Transfer method, method of manufacturing electronic device, and transfer member

Abstract

To make an adherend hard to broken when a transfer member is separated from the adherend.SOLUTION: A transfer method including the steps of: pressing a transfer member (107) onto an adherend (104) on a first substrate (101) to be jointed to the adherend (104); moving the transfer member (107) apart from the first substrate (101) to separate the adherend (104) jointed to the transfer member (107) from the first substrate (101); moving the transfer member (107) to bond the adherend (104) to a second substrate (110); moving the transfer member (107) away from the second substrate (110) to separate a second joint part (105b) from the adherend (104) while a first joint part (105a) is jointed to the adherend (104), and then moving the transfer member (107) away from the second substrate (110) to separate the first joint part (105a) from the adherend (104).SELECTED DRAWING: Figure 16

Description

[Technical field]

[0001] The present disclosure relates to a transfer method, a method for manufacturing an electronic device, and a transfer member. [Background technology]

[0002] Conventionally, a method has been known in which a stamp (also called a "transfer member") is used to separate a composite integrated film (also called an "adherend") formed on a growth substrate from the growth substrate, the adherend is abutted against an apparatus substrate and bonded thereto by intermolecular forces, and the transfer member is separated from the adherend (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2022-79295 A (see FIG. 11, paragraphs 0063-0067) Summary of the Invention [Problem to be solved by the invention]

[0004] However, when the transfer member is separated from the adherend bonded to the device substrate, the adherend may be damaged.

[0005] An object of the present disclosure is to provide a transfer method and a transfer member that make it possible to reduce the risk of damage to an adherend when the transfer member is separated from the adherend.

[0006] Another object of the present disclosure is to provide a method for manufacturing an electronic device that makes it possible to reduce the risk of damage to an adherend when a transfer member is separated from the adherend. [Means for solving the problem]

[0007] The transfer method of the present disclosure is a method of transferring an adherend on a first substrate onto a second substrate, comprising the steps of: pressing a transfer member including a first bonding portion and a second bonding portion against the adherend on the first substrate, thereby elastically deforming the first bonding portion to bond the first bonding portion and the second bonding portion to the adherend; moving the transfer member away from the first substrate to separate the adherend from the first substrate while the first bonding portion and the second bonding portion are bonded to the adherend; moving the transfer member toward the second substrate to bond the adherend to the second substrate; moving the transfer member away from the second substrate to separate the second bonding portion from the adherend while the first bonding portion is bonded to the adherend; and, after the second bonding portion is separated, further moving the transfer member away from the second substrate to separate the first bonding portion from the adherend.

[0008] The method for manufacturing an electronic device according to the present disclosure includes pressing a transfer member including a first bonding portion and a second bonding portion against an adherend on the first substrate, thereby elastically deforming the first bonding portion to bond the first bonding portion and the second bonding portion to the adherend, moving the transfer member away from the first substrate to separate the adherend from the first substrate while the first bonding portion and the second bonding portion are bonded to the adherend, moving the transfer member toward the second substrate to bond the adherend to the second substrate, moving the transfer member away from the second substrate to separate the second bonding portion from the adherend while the first bonding portion is bonded to the adherend, and after the second bonding portion is separated, further moving the transfer member away from the second substrate to separate the first bonding portion from the adherend and provide the adherend on the second substrate.

[0009] The transfer member disclosed herein has a joining member that is joined to an adherend by being pressed against the adherend, the joining member including a first joining portion that can be joined to the adherend and a second joining portion that can be joined to the adherend when the first joining portion is joined to the adherend, the joining member being configured such that the first joining portion and the second joining portion are joined to the adherend when the first joining portion is pressed against the adherend and elastically deformed, and the second joining portion is separated from the adherend when the specified pressure is released and the first joining portion restores its original shape. Effect of the Invention

[0010] According to the present disclosure, it is possible to prevent the adherend from being damaged when the transfer member is separated from the adherend. [Brief description of the drawings]

[0011] [Figure 1] 1 is a schematic cross-sectional view showing a growth substrate (first base material) used for forming an adherend that is an object to be transferred in a transfer method (a method for manufacturing an electronic device) according to a first embodiment. [Diagram 2] 1A and 1B are a schematic cross-sectional view and a schematic plan view showing an epitaxial layer formed on a semiconductor wafer serving as a growth substrate. [Diagram 3] 1(A) and 1(B) are a schematic cross-sectional view and a schematic plan view illustrating a step of forming an adherend including a semiconductor layer. [Figure 4] FIG. 2 is a schematic perspective view showing an example of a composite integrated film as an adherend. [Diagram 5] 1 is a schematic plan view showing a semiconductor wafer on which a plurality of adherends are formed. [Figure 6] 1 is a schematic perspective view showing a stamp as a transfer member used in the transfer method according to the first embodiment. FIG. [Figure 7] FIG. 2 is a schematic cross-sectional view showing the etching process of the growth substrate (part below the adherend). [Figure 8] FIG. 8 is a schematic cross-sectional view showing a state after the etching process of FIG. 7. [Figure 9] 5 is a schematic cross-sectional view showing a step of bonding a first bonding portion of a bonding member (elastic body) of the stamp according to the first embodiment to an adherend. FIG. [Figure 10] FIG. 2 is an explanatory diagram showing the maximum surface roughness of the contact surface of the joining member of the stamp and the maximum surface roughness of the adherend. [Figure 11] 5 is a schematic cross-sectional view showing a step of bonding a second bonding portion of a bonding member of the stamp according to the first embodiment to an adherend. FIG. [Figure 12] 4 is a schematic cross-sectional view showing a step (part 1) of moving a bonding member of the stamp according to the first embodiment in a state where the bonding member is bonded to an adherend. FIG. [Figure 13] 10 is a schematic cross-sectional view showing a second step of moving the bonding member of the stamp according to the first embodiment while it is bonded to the adherend. FIG. [Figure 14] 10 is a schematic cross-sectional view showing a third step of moving the bonding member of the stamp according to the first embodiment while it is bonded to the adherend. FIG. [Figure 15] 4 is a schematic cross-sectional view showing a step (part 1) of bonding an adherend to a device substrate (second base material) by using the stamp according to the first embodiment. FIG. [Figure 16] 5 is a schematic cross-sectional view showing a second step of bonding an adherend to a device substrate by using the stamp according to the first embodiment. FIG. [Figure 17] FIG. 4 is a schematic cross-sectional view showing a step (part 1) of separating the stamp according to the first embodiment from an adherend bonded to a device substrate. [Figure 18] 5 is a schematic cross-sectional view showing a second step of separating the stamp according to the first embodiment from the adherend bonded to the device substrate. FIG. [Figure 19] 1A and 1B are a schematic cross-sectional view and a schematic plan view showing the shape and dimensions of a joining member (elastic body) of a stamp according to the first embodiment. [Figure 20] 1 is a block diagram showing a schematic configuration of an apparatus that performs a transfer method according to a first embodiment. [Figure 21] 4 is a flowchart showing a transfer method according to the first embodiment. [Figure 22] FIG. 11 is a schematic perspective view showing a stamp as a transfer member used in a transfer method (a method for manufacturing an electronic device) according to a second embodiment. [Diagram 23] FIG. 11 is a schematic perspective view showing another stamp used in the transfer method according to the second embodiment. [Figure 24] 10 is a schematic cross-sectional view showing a step of bonding a first bonding portion of a bonding member of a stamp according to embodiment 2 to an adherend. FIG. [Diagram 25] 10 is a schematic cross-sectional view showing a step of bonding a second bonding portion of a bonding member of a stamp according to embodiment 2 to an adherend. FIG. [Figure 26] FIG. 11 is a schematic cross-sectional view showing a step (part 1) of moving a bonding member of a stamp according to embodiment 2 while the member is bonded to an adherend. [Figure 27] 10 is a schematic cross-sectional view showing a step (part 2) of moving the bonding member of the stamp according to the second embodiment while it is bonded to the adherend. FIG. [Figure 28] FIG. 11 is a schematic cross-sectional view showing a third step of moving the bonding member of the stamp according to the second embodiment while it is bonded to the adherend. [Figure 29] 10 is a schematic cross-sectional view showing a step (part 1) of bonding an adherend to a device substrate (second base material) by using a stamp according to the second embodiment. FIG. [Diagram 30] 10 is a schematic cross-sectional view showing a step (part 2) of bonding an adherend to a device substrate by using a stamp according to the second embodiment. FIG. [Diagram 31] FIG. 11 is a schematic cross-sectional view showing a step (part 1) of separating the stamp according to the second embodiment from an adherend bonded to an apparatus substrate. [Diagram 32] FIG. 11 is a schematic cross-sectional view showing a step (part 2) of separating the stamp according to the second embodiment from the adherend bonded to the device substrate. [Diagram 33] 10 is a schematic cross-sectional view showing the shape and dimensions of a joining member of a stamp according to a second embodiment. FIG. [Diagram 34]FIG. 11 is a schematic perspective view showing a stamp as a transfer member used in a transfer method (a method for manufacturing an electronic device) according to a third embodiment. [Diagram 35] 11 is a schematic cross-sectional view showing a step of bonding a first bonding portion of a bonding member of a stamp according to embodiment 3 to an adherend. FIG. [Diagram 36] 13 is a schematic cross-sectional view showing a step of bonding a second bonding portion of a bonding member of a stamp according to embodiment 3 to an adherend. FIG. [Figure 37] FIG. 11 is a schematic cross-sectional view showing a step (part 1) of moving a bonding member of a stamp according to embodiment 3 while the member is bonded to an adherend. [Figure 38] FIG. 11 is a schematic cross-sectional view showing a second step of moving the bonding member of the stamp according to the third embodiment while it is bonded to the adherend. [Figure 39] FIG. 13 is a schematic cross-sectional view showing a third step of moving the joining member of the stamp according to the third embodiment while it is joined to the adherend. [Diagram 40] 11 is a schematic cross-sectional view showing a step (part 1) of bonding an adherend to a device substrate (second base material) by using a stamp according to the third embodiment. FIG. [Diagram 41] 13 is a schematic cross-sectional view showing a step (part 2) of bonding an adherend to a device substrate by using a stamp according to the third embodiment. FIG. [Diagram 42] FIG. 11 is a schematic cross-sectional view showing a step (part 1) of separating the stamp according to the third embodiment from an adherend bonded to an apparatus substrate. [Diagram 43] FIG. 11 is a schematic cross-sectional view showing a second step of separating the stamp according to the third embodiment from the adherend bonded to the device substrate. [Diagram 44] 11 is a schematic cross-sectional view showing the shape and dimensions of a joining member of a stamp according to embodiment 3. FIG. [Diagram 45] FIG. 13 is a schematic cross-sectional view showing a step of bonding a first bonding portion of a bonding member of a stamp serving as a transfer member used in a transfer method (electronic device manufacturing method) according to embodiment 4 to an adherend. [Diagram 46]13 is a schematic cross-sectional view showing a step of bonding a second bonding portion of a bonding member of a stamp according to embodiment 4 to an adherend. FIG. [Figure 47] FIG. 13 is a schematic cross-sectional view showing a step (part 1) of moving a bonding member of a stamp according to embodiment 4 while the member is bonded to an adherend. [Figure 48] 13 is a schematic cross-sectional view showing a step (part 2) of moving the bonding member of the stamp according to the fourth embodiment while it is bonded to the adherend. FIG. [Figure 49] FIG. 13 is a schematic cross-sectional view showing a third step of moving the joining member of the stamp according to the fourth embodiment while it is joined to the adherend. [Figure 50] 13 is a schematic cross-sectional view showing a step (part 1) of bonding an adherend to a device substrate by using a stamp according to a fourth embodiment. FIG. [Figure 51] 13 is a schematic cross-sectional view showing a step (part 2) of bonding an adherend to a device substrate by using a stamp according to the fourth embodiment. FIG. [Figure 52] FIG. 11 is a schematic cross-sectional view showing a step (part 1) of separating the stamp according to the fourth embodiment from an adherend bonded to an apparatus substrate. [Diagram 53] FIG. 13 is a schematic cross-sectional view showing a second step of separating the stamp according to the fourth embodiment from the adherend bonded to the device substrate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] A transfer method, a manufacturing method for an electronic device, and a transfer member according to embodiments of the present disclosure will be described below with reference to the drawings. The following embodiments are merely examples, and the embodiments can be appropriately combined and modified.

[0013] In the figure, the coordinate axes of an xyz Cartesian coordinate system are shown to facilitate understanding of the relationship between the figures. The x-axis and y-axis are coordinate axes parallel to the surface of the growth substrate as the first base material or the surface of the device substrate as the second base material. The z-axis is the coordinate axis in the thickness direction (i.e., the height direction or depth direction) of the stamp as the transfer member. The -z direction is also referred to as the first direction.

[0014] The transfer method according to the embodiment is a method of transferring an adherend (e.g., a structure) on a first substrate to a second substrate using a transfer member that can be moved by a transfer device. The adherend is, for example, a structure. The structure is a material that does not have a function by itself, for example, a semiconductor film including an epitaxially grown film. The adherend may be, for example, a functional unit including a semiconductor device. The functional unit is a material having a function including a metal or an organic material other than a semiconductor film, such as a composite integrated film or a wafer.

[0015] The manufacturing method of the electronic device according to the embodiment is a method of transferring an adherend on a first substrate to a second substrate using a transfer member that can be moved by a transfer device. The adherend is, for example, a semiconductor film including an epitaxially grown film. The electronic device includes a μLED display having a plurality of μLEDs (micro light emitting diodes), a light source device having μLEDs, and the like.

[0016] The transfer member according to the embodiment has a bonding member that is bonded to an adherend. The bonding member has a first bonding portion (first bonding region) and a second bonding portion (second bonding region), and is bonded to an adherend on a first substrate, and separates the adherend from the first substrate, and transfers the adherend onto a second substrate. The transfer member has, for example, a bonding member that is an elastic body, and a support that supports the bonding member. The joining member supported by the support is preferably integrally made of the same material. However, the joining member may be formed of a combination of different materials. For example, the base part on the support side and the deformable part on the adherend side may be formed of different materials. The support is made of a material harder than the joining member.

[0017] 1. First embodiment 1-1: Adherend and stamp (transfer member) An adherend (for example, a structure) as a transfer target to which a transfer pattern is to be transferred by the transfer method according to the first embodiment will be described.

[0018] 1 is a schematic cross-sectional view showing a growth substrate 101 as a first base material used to form an adherend 104 that is an object to be transferred in the transfer method according to embodiment 1. The growth substrate 101 is, for example, a silicon substrate whose crystal growth surface (upper surface in FIG. 1) is a (111) surface, that is, a Si(111) substrate.

[0019] 2(A) and (B) are schematic cross-sectional and plan views showing an epitaxial layer formed on a semiconductor wafer, which is a growth substrate 101. As shown in FIG. 2(A) or (B), an AlN (aluminum nitride) layer 102 is epitaxially grown on the growth substrate 101 as a buffer layer, and a GaN (gallium nitride) layer 103 is epitaxially grown thereon to form an epitaxially grown film (also called a "semiconductor film"). The structure of the laminated semiconductor, which is the epitaxially grown film, is not limited to the example shown in the figure. The epitaxially grown film may have three or more semiconductor layers. The layer to be epitaxially grown may include an AlGaAs (aluminum gallium arsenide) layer, an AlInGaP (aluminum indium gallium phosphide) layer, an InP (indium phosphide) layer, a Si (silicon layer) layer, or the like, in addition to a GaN layer.

[0020] 3(A) and (B) are schematic cross-sectional and plan views showing a process of forming an adherend 104 including a semiconductor layer. FIG. 4 is a schematic perspective view showing an example of a composite integrated film as the adherend 104. FIG. 5 is a schematic plan view showing a semiconductor wafer on which a plurality of adherends 104 are formed. A photoresist (not shown) for patterning is formed on the upper surface of the laminated semiconductor shown in FIG. 2(A), and patterned into an element shape by dry etching to form the adherend 104, which is an element-shaped structure, shown in FIGS. 3(A) and (B) and FIG. 5. During patterning, etching is performed down to the growth substrate 101, which is a Si substrate. The overetching length t at this time is within a range of 50 to 10,000 nm. As shown in FIG. 5, a plurality of adherends arranged regularly (for example, in a matrix) are formed on the semiconductor wafer.

[0021] The adherend 104 may be a composite integrated film as shown in FIG. 4. The composite integrated film has a structure in which a plurality of components (e.g., a wiring layer, an electrode layer, etc.) are provided on a thin base film. The adherend 104 can be transferred to any adherend having an uneven surface or a flat surface. The preferred shape of the adherend 104 is a flat surface with a high degree of smoothness.

[0022] FIG. 6 is a schematic perspective view showing a stamp 107 as a transfer member used in the transfer method according to the first embodiment. The stamp 107 in FIG. 6 has a plurality of bonding members (elastic bodies) 105 formed at positions corresponding to the plurality of adherends 104 in FIG. 5, and a support 106 supporting the plurality of bonding members 105. As shown in FIG. 6, the bonding member 105 has a first bonding portion 105a that is convex and protrudes in the -z direction (i.e., is high in the -z direction), and a second bonding portion 105b that is lower than the first bonding portion 105a. That is, a recess 105c is formed in the -z direction of the second bonding portion 105b. The first bonding portion 105a is a portion that is always bonded in a process other than the process in which it is separated from the adherend 104 in the transfer process. The contact surface of the second bonding portion 105b is provided closer to the support 106 than the contact surface of the first bonding portion 105a. The second bonding portion 105b is bonded to the adherend 104 when the adherend 104 is separated from the growth substrate 101 or when the adherend 104 is bonded to the device substrate 110. The bonding member 105 is a portion for picking up the adherend 104 as a semiconductor thin film. The bonding member 105 is made of silicone such as PDMS (dimethylpolysiloxane). The support 106 is made of a rigid material that is harder than the bonding member 105. A glass substrate or the like can be used as the support 106.

[0023] Fig. 7 is a schematic cross-sectional view showing an etching process of the growth substrate 101. Fig. 8 is a schematic cross-sectional view showing the state after the etching process of Fig. 7. The growth substrate 101 shown in Fig. 3(A) is anisotropically etched with an etching solution such as an aqueous potassium hydroxide (KOH) solution, whereby a part of the growth substrate 101 (part indicated by 101a) is etched in the horizontal direction as shown in Fig. 7. As a result, as shown in Fig. 8, the sacrificial layer part is etched and the AlN layer 102 of the adherend 104 is placed on the growth substrate 101 in a separated state in which it is not bonded to the growth substrate 101.

[0024] Furthermore, the adherend 104 is not limited to the AlN layer 102 and the GaN layer 103 as a buffer layer on the growth substrate 101, but may have a structure in which, for example, an AlAs layer is used as a sacrificial layer and an AlGaAs layer or an AlInGaP layer is epitaxially grown thereon. In this case, for example, hydrochloric acid or hydrofluoric acid can be used to etch the sacrificial layer. Furthermore, the adherend 104 may be a composite integrated film in which an organic film, a semiconductor film, or an inorganic film is integrated on a sacrificial layer of, for example, Al2O3, Al, Ti, Au, or AuGeNi. In this case, for example, hydrochloric acid, hydrofluoric acid, phosphoric acid, or an iodine-based etchant can be used to etch the sacrificial layer. The thickness of the adherend 104 is preferably 1 to 100 μm.

[0025] 1-2 Transfer method Fig. 9 is a schematic cross-sectional view showing a step of bonding the first bonding portion 105a of the bonding member 105 of the stamp 107 according to the first embodiment to the adherend 104. Fig. 11 is a schematic cross-sectional view showing a step of bonding the second bonding portion 105b of the bonding member 105 of the stamp 107 to the adherend 104. As shown in Fig. 9, the stamp 107 including the first bonding portion 105a and the second bonding portion 105b is pressed against the adherend 104 on the growth substrate 101, whereby the first bonding portion 105a is elastically deformed, and the first bonding portion 105a and the second bonding portion 105b are bonded to the adherend 104 as shown in Fig. 11.

[0026] As shown in FIG. 9, the stamp 107 is brought into contact with the adherend 104. At this time, the area S1 of the contact region of the first bonding portion 105a of the bonding member 105 is, for example, 1666 μm 2 11, when the stamp 107 is moved further downward (in the -z direction), the second bonding portion 105b of the bonding member 105 comes into contact with the adherend 104. At this time, the area S of the region where both the first bonding portion 105a and the second bonding portion 105b of the bonding member 105 come into contact is, for example, 2500 μm 29 is smaller than the area of ​​the region where the adherend 104 and the bonding member 105 contact each other in FIG.

[0027] As shown in Fig. 11, the movement amount of the bonding member 105 so that the first bonding portion 105a and the second bonding portion 105b are entirely attached to the adherend 104 by elastic deformation is adjusted in advance based on experiments or the like, and is controlled by a transfer device (shown in Fig. 20 described later) that stores the movement amount. The bonding member 105 is made of a material that has extensibility and flexibility, such as PDMS. PDMS has delayed elastic recovery characteristics in which, when the stress is released after a large deformation, the deformation does not suddenly recover, and the PDMS recovers to almost the original shape after a certain time has passed.

[0028] 10 is an explanatory diagram showing the maximum surface roughness of the contact surface of the stamp 107 with the bonding member 105 and the maximum surface roughness of the adherend. 104 is the maximum surface roughness R of the contact surface of the first bonding portion 105a of the bonding member 105 of the stamp 107 that contacts the adherend surface of the adherend. 105a It is desirable that the maximum surface roughness R 104 is the maximum surface roughness R of the contact surface of the second bonding portion 105b of the bonding member 105 of the stamp 107 that contacts the adherend surface of the adherend 104. 105b It is desirable that the maximum surface roughness R105a, R105b is the difference between the most protruding part in the +z direction and the most protruding part in the -z direction on the contact surface (surface) of the joining member 105. Also, the maximum surface roughness R104 is the difference between the most protruding part in the +z direction and the most protruding part in the -z direction on the adhesion surface (surface) of the adherend 104. Also, the maximum surface roughness R 105a and maximum surface roughness R 105b Each of these is preferably smaller than a height H1 shown in FIG. 19(A) described later.

[0029] 12 to 14 are schematic cross-sectional views showing steps (parts 1 to 3) of moving the bonding member 105 of the stamp 107 according to the first embodiment while it is bonded to the adherend 104. Fig. 12 shows the stamp 107 starting to move upward (in the +z direction). Fig. 13 shows the stamp 107 moving upward (in the +z direction) and starting to peel the adherend 104 from the growth substrate 101. Fig. 14 shows the bonding member 105 restored to its original shape.

[0030] As shown in FIG. 12, the stamp 107 is moved upward (in the +z direction). At this time, the bonding member 105, which had been elastically deformed by being pressed from above, tries to return to its original shape when it is no longer subjected to pressure from above. At this time, the end portion of the bonded adherend 104 comes into contact with the adherend 104 due to deformation and is bonded by adhesive force, so that the adherend 104 peels off from the end portion as shown in FIG. 13. Each figure is a schematic diagram and is deformed. Thereafter, as shown in FIG. 14, due to its characteristics, the end portion of the adherend 104 peels off from the growth substrate 101 due to deformation recovery, and the bonded end portion to the adherend 104 also peels off, but the peeling between the lower portion of the adherend 104 and the growth substrate 101 is completed before the end portion peels off.

[0031] 15 and 16 are schematic cross-sectional views showing steps (parts 1 and 2) of bonding an adherend 104 (e.g., a functional unit) to a device substrate 110 (second base material) by using a stamp 107 according to embodiment 1. Fig. 15 shows a state in which the adherend 104 is in contact with the device substrate 110. Fig. 16 shows a state in which the bonding member 105 is deformed when the adherend 104 is attached by applying a further load from the state shown in Fig. 15.

[0032] 17 and 18 are schematic cross-sectional views showing steps (part 1 and part 2) of separating the stamp 107 according to the first embodiment from the adherend 104 bonded to the device substrate. Fig. 17 shows the process of the stamp 107 peeling off from the adherend 104 after the adherend 104 is attached to the device substrate 110. Fig. 18 shows the state in which the stamp 107 is separated from the adherend 104 after the adherend 104 is attached to the device substrate 110.

[0033] 19(A) and (B) are a schematic cross-sectional view and a schematic plan view showing the shape and dimensions of a bonding member 105 of a stamp 107 according to the first embodiment.

[0034] 14, after the adherend 104 is peeled off, the bonding member 105 returns to its original shape. The first bonding portion 105a and the second bonding portion 105b of the bonding member 105 of the stamp 107 return to their original shapes with respect to the picked-up adherend 104, and hold the adherend 104.

[0035] 15, the adherend 104 is transferred onto the device substrate 110 by the stamp 107. At this time, the end of the bonding member 105 is not in contact with the adherend 104, so the bonding member 105 adheres to the adherend 104 from the center. The contact area of ​​the bonding member 105 at this time is the region S1 shown in FIG. 19(B), which is 1666 μm in the first embodiment. 2 It is.

[0036] 16, a downward force is applied from above to deform the first bonding portion 105a and the second bonding portion 105b of the bonding member 105, and the second bonding portion 105b (the end portion in the first embodiment) is also tightly attached to the device substrate 110 by pressing the bonding member 105 against the end portion of the adherend 104 until the end portion comes into contact with the adherend 104. At this time, the contact area of ​​the bonding member 105 is an area S shown in FIG. 19(B), which is 2500 μm in the first embodiment. 2 15 is smaller than the contact area between the adherend 104 and the joining member 105 in FIG.

[0037] Finally, as shown in FIG. 17, the stamp 107 is moved upward (in the +z direction), and the second bonding portion 105b of the bonding member 105 is peeled off from the end. At this time, since the end of the bonding member 105 is inside the end of the adherend 104, the adherend 104 is stable without being subjected to a force in the direction of peeling after transfer. Finally, as shown in FIG. 18, the stamp 107 is separated to complete the transfer. When the stamp 107 is separated, the second bonding portion 105b (end region 110 of the bonding member 105 in FIG. 16) having a width of W2 shown in FIG. 19(A) is separated from the end while the first bonding portion 105a having a width of W1 is in contact with the adherend 104 at the adhesive portion (i.e., the adherend 104 is held down by the first bonding portion 105a having a width of W1), and deformation recovery occurs, and then the width portion of W2 is also peeled off.

[0038] The bonding member 105 in FIG. 19(A) is made of PDMS and has, for example, the following properties. Shore hardness A=55[Hs] Young's modulus E=3.0[MPa] Vertical spring constant k=85[N / m] Adhesive strength D=0.1[MPa]

[0039] For example, the projected area of ​​the portion indicated by the width W2 of the joint member 105 is assumed to be S in the following formula. {W1+(W2×2)} 2 =S The area of ​​the portion indicated by the width W1 of the protrusion is defined as S1 in the following formula. S1 = W1 × W1 = S × (2 / 3) Area S is 2500μm 2 Then, the area S1 is 1666 μm 2 The area ratio of area S1 to area S is a r Then, a r = 2 / 3, and the area of ​​the recess is S3. S3 = S - S1 = 834 μm 2 Moreover, the height H1 in FIG.

[0040] The force required to crush the first bond portion 105a, which is a region of area S1, can be calculated as follows. Repulsive force = k (vertical spring constant) × H1 =85×10×10 -6 [N] =8.5×10 -4 [N] If the repulsive pressure acting on the area of ​​S3 is P3, then Repulsion pressure P3 = (8.5 × 10 -4 ) / (834×10 -12 ) / 10 -6 =1.0 [MPa] It becomes.

[0041] Therefore, a pressure of 1 MPa per unit area is applied to crush the bonding member 105 from the state in Fig. 11 to the state in Fig. 12. When the stamp 107 is peeled off from that state, as shown in Fig. 12 and Fig. 13, when the end portion peels off, it returns to its original shape when it is pulled upward (in the +z direction) because the adhesive force exceeds 0.1 MPa, but when the adhesive force is below 0.1 MPa, a force that peels off the adherend 104 is applied to the end portion.

[0042] The relationship can be expressed as the following formula: S1=a r S (1) S3 = (1-a r )×S (2) K = E S1 / H (3) F = k H1(4) P=F / S3>D (5) P=E·S1·H1 / S3·H>D (6) P=a r E S H1 / (1-a r )S·H>D (7) D r E H1 / (1-a r )H (8) a r ·E·H1>D·Ha r D H (9) a r >D H / (E H1+D H) (10) ​

[0043] When each dimension is calculated using the above formula, the values ​​(unit: μm) are given in Table 1 below.

[0044] [Table 1]

[0045] Moreover, it is desirable that H1 and H2 satisfy the relationship of the following formula. H1×20≧H2≧H1×2

[0046] In addition, the adhesive strength of the joining member 105 to the support 106 relative to the weight of the joining member 105 is necessary and sufficient, so the joining member 105 will not peel off from the support 106 regardless of the thickness of the joining member 105. In addition, the adhesive strength of the joining member 105 to the adherend 104 relative to the weight of the adherend 104 is necessary and sufficient, so the joining member 105 will not peel off from the joining member 105 regardless of the thickness of the adherend 104.

[0047] Furthermore, it is desirable that the width of the first joint 105a is narrower than the width of the adherend 104, and that the sum of the width W1 of the first joint 105a and the width W2 of the two second joints 105b in the x or y direction (W1+2·W2 in Figure 19(A)) is greater than or equal to the width of the adherend 104.

[0048] As described above, when the bonding member 105 of the stamp 107 peels off the adherend 104, the entirety of the bonding member 105 is deformed and brought into a tightly adhered state, and the entire upper surface of the adherend 104 is peeled off with a weak force (0.1 MPa or less) by the bonding member 105. At this time, the end of the adherend 104 is peeled off reliably. Next, the elastic deformation of the bonding member 105 returns to its original state, and the entire adherend 104 is peeled off stably by pulling it up with a strong force.

[0049] By removing the portion of the growth substrate 101 below the adherend 104, the bonding strength between the adherend 104 and the growth substrate 101 is sufficiently weaker than the adhesive strength of PDMS, which is 0.1 MPa. The bonding strength between the adherend 104 and the device substrate 110 is stronger than the bonding strength between the stamp 107 and the adherend 104, which is 0.1 MPa or more.

[0050] As described above, by pulling up stamp 107 after the concave parts have naturally peeled off due to the elasticity of the convex parts, stamp 107 can be peeled off without the outer periphery of bonding member 105 pulling adherend 104.

[0051] Fig. 20 is a block diagram showing a schematic configuration of a transfer device 150 that executes the transfer method according to the first embodiment. As shown in Fig. 20, the transfer device 150 has a control unit 151, a stamp moving unit 152 including a mechanism for moving the stamp 107, and the stamp 107. The control unit 151 includes a control circuit that controls the operation of the stamp moving unit 152. The control unit 151 may have a processor that operates according to a software program. The control unit 151 may be a computer.

[0052] 21 is a flowchart showing the transfer method according to the embodiment 1. First, an adherend 104 is formed as an adherend on a growth substrate 101 as a first base material, and a portion of the growth substrate 101 below the adherend 104 is etched (step ST11).

[0053] Next, the transfer device 150 presses the stamp 107 including the first bonding portion 105a and the second bonding portion 105b against the adherend 104 on the growth substrate 101, thereby elastically deforming the first bonding portion 105a and bonding the first bonding portion 105a and the second bonding portion 105b to the adherend 104 (step ST12).

[0054] Next, the transfer device 150 moves (lifts) the stamp 107 away from the growth substrate 101, thereby separating the adherend 104 bonded to the stamp 107 from the growth substrate 101 (step ST13).

[0055] Next, the transfer device 150 moves the stamp 107 to bond the adherend 104 to the device substrate 110 (step ST14). Bonding is achieved by intermolecular bonding forces, and no adhesive is required.

[0056] Next, the transfer device 150 moves the stamp 107 away from the device substrate 110, thereby separating the second bonding portion 105b from the adherend 104 while leaving the first bonding portion 105a bonded to the adherend 104 (step ST15).

[0057] Next, after the second bonding portion 105b is separated, the transfer device 150 moves the stamp 107 away from the device substrate 110, thereby separating the first bonding portion 105a from the adherend 104 (step ST16).

[0058] The moving speed of the stamp 107 when it is moved away from the growth substrate 101 in step ST13 is desirably faster than the moving speed of the stamp 107 when it is moved away from the device substrate 110 in steps ST15 and ST16. In step S13, by increasing the speed at which the adherend 104 is separated from the growth substrate 101, the adherend 104 can be peeled off from the growth substrate 101 before the second bonded portion 105b naturally peels off. On the other hand, by slowly separating the adherend 104 from the stamp 107 after bonding the adherend 104 to the device substrate 110, only the stamp 107 is peeled off after the second bonding portion 105b naturally peels off. This method makes it possible to bond the adherend 104 to the device substrate 110 without damaging the end portion. Therefore, it is preferable to create a difference in the moving speed.

[0059] 1-3 Effects As described above, according to the first embodiment, by forming stamp 107 from an elastic material such as PDMS and providing a step at the end of stamp 107, it is possible to make it difficult for stress-induced cracks to occur at the end of adherend 104 both when adherend 104 is peeled off from growth substrate 101 and when stamp 107 is peeled off from adherend 104 bonded to device substrate 110. In addition, transfer can be performed from the end when peeling, and from the center when attaching.

[0060] 2. Second embodiment 2-1 Configuration and operation The flow of forming the adherend 104 shown in Figures 1 to 5, 7 and 8, the block diagram of the transfer device 150 shown in Figure 20, and the flow chart shown in Figure 21 are also applied to the embodiment 2. The embodiment 2 differs from the embodiment 1 in the structure of the stamp 207.

[0061] FIG. 22 is a schematic perspective view showing a stamp 207 as a transfer member used in the transfer method (electronic device manufacturing method) according to the second embodiment. FIG. 23 is a schematic perspective view showing another stamp 207 used in the transfer method according to the second embodiment. The other stamp in FIG. 23 is different from the stamp in FIG. 22, in which the recess is a groove that does not penetrate, in that the recess is a groove that penetrates through. The stamp 207 in FIG. 22 or FIG. 23 has a plurality of bonding members (elastic bodies) 205 formed at positions corresponding to the plurality of adherends 104 in FIG. 5, and a support 106 that supports the plurality of bonding members 205. As shown in FIG. 22 or FIG. 23, the bonding member 205 has a first bonding portion 205a that is convex and protrudes in the -z direction (i.e., is high in the -z direction) and a second bonding portion 205b that is lower than the first bonding portion 205a. That is, a recess 205c is formed in the -z direction of the second bonding portion 205b. The recess 205c has an inclined surface that becomes shallower as it approaches the end. The bonding member 205 is a portion for picking up the semiconductor thin film as the adherend 104. The material of the bonding member 205 is the same as that of the first embodiment.

[0062] Fig. 24 is a schematic cross-sectional view showing a step of bonding a first bonding portion 205a of a bonding member 205 of a stamp 207 according to embodiment 2 to an adherend 104. Fig. 24 shows a state in which the first bonding portion 205a of the bonding member 205 moves toward the adherend 104 and comes into contact with the adherend 104.

[0063] Fig. 25 is a schematic cross-sectional view showing a step of bonding second bonding portion 205b of bonding member 205 of stamp 207 according to embodiment 2 to adherend 104. Fig. 25 shows a state in which bonding member 205 is deformed and second bonding portion 205b is in close contact with adherend 104.

[0064] 26 to 28 are schematic cross-sectional views showing steps (parts 1 to 3) of moving the bonding member 205 of the stamp 207 according to the second embodiment while it is bonded to the adherend 104. FIG. 26 shows the stamp 207 starting to move upward (in the +z direction). FIG. 27 shows the stamp 207 moving upward (in the +z direction) and starting to peel the adherend 104 from the growth substrate 101. FIG. 28 shows the bonding member 205 restored to its original shape.

[0065] 29 and 30 are schematic cross-sectional views showing steps (parts 1 and 2) of bonding the adherend 104 to the device substrate 110 (second base material) by the stamp 207 according to embodiment 2. Fig. 29 shows a state in which the adherend 104 is in contact with the device substrate 110. Fig. 30 shows a state in which the bonding member 205 is deformed when the adherend 104 is attached by applying a further load from the state shown in Fig. 29.

[0066] Fig. 31 and Fig. 32 are schematic cross-sectional views showing steps (part 1 and part 2) of separating the stamp 207 according to the second embodiment from the adherend 104 bonded to the device substrate. Fig. 31 shows the process of the stamp 207 peeling off from the adherend 104 after the adherend 104 is attached to the device substrate 110. Fig. 32 shows the state in which the stamp 207 is separated from the adherend 104 after the adherend 104 is attached to the device substrate 110.

[0067] FIG. 33 is a schematic cross-sectional view showing the shape and dimensions of a bonding member 205 of a stamp 207 according to the second embodiment.

[0068] In the second embodiment, first, as shown in FIG. 24, a stamp 207 composed of a bonding member 205 and a support 106 is brought into contact with the adherend 104. Furthermore, as shown in FIG. 25, the stamp 207 is moved downward (in the -z direction) until the contact surfaces of the first bonding portion 205a and the second bonding portion 205b of the bonding member 205 and the adherend 104 become parallel. The amount of movement is adjusted based on the results of a previously performed experiment so that the bonding member 205 elastically deforms and comes into complete contact as shown in FIG. 25, and the transfer device 150 that stores the amount of movement moves the stamp 207. As in the first embodiment, the contact area between the bonding member 205 and the adherend 104 in FIG. 24 is smaller than the contact area between the bonding member 205 and the adherend 104 in FIG. 25. The material of the bonding member 205 is the same as that of the first embodiment.

[0069] Next, as shown in FIG. 26, the stamp 207 is moved upward (in the +z direction). At this time, the bonding member 205, which had been elastically deformed by being pressed from above, tries to return to its original shape as it is no longer subjected to pressure from above. At this time, the end of the bonded ...

[0070] 28, after the adherend 104 is peeled off, the bonding member 205 returns to its original shape. With respect to the picked-up adherend 104, the first bonding portion 205a and the second bonding portion 205b of the bonding member 205 of the stamp 207 return to their original shapes and hold the adherend 104.

[0071] Next, as shown in FIG. 29, the adherend 104 is transferred onto the device substrate 110 by the stamp 207. At this time, the end of the bonding member 205 is not in contact with the adherend 104, so that the end is attached to the center of the adherend 104. Furthermore, as shown in FIG. 30, a downward force is applied from above to deform the first bonding portion 205a and the second bonding portion 205b of the bonding member 205, and the end is pressed down until it contacts the end of the adherend 104, so that the end is also in close contact with the device substrate 110. As in the first embodiment, the contact area between the bonding member 205 and the adherend 104 in FIG. 30 is larger than the contact area between the bonding member 205 and the adherend 104 in FIG. 31.

[0072] Finally, as shown in FIG. 31, the stamp 207 is moved upward (in the +z direction), and the second bonding portion 205b of the bonding member 205 is peeled off from the end. At this time, since the end contact portion of the bonding member 205 is partially inside the end of the adherend 104, the adherend 104 is stabilized without being subjected to a force in the direction of peeling after transfer. Finally, as shown in FIG. 32, the stamp 207 is separated to complete the transfer. When the stamp 207 is separated, the second bonding portion 205b (end region 210 of the bonding member 205 in FIG. 30) having a width of W2 shown in FIG. 33 is separated from the end while the first bonding portion 205a having a width of W1 is in contact with the adherend 104 at the adhesive portion (i.e., the adherend 104 is held down by the first bonding portion 205a having a width of W1), and deformation recovery occurs, and then the width portion of W2 is also peeled off.

[0073] The relationship between the dimensions H1, H2, W1, and W2 of the bonding member 205 shown in FIG. 33 is the same as that in the first embodiment. The total width of the first bonding portion 205a is narrower than the width of the adherend 104, and the total width W1 of the first bonding portion 205a and the width W2 of the second bonding portion 205b in the x-direction or y-direction (3·W1+6·W2 in FIG. 33) is preferably equal to or greater than the width of the adherend 104. The adhesive force of the bonding member 205 to the support 106 relative to the weight of the bonding member 205 is necessary and sufficient, so the bonding member 205 will not peel off from the support 106 regardless of the thickness of the bonding member 205. The adhesive force of the bonding member 205 to the adherend 104 relative to the weight of the adherend 104 is necessary and sufficient, so the bonding member 205 will not peel off from the support 106 regardless of the thickness of the adherend 104.

[0074] As described above, when the bonding member 205 of the stamp 207 peels off the adherend 104, the entirety of the bonding member 205 deforms and comes into a tightly attached state, and the entire upper surface of the adherend 104 is peeled off with a weak force (0.1 MPa or less) by the bonding member 205. At this time, the end of the adherend 104 is peeled off reliably. Next, the elastic deformation of the bonding member 205 returns to its original state, and the entirety of the adherend 104 is peeled off stably by pulling it up with a strong force.

[0075] The bonding strength between the adherend 104 and the growth substrate 101 after the growth substrate 101 is removed is sufficiently weaker than the adhesive strength of PDMS, which is 0.1 MPa. The bonding strength between the adherend 104 and the device substrate 110 is stronger than that between the stamp 207 and the adherend 104, being 0.1 MPa or more.

[0076] As described above, by pulling up the stamp 207 from a state in which the recessed portion, which is the second bonding portion 205b of the bonding member 205, is naturally peeled off due to the elasticity of the convex portion, which is the first bonding portion 205a of the bonding member 205, the stamp 207 can be peeled off without the outer periphery of the bonding member 205 pulling on the adherend 104.

[0077] 2-2 Effects As described above, according to the second embodiment, in addition to the effects of the first embodiment, by forming the stamp 207 from an elastic material such as PDMS and providing holes in multiple locations from the center to the ends of the stamp 207, the contact area between the first bonding portion in FIG. 31 and the adherend 104 is reduced, and when the stamp 207 is peeled off from the adherend 104, it is possible to make it less likely that cracks will occur due to stress even in the center of the adherend 104.

[0078] 3. Third embodiment 3-1 Configuration and operation The flow of forming the adherend 104 shown in Figures 1 to 5, 7 and 8, the block diagram of the transfer device 150 shown in Figure 20, and the flow chart shown in Figure 21 are also applied to the embodiment 3. The embodiment 3 differs from the embodiment 1 in the structure of the stamp 307.

[0079] FIG. 34 is a schematic perspective view showing a stamp 307 as a transfer member used in a transfer method (electronic device manufacturing method) according to the third embodiment. The stamp 307 in FIG. 34 has a plurality of bonding members (elastic bodies) 305 formed at positions corresponding to a plurality of adherends 104 in FIG. 5, and a support 106 supporting the plurality of bonding members 305. As shown in FIG. 34, the bonding member 305 has a first bonding portion 305a that is convex and protrudes in the -z direction (i.e., is high in the -z direction), and a second bonding portion 305b that is lower than the first bonding portion 305a. That is, a recess 305c is formed in the -z direction of the second bonding portion 305b. The recess 305c has an inclined surface that becomes shallower as it approaches the end. The bonding member 305 is a portion for picking up the adherend 104 as a semiconductor thin film. The material of the bonding member 305 is the same as that of the first embodiment.

[0080] Fig. 35 is a schematic cross-sectional view showing a step of bonding a first bonding portion 305a of a bonding member 305 of a stamp 307 according to embodiment 3 to an adherend 104. Fig. 35 shows a state in which the first bonding portion 305a of the bonding member 305 moves toward the adherend 104 and comes into contact with the adherend 104.

[0081] Fig. 36 is a schematic cross-sectional view showing a step of bonding second bonding portion 305b of bonding member 305 of stamp 307 according to embodiment 3 to adherend 104. Fig. 36 shows a state in which bonding member 305 is deformed and second bonding portion 305b is in close contact with adherend 104.

[0082] 37 to 39 are schematic cross-sectional views showing steps (parts 1 to 3) of moving the bonding member 305 of the stamp 307 according to the third embodiment while it is bonded to the adherend 104. FIG. 37 shows the stamp 307 starting to move upward (in the +z direction). FIG. 38 shows the stamp 307 moving upward (in the +z direction) and starting to peel the adherend 104 from the growth substrate 101. FIG. 39 shows the bonding member 305 restored to its original shape.

[0083] 40 and 41 are schematic cross-sectional views showing steps (parts 1 and 2) of bonding the adherend 104 to the device substrate 110 (second base material) by the stamp 307 according to embodiment 3. Fig. 40 shows a state in which the adherend 104 is in contact with the device substrate 110. Fig. 41 shows a state in which the bonding member 305 is deformed when the adherend 104 is attached by applying a further load from the state shown in Fig. 40.

[0084] Fig. 42 and Fig. 43 are schematic cross-sectional views showing steps (part 1 and part 2) of separating the stamp 307 according to the third embodiment from the adherend 104 bonded to the device substrate. Fig. 42 shows the process of the stamp 307 peeling off from the adherend 104 after the adherend 104 is attached to the device substrate 110. Fig. 43 shows the state in which the stamp 307 is separated from the adherend 104 after the adherend 104 is attached to the device substrate 110.

[0085] FIG. 44 is a schematic cross-sectional view showing the shape and dimensions of a bonding member 305 of a stamp 307 according to the third embodiment.

[0086] In the third embodiment, first, as shown in FIG. 35, a stamp 307 composed of a bonding member 305 and a support 106 is brought into contact with the adherend 104. Furthermore, as shown in FIG. 36, the stamp 307 is moved downward (in the -z direction) until the first bonding portion 305a and the second bonding portion 305b of the bonding member 305 and the abutment surface of the adherend 104 become parallel. As in the first embodiment, the abutment area between the bonding member 305 and the adherend 104 in FIG. 35 is smaller than the abutment area between the bonding member 305 and the adherend 104 in FIG. 36. The amount of movement is adjusted based on the results of a previously performed experiment so that the bonding member 305 is elastically deformed and completely adhered as shown in FIG. 36, and the stamp 307 is moved by the transfer device 150 that has stored the amount of movement. The material of the bonding member 305 is the same as that of the first embodiment.

[0087] Next, as shown in FIG. 37, the stamp 307 is moved upward (in the +z direction). At this time, the bonding member 305, which had been elastically deformed by being pressed from above, tries to return to its original shape as it is no longer subjected to pressure from above. At this time, the end of the bonded adherend 104 comes off from the end because the end of the bonded adherend 104 comes into contact with the adherend 104 due to deformation and is bonded by adhesive force. Note that each figure is a schematic diagram and is drawn in a deformed form. Thereafter, as shown in FIG. 38, the end of the bonded adherend 104 gradually comes off from the growth substrate 101 due to the characteristics of the bonded adherend 104, and the bonded adherend 104 also comes off, but the peeling between the lower part of the bonded adherend 104 and the growth substrate 101 is completed before the end comes off.

[0088] 39, after the adherend 104 is peeled off, the bonding member 305 returns to its original shape. The first bonding portion 305a and the second bonding portion 305b of the bonding member 305 of the stamp 307 return to their original shapes with respect to the picked-up adherend 104, and hold the adherend 104.

[0089] Next, as shown in FIG. 40, the adherend 104 is transferred onto the device substrate 110 by the stamp 307. At this time, the end of the bonding member 305 is not in contact with the adherend 104, so that the end is attached to the center of the adherend 104. Furthermore, as shown in FIG. 41, a downward force is applied from above to deform the first bonding portion 305a and the second bonding portion 305b of the bonding member 305, and the end is pressed down until it contacts the end of the adherend 104, so that the end is also tightly attached to the device substrate 110. As in the first embodiment, the contact area between the bonding member 305 and the adherend 104 in FIG. 40 is smaller than the contact area between the bonding member 305 and the adherend 104 in FIG. 41.

[0090] 42, the stamp 307 is moved upward (in the +z direction), and the second bonding portion 305b of the bonding member 305 is gradually peeled off from the end of the protruding portion. At this time, since the end of the bonding member 305 is located inside the end of the adherend 104, the adherend 104 is stable without being subjected to a force in the peeling direction after transfer.

[0091] Finally, as shown in Fig. 43, the stamp 307 is separated to complete the transfer. When the stamp 307 is separated, the second bonding portion 305b having a width of W2 shown in Fig. 44 (the end region 310 of the bonding member 305 in Fig. 41) is separated from the end portion while the first bonding portion 305a having a width of W1 is in contact with the adherend 104 at the adhesive portion (i.e., the adherend 104 is held down by the first bonding portion 305a having a width of W1), causing deformation recovery, and then the portion having a width of W2 is peeled off.

[0092] 44, the relationship between the dimensions H1, H2, W1, and W2 of the bonding member 305 is similar to that in embodiment 1. The width of the first bonding portion 305a is narrower than the width of the adherend 104, and the sum of the width W1 of the first bonding portion 305a and the width W2 of the two second bonding portions 305b in the x or y direction (W1+2·W2 in FIG. 44) is desirably equal to or greater than the width of the adherend 104.

[0093] The adhesive strength of the joining member 305 to the support 106 relative to the weight of the joining member 305 is necessary and sufficient, so the joining member 305 will not peel off from the support 106 regardless of the thickness of the joining member 305. Furthermore, the adhesive strength of the joining member 305 to the adherend 104 relative to the weight of the adherend 104 is necessary and sufficient, so the joining member 305 will not peel off from the joining member 305 regardless of the thickness of the adherend 104.

[0094] As described above, when the joining member 305 of the stamp 307 is peeled off from the adherend 104, the entire stamp 307 is deformed to be in a tightly adhered state, and the entire upper surface of the adherend 104 is peeled off with a weak force (0.1 MPa or less) by the joining member 305. At this time, the end of the adherend 104 is peeled off reliably, and then, as the elastic deformation of the joining member 305 returns to its original state, it is pulled up with a strong force, and the entire adherend 104 is peeled off stably.

[0095] The bonding strength between the adherend 104 and the growth substrate 101 after the growth substrate 101 is removed is sufficiently weaker than the adhesive strength of PDMS, which is 0.1 MPa. The bonding strength between the adherend 104 and the device substrate 110 is stronger than that between the stamp 307 and the adherend 104, being 0.1 MPa or more.

[0096] As described above, the elasticity of the convex portion of the second bonding portion 305b of the bonding member 305 causes the concave portion to naturally peel off from the adherend 104, and then, by pulling up the stamp 307, the stamp 307 can be peeled off without the outer periphery of the bonding member 305 pulling on the adherend 104.

[0097] 3-2 Effects As described above, according to the third embodiment, in addition to the effects of the first embodiment, by forming the stamp 307 from an elastic material such as PDMS and providing an inclination in the recess 305c, when the adherend 104 peels off from the second bonding portion 305b due to the deformation and recovery of the first bonding portion 305a, the adherend 104 peels off gradually from the deeper side to the shallower side of the recess 305c, making it possible to prevent the edge of the adherend 104 from cracking due to stress.

[0098] 4. Fourth embodiment 4-1 Configuration and operation The flow of forming the adherend 104 shown in Figures 1 to 4, 7 and 8, the block diagram of the transfer device 150 shown in Figure 20, and the flow chart shown in Figure 21 are also applied to the embodiment 4. The embodiment 4 differs from the embodiment 1 in the structure of the stamp 407.

[0099] Fig. 45 is a schematic cross-sectional view showing a step of bonding a first bonding portion 405a of a bonding member 405 (elastic body) of a stamp 407 serving as a transfer member used in a transfer method (electronic device manufacturing method) according to embodiment 4 to an adherend 104. Fig. 45 shows a state in which the stamp 407, which is composed of the bonding member 405 and the support 106, is brought into contact with the adherend 104.

[0100] Fig. 46 is a schematic cross-sectional view showing a step of bonding second bonding portion 405b of bonding member 405 of stamp 407 according to embodiment 4 to adherend 104. Fig. 46 shows a state in which bonding member 405 is deformed and comes into close contact with adherend 104.

[0101] 47 to 49 are schematic cross-sectional views showing steps (parts 1 to 3) of moving the bonding member 405 of the stamp 407 according to embodiment 4 while it is bonded to the adherend 104. Fig. 47 shows the stamp 407 starting to move upward (in the +z direction). Fig. 48 shows the state in which the stamp 407 has been moved upward (in the +z direction) and the adherend 104 has been peeled off from the growth substrate 101. Fig. 49 shows the state in which the bonding member 405 has restored to its original shape.

[0102] 50 and 51 are schematic cross-sectional views showing steps (part 1 and part 2) of bonding the adherend 104 to the device substrate 110 by the stamp 407 according to embodiment 4. Fig. 50 shows a state in which the adherend 104 is in contact with the device substrate 110. Fig. 51 shows a state in which the bonding member 405 is deformed when the adherend 104 is attached by applying a further load from the state shown in Fig. 50.

[0103] Fig. 52 and Fig. 53 are schematic cross-sectional views showing steps (part 1 and part 2) of separating the stamp 407 according to embodiment 4 from the adherend 104 bonded to the device substrate. Fig. 52 shows the process of the stamp 407 peeling off from the adherend 104 after the adherend 104 is attached to the device substrate 110. Fig. 53 shows the state in which the stamp 407 is separated from the adherend 104 after the adherend 104 is attached to the device substrate 110.

[0104] In the fourth embodiment, first, as shown in FIG. 45, a stamp 407 composed of a bonding member 405 and a support 106 is brought into contact with the adherend 104. Furthermore, as shown in FIG. 46, the stamp 407 is moved downward (in the -z direction) until the first bonding portion 405a and the second bonding portion 405b of the bonding member 405 are elastically deformed and the contact surface with the adherend 104 becomes flat. As in the first embodiment, the contact area between the bonding member 405 and the adherend 104 in FIG. 45 is smaller than the contact area between the bonding member 405 and the adherend 104 in FIG. 46. The amount of movement of the bonding member 405 is adjusted based on experimental results obtained in advance so that the bonding member 405 is elastically deformed and completely adheres to the adherend 104 as shown in FIG. 46, and the stamp 407 is operated by the transfer device 150 in which the amount of movement is stored. The material of the bonding member 405 is the same as that of the first embodiment.

[0105] Next, as shown in FIG. 48, the stamp 407 is moved upward (in the +z direction). At this time, the bonding member 405, which had been elastically deformed by being pressed from above, tries to return to its original shape when it is no longer subjected to pressure from above. At this time, the end portion of the bonded adherend 104 comes into contact with the adherend 104 due to deformation and is bonded by adhesive force, so the adherend 104 peels off from the end portion. Note that each figure is a schematic diagram and is depicted in a deformed form. Thereafter, as shown in FIG. 48, due to its characteristics, the end portion of the adherend 104 peels off from the growth substrate 101 due to deformation recovery, and the bonded end portion to the adherend 104 also peels off, but the peeling between the lower portion of the adherend 104 and the growth substrate 101 is completed before the end portion peels off.

[0106] Next, as shown in Fig. 49, after the adherend 104 is peeled off, the bonding member 405 tries to restore its original shape. The first bonding portion 405a and the second bonding portion 405b of the bonding member 405 of the stamp 407 return to their original shapes with respect to the picked-up adherend 104, and hold the adherend 104 in a state where the restoring elastic force of the first bonding portion 405a is balanced with the adhesive force of the first bonding portion 405a and the rigidity of the adherend 104. At this time, since the original shape of the bonding member 405 is a curved shape at the bottom, the adherend 104 is held in a slightly warped state as shown in the figure.

[0107] Next, as shown in FIG. 50, the adherend 104 held by the stamp 407 is transferred onto the device substrate 110. At this time, since the adherend 104 is slightly warped by the bonding member 405, the center of the adherend 104 is attached. Furthermore, as shown in FIG. 51, a downward force is applied from above to deform the first bonding portion 405a and the second bonding portion 405b of the bonding member 405, and the bonding member 405 is pressed down until it contacts the end of the adherend 104, so that the end also adheres to the device substrate 110. As in the first embodiment, the contact area between the bonding member 405 and the adherend 104 in FIG. 50 is smaller than the contact area between the bonding member 405 and the adherend 104 in FIG. 51.

[0108] 52, the stamp 407 is moved upward (in the +z direction), and the bonding member 405 is gradually peeled off from the adherend 104 from the edge toward the center. Finally, as shown in FIG 53, the stamp 407 is separated from the adherend 104 to complete the transfer.

[0109] 4-2 Effect As described above, by forming the stamp 407 from an elastic material such as PDMS and curving the first bonding portion 405a and the second bonding portion 405b, it is possible to make it difficult for stress-induced cracks to occur at the edge of the adherend 104 both when peeling the adherend 104 from the growth substrate 101 and when peeling the stamp 407 from the adherend 104 bonded to the device substrate 110. In addition, transfer is possible from the edge when peeling and from the center when attaching.

[0110] 5. Variations In the first to fourth embodiments, PDMS is used as the bonding material of the stamp, but other materials may be used as long as they are elastic and viscous. In addition, other shapes may be used for the shape of the bonding material of the stamp as long as there is a step or the like at the end and the end does not come into contact with the adherend 104 when the elastic body is in the shape before deformation.

[0111] 6. Additional Notes Various aspects of the present disclosure are summarized below as appendices. (Appendix 1) A method for transferring an adherend on a first substrate onto a second substrate, comprising the steps of: pressing a transfer member including a first bonding portion and a second bonding portion against the adherend on the first base material to elastically deform the first bonding portion and bond the first bonding portion and the second bonding portion to the adherend; The transfer member is moved away from the first substrate, thereby separating the adherend from the first substrate while the first bonding portion and the second bonding portion are bonded to the adherend; The transfer member is moved toward the second substrate to bond the adherend to the second substrate; The transfer member is moved away from the second base material, thereby separating the second bonding portion from the adherend while the first bonding portion remains bonded to the adherend; After the second bonded portion is separated, the transfer member is further moved away from the second base material, thereby separating the first bonded portion from the adherend. A transfer method comprising: (Appendix 2) A speed of movement of the transfer member when moving the transfer member away from the first substrate is faster than a speed of movement of the transfer member when moving the transfer member away from the second substrate. 2. The transfer method according to claim 1, (Appendix 3) The width of the first joint portion is narrower than the width of the adherend, The sum of the width of the first bonding portion and the width of the second bonding portion is equal to or greater than the width of the adherend. 3. The transfer method according to claim 1 or 2, (Appendix 4) A contact area between the transfer member and the adherend when the first bonding portion and the second bonding portion are bonded to the adherend is larger than a contact area between the transfer member and the adherend when the transfer member is moved away from the second base material after the second bonding portion is separated. 4. The transfer method according to any one of claims 1 to 3, (Appendix 5) pressing a transfer member including a first bonding portion and a second bonding portion against an adherend on the first base material to elastically deform the first bonding portion and bond the first bonding portion and the second bonding portion to the adherend; The transfer member is moved away from the first substrate, thereby separating the adherend from the first substrate while the first bonding portion and the second bonding portion are bonded to the adherend; The transfer member is moved toward the second substrate to bond the adherend to the second substrate; The transfer member is moved away from the second base material, thereby separating the second bonding portion from the adherend while the first bonding portion remains bonded to the adherend; After the second bonding portion is separated, the transfer member is further moved away from the second base material to separate the first bonding portion from the adherend and provide the adherend on the second base material. 2. A method for producing an electronic device comprising the steps of: (Appendix 6) A speed of movement of the transfer member when moving the transfer member away from the first substrate is faster than a speed of movement of the transfer member when moving the transfer member away from the second substrate. 6. A method for producing an electronic device according to claim 5, (Appendix 7) The width of the first joint portion is narrower than the width of the adherend, The sum of the width of the first bonding portion and the width of the second bonding portion is equal to or greater than the width of the adherend. 7. A method for producing an electronic device according to claim 5 or 6. (Appendix 8) A contact area between the transfer member and the adherend when the first bonding portion and the second bonding portion are bonded to the adherend is larger than a contact area between the transfer member and the adherend when the transfer member is moved away from the second base material after the second bonding portion is separated. 8. A method for producing an electronic device according to any one of claims 5 to 7. (Appendix 9) A bonding member that is bonded to an adherend by being pressed against the adherend, The joining member is A first bonding portion capable of bonding to the adherend; a second bonding portion that can be bonded to the adherend when the first bonding portion is bonded to the adherend; Including, The joining member is configured so that when the first joining portion is pressed against the adherend and elastically deformed, the first joining portion and the second joining portion join to the adherend, and when the pressure is released and the first joining portion returns to its original shape, the second joining portion separates from the adherend. A transfer member characterized by: (Appendix 10) The joint member further includes a support member for supporting the joint member. In a first direction from the support to the adherend, the height of the first bonded portion is higher than the height of the second bonded portion. 10. The transfer member according to claim 9, (Appendix 11) The second joint portion has a recess having a depth direction in the first direction. 11. The transfer member according to claim 10, (Appendix 12) The second joint portion is provided on the end side (outside) of the first joint portion. 12. A transfer member according to any one of claims 9 to 11. (Appendix 13) The support is harder than the joining member. 12. The transfer member according to claim 10 or 11. (Appendix 14) The width of the second joint is equal to or greater than half the height of the first joint and equal to or less than 1.5 times the width of the first joint. 14. A transfer member according to any one of claims 9 to 13. (Appendix 15) The width of the first joint is equal to or greater than the height of the first joint. 14. A transfer member according to any one of claims 9 to 13. (Appendix 16) The sum of the width of the first joint portion and the width of the second joint portion is equal to or greater than the height of the joint member including the first joint portion and the second joint portion minus the height of the first joint portion. 14. A transfer member according to any one of claims 9 to 13. (Appendix 17) The height of the joint member including the first joint portion and the second joint portion is 2 times or more and 20 times or less than the height of the first joint portion. 14. A transfer member according to any one of claims 9 to 13. (Appendix 18) The transfer member described in any one of Appendices 9 to 17, characterized in that the transfer member satisfies the following conditional formula (A1), and when the first bonding portion is released from a predetermined pressure and deformed, the second bonding portion is separated from the adherend. a1>A·H / (E·H1+A·H) …(A1) however, a1: contact area between the first bonding portion and the adherend A: Adhesive strength of the joining material E: Young's modulus of the joint material H1: Height of the first joint H: Height of the joint member. (Appendix 19) The transfer member described in any one of Appendices 9 to 17, characterized in that the transfer member satisfies the following conditional formula (A2), and when the first bonding portion is released from a predetermined pressure and deformed, the second bonding portion is separated from the adherend. a2 <E·H1 / (E·H1+A·H) …(A2) however, a2: Contact area between the second joint and the adherend A: Adhesive strength of the joining material E: Young's modulus of the joint material H1: Height of the first joint H: Height of the joint member. [Explanation of symbols]

[0112] 101 growth substrate (first base material), 104 functional unit (adherend), 105, 205, 305, 405 bonding member (elastic body), 105a, 205a, 305a, 405a first bonding portion, 105b, 205b, 305b, 405b second bonding portion, 105c recess (step portion), 205c, 305c recess, 106 support, 107, 207, 307, 407 stamp (transfer member), 110 device substrate (second base material).

Claims

1. A method for transferring an adherend on a first substrate onto a second substrate, comprising the steps of: A transfer member including a first bonding portion and a second bonding portion is pressed against the adherend on the first base material, thereby elastically deforming the first bonding portion and bonding the first bonding portion and the second bonding portion to the adherend; The transfer member is moved away from the first substrate, thereby separating the adherend from the first substrate while the first bonding portion and the second bonding portion are bonded to the adherend; The transfer member is moved toward the second substrate to bond the adherend to the second substrate; The transfer member is moved away from the second base material, thereby separating the second bonding portion from the adherend while the first bonding portion remains bonded to the adherend; After the second bonded portion is separated, the transfer member is further moved away from the second base material, thereby separating the first bonded portion from the adherend. A transfer method comprising:

2. A speed of movement of the transfer member when moving the transfer member away from the first substrate is faster than a speed of movement of the transfer member when moving the transfer member away from the second substrate.

2. The method according to claim 1, wherein the transfer medium is a conductive material.

3. The width of the first joint portion is narrower than the width of the adherend, The sum of the width of the first joint portion and the width of the second joint portion is equal to or greater than the width of the adherend.

3. The transfer method according to claim 1 or 2.

4. A contact area between the transfer member and the adherend when the first bonded portion and the second bonded portion are bonded to the adherend is larger than a contact area between the transfer member and the adherend when the transfer member is moved away from the second base material after the second bonded portion is separated.

3. The transfer method according to claim 1 or 2.

5. pressing a transfer member including a first bonding portion and a second bonding portion against an adherend on the first base material to elastically deform the first bonding portion and bond the first bonding portion and the second bonding portion to the adherend; The transfer member is moved away from the first substrate, thereby separating the adherend from the first substrate while the first bonding portion and the second bonding portion are bonded to the adherend; The transfer member is moved toward the second substrate to bond the adherend to the second substrate; The transfer member is moved away from the second base material, thereby separating the second bonding portion from the adherend while the first bonding portion remains bonded to the adherend; After the second bonded portion is separated, the transfer member is further moved away from the second base material to separate the first bonded portion from the adherend and provide the adherend on the second base material.

2. A method for producing an electronic device comprising the steps of:

6. A speed of movement of the transfer member when moving the transfer member away from the first substrate is faster than a speed of movement of the transfer member when moving the transfer member away from the second substrate. The method for manufacturing an electronic device according to claim 5 .

7. The width of the first joint portion is narrower than the width of the adherend, The sum of the width of the first joint portion and the width of the second joint portion is equal to or greater than the width of the adherend.

7. The method for manufacturing an electronic device according to claim 5 or 6.

8. A contact area between the transfer member and the adherend when the first bonded portion and the second bonded portion are bonded to the adherend is larger than a contact area between the transfer member and the adherend when the transfer member is moved away from the second base material after the second bonded portion is separated.

7. The method for manufacturing an electronic device according to claim 5 or 6.

9. A bonding member that is bonded to an adherend by being pressed against the adherend, The joining member is A first bonding portion capable of bonding to the adherend; a second bonding portion that can be bonded to the adherend when the first bonding portion is bonded to the adherend; Including, The joining member is configured such that, when the first joining portion is pressed against the adherend and elastically deformed, the first joining portion and the second joining portion join to the adherend, and, when the pressure is released and the first joining portion returns to its original shape, the second joining portion separates from the adherend. A transfer member characterized by:

10. The joint member further includes a support member for supporting the joint member. In a first direction from the support toward the adherend, the height of the first bonded portion is greater than the height of the second bonded portion.

10. The transfer member according to claim 9.

11. The second joint portion has a recess having a depth direction in the first direction.

11. The transfer member according to claim 10.

12. The second joint portion is provided on an end side of the first joint portion. The transfer member according to any one of claims 9 to 11.

13. The support is harder than the joining member.

12. The transfer member according to claim 10 or 11.

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