High frequency module and communication device

Abstract

To reduce the deterioration of attenuation characteristics of a filter.SOLUTION: A high frequency module 1 includes a first receiving filter, a second receiving filter, a first low-noise amplifier, a first inductor, a second inductor, and a mounting substrate 4. The first receiving filter, the second receiving filter, the first inductor, and the second inductor are disposed on a first main surface 41 of the mounting substrate 4. In a plan view from a thickness direction D1 of the mounting substrate 4, an outer size S1 of the first inductor is larger than an outer size S2 of the second inductor. The first inductor has a first portion 563 in which part of a winding 562 is densely wound, and a second portion 564 in which the rest of the winding 562 is sparsely wound. In a direction perpendicular to the thickness direction D1, the first portion 563 of the first inductor and the first receiving filter do not overlap.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention generally relates to a high-frequency module and a communication device, and more particularly to a high-frequency module including a plurality of filters and a plurality of inductors, and a communication device including the high-frequency module. [Background technology]

[0002] Patent Document 1 describes a high-frequency module including multiple filters and multiple inductors. In the high-frequency module described in Patent Document 1, an inductor is disposed at the input / output section of each filter, thereby adjusting the impedance for each filter. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2018 / 110577 Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, in the high-frequency module described in Patent Document 1, the attenuation characteristics of the filters may be degraded depending on the arrangement and orientation of the inductors on the mounting board on which the filters and inductors are mounted.

[0005] An object of the present invention is to provide a high-frequency module and a communication device capable of reducing the deterioration of the attenuation characteristics of a filter. [Means for solving the problem]

[0006] A high-frequency module according to an aspect of the present invention includes a first receiving filter, a second receiving filter, a first low-noise amplifier, a first inductor, a second inductor, and a mounting substrate. The first receiving filter has a pass band including a first receiving band. The second receiving filter has a pass band including a second receiving band different from the first receiving band. The first inductor has a core and a winding, and is connected between the first receiving filter and the first low-noise amplifier. The second inductor is connected to an output terminal of the second receiving filter. The mounting substrate has a first main surface and a second main surface that face each other. The first receiving filter, the second receiving filter, the first inductor, and the second inductor are disposed on the first main surface of the mounting substrate. In a plan view from the thickness direction of the mounting substrate, the outer size of the first inductor is larger than the outer size of the second inductor. The first inductor has a first portion in which a part of the winding is densely wound, and a second portion in which the rest of the winding is sparsely wound. In a direction perpendicular to the thickness direction, the first portion of the first inductor and the first receiving filter do not overlap.

[0007] A radio frequency module according to another aspect of the present invention includes a first receiving filter, a second receiving filter, a first low-noise amplifier, a first inductor, a second inductor, and a mounting substrate. The first receiving filter has a pass band including a first receiving band. The second receiving filter has a pass band including a second receiving band different from the first receiving band. The first inductor has a core and a winding, and is connected between the first receiving filter and the first low-noise amplifier. The second inductor is connected to an output terminal of the second receiving filter. The mounting substrate has a first main surface and a second main surface that face each other. The first receiving filter, the second receiving filter, the first inductor, and the second inductor are disposed on the first main surface of the mounting substrate. In a plan view from a thickness direction of the mounting substrate, the outer size of the first inductor is larger than the outer size of the second inductor. In a plan view from the thickness direction, the first receiving filter and the second receiving filter are arranged side by side in a first direction perpendicular to the thickness direction. In a planar view from the thickness direction, the second receiving filter and the first inductor are aligned, and the first receiving filter and the second inductor are aligned, in a second direction perpendicular to both the thickness direction and the first direction.

[0008] A communication device according to an aspect of the present invention includes the radio frequency module and a signal processing circuit, the signal processing circuit being connected to the radio frequency module. Effect of the Invention

[0009] According to a radio frequency module and a communication device according to an aspect of the present invention, it is possible to reduce deterioration of the attenuation characteristics of a filter. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a circuit configuration diagram of a communication device including a high-frequency module according to the first embodiment. [Diagram 2] FIG. 2 is a plan view of the high-frequency module. [Diagram 3] FIG. 3 is a bottom view of the high-frequency module. [Figure 4] FIG. 4 is a plan view of a high-frequency module according to a modified example of the first embodiment. [Diagram 5] FIG. 5 is a graph showing attenuation characteristics of the high-frequency module according to the first embodiment and a high-frequency module according to a modified example of the first embodiment. [Figure 6] FIG. 6 is a plan view of the high-frequency module according to the second embodiment. [Figure 7] FIG. 7 is a plan view of the high-frequency module according to the third embodiment. [Figure 8] FIG. 8 is a plan view of the high-frequency module according to the fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, embodiments 1 to 4 will be described with reference to the drawings. The drawings referred to in the following embodiments are schematic drawings, and the sizes and thicknesses of components in the drawings do not necessarily reflect the actual dimensions, and the size ratios and thickness ratios between components do not necessarily reflect the actual dimensional ratios.

[0012] (Embodiment 1) (1) High-frequency module First, the configuration of a high-frequency module 1 according to the first embodiment will be described with reference to FIG.

[0013] As shown in FIG. 1, the high-frequency module 1 is used in, for example, a communication device 10. The communication device 10 is, for example, a mobile phone such as a smartphone. The communication device 10 is not limited to being a mobile phone, and may be, for example, a wearable terminal such as a smart watch. The high-frequency module 1 is, for example, a module that can support 4G (fourth generation mobile communication) standards, 5G (fifth generation mobile communication) standards, and the like. The 4G standard is, for example, 3GPP (registered trademark, Third Generation Partnership Project) LTE (registered trademark, Long Term Evolution) standard. The 5G standard is, for example, 5G NR (New Radio). The high-frequency module 1 is, for example, a module that can support carrier aggregation and dual connectivity.

[0014] The communication device 10 receives a reception signal by a high-frequency module 1 serving as a reception module. The communication device 10 also transmits a transmission signal from a transmission module (not shown) that is input to the high-frequency module 1 via a signal input terminal 254 described later. The communication device 10, for example, switches between transmission and reception at regular intervals. If the reception signal and the transmission signal are signals of the same frequency band, they are TDD (Time Division Duplex) signals. TDD is a wireless communication technology in which the same frequency band is assigned to transmission and reception in wireless communication, and transmission and reception are switched at regular intervals. Note that some of the transmission and reception signals of the communication device 10 may be FDD (Frequency Division Duplex) signals. FDD is a wireless communication technology in which different frequency bands are assigned to transmission and reception in wireless communication, and transmission and reception are performed.

[0015] (2) Circuit configuration of high-frequency module Next, the circuit configuration of the high-frequency module 1 according to the first embodiment will be described with reference to FIG.

[0016] 1, the high-frequency module 1 includes a plurality of (five in the illustrated example) receiving filters 111-115, a plurality of (two in the illustrated example) low-noise amplifiers 121, 122, and a plurality of (four in the illustrated example) switches 13, 14, 16. The high-frequency module 1 further includes a plurality of (two in the illustrated example) input matching circuits 171, 172, a plurality of (three in the illustrated example) matching circuits 18, 191, 192, a low-pass filter 23, and an attenuator 24. The high-frequency module 1 further includes a plurality of (four in the illustrated example) external connection terminals 25. In the first embodiment, the high-frequency module 1 is a receiving module, but may be a transmitting / receiving module further including a transmitting filter, a power amplifier, and the like.

[0017] (2.1) Receiving filter Each of the multiple receive filters 111 to 115 is a filter that passes a receive signal. The receive filter 111 has a pass band that includes, for example, the second receive band. The receive filter 112 has a pass band that includes, for example, the third receive band. The receive filter 113 has a pass band that includes, for example, the fourth receive band. The receive filter 114 has a pass band that includes, for example, the fifth receive band. The receive filter 115 has a pass band that includes, for example, the first receive band.

[0018] The first reception band is, for example, Band 26 of the 3GPP LTE standard. The second reception band is, for example, Band 71 of the 3GPP LTE standard. The third reception band is, for example, Band 12 of the 3GPP LTE standard. The fourth reception band is, for example, Band 14 of the 3GPP LTE standard. The fifth reception band is, for example, Band 20 of the 3GPP LTE standard. In the high-frequency module 1 according to the first embodiment, the reception filter 115 corresponds to the first reception filter, and the reception filter 111 corresponds to the second reception filter.

[0019] In the high-frequency module 1 according to the first embodiment, the first reception band is Band 26. However, the first reception band may be, for example, Band 8, Band 12, Band 29, Band 13, Band 14, Band 28, or Band 20.

[0020] Each of the plurality of receiving filters 111 to 115 includes an acoustic wave filter. The acoustic wave filter has a plurality of acoustic wave resonators. Each of the plurality of acoustic wave resonators is a SAW (Surface Acoustic Wave) resonator. Note that the plurality of receiving filters 111 to 115 are not limited to acoustic wave filters and may be, for example, a BAW (Bulk Acoustic Wave) filter.

[0021] (2.2) Low-noise amplifier Each of the multiple low-noise amplifiers 121, 122 is an amplifier that amplifies a received signal with low noise. The low-noise amplifier 121 is connected between the receiving filters 111 to 113 and a signal output terminal 253 described below. The low-noise amplifier 122 is connected between the receiving filters 114, 115 and the signal output terminal 253. In the high-frequency module 1 according to the first embodiment, the low-noise amplifier 121 corresponds to the second low-noise amplifier, and the low-noise amplifier 122 corresponds to the first low-noise amplifier.

[0022] Each of the low-noise amplifiers 121, 122 has an input terminal (not shown) and an output terminal (not shown). The input terminal of the low-noise amplifier 121 is connected to the input matching circuit 171. The output terminal of the low-noise amplifier 121 is connected to the low-pass filter 23. The output terminal of the low-noise amplifier 121 is connected to an external circuit (for example, the signal processing circuit 2) via the low-pass filter 23, the attenuator 24, and the signal output terminal 253. The input terminal of the low-noise amplifier 122 is connected to the input matching circuit 172. The output terminal of the low-noise amplifier 122 is connected to the low-pass filter 23. The output terminal of the low-noise amplifier 122 is connected to an external circuit (for example, the signal processing circuit 2) via the low-pass filter 23, the attenuator 24, and the signal output terminal 253.

[0023] (2.3) Switch The switch 13 has two common terminals 130A and 130B and five selection terminals 131 to 135. The switch 13 switches between connection and disconnection between the common terminal 130A and at least one of the five selection terminals 131 to 135, and switches between connection and disconnection between the common terminal 130B and at least one of the five selection terminals 131 to 135. The common terminal 130A is connected to a first antenna terminal 251 described later via the switch 16. The common terminal 130B is connected to a second antenna terminal 252 described later. The selection terminal 131 is connected to an input terminal of the receiving filter 111. The selection terminal 132 is connected to an input terminal of the receiving filter 112. The selection terminal 133 is connected to an input terminal of the receiving filter 113. The selection terminal 134 is connected to an input terminal of the receiving filter 114. The selection terminal 135 is connected to an input terminal of the receiving filter 115. In the high-frequency module 1 according to the first embodiment, the first antenna terminal 251 and the second antenna terminal 252 correspond to the antenna terminals, and the switch 13 corresponds to the second switch.

[0024] The switch 14 has two common terminals 140A and 140B and five selection terminals 141 to 145. The switch 14 switches between connection and disconnection between the common terminal 140A and at least one of the five selection terminals 141 to 145, and switches between connection and disconnection between the common terminal 140B and at least one of the five selection terminals 141 to 145. The common terminal 140A is connected to an input terminal of the low-noise amplifier 121 via an input matching circuit 171. The common terminal 140B is connected to an input terminal of the low-noise amplifier 122 via an input matching circuit 172. The selection terminal 141 is connected to an output terminal of the receiving filter 111 via a matching circuit 18. The selection terminal 142 is connected to an output terminal of the receiving filter 112. The selection terminal 143 is connected to an output terminal of the receiving filter 113. The selection terminal 144 is connected to an output terminal of the receiving filter 114. The selection terminal 145 is connected to an output terminal of the receiving filter 115. In the high-frequency module 1 of embodiment 1, the switch 14 corresponds to the first switch (switch), the common terminal 140B corresponds to the first common terminal, the common terminal 140A corresponds to the second common terminal, the selection terminal 145 corresponds to the first selection terminal, and the selection terminal 141 corresponds to the second selection terminal.

[0025] The switch 16 has a common terminal 160 and two selection terminals 161 and 162. The common terminal 160 is connected to a first antenna terminal 251. The selection terminal 161 is connected to a common terminal 130A of the switch 13. The selection terminal 162 is connected to a signal input terminal 254, which will be described later. The switch 16 is formed of an SPDT type switch circuit.

[0026] (2.4) Input matching circuit The input matching circuit 171 includes an inductor L1. The inductor L1 of the input matching circuit 171 is provided on the input side of the low-noise amplifier 121. More specifically, the inductor L1 is connected between the common terminal 140 of the switch 14 and the input terminal of the low-noise amplifier 121. The inductor L1 is also connected between the receive filter 111 and the low-noise amplifier 121. The input matching circuit 171 matches the impedance between the switch 14 and the low-noise amplifier 121.

[0027] The input matching circuit 172 includes an inductor L2. The inductor L2 of the input matching circuit 172 is provided on the input side of the low-noise amplifier 122. More specifically, the inductor L2 is connected between the common terminal 150 of the switch 15 and the input terminal of the low-noise amplifier 122. The inductor L2 is also connected between the receive filter 115 and the low-noise amplifier 122. The input matching circuit 172 matches the impedance between the switch 15 and the low-noise amplifier 122.

[0028] The input matching circuit 171 is not limited to a configuration including one inductor L1, and may be, for example, a configuration including multiple inductors, or a configuration including multiple inductors and multiple capacitors. The input matching circuit 172 is not limited to a configuration including one inductor L2, and may be, for example, a configuration including multiple inductors, or a configuration including multiple inductors and multiple capacitors. In the high-frequency module 1 according to the first embodiment, the inductor L2 of the input matching circuit 172 corresponds to the first inductor, and the inductor L1 of the input matching circuit 171 corresponds to the third inductor.

[0029] (2.5) Matching circuit The matching circuit 18 includes an inductor L3. The inductor L3 of the matching circuit 18 is connected between the output terminal of the receiving filter 111 and the selection terminal 141 of the switch 14. The matching circuit 18 matches the impedance between the receiving filter 111 and the switch 14. In the high-frequency module 1 according to the first embodiment, the inductor L3 of the matching circuit 18 corresponds to the second inductor.

[0030] The matching circuit 191 includes an inductor L4. The inductor L4 of the matching circuit 191 is connected between the path between the common terminal 130A of the switch 13 and the selection terminal 161 of the switch 16 and the ground. The matching circuit 191 matches the impedance of the switch 13 and the switch 16.

[0031] The matching circuit 192 includes an inductor L5. The inductor L5 of the matching circuit 192 is connected between the path between the second antenna terminal 252 and the common terminal 130A of the switch 13 and the ground. The matching circuit 192 matches the impedance between a second antenna 32 and the switch 13, which will be described later.

[0032] The matching circuit 18 is not limited to a configuration including one inductor L3, and may be, for example, a configuration including multiple inductors, or a configuration including multiple inductors and multiple capacitors. The matching circuit 191 is not limited to a configuration including one inductor L4, and may be, for example, a configuration including multiple inductors, or a configuration including multiple inductors and multiple capacitors. The matching circuit 192 is not limited to a configuration including one inductor L5, and may be, for example, a configuration including multiple inductors, or a configuration including multiple inductors and multiple capacitors.

[0033] (2.6) Low-pass filter The low-pass filter 23 is, for example, an LC filter. The low-pass filter 23 has a pass band that includes the above-mentioned first reception band, second reception band, third reception band, fourth reception band, and fifth reception band.

[0034] (2.7) Attenuator The attenuator 24 is connected between the low-pass filter 23 and the signal output terminal 253. The attenuator 24 attenuates a signal received via a first antenna 31 or a second antenna 32 (described later) to a predetermined signal level.

[0035] (2.8) External connection terminal 1, the multiple external connection terminals 25 are terminals for electrically connecting to an external circuit (for example, the signal processing circuit 2). The multiple external connection terminals 25 include a first antenna terminal 251, a second antenna terminal 252, a signal output terminal 253, a signal input terminal 254, and multiple ground terminals (not shown).

[0036] The first antenna terminal 251 is connected to the first antenna 31. In the high-frequency module 1, the first antenna terminal 251 is connected to a common terminal 160 of the switch 16. The second antenna terminal 252 is connected to the second antenna 32. In the high-frequency module 1, the second antenna terminal 252 is connected to a common terminal 130B of the switch 13.

[0037] The signal output terminal 253 is a terminal for outputting to an external circuit (e.g., the signal processing circuit 2) a received signal input to the high-frequency module 1 via the first antenna terminal 251 or the second antenna terminal 252. In the high-frequency module 1, the signal output terminal 253 is connected to the attenuator 24.

[0038] The signal input terminal 254 is a terminal for inputting a transmission signal from an external circuit (for example, a transmission module not shown) to the high-frequency module 1. In the high-frequency module 1, the signal input terminal 254 is connected to the selection terminal 162 of the switch 16. In addition, the signal input terminal 254 is connected to the first antenna terminal 251 via the switch 16.

[0039] The multiple ground terminals are terminals to which a ground potential is applied by being electrically connected to a ground electrode of an external substrate (not shown) included in the communication device 10. In the high-frequency module 1, the multiple ground terminals are connected to a ground layer (not shown) of the mounting substrate 4 (see FIG. 2). The ground layer is a circuit ground for the high-frequency module 1.

[0040] (3) Circuit configuration of communication device Next, the circuit configuration of the communication device 10 according to the first embodiment will be described with reference to FIG.

[0041] 1, a communication device 10 according to the first embodiment includes a high-frequency module 1, a signal processing circuit 2, a first antenna 31, and a second antenna 32. The signal processing circuit 2 is connected to the high-frequency module 1.

[0042] (3.1) Signal processing circuit The signal processing circuit 2 includes an RF signal processing circuit 21 and a baseband signal processing circuit 22.

[0043] The RF signal processing circuit 21 is, for example, an RFIC (Radio Frequency Integrated Circuit). The RF signal processing circuit 21 performs signal processing such as up-conversion on a high-frequency signal (transmission signal) output from the baseband signal processing circuit 22, and outputs the high-frequency signal after the signal processing. The RF signal processing circuit 21 also performs signal processing such as down-conversion on a high-frequency signal (reception signal) output from the high-frequency module 1, and outputs the high-frequency signal after the signal processing to the baseband signal processing circuit 22.

[0044] The baseband signal processing circuit 22 is, for example, a BBIC (Baseband Integrated Circuit). The baseband signal processing circuit 22 generates an I-phase signal and a Q-phase signal from a baseband signal. The baseband signal is, for example, an audio signal or an image signal input from the outside. The baseband signal processing circuit 22 performs IQ modulation processing by synthesizing the I-phase signal and the Q-phase signal, and outputs a transmission signal. At this time, the transmission signal is generated as a modulated signal (IQ signal) in which a carrier signal of a predetermined frequency is amplitude-modulated with a period longer than the period of the carrier signal. The reception signal processed by the baseband signal processing circuit 22 is used, for example, as an image signal for image display, or as an audio signal for a call by a user of the communication device 10.

[0045] (3.2) Antenna The first antenna 31 is connected to a first antenna terminal 251 of the high-frequency module 1. The second antenna 32 is connected to a second antenna terminal 252 of the high-frequency module 1. Each of the first antenna 31 and the second antenna 32 has a receiving function of receiving a reception signal from the outside as a radio wave and outputting the reception signal to the high-frequency module 1. In addition, the first antenna 31 further has a transmitting function of emitting a transmission signal input to the high-frequency module 1 via the signal input terminal 254 as a radio wave.

[0046] (4) Structure of high-frequency module Next, the structure of the high-frequency module 1 according to the first embodiment will be described with reference to FIGS.

[0047] 2 and 3, the high-frequency module 1 includes a mounting substrate 4, first to ninth electronic components 51 to 59, and a plurality of (16 in the illustrated example) external connection terminals 25. The high-frequency module 1 further includes a first resin layer (not shown), a second resin layer (not shown), and a metal electrode layer (not shown).

[0048] The high-frequency module 1 can be electrically connected to an external board (not shown). The external board corresponds to a mother board of a communication device 10 (see FIG. 1), such as a mobile phone or a communication device. Note that the high-frequency module 1 being electrically connectable to an external board includes not only the case where the high-frequency module 1 is directly mounted on the external board, but also the case where the high-frequency module 1 is indirectly mounted on the external board. The case where the high-frequency module 1 is indirectly mounted on the external board includes the case where the high-frequency module 1 is mounted on another high-frequency module mounted on the external board, etc.

[0049] (4.1) Mounting board As shown in FIG. 2 and FIG. 3, the mounting board 4 has a first main surface 41 and a second main surface 42 that face each other in the thickness direction D1 of the mounting board 4. In a plan view from the thickness direction D1 of the mounting board 4, the outer edge of the mounting board 4 is, for example, rectangular, but may be a shape other than rectangular. The mounting board 4 is, for example, a multilayer board in which a plurality of dielectric layers (not shown) and a plurality of conductive layers (not shown) are laminated. The plurality of conductive layers are formed in a predetermined pattern determined for each layer. Each of the plurality of conductive layers includes one or a plurality of conductor parts in a plane perpendicular to the thickness direction D1 of the mounting board 4. The material of each conductive layer is, for example, copper. The plurality of conductive layers includes a ground layer. The ground layer of the mounting board 4 is electrically connected to at least one ground terminal included in the plurality of external connection terminals 25 through a via conductor of the mounting board 4 or the like.

[0050] The mounting substrate 4 is, for example, a low temperature co-fired ceramics (LTCC) substrate. Note that the mounting substrate 4 is not limited to an LTCC substrate, and may be, for example, a printed wiring board, a high temperature co-fired ceramics (HTCC) substrate, a resin multilayer substrate, or a substrate with built-in components.

[0051] The first to eighth electronic components 51 to 58 are disposed on the first main surface 41 of the mounting board 4. The ninth electronic component 59 is disposed on the second main surface 42 of the mounting board 4. "The electronic components are disposed on the first main surface 41 of the mounting board 4" includes the electronic components being mounted on (mechanically connected to) the first main surface 41 of the mounting board 4 and being electrically connected to (an appropriate conductor portion of) the mounting board 4. "The electronic components are disposed on the second main surface 42 of the mounting board 4" includes the electronic components being mounted on (mechanically connected to) the second main surface 42 of the mounting board 4 and being electrically connected to (an appropriate conductor portion of) the mounting board 4. In a plan view from the thickness direction D1 of the mounting board 4, the outer edges of each of the first to ninth electronic components 51 to 59 are, for example, rectangular.

[0052] In addition, in Figures 2 and 3, the electronic components that constitute the switches 13, 14, and 16, the matching circuits 191 and 192, the low-pass filter 23, and the attenuator 24 are not shown, but these electronic components are also arranged on the first main surface 41 or the second main surface 42 of the mounting substrate 4.

[0053] (4.2) First electronic component As shown in FIG. 2, the first electronic component 51 is disposed on the first main surface 41 of the mounting board 4. In the example of FIG. 2, the first electronic component 51 is mounted on the first main surface 41 of the mounting board 4. Note that, in the first electronic component 51, a part of the first electronic component 51 may be mounted on the first main surface 41 of the mounting board 4, and the rest of the first electronic component 51 may be incorporated in the mounting board 4. In short, the first electronic component 51 is located on the first main surface 41 side of the second main surface 42 in the mounting board 4, and has at least a part mounted on the first main surface 41. The first electronic component 51 is, for example, an electronic component constituting a receiving filter 111. That is, the receiving filter 111 (second receiving filter) is disposed on the first main surface 41 of the mounting board 4.

[0054] (4.3) Secondary Electronic Component As shown in FIG. 2, the second electronic component 52 is disposed on the first main surface 41 of the mounting board 4. In the example of FIG. 2, the second electronic component 52 is mounted on the first main surface 41 of the mounting board 4. Note that, in the second electronic component 52, a part of the second electronic component 52 may be mounted on the first main surface 41 of the mounting board 4, and the remainder of the second electronic component 52 may be incorporated in the mounting board 4. In short, the second electronic component 52 is located on the first main surface 41 side of the second main surface 42 in the mounting board 4, and has at least a part mounted on the first main surface 41. The second electronic component 52 is, for example, an electronic component constituting the receiving filter 115. That is, the receiving filter 115 (first receiving filter) is disposed on the first main surface 41 of the mounting board 4.

[0055] (4.4) Third Electronic Component As shown in FIG. 2, the third electronic component 53 is disposed on the first main surface 41 of the mounting board 4. In the example of FIG. 2, the third electronic component 53 is mounted on the first main surface 41 of the mounting board 4. Note that, in the third electronic component 53, a part of the third electronic component 53 may be mounted on the first main surface 41 of the mounting board 4, and the remainder of the third electronic component 53 may be incorporated in the mounting board 4. In short, the third electronic component 53 is located on the first main surface 41 side of the second main surface 42 in the mounting board 4, and has at least a part mounted on the first main surface 41. The third electronic component 53 is, for example, an electronic component constituting the receiving filter 112.

[0056] (4.5) Fourth Electronic Component 2, the fourth electronic component 54 is disposed on the first main surface 41 of the mounting board 4. In the example of FIG. 2, the fourth electronic component 54 is mounted on the first main surface 41 of the mounting board 4. Note that, in the fourth electronic component 54, a part of the fourth electronic component 54 may be mounted on the first main surface 41 of the mounting board 4, and the remainder of the fourth electronic component 54 may be incorporated in the mounting board 4. In short, the fourth electronic component 54 is located on the first main surface 41 side of the second main surface 42 in the mounting board 4, and has at least a part mounted on the first main surface 41. The fourth electronic component 54 is, for example, an electronic component constituting the receiving filter 113.

[0057] (4.6) Fifth Electronic Component As shown in FIG. 2, the fifth electronic component 55 is disposed on the first main surface 41 of the mounting board 4. In the example of FIG. 2, the fifth electronic component 55 is mounted on the first main surface 41 of the mounting board 4. Note that, in the fifth electronic component 55, a part of the fifth electronic component 55 may be mounted on the first main surface 41 of the mounting board 4, and the rest of the fifth electronic component 55 may be incorporated in the mounting board 4. In short, the fifth electronic component 55 is located on the first main surface 41 side of the second main surface 42 in the mounting board 4, and has at least a part mounted on the first main surface 41. The fifth electronic component 55 is, for example, an electronic component constituting the receiving filter 114.

[0058] (4.7) 6th Electronic Component As shown in FIG. 2, the sixth electronic component 56 is disposed on the first main surface 41 of the mounting board 4. In the example of FIG. 2, the sixth electronic component 56 is mounted on the first main surface 41 of the mounting board 4. Note that, in the sixth electronic component 56, a part of the sixth electronic component 56 may be mounted on the first main surface 41 of the mounting board 4, and the remainder of the sixth electronic component 56 may be embedded in the mounting board 4. In short, the sixth electronic component 56 is located on the first main surface 41 side of the second main surface 42 in the mounting board 4, and has at least a part mounted on the first main surface 41. The sixth electronic component 56 is, for example, an electronic component constituting the inductor L2 of the input matching circuit 172. That is, the inductor L2 (first inductor) is disposed on the first main surface 41 of the mounting board 4.

[0059] (4.8) 7th Electronic Component As shown in FIG. 2, the seventh electronic component 57 is disposed on the first main surface 41 of the mounting board 4. In the example of FIG. 2, the seventh electronic component 57 is mounted on the first main surface 41 of the mounting board 4. Note that, in the seventh electronic component 57, a part of the seventh electronic component 57 may be mounted on the first main surface 41 of the mounting board 4, and the rest of the seventh electronic component 57 may be embedded in the mounting board 4. In other words, the seventh electronic component 57 is located on the first main surface 41 side of the second main surface 42 in the mounting board 4, and has at least a part mounted on the first main surface 41. The seventh electronic component 57 is, for example, an electronic component constituting the inductor L3 of the matching circuit 18. That is, the inductor L3 (second inductor) is disposed on the first main surface 41 of the mounting board 4.

[0060] (4.9) 8th Electronic Component As shown in FIG. 2, the eighth electronic component 58 is disposed on the first main surface 41 of the mounting board 4. In the example of FIG. 2, the eighth electronic component 58 is mounted on the first main surface 41 of the mounting board 4. Note that, in the eighth electronic component 58, a part of the eighth electronic component 58 may be mounted on the first main surface 41 of the mounting board 4, and the rest of the eighth electronic component 58 may be incorporated in the mounting board 4. In other words, the eighth electronic component 58 is located on the first main surface 41 side of the second main surface 42 in the mounting board 4, and has at least a part mounted on the first main surface 41. The eighth electronic component 58 is, for example, an electronic component constituting the inductor L1 of the input matching circuit 171. That is, the inductor L1 (third inductor) is disposed on the first main surface 41 of the mounting board 4.

[0061] (4.10) 9th Electronic Component As shown in FIG. 3, the ninth electronic component 59 is disposed on the second main surface 42 of the mounting board 4. In the example of FIG. 3, the ninth electronic component 59 is mounted on the second main surface 42 of the mounting board 4. Note that, in the ninth electronic component 59, a part of the ninth electronic component 59 may be mounted on the second main surface 42 of the mounting board 4, and the rest of the ninth electronic component 59 may be incorporated in the mounting board 4. In short, the ninth electronic component 59 is located on the second main surface 42 side of the mounting board 4 rather than the first main surface 41, and has at least a part mounted on the second main surface 42. The ninth electronic component 59 is, for example, an IC chip 6. That is, the IC chip 6 is disposed on the second main surface 42 of the mounting board 4. The IC chip 6 includes a low-noise amplifier 121, a low-noise amplifier 122, and a switch 15.

[0062] (4.11) External connection terminal The plurality of external connection terminals 25 are terminals for electrically connecting the mounting board 4 to an external board (not shown).

[0063] The multiple external connection terminals 25 are arranged on the second main surface 42 of the mounting board 4, as shown in Fig. 3. "The external connection terminals 25 are arranged on the second main surface 42 of the mounting board 4" means that the external connection terminals 25 are mechanically connected to the second main surface 42 of the mounting board 4, and that the external connection terminals 25 are electrically connected to (an appropriate conductor portion of) the mounting board 4. The multiple external connection terminals 25 are made of a material such as a metal (such as copper or a copper alloy). Each of the multiple external connection terminals 25 is a columnar electrode (such as a cylindrical electrode).

[0064] (4.12) Resin layer and metal electrode layer The first resin layer is disposed on the first main surface 41 of the mounting board 4, and covers the first to eighth electronic components 51 to 58 and the first main surface 41 of the mounting board 4. The first resin layer has electrical insulation properties. The first resin layer contains a resin (e.g., an epoxy resin). The first resin layer may contain a filler in addition to the resin.

[0065] The second resin layer is disposed on the second main surface 42 of the mounting board 4. The second resin layer covers the outer peripheral surface and top surface of the ninth electronic component 59 disposed on the second main surface 42 of the mounting board 4, and the outer peripheral surfaces of each of the multiple external connection terminals 25. The second resin layer does not cover the main surface of the ninth electronic component 59 on the side opposite to the mounting board 4. The second resin layer has electrical insulation properties. The second resin layer contains a resin (e.g., epoxy resin). The second resin layer may contain a filler in addition to the resin. The material of the second resin layer may be the same as the material of the first resin layer, or may be a different material.

[0066] The metal electrode layer covers the first resin layer, the mounting substrate 4, and the second resin layer. More specifically, the metal electrode layer covers the main surface and outer peripheral surface of the first resin layer opposite the mounting substrate 4 side, the outer peripheral surface of the mounting substrate 4, and the outer peripheral surface of the second resin layer. On the other hand, the metal electrode layer does not cover the main surface of the second resin layer opposite the mounting substrate 4 side.

[0067] The metal electrode layer is conductive. In the high-frequency module 1, the metal electrode layer is a shield layer provided for the purpose of electromagnetic shielding the inside and outside of the high-frequency module 1. The metal electrode layer is in contact with at least a part of the outer peripheral surface of the ground layer of the mounting board 4. This allows the potential of the metal electrode layer to be the same as the potential of the ground layer. The metal electrode layer has a multi-layer structure in which multiple metal layers are stacked, but is not limited to a multi-layer structure and may be a single metal layer. The metal layer includes one or more types of metal.

[0068] (5) Inductor structure Next, the structures of the inductors L1 and L2 that configure the input matching circuits 171 and 172 will be described with reference to Fig. 2. Note that Fig. 2 illustrates the sixth electronic component 56 and the eighth electronic component 58 in a see-through state, showing the cores and windings arranged therein.

[0069] 2, inductor L1 (third inductor) formed by eighth electronic component 58 has core 581 and winding 582. In inductor L1, winding 582 is densely wound over the entire length of the shaft portion of core 581 extending along first direction D21. That is, in the example of FIG. 2, the winding central axis of inductor L1 is aligned along first direction D21.

[0070] The inductor L2 (first inductor) made up of the sixth electronic component 56 has a core 561 and a winding 562, as shown in FIG. 2. The inductor L2 also has a first portion 563 and a second portion 564. The first portion 563 is a portion of the shaft portion of the core 561 where a part of the winding 562 is densely wound along the first direction D21. The second portion 564 is a portion of the shaft portion of the core 561 where the rest of the winding 562 is sparsely wound along the first direction D21. That is, the inductor L2 is disposed on the first main surface 41 of the mounting board 4 such that the first portion 563 and the second portion 564 are aligned in the first direction D21. Here, "the winding 562 is sparsely wound" includes a state where the winding 562 is not wound at all around the shaft portion of the core 561 and a state where the winding 562 is wound around the shaft portion of the core 561 with a gap therebetween. In the example of FIG. 2, the second portion 564 of the inductor L2 does not have any windings 562 wound around it.

[0071] That is, inductor L2 has a first portion 563 which is a dense portion, and a second portion 564 which is a sparse portion. Here, the "sparse portion" includes a portion having fewer turns of winding 562 per unit length of the core compared to the dense portion, a portion where winding 562 is wound less than one turn, and a portion where winding 562 is not wound at all.

[0072] 2, in plan view from the thickness direction D1 of the mounting board 4, the outer size S1 of the inductor L2 (first inductor) is larger than the outer size S2 of the inductor L3 (second inductor) made of the seventh electronic component 57. Here, the outer sizes S1 and S2 are the areas of the inductors L2 and L3 in plan view from the thickness direction D1 of the mounting board 4.

[0073] (6) Layout Next, the layout of the high-frequency module 1 will be described with reference to FIGS.

[0074] As described above, the first to eighth electronic components 51 to 58 are arranged on the first main surface 41 of the mounting board 4. Furthermore, as described above, the ninth electronic component 59 and the plurality of external connection terminals 25 are arranged on the second main surface 42 of the mounting board 4. In the example of Fig. 3, the ninth electronic component 59 is arranged in the center of the second main surface 42 of the mounting board 4, and the plurality of external connection terminals 25 are arranged around the ninth electronic component 59 so as to surround the ninth electronic component 59.

[0075] The first electronic component 51 and the second electronic component 52 are aligned in the first direction D21. That is, in a plan view from the thickness direction D1 of the mounting board 4, the receiving filter 115 (first receiving filter) and the receiving filter 111 (second receiving filter) are aligned in the first direction D21. More specifically, the first electronic component 51 and the second electronic component 52 are adjacent to each other in the first direction D21. "The first electronic component 51 and the second electronic component 52 are adjacent to each other" means that the first electronic component 51 and the second electronic component 52 are arranged without any other electronic component being arranged between them. In the first embodiment, the first direction D21 is a direction perpendicular to the thickness direction D1 of the mounting board 4 and along the longitudinal direction of the mounting board 4 (the left-right direction in FIG. 2).

[0076] The second electronic component 52 and the third electronic component 53 are arranged in the first direction D21. More specifically, the second electronic component 52 and the third electronic component 53 are adjacent to each other in the first direction D21. The third electronic component 53, the fourth electronic component 54, and the fifth electronic component 55 are arranged in this order in a second direction D22 perpendicular to the first direction D21. More specifically, the third electronic component 53 and the fourth electronic component 54 are adjacent to each other in the second direction D22, and the fourth electronic component 54 and the fifth electronic component 55 are adjacent to each other. In the first embodiment, the second direction D22 is a direction perpendicular to both the thickness direction D1 and the first direction D21 of the mounting board 4 (perpendicular direction) and is a direction along the short-side direction of the mounting board 4 (the vertical direction in FIG. 2).

[0077] The first electronic component 51 and the sixth electronic component 56 are aligned in the second direction D22. That is, the receiving filter 111 (second receiving filter) and the inductor L2 (first inductor) are aligned in the second direction D22 in a plan view from the thickness direction D1 of the mounting board 4. More specifically, the first electronic component 51 and the sixth electronic component 56 are adjacent to each other in the second direction D22.

[0078] The second electronic component 52 and the seventh electronic component 57 are aligned in the second direction D22. That is, the receiving filter 115 (first receiving filter) and the inductor L3 (second inductor) are aligned in the second direction D22 in a plan view from the thickness direction D1 of the mounting board 4. More specifically, the second electronic component 52 and the seventh electronic component 57 are adjacent to each other in the second direction D22.

[0079] The eighth electronic component 58 is disposed on the opposite side to the second electronic component 52 side with respect to the seventh electronic component 57 in the second direction D22. That is, the inductor L3 (second inductor) is disposed between the inductor L1 (third inductor) and the receiving filter 115 (first receiving filter) in the second direction D22.

[0080] Here, as shown in FIG. 2, the inductor L2 formed of the sixth electronic component 56 is arranged such that the first portion 563 is on the first electronic component 51 side and the second portion 564 is on the second electronic component 52 side in the first direction D21 in a plan view from the thickness direction D1 of the mounting board 4. As a result, the first portion 563 of the inductor L2 does not overlap with the receiving filter 115 in the second direction D22. "The first portion 563 of the inductor L2 does not overlap with the receiving filter 115" includes a state in which a part of the first portion 563 of the inductor L2 does not overlap with the receiving filter 115 and a state in which the entire first portion 563 of the inductor L2 does not overlap with the receiving filter 115. In other words, "The first portion 563 of the inductor L2 does not overlap with the receiving filter 115" means that at least a part of the first portion 563 of the inductor L2 does not overlap with the receiving filter 115. In the high-frequency module 1 according to the first embodiment, the second direction D22 corresponds to the orthogonal direction.

[0081] (7) Effects The high-frequency module 1 according to the first embodiment includes a receiving filter 115 (first receiving filter), a receiving filter 111 (second receiving filter), a low-noise amplifier 122, an inductor L2 (first inductor), an inductor L3 (second inductor), and a mounting substrate 4. The receiving filter 115 has a pass band including a first receiving band. The receiving filter 111 has a pass band including a second receiving band different from the first receiving band. The inductor L2 has a core 561 and a winding 562, and is connected between the receiving filter 115 and the low-noise amplifier 122. The inductor L3 is connected to an output terminal of the receiving filter 111. The mounting substrate 4 has a first main surface 41 and a second main surface 42 that face each other. The receiving filter 115, the receiving filter 111, the inductor L2, and the inductor L3 are disposed on the first main surface 41 of the mounting substrate 4. In a plan view in the thickness direction D1 of the mounting substrate 4, the outer size S1 of the inductor L2 is larger than the outer size S2 of the inductor L3. The inductor L2 has a first portion 563 in which a part of the winding 562 is densely wound, and a second portion 564 in which the rest of the winding 562 is sparsely wound. In an orthogonal direction D22 orthogonal to the thickness direction D1, the first portion 563 of the inductor L2 and the receiving filter 115 do not overlap.

[0082] In the high-frequency module 1 of embodiment 1, a part of the winding 562 of the inductor L2 where the winding is tightly wound does not overlap with the receiving filter 115 in the orthogonal direction D22 perpendicular to the thickness direction D1 of the mounting substrate 4. This makes it possible to prevent the electromagnetic field of the inductor L2 from interfering with the receiving filter 115, thereby reducing deterioration of the attenuation characteristics of the receiving filter 115.

[0083] The high-frequency module 1 according to the first embodiment includes a receiving filter 115 (first receiving filter), a receiving filter 111 (second receiving filter), a low-noise amplifier 122, an inductor L2 (first inductor), an inductor L3 (second inductor), and a mounting substrate 4. The receiving filter 115 has a pass band including a first receiving band. The receiving filter 111 has a pass band including a second receiving band different from the first receiving band. The inductor L2 has a core 561 and a winding 562, and is connected between the receiving filter 115 and the low-noise amplifier 122. The inductor L3 is connected to an output terminal of the receiving filter 111. The mounting substrate 4 has a first main surface 41 and a second main surface 42 that face each other. The receiving filter 115, the receiving filter 111, the inductor L2, and the inductor L3 are disposed on the first main surface 41 of the mounting substrate 4. In a plan view from the thickness direction D1 of the mounting substrate 4, the outer size S1 of the inductor L2 is larger than the outer size S2 of the inductor L3. In a plan view from the thickness direction D1 of the mounting substrate 4, the receiving filter 115 and the receiving filter 111 are aligned in a first direction D21 perpendicular to the thickness direction D1. In a plan view from the thickness direction D1 of the mounting substrate 4, the receiving filter 111 and the inductor L2 are aligned, and the receiving filter 115 and the inductor L3 are aligned in a second direction D22 perpendicular to both the thickness direction D1 and the first direction D21.

[0084] In the high-frequency module 1 of embodiment 1, in a first direction D21 perpendicular to the thickness direction D1 of the mounting board 4, the receiving filter 115 and the receiving filter 111 are adjacent to each other, and in a second direction D22 perpendicular to both the thickness direction D1 and the first direction D21 of the mounting board 4, the inductor L2 and the receiving filter 111 are adjacent to each other, and the inductor L3 and the receiving filter 115 are adjacent to each other. In other words, the inductor L2 and the receiving filter 115 do not overlap in the second direction D22, so that interference between the electromagnetic field of the inductor L2 and the receiving filter 115 can be suppressed, and deterioration of the attenuation characteristics of the receiving filter 115 can be reduced.

[0085] Furthermore, in the high-frequency module 1 according to the first embodiment, by arranging the three inductors L1 to L3 for the five receiving filters 111 to 115, it is possible to satisfy the characteristics of the five receiving filters 111 to 115. As a result, it is also possible to reduce the size of the high-frequency module 1.

[0086] Furthermore, in the high-frequency module 1 according to the first embodiment, the inductor L3 (second inductor) is disposed between the inductor L1 (third inductor) and the receiving filter 115 (first receiving filter) in the second direction D22. This makes it possible to reduce deterioration of the attenuation characteristics of the filter due to electromagnetic coupling between the inductor L1 and the inductor L3.

[0087] Furthermore, in the high-frequency module 1 according to the first embodiment, the inductor L2 (first inductor) connected to the common terminal 150 of the switch 15 makes it possible to satisfy the characteristics of multiple receiving filters (in the illustrated example, receiving filters 114 and 115).

[0088] Furthermore, in the high-frequency module 1 according to the first embodiment, the low-noise amplifiers 121, 122 and the switch 15 are included in one IC chip 6. This makes it possible to reduce the size of the mounting board 4 in plan view in the thickness direction D1 of the mounting board 4.

[0089] Moreover, in the high-frequency module 1 according to the first embodiment, the IC chip 6 is disposed on the second main surface 42 of the mounting board 4. This enables the mounting board 4 to be further reduced in size in plan view in the thickness direction D1 of the mounting board 4.

[0090] (8) Variations Next, a high-frequency module 1 according to a modification of the first embodiment will be described with reference to FIGS.

[0091] In the high-frequency module 1 according to the first embodiment, the inductor L2 formed of the sixth electronic component 56 is arranged in a direction in which the first portion 563 is on the first electronic component 51 side and the second portion 564 is on the second electronic component 52 side in the first direction D21, as shown in Fig. 2. In contrast, the inductor L2 may be arranged in a direction in which the second portion 564 is on the first electronic component 51 side and the first portion 563 is on the second electronic component 52 side in the first direction D21, as shown in Fig. 4. Even in this case, it is preferable that the first portion 563 of the inductor L2 (first inductor) does not overlap with the receiving filter 115 (first receiving filter) in the second direction D22 (orthogonal direction) orthogonal to the thickness direction D1 of the mounting board 4, as shown in Fig. 4.

[0092] Fig. 5 is a graph showing the attenuation characteristics in the transmission band of a reception signal of Band26 passing through the reception filter 115. In Fig. 5, the solid line indicates the attenuation characteristics corresponding to the arrangement example shown in Fig. 2, and the dashed line indicates the attenuation characteristics corresponding to the arrangement example shown in Fig. 4. According to Fig. 5, there is little variation between the attenuation characteristics in the arrangement example shown in Fig. 2 and the attenuation characteristics in the arrangement example shown in Fig. 4. In other words, according to the high-frequency module 1, it is possible to reduce the variation in the attenuation characteristics due to the orientation of the inductor L2 in the first direction D21.

[0093] Similarly to the high-frequency module 1 according to the first embodiment, the high-frequency module 1 according to the modification of the first embodiment can achieve both reduced degradation of the attenuation characteristics of the filter and miniaturization.

[0094] (Embodiment 2) The high-frequency module 1 according to the second embodiment will be described with reference to Fig. 6. Regarding the high-frequency module 1 according to the second embodiment, the same components as those in the high-frequency module 1 according to the first embodiment (see Figs. 2 and 3) are denoted by the same reference numerals and description thereof will be omitted.

[0095] As shown in FIG. 6, the high-frequency module 1 according to the second embodiment differs from the high-frequency module 1 according to the first embodiment in that, when viewed in a plan view from the thickness direction D1 of the mounting substrate 4, the orientation of the seventh electronic component 57 that constitutes the inductor L3 is different by 90 degrees.

[0096] That is, in the high-frequency module 1 of embodiment 2, the seventh electronic component 57 is arranged on the first main surface 41 of the mounting board 4 such that the longitudinal direction of the seventh electronic component 57 is aligned along the first direction D21 and the short side direction of the seventh electronic component 57 is aligned along the second direction D22.

[0097] Similarly to the high-frequency module 1 according to the first embodiment, the high-frequency module 1 according to the second embodiment can achieve both reduced degradation of the attenuation characteristics of the filter and miniaturization.

[0098] In the high-frequency module 1 of embodiment 2 as well, similar to the high-frequency module 1 of the modified example of embodiment 1, the inductor L2 may be disposed on the first main surface 41 of the mounting board 4 in an orientation in the first direction D21 such that the second portion 564 is on the first electronic component 51 side and the first portion 563 is on the second electronic component 52 side.

[0099] (Embodiment 3) The high-frequency module 1 according to the third embodiment will be described with reference to Fig. 7. Regarding the high-frequency module 1 according to the third embodiment, the same components as those of the high-frequency module 1 according to the first embodiment (see Figs. 2 and 3) are denoted by the same reference numerals and description thereof will be omitted.

[0100] As shown in FIG. 7, the high-frequency module 1 according to the third embodiment differs from the high-frequency module 1 according to the first embodiment in that, when viewed in a plan view from the thickness direction D1 of the mounting substrate 4, the orientation of the sixth electronic component 56 that constitutes the inductor L2 is different by 90 degrees.

[0101] That is, in the high-frequency module 1 according to the third embodiment, the sixth electronic component 56 is disposed on the first main surface 41 of the mounting board 4 with the longitudinal direction of the sixth electronic component 56 aligned along the second direction D22 and the lateral direction of the sixth electronic component 56 aligned along the first direction D21. More specifically, the sixth electronic component 56 is disposed on the first main surface 41 of the mounting board 4 with the winding central axis of the inductor L2 aligned along the second direction D22.

[0102] In this case, it is preferable that the inductor L2 is arranged on the first main surface 41 of the mounting board 4 in an orientation in the second direction D22, as shown in FIG. 7, such that the second portion 564 faces the first electronic component 51 and the first portion 563 faces the opposite side to the first electronic component 51.

[0103] Similarly to the high-frequency module 1 according to the first embodiment, the high-frequency module 1 according to the third embodiment can achieve both reduced degradation of the attenuation characteristics of the filter and reduced size.

[0104] In addition, the inductor L2 may be arranged on the first main surface 41 of the mounting board 4 with the first portion 563 facing the first electronic component 51 and the second portion 564 facing the opposite side to the first electronic component 51 in the second direction D22.

[0105] (Embodiment 4) The high-frequency module 1 according to the fourth embodiment will be described with reference to Fig. 8. Regarding the high-frequency module 1 according to the fourth embodiment, the same components as those of the high-frequency module 1 according to the first embodiment (see Figs. 2 and 3) are denoted by the same reference numerals and description thereof will be omitted.

[0106] As shown in FIG. 8, the high-frequency module 1 of the fourth embodiment differs from the high-frequency module 1 of the first embodiment in that, in a plan view from the thickness direction D1 of the mounting substrate 4, in the second direction D22, an eighth electronic component 58 constituting the inductor L1 is disposed between the second electronic component 52 constituting the receiving filter 115 and the seventh electronic component 57 constituting the inductor L3.

[0107] That is, in the high-frequency module 1 of embodiment 4, in a planar view from the thickness direction D1 of the mounting substrate 4, the inductor L1, which is the third inductor, is disposed in the second direction D22 between the inductor L3, which is the second inductor, and the receiving filter 115, which is the first receiving filter.

[0108] Similarly to the high-frequency module 1 according to the first embodiment, the high-frequency module 1 according to the fourth embodiment can achieve both reduced degradation of the attenuation characteristics of the filter and miniaturization.

[0109] In the high-frequency module 1 of embodiment 4 as well, similar to the high-frequency module 1 of the modified example of embodiment 1, the inductor L2 may be disposed on the first main surface 41 of the mounting board 4 in an orientation in the first direction D21 such that the second portion 564 is on the first electronic component 51 side and the first portion 563 is on the second electronic component 52 side.

[0110] (Aspect) The present specification discloses the following aspects.

[0111] The high-frequency module (1) according to the first aspect includes a first receiving filter (115), a second receiving filter (111), a first low-noise amplifier (122), a first inductor (L2), a second inductor (L3), and a mounting board (4). The first receiving filter (115) has a pass band including a first receiving band. The second receiving filter (111) has a pass band including a second receiving band different from the first receiving band. The first inductor (L2) has a core (561) and a winding (562), and is connected between the first receiving filter (115) and the first low-noise amplifier (122). The second inductor (L3) is connected to an output terminal of the second receiving filter (111). The mounting board (4) has a first main surface (41) and a second main surface (42) facing each other. The first receiving filter (115), the second receiving filter (111), the first inductor (L2), and the second inductor (L3) are disposed on a first main surface (41) of a mounting board (4). In a plan view from a thickness direction (D1) of the mounting board (4), an outer size (S1) of the first inductor (L2) is larger than an outer size (S2) of the second inductor (L3). The first inductor (L2) has a first portion (563) in which a part of the winding (562) is densely wound, and a second portion (564) in which the rest of the winding (562) is sparsely wound. In an orthogonal direction (D22) perpendicular to the thickness direction (D1), the first portion (563) of the first inductor (L2) does not overlap with the first receiving filter (115).

[0112] According to this aspect, it is possible to reduce the deterioration of the attenuation characteristics of the filter.

[0113] A high-frequency module (1) according to a second aspect includes a first receiving filter (115), a second receiving filter (111), a first low-noise amplifier (122), a first inductor (L2), a second inductor (L3), and a mounting board (4). The first receiving filter (115) has a pass band including a first receiving band. The second receiving filter (111) has a pass band including a second receiving band different from the first receiving band. The first inductor (L2) has a core (561) and a winding (562), and is connected between the first receiving filter (115) and the first low-noise amplifier (122). The second inductor (L3) is connected to an output terminal of the second receiving filter (111). The mounting board (4) has a first main surface (41) and a second main surface (42) facing each other. The first receiving filter (115), the second receiving filter (111), the first inductor (L2), and the second inductor (L3) are disposed on a first main surface (41) of the mounting board (4). In a plan view from the thickness direction (D1) of the mounting board (4), the outer size (S1) of the first inductor (L2) is larger than the outer size (S2) of the second inductor (L3). In a plan view from the thickness direction (D1) of the mounting board (4), the first receiving filter (115) and the second receiving filter (111) are arranged side by side in a first direction (D21) perpendicular to the thickness direction (D1). In a planar view from the thickness direction (D1) of the mounting board (4), the second receiving filter (111) and the first inductor (L2) are aligned, and the first receiving filter (115) and the second inductor (L3) are aligned in a second direction (D22) perpendicular to both the thickness direction (D1) and the first direction (D21).

[0114] According to this aspect, it is possible to reduce the deterioration of the attenuation characteristics of the filter.

[0115] The high-frequency module (1) according to the third aspect is the same as that of the first aspect, but further includes a second low-noise amplifier (121) and a third inductor (L1). The third inductor (L1) has a core (581) and a winding (582), and is connected between the second receiving filter (111) and the second low-noise amplifier (121). The third inductor (L1) is disposed on the first main surface (41) of the mounting board (4). One of the second inductor (L3) and the third inductor (L1) is disposed between the other of the second inductor (L3) and the third inductor (L1) and the first receiving filter (115) in the orthogonal direction (D22).

[0116] According to this embodiment, it is possible to reduce deterioration of the attenuation characteristics of the filter due to electromagnetic field coupling between the second inductor (L3) and the third inductor (L1).

[0117] The high-frequency module (1) according to the fourth aspect is the second aspect, and further includes a second low-noise amplifier (121) and a third inductor (L1). The third inductor (L1) has a core (581) and a winding (582), and is connected between the second receiving filter (111) and the second low-noise amplifier (121). The third inductor (L1) is disposed on the first main surface (41) of the mounting board (4). In a plan view from the thickness direction (D1) of the mounting board (4), the second inductor (L3) is disposed between the third inductor (L1) and the first receiving filter (115) in the second direction (D22).

[0118] According to this embodiment, it is possible to reduce deterioration of the attenuation characteristics of the filter due to electromagnetic field coupling between the second inductor (L3) and the third inductor (L1).

[0119] A high-frequency module (1) according to a fifth aspect is any one of the first to fourth aspects, and further includes a second low-noise amplifier (121), a first switch (14), and a third inductor (L1). The first switch (14) has a first common terminal (140B), a second common terminal (140A), a first selection terminal (142), and a second selection terminal (141). The third inductor (L1) has a core (581) and a winding (582), and is connected between the second receiving filter (111) and the second low-noise amplifier (121). The first selection terminal (142) is connected to the output terminal of the first receiving filter (115). The second selection terminal (141) is connected to the output terminal of the second receiving filter (111) via the second inductor (L3). The first common terminal (140B) is connected to the input terminal of the first low-noise amplifier (122) via a first inductor (L2). The second common terminal (140A) is connected to the input terminal of the second low-noise amplifier (121) via a third inductor (L1).

[0120] According to this embodiment, the characteristics of the plurality of receiving filters (receiving filters 114, 115) can be satisfied by the first inductor (L2) connected to the first common terminal (140B) of the first switch (14).

[0121] The high-frequency module (1) according to a sixth aspect is the high-frequency module (1) of the fifth aspect, further including a second low-noise amplifier (121). The first low-noise amplifier (122), the second low-noise amplifier (121), and the first switch (14) are included in one IC chip (6).

[0122] According to this embodiment, it is possible to reduce the size of the mounting board (4) when viewed in a plan view in the thickness direction (D1) of the mounting board (4).

[0123] In the high-frequency module (1) according to the seventh aspect, in the sixth aspect, the IC chip (6) is disposed on the second main surface (42) of the mounting board (4).

[0124] According to this embodiment, it is possible to further reduce the size of the mounting board (4) when viewed in a plan view in the thickness direction (D1) of the mounting board (4).

[0125] The high-frequency module (1) according to an eighth aspect is any one of the fifth to seventh aspects, further including antenna terminals (251, 252) and a second switch (13). The second switch (13) is connected between the input terminal of the first receiving filter (115) and the input terminal of the second receiving filter (111) and the antenna terminals (251, 252).

[0126] In a high-frequency module (1) according to a ninth aspect, in any one of the first to eighth aspects, the first reception band is Band 26, Band 8, Band 12, Band 29, Band 13, Band 14, Band 28, or Band 20 of the 3GPP LTE standard.

[0127] In a high-frequency module (1) according to a tenth aspect, in any one of the first to ninth aspects, the second reception band is Band 71 of the 3GPP LTE standard.

[0128] A communication device (10) according to an eleventh aspect includes the high-frequency module (1) according to any one of the first to tenth aspects, and a signal processing circuit (2). The signal processing circuit (2) is connected to the high-frequency module (1).

[0129] According to this aspect, it is possible to reduce the deterioration of the attenuation characteristics of the filter. [Explanation of symbols]

[0130] 1 High frequency module 2. Signal Processing Circuit 4 Mounting board 6. IC Chip 10. Communications Equipment 13 Switch (second switch) 14 Switch (1st switch) 16 Switch 18 Matching circuit 21 RF signal processing circuit 22 Baseband signal processing circuit 23 Low-pass filter 24 Attenuator 25 External connection terminal 31 First Antenna 32 Second Antenna 41 First main surface 42 Second main surface 51 First Electronic Parts 52 Secondary Electronic Components 53 Third Electronic Parts 54 4th Electronic Parts 55 5th Electronic Parts 56 6th Electronic Parts 57 7th Electronic Component 58 8th Electronic Component 59 9th Electronic Component 111 Receiving filter (second receiving filter) 112 Receive Filter 113 Receive Filter 114 Receive Filter 115 Receiving filter (first receiving filter) 121 Low noise amplifier (second low noise amplifier) 122 Low noise amplifier (first low noise amplifier) 130A, 130B common terminal 131~135 Selection terminal 140A common terminal (second common terminal) 140B Common terminal (first common terminal) 141 Selection terminal (second selection terminal) 142 Selection terminal 143 Selection terminal 144 Selection terminal 145 Selection terminal (first selection terminal) 160 Common terminal 161,162 Selection terminal 171,172 Input matching circuit 191,192 matching circuit 251 First antenna terminal 252 Second antenna terminal 253 Signal output terminal 254 signal input terminal 561 cores 562 Winding 563 Part 1 564 Part 2 581 cores 582 Windings D1 Thickness direction D21 1st direction D22 2nd direction L1 inductor (third inductor) L2 inductor (first inductor) L3 inductor (second inductor) L4 inductor L5 inductor S1, S2 External dimensions

Claims

1. a first receive filter having a passband that includes the first receive band; a second receive filter having a passband that includes a second receive band different from the first receive band; A first low noise amplifier; a first inductor having a core and a winding and connected between the first receiving filter and the first low-noise amplifier; a second inductor connected to an output terminal of the second receive filter; a mounting substrate having a first main surface and a second main surface opposed to each other, the first receiving filter, the second receiving filter, the first inductor, and the second inductor are disposed on the first main surface of the mounting substrate, an outer size of the first inductor is larger than an outer size of the second inductor in a plan view in a thickness direction of the mounting substrate; The first inductor is a first portion in which a portion of the winding is tightly wound; a second portion in which the remainder of the winding is loosely wound; the first portion of the first inductor and the first receiving filter do not overlap in an orthogonal direction orthogonal to the thickness direction; High frequency module.

2. a first receive filter having a passband that includes the first receive band; a second receive filter having a passband that includes a second receive band different from the first receive band; A first low noise amplifier; a first inductor having a core and a winding and connected between the first receiving filter and the first low-noise amplifier; a second inductor connected to an output terminal of the second receive filter; a mounting substrate having a first main surface and a second main surface opposed to each other, the first receiving filter, the second receiving filter, the first inductor, and the second inductor are disposed on the first main surface of the mounting substrate, When viewed from a thickness direction of the mounting substrate, an outer size of the first inductor is larger than an outer size of the second inductor; the first receiving filter and the second receiving filter are aligned in a first direction perpendicular to the thickness direction, the second receiving filter and the first inductor are aligned in a second direction perpendicular to both the thickness direction and the first direction, and the first receiving filter and the second inductor are aligned in a second direction perpendicular to both the thickness direction and the first direction. High frequency module.

3. A second low noise amplifier; a third inductor having a core and a winding and connected between the second receiving filter and the second low-noise amplifier; the third inductor is disposed on the first main surface of the mounting substrate, one of the second inductor and the third inductor is disposed between the other of the second inductor and the third inductor and the first receive filter in the orthogonal direction; The high frequency module according to claim 1 .

4. A second low noise amplifier; a third inductor having a core and a winding and connected between the second receiving filter and the second low-noise amplifier; the third inductor is disposed on the first main surface of the mounting substrate, the second inductor is disposed between the third inductor and the first receive filter in the second direction. The high frequency module according to claim 2 .

5. A second low noise amplifier; a first switch having a first common terminal, a second common terminal, a first selection terminal, and a second selection terminal; a third inductor having a core and a winding and connected between the second receiving filter and the second low-noise amplifier; the first selection terminal is connected to an output terminal of the first reception filter; the second selection terminal is connected to an output terminal of the second receive filter via the second inductor; the first common terminal is connected to an input terminal of the first low-noise amplifier via the first inductor; the second common terminal is connected to an input terminal of the second low-noise amplifier via the third inductor; The high frequency module according to any one of claims 1 to 4.

6. the first low-noise amplifier, the second low-noise amplifier, and the first switch are included in one IC chip. The high frequency module according to claim 5 .

7. The IC chip is disposed on the second main surface of the mounting substrate. The high frequency module according to claim 6.

8. An antenna terminal; and a second switch, the second switch is connected between an input terminal of the first receiving filter and an input terminal of the second receiving filter and the antenna terminal; The high frequency module according to claim 5 .

9. The first receiving band is Band 26, Band 8, Band 12, Band 29, Band 13, Band 14, Band 28, or Band 20 of the 3GPP LTE standard; The high frequency module according to any one of claims 1 to 4.

10. The second receiving band is Band 71 of the 3GPP LTE standard. The high frequency module according to any one of claims 1 to 4.

11. A high-frequency module according to any one of claims 1 to 4, A signal processing circuit connected to the high-frequency module. Communications equipment.

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