Laser beam irradiation device, and alignment adjustment method

Abstract

To further enhance accuracy of an irradiation position of a laser beam.SOLUTION: A laser beam irradiation device includes a laser light source for emitting a laser beam, a substrate stage mounted with a mounting substrate irradiated with the laser beam, a mask which is provided between the laser light source and the substrate stage and separates the laser beam by a plurality of openings, a microlens array which is provided at the rear stage of the mask and condenses the laser beam each having transmitted through the plurality of openings by a plurality of microlenses, a first camera which transmits through a first mark opening provided on the mask and images illumination light condensed by the microlenses provided on the microlens array, and a second camera which images a second mark provided on the microlens array, and adjusts a plane position of the mask on the basis of an imaging result of the illumination light, and adjusts the plane position of the mask and the microlens array on the basis of the imaging result of the second mark.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a laser light irradiation device and an alignment adjustment method. [Background technology]

[0002] In the manufacturing process of LED (Light Emitting Diode) elements made of compound semiconductors, a process called laser lift-off is known to be performed in which an LED element formed on one side of a substrate is irradiated with laser light from the other side of the substrate to peel the LED element off from the substrate.

[0003] For example, the following Patent Document 1 discloses a laser lift-off device that sequentially irradiates a laser beam onto a growth substrate on one side of which chip components are formed in a matrix at a predetermined arrangement pitch, thereby enabling the chip components to be peeled off from the growth substrate. The laser lift-off device disclosed in Patent Document 1 irradiates the growth substrate with a laser beam that has passed through a photomask and is focused by an array of microlenses to a diameter approximately equal to the outer diameter of the chip components. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2022-147017 A Summary of the Invention [Problem to be solved by the invention]

[0005] Here, when the laser light emitted from the laser light source is separated into multiple laser lights using a mask and each of the multiple separated laser lights is focused using an array of microlenses, alignment between the mask, the microlens array, and the irradiation position becomes important.

[0006] However, in the above-mentioned Patent Document 1, the method of adjusting the alignment between the mask, the microlens array, and the irradiation position was not fully considered. If these alignments are not adequately adjusted, the accuracy of the irradiation position of the laser light decreases.

[0007] Therefore, the present invention has been made in consideration of the above problems, and an object of the present invention is to provide a new and improved laser light irradiation device and alignment adjustment method that can further improve the accuracy of the irradiation position of the laser light. [Means for solving the problem]

[0008] In order to solve the above problem, according to one aspect of the present invention, there is provided a light source unit including a laser light source that emits laser light and an illumination light source that emits illumination light, a substrate stage on which a mounting substrate to be irradiated with the laser light is placed, a mask provided between the light source unit and the substrate stage and using a plurality of openings to separate the laser light into a plurality of openings, a microlens array provided behind the mask between the light source unit and the substrate stage and using a plurality of microlenses to focus the laser light that has passed through each of the plurality of openings onto the mounting substrate, The present invention provides a laser light irradiation device comprising: a first camera provided opposite the illumination light source and capturing an image of the illumination light that passes through a first mark opening and is focused by a microlens provided on the microlens array; a second camera provided opposite the second mark and capturing an image of the second mark on the microlens array; and an alignment adjustment unit that adjusts a planar position of the mask based on an image of the illumination light captured by the first camera, and adjusts planar positions of the mask and the microlens array by the same amount based on an image of the second mark captured by the second camera.

[0009] In order to solve the above-mentioned problems, according to another aspect of the present invention, there is provided an alignment adjustment method for a substrate stage on which a mounting substrate is placed, on which a laser beam emitted from a laser light source included in a light source unit is irradiated, a mask that is provided between the light source unit and the substrate stage in an adjustable manner in planar position and that separates the laser beam into a plurality of apertures using a plurality of apertures, and a microlens array that is provided behind the mask between the light source unit and the substrate stage in an adjustable manner in planar position and that focuses the laser beam that has passed through each of the plurality of apertures onto the mounting substrate using a plurality of microlenses, The alignment adjustment method includes the steps of: capturing an image of the illumination light, which passes through a first mark opening provided on the mask and is focused by a microlens provided on the microlens array, with a first camera provided at a position corresponding to the illumination light source; adjusting a planar position of the mask based on an imaging result of the illumination light by the first camera; capturing an image of a second mark provided on the microlens array with a second camera provided at a position corresponding to the second mark; and adjusting the planar positions of the mask and the microlens array by the same amount based on an imaging result of the second mark by the second camera. Effect of the Invention

[0010] As described above, according to the present invention, it is possible to further improve the accuracy of the irradiation position of the laser beam. [Brief description of the drawings]

[0011] [Figure 1] 1 is a block diagram showing a schematic configuration of a laser light irradiation device according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a schematic perspective view for explaining detailed configurations of a laser light source, a mask, a microlens array, and a substrate stage. [Diagram 3] FIG. 2 is a schematic perspective view illustrating a detailed configuration of a mounting board. [Figure 4]FIG. 11 is a flowchart showing the flow of an alignment adjustment operation performed by the laser light irradiation device. [Diagram 5] 4 is a schematic cross-sectional view showing the positional relationship between a first mark opening, a second mark, a third mark, and a fourth mark. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In this specification and the drawings, components having substantially the same functional configurations are designated by the same reference numerals, and duplicated explanations will be omitted.

[0013] <1. Overview> First, a schematic configuration of a laser beam irradiation device according to an embodiment of the present invention will be described with reference to Fig. 1. Fig. 1 is a block diagram showing a schematic configuration of a laser beam irradiation device 1 according to this embodiment.

[0014] As shown in FIG. 1, the laser light irradiation device 1 includes a laser light source 111, a mask 120, a microlens array 130, a substrate stage 140, an imaging section 150, an alignment adjustment section 160, and a control device 170.

[0015] The laser light irradiation device 1 is a device that irradiates a mounting substrate 200 placed on a substrate stage 140 with laser light L that is emitted from a laser light source 111, passes through a mask 120, and is focused by a microlens array 130. The mounting substrate 200 is a laminate in which a support substrate having an LED element formed on one surface and a circuit substrate are bonded together so that the LED element is transferred to the circuit substrate. In other words, the laser light irradiation device 1 is a laser lift-off device that irradiates a laser beam from the other surface side of the support substrate to the interface between the LED element and the support substrate, thereby peeling the support substrate from the LED element.

[0016] The laser light source 111 is, for example, an excimer laser. The laser light L emitted from the laser light source 111 is emitted to the mask 120. The laser light source 111 may emit the laser light L having a uniform light intensity distribution by using, for example, a homogenizer or the like.

[0017] The mask 120 is a light-shielding substrate having a plurality of openings through which the laser light L can pass. The mask 120 may be formed, for example, by forming a light-shielding film such as chromium (Cr) on a transparent substrate such as quartz glass, and then patterning the formed light-shielding film. The mask 120 can separate the laser light L emitted from the laser light source 111 into a plurality of laser lights L1 by a plurality of openings provided corresponding to each of the microlenses of the microlens array 130 described later.

[0018] The microlens array 130 is a transparent substrate having a plurality of microlenses arranged in a predetermined arrangement on one surface. The microlens array 130 can focus the plurality of laser beams L1 separated by the plurality of openings of the mask 120 onto the mounting substrate 200 using the microlenses. For example, the microlens array 130 may focus each of the plurality of laser beams L1 to a beam spot diameter approximately equal to the outer diameter of an LED element provided on the mounting substrate 200.

[0019] The substrate stage 140 places the mounting substrate 200 on a surface facing the laser light source 111, and transports the placed mounting substrate 200 in a direction opposite to the scanning direction of the laser light L1. By transporting the placed mounting substrate 200, the substrate stage 140 can irradiate each of the LED elements on the mounting substrate 200 with the laser light L1. For example, the substrate stage 140 may transport the mounting substrate 200 in each of the X direction and the Y direction.

[0020] The imaging section 150 uses a camera to capture images of the alignment marks provided on the mask 120 and the microlens array 130. For example, the imaging section 150 may capture images of the alignment marks of the mask 120 and the microlens array 130 from the substrate stage 140 side using a camera provided on the substrate stage 140.

[0021] The alignment adjustment section 160 adjusts the planar positions of the mask 120 and the microlens array 130 based on the imaging results of the alignment marks provided on the mask 120 and the microlens array 130. For example, the alignment adjustment section 160 may adjust the planar positions of the mask 120 and the microlens array 130 based on a deviation in the imaging positions of the alignment marks provided on the mask 120 and the microlens array 130.

[0022] Furthermore, the imaging section 150 may capture images of the alignment marks provided on the substrate stage 140 and the mounting substrate 200, respectively, with separate cameras. For example, the imaging section 150 may capture images of the alignment marks provided on the substrate stage 140 and the mounting substrate 200, respectively, with cameras provided opposite the substrate stage 140.

[0023] In such a case, the alignment adjustment unit 160 can adjust the planar positions of the substrate stage 140 and the mounting substrate 200 based on the imaging results of the alignment marks provided on the substrate stage 140 and the mounting substrate 200. For example, the alignment adjustment unit 160 may adjust the planar positions of the substrate stage 140 and the mounting substrate 200 based on a deviation in the imaging positions of the alignment marks provided on the substrate stage 140 and the mounting substrate 200.

[0024] The control device 170 controls the substrate stage 140 and the laser light source 111 in cooperation with each other. Specifically, the control device 170 controls the transportation of the mounting substrate 200 by the substrate stage 140, and also controls the emission timing of the laser light L from the laser light source 111. In this way, the control device 170 can control the transportation of the mounting substrate 200 and the emission timing of the laser light L so that the laser light L emitted from the laser light source 111 is irradiated onto desired LED elements on the mounting substrate 200.

[0025] The functions of the alignment adjustment unit 160 and the control device 170 may be realized by cooperation between software and hardware such as a CPU, a ROM, and a RAM. The CPU functions as an arithmetic processing device and controls the operations of the alignment adjustment unit 160 and the control device 170 according to various programs recorded in the ROM, RAM, or the like. The ROM is a storage device that stores programs used by the CPU, arithmetic parameters, and the like. The RAM is a storage device that temporarily stores programs used in the execution of the CPU, parameters used during the execution, and the like.

[0026] <2. Configuration> Next, a detailed configuration of the laser light irradiation device according to this embodiment will be described with reference to Fig. 2 and Fig. 3. Fig. 2 is a schematic perspective view for explaining the detailed configuration of the laser light source 111, the mask 120, the microlens array 130, and the substrate stage 140. Fig. 3 is a schematic perspective view for explaining the detailed configuration of the mounting substrate 200.

[0027] 2, in the laser light irradiation device 1, a laser light source 111 included in a light source unit 110 irradiates a substrate stage 140 with laser light L. The laser light L emitted from the laser light source 111 is separated and shaped by passing through a plurality of openings 121 provided in a mask 120, and then is collected by each of the microlenses 131 provided in a microlens array 130 to reach the substrate stage 140.

[0028] The mask 120 and the microlens array 130 are provided so as to be independently movable in, for example, the X direction, the Y direction, and the rotation direction around the Z axis. The laser light irradiation device 1 can adjust the alignment of the light source unit 110, the mask 120, the microlens array 130, and the substrate stage 140 by moving the mask 120 and the microlens array 130 relative to the substrate stage 140 in the X direction, the Y direction, and the rotation direction around the Z axis.

[0029] The mounting substrate 200 shown in Fig. 3 is placed on the substrate stage 140. As shown in Fig. 3, the mounting substrate 200 is formed by bonding a support substrate 230, on one surface of which a plurality of LED elements 220 are arranged in a matrix, to a circuit substrate 210 such that the LED elements 220 and the circuit substrate 210 face each other. The laser light irradiation device 1 irradiates each of the plurality of LED elements 220 arranged on the mounting substrate 200 with laser light L, thereby enabling the plurality of LED elements 220 to be peeled off from the support substrate 230 by laser lift-off.

[0030] Specifically, the laser light source 111 emits a rectangular laser light L extending in the Y direction. The width of the laser light L in the X direction may be equal to or greater than the arrangement pitch of the LED elements 220 arranged on the mounting substrate 200 in the X direction (i.e., row direction). For example, the width of the laser light L in the X direction may be equal to or greater than one arrangement pitch of the LED elements 220 in the X direction but less than two. The length of the laser light L in the Y direction may correspond to at least a part of a row extending in the Y direction (i.e., column direction) of the LED elements 220 arranged on the mounting substrate 200, and may be, for example, a length corresponding to a plurality of the LED elements 220 arranged in the Y direction. The laser light L emitted from the laser light source 111 may be converted by, for example, a homogenizer or the like so that the light intensity distribution in the irradiation area becomes uniform.

[0031] Furthermore, the light source unit 110 includes an illumination light source 112 in addition to the laser light source 111. The illumination light sources 112 are provided on both sides of the laser light source 111 in the Y direction, and emit illumination light S to a first mark opening M1 provided in the mask 120.

[0032] The mask 120 is provided with a plurality of openings 121 corresponding to the arrangement pitch in the Y direction of the LED elements 220 arranged on the mounting substrate 200. Specifically, the mask 120 is provided with a plurality of openings 121 arranged in the Y direction at a pitch approximately equal to the arrangement pitch in the Y direction of the LED elements 220 on the mounting substrate 200. The mask 120 may further be provided with a plurality of rows of the plurality of openings 121 arranged in the Y direction at a predetermined interval in the X direction. The plurality of openings 121 may be, for example, rectangular in shape corresponding to the shape of the LED elements 220. The laser light L emitted from the laser light source 111 and incident on the mask 120 is separated into a plurality of laser lights L1 for each of the plurality of openings 121 by transmitting through the plurality of openings 121.

[0033] In addition, the mask 120 is provided with first mark openings M1 at the outermost sides in the Y direction, sandwiching a region in which the plurality of openings 121 are provided. For example, the first mark openings M1 may be provided on both sides in the Y direction of a row in which the plurality of openings 121 are arranged as openings having a shape such as a cross whose center is easily identified. It is desirable that the first mark openings M1 are provided at at least two or more different positions in order to adjust the position of the mask 120 in the rotation direction about the Z axis. The first mark openings M1 transmit the illumination light S irradiated from the illumination light source 112, and thereby can shape the illumination light S into a planar shape corresponding to the shape of the first mark openings M1.

[0034] The microlens array 130 is provided with a plurality of microlenses 131 corresponding to the arrangement pitch in the Y direction of the LED elements 220 arranged on the mounting substrate 200. Specifically, the microlens array 130 is provided with a plurality of microlenses 131 arranged in the Y direction at a pitch approximately equal to the arrangement pitch in the Y direction of the LED elements 220 on the mounting substrate 200. The microlens array 130 may further include a plurality of rows of the microlenses 131 arranged in the Y direction at a predetermined interval in the X direction. The plurality of microlenses 131 may be, for example, lenses having a shape capable of forming an image of the position of the mask 120 (i.e., an image of the aperture 121) on the substrate stage 140 at a desired magnification. The plurality of laser beams L1 transmitted through the plurality of apertures 121 and incident on the microlens array 130 are each focused by the microlenses 131 to form an image on the substrate stage 140.

[0035] Further, the microlens array 130 is further provided with a microlens 131A at a position corresponding to the first mark opening M1 of the mask 120. Specifically, the microlens array 130 is further provided with a microlens 131A for collecting the illumination light S transmitted through the first mark opening M1 at the outermost portions on both sides in the Y direction across the region in which the multiple microlenses 131 are provided. The microlens 131A can form an image of the illumination light S shaped into the shape of the first mark opening M1 on the substrate stage 140. The illumination light S formed on the substrate stage 140 is captured by a first camera 151 provided on the substrate stage 140 and used for adjusting the position of the mask 120.

[0036] Furthermore, second marks M2 are provided on both sides in the X direction of the microlens array 130, sandwiching the area in which the microlenses 131 are provided. For example, the second marks M2 may be provided on the outermost sides of the microlens array 130 in the X direction as marks having a shape such as a cross whose center is easily identifiable. It is desirable that the second marks M2 are provided in at least two or more different positions in order to adjust the position of the microlens array 130 in the rotation direction about the Z axis. The second marks M2 are imaged by a second camera 152 provided on the substrate stage 140, and are used to adjust the positions of the mask 120 and the microlens array 130.

[0037] The positions at which the first mark opening M1 and the second mark M2 are provided are not limited to those described above. The first mark opening M1 and the second mark M2 may be provided at different positions so as not to overlap each other.

[0038] The substrate stage 140 is provided with a first camera 151 and a second camera 152 of the imaging section 150 so as to be able to capture an image from the mounting surface of the mounting substrate 200. For example, the first camera 151 and the second camera 152 may be embedded in the mounting surface of the substrate stage 140 on which the mounting substrate 200 is placed.

[0039] First camera 151 is provided at a position facing first mark opening M1, and captures illumination light S that is emitted from illumination light source 112, passes through first mark opening M1, and is collected by microlens 131A. The result of capturing the illumination light S by first camera 151 is used for aligning mask 120 and microlens array 130.

[0040] The second camera 152 is provided at a position facing the second mark M2, and captures an image of the second mark M2 provided on the microlens array 130. The image of the second mark M2 captured by the second camera 152 is used for aligning the substrate stage 140 with the mask 120 and the microlens array 130.

[0041] Specifically, the alignment adjustment unit 160 may align the mask 120 with the microlens array 130 by adjusting the planar position of the mask 120 according to the difference between the position of the center of imaging by the first camera 151 and the position of the captured illumination light S. Thereafter, the alignment adjustment unit 160 may align the mask 120 with the substrate stage 140 and the microlens array 130 by adjusting the planar positions of the mask 120 and the microlens array 130 by the same amount according to the difference between the position of the center of imaging by the second camera 152 and the position of the captured second mark M2.

[0042] Furthermore, a third camera 153 of the imaging section 150 is provided so as to face the mounting substrate 200 of the substrate stage 140 .

[0043] The third camera 153 captures an image of a third mark M3 provided on the outer periphery of the substrate stage 140, and a fourth mark M4 provided on the mounting substrate 200 to correspond to the third mark M3. Based on the image of the third mark M3 by the third camera 153 and the image of the fourth mark M4 by the third camera 153, the substrate stage 140 and the mounting substrate 200 are aligned.

[0044] The third mark M3 is provided at a corner of the outer periphery of the substrate stage 140 as a mark having a shape such as a cross whose center is easily identifiable. The third mark M3 is desirably provided at at least two or more different positions in order to align the substrate stage 140 and the mounting substrate 200 in the rotational direction around the Z axis. The fourth mark M4 is provided at a corner of the outer periphery of the circuit substrate 210 of the mounting substrate 200 as a mark having a shape such as a cross whose center is easily identifiable, as shown in FIG. 3, so as to correspond to the third mark M3 of the substrate stage 140. In order to make the mounting substrate 200 placed on the substrate stage 140 in any orientation, the fourth mark M4 may be provided at each of the four corners of the circuit substrate 210.

[0045] Specifically, the alignment adjustment unit 160 may align the substrate stage 140 and the mounting substrate 200 by adjusting the placement position of the mounting substrate 200 in accordance with the difference between the position of the third mark M3 imaged by the third camera 153 and the position of the fourth mark M4 imaged by the third camera 153. The adjustment of the placement position of the mounting substrate 200 may be performed by, for example, a robot arm used when placing the mounting substrate 200 on the substrate stage 140.

[0046] According to the above configuration, the laser light irradiation device 1 can automatically adjust the planar position of the mask 120 based on the imaging result of the illumination light S that is emitted from the illumination light source 112, formed by the first mark opening M1 provided in the mask 120, and then collected by the microlens 131A. Furthermore, the laser light irradiation device 1 can automatically adjust the planar positions of the mask 120 and the microlens array 130 based on the imaging result of the second mark M2 provided in the microlens array 130. Therefore, the laser light irradiation device 1 can adjust the alignment of the light source unit 110, the mask 120, the microlens array 130, and the substrate stage 140 with high accuracy based on the imaging results of the first camera 151 and the second camera 152.

[0047] Furthermore, the laser light irradiation device 1 can automatically adjust the planar position of the mounting substrate 200 based on the imaging result of the third mark M3 provided on the substrate stage 140 and the imaging result of the fourth mark M4 provided on the mounting substrate 200. Therefore, the laser light irradiation device 1 can adjust the alignment of the substrate stage 140 and the mounting substrate 200 with high accuracy based on the imaging result of the third camera 153.

[0048] <3. Alignment adjustment procedure> Next, the flow of the alignment adjustment operation by the laser light irradiation device 1 will be described with reference to Fig. 4 and Fig. 5. Fig. 4 is a flow chart showing the flow of the alignment adjustment operation by the laser light irradiation device 1. Fig. 5 is a schematic cross-sectional view showing the positional relationship between the first mark opening M1, the second mark M2, the third mark M3, and the fourth mark M4.

[0049] 4, first, the illumination light S emitted from the illumination light source 112, transmitted through the first mark opening M1, and collected by the microlens 131A is imaged by the first camera 151 (S101). Specifically, the illumination light S emitted from the illumination light sources 112 provided on both sides of the laser light source 111 is shaped by the first mark opening M1 provided on the outer periphery of the mask 120, and then collected by the microlens 131A provided on the outer periphery of the microlens array 130. The illumination light S collected by the microlens 131A forms an image on the substrate stage 140, and is imaged by the first camera 151 provided on the substrate stage 140 so as to face the illumination light source 112.

[0050] Next, the planar position of the mask 120 is adjusted based on the image capturing result of the illumination light S by the first camera 151 (S103). Specifically, the alignment adjustment unit 160 adjusts the planar position of the mask 120 according to the difference between the position of the center of image capturing by the first camera 151 and the position of the illumination light S captured by the first camera 151. This allows the laser light irradiation device 1 to adjust the alignment between the mask 120 and the microlens array 130.

[0051] Further, the second mark M2 provided on the microlens array 130 is imaged by the second camera 152 (S105). Specifically, the second mark M2 provided on the outer periphery of the microlens array 130 is imaged by the second camera 152 provided on the substrate stage 140 so as to face the second mark M2.

[0052] Next, the planar positions of the mask 120 and the microlens array 130 are adjusted based on the image capturing result of the second mark M2 by the second camera 152 (S107). Specifically, the alignment adjustment unit 160 adjusts the planar positions of the mask 120 and the microlens array 130 by the same amount according to the difference between the position of the center of the image captured by the second camera 152 and the position of the second mark M2 captured by the second camera 152.

[0053] The alignment between the mask 120 and the microlens array 130 has already been adjusted by the operation of step S103. Therefore, the alignment adjustment unit 160 can adjust the alignment between the substrate stage 140 and the mask 120 and the microlens array 130 without changing the alignment between the mask 120 and the microlens array 130 by moving the planar positions of the mask 120 and the microlens array 130 by the same amount. This allows the laser light irradiation device 1 to adjust the alignment between the substrate stage 140 and the mask 120 and the microlens array 130.

[0054] Furthermore, the third mark M3 provided on the substrate stage 140 and the fourth mark M4 provided on the mounting substrate 200 are imaged by the third camera 153 (S109). Specifically, first, the third mark M3 provided on the substrate stage 140 before the mounting substrate 200 is placed is imaged by the third camera 153 facing the substrate stage 140. Then, the fourth mark M4 provided on the mounting substrate 200 after the mounting substrate 200 is placed is imaged by the third camera 153.

[0055] Next, the planar position of the mounting substrate 200 is adjusted based on the image capturing results of the third mark M3 and the fourth mark M4 by the third camera 153 (S111). Specifically, the alignment adjustment unit 160 moves the mounting substrate 200 based on the positional deviation of the third mark M3 and the fourth mark M4 captured by the third camera 153. This allows the laser light irradiation device 1 to adjust the alignment between the substrate stage 140 and the mounting substrate 200.

[0056] According to the above-mentioned operation flow, the laser light irradiation device 1 can adjust the alignment of each of the laser light source 111, the mask 120, the microlens array 130, the substrate stage 140, and the mounting substrate 200. Therefore, the laser light irradiation device 1 can irradiate the mounting substrate 200 with the laser light L1 with higher positional accuracy.

[0057] Although the preferred embodiment of the present invention has been described in detail above with reference to the accompanying drawings, the present invention is not limited to such an example. It is clear that a person having ordinary knowledge in the technical field to which the present invention pertains can conceive of various modified or altered examples within the scope of the technical ideas described in the claims, and it is understood that these also naturally belong to the technical scope of the present invention. [Explanation of symbols]

[0058] 1...laser light irradiation device, 110...light source section, 111...laser light source, 112...illumination light source, 120...mask, 121...aperture, 130...microlens array, 131, 131A...microlens, 140...substrate stage, 150...imaging section, 151...first camera, 152...second camera, 153...third camera, 160...alignment adjustment section, 170...control device, 200...mounting substrate, 210...circuit board, 220...LED element, 230...support substrate, L, L1...laser light, S...illumination light, M1...first mark aperture, M2...second mark, M3...third mark, M4...fourth mark

Claims

1. a light source unit including a laser light source that emits laser light and an illumination light source that emits illumination light; a substrate stage on which a mounting substrate to be irradiated with the laser light is placed; a mask provided between the light source unit and the substrate stage, the mask having a plurality of openings for separating the laser light into a plurality of openings; a microlens array provided behind the mask between the light source unit and the substrate stage, the microlens array focusing the laser light transmitted through each of the plurality of openings onto the mounting substrate by a plurality of microlenses; a first camera disposed at a position facing the illumination light source, the first camera capturing an image of the illumination light that is emitted from the illumination light source, passes through a first mark opening provided in the mask, and is condensed by a microlens provided in the microlens array; and a second camera that captures an image of a second mark provided on the microlens array and is provided at a position facing the second mark; an alignment adjustment unit that adjusts a planar position of the mask based on an image capturing result of the illumination light by the first camera, and adjusts planar positions of the mask and the microlens array by the same amount based on an image capturing result of the second mark by the second camera; A laser light irradiation device comprising:

2. The laser light irradiation device according to claim 1 , wherein the first mark opening and the second mark are provided at different positions.

3. The laser light irradiation device according to claim 2 , wherein at least two of the first mark openings and at least two of the second marks are provided.

4. At least two of the first mark openings are provided on opposite sides of the plurality of openings, The laser light irradiation device according to claim 3 , wherein at least two of the second marks are provided on opposite sides of the plurality of microlenses.

5. A plurality of LED elements are arranged on the mounting substrate, The laser light irradiation device according to claim 1 , wherein the laser light is irradiated onto each of the plurality of LED elements.

6. The LED elements are arranged in a matrix, The laser light irradiation device according to claim 5 , wherein the laser light is irradiated onto at least a part of a row of the LED elements extending in a row direction.

7. The laser light irradiation device according to claim 1 , wherein the first camera and the second camera are embedded in a mounting surface of the substrate stage on which the mounting substrate is placed.

8. a third camera configured to capture an image of a third mark provided on the substrate stage and a fourth mark provided on the mounting substrate at a position corresponding to the third mark, 8. The laser light irradiation device according to claim 1, wherein the alignment adjustment unit further adjusts a planar position of the mounting substrate based on the imaging results of the third mark and the fourth mark by the third camera.

9. The laser light irradiation device according to claim 8 , wherein at least two of the third marks and at least two of the fourth marks are provided.

10. An alignment adjustment method for a substrate stage on which a mounting substrate is placed and which is irradiated with the laser light emitted from a laser light source included in a light source unit, a mask which is provided between the light source unit and the substrate stage in such a way that its planar position can be adjusted and which separates the laser light into a plurality of apertures using a plurality of apertures, and a microlens array which is provided behind the mask between the light source unit and the substrate stage in such a way that its planar position can be adjusted and which focuses the laser light which has passed through each of the plurality of apertures onto the mounting substrate using a plurality of microlenses, capturing an image of the illumination light emitted from an illumination light source included in the light source unit, transmitted through a first mark opening provided in the mask, and collected by a microlens provided in the microlens array, with a first camera provided at a position corresponding to the illumination light source; adjusting a planar position of the mask based on an image capturing result of the illumination light by the first camera; capturing an image of a second mark provided on the microlens array with a second camera provided at a position corresponding to the second mark; adjusting planar positions of the mask and the microlens array by the same amount based on an image capturing result of the second mark by the second camera; An alignment adjustment method comprising:

Images