Shake correction device and imaging apparatus

Abstract

To provide a shake correction device that corrects an image shake by moving a movable member including an imaging element and an imaging apparatus including the shake correction device.SOLUTION: In a shake correction device 1 having a magnet M and a Hall element h3 for position detection, and an FPC substrate 70 that connects a movable member 2 to which an imaging element 20 is attached and a fixed member 3, the FPC substrate 70 is disposed between the Hall element h3 and the magnet M.SELECTED DRAWING: Figure 16

Description

[Technical field]

[0001] The present invention relates to a blur correction device for correcting image blur, and an imaging apparatus equipped with the blur correction device. [Background technology]

[0002] Patent Document 1 discloses a shake correction device having a movable part having an imaging element, upper and lower fixed parts, and a flexible board that electrically connects the imaging element and a control board. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2021-135401 A Summary of the Invention

[0004] One embodiment of the technique of the present disclosure provides a blur correction device that corrects image blur by moving a movable member including an imaging element, and an imaging device including this blur correction device. [Means for solving the problem]

[0005] A first aspect of the present invention is a motion compensation device having a magnet and a Hall element for position detection, and a flexible substrate connecting a movable member to which an imaging element is attached and a fixed member, in which the flexible substrate is disposed between the Hall element and the magnet.

[0006] A second aspect of the present invention provides the image stabilizer of the first aspect, wherein the flexible substrate is a flexible substrate that supplies power to the imaging element.

[0007] The image stabilization device according to the third aspect of the present invention is the same as that of the second aspect, but has, in addition to the flexible board for supplying power, a flexible board for data communication for communicating imaging data with the imaging element, and a flexible board for drive signals for sending drive signals to the movable member.

[0008] A blur correction device according to a fourth aspect of the present invention is any one of the first to third aspects, in which the flexible substrate has a tilt portion, and when the imaging element is viewed from the optical axis direction, the Hall element and the tilt portion have an overlapping region where they at least partially overlap.

[0009] A fifth aspect of the present invention relates to the image stabilizer of the fourth aspect, wherein the tilt portion is connected obliquely to the connector portion.

[0010] A sixth aspect of the present invention is a blur correction device in any one of the first to fifth aspects, in which the flexible substrate has a slit, and when the imaging element is viewed from the optical axis direction, at least a part of the Hall element is arranged between the slits.

[0011] A blur correction device according to a seventh aspect of the present invention is any one of the first to sixth aspects, in which the Hall element is disposed within the area of ​​the imaging element when the imaging element is viewed from the optical axis direction.

[0012] An eighth aspect of the present invention provides the image stabilizer of the seventh aspect, wherein the Hall element is disposed within a pixel region of the imaging element.

[0013] A ninth aspect of the present invention is directed to a blur correction device, wherein in the first aspect, the flexible substrate has first wiring that causes a current to flow in a first direction and second wiring that causes a current to flow in a second direction, and the first wiring and second wiring are arranged alternately.

[0014] A tenth aspect of the present invention is a motion compensation device according to the first or second aspect, wherein the flexible substrate has a first wiring section that collects first wirings that carry a current in a first direction, and a second wiring section that collects second wirings that carry a current in a second direction, and the first wiring section and the second wiring section are arranged adjacent to each other.

[0015] An eleventh aspect of the present invention relates to the image stabilizer of the tenth aspect, wherein the first wiring portion is disposed at a position farther away from the Hall element than the second wiring portion is.

[0016] A twelfth aspect of the present invention relates to the image stabilizer of the eleventh aspect, wherein the flexible substrate has a slit portion in a region where the second wiring portion is arranged.

[0017] An imaging device according to a first aspect of the present invention includes a motion compensation device according to any one of the first to twelfth aspects, and an optical system that forms an optical image of a subject on an imaging element. [Brief description of the drawings]

[0018] [Figure 1] FIG. 1 is a diagram showing a schematic configuration of a camera as an embodiment of an imaging device. [Diagram 2] FIG. 2 is a functional block diagram showing one embodiment of the internal configuration of the camera. [Diagram 3] FIG. 3 is a perspective view of the image stabilization device as viewed from the front side. [Figure 4] FIG. 4 is a perspective view of the image stabilization device as viewed from the rear side. [Diagram 5] FIG. 5 is an exploded perspective view of the fixing member of the image stabilization device as viewed from the front side. [Figure 6] FIG. 6 is a perspective view of the movable member of the image stabilization device as viewed from the front side. [Figure 7] FIG. 7 is a perspective view of the movable member as viewed from the rear side. [Figure 8] FIG. 8 is a perspective view of the FPC board and the yoke of the movable member. [Figure 9] FIG. 9 is a perspective view of the yoke as viewed from the front side. [Figure 10] FIG. 10 is a perspective view of the movable member to which the FPC board is connected. [Figure 11] FIG. 11 is a diagram for explaining the strength of the magnetic field in the Z direction calculated by Ampere's law. [Figure 12] FIG. 12 is an explanatory diagram showing an example of a pattern arrangement of an FPC board for reducing the strength of a magnetic field. [Figure 13] FIG. 13 is an explanatory diagram showing a pattern arrangement of an FPC board for reducing the strength of a magnetic field. [Figure 14] FIG. 14 is an explanatory diagram showing a pattern arrangement of an FPC board for reducing the strength of a magnetic field. [Figure 15] FIG. 15 is a graph showing the relationship between the Hall output and the BIS movable distance. [Figure 16] FIG. 16 is an explanatory diagram for explaining design requirements for disposing an FPC board between a Hall element and a magnet. [Figure 17] FIG. 17 is an explanatory diagram comparing the image stabilization device of the embodiment with a image stabilization device of a comparative example. [Figure 18] FIG. 18 is an explanatory diagram showing the arrangement position of the Hall element with respect to the imaging element. [Figure 19] FIG. 19 is an explanatory diagram showing an arrangement in which the tilt portion and the Hall element are overlapped when viewed from the Z direction. [Figure 20] FIG. 20 is a diagram of the FPC board in which the slits are formed, viewed from the rear surface side. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0020] FIG. 1 is a diagram showing a schematic configuration of a digital camera 100 which is an embodiment of an imaging apparatus of the present invention.

[0021] 1 is composed of a camera body 102 and a lens 104 provided on the camera body 102. The camera 100 in this example is a camera in which the lens 104 is detachable (replaceable) from the camera body 102, but may also be a camera with an integrated lens.

[0022] The camera 100 comprises a camera body 102 and a lens 104 that includes imaging optics 106 .

[0023] The camera body 102 includes a blur correction device 1, an image sensor driver 108 that drives the image sensor 20, an analog front end (AFE) 110, an image processing unit 112, a motion detection sensor 114, an operation unit 116, a display unit 118, and a system control unit 120 that provides overall control of the entire camera 100.

[0024] The motion compensation device 1 includes a movable member 2 including an imaging element 20, and a fixed member 3 that movably supports the movable member 2. The motion compensation device 1 is an example of the motion compensation device of the present invention.

[0025] The imaging optical system 106 includes a lens group and an aperture, and forms an optical image of a subject on the imaging element 20 by moving a part or the entire lens group along an optical axis.

[0026] The imaging element 20 captures an image of a subject through an imaging optical system 106, and includes a semiconductor chip on which a Complementary Metal Oxide Semiconductor (CMOS) image sensor or a Charge Coupled Device (CCD) image sensor is formed, and a package that houses the semiconductor chip.

[0027] As will be described later, the light receiving surface 20A (see FIG. 3) of the image sensor 20 is configured in a rectangular shape. Note that the light receiving surface 20A refers to a pixel region T1 (see FIG. 18) of the image sensor 20, and is an area smaller in surface area than a region T2 of the image sensor 20 including a package.

[0028] The image stabilization device 1 includes a movable member 2 including an image sensor 20, and a fixed member 3 that supports the movable member 2 and is fixed to a camera body 102. The fixed member 3 supports the movable member 2 movably within a plane that intersects with the optical axis K of the image sensor 20. In this embodiment, the movable member 2 is supported movably within a plane that is perpendicular to the optical axis K of the image sensor 20. The term "perpendicular" includes a range that is recognized as being substantially perpendicular.

[0029] The image blur correction device 1 corrects image blur in an image captured by the image sensor 20 by moving the light receiving surface 20A of the image sensor 20 within a plane perpendicular to the optical axis K of the image sensor 20 (within a plane intersecting the optical axis K). The optical axis K of the image sensor 20 is a virtual straight line that passes through the center P of the light receiving surface 20A of the image sensor 20 and is perpendicular to the light receiving surface 20A.

[0030] In this specification, a state in which the optical axis OA of the imaging optical system 106 and the optical axis K of the imaging element 20 are coaxially positioned is defined as a reference state. In the reference state, the center P of the light receiving surface 20A of the imaging element 20 is positioned on the optical axis OA of the imaging optical system 106.

[0031] A detailed configuration of the image blur correction device 1 will be described later, but in the above-mentioned reference state, the image blur is corrected by moving a movable member 2 including the image sensor 20 relative to a fixed member 3 in three directions: direction X which is the longitudinal direction of the light receiving surface 20A of the image sensor 20, direction Y which is the lateral direction of the light receiving surface 20A, and direction θ which is a direction around the optical axis (a rotational direction about the optical axis K).

[0032] The AFE 110 performs predetermined analog signal processing on the image signal output from the image sensor 20, converts it into a digital signal, and outputs it.

[0033] The image processing unit 112 performs digital signal processing on the imaging signal processed by the AFE 110 to generate captured image data.

[0034] The motion detection sensor 114 is a sensor for detecting the motion of the camera 100 (camera body 102), and is configured by an acceleration sensor or an angular velocity sensor, or both of these.

[0035] The system control unit 120 controls the image sensor driving unit 108 and the AFE 110 to cause the image sensor 20 to capture an image of a subject and to cause the image sensor 20 to output an image signal corresponding to the subject image.

[0036] An operation unit 116 includes various operation members such as a release switch for operating the timing of driving a shutter (not shown), a user interface unit for setting various settings such as the shooting mode for the camera 100, and a power switch.

[0037] Display unit 118 is provided on the rear surface of camera body 102, and displays live view images, playback images, information (menus) related to operations, etc. A user interface unit (not shown) of operation unit 116 also includes a touch panel disposed on top of display unit 118.

[0038] The system control unit 120 controls the image stabilization device 1 based on the motion information of the camera 100 detected by the motion detection sensor 114. The system control unit 120 controls the movement of the movable member 2 including the image sensor 20, and corrects image blur in the image captured by the image sensor 20 by moving the light receiving surface 20A of the image sensor 20 in at least one of the directions X, Y, and θ.

[0039] When the shake correction function is ON and no motion of the camera 100 is detected by the motion detection sensor 114, the system control unit 120 controls the operation of the shake correction device 1 so that the position of the light receiving surface 20A of the image sensor 20 becomes the position in the above-mentioned reference state. Note that when the shake correction function is OFF, the system control unit 120 controls the operation of the shake correction device 1 so that the position of the light receiving surface 20A of the image sensor 20 maintains the position in the above-mentioned reference state.

[0040] (Processor) In the above embodiment, the hardware structure of the processing units that execute various processes in the image sensor driving unit 108, the AFE 110, the image processing unit 112, and the system control unit 120 is various processors as follows:

[0041] Various types of processors include a CPU (Central Processing Unit), which is a general-purpose processor that executes software (programs) and functions as various processing units, a Programmable Logic Device (PLD), which is a processor whose circuit configuration can be changed after manufacture, such as an FPGA (Field Programmable Gate Array), and a dedicated electrical circuit, such as an ASIC (Application Specific Integrated Circuit), which is a processor having a circuit configuration designed specifically to execute a specific process.

[0042] A single processing unit may be configured with one of these various processors, or may be configured with two or more processors of the same or different types (e.g., multiple FPGAs, or a combination of a CPU and an FPGA). Also, multiple processing units may be configured with a single processor.

[0043] As an example of configuring multiple processing units with one processor, first, there is a form in which one processor is configured with a combination of one or more CPUs and software, as typified by a computer such as a client or server, and this processor functions as multiple processing units. Second, there is a form in which a processor is used that realizes the functions of the entire system including multiple processing units with one IC (Integrated Circuit) chip, as typified by a system on chip (SoC). In this way, the various processing units are configured using one or more of the above various processors as a hardware structure.

[0044] Furthermore, the hardware structure of these various processors is, more specifically, an electric circuit that combines circuit elements such as semiconductor elements.

[0045] The above configurations and functions can be realized by any hardware, software, or a combination of both. For example, the present invention can be applied to a program that causes a computer to execute the above processing steps (processing procedures), a computer-readable recording medium (non-transitory recording medium) that records such a program, or a computer in which such a program can be installed.

[0046] FIG. 2 is a functional block diagram showing a schematic configuration of the image stabilization device 1 in the camera 100 shown in FIG.

[0047] As shown in FIG. 2, the image stabilization device 1 includes a movable member 2 that is movable in each of directions X, Y, and θ, and a fixed member 3 that supports the movable member 2 so that it is movable in each of directions X, Y, and θ.

[0048] The movable member 2 has a circuit board 22 on which the imaging element 20 is attached (mounted), an X-axis / rotational drive coil C1, an X-axis / rotational drive coil C2, and a Y-axis drive coil C3.

[0049] The movable member 2 also has Hall elements h1, h2, and h3 that constitute a Hall sensor for detecting position. Output signals from the Hall elements h1, h2, and h3 are input to a system control unit 120 (see FIG. 1). The system control unit 120 controls the control currents flowing through the coils C1, C2, and C3 based on the output signals from the Hall elements h1, h2, and h3, respectively, to move the movable member 2 and correct image blur.

[0050] The fixed member 3 has yokes 3A and 3B as described below. The yoke 3A has a magnet Mv1 for X-axis and rotational drive, a magnet Mv2 for X-axis and rotational drive, and a magnet Mv3 for Y-axis drive (see FIG. 5). The yoke 3B is disposed at a position facing the magnets Mv1, Mv2, and Mv3 (see FIG. 5).

[0051] Fig. 3 is a perspective view of the motion compensation device 1 as viewed from the front side (hereinafter abbreviated as "front side") of camera body 102. Fig. 4 is a perspective view of the motion compensation device 1 as viewed from the rear side (hereinafter abbreviated as "rear side") of camera body 102. As shown in Figs. 3 and 4, the motion compensation device 1 includes a movable member 2 and a fixed member 3.

[0052] The image stabilization device 1 includes a movable member 2 to which a circuit board 22 on which an image sensor 20 is mounted is fixed, and a fixed member 3 having yokes 3A and 3B.

[0053] The yoke 3A is disposed on the rear side of the movable member 2. The yoke 3B is disposed on the front side of the movable member 2. With the movable member 2 sandwiched between the yoke 3A and the yoke 3B, the yoke 3A and the yoke 3B are fixed to each other by a plurality of screws 4.

[0054] The image stabilizer 1 is fixed to the camera body 102 with the light receiving surface 20A of the image sensor 20 facing the imaging optical system 106 (see FIG. 1). In FIG. 3, a rectangular pixel region T1 of the light receiving surface 20A is indicated by a dashed line.

[0055] The image blur correction device 1 corrects image blur by moving the movable member 2 in a direction θ around the optical axis, in a direction X which is the longitudinal direction of the light receiving surface 20A, and in a direction Y which is the lateral direction of the light receiving surface 20A.

[0056] In the following description, a direction parallel to the optical axis K of the image sensor 20 is referred to as direction Z. In this embodiment, the movable member 2 moves along a plane (XY plane) that perpendicularly intersects with the optical axis K (direction Z). Note that the Z(+) direction of direction Z indicates the direction toward the front side, and the Z(-) direction indicates the direction toward the back side.

[0057] The movable member 2 can move from the reference state by the same distance in each of the X(+) direction (leftward) and the X(-) direction (rightward) of the X direction. Note that the X(+) direction and the X(-) direction refer to the directions when the camera 100 is viewed from the rear side. The same applies below.

[0058] The movable member 2 is movable from the reference state by the same distance in both the Y(+) direction (upward) and the Y(-) direction (downward) of the Y direction.

[0059] The movable member 2 is rotatable from a reference state by the same angle in one direction (right-handed rotation direction) and the other direction (left-handed rotation direction) of the direction θ.

[0060] In the camera 100 shown in FIG. 1, a posture in which the direction Y shown in FIG. 3 is parallel to the direction of gravity is regarded as a normal posture (a posture for taking a landscape shot).

[0061] FIG. 5 is an exploded perspective view of the fixed member 3 (yokes 3A, 3B) of the motion compensation device 1 shown in FIGS. 3 and 4, viewed from the front side.

[0062] As shown in Fig. 5, the yoke 3A has a plate-shaped base 10 having a plane perpendicular to the direction Z. The base 10 has through holes 12 for inserting and arranging three FPC boards (Flexible Printed Circuits) 50, 60, and 70 (see Fig. 4). The FPC boards 50, 60, and 70 are FPC boards that connect between the movable member 2 and the yoke 3A, and are an example of the flexible board of the present invention.

[0063] The yoke 3B is configured in an inverted L-shape when viewed from the front side. The yoke 3B is configured in an inverted L-shape with the X(+) direction side and the Y(-) direction side being open when viewed from the front side.

[0064] Magnets Mv1 and Mv2 are fixed to the surface of the portion extending along the direction Y on the front side of the yoke 3A with a gap therebetween.

[0065] A magnet Mv3 is fixed to the surface of a portion extending along the direction X on the front side of the yoke 3A.

[0066] In order to prevent leakage of magnetic flux to the surroundings, the yoke 3B is disposed in a position overlapping the magnets Mv1, Mv2, and Mv3 when viewed from the front side. The shape of the yoke 3B is not limited to a substantially L-shape, and may be a substantially U-shape, as long as it overlaps the magnets Mv1, Mv2, and Mv3.

[0067] On the front surface of the yoke 3A, flat plates 16A, 16B, and 16C are provided which are perpendicular to the direction Z. The flat plates 16A, 16B, and 16C are all located at the same position in the direction Z and are all formed on the same plane. These flat plates 16A, 16B, and 16C will be described later.

[0068] Fig. 6 is a perspective view of the movable member 2 of the image stabilizer 1 shown in Fig. 3 and Fig. 4, as viewed from the front side. Fig. 7 is a perspective view of the movable member 2 shown in Fig. 6, as viewed from the rear side.

[0069] 6 and 7, the movable member 2 includes a rectangular base 24 to which the circuit board 22 is fixed. The base 24 has an opening 25 for exposing a part of the circuit board 22 on the rear side, as shown in FIG.

[0070] 8 is a perspective view, seen from the front side, of the yoke 3A and the FPC board 14 (the FPC board 14 having wiring for supplying control current to the coils C1, C2, and C3) attached to the movable member 2. The FPC board 14 is integral with the FPC board 50 (see FIG. 4).

[0071] Fig. 9 is a perspective view of the yoke 3A as viewed from the front side. Note that Fig. 9 also shows coils C1, C2, and C3 arranged on the FPC board 14 (see Fig. 8).

[0072] As shown in FIG. 9, a coil C1 is disposed at a position facing the magnet Mv1, a coil C2 is disposed at a position facing the magnet Mv2, and a coil C3 is disposed at a position facing the magnet Mv3.

[0073] Coil C1 and magnet Mv1 form a VCM (Voice Coil Motor) for driving the X-axis.

[0074] The X-axis driving VCM moves the movable member 2 in the X direction by the Lorentz force between the coil C1 and the magnet Mv1 when a control current flows through the coil C1.

[0075] Coil C2 and magnet Mv2 form a VCM. This VCM and the above-mentioned X-axis drive VCM form a rotation drive VCM.

[0076] The VCM for rotational drive rotates the movable member 2 around the optical axis K with the center P of the light receiving surface 20A as the center of rotation by using the Lorentz force between coil C1 and magnet Mv1 and the Lorentz force between coil C2 and magnet Mv2, by reversing the direction of the control current passed through coil C1 and coil C2.

[0077] Coil C3 and magnet Mv3 form a VCM for driving the Y-axis.

[0078] The Y-axis driving VCM moves the movable member 2 in the Y direction by the Lorentz force between the coil C3 and the magnet Mv3 by passing a control current through the coil C3.

[0079] 7, a Hall element h1 is disposed at the center of the coil C1, and a Hall element h2 is disposed at the center of the coil C2. A Hall element h3 is disposed at the center of the magnet M for position detection. The magnet M is fixed to the base 10 of the yoke 3A (see FIG. 9). The Hall element h3 is fixed to the circuit board 22.

[0080] The Hall element h1 is fixed at a position facing the midpoint between the south pole and the north pole of the magnet Mv1 (see FIG. 5).

[0081] The hall element h2 is fixed at a position facing the midpoint between the south pole and the north pole of the magnet Mv2.

[0082] The Hall element h3 is fixed at a position facing the midpoint between the south pole and the north pole of the magnet M. In addition, the Hall element h3 is disposed within the pixel region T1 of the image sensor 20 when the image sensor 20 is viewed from the optical axis K direction (see FIG. 3).

[0083] The Hall element h1 outputs a signal corresponding to the magnetic field generated by the magnet Mv1, and the system control unit 120 detects the position of the movable member 2 in the direction X based on a change in the output of this signal.

[0084] The Hall element h2 outputs a signal corresponding to the magnetic field generated by the magnet Mv2, and the system control unit 120 detects the position of the movable member 2 in the direction X based on a change in the output of this signal.

[0085] The Hall element h3 outputs a signal corresponding to the magnetic field generated by the magnet M, and the system control unit 120 detects the position of the movable member 2 in the Y direction.

[0086] Based on the change in the output signal of the Hall element h1 and the change in the output signal of the Hall element h2, the system control unit 120 detects the rotation angle of the movable member 2 about the optical axis K as the position of the movable member 2 in the direction θ.

[0087] 8, the FPC board 14 is provided with a plurality of magnetic attraction plates 18 that urge the movable member 2 toward the fixed member 3 by the magnetic forces of magnets Mv1, Mv2, and Mv3. By urging the movable member 2 toward the fixed member 3, the movable member 2 is prevented from floating up from the fixed member 3. This allows the movable member 2 to be movably held relative to the fixed member 3. Note that a coil spring may be used instead of the magnetic attraction plates 18. Also, a combination of a coil spring and a magnetic attraction plate may be used.

[0088] 7, recesses 28A, 28B, and 28C are disposed on the base 24 of the movable member 2 at positions facing the planar plates 16A, 16B, and 16C of the yoke 3A. The bottom surface of each of the recesses 28A, 28B, and 28C is formed as a plane perpendicular to the direction Z. The recesses 28A, 28B, and 28C each house a rolling element 26 for supporting the movable member 2 movably within the XY plane.

[0089] The bottom surfaces of the recesses 28A, 28B, and 28C are all located at the same position in the direction Z and are all formed on the same plane. In this example, the three bottom surfaces are arranged on the same plane, but they do not have to be on the same plane as long as they are in a relatively parallel positional relationship. The movable member 2 moves smoothly within a plane (XY plane) perpendicular to the direction Z by the rolling action of the three rolling bodies 26.

[0090] As shown in FIG. 7, connectors 32 and 34 are disposed on the rear side of the movable member 2.

[0091] The connectors 32 and 34 are disposed along the direction X at the end of the circuit board 22 on the Y(-) direction side. The connector 32 is a connector for high-speed communication. The connector 34 is a connector for driving the imaging element.

[0092] An FPC board 60 (see FIG. 4), which is a flexible board, is connected to the connector 32. This FPC board 60 is an FPC board for data communication having wiring for communicating imaging data (image data obtained by imaging; so-called RAW data) between the imaging element 20 and a main board (a board on which the system control unit 120 and the like are formed: not shown), and the imaging element 20 and the main board are electrically connected via the FPC board 60.

[0093] An FPC board 70 (see FIG. 4), which is a flexible board, is connected to the connector 34. The FPC board 70 has wiring for supplying power to the imaging element 20 and a ground wiring, and the imaging element 20 and the main board are electrically connected via the FPC board 70.

[0094] The flexible substrate FPC board 50 (see FIG. 4) has wiring for driving each VCM, and each coil C1, C2, C3 of each VCM is electrically connected to the main substrate via the FPC board 50 (including the FPC board 14). The FPC board 50 is an example of a flexible substrate for drive signals that sends drive signals to the movable member 2.

[0095] FIG. 10 is a perspective view of the movable member 2 to which the FPC boards 60 and 70 are connected, as viewed from the rear side.

[0096] 10, FPC boards 60, 70 are respectively connected to movable member 2. One end of FPC boards 60, 70 is respectively connected to connectors 32, 34. FPC boards 60, 70 are routed from connectors 32, 34 in the Y(+) direction and drawn out from through hole 12 of yoke 3A to the rear side of yoke 3A, then bent in the Y(-) direction midway, and the other end is respectively connected to the main board. The above is the configuration of camera 100 of the embodiment.

[0097] Here, a digital camera, which is an example of an imaging device, is equipped with a shake correction function to deal with image blur caused by camera shake. Conventionally, optical image stabilization (OIS) in the lens was mainstream, but in recent years, due to improved performance of digital cameras and the miniaturization of the overall size of cameras and lenses, an increasing number of models are equipped with in-body image stabilization (BIS) that drives the image sensor to correct image blur. Note that BIS is also adopted in the shake correction device 1 of the embodiment.

[0098] Image sensors are becoming larger due to higher pixel counts and improved image quality processing performance. Therefore, in order to miniaturize the BIS, it is necessary to devise the layout of the actuator that drives the image sensor, the layout of the sensor that detects the position of the image sensor, and the routing of the FPC board that connects the image sensor circuit board and the main board.

[0099] In BIS, VCM actuators and Hall sensors are generally used. In a VCM actuator, a magnetic circuit is composed of a coil, a magnet, and a yoke, while in a Hall sensor, a magnetic circuit is composed of a Hall element, a magnet, and a yoke.

[0100] If the magnetic circuits of the VCM actuator and the Hall sensor are miniaturized, the BIS can also be miniaturized, but this leads to a problem that the performance of both the VCM actuator and the Hall sensor decreases. Therefore, there is a trade-off between the performance and miniaturization of the BIS.

[0101] In addition, the external shape, routing, and pattern (wiring) design of the FPC board are related to the performance and miniaturization of the BIS. The FPC board has a spring reaction force, and to make full use of the VCM actuator with a small magnetic circuit, the FPC board needs to be routed so that the spring reaction force is small. In order to reduce the spring reaction force of the FPC board, it is desirable to route the FPC board with a bending (curvature) R of a certain value or more, but this is also in a trade-off relationship with miniaturization.

[0102] Furthermore, FPC boards have the property of generating a magnetic field around the pattern through which current flows. To make full use of the small magnetic circuit Hall sensor, it is necessary to route the FPC board so that it is not easily affected by electromagnetic noise caused by the FPC board pattern. In order to reduce the effect of electromagnetic noise, it is desirable to route the FPC board and the Hall element with a certain distance between them, but this is also a trade-off with miniaturization.

[0103] For these reasons, it is difficult to design the routing of the FPC board in a BIS to achieve both compactness and high performance, and it is particularly difficult to miniaturize the BIS when the FPC board is designed to be routed away from the magnetic circuit of the Hall sensor.

[0104] Therefore, an object of the present disclosure is to provide a motion compensation device and an imaging device that can solve the above problems. Several means for solving these problems will be described below.

[0105] When designing the pattern layout of the FPC board to be less susceptible to electromagnetic noise and the layout of the FPC board within the magnetic circuit of the Hall sensor, the influence of electromagnetic noise from the FPC board must be taken into consideration. The influence of electromagnetic noise can be estimated based on the magnetic field strength "H" calculated using Ampere's law in the following formula (1).

[0106] H=Icosθ / 2πr (Equation 1)

[0107] Fig. 11 is a diagram for explaining the magnetic field strength "H" in the Z direction calculated by Ampere's law. Fig. 11 shows the magnetic field strength "H" in the Z direction entering the Hall element h from the direction of angle "θ" when the current value flowing through each pattern of the FPC board is "I" and the distance between the position where the current flows in the pattern and the position where the magnetic field of the Hall element h is detected is "r."

[0108] Based on Ampere's law, to reduce the effects of electromagnetic noise, consider the following requirements 1, 2, and 3.

[0109] Requirement 1: In the case of a pattern in which the current value "I" is large, the magnetic field strength "H" entering the Hall element h can be reduced by making the distance "r" from the position where the current is flowing to the Hall element h longer.

[0110] Requirement 2: By combining patterns with currents flowing in opposite directions and running them side by side to cancel out the magnetic fields, the strength of the magnetic field "H" entering the Hall element h is reduced.

[0111] Requirement 3: By increasing the output of the Hall sensor's magnetic circuit, the effect of the magnetic field strength "H" entering the Hall element h is reduced.

[0112] Consider requirements 1 and 2 above.

[0113] In the image stabilization device 1 of this example that employs a BIS, as shown in FIG. 4, an FPC board 50 for driving the VCM, an FPC board 60 for communicating data between the image sensor 20 and the main board, and an FPC board 70 for supplying power to the image sensor 20 are used.

[0114] (FPC board 50) A large current "I" flows through the FPC board 50 to generate a thrust for the VCM. In this case, in order to weaken the magnetic field "H" entering the Hall element h3 (Hall element h3 is the closest to the FPC board 50 among the Hall elements h1, h2, and h3), it is desirable to arrange the VCM drive pattern of the FPC board 50 away from the Hall element h3. Even if the FPC board 50 is routed close to the Hall element h3, there is no problem as long as the layout (position) is such that the VCM drive pattern is unlikely to cause electromagnetic noise effects.

[0115] FIG. 12 is an explanatory diagram showing an example of a pattern arrangement of the FPC board 50 for reducing the strength "H" of the magnetic field entering the Hall element h3.

[0116] FIG. 12 shows an arrangement state in which, among the multiple patterns of the FPC board 50, a VCM drive pattern area P1 in the central area surrounded by a dotted line (pattern area P1 through which a larger current “I” flows than in the other patterns) is separated from the Hall element h3.

[0117] By adopting the above pattern arrangement in the FPC board 50, it is possible to weaken the magnetic field "H" that enters the Hall element h3 from the VCM drive pattern area P1 of the FPC board 50. Therefore, it is possible to reduce the influence of electromagnetic noise caused by the FPC board 50.

[0118] (FPC board 60) The FPC board 60 does not have a high-speed communication signal pattern through which a large current "I" flows, but it does have patterns in which the current "I" flows in opposite directions. For this reason, it is desirable to weaken the magnetic field "H" that enters the Hall element h3 by running these patterns in parallel to cancel each other out. Note that even if the FPC board 60 is routed close to the Hall element h3, there is no problem as long as the layout is such that the effects of electromagnetic noise from each pattern are unlikely to occur.

[0119] FIG. 13 is an explanatory diagram showing an example of a pattern arrangement of the FPC board 60 for reducing the strength "H" of the magnetic field entering the Hall element h3.

[0120] According to Fig. 13, the FPC board 60 has a pattern area P2 in which the directions of the current "I" flowing through the wiring are opposite to each other. In the pattern area P2, the wiring (first wiring) indicated by the symbol A is a wiring for flowing a current in the first direction from the main board to the circuit board 22 of the imaging element 20, and the wiring (second wiring) indicated by the symbol B is a wiring for flowing a current in the second direction from the circuit board 22 to the main board. Note that in Fig. 13, arrows are added to the wiring to indicate the direction of the current flowing through the wiring. As shown in Fig. 13, the wiring (first wiring) for flowing a current in the first direction and the wiring (second wiring) for flowing a current in the second direction are arranged alternately.

[0121] By adopting the above pattern arrangement in the FPC board 60, it is possible to weaken the magnetic field "H" that enters the Hall element h3 from the pattern area P2 of the FPC board 60. Therefore, it is possible to reduce the influence of electromagnetic noise caused by the FPC board 60.

[0122] (FPC board 70) A large current "I" flows through the FPC board 70 to the digital power supply and analog power supply of the image sensor 20. To weaken the magnetic field "H" entering the Hall element h3, it is desirable to arrange the patterns for the digital power supply and analog power supply of the FPC board 70 away from the Hall element h3. Even if the FPC board 70 is routed close to the Hall element h3, there is no problem as long as the layout is such that electromagnetic noise from these patterns is unlikely to be generated. In addition, because currents flow in opposite directions in the power supply pattern and the ground pattern, it is desirable to run these patterns side by side to reduce the electromagnetic noise effect.

[0123] FIG. 14 is an explanatory diagram showing an example of a pattern arrangement of the FPC board 70 for reducing the magnetic field strength "H."

[0124] 14, among the patterns of the FPC board 70, the pattern area P3 for the digital power supply and the analog power supply is arranged farther from the Hall element h3 than the ground pattern area P4. The pattern area P3 and the ground pattern area P4, which has a wide line width and through which a large current flows, are arranged in parallel so that currents flow in opposite directions.

[0125] Pattern region P3 functions as a first wiring section that collects first wiring that causes a current to flow from the main board to the circuit board 22, which is a first direction indicated by an arrow E. Moreover, ground pattern region P4 functions as a second wiring section that collects second wiring that causes a current to flow from the circuit board 22 to the main board, which is a second direction indicated by an arrow F. Pattern region P3 and pattern region P4 are disposed adjacent to each other.

[0126] By adopting the above pattern arrangement in the FPC board 70, it is possible to weaken the magnetic field "H" entering the Hall element h3 from the patterns P3 and P4. Therefore, it is possible to reduce the influence of electromagnetic noise caused by the FPC board 70.

[0127] In this way, by optimally designing the pattern layout of the FPC boards 50, 60, and 70 to reduce the influence of electromagnetic noise, it becomes possible to route the FPC boards 50, 60, and 70 within the magnetic circuit of the Hall sensor. In other words, the BIS can be made smaller.

[0128] Next, we consider requirement 3 above.

[0129] The output of the Hall sensor's magnetic circuit can be estimated using electromagnetic field analysis. Three things are required in the design of a Hall sensor's magnetic circuit: compact size, large Hall output, and excellent Hall linearity. Hall output is an indicator of high resolution in position detection, while Hall linearity is an indicator of low error in position detection. In a layout that aims to miniaturize the BIS by routing an FPC board around the Hall sensor's magnetic circuit, it is desirable to use a layout in which the FPC board is routed between the Hall element and the magnet.

[0130] Next, in order to route the FPC board between the Hall element and the magnet, the following two requirements 3-1 and 3-2 must be considered.

[0131] 3-1: Keep a distance "r" between the Hall element and the FPC board so that electromagnetic noise is not generated.

[0132] 3-2: The magnet and the movable part of the BIS (FPC board) are spaced a distance "d" such that they do not come into contact (no friction load is generated) regardless of the posture or in-plane position to which they are driven.

[0133] Therefore, it is desirable to determine the distance between the Hall element and the magnet in accordance with the above requirements 3-1 and 3-2, and to optimize the gap between a pair of magnets that are sensitive to Hall output and linearity, thereby establishing a small magnetic circuit that is less susceptible to electromagnetic noise. In addition, it is desirable to optimize the gap between the pair of magnets by designing and adjusting it to achieve performance that increases Hall output while keeping linearity to a minimum. Here, the pair of magnets refers to magnet M (see FIG. 5, etc.) in the image stabilization device 1 of this example.

[0134] Fig. 15 is a graph showing the relationship between the Hall output and the BIS movable distance. As shown in Fig. 15, the Hall output (V) and the BIS movable distance (mm) are in a roughly proportional relationship. In addition, when the linearity is high, the position detection error is small, and when the Hall output (V) is large, the position detection resolution is high.

[0135] FIG. 16 is an explanatory diagram for explaining design requirements for arranging the FPC boards 60, 70 between the Hall element h3 and the magnet M (gap 40 in direction Z).

[0136] 16, the Hall element h3 is disposed on the rear side of the circuit board 22, and the FPC boards 60, 70 are routed from the rear side of the circuit board 22. By adopting such a layout, the BIS can be made smaller than one in which the FPC boards are routed from the side of the circuit board 22.

[0137] Of the FPC boards 50, 60, and 70, the FPC boards 60, 70 are connected to the connectors 32, 34 on the circuit board 22. For this reason, it is effective to miniaturize the BIS by arranging the FPC boards 60, 70 using the gap 40 on the rear side of the circuit board 22. It is more preferable to also arrange the FPC board 50 in the gap 40.

[0138] In this way, by disposing the FPC boards 60, 70 between the Hall element h3 and the magnet M, the BIS can be made smaller.

[0139] (Comparative Example) Here, miniaturization of the motion compensation device will be described using motion compensation device 1 of the embodiment shown in XVIIA of FIG. 17 and motion compensation device 200 of the comparative example shown in XVIIB of FIG.

[0140] The image stabilization device 1 of the embodiment employs a configuration in which FPC boards 60, 70 are disposed between the Hall element h3 and the magnet M.

[0141] In contrast, in the image stabilization device 200 of the comparative example, the FPC boards 60, 70 are not disposed between the Hall element h3 and the magnet M (gap 40), but are disposed between the yoke 3A and the circuit board 22 (gap 42).

[0142] In the image stabilization device 200, the Hall element h3 is disposed on the Y(-) direction side with respect to the connectors 32 and 34, and the magnet M is disposed at a position facing this Hall element h3.

[0143] When comparing the sizes of the image stabilization device 1 and the image stabilization device 200, if the positions of the connectors 32, 34 in the direction Y are the same, the length of the yoke 3A in the image stabilization device 200 in the direction Y is longer than that of the image stabilization device 1 by the amount (length L) that the Hall element h3 is positioned on the Y(-) direction side relative to the connectors 32, 34.

[0144] Therefore, according to the embodiment of the image stabilization device 1, a configuration is adopted in which the FPC boards 60, 70 are arranged between the Hall element h3 and the magnet M, so that it is possible to reduce the size of the image stabilization device 200 of the comparative example by the above-mentioned length L.

[0145] On the other hand, the Hall element h3 is provided on the back side of the circuit board 22. When the imaging element 20 is viewed from the optical axis K direction, the Hall element h3 is desirably disposed within region T2 (see FIG. 18) of the imaging element 20, more desirably within pixel region T1 of the imaging element 20, and more desirably near center P of the imaging element 20. This makes it possible to improve the tracking ability of the roll position control.

[0146] Fig. 18 is an explanatory diagram showing the arrangement position of the Hall element h3 with respect to the imaging element 20. Fig. 18 shows that the Hall element h3 is arranged in a pixel region T1 of the imaging element 20 when the imaging element 20 is viewed from the optical axis K direction. However, the arrangement is not limited to this, and the Hall element h3 may be arranged in a region T2 of the imaging element 20.

[0147] On the other hand, if the Hall element h3 is placed close to other mounted components, the Hall element h3 will be affected by electromagnetic noise generated by the other components. For this reason, measures against electromagnetic noise can be taken by designing the board around the Hall element h3 as a no-component mounting area, but this may result in other problems, such as a reduction in the component mounting area on the circuit board 22.

[0148] In order to solve the above problems, the connectors 32, 34 to which the FPC boards 60, 70 are connected are made to be of the tilt type (FPC board inserted at an angle) as shown in Fig. 16, and the other end side of the FPC boards 50, 70 is made to have a tilt section 80 that is inclined obliquely toward the tilt type connectors 32, 34, and this tilt section 80 is connected obliquely to the connectors 32, 34. This configuration has the following two advantages over a right angle type (FPC board inserted flat) connector. The tilt section 80 is an example of the tilt section of the present invention.

[0149] First point: It is possible to make the distance "r" between the FPC boards 60, 70 and the Hall element h3 longer, thereby suppressing the effects of electromagnetic noise. This makes it possible to improve the performance of the BIS. As a result, in combination with the configuration in which the FPC boards 60, 70 are disposed between the Hall element h3 and the magnet M, it is possible to achieve both a compact BIS and high performance.

[0150] In this case, when the imaging element 20 is viewed from the optical axis K direction (Z(+) direction), it is desirable that the Hall element h3 and the tilt portion 80 have an overlapping region S where they at least partially overlap, as shown in Fig. 19. Fig. 19 shows a diagram in which the Hall element h3 and the tilt portion 80 of the FPC board 70 partially overlap when viewed from the Z direction. With this configuration, it is possible to make the distance "r" between the FPC board 70 and the Hall element h3 longer.

[0151] Second, components can be mounted on the circuit board 22 up to the vicinity of the inlets of the connectors 32 and 34 with high density.

[0152] In order to reduce the spring reaction force of the FPC board, a slit is provided in the FPC board. In this case, it is preferable to form a slit 72 in the FPC board 70 that is routed around the Hall element h3, as shown in FIG.

[0153] The slits 72 are formed along the longitudinal direction of the FPC board 70. When the imaging element 20 is viewed from the optical axis K direction, it is preferable that at least a part of the Hall element h3 is disposed between the slits 72, and it is more preferable that the entire Hall element h3 is disposed between the slits 72. This is effective in reducing the influence of electromagnetic noise while lowering the spring reaction force of the FPC 70.

[0154] In addition, the spring reaction force of the FPC board can be reduced by reducing the total thickness of the FPC board and lowering each of the bending and torsional rigidity. Also, by changing the form of the support part that supports the curved part and straight part to a form of support part that supports only the curved part, the torsional reaction force of the FPC board can be reduced by reducing the support part of the FPC board. By combining multiple such ideas with other ideas, it is possible to reduce the size of the curved part of the FPC board.

[0155] While the image stabilization device and the image capture device according to the embodiment have been described above, the present invention may be improved or modified in several ways without departing from the gist of the present invention. [Explanation of symbols]

[0156] 1 Image stabilization device 2 Movable parts 3 Fixing material 3A York 3B York 4 screws 10 Base 12 Through hole 14 FPC board 16A flat plate 16B flat plate 16C flat plate 18 Magnetic Adsorption Board 20. Image sensor 20A light receiving surface 22 Circuit Board 24 Base 25 Opening 26 Rolling elements 28A Recess 28B Recess 28C Recess 32 Connectors 34 Connector 40 Gap 50 FPC board 60 FPC board 70 FPC board 100 Digital Camera 102 Camera body 104 Lens 106 Imaging Optical System 108 Image sensor driver 110 Analog Front End 112 Image processing section 114 Motion Detection Sensor 116 Operation section 118 Display section 120 System control section 200 Image Stabilizer C1 Coil C2 coil C3 Coil h Hall element h1 Hall element h2 Hall element h3 Hall element M Magnet Mv1 Magnet Mv2 Magnet Mv3 Magnet K optical axis P center OA optical axis X direction Y Direction Z direction r distance d Distance H Magnetic field strength S Overlapping area

Claims

1. A motion compensation device having a magnet and a Hall element for detecting a position, and a flexible substrate for connecting a movable member to which an image sensor is attached and a fixed member, the flexible substrate is disposed between the Hall element and the magnet; Image stabilization device.

2. the flexible substrate is a flexible substrate that supplies power to the imaging element; The image stabilization device according to claim 1 .

3. In addition to the flexible substrate that supplies the power, a data communication flexible substrate for communicating imaging data with the imaging element; A flexible substrate for driving signals that transmits driving signals to the movable member. The image stabilization device according to claim 2 .

4. the flexible substrate has a tilt portion, When the imaging element is viewed from the optical axis direction, the Hall element and the tilt portion have an overlapping region where they at least partially overlap each other.

3. The image stabilization device according to claim 1.

5. The tilt portion is connected obliquely to the connector portion. The image stabilization device according to claim 4.

6. the flexible substrate has a slit; When the imaging element is viewed from the optical axis direction, at least a part of the Hall element is disposed between the slits.

3. The image stabilization device according to claim 1.

7. When the imaging element is viewed from the optical axis direction, the Hall element is disposed within the area of ​​the imaging element.

3. The image stabilization device according to claim 1.

8. The Hall element is disposed within a pixel region of the imaging element. The image stabilization device according to claim 7.

9. The flexible substrate comprises: A first wiring that allows a current to flow in a first direction and a second wiring that allows a current to flow in a second direction, The first wiring and the second wiring are arranged alternately. The image stabilization device according to claim 1 .

10. The flexible substrate comprises: a first wiring section that collects first wirings that allow a current to flow in a first direction, and a second wiring section that collects second wirings that allow a current to flow in a second direction; The first wiring portion and the second wiring portion are disposed adjacent to each other.

3. The image stabilization device according to claim 1.

11. the first wiring portion is disposed at a position farther from the Hall element than the second wiring portion is. The image stabilization device according to claim 10.

12. the flexible substrate has a slit portion in a region where the second wiring portion is arranged; The image stabilization device according to claim 11.

13. A motion compensation device according to claim 1 or 2; an optical system that forms an optical image of a subject on the image sensor; Equipped with Imaging device.

Images