Substrate dividing tool

Abstract

To provide a substrate dividing tool that is easy to carry and can suppress pressure and distortion of the wiring area of the substrate.SOLUTION: A substrate dividing tool comprises: a crushing section having a projection that crushes the division of a substrate with a slit and a divided section along the slit; a holding section having a holding surface facing the tip of the projection of the crushing section and holding the substrate by the holding surface; a drive section that drives at least one of the crushing section and the holding section in the direction that the crushing section crushes the divided section by the crushing section and the holding section holding the divided section between the crushing section and the holding section; a support shaft that supports the crushing section and the holding section in a relatively movable manner; and a pair of graspers that extend from the support shaft to operate the drive section.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a circuit board dividing tool, and more particularly to a circuit board dividing tool for dividing a composite circuit board (hereinafter referred to as a circuit board) consisting of a product circuit board (hereinafter referred to as a circuit board main body) and a dummy circuit board, also known as a discarded circuit board. [Background technology]

[0002] Generally, there are two types of printed circuit boards: a printed wiring board (PWB) without electronic components attached, and a printed circuit board (PCB) with electronic components mounted thereon to function as an electronic circuit. In the manufacturing process, the product board (board body) is obtained by dividing a dummy board from a composite board. The board body and the dummy board of the composite board are connected at a division section, and the parts other than the division section are separated by division slits. In addition, a V-groove with a V-shaped cross section is engraved in the division section as the part (cut section) that is cut when dividing the composite board into individual board bodies. A composite board with such a shape is formed by using a single flat board as the board base material and carrying out processes of cutting slits and carving V-grooves into it. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2012-222218 A Summary of the Invention [Problem to be solved by the invention]

[0004] In a composite board, multiple circuit boards or dummy boards are connected together at dividing sections such as V-grooves or perforations, and after mounting components, the dividing sections can be separated into individual product boards using a dividing device (router or cutter) or board dividing tool (paperweight-shaped metal fittings or T-shaped metal fittings), etc. However, this process can cause distortion near the dividing sections of the product board, and if this distortion is applied to the small chip components around the dividing sections, the components can be damaged.

[0005] Generally, when a dividing device is used, distortion during substrate division tends to be small; however, the introduction cost is high and it is difficult to transport, which is a disadvantage as it is difficult to use in large-scale mass production processes.

[0006] On the other hand, board dividing tools have low introduction costs and are easy to carry, but because they work by bending and breaking the product board or a dummy part, the distortion near the divided part is greater than with a dividing device, and there is a disadvantage that the holding part of the board and the fixing part of the board dividing tool differ depending on the worker, resulting in large variation in distortion.

[0007] Patent Document 1 describes a method for preventing damage to components by providing a through-hole between the separation part and the components in a composite substrate that can suppress damage to electronic components on a circuit board when separating the circuit board from the composite substrate, and allowing distortion to be absorbed by the through-hole.

[0008] However, in order to absorb the distortion, it is necessary to make through holes in the product board, but since small holes may not be able to absorb the stress on the parts, it is necessary to make holes equal to or larger than the chip part size, which means that wiring cannot be done around the through holes, which raises concerns about the adverse effect on density. In addition, the introduction cost is high for methods that assume the use of a dividing device with a rotary blade.

[0009] As described above, the board dividing device reduces distortion during division, but the introduction cost of the device is high and it is difficult to carry. On the other hand, the introduction cost of the board dividing tool is low and it is easy to carry, but it is difficult to suppress distortion. When new holes are made on the board side as in Patent Document 1, it puts pressure on the wiring area and has a negative effect on high-density wiring.

[0010] The present invention has been made in consideration of the above points, and aims to provide a board dividing tool that is inexpensive and easy to carry, and that suppresses distortion without compressing the wiring area of ​​the board. [Means for solving the problem]

[0011] The substrate splitting tool according to the present invention is characterized in having a crushing section having protrusions for crushing a split section of a substrate having a slit and a split section along the slit, a holding section having a holding surface facing the tip of the protrusion of the crushing section and holding the substrate with the holding surface, a drive section for driving at least one of the crushing section and the holding section in a direction in which the crushing section crushes the split section by clamping the crushing section and the holding section, a support shaft section for supporting the crushing section and the holding section so that they can move relative to each other, and a pair of handle sections extending from the support shaft section for operating the drive section. Effect of the Invention

[0012] According to the present invention, it is possible to provide a circuit board dividing tool that is inexpensive and easy to carry, and that has the effect of reducing stress on components mounted near the divided portion when dividing a circuit board. [Brief description of the drawings]

[0013] [Figure 1] 1 is a schematic perspective view showing the appearance of a substrate dividing tool according to a first embodiment of the present invention; [Diagram 2] 1 is an enlarged partial plan view showing an example of a composite substrate to be divided by a substrate dividing tool of a first embodiment; [Diagram 3]4 is an enlarged partial plan view showing the relationship between the pressing portion and the division support portion of the substrate dividing tool of the first embodiment, showing the holding surface of the pressing portion viewed from below. FIG. [Figure 4] 1 is an enlarged partial plan view showing the holding surface of the pressing part viewed from below, illustrating the relationship between the pressing part and the dividing support part of the substrate dividing tool of the first embodiment and a dividing part of the composite substrate positioned between them. FIG. [Diagram 5] 1 is an enlarged partial perspective view showing the relationship between the pressing portion and the dividing support portion of the substrate dividing tool of the first embodiment, showing the pressing portion and the composite substrate in contact therewith from diagonally above and in front of the main portion. FIG. [Figure 6] 1 is a schematic perspective view showing the appearance of a substrate dividing tool according to a first embodiment. FIG. [Figure 7] 1 is a schematic perspective view showing the appearance of a substrate dividing tool according to a first embodiment. FIG. [Figure 8] 1 is a schematic perspective view showing the appearance of a substrate dividing tool according to a first embodiment. FIG. [Figure 9] 1 is a schematic perspective view showing the appearance of a substrate dividing tool according to a first embodiment. FIG. [Figure 10] 1 is a schematic perspective view showing the appearance of a substrate dividing tool according to a first embodiment. FIG. [Figure 11] FIG. 11 is a schematic perspective view showing the appearance of a substrate dividing tool according to a second embodiment of the present invention. [Figure 12] 11 is an enlarged partial plan view showing an example of a composite substrate to be divided by a substrate dividing tool according to a second embodiment; FIG. [Figure 13] 13 is an enlarged partial plan view showing the holding surface of the pressing portion viewed from below, illustrating the relationship between the pressing portion and the division support portion of the substrate dividing tool of the second embodiment. FIG. [Figure 14] 13 is an enlarged partial plan view showing the holding surface of the pressing part viewed from below, illustrating the relationship between the pressing part and the dividing support part of the substrate dividing tool of the second embodiment and a dividing part of the composite substrate positioned between them. FIG. [Figure 15] FIG. 11 is a schematic perspective view showing the appearance of a substrate dividing tool according to a third embodiment of the present invention. [Figure 16] FIG. 13 is a schematic perspective view showing the appearance of a substrate dividing tool according to a modified example of the third embodiment. [Figure 17] 13 is an enlarged partial plan view showing the holding surface of the pressing portion viewed from below, illustrating the relationship between the pressing portion and the division support portion of a substrate dividing tool according to a fourth embodiment of the present invention. FIG. [Figure 18] 13 is an enlarged partial plan view showing the holding surface of the pressing part viewed from below, illustrating the relationship between the pressing part and the dividing support part of the substrate dividing tool of the fourth embodiment and a dividing part of the composite substrate positioned between them. FIG. [Figure 19] FIG. 13 is a schematic perspective view showing the appearance of a substrate dividing tool according to a fifth embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, a substrate dividing tool according to an embodiment of the present invention will be described in detail with reference to the drawings. In the embodiments, components having substantially the same functions and configurations are designated by the same reference numerals and will not be described repeatedly.

[0015] (First embodiment) 1 is a schematic perspective view showing the substrate dividing tool of this embodiment. For convenience of explanation, the directions of the orthogonal XYZ coordinate axes as shown in the figure are defined as the XYZ directions, the direction from the substrate loading / unloading side toward the tip of the substrate dividing tool is defined as the Z direction (i.e., front and tip), and the left and right (X direction) and the up and down (Y direction) are defined as seen from the user when the user holds the substrate dividing tool.

[0016] The substrate dividing tool has, for example, a metal dividing support part CSH (crushing part), a pressing part PMT, a driving part DRP, and a pair of grip parts HD.

[0017] The substrate dividing tool is inserted between the dividing support part CSH and the clamping part PMT from the dummy substrate 14 of the composite substrate 11 to be divided, and the substrate main body 13 and the vicinity of the dummy substrate 14 are positioned between the dividing support part CSH and the clamping part PMT with the dividing part 12 at the center.

[0018] Fig. 2 is an enlarged partial plan view showing an example of a composite substrate 11 to be divided by a substrate dividing tool. Composite substrate 11 is made up of substrate main body 13 and dummy substrate 14 connected via dividing portion 12. Although only one dividing portion 12 is shown in Figs. 1 and 2, a plurality of dividing portions 12 are provided in composite substrate 11, and slits RH as long through holes are provided in composite substrate 11 between adjacent dividing portions 12. A plurality of mounted components are mounted on substrate main body 13, but are not shown.

[0019] The dividing portion 12 is a linear portion that is weaker than the surrounding area and has a V-groove or perforations (short slits) for dividing the dummy substrate 14 from the substrate main body 13. The dividing portion 12 shown in Fig. 2 is configured by drilling eight holes aligned in a row between adjacent slits RH.

[0020] The slits RH are also used for aligning the corresponding positions of the pressing parts PMT in order to position and fix the composite substrate 11. By using the slits RH to insert a pin or the like, positioning and holding can be performed quickly.

[0021] The upper pressing part PMT shown in FIG. 1 has a holding surface 6a facing the tip of the protrusion of the division supporting part CSH, and holds the division part 12 of the composite substrate 11 by means of the holding surface 6a.

[0022] The division support part CSH shown in FIG. 1 has a protrusion facing the holding surface 6a of the pressing part PMT in order to crush the division parts 12 of the composite substrate 11.

[0023] FIG. 3 is an enlarged partial plan view showing the relationship between the pressing member PMT and the divided support members CSH, in which a holding surface 6a of the pressing member PMT is viewed from below.

[0024] FIG. 4 is an enlarged partial plan view of holding surface 6a of pressing part PMT viewed from below, showing the relationship between pressing part PMT and divided supporting part CSH and a divided part 12 of composite substrate 11 located between them.

[0025] The pressing part PMT has a cylindrical holding part 5 and a movable part 6 that is slidably disposed in the hollow part of the holding part 5 and has a holding surface 6a on the lower side. The lower end surface of the holding part 5 also temporarily functions as a holding surface.

[0026] The movable part 6 has a pair of pins 8 that sandwich the divided part 12 when the composite substrate 11 is held by the holding surface 6a. The pair of pins 8 function as insertion parts into the slits RH that sandwich the divided part 12 of the composite substrate 11. In other words, the pressing part PMT has an insertion part formed on the holding surface 6a of the movable part 6 so as to be inserted into the slits RH when the composite substrate 11 is held by the holding surface 6a.

[0027] 3 and 4, the split support part CSH indicated by the two-dot chain line has a protrusion facing the holding surface 6a of the movable part 6 of the pressing part PMT. The protrusion of the split support part CSH has a cutting edge part BLD that protrudes between the pair of pins 8 along the extension direction of the split part 12. The annular portion of the holding surface 6a of the movable part 6 where the pair of pins 8 are located is flat, and the central portion of the annular portion may be flat or may have a shallow concave surface.

[0028] In the crushing process by the cutting blade BLD, the division part 12 sandwiched between the holding surface 6a and the cutting blade BLD is subjected to a large compressive force, so that compressive stress is generated inside the division part 12, and the compressive stress is transmitted toward the inside of the board body 13. Therefore, if a shallow concave surface is provided in the center part of the annular part of the holding surface 6a as in this embodiment, it functions as a relief part for local contraction and expansion of the division part 12, and the flat annular part absorbs the compressive stress. Therefore, the compressive stress transmitted from the division part 12 to the board body 13 around the holding surface 6a can be alleviated, and the impact on the mounted components (not shown) during division can be suppressed. Therefore, it is preferable to make the center part of the annular part of the holding surface 6a a shallow concave surface.

[0029] FIG. 5 is an enlarged partial perspective view showing the relationship between the pressing part PMT and the composite substrate 11, in which the pressing part PMT and the composite substrate 11 in contact therewith are viewed from diagonally above in front of the main part.

[0030] The pressing part PMT has a corresponding marking MK2 formed on the side of the holding part 5 so as to face the marking MK formed on the composite substrate 11 when the composite substrate 11 is pressed by the holding surface 6a.

[0031] Now, the drive part DRP and the grip part HD will be described with reference to Fig. 1. By operating the grip part HD and the drive part DRP, the movable part 6 in the pressing part PMT can be moved up and down relative to the holding part 5 so as to protrude relative to the divided support part CSH.

[0032] The drive part DRP includes a frame FL, which cooperates with the grip part GRP and lever part LVP of the grip part HD, a holding part 5 (split support part CSH), a support part PV, a second support part PV2, and a movable post MVP. A compression spring CSG is provided between the grip part GRP, which is held by the operator, and the lever part LVP.

[0033] The gripping portion GRP and lever portion LVP of the pair of handle portions HD extend from the support shaft PV, which supports the split support portion CSH and the holding portion PMT so that they can move relatively, to operate the driving portion DRP. The gripping portion GRP and lever portion LVP drive one relative to the other, so that the driving portion DRP drives at least one of the split support portion CSH and the holding portion PMT in a direction in which the split support portion CSH and the holding portion PMT clamp the split portion 12 and the split support portion CSH crushes the split portion 12.

[0034] One side of the handle portion HD includes a frame FL, a holding portion 5, and a grip portion GRP that are integrated together.

[0035] The frame FL extends from the support shaft portion PV along one side surface S1 of the holding portion 5 to support the one side surface S1 and also supports the divided support portion CSH via the holding portion 5.

[0036] The gripping portion GRP extends in an opposing direction from an opposing side surface S2 of the holding portion 5 that faces the one side surface S1 of the holding portion 5 on the opposite side of the frame FL.

[0037] The other side of the handle portion HD has a lever portion LVP. The lever portion LVP is arranged parallel to and facing the grip portion GRP from the support shaft portion PV. The lever portion LVP has a second support shaft portion PV2 and a movable post MVP whose upper end is rotatably supported by the support shaft portion PV2. The movable post MVP is connected to the upper end of the movable portion 6 at the other lower end, and supports the movable portion 6 so that it can move (slide) relative to the holding portion 5. The lever portion LVP has a second support shaft portion PV2 at a position of a first distance D1 away from the support shaft portion PV, and extends beyond the second support shaft portion PV2 to a position of a second distance D2 longer than the first distance D1. The grip portion GRP also extends from the frame FL to the same extent as the lever portion LVP.

[0038] The drive unit DRP is configured to transition from a state in which the split portion 12 is clamped between the holding surface 6a of the holding portion 5 and the split support portion CSH (when gripped until a sense of resistance to contact is felt in the hand) to a state in which the movable portion 6 protrudes further from the holding portion 5 (when gripped until a sense of resistance to crushing is felt in the hand) by manually operating the grip portion GRP and lever portion LVP of the handle portion HD.

[0039] In this embodiment, the composite substrate 11 is divided while pressing the periphery of the division portion 12 (V groove, perforation, etc.) with the holding surface 6a of the movable portion 6 of the pressing unit PMT. By pressing the periphery of the division portion 12, it is possible to prevent distortion that occurs when the division portion 12 is pressed and broken to be divided from spreading to the surrounding parts.

[0040] (Explanation of operation) The operation of separating dummy substrate 14 from composite substrate 11 using a substrate dividing tool will be described in order, beginning with FIG.

[0041] 6 and 7, at the start of the crushing operation in the separation process, the movable part 6 of the holding part PMT in the substrate dividing tool is set back into the hollow part of the holding part 5 to protect the pins 8 on the holding surface 6a. Since the pins 8 of the movable part 6 are not protruding, the composite substrate 11 can be inserted between the holding part PMT and the dividing support part CSH from the dummy substrate 14 side without damaging the pins 8 and the composite substrate 11.

[0042] Next, as shown in Fig. 8, after insertion, the position is aligned using the alignment markings MK, MK2 (see Fig. 5) provided on the substrate main body 13 and the holding part 5, the movable part 6 is lowered so that the holding part 5 and the movable part 6 are flush, the composite substrate 11 is raised from below the alignment pins 8 protruding from the movable part 6, and a pair of pins 8 is inserted into the slits RH on either side of the division part 12. Here, the composite substrate 11 is positioned and held so that the division support parts CSH abut the center of the perforation of the division part 12 to be divided (see Fig. 4).

[0043] Next, as shown in Figure 9, when the gripping part GRP of the substrate dividing tool is grasped and force is applied, the movable part 6 of the substrate dividing tool moves and moves downward, and the composite substrate 11 (divided part 12) is sandwiched and held between the dividing support part CSH and the movable part 6 (holding surface 6a).

[0044] Next, as shown in FIG. 10, when further force is applied to the gripping portion GRP, the movable portion 6 protrudes further from the holding portion 5 and, together with the dividing support portion CSH (cutting blade portion BLD), pushes through the perforation portion (dividing portion 12), dividing the composite substrate 11.

[0045] When there are a plurality of division sections 12, the above operation is repeated until all division sections 12 are crushed, and then the substrate body 13 is separated from the dummy substrate 14 separated at the division sections 12, completing the division process.

[0046] (Explanation of effect) As described above, according to this embodiment, the board dividing tool is easy to carry, and further, by using two gripping actions (see Figs. 9 and 10), the movable part 6 presses the periphery of the dividing part 12 of the composite board 11 while pushing through the dividing part 12, thereby suppressing the spread of distortion during board division to the surroundings. Therefore, the composite board 11 after mounting electronic components can be divided while suppressing distortion without compressing the wiring area of ​​the board body 13. Furthermore, if the composite board 11 has multiple dividing points into the dividing parts 12, the above two actions must be performed for each dividing part 12, but the same is true for conventional dividing jigs, so that the effect is obtained that the number of steps required for division does not increase compared to the conventional case.

[0047] (Second Example) Fig. 11 is a schematic perspective view showing the substrate dividing tool of this embodiment. This embodiment is the same as the first embodiment, except that a dividing support part CSH2 having two pyramidal projections CON, each having a tapered shape, is adopted instead of the dividing support part CSH having one cutting blade part BLD of the first embodiment. The dividing support part CSH2 having two pyramidal projections CON in this embodiment protrudes corresponding to two of the perforation holes of a composite substrate 11 having a dividing part 12a having perforation holes only in a substrate main body 13 shown in Fig. 12.

[0048] Fig. 12 is an enlarged partial plan view showing a composite substrate 11 to be divided by the substrate dividing tool of this embodiment. This composite substrate 11 has a dividing section 12a in which five perforation holes are provided only on the substrate main body 13 side based on the slit RH as shown in Fig. 12. Two pyramidal projections CON of a dividing support section CSH of the substrate dividing tool protrude in correspondence with two of the five perforation holes 12b, 12c (see Figs. 13 and 14).

[0049] Fig. 13 is an enlarged partial plan view of the holding surface 6a of the holding part PMT viewed from below, showing the relationship between the holding part PMT and the divided support part CSH2. Fig. 14 is an enlarged partial plan view of the holding surface 6a of the holding part PMT viewed from below, showing the relationship between the holding part PMT and the divided support part CSH2 and the divided part 12a of the composite substrate 11 located between them.

[0050] In the first embodiment, perforations (see FIG. 2) are provided on both sides of the substrate body 13 and the dummy substrate 14 as the dividing portion 12 of the composite substrate 11 to be divided, and the portion between them is pressed and broken by the dividing support portion CSH (cutting blade portion BLD), thereby dividing the composite substrate 11. On the other hand, in the second embodiment, when perforations are provided only in the substrate body 13 (or the dummy substrate 14) as the dividing portion 12a as shown in FIG. 12, the dividing support portion CSH2 has a structure in which two tapered cone-shaped protrusions CON are inserted into two corresponding perforation holes 12b, 12c as shown in FIG. 13 and FIG. 14.

[0051] (Explanation of operation) In the second embodiment, the operation procedure is similar to that of the first embodiment (see Figs. 6 to 10), but the split support part CSH does not push and break, but inserts the pyramidal projection parts CON of the split support part CSH2 into the predetermined perforation holes, thereby crushing the spaces between the perforation holes and splitting the composite substrate 11. However, the maximum diameter of each pyramidal projection part CON is larger than the diameter of each predetermined perforation hole.

[0052] (Explanation of effect) In the second embodiment, as in the first embodiment, the distortion caused when the substrate is divided is prevented from spreading to the surroundings.

[0053] (Third Example) 15 is a schematic perspective view showing the substrate dividing tool of this embodiment. This embodiment is the same as the first embodiment, except that instead of the frame FL of the first embodiment, which extends from the support shaft part PV along one side surface S1 of the holding part 5 and supports the division support part CSH, a first frame FL1 on one side surface S1 of the holding part 5 which is integrated with the holding part 5 and a second frame FL2 on the opposing side surface S2 (the gripping part GRP side) of the holding part 5 are employed.

[0054] The first frame FL1 extends from the support shaft part PV along one side surface S1 of the holding part 5 and is fixed to the holding part 5, and the second frame FL2 has an upper side fixed to the holding part 5 and a lower side supporting the divided support part CSH.

[0055] According to this embodiment, the same effects as those of the first embodiment can be obtained, and since the gripping portion GRP of the substrate dividing tool during the dividing operation is not positioned above the composite substrate 11, unlike the first embodiment, even if there are tall components within the substrate body 13 of the composite substrate 11, the gripping portion GRP of the substrate dividing tool can be prevented from interfering with those components during dividing.

[0056] (Modification) 16 is a schematic perspective view showing a substrate dividing tool of this modified example. This modified example is the same as the third embodiment except that a third frame FL3 is used instead of the second frame FL2 on the gripper GRP side of the third embodiment.

[0057] The third frame FL3 has an upper side fixed to the holding part 5 and the gripping part GRP, a lower side supporting the divided support part CSH, and a middle part spanning the upper and lower sides extending along the gripping part GRP to define a space into which the composite substrate 11 can be inserted. Furthermore, the third frame FL3 also defines a space into which the operator can insert his / her hand between the upper holding part 5 and the gripping part GRP.

[0058] According to this modified example, the same effects as those of the third embodiment can be obtained, and even when the dividing portions 12 of the composite substrate 11 to be divided are located at various different positions on the composite substrate, it is possible to use a single modified substrate dividing tool.

[0059] (Fourth Example) Fig. 17 is an enlarged partial plan view of the holding surface 6a of the holding part PMT from below, showing the relationship between the holding part PMT and the division support part CSH in the substrate dividing tool of this embodiment. Fig. 18 is an enlarged partial plan view of the holding surface 6a of the holding part PMT from below, showing the relationship between the holding part PMT and the division support part CSH in the substrate dividing tool of this embodiment and the divided part 12 of the composite substrate 11 located between them. This embodiment is the same as the first embodiment, except that a plate-shaped pin 8a is used as the piercing part instead of the pin 8 that is the piercing part provided on the holding surface 6a of the movable part 6 of the holding part PMT of the first embodiment.

[0060] As shown in FIG. 18, when the composite substrate 11 is pressed by the holding surface 6a, the plate-like pin 8a extends along the slit RH adjacent to the division portion 12 and fits into the slit RH.

[0061] According to this embodiment, the same effects as those of the first embodiment can be obtained, and since the cross section of the plate-like pin 8a is rectangular, it is possible to suppress rotation around the normal to the composite substrate 11 when the plate-like pin 8a is fitted into the slit RH adjacent to the dividing portion 12. Therefore, even if only one of the plate-like pins 8a is provided on the holding surface 6a of the movable portion 6, instead of a pair of plate-like pins 8a as shown in FIG. 18, it is possible to achieve positioning of the composite substrate 11 and substrate holding.

[0062] (Fifth Example) 19 is a schematic perspective view showing the substrate dividing tool of this embodiment. This embodiment is the same as the first embodiment, except that, instead of the configuration in which the drive unit DRP and the pair of grip units HD are arranged on the composite substrate 11 side with the division support unit CSH and the holding unit PMT at the center, the drive unit DRP and the pair of grip units HD are arranged on the side where the composite substrate 11 is not present with the division support unit CSH and the holding unit PMT at the center in the first embodiment.

[0063] In the substrate splitting tool of this embodiment, one of the handle portions HD has a frame FL extending from the support shaft portion PV along one side surface S1 of the holding portion 5 to support the one side surface S1 and to support the split support portion CSH via the holding portion 5, and a gripping portion GRP extending from the support shaft portion PV in a direction away from the holding portion 5 and intersecting the frame FL on the one side surface S1 side of the holding portion 5.

[0064] In the substrate dividing tool of this embodiment, the other side of the handle portion HD has a second support shaft portion PV2 which is arranged opposite and parallel to the gripping portion GRP and which rotatably supports a movable post MVP which movably supports the movable portion 6 relative to the holding portion 5 at a position a first distance D1 away from the support shaft portion PV across the frame FL, and has a lever portion LVP on the opposite side of the second support shaft portion PV2 which extends beyond the support shaft portion PV to a position a second distance D2 longer than the first distance D1.

[0065] According to this embodiment, the same effects as those of the first embodiment can be obtained, and since the gripping portion GRP of the substrate dividing tool during the dividing operation is not positioned above the composite substrate 11, unlike the first embodiment, even if there are tall components within the substrate body 13 of the composite substrate 11, the gripping portion GRP of the substrate dividing tool can be prevented from interfering with those components during dividing.

[0066] In the above embodiment, the case where a composite board (printed circuit board (PCB)) on which electronic components are mounted is divided has been described, but the composite board may be a printed wiring board (PWB) on which no electronic components are mounted, and the present invention is also applicable to any plate-shaped object other than a composite board.

[0067] Furthermore, the present invention includes any combination of the above-described embodiments and modifications. [Explanation of symbols]

[0068] 5 Holding part 6 Moving parts 6a Holding surface 8 Alignment pin 11 Composite board 12 Division 13 Board body 14 Dummy board LVP Lever FL Frame PMT holding part PV spindle PV2 Second support shaft BLD cutting edge RH Dividing Slit CSH Separate support section (crushing section) CON Cone-like projection HD handle part GRP gripping part DRP Drive Unit MK Marking MVP Movable Post 8a Plate-shaped pin

Claims

1. A crushing unit having a protrusion for crushing a divided portion of a substrate having a slit and a divided portion along the slit; a pressing part having a holding surface facing the tip of the protrusion of the crushing part and pressing the substrate with the holding surface; a drive unit that drives at least one of the crushing unit and the holding unit in a direction in which the crushing unit crushes the divided portions while the crushing unit and the holding unit sandwich the divided portions; A substrate splitting tool comprising: a support shaft portion that supports the crushing portion and the pressing portion so that they can move relatively, and a pair of handle portions that extend from the support shaft portion and operate the drive portion.

2. The pressing portion has a cylindrical holding portion and a movable portion that is disposed in a hollow portion of the holding portion and has the holding surface, 2. The substrate splitting tool according to claim 1, wherein the movable part is movable by the drive part relative to the holding part so as to protrude toward the crushing part.

3. The substrate splitting tool according to claim 2, characterized in that the drive unit, by operating the handle portion, transitions from a state in which the splitting portion is clamped between the holding surface of the holding portion and the crushing portion to a state in which the movable portion protrudes relatively from the holding portion.

4. 3. The substrate dividing tool according to claim 2, wherein the holding portion has a corresponding marking formed on a side of the holding portion so as to face a marking formed on the substrate when the substrate is held by the holding surface.

5. 3. The substrate dividing tool according to claim 2, wherein the pressing portion has a piercing portion formed on the holding surface of the movable portion so as to be inserted into the slit when the substrate is pressed by the holding surface.

6. 6. The substrate dividing tool according to claim 5, wherein the insertion portion is a pair of pins that sandwich the dividing portion when the substrate is held by the holding surface.

7. 7. The substrate dividing tool according to claim 6, wherein the projection of the crushing portion has a cutting edge portion that projects between the pair of pins along the extending direction of the dividing portion.

8. 7. The substrate dividing tool according to claim 6, wherein the projection of the crushing portion has a pyramidal projection that projects between the pair of pins along the extending direction of the dividing portion.

9. 6. The substrate dividing tool according to claim 5, wherein the insertion portion has a plate-shaped pin that extends along the slit adjacent to the dividing portion and fits into the slit when the substrate is held by the holding surface.

10. One of the handles has a frame extending from the support shaft along one side surface of the holding part to support the one side surface and to support the crushing part via the holding part, and a gripping part extending in an opposing direction from an opposing side surface of the holding part that faces the one side surface of the holding part on the opposite side of the frame, The other of the handle portions has a second support shaft portion that is arranged opposite and parallel to the gripping portion, and that rotatably supports a movable post that movably supports the movable portion relative to the holding portion at a position a first distance away from the support shaft portion, and has a lever portion that extends beyond the second support shaft portion to a position a second distance longer than the first distance.

11. One of the handles has a frame extending from the support shaft along one side surface of the holding part to support the one side surface and to support the crushing part via the holding part, and a gripping part extending from the support shaft in a direction away from the holding part and intersecting the frame on the one side surface side of the holding part, The other of the handle portions has a second support shaft portion that is arranged opposite to and parallel to the gripping portion, and that rotatably supports a movable post that movably supports the movable portion relative to the holding portion at a first distance away from the support shaft portion across the frame, and a lever portion that extends beyond the support shaft portion to a second distance longer than the first distance on the opposite side of the second support shaft portion.

Images