation from the structure of VED 100. The elements 156, 158, and 160 that form the outer body of the device are formed from a conductive material such as copper. This electrostatic quadrupole focusing approach is compatible with the VE of sheet and pencil beams. D. Elements 162, 164 confine the electron beam traveling along axis 102. Between elements 156 and 160, there is a periodic cusp. Magnets, Periodic Permanent Magnets, Wiggler Magnets, Halbach Magnets, Permanent Magnets, Electromagnets - Permanent The magnetic assembly or magnetics of the VED may be one or more of the following types: The circuit is located.

[0030] FIG. 2 is a rear left perspective view of the VED 100 of FIG. 1 in accordance with one embodiment. , 168 are magnetic poles that serve to contain and focus the electron beam traveling along axis 102. A control plate bias signal (discussed in more detail below) and / or RF input Electrical signals, such as output signals, are provided at terminals 170, 172, 174, 176, 178, and 180. These terminals are carried by insulators 182, 184, and 186, respectively, as shown. , 188, 190, and 192 from the rest of the structure.

[0031] FIG. 3 is a right-side front view of the VED 100 of FIG. 1, according to one embodiment. 1. Additionally shown is the conductor insulation 198, 200 that separates element 1 from element 1. 58 are electrical terminals 194, 196 which are insulated from each other.

[0032] FIG. 4 is a cutaway perspective view of the front right side of the VED 100 of FIG. 1, in accordance with one embodiment. According to this embodiment, elements 156a and 160a are the same as elements 15 in FIGS. 6 and 160 are formed from insulating material rather than conductive material. Element 158 ​​is shown in FIG. 4 (and FIG. 5) as having two portions 158a and 158b. In the cutaway view, the electronic sheet beam tunnel 202 is shown as a coupled cavity. It may appear to be a type of structure.

[0033] FIG. 5 is a partial cutaway perspective view of the interior front right side of the VED 100 of FIG. 1 in accordance with one embodiment. It is.

[0034] FIG. 6 is a view taken along line 6-6 of a portion of the interior of the VED 100 of FIG. 1 in accordance with one embodiment. 1 is a cross-sectional view of a control plate bias signal (discussed in more detail below) and / or Electrical signals such as RF input / output signals are input to terminals 204, 206, 208, 210, 212, and These terminals are carried by insulators 216 and 214, respectively, as shown. 8, 220, 222, 224, and 226. 228 is an outer conductive cover, and element 230 is a conductive part made, for example, of copper. minutes.

[0035] FIG. 7 illustrates the front of one VED 700 cut from an assembly 702 according to one embodiment. According to this embodiment, the VED 700 is made of materials 704, 706, 708. , 710, 712, 714, 716, and at least one of these materials At least 706, 708, 710, 712, and 714 comprise a conductive material such as copper, Layers 702, 704 and 716 may be magnetic materials such as iron or nickel. 706, 708, 710, 712, 714, 716 are joined together. Interaction Region 7 18 includes layers 708, 710, and 712, and is configured to allow the electron beam of the VED 700 to interact with the RF signal. Such an RF signal is applied, for example, via conductor 720 to interaction region 710. 18 and may be extracted via conductor 722. After fabrication, the assembly 702 is cut ( for example laser or water jet cutting) to produce individual components such as the VED700 , leaving a gap 724 .

[0036] FIG. 8 is a cross-sectional view of a portion of the interior of a VED 800 according to one embodiment. 00 is a set of bonding layers that may be horizontal or perpendicular to the electron beam axis 802 of the device. The electron beam tunnel or interaction region is shown at 804. D800 includes a repeating set of blocks 806 comprising elements 808, 810, and 812. Elements 808 and 812 confine one or more electron beams of the VED 800. Element 810 is a permanent magnet to aid in confinement. The elements 814, 816, 818, 820, 822 may be permanent magnets made of pieces of material. 2, and 824 are conductive elements along which the electron beam of the VED 800 travels. 26, 828, 830, 832, 834, 836, 838, 840, and 842 are V The conductive parts of the ED800 body are connected to the various control plates 844, 846, 848, 8 50, and 852. The control plates 854, 856, and 858 are, for example, By applying various electrical biases (DC voltages) to the control plate, the electron beam The control plate 860 may be used to focus the three insulators 838, 840. , 842, and two conductive plates 850, 852, e.g. Various electrical biases (DC voltages) are applied to the inputs 850, 852, e.g., one is positive and the other is Two-axis electrostatic beam steering (PLL) is achieved by applying an electrical bias, one of which may be positive. The element 862 may be made of a material such as iron or nickel. The elements 864, 866, 868, and 870 is a conductive element along which the electron beam of VED 800 travels.

[0037] It is desirable to "punch" or "pre-punch" the electron beam to improve efficiency. In some cases, it may be desirable to apply a pulsed or modulated rather than a continuous DC voltage signal to the single-electrode electrostatic lens. The device can provide a voltage signal that is

[0038] FIG. 9 is a partial cutaway perspective view of the interior front left side of the VED 800 of FIG. 8 in accordance with one embodiment. It is.

[0039] FIG. 10 is a partial cutaway perspective view of the front left side of the VED 800 of FIG. 8 in accordance with one embodiment. do.

[0040] FIG. 11 illustrates an interior front left portion of section 11 of the VED 800 of FIG. 10 according to one embodiment. FIG.

[0041] 12A, 12b, 12C, and 12D show a method for detecting a beam according to an embodiment. It can be used to provide output (current), steering (deflection), and focusing (bias) functions. Various control plates or electrostatic lenses 1200, 1202, 1204, and 1206 are shown. 06. The beam focusing is achieved by, for example, focusing the electron beam in a completely conductive manner throughout the This can be achieved with a single voltage introduced into the plate. This is illustrated in FIG. The port 1200 may be formed from a conductor such as copper or another vacuum compatible material. The rod passes through an opening 1208 in the plate 1200 and is connected to a terminal 1210 (either positive or negative). ) voltage is applied. The negatively charged electrons are attracted in part by the charged plate 1200. They attract or repel one another and provide a focusing function.

[0042] FIG. 12B shows alumina (Al 2 O 3 A similar plate 120 formed from an insulating material such as 2. Alumina is easily brazed, as known to those skilled in the art. In the example shown, two electrodes 1212 and 1214 (located at 12 o'clock and 6 o'clock) The electron beam is formed (such as by plating or electroplating, or another equivalent method). The system can be configured to apply a positive or negative voltage to one or both of the electrodes 1212 and 1214. For example, the electrodes 1212 and 1214 may be steered or moved somewhat. One of the electrodes may be positively biased and the other negatively biased. Alternatively, one of electrodes 1212 and 1214 may be omitted entirely, and the voltage simply applied to the remaining electrode. It may be applied.

[0043] FIG. 12C shows a plate 1202 similar to that of FIG. 12B but at a different angle (in this case 90 12 illustrates a plate 1204 oriented at 3 o'clock and 9 o'clock (displaced by 120°). If control is desired, plates 12020 and 1204 can be stacked close to each other but insulated from each other. Additionally, electrodes 1216 and 1218 on plate 1204 are added to provide such control. It may be offered.

[0044] FIG. 12D illustrates the concept just described, but with four electrodes 1220, 1222. 1 illustrates the concept implemented in the form of a single plate having 1224, 1226, and 1228. It should be noted that more electrodes may be provided and different angular positions may be used if desired. Note that the final voltage applied to the electrodes may provide a focusing effect, and the unbalanced voltage may This may provide a deflection effect.

[0045] 12A, 12B, 12C, and 12D show an embodiment of an electron beam It is used for detection, focusing, and steering (and also beam acceleration / deceleration, if desired). 8 illustrates a control plate that may be used. For example, in FIG. 8, the control plate includes elements 854, 8 56, 858, and 860. The VEDs referred to in this specification are The magnet includes a V The ED may be of the solenoid type surrounding the ED, or as exemplified herein, may be of the electronic Incorporated into the VED structure to place the magnet closer (and more effectively) to the beam Without some kind of containment force, the electron beam The electron beam spreads out like water coming out of a hose. Magnetic containment keeps the electron beam narrow and The beam is incident directly on the VED structure, damaging the VED and wasting the electron beam energy. Contain the electron beam along its path to keep it outside the range of It acts like a magnetic lens.

[0046] The control plate is an electrostatic lens. Electrostatic lenses are periodically introduced along the electron beam. The electron lens steers and focuses the electron beam and is integrated around the electron beam (the electron lens is the The center is hollow to allow the beam to pass through, and the propagation path is along a fixed magnetic field These control plates may have one or more electrical connections. The control plates of the VED may be stacked close to each other. The electrostatic lens focuses the VED along the magnetic structure. may be stacked to occasionally interrupt the magnetic structure of the VED to achieve a higher magnetic strength at the beam axis. This allows the magnetic structures to be closer to the beam tunnel.

[0047] In addition, by incorporating electrostatic lenses at various locations along the electron beam tunnel, This allows for incremental measurement of electron beam loss along the electron beam tunnel. and / or as a result, the circuitry is connected to the magnetic assembly. or to help identify problem areas with respect to electron beam alignment. The electrostatic lens extends continuously along the electron beam tunnel at a certain axial location. The electron beam may be oriented in a direction perpendicular to the surface of the electron beam, may be oriented to surround the electron beam, or may be oriented at a separate location. and may be positioned along the electron beam at a fixed axial location.

[0048] Electrostatic lenses (individual conductors) detect the electron current density at each sensor location along the electron beam. The electrostatic lens may function to adjust the potential of the electrostatic lens to the electrodes and the VED. Focusing or steering the electron beam by minimizing the electron beam current delivered to the structure This technique operates at millimeter wave and near THz frequencies. The VEDs described herein are particularly useful for compensating for magnetic field irregularities commonly encountered in such devices. It is beneficial.

[0049] The control plate determines the position of the electron beam inside the beam tunnel and, if circular, provides multiple electrodes surrounding the electron beam, which helps characterize the concentricity of the electron beam. The ion exchange can be adapted to

[0050] The magnetic-electrostatic focusing design is made possible by the multi-layer, multi-material manufacturing approach described herein. The approach involves the use of metallic, magnetic and other materials in the fabrication of the focusing / steering / detection system. The materials used are stainless steel and ceramic.

[0051] This approach includes sheet beams, hollow beams, pencil beams, distributed beams, and multi-beams. The present invention may be used in beam types such as beam devices.

[0052] The detected electron beam current is used to apply potentials to available electrostatic lenses to control the electron beam propagation. To optimize the electron beam propagation along the electron beam tunnel by optimizing may be employed, thereby reducing the need for assembly and fine-tuning by a technician.

[0053] To perfectly focus and position the electron beam for maximum performance, The current that flows to ground but not to the collector is monitored to determine the magnetic field and current around the VED. Applying adjustments to the electrostatic voltage input to various control plates introduced along the child beam This can be minimized by

[0054] FIG. 13 illustrates a process for manufacturing a vacuum electronic device according to an embodiment of the present invention. 13 is a flow diagram illustrating a method 1300. The process steps described in connection with FIG. may be performed, or some or all at once.

[0055] Block 1302 is the first step, which involves forming a first planar non-magnetic conductive material from a non-magnetic conductive material. A conductor plate is formed.

[0056] Block 1304 is the second step, forming a second planar non-magnetic conductive material from the non-magnetic conductive material. A conductor plate is formed.

[0057] Block 1306 is a third step, in which the interaction structure includes an electron beam tunnel. The non-magnetic interaction structure is formed by a plurality of planar non-magnetic interaction structure forming plates arranged parallel to each other so as to An interaction structure is formed, and the interaction structure has at least one leading edge that leads to the outside of the interaction structure. At least one electrostatic lens element having a conductive path, the conductive path being electrically isolated from the interaction structure so that a voltage applied to the electrostatic lens element is conducted to the electrostatic lens element. do.

[0058] Block 1308 is a fourth step, which comprises forming a first planar non-magnetic conductive plate and a second The first planar non-magnetic conductive plate is placed on the outside of the lamination. The port, the interacting structure, and a second planar non-magnetic conductive plate are arranged in a stack.

[0059] Block 1310 is the fifth step, which comprises forming a first planar non-magnetic conductive plate, an interacting The support structure, and a second planar non-magnetic conductive plate are joined together.

[0060] Block 1312 is the sixth step, which involves sealing the electron beam inside the electron beam tunnel. At least one magnet arranged to confine the electron beam tunnel region surrounds the electron beam tunnel region.

[0061] Block 1314 is a seventh optional step, which involves placing a To deliver an electrical bias signal provided on at least one electrically isolated conductor. At least one electrostatic lens element is formed so as to be configured as follows:

[0062] Block 1316 is a seventh optional step, which involves placing a At least two separate electrical insulated conductors are provided on at least two separate electrical insulated conductors. forming at least one electrostatic lens element configured to deliver an electrical bias signal; Complete.

[0063] Block 1318 is a seventh optional step, which involves placing a At least four separate electrical insulated conductors provided on at least four separate electrical insulated conductors. forming at least one electrostatic lens element configured to deliver an electrical bias signal; Complete.

[0064] It will now be appreciated by those skilled in the art that these steps can be performed in the order most convenient for manufacturing and fixing. It will be appreciated that the steps of joining do not necessarily have to be performed in a set order. The forming step can be performed in one step to produce a part for later assembly. For example, it can be carried out with

[0065] The step of joining the two-dimensional sheets together can be performed by brazing, diffusion bonding, or assisted diffusion bonding (a ssisted diffusion bonding, solid state bonding ate bonding), cold welding, ultrasonic welding, or a combination of one or more of the above. The joint formed between two adjacent sheets may be a 1×1 0 -6 The vacuum environment should be maintained at 300 K or better. Bonding should be done with hydrogen, nitrogen, vacuum, etc. Before bonding, the corresponding layers should be cleaned or pre-treated. The surface oxide layer should be removed by Zuma etching, which helps to form a good leak-tight joint. To achieve this, the corresponding layers should be maintained in a vacuum environment before bonding. In this case, the corresponding layers are arranged in a vacuum-compatible field between the two corresponding layers (which may be of dissimilar materials). Coating with vacuum compatible materials (sputtering, electroplating, metallization, etc.) to enhance surface creation and / or painted). Coatings include nickel, gold, silver, molybdenum-manum, Gun, copper, copper-gold, copper-silver, titanium-nickel, gold-copper-titanium, copper-silver-titanium, copper- Silver-titanium-aluminum, titanium-nickel-copper, gold-copper-titanium-aluminum, silver -Copper-Indium-Titanium, Copper-Germanium, Palladium-Nickel-Copper-Silver, Gold-Palladium Radium-magnesium, silver-palladium, gold-copper-nickel, gold-copper-indium, silver -Containing one or more of the following: copper-indium, gold-nickel, gold-nickel-chromium, etc. In this manner, the bonded layers form a high strength assembly, resulting in a relatively high yield. The force handling capability and high gradient capability of the VED are obtained.

[0066] The layers are also electrically insulating to manage the heat flow as well as the electrical potential within the VED. coated with conductive or electrically conductive materials (sputtered, electroplated, metallized, and / or painted) ) The coating may also reduce the flow of heat into and away from the VED. To better manage this, materials designed to conduct heat (e.g. diamond) The layers may then include electrodes, and and an insulator that is plated with conductive paths to form an electrical path to bias the electrodes. (For example, Al 2 O 3 ) may be made.

[0067] Cutouts or pockets are milled, turned, eroded, lithographed Using techniques such as etching, laser cutting, electron beam cutting, water jet cutting, etc. The cutouts or pockets so formed may be formed in the conductive sheet of the VED. The materials used are ceramic materials, vacuum windows, and circuit-disconnecting materials (used to improve device stability). attenuators for use in detecting electrons, electron emitting materials, vacuum pumping materials, getter materials, Components such as magnets, iron pieces, shielding materials, isolation materials, conductors, connectors, waveguides, couplers, etc. It may be populated by elements.

[0068] By incorporating ceramic materials, focusing, propagation, guidance, steering, punching, and Electrostatic beam-shaping lenses, which ultimately help improve the electron beam propagation between the cathode and collector Alternatively, an electrostatic beam forming section can be added inside the VED. Rather than providing this capability, by incorporating this capability within the VED itself, This allows for more precise control of the child beams with less power consumption.

[0069] Aligning adjacent layers or sheets of material within the VED during the manufacturing process is This may be accomplished using column features 112. Such features are discussed elsewhere herein. Such alignment holes, alignment pins, rectangular features, combinations thereof, and optical features suitable for robotic assembly techniques The assembly of the seat can be done by hand, robot, or Translation stages, automated translation, robotic placement, video from microscale to nanoscale It may be affected by alignment, banya, etc.

[0070] Having shown and described exemplary embodiments and applications, it is understood that those skilled in the art will appreciate that, having the benefit of this disclosure, Those skilled in the art will appreciate that, without departing from the scope of the invention as defined by the appended claims, The various exemplary embodiments described herein may include numerous modifications not specifically mentioned above. It will be apparent that corrections, modifications and adaptations may be made.

Claims

1. A vacuum electron device, comprising: a first planar non-magnetic conductive plate; a second planar non-magnetic conductive plate; A magnetic field is formed between the first planar non-magnetic conductive plate and the second planar non-magnetic conductive plate. a plurality of planar surfaces positioned to form an RF interactive structure housing an electron beam tunnel region; Non-magnetic interaction structure forming plate and Equipped with the first planar non-magnetic conductive plate, the second planar non-magnetic conductive plate, and the plurality of non-magnetic interactive structure forming plates are arranged in parallel and joined together; The electron beam tunnel region confines the electron beam within the electron beam tunnel region. The magnet is surrounded by a plurality of permanent magnets arranged so as to be embedded in the magnet. The RF interactive region includes at least one electrically isolated RF interactive region. a control plate, the at least one control plate communicating with the RF interaction structure; at least one of the RF interaction structures arranged to be electrically isolated from the RF interaction structure; A vacuum electronic device that is bonded to an electrically isolated conductor.

2. The at least one control plate includes at least one of the at least two control plates disposed on the control plate. and configured to deliver an electrical bias signal provided on another electrically isolated conductor. The vacuum electron device according to claim 1 .

3. The at least one control plate includes at least two control plates disposed on the control plate. At least two separate electrical biases provided on two separate electrically insulated conductors. The vacuum electron device of claim 1 configured to deliver a signal.

4. The at least one control plate includes at least four control plates disposed on the control plate. At least four separate electrical biases provided on four separate electrically insulated conductors. The vacuum electron device of claim 1 configured to deliver a signal.

5. A vacuum electron device, comprising: The conductive sections of the interaction structure that houses the electron beam tunnel of the VED. the electron beam tunnel having a longitudinal axis parallel to the interaction structure; The plurality of conductive sections are separated by pairs of electrical insulators, each pair being spaced apart from the length. sandwiching at least one electrostatic lens element disposed perpendicular to the longitudinal axis; Each of the electrostatic lens elements has at least one conductive path leading to the exterior of the interaction structure. a conductive path configured to cause a voltage applied to the conductive path to be applied to the electrostatic lens element electrically isolated from the interactive structure so as to be conductive to A plurality of conductive sections are provided, The electron beam tunnel region confines the electron beam within the electron beam tunnel region. A vacuum electronic device surrounded by a number of permanent magnets arranged to enclose a vacuum.

6. The at least one electrostatic lens element includes a plurality of electrostatic lenses disposed on the electrostatic lens element. and configured to deliver an electrical bias signal provided on at least one electrically isolated conductor. The vacuum electron device according to claim 5 .

7. The at least one electrostatic lens element includes at least one At least two separate electrical bipolar plates provided on two separate electrically insulated conductors.

6. The vacuum electron device of claim 5 configured to deliver an ass signal.

8. The at least one electrostatic lens element includes at least one At least four separate electrical bipolar plates provided on four separate electrically insulated conductors.

6. The vacuum electron device of claim 5 configured to deliver an ass signal.

9. 1. A method of fabricating a vacuum electronic device, comprising the steps of: forming a first planar non-magnetic conductive plate from a non-magnetic conductive material; forming a second planar non-magnetic conductive plate from a non-magnetic conductive material; A plurality of conductive non-magnetic interaction structure forming plates arranged parallel to each other are used to form an interaction structure. forming the interaction structure such that the structure contains an electron beam tunnel. The interactive structure has at least one conductive path leading to an exterior of the interactive structure. At least one electrostatic lens element having a conductive path, electrically isolated from the interactive structure so that an applied voltage is conducted to the electrostatic lens element. A step bordered by The first planar non-magnetic conductive plate and the second planar non-magnetic conductive plate are stacked. The first planar non-magnetic conductive plate, the interacting structure, and and disposing said second planar non-magnetic conductive plate in said stack; The first planar non-magnetic conductive plate, the interacting structure, and the second planar non-magnetic conductive plate. joining the magnetic conductor plates together; at least one of said first and second electrodes arranged to confine the electron beam within said electron beam tunnel region; surrounding the electron beam tunnel region with another permanent magnet; A method for providing the above.

10. on at least one electrically insulated conductor disposed on the electrostatic lens element. the at least one electrostatic lens configured to deliver an electrical bias signal to the Forming the element The method of claim 9 further comprising:

11. On at least two separate electrically insulated conductors disposed on the electrostatic lens element. configured to deliver at least two separate electrical bias signals provided to Forming the at least one electrostatic lens element. The method of claim 9 further comprising:

12. on at least four separate electrically isolated conductors disposed on said electrostatic lens element; configured to deliver at least four separate electrical bias signals provided to Forming the at least one electrostatic lens element. The method of claim 9 further comprising:

Images