Wiring circuit board and wiring circuit board assembly sheet

Abstract

To provide a wiring circuit board in which when mounting an electrical element, a configuration including the electrical element can be thinned and high reliability can be obtained in terms of a mechanical strength.SOLUTION: An electrical element is mounted on a wiring circuit board 100. The wiring circuit board 100 comprises a support 10. The support 10 includes a top face and a bottom face. A first through hole 19 extending in a thickness direction is formed in the support 10. The wiring circuit board 100 also comprises an insulation layer 20 covering an outer surface of the support 10. A portion covering an inner peripheral surface of the first through hole 19 in the insulation layer 20 forms a second through hole 29 extending in the thickness direction inside of the first through hole 19. The second through hole 29 is formed so as to store at least a portion of the electrical element therein. A first conductor layer 30 and a second conductor layer 40 are formed in a predetermined pattern so as to extend from an inner peripheral surface of the second through hole 29 to a top face and a bottom face of the insulation layer 20.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a wired circuit board on which electrical elements can be mounted, and a wired circuit board assembly sheet including a plurality of wired circuit boards. [Background technology]

[0002] For example, a wired circuit board is used to transmit and receive electric signals or supply power between multiple electronic components. The wired circuit board has two surfaces facing in opposite directions. In the wired circuit board, for example, electrical elements are mounted on at least one of the two surfaces.

[0003] In the printed wiring board (wired circuit board) described in Patent Document 1, a wiring pattern (a wiring having a predetermined pattern) is formed on two surfaces of a plate-shaped insulating substrate. The wiring pattern formed on one of the two surfaces includes a plurality of pads. A plurality of terminals of an electrolytic capacitor (electrical element) are soldered onto the plurality of pads. In this way, the electrolytic capacitor is mounted on the printed wiring board. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2013-45919 A Summary of the Invention [Problem to be solved by the invention]

[0005] As described above, electrical elements are mounted on the wiring circuit board. Therefore, the wiring circuit board and the electrical elements mounted thereon are treated as an integrated unit called an electrical element mounting board. The electrical element mounting board is used in various products such as mobile terminals and in-vehicle devices. Therefore, the electrical element mounting board is required to be thinned in accordance with the miniaturization of the products in which it is used. Even if the electrical element mounting board is thinned, if the mechanical strength of the electrical element mounting board decreases as the electrical element mounting board is thinned, the reliability of the electrical element mounting board decreases.

[0006] An object of the present invention is to provide a wiring circuit board that enables a structure including electrical elements to be made thinner when the electrical elements are mounted and that is highly reliable in terms of mechanical strength, and a wiring circuit board assembly sheet that includes a plurality of wiring circuit boards. [Means for solving the problem]

[0007] A wired circuit board according to one aspect of the present invention is a wired circuit board on which electrical elements are mounted, the wired circuit board comprising: a support layer having a first surface and a second surface facing in opposite directions and having a first through hole extending in a thickness direction intersecting the first surface and the second surface; an insulating layer covering at least a portion of the first surface, at least a portion of the second surface, and an inner surface of the first through hole; and a conductor layer formed in a predetermined pattern on the insulating layer, wherein the support layer has higher rigidity than the insulating layer and the conductor layer, a portion of the insulating layer covering the inner surface of the first through hole forms a second through hole extending in the thickness direction inside the first through hole, the second through hole is formed so that at least a portion of the electrical element can be accommodated inside the second through hole, and the inner surface of the second through hole includes a conductor layer formation region where the conductor layer is formed and a conductor layer non-formation region where the conductor layer is not formed.

[0008] A wired circuit board according to another aspect of the present invention is a wired circuit board on which electrical elements are mounted, comprising: a support layer formed of an insulating material and having a first surface and a second surface facing in opposite directions and having a through hole extending from the first surface to the second surface; and a conductor layer formed in a predetermined pattern on the support layer, wherein the support layer has a higher rigidity than the conductor layer, the through hole is formed so that at least a portion of the electrical element can be accommodated inside the through hole, and the inner surface of the through hole includes a conductor layer forming region where the conductor layer is formed and a conductor layer non-forming region where the conductor layer is not formed.

[0009] A wired circuit board assembly sheet according to still another aspect of the present invention includes a plurality of the above-described wired circuit boards, the plurality of wired circuit boards being integrally provided. Effect of the Invention

[0010] According to the present invention, when an electric element is mounted, it is possible to reduce the thickness of a structure including the electric element and to obtain high reliability in terms of mechanical strength. [Brief description of the drawings]

[0011] [Figure 1] 1 is a top view of a printed circuit board according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a bottom view of the printed circuit board of FIG. [Diagram 3] 2 is a cross-sectional view of the printed circuit board shown in FIG. 1 taken along line AA. [Figure 4] 2 is a cross-sectional view of the printed circuit board shown in FIG. 1 along line BB. [Diagram 5] FIG. 2 is a diagram for explaining a method of mounting a mounting target item on the wired circuit board of FIG. [Figure 6] FIG. 6 is a top view of the mounting board in FIG. [Figure 7] FIG. 1 is a schematic side view showing an example of a roll-to-roll apparatus used in a manufacturing process of a printed circuit board. [Figure 8] 1 is a perspective view showing an example of an assembly sheet according to an embodiment of the present invention. [Figure 9] 9 is a partially enlarged top view of the assembly sheet of FIG. 8. FIG. [Figure 10] 9A to 9C are process diagrams illustrating an example of a method for producing the assembly sheet of FIG. 8. [Figure 11] 9A to 9C are process diagrams illustrating an example of a method for producing the assembly sheet of FIG. 8. [Figure 12] 9A to 9C are process diagrams illustrating an example of a method for producing the assembly sheet of FIG. 8. [Figure 13] 9A to 9C are process diagrams illustrating an example of a method for producing the assembly sheet of FIG. 8. [Figure 14] 9A to 9C are process diagrams illustrating an example of a method for producing the assembly sheet of FIG. 8. [Figure 15] FIG. 2 is a partially enlarged top view showing a state in which a plurality of mounting targets are mounted on each of a plurality of wired circuit boards of an assembly sheet. [Figure 16] FIG. 11 is a partially enlarged top view of an assembly sheet according to another embodiment of the present invention. [Figure 17] 5A and 5B are a top view and a cross-sectional view of a printed circuit board according to another embodiment of the present invention. [Figure 18] 11A and 11B are a top view and a cross-sectional view of a printed circuit board according to still another embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A wired circuit board and a wired circuit board assembly sheet according to an embodiment of the present invention will now be described with reference to the drawings.

[0013] 1. Basic structure of printed circuit board The wired circuit board according to an embodiment of the present invention is an FPC (flexible printed circuit) board configured to be able to mount electrical elements, and is manufactured, for example, by a roll-to-roll method. Therefore, the wired circuit board according to this embodiment has flexibility to the extent that it can be wound around a roll used in the roll-to-roll method. In addition, the wired circuit board according to this embodiment has two surfaces facing in opposite directions. In the following description, one of the two surfaces of the wired circuit board is called the upper surface of the wired circuit board, and the other of the two surfaces of the wired circuit board is called the lower surface of the wired circuit board. Furthermore, in the following description, an electrical element that is planned to be mounted on one wired circuit board and an electrical element that is mounted on one wired circuit board are called a mounting target corresponding to the one wired circuit board. The mounting target may be, for example, a semiconductor chip, or various electronic components that have been made into chips, such as chip capacitors and chip resistors.

[0014] Fig. 1 is a top view of a wired circuit board according to an embodiment of the present invention, and Fig. 2 is a bottom view of the wired circuit board of Fig. 1. Fig. 3 is a cross-sectional view of the wired circuit board 100 of Fig. 1 taken along line AA, and Fig. 4 is a cross-sectional view of the wired circuit board 100 of Fig. 1 taken along line BB.

[0015] The wired circuit board 100 according to the present embodiment generally has a configuration in which an insulating layer 20 is formed so as to cover the outer surface of a sheet-like support 10, and a first conductor layer 30 and a second conductor layer 40 are formed in a predetermined pattern on the insulating layer 20. In Fig. 1 and Fig. 2, the outline of the support 10 covered by the insulating layer 20 is indicated by a dashed line.

[0016] As shown in Figures 3 and 4, the support 10 has a support upper surface 11 and a support lower surface 12 that face in opposite directions in the thickness direction of the wired circuit board 100. A first through hole 19 is formed in the center of the support 10 from the support upper surface 11 to the support lower surface 12. The first through hole 19 has a rectangular shape when viewed from above, as shown in Figure 1. The thickness of the support 10 is, for example, 10 µm or more and 500 µm or less.

[0017] In the wired circuit board 100, the support 10 has higher rigidity than the insulating layer 20, the first conductor layer 30, and the second conductor layer 40, and is formed of, for example, a metal material. Examples of the metal material forming the support 10 include stainless steel, copper, a copper alloy, aluminum, titanium, and an alloy containing iron and nickel.

[0018] The support 10 only needs to have a higher rigidity than the insulating layer 20, the first conductor layer 30, and the second conductor layer 40, and may be made of a resin or a material containing a resin instead of a metal material. In this case, the resin may be a polyimide resin, an epoxy resin, an acrylic resin, or the like. The resin may also be a material composed of an epoxy resin and a silica filler, or a material composed of an epoxy resin and a glass fiber, or the like.

[0019] 3 and 4, the insulating layer 20 is formed over the entire outer surface of the support 10 so as to cover the support upper surface 11 and the support lower surface 12, and also to cover the inner peripheral surface of the first through hole 19. A portion of the insulating layer 20 positioned inside the first through hole 19 forms a second through hole 29 extending in the thickness direction of the wired circuit board 100 inside the first through hole 19. The first through hole 19 and the second through hole 29 of the support 10 are formed so that at least a part of the mounting target corresponding to the wired circuit board 100 can be accommodated inside the second through hole 29.

[0020] 1, the second through hole 29 has a rectangular shape in a top view. A step is formed on an inner circumferential surface 28 of the second through hole 29 at approximately the center in the thickness direction of the wired circuit board 100, over the entire circumference of the inner circumferential surface 28. Due to this step, the opening area of ​​the upper part of the second through hole 29 is larger than the opening area of ​​the lower part of the second through hole 29.

[0021] The thickness of the portion of insulating layer 20 located on support upper surface 11 and the thickness of the portion of insulating layer 20 located on support lower surface 12 are, for example, 2 μm or more and 30 μm or less. Moreover, the thickness of the portion of insulating layer 20 forming second through hole 29 inside first through hole 19 (thickness in a direction perpendicular to the thickness direction of wired circuit board 100) is, for example, 2 μm or more and 30 μm or less.

[0022] The insulating layer 20 is formed of, for example, a photosensitive material. As the photosensitive material forming the insulating layer 20, photosensitive polyimide can be used. The insulating layer 20 may be formed of other photosensitive resins instead of photosensitive polyimide. In this case, examples of the other photosensitive resins include photosensitive resins such as acrylic resins, epoxy resins, polyamide resins, polybenzoxazole resins, and polyvinyl chloride resins. Alternatively, the insulating layer 20 may be formed of inorganic insulating materials or organic insulating materials other than photosensitive materials. Specifically, as the material of the insulating layer 20, silicon carbide, silicon dioxide, aluminum nitride, aluminum oxide, or the like can also be used.

[0023] The first conductor layer 30 and the second conductor layer 40 are formed in a predetermined pattern on the support upper surface 11 and the support lower surface 12 via the insulating layer 20. The first conductor layer 30 and the second conductor layer 40 are also formed in a predetermined pattern on the inner circumferential surface 28 of the second through hole 29, as shown in Figs. 3 and 4.

[0024] Here, on the inner circumferential surface 28 of the second through hole 29, the two conductor layers (30, 40) are formed only on a partial region of the inner circumferential surface 28, and are not formed on other regions of the inner circumferential surface 28. Therefore, the two conductor layers (30, 40) do not cover the entire inner circumferential surface 28. In the following description, the region of the inner circumferential surface 28 of the second through hole 29 where the two conductor layers (30, 40) are formed is referred to as the target region 28a, and the region where the two conductor layers (30, 40) are not formed is referred to as the non-target region 28b.

[0025] A specific configuration of the first conductor layer 30 will be described. The first conductor layer 30 has a mounting terminal portion 31 (FIGS. 1 and 2), an upper wiring portion 32a (FIG. 1), a lower wiring portion 32b (FIG. 2), an upper pad portion 33a (FIG. 1), and a lower pad portion 33b (FIG. 2). The mounting terminal portion 31 is formed on the target area 28a (FIGS. 3 and 4) inside the second through hole 29 of the insulating layer 20, and overlaps one of the short sides of the four sides of the rectangle that forms the inner edge of the second through hole 29 in a top view, as shown in FIG. 1. A first terminal portion 201 (FIG. 5) of a mounting target 200 (FIG. 5), which will be described later, is to be joined to the mounting terminal portion 31 when the mounting target 200 (FIG. 5) is mounted.

[0026] 1, the upper wiring portion 32a is formed on the upper surface side of the wired circuit board 100 so as to extend a predetermined distance from the mounting terminal portion 31 to one side of the second through hole 29. The upper pad portion 33a is formed in a substantially circular shape at the tip portion of the upper wiring portion 32a. The upper pad portion 33a is formed so as to be capable of joining a terminal portion of an electrical element other than the mounting target item 200 described later.

[0027] 2, the mounting terminal portion 31 overlaps one of the short sides of the four sides of a rectangle that forms the inner edge of the second through hole 29 in a bottom view. The lower wiring portion 32b is formed on the bottom surface side of the wired circuit board 100 so as to extend a predetermined distance from the mounting terminal portion 31 to one side of the second through hole 29. The lower pad portion 33b is formed in a substantially circular shape at the tip portion of the lower wiring portion 32b. The lower pad portion 33b is formed so as to be capable of joining a terminal portion of an electrical element other than the mounting target item 200 described later.

[0028] A specific configuration of the second conductor layer 40 will be described. The second conductor layer 40 has a mounting terminal portion 41 (FIGS. 1 and 2), an upper wiring portion 42a (FIG. 1), a lower wiring portion 42b (FIG. 2), an upper pad portion 43a (FIG. 1), and a lower pad portion 43b (FIG. 2). The mounting terminal portion 41 is formed on the target area 28a inside the second through hole 29 of the insulating layer 20, and overlaps the other short side of the four sides of the rectangle that forms the inner edge of the second through hole 29 in a top view, as shown in FIG. 1. Therefore, the mounting terminal portion 41 of the second conductor layer 40 faces the mounting terminal portion 31 of the first conductor layer 30 across the internal space of the second through hole 29. A second terminal portion 202 (FIG. 5) of the mounting target 200 (FIG. 5) is joined to the mounting terminal portion 41 when the mounting target 200 (FIG. 5) described later is mounted.

[0029] 1, the upper wiring portion 42a is formed on the upper surface side of the wired circuit board 100 so as to extend a predetermined distance from the mounting terminal portion 41 to the other side of the second through hole 29. The upper pad portion 43a is formed in a substantially circular shape at the tip portion of the upper wiring portion 42a. The upper pad portion 43a is formed so as to be capable of joining a terminal portion of an electrical element other than the mounting target item 200 described later.

[0030] 2, the mounting terminal portion 41 overlaps the other short side of the four sides of the rectangle that forms the inner edge of the second through hole 29 in bottom view. The lower wiring portion 42b is formed on the bottom surface side of the wired circuit board 100 so as to extend a predetermined distance from the mounting terminal portion 41 toward the other side of the second through hole 29. The lower pad portion 43b is formed in a substantially circular shape at the tip portion of the lower wiring portion 42b. The lower pad portion 43b is formed so as to be capable of joining a terminal portion of an electrical element other than the mounting target item 200 described later.

[0031] The thickness of each portion of the first conductor layer 30 and the second conductor layer 40 is, for example, 2 μm or more and 50 μm or less. The width of each of the upper wiring portions 32a, 42a and the lower wiring portions 32b, 42b of the first conductor layer 30 and the second conductor layer 40 (the width of the wiring perpendicular to the direction in which the wiring extends) is, for example, 3 μm or more and 100 μm or less.

[0032] Each of the first conductor layer 30 and the second conductor layer 40 is formed, for example, by forming a plating resist of a predetermined pattern on a seed layer and performing electrolytic plating. The seed layer forming the conductor layer is made of, for example, a chromium thin film and a copper thin film. Alternatively, the seed layer is made of a copper thin film. Alternatively, the seed layer may contain either nickel or palladium. On the other hand, the plating layer is formed of a metal or an alloy containing one or more of copper, gold, silver, platinum, lead, tin, nickel, cobalt, indium, rhodium, chromium, tungsten, and ruthenium. In this embodiment, the plating layer is copper.

[0033] A cover insulating layer 50 is further formed on the upper surface of the wiring circuit board 100, except for the portions where the second through hole 29 and the upper pad portions 33a, 43a are formed, as shown by dashed lines in Figs. 3 and 4. The cover insulating layer 50 covers the upper wiring portions 32a, 42a located on the upper surface of the wiring circuit board 100, thereby protecting the upper wiring portions 32a, 42a. In addition, a cover insulating layer 60 is formed on the lower surface of the wiring circuit board 100, except for the portions where the second through hole 29 is formed and the lower pad portions 33b, 43b are formed, as shown by dashed lines in Figs. 3 and 4. The cover insulating layer 60 covers the lower wiring portions 32b, 42b located on the lower surface of the wiring circuit board 100, thereby protecting the lower wiring portions 32b, 42b.

[0034] The cover insulating layers 50 and 60 may be formed of the same material as the insulating layer 20, or may be formed of an insulating material different from that of the insulating layer 20. Specifically, when the insulating layer 20 is formed of a photosensitive polyimide, the cover insulating layers 50 and 60 may be formed of a photosensitive polyimide. Alternatively, the cover insulating layers 50 and 60 may be formed of a photosensitive resin, such as a polyimide resin, an acrylic resin, an epoxy resin, a polyamide resin, a polybenzoxazole resin, or a polyvinyl chloride resin, regardless of the material of the insulating layer 20.

[0035] In addition, in Figures 1 and 2 and Figure 5 and subsequent figures, the cover insulating layers 50, 60 in Figures 3 and 4 are omitted from the illustration so as to make it easier to understand the structures of the support 10, insulating layer 20, first conductor layer 30 and second conductor layer 40.

[0036] 2. Mounting of a mounting target on the printed circuit board 100 of FIG. 1 An item to be mounted is mounted on the wired circuit board 100 having the above configuration. Fig. 5 is a diagram for explaining a method of mounting an item to be mounted on the wired circuit board 100 of Fig. 1. In Fig. 5, the method of mounting an item to be mounted 200 on the wired circuit board 100 is shown in chronological order using two perspective views arranged vertically.

[0037] At the time of mounting, a mounting target 200 corresponding to the wired circuit board 100 of FIG. 1 is prepared. As shown in the upper part of FIG. 5, the mounting target 200 of this example has a rectangular parallelepiped shape. A first terminal portion 201 and a second terminal portion 202 are formed at both ends in the longitudinal direction of the mounting target 200. In FIG. 5, a dot pattern is applied to the first terminal portion 201 and the second terminal portion 202 so that the positions and shapes of the first terminal portion 201 and the second terminal portion 202 of the mounting target 200 can be easily understood. In FIG. 5, the first conductor layer 30 and the second conductor layer 40 are hatched so that the positions and shapes of the first conductor layer 30 and the second conductor layer 40 of the wired circuit board 100 can be easily understood.

[0038] As described above, the second through hole 29 of the wired circuit board 100 is formed so as to be able to accommodate at least a part of the item to be mounted 200 inside the second through hole 29. In this example, the second through hole 29 is formed so as to be able to accommodate the entire item to be mounted 200. In other words, in this example, the size of the area surrounded by the inner edge of the second through hole 29 in top view is larger than the item to be mounted 200.

[0039] As shown by the thick solid arrow in FIG. 5, the mounting target 200 is inserted into the second through hole 29 so that the first terminal portion 201 is close to the mounting terminal portion 31 of the first conductor layer 30 and the second terminal portion 202 is close to the mounting terminal portion 41 of the second conductor layer 40. In this state, the first terminal portion 201 and the first conductor layer 30 arranged opposite each other are joined using solder, and the second terminal portion 202 and the second conductor layer 40 arranged opposite each other are joined using solder. As a result, as shown in the lower part of FIG. 5, the mounting target 200 is mounted on the wiring circuit board 100 in a state where it is accommodated in the second through hole 29 of the wiring circuit board 100. In this manner, the mounting target 200 and the wiring circuit board 100 are integrated to form a mounting board 120.

[0040] In this mounting board 120, the item to be mounted 200 is accommodated in the second through hole 29 of the wiring circuit board 100. Therefore, compared to the case where the item to be mounted 200 is mounted on the upper surface or the lower surface of the wiring circuit board 100, the mounting board 120 can be made thinner.

[0041] Fig. 6 is a top view of the mounting board 120 of Fig. 5. As shown in Fig. 6, in the mounting board 120, a first terminal portion 201 located at one end of the mounting target 200 is joined to the first conductor layer 30 of the wired circuit board 100 via solder 210. Also, a second terminal portion 202 located at the other end of the mounting target 200 is joined to the second conductor layer 40 of the wired circuit board 100 via solder 210.

[0042] In contrast, both sides of the mounting target 200 are spaced apart from the inner circumferential surface 28 (non-target area 28b of the inner circumferential surface 28) of the second through hole 29 of the wiring circuit board 100 in a top view. That is, in a state in which the mounting target 200 is mounted on the wiring circuit board 100, two gaps 29G are formed between a part of the mounting target 200 and the wiring circuit board 100. These gaps 29G can be used as a working space when mounting the mounting target 200 on the wiring circuit board 100. In addition, when removing the mounting target 200 from the wiring circuit board 100 for reasons such as replacing the old mounting target 200 incorporated in the mounting board 120 with a new mounting target 200, the above-mentioned gaps 29G can also be used as a working space. In this way, the formation of one or more gaps 29G between the mounting target 200 and the wiring circuit board 100 facilitates mounting and removing the mounting target 200 on the wiring circuit board 100. In addition to the above examples, cases in which the mounting target 200 needs to be removed from the printed circuit board 100 include when it is desired to replace a defective mounting target 200, or when it is desired to remount a mounting target 200 that has been mounted in a posture different from the predetermined posture.

[0043] 3. Wired circuit board assembly sheet and manufacturing method thereof The wired circuit board 100 according to the present embodiment is manufactured, for example, by a roll-to-roll method as described above. In the roll-to-roll method, a wired circuit board assembly sheet (hereinafter simply referred to as an assembly sheet) including a plurality of wired circuit boards 100 is produced. A roll-to-roll device is used to produce this assembly sheet.

[0044] 7 is a schematic side view showing an example of a roll-to-roll apparatus used in the manufacturing process of the wired circuit board 100. As shown in Fig. 7, the roll-to-roll apparatus 900 includes an unwinding section 901, a winding section 902, and a plurality of processing sections 910, 920, .... First, a roll (unwinding roll) R1 around which a long base member BM is wound is prepared and set in the unwinding section 901 of the roll-to-roll apparatus 900.

[0045] A base member BM is unwound from a prepared unwinding roll R1. The unwound base member BM is taken up by another roll (take-up roll) R2 set in a take-up unit 902, as shown by the dotted arrow in FIG.

[0046] In the roll-to-roll apparatus 900, a plurality of processing sections 910, 920, ... are arranged between two rolls (R1, R2) in the moving direction of the base member BM. The plurality of processing sections 910, 920, ... perform various processes on each region of the long-shaped base member BM moving between the two rolls (R1, R2). As a result, the respective regions of the base member BM pass through the plurality of processing sections 910, 920, ... to produce an assembly sheet 500, which is then wound up on the winding roll R2.

[0047] Fig. 8 is a perspective view showing an example of an assembly sheet 500 according to an embodiment of the present invention. Fig. 8 shows the assembly sheet 500 in a state in which it is wound around the winding roll R2 of Fig. 7. In the assembly sheet 500, a plurality of wired circuit boards 100 are regularly arranged.

[0048] Fig. 9 is a partially enlarged top view of the assembly sheet 500 in Fig. 8. As shown in Fig. 9, the assembly sheet 500 unrolled from the winding roll R2 has a long shape. In the following description, a direction parallel to a pair of short sides of the assembly sheet 500 (the short-side direction of the assembly sheet 500) is referred to as the X direction. Also, a direction parallel to the other pair of long sides of the assembly sheet 500 (the long-side direction of the assembly sheet 500) is referred to as the Y direction. Furthermore, a direction perpendicular to the assembly sheet 500 is referred to as the Z direction. In Figs. 8 and 9, the X direction, Y direction, and Z direction are indicated by arrows X, Y, and Z, respectively.

[0049] The assembly sheet 500 includes a plurality of wiring circuit boards 100, a frame body 510, and an insulating layer 600. The assembly sheet 500 also includes a cover insulating layer (not shown). The frame body 510 is formed of the same material as the support body 10 of the wiring circuit board 100, and includes an outer frame 511 and a plurality of inner frames 512. The outer frame 511 is a rectangular frame having a pair of short sides extending in the X direction and a pair of long sides extending in the Y direction. The plurality of inner frames 512 are formed in a mesh shape so as to divide the inner region of the outer frame 511 into a plurality of squares according to the size of each of the plurality of wiring circuit boards 100.

[0050] Insulating layer 600 is formed of the same material as insulating layer 20 of wired circuit board 100, and is provided so as to cover frame body 510. In assembly sheet 500, a plurality of wired circuit boards 100 are arranged in a plurality of rectangular regions (partitioned regions) partitioned by outer frame 511 and inner frame 512 of frame body 510. A cover insulating layer (not shown) is formed so as to cover partial regions of the upper and lower surfaces of wired circuit board 100.

[0051] In each partitioned region, both ends of wired circuit board 100 in the Y direction are supported by either the short sides of outer frame 511 or multiple inner frames 512 via a pair of bridges 513. After assembly sheet 500 is manufactured, each wired circuit board 100 can be separated from frame body 510 by cutting bridges 513 and extracting wired circuit boards 100 from each partitioned region.

[0052] Figures 10 to 14 are process diagrams for explaining an example of a manufacturing method for the assembly sheet 500 of Figure 8. In Figures 10 to 14, a partially enlarged top view of the assembly sheet 500 is shown in the upper left portion, a cross-sectional view of the assembly sheet 500 taken along line CC is shown in the upper center portion, and a cross-sectional view of the assembly sheet 500 taken along line DD is shown in the upper right portion. Furthermore, a cross-sectional view of the assembly sheet 500 taken along line EE is shown in the lower left portion.

[0053] First, as shown in Fig. 10, a two-layer base material including a support layer LA1 and a lower insulating layer LA2 is prepared as a base member BM. The support layer LA1 is made of the same material as the support body 10 of the wiring circuit board 100. The lower insulating layer LA2 is made of the same material as the insulating layer 20 of the wiring circuit board 100.

[0054] Next, as shown in FIG. 11, unnecessary portions of the support layer LA1 in FIG. 10 are removed to form a frame body 510, a plurality of bridges 513, and a plurality of supports 10 (supports 10 of the wiring circuit board 100). When the support layer LA1 is made of a metal material, the unnecessary portions of the support layer LA1 can be removed by, for example, etching using an etching resist. When the support layer LA1 is made of a photosensitive resin or the like, the frame body 510, the plurality of bridges 513, and the plurality of supports 10 may be formed using a photolithography technique. In FIG. 11, the frame body 510, the plurality of bridges 513, and the plurality of supports 10 are hatched to make their shapes easier to understand.

[0055] 12, an upper insulating layer LA3 is formed on the upper surface of the lower insulating layer LA2 so as to cover the frame 510, the multiple bridges 513, and the multiple supports 10 (supports 10 of the wiring circuit board 100). The upper insulating layer LA3 can be formed, for example, by applying a precursor of a photosensitive resin to the upper surface of the lower insulating layer LA2, exposing the photosensitive resin precursor to light, and developing the photosensitive resin precursor.

[0056] As a result, the lower insulating layer LA2 and the upper insulating layer LA3 located inside the partitioned region constitute the insulating layer 20 of the multiple wired circuit boards 100. The lower insulating layer LA2 and the upper insulating layer LA3 located outside the partitioned region constitute the insulating layer 600 in Fig. 9. In Figs. 12, 13, and 14, the outer edge of the portion of each partitioned region where the wired circuit boards 100 are to be formed, i.e., the boundary between the portion where each wired circuit board 100 is to be removed from the assembly sheet 500 and the other portion, is indicated by a two-dot chain line.

[0057] The multiple supports 10 constituting the multiple wired circuit boards 100 each have a first through hole 19 in the center. Therefore, when the upper insulating layer LA3 is formed, the upper insulating layer LA3 is formed in a concave shape inside the first through hole 19 of the support 10, as shown in the cross section of line CC in Fig. 12. In other words, a depression in the upper insulating layer LA3 (insulating layer 20) is formed inside the first through hole 19.

[0058] After the upper insulating layer LA3 is formed in the step of Fig. 12, second through holes 29 are formed in the insulating layer 20 so as to pass through the inside of the first through holes 19 of each support 10, as shown in Fig. 13. The second through holes 29 are formed by, for example, laser processing. The second through holes 29 may also be formed by mechanical processing such as cutting or punching. At this time, the second through holes 29 are formed to have a size slightly smaller than the depressions in the first through holes 19 of the upper insulating layer LA3 (insulating layer 20) in Fig. 12, for example.

[0059] Next, as shown in Fig. 14, a conductor layer is formed in a predetermined pattern on the surface of the insulating layer 20 in each partitioned region to form the first conductor layer 30 and the second conductor layer 40 of each printed circuit board 100. The first conductor layer 30 and the second conductor layer 40 are formed, for example, by a semi-additive method using the above-mentioned seed layer. The first conductor layer 30 and the second conductor layer 40 may be formed by an additive method or a semi-additive method.

[0060] Thereafter, in each partitioned region, cover insulating layers 50, 60 are formed on the upper and lower surfaces of insulating layer 20, respectively, excluding the portions where second through-hole 29 and the plurality of pad portions (33a, 33b, 43a, 43b) are formed. This completes the plurality of wired circuit boards 100, which are integrally supported by insulating layer 600 and frame 510. That is, assembly sheet 500 in FIG. 1 is completed. With assembly sheet 500, the plurality of wired circuit boards 100 can be handled integrally.

[0061] On each of the multiple wired circuit boards 100 integrated by the assembly sheet 500, an item to be mounted 200 can be mounted before being separated from the assembly sheet 500. In this case, mounting of the item to be mounted 200 on each wired circuit board 100 is also performed by the roll-to-roll method, thereby improving the manufacturing efficiency of the multiple mounting boards 120 (FIG. 5).

[0062] Fig. 15 is a partially enlarged top view showing a state in which a plurality of items to be mounted 200 are mounted on each of a plurality of wired circuit boards 100 of an assembly sheet 500. The top view of Fig. 15 corresponds to the top view of Fig. 9. As shown in Fig. 15, according to the assembly sheet 500 of this example, it is possible to handle a plurality of mounting boards 120 as a whole. As shown by the two-dot chain lines in Fig. 15, the outer edge of the mounting board 120 can be cut within each partitioned area, thereby separating each of the plurality of mounting boards 120 from the assembly sheet 500.

[0063] 4. Effects of the embodiment (a) In the above-mentioned wired circuit board 100, the mounting target 200 can be placed inside the second through hole 29 of the insulating layer 20. In addition, the mounting terminal portion 31 of the first conductor layer 30 and the mounting terminal portion 41 of the second conductor layer 40 are formed on a part of the inner circumferential surface 28 of the second through hole 29. This allows the mounting target 200 to be electrically connected to the first conductor layer 30 and the second conductor layer 40 inside the second through hole 29. In this manner, the mounting target 200 is mounted inside the second through hole 29. In this case, the mounting board 120 to which the wiring circuit board 100 and the mounting target 200 are integrally connected can be made thinner than when the mounting target 200 is mounted on the upper surface or the lower surface of the wired circuit board 100.

[0064] Moreover, in the above-mentioned wired circuit board 100, the support 10 has higher rigidity than the insulating layer 20, the first conductor layer 30, and the second conductor layer 40. Therefore, the wired circuit board 100 has higher reliability in terms of mechanical strength than a wired circuit board consisting of only the insulating layer 20, the first conductor layer 30, and the second conductor layer 40.

[0065] As a result, according to the wired circuit board 100, the mounting board 120 produced by mounting the mounting target 200 can be made thin, and high reliability in terms of mechanical strength can be obtained.

[0066] (b) As described above, the support 10 may be formed of a metal material. When the support 10 is formed of a metal material, it is easier to ensure the strength of the support 10 compared to when the support 10 is formed of a resin. Alternatively, the support 10 may be formed of a resin. When the support 10 is formed of a resin, it becomes possible to directly form the first conductor layer 30 and the second conductor layer 40 on the support 10 by using an insulating resin as the resin.

[0067] (c) A mounting terminal portion 31 of the first conductor layer 30 and a mounting terminal portion 41 of the second conductor layer 40 are formed to face each other on the inner peripheral surface 28 of the second through hole 29 of the wired circuit board 100. The mounting terminal portions 31, 41 are arranged to face the first terminal portion 201 and the second terminal portion 202 of the mounting target 200, respectively, in a state in which the mounting target 200 is accommodated in the second through hole 29.

[0068] This makes it easier to connect the first terminal portion 201 and the second terminal portion 202 of the component 200 to the mounting terminal portions 31, 41 when the component 200 is mounted on the wired circuit board 100.

[0069] (d) In the above-mentioned wired circuit board 100, two wiring parts (32a, 32b) are formed so as to extend from the mounting terminal part 31 in the second through hole 29 to the upper and lower surfaces of the wired circuit board 100. In addition, two wiring parts (42a, 42b) are formed so as to extend from the mounting terminal part 41 in the second through hole 29 to the upper and lower surfaces of the wired circuit board 100. This ensures a large number of conductive paths to the mounting target 200 mounted in the second through hole 29. Therefore, the degree of freedom in the layout of wiring for the mounting target 200 is improved. In addition, according to the above-mentioned configuration, since the mounting terminal parts 31, 41 are formed on a part of the inner circumferential surface 28 of the second through hole 29, the area of ​​the connection part for the mounting target 200 is ensured, and the reliability of the connection between the wired circuit board 100 and the mounting target 200 is also improved.

[0070] 5. Other embodiments (a) In the assembly sheet 500 according to the above embodiment, the support 10 and frame 510 of each of the wired circuit boards 100 are connected by two bridges 513, but the present invention is not limited to this. The support 10 and frame 510 of each of the wired circuit boards 100 are formed on a common lower insulating layer LA2 (FIG. 12) and covered by a common upper insulating layer LA3 (FIG. 12). Therefore, as long as the lower insulating layer LA2 and the upper insulating layer LA3 have a rigidity sufficient to support the support 10 and frame 510 in a roll-to-roll manufacturing process, the bridges 513 do not have to be provided.

[0071] Fig. 16 is a partially enlarged top view of an assembly sheet 500 according to another embodiment of the present invention. The top view of Fig. 16 corresponds to the top view of Fig. 9. As shown in Fig. 16, in assembly sheet 500 of this example, bridges 513 are not present between each of the multiple wired circuit boards 100 and frame 510. Therefore, when each wired circuit board 100 is removed from assembly sheet 500, mechanical loads, operational loads, and the like are reduced.

[0072] (b) In the wired circuit board 100 according to the above embodiment, a step is formed on the inner circumferential surface 28 of the second through hole 29 in the insulating layer 20, but the present invention is not limited to this. The inner circumferential surface 28 of the second through hole 29 does not necessarily have to have a step.

[0073] Fig. 17 is a top view and a cross-sectional view of a wired circuit board 100 according to another embodiment of the present invention. In Fig. 17, a top view of the wired circuit board 100 is shown at the top, and a cross-sectional view of the wired circuit board 100 taken along line FF is shown at the bottom.

[0074] 17, no step is formed on the inner circumferential surface 28 of the second through hole 29 in this example. In this case, the surfaces (surfaces facing inward of the second through hole 29) of the mounting terminal portion 31 of the first conductor layer 30 and the mounting terminal portion 41 of the second conductor layer 40 formed on the inner circumferential surface 28 can be flattened over a wider range. This makes it easier to join the terminal portions when mounting the mounting target 200.

[0075] (c) In the wired circuit board 100 according to the above embodiment, the insulating layer 20 is provided so as to cover the outer surface of the support 10, but the present invention is not limited thereto. When an insulating material is used as the material of the support 10, the insulating layer 20 may not be provided on the wired circuit board 100.

[0076] Fig. 18 is a top view and a cross-sectional view of a printed circuit board 100 according to still another embodiment of the present invention. In Fig. 18, a top view of the printed circuit board 100 is shown at the top, and a cross-sectional view of the printed circuit board 100 of the upper row taken along line GG is shown at the bottom.

[0077] In the wired circuit board 100 of this example, the support 10 is made of, for example, an insulating resin or an insulating material containing a resin. In this case, as shown in Fig. 18, it is possible to form the first conductor layer 30 and the second conductor layer 40 directly on the surface of the support 10. This makes it possible to further reduce the thickness of the wired circuit board 100, and also reduces the number of manufacturing steps for the wired circuit board 100.

[0078] (d) In the wired circuit board 100 according to the above embodiment, the insulating layer 20 is formed so as to cover the entire outer surface of the support 10, but the present invention is not limited thereto. For example, when the support 10 is made of a conductive material, the insulating layer 20 only needs to ensure insulation between the two conductor layers (30, 40) and the support 10. Therefore, the insulating layer 20 only needs to be formed on at least the portion of the outer surface of the support 10 where the two conductor layers (30, 40) are formed. In other words, the insulating layer 20 may be formed only on a portion of the outer surface of the support 10.

[0079] (e) In the wired circuit board 100 according to the above embodiment, the cover insulating layers 50, 60 that cover parts of the first conductor layer 30 and the second conductor layer 40 are formed on the upper and lower surfaces of the insulating layer 20, but the present invention is not limited thereto. In cases where a material with excellent corrosion resistance is used for the first conductor layer 30 and the second conductor layer 40, the cover insulating layers 50, 60 do not need to be provided.

[0080] (f) In the wired circuit board 100 before mounting the mounting target 200, a treatment for imparting corrosion resistance may be applied to the surfaces of the mounting terminal portions 31, 41 facing inwardly of the second through-hole 29. For example, the outer surfaces of the mounting terminal portions 31, 41 may be plated with gold or the like.

[0081] (g) The printed circuit board 100 according to the above embodiment is an FPC board, but the present invention is not limited to this. The printed circuit board 100 may be a rigid board that cannot be wound around a roll and is used in a roll-to-roll system.

[0082] (h) In the wired circuit board 100 according to the above embodiment, the upper wiring portion 32a of the first conductor layer 30 and the upper wiring portion 42a of the second conductor layer 40 are formed on the upper surface. In addition, the lower wiring portion 32b of the first conductor layer 30 and the lower wiring portion 42b of the second conductor layer 40 are formed on the lower surface. However, the present invention is not limited to this. In the wired circuit board 100, it is sufficient that the wiring portion of either the first conductor layer 30 or the second conductor layer 40 is formed on at least one of the upper surface and the lower surface.

[0083] (i) In the wired circuit board 100 according to the above embodiment, when the mounting target 200 is mounted, a gap 29G is formed between a part of the inner circumferential surface 28 of the second through hole 29 and the mounting target 200, but the present invention is not limited to this. The second through hole 29 of the wired circuit board 100 may be formed such that no gap is formed between the inner circumferential surface 28 and the mounting target 200 when the mounting target 200 is mounted.

[0084] (j) In the wired circuit board 100 according to the above embodiment, the first through hole 19 and the second through hole 29 have a rectangular shape in top view, but the present invention is not limited to this. The first through hole 19 and the second through hole 29 may have a shape other than a rectangular shape in top view, for example, a circular shape, an elliptical shape, or a triangular shape.

[0085] (k) In one roll-to-roll apparatus 900 used in the above embodiment, all steps for producing the assembly sheet 500 are performed. That is, one roll-to-roll apparatus 900 includes a plurality of apparatuses each corresponding to all steps for producing the wired circuit board 100. However, the present invention is not limited to this.

[0086] The multiple steps for producing the assembly sheet 500 may be performed by multiple roll-to-roll devices. For example, the first half of the series of steps for producing the wired circuit board 100 may be performed by one roll-to-roll device, and the second half of the steps may be performed by another roll-to-roll device. Also, the multiple steps for producing the assembly sheet 500 may be performed using three or more roll-to-roll devices. Furthermore, only some of the multiple steps for producing the assembly sheet 500 may be performed by a roll-to-roll device.

[0087] (l) In the above embodiment, the wired circuit board 100 is manufactured by a roll-to-roll method, but the present invention is not limited to this. The wired circuit board 100 may be manufactured by a method other than the roll-to-roll method. For example, the wired circuit board 100 may be manufactured by a sheet-by-sheet method in which a single sheet is sequentially processed.

[0088] 6. Correspondence between each component of the claims and each part of the embodiment Below, examples of the correspondence between each component of the claims and each element of the embodiment will be described, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each component of the claims.

[0089] In the above embodiment, the mounted object 200 is an example of an electrical element, the wired circuit board 100 is an example of a wired circuit board, the support upper surface 11 of the support 10 is an example of a first surface, the support lower surface 12 of the support 10 is an example of a second surface, the first through hole 19 is an example of a first through hole, and the support 10 is an example of a support layer.

[0090] Additionally, insulating layer 20 is an example of an insulating layer, first conductor layer 30 and second conductor layer 40 are examples of conductor layers, second through hole 29 is an example of a second through hole, inner surface 28 of second through hole 29 is an example of the inner surface of a second through hole, target region 28a is an example of a conductor layer formed region, and non-target region 28b is an example of a conductor layer non-formed region.

[0091] In addition, the first terminal portion 201 and the second terminal portion 202 of the mounting target 200 are examples of terminal portions of an electrical element, the mounting terminal portions 31, 41 are examples of portions of a conductor layer formed in a conductor layer formation region and intermediate conductor layers, the upper wiring portions 32a, 42a are examples of a first wiring portion, the lower wiring portions 32b, 42b are examples of a second wiring portion, the first through hole 19 in Figure 18 is an example of a through hole, and the assembly sheet 500 is an example of a wiring circuit board assembly sheet.

[0092] 7. Summary of the embodiment (1) The printed circuit board according to paragraph 1 is A printed circuit board on which electrical components are mounted, a support layer having a first surface and a second surface facing in opposite directions and a first through hole extending in a thickness direction intersecting the first surface and the second surface; an insulating layer covering at least a portion of the first surface, at least a portion of the second surface, and an inner circumferential surface of the first through hole; a conductor layer formed in a predetermined pattern on the insulating layer, the support layer has a higher rigidity than the insulating layer and the conductor layer; a portion of the insulating layer covering an inner circumferential surface of the first through hole forms a second through hole extending in the thickness direction inside the first through hole, the second through hole is formed so as to be able to accommodate at least a portion of the electrical element therein; The inner circumferential surface of the second through hole includes a conductor layer forming region where the conductor layer is formed and a conductor layer non-forming region where the conductor layer is not formed.

[0093] In the wired circuit board, at least a part of the electrical element can be disposed inside the second through hole of the insulating layer. Also, since a conductor layer is formed on a part of the inner peripheral surface of the second through hole, the electrical element can be electrically connected to the conductor layer inside the second through hole. By mounting the electrical element inside the second through hole in this manner, a thinner structure (electrical element mounting board) in which the electrical element and the wired circuit board are integrally connected can be realized compared to the case where the electrical element is mounted on the first surface or the second surface.

[0094] Furthermore, in the above-described wired circuit board, since the support layer has a higher rigidity than the insulating layer and the conductor layer, the wired circuit board has a higher reliability in terms of mechanical strength than a wired circuit board consisting of only an insulating layer and a conductor layer.

[0095] As a result, when the electrical elements are mounted, the structure including the electrical elements can be made thinner and can achieve high reliability in terms of mechanical strength.

[0096] (2) In the printed circuit board according to the first aspect, The support layer may be made of a metal or a resin.

[0097] When the support layer is made of metal, it is easier to ensure the strength of the support layer compared to when the support layer is made of resin. On the other hand, when the support layer is made of resin, by using an insulating resin as the resin, it becomes possible to directly form a conductor layer on the support layer.

[0098] (3) In the printed circuit board according to the first or second aspect, The electrical element has a terminal portion, A portion of the conductor layer formed in the conductor layer formation region may face the terminal portion of the electrical element with at least a portion of the electrical element accommodated in the second through hole.

[0099] In this case, with at least a portion of the electrical element disposed inside the second through hole of the insulating layer, the terminal portion of the electrical element can be easily connected to a portion of the conductor layer formed on the inner surface of the second through hole.

[0100] (Item 4) In the wired circuit board according to any one of items 1 to 3, The conductor layer is a first wiring portion formed on the first surface with the insulating layer interposed therebetween; a second wiring portion formed on the second surface via the insulating layer; an intermediate conductor portion formed inside the second through hole, The first wiring portion and the second wiring portion may be electrically connected to the intermediate conductor portion.

[0101] In this case, with the electrical element mounted inside the second through hole, electrical conduction paths for the electrical element can be secured on the first and second surfaces of the support layer, thus improving the degree of freedom in the layout of wiring for the electrical element to be mounted.

[0102] (Item 5) In the wired circuit board according to any one of items 1 to 4, The conductive layer non-forming region may be spaced apart from the electrical element with the at least a portion of the electrical element being accommodated in the second through hole.

[0103] In this case, when mounting the electric element on the wiring circuit board, a gap is formed between the conductive layer non-forming region of the second through hole and the electric element. This allows the gap to be used as a working space when mounting the electric element on the wiring circuit board. The gap can also be used as a working space when removing the electric element from the wiring circuit board on which the electric element is mounted. This makes it easier to mount and remove the electric element on the wiring circuit board.

[0104] (Item 6) The wired circuit board according to item 6 is A printed circuit board on which electrical components are mounted, a support layer formed of an insulating material, having a first surface and a second surface facing in opposite directions, and having a through hole extending from the first surface to the second surface; a conductor layer formed in a predetermined pattern on the support layer; the support layer has a higher rigidity than the conductor layer, the through hole is formed so as to be able to accommodate at least a portion of the electrical element therein; The inner circumferential surface of the through hole includes a conductor layer forming region where the conductor layer is formed and a conductor layer non-forming region where the conductor layer is not formed.

[0105] In the wired circuit board, at least a part of the electrical element can be disposed inside the through hole of the support layer. Also, since a conductor layer is formed on a part of the inner peripheral surface of the through hole, the electrical element can be electrically connected to the conductor layer inside the through hole. By mounting the electrical element inside the through hole in this manner, a thinner structure (electrical element mounting board) in which the electrical element and the wired circuit board are integrally connected can be realized compared to the case where the electrical element is mounted on the first surface or the second surface.

[0106] In addition, since the support layer of the above-mentioned wired circuit board has a higher rigidity than the conductor layer, it has a higher reliability in terms of mechanical strength than a wired circuit board consisting of only an insulating layer and a conductor layer, which have a lower rigidity than the conductor layer.

[0107] As a result, when the electrical elements are mounted, the structure including the electrical elements can be made thinner and can achieve high reliability in terms of mechanical strength.

[0108] (Item 7) The wired circuit board assembly sheet according to Item 7 is A plurality of wired circuit boards according to any one of claims 1 to 6 are included, The plurality of wired circuit boards are integrally provided.

[0109] In this case, a plurality of wired circuit boards can be handled as a single unit. [Explanation of symbols]

[0110] 10...support, 11...upper surface of support, 12...lower surface of support, 19...first through hole, 20...insulating layer, 28...inner surface, 28a...target area, 28b...non-target area, 29...second through hole, 29G...gap, 30...first conductor layer, 31, 41...mounting terminal portion, 32a, 42a...upper wiring portion, 32b, 42b...lower wiring portion, 33a, 43a...upper pad portion, 33b, 43b...lower pad portion, 40...second conductor layer, 50, 60...cover insulating layer, 100...wired circuit board, 1 20... mounting board, 200... mounting object, 201... first terminal portion, 202... second terminal portion, 210... solder, 500... assembly sheet, 510... frame, 511... outer frame, 512... inner frame, 513... bridge, 600... insulating layer, 900... roll device, 901... unwinding section, 902... winding section, 910, 920... processing section, BM... base member, LA1... support layer, LA2... lower insulating layer, LA3... upper insulating layer, R1... unwinding roll, R2... winding roll

Claims

1. A printed circuit board on which electrical components are mounted, a support layer having a first surface and a second surface facing in opposite directions and a first through hole extending in a thickness direction intersecting the first surface and the second surface; an insulating layer covering at least a portion of the first surface, at least a portion of the second surface, and an inner circumferential surface of the first through hole; a conductor layer formed in a predetermined pattern on the insulating layer, the support layer has a higher rigidity than the insulating layer and the conductor layer; a portion of the insulating layer covering an inner circumferential surface of the first through hole forms a second through hole extending in the thickness direction inside the first through hole, the second through hole is formed so as to be able to accommodate at least a portion of the electrical element therein; the inner circumferential surface of the second through hole includes a conductor layer forming region where the conductor layer is formed and a conductor layer non-forming region where the conductor layer is not formed.

2. 2. The printed circuit board according to claim 1, wherein said support layer is made of a metal or a resin.

3. The electrical element has a terminal portion, 3. The wired circuit board according to claim 1, wherein a portion of the conductor layer formed in the conductor layer forming region faces the terminal portion of the electrical element with at least a portion of the electrical element accommodated in the second through hole.

4. The conductor layer is a first wiring portion formed on the first surface with the insulating layer interposed therebetween; a second wiring portion formed on the second surface with the insulating layer interposed therebetween; an intermediate conductor portion formed inside the second through hole, 3. The printed circuit board according to claim 1, wherein the first wiring portion and the second wiring portion are electrically connected to the intermediate conductor portion.

5. 3. The printed circuit board according to claim 1, wherein the conductive layer non-forming region is spaced apart from the electrical element with the at least a portion of the electrical element being housed in the second through hole.

6. A printed circuit board on which electrical components are mounted, a support layer formed of an insulating material, having a first surface and a second surface facing in opposite directions, and having a through hole extending from the first surface to the second surface; a conductor layer formed in a predetermined pattern on the support layer; the support layer has a higher rigidity than the conductor layer, the through hole is formed so as to be able to accommodate at least a portion of the electrical element therein; The inner surface of the through hole includes a conductor layer forming region where the conductor layer is formed and a conductor layer non-forming region where the conductor layer is not formed.

7. A wiring circuit board according to claim 1 or 2, A wired circuit board assembly sheet having a configuration in which the plurality of wired circuit boards are integrally provided.

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