Method for creating three-dimensional structure, and laser lithography device

Abstract

To enable a rapid production of three-dimensional structures by using laser lithography technology.SOLUTION: There is provided a method for creating a three-dimensional structure in a lithographic material (12), the method comprising the following steps: holding the lithographic material (12) by means of a lithographic material holder (14); generating an input laser beam (20) by means of a laser beam source (18); demultiplexing the input laser beam (20) for temporally splitting the input laser beam (20) to form a plurality of laser writing beams (26); focusing the plurality of laser writing beams (26) by means of an objective (70); creating the three-dimensional structure in the lithographic material (12) by means of the focused laser writing beams (26).SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a method for producing a three-dimensional structure and a laser lithography apparatus. [Background technology]

[0002] The technique of laser lithography referred to in this context is also called, for example, stereolithography or direct laser writing. In this technique, a laser writing beam writes structures into a generally initially liquid photosensitive substance, called in this context the lithographic material. In this process, a solidification effect is triggered locally in the lithographic material by the laser writing beam. The solidification occurs by local polymerization of the lithographic material, induced for example by the absorption of photons. In the field of photolithography, such a lithographic material is also called photoresist. In the field of stereolithography, it is also called resin.

[0003] The techniques of laser lithography or direct laser writing are advantageously used for the production of micro- or nanostructures when high precision is desired and at the same time design freedom and shaping flexibility must be preserved: for example, in contrast to the methods of mask lithography, different structures can be specifically written without being defined by a mask or the like.

[0004] Here, various techniques are known that allow for varying degrees of direct contact between the focusing optics or its optical terminal elements and the lithographic material: Firstly, it is known that, in principle, a desired overall structure can be produced by successively writing (for example in layers or slices) a series of substructures which furthermore generally complement each other to form the desired structure.

[0005] In one type of known technique, a writing beam strikes the surface of a volume of lithographic material, resulting in local solidification at that surface. Generally, these methods are based on linear processes such as one-photon absorption and the resulting local change of the lithographic material. To write structures that extend into three dimensions, such methods apply additional layers of lithographic material after the layer has been written in the application step. This can be achieved, for example, by gradually lowering the substrate on which the structure is to be written into a bath of lithographic material, each time structuring by the writing beam on the surface. In such techniques, contact between the terminating element of the focusing optics and the lithographic material may occur.

[0006] Another approach generally uses the physical principles of two-photon or multiphoton polymerization to achieve solidification of the lithographic material within its volume, i.e. also below the surface. This is possible by adjusting the writing beam and the lithographic material to each other in such a way that a solidification effect accompanied by a nonlinear effect occurs. For example, the writing beam is selected in a spectral range that does not normally trigger a solidification effect in the lithographic material. For example, the lithographic material and the writing beam can be adjusted in such a way that induced solidification occurs only upon absorption of two or more photons of the writing beam (two-photon or multiphoton polymerization). In this context, the term multiphoton polymerization means induced polymerization by absorption of two or more photons. In this respect, the term "multiphoton absorption" also includes the processes "two-photon absorption" and "two-step absorption" herein. The necessary conditions for multiphoton polymerization are generally only achieved in a zone of increased intensity. This zone of increased intensity is usually provided in the region of the focus of the laser writing beam. In this respect, the focal point is the beam waist of the laser writing beam, which is generated by suitable optics (e.g. beam steering optics, beam shaping optics and / or objective lens). For lithographic fabrication of extended 3D structures, the focal point can be moved through the volume of the lithographic material according to shape description data to locally trigger the solidification process.

[0007] The production of three-dimensional structures using two-photon polymerization is often carried out with a working distance of 100 μm (micrometers) to 20 mm (millimeters). The working distance is the distance between the focal point and the optical end element of the objective lens for focusing. At such small working distances, contact between the lens and the lithographic material cannot often be prevented. In particular, the objective lens is immersed in the lithographic material. A manufacturing method in which the lens is at least partially immersed in the lithographic material can also be called dip-in multiphoton polymerization. Here, during the production of three-dimensional structures, the lithographic material often rests on the objective lens, in particular on the optical end element.

[0008] Regardless of the particular technology, the challenge is that the writing process of complex structures can be time consuming, and this speed of writing usually must not come at the expense of accuracy.

[0009] US Patent No. 5,399,633 discloses an apparatus for lithography-based manufacturing of three-dimensional parts. The apparatus includes a beam splitter that splits an input beam into multiple beams that are focused to focal points within a material. In addition, the apparatus includes a number of acousto-optic modulators corresponding to the number of beams. An acousto-optic modulator is disposed in each beam path to shift the focal point of that particular beam. [Prior art documents] [Patent documents]

[0010] [Patent Document 1] European Patent Application Publication No. 4163083 Summary of the Invention [Problem to be solved by the invention]

[0011] The invention is notably based on the object of enabling the rapid production of three-dimensional structures by using laser lithography techniques.

[0012] This object is achieved by a method having the features of claim 1 and by a laser lithography apparatus having the features of claim 8. Advantageous and preferred embodiments of the invention are contained in the further claims. [Means for solving the problem]

[0013] A method for creating a three-dimensional structure in a lithographic material according to the present invention comprises the steps of holding the lithographic material by a lithographic material holder, generating an input laser beam propagating in a propagation direction by a laser beam source, forming a plurality, in particular three, four or five laser writing beams by demultiplexing the laser beam by a demultiplexer unit arranged between the laser beam source and an objective lens, focusing the plurality of laser writing beams by an objective lens, and creating a three-dimensional structure in the lithographic material by the focused laser writing beams.

[0014] Splitting the laser beam creates multiple laser writing beams that can be used to create three-dimensional structures, thereby reducing the time required to move the lithographic material relative to the laser writing beams, thereby allowing for particularly rapid production of three-dimensional structures.

[0015] When using two-photon or multiphoton polymerization, splitting of the laser writing beam by time demultiplexing can bring special advantages to laser lithography. The lithographic material is converted to an exposed state, in particular a polymerized or solidified state, by a nonlinear process. For this reason, when a pulsed laser beam is used, the peak power (output) of the individual laser pulses of the laser beam is a relevant variable for the process of two-photon or multiphoton polymerization. Time demultiplexing of the laser beam produces a laser writing beam with a higher peak power than a laser writing beam produced by successive beam splitting, for example by a beam splitter. Successive beam splitting can be understood as time-successive beam splitting or passive successive beam splitting. Successive beam splitting can be achieved by means of passive optical elements. Thus, time demultiplexing improves the process efficiency of two-photon or multiphoton polymerization.

[0016] The laser light source can be designed as a laser diode.

[0017] The laser writing beam strikes the lithographic material, i.e. is focused into the lithographic material, and the laser writing beam and the lithographic material are adjustable with respect to each other such that the lithographic material can be locally transferred to an exposed state, in particular a polymerized or solidified state, within a particular focal point of the laser writing beam or within multiple regions around it to create three-dimensional structures by multiphoton polymerization.

[0018] The laser writing beams can pass through a frequency doubling device that doubles the frequency of the laser writing beam. The frequency doubling device can be disposed between the waveguide arrangement and the objective lens. The frequency doubling device can include a nonlinear crystal, for example a lithium niobate crystal. The nonlinear crystal can be disposed in phase with the laser writing beams such that at least a portion of each laser writing beam is frequency doubled after passing through the nonlinear crystal. The frequency doubling device can be held by a holding matrix.

[0019] The lithography material holder can be designed to hold a lithography material for the purpose of creating a three-dimensional structure. In particular, it is said that the lithography material holder can hold a volume of the lithography material such that a laser writing beam can be focused into the lithography material. The lithography material holder can hold the lithography material such that an objective lens can be immersed in the lithography material for the purpose of creating a three-dimensional structure.

[0020] The lithographic material holder is preferably designed to hold the lithographic material in place to create three-dimensional structures, and may be referred to as a lithographic material carrier.

[0021] Various geometric designs of the lithographic material holder are conceivable, each of which may bring different advantages. For example, the lithographic material holder can be designed as a tank, container or pot for holding the lithographic material. It is also conceivable to design the lithographic material holder as a table, carrier or substrate on which the lithographic material is placed in the form of droplets or layers. It is also conceivable to place a substrate, in particular in the form of a wafer, on the table and to place the lithographic material on the substrate in the form of droplets or layers, in order to produce three-dimensional structures on the substrate. The table may be the machine table of the lithographic apparatus.

[0022] The lithographic material holder can be designed to be transparent to the laser writing beam at least in areas. For example, the walls, floor, or cover plate of the lithographic material holder, if present in a particular design, can be designed to be transparent to the laser writing beam. Thus, the laser writing beam can be focused through the lithographic material holder into the lithographic material. For example, illumination or exposure from below of the lithographic material is possible.

[0023] The input laser beam may be a continuous wave laser beam or a pulsed laser beam, in particular, the laser pulses of the pulsed laser beam may have a pulse duration of 50 femtoseconds to 500 nanoseconds.

[0024] The splitting of the input laser beam can be a temporal and / or spatial splitting of the input laser beam. In particular, a temporal and spatial splitting of the input laser beam can be performed simultaneously. The splitting of the input laser beam can preferably result in a temporal and spatial splitting of the input laser beam. Splitting can be understood as deflection, directing, separation or extraction. The splitting can be performed by an optical switch. The optical switch can be a fiber integrated optical switch.

[0025] In this regard, the method particularly provides for splitting the laser beam by a demultiplexer unit arranged between the laser beam source and the objective lens to form a plurality of laser writing beams. Splitting is specifically the opposite of multiplexing. The demultiplexer can include directing or directing at least a portion of the power of the input laser beam to one of several outputs of the demultiplexer unit. At least a portion of the power of the input laser beam directed or directed towards the output can form the laser writing beam after passing through the output. Splitting can include directing or directing at least a portion of the power of the input laser beam alternately to outputs of different demultiplexer units.

[0026] If the input laser beam is a pulsed laser beam, the demultiplexing can be a pulse picking of individual laser pulses or groups of laser pulses of the pulsed input laser beam. If the input laser beam is a continuous wave laser beam, the demultiplexing can be a formation of a pulsed laser writing beam, in particular, the pulse width and / or pulse length is equal to the switching duration of the demultiplexer unit. For example, a duty cycle pulse can be generated by the demultiplexer unit. That is, the demultiplexer unit can be used to pulse the continuous wave laser light.

[0027] The splitting of the input laser beam can be performed over time, periodically, or continuously in response to a signal. For example, the splitting can be performed so that each laser writing light is formed from the input laser beam for a specified period of time. The specified period can be, for example, 100 femtoseconds to 500 nanoseconds.

[0028] Each laser writing beam may propagate along a beam axis. The beam axes of the laser writing beams may be different from each other. The beam axes of the laser writing beams may be oriented parallel to each other and offset from each other. The beam axes of the laser writing beams and the beam axis of the input laser beam may be different from each other, in particular the beam axis of the input laser beam may be oriented orthogonal to the beam axis of the laser writing beam. In other words, the beam axis of the laser writing beam cannot run parallel to the beam axis of the laser beam.

[0029] The beam axis can be understood as the longitudinal axis of a particular laser beam extending in its propagation direction. In this respect, the beam axis can be defined by the Poynting vector of the radiation. The Poynting vector can be the effective Poynting vector. The effective Poynting vector can be, for example, the intensity-weighted average Poynting vector.

[0030] Each laser writing beam can be designed to transform the lithographic material into an exposed state by two-photon or multi-photon polymerization, specifically polymerizing or otherwise solidifying the lithographic material.

[0031] Focusing the multiple laser writing beams can include forming multiple focal points. In particular, all laser writing beams are focused using the same objective lens, in particular such that each laser writing beam has its own assigned focal point. These focal points can be spatially and temporally separated from one another. In other words, the laser writing beams can be focused such that the multiple laser writing beams form focal points one after the other in time and next to each other in space. It is preferred that the arrangement is such that the focal points are within the volume of the lithographic material, preferably below the surface of the lithographic material.

[0032] In connection with the step of focusing the multiple laser writing beams, the method may include a step of immersing the objective lens in the lithographic material, in particular before focusing, in other words the method may be a dip-in multiphoton polymerization method.

[0033] The objective lens may have a numerical aperture in the range of, for example, 0.01 to 1.6. In particular, a large numerical aperture can contribute to high accuracy.

[0034] Creating a three-dimensional structure in the lithographic material can include spatially overlapping a focal point of a laser writing beam on the lithographic material. In other words, the laser writing beam is focused on the lithographic material to create a three-dimensional structure. The three-dimensional structure of the lithographic material can be created using multiphoton polymerization of the lithographic material.

[0035] In a further development of the method, the splitting includes splitting off a portion of the laser beam from the input laser beam sufficient to transition the lithographic material to an exposed state, forming each laser writing beam. In particular, the splitting can be performed such that the particular laser writing beam at its focus has at least a sufficient exposure dose, energy dose and / or intensity for two-photon or multi-photon polymerization of the lithographic material. The exposure can be achieved by two-photon or multi-photon polymerization.

[0036] For example, the lithographic material may be liquid in an unexposed state and solid in an exposed state. In other words, the lithographic material may be locally solidified by transitioning the lithographic material locally to an exposed state. The unexposed, liquid lithographic material may then be separated from the solidified lithographic material as a result of exposure, for example in connection with a development step.

[0037] In another example, the lithographic material can be solid in the unexposed state and in the exposed state, its structure, e.g. chemical structure, molecular structure, crosslinking of the lithographic material, degree of polymerization, etc. can be changed compared to the unexposed state. In other words, the lithographic material can be locally transferred to the exposed state by changing the crosslinking of the lithographic material. The unexposed lithographic material can then be separated from the exposed lithographic material, e.g. in a development step.

[0038] In a further development of the method, the input laser beam is a pulsed laser beam having a plurality of laser pulses. The plurality of laser writing beams are formed by decoupling a first group of laser pulses and at least one second group of laser pulses from the pulsed input laser beam. The first group of laser pulses forms a first laser writing beam and the second group of laser pulses forms a second laser writing beam. The first group of laser pulses and the second group of laser pulses can be separated from each other in time and space. The decoupling can be referred to as pulse picking.

[0039] In a further development of the method, the method comprises a step of detecting the power of the input laser beam in the beam path of the input laser beam after the splitting. The formation of the multiple laser writing beams occurs as a function of the detected power. The detection of the power may be a detection of the power of a residual beam of the input laser beam. The residual beam is preferably not a laser writing beam. In particular, the residual beam may be a laser beam remaining from the input laser beam after the splitting of the input laser beam. The splitting may be performed by a demultiplexer unit. The power may be detected downstream of the demultiplexer unit. The power may be the power of the input laser beam after passing through the demultiplexer unit.

[0040] In a further development of the method, the method comprises a step of coupling a plurality of laser writing beams into a waveguide arrangement having a plurality of waveguides. In each case, one waveguide is assigned to one laser writing beam. The waveguides are arranged in the beam path between the laser beam source and the objective lens. This waveguide arrangement allows the method to be advantageously carried out in a particularly stable and reliable manner. The waveguide arrangement can generate a defined spatial arrangement of the laser writing beams relative to one another and maintain this robustly against interference. Each waveguide can be designed to guide or direct a specific laser writing beam. Each waveguide can be designed as or include a hollow-core or solid-core fiber.

[0041] In a further development of the method, each waveguide has a first end and a second end opposite the first end. Each first end is configured to couple a laser writing beam and each second end is configured to decouple a laser writing beam coupled to the first end. The second ends of the plurality of waveguides are held by a holding matrix of the waveguide arrangement. The method can result in a shift of the focal point relative to the lithographic material holder by shifting the holding matrix. The waveguides can follow the movement of the holding matrix, if necessary, for example by corresponding (elastic) deformation, bending or the like. The shift of the focal point relative to the lithographic material holder can also be performed or supported by a shift of the objective lens. Alternatively or in addition to the above options, the focal point can be shifted relative to the lithographic material holder by shifting the lithographic material holder and / or by deflecting the laser writing beam with an optical deflection device to shift the focal point relative to the lithographic material holder.

[0042] By providing a holding matrix, the second ends of the waveguides can be held in a particularly compact and accurate manner relative to one another in a defined arrangement.

[0043] The retaining matrix may be made of plastic, resin, glass or silicon, and the second ends of the waveguides are at least partially, in particular sectionally, embedded in the retaining matrix.

[0044] The retention matrix can have a substrate with precision machined V-shaped notches for inserting the waveguides. Alternatively, the retention matrix can have a microstructured perforated plate, and the waveguides can be inserted into the holes in the perforated plate. Alternatively, the retention matrix can have a plurality of ferrules, and the waveguides can be inserted into the ferrules. Alternatively, the retention matrix can be a welded connection between the second ends of the waveguides in the waveguide arrangement.

[0045] A shift can be understood as the performance of a movement. Each shift can be performed by a drive, in particular a linear drive and / or a rotary drive.

[0046] The shifting of the retention matrix can be achieved by moving the retention matrix across the laser writing beam and / or by moving the retention matrix longitudinally relative to the laser writing beam.

[0047] During the shifting of the focal point relative to the lithographic material holder by shifting the holding matrix, the objective lens can be stationary or can be shifted together with the holding matrix. Shifting the holding matrix together with the objective lens can mean that the holding matrix and the objective lens are shifted simultaneously in the same direction and by the same distance. The joint shifting of the holding matrix and the objective lens can be achieved, for example, by the same drive.

[0048] The holding matrix and / or the objective lens can be stationary when shifting the focal point relative to the lithographic material holder due to the shifting of the lithographic material holder.

[0049] The optical deflection device can be disposed between the waveguide arrangement and the objective lens and can include a scanner mirror, a mirror galvanometer, an acousto-optic deflector, an acousto-optic modulator, and / or a pellicle mirror for deflecting the laser writing beam.

[0050] In a further development of the method, each waveguide is designed as a hollow core optical fiber. This ensures that undesired absorption is significantly reduced and the damage threshold of the waveguide is significantly higher. Furthermore, each hollow core fiber can be aligned with the associated laser writing beam so that no pulse broadening of the laser pulse of the laser writing beam occurs after passing through the hollow core fiber. The hollow core fiber can be an optical fiber having a hollow fiber core.

[0051] In a further development of the method, each waveguide is selected from the group comprising HC PCF fibre, in particular HC Kagome fibre, HC PBGF fibre, HC ARF fibre, HC IC fibre, RH fibre, LMA fibre, PCF fibre.

[0052] It can be understood that HC PCF fiber is hollow-core photonic crystal fiber, HC Kagome fiber is hollow-core Kagome fiber, HC PBGF fiber is hollow-core photonic bandgap fiber, HC ARF fiber is hollow-core anti-resonant fiber, HC IC fiber is hollow-core suppressed-coupled fiber, RH fiber is radiation-hardened fiber, LMA fiber is large-mode-area fiber, and PCF fiber is photonic crystal fiber.

[0053] According to the invention there is provided a laser lithography apparatus for producing three-dimensional structures in a lithography material. In so far as the features and components of the laser lithography apparatus are also described in connection with the present method, the statements in this respect also apply accordingly to the laser lithography apparatus. The apparatus comprises a lithography material holder, a laser beam source, a demultiplexer unit, an objective lens and a scanning device. The lithography material holder is designed to hold the lithography material. The laser beam source is designed to generate an input laser beam. The demultiplexer unit is arranged between the laser beam source and the objective lens, in particular in the propagation direction of the input laser beam. The demultiplexer unit is configured to split the input laser beam into a plurality of laser writing beams over time by demultiplexing. The objective lens is designed to focus the laser writing beam in a focal point assigned to each laser writing beam. The scanning device is designed to shift the focal point relative to the lithography material holder.

[0054] The laser lithography apparatus is specifically designed and specifically configured to carry out the aforementioned method, and the above description of the method is also applicable to identical or functionally equivalent features of the laser lithography apparatus.

[0055] The scanning device may comprise an optical deflection device as described above for deflecting the laser writing beam and thereby shifting the focal point relative to the lithography material holder. The optical deflection device of the scanning device may be arranged between the demultiplexer unit and the objective lens.

[0056] Additionally or alternatively, the scanning device can be designed to shift the focal point relative to the lithographic material holder by shifting the objective lens and / or to shift the focal point relative to the lithographic material holder by shifting the lithographic material holder, for which the scanning device can comprise here an actuator, in particular a servomotor or a linear actuator, preferably a vibration piezoelectric actuator.

[0057] The lithographic material may be held by a lithographic material holder. The lithographic apparatus may also include the lithographic material.

[0058] In a further development of the laser lithography apparatus, the laser beam source is designed to generate a pulsed input laser beam having a plurality of laser pulses. The demultiplexer unit is designed to perform the demultiplexing by separating a first group of laser pulses and at least one second group of laser pulses from the pulsed input laser beam. The first group of laser pulses forms a first laser writing beam and the second group of laser pulses forms a second laser writing beam.

[0059] In a further development of the laser lithography apparatus, the demultiplexer unit comprises a plurality of optical switches, in particular three, four or five, arranged in series one after the other in the beam path of the input laser beam. In a switching position, each optical switch is configured to form a respective laser writing beam by splitting off a portion of the laser beam from the input laser beam sufficient to transition the lithography material to an exposed state. In a non-switching position, in particular, the laser writing beam is not split off. Each optical switch can be designed as a fiber-integrated optical switch.

[0060] The optical switches can be arranged in series in the direction of propagation of the input laser beam. Multiple optical switches can equate to multiple laser writing beams. In each case, one optical switch can be provided to form one laser writing beam.

[0061] Each optical switch may have an acousto-optic modulator or deflector for splitting off a portion of the laser beam from the input laser beam sufficient to transition the lithographic material to an exposed state. Each optical switch may have a digital input for moving the optical switch to a switching position. A signal may be applied to the digital input to move the optical switch between a switching position and a non-switching position. For example, the optical switch may be in a switching position when a signal is applied to the digital input and in a non-switching position when no signal is applied to the digital input.

[0062] Specifically, when the optical switch is in the unswitched position, it is said that an input laser beam can pass through the optical switch without forming a laser writing beam.

[0063] The degree to which each optical switch is decoupled can be adjusted, in particular it can be infinitely variable. The degree to which an optical switch is decoupled can be the relationship of the power, in particular the peak power or the average power, of the laser writing beam formed by the optical switch to the power, in particular the peak power or the average power, of the input laser beam upstream of the optical switch. In the non-switched position, the degree of decoupling can be 0%. In other words, at a degree of decoupling of 0%, the input laser beam can pass through the optical switch without forming a laser writing beam. In the switched position, the degree of decoupling can be, for example, 10%, 20%, 30%, 40%, 50%, 60%, 80%, 90% or 95%. In other words, when the optical switches are continuously in the switched position, the power of the laser writing beam formed by the optical switch is 10%, 20%, 30%, 40%, 50%, 60%, 80%, 90% or 95% of the power of the input laser beam upstream of the optical switch.

[0064] The optical switch may have an analog input to which a signal may be applied to adjust the degree of separation, thereby achieving different exposure levels of the lithographic material.

[0065] In a further development of the laser lithography apparatus, the demultiplexer unit comprises an optical switch arranged in a beam path of the input laser beam downstream of the laser beam source, the demultiplexer unit having an optical arrangement configured to direct the input laser beam several times through the optical switch, in a switching position the optical switch is configured to form a laser writing beam from the input laser beam by cutting off a portion of the laser beam sufficient to transition the lithography material to an exposed state.

[0066] The demultiplexer unit may in particular comprise a single optical switch. The optical arrangement may then be configured to pass the input laser beam through the optical switch two, three or four times. The optical arrangement may be configured to direct the input laser beam through the optical switch multiple times at different angles of incidence. The above description of the optical switch may also be applied to optical switches where the input laser beam is directed several times.

[0067] In a further development of the laser lithography apparatus, the laser lithography apparatus comprises a power detection unit for detecting a power of the input laser beam in the beam path after the demultiplexer unit, the laser lithography apparatus comprises a control unit configured to control the demultiplexer unit for forming a plurality of laser writing beams by demultiplexing the input laser beam as a function of the detected power, the control unit may be a computer or a calculation unit.

[0068] The power detection unit can be a photodiode or a power detector that detects the power of the input laser beam. The power detection unit can be configured such that it detects the power of a residual beam of the input laser beam. The residual beam cannot be the laser writing beam. The residual beam can be a laser beam that remains from the input laser beam after passing through the demultiplexer unit. The power can be the power of the residual beam.

[0069] In a further development of the laser lithography device, the laser lithography device has a waveguide arrangement with a plurality of waveguides guiding a plurality of laser writing beams. In each case, one waveguide is assigned to one laser writing beam. The waveguides in the beam path are arranged between a demultiplexer unit and an objective lens. Each waveguide has a first end and a second end opposite the first end. Each first end is configured to couple a laser writing beam, and each second end is configured to decouple a laser writing beam coupled to the first end. The second ends of the plurality of waveguides are held by a holding matrix of the waveguide arrangement. In the holding matrix, the waveguides can run parallel to each other and offset from each other. Each waveguide can be formed as a hollow core fiber or a solid core fiber, or can include a corresponding fiber.

[0070] The second ends can be spaced apart from each other in the propagation direction of the laser writing beam decoupled from the second ends. In other words, each second end of the plurality of waveguides can have an end face configured to decouple the laser writing beam coupled to the first end, the end faces of the second ends being located on different planes from each other. In other words, the second ends extend to different distances. Advantageously, this allows for simultaneous exposure of lithographic material on different planes. This can increase the stability of the three-dimensional structure during the fabrication or printing process. Furthermore, the three-dimensional structure can be fabricated more quickly. In particular, this can allow for a higher packing density of the foci.

[0071] In a further development of the laser lithography apparatus, the second ends of the plurality of waveguides are held in a linear or two-dimensional arrangement by a holding matrix. The linear and / or two-dimensional arrangement can be a regular arrangement.

[0072] When the second ends are held in a linear arrangement, the second ends can be equidistant from each other. When the second ends are held in a two-dimensional arrangement, the second ends can be arranged in a crystal-like structure. A crystal-like structure can be understood to mean that the second ends are arranged like a dot lattice having a periodic repeating pattern.

[0073] In a further development of the laser lithography apparatus, the distance between two adjacent second ends of the plurality of waveguides is between 25 μm and 1000 μm, in particular between 115 μm and 600 μm, thereby realizing a particularly compact waveguide configuration.

[0074] In a further development of the laser lithography apparatus, each second end of the plurality of waveguides has an end face configured to decouple a laser writing beam coupled to the first end, the end faces of the second ends being disposed in a plane, the plane being capable of being aligned perpendicular to a direction of propagation of the decoupled laser writing beam.

[0075] In a further development of the laser lithography apparatus, the scanning device is configured to shift the focal point relative to the lithography material holder by shifting the holding matrix. For this purpose, the scanning device can include an actuator, in particular a servo motor or a linear motor, which shifts the holding matrix.

[0076] In a further development of the laser lithography apparatus, each waveguide is designed as a hollow core optical fiber.

[0077] In a further development of the laser lithography apparatus, each waveguide is selected from the group comprising HC PCF fibre, in particular HC Kagome fibre, HC PBGF fibre, HC ARF fibre, HC IC fibre, RH fibre, LMA fibre, PCF fibre.

[0078] Further advantages and aspects of the present invention will become apparent from the following description of preferred exemplary embodiments thereof, taken in conjunction with the drawings, and from the claims, in which identical and functionally corresponding elements are designated by the same reference numerals. [Brief description of the drawings]

[0079] [Figure 1] 1 shows a schematic diagram of a laser lithography apparatus; [Diagram 2] 1 shows a schematic diagram of the operation of a demultiplexer unit of a laser lithography apparatus; [Diagram 3] 1 shows a schematic diagram of the front side of a waveguide arrangement of a laser lithography apparatus. [Figure 4] FIG. 4 shows the schematic diagram of FIG. 3 for a variation of the waveguide configuration. [Diagram 5] 2 shows a schematic diagram of the focus of a laser writing beam in a focal plane. [Figure 6] 6 shows a schematic diagram of the focus of FIG. 5 in a plane orthogonal to the focal plane. [Figure 7] 2 shows a schematic diagram of FIG. 1 for a variant of the laser lithography apparatus; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0080] FIG. 1 shows a laser lithography apparatus 10 for producing three-dimensional structures in a lithographic material 12 by multiphoton polymerization.

[0081] The laser lithography apparatus 10 comprises a lithography material holder 14. The lithography material holder 14 is designed as a table in the form of a machine table. A substrate 16 in the form of a wafer is arranged on the lithography material holder 14, on which a three-dimensional structure is to be produced.

[0082] Lithographic material 12 is present in the form of droplets on lithographic material holder 14 and substrate 16. Figure 1 shows lithographic material 12 in contact with lithographic material holder 14 and substrate 16. In another embodiment (not shown), lithographic material only contacts the substrate. In either case, lithographic material holder 14 is designed to hold lithographic material 12 for the purpose of creating three-dimensional structures.

[0083] The laser lithography apparatus 10 includes a laser beam source 18 that generates an input laser beam 20. The input laser beam 20 propagates in a propagation direction 22.

[0084] The input laser beam 20 is a pulsed laser beam including a plurality of laser pulses. The laser pulses of the pulsed input laser beam 20 have a pulse duration of 250 femtoseconds. The laser pulses of the pulsed input laser beam 20 have a repetition rate of 80 MHz.

[0085] The laser lithography apparatus 10 comprises a demultiplexer unit 24. The demultiplexer unit 24 is arranged after the laser source 18 in the propagation direction 22 of the input laser beam 20. The demultiplexer unit 24 is configured to split the input laser beam 20 in time and space into a number of laser writing beams 26 by demultiplexing.

[0086] Each laser writing beam 26 propagates along a beam axis. The beam axis is the longitudinal axis of a particular laser writing beam 26 and extends in its direction of propagation. The beam axes of the laser writing beams 26 are different from one another. The beam axes of the laser writing beams 26 are oriented parallel to one another and offset from one another. The beam axis of the laser writing beams 26 and the beam axis of the input laser beam 20 are oriented orthogonal to one another. In other words, the beam axis of the laser writing beam 26 does not run parallel to the beam axis of the laser beam 20.

[0087] 1, the input laser beam 20 is split into a total of four laser writing beams 26 by the demultiplexer unit 24. For this purpose, the demultiplexer unit 24 has a total of four optical switches 28 arranged in series one after the other in the propagation direction 22. In other words, in the unswitched positions of the optical switches 28, the input laser beam 20 can pass through the optical switches 28 one after the other without being influenced by the optical switches 28.

[0088] In each case, one optical switch 28 is provided to form one laser writing beam 26. Each optical switch 28 is configured to form a respective laser writing beam 26 from the input laser beam 20 in a switching position. Each optical switch 28 is designed as an acousto-optical modulator. The laser writing beam 26 is formed by splitting off a portion of the laser beam from the input laser beam 20 that is sufficient to solidify the lithographic material 12. In other words, splitting is the directing or guiding of a sufficient portion of the laser beam to one of several outputs 29 of the demultiplexer unit 24. In the illustrated exemplary embodiment, this is done by the optical switches 28 and deflection mirrors (not shown for simplicity).

[0089] Demultiplexer unit 24 has a total of four outputs 29. The number of outputs 29 is equal to the number of laser writing beams 26 formed by demultiplexer unit 24. A sufficient portion of the laser beam directed or guided to an output 29 forms a laser writing beam 26 after passing through output 26.

[0090] To form the four laser writing beams 26 by the demultiplexer unit 24 , the optical switches 28 are successively moved to switching positions and a sufficient portion of the laser beam is decoupled from the input laser beam 20 and directed to an associated output 29 .

[0091] Each optical switch 28 has a digital input for moving the optical switch between a non-switching position and a switching position. Movement to the switching or non-switching position is effected by a signal applied to the digital input. In the illustrated example, optical switch 28 is in the switching position when a signal is applied to the digital input and is in the non-switching position when no signal is applied to the digital input.

[0092] The laser lithography apparatus 10 comprises a control unit 30 configured to control the demultiplexer unit 24 for the purpose of forming the laser writing beam 26 by demultiplexing the input laser beam 20. The optical switches 28 are successively moved to their switching positions by the control unit 30. To this end, the control unit 30 applies signals to the digital inputs of each of the optical switches 28 in sequence.

[0093] The laser lithography apparatus 10 comprises a power detection unit 32 downstream of the demultiplexer unit 24 in the form of a power detector for detecting the power of the input laser beam 20. The power detection unit 32 thus detects the power of the input laser beam 20 remaining from the input laser beam 20 after passing through the demultiplexer unit 24. In the example shown in Fig. 1, the power detection unit 32 is arranged such that the input laser beam 20 impinges on the power detection 32 when the optical switch 28 is in the unswitched position and the input laser beam 20 passes through the optical switch 28 in sequence without being influenced by the optical switch 28. The power detection unit 32 detects a power of the input laser beam 20 equal to the power of the input laser beam 20 upstream of the demultiplexer unit 24.

[0094] When one of the optical switches 28 is in a switching position, e.g., 80% of the peak power of the input laser beam 20 is switched off to form the laser writing beam 26, the power detection unit 32 detects the power of the input laser beam 20. Here, the peak power of the input laser beam 20 impinging on the power detection unit 32 is 20% of the peak power of the input laser beam 20 upstream of the demultiplexer unit 24.

[0095] The control unit 30 is configured to control the demultiplexer unit 24 as a function of the power detected by the power detection unit 32 .

[0096] An example of the operation of the demultiplexer unit 24 is shown in FIG.

[0097] In Fig. 2 a) the individual laser pulses 34 of the pulsed input laser beam 20 upstream of the demultiplexer unit 24 are shown in the form of arrows on a time axis 36. In Fig. 2 b) to e) the time progression of the signals applied by the control unit 30 to the digital inputs of the respective optical switches 28 is shown on the time axis 36. When the signal has the value 1 the respective optical switch 28 assumes a switching position and when the signal has the value 0 the respective optical switch 28 assumes a non-switching position.

[0098] The control unit 30 is configured to sequentially apply signals to the digital inputs of the optical switches 28 for a specified duration. The specified duration is the same for all optical switches 28. In the exemplary embodiment of FIG. 2, the specified duration is selected such that each optical switch 28 splits off ten laser pulses 34 from the input laser beam 20. In other words, the control unit 30 is configured to apply signals to the digital inputs of the optical switches 28 for a duration of ten laser pulses 34. However, the specified duration can also be selected to be different such that more or fewer laser pulses 34 are split off. The split laser pulses 34 at least partially form the laser writing beam 26.

[0099] Between two successive signals applied to the optical switch 28, no signal is applied to the optical switch 28 for a designated period of time. In the exemplary embodiment of FIG. 2, the designated period of time is selected such that during the separated laser pulse 34, the two laser pulses 34 are not separated by the optical switch 28. The unseparated laser pulses 34 reach the power detection unit 32. However, the designated period of time can also be selected to be different such that more or fewer laser pulses reach the power detection unit 32.

[0100] In detail, FIG. 2 shows that two laser pulses 34 reach the power detection unit 32 in a period 38. The control unit 30 applies a signal shown in FIG. 2 b) to the first optical switch 28 for a period 40 including ten laser pulses 34. The ten laser pulses 34 separated by the first optical switch 28 at least partially form the first laser writing beam 26. Then, two laser pulses 34 reach the power detection unit 32 in a period 42. The control unit 30 applies a signal shown in FIG. 2 c) to the second optical switch 28 for a period 44 including ten laser pulses 34. The ten laser pulses 34 separated by the second optical switch 28 at least partially form the second laser writing beam 26. Then, two laser pulses 34 reach the power detection unit 32 in a period 46. The control unit 30 applies a signal shown in FIG. 2 d) to the third optical switch 28 for a period 48 including ten laser pulses 34. The ten laser pulses 34 separated by the third optical switch 28 at least partially form the third laser writing beam 26. Then, two laser pulses 34 of period 50 reach the power detection unit 32. The control unit 30 applies the signal shown in FIG. 2e) to the fourth optical switch 28 during a period 52 including the ten laser pulses 34. The ten laser pulses 34 separated by the fourth optical switch 28 at least partially form the fourth laser writing beam 26. The next two subsequent laser pulses 34 start the sequence of applying signals to the optical switch 28 again.

[0101] Calibration of the optical switches 28, in particular the calibration of the time offset for the operation of the optical switches 28, is performed by applying in each case one periodic signal to two optical switches 28 and no signal to the remaining optical switch 28. After this, the time offset between these two periodic signals is changed and at the same time the average power is detected by the power detection unit 32. In this case, the maximum average power is detected in the power detection unit 32 when the two optical switches 28 are simultaneously in the switching position. The time offset of this state can be used to determine the time offset that the operating state shown in Figure 2 causes for these two optical switches 28. The remaining optical switches 28 are calibrated accordingly.

[0102] The demultiplexer unit 24 is designed to perform the demultiplexing by splitting groups of laser pulses from the pulsed input laser beam 20. The groups of laser pulses form the laser writing beam 26. That is, the demultiplexer unit 24 forms the laser writing beam 26 by pulse picking. The laser writing beam 26 is formed by splitting the laser pulses 34 of the input laser beam 20 in time and space.

[0103] The optical switches 28 in each case have an analog input to which a signal can be applied to set the degree of decoupling. The degree of decoupling of each optical switch 28 is infinitely variably adjustable. The degree of decoupling is the relationship of the peak power of the laser writing beam 26 formed by the optical switch 28 to the peak power of the input laser beam 20 upstream of the optical switch 28.

[0104] The control unit 30 is configured to apply a signal to each optical switch 28 that adjusts the degree of decoupling. In the illustrated example, the control unit 30 applies a signal to the analog input such that the degree of decoupling is 80%. In other words, the peak power of the laser pulse decoupled by the optical switch 28 is reduced by 20% compared to the peak power of the laser pulse of the input laser beam 20.

[0105] The laser lithography apparatus 10 comprises a waveguide arrangement 54 (see FIG. 1). The waveguide arrangement 54 comprises a number of waveguides 56 which guide a number of laser writing beams 26. In each case, one waveguide 56 is assigned to one laser writing beam 26.

[0106] Waveguides 56 are disposed in the beam path downstream of the demultiplexer unit 24. Each waveguide 56 is a hollow-core optical fiber, i.e., a hollow-core photonic crystal fiber. Each waveguide 56 is designed to direct or guide the laser writing beam 26 associated with the waveguide 56.

[0107] Each waveguide 56 has a first end 58 and a second end 60 opposite the first end. Each first end 58 is configured to couple a laser writing beam 26 associated with the waveguide 56. The laser writing beam 26 is coupled to the waveguide 56 via free-space beam coupling. Each second end 60 has an end face configured to decouple the laser writing beam 26 coupled to the first end 58. Thus, each second end 60 is configured to decouple the laser writing beam 26 coupled to the first end 58.

[0108] The second end 60 is held by a retaining matrix 62 of the waveguide arrangement 54. In the retaining matrix 62, the waveguides 56 run parallel to each other and offset from each other. In the illustrated example, the retaining matrix 62 comprises a substrate with precision-machined parallel V-shaped notches. The substrate may be made of, for example, plastic, resin, glass or silicon. The waveguides 56 are inserted into these notches. The free space between the waveguides 56 and the substrate is filled with a glue suitable for the optical system, for example in the form of a UV glue. The cover of the retaining matrix 62 is glued, forcing the waveguides 56 into the V-shaped notches.

[0109] The end face of the second end 60 is disposed in a plane. The plane and the end face 64 are aligned perpendicular to the direction of propagation of the decoupled output laser writing beam 26.

[0110] 3 shows a schematic diagram of an end face 64 of the waveguide arrangement 54. The second ends 60 of the waveguides 56 are held in a regular linear arrangement by a holding matrix 62. In other words, the second ends 60 have the same distance 66 from each other. The distance 66 between two adjacent second ends 60 is 250 μm.

[0111] Figure 4 shows another exemplary embodiment of the waveguide arrangement 54 of Figure 3, which is suitable for use with up to eight laser writing beams. Identical and functionally equivalent elements have the same reference numerals, and in this respect reference may be made to the above description of the exemplary embodiment of Figure 3, so that essentially only existing differences are highlighted.

[0112] 4 are held in a regular two-dimensional arrangement by a holding matrix 62. The second ends 60 are arranged like a crystal structure. In other words, the second ends 60 are arranged in a periodically repeating pattern.

[0113] 1 shows that lithography apparatus 10 has an optical deflection device 68 in the form of a mirror galvanometer and an objective lens 70 in the beam path of laser writing beam 26 downstream of waveguide arrangement 54. Optical deflection device 68 is designed to deflect laser writing beam 26, and objective lens 70 is designed to focus laser writing beam 26.

[0114] Objective lens 70 is immersed in lithographic material 12. Objective lens 70 focuses laser writing beam 26 for the purpose of creating three-dimensional structures in lithographic material 12. All of the focal points of laser writing beam 26 are in one focal plane.

[0115] Figure 5 is a schematic diagram of a focal plane and individual focal points 72. By splitting the input laser beam 20, focal points 72 that are separated in time and space from one another are formed in the lithographic material 12. This is illustrated in Figure 5 by the dashed and solid lines of the focal points 72.

[0116] Figure 6 is a schematic diagram of the focal point 72 of Figure 5 in a plane orthogonal to the focal plane 74. A region 76 around the focal point of the laser writing beam is shown where the lithographic material 12 solidifies by multiphoton polymerization. Thus, the laser writing beam 26 formed by splitting has a portion of the laser beam from the input laser beam 20 sufficient to solidify the lithographic material 12.

[0117] 1 shows that the lithographic apparatus 10 has a scanning device 78 for shifting the focal point 72 relative to the lithographic material holder 14. The scanning device 78 includes an optical deflection device 68. Furthermore, the scanning device 78 has an actuator 80 arranged on the lithographic material holder 14, an actuator 82 arranged on the objective lens 70, and an actuator 84 arranged on the retention matrix 62. Each actuator 80, 82, 84 is a linear actuator in the form of a piezoelectric actuator. In alternative embodiments (not shown), other types of actuators are also contemplated.

[0118] In another exemplary embodiment (not shown), the lithographic apparatus 10 may comprise at least one of the actuators 80 , 82 , 84 .

[0119] An actuator 80 disposed on the lithographic material holder 14 allows the scanning device 78 to shift the focal point 72 relative to the lithographic material holder 14 by shifting the lithographic material holder 14. An actuator 82 disposed on the objective lens 70 allows the scanning device 78 to shift the focal point 72 relative to the lithographic material holder 14 by shifting the objective lens 70. An actuator 84 disposed on the retention matrix 62 allows the scanning device 78 to shift the focal point 72 relative to the lithographic material holder 14 by shifting the retention matrix 62. An optical deflection device 68 allows the scanning device 78 to shift the laser writing beam 26 to shift the focal point 72 relative to the lithographic material holder 14.

[0120] The laser lithography apparatus 10 is designed to perform a method of fabricating a three-dimensional structure in a lithographic material 12. The method includes the steps of holding the lithographic material 12 with a lithographic material holder 14, splitting an input laser beam 20 by a demultiplexer unit 62 disposed between a laser beam source 18 and an objective lens to form four laser writing beams 26, coupling the laser writing beams 26 into a waveguide arrangement 54 having a plurality of waveguides 56, immersing the objective lens in the lithographic material, focusing the laser writing beams 26 into the lithographic material 12 by an objective lens 70, and using the focused laser writing beams 26 to fabricate a three-dimensional structure in the lithographic material 12 by multiphoton polymerization.

[0121] Figure 7 shows a further exemplary embodiment of the laser lithography apparatus 10 of Figure 1, where identical reference symbols are used for identical and functionally equivalent elements, and in this respect reference may be made to the above description of the exemplary embodiment of Figure 1, so that essentially only existing differences will be discussed.

[0122] The laser lithography apparatus 10 comprises an additional laser beam source 86. The additional laser beam source 86 is designed to generate a continuous wave laser beam.

[0123] In another exemplary embodiment (not shown), the additional laser beam source can be designed to generate a pulsed laser beam.

[0124] In the exemplary embodiment of Fig. 7, the additional laser beam source 86 is coupled to the waveguide 56 of the waveguide arrangement 54. In other words, the additional laser beam source 86 provides its generated laser beam to a fiber output that is coupled to a first end of the waveguide 56 of the waveguide arrangement 54. To couple the generated laser radiation, the fiber output can be connected to the first end of the waveguide 56. Alternatively, the fiber output and the first end of the waveguide 56 can be held by a coupler for the purpose of coupling the generated laser radiation to the first end.

[0125] The additional laser beam source 86 may have an integrated power modulation. The integrated power modulation may be implemented, for example, by an integrated acousto-optical modulator. Alternatively, the additional power beam source 86 may modulate its power by electrical switching, for example by switching it alternately on and off. Alternatively, the additional power beam source 86 may be modulated by direct modulation, for example by electrically switching a supply current.

[0126] 7 includes three optical switches 28, each of which generates a laser writing beam 26 by splitting an input laser beam 20. The three laser writing beams 26 are coupled to the remaining three waveguides 56 of the waveguide arrangement 54 via free-space beam combining. [Explanation of symbols]

[0127] 10 Laser lithography equipment 12 Lithography Materials 14 Lithography material holder 16 Substrate 18 Laser beam source 20 Input laser beam 22 Propagation direction 24 Demultiplexer Unit 26 Laser writing beam 28 Optical Switch 29 Output 30 Control Unit 32 Power Detection Unit 34 Laser Pulse 54 Waveguide configuration 56 Waveguide 58 First end 60 Second end 62 Retention Matrix 64 End face 68 Light deflection device 70 Objective Lens 72 focus 78 Scanning Device 80, 82, 84 Actuator

Claims

1. A method for producing a three-dimensional structure in a lithographic material (12), comprising the steps of: holding said lithographic material (12) by a lithographic material holder (14); generating an input laser beam (20) by a laser beam source (18); splitting the input laser beam (20) to form a plurality of laser writing beams (26) by splitting the input laser beam (20) in time; focusing the laser writing beam (26) by an objective lens (70); creating the three-dimensional structure in the lithographic material (12) with the focused laser writing beam (26); The method includes:

2. 2. The method of claim 1, wherein each of the laser writing beams (26) is formed by splitting off a portion of the laser beam (20) sufficient to transition the lithographic material (12) to an exposed state from the input laser beam (20).

3. the input laser beam (20) being a pulsed laser beam (20) having a plurality of laser pulses (34); The input laser beam (20) is split by separating a first group of the laser pulses (34) and a second group of at least one of the laser pulses (34) from the pulsed input laser beam (20), thereby: a first group of the laser pulses (34) forming a first laser writing beam and a second group of the laser pulses (34) forming a second laser writing beam; The method according to claim 1 or claim 2.

4. 3. The method of claim 1 or claim 2, further comprising detecting a power of the input laser beam (20) in a beam path of the input laser beam (20) after splitting, and the multiple laser writing beams (26) are formed as a function of the detected power.

5. 3. The method of claim 1 or 2, comprising a step of coupling the multiple laser writing beams (26) into a waveguide arrangement (54) including multiple waveguides (56), in each case one waveguide (56) assigned to one laser writing beam (26), the waveguides (56) being arranged in a beam path between the laser beam source (18) and the objective lens (70).

6. Each of the waveguides (56) has a first end (58) and a second end (60) opposite the first end (58); each said first end (58) configured to couple said laser writing beam (26) and each said second end (60) configured to decouple said laser writing beam (26) coupled to said first end (58); the second ends (60) of the plurality of waveguides (56) are held by a retention matrix (62) of the waveguide arrangement (54); Shifting the focal point (72) relative to the lithographic material holder (14) by shifting the retention matrix (62), and / or shifting the focal point (72) relative to the lithography material holder (14) by shifting the objective lens (70); shifting the lithography material holder (14) to shift the focal point (72) relative to the lithography material holder (14); and / or shifting the focal point (72) relative to the lithography material holder (14) by deflecting the laser writing beam (26) using an optical deflection device (68). The method according to claim 5.

7. 6. The method of claim 5, wherein each of the waveguides (56) is selected from the group comprising HC PCF fiber, in particular HC Kagome fiber, HC PBGF fiber, HC ARF fiber, HC IC fiber, RH fiber, LMA fiber, PCF fiber.

8. A laser lithography apparatus (10) for producing three-dimensional structures in a lithographic material (12), comprising: a lithography material holder (14) for holding the lithography material (12); a laser beam source (18) generating an input laser beam (20); a demultiplexer unit (24) arranged between the laser beam source (18) and an objective lens (70) and configured to split the input laser beam (20) into a plurality of laser writing beams (26) over time by demultiplexing; the objective lens (70) for focusing the laser writing beam (26) at a focal point (72) assigned to the laser writing beam (26); a scanning device (78) for shifting the focal point (72) relative to the lithography material holder (14); A laser lithography apparatus (10) comprising:

9. The laser beam source (18) is configured to generate a pulsed input laser beam (20) having a plurality of laser pulses (34); the demultiplexer unit (24) is designed to demultiplex by separating a first group of the laser pulses (34) and a second group of at least one of the laser pulses (34) from the pulsed input laser beam (20); a first group of the laser pulses (34) forming a first laser writing beam (26) and a second group of the laser pulses (34) forming a second laser writing beam (26); 9. A laser lithography apparatus (10) according to claim 8.

10. The demultiplexer unit (24) includes a plurality of optical switches (28) arranged in series and sequentially in the beam path of the input laser beam (20); Each of the optical switches (28) in a switched position is configured to shape a respective one of the laser writing beams (26) by cutting off a portion of the laser beam sufficient to transition the lithographic material (12) to an exposure state. A laser lithography apparatus (10) according to claim 8 or claim 9.

11. the demultiplexer unit (24) includes an optical switch (28) disposed in a beam path of the input laser beam (20) downstream of the laser beam source (18); the demultiplexer unit (24) having an optical arrangement configured to direct the input laser beam (20) through the optical switch (28) several times; the optical switch (28) in a switched position is configured to shape the laser writing beam (26) by cutting off a portion of the laser beam sufficient to transition the lithographic material (12) to an exposed state. A laser lithography apparatus (10) according to claim 8 or claim 9.

12. a power detection unit (32) in the beam path downstream of the demultiplexer unit (24) for detecting the power of the input laser beam (20); a control unit (30) configured to control the demultiplexer unit (24) for forming the plurality of laser writing beams (26) by demultiplexing the input laser beam (20) as a function of the detected power. A laser lithography apparatus (10) according to claim 8 or claim 9.

13. the laser lithography apparatus (10) comprises a waveguide arrangement (54) having a plurality of waveguides (56) for guiding the plurality of laser writing beams (26), in each case one of the waveguides (56) being assigned to one of the laser writing beams (26); the waveguide (56) is disposed in a beam path between the demultiplexer unit (24) and the objective lens (70); Each of the waveguides (56) has a first end (58) and a second end (60) opposite the first end (58); each said first end (58) configured to couple said laser writing beam (26) and each said second end (60) configured to decouple said laser writing beam (26) coupled to said first end (58); the second ends (60) of the plurality of waveguides (56) being held by a retention matrix (62) of the waveguide arrangement (54); A laser lithography apparatus (10) according to claim 8 or claim 9.

14. 14. The laser lithography apparatus (10) of claim 13, wherein the second ends (60) of the plurality of waveguides (56) are held in a linear or two-dimensional arrangement by the holding matrix (62).

15. The laser lithography apparatus (10) of claim 13, wherein a distance between two adjacent second ends (60) of the plurality of waveguides (56) is between 25 μm and 1000 μm, in particular between 115 μm and 600 μm.

16. the second ends (60) of each of the plurality of waveguides (56) having an end face configured to decouple the laser writing beam (26) coupled to the first ends (58); The end surface of the second end (60) is disposed in one plane. A laser lithography apparatus (10) according to claim 13.

17. 14. The laser lithography apparatus (10) of claim 13, wherein the scanning device (78) is configured to shift the focal point (72) relative to the lithography material holder (14) by shifting the retention matrix (62).

18. The laser lithography apparatus (10) of claim 13, wherein each of the waveguides (56) is configured as an optical hollow core fiber.

19. 14. The laser lithography apparatus (10) of claim 13, wherein each of the waveguides (56) is selected from the group comprising HC PCF fiber, in particular HC Kagome fiber, HC PBGF fiber, HC ARF fiber, HC IC fiber, RH fiber, LMA fiber, PCF fiber.

Images