Light-emitting element and distance measuring apparatus

Abstract

To provide a light-emitting element and a distance measuring apparatus, in which increase in a manufacturing cost is suppressed and entry of return light in a driving circuit is suppressed.SOLUTION: A first substrate 10 including a driving circuit 12, and a second substrate 20 including a light-emitting part 21 driven by the driving circuit 12 and mounted on one surface side of the first substrate 10 are provided. The first substrate 10 includes two or more wiring layers 13 electrically connected to each other. The wiring layers 13 and some pad electrodes 14 that are adjacent in a thickness direction are disposed in a zigzag manner so as to cover at least a part of the driving circuit 12 in a plan view from the second substrate 20 side. Thus, the wiring layers 13 disposed in the zigzag manner can attenuate the return light that penetrates the second substrate 20.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The technology according to the present disclosure (hereinafter also referred to as "the technology") relates to a light-emitting element and a distance measuring device. [Background technology]

[0002] Conventionally, light emitting elements such as vertical cavity surface emitting lasers (VCSELs) that emit light in a direction perpendicular to a semiconductor substrate have been used. Vertical cavity surface emitting lasers are used in a wide variety of fields, such as optical communications, optoelectronic devices, and optical sensing.

[0003] For example, Patent Document 1 discloses a vertical cavity surface emitting laser in which a laser chip is disposed on a laser driver IC. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2020 / 100572 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the light emitted by the light-emitting element is diffusely reflected and becomes return light, which may enter the drive circuit (laser driver IC). When this return light enters the drive circuit, the drive current fluctuates due to the photoelectric effect, which may cause the emission intensity, which is set to the desired output value, to fluctuate.

[0006] One possible solution to this problem is to place a light-shielding film, but it is difficult to place a light-shielding film around the laser chip in a configuration in which the laser chip is placed on a laser driver IC, as in Patent Document 1. Furthermore, placing a light-shielding film increases manufacturing costs.

[0007] In view of the above, a main object of the present technology is to provide a light-emitting element and a distance measuring device that suppresses return light from entering a drive circuit while suppressing an increase in manufacturing costs. [Means for solving the problem]

[0008] This technology is A first substrate having a driving circuit; a second substrate having a light-emitting unit driven by the drive circuit and mounted on one surface side of the first substrate; the first substrate has two or more wiring layers that are electrically connected to each other; The light emitting element is provided in which some of the wiring layers adjacent to each other in the thickness direction are arranged in a staggered manner so as to cover at least a part of the drive circuit when viewed in a plan view from the second substrate side. The wiring layers arranged in a staggered pattern may be arranged in the vicinity of the second substrate. The second substrate, the wiring layer arranged in a staggered pattern, and the drive circuit may be laminated. The wiring layer arranged in a staggered pattern may be arranged in an upper layer. The wiring layer arranged in a staggered pattern may be arranged in a lower layer. The first substrate may have three or more wiring layers arranged in a staggered pattern. When viewed in plan from the second substrate side, the wiring layers arranged in a staggered pattern may be arranged so as to cover the entire drive circuit. The wiring layer may include a material that is light-shielding to infrared rays. The wiring layer may contain at least one material selected from aluminum (Al), copper (Cu), tungsten (W), and gold (Au). The light emitting element may further include a light shielding portion that shields at least a portion of the drive circuit from light emitted by the light emitting portion. The light blocking portion may be disposed on the first substrate on a side facing the second substrate. The light blocking portion may be arranged in a ring shape along an outer periphery of the first substrate. The light emitting portion may include a vertical cavity surface emitting laser. The light emitted by the light emitting portion may be infrared light. In addition, this technology: A first substrate having a driving circuit; a second substrate having a light-emitting unit driven by the drive circuit and mounted on one surface side of the first substrate; the first substrate has two or more wiring layers that are electrically connected to each other; When the wiring layers adjacent to each other in the thickness direction are a first wiring layer and a second wiring layer, The light-emitting element is provided, in which the second wiring layer is arranged to protrude from an end of the first wiring layer so as to cover at least a portion of the drive circuit when viewed in a plan view from the second substrate side. In addition, this technology: A light-emitting element; A light receiving element, The light-emitting element is A first substrate having a driving circuit; a second substrate having a light-emitting unit driven by the drive circuit and mounted on one surface side of the first substrate; the first substrate has two or more wiring layers that are electrically connected to each other; some of the wiring layers adjacent to each other in a thickness direction are arranged in a staggered manner so as to cover at least a part of the drive circuit when viewed in a plan view from the second substrate side; The light receiving element is There is provided a distance measuring device having a light receiving section that receives the light emitted by the light emitting section.

[0009] According to the present technology, it is possible to provide a light emitting element and a distance measuring device that suppress the return light from entering a driving circuit while suppressing an increase in manufacturing cost. Note that the effects described here are not necessarily limited to those described herein, and may be any of the effects described in the present disclosure. [Brief description of the drawings]

[0010] [Figure 1] 1 is a schematic perspective view showing an example of the configuration of a light-emitting device 100 according to an embodiment of the present technology. [Diagram 2] FIG. 2 is a schematic perspective view showing a comparative example of the light-emitting device 100 according to an embodiment of the present technology. [Diagram 3] 1 is a schematic cross-sectional view showing a comparative example of the light-emitting device 100 according to an embodiment of the present technology. [Figure 4] 1 is a schematic cross-sectional view showing an example of the configuration of a light-emitting device 100 according to an embodiment of the present technology. [Diagram 5] 1 is a schematic cross-sectional view showing an example of the configuration of a simulation model of a light-emitting device 100 according to an embodiment of the present technology. [Figure 6] 1 is a graph showing a simulation result of the light-emitting device 100 according to an embodiment of the present technology. [Figure 7] 1 is a schematic cross-sectional view showing an example of the configuration of a light-emitting device 100 according to an embodiment of the present technology. [Figure 8] 1 is a schematic cross-sectional view showing an example of the configuration of a light-emitting device 100 according to an embodiment of the present technology. [Figure 9] 1 is a schematic cross-sectional view showing an example of the configuration of a light-emitting device 100 according to an embodiment of the present technology. [Figure 10] 1 is a schematic cross-sectional view showing an example of the configuration of a light-emitting device 100 according to an embodiment of the present technology. [Figure 11] 1 is a schematic cross-sectional view showing an example of the configuration of a light-emitting device 100 according to an embodiment of the present technology. [Figure 12] 1 is a schematic cross-sectional view showing an example of the configuration of a light-emitting device 100 according to an embodiment of the present technology. [Figure 13] 1 is a schematic cross-sectional view showing an example of the configuration of a light-emitting device 100 according to an embodiment of the present technology. [Figure 14] 1 is a schematic cross-sectional view showing an example of the configuration of a light-emitting device 100 according to an embodiment of the present technology. [Figure 15] 1 is a schematic cross-sectional view showing an example of the configuration of a light-emitting device 100 according to an embodiment of the present technology. [Figure 16] 1 is a schematic cross-sectional view showing an example of the configuration of a light-emitting device 100 according to an embodiment of the present technology. [Figure 17] 1 is a schematic cross-sectional view showing an example of the configuration of a light-emitting device 100 according to an embodiment of the present technology. [Figure 18] 1 is a schematic cross-sectional view showing an example of the configuration of a light-emitting device 100 according to an embodiment of the present technology. [Figure 19] 1 is a schematic diagram showing a configuration example of a distance measuring device 1 according to an embodiment of the present technology. [Figure 20] FIG. 1 is an explanatory diagram of the STL method. [Figure 21] FIG. 1 is a block diagram showing a schematic configuration example of an electronic device including a light-emitting device 100 according to an embodiment of the present technology. [Figure 22] 1 is a block diagram showing a schematic configuration example of a vehicle control system that is an example of a mobile object control system to which the present technology can be applied. [Diagram 23] 1A to 1C are diagrams illustrating examples of installation positions of a distance measuring device 12031 according to an embodiment of the present technology. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, preferred embodiments for carrying out the present technology will be described with reference to the drawings. Note that the embodiment described below shows an example of a representative embodiment of the present technology, and does not limit the scope of the present technology. In addition, the present technology can be combined with any of the following examples and their modified examples.

[0012] In the following description of the embodiments, the configuration may be described using terms with "approximately" such as "approximately parallel" and "approximately perpendicular". For example, "approximately parallel" does not only mean completely parallel, but also means substantially parallel, that is, including a state in which the state is deviated from the completely parallel state by, for example, about several percent. The same applies to other terms with "approximately". In addition, each figure is a schematic diagram and is not necessarily illustrated precisely. The scale of the drawings is emphasized to make the characteristics of the technology easier to understand. Therefore, it should be noted that the scale of the drawings and the scale of the actual device are not necessarily the same.

[0013] Unless otherwise specified, in the drawings, "top" means the top direction or upper side in the drawing, "bottom" means the bottom direction or lower side in the drawing, "left" means the left direction or left side in the drawing, and "right" means the right direction or right side in the drawing. In addition, in the drawings, the same or equivalent elements or members are given the same reference numerals, and duplicate explanations are omitted.

[0014] The explanation will be given in the following order. 1. First embodiment of the present technology (example 1 of light-emitting device) (1) Overview (2) Configuration example of light-emitting element 100 (3) Arrangement of wiring layer 13 (4) Simulation (5) Vertical-cavity surface-emitting laser 2. Second embodiment of the present technology (example 2 of light-emitting device) 3. Third embodiment of the present technology (example 3 of light-emitting device) 4. Fourth embodiment of the present technology (example 4 of light-emitting device) 5. Fifth embodiment of the present technology (example 5 of light-emitting device) 6. Sixth embodiment of the present technology (example of distance measuring device) (1) Configuration of distance measuring device 1 (2) Distance measurement method 7. Seventh embodiment of the present technology (example 1 of electronic device) 8. Eighth embodiment of the present technology (example 2 of electronic device)

[0015] [1. First embodiment of the present technology (example 1 of light-emitting device)] [(1) Overview] A configuration example of a light-emitting device according to an embodiment of the present technology will be described with reference to Fig. 1. Fig. 1 is a schematic perspective view showing a configuration example of a light-emitting device 100 according to an embodiment of the present technology. As shown in Fig. 1, the light-emitting device 100 includes a first substrate 10, a second substrate 20, and a substrate 11.

[0016] The first substrate 10 has a drive circuit 12. The drive circuit 12 is an electric circuit that drives the light-emitting unit 21. The drive circuit 12 is provided, for example, in a substrate called an LDD (Laser Diode Driver) substrate.

[0017] The second substrate 20 has a light-emitting section 21 driven by the drive circuit 12, and is mounted on one surface of the first substrate 10. That is, the second substrate 20 is arranged by being stacked on the first substrate 10. This shortens the wiring connecting the first substrate 10 and the second substrate 20, thereby enabling high-speed driving of the light-emitting element 100. In addition, the arrangement area is smaller than that of a configuration in which the first substrate 10 and the second substrate 20 are arranged side by side, thereby enabling miniaturization of the light-emitting element 100. This will be described with reference to FIG. 2. FIG. 2 is a schematic perspective view showing a comparative example of the light-emitting element 100 according to an embodiment of the present technology.

[0018] As shown in Fig. 2, in this comparative example, the first substrate 10 and the second substrate 20 are arranged side by side. Therefore, the wiring connecting the first substrate 10 and the second substrate 20 is long, and there is a concern that the driving speed will be lower than in the configuration in which the first substrate 10 and the second substrate 20 are stacked (see Fig. 1). Furthermore, in the comparative example shown in Fig. 2, the area in which the first substrate 10 and the second substrate 20 are arranged is larger than in the configuration in which the first substrate 10 and the second substrate 20 are stacked (see Fig. 1). Therefore, there is a concern that the light emitting element 100 will be large.

[0019] Incidentally, light emitted from the light-emitting unit 21 may be diffusely reflected by components constituting the device, becoming return light and entering the driving circuit 12. This will be described with reference to Fig. 3. Fig. 3 is a schematic cross-sectional view showing a comparative example of the light-emitting element 100 according to an embodiment of the present technology.

[0020] 3, in this comparative example, the light emitting element 101 includes a first substrate 10 having a drive circuit 12, and a second substrate 20 having a light emitting section 21 driven by the drive circuit 12 and mounted on one surface of the first substrate 10. The first substrate 10 and the second substrate 20 are electrically connected via bump electrodes 22.

[0021] The first substrate has a wiring layer 13 electrically connected to a power supply circuit (not shown), a drive circuit 12, etc. Light emitted from the light emitting unit 21 is diffusely reflected and becomes return light L, and this return light L passes through gaps between the wiring layers 13 and enters the substrate 11.

[0022] The return light L that enters the substrate 11 may further enter the drive circuit 12. When the return light L enters the drive circuit 12, the drive current fluctuates due to the photoelectric effect, which may cause the emission intensity set to a desired output value to fluctuate.

[0023] As a countermeasure against the intrusion of the return light L, for example, a light-shielding film may be formed from a resin material, a metal material, or the like, and disposed on the first substrate 10 having the drive circuit 12, thereby making it possible to suppress the intrusion of this return light L.

[0024] However, due to the structure of the light emitting element 100, it is difficult to bring the second substrate 20 and the light shielding film into contact with each other, and it is necessary to form a gap of several μm around the second substrate 20. Therefore, there is a risk that the return light L may enter through this gap. In addition, if the light shielding film is made of a metal material, there is a risk that the light shielding film may come into contact with the wiring layer 13, causing a short circuit. Furthermore, since a light shielding film cannot be formed between the first substrate 10 and the second substrate 20, there is a risk that the return light L may penetrate the second substrate 20 and enter the first substrate 10.

[0025] [(2) Configuration example of light-emitting element 100] Therefore, in the present technology, the electrically connected wiring layer 13 is devised in its arrangement to suppress the intrusion of the return light L. This will be described with reference to Fig. 4. Fig. 4 is a schematic cross-sectional view showing a configuration example of a light emitting device 100 according to an embodiment of the present technology.

[0026] As shown in Figure 4, the light-emitting element 100 comprises a first substrate 10 having a driving circuit 12, and a second substrate 20 having a light-emitting section 21 driven by the driving circuit and mounted on one side of the first substrate 10.

[0027] The first substrate 10 has an insulating layer 15 and two or more electrically connected wiring layers 13 on a substrate 11. The wiring layers 13 are electrically connected to a power supply circuit (not shown), a drive circuit 12, etc.

[0028] The second substrate 20, the wiring layer 13 arranged in a staggered pattern, and the driving circuit 12 are laminated together. The first substrate 10 and the second substrate 20 are electrically connected via bump electrodes 22 and pad electrodes 14. This configuration shortens the wiring connecting the driving circuit 12 and the second substrate 20, allowing the light emitting element 100 to be driven at high speed. In addition, the arrangement area is smaller than in a configuration in which the first substrate 10 and the second substrate 20 are arranged side by side, allowing the light emitting element 100 to be miniaturized.

[0029] Each of the multiple wiring layers 13 is disposed on an upper layer 13a, which is a layer on the second substrate 20 side, and a lower layer 13b, which is a layer on the substrate 11 side. The wiring layer 13 disposed on the upper layer 13a is formed to be thicker in the vertical direction than the wiring layer 13 disposed on the lower layer 13b. Specifically, the wiring layer 13 disposed on the upper layer 13a is formed to be about 10 times thicker than the wiring layer 13 disposed on the lower layer 13b.

[0030] In this case, it is preferable that some of the wiring layers 13 adjacent to each other in the thickness direction are arranged in a staggered pattern so as to cover at least a portion of the drive circuit 12 when viewed in plan from the second substrate 20 side.

[0031] In other words, when some of the wiring layers 13 adjacent in the thickness direction arranged on the upper layer 13a are the first wiring layer 131 and the second wiring layer 132, it is preferable that the second wiring layer 132 is arranged to protrude from the end of the first wiring layer 131 so as to cover at least a portion of the drive circuit 12 when viewed in a plane from the second substrate 20 side.

[0032] Similarly, when some of the wiring layers 13 adjacent in the thickness direction arranged on the lower layer 13b are a first wiring layer 133 and a second wiring layer 134, it is preferable that the second wiring layer 134 is arranged to protrude from the end of the first wiring layer 133 so as to cover at least a portion of the drive circuit 12 when viewed in a plane from the second substrate 20 side.

[0033] According to the present technology, the wiring layers 13 arranged in a staggered pattern attenuate the returning light, thereby making it possible to prevent the returning light from entering the driving circuit.

[0034] According to this technology, in the existing wiring layer formation process, it is only necessary to devise the arrangement of the wiring layer, and the formation of the light-shielding film is not necessary. Therefore, the process of forming the light-shielding film is not necessary, and a decrease in manufacturing efficiency can be prevented. In addition, since the light-shielding film is not required, the manufacturing cost can be reduced, and further, the generation of electromagnetic noise when the light-shielding film is made of a metal material can be prevented.

[0035] 2, in the case of a configuration in which the first substrate 10 and the second substrate 20 are arranged side by side, in order to shield the drive circuit 12 of the first substrate 10 from light, it is possible to shield the drive circuit 12 by, for example, extending a wiring layer (not shown) to the vicinity of the drive circuit 12. Since the drive circuit 12 is arranged at a position far from the light-emitting section 21, it is relatively easy to extend the wiring layer.

[0036] 4, in the case of a configuration in which the second substrate 20 is stacked on the first substrate 10, the wiring density around the power supply circuit significantly affects characteristics such as impedance, making it difficult to simply extend the wiring layer 13. As a result of extensive research, the inventors have succeeded in suppressing changes in characteristics such as impedance while exerting a light blocking effect by devising a staggered arrangement of the wiring layer 13.

[0037] The above-mentioned effects are similarly achieved in other embodiments described below, and therefore repeated description of the other embodiments may be omitted.

[0038] [(3) Arrangement of wiring layer 13] As shown in FIG. 4, if the areas of the second wiring layers 132, 134 that extend beyond the ends of the first wiring layers 131, 133 are arranged so as to cover at least a portion of the drive circuit 12, the return light L can be sufficiently attenuated.

[0039] However, when viewed in plan from the second substrate 20 side, it is more preferable that the wiring layers 13 arranged in a staggered pattern are arranged so as to cover the entire driving circuit 12. In other words, it is more preferable that the areas of the second wiring layers 132, 134 that are arranged protruding from the ends of the first wiring layers 131, 133 are arranged so as to cover the entire driving circuit 12.

[0040] Furthermore, it is preferable that the wiring layers 13 arranged in a staggered pattern are arranged near the second substrate 20. This allows the wiring layers 13 arranged in a staggered pattern to attenuate the return light penetrating the second substrate 20. In addition, due to the structure of the light-emitting element 100, it is necessary to form a gap of at least several μm around the periphery 23 of the second substrate 20, and it is difficult to form a light-shielding portion around the periphery 23 of the second substrate 20. Therefore, the wiring layers 13 arranged in a staggered pattern can attenuate the return light entering through this gap.

[0041] As shown in Fig. 5 described later, at least two wiring layers 13 arranged in a staggered pattern are effective in attenuating the returning light. As shown in Fig. 4, when the first substrate 10 has three or more wiring layers 13 arranged in a staggered pattern, the effect of attenuating the returning light is further increased.

[0042] While the positional relationship between the wiring layers 13 has been described so far, the same can be said about the positional relationship between the wiring layers 13 and the pad electrodes 14. As shown in Fig. 4, some of the pad electrodes 14 and the wiring layers 13 adjacent to each other in the thickness direction may be arranged in a staggered manner so as to cover at least a part of the driving circuit 12 when viewed in a plan view from the second substrate 20 side. In other words, the wiring layers 13 may be arranged to protrude from the ends of the pad electrodes 14 so as to cover at least a part of the driving circuit 12 when viewed in a plan view from the second substrate 20 side.

[0043] [(4) Simulation] Since the second wiring layer 132 is disposed protruding from the end of the first wiring layer 131, the return light L collides with this protruding region and is attenuated. A simulation was performed to confirm this. This simulation will be described with reference to Figs. 5 and 6. Fig. 5 is a schematic cross-sectional view showing a configuration example of a simulation model of the light-emitting element 100 according to an embodiment of the present technology. Fig. 6 is a graph showing a simulation result of the light-emitting element 100 according to an embodiment of the present technology.

[0044] As shown in FIG. 5, in this simulation model, a first wiring layer 131, a second wiring layer 132, and an insulating layer 15 are formed on a substrate 11.

[0045] A light emitting section 41 is disposed above the wiring layer 13. A light receiving section 42 is disposed on one surface of the substrate 11. Light emitted from the light emitting section 41 collides with the first wiring layer 131 and / or the second wiring layer 132 and is received by the light receiving section 42.

[0046] The first wiring layer 131 and the second wiring layer 132 are adjacent to each other in the thickness direction. When viewed from above in a plan view, the second wiring layer 132 is disposed so as to protrude from an end of the first wiring layer 131. The protruding length is defined as x [μm].

[0047] In this simulation, the transmittance was calculated based on the intensity of light emitted by the light-emitting section 41 and the intensity of light received by the light-receiving section 42. In Fig. 6, the vertical axis indicates the transmittance [%] of the light received by the light-receiving section 42. The higher the effect of the wiring layer 13 in attenuating light, the lower the light transmittance.

[0048] The horizontal axis indicates the length x [μm] of the second wiring layer 132 protruding from the end of the first wiring layer 131. The light transmittance is plotted against the protruding length x.

[0049] The first state S1 is a state in which light is not attenuated because the wiring layer 13 is not formed. That is, this is a state in which the intensity of the light emitted by the light-emitting portion 41 is the same as the intensity of the light received by the light-receiving portion 42. The light transmittance in this first state S1 is defined as 100%.

[0050] In the second state S2, the wiring layer 13 is formed, and the second wiring layer 132 does not protrude from the end of the first wiring layer 131. In other words, the first wiring layer 131 and the second wiring layer 132 are completely overlapped. In the second state S2, the light is attenuated by colliding with the wiring layer 13. Therefore, the light transmittance in the second state S2 is lower than the light transmittance in the first state S1.

[0051] As the protruding length x is gradually increased, the light receiving portion 42 is covered by the protruding area, and the transmittance decreases rapidly. This shows that even if the protruding length x is small, a sufficient effect is produced.

[0052] In the third state S3, the wiring layer 13 is formed, and the second wiring layer 132 protrudes from the end of the first wiring layer 131. Furthermore, the left end 131a of the first wiring layer 131 and the right end 132a of the second wiring layer 132 are arranged side by side in the thickness direction. In the third state S3, the transmittance is 0.1% or less.

[0053] From the second state S2 to the third state S3, a part of the light receiving section 42 is covered by the wiring layer 13 and a part of the light receiving section 42 is exposed. On the other hand, in the third state S3, the light receiving section 42 is completely covered by the wiring layer 13 and is not exposed. From this, it can be seen that it is preferable that the drive circuit 12 is completely covered by the wiring layer 13 and is not exposed.

[0054] In the fourth state S4, the wiring layer 13 is formed, and the second wiring layer 132 protrudes from the end of the first wiring layer 131. Furthermore, the left region 131b of the first wiring layer 131 and the right region 132b of the second wiring layer 132 are arranged to overlap in the thickness direction. In the fourth state S4, the transmittance is 0.1% or less, similar to the third state S3.

[0055] From the above simulation results, it has been confirmed that when the wiring layer 13 is arranged in a staggered pattern (the second wiring layer 132 protrudes from the end of the first wiring layer 131), and the exposed area of ​​the substrate 11 is reduced, it is possible to sufficiently attenuate light.

[0056] [(5) Vertical-cavity surface-emitting laser] The light emitting unit 21 according to an embodiment of the present technology may have, for example, a vertical cavity surface emitting laser (VCSEL). The VCSEL may be electrically connected to the driving circuit 12 via a bump electrode 22 (see FIG. 4, etc.).

[0057] VCSELs have the characteristic of multi-channel emission, which allows multiple emitters to emit light at the same time. In addition, VCSELs can be realized in an array structure or a stacked structure. On the other hand, since VCSELs have a higher light intensity than, for example, LEDs (Light Emitting Diodes), the intensity of the return light, which is the diffuse reflection of the emitted laser light, tends to be higher. For this reason, it is preferable that the light-emitting element 100 has some kind of light-shielding function. According to the present technology, the return light can be attenuated by devising the arrangement of the wiring layer 13.

[0058] When the light emitting element 100 has a VCSEL, the light emitted by the light emitting section 21 is infrared light, and the return light may also be infrared light. Therefore, it is preferable that the wiring layer 13 contains a material that has a light blocking property against infrared light. Furthermore, since the wiring layer 13 is electrically connected to a power supply circuit, a drive circuit, etc., it is preferable that the wiring layer 13 contains a conductive material.

[0059] Specifically, it is preferable that the wiring layer 13 contains at least one material selected from aluminum (Al), copper (Cu), tungsten (W), and gold (Au), so that the wiring layer 13 can attenuate the return light while having electrical conductivity.

[0060] The above description of the light-emitting device 100 according to the first embodiment of the present technology can be applied to other embodiments of the present technology unless there is any particular technical contradiction.

[0061] [2. Second embodiment of the present technology (example 2 of light-emitting device)] A configuration example of a light-emitting device 100 according to an embodiment of the present technology will be described with reference to Fig. 7. Fig. 7 is a schematic cross-sectional view showing a configuration example of a light-emitting device 100 according to an embodiment of the present technology.

[0062] 7, the wiring layers 13 arranged in a staggered pattern are preferably arranged on the upper layer 13a. The wiring layers 13 arranged on the upper layer 13a are easier to change in arrangement than the wiring layers 13 arranged on the lower layer 13b. Furthermore, when the wiring layers 13 arranged in a staggered pattern are arranged on the upper layer 13a, the effect of attenuating the return light is enhanced.

[0063] The wiring layer 13 disposed in the lower layer 13b is preferably arranged in a staggered pattern, but it does not have to be arranged in a staggered pattern as in this figure.

[0064] The staggered arrangement pattern will be further described with reference to Figures 8 to 11. Figures 8 to 11 are schematic cross-sectional views showing configuration examples of the light-emitting device 100 according to an embodiment of the present technology.

[0065] 8, a left end 131a of the first wiring layer 131 and a right end 132a of the second wiring layer 132 disposed on the upper layer 13a may be disposed side by side in the thickness direction (the up-down direction in the figure) of the light emitting element 100. Also, a right region 131b of the first wiring layer 131 and a left region 132b of the second wiring layer 132 may be disposed to overlap each other in the thickness direction of the light emitting element 100.

[0066] 9, a left region 131a of the first wiring layer 131 and a right region 132a of the second wiring layer 132 disposed on the upper layer 13a may be disposed so as to overlap in the thickness direction (the vertical direction in the figure) of the light emitting element 100. Also, a right region 131b of the first wiring layer 131 and a left region 132b of the second wiring layer 132 may be disposed so as to overlap in the thickness direction of the light emitting element 100.

[0067] 10, the length of the second wiring layer 132 in the radial direction (left-right direction in the figure) of the light emitting element 100 may be at least twice the length of the first wiring layer 131. Although not limited thereto, a length of at least three times, and more preferably at least four times, can be exemplified.

[0068] In this configuration example, the left end of the first wiring layer 131 and the right end of the second wiring layer 132 are arranged side by side in the thickness direction (the vertical direction in the figure) of the light emitting element 100. A part of the first wiring layer 131 and a part of the second wiring layer 132 may be arranged to overlap each other in the thickness direction of the light emitting element 100.

[0069] 11, a part of the wiring layer 13 may be arranged in a staggered manner and a part of the wiring layer 13 may be arranged to overlap each other. In this configuration example, the first wiring layer 131 and the second wiring layer 132 are arranged in a staggered manner, and the second wiring layer 132 and the third wiring layer 135 are arranged to overlap each other.

[0070] The above description of the light-emitting device 100 according to the second embodiment of the present technology can be applied to other embodiments of the present technology unless there is any particular technical contradiction.

[0071] [3. Third embodiment of the present technology (example 3 of light-emitting device)] A configuration example of a light-emitting device 100 according to an embodiment of the present technology will be described with reference to Fig. 12. Fig. 12 is a schematic cross-sectional view showing a configuration example of a light-emitting device 100 according to an embodiment of the present technology.

[0072] As shown in FIG. 12, the wiring layers 13 arranged in a staggered pattern may be arranged on the lower layer 13b.

[0073] The wiring layers 13 disposed on the upper layer 13a are preferably arranged in a staggered pattern, but they do not have to be arranged in a staggered pattern as in this figure.

[0074] The staggered arrangement pattern will be further described with reference to Fig. 13 to Fig. 15. Fig. 13 to Fig. 15 are schematic cross-sectional views showing configuration examples of a light-emitting device 100 according to an embodiment of the present technology.

[0075] 13, a left end 133a of the first wiring layer 133 and a right end 134a of the second wiring layer 134 disposed in the lower layer 13b may be disposed side by side in the thickness direction (the up-down direction in the figure) of the light emitting element 100. Also, a right region 133b of the first wiring layer 133 and a left region 134b of the second wiring layer 134 may be disposed to overlap each other in the thickness direction of the light emitting element 100.

[0076] 14, the length of the second wiring layer 134 in the radial direction (left-right direction in the figure) of the light emitting element 100 may be at least twice the length of the first wiring layer 133. Although not limited thereto, a length of at least three times, and more preferably at least four times, can be exemplified.

[0077] In this configuration example, the left end of the first wiring layer 133 and the right end of the second wiring layer 134 are arranged side by side in the thickness direction (the vertical direction in the figure) of the light emitting element 100. A part of the first wiring layer 133 and a part of the second wiring layer 134 may be arranged to overlap each other in the thickness direction of the light emitting element 100.

[0078] 15, some of the wiring layers 13 may be arranged in a staggered manner and some may be arranged to overlap each other. In this configuration example, the first wiring layer 133 and the second wiring layer 134 arranged in the lower layer 13b are arranged in a staggered manner, and the first wiring layer 133 and the third wiring layer 136 are arranged to overlap each other.

[0079] The above description of the light-emitting device 100 according to the third embodiment of the present technology can be applied to other embodiments of the present technology unless there is any particular technical contradiction.

[0080] [4. Fourth embodiment of the present technology (example 4 of light-emitting device)] As described above, the wiring layer 13 is arranged in a staggered pattern to attenuate the return light, but a light shielding portion may be further provided to further enhance the attenuation effect. This will be described with reference to Fig. 16. Fig. 16 is a schematic cross-sectional view showing a configuration example of a light-emitting element 100 according to an embodiment of the present technology.

[0081] 16, the light-emitting element 100 according to an embodiment of the present technology further includes a light-shielding portion 30 that shields at least a part of the driving circuit 12 from light emitted by the light-emitting portion 21. The light-shielding portion 30 is preferably disposed on the second substrate 20 side, which has a large amount of return light, of the first substrate 10 having the driving circuit 12. In this configuration example, the light-shielding portion 30 is formed on the surface of the first substrate 10, but the position of the light-shielding portion 30 is not particularly limited. The light-shielding portion 30 may be disposed, for example, inside the first substrate 10 or on the second substrate 20.

[0082] The light shielding portion 30 preferably includes a metal material that has a light shielding property against infrared rays when in a thin film state. The light shielding portion 30 preferably includes a material that has a light shielding property against infrared rays, such as aluminum (Al), copper (Cu), tungsten (W), and gold (Au). Alternatively, the light shielding portion 30 may include a resin material that has a light shielding property against infrared rays. The light shielding portion 30 may include, for example, a black resin material in order to have a light shielding property against infrared rays.

[0083] The above description of the light-emitting device 100 according to the fourth embodiment of the present technology can be applied to other embodiments of the present technology unless there is any particular technical contradiction.

[0084] [5. Fifth embodiment of the present technology (example 5 of light-emitting device)] Other arrangement patterns of the light blocking portion will be described with reference to Fig. 17 and Fig. 18. Fig. 17 and Fig. 18 are schematic cross-sectional views showing configuration examples of the light emitting device 100 according to an embodiment of the present technology.

[0085] 17, the light-shielding portion 31 is arranged in a ring shape along the outer periphery of the first substrate 10. This allows the light-shielding portion 31 to attenuate return light entering the light-emitting element 100 from its side surface.

[0086] In this configuration example, the light shielding portion 31 is disposed inside the first substrate 10, but the position of the light shielding portion 31 is not particularly limited. The light shielding portion 31 may be disposed, for example, on the surface of the first substrate 10 or on the second substrate 20.

[0087] 18, a dummy wiring layer 32 may be arranged as an example of the light shielding portion 31. The dummy wiring layer is preferably arranged in a staggered pattern. The dummy wiring layer 32 is not electrically connected, so it is unlikely to affect characteristics such as impedance. Therefore, it can be easily arranged.

[0088] Although not shown in the drawings, an electrically connected wiring layer 13 may be arranged as an example of the light shielding portion 31. The electrically connected wiring layers are preferably arranged in a staggered pattern.

[0089] Alternatively, although not shown, an example of the light shielding portion 31 may be configured by combining the dummy wiring layer 32 and the wiring layer 13 electrically connected thereto.

[0090] The above description of the light-emitting device 100 according to the fifth embodiment of the present technology can be applied to other embodiments of the present technology unless there is any particular technical contradiction.

[0091] [6. Sixth embodiment of the present technology (example of distance measuring device)] [(1) Configuration of distance measuring device 1] The present technology provides a distance measuring device including a light emitting element 100 according to any one of the first to fifth embodiments of the present technology. That is, the distance measuring device includes a light emitting element and a light receiving element, and the light emitting element includes a first substrate having a drive circuit, and a second substrate having a light emitting section driven by the drive circuit and mounted on one surface side of the first substrate. The first substrate has two or more wiring layers electrically connected to each other, and some of the wiring layers adjacent to each other in the thickness direction are arranged in a staggered manner so as to cover at least a part of the drive circuit when viewed in plan from the second substrate side. The light receiving element has a light receiving section that receives light emitted by the light emitting section.

[0092] An example of the configuration of a distance measuring device according to an embodiment of the present technology will be described with reference to Fig. 19. Fig. 19 is a schematic diagram showing an example of the configuration of a distance measuring device 1 according to an embodiment of the present technology.

[0093] As shown in Figure 19, the distance measuring device 1 includes a light emitting unit 2, a driving unit 3, a power supply circuit 4, a light emitting side optical system 5, a light receiving side optical system 6, a light receiving unit 7, a signal processing unit 8, a control unit 9, and a temperature detection unit 10.

[0094] The light emitting unit 2 emits light from a plurality of light sources. As described later, the light emitting unit 2 in this example has light emitting elements 100, such as vertical cavity surface emitting lasers (VCSELs), as the light sources, and the light emitting elements 100 are arranged in a predetermined manner, such as a matrix.

[0095] The driving unit 3 is configured to have a power supply circuit for driving the light emitting unit 2. The power supply circuit 4 generates a power supply voltage (a driving voltage Vd, described later) for the driving unit 3 based on an input voltage (an input voltage Vin, described later) from, for example, a battery (not shown) or the like provided in the distance measuring device 1. The driving unit 3 drives the light emitting unit 2 based on the power supply voltage.

[0096] Light emitted from the light-emitting unit 2 is irradiated onto a subject S as a distance measurement target via a light-emitting side optical system 5. Then, the light thus irradiated is reflected from the subject S and enters a light-receiving surface of a light-receiving unit 7 via a light-receiving side optical system 6.

[0097] The light receiving unit 7 is a light receiving element such as a CCD (Charge Coupled Device) sensor or a CMOS (Complementary Metal Oxide Semiconductor) sensor, and receives reflected light from the subject S that is incident via the light receiving optical system 6 as described above, converts it into an electrical signal, and outputs it.

[0098] The light receiving unit 7 performs, for example, CDS (Correlated Double Sampling) processing, AGC (Automatic Gain Control) processing, etc., on the electrical signal obtained by photoelectrically converting the received light, and further performs A / D (Analog / Digital) conversion processing.Then, the signal is output as digital data to the signal processing unit 8 at the downstream side.

[0099] Moreover, the light receiving unit 7 in this example outputs a frame synchronization signal Fs to the driving unit 3. This enables the driving unit 3 to cause the light emitting element 100 in the light emitting unit 2 to emit light at a timing according to the frame period of the light receiving unit 7.

[0100] The signal processing unit 8 is configured as a signal processor, for example, a DSP (Digital Signal Processor), etc. The signal processing unit 8 performs various signal processes on the digital signal input from the light receiving unit .

[0101] The control unit 9 is configured with, for example, a microcomputer having a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), etc., or an information processing device such as a DSP, and controls the drive unit 3 for controlling the light emission operation by the light emitting unit 2, and controls the light receiving operation by the light receiving unit 7.

[0102] The control unit 9 has a function as a distance measuring unit 9a. The distance measuring unit 9a measures the distance to the subject S based on a signal input via the signal processing unit 8 (i.e., a signal obtained by receiving reflected light from the subject S). The distance measuring unit 9a in this example measures the distance to each part of the subject S in order to enable identification of the three-dimensional shape of the subject S. Note that a specific distance measuring method in the distance measuring device 1 will be described later.

[0103] The temperature detection unit 10 detects the temperature of the light-emitting unit 2. The temperature detection unit 10 may be configured to detect temperature using, for example, a diode. In this example, information on the temperature detected by the temperature detection unit 10 is supplied to the drive unit 3, which enables the drive unit 3 to drive the light-emitting unit 2 based on the temperature information.

[0104] [(2) Distance measurement method] As a distance measuring method in the distance measuring device 1, for example, a distance measuring method based on an STL (Structured Light) method or a ToF (Time of Flight) method can be adopted.

[0105] The STL method is a method for measuring distance based on an image of a subject S illuminated with light having a predetermined light / dark pattern, such as a dot pattern or a grid pattern. The STL method will be described with reference to Fig. 20. Fig. 20 is an explanatory diagram of the STL method.

[0106] In the STL method, a subject S is irradiated with pattern light Lp having a dot pattern as shown in Fig. 20A. The pattern light Lp is divided into multiple blocks BL, and a different dot pattern is assigned to each block BL (dot patterns are arranged not to overlap between blocks B).

[0107] 20B is an explanatory diagram of the distance measurement principle of the STL method. In this example, a wall W and a box BX placed in front of it are taken as subject S, and pattern light Lp is irradiated onto the subject S. "G" in the figure shows a schematic representation of the angle of view of the light receiving unit 7.

[0108] In addition, in the drawing, “BLn” means light of a certain block BL in the pattern light Lp, and “dn” means a dot pattern of the block BLn projected on the light-receiving image by the light-receiving unit 7.

[0109] Here, if there is no box BX in front of the wall W, the dot pattern of block BLn in the received light image is projected at the position of "dn'" in the figure. In other words, the position where the pattern of block BLn is projected in the received light image differs depending on whether or not there is a box BX; specifically, the pattern is distorted.

[0110] The STL method uses the fact that the irradiated pattern is distorted by the object shape of the subject S to determine the shape and depth of the subject S. Specifically, this method determines the shape and depth of the subject S from the way the pattern is distorted.

[0111] When the STL method is adopted, for example, an infrared (IR) light receiving unit using a global shutter method is used as the light receiving unit 7. In the case of the STL method, the distance measuring unit 9a controls the driving unit 3 so that the light emitting unit 2 emits pattern light, detects distortion of the pattern in the image signal obtained via the signal processing unit 8, and calculates the distance based on the way the pattern is distorted.

[0112] Next, the ToF method is a method for measuring the distance to an object by detecting the flight time (time difference) of light emitted from the light-emitting unit 2, reflected by the object, and reaching the light-receiving unit 7.

[0113] When a so-called direct ToF (dToF) method is adopted as the ToF method, a SPAD (Single Photon Avalanche Diode) is used as the light receiving unit 7, and the light emitting unit 2 is pulse-driven. In this case, the distance measuring unit 9a calculates the time difference between when the light emitted by the light emitting unit 2 is emitted and when the light is received by the light receiving unit 7, based on a signal input via the signal processing unit 8, and calculates the distance to each part of the subject S based on the time difference and the speed of light.

[0114] When a so-called indirect ToF (iToF) method (phase difference method) is adopted as the ToF method, a light receiving unit capable of receiving, for example, IR light is used as the light receiving unit 7.

[0115] The above description of the distance measuring device according to the sixth embodiment of the present technology can be applied to other embodiments of the present technology unless there is any particular technical contradiction.

[0116] [7. Seventh embodiment of the present technology (example 1 of electronic device)] The present technology provides an electronic device including a light-emitting element 100 according to any one of the first to fifth embodiments of the present technology.

[0117] An example of the electronic device is a distance measuring device. FIG. 21 is a block diagram showing a schematic configuration example of an electronic device including a light emitting element 100 according to an embodiment of the present technology. A distance measuring device 1000, which is an example of the electronic device, measures the distance to a subject S by a ToF (Time of Flight) method. The distance measuring device 1000 includes the light emitting element 100 as a light source. The distance measuring device 1000 includes, for example, the light emitting element 100, a light receiving device 125, lenses 117 and 130, a signal processing unit 140, a control unit 150, a display unit 160, and a storage unit 170.

[0118] The light emitting element 100 is driven by a laser driver (driver). The laser driver has an anode terminal and a cathode terminal connected to the anode electrode and the cathode electrode of the light emitting element 100 via wiring or conductive bumps, respectively. The laser driver is configured to include circuit elements such as a capacitor and a transistor.

[0119] The light receiving device 125 detects the light reflected by the subject S. The lens 117 is a collimating lens that converts the light emitted from the light emitting element 100 into parallel light. The lens 130 is a condensing lens that collects the light reflected by the subject S and guides it to the light receiving device 125.

[0120] The signal processing unit 140 is a circuit for generating a signal corresponding to the difference between the signal input from the light receiving device 125 and the reference signal input from the control unit 150. The control unit 150 is configured to include, for example, a Time to Digital Converter (TDC). The reference signal may be a signal input from the control unit 150, or may be an output signal of a detection unit that directly detects the output of the light emitting element 100. The control unit 150 is, for example, a processor that controls the light emitting element 100, the light receiving device 125, the signal processing unit 140, the display unit 160, and the storage unit 170. The control unit 150 is a circuit that measures the distance to the subject S based on the signal generated by the signal processing unit 140. The control unit 150 generates a video signal for displaying information about the distance to the subject S and outputs it to the display unit 160. The display unit 160 displays information about the distance to the subject S based on the video signal input from the control unit 150. The control unit 150 stores information about the distance to the subject S in the storage unit 170.

[0121] The above description of the electronic device according to the seventh embodiment of the present technology can be applied to other embodiments of the present technology unless there is any particular technical contradiction.

[0122] [8. Eighth embodiment of the present technology (example 8 of electronic device)] FIG. 22 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a moving object control system to which the present technology can be applied.

[0123] The vehicle control system 12000 includes a plurality of electronic control units connected via a communication network 12001. In the example shown in Fig. 22, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside-vehicle information detection unit 12030, an inside-vehicle information detection unit 12040, and an integrated control unit 12050. Also, as functional configurations of the integrated control unit 12050, a microcomputer 12051, an audio / video output unit 12052, and an in-vehicle network I / F (interface) 12053 are illustrated.

[0124] The drivetrain control unit 12010 controls the operation of devices related to the drivetrain of the vehicle in accordance with various programs. For example, the drivetrain control unit 12010 functions as a control device for a drive force generating device for generating a drive force of the vehicle, such as an internal combustion engine or a drive motor, a drive force transmission mechanism for transmitting the drive force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, and a braking device for generating a braking force of the vehicle.

[0125] The body system control unit 12020 controls the operation of various devices mounted on the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window device, or various lamps such as head lamps, back lamps, brake lamps, turn signals, and fog lamps. In this case, radio waves or signals of various switches transmitted from a portable device that replaces a key may be input to the body system control unit 12020. The body system control unit 12020 receives the input of these radio waves or signals and controls the door lock device, power window device, lamps, and the like of the vehicle.

[0126] The outside-vehicle information detection unit 12030 detects information outside the vehicle equipped with the vehicle control system 12000. For example, a distance measurement device 12031 is connected to the outside-vehicle information detection unit 12030. The distance measurement device 12031 includes the distance measuring device 1 described above. The outside-vehicle information detection unit 12030 causes the distance measurement device 12031 to measure the distance to an object (subject S) outside the vehicle, and acquires distance data obtained thereby. The outside-vehicle information detection unit 12030 may perform object detection processing of people, cars, obstacles, signs, etc. based on the acquired distance data.

[0127] The in-vehicle information detection unit 12040 detects information inside the vehicle. For example, a driver state detection unit 12041 that detects the state of the driver is connected to the in-vehicle information detection unit 12040. The driver state detection unit 12041 includes, for example, a camera that captures an image of the driver, and the in-vehicle information detection unit 12040 may calculate the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041, or may determine whether the driver is dozing.

[0128] The microcomputer 12051 can calculate control target values ​​for the driving force generating device, the steering mechanism, or the braking device based on the information inside and outside the vehicle acquired by the outside-of-vehicle information detection unit 12030 or the inside-vehicle information detection unit 12040, and output a control command to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing the functions of an ADAS (Advanced Driver Assistance System), including vehicle collision avoidance or impact mitigation, following driving based on the inter-vehicle distance, vehicle speed maintenance driving, vehicle collision warning, vehicle lane departure warning, etc.

[0129] In addition, the microcomputer 12051 can perform cooperative control for the purpose of autonomous driving, which allows the vehicle to travel autonomously without relying on the driver's operation, by controlling the driving force generating device, steering mechanism, braking device, etc. based on information about the surroundings of the vehicle acquired by the outside vehicle information detection unit 12030 or the inside vehicle information detection unit 12040.

[0130] Furthermore, the microcomputer 12051 can output a control command to the body system control unit 12020 based on the information outside the vehicle acquired by the outside-vehicle information detection unit 12030. For example, the microcomputer 12051 can control the headlamps according to the position of a preceding vehicle or an oncoming vehicle detected by the outside-vehicle information detection unit 12030, and perform cooperative control for the purpose of preventing glare, such as switching from high beams to low beams.

[0131] The audio / image output unit 12052 transmits at least one output signal of audio and image to an output device capable of visually or audibly notifying information to passengers in the vehicle or the outside of the vehicle. In this example, the output device is exemplified by an audio speaker 12061, a display unit 12062, and an instrument panel 12063. The display unit 12062 may include at least one of an on-board display and a head-up display, for example.

[0132] Fig. 23 is a diagram showing an example of an installation position of a distance measurement device 12031 according to an embodiment of the present technology. In Fig. 23, a vehicle 12100 has distance measurement devices 12101, 12102, 12103, 12104, and 12105 as the distance measurement device 12031.

[0133] The distance measuring devices 12101, 12102, 12103, 12104, and 12105 are provided, for example, at the front nose, side mirrors, rear bumper, back door, and upper part of the windshield inside the vehicle cabin of the vehicle 12100. The distance measuring device 12101 provided at the front nose and the distance measuring device 12105 provided at the upper part of the windshield inside the vehicle cabin mainly obtain data of the front of the vehicle 12100. The distance measuring devices 12102 and 12103 provided at the side mirrors mainly obtain data of the sides of the vehicle 12100. The distance measuring device 12104 provided at the rear bumper or back door mainly obtains data of the rear of the vehicle 12100. The front data obtained by the distance measuring devices 12101 and 12105 is mainly used to detect a preceding vehicle, a pedestrian, an obstacle, a traffic light, a traffic sign, and the like.

[0134] 23 shows an example of the detection ranges of the distance measurement devices 12101 to 12104. Detection range 12111 indicates the detection range of the distance measurement device 12101 provided on the front nose, detection ranges 12112 and 12113 indicate the detection ranges of the distance measurement devices 12102 and 12103 provided on the side mirrors, respectively, and detection range 12114 indicates the detection range of the distance measurement device 12104 provided on the rear bumper or back door.

[0135] For example, the microcomputer 12051 can extract, as a preceding vehicle, a three-dimensional object that is the closest three-dimensional object on the travel path of the vehicle 12100 and travels at a predetermined speed (for example, 0 km / h or more) in approximately the same direction as the vehicle 12100, by calculating the distance to each three-dimensional object within the detection ranges 12111 to 12114 and the change over time of this distance (relative speed with respect to the vehicle 12100) based on the distance data obtained from the distance measuring devices 12101 to 12104. Furthermore, the microcomputer 12051 can set a vehicle distance to be secured in advance in front of the preceding vehicle, and perform automatic brake control (including follow-up stop control) and automatic acceleration control (including follow-up start control). In this way, cooperative control can be performed for the purpose of automatic driving that runs autonomously without relying on the driver's operation.

[0136] For example, the microcomputer 12051 classifies and extracts three-dimensional object data on three-dimensional objects, such as two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects, based on the distance data obtained from the distance measuring devices 12101 to 12104, and can use the data for automatic obstacle avoidance. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. Then, the microcomputer 12051 determines a collision risk indicating the risk of collision with each obstacle, and when the collision risk is equal to or exceeds a set value and there is a possibility of a collision, the microcomputer 12051 can provide driving assistance for collision avoidance by outputting an alarm to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or avoidance steering via the drive system control unit 12010.

[0137] The above description of the electronic device according to the eighth embodiment of the present technology can be applied to other embodiments of the present technology unless there is any particular technical contradiction.

[0138] In addition, the embodiments of the present technology are not limited to the above-mentioned embodiments, and various modifications are possible within the scope of the present technology. The specific values, shapes, materials (including compositions) and the like described in each embodiment are merely examples, and the present technology is not limited to these.

[0139] The present technology can also be configured as follows. [1] A first substrate having a driving circuit; a second substrate having a light-emitting unit driven by the drive circuit and mounted on one surface side of the first substrate; the first substrate has two or more wiring layers that are electrically connected to each other; The light-emitting element is configured such that some of the wiring layers adjacent to each other in a thickness direction are arranged in a staggered manner so as to cover at least a portion of the drive circuit when viewed in a plan view from the second substrate side. [2] The wiring layers arranged in a staggered pattern are arranged in the vicinity of the second substrate. The light-emitting element according to [1]. [3] The second substrate, the wiring layer arranged in a staggered pattern, and the drive circuit are laminated. The light-emitting element according to [1] or [2]. [4] The wiring layer arranged in a staggered pattern is arranged on an upper layer. The light-emitting element according to any one of [1] to [3]. [5] The wiring layer arranged in a staggered pattern is arranged in a lower layer. The light-emitting element according to any one of [1] to [4]. [6] The first substrate has three or more wiring layers arranged in a staggered pattern. The light-emitting element according to any one of [1] to [5]. [7] When viewed from the second substrate side, the wiring layers arranged in a staggered pattern are arranged to cover the entire driving circuit. The light-emitting element according to any one of [1] to [6]. [8] The wiring layer contains a material having an infrared ray shielding property. The light-emitting element according to any one of [1] to [7]. [9] The wiring layer contains at least one material selected from aluminum (Al), copper (Cu), tungsten (W), and gold (Au); The light-emitting element according to any one of [1] to [8].

[10] The light-emitting element further includes a light-shielding portion that shields at least a portion of the driving circuit from light emitted by the light-emitting portion. The light-emitting element according to any one of [1] to [9].

[11] The light-shielding portion is disposed on the first substrate on the second substrate side. The light-emitting element according to

[10] .

[12] The light-shielding portion is arranged in a ring shape along the outer periphery of the first substrate. The light-emitting element according to

[10] or

[11] .

[13] The light emitting unit has a vertical cavity surface emitting laser. The light-emitting element according to any one of [1] to

[12] .

[14] The light emitted by the light emitting unit is infrared light. The light-emitting element according to any one of [1] to

[13] .

[15] A first substrate having a driving circuit; a second substrate having a light-emitting unit driven by the drive circuit and mounted on one surface side of the first substrate; the first substrate has two or more wiring layers that are electrically connected to each other; When the wiring layers adjacent to each other in the thickness direction are a first wiring layer and a second wiring layer, A light-emitting element, wherein the second wiring layer is arranged to protrude from an end of the first wiring layer so as to cover at least a portion of the drive circuit when viewed in a plan view from the second substrate side.

[16] A light-emitting element; A light receiving element, The light-emitting element is A first substrate having a driving circuit; a second substrate having a light-emitting unit driven by the drive circuit and mounted on one surface side of the first substrate; the first substrate has two or more wiring layers that are electrically connected to each other; some of the wiring layers adjacent to each other in a thickness direction are arranged in a staggered manner so as to cover at least a part of the drive circuit when viewed in a plan view from the second substrate side; The light receiving element is A distance measuring device having a light receiving unit that receives the light emitted by the light emitting unit.

[17] A first substrate having a driving circuit; a second substrate having a light-emitting unit driven by the drive circuit and mounted on one surface side of the first substrate; the first substrate has two or more wiring layers that are electrically connected to each other; a light-emitting element, wherein some of the wiring layers adjacent to each other in a thickness direction are arranged in a staggered manner so as to cover at least a part of the driving circuit when viewed in a plan view from the second substrate side; An electronic device comprising: [Explanation of symbols]

[0140] 100 Light emitting element 10 First board 11 Substrate 12 Drive circuit 13 Wiring layer 131 1st wiring layer 132 2nd wiring layer 13a upper layer 13b Lower layer 14 Pad Electrode 15 Insulating layer 20 Second board 21 Light emitting part 22 Bump electrode 30, 31 Light shielding section 32 Dummy wiring layer 1 Ranging device L Return light

Claims

1. a first substrate having a driving circuit; a second substrate having a light-emitting unit driven by the drive circuit and mounted on one surface side of the first substrate, the first substrate has two or more wiring layers that are electrically connected to each other; A light-emitting element, wherein some of the wiring layers adjacent to each other in a thickness direction are arranged in a staggered manner so as to cover at least a portion of the drive circuit when viewed in a plan view from the second substrate side.

2. The wiring layers arranged in a staggered pattern are arranged in the vicinity of the second substrate. The light-emitting device according to claim 1 .

3. the second substrate, the wiring layer arranged in a staggered pattern, and the drive circuit are laminated; The light-emitting device according to claim 1 .

4. The wiring layer arranged in a staggered pattern is arranged on an upper layer. The light-emitting device according to claim 1 .

5. The wiring layer arranged in a staggered pattern is arranged in a lower layer. The light-emitting device according to claim 1 .

6. The first substrate has three or more wiring layers arranged in a staggered pattern. The light-emitting device according to claim 1 .

7. When viewed from the second substrate side, the wiring layers arranged in a staggered pattern are arranged to cover the entire driving circuit. The light-emitting device according to claim 1 .

8. The wiring layer contains a material having an infrared ray shielding property. The light-emitting device according to claim 1 .

9. the wiring layer contains at least one material selected from aluminum (Al), copper (Cu), tungsten (W), and gold (Au); The light-emitting device according to claim 1 .

10. The light-emitting element further includes a light-shielding portion that shields at least a portion of the driving circuit from light emitted by the light-emitting portion. The light-emitting device according to claim 1 .

11. The light-shielding portion is disposed on the first substrate on the second substrate side. The light-emitting device according to claim 10.

12. The light-shielding portion is arranged in a ring shape along the outer periphery of the first substrate. The light-emitting device according to claim 10.

13. The light emitting unit has a vertical cavity surface emitting laser. The light-emitting device according to claim 1 .

14. The light emitted by the light emitting unit is infrared light. The light-emitting device according to claim 1 .

15. a first substrate having a driving circuit; a second substrate having a light-emitting unit driven by the drive circuit and mounted on one surface side of the first substrate, the first substrate has two or more wiring layers that are electrically connected to each other; When the wiring layers adjacent to each other in the thickness direction are a first wiring layer and a second wiring layer, A light-emitting element, wherein the second wiring layer is arranged to protrude from an end of the first wiring layer so as to cover at least a portion of the drive circuit when viewed in a plan view from the second substrate side.

16. A light-emitting element; A light receiving element, The light-emitting element is a first substrate having a driving circuit; a second substrate having a light-emitting unit driven by the drive circuit and mounted on one surface side of the first substrate, the first substrate has two or more wiring layers that are electrically connected to each other; some of the wiring layers adjacent to each other in a thickness direction are arranged in a staggered manner so as to cover at least a part of the drive circuit when viewed in a plan view from the second substrate side; The light receiving element is A distance measuring device having a light receiving unit that receives the light emitted by the light emitting unit.

Images