Electronic apparatus

Abstract

To provide an electronic apparatus that can improve cooling efficiency.SOLUTION: An electronic apparatus according to an embodiment includes a fan, a duct, and a heat sink. The duct includes an upper wind direction plate, a lower wind direction plate, first and second side face plates, and a current plate. The duct has an opening that opens toward the fan. The upper wind direction plate includes a first and second upper plate sections. The first upper plate section extends in a first direction from one end of the opening. The second upper plate section bends from the first upper plate section toward the heat sink. The current plate is provided between the heat sink and the upper wind direction plate. The current plate includes a first rectifying section extending in the first direction and a second rectifying section extending from the first rectification part to the heat sink. The lower wind direction plate extends from the other end of the opening and includes a ramp that slopes in the direction of approaching the first upper plate as it approaches the heat sink. The space between the ramp and the heat sink is open in the third direction.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] An embodiment of the present invention relates to an electronic device. [Background technology]

[0002] For example, electronic devices include heat-generating electronic components such as a CPU (Central Processing Unit). In electronic devices, a heat sink is provided close to the electronic components, and a fan blows air onto the heat sink, thereby cooling (dissipating heat) the electronic components. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2017-131103 A Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide an electronic device capable of improving cooling efficiency. [Means for solving the problem]

[0005] The electronic device according to the embodiment includes a fan, a duct, and a heat sink. The duct includes an upper airflow direction plate, a lower airflow direction plate, a first side plate and a second side plate connecting the upper airflow direction plate and the lower airflow direction plate, and a rectifying plate. The duct has an opening that opens toward the fan. The heat sink is disposed close to the first electronic component. The upper airflow direction plate includes a first upper plate portion and a second upper plate portion. The first upper plate portion extends in a first direction from one end of the opening. The second upper plate portion bends from the first upper plate portion toward the heat sink. The second upper plate portion includes a wall portion that is aligned with the heat sink in a second direction perpendicular to the first direction and extends along the second direction. The rectifying plate is provided between the heat sink and the upper airflow direction plate. The rectifying plate includes a first rectifying portion and a second rectifying portion. The first rectifying portion extends in the first direction. The second rectifying portion bends from the first rectifying portion toward the heat sink. The second rectifying portion includes a portion that is aligned with the heat sink in the second direction and extends along the second direction. The lower airflow direction plate extends from the one end of the opening to the other end that is distant in the second direction. The lower airflow direction plate is located between the heat sink and the opening in the first direction. The lower airflow direction plate includes an inclined portion that inclines in a direction toward the first upper plate portion as it approaches the heat sink. At least a part of the inclined portion is located between the heat sink and the opening. A space located between the inclined portion and the heat sink is open in a third direction perpendicular to the first direction and the second direction. The first side plate and the second side plate face each other in the third direction. A space between the upper airflow direction plate and the lower airflow direction plate, and a space between the heat sink and the upper airflow direction plate are located between the first side plate and the second side plate. [Brief description of the drawings]

[0006] [Figure 1] FIG. 1 is a schematic plan view illustrating an electronic device according to an embodiment. [Diagram 2] FIG. 2 is a schematic cross-sectional view illustrating the electronic device according to the embodiment. [Diagram 3]FIG. 3 is a schematic perspective view illustrating a fan and a duct of the electronic device according to the embodiment. [Figure 4] FIG. 4 is a schematic cross-sectional view illustrating a fan, a duct, and a heat sink of the electronic device according to the embodiment. [Diagram 5] FIG. 5 is a schematic perspective view illustrating a duct of the electronic device according to the embodiment. [Figure 6] FIG. 6 is a schematic perspective view illustrating a duct of the electronic device according to the embodiment. [Figure 7] FIG. 7 is a schematic perspective view illustrating a duct of the electronic device according to the embodiment. [Figure 8] FIG. 8 is a schematic cross-sectional view illustrating the flow of air in a duct of the electronic device according to the embodiment. [Figure 9] FIG. 9 is a schematic plan view illustrating a part of the electronic device according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In this specification and each drawing, elements similar to those already explained are given the same reference numerals and detailed explanations are omitted as appropriate.

[0008] FIG. 1 is a schematic plan view illustrating an electronic device according to an embodiment. FIG. 2 is a schematic cross-sectional view illustrating the electronic device according to the embodiment. FIG. 2 shows a cross section taken along line A1-A2 in FIG. The electronic device 100 according to the embodiment has a substantially rectangular parallelepiped housing 80. Fig. 1 shows the inside of the housing 80. The electronic device 100 is an electronic computing device such as an industrial computer.

[0009] 1, a fan 10, a duct 30 (air duct), a heat sink 40, a first electronic component 51, a second electronic component 52, a power supply unit 53, and an expansion card holder 54 are provided in a housing 80 of the electronic device 100. These are directly or indirectly fixed to the housing 80 by fixing means such as screws. Also provided in the housing 80 are a board 56 and a memory 57.

[0010] The housing 80 has a front surface 80f and a rear surface 80b opposite the front surface 80f. The housing 80 has a side surface 80s and a side surface 80t connecting the front surface 80f and the rear surface 80b.

[0011] The fan 10 is provided on the front surface 80f side of the housing 80. The fan 10 is, for example, an axial flow fan. The fan 10 draws air from the outside of the housing 80 through an air intake port on the front surface 80f, and sends the air to the inside of the housing 80, such as the duct 30.

[0012] The duct 30 is provided closer to the rear surface 80b than the fan 10. The duct 30 sends the air sent from the fan 10 to a heat sink 40, for example.

[0013] The heat sink 40 is disposed closer to the rear surface 80b than a portion of the duct 30. A front portion 40a of the heat sink 40 overlaps with the duct 30 in the vertical direction. A rear portion 40b of the heat sink 40 does not overlap with the duct 30 in the vertical direction.

[0014] The heat sink 40 is disposed adjacent to a first electronic component 51. The first electronic component 51 is, for example, a CPU, and serves as a heat source. The first electronic component 51 is disposed substantially below the center of the heat sink 40. The heat sink 40 dissipates heat from the first electronic component 51.

[0015] 1, in this example, the heat sink 40 has a rectangular planar shape. Also, as shown in Fig. 2, in this example, the heat sink 40 has a plate-shaped base portion 41 and a plurality of fins 42. The base portion 41 is provided on the first electronic component 51, and the plurality of fins 42 extend upward from the upper surface of the base portion 41. The fins 42 are, for example, plate-shaped extending in the front-rear direction.

[0016] 1, the second electronic component 52 is disposed closer to the side surface 80t than the duct 30 and the heat sink 40. The second electronic component 52 is, for example, a hard disk drive (HDD), and serves as a heat source.

[0017] The expansion card holder 54 is provided closer to the rear surface 80b than the heat sink 40. Between the expansion card holder 54 and the heat sink 40 is an expansion card mounting area 55.

[0018] The power supply unit 53 is provided closer to the side surface 80t than the expansion card mounting area 55 and closer to the rear surface 80b than the second electronic component 52. The board 56 (e.g., a RAID board) and the memory 57 are provided closer to the side surface 80s than the heat sink 40 and closer to the rear surface 80b than the duct 30, for example.

[0019] FIG. 3 is a schematic perspective view illustrating a fan and a duct of the electronic device according to the embodiment. 4 is a schematic cross-sectional view illustrating a fan, a duct, and a heat sink of the electronic device according to the embodiment, which corresponds to the cross section taken along line A3-A4 in FIG. 5 to 7 are schematic perspective views illustrating ducts of the electronic device according to the embodiment.

[0020] For example, as shown in Figs. 4 to 6, the duct 30 has an opening 31 that opens toward the fan 10. The fan 10 blows air into the duct 30 from the opening 31. As shown in Fig. 4, the duct 30 has an upper airflow direction plate 32, a lower airflow direction plate 33, and a straightening plate 34. As shown in Figs. 5 and 6, the duct 30 has a first side plate 35 and a second side plate 36. The opening 31 is formed by the front ends of the upper airflow direction plate 32, the lower airflow direction plate 33, the first side plate 35, and the second side plate 36, and has a substantially rectangular shape.

[0021] 4, the upper airflow direction plate 32 has a first upper plate portion 321 and a second upper plate portion 322. The first upper plate portion 321 extends from one end portion 31p of the opening portion 31 in the first direction D1.

[0022] In the description of the embodiment, the direction perpendicular to the first direction D1 is the second direction D2, and the direction perpendicular to the first direction D1 and the second direction D2 is the third direction D3. For convenience of description, the direction from the fan 10 to the duct 30 or the heat sink 40 is called "rear", and the opposite direction of rear is called "forward". The rear is, for example, the blowing direction of the fan 10. The forward is, for example, the opening direction of the opening 31 of the duct 30. The first direction D1 is a direction along the front-rear direction (for example, a direction parallel to the front-rear direction). The direction from the lower airflow direction vane 33 or the heat sink 40 to the upper airflow direction vane 32 is called "upward", and the opposite direction of upward is called "downward". The second direction D2 is a direction along the vertical direction (for example, a direction parallel to the vertical direction).

[0023] The second upper plate portion 322 curves and extends from an end 321e (the end opposite the opening 31) of the first upper plate portion 321 toward the heat sink 40. The second upper plate portion 322 has a wall portion 322w located at its lower end. The wall portion 322w is aligned with the heat sink 40 in the second direction D2 and extends in the second direction D2.

[0024] An opening 39 is provided on the rear surface of the duct 30 and is located below the wall portion 322w. The heat sink 40 is disposed in the opening 39. More specifically, a front portion of the heat sink 40 is disposed inside the duct 30 forward of the opening 39, and a rear portion of the heat sink 40 is disposed outside the duct 30 rearward of the opening 39. A portion of the air sent from the opening 31 into the duct 30 can flow to the outside through the opening 39.

[0025] The rectifying plate 34 is provided between the heat sink 40 and the upper airflow direction plate 32. The rectifying plate 34 includes a first rectifying portion 341 and a second rectifying portion 342. For example, the first rectifying portion 341 extends in the first direction D1 between the heat sink 40 and a portion of the first upper plate portion 321, and between the heat sink 40 and a portion of the second upper plate portion 322.

[0026] The second rectifying portion 342 curves and extends from an end 341e (the end opposite the opening 31) of the first rectifying portion 341 toward the heat sink 40. The second rectifying portion 342 has a wall portion 342w located at its lower end. The wall portion 342w is aligned with the heat sink 40 in the second direction D2 and extends in the second direction D2.

[0027] For example, the region between the wall portion 342w and the wall portion 322w overlaps with the center in the first direction D1 of the heat sink 40. For example, the region between the wall portion 342w and the wall portion 322w overlaps with the heat source (first electronic component) in the second direction D2.

[0028] The heat sink 40 is aligned with the opening 31 in the first direction D1. In this example, the heat sink 40 is located below one end 31p of the opening 31 and above the other end 31q of the opening 31. The other end 31q is an end away from the one end 31p in the second direction D2.

[0029] The lower airflow direction vane 33 extends from the other end 31q of the opening 31 of the duct 30. The lower airflow direction vane 33 is between the heat sink 40 and the opening 31 (or the fan 10) in the first direction D1. In other words, the position of the lower airflow direction vane 33 in the first direction D1 is between the position of the heat sink 40 in the first direction D1 and the position of the opening 31 (or the fan 10) in the first direction D1.

[0030] Furthermore, the rear side of the lower airflow direction plate 33 forms an inclined portion 331. The inclined portion 331 is inclined in a direction approaching the first upper plate portion 321 as it approaches the heat sink 40. In other words, the inclined portion 331 is in the shape of a plate having an upward inclination toward the rear.

[0031] At least a portion of the inclined portion 331 is located between the heat sink 40 and the opening 31 (or the fan 10). In this example, a front end 331f of the inclined portion 331 is located below the heat sink 40. A rear end 331e of the inclined portion 331 is aligned with the fins 42 in the first direction D1 and located below the upper ends of the fins 42. Also, as shown in FIG. 4, for example, the position of the first rectifying portion 341 in the second direction D2 is between the position of the rear end 331e (the end on the heat sink 40 side) of the inclined portion 331 in the second direction D2 and the position of the first upper plate portion 321 in the second direction D2.

[0032] A space SP3 is formed between the heat sink 40 and the inclined portion 331. The space SP3 is located behind the inclined portion 331 and in front of the heat sink 40.

[0033] 5 and 6, the upper airflow direction plate 32 and the lower airflow direction plate 33 each extend in the third direction D3. The first side panel 35 and the second side panel 36 each extend rearward from the opening 31 of the duct 30. The first side panel 35 and the second side panel 36 face each other in the third direction D3.

[0034] The first side panel 35 connects one end of the upper airflow direction plate 32 to one end of the lower airflow direction plate 33. The second side panel 36 connects the other end of the upper airflow direction plate 32 to the other end of the lower airflow direction plate 33. A space SP1 between the upper airflow direction flare 32 and the lower airflow direction flare 33, and a space SP2 between the heat sink 40 and the upper airflow direction flare 32 are located between the first side panel 35 and the second side panel .

[0035] 5 and 7, the first side panel 35 and the second side panel 36 do not cover the sides of the space SP3. The space SP3 is open in the third direction D3. In other words, the sides of the duct 30 are provided with openings 37 (see FIG. 7) and 38 (see FIG. 5) that are located on the sides of the space SP3 and communicate with the space SP3. A portion of the air sent from the opening 31 into the duct 30 can flow to the outside from the openings 37 and 38.

[0036] For example, as shown in FIG. 5 (or FIG. 3), the second side plate 36 has one or more side holes 361 (side hole 361a and side hole 361b). The side hole 361 penetrates the second side plate 36 in the third direction D3. The side hole 361a is located above the inclined portion 311. The side hole 361a is located to the side of the space SP1. The side hole 361b is located behind the inclined portion 331. The side hole 361b is located, for example, to the side of the heat sink 40 or the space SP2.

[0037] 4, a gap G1 is provided between the end (rear end 331e) of the inclined portion 331 on the heat sink 40 side and the front end of the first rectification portion 341. That is, the space SP2 is divided into a portion located above the first rectification portion 341 and continuing from the space SP1, and a portion located below the first rectification portion 341 and continuing from the space SP1.

[0038] FIG. 8 is a schematic cross-sectional view illustrating the flow of air in a duct of the electronic device according to the embodiment. 8 is based on a flow velocity analysis simulation, and the arrows in Fig. 8 indicate the direction of air flow. When fan 10 is operated, fan 10 blows air into duct 30 through opening 31.

[0039] The air taken in through the opening 31 flows from the space SP1 to the space SP2. For example, in the upper part of the space SP1, the air flows backward along the first upper plate portion 321 of the upper airflow direction plate 32. Also, for example, in the lower part of the space SP1, the air is lifted upward along the inclination of the inclined portion 331 of the lower airflow direction plate 33.

[0040] Of the air flowing from space SP1 to space SP2, the air that flows into the portion of space SP2 above the straightening plate 34 flows downward along the second upper plate portion 322 and the second straightening portion 342, and hits the central portion 40c of the heat sink 40 from above the heat sink 40. Of the air flowing from space SP1 to space SP2, the air that flows into the portion of space SP2 below the straightening plate 34 flows downward by the second straightening portion 342 and hits the portion of the heat sink 40 in front of the central portion 40c of the heat sink 40 from above.

[0041] A part of the air that strikes the heat sink 40 from above flows rearward over the heat sink 40 and then flows rearward of the duct 30 through an opening 39 provided at the rear of the duct 30 . Another part of the air that hits the heat sink 40 from above flows forward over the heat sink 40 and flows into the space SP3 behind and below the inclined portion 331. The air that has flowed into the space SP3 flows to the side of the duct from, for example, the opening 37 (see FIG. 7) or the opening 38 (see FIG. 5) on the side of the space SP3.

[0042] For example, a reference example configuration may be considered in which wind is blown onto the heat sink from the front of the heat sink. In this case, the wind flows from the front end to the rear end of the heat sink. Here, the flow resistance is high above the heat sink due to pressure loss caused by fins, for example, so the flow speed of the wind may decrease.

[0043] In addition, in a heat sink, the temperature is highest at the base, which receives heat from the heat source, and decreases from the base of the fins to the tips of the fins. In a reference example in which air is blown onto the heat sink from the front, the air mainly hits the tips and bases of the fins. In the base, which is the hottest, the air may only hit the end faces.

[0044] In contrast, in the embodiment, as described above, the upper airflow direction plate 32 has the first upper plate portion 321 and the second upper plate portion 322. The rectifying plate 34 has the first rectifying portion 341 and the second rectifying portion 342. As a result, as described with reference to FIG. 8, the air can be blown onto the heat sink 40 from above the heat sink 40. Here, the lower airflow direction plate 33 has the inclined portion 331, so that the air can be once sent upward. As a result, the air can be efficiently blown onto the heat sink 40 from above. In addition, the rectifying plate 34 is positioned between the heat sink 40 and the upper airflow direction plate 32, so that the generation of a vortex can be suppressed. When the air is blown onto the heat sink 40 from above, for example, the air is sent from the center of the upper surface of the heat sink 40 toward the base portion 41. As a result, for example, the cooling efficiency can be improved. Then, the air that hits the heat sink 40 from above the heat sink 40 flows, for example, forward or backward. For example, compared to the reference example in which the wind flows from the front end to the rear end of the heat sink 40, the wind above the heat sink is exhausted from both the front and rear of the heat sink 40, so that the area from which the wind is exhausted is increased. Furthermore, the distance over which the wind flows over the heat sink 40 is shortened, so that the flow path resistance can be reduced. This can, for example, suppress a decrease in flow rate and improve cooling efficiency. In addition, the space SP3 between the inclined portion 331 and the heat sink 40 is open in the third direction D3. Therefore, the air that flows forward over the heat sink 40 and enters the space SP3 can flow out of the duct from the side of the space SP3. This can reduce the flow path resistance for the air that flows forward over the heat sink 40 and is exhausted. This can suppress a decrease in flow rate and further improve cooling efficiency. In addition, when the gap G1 (FIG. 4) is provided, the wind can be blown from above through the gap G1 to a wider area of ​​the heat sink 40.

[0045] For example, industrial equipment such as industrial computers is designed to operate 24 hours a day, 365 days a year, and in order to reduce downtime of the systems in which it is installed, maintenance must be done in a short period of time. For this reason, CPU cooling fans, which are limited in life, are placed on the front of the unit to make them easier to replace, and use a method of blowing air onto the heat source and heat sink. As CPUs become more powerful, the amount of heat they generate also tends to increase. For example, when a CPU gets too hot, its safety circuit activates, causing its performance to decrease, so sufficient cooling is desirable. In addition, for example, it is desirable for other devices and ICs to be sufficiently cooled in order to extend their lifespan. When the fan is placed on the front of the main unit, the flow resistance between the fins of the heat sink makes it difficult for the cooling air to flow. In particular, when the fins are spaced closely together, cooling performance may decline. Conventionally, an air duct is used to create a flow path that sends air to the front of the heat sink (the surface perpendicular to the fins), and the flow path is narrowed midway through to increase the air speed and improve cooling performance. However, as already mentioned, with the method of sending cooling air from the front of the heat sink through an air duct, most of the air hits the tips and bases of the fins, and the base, which becomes the hottest, is only exposed to the edges.

[0046] In contrast, in the embodiment, high-speed cooling air is directed toward the heat generating element by blowing cooling air from above onto the heat sink 40 through the duct 30. Also, air is exhausted not only from the rear of the duct but also from the front side and the lower side, reducing flow resistance and improving cooling efficiency. For example, it is possible to achieve both the ability to mount a fan on the front and a structure that sufficiently cools the CPU.

[0047] FIG. 9 is a schematic plan view illustrating a part of the electronic device according to the embodiment. The arrows in FIG. 9 indicate the direction of air flow. 9, the second electronic component 52 is aligned with the duct 30 in the third direction D3 in a plan view. The second side panel 36 is between the second electronic component 52 and the first side panel 35 in the third direction D3.

[0048] The second side plate 36 extends in the first direction D1. The first side plate 35 has an inclined plate portion 351 and a plate portion 352. The inclined plate portion 351 is inclined in a direction approaching the second side plate 36 as it approaches the heat sink 40. The plate portion 352 extends from the rear end of the inclined plate portion 351 in the first direction D1.

[0049] The center of the fan 10 is offset with respect to the center of the heat sink 40 (or the first electronic component 51). That is, the center position P1 of the heat sink 40 (or the first electronic component 51) in the third direction D3 is between the center position P2 of the fan 10 in the third direction D3 and the position of the second side panel 36 in the third direction D3.

[0050] The flow direction of a portion of the air sent by the fan 10 from the opening 31 into the duct 30 is changed by the inclined plate portion 351 from the first direction D1 to a direction inclined toward the second side plate 36 from the first direction D1. The portion of the air that has flowed toward the second side plate 36 can flow toward the second electronic component 52 through a side hole 361 (see FIG. 5) provided in the second side plate 36. This allows the second electronic component 52 to be cooled.

[0051] For example, when the HDD (second electronic component 52) ​​heats up, the oil in the bearings evaporates, shortening its lifespan. In contrast, according to the embodiment, it is possible to efficiently cool the HDD arranged in parallel with the CPU. The inclined plate portion 351 narrows the flow path in the duct 30, for example, to increase the pressure inside the duct and increase the air speed from the side hole 361.

[0052] The embodiment may include the following features. (Configuration 1) With fans, A duct including an upper wind direction plate, a lower wind direction plate, a first side plate and a second side plate connecting the upper wind direction plate and the lower wind direction plate, and a straightening plate, and having an opening that opens toward the fan; a heat sink disposed adjacent to the first electronic component; Equipped with The upper wind deflector is a first upper plate portion extending in a first direction from one end of the opening; a second upper plate portion including a wall portion that curves from the first upper plate portion toward the heat sink and is aligned with the heat sink in a second direction perpendicular to the first direction and extends along the second direction; Including, The airflow rectifying plate is provided between the heat sink and the upper airflow direction plate, A first flow straightening portion extending in the first direction; a second rectifying portion including a portion that bends from the first rectifying portion toward the heat sink and extends along the second direction in line with the heat sink in the second direction; Including, The lower airflow direction plate extends from the one end of the opening to the other end away from the one end of the opening in the second direction, is located between the heat sink and the opening in the first direction, and includes an inclined portion that inclines in a direction toward the first upper plate portion as it approaches the heat sink, At least a portion of the inclined portion is located between the heat sink and the opening, a space between the inclined portion and the heat sink is open in a third direction perpendicular to the first direction and the second direction; the first side plate and the second side plate face each other in the third direction, An electronic device, wherein a space between the upper air deflector and the lower air deflector, and a space between the heat sink and the upper air deflector are located between the first side panel and the second side panel. (Configuration 2) a position of the first flow straightening portion in the second direction is between a position of an end of the inclined portion on the heat sink side in the second direction and a position of the first upper plate portion in the second direction, The electronic device of configuration 1, wherein a gap is provided between the end of the inclined portion on the heat sink side and the first rectifying portion. (Configuration 3) a second electronic component aligned with the duct in the third direction in a plan view; the second side plate is located between the first side plate and the second electronic component in the third direction and has a side hole penetrating the second side plate in the third direction; a position of a center of the heat sink in the third direction is between a position of a center of the fan in the third direction and the second side panel, The electronic device of configuration 1 or 2, wherein the first side panel has an inclined panel portion that is inclined in a direction toward the second side panel as it approaches the heat sink from the opening.

[0053] According to the embodiment, it is possible to provide an electronic device capable of improving cooling efficiency.

[0054] In this specification, "vertical" and "parallel" do not only mean strictly vertical and strictly parallel, but also include, for example, variations in the manufacturing process, and may mean substantially vertical and substantially parallel.

[0055] Although some embodiments of the present invention have been illustrated above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, modifications, etc. can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the scope of the invention and its equivalents described in the claims. In addition, the above-mentioned embodiments can be implemented in combination with each other. [Explanation of symbols]

[0056] 10: Fan 30: Duct 31: Opening 31p: One end 31q: Other end 32:Upper wind direction board 33: Downward wind direction board 34: Rectifier plate 35: 1st side plate 36:Second side plate 37, 38, 39: Opening 40: Heat sink 40a: Front part 40b: Back part 40c: Central part 41: Base section 42: Finn 51: First electronic component 52: Second electronic component 53: Power supply unit 54: Expansion card holder 55: Expansion card mounting area 56: Circuit board 57: Memory 80: Cabinet 80b: Rear 80f:Front 80s, 80t: Side 80t: side 100:Electronic equipment 311: Inclined part 321: First upper plate 321e:edge 322: Second upper plate 322w: wall 331: Inclined part 331e: Rear end 331f: Front end 341: 1st rectifier 341e:edge 342:Second rectifier 342w: wall 351: Inclined plate part 352: Board part 361, 361a, 361b: Side hole G1: Gap P1, P2:Position SP1, SP2, SP3: Space

Claims

1. With fans, A duct including an upper wind direction plate, a lower wind direction plate, a first side plate and a second side plate connecting the upper wind direction plate and the lower wind direction plate, and a straightening plate, the duct having an opening that opens toward the fan; a heat sink disposed adjacent to the first electronic component; Equipped with The upper wind deflector is a first upper plate portion extending in a first direction from one end of the opening; a second upper plate portion including a wall portion that curves from the first upper plate portion toward the heat sink and is aligned with the heat sink in a second direction perpendicular to the first direction and extends along the second direction; Including, The airflow rectifying plate is provided between the heat sink and the upper airflow direction plate, A first flow straightening portion extending in the first direction; a second rectifying portion including a portion that bends from the first rectifying portion toward the heat sink and extends along the second direction in line with the heat sink in the second direction; Including, the lower airflow direction plate extends from the one end of the opening to the other end distant in the second direction, is located between the heat sink and the opening in the first direction, and includes an inclined portion inclined in a direction approaching the first upper plate portion as it approaches the heat sink, At least a portion of the inclined portion is located between the heat sink and the opening, a space between the inclined portion and the heat sink is open in a third direction perpendicular to the first direction and the second direction; the first side plate and the second side plate face each other in the third direction, An electronic device, wherein a space between the upper air deflector and the lower air deflector, and a space between the heat sink and the upper air deflector are located between the first side panel and the second side panel.

2. a position of the first flow straightening portion in the second direction is between a position of an end of the inclined portion on the heat sink side in the second direction and a position of the first upper plate portion in the second direction, The electronic device according to claim 1 , wherein a gap is provided between the end of the inclined portion on the heat sink side and the first flow straightening portion.

3. a second electronic component aligned with the duct in the third direction in a plan view, the second side plate is located between the first side plate and the second electronic component in the third direction and has a side hole penetrating the second side plate in the third direction; a position of a center of the heat sink in the third direction is between a position of a center of the fan in the third direction and the second side panel, The electronic device according to claim 1 , wherein the first side panel has an inclined panel portion that is inclined in a direction approaching the second side panel as it approaches the heat sink from the opening portion.

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