Electronic component

Abstract

To provide an electronic component that reliably relieves stress acting on an element body while reducing tilt of the electronic component that may occur when the electronic component is mounted.SOLUTION: An element body 3 includes an end face 3e, a side face 3a adjacent to the end face 3e, and side faces 3c, 3d adjacent to the end face 3e and the side face 3a and facing each other. An external electrode 5 includes a first electrode layer E1 and a second electrode layer E2, and is disposed on the element body 3. When the first electrode layer E1 and the second electrode layer E2 are viewed from a direction perpendicular to the side face 3a, the second electrode layer E2 covers the edge of the first electrode layer E1. The external electrode 5 includes an electrode portion 5a located on the side face 3a. The electrode portion 5a has a greater thickness near both ends in a direction D3 than at the center in the direction D3.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to electronic components. [Background technology]

[0002] A known electronic component includes an element body and an external electrode including a sintered metal layer and a conductive resin layer and disposed on the element body (see, for example, Patent Document 1). The element body has, for example, a rectangular parallelepiped shape and includes an end face, a first side face adjacent to the end face, and second and third side faces adjacent to the end face and the first side face and facing each other. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2018-006501 A Summary of the Invention [Problem to be solved by the invention]

[0004] An object of one aspect of the present invention is to provide an electronic component that reduces the tilt of the electronic component that may occur when the electronic component is mounted, while mitigating the stress acting on the element body. [Means for solving the problem]

[0005] An electronic component according to one embodiment of the present invention includes an element body having a rectangular parallelepiped shape and including an end face, a first side face adjacent to the end face, and second and third side faces adjacent to the end face and the first side face and facing each other, and an external electrode including a sintered metal layer and a conductive resin layer and disposed on the element body. When the sintered metal layer and the conductive resin layer are viewed from a direction perpendicular to the first side face, the conductive resin layer covers the edge of the sintered metal layer. The external electrode includes an electrode portion located on the first side face. The electrode portion has a greater thickness near both ends in the direction in which the second and third side faces, compared to a center in the direction in which the second and third side faces.

[0006] In the one aspect, the electrode portion located on the first side surface of the external electrode is thicker at both ends in the direction in which the second and third side surfaces face each other than at the center in the direction in which the second and third side surfaces face each other. Thus, the external electrode has a shape in which the electrode portion located on the first side surface protrudes toward both ends in the direction in which the second and third side surfaces face each other. For example, when the first side surface faces an electronic device on which the electronic component according to the one aspect is mounted, that is, when the first side surface constitutes a mounting surface, the one aspect reduces tilt of the electronic component that may occur when the electronic component is mounted. The electronic device includes, for example, a circuit board or another component.

[0007] When an electronic component is mounted in an electronic device, an external force acting on the electronic component from the electronic device may act as stress on the element. The external force acts on the element through the external electrodes. The stress tends to concentrate on the edge of the sintered metal layer on the mounting surface of the element. When the stress concentrates on the edge of the sintered metal layer, there is a risk that cracks will occur in the element, starting from the edge of the sintered metal layer. In the above-mentioned one embodiment, when the sintered metal layer and the conductive resin layer are viewed from a direction perpendicular to the first side surface, the conductive resin layer covers the edge of the sintered metal layer. Therefore, for example, when the first side surface constitutes a mounting surface, the above-mentioned one embodiment relieves stress acting on the element body. In this case, the edge of the sintered metal layer is unlikely to become a starting point of a crack, and cracks are unlikely to occur in the element body.

[0008] The above-mentioned one aspect may include the following configuration: In this configuration, the electrode portion located on the first side surface includes a conductive resin layer having a thickness greater near both ends in the direction in which the second and third side surfaces face each other than a center in the direction in which the second and third side surfaces face each other. A configuration in which the conductive resin layer has the above thickness makes it easier to control the shape of the electrode portion compared to, for example, a configuration in which the sintered metal layer has the above thickness.

[0009] The above-mentioned one aspect may include the following configuration, in which the ratio of the thickness of the conductive resin layer at the center in the direction in which the second and third side faces oppose to the thickness at both ends in the direction in which the second and third side faces oppose is 0.02 to 0.9. In a configuration in which the ratio is greater than 0.9, the difference between the thickness at both ends in the direction in which the second and third side faces and the thickness at the center in the direction in which the second and third side faces tends to be small. In a configuration in which the ratio is greater than 0.9, the degree to which the electrode portions located on the first side face protrude toward both ends in the direction in which the second and third side faces. Therefore, in a configuration in which the ratio is greater than 0.9, it is difficult to reduce the tilt of the electronic component. In a configuration in which the ratio is less than 0.02, the thickness of the conductive resin layer covering the edge of the sintered metal layer on the first side surface tends to be small. In a configuration in which the ratio is less than 0.02, it is difficult to ensure the thickness of the conductive resin layer covering the edge of the sintered metal layer on the first side surface. Therefore, in a configuration in which the ratio is less than 0.02, it is difficult to alleviate the stress acting on the element body. As a result, a configuration in which the above ratio is 0.02 to 0.9 reliably reduces the tilt of the electronic component while reliably mitigating the stress acting on the element body.

[0010] The above one aspect may include the following configuration. In this configuration, the element body includes a fourth side surface facing the first side surface. When the sintered metal layer and the conductive resin layer are viewed in a direction perpendicular to the second side surface, the conductive resin layer covers an edge of the sintered metal layer, when the sintered metal layer and the conductive resin layer are viewed in a direction perpendicular to the third side surface, the conductive resin layer covers an edge of the sintered metal layer, and when the sintered metal layer and the conductive resin layer are viewed in a direction perpendicular to the fourth side surface, the conductive resin layer covers an edge of the sintered metal layer. The external electrode includes an electrode portion located on the second side surface, an electrode portion located on the third side surface, and an electrode portion located on the fourth side surface. Each of the electrode portion located on the second side surface and the electrode portion located on the third side surface has a thickness greater toward both ends in the direction in which the first and fourth side surfaces face each other than a center in the direction in which the first and fourth side surfaces face each other. The electrode portion located on the fourth side surface has a thickness greater toward both ends in the direction in which the second and third side surfaces face each other than a center in the direction in which the second and third side surfaces face each other. In this configuration, the external electrodes are shaped such that the electrode portions located on the first and fourth side surfaces protrude toward both ends in the direction in which the second and third side surfaces face each other, and the electrode portions located on the second and third side surfaces protrude toward both ends in the direction in which the first and fourth side surfaces face each other. Therefore, any of the first to fourth side surfaces can form a mounting surface. In the above-mentioned aspect including the above-mentioned configuration, there is no need to consider directionality when mounting an electronic component, improving the workability of mounting. Even when any one of the first to fourth side surfaces constitutes the mounting surface, the above-mentioned aspect including the above-mentioned configuration reduces the tilt of the electronic component while mitigating the stress acting on the element body.

[0011] The above-mentioned one aspect may include the following configuration. In this configuration, each of the electrode portion located on the second side surface and the electrode portion located on the third side surface includes a conductive resin layer having a greater thickness near both ends in the direction in which the first and fourth side surfaces face each other than at the center in the direction in which the first and fourth side surfaces face each other. The electrode portion located on the fourth side surface includes a conductive resin layer having a greater thickness near both ends in the direction in which the second and third side surfaces face each other than at the center in the direction in which the second and third side surfaces face each other. A configuration in which each conductive resin layer has the above thickness makes it easier to control the shape of each electrode portion compared to, for example, a configuration in which only a sintered metal layer has the above thickness.

[0012] The above one embodiment may include the following configuration. In this configuration, in the conductive resin layer included in each of the electrode portion located on the second side face and the electrode portion located on the third side face, the ratio of the thickness at the center in the direction in which the first and fourth side faces oppose to the thickness near both ends in the direction in which the first and fourth side faces oppose is 0.02 to 0.9. In the conductive resin layer included in the electrode portion located on the fourth side face, the ratio of the thickness at the center in the direction in which the second and third side faces oppose to the thickness near both ends in the direction in which the second and third side faces oppose is 0.02 to 0.9. As described above, a configuration in which the ratio is 0.02 to 0.9 reliably reduces the tilt of the electronic component while reliably mitigating the stress acting on the element body.

[0013] The above-mentioned one aspect may include the following configuration: In this configuration, the sintered metal layer covers the end surface and the ridge portion between the end surface and the first side surface, and the conductive resin layer includes a portion located on the first side surface, a portion located on the ridge portion, and a portion located on the end surface. This configuration reliably relieves stress acting on the element body even in a configuration in which the sintered metal layer covers the end face and the ridge portion between the end face and the first side face.

[0014] The above-mentioned one aspect may include the following configuration. In this configuration, the sintered metal layer covers the end surface and the first side surface. The conductive resin layer includes a portion located on the first side surface and a portion located on the end surface. This configuration reliably relieves the stress acting on the element body even in a configuration in which the sintered metal layer covers the end faces and the first side face.

[0015] The above-mentioned one aspect may include the following configuration. In this configuration, the sintered metal layer includes a sintered metal layer located on the end surface. The sintered metal layer located on the end surface includes a region covered with the conductive resin layer and a region exposed from the conductive resin layer. This configuration forms a current path to the external electrodes that does not include a conductive resin layer, and therefore reduces the equivalent series resistance (ESR). Effect of the Invention

[0016] One aspect of the present invention provides an electronic component that reliably relieves stress acting on an element body while reducing tilt of the electronic component that may occur when the electronic component is mounted. [Brief description of the drawings]

[0017] [Figure 1] FIG. 1 is a perspective view of the multilayer capacitor in accordance with the first embodiment. [Diagram 2] FIG. 2 is a diagram showing a cross-sectional configuration of the multilayer capacitor in accordance with the first embodiment. [Diagram 3] FIG. 3 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with the first embodiment. [Figure 4] FIG. 4 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with the first embodiment. [Diagram 5] FIG. 5 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with the first embodiment. [Figure 6] FIG. 6 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with the first embodiment. [Figure 7] FIG. 7 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the first embodiment. [Figure 8] FIG. 8 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the first embodiment. [Figure 9] FIG. 9 is a plan view showing the first electrode layer and the second electrode layer. [Figure 10] FIG. 10 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with the second embodiment. [Figure 11] FIG. 11 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with the second embodiment. [Figure 12] FIG. 12 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with the second embodiment. [Figure 13] FIG. 13 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with the second embodiment. [Figure 14] FIG. 14 is a cross-sectional view showing the structure of the multilayer capacitor in accordance with the second embodiment. [Figure 15] FIG. 15 is a perspective view of the multilayer capacitor in accordance with the third embodiment. [Figure 16] FIG. 16 is a cross-sectional view showing the structure of the multilayer capacitor in accordance with the third embodiment. [Figure 17] FIG. 17 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with the third embodiment. [Figure 18] FIG. 18 is a cross-sectional view showing the structure of the multilayer capacitor in accordance with the third embodiment. [Figure 19] FIG. 19 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with the third embodiment. [Figure 20] FIG. 20 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with the third embodiment. [Figure 21] FIG. 21 is a perspective view of the multilayer capacitor in accordance with the fourth embodiment. [Figure 22] FIG. 22 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with the fourth embodiment. [Figure 23] FIG. 23 is a cross-sectional view showing the structure of the multilayer capacitor in accordance with the fourth embodiment. [Figure 24] FIG. 24 is a cross-sectional view showing the structure of the multilayer capacitor in accordance with the fourth embodiment. [Diagram 25] FIG. 25 is a diagram showing a cross-sectional configuration of an electronic component device according to the fifth embodiment. [Figure 26] FIG. 26 is a diagram showing a cross-sectional configuration of an electronic component device according to the fifth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same elements or elements having the same functions will be denoted by the same reference numerals, and duplicated description will be omitted.

[0019] First embodiment The configuration of the multilayer capacitor C1 in accordance with the first embodiment will be described with reference to Figures 1 to 6. Figure 1 is a perspective view of the multilayer capacitor in accordance with the first embodiment. Figures 2 to 6 are diagrams showing the cross-sectional configuration of the multilayer capacitor in accordance with the first embodiment. In the first embodiment, the electronic component is, for example, a multilayer capacitor C1.

[0020] 1, the multilayer capacitor C1 includes a rectangular parallelepiped-shaped element body 3 and a plurality of external electrodes 5. The multilayer capacitor C1 includes, for example, a pair of external electrodes 5. The pair of external electrodes 5 are arranged on the outer surfaces of the element body 3. The pair of external electrodes 5 are spaced apart from each other. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and edges, and a rectangular parallelepiped shape with rounded corners and edges.

[0021] The element body 3 includes a pair of side surfaces 3a, 3b facing each other, a pair of side surfaces 3c, 3d facing each other, and a pair of end surfaces 3e facing each other. The pair of side surfaces 3a, 3b, the pair of side surfaces 3c, 3d, and the pair of end surfaces 3e have a rectangular shape. The direction in which the pair of side surfaces 3a, 3b face each other is direction D2. The direction in which the pair of side surfaces 3c, 3d face each other is direction D3. The direction in which the pair of end surfaces 3e face each other is direction D1. The multilayer capacitor C1 is solder-mounted on an electronic device. The electronic device includes, for example, a circuit board or another electronic component. In the multilayer capacitor C1, one of the four side surfaces 3a, 3b, 3c, and 3d faces the electronic device. One of the four side surfaces 3a, 3b, 3c, and 3d is arranged to form a mounting surface. One of the four side surfaces 3a, 3b, 3c, and 3d is the mounting surface. For example, the side surface 3a is the mounting surface. For example, when the side surface 3a includes a first side surface, the side surface 3b includes a fourth side surface. For example, when the side surface 3a includes a first side surface and the side surface 3c includes a second side surface, the side surface 3d includes a third side surface.

[0022] The direction D2 is a direction perpendicular to each side surface 3a, 3b, and perpendicular to the direction D3. The direction D1 is a direction parallel to each side surface 3a, 3b and each side surface 3c, and perpendicular to the directions D2 and D3. The direction D3 is a direction perpendicular to each side surface 3c, 3d, and the direction D1 is a direction perpendicular to each end surface 3e. The length of the element body 3 in the direction D1 is, for example, greater than the length of the element body 3 in the direction D2 and greater than the length of the element body 3 in the direction D3. The direction D1 is the longitudinal direction of the element body 3. The length of the element body 3 in the direction D2 and the length of the element body 3 in the direction D3 may be equal to each other. The length of the element body 3 in the direction D2 and the length of the element body 3 in the direction D3 may be different from each other.

[0023] The length of element body 3 in direction D2 is the height of element body 3. The length of element body 3 in direction D3 is the width of element body 3. The length of element body 3 in direction D1 is the length of element body 3. For example, the height of element body 3 is 0.1 to 3.2 mm, the width of element body 3 is 0.1 to 6.3 mm, and the length of element body 3 is 0.2 to 7.5 mm. For example, the height of element body 3 is 2.5 mm, the width of element body 3 is 2.5 mm, and the length of element body 3 is 3.2 mm.

[0024] The pair of side surfaces 3c, 3d extend in direction D2 to connect the pair of side surfaces 3a, 3b. The pair of side surfaces 3c, 3d also extend in direction D1. The pair of end surfaces 3e extend in direction D2 to connect the pair of side surfaces 3a, 3b. The pair of end surfaces 3e extend in direction D3 to connect the pair of side surfaces 3c, 3d.

[0025] The element body 3 includes four ridges 3g, four ridges 3i, and four ridges 3j. The ridges 3g are located between the end face 3e and each of the side faces 3a and 3b. The ridges 3i are located between the end face 3e and each of the side faces 3c and 3d. The ridges 3j are located between each of the side faces 3a and 3b and each of the side faces 3c and 3d. For example, each of the ridges 3g, 3i, and 3j is rounded to be curved. The element body 3 is subjected to so-called R chamfering. The end face 3e and each of the side faces 3a and 3b are indirectly adjacent to each other via the ridges 3g. The end face 3e and each of the side faces 3c and 3d are indirectly adjacent to each other via the ridges 3i. The side faces 3a and 3b and each of the side faces 3c and 3d are indirectly adjacent to each other via the ridges 3j.

[0026] The element body 3 is configured by stacking a plurality of dielectric layers in the direction D2. The element body 3 includes a plurality of dielectric layers that are stacked. In the element body 3, the stacking direction of the plurality of dielectric layers coincides with the direction D2. Each dielectric layer is configured, for example, from a sintered body of a ceramic green sheet including a dielectric material. The dielectric material includes, for example, a BaTiO3-based, Ba(Ti,Zr)O3-based, or (Ba,Ca)TiO3-based dielectric ceramic. In the actual element body 3, the dielectric layers are integrated to such an extent that the boundaries between the dielectric layers are not visible.

[0027] As shown in Figs. 2 to 6, the multilayer capacitor C1 includes a plurality of internal electrodes 7. Each internal electrode 7 is an internal conductor disposed within the element body 3. Each internal electrode 7 is made of a conductive material that is typically used as an internal conductor for a multilayer electronic component. The conductive material includes, for example, a base metal. The conductive material includes, for example, Ni or Cu. The internal electrode 7 is configured as a sintered body of a conductive paste that includes the conductive material. For example, the internal electrode 7 is made of Ni.

[0028] The internal electrodes 7 are arranged at different positions (layers) in the direction D2. The internal electrodes 7 are arranged in the element body 3 so as to face each other with a gap in the direction D2. The internal electrodes 7 adjacent to each other in the direction D2 have different polarities. One end of the internal electrode 7 is exposed at a corresponding end face 3e of the pair of end faces 3e. The internal electrodes 7 include one end exposed at the corresponding end face 3e. The internal electrodes 7 include an internal electrode 7 exposed at one end face 3e of the pair of end faces 3e and an internal electrode 7 exposed at the other end face 3e of the pair of end faces 3e. The internal electrodes 7 exposed at one end face 3e and the internal electrodes 7 exposed at the other end face 3e are alternately arranged in the direction D2. The internal electrodes 7 are arranged in the element body 3 so as to be aligned in the direction D2. The internal electrodes 7 are located in a plane substantially parallel to the side faces 3a and 3b. The direction in which the internal electrodes 7 face each other (direction D2) is perpendicular to the directions (direction D3 and direction D1) parallel to the side surfaces 3a and 3b.

[0029] When the lamination direction of the multiple dielectric layers is direction D3, the multiple internal electrodes 7 are arranged at different positions (layers) in direction D3. When the lamination direction of the multiple dielectric layers is direction D3, the internal electrodes 7 exposed at one end face 3e and the internal electrodes 7 exposed at the other end face 3e are arranged alternately in direction D3. The internal electrodes 7 are located in a plane approximately parallel to each of the side faces 3c, 3d. The internal electrodes 7 face each other in direction D3.

[0030] As shown in FIG. 1, the external electrodes 5 are disposed on both ends of the element body 3 in the direction D1. Each external electrode 5 is disposed on the side of the corresponding end face 3e of the element body 3. For example, each external electrode 5 is disposed on a pair of side faces 3a and 3b, a pair of side faces 3c and 3d, and one end face 3e. As shown in FIGS. 2 to 4, the external electrode 5 includes a plurality of electrode portions 5a, 5b, 5c, 5d, and 5e. The electrode portion 5a is located on the side face 3a. The electrode portion 5b is located on the side face 3b. The electrode portion 5c is located on the side face 3c. The electrode portion 5d is located on the side face 3d. The electrode portion 5e is located on the end face 3e. The external electrode 5 includes a plurality of electrode portions 5g and 5i. The electrode portion 5g is located on the ridge portion 3g. The electrode portion 5i is located on the ridge portion 3i. The external electrode 5 also includes an electrode portion located on the ridge portion 3j.

[0031] The external electrode 5 is formed on five surfaces, namely the four side surfaces 3a, 3b, 3c, 3d and one end surface 3e, as well as on the ridges 3g, 3i, 3j. The electrode portions 5a, 5b, 5c, 5d, 5e, 5g, 5i adjacent to each other are physically linked and electrically connected. The electrode portion 5e covers an end of a corresponding one of the multiple internal electrodes 7. The electrode portion 5e is directly connected to the corresponding internal electrode 7. The external electrode 5 is electrically connected to the corresponding internal electrode 7. 2 to 6, the external electrode 5 includes a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The third electrode layer E3 constitutes the outermost layer of the external electrode 5. Each of the electrode portions 5a, 5b, 5c, 5d, 5e, 5g, and 5i includes the first electrode layer E1, the second electrode layer E2, and the third electrode layer E3.

[0032] As shown in FIG. 2 and FIG. 3, the first electrode layer E1 of the electrode portion 5a is disposed on the side surface 3a. The first electrode layer E1 of the electrode portion 5a covers a partial area of ​​the side surface 3a. The first electrode layer E1 of the electrode portion 5a is in contact with the partial area of ​​the side surface 3a. In the electrode portion 5a, the first electrode layer E1 is in direct contact with the element body 3. The partial area of ​​the side surface 3a is covered by the first electrode layer E1, and the remaining part except for the partial area is exposed from the first electrode layer E1. The partial area of ​​the side surface 3a is located closer to the end face 3e. The first electrode layer E1 of the electrode portion 5a is located on the side surface 3a. The first electrode layer E1 does not have to be formed on the side surface 3a. That is, the first electrode layer E1 does not have to be disposed on the side surface 3a. The second electrode layer E2 of the electrode portion 5a is disposed on the first electrode layer E1 and on the side surface 3a. In the electrode portion 5a, the second electrode layer E2 covers the first electrode layer E and a part of the side surface 3a. In the electrode portion 5a, the second electrode layer E2 is in direct contact with the first electrode layer E and a part of the side surface 3a. In the electrode portion 5a, the second electrode layer E2 directly covers the entire first electrode layer E. In the electrode portion 5a, the second electrode layer E2 indirectly covers the side surface 3a such that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3a. The second electrode layer E2 of the electrode portion 5a is located on the side surface 3a. The second electrode layer E2 of the electrode portion 5a has a greater thickness near both ends in the direction D3 than at the center in the direction D3. The third electrode layer E3 of the electrode portion 5a is disposed on the second electrode layer E2. In the electrode portion 5a, the third electrode layer E3 covers the second electrode layer E2. In the electrode portion 5a, the third electrode layer E3 is in contact with the second electrode layer E2. That is, in the electrode portion 5a, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode portion 5a, the third electrode layer E3 is not in contact with the side surface 3a. The third electrode layer E3 of the electrode portion 5a is located on the side surface 3a. The electrode portion 5a has a thickness greater near both ends in the direction D3 than at the center in the direction D3.

[0033] The first electrode layer E1 of the electrode portion 5b is disposed on the side surface 3b. The first electrode layer E1 of the electrode portion 5b covers a partial region of the side surface 3b. The first electrode layer E1 of the electrode portion 5b is in contact with the partial region of the side surface 3b. In the electrode portion 5b, the first electrode layer E1 is in direct contact with the element body 3. The partial region of the side surface 3b is covered by the first electrode layer E1, and the remaining part except for the partial region is exposed from the first electrode layer E1. The partial region of the side surface 3b is located closer to the end face 3e. The first electrode layer E1 of the electrode portion 5b is located on the side surface 3b. The first electrode layer E1 does not have to be formed on the side surface 3b. That is, the first electrode layer E1 does not have to be disposed on the side surface 3b. The second electrode layer E2 of the electrode portion 5b is disposed on the first electrode layer E1 and on the side surface 3b. In the electrode portion 5b, the second electrode layer E2 covers the first electrode layer E and a part of the side surface 3b. In the electrode portion 5b, the second electrode layer E2 is in direct contact with the first electrode layer E and a part of the side surface 3b. In the electrode portion 5b, the second electrode layer E2 directly covers the entire first electrode layer E. In the electrode portion 5b, the second electrode layer E2 indirectly covers the side surface 3b such that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3b. The second electrode layer E2 of the electrode portion 5b is located on the side surface 3b. The second electrode layer E2 of the electrode portion 5b has a greater thickness near both ends in the direction D3 than at the center in the direction D3. The third electrode layer E3 of the electrode portion 5b is disposed on the second electrode layer E2. In the electrode portion 5b, the third electrode layer E3 covers the second electrode layer E2. In the electrode portion 5b, the third electrode layer E3 is in contact with the second electrode layer E2. That is, in the electrode portion 5b, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode portion 5b, the third electrode layer E3 is not in contact with the side surface 3b. The third electrode layer E3 of the electrode portion 5b is located on the side surface 3b. The electrode portion 5b has a thickness greater near both ends in the direction D3 than at the center in the direction D3.

[0034] "Near both ends in the direction D3" may also include "both ends in the direction D3". Therefore, the second electrode layer E2 of the electrode portion 5a may have a greater thickness at both ends in the direction D3 than at the center in the direction D3. The electrode portion 5a may have a greater thickness at both ends in the direction D3 than at the center in the direction D3. The second electrode layer E2 of the electrode portion 5b may have a greater thickness at both ends in the direction D3 than at the center in the direction D3. The electrode portion 5b may have a greater thickness at both ends in the direction D3 than at the center in the direction D3.

[0035] As shown in FIG. 4 and FIG. 5, the first electrode layer E1 of the electrode portion 5c is disposed on the side surface 3c. The first electrode layer E1 of the electrode portion 5c covers a portion of the side surface 3c. The first electrode layer E1 of the electrode portion 5c is in contact with the portion of the side surface 3c. In the electrode portion 5c, the first electrode layer E1 is in direct contact with the element body 3. The portion of the side surface 3c is covered by the first electrode layer E1, and the remaining portion except for the portion of the side surface 3c is exposed from the first electrode layer E1. The portion of the side surface 3c is located closer to the end surface 3e. The first electrode layer E1 of the electrode portion 5c is located on the side surface 3c. The first electrode layer E1 does not have to be formed on the side surface 3c. That is, the first electrode layer E1 does not have to be disposed on the side surface 3c. The second electrode layer E2 of the electrode portion 5c is disposed on the first electrode layer E1 and on the side surface 3c. In the electrode portion 5c, the second electrode layer E2 covers the first electrode layer E and a part of the side surface 3c. In the electrode portion 5c, the second electrode layer E2 is in direct contact with the first electrode layer E and a part of the side surface 3c. In the electrode portion 5c, the second electrode layer E2 directly covers the entire first electrode layer E. In the electrode portion 5c, the second electrode layer E2 indirectly covers the side surface 3c such that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3c. The second electrode layer E2 of the electrode portion 5c is located on the side surface 3c. The second electrode layer E2 of the electrode portion 5c has a greater thickness near both ends in the direction D2 than at the center in the direction D2. The third electrode layer E3 of the electrode portion 5c is disposed on the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 covers the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 is in contact with the second electrode layer E2. That is, in the electrode portion 5c, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 is not in contact with the side surface 3c. The third electrode layer E3 of the electrode portion 5c is located on the side surface 3c. The electrode portion 5c has a thickness greater near both ends in the direction D2 than at the center in the direction D2.

[0036] The first electrode layer E1 of the electrode portion 5d is disposed on the side surface 3d. The first electrode layer E1 of the electrode portion 5d covers a portion of the side surface 3d. The first electrode layer E1 of the electrode portion 5d is in contact with the portion of the side surface 3d. In the electrode portion 5d, the first electrode layer E1 is in direct contact with the element body 3. The portion of the side surface 3d is covered by the first electrode layer E1, and the remaining portion excluding the portion of the side surface 3d is exposed from the first electrode layer E1. The portion of the side surface 3d is located closer to the end face 3e. The first electrode layer E1 of the electrode portion 5d is located on the side surface 3a. The first electrode layer E1 does not have to be formed on the side surface 3d. That is, the first electrode layer E1 does not have to be disposed on the side surface 3d. The second electrode layer E2 of the electrode portion 5d is disposed on the first electrode layer E1 and on the side surface 3d. In the electrode portion 5d, the second electrode layer E2 covers the first electrode layer E and a part of the side surface 3d. In the electrode portion 5d, the second electrode layer E2 is in direct contact with the first electrode layer E and a part of the side surface 3d. In the electrode portion 5d, the second electrode layer E2 directly covers the entire first electrode layer E. In the electrode portion 5d, the second electrode layer E2 indirectly covers the side surface 3d such that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3d. The second electrode layer E2 of the electrode portion 5d is located on the side surface 3d. The second electrode layer E2 of the electrode portion 5d has a greater thickness near both ends in the direction D2 than at the center in the direction D2. The third electrode layer E3 of the electrode portion 5d is disposed on the second electrode layer E2. In the electrode portion 5d, the third electrode layer E3 covers the second electrode layer E2. In the electrode portion 5d, the third electrode layer E3 is in contact with the second electrode layer E2. That is, in the electrode portion 5d, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode portion 5d, the third electrode layer E3 is not in contact with the side surface 3d. The third electrode layer E3 of the electrode portion 5d is located on the side surface 3d. The electrode portion 5d has a thickness greater near both ends in the direction D2 than at the center in the direction D2.

[0037] "Near both ends in direction D2" may also include "both ends in direction D2". Therefore, the second electrode layer E2 of the electrode portion 5c may have a greater thickness at both ends in the direction D2 than at the center in the direction D2. The electrode portion 5c may have a greater thickness at both ends in the direction D2 than at the center in the direction D2. The second electrode layer E2 of the electrode portion 5d may have a greater thickness at both ends in the direction D2 than at the center in the direction D2. The electrode portion 5d may have a greater thickness at both ends in the direction D2 than at the center in the direction D2.

[0038] The first electrode layer E1 of the electrode portion 5e is disposed on the end surface 3e. The first electrode layer E1 of the electrode portion 5e covers the entire end surface 3e. The first electrode layer E1 of the electrode portion 5e is in contact with the entire end surface 3e. That is, in the electrode portion 5e, the first electrode layer E1 is in direct contact with the end surface 3e. The second electrode layer E2 of the electrode portion 5e is disposed on the first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 covers the entire first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 is in direct contact with the first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 indirectly covers the end surface 3e such that the first electrode layer E1 is located between the second electrode layer E2 and the end surface 3e. The second electrode layer E2 of the electrode portion 5e is located on the end surface 3e. The third electrode layer E3 of the electrode portion 5e is disposed on the second electrode layer E2. In the electrode portion 5e, the third electrode layer E3 covers the entire second electrode layer E2. In the electrode portion 5e, the third electrode layer E3 is in contact with the entire second electrode layer E2. That is, in the electrode portion 5e, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode portion 5e, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode portion 5e is located on the end surface 3e. As shown in Figures 7 and 8, the electrode portion 5e does not need to include the second electrode layer E2. In a configuration in which the electrode portion 5e does not include the second electrode layer E2, the third electrode layer E3 in the electrode portion 5e covers the entire first electrode layer E1 and is in direct contact with the first electrode layer E1. Figures 7 and 8 are diagrams showing cross-sectional configurations of multilayer capacitors according to modified examples of the first embodiment.

[0039] The first electrode layer E1 of the electrode portion 5g is disposed on the edge portion 3g. The first electrode layer E1 of the electrode portion 5g covers the entire edge portion 3g. The first electrode layer E1 of the electrode portion 5g is in contact with the entire edge portion 3g. That is, in the electrode portion 5g, the first electrode layer E1 is in direct contact with the element body 3. The first electrode layer E1 of the electrode portion 5g is located on the edge portion 3g. The first electrode layer E1 does not have to be formed on the edge portion 3g. That is, the first electrode layer E1 does not have to be disposed on the edge portion 3g. The second electrode layer E2 of the electrode portion 5g is disposed on the first electrode layer E1. In the electrode portion 5g, the second electrode layer E2 covers the entire first electrode layer E1. In the electrode portion 5g, the second electrode layer E2 is in direct contact with the first electrode layer E1. In the electrode portion 5g, the second electrode layer E2 indirectly covers the edge portion 3g such that the first electrode layer E1 is located between the second electrode layer E2 and the edge portion 3g. The second electrode layer E2 of the electrode portion 5g is located on the edge portion 3g. The third electrode layer E3 of the electrode portion 5g is disposed on the second electrode layer E2. In the electrode portion 5g, the third electrode layer E3 covers the entire second electrode layer E2. In the electrode portion 5g, the third electrode layer E3 is in contact with the entire second electrode layer E2. That is, in the electrode portion 5g, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode portion 5g, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode portion 5g is located on the edge portion 3g.

[0040] The first electrode layer E1 of the electrode portion 5i is disposed on the ridge portion 3i. The first electrode layer E1 of the electrode portion 5i covers the entire ridge portion 3i. The first electrode layer E1 of the electrode portion 5i is in contact with the entire ridge portion 3i. That is, in the electrode portion 5i, the first electrode layer E1 is in direct contact with the element body 3. The first electrode layer E1 of the electrode portion 5i is located on the ridge portion 3i. The first electrode layer E1 does not have to be formed on the ridge portion 3i. That is, the first electrode layer E1 does not have to be disposed on the ridge portion 3i. The second electrode layer E2 of the electrode portion 5i is disposed on the first electrode layer E1. In the electrode portion 5i, the second electrode layer E2 covers the entire first electrode layer E1. In the electrode portion 5i, the second electrode layer E2 is in direct contact with the first electrode layer E1. In the electrode portion 5i, the second electrode layer E2 indirectly covers the edge portion 3i such that the first electrode layer E1 is located between the second electrode layer E2 and the edge portion 3i. The second electrode layer E2 of the electrode portion 5i is located on the edge portion 3i. The third electrode layer E3 of the electrode portion 5i is disposed on the second electrode layer E2. In the electrode portion 5i, the third electrode layer E3 covers the entire second electrode layer E2. In the electrode portion 5i, the third electrode layer E3 is in contact with the entire second electrode layer E2. That is, in the electrode portion 5i, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode portion 5i, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode portion 5i is located on the edge portion 3i.

[0041] As shown in FIG. 6, in the second electrode layer E2 of each of the electrode portions 5a and 5b, the ratio (TH2 / TH1) of the thickness TH2 at the center in the direction D3 to the thickness TH1 at both ends in the direction D3 is 0.02 to 0.9. The thickness TH1 is defined, for example, by the maximum thickness of the second electrode layer E2 at both ends in the direction D3. The thickness TH2 is defined, for example, by the maximum thickness of the second electrode layer E2 at the center in the direction D3. The thickness TH1 at the electrode portion 5a and the thickness TH1 at the electrode portion 5b may be equal to or different from each other. The thickness TH2 at the electrode portion 5a and the thickness TH2 at the electrode portion 5b may be equal to or different from each other. In the multilayer capacitor C1, for example, the thickness TH1 is 5 to 100 μm and the thickness TH2 is 2 to 90 μm. For example, the thickness TH1 is 50 μm and the thickness TH2 is 20 μm.

[0042] In each of the second electrode layers E2 of the electrode portions 5c and 5d, the ratio (TH4 / TH3) of the thickness TH4 at the center in the direction D2 to the thickness TH3 at both ends in the direction D2 is 0.02 to 0.9. The thickness TH3 is defined, for example, by the maximum thickness of the second electrode layer E2 at both ends in the direction D2. The thickness TH4 is defined, for example, by the maximum thickness of the second electrode layer E2 at the center in the direction D2. The thickness TH3 at the electrode portion 5c and the thickness TH3 at the electrode portion 5d may be equal to or different from each other. The thickness TH4 at the electrode portion 5c and the thickness TH4 at the electrode portion 5d may be equal to or different from each other. The thickness TH1 and the thickness TH3 may be equal to or different from each other. The thickness TH2 and the thickness TH4 may be equal to or different from each other. In the multilayer capacitor C1, for example, the thickness TH3 is 5 to 100 μm and the thickness TH4 is 2 to 90 μm. For example, the thickness TH3 is 50 μm and the thickness TH4 is 20 μm.

[0043] In the multilayer capacitor C1, as described above, the first electrode layer E1 is located on each of the side surfaces 3a, 3b, 3c, 3d, the end surface 3e, and each of the ridges 3g, 3i. The second electrode layer E2 is also located on each of the side surfaces 3a, 3b, 3c, 3d, the end surface 3e, and each of the ridges 3g, 3i. The second electrode layer E2 includes a portion located on the side surfaces 3a, 3b, 3c, 3d, a portion located on the end surface 3e, and a portion located on the ridges 3g, 3i. The second electrode layer E2 extends beyond the edge of the first electrode layer E1 in the portion located on the side surfaces 3a, 3b, 3c, 3d, for example. Therefore, the first electrode layer E1 and the second electrode layer E2 have the following relationship. As shown in (a) of FIG. 9, when the first electrode layer E1 and the second electrode layer E2 are viewed from a direction perpendicular to the side surface 3a, the edge of the first electrode layer E1 is covered. As shown in (b) of FIG. 9, when the first electrode layer E1 and the second electrode layer E2 are viewed from a direction perpendicular to the side surface 3b, the edge of the first electrode layer E1 is covered. As shown in (c) of FIG. 9, when the first electrode layer E1 and the second electrode layer E2 are viewed from a direction perpendicular to the side surface 3c, the edge of the first electrode layer E1 is covered. As shown in (d) of FIG. 9, when the first electrode layer E1 and the second electrode layer E2 are viewed from a direction perpendicular to the side surface 3d, the edge of the first electrode layer E1 is covered. FIG. 9 is a plan view showing the first electrode layer and the second electrode layer.

[0044] The first electrode layer E1 is formed by baking a conductive paste applied to the surface of the element body 3. The conductive paste is applied to a partial region of each of the side surfaces 3a, 3b, 3c, and 3d, one end face 3e, and the ridges 3g, 3i, and 3j. The first electrode layer E1 is formed so as to cover a partial region of each of the side surfaces 3a, 3b, 3c, and 3d, one end face 3e, and the ridges 3g, 3i, and 3j. The first electrode layer E1 is formed by sintering a metal component (metal particles) contained in the conductive paste. The first electrode layer E1 is a sintered metal layer. The first electrode layer E1 is a sintered metal layer formed on the element body 3. In this embodiment, the first electrode layer E1 is a sintered metal layer made of Cu. The first electrode layer E1 may be a sintered metal layer made of Ni. The first electrode layer E1 contains a base metal. The conductive paste contains, for example, particles made of Cu or Ni, a glass component, an organic binder, and an organic solvent. The first electrode layer E1 included in each of the electrode portions 5e, 5g, 5i is integrally formed.

[0045] The second electrode layer E2 is formed by hardening a conductive resin paste applied onto the first electrode layer E1 and the element body 3. The conductive resin paste is applied onto the first electrode layer E1 and onto a portion of each of the side surfaces 3a, 3b, 3c, and 3d. The second electrode layer E2 is formed over the first electrode layer E1 and the element body 3. The second electrode layer E2 is a conductive resin layer that covers the first electrode layer E1. The conductive resin paste contains, for example, a resin, a conductive material, and an organic solvent. The resin is, for example, a thermosetting resin. The conductive material is, for example, metal particles. The metal particles are, for example, silver particles or copper particles. In this embodiment, the second electrode layer E2 contains a plurality of silver particles. The thermosetting resin is, for example, a phenol resin, an acrylic resin, a silicone resin, an epoxy resin, or a polyimide resin. The second electrode layer E2 is in contact with a portion of the ridge portion 3j. The second electrode layer E2 included in each of the electrode portions 5a, 5b, 5c, 5d, 5e, 5g, and 5i is integrally formed.

[0046] The application of the conductive resin paste includes, for example, the following steps. One process includes forming a layer of a predetermined thickness made of conductive resin paste on the base body 3, applying the conductive resin paste to both ends in direction D3 of the layer of the predetermined thickness located on each side 3a, 3b, and applying the conductive resin paste to both ends in direction D2 of the layer of the predetermined thickness located on each side 3c, 3d. Another process includes forming a layer of conductive resin paste having a predetermined thickness on the base body 3, removing a portion of the conductive resin paste located at the center in direction D3 of the layer of the predetermined thickness located on each side 3a, 3b, and removing a portion of the conductive resin paste located at the center in direction D2 of the layer of the predetermined thickness located on each side 3c, 3d. Either process results in a layer made of conductive resin paste on each side 3a, 3b that is thicker near both ends in direction D3 than at the center in direction D3, and a layer made of conductive resin paste on each side 3c, 3d that is thicker near both ends in direction D2 than at the center in direction D2.

[0047] The third electrode layer E3 is formed on the second electrode layer E2 and on the first electrode layer E1 (a portion exposed from the second electrode layer E2) by plating. The third electrode layer E3 may have a multi-layer structure. In this case, the third electrode layer E3 has, for example, a Ni plating layer and a solder plating layer. The Ni plating layer is formed on the second electrode layer E2 and the first electrode layer E1. The solder plating layer is formed on the Ni plating layer. The solder plating layer covers the Ni plating layer. The Ni plating layer has better solder erosion resistance than the metal contained in the second electrode layer E2. The third electrode layer E3 may have a Sn plating layer, a Cu plating layer, or a Au plating layer instead of the Ni plating layer. The solder plating layer includes, for example, a Sn plating layer, a Sn-Ag alloy plating layer, a Sn-Bi alloy plating layer, or a Sn-Cu alloy plating layer. The third electrode layer E3 of each of the electrode portions 5a, 5b, 5c, and 5e is integrally formed.

[0048] In the multilayer capacitor C1, the electrode portion 5a is thicker at both ends in the direction D3 than at the center in the direction D3. Therefore, the external electrode 5 has a shape in which the electrode portion 5a protrudes toward both ends in the direction D3. For example, when the side surface 3a constitutes the mounting surface, the multilayer capacitor C1 reduces the inclination of the multilayer capacitor C1 that may occur when the multilayer capacitor C1 is mounted.

[0049] When the multilayer capacitor C1 is mounted on an electronic device, an external force acting on the multilayer capacitor C1 from the electronic device may act as stress on the element body 3. The external force acts on the element body through the external electrodes 5. The stress tends to concentrate on the edges of the first electrode layer E1 on the mounting surface of the element body 3. When the stress concentrates on the edges of the first electrode layer E1, there is a risk that cracks will occur in the element body 3, starting from the edges of the first electrode layer E1. In the multilayer capacitor C1, when the first electrode layer E1 and the second electrode layer E2 are viewed from a direction perpendicular to the side surface 3a, the second electrode layer E2 covers the edge of the first electrode layer E1. Therefore, for example, when the side surface 3a constitutes the mounting surface, the multilayer capacitor C1 relieves the stress acting on the element body 3. In this case, the edge of the first electrode layer E1 is unlikely to become the starting point of a crack, and cracks are unlikely to occur in the element body 3.

[0050] In the multilayer capacitor C1, the electrode portion 5a includes a second electrode layer E2 having a thickness greater near both ends in the direction D3 than at the center in the direction D3, that is, a thickness TH1 and a thickness TH2. A configuration in which the second electrode layer E2 has thicknesses TH1 and TH2 makes it easier to control the shape of the electrode portion 5a compared to, for example, a configuration in which the first electrode layer E1 has a greater thickness near both ends in direction D3 compared to the center in direction D3.

[0051] The electrode portion 5b includes the second electrode layer E2 having a thickness TH1 and a thickness TH2. Therefore, in the multilayer capacitor C1, it is easy to control the shape of the electrode portion 5b. Each of the electrode portions 5c and 5d includes the second electrode layer E2 having a thickness TH3 and a thickness TH4. Therefore, in the multilayer capacitor C1, it is easy to control the shape of each of the electrode portions 5c and 5d.

[0052] In the second electrode layer E2 included in the electrode portion 5a, when the ratio of the thickness TH2 to the thickness TH1 is greater than 0.9, the difference between the thickness TH1 and the thickness TH2 tends to be small. When the ratio is greater than 0.9, the degree to which the electrode portion 5a protrudes toward both ends in the direction D3 is reduced. Therefore, when the ratio is greater than 0.9, it is difficult to reduce the inclination of the multilayer capacitor C1. In a configuration in which the ratio is less than 0.02, the thickness of the second electrode layer E2 covering the edge of the first electrode layer E1 on the side surface 3a tends to be small. In a configuration in which the ratio is less than 0.02, it is difficult to ensure the thickness of the second electrode layer E2 covering the edge of the first electrode layer E1 on the side surface 3a. Therefore, in a configuration in which the ratio is less than 0.02, it is difficult to alleviate the stress acting on the element body 3. In the second electrode layer E2 included in the electrode portion 5a, the ratio of the thickness TH2 to the thickness TH1 is 0.02 to 0.9. In the second electrode layer E2 included in the electrode portion 5a, the ratio of the thickness TH2 to the thickness TH1 is 0.02 to 0.9. Therefore, the multilayer capacitor C1 reliably relieves the stress acting on the element body 3 while reliably reducing the tilt of the multilayer capacitor C1.

[0053] The electrode portion 5b is thicker at both ends in the direction D3 than at the center in the direction D3. The external electrode 5 has a shape in which the electrode portion 5b protrudes toward both ends in the direction D3. Therefore, even when the side surface 3b constitutes the mounting surface, the multilayer capacitor C1 reduces the inclination of the multilayer capacitor C1 that may occur when the multilayer capacitor C1 is mounted. When the first electrode layer E1 and the second electrode layer E2 are viewed from a direction perpendicular to the side surface 3b, the second electrode layer E2 covers the edge of the first electrode layer E1. Therefore, even when the side surface 3b constitutes a mounting surface, the multilayer capacitor C1 relieves stress acting on the element body 3. In the second electrode layer E2 included in the electrode portion 5b, the ratio of the thickness TH2 to the thickness TH1 is 0.02 to 0.9. Therefore, even when the side surface 3b of the multilayer capacitor C1 constitutes the mounting surface, the inclination of the multilayer capacitor C1 is reliably reduced and the stress acting on the element body 3 is reliably alleviated.

[0054] Each of the electrode portions 5c, 5d is thicker near both ends in the direction D2 than at the center in the direction D2. The external electrode 5 has a shape in which each of the electrode portions 5c, 5d protrudes toward both ends in the direction D2. Therefore, even when one of the side surfaces 3c, 3d constitutes the mounting surface, the multilayer capacitor C1 reduces the inclination of the multilayer capacitor C1 that may occur when the multilayer capacitor C1 is mounted. When the first electrode layer E1 and the second electrode layer E2 are viewed from a direction perpendicular to the side surface 3c, the second electrode layer E2 covers the edge of the first electrode layer E1. When the first electrode layer E1 and the second electrode layer E2 are viewed from a direction perpendicular to the side surface 3d, the second electrode layer E2 covers the edge of the first electrode layer E1. Therefore, even when one of the side surfaces 3c, 3d constitutes the mounting surface, the multilayer capacitor C1 relieves the stress acting on the element body 3. In the second electrode layer E2 included in each of the electrode portions 5c, 5d, the ratio of the thickness TH4 to the thickness TH3 is 0.02 to 0.9. Therefore, even when one of the side surfaces 3c, 3d of the multilayer capacitor C1 constitutes a mounting surface, the multilayer capacitor C1 reliably reduces the inclination of the multilayer capacitor C1 and reliably relieves the stress acting on the element body 3.

[0055] As described above, the external electrode 5 has a shape in which the electrode portions 5a, 5b protrude toward both ends in the direction D3, and the electrode portions 5c, 5d protrude toward both ends in the direction D2. The external electrode 5 includes four protrusions on each of the side surfaces 3a, 3b, 3c, 3d, and the heights of the four protrusions are, for example, equal. "Equal" does not necessarily mean that the values ​​are the same. Even if the values ​​include slight differences, manufacturing errors, or measurement errors within a preset range, the values ​​may be considered to be equal. The height of the protrusions can be specified, for example, by the distance between the corresponding side surface among the side surfaces 3a, 3b, 3c, 3d and a plane that is parallel to the corresponding side surface and contacts the protrusions.

[0056] The external electrode 5 has a shape in which the electrode portions 5a and 5b protrude toward both ends in the direction D3, and the electrode portions 5c and 5d protrude toward both ends in the direction D2. Therefore, any of the side surfaces 3a, 3b, 3c, and 3d can be used as a mounting surface. The multilayer capacitor C1 does not require any particular direction when mounting the multilayer capacitor C1, improving the workability of mounting.

[0057] The first electrode layer E1 covers the end face 3e and the edge portion 3g. The second electrode layer E2 includes a portion located on the side surface 3a, a portion located on the ridge portion 3g, and a portion located on the end surface 3e. Therefore, even in a configuration in which the first electrode layer E1 covers the end surface 3e and the ridge portion 3g, the second electrode layer E2 reliably relieves the stress acting on the element body 3. Even in a configuration in which the first electrode layer E1 is not disposed on the side surface 3a, the second electrode layer E2 reliably relieves the stress acting on the element body 3. The second electrode layer E2 includes a portion located on the side surface 3b, a portion located on the ridge portion 3g, and a portion located on the end surface 3e. Therefore, even when the side surface 3b constitutes the mounting surface, the second electrode layer E2 reliably relieves the stress acting on the element body 3. Even in a configuration in which the first electrode layer E1 is not disposed on the side surface 3b, the second electrode layer E2 reliably relieves the stress acting on the element body 3. The second electrode layer E2 includes a portion located on the side surfaces 3c, 3d, a portion located on the ridge portion 3i, and a portion located on the end surface 3e. Therefore, even if one of the side surfaces 3c, 3d constitutes the mounting surface, the second electrode layer E2 reliably relieves the stress acting on the element body 3. Even in a configuration in which the first electrode layer E1 is not disposed on one of the side surfaces 3c, 3d that constitutes the mounting surface, the second electrode layer E2 reliably relieves the stress acting on the element body 3.

[0058] In the configuration in which the electrode portion 5e does not include the second electrode layer E2, as described above, the third electrode layer E3 included in the electrode portion 5e is in direct contact with the first electrode layer E1. The external electrode 5 forms a current path that does not include the second electrode layer E2. Therefore, the multilayer capacitor C1 reduces the ESR.

[0059] Second Embodiment The configuration of the multilayer capacitor C2 in accordance with the second embodiment will be described with reference to Figs. 10 to 14. Figs. 10 to 14 are diagrams showing the cross-sectional configuration of the multilayer capacitor in accordance with the second embodiment. The multilayer capacitor C2 is generally similar to or the same as the above-mentioned multilayer capacitor C1, but the multilayer capacitor C2 differs from the multilayer capacitor C1 in terms of the configurations of the first electrode layer E1 and the second electrode layer E2. The following mainly describes the differences between the multilayer capacitor C1 and the multilayer capacitor C2.

[0060] The multilayer capacitor C2, like the multilayer capacitor C1, includes a rectangular parallelepiped body 3, a plurality of external electrodes 5, and a plurality of internal electrodes 7. The external electrodes 5 include a plurality of electrode portions 5a, 5b, 5c, 5d, 5e, 5g, and 5i. Each of the electrode portions 5a, 5b, 5c, 5d, 5e, 5g, and 5i includes a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The electrode portion 5e does not need to include the second electrode layer E2, like the electrode portion 5e included in the multilayer capacitor C1.

[0061] 10, 11, and 14, the first electrode layer E1 of the electrode portion 5a is disposed on the side surface 3a. The first electrode layer E1 of the electrode portion 5a has a greater thickness near both ends in the direction D3 than at the center in the direction D3. The electrode portion 5a has a greater thickness toward both ends in the direction D3 than at the center in the direction D3. In the electrode portion 5a, unlike the multilayer capacitor C1, not the second electrode layer E2 but the first electrode layer E1 has a greater thickness toward both ends in the direction D3 than at the center in the direction D3.

[0062] The first electrode layer E1 of the electrode portion 5b is disposed on the side surface 3b. The first electrode layer E1 of the electrode portion 5b has a thickness greater near both ends in the direction D3 than at the center in the direction D3. The electrode portion 5b has a greater thickness toward both ends in the direction D3 than at the center in the direction D3. In the electrode portion 5b, unlike the multilayer capacitor C1, the first electrode layer E1, not the second electrode layer E2, has a greater thickness toward both ends in the direction D3 than at the center in the direction D3.

[0063] 12, 13, and 14, the first electrode layer E1 of the electrode portion 5c is disposed on the side surface 3c. The first electrode layer E1 of the electrode portion 5c has a greater thickness near both ends in the direction D2 than at the center in the direction D2. The electrode portion 5c has a greater thickness toward both ends in the direction D2 than at the center in the direction D2. In the electrode portion 5c, unlike the multilayer capacitor C1, the first electrode layer E1, not the second electrode layer E2, has a greater thickness toward both ends in the direction D2 than at the center in the direction D2.

[0064] The first electrode layer E1 of the electrode portion 5d is disposed on the side surface 3d. The first electrode layer E1 of the electrode portion 5d has a thickness greater near both ends in the direction D2 than at the center in the direction D2. The electrode portion 5d has a greater thickness toward both ends in the direction D2 than at the center in the direction D2. In the electrode portion 5d, unlike the multilayer capacitor C1, the first electrode layer E1, not the second electrode layer E2, has a greater thickness toward both ends in the direction D2 than at the center in the direction D2.

[0065] As described above, "near both ends in the direction D3" may also include "both ends in the direction D3." Thus, in the electrode portion 5a, the first electrode layer E1 may have a greater thickness at both ends in the direction D3 than at the center in the direction D3. In the electrode portion 5b, the first electrode layer E1 may have a greater thickness at both ends in the direction D3 than at the center in the direction D3. As described above, "near both ends in the direction D2" may also include "both ends in the direction D2". Thus, in the electrode portion 5c, the first electrode layer E1 may have a greater thickness at both ends in the direction D2 than at the center in the direction D2. In the electrode portion 5d, the first electrode layer E1 may have a greater thickness at both ends in the direction D2 than at the center in the direction D2.

[0066] In the multilayer capacitor C2, as described above, the first electrode layer E1 is located on each of the side surfaces 3a, 3b, 3c, 3d, on the end surface 3e, and on each of the ridges 3g, 3i. The second electrode layer E2 is located not only on the first electrode layer E1, but also directly on the side surfaces 3a, 3b, 3c, 3d. The second electrode layer E2 includes a portion located on the side surfaces 3a, 3b, 3c, 3d, a portion located on the end surface 3e, and a portion located on the ridges 3g, 3i. The second electrode layer E2 extends beyond the edge of the first electrode layer E1 at the above-mentioned portion located on the side surfaces 3a, 3b, 3c, 3d. Therefore, the first electrode layer E1 and the second electrode layer E2 have the following relationship. In the multilayer capacitor C2, similarly to the multilayer capacitor C1, the first electrode layer E1 and the second electrode layer E2 cover the edge of the first electrode layer E1 when viewed from a direction perpendicular to the side surface 3a (see FIG. 9(a)). The first electrode layer E1 and the second electrode layer E2 cover the edge of the first electrode layer E1 when viewed from a direction perpendicular to the side surface 3b (see FIG. 9(b)). The first electrode layer E1 and the second electrode layer E2 cover the edge of the first electrode layer E1 when viewed from a direction perpendicular to the side surface 3c (see FIG. 9(c)). The first electrode layer E1 and the second electrode layer E2 cover the edge of the first electrode layer E1 when viewed from a direction perpendicular to the side surface 3d (see FIG. 9(d)).

[0067] Regarding the formation of the first electrode layer E1, the application of the conductive paste includes, for example, the following steps. One process includes forming a layer of conductive paste having a predetermined thickness on the base body 3, applying the conductive paste to both ends in direction D3 of the layer of the predetermined thickness located on each side 3a, 3b, and applying the conductive paste to both ends in direction D2 of the layer of the predetermined thickness located on each side 3c, 3d. Another process includes forming a layer of conductive paste having a predetermined thickness on the base body 3, removing a portion of the conductive paste located at the center in direction D3 of the layer of the predetermined thickness located on each side 3a, 3b, and removing a portion of the conductive paste located at the center in direction D2 of the layer of the predetermined thickness located on each side 3c, 3d. Either process results in a layer on each side 3a, 3b made of conductive paste that is thicker toward both ends in direction D3 than at the center in direction D3, and a layer on each side 3c, 3d made of conductive paste that is thicker toward both ends in direction D2 than at the center in direction D2.

[0068] In the multilayer capacitor C2, like the multilayer capacitor C1, the electrode portion 5a is thicker at both ends in the direction D3 than at the center in the direction D3. Therefore, for example, when the side surface 3a constitutes the mounting surface, the multilayer capacitor C2 reduces the inclination of the multilayer capacitor C2 that may occur when the multilayer capacitor C2 is mounted. In the multilayer capacitor C2, similarly to the multilayer capacitor C1, when the first electrode layer E1 and the second electrode layer E2 are viewed from a direction perpendicular to the side surface 3a, the second electrode layer E2 covers the edge of the first electrode layer E1. Therefore, for example, when the side surface 3a constitutes the mounting surface, the multilayer capacitor C2 relieves the stress acting on the element body 3.

[0069] As with the multilayer capacitor C1, the electrode portion 5b is thicker at both ends in the direction D3 than at the center in the direction D3. Therefore, even when the side surface 3b constitutes the mounting surface, the multilayer capacitor C2 reduces the inclination of the multilayer capacitor C2 that may occur when the multilayer capacitor C2 is mounted. When the first electrode layer E1 and the second electrode layer E2 are viewed from a direction perpendicular to the side surface 3b, the second electrode layer E2 covers the edge of the first electrode layer E1. Therefore, even when the side surface 3b constitutes a mounting surface, the multilayer capacitor C2 relieves stress acting on the element body 3.

[0070] Like the multilayer capacitor C1, the thickness of each of the electrode portions 5c, 5d is greater at both ends in the direction D2 than at the center in the direction D2. Therefore, even when one of the side surfaces 3c, 3d constitutes the mounting surface, the multilayer capacitor C2 reduces the inclination of the multilayer capacitor C2 that may occur when the multilayer capacitor C2 is mounted. When the first electrode layer E1 and the second electrode layer E2 are viewed from a direction perpendicular to the side surface 3c, the second electrode layer E2 covers the edge of the first electrode layer E1. When the first electrode layer E1 and the second electrode layer E2 are viewed from a direction perpendicular to the side surface 3d, the second electrode layer E2 covers the edge of the first electrode layer E1. Therefore, even when one of the side surfaces 3c, 3d constitutes the mounting surface, the multilayer capacitor C2 relieves the stress acting on the element body 3.

[0071] In the multilayer capacitor C2, like the multilayer capacitor C1, any of the side surfaces 3a, 3b, 3c, and 3d can be configured as a mounting surface. Therefore, in the multilayer capacitor C2, there is no need to consider directionality when mounting the multilayer capacitor C2, improving the workability of mounting.

[0072] The first electrode layer E1 covers the end face 3e and the side faces 3a, 3b, 3c, and 3d. The second electrode layer E2 includes a portion located on the side surface 3a and a portion located on the end surface 3e. Therefore, the second electrode layer E2 reliably relieves the stress acting on the element body 3 even in a configuration in which the first electrode layer E1 covers the end surface 3e and the side surface 3a. The second electrode layer E2 includes a portion located on the side surface 3b and a portion located on the end surface 3e. Therefore, even when the side surface 3b constitutes the mounting surface, the second electrode layer E2 reliably relieves the stress acting on the element body 3. The second electrode layer E2 includes a portion located on the side surfaces 3c, 3d and a portion located on the end surface 3e. Therefore, even if one of the side surfaces 3c, 3d constitutes the mounting surface, the second electrode layer E2 reliably relieves the stress acting on the element body 3.

[0073] Third embodiment The configuration of the multilayer capacitor C3 in accordance with the third embodiment will be described with reference to Figs. 15 to 20. Fig. 15 is a perspective view of the multilayer capacitor in accordance with the third embodiment. Figs. 16 to 20 are views showing the cross-sectional configuration of the multilayer capacitor in accordance with the third embodiment. The multilayer capacitor C3 is generally similar to or the same as the above-mentioned multilayer capacitor C1, but the multilayer capacitor C3 differs from the multilayer capacitor C1 in terms of the configuration of the external electrodes 5. The following mainly describes the differences between the multilayer capacitor C1 and the multilayer capacitor C3.

[0074] Like the multilayer capacitor C1, the multilayer capacitor C3 includes a rectangular parallelepiped element body 3, a plurality of external electrodes 5, and a plurality of internal electrodes 7. In the multilayer capacitor C3, only the side surface 3a constitutes the mounting surface. The external electrode 5 includes a plurality of electrode portions 5a, 5b, 5c, 5d, 5e, 5g, and 5i. Each of the electrode portions 5a, 5c, 5d, 5e, and 5i includes a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The electrode portion 5b includes the first electrode layer E1 and the third electrode layer E3. The electrode portion 5b does not include the second electrode layer E2. The electrode portion 5g located between the electrode portion 5a and the electrode portion 5e includes the first electrode layer E1, the second electrode layer E2, and the third electrode layer E3. The electrode portion 5g located between the electrode portion 5b and the electrode portion 5e includes the first electrode layer E1 and the third electrode layer E3. The electrode portion 5g located between the electrode portion 5b and the electrode portion 5e does not include the second electrode layer E2.

[0075] As shown in FIG. 16, FIG. 17, and FIG. 20, the second electrode layer E2 of the electrode portion 5a is disposed on the side surface 3a. The second electrode layer E2 of the electrode portion 5a has a greater thickness at both ends in the direction D3 than at the center in the direction D3. The electrode portion 5a has a greater thickness at both ends in the direction D3 than at the center in the direction D3. As shown in FIG. 9(a), the electrode portion 5a covers the edge of the first electrode layer E1 when the first electrode layer E1 and the second electrode layer E2 are viewed from a direction perpendicular to the side surface 3a. As described above, the electrode portion 5a may have a greater thickness at both ends in the direction D3 than at the center in the direction D3. In the electrode portion 5b, the third electrode layer E3 covers the entire first electrode layer E1. In the electrode portion 5b, the third electrode layer E3 is in direct contact with the first electrode layer E1. In the electrode portion 5b, the entire first electrode layer E1 is exposed from the second electrode layer E2. In the electrode portion 5b, the first electrode layer E1 includes only a region exposed from the second electrode layer E2. As shown in Figures 18 to 20, the second electrode layer E2 of the electrode portion 5c is disposed on the side surface 3c. A portion of the area covered by the second electrode layer E2 of the electrode portion 5c is located at a corner of the side surface 3c close to the side surface 3a and the end surface 3e. The corner of the side surface 3c close to the side surface 3b and the end surface 3e is exposed from the second electrode layer E2. The second electrode layer E2 of the electrode portion 5c is located close to the side surface 3a and the end surface 3e. The second electrode layer E2 of the electrode portion 5d is disposed on the side surface 3d. A portion of the area covered by the second electrode layer E2 of the electrode portion 5d is located at a corner of the side surface 3d close to the side surface 3a and the end surface 3e. The corner of the side surface 3d close to the side surface 3b and the end surface 3e is exposed from the second electrode layer E2. The second electrode layer E2 of the electrode portion 5d is located close to the side surface 3a and the end surface 3e.

[0076] As shown in Figs. 16 to 19, the second electrode layer E2 of the electrode portion 5e is disposed on the first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 covers only a partial region of the first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 is in direct contact with the partial region of the first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 indirectly covers a partial region of the end face 3e such that the partial region of the first electrode layer E1 is located between the second electrode layer E2 and the end face 3e. The second electrode layer E2 of the electrode portion 5e is located on the end face 3e. The partial region of the end face 3e is located closer to the side face 3a. The electrode portion 5e includes a region where the first electrode layer E1 is covered by the second electrode layer E2 and a region where the first electrode layer E1 is exposed from the second electrode layer E2. The region where the first electrode layer E1 is covered by the second electrode layer E2 is closer to the side surface 3a than the region where the first electrode layer E1 is exposed from the second electrode layer E2. In the electrode portion 5e, the first electrode layer E1 includes a region where the first electrode layer E1 is covered by the second electrode layer E2 and a region where the first electrode layer E1 is exposed from the second electrode layer E2. In the region where the first electrode layer E1 is exposed from the second electrode layer E2, the first electrode layer E1 is in direct contact with the third electrode layer E3.

[0077] In the electrode portion 5g located between the electrode portion 5a and the electrode portion 5e, the second electrode layer E2 is in direct contact with the first electrode layer E1. In the electrode portion 5g located between the electrode portion 5a and the electrode portion 5e, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode portion 5g located between the electrode portion 5b and the electrode portion 5e, the third electrode layer E3 covers the entire first electrode layer E1. In the electrode portion 5g located between the electrode portion 5b and the electrode portion 5e, the third electrode layer E3 is in direct contact with the first electrode layer E1. In the electrode portion 5g located between the electrode portion 5b and the electrode portion 5e, the entire first electrode layer E1 is exposed from the second electrode layer E2. In the electrode portion 5g located between the electrode portion 5b and the electrode portion 5e, the first electrode layer E1 includes only a region exposed from the second electrode layer E2.

[0078] The second electrode layer E2 of the electrode portion 5i is disposed on the first electrode layer E1. In the electrode portion 5i, the second electrode layer E2 covers only a partial area of ​​the first electrode layer E1. In the electrode portion 5i, the second electrode layer E2 is in direct contact with the partial area of ​​the first electrode layer E1. In the electrode portion 5i, the second electrode layer E2 indirectly covers a partial area of ​​the ridge portion 3i such that the partial area of ​​the first electrode layer E1 is located between the second electrode layer E2 and the ridge portion 3i. The second electrode layer E2 of the electrode portion 5i is located on the ridge portion 3i. The partial area of ​​the ridge portion 3i is located closer to the side surface 3a. The electrode portion 5i includes a region where the first electrode layer E1 is covered by the second electrode layer E2 and a region where the first electrode layer E1 is exposed from the second electrode layer E2. The region where the first electrode layer E1 is covered by the second electrode layer E2 is closer to the side surface 3a than the region where the first electrode layer E1 is exposed from the second electrode layer E2. In the electrode portion 5i, the first electrode layer E1 includes a region where the first electrode layer E1 is covered by the second electrode layer E2 and a region where the first electrode layer E1 is exposed from the second electrode layer E2. In the region where the first electrode layer E1 is exposed from the second electrode layer E2, the first electrode layer E1 is in direct contact with the third electrode layer E3.

[0079] In the multilayer capacitor C3, the electrode portion 5a is thicker at both ends in the direction D3 than at the center in the direction D3, thereby reducing the tilt of the multilayer capacitor C3 that may occur when the multilayer capacitor C3 is mounted. In the multilayer capacitor C3, when the first electrode layer E1 and the second electrode layer E2 are viewed from a direction perpendicular to the side surface 3a, the second electrode layer E2 covers the edge of the first electrode layer E1. Therefore, the multilayer capacitor C3 relieves the stress acting on the element body 3.

[0080] In the multilayer capacitor C3, the first electrode layer E1 included in the electrode portion 5e includes a region covered by the second electrode layer E2 and a region exposed from the second electrode layer E2. The external electrode 5 forms a current path that does not include the second electrode layer E2. Therefore, the multilayer capacitor C3 reduces the ESR.

[0081] (Fourth embodiment) The configuration of the multilayer capacitor C4 in accordance with the fourth embodiment will be described with reference to Figs. 21 to 24. Fig. 21 is a perspective view of the multilayer capacitor in accordance with the fourth embodiment. Figs. 22 to 24 are views showing a cross-sectional configuration of the multilayer capacitor in accordance with the fourth embodiment. The multilayer capacitor C4 is generally similar to or the same as the above-mentioned multilayer capacitor C3, but the multilayer capacitor C4 differs from the multilayer capacitor C3 in terms of the configuration of the external electrodes 5. The following mainly describes the differences between the multilayer capacitor C3 and the multilayer capacitor C4.

[0082] Like the multilayer capacitor C1, the multilayer capacitor C4 includes a rectangular parallelepiped element body 3, a plurality of external electrodes 5, and a plurality of internal electrodes 7. In the multilayer capacitor C4, the side surface 3a or the side surface 3b forms the mounting surface. The external electrode 5 includes a plurality of electrode portions 5a, 5b, 5c, 5d, 5e, 5g, and 5i. Each of the electrode portions 5a, 5b, 5c, 5d, 5e, 5g, and 5i includes a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3.

[0083] As shown in Figures 22 to 24, the second electrode layer E2 of the electrode portion 5a is disposed on the side surface 3a. The second electrode layer E2 of the electrode portion 5a has a greater thickness near both ends in the direction D3 than at the center in the direction D3. The electrode portion 5a has a greater thickness near both ends in the direction D3 than at the center in the direction D3. As shown in Figure 9(a), the electrode portion 5a covers the edge of the first electrode layer E1 when the first electrode layer E1 and the second electrode layer E2 are viewed from a direction perpendicular to the side surface 3a. The second electrode layer E2 of the electrode portion 5b is disposed on the side surface 3b. The second electrode layer E2 of the electrode portion 5b has a greater thickness near both ends in the direction D3 than at the center in the direction D3. The electrode portion 5b has a greater thickness near both ends in the direction D3 than at the center in the direction D3. As shown in FIG. 9(b), the electrode portion 5b covers the edge of the first electrode layer E1 when the first electrode layer E1 and the second electrode layer E2 are viewed from a direction perpendicular to the side surface 3b. As described above, electrode portion 5a may have a greater thickness at both ends in direction D3 than at the center in direction D3. Electrode portion 5b may have a greater thickness at both ends in direction D3 than at the center in direction D3.

[0084] The second electrode layer E2 of the electrode portion 5c is disposed on the side surface 3c. A part of the area covered by the second electrode layer E2 of the electrode portion 5c is located at a corner of the side surface 3c close to the side surface 3a and the end surface 3e, and at a corner of the side surface 3c close to the side surface 3b and the end surface 3e. The second electrode layer E2 of the electrode portion 5c includes a layer portion located at a corner of the side surface 3c close to the side surface 3a and the end surface 3e, and a layer portion located at a corner of the side surface 3c close to the side surface 3b and the end surface 3e. In the electrode portion 5c, the above two layer portions included in the second electrode layer E2 are separated from each other. The side surface 3c is exposed from the second electrode layer E2 between the above two layer portions. The second electrode layer E2 of the electrode portion 5d is disposed on the side surface 3d. A part of the area covered by the second electrode layer E2 of the electrode portion 5d is located at a corner of the side surface 3d close to the side surface 3a and the end surface 3e, and at a corner of the side surface 3d close to the side surface 3b and the end surface 3e. The second electrode layer E2 of the electrode portion 5d includes a layer portion located at a corner of the side surface 3d close to the side surface 3a and the end surface 3e, and a layer portion located at a corner of the side surface 3d close to the side surface 3b and the end surface 3e. In the electrode portion 5d, the above two layer portions included in the second electrode layer E2 are separated from each other. The side surface 3d is exposed from the second electrode layer E2 between the above two layer portions.

[0085] As shown in Figures 22 and 23, the second electrode layer E2 of the electrode portion 5e is disposed on the first electrode layer E1. A portion of the first electrode layer E1 covered by the second electrode layer E2 is located closer to the side surface 3a and closer to the side surface 3b. The second electrode layer E2 of the electrode portion 5e includes a layer portion located closer to the side surface 3a and a layer portion located closer to the side surface 3b. In the electrode portion 5e, the two layer portions included in the second electrode layer E2 are spaced apart from each other. The first electrode layer E1 of the electrode portion 5e is exposed from the second electrode layer E2 between the two layer portions. The electrode portion 5e includes two regions where the first electrode layer E1 is covered by the second electrode layer E2 and a region where the first electrode layer E1 is exposed from the second electrode layer E2. One region where the first electrode layer E1 is covered by the second electrode layer E2 is closer to the side surface 3a than the region where the first electrode layer E1 is exposed from the second electrode layer E2. The other region where the first electrode layer E1 is covered by the second electrode layer E2 is closer to the side surface 3b than the region where the first electrode layer E1 is exposed from the second electrode layer E2.

[0086] The second electrode layer E2 of the electrode portion 5i is disposed on the first electrode layer E1. A portion of the first electrode layer E1 covered by the second electrode layer E2 is located closer to the side surface 3a and closer to the side surface 3b. The second electrode layer E2 of the electrode portion 5i includes a layer portion located closer to the side surface 3a and a layer portion located closer to the side surface 3b. In the electrode portion 5i, the two layer portions included in the second electrode layer E2 are spaced apart from each other. The first electrode layer E1 of the electrode portion 5i is exposed from the second electrode layer E2 between the two layer portions. The electrode portion 5i includes two regions where the first electrode layer E1 is covered by the second electrode layer E2 and a region where the first electrode layer E1 is exposed from the second electrode layer E2. One region where the first electrode layer E1 is covered by the second electrode layer E2 is closer to the side surface 3a than the region where the first electrode layer E1 is exposed from the second electrode layer E2. The other region where the first electrode layer E1 is covered by the second electrode layer E2 is closer to the side surface 3b than the region where the first electrode layer E1 is exposed from the second electrode layer E2.

[0087] In the multilayer capacitor C4, the thickness of each of the electrode portions 5a, 5b is greater at both ends in the direction D3 than at the center in the direction D3. Therefore, even when one of the side surfaces 3a, 3b constitutes the mounting surface, the multilayer capacitor C4 reduces the inclination of the multilayer capacitor C4 that may occur when the multilayer capacitor C4 is mounted. In the multilayer capacitor C4, when the first electrode layer E1 and the second electrode layer E2 are viewed from a direction perpendicular to the side surface 3a, the second electrode layer E2 covers the edge of the first electrode layer E1. When the first electrode layer E1 and the second electrode layer E2 are viewed from a direction perpendicular to the side surface 3b, the second electrode layer E2 covers the edge of the first electrode layer E1. Therefore, even when one of the side surfaces 3a and 3b constitutes the mounting surface, the multilayer capacitor C4 relieves the stress acting on the element body 3.

[0088] In the multilayer capacitor C4, the first electrode layer E1 included in the electrode portion 5e includes two regions covered by the second electrode layer E2 and a region exposed from the second electrode layer E2. The external electrode 5 forms a current path that does not include the second electrode layer E2. Therefore, the multilayer capacitor C4 reduces the ESR.

[0089] Fifth embodiment An electronic component device according to a fifth embodiment will be described with reference to Fig. 25 and Fig. 26. Fig. 25 and Fig. 26 are diagrams showing a cross-sectional configuration of the electronic component device according to the fifth embodiment.

[0090] The electronic component device includes a multilayer capacitor C1 and an electronic device ED. The electronic device ED is, for example, a circuit board or another electronic component. The multilayer capacitor C1 is solder-mounted to the electronic device ED. The electronic device ED includes a main surface EDa and two pad electrodes PE. Each pad electrode PE is disposed on the main surface EDa. The two pad electrodes PE are spaced apart from each other. The multilayer capacitor C1 is disposed on the electronic device ED such that the side surface 3a and the main surface EDa face each other. As shown in FIG. 19, the electrode portion 5a is substantially in contact with the pad electrode PE near both ends in the direction D3. As shown in FIG. 20, the electrode portion 5a is spaced apart from the pad electrode PE at the center in the direction D3. When the multilayer capacitor C1 is solder-mounted, molten solder wets and rises up the external electrodes 5 (third electrode layers E3). When the wetted solder solidifies, solder fillets SF are formed on the external electrodes 5. The corresponding external electrodes 5 and pad electrodes PE are connected via the solder fillets SF. The electronic component device may include a multilayer capacitor C2, a multilayer capacitor C3, or a multilayer capacitor C4 instead of the multilayer capacitor C1.

[0091] In this specification, when an element is described as being disposed on another element, the element may be directly disposed on the other element or indirectly disposed on the other element. When an element is indirectly disposed on another element, an intervening element is present between the element and the other element. When an element is directly disposed on the other element, an intervening element is not present between the element and the other element. In this specification, when an element is described as being located on another element, the element may be directly located on the other element or indirectly located on the other element. When an element is indirectly located on another element, an intervening element is present between the element and the other element. When an element is directly located on the other element, an intervening element is not present between the element and the other element. In this specification, when an element is described as covering another element, the element may directly cover the other element or may indirectly cover the other element. When an element indirectly covers another element, an intervening element is present between the element and the other element. When an element directly covers another element, an intervening element is not present between the element and the other element.

[0092] The above describes the embodiments and modifications of the present invention, but the present invention is not necessarily limited to the above-described embodiments and modifications, and various modifications are possible without departing from the spirit of the present invention.

[0093] In the multilayer capacitors C1, C3, and C4, each of the electrode portions 5a, 5b, 5c, and 5d may include a first electrode layer E1. In the multilayer capacitors C3 and C4, instead of the second electrode layer E2 having a greater thickness near both ends in the direction D3 than the center in the direction D3, the first electrode layer E1 may have a greater thickness near both ends in the direction D3 than the center in the direction D3. Each of the first electrode layer E1 and the second electrode layer E2 may have a greater thickness near both ends in the direction D3 than the center in the direction D3. In the multilayer capacitors C1 and C2, each of the first electrode layer E1 and the second electrode layer E2 may have a greater thickness near both ends in the direction D3 than at the center in the direction D3. Each of the first electrode layer E1 and the second electrode layer E2 may have a greater thickness near both ends in the direction D2 than at the center in the direction D2.

[0094] In the present embodiment and the modified example, a multilayer capacitor has been described as an example of an electronic component, but applicable electronic components are not limited to multilayer capacitors. Applicable electronic components include, for example, multilayer electronic components such as multilayer inductors, multilayer varistors, multilayer piezoelectric actuators, multilayer thermistors, multilayer solid-state battery components, and multilayer composite components, or electronic components other than multilayer electronic components.

[0095] As will be understood from the above description of the embodiments and modifications, this specification includes disclosure of the following aspects. (Appendix 1) an element body having a rectangular parallelepiped shape and including an end face, a first side face adjacent to the end face, and second and third side faces adjacent to the end face and the first side face and facing each other; an external electrode including a sintered metal layer and a conductive resin layer and disposed on the element body; When the sintered metal layer and the conductive resin layer are viewed from a direction perpendicular to the first side surface, the conductive resin layer covers an edge of the sintered metal layer, the external electrode includes an electrode portion located on the first side surface, An electronic component, wherein the electrode portion has a thickness greater toward both ends in the direction in which the second and third side surfaces face each other than a center in the direction in which the second and third side surfaces face each other. (Appendix 2) The electronic component described in Appendix 1, wherein the electrode portion located on the first side includes the conductive resin layer having a thickness greater toward both ends in the direction in which the second and third side faces than at a center in the direction in which the second and third side faces. (Appendix 3) The electronic component described in Appendix 2, wherein the ratio of the thickness of the conductive resin layer at the center in the direction in which the second and third side surfaces oppose to the thickness at both ends in the direction in which the second and third side surfaces oppose is 0.02 to 0.9. (Appendix 4) the element body includes a fourth side surface opposite to the first side surface, When the sintered metal layer and the conductive resin layer are viewed from a direction perpendicular to the second side surface, the conductive resin layer covers an edge of the sintered metal layer, When the sintered metal layer and the conductive resin layer are viewed from a direction perpendicular to the third side surface, the conductive resin layer covers an edge of the sintered metal layer, When the sintered metal layer and the conductive resin layer are viewed from a direction perpendicular to the fourth side surface, the conductive resin layer covers an edge of the sintered metal layer, the external electrode includes an electrode portion located on the second side surface, an electrode portion located on the third side surface, and an electrode portion located on the fourth side surface, the electrode portion located on the second side surface and the electrode portion located on the third side surface each have a thickness greater near both ends in the direction in which the first and fourth side surfaces face each other than a center in the direction in which the first and fourth side surfaces face each other, An electronic component described in any one of Appendices 1 to 4, wherein the electrode portion located on the fourth side surface has a thickness greater toward both ends in the direction in which the second and third side surfaces oppose each other than a center in the direction in which the second and third side surfaces oppose each other. (Appendix 5) each of the electrode portion located on the second side surface and the electrode portion located on the third side surface includes the conductive resin layer having a thickness greater toward both ends in the direction in which the first and fourth side surfaces face each other than a center in the direction in which the first and fourth side surfaces face each other; The electronic component described in Appendix 4, wherein the electrode portion located on the fourth side surface includes the conductive resin layer having a thickness greater toward both ends in the direction in which the second and third side surfaces oppose each other than a center in the direction in which the second and third side surfaces oppose each other. (Appendix 6) the conductive resin layer included in each of the electrode portion located on the second side surface and the electrode portion located on the third side surface has a ratio of a thickness at a center in the direction in which the first and fourth side surfaces face each other to a thickness near both ends in the direction in which the first and fourth side surfaces face each other of 0.02 to 0.9; The electronic component described in Appendix 5, wherein in the conductive resin layer included in the electrode portion located on the fourth side surface, a ratio of a thickness at the center in the direction in which the second and third side surfaces oppose to a thickness near both ends in the direction in which the second and third side surfaces oppose is 0.02 to 0.9. (Appendix 7) The sintered metal layer covers the end surface and a ridge portion between the end surface and the first side surface, The electronic component described in any one of Appendix 1 to Appendix 6, wherein the conductive resin layer includes a portion located on the first side surface, a portion located on the ridge portion, and a portion located on the end surface. (Appendix 8) The sintered metal layer covers the end surface and the first side surface, 7. The electronic component according to claim 1, wherein the conductive resin layer includes a portion located on the first side surface and a portion located on the end surface. (Appendix 9) The sintered metal layer includes a sintered metal layer located on the end surface, The electronic component described in Appendix 7 or 8, wherein the sintered metal layer located on the end surface includes an area covered by the conductive resin layer and an area exposed from the conductive resin layer. [Explanation of symbols]

[0096] 3...element body, 3a,3b,3c,3d...side surface, 3e...end surface, 5...external electrode, C1,C2,C3,C4...multilayer capacitor, D1,D2,D3...direction, E1...first electrode layer, E2...second electrode layer.

Claims

1. an element body having a rectangular parallelepiped shape and including an end face, a first side face adjacent to the end face, and second and third side faces adjacent to the end face and the first side face and facing each other; an external electrode including a sintered metal layer and a conductive resin layer and disposed on the element body; When the sintered metal layer and the conductive resin layer are viewed from a direction perpendicular to the first side surface, the conductive resin layer covers an edge of the sintered metal layer, the external electrode includes an electrode portion located on the first side surface, An electronic component, wherein the electrode portion has a thickness greater toward both ends in the direction in which the second and third side surfaces face each other than a center in the direction in which the second and third side surfaces face each other.

2. The electronic component according to claim 1, wherein the electrode portion located on the first side includes a conductive resin layer having a thickness greater toward both ends in the direction in which the second and third side faces than at a center in the direction in which the second and third side faces.

3. The electronic component according to claim 2, wherein the ratio of the thickness of the conductive resin layer at the center in the direction in which the second and third side surfaces face each other to the thickness at both ends in the direction in which the second and third side surfaces face each other is 0.02 to 0.

9.

4. the element body includes a fourth side surface opposite to the first side surface, When the sintered metal layer and the conductive resin layer are viewed from a direction perpendicular to the second side surface, the conductive resin layer covers an edge of the sintered metal layer, When the sintered metal layer and the conductive resin layer are viewed from a direction perpendicular to the third side surface, the conductive resin layer covers an edge of the sintered metal layer, When the sintered metal layer and the conductive resin layer are viewed from a direction perpendicular to the fourth side surface, the conductive resin layer covers an edge of the sintered metal layer, the external electrode includes an electrode portion located on the second side surface, an electrode portion located on the third side surface, and an electrode portion located on the fourth side surface, the electrode portion located on the second side surface and the electrode portion located on the third side surface each have a thickness greater at both ends in the direction in which the first and fourth side surfaces face each other than a center in the direction in which the first and fourth side surfaces face each other, The electronic component according to claim 1 , wherein the electrode portion located on the fourth side surface has a thickness greater toward both ends in the direction in which the second and third side surfaces face each other than a center in the direction in which the second and third side surfaces face each other.

5. each of the electrode portion located on the second side surface and the electrode portion located on the third side surface includes the conductive resin layer having a thickness greater toward both ends in the direction in which the first and fourth side surfaces face each other than a center in the direction in which the first and fourth side surfaces face each other; The electronic component according to claim 4, wherein the electrode portion located on the fourth side includes a conductive resin layer having a thickness greater toward both ends in the direction in which the second and third side faces than at a center in the direction in which the second and third side faces.

6. the conductive resin layer included in each of the electrode portion located on the second side surface and the electrode portion located on the third side surface has a ratio of a thickness at a center in the direction in which the first and fourth side surfaces face each other to a thickness near both ends in the direction in which the first and fourth side surfaces face each other of 0.02 to 0.9; The electronic component of claim 5, wherein in the conductive resin layer including the electrode portion located on the fourth side surface, the ratio of the thickness at the center in the direction in which the second and third side surfaces oppose to the thickness near both ends in the direction in which the second and third side surfaces oppose is 0.02 to 0.

9.

7. The sintered metal layer covers the end surface and a ridge portion between the end surface and the first side surface, The electronic component according to claim 1 , wherein the conductive resin layer includes a portion located on the first side surface, a portion located on the ridge portion, and a portion located on the end surface.

8. The sintered metal layer covers the end surface and the first side surface, The electronic component according to claim 1 , wherein the conductive resin layer includes a portion located on the first side surface and a portion located on the end surface.

9. The sintered metal layer includes a sintered metal layer located on the end surface, The electronic component according to claim 7 or 8, wherein the sintered metal layer located on the end surface includes a region covered with the conductive resin layer and a region exposed from the conductive resin layer.

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