Bonding device and bonding method

By detecting and controlling the transmission path of the first layer diaphragm in the lamination device, the problem of position deviation of the first layer diaphragm and the first layer substrate in the transmission direction is solved, and higher lamination accuracy and stability are achieved.

JP2025048728APending Publication Date: 2025-04-03AGC INC

Patent Information

Application Number
JP2024102237
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-09-21
Filing Date
2024-06-25
Publication Date
2025-04-03

AI Technical Summary

Technical Problem

In the lamination device, the first layer diaphragm and the first layer substrate are prone to position deviations in the transmission direction, resulting in inaccurate lamination.

Method used

A lamination device is designed, including a first-layer substrate transmission part, a first-layer diaphragm transmission part and a first-layer adhesive part. The device controls its transmission path by detecting the alignment marks on the first diaphragm, ensuring accurate alignment at the bonding point.

Benefits of technology

The position deviation of the first layer diaphragm and the first layer substrate in the transmission direction is effectively suppressed, and the accuracy and stability of the lamination are improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a technique that suppresses misalignment between a first laminate film and a first substrate in a transport direction of the first laminate film.SOLUTION: A bonding device comprises a first bonding section that bonds a first substrate and a first laminate film at a first merging point where a transport path of the first substrate and a transport path of the first laminate film merge. The first laminate film and a first carrier film that holds the plurality of first laminate films at intervals in its transport direction constitute a first layered film. The first layered film has, for each first laminate film, a first alignment mark that indicates a position of each first laminate film. The bonding device detects the first alignment mark before the first merging point of the transport path of the first laminate film, and controls transport of the first laminate film on the basis of the detection result.SELECTED DRAWING: Figure 1
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Description

[Technical field]

[0001] The present disclosure relates to a bonding apparatus and a bonding method. [Background technology]

[0002] The lamination device described in Patent Document 1 laminates a substrate and a film piece. The film piece includes a polarizing plate and an adhesive layer. The film piece is adhered to one side of a release film, and is laminated to a substrate after being peeled off from the release film. A plurality of film pieces are provided at intervals in the longitudinal direction of the release film. Ladder-shaped ear pieces are provided so as to surround the plurality of film pieces. The ear pieces are adhered to one side of the release film. The ear pieces and the film piece are cut in advance. The release film is not cut. After being peeled off from the release film, the ear pieces are taken up by a take-up roller without being laminated to a substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2005-43384 A Summary of the Invention [Problem to be solved by the invention]

[0004] When the first laminate film and the first substrate are bonded to each other, misalignment between the first laminate film and the first substrate sometimes occurs in the transport direction of the first laminate film.

[0005] One aspect of the present disclosure provides a technique for suppressing misalignment between a first laminate film and a first substrate in a transport direction of the first laminate film. [Means for solving the problem]

[0006] A bonding device according to an embodiment of the present disclosure includes a first substrate transport section, a first film transport section, and a first bonding section. The first substrate transport section forms a transport path for a first substrate having a first main surface and a second main surface facing the opposite direction to the first main surface. The first film transport section forms a transport path for a first laminate film to be bonded to the first main surface of the first substrate, and a transport path for a first carrier film that holds a plurality of the first laminate films at intervals in the transport direction. The first bonding section fabricates a second substrate by bonding the first substrate and the first laminate film at a first junction where the transport path for the first substrate and the transport path for the first laminate film join. The first laminate film and the first carrier film form a first laminate film. The first laminate film has a first alignment mark indicating the position of the first laminate film for each of the first laminate films. The bonding device includes a first mark detection unit and a control unit. The first mark detection unit detects the first alignment mark before the first junction of the transport path of the first laminate film. The control unit controls transport of the first laminate film based on a detection result of the first mark detection unit. Effect of the Invention

[0007] According to one aspect of the present disclosure, it is possible to suppress misalignment between the first laminate film and the first substrate in the transport direction of the first laminate film. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a side view showing an upstream area of ​​a bonding apparatus according to one embodiment. [Diagram 2] FIG. 2 is a side view showing an example of a junction of the transport path for the first substrate and the transport path for the first laminate film. [Diagram 3] FIG. 3 is a top view showing an example of the first substrate transport section. [Figure 4] FIG. 4 is a top view showing an example of the first substrate. [Diagram 5]FIG. 5 is a top view showing an example of the first laminate film. [Figure 6] FIG. 6 is a cross-sectional view showing an example of the first laminate film. [Figure 7] FIG. 7 is a top view showing an example of the second laminate film. [Figure 8] FIG. 8 is a cross-sectional view showing an example of the second laminate film. [Figure 9] FIG. 9 is a cross-sectional view showing an example of the second substrate. [Figure 10] FIG. 10 is a top view showing an example of the second substrate. [Figure 11] FIG. 11 is a cross-sectional view showing an example of the first bonding section. [Figure 12] FIG. 12 is a cross-sectional view showing a modified example of the second substrate. [Figure 13] FIG. 13 is a cross-sectional view showing a modified example of the first bonding section. [Figure 14] FIG. 14 is a side view showing an example of the transport speed of the first bonding unit and the transport speed of the second substrate transport unit. [Figure 15] FIG. 15 is a side view showing an example of the operation of the first bonding unit. [Figure 16] FIG. 16 is a side view showing an example of the operation of the first bonding unit subsequent to FIG. [Figure 17] FIG. 17 is a side view showing the midstream area of ​​the bonding apparatus according to one embodiment. [Figure 18] FIG. 18 is a top view showing an example of the third laminate film. [Figure 19] FIG. 19 is a cross-sectional view showing an example of the third laminate film. [Figure 20] FIG. 20 is a cross-sectional view showing an example of the third substrate. [Figure 21] FIG. 21 is a top view showing an example of the third substrate. [Figure 22] FIG. 22 is a cross-sectional view showing an example of the second bonding section. [Figure 23] FIG. 23 is a side view showing an example of the operation of the second bonding unit. [Figure 24]FIG. 24 is a side view showing a downstream area of ​​a bonding apparatus according to one embodiment. [Diagram 25] FIG. 25 is a cross-sectional view showing an example of the fourth laminate film. [Figure 26] FIG. 26 is a cross-sectional view showing an example of the fifth laminate film. [Figure 27] FIG. 27 is a cross-sectional view showing an example of the fourth substrate. [Figure 28] FIG. 28 is a top view showing an example of the fourth substrate. [Figure 29] FIG. 29 is a cross-sectional view showing an example of the third bonding section. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In each drawing, the same or corresponding components are denoted by the same reference numerals, and the description may be omitted. In the specification, the symbol "~" indicating a range of values ​​means that the values ​​before and after the symbol are included as the lower and upper limits.

[0010] In this specification, the first direction is the transport direction of the first substrate. In the following embodiments, the positive X-axis direction is an example of the first direction. The second direction is the opposite direction to the first direction. The negative X-axis direction is an example of the second direction. The positive X-axis direction and the negative X-axis direction may be collectively referred to as the X-axis direction.

[0011] The third direction is a direction parallel to the first main surface of the first substrate and perpendicular to the first direction. The positive Y-axis direction is an example of the third direction. The fourth direction is the opposite direction to the third direction. The negative Y-axis direction is an example of the fourth direction. The positive Y-axis direction and the negative Y-axis direction may be collectively referred to as the Y-axis direction.

[0012] The fifth direction is a direction perpendicular to the first main surface of the first substrate. The positive Z-axis direction is an example of the fifth direction. The sixth direction is the opposite direction to the fifth direction. The negative Z-axis direction is an example of the sixth direction. The positive Z-axis direction and the negative Z-axis direction may be collectively referred to as the Z-axis direction.

[0013] The X-axis, Y-axis, and Z-axis directions are perpendicular to each other. In the following embodiment, the X-axis and Y-axis directions are horizontal directions, and the Z-axis direction is vertical (up-down direction). Rotation as viewed from the Z-axis direction, that is, rotation around the Z axis, is referred to as θ Z This is sometimes referred to as the rotation of the direction. Z The rotation in the direction may be a clockwise rotation or a counterclockwise rotation when viewed from the positive Z-axis direction to the negative Z-axis direction. The rotation as viewed from the Y-axis direction, that is, the rotation around the Y-axis, is called θ Y This is sometimes referred to as the rotation of the direction. Y The rotation direction may be clockwise or counterclockwise when viewed from the positive Y-axis direction to the negative Y-axis direction.

[0014] First, an overview of the upstream area of ​​a bonding apparatus 100 according to an embodiment will be described mainly with reference to Fig. 1 and Fig. 2. In this embodiment, the bonding apparatus 100 includes a second bonding section 320 (see Fig. 17) and a third bonding section 330 (see Fig. 24) in addition to a first bonding section 310, but it is sufficient to include at least one of the first bonding section 310, the second bonding section 320, and the third bonding section 330. The transport path of the substrate, the transport path of the film, and the like may also be changed as appropriate.

[0015] The bonding device 100 includes, for example, a first substrate conveying section 110, a first film conveying section 210, a second film conveying section 220, and a first bonding section 310. The first substrate conveying section 110 forms a conveying path for the first substrate 10. The first film conveying section 210 forms a conveying path for at least the first laminate film 21. The first laminate film 21 is bonded to the first main surface 11 of the first substrate 10 (see FIG. 9). The second film conveying section 220 is disposed on the opposite side of the first film conveying section 210 with respect to the first substrate conveying section 110, and has a structure in which the first film conveying section 210 is inverted upside down. The second film conveying section 220 forms a conveying path for at least the second laminate film 31. The second laminate film 31 is bonded to the second main surface 12 of the first substrate 10 (see FIG. 9). The point where the transport path of the first substrate 10, the transport path of the first laminate film 21, and the transport path of the second laminate film 31 join together may be referred to as a first joining point. The first bonding unit 310 bonds the first laminate film 21 and the second laminate film 31 to the first substrate 10 at the first joining point, thereby producing the second substrate 10A.

[0016] The bonding apparatus 100 may not include the second film transport section 220. In this case, the point where the transport path of the first substrate 10 and the transport path of the first laminate film 21 join is called the first joining point. The first bonding section 310 bonds the first substrate 10 and the first laminate film 21 at the first joining point to produce the second substrate 10A. In this case, the second laminate film 31 is not bonded to the second main surface 12 of the first substrate 10. In this embodiment, the first main surface 11 of the first substrate 10 is the upper surface, and the second main surface 12 of the first substrate 10 is the lower surface, but the arrangement may be reversed. That is, the first main surface 11 may be the lower surface, and the second main surface 12 may be the upper surface. In that case, the bonding apparatus 100 may have a structure that is upside down.

[0017] On the other hand, by providing the bonding device 100 with the second film transport section 220, the laminate film can be bonded simultaneously to both the first main surface 11 and the second main surface 12. Compared to bonding the laminate film to each side individually, the overall length of the bonding device 100 can be shortened and the time required to bond the laminate film to both sides can be reduced by about half. Also, by bonding the laminate film to both sides simultaneously, contact between the first substrate 10 and the lamination roller can be prevented, and the adhesion of dirt or scratches can be suppressed.

[0018] Next, the first substrate 10, the first laminate film 20, and the second laminate film 30 will be described mainly with reference to FIGS.

[0019] In this embodiment, the first substrate 10 is a glass substrate, but may be a ceramic substrate, a resin substrate, or a metal substrate. The first main surface 11 of the first substrate 10 is polygonal as shown in FIG. 4. The polygon is not rectangular, but may be rectangular. A polygon other than a rectangle may be described as an irregular shape. The corners of the polygon may be chamfered. Each side constituting the polygon is linear, but may be a shape obtained by correcting the straight line to a free curve.

[0020] The first substrate 10 may have a transmissive region A1 that transmits visible light and a light-shielding region A2 that blocks visible light when viewed from a direction perpendicular to the first main surface 11. The transmissive region A1 transmits, for example, an image of a display. The light-shielding region A2 is formed so as to surround the transmissive region A1. The light-shielding region A2 is made of, for example, a printed layer formed on the second main surface 12. The printed layer is made of, for example, a black material, which may be either an inorganic material or an organic material. The first substrate 10 may have a through hole (not shown).

[0021] 5, the first laminate film 20 has a first laminate film 21 and a first carrier film 22 (see FIG. 6) that holds a plurality of the first laminate films 21 at intervals in the transport direction. The plurality of first laminate films 21 are provided on one side of the first carrier film 22 at intervals in the longitudinal direction of the first carrier film 22.

[0022] The first laminating film 20 has a first alignment mark 23 for each first laminating film 21, which indicates the position of the first laminating film 21. The first alignment mark 23 indicates the position of the first laminating film 21 in the longitudinal direction of the first carrier film 22. One or more first alignment marks 23 are provided for each first laminating film 21. The first alignment marks 23 may be provided on both the Y-axis positive direction side and the Y-axis negative direction side of the first laminating film 21.

[0023] 6, the first laminate film 21 has a base film 21a and an adhesive layer 21b, and is adhered to one side of the first carrier film 22 with the adhesive layer 21b facing the first carrier film 22. After being peeled off from the one side of the first carrier film 22, the first laminate film 21 is attached to the first main surface 11 of the first substrate 10 with the adhesive layer 21b facing the first substrate 10, as shown in FIG.

[0024] 10, when viewed in a direction perpendicular to the first main surface 11 of the first substrate 10, the first laminate film 21 has a similar shape to the first substrate 10. In this embodiment, the first laminate film 21 is smaller than the first substrate 10, but may be larger than the first substrate 10. In addition, the first laminate film 21 may have the same size as the first substrate 10.

[0025] The first laminate film 21 may be smaller than the first substrate 10, and the entire first laminate film 21 may be attached to the first main surface 11 of the first substrate 10. In this case, the first laminate film 21 is fixed without protruding from the outer periphery of the first substrate 10, making it difficult to peel the first laminate film 21 from the first substrate 10.

[0026] Therefore, the first laminate film 21 may have a first pull tab (not shown). The first pull tab protrudes outside the first main surface 11 of the first substrate 10 at a part of the periphery of the first main surface 11. A worker or a working robot can peel off the first laminate film 21 and the first substrate 10 while holding the first pull tab. It is preferable that the corners of the first pull tab are chamfered.

[0027] 5 and 6, the first laminate film 20 may have a first laminate film 21 and a first outer film 24 disposed on the outer side of the first laminate film 21 on one side of a first carrier film 22. The first alignment mark 23 is provided on the first outer film 24.

[0028] 6, the first laminate film 20 is half-cut in advance, and has a slit 27 that separates the first laminate film 21 and the first outer film 24. The slit 27 may reach one side of the first carrier film 22, but does not reach the other side of the first carrier film 22. The slit 27 need not penetrate the first carrier film 22. The slit 27 is formed along the entire periphery of the first laminate film 21.

[0029] As shown in FIG. 9, after the first laminate film 21 and the first substrate 10 are bonded, a part of the first main surface 11 of the first substrate 10 may be exposed from the first laminate film 21. In that case, as shown in FIG. 11, it is preferable that the first outer film 24 passes through the pair of first laminate rollers 311, 312 while contacting the first substrate 10 and the first laminate roller 311. This makes it possible to suppress contact between the first substrate 10 and the first laminate roller 311, and to suppress friction and transfer of dirt. In the method of this technology in which bonding is performed repeatedly many times, if it is desired to suppress transfer of dirt, the bonding operation must be stopped each time for cleaning, which leads to a large tact loss, so a mechanism for preventing such surface friction and transfer of dirt is important.

[0030] As shown in Fig. 6, the first outer film 24 has a base film 24a and an adhesive layer 24b, and is adhered to one side of the first carrier film 22 with the adhesive layer 24b facing the first carrier film 22. After being peeled off from one side of the first carrier film 22, the first outer film 24 passes through a pair of first lamination rollers 311, 312 as shown in Fig. 11. Thereafter, the first outer film 24 is collected in a first collection section 216 (see Fig. 1). The first collection section 216 may have a first collection shaft that takes up the first outer film 24.

[0031] 7, the second laminate film 30 has a second laminate film 31 and a second carrier film 32 that holds a plurality of second laminate films 31 at intervals in the transport direction. A plurality of second laminate films 31 are provided on one side of the second carrier film 32 at intervals in the longitudinal direction of the second carrier film 32.

[0032] The second laminating film 30 has a second alignment mark 33 for each second laminating film 31, indicating the position of the second laminating film 31. The second alignment mark 33 indicates the position of the second laminating film 31 in the longitudinal direction of the second carrier film 32. One or more second alignment marks 33 are provided for each second laminating film 31. The second alignment marks 33 may be provided on both the Y-axis positive direction side and the Y-axis negative direction side of the second laminating film 31.

[0033] 8, the second laminate film 31 has a base film 31a and an adhesive layer 31b, and is adhered to one side of the second carrier film 32 with the adhesive layer 31b facing the second carrier film 32. After being peeled off from the one side of the second carrier film 32, the second laminate film 31 is attached to the second main surface 12 of the first substrate 10 with the adhesive layer 31b facing the first substrate 10, as shown in FIG.

[0034] Although not shown, the second laminate film 31 has a similar shape to the first substrate 10, similar to the first laminate film 21. The second laminate film 31 is smaller than the first substrate 10 in this embodiment, but may be larger than the first substrate 10. The second laminate film 31 may also have the same size as the first substrate 10.

[0035] The second laminate film 31 may be smaller than the first substrate 10, and the entire second laminate film 31 may be attached to the second main surface 12 of the first substrate 10. In this case, the second laminate film 31 is fixed without protruding from the outer periphery of the first substrate 10, making it difficult to peel the second laminate film 31 from the first substrate 10.

[0036] Therefore, the second laminate film 31 may have a second pull tab (not shown). The second pull tab protrudes outside the second main surface 12 of the first substrate 10 at a part of the periphery of the second main surface 12. A worker or a working robot can peel off the second laminate film 31 and the first substrate 10 while holding the second pull tab. It is preferable that the corners of the second pull tab are chamfered.

[0037] 7 and 8, the second laminate film 30 may have a second laminate film 31 and a second outer film 34 disposed on the outer side of the second laminate film 31 on one side of a second carrier film 32. The second alignment mark 33 is provided on the second outer film 34.

[0038] 8, the second laminate film 30 is half-cut in advance, and has a slit 37 that separates the second laminate film 31 and the second outer film 34. The slit 37 may reach one side of the second carrier film 32, but does not reach the other side of the second carrier film 32. The slit 37 need not penetrate the second carrier film 32. The slit 37 is formed along the entire periphery of the second laminate film 31.

[0039] As shown in Fig. 9, after the second laminate film 31 and the first substrate 10 are bonded together, a part of the second main surface 12 of the first substrate 10 may be exposed from the second laminate film 31. In that case, as shown in Fig. 11, it is preferable that the second outer film 34 passes through the pair of first laminate rollers 311, 312 while contacting the first substrate 10 and the first laminate roller 312. This makes it possible to suppress contact between the first substrate 10 and the first laminate roller 312, and thus to suppress friction and transfer of dirt.

[0040] As shown in Fig. 8, the second outer film 34 has a base film 34a and an adhesive layer 34b, and is adhered to one side of the second carrier film 32 with the adhesive layer 34b facing the second carrier film 32. After being peeled off from one side of the second carrier film 32, the second outer film 34 passes through a pair of first lamination rollers 311, 312 as shown in Fig. 11. Thereafter, the second outer film 34 is collected in the second collection section 226 (see Fig. 1). The second collection section 226 may have a second collection shaft that takes up the second outer film 34.

[0041] 1 and 2 again, details of the upstream area of ​​the bonding apparatus 100 will be described. The bonding apparatus 100 includes, for example, a first substrate transport section 110, a first film transport section 210, a second film transport section 220, a first bonding section 310, and a control section 190.

[0042] The control unit 190 is, for example, a computer, and includes an arithmetic unit such as a CPU (Central Processing Unit) and a storage unit such as a memory. The storage unit stores programs that control various processes executed in the bonding apparatus 100. The control unit 190 controls the operation of the bonding apparatus 100 by causing the arithmetic unit to execute the programs stored in the storage unit.

[0043] The control unit 190 includes electronic circuits such as a CPU, an FPGA (Field Programmable Gate Array) or an ASIC (Application Specific Integrated Circuit), and performs various control operations described in this specification by executing instruction codes stored in a memory or by being a circuit designed for a specific purpose.

[0044] The first substrate transport section 110 forms a transport path for the first substrate 10. As shown in Fig. 9, the first substrate 10 has a first main surface 11 and a second main surface 12 facing opposite to the first main surface 11. The first main surface 11 is the upper surface, and the second main surface 12 is the lower surface. A plurality of first substrates 10 are arranged at intervals in the positive direction of the X-axis, and are transported in the positive direction of the X-axis either collectively or individually.

[0045] As shown in Fig. 1, the first substrate transport section 110 has a plurality of first transport rollers 111. The plurality of first transport rollers 111 are arranged at intervals in the X-axis direction. The first transport rollers 111 have, for example, a metal roller and a resin film covering the outer circumferential surface of the metal roller. The resin film comes into contact with the first substrate 10. This can prevent the first substrate 10 from being scratched.

[0046] The first substrate transport section 110 has a first transport motor (not shown). The first transport motor rotates the first transport rollers 111. A plurality of first transport motors may rotate the plurality of first transport rollers 111 individually. Also, one first transport motor may rotate the plurality of first transport rollers 111 collectively. The first substrate transport section 110 does not need to rotate all of the first transport rollers 111 at the same time.

[0047] The first substrate transport section 110 transports the first substrate 10 in the positive direction of the X-axis by rotating a plurality of first transport rollers 111. The transport speed of the first substrate 10 is equal to the circumferential speed of the first transport rollers 111. The circumferential speed is the product of the circumferential length and the rotation speed (rpm).

[0048] The first substrate transport unit 110 is ZIt may have a positioning section (not shown) that adjusts the position of the first substrate 10 in the direction. The positioning section has, for example, a plurality of rollers (for example, four) that come into contact with and separate from the end face of the first substrate 10 at intervals along the periphery of the first substrate 10. It is preferable that the first bonding section 310 bonds the first laminate film 21 and the second laminate film 31 to the first substrate 10 after the positioning section adjusts the position of the first substrate 10.

[0049] The first film transport section 210 forms, for example, a transport path for the first laminate film 21 and a transport path for the first carrier film 22. The first laminate film 21 is bonded to the first main surface 11 of the first substrate 10. The first carrier film 22 holds a plurality of the first laminate films 21 at intervals in the transport direction.

[0050] The first film transport section 210 has, for example, a first unwinding shaft 211, a first peeling body 212, and a first winding shaft 213. The first unwinding shaft 211 unwinds the first laminate film 20 that has been wound in a roll in advance. The first peeling body 212 peels the first carrier film 22 and the first laminate film 21 by folding back the first carrier film 22 before a first joining point of the transport path of the first carrier film 22. The first peeling body 212 has, for example, a wedge-shaped tip, and peels off the first carrier film 22 and the first laminate film 21 at the tip. The first winding shaft 213 winds up the first carrier film 22 folded back by the first peeling body 212 into a roll.

[0051] The first film transport section 210 may have first relay rollers 214, 215. The first relay roller 214 changes the transport direction of the first laminate film 20 between the first unwinding shaft 211 and the first peeling body 212. A plurality of first relay rollers 214 may be provided. The first relay roller 215 changes the transport direction of the first carrier film 22 between the first peeling body 212 and the first winding shaft 213. A plurality of first relay rollers 215 may be provided.

[0052] It is desirable to provide a mechanism for sandwiching the first carrier film 22 between two rollers (not shown) between the first peeling body 212 and the first winding shaft 213 of the first film transport section 210 and transporting the first carrier film 22 independently of the first winding shaft 213. One of the two rollers may be driven by the other.

[0053] As shown in FIG. 2, the first film transport section 210 may include a first individual adjustment section 217. Unlike the first drive section 102 described below, the first individual adjustment section 217 moves a part of the first film transport section 210 rather than the entire first film transport section 210. The first individual adjustment section 217 moves, for example, the first peeling body 212. The first individual adjustment section 217 moves the first peeling body 212 in the Y-axis positive direction and the Y-axis negative direction. In addition, the first individual adjustment section 217 moves the first peeling body 212 in the X-axis positive direction, the X-axis negative direction, the Z-axis positive direction, and the Z-axis negative direction, and rotates the first peeling body 212 in an angle θ Y Rotate in the direction.

[0054] 1, the second film transport section 220 forms, for example, a transport path for the second laminate film 31 and a transport path for the second carrier film 32. The second laminate film 31 is bonded to the second main surface 12 of the first substrate 10. The second carrier film 32 holds a plurality of second laminate films 31 at intervals in the transport direction.

[0055] The second film transport section 220 has, for example, a second unwinding shaft 221, a second peeling body 222, and a second winding shaft 223. The second unwinding shaft 221 unwinds the second laminate film 30 that has been wound in a roll in advance. The second peeling body 222 peels the second carrier film 32 and the second laminate film 31 by folding back the second carrier film 32 before the first joining point of the transport path of the second carrier film 32. The second peeling body 222 has, for example, a wedge-shaped tip, and peels off the second carrier film 32 and the second laminate film 31 at the tip. The second winding shaft 223 winds up the second carrier film 32 folded back by the second peeling body 222 into a roll.

[0056] The second film transport section 220 may have second relay rollers 224, 225. The second relay roller 224 changes the transport direction of the second laminate film 30 between the second unwinding shaft 221 and the second peeling body 222. A plurality of second relay rollers 224 may be provided. The second relay roller 225 changes the transport direction of the second carrier film 32 between the second peeling body 222 and the second winding shaft 223. A plurality of second relay rollers 225 may be provided.

[0057] It is desirable to provide a mechanism for sandwiching the second carrier film 32 between two rollers (not shown) between the second peeling body 222 and the second winding shaft 223 of the second film transport section 220 and transporting the second carrier film 32 independently of the second winding shaft 223. One of the two rollers may be driven by the other.

[0058] As shown in FIG. 2, the second film transport section 220 may include a second individual adjustment section 227. Unlike the second drive section 105 described later, the second individual adjustment section 227 moves a part of the second film transport section 220 rather than the entire second film transport section 220. The second individual adjustment section 227 moves, for example, the second peeling body 222. The second individual adjustment section 227 moves the second peeling body 222 in the Y-axis positive direction and the Y-axis negative direction. In addition, the second individual adjustment section 227 moves the second peeling body 222 in the X-axis positive direction, the X-axis negative direction, the Z-axis positive direction, and the Z-axis negative direction, and rotates the second peeling body 222 in an angle θ Y Rotate in the direction.

[0059] The first bonding section 310 produces a second substrate 10A by bonding a first laminate film 21 and a second laminate film 31 to the first substrate 10 at a first joining point. The second substrate 10A has the first laminate film 21 and the second laminate film 31 sandwiching the first substrate 10 therebetween.

[0060] The first laminating section 310 has, for example, a pair of first laminating rollers 311, 312. The pair of first laminating rollers 311, 312 sandwich and feed the first laminating film 21, the first substrate 10, and the second laminating film 31 in this order from the top to the bottom. The first laminating section 310 may be configured similarly to the second laminating section 320 described later.

[0061] The first laminating section 310 transports the second substrate 10A in the positive direction of the X-axis, for example, by rotating a pair of first laminating rollers 311, 312. The transport speed of the second substrate 10A is equal to the circumferential speed of the pair of first laminating rollers 311, 312. The circumferential speed is the product of the circumferential length and the rotation speed (rpm). The circumferential speeds of the pair of first laminating rollers 311, 312 are equal.

[0062] 11, the first laminating unit 310 has, for example, a pair of first rotating motors 313 and 314. The first rotating motor 313 rotates the first laminating roller 311. The first rotating motor 314 rotates the first laminating roller 312. Note that one of the first rotating motors 313 and 314 may be omitted. One of the pair of first laminating rollers 311 and 312 may be rotated passively in response to the rotation of the other roller.

[0063] 1, the bonding apparatus 100 includes a first mark detection unit 101. The first mark detection unit 101 detects the first alignment mark 23 before the first junction of the transport path of the first laminate film 21. It is preferable that the detection position is as close to the first junction as possible.

[0064] The first mark detection unit 101 includes, for example, a photoelectric sensor. The photoelectric sensor has a light emitting element and a light receiving element that receives light emitted from the light emitting element. The light emitting element may be a laser, and the photoelectric sensor may be a laser sensor.

[0065] The light emitting element and the light receiving element are provided, for example, on one side of the first laminate film 20. The light receiving element receives light reflected by the first laminate film 20. If the first alignment mark 23 is a through hole as described below, the amount of light received by the light receiving element decreases when the first alignment mark 23 passes through the optical path of light from the light emitting element to the light receiving element.

[0066] The light-emitting element and the light-receiving element may be disposed with the first laminate film 20 in between, and the light-receiving element may receive light transmitted through the first laminate film 20. When the first alignment mark 23 is a through hole as described below, the amount of light received by the light-receiving element increases when the first alignment mark 23 passes through the optical path of light traveling from the light-emitting element to the light-receiving element.

[0067] The first alignment mark 23 is, for example, a through hole. The first alignment mark 23 may be a notch. The through hole and the notch are formed penetrating the first laminate film 20 in the thickness direction. This makes it easier for the amount of light received by the light receiving element to change, and the first alignment mark 23 can be detected with high accuracy.

[0068] The first mark detection unit 101 is not limited to a photoelectric sensor. A proximity sensor may be used instead of the photoelectric sensor. The first mark detection unit 101 may also include an image sensor and an image processing device. The image processing device detects the first alignment mark 23 by processing an image captured by the image sensor. The first alignment mark 23 may be printed with ink.

[0069] The control unit 190 controls the transport of the first laminate film 21 based on the detection result of the first mark detection unit 101. The controlled items include at least one of the transport distance, the transport speed, and the transport time. This makes it possible to suppress misalignment of the first laminate film 21 and the first substrate 10 in the X-axis direction at the start of bonding, and to bond the first laminate film 21 and the first substrate 10 with high accuracy.

[0070] It is also possible to suppress misalignment between the first laminate film 21 and the first substrate 10 in the Y-axis direction at the start of bonding. As shown in Fig. 1, the bonding device 100 may include a first drive unit 102 and a first edge detection unit 103. The first drive unit 102 moves the first film transport unit 210 in the Y-axis positive direction and the Y-axis negative direction. The first drive unit 102 has, for example, a motor and a ball screw that converts the rotational motion of the motor into linear motion of the first film transport unit 210.

[0071] The first drive unit 102 moves the components of the first film transport unit 210 together, such as the first unwinding shaft 211, the first peeling body 212, and the first winding shaft 213. The transport path of the first laminating film 21 and the transport path of the first carrier film 22 can be moved relative to the transport path of the first substrate 10 while maintaining the relative positions of these components.

[0072] The first edge detection unit 103 detects the edge of the first laminate film 20 in at least one of the Y-axis positive direction and the Y-axis negative direction (both directions in this embodiment). For example, the edge to be detected is the edge of the first carrier film 22. The first edge detection unit 103 has, for example, a laser displacement sensor. Alternatively, the first edge detection unit 103 may have an imaging sensor and an image processing device. The image processing device detects the edge of the first laminate film 20 by processing an image captured by the imaging sensor.

[0073] The control unit 190 controls the first driving unit 102 based on the detection result of the first edge detection unit 103, thereby performing control to move the first laminate film 21 in the positive Y-axis direction or the negative Y-axis direction to a desired position. This makes it possible to suppress misalignment of the first laminate film 21 and the first substrate 10 in the Y-axis direction at the start of bonding, and to bond the first laminate film 21 and the first substrate 10 with high accuracy.

[0074] The first driving unit 102 and the first edge detection unit 103 are Z The first driving unit 102 can also be used to adjust the positions of the first laminate film 21 and the first substrate 10 in the θ direction.Z The first edge detection unit 103 may detect one widthwise end of the first laminate film 20 at a plurality of locations spaced apart in the longitudinal direction of the first laminate film 20. The first edge detection unit 103 may detect the other widthwise end of the first laminate film 20 at a plurality of locations spaced apart in the longitudinal direction of the first laminate film 20. As shown in FIG. 1 , a plurality of first edge detection units 103 may be provided at intervals in the longitudinal direction of the first laminate film 20. The first edge detection unit 103 detects the inclination of the first laminate film 20 with respect to the reference direction, and based on the detection result, the first drive unit 102 controls the first film transport unit 210 to rotate in an angle θ Z The first edge detection unit 103 detects the inclination of the first laminate film 20 with respect to the reference direction, and based on the detection result, a first position adjustment unit 316 (described later) rotates the first substrate 10 in the θ Z It may be rotated in the direction.

[0075] The control unit 190 controls the first driving unit 102 based on the detection result of the first edge detection unit 103 to move the first laminating film 21 to a desired position by an angle θ Z Alternatively, the control unit 190 controls the first position adjustment unit 316 based on the detection result of the first edge detection unit 103 to move the first substrate 10 to a desired position in the θ direction. Z This controls the rotation in the θ direction at the start of lamination. Z This makes it possible to suppress misalignment between first laminate film 21 and first substrate 10 in the direction, and allows first laminate film 21 and first substrate 10 to be bonded together with high precision.

[0076] The bonding apparatus 100 includes a second mark detection unit 104. The second mark detection unit 104 detects the second alignment mark 33 before the first junction of the transport path of the second laminate film 31. The detection position is preferably as close to the first junction as possible. The second mark detection unit 104 is configured similarly to the first mark detection unit 101.

[0077] The second alignment mark 33 is, for example, a through hole. The second alignment mark 33 may be a notch. The through hole and the notch are formed penetrating the second laminate film 30 in the thickness direction. This makes it easier for the amount of light received by the light receiving element to change, and the second alignment mark 33 can be detected with high accuracy.

[0078] The control unit 190 controls the transport of the second laminate film 31 based on the detection result of the second mark detection unit 104. The controlled items include at least one of the transport distance, the transport speed, and the transport time. This makes it possible to suppress misalignment of the second laminate film 31 and the first substrate 10 in the X-axis direction at the start of bonding, and to bond the second laminate film 31 and the first substrate 10 with high accuracy.

[0079] It is also possible to suppress misalignment between the second laminate film 31 and the first substrate 10 in the Y-axis direction at the start of bonding. As shown in Fig. 1, the bonding device 100 may include a second drive unit 105 and a second edge detection unit 106. The second drive unit 105 moves the second film transport unit 220 in the Y-axis positive direction and the Y-axis negative direction. The second drive unit 105 has, for example, a motor and a ball screw that converts the rotational motion of the motor into linear motion of the second film transport unit 220.

[0080] The second drive unit 105 moves the components of the second film transport unit 220 together, for example, the second unwinding shaft 221, the second peeling body 222, and the second winding shaft 223. The transport path of the second laminating film 31 and the transport path of the second carrier film 32 can be moved relative to the transport path of the first substrate 10 while maintaining the relative positions of these components.

[0081] The second edge detection unit 106 detects the edge of the second laminate film 30 in at least one of the positive Y-axis direction and the negative Y-axis direction (in this embodiment, both directions). The edge to be detected is, for example, the edge of the second carrier film 32. The second edge detection unit 106 is configured similarly to the first edge detection unit 103.

[0082] The control unit 190 controls the second drive unit 105 based on the detection result of the second edge detection unit 106 to control the second laminate film 31 to move in the positive Y-axis direction or the negative Y-axis direction to a desired position. This makes it possible to suppress misalignment of the second laminate film 31 and the first substrate 10 in the Y-axis direction at the start of bonding, and to bond the second laminate film 31 and the first substrate 10 with high accuracy.

[0083] The second driving unit 105 and the second edge detection unit 106 are Z The second driving unit 105 can also be used to adjust the positions of the second laminating film 31 and the first substrate 10 in the θ direction. Z The second edge detection unit 106 may detect one widthwise end of the second laminate film 30 at a plurality of locations spaced apart in the longitudinal direction of the second laminate film 30. The second edge detection unit 106 may detect the other widthwise end of the second laminate film 30 at a plurality of locations spaced apart in the longitudinal direction of the second laminate film 30. As shown in FIG. 1, a plurality of second edge detection units 106 may be provided at intervals in the longitudinal direction of the second laminate film 30. The second edge detection unit 106 detects the inclination of the second laminate film 30 with respect to the reference direction, and based on the detection result, the second drive unit 105 controls the second film transport unit 220 to rotate in an angle θ Z The second edge detection unit 106 detects the inclination of the second laminate film 30 with respect to the reference direction, and based on the detection result, a first position adjustment unit 316 (described later) rotates the first substrate 10 in the θ Z It may be rotated in the direction.

[0084] The control unit 190 controls the second driving unit 105 based on the detection result of the second edge detection unit 106 to move the second laminating film 31 to a desired position by an angle θ Z Alternatively, the control unit 190 controls the first position adjustment unit 316 based on the detection result of the second edge detection unit 106 to move the first substrate 10 to a desired position in the θ direction. Z This controls the rotation in the θ direction at the start of lamination. ZThis makes it possible to suppress misalignment between the second laminate film 31 and the first substrate 10 in the direction, and allows the second laminate film 31 and the first substrate 10 to be bonded together with high precision.

[0085] The first lamination unit 310 may have a first suction plate 315. The first suction plate 315 suctions the first substrate 10. For example, the first suction plate 315 suctions the first substrate 10 by vacuum suction. It is preferable that the first suction plate 315 suctions the first substrate 10 after the first substrate transport unit 110 adjusts the position of the first substrate 10 by using rollers or the like.

[0086] After first suction plate 315 receives first substrate 10 from first substrate transport section 110, first suction plate 315 suctions first substrate 10 at least until the pair of first laminating rollers 311, 312 sandwiches first substrate 10, etc. This makes it possible to prevent the position of first substrate 10 from shifting due to the impact generated when the pair of first laminating rollers 311, 312 sandwiches first substrate 10, etc.

[0087] The first suction plate 315 is provided, for example, facing the second main surface 12 of the first substrate 10. The first suction plate 315 has, for example, a metal plate and a resin film covering the surface of the metal plate facing the first substrate 10. The resin film comes into contact with the first substrate 10. This makes it possible to prevent the first substrate 10 from being scratched. The first suction plate 315 is provided, for example, in a space formed by dividing the first transport roller 111 in the Y-axis direction, as shown in FIG. 3.

[0088] As shown in FIG. 2, the first suction plate 315 may continue to suction the first substrate 10 while the pair of first laminating rollers 311, 312 sandwich and send out the first substrate 10. The posture of the first substrate 10 can be stabilized by the first suction plate 315. During this time, the control unit 190 controls the circumferential speed of the pair of first laminating rollers 311, 312 and the moving speed of the first suction plate 315 to be the same in order to suppress the occurrence of sliding friction due to the difference in conveying speed and to suppress the attachment of scratches or dirt. Here, the same conveying speed means that the conveying speed of one (for example, the circumferential speed of the first laminating rollers 311, 312) is 95% to 105% of the conveying speed of the other (for example, the moving speed of the first suction plate 315).

[0089] Before the first suction plate 315 collides with the first laminating roller 312, the first suction plate 315 may stop moving in the positive direction of the X-axis and release the suction of the first substrate 10. During this time, the rotation of the pair of first laminating rollers 311, 312 is stopped so as to prevent sliding friction from occurring. Thereafter, the pair of first laminating rollers 311, 312 is rotated again, and sandwiches and sends out the first substrate 10 and the like.

[0090] If the movement of first suction plate 315 and the rotation of the pair of first lamination rollers 311, 312 are stopped when first suction plate 315 releases suction from first substrate 10, a mark indicating the lamination position at that time will remain. Therefore, first suction plate 315 may release suction from first substrate 10 while continuing to move in the positive direction of the X-axis. It is preferable to decelerate the movement speed of first suction plate 315 before first suction plate 315 releases suction from first substrate 10.

[0091] 1, the first bonding unit 310 may have a first position adjustment unit 316 and a first position detection unit 317. The first position adjustment unit 316 moves the first suction plate 315 in the X-axis positive direction, the X-axis negative direction, the Y-axis positive direction, the Y-axis negative direction, the Z-axis positive direction, and the Z-axis negative direction, and also detects an angle θ Z First position detection unit 317 detects the position of first substrate 10 after first suction plate 315 has suctioned first substrate 10 and before the pair of first lamination rollers 311, 312 sandwich first substrate 10 and the like.

[0092] The first position detection unit 317 detects the position of the first substrate 10, for example, by detecting the positions of each of a plurality of feature points of the first substrate 10. The feature points of the first substrate 10 are, for example, corners of the periphery of the first main surface 11 of the first substrate 10, or corners of the boundary line between the transmission area A1 and the light-shielding area A2. The first position detection unit 317 has, for example, an image sensor and an image processing device. The image processing device detects the positions of the feature points by processing an image captured by the image sensor. The first position detection unit 317 detects the positions of the feature points in, for example, the X-axis direction, the Y-axis direction, and the θ-axis direction. ZThe position of the first substrate 10 in the direction is detected.

[0093] The control unit 190 controls the first position adjustment unit 316 based on the detection result of the first position detection unit 317, thereby performing control to move or rotate the first substrate 10 to a desired position. Z The position of the first substrate 10 in the direction can be controlled to a desired position, and therefore the first laminate film 21 and the first substrate 10 can be bonded together with high precision.

[0094] The bonding apparatus 100 may include a second substrate transport section 120. The second substrate transport section 120 forms a transport path for the second substrate 10A produced in the first bonding section 310. The second substrate transport section 120 is provided, for example, on an extension of the first substrate transport section 110. A plurality of second substrates 10A are lined up at intervals in the positive direction of the X-axis, and are transported in the positive direction of the X-axis either collectively or individually.

[0095] The second substrate conveying section 120 has a plurality of second conveying rollers 121. The plurality of second conveying rollers 121 are arranged at intervals in the X-axis direction. The second conveying rollers 121 have, for example, a metal roller and a resin film covering the outer circumferential surface of the metal roller. The resin film comes into contact with the second substrate 10A. This can prevent the second substrate 10A from being scratched.

[0096] The second substrate transport section 120 has a second transport motor (not shown). The second transport motor rotates the second transport rollers 121. A plurality of second transport motors may rotate the plurality of second transport rollers 121 individually. Also, one second transport motor may rotate the plurality of second transport rollers 121 collectively. The second substrate transport section 120 does not need to rotate all of the second transport rollers 121 at the same time.

[0097] The second substrate transport section 120 transports the second substrate 10A in the positive direction of the X-axis by rotating a plurality of second transport rollers 121. The transport speed of the second substrate 10A is equal to the circumferential speed of the second transport rollers 121. The circumferential speed is the product of the circumferential length and the rotation speed (rpm).

[0098] The second substrate transport section 120 is Z The second substrate 10A may have a positioning section (not shown) that adjusts the position of the second substrate 10A in the direction. The positioning section has, for example, a plurality of rollers (for example, four) that come into contact with and separate from the end face of the second substrate 10A and are spaced apart along the periphery of the second substrate 10A. After the positioning section adjusts the position of the second substrate 10A, it is preferable that the second bonding section 320 described later bonds the second substrate 10A and the third laminate film 41 together.

[0099] However, after laminating a laminate film, stains and scratches are often found on the surface of the laminate film or the surface of the substrate. The stains and scratches are often very small, so they are often difficult to find by visual inspection, and it is difficult to identify the cause. Therefore, the present inventors conducted many lamination tests to investigate the shape, position, range, and regularity of the stains and scratches, and found that the main cause is the speed difference between the laminating roller and the conveying section.

[0100] Therefore, the control unit 190 individually controls the transport speed of the second substrate 10A in the first bonding unit 310 and the second substrate transport unit 120. As shown in Fig. 14, the control unit 190 preferably controls the first bonding unit 310 and the second substrate transport unit 120 to operate at the same transport speed until the second substrate 10A separates from the pair of first lamination rollers 311, 312. Here, the same transport speed means that the transport speed of one (for example, the transport speed VL of the first bonding unit 310) is 95% to 105% of the transport speed of the other (for example, the transport speed VS of the second substrate transport unit).

[0101] As described above, the control unit 190 controls the first bonding unit 310 and the second substrate conveying unit 120 to operate at the same conveying speed until the second substrate 10A separates from the pair of first laminating rollers 311, 312. This makes it possible to suppress the occurrence of sliding friction due to the difference in conveying speeds VL and VS, and to suppress the adhesion of scratches or dirt. In particular, when the second laminate film 31 is not bonded to the second main surface 12 of the first substrate 10 and the first laminating roller 312 contacts the second main surface 12 of the first substrate 10 as shown in Figs. 12 and 13, the effect of suppressing the adhesion of scratches or dirt is easily obtained.

[0102] 13, when the first laminating roller 312 contacts the second main surface 12 of the first substrate 10, the first laminating section 310 preferably has a cleaning roller 318. While the outer peripheral surface of the first laminating roller 312 is in contact with the first substrate 10, the cleaning roller 318 contacts the outer peripheral surface of the first laminating roller 312 to remove foreign matter from the outer peripheral surface. This makes it possible to keep the outer peripheral surface of the first laminating roller 312 clean without stopping the laminating operation, and to prevent dirt from adhering to the first substrate 10. In addition, since there is no need to stop the laminating operation even when the first substrates 10 are continuously laminated, this contributes to shortening the tact time.

[0103] 14, the control unit 190 stops the rotation of the pair of first laminating rollers 311, 312 after the second substrate 10A has completely passed through the pair of first laminating rollers 311, 312. The control unit 190 continues the rotation of the pair of first laminating rollers 311, 312 without stopping it when bonding of the first laminating film 21 and the first substrate 10 is completed. This makes it possible to suppress the occurrence of sliding friction due to differences in conveying speed, and to suppress the adhesion of scratches or dirt.

[0104] 15 and 16, the operation of the upstream area of ​​the bonding apparatus 100 will be described. The first suction plate 315 is in advance waiting below the transport path of the first substrate 10, and when the first substrate 10 moves to a predetermined position in the positive direction of the X-axis and stops, the first suction plate 315 rises to adsorb the lower surface of the first substrate 10. The first suction plate 315 further rises to separate the first substrate 10 upward from the first transport roller 111. Next, while the first suction plate 315 is adsorbing the first substrate 10, the first position detection unit 317 detects the position of the first substrate 10. Next, the control unit 190 controls the first position adjustment unit 316 based on the detection result of the first position detection unit 317 to adjust the position of the first substrate 10 in the X-axis direction, the Y-axis direction and the θ direction. Z The position of the first substrate 10 in the direction is controlled to a desired position.

[0105] Next, first suction plate 315 moves in the positive direction of the X-axis while suctioning first substrate 10, and inserts first substrate 10 between the pair of first laminating rollers 311, 312. Next, upper first laminating roller 311 descends, and lower first laminating roller 312 ascends. Then, the pair of first laminating rollers 311, 312 sandwich first laminating film 21, first substrate 10, and second laminating film 31 in this order from top to bottom.

[0106] 16, a pair of first laminating rollers 311, 312 sandwich and send out the first substrate 10, etc. During this time, the first suction plate 315 may continue to suction the first substrate 10. The posture of the first substrate 10 can be stabilized by the first suction plate 315. During this time, the control unit 190 controls the circumferential speed of the pair of first laminating rollers 311, 312 and the moving speed of the first suction plate 315 to be the same speed, in order to suppress the occurrence of sliding friction due to the difference in conveying speed.

[0107] Before first suction plate 315 collides with first laminating roller 312, first suction plate 315 stops moving in the positive direction of the X-axis and releases suction of first substrate 10. During this time, rotation of the pair of first laminating rollers 311, 312 is stopped. Thereafter, the pair of first laminating rollers 311, 312 is rotated again, and sandwiches and sends out first substrate 10, etc.

[0108] If the movement of first suction plate 315 and the rotation of the pair of first lamination rollers 311, 312 are stopped when first suction plate 315 releases suction from first substrate 10, a mark indicating the lamination position at that time will remain. Therefore, first suction plate 315 may release suction from first substrate 10 while continuing to move in the positive direction of the X-axis. It is preferable to decelerate the movement speed of first suction plate 315 before first suction plate 315 releases suction from first substrate 10.

[0109] After the bonding of the first laminate film 21, the first substrate 10, and the second laminate film 31 is completed, the obtained second substrate 10A is moved in the positive direction of the X-axis by the second substrate transport section 120. After the first suction plate 315 releases the suction of the first substrate 10, it moves to its original position and waits below the transport path of the first substrate 10.

[0110] While the first laminate film 21, the first substrate 10, and the second laminate film 31 are repeatedly bonded to each other, the first mark detection unit 101 detects the first alignment mark 23 before the first joining point. The control unit 190 controls the transport of the first laminate film 21 based on the detection result of the first mark detection unit 101. The control unit 190 controls at least one of the transport distance, the transport speed, and the transport time. This makes it possible to suppress misalignment of the first laminate film 21 and the first substrate 10 in the X-axis direction at the start of bonding, and to bond the first laminate film 21 and the first substrate 10 with high accuracy.

[0111] In addition, while the first laminate film 21, the first substrate 10, and the second laminate film 31 are repeatedly bonded to each other, the second mark detection unit 104 detects the second alignment mark 33 before the first joining point. The control unit 190 controls the transport of the second laminate film 31 based on the detection result of the second mark detection unit 104. The control unit 190 controls at least one of the transport distance, the transport speed, and the transport time. This makes it possible to suppress misalignment of the second laminate film 31 and the first substrate 10 in the X-axis direction at the start of bonding, and to bond the second laminate film 31 and the first substrate 10 with high accuracy.

[0112] Next, an overview of the midstream area of ​​the bonding apparatus 100 according to an embodiment will be described mainly with reference to FIG. 17. The bonding apparatus 100 includes, for example, a second substrate conveying section 120, a third film conveying section 230, and a second bonding section 320. The second substrate conveying section 120 forms a conveying path for the second substrate 10A. The third film conveying section 230 forms a conveying path for at least the third laminate film 41. The third laminate film 41 is bonded to the second main surface 12 of the first substrate 10 in place of the second laminate film 31. The point where the conveying path of the second substrate 10A and the conveying path of the third laminate film 41 join together may be referred to as the second joining point. The second bonding section 320 produces the third substrate 10B by bonding the second substrate 10A and the third laminate film 41 together at the second joining point.

[0113] The second bonding section 320 can bond the third laminate film 41 to the first substrate 10 after bonding the first laminate film 21 to the first substrate 10, independently of the bonding of the first laminate film 21 to the first substrate 10. As a result, even if the third laminate film 41 protrudes 5 mm or more from at least a part of the periphery of the second main surface 12 of the first substrate 10 and the protruding portion swings toward the first main surface 11, the first outer film 24 has already been collected and removed by the first collection section 216 in the first bonding section 310 at the front stage of the bonding device 100, so the adhesive layer 41b of the third laminate film 41 does not adhere to the adhesive layer 24b of the first outer film 24. As a result, the outer peripheral portion of the third laminate film adheres to the first outer laminate film, and it is possible to suppress the occurrence of problems in the bonding operation and the occurrence of dirt and scratches on the glass substrate.

[0114] In addition, if the first bonding section 310 bonds the first laminate film 21 to the first main surface 11 of the first substrate 10 and bonds the third laminate film 41 to the second main surface 12 of the first substrate 10, when the protruding portion of the third laminate film 41 swings toward the first main surface 11, the adhesive layer 41b of the protruding portion will adhere to the adhesive layer 24b of the first outer film 24. As a result, the first substrate 10 and the third laminate film 41 are dragged by the first outer film 24, making it difficult to continue the bonding operation in the first bonding section 310. In addition, the third laminate film 41 may protrude by 5 mm or more around the entire periphery of the second main surface 12 of the first substrate 10.

[0115] Next, the third laminate film 40 will be described mainly with reference to Fig. 18 to Fig. 21. As shown in Fig. 18, the third laminate film 40 has a third laminate film 41 and a third carrier film 42 that holds a plurality of third laminate films 41 at intervals in the transport direction. A plurality of third laminate films 41 are provided on one side of the third carrier film 42 at intervals in the longitudinal direction of the third carrier film 42.

[0116] The third laminating film 40 has a third alignment mark 43 for each third laminating film 41, which indicates the position of the third laminating film 41. The third alignment mark 43 indicates the position of the third laminating film 41 in the longitudinal direction of the third carrier film 42. One or more third alignment marks 43 are provided for each third laminating film 41. The third alignment marks 43 may be provided on both the Y-axis positive direction side and the Y-axis negative direction side of the third laminating film 41.

[0117] 19, the third laminate film 41 has a base film 41a and an adhesive layer 41b, and is adhered to one side of the third carrier film 42 with the adhesive layer 41b facing the third carrier film 42. After being peeled off from the one side of the third carrier film 42, the third laminate film 41 is attached to the second main surface 12 of the first substrate 10 with the adhesive layer 41b facing the first substrate 10, as shown in FIG.

[0118] 21 , when viewed in a direction perpendicular to the first main surface 11 or the second main surface 12 of the first substrate 10, the third laminate film 41 does not have to have a similar shape to the first substrate 10, and may have, for example, a rectangular shape. The third laminate film 41 may be larger than the first substrate 10. The third laminate film 41 protrudes from the entire periphery of the first substrate 10.

[0119] The third laminate film 41 is larger than the first substrate 10. Therefore, after the third laminate film 41 and the first substrate 10 are bonded together, the third laminate film 41 can be easily peeled off from the first substrate 10. A worker or a working robot can peel off the third laminate film 41 from the first substrate 10 while holding the portion of the third laminate film 41 protruding from the first substrate 10. Therefore, the third laminate film 41 does not need to have a pull tab.

[0120] 18 and 19, the third laminate film 40 may have a third laminate film 41 on one side of a third carrier film 42, and a third outer film 44 disposed on the outer side of the third laminate film 41. The third alignment mark 43 is provided on the third outer film 44.

[0121] 19, the third laminate film 40 is half-cut in advance, and has a slit 47 that divides the third laminate film 41 and the third carrier film 42. The slit 47 may reach one side of the third carrier film 42, but does not reach the other side of the third carrier film 42. The slit 47 need not penetrate the third carrier film 42. The slit 47 is formed along the entire periphery of the third laminate film 41.

[0122] 19, the third outer film 44 has a base film 44a and an adhesive layer 44b, and is adhered to one side of the third carrier film 42 with the adhesive layer 44b facing the third carrier film 42. The third outer film 44 is taken up around the third winding shaft 233 (see FIG. 17) together with the third carrier film 42, without being peeled off from the one side of the third carrier film 42.

[0123] Next, details of the midstream area of ​​the bonding apparatus 100 will be described with reference again mainly to Fig. 17. The bonding apparatus 100 includes, for example, a second substrate transport section 120, a third film transport section 230, a second bonding section 320, and a control section 190.

[0124] The third film transport section 230 forms, for example, a transport path for the third laminate film 41 and a transport path for the third carrier film 42. The third laminate film 41 is bonded to the second main surface 12 of the first substrate 10. The third carrier film 42 holds a plurality of the third laminate films 41 at intervals in the transport direction.

[0125] The third film transport section 230 has, for example, a third unwinding shaft 231, a third peeling body 232, and a third winding shaft 233. The third unwinding shaft 231 unwinds the third laminate film 40 that has been wound in a roll in advance. The third peeling body 232 peels the third carrier film 42 and the third laminate film 41 by folding back the third carrier film 42 before the second joining point of the transport path of the third carrier film 42. The third peeling body 232 has, for example, a wedge-shaped tip, and peels off the third carrier film 42 and the third laminate film 41 at the tip. The third winding shaft 233 winds up the third carrier film 42 folded back by the third peeling body 232 in a roll.

[0126] The third peeling body 232 folds back the third outer film 44 together with the third carrier film 42. The third winding shaft 233 winds up the third outer film 44, which has been folded back together with the third carrier film 42 by the third peeling body 232, into a roll together with the third carrier film 42. The third outer film 44 does not need to pass through the second joining point. This is because, as shown in FIG. 22, the third laminate film 41 is larger than the first substrate 10 and therefore covers the entire second main surface 12 of the first substrate 10, so there is no risk of the first substrate 10 and the second laminate roller 322 coming into contact with each other.

[0127] The third film transport section 230 may have third relay rollers 234, 235 as shown in Fig. 17. The third relay roller 234 changes the transport direction of the third laminate film 40 between the third unwinding shaft 231 and the third peeling body 232. A plurality of third relay rollers 234 may be provided. The third relay roller 235 changes the transport direction of the third carrier film 42 between the third peeling body 232 and the third winding shaft 233. A plurality of third relay rollers 235 may be provided.

[0128] It is desirable to provide a mechanism for sandwiching the third carrier film 42 between two rollers (not shown) between the third peeling body 232 and the third winding shaft 233 of the third film transport section 230 and transporting the third carrier film 42 independently of the third winding shaft 233. One of the two rollers may be driven by the other.

[0129] The third film transport section 230 may include a third individual adjustment section (not shown) similar to the second film transport section 220. Unlike the third drive section 108 described later, the third individual adjustment section moves a part of the third film transport section 230 rather than the entire third film transport section 230. The third individual adjustment section moves, for example, the third peeling body 232. The third individual adjustment section moves the third peeling body 232 in the Y-axis positive direction and the Y-axis negative direction. Furthermore, the third individual adjustment section moves the third peeling body 232 in the X-axis positive direction, the X-axis negative direction, the Z-axis positive direction, and the Z-axis negative direction, and rotates the third peeling body 232 in an angle θ Y Rotate in the direction.

[0130] The second bonding section 320 produces a third substrate 10B by bonding the second substrate 10A and the third laminate film 41 at the second joining point. The third substrate 10B has the first laminate film 21 and the third laminate film 41 with the first substrate 10 sandwiched therebetween.

[0131] The second bonding section 320 has, for example, a second laminating roller 322 and a second suction plate 325. The second laminating roller 322 and the second suction plate 325 are provided on either side of the transport path of the second substrate 10A. The second laminating roller 322 contacts the third laminating film 41. The second suction plate 325 receives the second substrate 10A from the second substrate transport section 120 by adsorbing only the first laminating film 21 bonded to the first main surface 11 of the first substrate 10 without contacting the first substrate 10 so as not to damage or soil the first substrate 10 of the second substrate 10A.

[0132] The second laminating roller 322 and the second suction plate 325 sandwich the second substrate 10A and the third laminating film 41, and in a state in which the second suction plate 325 is adsorbing the second substrate 10A, the second suction plate 325 moves in the positive direction of the X-axis relative to the second laminating roller 322. At this time, the second rotating motor 324 rotates the second laminating roller 322 as shown in Fig. 22. This allows the third laminating film 41 to be bonded to the second main surface 12 of the first substrate 10.

[0133] When the second suction plate 325 moves in the positive direction of the X-axis, the second laminating roller 322 is rotated at the same circumferential speed as the moving speed. One conveying speed (for example, the circumferential speed of the second laminating roller 322) may be 95% to 105% of the other conveying speed (for example, the moving speed of the second suction plate 325). This control is performed until the third substrate 10B is separated from the second laminating roller 322. The control unit 190 stops the rotation of the second laminating roller 322 after the third substrate 10B is separated from the second laminating roller 322. The control unit 190 continues the rotation of the second laminating roller 322 without stopping it when the bonding of the third laminating film 41 and the second substrate 10A is completed. This makes it possible to suppress the occurrence of sliding friction due to the difference in conveying speed, and to suppress the adhesion of scratches or dirt.

[0134] The second suction plate 325, as shown in Fig. 17, suctions the second substrate 10A. For example, the second suction plate 325 vacuum-suctions the second substrate 10A. The second suction plate 325 has, for example, a metal plate and a resin film covering the surface of the metal plate facing the second substrate 10A. The resin film comes into contact with the second substrate 10A. This makes it possible to prevent the second substrate 10A from being scratched. The second suction plate 325 is provided, for example, on the opposite side (for example, the upper side) of the third film transport section 230 with respect to the second substrate transport section 120.

[0135] The second bonding unit 320 may have a second position adjustment unit 326 and a second position detection unit 327. The second position adjustment unit 326 moves the second suction plate 325 in the X-axis positive direction, the X-axis negative direction, the Y-axis positive direction, the Y-axis negative direction, the Z-axis positive direction, and the Z-axis negative direction, and also detects an angle θ ZSecond position detection section 327 detects the position of second substrate 10A after second suction plate 325 has suctioned second substrate 10A and before second suction plate 325 and second lamination roller 322 sandwich second substrate 10A.

[0136] The second position detection unit 327 detects the position of the second substrate 10A, for example, by detecting the positions of each of a plurality of feature points of the second substrate 10A (more specifically, the first substrate 10 included in the second substrate 10A). The feature points of the second substrate 10A are, for example, corners of the periphery of the second main surface 12 of the first substrate 10, or corners of the boundary between the transmission region A1 and the light-shielding region A2. The second position detection unit 327 includes, for example, an image sensor and an image processing device. The image processing device detects the positions of the feature points by processing an image captured by the image sensor. The second position detection unit 327 detects the positions of the feature points in, for example, the X-axis direction, the Y-axis direction, and the θ-axis direction. Z The position of the second substrate 10A in the direction is detected.

[0137] The control unit 190 controls the second position adjustment unit 326 based on the detection result of the second position detection unit 327, thereby performing control to move or rotate the second substrate 10A to a desired position. Z The position of second substrate 10A (more specifically, first substrate 10 included in second substrate 10A) in the direction can be controlled to a desired position, and third laminate film 41 and second substrate 10A can be bonded together with high precision.

[0138] As shown in Fig. 17, the bonding apparatus 100 includes a third mark detection unit 107. The third mark detection unit 107 detects the third alignment mark 43 before the second junction of the transport path of the third laminate film 41. It is preferable that the detection position is as close to the second junction as possible. The third mark detection unit 107 is configured similarly to the first mark detection unit 101.

[0139] The third alignment mark 43 is, for example, a through hole. The third alignment mark 43 may be a notch. The through hole and the notch are formed penetrating the third laminate film 40 in the thickness direction. This makes it easier for the amount of light received by the light receiving element to change, and the third alignment mark 43 can be detected with high accuracy.

[0140] The control unit 190 controls the transport of the third laminate film 41 based on the detection result of the third mark detection unit 107. The controlled items include at least one of the transport distance, the transport speed, and the transport time. This makes it possible to suppress misalignment of the third laminate film 41 and the first substrate 10 in the X-axis direction at the start of bonding, and to bond the third laminate film 41 and the first substrate 10 with high accuracy.

[0141] It is also possible to suppress misalignment between the third laminate film 41 and the first substrate 10 in the Y-axis direction at the start of bonding. As shown in Fig. 17, the bonding apparatus 100 may include a third drive unit 108 and a third edge detection unit 109. The third drive unit 108 moves the third film transport unit 230 in the Y-axis positive direction and the Y-axis negative direction. The third drive unit 108 has, for example, a motor and a ball screw that converts the rotational motion of the motor into linear motion of the third film transport unit 230.

[0142] The third drive unit 108 moves the components of the third film transport unit 230 together, for example, the third unwinding shaft 231, the third peeling body 232, and the third winding shaft 233. While maintaining the relative positions of these components, the transport path of the third laminating film 41 and the transport path of the third carrier film 42 can be moved relative to the transport path of the second substrate 10A (including the first substrate 10).

[0143] The third edge detection unit 109 detects the edge of the third laminate film 40 in at least one of the Y-axis positive direction and the Y-axis negative direction (in this embodiment, both directions). The edge to be detected is, for example, the edge of the third carrier film 42. The third edge detection unit 109 is configured similarly to the first edge detection unit 103.

[0144] The control unit 190 controls the third drive unit 108 based on the detection result of the third edge detection unit 109 to move the third laminate film 41 in the positive Y-axis direction or the negative Y-axis direction to a desired position. This makes it possible to suppress misalignment of the third laminate film 41 and the second substrate 10A in the Y-axis direction at the start of bonding, and to bond the third laminate film 41 and the second substrate 10A with high accuracy.

[0145] The third driving unit 108 and the third edge detection unit 109 are Z The third driving unit 108 can also be used to adjust the positions of the third laminating film 41 and the second substrate 10A in the θ direction. Z The third edge detection unit 109 may detect one widthwise end of the third laminate film 40 at a plurality of locations spaced apart in the longitudinal direction of the third laminate film 40. The third edge detection unit 109 may detect the other widthwise end of the third laminate film 40 at a plurality of locations spaced apart in the longitudinal direction of the third laminate film 40. As shown in FIG. 17 , a plurality of third edge detection units 109 may be provided at intervals in the longitudinal direction of the third laminate film 40. The third edge detection unit 109 detects the inclination of the third laminate film 40 with respect to the reference direction, and based on the detection result, the third drive unit 108 controls the third film transport unit 230 to rotate in an θ Z The third edge detection unit 109 detects the inclination of the third laminate film 40 with respect to the reference direction, and based on the detection result, a second position adjustment unit 326 (described later) rotates the second substrate 10A in the θ Z It may be rotated in the direction.

[0146] The control unit 190 controls the third driving unit 108 based on the detection result of the third edge detection unit 109 to move the third laminating film 41 to a desired position by an angle θ Z Alternatively, the control unit 190 controls the second position adjustment unit 326 based on the detection result of the third edge detection unit 109 to move the second substrate 10A to a desired position in the θ direction. Z This controls the rotation in the θ direction at the start of lamination. ZThis makes it possible to suppress misalignment between the third laminate film 41 and the second substrate 10A in the direction, and allows the third laminate film 41 and the second substrate 10A to be bonded together with high precision.

[0147] Next, the operation of the midstream area of ​​the bonding device 100 will be described with reference to FIG. 23. The second suction plate 325 is in advance waiting above the transport path of the second substrate 10A, and when the second substrate 10A moves to a predetermined position in the positive direction of the X-axis and stops, the second suction plate 325 descends to adsorb the upper surface of the second substrate 10A. Next, the second suction plate 325 rises to separate the second substrate 10A upward from the second transport roller 121. Next, while the second suction plate 325 is adsorbing the second substrate 10A, the second position detection unit 327 detects the position of the second substrate 10A (more specifically, the first substrate 10 included in the second substrate 10A). Next, the control unit 190 controls the second position adjustment unit 326 based on the detection result of the second position detection unit 327 to adjust the position of the second substrate 10A in the X-axis direction, the Y-axis direction, and the θ Z The position of second substrate 10A (more specifically, first substrate 10 included in second substrate 10A) in the direction is controlled to a desired position.

[0148] Next, the second suction plate 325 moves in the X-axis positive direction while adsorbing the second substrate 10A, and then moves in the Z-axis negative direction. The second lamination roller 322 moves in the Z-axis positive direction. Then, the second lamination roller 322 and the second suction plate 325 sandwich the second substrate 10A and the third lamination film 41, and the second suction plate 325 moves in the X-axis positive direction relative to the second lamination roller 322 while adsorbing the second substrate 10A. At this time, the second rotation motor 324 rotates the second lamination roller 322. This allows the third lamination film 41 to be bonded to the second main surface 12 of the first substrate 10. While the third lamination film 41 is being bonded to the second main surface 12 of the first substrate 10, it is preferable to form a gap between the first substrate 10 and the second transport roller 121 to prevent contamination. Furthermore, while the third laminate film 41 is being bonded to the second main surface 12 of the first substrate 10, it is preferable to form a gap between the third laminate film 41 and the third transport roller 131 to prevent contamination.

[0149] When the third substrate 10B moves in the positive direction of the X-axis together with the second suction plate 325, the second laminating roller 322 is rotated at the same peripheral speed as the moving speed. This control is performed until the third substrate 10B separates from the second laminating roller 322. The control unit 190 stops the rotation of the second laminating roller 322 after the third substrate 10B separates from the second laminating roller 322. The control unit 190 continues the rotation of the second laminating roller 322 without stopping it when the bonding of the third laminating film 41 and the second substrate 10A is completed. This makes it possible to suppress the occurrence of sliding friction due to the difference in conveying speed, and to suppress the adhesion of scratches or dirt.

[0150] After the third laminate film 41 and the second substrate 10A are bonded, the second suction plate 325 moves in the negative direction of the Z axis and lowers the third substrate 10B onto the third substrate conveying section 130. Then, the second suction plate 325 releases the suction of the third substrate 10B and then moves in the positive direction of the Z axis. Then, the third substrate conveying section 130 moves the third substrate 10B in the positive direction of the X axis. After moving in the positive direction of the Z axis, the second suction plate 325 moves in the negative direction of the X axis and waits at the original position. Then, when the next second substrate 10A moves to a predetermined position in the positive direction of the X axis and stops, the second suction plate 325 again descends and suctions the upper surface of the second substrate 10A.

[0151] While the bonding of the third laminate film 41 and the second substrate 10A is being repeated, the third mark detection unit 107 detects the third alignment mark 43 before the second joining point. The control unit 190 controls the transport of the third laminate film 41 based on the detection result of the third mark detection unit 107. The control unit 190 controls at least one of the transport distance, the transport speed, and the transport time. This makes it possible to suppress misalignment of the third laminate film 41 and the second substrate 10A in the X-axis direction at the start of bonding, and to bond the third laminate film 41 and the second substrate 10A with high accuracy.

[0152] Next, mainly with reference to FIG. 24, an overview of the downstream area of ​​the bonding apparatus 100 according to an embodiment will be described. The bonding apparatus 100 includes, for example, a third substrate conveying section 130, a fourth film conveying section 240, a fifth film conveying section 250, and a third bonding section 330. The third substrate conveying section 130 forms a conveying path for the second substrate 10A. The fourth film conveying section 240 forms a conveying path for at least the fourth laminate film 51. The fourth laminate film 51 is bonded to one surface (for example, the upper surface) of the second substrate 10A. The fifth film conveying section 250 is disposed on the opposite side of the fourth film conveying section 240 with respect to the third substrate conveying section 130, and has a structure in which the fourth film conveying section 240 is inverted upside down. The fifth film conveying section 250 forms a conveying path for at least the fifth laminate film 61. The fifth laminate film 61 is bonded to the opposite surface (e.g., the lower surface) of the second substrate 10A. The point where the transport path of the second substrate 10A, the transport path of the fourth laminate film 51, and the transport path of the fifth laminate film 61 join together may be referred to as a third joining point. The third bonding section 330 bonds the second substrate 10A, the fourth laminate film 51, and the fifth laminate film 61 together at the third joining point to produce the fourth substrate 10C.

[0153] Next, the fourth laminate film 50 and the fifth laminate film 60 will be described mainly with reference to FIGS.

[0154] 25, the fourth laminate film 50 has, for example, a fourth laminate film 51 and a fourth carrier film 52 that holds the fourth laminate film 51. The fourth laminate film 51 is provided on one side of the fourth carrier film 52. The fourth laminate film 51 and the fourth carrier film 52 may have the same width (the same dimension in the Y-axis direction). The fourth laminate film 50 does not need to be half-cut. Therefore, the fourth carrier film 52 may not be provided, and the fourth laminate film 50 may have only the fourth laminate film 51.

[0155] As shown in FIG. 25, the fourth laminate film 51 has a base film 51a and an adhesive layer 51b, and is attached to one side of the fourth carrier film 52 with the adhesive layer 51b facing the fourth carrier film 52. After being peeled off from one side of the fourth carrier film 52, the fourth laminate film 51 is attached to one side of the second substrate 10A with the adhesive layer 51b facing the second substrate 10A as shown in FIG. 27, and cut to a desired size by a cutting machine 339 (see FIG. 24). After being cut, as shown in FIG. 28, the fourth laminate film 51 does not have to have a similar shape to the first substrate 10 when viewed from a direction perpendicular to one side of the second substrate 10A, and may have, for example, a rectangular shape. The fourth laminate film 51 may be larger than the first substrate 10 and may protrude from the entire periphery of the first substrate 10.

[0156] 26, the fifth laminate film 60 has, for example, a fifth laminate film 61 and a fifth carrier film 62 that holds the fifth laminate film 61. The fifth laminate film 61 is provided on one side of the fifth carrier film 62. The fifth laminate film 61 and the fifth carrier film 62 may have the same width (the same dimension in the Y-axis direction). The fifth laminate film 60 does not need to be half-cut. Therefore, the fifth carrier film 62 may not be provided, and the fifth laminate film 60 may have only the fifth laminate film 61.

[0157] As shown in FIG. 26, the fifth laminate film 61 has a base film 61a and an adhesive layer 61b, and is attached to one side of the fifth carrier film 62 with the adhesive layer 61b facing the fifth carrier film 62. After being peeled off from one side of the fifth carrier film 62, the fifth laminate film 61 is attached to the opposite side of the second substrate 10A with the adhesive layer 61b facing the second substrate 10A, as shown in FIG. 27, and cut to a desired size by a cutting machine 339 (see FIG. 24). After being cut, the fifth laminate film 61 does not have to have a similar shape to the first substrate 10 when viewed from a direction perpendicular to the opposite side of the second substrate 10A, and may have, for example, a rectangular shape. The fifth laminate film 61 may be larger than the first substrate 10 and may protrude from the entire periphery of the first substrate 10.

[0158] Next, details of the downstream area of ​​the bonding apparatus 100 will be described mainly with reference to Fig. 24 again. The bonding apparatus 100 includes, for example, a third substrate transport section 130, a fourth film transport section 240, a fifth film transport section 250, and a third bonding section 330.

[0159] The third substrate transport section 130 forms a transport path for the second substrate 10A following the second substrate transport section 120. The second substrate transport section 120 may also function as the third substrate transport section 130. In this embodiment, the second substrate 10A has the first substrate 10 and the first laminating film 21 as shown in FIG. 27, but does not have the second laminating film 31 or the third laminating film 41. However, the second substrate 10A may have the second laminating film 31 or the third laminating film 41. The second substrates 10A are arranged at intervals in the positive direction of the X-axis, and are transported in the positive direction of the X-axis either collectively or individually.

[0160] As shown in Fig. 24, the third substrate transport section 130 has a plurality of third transport rollers 131. The plurality of third transport rollers 131 are arranged at intervals in the X-axis direction. The third transport rollers 131 have, for example, a metal roller and a resin film covering the outer circumferential surface of the metal roller. The resin film comes into contact with the second substrate 10A. This can prevent the second substrate 10A from being scratched.

[0161] The third substrate transport section 130 has a third transport motor (not shown). The third transport motor rotates the third transport rollers 131. A plurality of third transport motors may rotate the plurality of third transport rollers 131 individually. Also, one third transport motor may rotate the plurality of third transport rollers 131 collectively. The third substrate transport section 130 does not need to rotate all of the third transport rollers 131 at the same time.

[0162] The third substrate transport section 130 transports the second substrate 10A in the positive direction of the X axis by rotating a plurality of third transport rollers 131. The transport speed of the second substrate 10A is equal to the circumferential speed of the third transport rollers 131. The circumferential speed is the product of the circumferential length and the rotation speed (rpm).

[0163] The third substrate transport section 130 is Z The second substrate 10A may have a positioning section (not shown) that adjusts the position of the second substrate 10A in the direction. The positioning section may have, for example, a plurality of rollers (for example, four) that come into contact with and separate from the end face of the second substrate 10A and are spaced apart along the periphery of the second substrate 10A. After the positioning section adjusts the position of the second substrate 10A, it is preferable that the third bonding section 330 bonds the fourth laminate film 51 and the fifth laminate film 61 to the second substrate 10A.

[0164] The fourth film transport section 240 forms, for example, a transport path for the fourth laminate film 51 and a transport path for the fourth carrier film 52. The fourth laminate film 51 is attached to one surface (for example, the upper surface) of the second substrate 10A. The fourth carrier film 52 holds the fourth laminate film 51.

[0165] The fourth film transport section 240 has, for example, a fourth unwinding shaft 241, a fourth peeling body 242, and a fourth winding shaft 243. The fourth unwinding shaft 241 unwinds the fourth laminate film 50 that has been wound in a roll in advance. The fourth peeling body 242 peels off the fourth carrier film 52 and the fourth laminate film 51 before the third junction of the transport path of the fourth carrier film 52. The fourth peeling body 242 includes, for example, a pair of rollers. The fourth winding shaft 243 winds up the fourth carrier film 52 peeled off by the fourth peeling body 242 in a roll.

[0166] The fourth film transport section 240 may have fourth relay rollers 244, 245, and 246. The fourth relay roller 244 changes the transport direction of the fourth laminate film 50 between the fourth unwinding shaft 241 and the fourth peeling body 242. A plurality of fourth relay rollers 244 may be provided. The fourth relay roller 245 changes the transport direction of the fourth carrier film 52 between the fourth peeling body 242 and the fourth winding shaft 243. A plurality of fourth relay rollers 245 may be provided. The fourth relay roller 246 changes the transport direction of the fourth laminate film 51 between the fourth peeling body 242 and the third bonding section 330. A plurality of fourth relay rollers 246 may be provided.

[0167] The fifth film transport section 250 forms, for example, a transport path for the fifth laminating film 61 and a transport path for the fifth carrier film 62. The fifth laminating film 61 is attached to the opposite surface (for example, the lower surface) of the second substrate 10A. The fifth carrier film 62 holds the fifth laminating film 61.

[0168] The fifth film transport section 250 has, for example, a fifth unwinding shaft 251, a fifth peeling body 252, and a fifth winding shaft 253. The fifth unwinding shaft 251 unwinds the fifth laminate film 60 that has been wound in a roll in advance. The fifth peeling body 252 peels the fifth carrier film 62 and the fifth laminate film 61 before the third junction of the transport path of the fifth carrier film 62. The fifth peeling body 252 includes, for example, a pair of rollers. The fifth winding shaft 253 winds the fifth carrier film 62 peeled by the fifth peeling body 252 in a roll.

[0169] The fifth film transport section 250 may have fifth relay rollers 254, 255, and 256. The fifth relay roller 254 changes the transport direction of the fifth laminate film 60 between the fifth unwinding shaft 251 and the fifth peeling body 252. A plurality of fifth relay rollers 254 may be provided. The fifth relay roller 255 changes the transport direction of the fifth carrier film 62 between the fifth peeling body 252 and the fifth winding shaft 253. A plurality of fifth relay rollers 255 may be provided. The fifth relay roller 256 changes the transport direction of the fifth laminate film 61 between the fifth peeling body 252 and the third bonding section 330. A plurality of fifth relay rollers 256 may be provided.

[0170] The third bonding section 330 produces a fourth substrate 10C by bonding a fourth laminate film 51 and a fifth laminate film 61 to the second substrate 10A at the third joining point. The fourth substrate 10C includes the fourth laminate film 51 and the fifth laminate film 61 with the second substrate 10A sandwiched therebetween.

[0171] The third laminating section 330 has, for example, a pair of third laminating rollers 331, 332. The pair of third laminating rollers 331, 332 sandwich and feed the fourth laminating film 51, the second substrate 10A, and the fifth laminating film 61 from the top to the bottom in this order. The third laminating section 330 may be configured similarly to the second laminating section 320.

[0172] 29, the third laminating section 330 transports the second substrate 10A in the positive direction of the X-axis by, for example, rotating a pair of third laminating rollers 331, 332. The transport speed of the second substrate 10A is equal to the circumferential speed of the pair of third laminating rollers 331, 332. The circumferential speed is the product of the circumferential length and the rotation speed (rpm). The circumferential speeds of the pair of third laminating rollers 331, 332 are equal.

[0173] The third laminating unit 330 has, for example, a pair of third rotation motors 333 and 334. The third rotation motor 333 rotates the third laminating roller 331. The third rotation motor 334 rotates the third laminating roller 332. Note that one of the third rotation motors 333 and 334 may be omitted. One of the pair of third laminating rollers 331 and 332 may be rotated passively in response to the rotation of the other roller.

[0174] After the third laminating section 330 bonds the fourth laminate film 51 and the fifth laminate film 61 to the second substrate 10A, the cutting machine 339 cuts the fourth laminate film 51 and the fifth laminate film 61. When cutting is performed after bonding, the positional accuracy of the fourth laminate film 51 relative to the second substrate 10A and the positional accuracy of the fifth laminate film 61 relative to the second substrate 10A during bonding may be loose.

[0175] By arranging the third laminating section 330 in series on the downstream side of the first laminating section 310 in this way, the fourth laminating film 51 and the fifth laminating film 61 can be continuously laminated to the second substrate 10A, and a large number of fourth substrates 10C can be produced in a short time, which contributes to shortening the tact time. In addition, after the second substrate 10A is produced, the fourth laminating film 51 and the fifth laminating film 61 can be intermittently laminated instead of continuously laminated, which reduces the chance of contact with the second substrate 10A by equipment members or human hands, and suppresses the occurrence of dirt and scratches on the second substrate 10A and the first substrate 10. Note that even if the second laminating section 320 is arranged between the first laminating section 310 and the third laminating section 330, there is no hindrance to shortening the tact time.

[0176] Incidentally, the operation of the downstream area of ​​the bonding apparatus 100 is a general one, and therefore illustration and description thereof will be omitted.

[0177] The following supplementary notes are disclosed regarding the above-described embodiments.

[0178] [Appendix 1] a first substrate transport section that forms a transport path for a first substrate having a first main surface and a second main surface facing opposite to the first main surface; a first film transport section that forms a transport path for a first laminate film that is bonded to the first main surface of the first substrate, and a transport path for a first carrier film that holds a plurality of the first laminate films at intervals in the transport direction; a first bonding unit that prepares a second substrate by bonding the first substrate and the first laminate film at a first junction where a transport path of the first substrate and a transport path of the first laminate film join; Equipped with the first laminating film and the first carrier film constitute a first laminate film; the first laminate film has a first alignment mark for each of the first laminate films that indicates the position of the first laminate film; a first mark detection unit that detects the first alignment mark before the first joining point of the transport path of the first laminate film; A control unit that controls the transport of the first laminating film based on a detection result of the first mark detection unit; A bonding apparatus comprising:

[0179] [Appendix 2] 2. The bonding apparatus according to claim 1, wherein the first alignment mark is a through hole or a notch formed penetrating the first laminate film in a thickness direction thereof.

[0180] [Appendix 3] the first film transport section includes a first unwinding shaft that unwinds the first laminate film that has been wound in a roll in advance, a first peeling body that peels off the first carrier film and the first laminate film by folding back the first carrier film before the first junction of the transport path of the first carrier film, and a first winding shaft that winds up the first carrier film folded back by the first peeling body in a roll, A transport direction of the first substrate in the first substrate transport unit is defined as a first direction, a direction opposite to the first direction is defined as a second direction, a direction parallel to the first main surface of the first substrate and perpendicular to the first direction is defined as a third direction, a direction opposite to the third direction is defined as a fourth direction, a direction perpendicular to the first main surface of the first substrate is defined as a fifth direction, and a direction opposite to the fifth direction is defined as a sixth direction. The bonding device described in Appendix 1 or 2, further comprising: a first drive unit that moves the first film transport unit in the third direction and the fourth direction; a first edge detection unit that detects an edge of the first laminate film in at least one of the third direction and the fourth direction; and a control unit that controls the first drive unit based on a detection result of the first edge detection unit, thereby controlling the movement of the first laminate film in the third direction or the fourth direction to a desired position.

[0181] [Appendix 4] the first drive section rotates the first film transport section when viewed from the fifth direction or the sixth direction, The bonding device according to claim 3, wherein the control unit controls the first drive unit based on a detection result of the first edge detection unit, thereby controlling the rotation of the first laminating film to a desired position.

[0182] [Appendix 5] A transport direction of the first substrate in the first substrate transport unit is defined as a first direction, a direction opposite to the first direction is defined as a second direction, a direction parallel to the first main surface of the first substrate and perpendicular to the first direction is defined as a third direction, a direction opposite to the third direction is defined as a fourth direction, a direction perpendicular to the first main surface of the first substrate is defined as a fifth direction, and a direction opposite to the fifth direction is defined as a sixth direction. The bonding device described in any one of Appendices 1 to 4, wherein the first film transport section has a first peeling body that peels off the first carrier film and the first laminate film by folding back the first carrier film before the first junction of the transport path of the first carrier film, and a first individual adjustment section that moves the first peeling body in the third direction and the fourth direction.

[0183] [Appendix 6] A transport direction of the first substrate in the first substrate transport unit is defined as a first direction, a direction opposite to the first direction is defined as a second direction, a direction parallel to the first main surface of the first substrate and perpendicular to the first direction is defined as a third direction, a direction opposite to the third direction is defined as a fourth direction, a direction perpendicular to the first main surface of the first substrate is defined as a fifth direction, and a direction opposite to the fifth direction is defined as a sixth direction. The bonding device described in any one of Appendices 1 to 5, wherein the first film transport unit includes a first peeling body that peels off the first carrier film and the first laminate film by folding back the first carrier film before the first junction of the transport path of the first carrier film, and a first individual adjustment unit that moves the first peeling body in the first direction, the second direction, the fifth direction, and the sixth direction and rotates the first peeling body when viewed from the third direction or the fourth direction.

[0184] [Appendix 7] the first bonding unit has a pair of first lamination rollers that sandwich and feed the first substrate and the first laminate film, and a first suction plate that suctions the first substrate, The bonding device according to any one of claims 1 to 6, wherein the first suction plate adsorbs the first substrate from the time the first suction plate receives the first substrate from the first substrate transport section until at least one pair of the first lamination rollers sandwich the first substrate.

[0185] [Appendix 8] A transport direction of the first substrate in the first substrate transport unit is defined as a first direction, a direction opposite to the first direction is defined as a second direction, a direction parallel to the first main surface of the first substrate and perpendicular to the first direction is defined as a third direction, a direction opposite to the third direction is defined as a fourth direction, a direction perpendicular to the first main surface of the first substrate is defined as a fifth direction, and a direction opposite to the fifth direction is defined as a sixth direction. the first bonding unit has a first position adjustment unit that moves the first suction plate in the first direction, the second direction, the third direction, the fourth direction, the fifth direction, and the sixth direction and rotates the first suction plate when viewed from the fifth direction or the sixth direction, and a first position detection unit that detects a position of the first substrate after the first suction plate has adsorbed the first substrate and before the first substrate is sandwiched between the pair of first lamination rollers, The bonding apparatus according to claim 7, further comprising a control unit that controls the first position adjustment unit based on a detection result of the first position detection unit, thereby moving or rotating the first substrate to a desired position.

[0186] [Appendix 9] the first bonding unit has a pair of first lamination rollers that sandwich and feed the first substrate and the first lamination film, The bonding apparatus includes a second substrate transport unit that forms a transport path for the second substrate prepared in the first bonding unit, and a control unit that individually controls a transport speed of the second substrate in the first bonding unit and the second substrate transport unit, The bonding device according to any one of claims 1 to 8, wherein the control unit controls the pair of first laminating rollers and the second substrate transport unit to operate at the same transport speed until the second substrate separates from the pair of first laminating rollers.

[0187] [Appendix 10] the first bonding unit has a pair of first lamination rollers that sandwich and feed the first substrate and the first lamination film, The first laminate film has the first laminate film on one side of the first carrier film, and a first outer film disposed on the outer side of the first laminate film, After the first substrate and the first laminate film are bonded to each other, a part of the first main surface of the first substrate is exposed from the first laminate film. The bonding device is described in any one of Appendices 1 to 9, and is provided with a first recovery section that recovers the first outer film separately from the first substrate and the first laminate film after the first outer film and the first laminate film pass through a pair of the first laminate rollers while simultaneously contacting the first substrate and the first laminate roller.

[0188] [Appendix 11] The bonding device according to any one of appendixes 1 to 10, wherein the first bonding section has a first laminating roller that contacts the second main surface of the first substrate, and a cleaning roller that contacts the outer circumferential surface of the first laminating roller to remove foreign matter from the outer circumferential surface while the outer circumferential surface of the first laminating roller is in contact with the first substrate.

[0189] [Appendix 12] a second film transport section that forms a transport path for a second laminate film that is bonded to the second main surface of the first substrate, and a transport path for a second carrier film that holds a plurality of the second laminate films at intervals in the transport direction; the first laminating section has a pair of first laminating rollers that sandwich and feed the first laminating film, the first substrate, and the second laminating film; 11. The bonding apparatus according to any one of claims 1 to 10, wherein the second substrate has the first laminate film and the second laminate film sandwiching the first substrate.

[0190] [Appendix 13] A second substrate transport section that forms a transport path for the second substrate produced in the first bonding section; a third film transport section that forms a transport path for a third laminate film that is bonded to the second main surface of the first substrate, and a transport path for a third carrier film that holds a plurality of the third laminate films at intervals in the transport direction; a second bonding section that bonds the second substrate and the third laminate film at a second joining point where the transport path of the second substrate and the transport path of the third laminate film join to produce a third substrate; Equipped with 12. The bonding apparatus according to any one of claims 1 to 11, wherein the third laminating film protrudes from at least a part of the periphery of the second main surface of the first substrate by 5 mm or more.

[0191] [Appendix 14] the third laminating film and the third carrier film constitute a third laminate film, The third laminate film has the third laminate film on one side of the third carrier film and a third outer film disposed on the outer side of the third laminate film, The bonding device described in Appendix 13, wherein the third film transport section includes a third unwinding shaft that unwinds the third laminate film that has been wound in a roll in advance, a third peeling body that peels off the third carrier film and the third laminate film by folding back the third carrier film before the second junction of the transport path of the third carrier film, and a third winding shaft that winds up the third outer film that has been folded back together with the third carrier film by the third peeling body into a roll together with the third carrier film.

[0192] [Appendix 15] the second bonding unit has a second suction plate that adsorbs the first laminate film without contacting the first substrate and receives the second substrate from the second substrate transport unit, and a second laminate roller that contacts the third laminate film, The bonding device according to claim 13 or 14, wherein the second suction plate and the second laminating roller sandwich the second substrate and the third laminating film, and the second suction plate moves relative to the second laminating roller while adsorbing the second substrate.

[0193] [Appendix 16] A transport direction of the second substrate in the second substrate transport unit is defined as a first direction, a direction opposite to the first direction is defined as a second direction, a direction parallel to the first main surface of the first substrate and perpendicular to the first direction is defined as a third direction, a direction opposite to the third direction is defined as a fourth direction, a direction perpendicular to the first main surface of the first substrate is defined as a fifth direction, and a direction opposite to the fifth direction is defined as a sixth direction. the second bonding unit has a second position adjustment unit that moves the second suction plate in the first direction, the second direction, the third direction, the fourth direction, the fifth direction, and the sixth direction and rotates the second suction plate when viewed from the fifth direction or the sixth direction, and a second position detection unit that detects a position of the second substrate after the second suction plate has adsorbed the second substrate and before the second suction plate and the second lamination roller sandwich the second substrate, The bonding device according to claim 15, further comprising a control unit that controls the second position adjustment unit based on a detection result of the second position detection unit, thereby moving or rotating the second suction plate to a desired position.

[0194] [Appendix 17] a third substrate transport unit that forms a transport path for the second substrate produced in the first bonding unit; a fourth film transport section that forms a transport path for a fourth laminate film that is to be bonded to one surface of the second substrate; A fifth film transport section that forms a transport path for a fifth laminate film that is to be bonded to the opposite surface of the second substrate; a third laminating unit that manufactures a fourth substrate by laminating the fourth laminating film and the fifth laminating film to the second substrate at a third junction where the transport path of the second substrate, the transport path of the fourth laminating film, and the transport path of the fifth laminating film join; 17. The bonding device according to any one of claims 1 to 16, wherein the third bonding section has a pair of third laminating rollers that sandwich and feed out the fourth laminating film, the second substrate, and the fifth laminating film.

[0195] [Appendix 18] 18. A bonding method comprising: bonding the first substrate and the first laminate film together using the bonding apparatus according to any one of claims 1 to 17.

[0196] [Appendix 19] a first substrate transport section that forms a transport path for a first substrate having a first main surface and a second main surface facing opposite to the first main surface; a first film transport section that forms a transport path for a first laminate film that is bonded to the first main surface of the first substrate, and a transport path for a first carrier film that holds a plurality of the first laminate films at intervals in the transport direction; a first bonding unit that prepares a second substrate by bonding the first substrate and the first laminate film at a first junction where a transport path of the first substrate and a transport path of the first laminate film join; Equipped with the first laminating film and the first carrier film constitute a first laminate film; the first film transport section includes a first unwinding shaft that unwinds the first laminate film that has been wound in a roll in advance, a first peeling body that peels off the first carrier film and the first laminate film by folding back the first carrier film before the first junction of the transport path of the first carrier film, and a first winding shaft that winds up the first carrier film folded back by the first peeling body in a roll, A transport direction of the first substrate in the first substrate transport unit is defined as a first direction, a direction opposite to the first direction is defined as a second direction, a direction parallel to the first main surface of the first substrate and perpendicular to the first direction is defined as a third direction, a direction opposite to the third direction is defined as a fourth direction, a direction perpendicular to the first main surface of the first substrate is defined as a fifth direction, and a direction opposite to the fifth direction is defined as a sixth direction. a first drive unit that moves the first film transport unit in the third direction and the fourth direction; a first edge detection unit that detects an edge of the first laminate film in at least one of the third direction and the fourth direction; and a control unit that controls the first drive unit based on a detection result of the first edge detection unit, thereby controlling the movement of the first laminate film in the third direction or the fourth direction to a desired position.

[0197] [Appendix 20] the first drive section rotates the first film transport section when viewed from the fifth direction or the sixth direction, The bonding device according to claim 19, wherein the control unit controls the first drive unit based on the detection result of the first edge detection unit, thereby controlling the rotation of the first laminating film to a desired position.

[0198] [Appendix 21] a first substrate transport section that forms a transport path for a first substrate having a first main surface and a second main surface facing opposite to the first main surface; a first film transport section that forms a transport path for a first laminate film that is bonded to the first main surface of the first substrate, and a transport path for a first carrier film that holds a plurality of the first laminate films at intervals in the transport direction; a first bonding unit that prepares a second substrate by bonding the first substrate and the first laminate film at a first junction where a transport path of the first substrate and a transport path of the first laminate film join; Equipped with the first laminating film and the first carrier film constitute a first laminate film; A transport direction of the first substrate in the first substrate transport unit is defined as a first direction, a direction opposite to the first direction is defined as a second direction, a direction parallel to the first main surface of the first substrate and perpendicular to the first direction is defined as a third direction, a direction opposite to the third direction is defined as a fourth direction, a direction perpendicular to the first main surface of the first substrate is defined as a fifth direction, and a direction opposite to the fifth direction is defined as a sixth direction. The first film transport section of the bonding device has a first peeling body that peels off the first carrier film and the first laminate film by folding back the first carrier film before the first junction of the transport path of the first carrier film, and a first individual adjustment section that moves the first peeling body in the third direction and the fourth direction.

[0199] [Appendix 22] 22. The bonding device according to claim 21, wherein the first individual adjustment unit moves the first peeling body in the first direction, the second direction, the fifth direction, and the sixth direction, and rotates the first peeling body when viewed from the third direction or the fourth direction.

[0200] [Appendix 23] a first substrate transport section that forms a transport path for a first substrate having a first main surface and a second main surface facing opposite to the first main surface; a first film transport section that forms a transport path for a first laminate film that is bonded to the first main surface of the first substrate, and a transport path for a first carrier film that holds a plurality of the first laminate films at intervals in the transport direction; a first bonding unit that prepares a second substrate by bonding the first substrate and the first laminate film at a first junction where a transport path of the first substrate and a transport path of the first laminate film join; Equipped with the first laminating film and the first carrier film constitute a first laminate film; the first bonding unit has a pair of first lamination rollers that sandwich and feed the first substrate and the first laminate film, and a first suction plate that suctions the first substrate, A bonding device, wherein the first suction plate adsorbs the first substrate from the first substrate transport unit until at least one pair of the first lamination rollers sandwich the first substrate.

[0201] [Appendix 24] A transport direction of the first substrate in the first substrate transport unit is defined as a first direction, a direction opposite to the first direction is defined as a second direction, a direction parallel to the first main surface of the first substrate and perpendicular to the first direction is defined as a third direction, a direction opposite to the third direction is defined as a fourth direction, a direction perpendicular to the first main surface of the first substrate is defined as a fifth direction, and a direction opposite to the fifth direction is defined as a sixth direction. the first bonding unit has a first position adjustment unit that moves the first suction plate in the first direction, the second direction, the third direction, the fourth direction, the fifth direction, and the sixth direction and rotates the first suction plate when viewed from the fifth direction or the sixth direction, and a first position detection unit that detects a position of the first substrate after the first suction plate has adsorbed the first substrate and before the first substrate is sandwiched between the pair of first lamination rollers, The bonding apparatus according to claim 23, further comprising a control unit that controls the first position adjustment unit based on a detection result of the first position detection unit, thereby moving or rotating the first substrate to a desired position.

[0202] [Appendix 25] a first substrate transport section that forms a transport path for a first substrate having a first main surface and a second main surface facing opposite to the first main surface; a first film transport section that forms a transport path for a first laminate film that is bonded to the first main surface of the first substrate, and a transport path for a first carrier film that holds a plurality of the first laminate films at intervals in the transport direction; a first bonding unit that prepares a second substrate by bonding the first substrate and the first laminate film at a first junction where a transport path of the first substrate and a transport path of the first laminate film join; Equipped with the first laminating film and the first carrier film constitute a first laminate film; the first bonding unit has a pair of first lamination rollers that sandwich and feed the first substrate and the first lamination film, The first laminate film has the first laminate film on one side of the first carrier film, and a first outer film disposed on the outer side of the first laminate film, After the first substrate and the first laminate film are bonded to each other, a part of the first main surface of the first substrate is exposed from the first laminate film. The bonding device includes a first recovery section that recovers the first outer film separately from the first substrate and the first laminate film after the first outer film and the first laminate film pass through a pair of first laminate rollers while simultaneously contacting the first substrate and the first laminate roller.

[0203] [Appendix 26] a first substrate transport section that forms a transport path for a first substrate having a first main surface and a second main surface facing opposite to the first main surface; a first film transport section that forms a transport path for a first laminate film that is bonded to the first main surface of the first substrate, and a transport path for a first carrier film that holds a plurality of the first laminate films at intervals in the transport direction; a first bonding unit that prepares a second substrate by bonding the first substrate and the first laminate film at a first junction where a transport path of the first substrate and a transport path of the first laminate film join; Equipped with the first laminating film and the first carrier film constitute a first laminate film; The first bonding unit includes a first laminating roller that contacts the second main surface of the first substrate, and a cleaning roller that contacts the outer circumferential surface of the first laminating roller to remove foreign matter from the outer circumferential surface while the outer circumferential surface of the first laminating roller is in contact with the first substrate.

[0204] [Appendix 27] a first substrate transport section that forms a transport path for a first substrate having a first main surface and a second main surface facing opposite to the first main surface; a first film transport section that forms a transport path for a first laminate film that is bonded to the first main surface of the first substrate, and a transport path for a first carrier film that holds a plurality of the first laminate films at intervals in the transport direction; a first bonding unit that prepares a second substrate by bonding the first substrate and the first laminate film at a first junction where a transport path of the first substrate and a transport path of the first laminate film join; Equipped with the first laminating film and the first carrier film constitute a first laminate film; A second substrate transport section that forms a transport path for the second substrate produced in the first bonding section; a third film transport section that forms a transport path for a third laminate film that is bonded to the second main surface of the first substrate, and a transport path for a third carrier film that holds a plurality of the third laminate films at intervals in the transport direction; a second bonding section that bonds the second substrate and the third laminate film at a second joining point where the transport path of the second substrate and the transport path of the third laminate film join to produce a third substrate; Equipped with The third laminating film protrudes from at least a portion of the periphery of the second main surface of the first substrate by 5 mm or more.

[0205] [Appendix 28] the third laminating film and the third carrier film constitute a third laminate film, The third laminate film has the third laminate film on one side of the third carrier film and a third outer film disposed on the outer side of the third laminate film, The bonding device described in Appendix 27, wherein the third film transport section includes a third unwinding shaft that unwinds the third laminate film that has been wound in a roll in advance, a third peeling body that peels off the third carrier film and the third laminate film by folding back the third carrier film before the second junction of the transport path of the third carrier film, and a third winding shaft that winds up the third outer film folded back together with the third carrier film by the third peeling body into a roll together with the third carrier film.

[0206] [Appendix 29] the second bonding unit has a second suction plate that adsorbs the first laminate film without contacting the first substrate and receives the second substrate from the second substrate transport unit, and a second laminate roller that contacts the third laminate film, The bonding device described in Appendix 27 or 28, wherein the second suction plate and the second laminating roller sandwich the second substrate and the third laminating film, and the second suction plate moves relative to the second laminating roller while adsorbing the second substrate.

[0207] [Appendix 30] A transport direction of the second substrate in the second substrate transport unit is defined as a first direction, a direction opposite to the first direction is defined as a second direction, a direction parallel to the first main surface of the first substrate and perpendicular to the first direction is defined as a third direction, a direction opposite to the third direction is defined as a fourth direction, a direction perpendicular to the first main surface of the first substrate is defined as a fifth direction, and a direction opposite to the fifth direction is defined as a sixth direction. the second bonding unit has a second position adjustment unit that moves the second suction plate in the first direction, the second direction, the third direction, the fourth direction, the fifth direction, and the sixth direction and rotates the second suction plate when viewed from the fifth direction or the sixth direction, and a second position detection unit that detects a position of the second substrate after the second suction plate has adsorbed the second substrate and before the second suction plate and the second lamination roller sandwich the second substrate, The bonding device according to claim 29, further comprising a control unit that controls the second position adjustment unit based on a detection result of the second position detection unit, thereby controlling the second suction plate to move or rotate to a desired position.

[0208] [Appendix 31] A bonding method comprising: bonding the first substrate and the first laminate film together using the bonding apparatus according to any one of claims 19 to 30.

[0209] The lamination device and lamination method according to the present disclosure have been described above, but the present disclosure is not limited to the above-mentioned embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These naturally fall within the technical scope of the present disclosure. [Explanation of symbols]

[0210] 10 first substrate, 10A second substrate, 10B third substrate, 10C fourth substrate, 11 first main surface, 12 second main surface, 20 first laminate film, 21 first laminate film, 21a base film, 21b adhesive layer, 22 first carrier film, 23 first alignment mark, 24 first outer film, 24a base film, 24b adhesive layer, 27 cut, 30 second laminate film, 31 second laminate film, 31a base film, 31b adhesive layer, 32 second carrier film, 33 second alignment mark, 34 second outer film, 34a base film, 34b adhesive layer, 37 cut, 40 third laminate film, 41 third laminate film, 41a base film, 41b adhesive layer, 42 third carrier film, 43 third alignment mark, 44 Third outer film, 44a base film, 44b adhesive layer, 47 cut, 50 fourth laminate film, 51 fourth laminate film, 51a base film, 51b adhesive layer, 52 fourth carrier film, 60 fifth laminate film, 61 fifth laminate film, 61a base film, 61b adhesive layer, 62 fifth carrier film, 100 bonding device, 101 first mark detection unit, 102 first drive unit, 103 first edge detection unit, 104 second mark detection unit, 105 second drive unit, 106 second edge detection unit, 107 third mark detection unit, 108 third drive unit, 109 third edge detection unit, 110 first substrate transport unit, 111 first transport roller, 120 second substrate transport unit, 121 second transport roller, 130 third substrate transport unit, 131 third transport roller, 190 Control unit, 210, first film transport unit, 211, first unwinding shaft, 212, first peeling body, 213, first winding shaft, 214, first relay roller, 215, first relay roller, 216, first collection unit, 217, first individual adjustment unit, 220, second film transport unit, 221, second unwinding shaft, 222, second peeling body, 223, second winding shaft, 224, second relay roller, 225, second relay roller, 226, second collection unit, 227, second individual adjustment unit, 230, third film transport unit, 231, third unwinding shaft, 232, third peeling body, 233, third winding shaft, 234, third relay roller, 235, third relay roller, 240, fourth film transport unit, 241, fourth unwinding shaft, 242, fourth peeling body, 2434th winding shaft, 244 4th relay roller, 245 4th relay roller, 246 4th relay roller, 250 5th film transport section, 251 5th winding output shaft, 252 5th peeling body, 253 5th winding shaft, 254 5th relay roller, 255 5th relay roller, 256 5th relay roller, 310 1st bonding section, 311 1st laminating roller, 312 1st laminating roller, 313 1st rotating motor, 314 1st rotating motor, 315 1st suction plate, 316 1st position adjustment section, 317 1st position detection section, 318 cleaning roller, 320 2nd bonding section, 322 2nd laminating roller, 324 2nd rotating motor, 325 2nd suction plate, 326 2nd position adjustment section, 327 2nd position detection section, 330 3rd bonding section, 331 3rd laminating roller, 332 3rd lamination roller, 333 3rd rotating motor, 334 3rd rotating motor, 339 cutting machine, A1 transparent area, A2 light-shielding area, VL conveying speed, VS conveying speed

Claims

1. a first substrate transport section that forms a transport path for a first substrate having a first main surface and a second main surface facing opposite to the first main surface; a first film transport section that forms a transport path for a first laminate film that is bonded to the first main surface of the first substrate, and a transport path for a first carrier film that holds a plurality of the first laminate films at intervals in the transport direction; a first bonding section that bonds the first substrate and the first laminate film at a first joining point where a conveying path of the first substrate and a conveying path of the first laminate film join to produce a second substrate; Equipped with The first laminate film and the first carrier film constitute a first laminate film, the first laminate film has a first alignment mark for each of the first laminate films indicating a position of the first laminate film; a first mark detection unit that detects the first alignment mark before the first joining point of the transport path of the first laminate film; A control unit that controls the transport of the first laminating film based on a detection result of the first mark detection unit; A bonding apparatus comprising:

2. The bonding apparatus according to claim 1 , wherein the first alignment mark is a through hole or a notch formed penetrating the first laminated film in a thickness direction thereof.

3. the first film transport section includes a first unwinding shaft that unwinds the first laminate film that has been wound in a roll in advance, a first peeling body that peels off the first carrier film and the first laminate film by folding back the first carrier film before the first joining point of the transport path of the first carrier film, and a first winding shaft that winds up the first carrier film folded back by the first peeling body in a roll, A transport direction of the first substrate in the first substrate transport unit is defined as a first direction, a direction opposite to the first direction is defined as a second direction, a direction parallel to the first main surface of the first substrate and perpendicular to the first direction is defined as a third direction, a direction opposite to the third direction is defined as a fourth direction, a direction perpendicular to the first main surface of the first substrate is defined as a fifth direction, and a direction opposite to the fifth direction is defined as a sixth direction. The bonding device according to claim 1 or 2, further comprising: a first drive unit that moves the first film transport unit in the third direction and the fourth direction; a first edge detection unit that detects an edge of the first laminate film in at least one of the third direction and the fourth direction; and a control unit that controls the first drive unit based on the detection result of the first edge detection unit, thereby controlling the movement of the first laminate film in the third direction or the fourth direction to a desired position.

4. the first drive section rotates the first film transport section when viewed from the fifth direction or the sixth direction, The bonding device according to claim 3 , wherein the control unit controls the first drive unit based on a detection result of the first edge detection unit, thereby performing control to rotate the first laminating film to a desired position.

5. A transport direction of the first substrate in the first substrate transport unit is defined as a first direction, a direction opposite to the first direction is defined as a second direction, a direction parallel to the first main surface of the first substrate and perpendicular to the first direction is defined as a third direction, a direction opposite to the third direction is defined as a fourth direction, a direction perpendicular to the first main surface of the first substrate is defined as a fifth direction, and a direction opposite to the fifth direction is defined as a sixth direction. The bonding device described in claim 1 or 2, wherein the first film transport section has a first peeling body that peels off the first carrier film and the first laminate film by folding back the first carrier film before the first junction point of the transport path of the first carrier film, and a first individual adjustment section that moves the first peeling body in the third direction and the fourth direction.

6. A transport direction of the first substrate in the first substrate transport unit is defined as a first direction, a direction opposite to the first direction is defined as a second direction, a direction parallel to the first main surface of the first substrate and perpendicular to the first direction is defined as a third direction, a direction opposite to the third direction is defined as a fourth direction, a direction perpendicular to the first main surface of the first substrate is defined as a fifth direction, and a direction opposite to the fifth direction is defined as a sixth direction. The bonding device described in claim 1 or 2, wherein the first film transport unit includes a first peeling body that peels off the first carrier film and the first laminate film by folding back the first carrier film before the first junction of the transport path of the first carrier film, and a first individual adjustment unit that moves the first peeling body in the first direction, the second direction, the fifth direction, and the sixth direction and rotates the first peeling body when viewed from the third direction or the fourth direction.

7. the first bonding unit has a pair of first lamination rollers that sandwich and feed the first substrate and the first laminate film, and a first suction plate that suctions the first substrate, 3. The bonding device according to claim 1, wherein the first suction plate adsorbs the first substrate from the first substrate transport section until at least one pair of the first lamination rollers sandwich the first substrate.

8. A transport direction of the first substrate in the first substrate transport unit is defined as a first direction, a direction opposite to the first direction is defined as a second direction, a direction parallel to the first main surface of the first substrate and perpendicular to the first direction is defined as a third direction, a direction opposite to the third direction is defined as a fourth direction, a direction perpendicular to the first main surface of the first substrate is defined as a fifth direction, and a direction opposite to the fifth direction is defined as a sixth direction. the first bonding unit has a first position adjustment unit that moves the first suction plate in the first direction, the second direction, the third direction, the fourth direction, the fifth direction, and the sixth direction and rotates the first suction plate when viewed from the fifth direction or the sixth direction, and a first position detection unit that detects a position of the first substrate after the first suction plate has adsorbed the first substrate and before the first substrate is sandwiched between the pair of first lamination rollers, The bonding apparatus according to claim 7, further comprising a control unit that controls the first position adjustment unit based on a detection result of the first position detection unit to move or rotate the first substrate to a desired position.

9. The first bonding unit has a pair of first lamination rollers that sandwich and feed the first substrate and the first laminate film, The bonding apparatus includes a second substrate transport unit that forms a transport path for the second substrate prepared in the first bonding unit, and a control unit that individually controls a transport speed of the second substrate in the first bonding unit and the second substrate transport unit, The bonding apparatus according to claim 1 or 2, wherein the control unit controls the pair of first laminating rollers and the second substrate transport unit to operate at the same transport speed until the second substrate separates from the pair of first laminating rollers.

10. The first bonding unit has a pair of first lamination rollers that sandwich and feed the first substrate and the first laminate film, The first laminate film has the first laminate film on one side of the first carrier film and a first outer film disposed on the outer side of the first laminate film, After the first substrate and the first laminate film are bonded to each other, a part of the first main surface of the first substrate is exposed from the first laminate film. The bonding device according to claim 1 or 2, further comprising a first recovery section that recovers the first outer film separately from the first substrate and the first laminate film after the first outer film and the first laminate film pass through a pair of the first laminate rollers while simultaneously contacting the first substrate and the first laminate roller.

11. 3. The bonding device according to claim 1 or 2, wherein the first bonding section comprises: a first laminating roller that contacts the second main surface of the first substrate; and a cleaning roller that contacts the outer circumferential surface of the first laminating roller to remove foreign matter from the outer circumferential surface while the outer circumferential surface of the first laminating roller is in contact with the first substrate.

12. a second film transport section that forms a transport path for a second laminate film that is bonded to the second main surface of the first substrate, and a transport path for a second carrier film that holds a plurality of the second laminate films at intervals in the transport direction; The first lamination unit has a pair of first lamination rollers that sandwich and feed the first lamination film, the first substrate, and the second lamination film, The bonding apparatus according to claim 1 , wherein the second substrate has the first laminate film and the second laminate film sandwiching the first substrate therebetween.

13. a second substrate transport unit that forms a transport path for the second substrate produced in the first bonding unit; a third film transport section that forms a transport path for a third laminate film that is bonded to the second main surface of the first substrate, and a transport path for a third carrier film that holds a plurality of the third laminate films at intervals in the transport direction; a second bonding unit that manufactures a third substrate by bonding the second substrate and the third laminate film at a second joining point where the transport path of the second substrate and the transport path of the third laminate film join; Equipped with The bonding apparatus according to claim 1 , wherein the third laminate film protrudes from at least a portion of a periphery of the second main surface of the first substrate by 5 mm or more.

14. The third laminating film and the third carrier film constitute a third laminate film, The third laminate film has the third laminate film on one side of the third carrier film and a third outer film arranged on the outer side of the third laminate film, 14. The bonding device according to claim 13, wherein the third film transport section includes a third unwinding shaft that unwinds the third laminate film that has been wound in a roll in advance, a third peeling body that peels off the third carrier film and the third laminate film by folding back the third carrier film before the second junction of the transport path of the third carrier film, and a third winding shaft that winds up the third outer film folded back together with the third carrier film by the third peeling body into a roll together with the third carrier film.

15. the second bonding unit has a second suction plate that adsorbs the first laminate film without contacting the first substrate and receives the second substrate from the second substrate transport unit, and a second lamination roller that contacts the third laminate film, The bonding device according to claim 13, wherein the second suction plate and the second laminating roller sandwich the second substrate and the third laminating film, and the second suction plate moves relative to the second laminating roller while adsorbing the second substrate.

16. A transport direction of the second substrate in the second substrate transport unit is defined as a first direction, a direction opposite to the first direction is defined as a second direction, a direction parallel to the first main surface of the first substrate and perpendicular to the first direction is defined as a third direction, a direction opposite to the third direction is defined as a fourth direction, a direction perpendicular to the first main surface of the first substrate is defined as a fifth direction, and a direction opposite to the fifth direction is defined as a sixth direction. the second bonding unit has a second position adjustment unit that moves the second suction plate in the first direction, the second direction, the third direction, the fourth direction, the fifth direction, and the sixth direction and rotates the second suction plate when viewed from the fifth direction or the sixth direction, and a second position detection unit that detects a position of the second substrate after the second suction plate has adsorbed the second substrate and before the second suction plate and the second lamination roller sandwich the second substrate, The bonding device according to claim 15, further comprising a control unit that controls the second position adjustment unit based on a detection result of the second position detection unit, thereby controlling the second suction plate to move or rotate to a desired position.

17. a third substrate transport unit that forms a transport path for the second substrate produced in the first bonding unit; a fourth film transport section that forms a transport path for a fourth laminate film that is to be bonded to one surface of the second substrate; A fifth film transport section that forms a transport path for a fifth laminate film that is to be bonded to the opposite surface of the second substrate; a third bonding unit that bonds the fourth laminate film and the fifth laminate film to the second substrate at a third junction where the transport path of the second substrate, the transport path of the fourth laminate film, and the transport path of the fifth laminate film join, to produce a fourth substrate; The bonding device according to claim 1 or 2, wherein the third bonding section has a pair of third laminating rollers that sandwich and feed out the fourth laminating film, the second substrate, and the fifth laminating film.

18. a first substrate transport section that forms a transport path for a first substrate having a first main surface and a second main surface facing opposite to the first main surface; a first film transport section that forms a transport path for a first laminate film that is bonded to the first main surface of the first substrate, and a transport path for a first carrier film that holds a plurality of the first laminate films at intervals in the transport direction; a first bonding section that bonds the first substrate and the first laminate film at a first joining point where a conveying path of the first substrate and a conveying path of the first laminate film join to produce a second substrate; Equipped with The first laminate film and the first carrier film constitute a first laminate film, the first bonding unit has a pair of first lamination rollers that sandwich and feed the first substrate and the first laminate film, and a first suction plate that suctions the first substrate, A bonding device, wherein the first suction plate adsorbs the first substrate from the first substrate transport unit until at least one pair of the first lamination rollers sandwich the first substrate.

19. A transport direction of the first substrate in the first substrate transport unit is defined as a first direction, a direction opposite to the first direction is defined as a second direction, a direction parallel to the first main surface of the first substrate and perpendicular to the first direction is defined as a third direction, a direction opposite to the third direction is defined as a fourth direction, a direction perpendicular to the first main surface of the first substrate is defined as a fifth direction, and a direction opposite to the fifth direction is defined as a sixth direction. the first bonding unit has a first position adjustment unit that moves the first suction plate in the first direction, the second direction, the third direction, the fourth direction, the fifth direction, and the sixth direction and rotates the first suction plate when viewed from the fifth direction or the sixth direction, and a first position detection unit that detects a position of the first substrate after the first suction plate has adsorbed the first substrate and before the first substrate is sandwiched between the pair of first lamination rollers, The bonding apparatus according to claim 18, further comprising a control unit that controls the first position adjustment unit based on a detection result of the first position detection unit to move or rotate the first substrate to a desired position.

20. 20. A bonding method comprising: bonding the first substrate and the first laminate film using the bonding apparatus according to claim 1, 2, 18 or 19.

Citation Information

Patent Citations

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