Method for cleaning electronic components and method for manufacturing element chips

Abstract

To provide a cleaning method for cleaning side walls while reducing damage to electronic components and a method for manufacturing element chips.SOLUTION: A method includes an electronic component preparation step of preparing an electronic component having a first surface covered with a protective film, a second surface opposite to the first surface, a sidewall between the first surface and the second surface, and a deposit adhering to the sidewall, and a sidewall cleaning step of cleaning the sidewall of the electronic component. The sidewall cleaning step includes a deposition step of depositing a first film on the surfaces of the protective film and the deposit using a first plasma, and a removal step of removing at least a portion of the deposit together with the first film deposited on the surface of the deposit using a second plasma. The deposition step and the removal step are alternately repeated multiple times such that the protective film remains.SELECTED DRAWING: Figure 22

Description

[Technical field]

[0001] The present invention relates to a method for cleaning electronic components and a method for manufacturing component chips. [Background technology]

[0002] As a dicing method for manufacturing element chips from a substrate, a blade dicing method using a blade, a laser dicing method or a stealth dicing method using a laser, a plasma dicing method using plasma, etc. have been proposed. Among them, the plasma dicing method is being developed as a method that causes less mechanical damage to the substrate and suppresses the deterioration of device characteristics (for example, Patent Documents 1 and 2). In the plasma dicing method, a technique called the Bosch process is sometimes used. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2014-513868 [Patent Document 2] JP 2016-146395 A Summary of the Invention [Problem to be solved by the invention]

[0004] The Bosch process is a method for forming and digging trenches corresponding to the streets (division regions) that define the device regions of a substrate by repeating a cycle that alternates between an etching step using plasma of a fluorine-based gas and a film deposition step using plasma of a fluorocarbon gas. This method makes it possible to form trenches with a high aspect ratio. However, fluorocarbon-based polymers tend to adhere to the inner walls of the trenches that are formed, i.e., the side walls of the resulting device chip. Furthermore, fluorine atoms may be contained in the polymer. The higher the aspect ratio of the trench, the easier it is for the polymer to adhere.

[0005] The obtained element chip is picked up and then subjected to a packaging process. If a polymer is attached to the side wall, the polymer may peel off during pick-up, causing contamination, or the adhesion between the sealing resin and the element chip may decrease during the packaging process. Furthermore, the fluorine atoms contained in the polymer are easily mobile, which may cause a decrease in the reliability of the device.

[0006] In order to reduce the amount of polymer adhesion, the conditions of the Bosch process may be optimized. The optimal values ​​of the conditions of the Bosch process vary depending on the desired size of the element chip, the width of the division region, the depth of the groove, etc. Therefore, the conditions of the Bosch process must be optimized every time the above values ​​are changed, and this method is likely to impair productivity.

[0007] The polymer is also removed by an ashing process performed after the Bosch process. The ashing process is performed to remove a protective film (mask) provided on the surface of the element chip to protect the element region. The ashing process usually uses plasma generated by oxygen gas. The surface of the element chip is easily exposed to plasma, while its sidewall is not easily exposed to plasma. Therefore, if the ashing process is performed to the extent that the deposits on the sidewall are removed, the protective film may be removed excessively, causing damage to the element region.

[0008] There is also a method of removing the polymer by using a chemical solution. However, the use of a chemical solution makes process management complicated and requires waste liquid treatment, which is costly. As described above, there is a demand for a simpler method of removing the polymer adhering to the sidewall of the element chip with a wide process window. [Means for solving the problem]

[0009] One aspect of the present invention relates to a method for cleaning an electronic component, the method comprising: a preparation step of preparing an electronic component having a first surface covered with a protective film, a second surface opposite to the first surface, a sidewall between the first surface and the second surface, and an attachment adhering to the sidewall; and a sidewall cleaning step of cleaning the sidewall of the electronic component, the sidewall cleaning step comprising: a deposition step of depositing a first film on a surface of the protective film and the attachment using a first plasma; and a removal step of removing at least a portion of the attachment together with the first film deposited on the surface of the attachment using a second plasma, the deposition step and the removal step being alternately repeated multiple times in the sidewall cleaning step so that the protective film remains.

[0010] Another aspect of the present invention provides a semiconductor device including a semiconductor substrate, the semiconductor substrate including a semiconductor device having a first surface and a second surface opposite to the first surface, the semiconductor substrate including a semiconductor device having a plurality of element regions and division regions defining the element regions, the semiconductor substrate including a semiconductor device having a first surface and a second surface opposite to the first surface ... the sidewall cleaning step includes a deposition step of depositing a first film on a surface of the protective film and the adhesion using a first plasma, and a removal step of removing at least a part of the adhesion together with the first film deposited on the surface of the adhesion using a second plasma, and the deposition step and the removal step are alternately repeated multiple times in order that the protective film remains in the sidewall cleaning step.

[0011] Another aspect of the present invention relates to a method for cleaning an electronic component, comprising: a preparation step of preparing an electronic component having a first surface covered with a protective film, a second surface opposite to the first surface, a sidewall between the first surface and the second surface, and a deposit adhering to the sidewall; and a sidewall cleaning step of cleaning the sidewall of the electronic component, wherein the sidewall cleaning step is performed by exposing the electronic component to a fourth plasma generated by a process gas including a carbon oxide gas.

[0012] Another aspect of the present invention relates to a method for manufacturing an element chip, comprising: a substrate preparation step of preparing a substrate having a first surface and a second surface opposite to the first surface, the substrate having a plurality of element regions and division regions defining the element regions; a protective film formation step of forming a protective film on the first surface; an opening formation step of forming an opening in the protective film to expose the division regions on the first surface; a first step of forming a recess corresponding to the exposed division region by plasma processing; and a second step of depositing a second film on an inner wall of the recess by plasma processing, the first surface being covered with the protective film, the second surface, a sidewall between the first surface and the second surface, and a deposit adhering to the sidewall; and a sidewall cleaning step of cleaning the sidewall of the electronic component, the sidewall cleaning step being performed by exposing the electronic component to a fourth plasma generated by a process gas including a carbon dioxide gas. Effect of the Invention

[0013] According to the present invention, the sidewalls can be cleaned while reducing damage to the electronic components.

[0014] The novel features of the present invention are set forth in the appended claims, but the present invention, both in terms of structure and content, together with other objects and features of the present application, will be better understood from the following detailed description taken in conjunction with the drawings. [Brief description of the drawings]

[0015] [Figure 1] 3 is a cross-sectional view showing a schematic view of a main part of an electronic component subjected to a sidewall cleaning step according to the first embodiment of the present invention. FIG. [Diagram 2] 1 is a cross-sectional view showing a schematic view of a main part of an electronic component after a first deposition step according to a first embodiment of the present invention. [Diagram 3] 1 is a cross-sectional view showing a schematic view of a main part of an electronic component after a first removal step according to a first embodiment of the present invention. [Figure 4] 4 is a cross-sectional view illustrating a schematic view of a main part of an electronic component after an N-th (N≧2) deposition step according to the first embodiment of the present invention. [Diagram 5] 4 is a cross-sectional view showing a schematic view of a main part of an electronic component after an N-th (N≧2) removal step according to the first embodiment of the present invention. [Figure 6] 1 is a flowchart showing a method for cleaning an electronic component according to a first embodiment of the present invention. [Figure 7A] FIG. 2 is a top view diagrammatically illustrating an electronic component prepared in an electronic component preparation step according to the first and second embodiments of the present invention. [Figure 7B] FIG. 7B is a cross-sectional view taken along line AA in FIG. 7A. [Figure 8] 5 is a flowchart showing a method for manufacturing the component chip according to the first embodiment of the present invention. [Figure 9] FIG. 2 is a top view diagrammatically illustrating a substrate prepared by a substrate preparation step according to the first and second embodiments of the present invention. [Figure 10] FIG. 2 is a cross-sectional view illustrating a schematic view of a part of a substrate prepared in a substrate preparation step according to the first and second embodiments of the present invention. [Figure 11] FIG. 2 is a cross-sectional view showing a schematic view of a part of a substrate after a protective film forming step according to the first and second embodiments of the present invention. [Figure 12] FIG. 3 is a cross-sectional view illustrating a schematic view of a part of the substrate after an opening forming step according to the first and second embodiments of the present invention. [Figure 13]FIG. 2 is a cross-sectional view that typically illustrates a component chip produced in an etching process according to the first and second embodiments of the present invention. [Figure 14] FIG. 4 is a cross-sectional view that typically illustrates the element chip after a protective film removing step according to the first and second embodiments of the present invention. [Figure 15] 1 is a cross-sectional view that illustrates a schematic structure of a plasma processing apparatus that can be used in the first and second embodiments of the present invention. [Figure 16] FIG. 1 is a block diagram of a plasma processing apparatus used in the first and second embodiments of the present invention. [Figure 17] 1 is a graph showing the relationship between the vertical and lateral etch rate of a polymer and the pressure in a vacuum chamber. [Figure 18] 1 is a graph showing the relationship between the ratio of the etch rate in the vertical direction to the lateral direction of a polymer and the pressure in a vacuum chamber. [Figure 19] 10 is a cross-sectional view showing a schematic view of a main part of an electronic component subjected to a sidewall cleaning step according to a second embodiment of the present invention. FIG. [Figure 20] FIG. 11 is a cross-sectional view illustrating a schematic view of a main part of an electronic component during a sidewall cleaning process according to a second embodiment of the present invention. [Figure 21] FIG. 11 is a cross-sectional view showing a schematic view of a main part of an electronic component after a sidewall cleaning process according to a second embodiment of the present invention. [Figure 22] 5 is a flowchart showing a method for cleaning an electronic component according to a second embodiment of the present invention. [Diagram 23] 10 is a flowchart showing a method for manufacturing a component chip according to a second embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] First Embodiment A first embodiment of the present invention will be described. In this embodiment, the sidewall of an electronic component is cleaned by utilizing the difference in susceptibility to plasma treatment between the main surface and the sidewall of the electronic component. This makes it possible to remove deposits adhering to the sidewall while leaving the protective film (mask) covering the main surface of the electronic component. In the sidewall cleaning process of this embodiment, the following deposition process and removal process are repeated.

[0017] In the deposition step, a first plasma is used to deposit a first film on the surface of the protective film and the sidewalls covering one main surface (first surface) of the electronic component. The first film is deposited thicker on the surface of the protective film which is more easily irradiated with plasma. Meanwhile, the first film is deposited thinner on the sidewalls than on the surface of the protective film. The first surface is protected by the protective film and the first film.

[0018] In the removing step, the second plasma is used to remove at least a part of the deposits on the sidewall together with the first film. As described above, since the first film is deposited thinner on the sidewall, the removing step removes the deposits on the sidewall together with the first film. On the other hand, since the first film is deposited thickly on the first surface, the removing step does not etch the protective film or reduces the amount of etching.

[0019] By repeating the deposition process and the removal process, the deposition and removal of the first film are repeated on the first surface. In other words, even if the deposition process and the removal process are repeated, etching of the protective film itself is suppressed. Therefore, damage to the first surface due to the sidewall cleaning process is suppressed. On the other hand, on the surface of the sidewall, deposition and removal of the first film are repeated, and when the first film is removed, the deposits are also removed. This cleans the sidewall. The number of repetitions is not particularly limited, and can be repeated until the deposits on the sidewall are removed. This is because etching of the protective film itself is suppressed as described above.

[0020] The cleaning method according to this embodiment is particularly suitable for cleaning the side walls of electronic components that have undergone the Bosch process. In the Bosch process, a first step of forming a recess corresponding to a division region on a substrate by plasma processing and a second step of depositing a second film on the inner wall of the recess by plasma processing are repeated alternately. Therefore, the side walls of the formed element chips are prone to adhesion of the deposited film and reaction products (adherents) between the deposited film and plasma. Furthermore, unevenness called scallops is formed on the side walls. Adherents attached to the scallops are difficult to remove. According to the cleaning method according to this embodiment, such adherents can be removed in a simple manner. This embodiment includes a method for manufacturing element chips that includes an etching step using the Bosch process.

[0021] The sidewall cleaning process will now be described in detail. The sidewall cleaning process includes a deposition process and a removal process, and the deposition process and the removal process are alternately repeated multiple times in the sidewall cleaning process.

[0022] (a) Deposition process The sidewall of the electronic component is covered with a film (deposited film) deposited by, for example, the Bosch process and a deposit containing a reaction product between the deposited film and plasma. Such deposits are mainly composed of a polymer (fluorocarbon) containing carbon and fluorine atoms, and further contain silicon and oxygen. In this process, a first film is further deposited on the surface of the protective film and the deposit (i.e., the sidewall).

[0023] The deposition of the first film uses, for example, a first plasma generated by a first process gas containing carbon atoms (C). The gas containing carbon atoms efficiently deposits the first film on the surface of the protective film and the sidewall. Examples of the gas containing carbon atoms include fluorocarbon gases such as C4F8 and C5F8; and fluorohydrocarbons such as CHF3 and CH2F2.

[0024] The first process gas may contain other gases, such as Ar, CH4, H2, N2, etc. The ratio of the gas containing carbon atoms in the first process gas may be 10% by volume or more and less than 100% by volume, and may be 30% by volume or more and 98% by volume or less.

[0025] The thickness of the first film deposited on the surface of the protective film is not particularly limited. The thickness of the first film deposited on the surface of the protective film may be appropriately set in consideration of the conditions of the removal process, productivity, etc. The thickness of the first film deposited on the surface of the protective film may be 3 nm or more and 660 nm or less, or 50 nm or more and 300 nm or less. Such a first film can be formed under the conditions of a deposition rate of 200 nm / min or more and 2000 nm / min or less, and a deposition time of 1 second or more and 20 seconds or less.

[0026] It is desirable that the first film is not excessively deposited on the surface of the sidewall. The ratio of the thickness D2 of the first film deposited on the surface of the sidewall to the thickness D1 of the first film deposited on the surface of the protective film: D2 / D1 is preferably 4 / 10 or less, more preferably 3 / 10 or less. D2 / D1 is preferably 1 / 100 or more, more preferably 1 / 50 or more. The thickness D2 is the average value of the thickness of the first film deposited on the surface of the sidewall at any five points. Usually, the first film deposited on the surface of the sidewall is thicker closer to the first surface.

[0027] The conditions for generating the first plasma are appropriately set according to the thickness and components of the first film. In particular, it is desirable to generate the first plasma under conditions that allow a sufficient thickness of the first film to be deposited on the surface of the protective film, while preventing excessive deposition of the first film on the surface of the sidewall. This allows the deposits to be removed in a small number of cycles, improving productivity.

[0028] The rate at which the first film is deposited on the surface of the protective film in the deposition process is defined as rate RD1. The rate at which the first film is deposited on the surface of the sidewall in the deposition process is defined as rate RD2. From the above viewpoints, the ratio of rate RD2 to rate RD1, RD2 / RD1, is preferably 4 / 10 or less, and more preferably 3 / 10 or less. RD2 / RD1 is preferably 1 / 100 or more, and more preferably 1 / 50 or more.

[0029] The deposition rate of the first film can be controlled, for example, in a plasma processing apparatus used in the sidewall cleaning process, by the high frequency power applied to the first electrode arranged to face the stage on which the electronic components are placed, the high frequency power applied to the second electrode built into the stage, the pressure in the processing chamber, the flow rate of gas, and the temperature of the electronic components. By applying the high frequency power to the second electrode, a bias voltage is applied to the stage. However, it is preferable that the high frequency power applied to the second electrode in the deposition process is low, and it may be 0 W. This makes it possible to suppress the rate RD2 at which the first film is deposited on the surface of the sidewall.

[0030] In order to deposit a sufficient thickness of the first film on the surface of the protective film while preventing the first film from being excessively deposited on the surface of the sidewall, a method of increasing the pressure in the processing chamber is given. In particular, a method of increasing the pressure in the processing chamber while increasing the absolute value of the deposition rate of the first film is effective. This increases the difference between the amount of the first film deposited on the surface of the protective film and the amount deposited on the surface of the sidewall per unit time, and RD2 / RD1 tends to become smaller.

[0031] The pressure in the processing chamber can be increased, for example, by increasing the gas flow rate. The absolute value of the deposition rate of the first film can be increased, for example, by increasing the gas flow rate, increasing the high frequency power applied to the first electrode, or decreasing the temperature of the electronic component. However, an upper limit (threshold) is set for the gas flow rate according to the power value of the high frequency power applied to the first electrode. Therefore, by setting the gas flow rate near this upper limit and then adjusting the exhaust speed, it is possible to increase both the pressure in the processing chamber and the absolute value of the deposition rate of the first film. Two or more of the above methods may be combined. For example, the electronic component may be cooled while increasing the gas flow rate, and the high frequency power applied to the first electrode may be increased. In the deposition process, the pressure in the processing chamber is preferably 10 Pa or more. The electronic component may be cooled, for example, by being strongly adsorbed to a cooled stage.

[0032] The conditions for generating the first plasma are, for example, as follows. C4F8 is supplied to the processing chamber (vacuum chamber) as the process gas at 100 sccm or more and 600 sccm or less. The pressure in the vacuum chamber is 10 Pa or more and 40 Pa or less, the high frequency power PD1 is 1000 W or more and 4800 W or less, and the high frequency power PD2 is 0 W or more and 100 W or less. The stage temperature is -15°C or more and 15°C or less. According to the above conditions, the deposition rate is about 100 nm / min or more and 2500 nm / min or less. The processing time may be set in consideration of the thickness of the first film deposited on the surface of the protective film. The processing time is, for example, 1 second or more and 10 seconds or less.

[0033] (b) Removal process In this process, at least a portion of the deposits adhering to the sidewalls of the electronic component are removed by the second plasma. The deposits are removed together with the first film. The first film covering the surface of the protective film may also be removed. However, since the first film on the protective film is thick, damage to the protective film is suppressed.

[0034] The removal of the deposits and / or the first film (hereinafter sometimes collectively referred to as deposits, etc.) uses, for example, a second plasma generated by a second process gas containing oxygen atoms. Deposits, etc. containing organic matter as a main component are efficiently removed by the second plasma derived from a gas containing oxygen atoms. Examples of gases containing oxygen atoms include O2, CO2, and CO.

[0035] The second process gas may contain other gases, such as a fluorine-containing gas. This makes it easier to remove deposits and the like. Examples of the fluorine-containing gas include fluorocarbon gases such as CF4 and C4F8, fluorohydrocarbons such as CHF3, and SF6. The proportion of the gas containing oxygen atoms in the second process gas may be 10% by volume or more and less than 100% by volume, and may be 30% by volume or more and 98% by volume or less.

[0036] The conditions for generating the second plasma are appropriately set depending on the amount and components of the deposits, etc. However, it is desirable to generate the second plasma under conditions that do not remove the first film on the protective film excessively. This prevents damage to the protective film and protects the first surface.

[0037] The rate at which the first film on the surface of the protective film is removed in the removing step is defined as rate RR1. The rate at which the first film on the surface of the sidewall is removed in the removing step is defined as rate RR2. From the above viewpoint, the ratio of rate RR2 to rate RR1: RR2 / RR1 is preferably, for example, 3 / 10 or more and 10 / 10 or less.

[0038] The removal rate of the first film on the sidewall surface can also be controlled by the high frequency power applied to the first electrode, the high frequency power applied to the second electrode, the pressure in the processing chamber, the gas flow rate, the stage temperature, and the like.

[0039] In order to prevent the first film on the protective film from being excessively removed, a method of increasing the pressure in the processing chamber can be mentioned, as in the deposition process. In particular, a method of increasing the pressure in the processing chamber while increasing the absolute value of the removal rate of the first film is effective. In order to increase the absolute value of the removal rate of the first film, for example, a method of increasing the gas flow rate, a method of increasing the high frequency power applied to the first electrode, a method of increasing the temperature of the electronic component, and the like can be mentioned. Two or more of the above methods may be combined. For example, the temperature of the electronic component may be increased while increasing the gas flow rate, and further the high frequency power applied to the first electrode may be increased. In order to increase the temperature of the electronic component, a method of weakening the chucking force of the electronic component to the stage can be mentioned. The chucking force of the electronic component to the stage is controlled by the voltage value applied to the ESC electrodes described later. In the removal process, the pressure in the processing chamber is preferably 20 Pa or more, and more preferably 30 Pa or more.

[0040] The conditions for generating the second plasma are, for example, as follows. A mixed gas of O2 and CF4 (flow ratio CF4 / O2=0% to 10%) is supplied to the vacuum chamber at 50 sccm to 600 sccm as the process gas. The pressure in the vacuum chamber is 10 Pa to 60 Pa, the high frequency power PR1 is 1000 W to 4800 W, the high frequency power PR2 is 0 W to 100 W, and the stage temperature is -15°C to 15°C. According to the above conditions, the removal rate is about 200 nm / min to 3000 nm / min. The processing time may be set to such an extent that the thickness of the first film deposited on the surface of the protective film in the deposition process is removed. The processing time is, for example, 0.1 seconds to 200 seconds, and preferably 6 seconds to 15 seconds.

[0041] The deposition process and the removal process are repeatedly performed alternately a plurality of times. Each time the removal process is performed, the amount of the deposit on the sidewall decreases. On the other hand, the thickness of the protective film is maintained. Each deposition process may be performed under the same conditions or different conditions. For example, the processing time in the deposition process may be gradually shortened. Similarly, each removal process may be performed under the same conditions or different conditions. For example, the processing time in the removal process may be gradually lengthened. Alternatively, the high-frequency power PR2 applied to the second electrode in the removal process may be changed over time. The sidewall cleaning process may be started from the deposition process or the removal process. However, it is desirable to end with the removal process.

[0042] As described above, the sidewall cleaning process is performed by utilizing the difference in the ease of plasma treatment between the main surface and the sidewall of the electronic component. The sidewall cleaning process is preferably performed so that the ratio of the speed RD2 to the speed RD1 in the deposition process: RD2 / RD1 and the ratio of the speed RR2 to the speed RR1 in the removal process: RD2 / RD1 satisfy the relationship of RD2 / RD1 < RR2 / RR1. That is, it is preferable to perform the sidewall cleaning process under the condition that the first film is less likely to be deposited on the sidewall while the first film on the sidewall is easily removed as compared with the first film on the protective film. Thereby, the cleaning of the sidewall is performed more efficiently.

[0043] In order to satisfy the relationship of RD2 / RD1 < RR2 / RR1, for example, the pressure PD1 in the processing chamber in the deposition process and the pressure PR1 in the processing chamber in the removal process may be controlled so as to satisfy the relationship of PD1 < PR1.

[0044] Also, the high-frequency power PD2 applied to the second electrode in the deposition process and the high-frequency power PD2 applied to the second electrode in the removal process may be controlled so as to satisfy the relationship of PD2 ≤ PR2.

[0045] In the sidewall cleaning process, a plurality of electronic components may be processed simultaneously. This improves productivity. In this case, the distance W between the opposing sidewalls of any two electronic components and the height H of the sidewall of one of the electronic components may satisfy the relationship H≧5×W. Even in the case where there are high aspect ratio irregularities like this, according to this embodiment, it is possible to remove the deposits adhering to the sidewalls while maintaining the protective film covering the main surface of the electronic component. Furthermore, the relationship H≦50×W may be satisfied.

[0046] The height H of the side walls is not particularly limited. The height H of the side walls is, for example, 20 μm or more and 700 μm or less. The distance W between the side walls is also not particularly limited. The distance W between the side walls is, for example, 4 μm or more and 60 μm or less.

[0047] Distance W is the average value of the shortest distance between any two points on the ends of the first surfaces of opposing sidewalls of any two electronic components. If the entire surfaces of the sidewalls are not opposing, the shortest distance between the opposing parts of the sidewalls may be measured. Sidewall height H is the lower of the average values ​​of the heights of any two points on the two sidewalls (or parts thereof) used to calculate distance W. The sidewall height is the shortest distance between the first surface and the second surface that the sidewall connects.

[0048] Hereinafter, the present embodiment will be specifically described with reference to the drawings, taking as an example an electronic component having a semiconductor layer and a wiring layer, although the present embodiment is not limited thereto.

[0049] 1 is a cross-sectional view showing a schematic view of a main part of an electronic component to be subjected to a sidewall cleaning process. A plurality of electronic components 200 are supported on a holding sheet 22, which will be described later. The holding sheet 22 is used to improve handling properties and is not necessarily required.

[0050] The electronic component 200 includes a semiconductor layer 11 and a wiring layer 12 disposed on a first surface 200X side of the semiconductor layer 11. The first surface 200X is covered with a protective film 40. Scallops are formed on a sidewall 200Z of the electronic component 200. A deposit 60 is attached to the sidewall 200Z. Note that in the illustrated example, the scallops and the deposit are exaggerated.

[0051] 2 is a cross-sectional view showing a schematic view of the main part of the electronic component after the first deposition step. A first film 50 is deposited on the surface of the protective film 40 and the surface of the sidewall 200Z. However, the first film 50 deposited on the surface of the sidewall 200Z is thinner than the first film 50 deposited on the surface of the protective film 40.

[0052] 3 is a cross-sectional view showing a schematic view of a main part of an electronic component after a first removal step. The first film 50 deposited in the deposition step has been removed. On the sidewall 200Z, a part of the deposit 60 has been removed together with the first film 50, and the layer of the deposit 60 has become thin.

[0053] 4 is a cross-sectional view showing a schematic view of a main part of an electronic component after the Nth (N≧2) deposition step. A first film 50 is deposited on the surface of the protective film 40 and the surface of the sidewall 200Z. The first film 50 deposited on the surface of the sidewall 200Z is thinner than the first film 50 deposited on the surface of the protective film 40.

[0054] 5 is a cross-sectional view showing a schematic view of a main part of an electronic component after the Nth (N≧2) removal step. The first film 50 deposited in the Nth (N≧2) deposition step has been removed. On the sidewall 200Z, the first film 50 and the remaining part of the deposit 60 have been removed, exposing the sidewall 200Z.

[0055] Next, a cleaning method including the above-mentioned sidewall cleaning step will be described. A. How to clean electronic components The method for cleaning an electronic component according to the present embodiment includes a preparation step of preparing an electronic component having a first surface covered with a protective film, a second surface opposite to the first surface, a sidewall between the first surface and the second surface, and a deposit attached to the sidewall, and the sidewall cleaning step of cleaning the sidewall of the electronic component. Fig. 6 is a flowchart showing the cleaning method according to the present embodiment.

[0056] (i) Electronic component preparation process (S01) At least one electronic component is provided, the electronic component having a first surface covered with a protective film, a second surface opposite to the first surface, and a sidewall between the first surface and the second surface. The electronic component is, for example, a chip fabricated by plasma dicing a substrate by the Bosch process. The sidewall may have scallops, i.e., recesses and protrusions.

[0057] The electronic component includes, for example, a semiconductor layer and a wiring layer. The semiconductor layer includes, for example, silicon (Si), gallium arsenide (GaAs), gallium nitride (GaN), silicon carbide (SiC), etc. The thickness of the semiconductor layer in the electronic component is not particularly limited and may be, for example, 20 μm or more and 1000 μm or less, or 50 μm or more and 300 μm or less.

[0058] The wiring layer constitutes, for example, a semiconductor circuit, an electronic component element (LED, laser, MEMS, etc.), etc., and may include an insulating film, a metal material, a resin layer (for example, polyimide), a resist layer, an electrode pad, a bump, etc. The insulating film may be included as a laminate with a metal material for wiring (a multilayer wiring layer or a rewiring layer).

[0059] The protective film includes so-called resist materials, such as thermosetting resins such as polyimide, photoresists such as phenolic resins, or water-soluble resists such as acrylic resins. Such protective films formed from resist materials are usually formed to protect electronic components during manufacture and are removed before the electronic components are completed. An insulating film (such as silicon nitride or silicon oxide film) and / or a resin layer (polyimide) disposed on the outermost surface of the electronic components may be used as the protective film. Such protective films formed from insulating films are formed to protect electronic components not only during manufacture but also after distribution, and are not removed.

[0060] The thickness of the protective film is not particularly limited. However, when the protective film is formed of the above resist material, the thickness of the protective film is preferably such that it is not completely removed by the etching step using the Bosch process. For example, the amount (thickness) of the protective film etched in the above etching step is calculated, and the thickness of the protective film is set to be equal to or greater than this etching amount. The thickness of the protective film is, for example, 5 μm or more and 60 μm or less. Note that when the protective film is the above insulating film or the like, the conditions of the Bosch process are adjusted so that the amount of etching of the protective film in the above etching step is several μm or less.

[0061] When multiple electronic components are processed simultaneously in the sidewall cleaning process, it is preferable that the multiple electronic components are attached to a holding sheet fixed to a frame from the viewpoint of handleability. A member including a frame and a holding sheet fixed to the frame is called a transport carrier.

[0062] (Transport carrier) The frame is a frame having an opening large enough to enclose a plurality of electronic components, and has a predetermined width and a substantially constant thin thickness. The frame has a degree of rigidity that allows it to transport the holding sheet and the plurality of electronic components while holding them. The shape of the opening of the frame is not particularly limited, and may be, for example, a circle, a rectangle, a hexagon, or another polygon. Examples of the material of the frame include metals such as aluminum and stainless steel, and resins.

[0063] The material of the holding sheet is not particularly limited. In particular, it is preferable that the holding sheet includes an adhesive layer and a flexible non-adhesive layer, in that the electronic component can be easily attached thereto.

[0064] The material of the non-adhesive layer is not particularly limited, and examples thereof include thermoplastic resins such as polyolefins such as polyethylene and polypropylene, and polyesters such as polyvinyl chloride and polyethylene terephthalate. The resin film may contain various additives such as rubber components (e.g., ethylene-propylene rubber (EPM), ethylene-propylene-diene rubber (EPDM), etc.) for adding elasticity, plasticizers, softeners, antioxidants, and conductive materials. The thermoplastic resin may also have a functional group that exhibits a photopolymerization reaction, such as an acrylic group. The thickness of the non-adhesive layer is not particularly limited, and is, for example, 50 μm or more and 300 μm or less, and preferably 50 μm or more and 150 μm or less.

[0065] The outer periphery of the surface having the adhesive layer (adhesive surface) is attached to one surface of the frame, covering the opening of the frame. One main surface (second surface) of the electronic component is attached to the portion of the adhesive surface exposed from the opening of the frame, thereby holding the electronic component on the holding sheet. The electronic component may be held on the holding sheet via a die attachment film (DAF).

[0066] The adhesive layer is preferably made of an adhesive component whose adhesive strength decreases when irradiated with ultraviolet (UV) rays. As a result, when picking up the electronic components after the protective film removal step, the electronic components are easily peeled off from the adhesive layer by irradiating them with UV rays, making them easy to pick up. For example, the adhesive layer can be obtained by applying a UV-curable acrylic adhesive to one side of the non-adhesive layer to a thickness of 5 μm to 100 μm (preferably 5 μm to 15 μm).

[0067] The above-mentioned electronic component preparation step may include a substrate preparation step of preparing a substrate having a first surface and a second surface opposite to the first surface, a protective film formation step of forming a protective film covering the first surface, an opening formation step of forming an opening in the protective film to expose the division regions on the first surface, a first step of forming a recess corresponding to the exposed division regions by plasma processing, and a second step of depositing a second film on the inner wall of the recess by plasma processing. These steps will be described later. As a result, a plurality of electronic components arranged at a predetermined interval are prepared.

[0068] Fig. 7A is a top view showing an electronic component prepared in an electronic component preparation step, and Fig. 7B is a cross-sectional view taken along line AA in Fig. 7A, in which attachments are omitted for the sake of convenience.

[0069] The transport carrier 20 includes a frame 21 and a holding sheet 22 fixed to the frame 21. The frame 21 may be provided with a notch 21a or a corner cut 21b for positioning. The holding sheet 22 includes an adhesive surface 22X and a non-adhesive surface 22Y, and the outer periphery of the adhesive surface 22X is attached to one surface of the frame 21. The second surface 200Y of the electronic component 200 is attached to a portion of the adhesive surface 22X exposed from the opening of the frame 21.

[0070] The electronic components 200 are attached at intervals to the adhesive surface 22X of the holding sheet 22. Such electronic components 200 are obtained by plasma dicing a substrate using the Bosch process. The electronic component 200 includes a semiconductor layer 11 and a wiring layer 12 laminated on the first surface 200X side of the semiconductor layer 11. A protective film 40 is formed on the first surface 200X of the electronic component 200.

[0071] (ii) Sidewall cleaning process (S02) The sidewalls of the device chip are cleaned. The sidewall cleaning step is performed by the above-mentioned (a) deposition step (S021) and (b) removal step (S022). The sidewall cleaning step can remove the deposits on the sidewall while leaving the protective film. The deposition step and removal step are repeated until the deposits are removed.

[0072] (iii) Protective film removal process (S03) After the final removal step, the protective coating may be removed.

[0073] For example, a third plasma generated by a third process gas containing oxygen gas (O2) is used to remove the protective film. The third process gas may contain a fluorine-containing gas together with O2. Examples of the fluorine-containing gas include the same compounds as those described above. The proportion of O2 in the third process gas may be 10% by volume or more and less than 100% by volume, or 30% by volume or more and 98% by volume or less.

[0074] The conditions for generating the third plasma are appropriately set depending on the amount, components, etc. of the protective film. The conditions for generating the third plasma are, for example, as follows. A mixed gas of CF4 and O2 (flow ratio CF4 / O2=0% to 10%) is supplied to the vacuum chamber at 50 sccm to 600 sccm as an ashing gas. The pressure in the vacuum chamber is 1 Pa to 30 Pa, the high frequency power PA1 applied to the first electrode is 1000 W to 4800 W, and the high frequency power PA2 applied to the second electrode is 0 W to 100 W. It is desirable to set the high frequency power PA2 applied to the second electrode in the protective film removal step to be smaller than the power applied to the second electrode in the etching step. The processing time is appropriately set according to the amount of the protective film, and is, for example, 3 seconds to 300 seconds.

[0075] If the protective film is water-soluble, it may be removed by washing with water instead of the third plasma. If the protective film is an insulating film and / or a resin layer disposed on the outermost surface of the electronic component, it is not necessary to remove the protective film. This is because such a protective film is formed to protect the electronic component not only during manufacturing but also after distribution.

[0076] B. Manufacturing method of element chip The manufacturing method of the element chip according to this embodiment includes a substrate preparation step of preparing a substrate having a first surface and a second surface opposite to the first surface, the substrate having a plurality of element regions and dividing regions that define the element regions, the substrate having a plurality of element regions and a dividing region that defines the element regions, the substrate having a plurality of element regions and a dividing region that defines the first surface, the ...

[0077] The sidewall cleaning step includes a deposition step of depositing a first film on the surface of the protective film and the deposit using a first plasma, and a removal step of removing at least a part of the deposit together with the first film deposited on the surface of the deposit using a second plasma. The deposition step and the removal step are alternately repeated multiple times so that the protective film remains. Figure 8 is a flow chart showing a method for manufacturing a component chip according to this embodiment.

[0078] (1) Board preparation process (S11) First, a substrate to be processed is prepared.

[0079] (substrate) The substrate has a first surface and a second surface, and also has a plurality of element regions and division regions that define the element regions. The substrate has the semiconductor layer described above. The element regions of the substrate may further have the wiring layer described above. The division regions of the substrate may further have an insulating film and a metal material such as a TEG (Test Element Group). A plurality of element chips are obtained by etching the substrate in the division regions.

[0080] The size of the substrate is not particularly limited, and may be, for example, about 50 mm to 300 mm in maximum diameter. The shape of the substrate is also not particularly limited, and may be, for example, circular or rectangular. The substrate may also be provided with a cutout such as an orientation flat or a notch.

[0081] The shape of the divided regions is not limited to straight lines, and may be zigzag or wavy as long as it is set according to the desired shape of the element chip. Examples of the shape of the element chip include a rectangle, a hexagon, and the like.

[0082] The width of the divided regions is not particularly limited, and may be set appropriately depending on the size of the substrate and the element chip. The width of the divided regions is, for example, 10 μm or more and 300 μm or less. The widths of the divided regions may be the same or different. A plurality of divided regions are usually arranged on the substrate. The pitch between adjacent divided regions is also not particularly limited, and may be set appropriately depending on the size of the substrate and the element chip.

[0083] The second surface of the substrate may be attached to a holding sheet fixed to a frame. This improves handling. By dicing the substrate attached to the holding sheet, a plurality of device chips arranged at intervals on the holding sheet are obtained. The shape, material, etc. of the frame and holding sheet are as described above.

[0084] (2) Protective film formation process (S12) A protective film is formed covering the first surface of the substrate. The protective film is provided to protect the element region of the substrate from plasma, etc. After the etching process, the protective film is removed. The material and thickness of the protective film are as described above.

[0085] The protective film is formed, for example, by forming a resist material into a sheet and then attaching the sheet to a substrate, or by applying a raw material liquid of the resist material to the substrate by a method such as spin coating or spray coating. By applying the raw material liquid while changing the amount of application, the thickness of the protective film can be changed partially. The amount of application may be adjusted by using both spin coating and spray coating.

[0086] (3) Opening formation process (S13) Openings are formed in the protective film to expose the dividing regions of the substrate.

[0087] The openings are formed, for example, by removing areas of a protective film made of photoresist that correspond to the division regions by photolithography. Alternatively, the openings may be formed by patterning areas of a protective film made of a thermosetting resin or a water-soluble resist that correspond to the division regions by laser scribing.

[0088] The opening may be formed by removing the protective film and the wiring layer in the dividing region. The wiring layer in the dividing region may be removed in an etching process described below. In this case, the conditions for generating plasma for removing the wiring layer may be different from the conditions for generating plasma for etching the substrate.

[0089] (4) Etching process (S14) The substrate is exposed to plasma to etch the parting regions exposed through the openings down to the second surface, thereby forming a plurality of device chips from the substrate, the plurality of device chips being obtained in a state held by a holding sheet.

[0090] The etching process is performed by the so-called Bosch process. In the Bosch process, a cycle including a first step of forming grooves corresponding to the division regions in the substrate and a second step of depositing a film on the inner walls of the grooves is performed one or more times. Furthermore, a step of removing the film (deposited film) is performed between the first and second steps.

[0091] In the first step of the first cycle, a shallow recess corresponding to the division region is first formed. Then, in the second step, a deposition film is formed on the inner wall of the shallow recess formed. The second cycle starts with a deposition film removal step. In the deposition film removal step, anisotropic etching is performed. That is, the deposition film covering the bottom of the inner wall of the recess is removed. Then, the first step is performed, and the bottom of the recess is isotropically etched. After the first step, the second step is performed again, and a deposition film is formed on the inner wall of the recess. By repeating the second cycle (the deposition film removal step, the first step, and the second step) in this way, at least one element chip having a first surface covered with a protective film, a second surface, and a side wall is obtained. The side wall of the formed element chip is attached with a deposit including the deposition film and a reaction product of the deposition film and plasma. The side wall may be formed with a scallop.

[0092] The processing conditions in the deposition film removal step are, for example, as follows: SF6 is supplied to the vacuum chamber at 200 sccm to 1000 sccm and O2 is supplied to the vacuum chamber at 0 sccm to 20 sccm as process gases. The pressure in the vacuum chamber is 5 Pa to 30 Pa, the high frequency power applied to the first electrode is 1500 W to 4800 W, and the high frequency power applied to the second electrode is 50 W to 200 W. The processing time is 1 second to 5 seconds.

[0093] The processing conditions in the first step are, for example, as follows: SF6 is supplied to the vacuum chamber at 200 sccm to 1000 sccm and O2 is supplied to the vacuum chamber at 0 sccm to 20 sccm as process gases. The pressure in the vacuum chamber is 5 Pa to 30 Pa, the high frequency power applied to the first electrode is 1500 W to 4800 W, and the high frequency power applied to the second electrode is 0 W to 100 W. The processing time is 3 seconds to 30 seconds.

[0094] The processing conditions in the second step are, for example, as follows: C4F8 is supplied to the vacuum chamber as a process gas at 100 sccm to 600 sccm; the pressure in the vacuum chamber is 5 Pa to 30 Pa, the high frequency power applied to the first electrode is 1500 W to 4800 W, and the high frequency power applied to the second electrode is 0 W to 100 W; the processing time is 1 second to 10 seconds.

[0095] By repeating the second step, the deposited film removal step, and the first step under the above conditions, the semiconductor layer containing Si can be etched vertically in the depth direction at a rate of 10 μm / min or more and 20 μm / min or less.

[0096] (5) Sidewall cleaning process (S15) The side walls of the resulting electronic component are cleaned. The sidewall cleaning step is performed by the sidewall cleaning step (ii) in the above-mentioned method for cleaning electronic components. According to the sidewall cleaning step of this embodiment, it is possible to remove the deposits on the sidewall while maintaining the protective film.

[0097] The plasma processing apparatus used in the etching step and the sidewall cleaning step may be the same or different. When the same plasma processing apparatus is used, both steps may be performed successively.

[0098] (6) Protective film removal process (S16) The protective film removing step is carried out by the protective film removing step (iii) in the above-mentioned method for cleaning electronic components, whereby the protective film is removed.

[0099] The plasma processing apparatus used in the sidewall cleaning step and the protective film removing step may be the same or different. When the same plasma processing apparatus is used, both steps may be performed consecutively.

[0100] After the protective film removing step, the element chip is removed from the support sheet. The element chip is pushed up together with the holding sheet by a push-up pin from the non-adhesive surface side of the holding sheet, for example. As a result, at least a part of the element chip is lifted up from the holding sheet. Thereafter, the element chip is removed from the holding sheet by a pick-up device.

[0101] Hereinafter, the method for manufacturing the element chip will be specifically described with reference to the drawings, although the present embodiment is not limited thereto.

[0102] Fig. 9 is a top view showing a substrate prepared by the substrate preparation step according to the present embodiment. Fig. 10 is a cross-sectional view showing a part of the substrate. The substrate 10 has a first surface 10X and a second surface 10Y, and also has a plurality of element regions 101 and division regions 102 that define the element regions 101. The element region 101 has a semiconductor layer 11 and a wiring layer 12 laminated on the first surface 10X side of the semiconductor layer 11. The division region 102 has a semiconductor layer 11 and an insulating film 14. The second surface 10Y of the substrate 10 is attached to a holding sheet 22 provided on the transport carrier 20.

[0103] 11 is a cross-sectional view showing a schematic view of a part of the substrate after the protective film forming step according to the present embodiment. A protective film 40 is formed on a first surface 10X of the substrate 10.

[0104] 12 is a cross-sectional view showing a schematic view of a part of the substrate after the opening forming step according to the present embodiment. The protective film 40 and the insulating film 14 are removed from the dividing region 102, and the semiconductor layer 11 is exposed in the dividing region 102 through the opening.

[0105] 13 is a cross-sectional view showing a schematic diagram of an element chip produced by an etching process according to the present embodiment. A dividing region of a substrate is etched, and a plurality of element chips 200 are formed from the substrate. A scallop is formed on a side wall 200Z of the electronic component. A first surface 200X of the element chip 200 is covered with a protective film 40.

[0106] 14 is a cross-sectional view showing a schematic diagram of the component chip after the protective film removing step according to this embodiment, in which the protective film 40 covering the first surface 200X has been removed.

[0107] Hereinafter, a plasma processing apparatus used in the etching process, the sidewall cleaning process, and the protective film removal process will be specifically described with reference to Fig. 15. However, the plasma processing apparatus is not limited to this. Fig. 15 is a cross-sectional view showing a schematic structure of a plasma processing apparatus 100. In Fig. 15, a plurality of electronic components (element chips) are held by a transport carrier.

[0108] (Plasma processing equipment) The plasma processing apparatus 100 includes a stage 111. The transport carrier 20 holding the electronic components 200 is mounted on the stage 111 so that the surface of the holding sheet 22 holding the electronic components 200 faces upward. The stage 111 is large enough to accommodate the entire transport carrier 20. A cover 124 having a window 124W for exposing at least one electronic component 200 is disposed above the stage 111. A pressing member 107 for pressing the frame 21 when the frame 21 is placed on the stage 111 is disposed on the cover 124. The pressing member 107 is preferably a member that can come into point contact with the frame 21 (for example, a coil spring or a resin having elasticity). This makes it possible to correct the distortion of the frame 21 while suppressing the heat of the frame 21 and the cover 124 from affecting each other.

[0109] The stage 111 and the cover 124 are disposed in the vacuum chamber 103. The vacuum chamber 103 is generally cylindrical with an open top, and the top opening is closed by a dielectric member 108, which is a lid. Examples of materials constituting the vacuum chamber 103 include aluminum, stainless steel (SUS), and aluminum with anodized surface. Examples of materials constituting the dielectric member 108 include dielectric materials such as yttrium oxide (Y2O3), aluminum nitride (AlN), alumina (Al2O3), and quartz (SiO2). A first electrode 109 is disposed above the dielectric member 108 as an upper electrode. The first electrode 109 is electrically connected to a first high-frequency power supply 110A. The stage 111 is disposed on the bottom side in the vacuum chamber 103. The stage 111 and the first electrode 109 face each other.

[0110] A gas inlet 103a is connected to the vacuum chamber 103. A process gas source 112 and an ashing gas source 113, which are supply sources of a plasma generating gas (process gas), are connected to the gas inlet 103a by piping. The vacuum chamber 103 is also provided with an exhaust port 103b, to which a decompression mechanism 114 including a vacuum pump for exhausting gas in the vacuum chamber 103 and reducing the pressure is connected. With the process gas being supplied into the vacuum chamber 103, high frequency power is supplied from a first high frequency power supply 110A to a first electrode 109, whereby plasma is generated in the vacuum chamber 103.

[0111] The stage 111 includes a second electrode 120. Specifically, the stage 111 includes an electrode layer 115, a metal layer 116, a base 117 supporting the electrode layer 115 and the metal layer 116, and an outer periphery 118 surrounding the electrode layer 115, the metal layer 116, and the base 117, each of which is substantially circular. An electrode for electrostatic chuck (hereinafter, referred to as an ESC electrode 119) and a second electrode 120 electrically connected to the second high frequency power supply 110B are disposed inside the electrode layer 115. The outer periphery 118 is made of a metal having electrical conductivity and etching resistance, and protects the electrode layer 115, the metal layer 116, and the base 117 from plasma. An annular outer periphery ring 129 is disposed on the upper surface of the outer periphery 118. The outer periphery ring 129 serves to protect the upper surface of the outer periphery 118 from plasma. The electrode layer 115 and the outer ring 129 are made of, for example, the dielectric materials described above.

[0112] A DC power supply 126 is electrically connected to the ESC electrodes 119. The electrostatic adsorption mechanism is composed of the ESC electrodes 119 and the DC power supply 126. The holding sheet 22 is pressed against and fixed to the stage 111 by the electrostatic adsorption mechanism. Hereinafter, a case where an electrostatic adsorption mechanism is provided as a fixing mechanism for fixing the holding sheet 22 to the stage 111 will be described as an example, but is not limited to this. The holding sheet 22 may be fixed to the stage 111 by a clamp (not shown).

[0113] Metal layer 116 is made of, for example, aluminum with an alumite coating formed on the surface. Coolant flow path 127 is formed in metal layer 116. Coolant flow path 127 cools stage 111. By cooling stage 111, holding sheet 22 mounted on stage 111 is cooled, and cover 124, a part of which is in contact with stage 111, is also cooled. This prevents electronic component 200 and holding sheet 22 from being damaged by heating during plasma processing. Coolant in coolant flow path 127 is circulated by coolant circulator 125.

[0114] A plurality of supports 122 penetrating the stage 111 are disposed near the outer periphery of the stage 111. The supports 122 support the frame 21 of the transport carrier 20. The supports 122 are driven to move up and down by a first lifting mechanism 123A. When the transport carrier 20 is transported into the vacuum chamber 103, it is handed over to the supports 122 that have risen to a predetermined position. When the upper end surface of the supports 122 is lowered to the same level as the stage 111 or lower, the transport carrier 20 is placed at a predetermined position on the stage 111.

[0115] A plurality of lifting rods 121 are connected to the ends of the cover 124, enabling the cover 124 to be raised and lowered. The lifting rods 121 are driven to rise and lower by a second lifting mechanism 123B. The operation of lifting and lowering the cover 124 by the second lifting mechanism 123B can be performed independently of the first lifting mechanism 123A.

[0116] The control device 128 controls the operations of the elements constituting the plasma processing device 100, including the first high frequency power supply 110A, the second high frequency power supply 110B, the process gas source 112, the ashing gas source 113, the pressure reducing mechanism 114, the coolant circulating device 125, the first lifting mechanism 123A, the second lifting mechanism 123B, and the electrostatic adsorption mechanism. Fig. 16 is a block diagram of the plasma processing device used in this embodiment.

[0117] The plasma treatment of the electronic component 200 is performed in a state where the transport carrier 20 holding the electronic component 200 is carried into a vacuum chamber and the electronic component 200 is placed on the stage 111 . When the transport carrier 20 is loaded, the cover 124 is raised to a predetermined position in the vacuum chamber 103 by driving the lifting rod 121. A gate valve (not shown) opens and the transport carrier 20 is loaded. The multiple supports 122 wait in the raised state. When the transport carrier 20 reaches a predetermined position above the stage 111, the transport carrier 20 is handed over to the supports 122. The transport carrier 20 is handed over to the upper end surface of the support 122 so that the adhesive surface of the holding sheet 22 faces upward.

[0118] When the transport carrier 20 is transferred to the support 122, the vacuum chamber 103 is placed in a sealed state. Next, the support 122 starts to descend. The upper end surface of the support 122 descends to the same level as the stage 111 or lower, so that the transport carrier 20 is placed on the stage 111. Next, the lift rod 121 is driven. The lift rod 121 lowers the cover 124 to a predetermined position. At this time, the distance between the cover 124 and the stage 111 is adjusted so that the pressing member 107 arranged on the cover 124 can make point contact with the frame 21. As a result, the frame 21 is pressed by the pressing member 107, and the frame 21 is covered by the cover 124, and the substrate 10 is exposed from the window 124W.

[0119] Cover 124 is, for example, donut-shaped with a substantially circular outer contour, and has a constant width and a thin thickness. The diameter of window 124W is smaller than the inner diameter of frame 21, and the outer diameter is larger than the outer diameter of frame 21. Therefore, when transport carrier 20 is mounted at a predetermined position on stage 111 and cover 124 is lowered, cover 124 can cover frame 21. At least one electronic component 200 is exposed from window 124W.

[0120] The cover 124 is made of, for example, a dielectric material such as ceramics (e.g., alumina, aluminum nitride, etc.) or quartz, or a metal such as aluminum or aluminum whose surface has been anodized. The pressing member 107 can be made of a resin material in addition to the above-mentioned dielectric materials and metals.

[0121] After the transport carrier 20 is handed over to the support portion 122, a voltage is applied from the DC power supply 126 to the ESC electrodes 119. As a result, the holding sheet 22 is electrostatically attracted to the stage 111 at the same time as the holding sheet 22 comes into contact with the stage 111. Note that the application of the voltage to the ESC electrodes 119 may be started after the holding sheet 22 is placed on (in contact with) the stage 111.

[0122] When the plasma processing is completed, the gas in the vacuum chamber 103 is exhausted, and the gate valve is opened. The transport carrier 20 holding the plurality of electronic components 200 is carried out from the plasma processing apparatus 100 by the transport mechanism that enters through the gate valve. When the transport carrier 20 is carried out, the gate valve is quickly closed. The process of carrying out the transport carrier 20 may be performed in a reverse procedure to the procedure of mounting the transport carrier 20 on the stage 111 as described above. That is, after the cover 124 is raised to a predetermined position, the applied voltage to the ESC electrodes 119 is made zero, the adsorption of the transport carrier 20 to the stage 111 is released, and the support portion 122 is raised. After the support portion 122 is raised to a predetermined position, the transport carrier 20 is carried out.

[0123] Second Embodiment A second embodiment of the present invention will be described. In this embodiment, the sidewall of an electronic component is cleaned by utilizing the difference in susceptibility to plasma treatment between the main surface and the sidewall of the electronic component. This makes it possible to remove deposits attached to the sidewall while leaving the protective film (mask) covering the main surface of the electronic component.

[0124] In the sidewall cleaning step according to the present embodiment, the electronic component is exposed to a fourth plasma containing carbon dioxide gas. The reason why the fourth plasma can remove the deposits on the sidewall while leaving the protective film covering the main surface of the electronic component is considered to be as follows.

[0125] Carbon oxide gas contained in the process gas dissociates into oxygen atoms and carbon atoms in the plasma processing device. Therefore, the plasma generated in the plasma processing device contains carbon ions and radicals. When carbon ions and radicals collide with electronic components, carbon (C) derived from these carbon ions and radicals is deposited on the surface. In particular, carbon is likely to deposit on the main surface of the electronic component, i.e., on the protective film.

[0126] Furthermore, the plasma generated in the plasma processing device also contains oxygen ions and radicals. When the oxygen ions and radicals collide with the electronic components, the carbon on the sidewalls of the electronic components and the deposits are oxidized, decomposed, and removed. On the other hand, on the main surfaces of the electronic components, mainly the deposited carbon is etched.

[0127] The effect that the fourth plasma can remove the deposits on the sidewall while leaving the protective film covering the main surface of the electronic component is shown using specific data. FIG. 17 is a graph showing the relationship between the etching rate of the polymer in the vertical and horizontal directions and the pressure in the processing chamber (vacuum chamber). FIG. 18 is a graph showing the relationship between the ratio of the etching rate in the vertical direction to the horizontal direction of the polymer (vertical etching rate / horizontal etching rate, hereinafter referred to as the aspect ratio) and the pressure in the vacuum chamber. For comparison, FIG. 17 and FIG. 18 also show data in the case where oxygen (O2) gas is used as the process gas. The polymer etching rate in the vertical direction means the rate at which the polymer deposited on the main surface of the electronic component is etched. The polymer etching rate in the horizontal direction means the rate at which the polymer deposited on the sidewall of the electronic component is etched.

[0128] A silicon substrate with a polymer (fluorocarbon) deposited on it was used as the sample. The conditions for generating the polymer were as follows: C4F8 was supplied to the vacuum chamber at 600sccm, the pressure in the vacuum chamber was set to 10Pa, the high-frequency power applied to the electrode (first electrode) placed opposite the stage on which the sample was placed was set to 4800W, the high-frequency power applied to the electrode (second electrode) built into the stage was set to 0W, the stage temperature was set to -10℃, and the processing time was set to 2 minutes.

[0129] The polymer etching conditions were as follows: CO2 was supplied to the vacuum chamber as a process gas at 200sccm, the pressure inside the vacuum chamber was adjusted to 30Pa or less, the high frequency power applied to the first electrode was 3000W, the high frequency power applied to the second electrode was 0W, the stage temperature was -10℃, and the processing time was 1 minute. Polymer etching using oxygen (O2) gas was also performed under the same conditions.

[0130] As shown in Figure 17, the vertical etching rate in polymer etching using CO2 is significantly smaller than that in the case of using O2. This is believed to be because, as mentioned above, carbon dissociated from CO2 during the etching process is deposited on the main surface of the electronic component. Carbon is deposited on the main surface simultaneously with etching, which reduces the apparent vertical etching rate. This allows the protective film covering the main surface of the electronic component to remain. On the other hand, since no carbon is deposited in polymer etching using O2, the protective film on the surface of the electronic component is etched.

[0131] Also, as shown in Figure 17, the vertical etch rate in polymer etching decreases with increasing chamber pressure in both cases of using CO2 and using O2. When using O2, the lateral etch rate also decreases with increasing chamber pressure. On the other hand, Figure 17 shows that when using CO2, the lateral etch rate is less affected by the chamber pressure.

[0132] As shown in FIG. 18, the aspect ratio decreases with increasing pressure in both the cases of CO2 and O2. Furthermore, when CO2 is used, the aspect ratio falls to 1 or less in the region where the pressure is about 7 Pa or more. In other words, when CO2 is used, etching proceeds more easily in the horizontal direction than in the vertical direction. Thus, the above-mentioned effects are obtained. When O2 is used, the aspect ratio exceeds 1 in the region where the pressure is up to 30 Pa.

[0133] That is, the sidewall cleaning process removes deposits from the surface of the sidewall while suppressing etching of the protective film itself on the first surface, thereby making it possible to clean the sidewall of the electronic component while suppressing damage to the first surface due to the sidewall cleaning process.

[0134] The cleaning method according to this embodiment is particularly suitable for cleaning the side walls of electronic components that have undergone the Bosch process. In the Bosch process, a first step of forming a recess corresponding to a division region on a substrate by plasma processing and a second step of depositing a second film on the inner wall of the recess by plasma processing are repeated alternately. Therefore, the side walls of the formed element chips are prone to adhesion of the deposited film and reaction products (adherents) between the deposited film and plasma. Furthermore, unevenness called scallops is formed on the side walls. Adherents attached to the scallops are difficult to remove. According to the cleaning method according to this embodiment, such adherents can be removed in a simple manner. This embodiment includes a method for manufacturing element chips that includes an etching step using the Bosch process.

[0135] The sidewall cleaning process will now be described in detail. The sidewall cleaning step is performed by exposing the electronic component to a fourth plasma, the fourth plasma being generated by a process gas including carbon oxide gas.

[0136] Adherents, including a film (deposited film) deposited by, for example, the Bosch process and reaction products between the deposited film and plasma, are attached to the sidewalls of electronic components. Such adherents are mainly composed of polymers (fluorocarbons) containing carbon and fluorine atoms, and also contain silicon and oxygen. The fluorine atoms contained in the polymers are easily mobile and may cause a decrease in the reliability of devices. The polymers are easily removed by oxygen ions and radicals.

[0137] The fourth plasma is generated by a process gas (fourth process gas) containing carbon oxide gas. The carbon oxide gas is easily dissociated into oxygen atoms and carbon atoms in the plasma processing apparatus. Therefore, oxygen ions and radicals are easily generated, and the polymer can be quickly removed. On the other hand, the dissociated carbon atoms are easily attached to the protective film.

[0138] Table 1 shows the results of measuring the impurity concentration (C, O, F, Si, metal elements) on the surface of the electronic component before and after the sidewall cleaning process. The electronic component is a silicon chip with a thickness of 200 μm, which has a polyimide layer on its surface and a metal electrode (Au electrode) placed in the opening of the polyimide layer. The concentration was measured on the metal electrode on the chip surface and on the sidewall of the chip by X-ray photoelectron spectroscopy. The cleaning conditions were as follows: CO2 was supplied to the vacuum chamber at 200 sccm as the process gas, the pressure in the vacuum chamber was 1 Pa, the high frequency power applied to the first electrode was 3000 W, the high frequency power applied to the second electrode was 0 W, and the processing time was 5 minutes.

[0139] For comparison, data for the case where oxygen (O2) gas was used as the process gas is also shown in Table 1. The cleaning conditions were the same as above, except that the process gas was changed from CO2 to O2. When cleaning was performed under the above conditions, the polyimide layer was etched by 0.9 μm when CO2 was used, and by 2.5 μm when O2 was used.

[0140] As shown in Table 1, when CO2 was used, the fluorine concentrations on the metal electrode surface and sidewalls were reduced to 1.4 atomic % and 1.5 atomic %, respectively. On the other hand, when O2 was used, the fluorine concentrations on the metal electrode surface and sidewalls were also reduced, but remained at 3.5 atomic % and 3.65 atomic %, respectively. In other words, when CO2 was used, etching of the polyimide layer on the main surface side of the electronic component was suppressed, while fluorine atoms were efficiently removed. When CO2 was used, the fluorine removal effect on the sidewalls of the electronic component was also high.

[0141] [Table 1]

[0142] Carbon oxide is a compound of carbon and oxygen, e.g., C x O y (x=1 to 5, y=1, 2). Specific examples include carbon monoxide (CO), carbon dioxide (CO2), carbon dioxide tricarbonate, carbon dioxide pentacarbonate, and carbonyl sulfide (COS). These may be used alone or in combination of two or more. The carbon oxide gas may be CO or CO2, which are easily available.

[0143] The fourth process gas may contain other gases such as Ar, H2, N2, He, etc. The proportion of carbon dioxide gas in the fourth process gas may be 10% by volume or more and less than 100% by volume, and may be 30% by volume or more and 98% by volume or less.

[0144] The conditions for generating the fourth plasma are appropriately set according to the amount of attached matter, etc. The conditions for generating the fourth plasma are, for example, as follows. CO2 is supplied to the vacuum chamber as a process gas at 50 sccm or more and 400 sccm or less. The pressure in the vacuum chamber is 0.6 Pa or more and 30 Pa or less, the high frequency power applied to the first electrode is 500 W or more and 5000 W or less, and the high frequency power applied to the second electrode is 0 W or more and 100 W or less. The stage temperature is -20°C or more and 40°C or less. The pressure in the vacuum chamber is preferably 5 Pa or more, and more preferably 7 Pa or more.

[0145] Under the above conditions, the effective etching rate of the protective film on the surface of the electronic component is about 50 nm / min to 200 nm / min, and the effective etching rate of the deposits on the side surface of the electronic component is about 100 nm / min to 130 nm / min. The processing time may be set in consideration of the thickness of the protective film and the thickness of the deposits. The processing time is, for example, 60 seconds to 300 seconds.

[0146] In the sidewall cleaning process, a plurality of electronic components may be processed simultaneously. This improves productivity. In this case, the distance W between the opposing sidewalls of any two electronic components and the height H of the sidewall of one of the electronic components may satisfy the relationship H≧5×W. Even in the case where there are high aspect ratio irregularities like this, according to this embodiment, it is possible to remove the deposits adhering to the sidewalls while maintaining the protective film covering the main surface of the electronic component. Furthermore, the relationship H≦50×W may be satisfied.

[0147] The height H of the side walls is not particularly limited. The height H of the side walls is, for example, 20 μm or more and 700 μm or less. The distance W between the side walls is also not particularly limited. The distance W between the side walls is, for example, 4 μm or more and 60 μm or less.

[0148] Distance W is the average value of the shortest distance between any two points on the ends of the first surfaces of opposing sidewalls of any two electronic components. If the entire surfaces of the sidewalls are not opposing, the shortest distance between the opposing parts of the sidewalls may be measured. Sidewall height H is the lower of the average values ​​of the heights of any two points on the two sidewalls (or parts thereof) used to calculate distance W. The sidewall height is the shortest distance between the first surface and the second surface that the sidewall connects.

[0149] Hereinafter, the present embodiment will be specifically described with reference to the drawings, taking as an example an electronic component having a semiconductor layer and a wiring layer, although the present embodiment is not limited thereto.

[0150] 19 is a cross-sectional view showing a schematic view of a main part of an electronic component subjected to a sidewall cleaning process. A plurality of electronic components 200 are supported on a holding sheet 22, which will be described later. The holding sheet 22 is used to improve handling properties and is not necessarily required.

[0151] The electronic component 200 includes a semiconductor layer 11 and a wiring layer 12 disposed on a first surface 200X side of the semiconductor layer 11. The first surface 200X is covered with a protective film 40. Scallops are formed on a sidewall 200Z of the electronic component 200. A deposit 60 is attached to the sidewall 200Z. Note that in the illustrated example, the scallops and the deposit are exaggerated.

[0152] 20 is a cross-sectional view showing a schematic view of a main part of an electronic component during a sidewall cleaning process. While no significant reduction in the thickness of protective film 40 is observed, part of deposit 60 has been removed from sidewall 200Z, resulting in a thinner layer of deposit 60.

[0153] 21 is a cross-sectional view showing a schematic view of the main part of the electronic component after the sidewall cleaning process. While the protective film 40 remains, the remaining part of the deposit 60 has been removed from the sidewall 200Z, exposing the sidewall 200Z.

[0154] Next, a cleaning method including the above-mentioned sidewall cleaning step will be described. A. How to clean electronic components The method for cleaning an electronic component according to this embodiment includes a preparation step of preparing an electronic component having a first surface covered with a protective film, a second surface opposite to the first surface, a sidewall between the first surface and the second surface, and a deposit attached to the sidewall, and the sidewall cleaning step of cleaning the sidewall of the electronic component. Fig. 22 is a flowchart showing the cleaning method according to this embodiment.

[0155] (i) Electronic component preparation process (S01) At least one electronic component is provided, the electronic component having a first surface covered with a protective film, a second surface opposite to the first surface, and a sidewall between the first surface and the second surface. The electronic component is, for example, a chip fabricated by plasma dicing a substrate by the Bosch process. The sidewall may have scallops, i.e., recesses and protrusions.

[0156] The electronic components may be, for example, the same as those in the first embodiment.

[0157] When multiple electronic components are processed simultaneously in the sidewall cleaning process, it is preferable that the multiple electronic components are attached to a holding sheet fixed to a frame from the viewpoint of handleability. A member including a frame and a holding sheet fixed to the frame is called a transport carrier.

[0158] (Transport carrier) The transport carrier may be, for example, the same as that in the first embodiment.

[0159] The above-mentioned electronic component preparation step may include a substrate preparation step of preparing a substrate having a first surface and a second surface opposite to the first surface, a protective film formation step of forming a protective film covering the first surface, an opening formation step of forming an opening in the protective film to expose the division regions on the first surface, a first step of forming a recess corresponding to the exposed division regions by plasma processing, and a second step of depositing a second film on the inner wall of the recess by plasma processing. These steps will be described later. As a result, a plurality of electronic components arranged at a predetermined interval are prepared.

[0160] Fig. 7A is a top view showing an electronic component prepared in an electronic component preparation step, and Fig. 7B is a cross-sectional view taken along line AA in Fig. 7A, in which attachments are omitted for the sake of convenience.

[0161] The transport carrier 20 includes a frame 21 and a holding sheet 22 fixed to the frame 21. The frame 21 may be provided with a notch 21a or a corner cut 21b for positioning. The holding sheet 22 includes an adhesive surface 22X and a non-adhesive surface 22Y, and the outer periphery of the adhesive surface 22X is attached to one surface of the frame 21. A second surface 200Y (see FIG. 19, etc.) of the electronic component 200 is attached to a portion of the adhesive surface 22X exposed from the opening of the frame 21.

[0162] The electronic components 200 are attached at intervals to the adhesive surface 22X of the holding sheet 22. Such electronic components 200 are obtained by plasma dicing a substrate using the Bosch process. The electronic component 200 includes a semiconductor layer 11 and a wiring layer 12 laminated on the first surface 200X side of the semiconductor layer 11. A protective film 40 is formed on the first surface 200X of the electronic component 200.

[0163] (ii) Sidewall cleaning process (S02) The sidewalls of the device chip are cleaned. The sidewall cleaning step is performed by exposing the electronic component to the fourth plasma generated by the process gas containing carbon oxide gas, as described above. The sidewall cleaning step can remove the deposits on the sidewall while leaving the protective film.

[0164] (iii) Protective film removal process (S03) After the final removal step, the protective coating may be removed.

[0165] For example, a third plasma generated by a third process gas containing oxygen gas (O2) is used to remove the protective film. The third process gas may contain a fluorine-containing gas together with O2. Examples of the fluorine-containing gas include the same compounds as those described above. The proportion of O2 in the third process gas may be 10% by volume or more and less than 100% by volume, or 30% by volume or more and 98% by volume or less.

[0166] The conditions for generating the third plasma may be the same as those in the first embodiment.

[0167] When the protective film is water-soluble, it may be removed by washing with water instead of the third plasma. When the protective film is an insulating film (such as a silicon nitride or silicon oxide film) and / or a resin layer (polyimide) disposed on the outermost surface of the electronic component, the protective film is used to protect the electronic component not only during manufacturing but also after distribution, so it is not necessary to remove the protective film.

[0168] B. Manufacturing method of element chip The manufacturing method of the element chip according to this embodiment includes a substrate preparation step of preparing a substrate having a first surface and a second surface opposite to the first surface, the substrate having a plurality of element regions and dividing regions that define the element regions, the substrate having a plurality of element regions and a dividing region that defines the element regions, the substrate having a plurality of element regions and a dividing region that defines the first surface, the ...

[0169] The sidewall cleaning step is performed by exposing the electronic component to a fourth plasma generated by a process gas containing carbon oxide gas. Fig. 23 is a flowchart showing a method for manufacturing a component chip according to this embodiment.

[0170] (1) Board preparation process (S11) First, a substrate to be processed is prepared.

[0171] (substrate) The substrate may be the same as that in the first embodiment.

[0172] The second surface of the substrate may be attached to a holding sheet fixed to a frame. This improves handling. By dicing the substrate attached to the holding sheet, a plurality of device chips arranged at intervals on the holding sheet are obtained. The shape, material, etc. of the frame and holding sheet are as described above.

[0173] (2) Protective film formation process (S12) A protective film is formed covering the first surface of the substrate. The protective film is provided to protect the element region of the substrate from plasma, etc. After the etching process, the protective film is removed. The material and thickness of the protective film are as described above.

[0174] The protective film may be formed, for example, by the same method as in the first embodiment.

[0175] (3) Opening formation process (S13) Openings are formed in the protective film to expose the dividing regions of the substrate.

[0176] The openings may be formed, for example, by the same method as in the first embodiment.

[0177] (4) Etching process (S14) The substrate is exposed to plasma to etch the parting regions exposed through the openings down to the second surface, thereby forming a plurality of device chips from the substrate, the plurality of device chips being obtained in a state held by a holding sheet.

[0178] The etching process may be carried out, for example, in the same manner as in the first embodiment.

[0179] (5) Sidewall cleaning process (S15) The side walls of the resulting electronic component are cleaned. The sidewall cleaning step is performed by the sidewall cleaning step (ii) in the above-mentioned method for cleaning electronic components. According to the sidewall cleaning step of this embodiment, it is possible to remove the deposits on the sidewall while maintaining the protective film.

[0180] The plasma processing apparatus used in the etching step and the sidewall cleaning step may be the same or different. When the same plasma processing apparatus is used, both steps may be performed successively.

[0181] (6) Protective film removal process (S16) The protective film removing step is carried out by the protective film removing step (iii) in the above-mentioned method for cleaning electronic components, whereby the protective film is removed.

[0182] The plasma processing apparatus used in the sidewall cleaning step and the protective film removing step may be the same or different. When the same plasma processing apparatus is used, both steps may be performed consecutively.

[0183] After the protective film removing step, the element chip is removed from the support sheet. The element chip is pushed up together with the holding sheet by a push-up pin from the non-adhesive surface side of the holding sheet, for example. As a result, at least a part of the element chip is lifted up from the holding sheet. Thereafter, the element chip is removed from the holding sheet by a pick-up device.

[0184] Hereinafter, the method for manufacturing the element chip will be specifically described with reference to the drawings, although the present embodiment is not limited thereto.

[0185] Fig. 9 is a top view showing a substrate prepared by the substrate preparation step according to the present embodiment. Fig. 10 is a cross-sectional view showing a part of the substrate. The substrate 10 has a first surface 10X and a second surface 10Y, and also has a plurality of element regions 101 and division regions 102 that define the element regions 101. The element region 101 has a semiconductor layer 11 and a wiring layer 12 laminated on the first surface 10X side of the semiconductor layer 11. The division region 102 has a semiconductor layer 11 and an insulating film 14. The second surface 10Y of the substrate 10 is attached to a holding sheet 22 provided on the transport carrier 20.

[0186] 11 is a cross-sectional view showing a schematic view of a part of the substrate after the protective film forming step according to the present embodiment. A protective film 40 is formed on a first surface 10X of the substrate 10.

[0187] 12 is a cross-sectional view showing a schematic view of a part of the substrate after the opening forming step according to the present embodiment. The protective film 40 and the insulating film 14 are removed from the dividing region 102, and the semiconductor layer 11 is exposed in the dividing region 102 through the opening.

[0188] 13 is a cross-sectional view showing a schematic diagram of an element chip produced by an etching process according to the present embodiment. A dividing region of a substrate is etched, and a plurality of element chips 200 are formed from the substrate. A scallop is formed on a side wall 200Z of the electronic component. A first surface 200X of the element chip 200 is covered with a protective film 40.

[0189] 14 is a cross-sectional view showing a schematic diagram of the component chip after the protective film removing step according to this embodiment, in which the protective film 40 covering the first surface 200X has been removed.

[0190] The plasma processing apparatus used in the etching step, the sidewall cleaning step, and the protective film removing step may be, for example, the same as that in embodiment 1. Fig. 15 is a cross-sectional view that shows a schematic structure of the plasma processing apparatus 100. Fig. 16 is a block diagram of the plasma processing apparatus used in this embodiment.

[0191] Although the present invention has been described with respect to the presently preferred embodiments, such disclosure should not be interpreted as limiting. Various variations and modifications will no doubt become apparent to those skilled in the art to which the present invention pertains upon reading the above disclosure. Accordingly, the appended claims should be interpreted to cover all variations and modifications without departing from the true spirit and scope of the present invention. [Industrial Applicability]

[0192] The cleaning method of the present invention is capable of cleaning side walls while reducing damage to electronic components, and is therefore particularly suitable for post-treatment of element chips manufactured by plasma dicing using the Bosch process. [Explanation of symbols]

[0193] 200: Electronic components (element chips) 200X: First Side 200Y: Second Side 200Z: Side wall 10: Substrate 10X: First Side 10Y: Second Side 11: Semiconductor layer 12: Wiring layer 14: Insulating film 20: Transport carrier 21: Frame 21a:Notch 21b: Corner cut 22: Retaining sheet 22X: Adhesive surface 22Y: Non-adhesive surface 40:Protective film 50: First membrane 60: Adhesion 100: Plasma processing device 103: Vacuum chamber 103a: Gas inlet 103b: Exhaust port 108: Dielectric member 109: First electrode 110A: First high frequency power source 110B: second high frequency power source 111: Stage 112: Process gas source 113: Ashing gas source 114: Pressure reduction mechanism 115: Electrode layer 116: Metal layer 117: Foundation 118: Outer periphery 119:ESC electrode 120: second electrode 121: Lifting rod 122: Support part 123A, 123B: Lifting mechanism 124: Cover 124W: Window 125: Refrigerant circulation device 126:DC power supply 127: Coolant flow path 128: Control device 129: Outer ring

Claims

1. a preparation step of preparing an electronic component including a first surface covered with a protective film, a second surface opposite to the first surface, a sidewall between the first surface and the second surface, and an attachment attached to the sidewall; a sidewall cleaning step of cleaning the sidewall of the electronic component, The method for cleaning an electronic component, wherein the sidewall cleaning step is performed by exposing the electronic component to a fourth plasma generated by a process gas including a carbon oxide gas.

2. In the sidewall cleaning step, a plurality of the electronic components are processed, The distance W between the opposing side walls of any two of the electronic components and the height H of the side wall of any one of the electronic components are expressed as follows: The method for cleaning electronic parts according to claim 1 , wherein the relationship H≧5×W is satisfied.

3. The step of preparing the electronic component includes: a substrate preparation step of preparing a substrate including a plurality of element regions and division regions defining the element regions, the substrate having the first surface and the second surface; a protective film forming step of forming the protective film on the first surface; an opening forming step of forming an opening in the protective film to expose the dividing region on the first surface; 3. The method for cleaning electronic components according to claim 1, further comprising: an etching process for repeating a cycle including a first step of forming a recess corresponding to the exposed dividing region by plasma treatment, and a second step of depositing a second film on an inner wall of the recess by plasma treatment.

4. 4. The method for cleaning an electronic component according to claim 1, further comprising, after the sidewall cleaning step, a protective film removing step of removing the protective film.

5. a substrate preparation step of preparing a substrate including a plurality of element regions and division regions that define the element regions, the substrate having a first surface and a second surface opposite to the first surface; a protective film forming step of forming a protective film on the first surface; an opening forming step of forming an opening in the protective film to expose the dividing region on the first surface; an etching process for obtaining an electronic component including the first surface, the second surface, a side wall between the first surface and the second surface, and a deposit attached to the side wall, the first surface being covered with the protective film, by repeating a cycle including a first step of forming a recess corresponding to the exposed dividing region by a plasma treatment, and a second step of depositing a second film on an inner wall of the recess by a plasma treatment; a sidewall cleaning step of cleaning the sidewall of the electronic component, The method for manufacturing an element chip, wherein the sidewall cleaning step is performed by exposing the electronic component to a fourth plasma generated by a process gas containing carbon oxide gas.

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