Rotation speed calculation device, rotation speed calculation method, substrate cleaning device, and substrate processing device

Abstract

To calculate the rotation speed of a substrate more accurately.SOLUTION: A rotation speed calculation device includes: a first vibration sensor that, when a substrate to be cleaned is rotated by rotating and driving a roller that holds a peripheral part of the substrate, detects vibration that occurs due to contact between the roller and a notch of the peripheral part of the substrate; a second vibration sensor that detects vibration of a housing that defines a space where the substrate is cleaned; and a rotation speed calculation unit that calculates the rotation speed of the substrate on the basis of the vibration detected by the first vibration sensor and the vibration detected by the second vibration sensor.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a rotational speed calculation device and a rotational speed calculation method for calculating the rotational speed of a substrate, as well as a substrate cleaning apparatus and a substrate processing apparatus. [Background technology]

[0002] In a substrate cleaning apparatus, a technique is known in which vibrations and sounds generated when a notch on the periphery of the substrate hits a roller are detected to calculate the rotation speed of the substrate (Patent Document 1). However, the detected vibrations and sounds include not only those generated when the notch hits the roller (signals), but also those generated by other factors (noises). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 7078602 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to calculate the rotation speed of a substrate with higher accuracy. [Means for solving the problem]

[0005] By way of example, the following solution is provided:

[0006] [1] a first vibration sensor that detects vibrations generated when a notch on a peripheral edge of a substrate to be cleaned comes into contact with a roller when the substrate is rotated by rotating a roller that holds the peripheral edge of the substrate; a second vibration sensor that detects vibration of a housing that defines a space in which the substrate is cleaned; a rotational speed calculation unit that calculates a rotational speed of the substrate based on the vibration detected by the first vibration sensor and the vibration detected by the second vibration sensor.

[0007] [2] The rotation speed calculation unit calculates the rotation speed of the substrate based on vibrations detected by the first vibration sensor and the second vibration sensor, so as to cancel vibrations of the housing.

[0008] [3] The rotation speed calculation unit calculates the rotation speed of the substrate based on a value obtained by subtracting the vibration detected by the second vibration sensor from the vibration detected by the first vibration sensor.

[0009] [4] two or more vibration sensors provided corresponding to two or more of the rollers, the vibration sensors detecting vibrations generated when a notch on a peripheral edge of a substrate contacts each of the rollers when the substrate is rotated by rotating the rollers that hold the peripheral edge of the substrate; a rotation speed calculation unit that calculates the rotation speed of the substrate based on vibrations detected by the two or more vibration sensors.

[0010] [5] The substrate cleaning apparatus according to [4], wherein the rotation speed calculation unit calculates the rotation speed of the substrate based on a sum of vibrations detected by the two or more vibration sensors.

[0011] [6] the number of the rollers is equal to the number of the vibration sensors, The rotation speed calculation device according to [4] or [5], wherein each of the two or more vibration sensors is provided corresponding to each of the plurality of rollers.

[0012] [7] a first sound sensor that detects a sound generated when a notch on a peripheral edge of a substrate to be cleaned hits a roller that holds the peripheral edge of the substrate and rotates the roller to rotate the substrate; a second sound sensor that detects a sound generated from a housing that defines a space in which the substrate is cleaned; a rotation speed calculation unit that calculates the rotation speed of the substrate based on the sound detected by the first sound sensor and the sound detected by the second sound sensor.

[0013] [8] two or more sound sensors provided corresponding to two or more of the rollers, the sound sensors detecting a sound generated when a notch on a peripheral edge of the substrate hits each of the rollers when the substrate is rotated by rotating the rollers that hold the peripheral edge of the substrate; a rotation speed calculation unit that calculates the rotation speed of the substrate based on sounds detected by the two or more sound sensors.

[0014] [9] The roller; a rotation drive unit that rotates the roller to rotate the substrate; a substrate cleaning tool that cleans the substrate by contacting the substrate to be cleaned while the substrate is rotated; A substrate cleaning apparatus comprising: a rotation speed calculation device according to any one of [1] to [8].

[0015]

[10] a substrate polishing apparatus for polishing a substrate; A substrate processing apparatus comprising: the substrate cleaning apparatus according to [9], which cleans a substrate after polishing.

[0016]

[11] A first step of rotating a substrate to be cleaned by rotating a roller that holds a peripheral portion of the substrate; a second step of detecting vibrations generated when a notch on a peripheral edge of the substrate strikes the roller using a first vibration sensor; a third step of detecting vibration of a housing defining a space in which the substrate is cleaned by a second vibration sensor; and a fourth step of calculating a rotation speed of the substrate based on the vibrations detected by the first vibration sensor and the vibrations detected by the second vibration sensor.

[0017]

[12] a first step of rotating a substrate to be cleaned by rotating a plurality of rollers that hold a peripheral portion of the substrate; a second step in which two or more vibration sensors detect vibrations generated when the notch on the peripheral edge of the substrate contacts each of the plurality of rollers; and and a third step of calculating a rotation speed of the substrate based on the vibrations detected by the two or more vibration sensors.

[0018]

[13] A first step of rotating a substrate to be cleaned by rotating a roller that holds a peripheral portion of the substrate; a second step of detecting a sound generated when a notch on a peripheral edge of the substrate hits the roller using a first sound sensor; A third step of detecting a sound generated from a housing defining a space in which the substrate is cleaned by a second sound sensor; and a fourth step of calculating the rotation speed of the substrate based on the sound detected by the first sound sensor and the sound detected by the second sound sensor.

[0019]

[14] a first step of rotating a substrate to be cleaned by rotating a plurality of rollers that hold a peripheral portion of the substrate; a second step of detecting sounds generated when the notch on the peripheral edge of the substrate hits each of the plurality of rollers using two or more sound sensors; and a fourth step of calculating the rotation speed of the substrate based on the sounds detected by the two or more sound sensors. Effect of the Invention

[0020] The rotation speed of the substrate can be calculated with higher accuracy. [Brief description of the drawings]

[0021] [Figure 1] 1 is a schematic configuration diagram of a substrate processing apparatus 100 according to an embodiment. [Diagram 2] 1 is a schematic diagram of a substrate cleaning apparatus 4 according to a first embodiment. [Diagram 3] FIG. 4 is a plan view showing the arrangement of rollers 42a to 42d and rotation drivers 43a and 43b. [Figure 4] 3A to 3C are diagrams illustrating a notch formed in a substrate W. [Diagram 5] 5A to 5C are diagrams illustrating a rotation speed calculation method in the first embodiment. [Figure 6] FIG. 4 is a schematic view of a substrate cleaning apparatus 4 according to a second embodiment. [Figure 7A] 13A to 13C are diagrams illustrating a rotation speed calculation method in the second embodiment. [Figure 7B] 13A to 13C are diagrams illustrating a rotation speed calculation method in the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] Hereinafter, an embodiment of the present invention will be specifically described with reference to the drawings.

[0023] (First embodiment) 1 is a schematic diagram of a substrate processing apparatus 100 according to one embodiment. The substrate processing apparatus 100 is, for example, a CMP apparatus, and includes a substantially rectangular housing 1 and a load port 2 disposed adjacent to the housing 1.

[0024] A substrate cassette (not shown) for stocking a plurality of substrates W is placed on the load port 2. An example of the substrate W may be a semiconductor wafer. However, the substrate W to be processed is not limited to a semiconductor wafer, and may be other types of substrates used in the manufacture of semiconductor devices, such as a glass substrate or a ceramic substrate. Furthermore, at least one surface of the substrate W has a semiconductor film, a metal film, or the like formed thereon.

[0025] The substrate processing apparatus 100 includes one or more (four in FIG. 1) substrate polishing apparatuses 3a-3d (which may be collectively referred to as "substrate polishing apparatuses 3" when no particular distinction is made), one or more (two in FIG. 1) substrate cleaning apparatuses 4a, 4b (which may be collectively referred to as "substrate cleaning apparatus 4" when no particular distinction is made), and one or more (one in FIG. 1) substrate drying apparatuses 5, which are arranged inside a housing 1.

[0026] As an example, substrate polishing apparatuses 3a-3d are arranged along one longitudinal side of housing 1. Substrate cleaning apparatuses 4a and 4b and substrate drying apparatus 5 are arranged along the other longitudinal side of housing 1.

[0027] The substrate polishing apparatus 3 polishes the surface of the substrate W. More specifically, the substrate polishing apparatus 3 supplies slurry onto the substrate W while rotating the substrate W, and polishes the surface of the substrate W by pressing a polishing member (not shown) against the surface of the substrate W. Polishing debris and slurry may remain on the substrate W after polishing.

[0028] The substrate cleaning apparatus 4 cleans the surface of the substrate W after polishing. More specifically, the substrate cleaning apparatus 4 cleans the surface of the substrate W by pressing a substrate cleaning tool (not shown in FIG. 1) against the surface of the substrate W while rotating the substrate W. A specific example of the substrate cleaning apparatus 4 will be described later.

[0029] The substrate drying apparatus 5 dries the surface of the cleaned substrate W. For example, the substrate drying apparatus 5 is a spin drying apparatus that sprays isopropyl alcohol vapor from a spray nozzle onto the rotating substrate W to dry the substrate W, while rotating the substrate W at high speed to dry the substrate W by centrifugal force.

[0030] Furthermore, substrate processing apparatus 100 is equipped with substrate transfer devices 6a to 6d (which may be collectively referred to as “substrate transfer devices 6” when no particular distinction is required), which are disposed inside housing 1. As shown in FIG.

[0031] The substrate transport device 6a is disposed adjacent to the load port 2. The substrate transport device 6a receives an unprocessed substrate W from the load port 2 and passes it to the substrate transport device 6b, and receives a processed substrate W from the substrate transport device 6b.

[0032] Substrate transport device 6b extends in the longitudinal direction in the center of housing 1. Substrate transport device 6b receives an unprocessed substrate W from substrate transport device 6a and transports it to one of the substrate polishing devices 3a-3d, receives a polished substrate W from the substrate polishing devices 3a-3d and passes it to substrate transport device 6c, and receives a dried substrate W from substrate transport device 6d and passes it to substrate transport device 6a.

[0033] The substrate transport device 6c is disposed between the substrate cleaning devices 4a and 4b. The substrate transport device 6c receives the polished substrate W from the substrate transport device 6b and transports it to either of the substrate cleaning devices 4a or 4b, and receives the cleaned substrate W from the substrate cleaning device 4a and transports it to the substrate cleaning device 4b.

[0034] The substrate transport device 6d is disposed between the substrate cleaning device 4b and the substrate drying device 5. The substrate transport device 6d receives the cleaned substrate W from the substrate cleaning device 4b and transports it to the substrate drying device 5, and receives the dried substrate W from the substrate drying device 5 and passes it to the substrate transport device 6b.

[0035] The arrangement of the substrate polishing apparatus 3, the substrate cleaning apparatus 4, the substrate drying apparatus 5 and the substrate transport apparatus 6 is merely an example. It is sufficient that one or more substrate transport apparatuses 6 are provided so that the substrate W can be transported through the substrate polishing apparatus 3, the substrate cleaning apparatus 4 and the substrate drying apparatus 5 in this order.

[0036] 2 is a schematic diagram of a substrate cleaning apparatus 4 according to the first embodiment. The substrate cleaning apparatus 4 includes one or more (four in this embodiment) rollers 42a to 42d (only rollers 42a and 42b are shown in FIG. 2), rotation drivers 43a and 43b, substrate cleaners 44a and 44b, a cleaning liquid supply nozzle 45, and a housing 46.

[0037] The rollers 42a to 42d hold the peripheral edge of the substrate W. The rotation drive units 43a and 43b rotate the substrate W by driving the rollers 42a to 42d to rotate.

[0038] 3 is a plan view showing the arrangement of rollers 42a to 42d and rotational drivers 43a and 43b. Rollers 42a to 42d are arranged in this order at equal intervals in a clockwise direction. For example, rollers 42b and 42d are arranged adjacent to roller 42a, and roller 42c is arranged opposite roller 42a.

[0039] The rotational drive units 43a and 43b each have a motor (not shown). As shown in FIG. 3, the motor of the rotational drive unit 43a rotates and drives the rollers 42a and 42d via a pulley and a belt. The motor of the rotational drive unit 43b rotates and drives the rollers 42b and 42c via a pulley and a belt. The rotational drive units 43a and 43b rotate the rollers 42a to 42d in the same direction (counterclockwise in the example shown in FIG. 3). As a result, the substrate W held by the rollers 42a to 42d is rotated in the opposite direction to the rotational direction of the rollers 42a to 42d (clockwise in the example shown in FIG. 3) due to frictional forces acting between each of the rollers 42a to 42d and the peripheral edge of the substrate W.

[0040] In this embodiment, a notch (a part of the substrate W is cut out in a V-shape) is formed on the peripheral edge of the substrate W as shown in Fig. 4. Therefore, when the substrate W rotates and the notch hits the rollers 42a to 42d, vibrations and noise are generated. If the rotation speed (number of rotations per unit time) of the substrate W is constant, vibrations and noise are generated periodically. Therefore, the rotation speed can be calculated from this period.

[0041] Returning to Fig. 2, the substrate cleaners 44a and 44b come into contact with the upper and lower surfaces of the substrate W, respectively, to clean the substrate W. The substrate cleaners 44a and 44b shown in Fig. 2 are long, cylindrical, and are roll substrate cleaners (roll sponges) made of, for example, polyvinyl alcohol (PVA). However, the substrate cleaners 44a and 44b do not have to be roll cleaners, and may be, for example, cylindrical pen-type cleaners extending in the vertical direction, or buff cleaning and polishing members having a rotation axis extending in the vertical direction.

[0042] The cleaning liquid supply nozzle 45 supplies a cleaning liquid to the upper surface of the substrate W. The cleaning liquid may be pure water or a chemical liquid. Also, a cleaning liquid supply nozzle that supplies a cleaning liquid to the lower surface of the substrate W may be provided.

[0043] The housing 46 defines a cleaning space in which the substrate W is cleaned. The housing 46 contains at least the rollers 42a to 42d, the substrate cleaners 44a and 44b, and the cleaning liquid supply nozzle 45, and may further contain the rotational drive units 43a and 43b. By arranging the rollers 42a to 42d, the substrate cleaners 44a and 44b, and the cleaning liquid supply nozzle 45 inside the housing 46, the cleaning liquid supplied onto the substrate W is prevented from scattering outside the cleaning space.

[0044] An opening (substrate loading / unloading port) for loading or unloading the substrate W is formed in a side wall of the housing 46, and the substrate loading / unloading port can be opened and closed by shutters 46a, 46b. An exhaust port 46c is also formed in the bottom of the housing 46. Air inside the housing 46 is exhausted from the exhaust port 46c, and air outside the housing 46 flows in through gaps between the substrate loading / unloading port and the shutters 46a, 46b, thereby ventilating the cleaning space.

[0045] As one of the features of this embodiment, a rotational speed calculation device 50 is provided in the substrate cleaning apparatus 4. The rotational speed calculation device 50 may be included in the substrate cleaning apparatus 4, or may be separate from the substrate cleaning apparatus 4. The rotational speed calculation device 50 has vibration sensors 51 and 52 and a rotational speed calculation unit 53.

[0046] The vibration sensor 51 detects vibrations generated when the notch of the substrate W hits the rollers 42a to 42d during substrate cleaning. In detail, the vibration sensor 51 is provided corresponding to one of the rollers 42a to 42d (roller 42a in the example of FIG. 2), and mainly detects vibrations generated when the notch of the substrate W hits the roller 42a. There is no particular restriction on the installation position of the vibration sensor 51, but it is installed on the motor, for example, as shown in FIG. 2. However, the vibration sensor 51 does not only detect vibrations generated when the notch of the substrate W hits the roller 42a, but also detects vibrations caused by other factors (particularly, vibrations of the housing 46, as described later).

[0047] The vibration sensor 52 mainly detects vibration of the housing 46. There is no particular limitation on the installation position of the vibration sensor 52, but it is attached to the inside or outside of the housing 46, for example.

[0048] The rotation speed calculation unit 53 calculates the rotation speed of the substrate W based on the vibrations detected by the vibration sensors 51 and 52 .

[0049] FIG. 5 is a diagram illustrating a rotation speed calculation method in the first embodiment.

[0050] 5(a) shows a schematic diagram of vibrations that occur when the substrate W rotates and the notch hits the roller 42a. If the rotation speed of the substrate W is constant, large vibrations occur at a constant period T. In the illustrated example, large vibrations occur at times t1, t2, and t3. Therefore, the rotation speed can be calculated from the difference in time at which the large vibrations occur (for example, t2-t1, t3-t2). Alternatively, the rotation speed can be calculated from the number of times that large vibrations occur per unit time.

[0051] 5(a) by the vibration sensor 51. This is because the substrate cleaning apparatus 4 generates vibrations other than the vibration generated by the notch hitting the roller 42a. Such vibrations include, for example, vibrations from the housing 46.

[0052] FIG. 5(b) shows a schematic diagram of vibrations generated from the housing 46. The housing 46 generates vibrations due to various factors. These vibrations include vibrations unrelated to the rotation of the substrate W. This vibration X1 may be periodic or non-periodic. Such vibrations generated from the housing 46 are detected by the vibration sensor 52. FIG. 5(b) can also be said to be the vibration X1 detected by the vibration sensor 52. The vibration X1 is noise in the calculation of the rotation speed.

[0053] Fig. 5(c) shows a schematic diagram of the vibration X2 detected by the vibration sensor 51. The vibration sensor 51 mainly detects vibrations generated when the notch of the substrate W hits the roller 42a, but also detects other vibrations. The other vibrations are particularly large when they are generated from the housing 46. Therefore, the vibration X2 detected by the vibration sensor 51 is a superposition of the vibration generated when the notch of the substrate W hits the roller 42a (Fig. 5(a)) and the vibration generated from the housing 46 (Fig. 5(b)).

[0054] If the rotation speed calculation unit 53 were to attempt to calculate the rotation speed only from the vibration X2 detected by the vibration sensor 51, there is a risk that it will mistakenly recognize, for example, the time t1-t2' in Figure 5(c) as the rotation period, and calculate an incorrect rotation speed.

[0055] Therefore, the rotation speed calculation unit 53 of this embodiment takes into account not only the vibration X2 detected by the vibration sensor 51 but also the vibration X1 detected by the vibration sensor 52, and calculates the rotation speed of the substrate W by canceling the vibration of the housing 46.

[0056] As a specific processing example, the rotation speed calculation unit 53 subtracts the vibration X1 detected by the vibration sensor 52 from the vibration X2 detected by the vibration sensor 51. This cancels the vibration of the housing 46 as shown in Fig. 5(d), and a value (signal) corresponding to the vibration mainly caused by the notch hitting the roller 42a is obtained. In this signal, a large value occurs at a period T in response to the notch hitting the roller 42a.

[0057] Then, based on this signal value, the rotation speed calculation unit 53 calculates the rotation speed of the substrate W. For example, the rotation speed calculation unit 53 can calculate the rotation speed of the substrate W from the period T at which the signal shown in Fig. 5(d) becomes equal to or greater than a predetermined value. Alternatively, the rotation speed calculation unit 53 can calculate the rotation speed of the substrate W from the number of times per unit time that the signal shown in Fig. 5(d) becomes equal to or greater than a predetermined value.

[0058] In this way, in the first embodiment, the rotation speed is calculated by subtracting the vibration of the housing 46. Therefore, even if the vibration from the housing 46 becomes noise, the effect of the noise can be suppressed and the accuracy of the rotation speed calculation can be improved.

[0059] A sound sensor (for example, a microphone) may be used instead of the vibration sensors 51 and 52. The sound sensor instead of the vibration sensor 51 detects the sound generated when the notch hits the roller. The sound sensor instead of the vibration sensor 52 is provided in the housing 46, for example, and detects the sound generated from the housing.

[0060] Second embodiment In the second embodiment described below, a vibration sensor is provided on each of the rollers 42a to 42d. Below, the description of the points in common with the first embodiment will be omitted or simplified, and the differences will be mainly described. In this embodiment, for the sake of simplicity, the vibrations generated in the housing 46 are not taken into consideration, and the rollers 42a to 42d are arranged at equal intervals.

[0061] 6 is a schematic diagram of a substrate cleaning apparatus 4 according to the second embodiment. A rotational speed calculation device 50 provided in this substrate cleaning apparatus 4 has vibration sensors 61a-61d (only vibration sensors 61a and 61b are shown in FIG. 6) and a rotational speed calculation unit 62. The vibration sensors 61a-61 are provided corresponding to the rollers 42a-42d, respectively. They are installed, for example, in the motors corresponding to the respective rollers. The vibration sensors 61a-61d mainly detect vibrations generated when the notches of the substrate W hit the rollers 42a-42d, respectively.

[0062] 7A and 7B are diagrams illustrating a rotation speed calculation method in the second embodiment. 7A(a) to (d) respectively show schematic diagrams of vibrations generated when the notch hits the rollers 42a to 42d. The period of vibrations generated in each of the rollers 42a to 42d is a constant value T corresponding to the rotation speed of the substrate W, but the phases are shifted by T / 4 (if the rollers 42a to 42d are not disposed at equal intervals, the phases are shifted according to the intervals between them).

[0063] 7B(a) to (d) show schematic diagrams of vibrations Xa to Xd detected by the vibration sensors 61a to 61d, respectively.

[0064] As shown in Fig. 7B(a), the vibration sensor 61a corresponding to the roller 42a detects vibrations caused by the notch hitting the roller 42a at times t1, t2, and t3. Since this vibration occurs in the roller 42a corresponding to the vibration sensor 61a, it is detected as being relatively large. However, it is not necessarily large enough to calculate the rotation speed.

[0065] The vibration sensor 61a detects vibrations caused by the notch hitting the roller 42b at times t1+T / 4, t2+T / 4, and t3+T / 4. This vibration is generated between the roller 42a corresponding to the vibration sensor 61a and the adjacent roller 42b, and is therefore detected as being relatively small.

[0066] The vibration sensor 61a detects vibrations caused by the notch hitting the roller 42c at times t1+2T / 4, t2+2T / 4, and t3+2T / 4. Since these vibrations are generated by the roller 42c facing the roller 42a corresponding to the vibration sensor 61a, they are smaller than the vibrations detected at times t1, etc., but larger than the vibrations detected at times t1+T / 4, etc.

[0067] The vibration sensor 61a detects vibrations caused by the notch hitting the roller 42c at times t1+3T / 4, t2+3T / 4, and t3+3T / 4. Since these vibrations occur in the roller 42a corresponding to the vibration sensor 61a and the adjacent roller 42c, they are detected to be at the same level as the vibrations detected at times t1+T / 4, etc.

[0068] The vibrations Xb to Xd (FIGS. 7B(b) to (d)) detected by the vibration sensors 61b to 61d are each shifted in phase by T / 4 from the vibration X1 detected by the vibration sensor 61a.

[0069] The rotation speed calculation unit 62 of this embodiment calculates the rotation speed of the substrate W based on the vibrations Xa to Xd detected by the vibration sensors 61a to 61d. Specifically, the rotation speed calculation unit 62 adds up the vibrations Xa to Xd. As a result, as shown in FIG. 7B(e), a value (signal) corresponding to the vibration generated when the notch hits each of the rollers 42a to 42d is obtained. In this signal, large values ​​are generated at a period of T / 4 in response to the notch hitting each of the rollers 42a to 42d. Even if the vibration generated when the notch hits each of the rollers 42a to 42d is not sufficiently large, by adding them up, the signal value corresponding to the vibration becomes sufficiently large.

[0070] Then, based on this signal value, the rotation speed calculation section 62 calculates the rotation speed of the substrate W. For example, the rotation speed calculation section 62 can calculate the rotation speed of the substrate W from the period T / 4 at which the signal shown in Fig. 7B(e) becomes equal to or greater than a predetermined value. Alternatively, the rotation speed calculation section 62 can calculate the rotation speed of the substrate W from the number of times per unit time that the signal shown in Fig. 5(d) becomes equal to or greater than a predetermined value.

[0071] In this way, in the second embodiment, the vibrations generated in each of the rollers 42a to 42d are added together, so that even if the vibrations generated in each of the rollers 42a to 42d are not sufficiently large, the accuracy of the rotation speed calculation can be improved.

[0072] The vibration sensors 61a to 61d may be provided corresponding to all of the rollers 42a to 42d, respectively, or the vibration sensors 61a and 61c may be provided only to some of the rollers (for example, the rollers 42a and 42c facing each other).

[0073] Instead of the vibration sensors 61a to 61d, a sound sensor (for example, a microphone) that detects the sound generated when the notch hits the roller may be used.

[0074] As described above, according to the present disclosure, there is no need to use an idler puller to calculate the rotation speed, the number of parts can be reduced, and the idler puller does not contaminate the substrate W. Furthermore, even if the vibrations and sounds generated by the notch hitting the roller are small, the rotation speed can be calculated with high accuracy.

[0075] Any part or all of the functional units described in this specification may be realized by a program. The program mentioned in this specification may be distributed in a non-temporary manner recorded on a computer-readable recording medium, or may be distributed via a communication line (including wireless communication) such as the Internet, or may be distributed in a state in which it is installed on any terminal.

[0076] Based on the above description, a person skilled in the art may be able to conceive additional effects and various modifications of the present invention, but the aspects of the present invention are not limited to the individual embodiments described above. For example, inventions that extract only a part of each embodiment or inventions that combine multiple embodiments are naturally envisioned. Various additions, modifications, and partial deletions are possible within the scope of the conceptual idea and intent of the present invention derived from the contents defined in the claims and their equivalents.

[0077] For example, what is described in this specification as one device (or component, the same applies below) (including what is depicted in the drawings as one device) may be realized by multiple devices. Conversely, what is described in this specification as multiple devices (including what is depicted in the drawings as multiple devices) may be realized by one device. Alternatively, some or all of the means or functions included in one device may be included in another device. Furthermore, a "system" may be composed of one device, or two or more devices.

[0078] Furthermore, not all of the features described in this specification are essential requirements, and in particular, features described in this specification but not included in the claims may be considered optional additional features.

[0079] Furthermore, unless otherwise specified, the term "means" in this specification and claims refers to hardware itself (or a function realized by hardware), and does not include a human being (or a human mental activity).

[0080] It should be noted that the applicant is merely aware of the inventions disclosed in the documents in the "Prior Art Documents" column of this specification, and the present invention does not necessarily aim to solve the problems of the inventions disclosed in the documents. The problems that the present invention aims to solve should be identified by taking into consideration the entire specification. For example, if the specification states that a specific effect is achieved by a specific configuration, it can also be said that the problem that is the reverse of the specific effect is solved. However, it is not necessarily intended that such a specific configuration is an essential requirement. [Explanation of symbols]

[0081] 100 Substrate processing apparatus 1. Housing 2 Loading port 3,3a~3d Substrate polishing equipment 4, 4a, 4b Substrate cleaning equipment 5 Substrate drying equipment 6, 6a to 6c Substrate transport device 42a~42d Laura 43a, 43b Rotation drive unit 44a, 44b Substrate cleaning tool 45 Cleaning fluid supply nozzle 46 Case 50 Rotational speed calculation device 51, 52, 61a to 61d Vibration sensor 53,62 Rotational speed calculation section

Claims

1. a first vibration sensor that detects vibrations generated when a notch on a peripheral edge of a substrate strikes a roller when the substrate is rotated by rotating a roller that holds the peripheral edge of the substrate; a second vibration sensor that detects vibration of a housing that defines a space in which the substrate is cleaned; a rotational speed calculation unit that calculates a rotational speed of the substrate based on the vibration detected by the first vibration sensor and the vibration detected by the second vibration sensor.

2. The rotation speed calculation device according to claim 1 , wherein the rotation speed calculation unit calculates the rotation speed of the substrate based on vibrations detected by the first vibration sensor and the second vibration sensor so that vibrations of the housing are cancelled.

3. 2. The rotational speed calculation device according to claim 1, wherein the rotational speed calculation unit calculates the rotational speed of the substrate based on a value obtained by subtracting the vibration detected by the second vibration sensor from the vibration detected by the first vibration sensor.

4. two or more vibration sensors provided corresponding to two or more of the rollers, the vibration sensors detecting vibrations generated when a notch on a peripheral edge of a substrate contacts each of the rollers when the substrate is rotated by rotating the rollers that hold the peripheral edge of the substrate; a rotation speed calculation unit that calculates a rotation speed of the substrate based on vibrations detected by the two or more vibration sensors.

5. 5. The rotational speed calculation device according to claim 4, wherein the rotational speed calculation section calculates the rotational speed of the substrate based on a sum of vibrations detected by the two or more vibration sensors.

6. the number of the rollers is equal to the number of the vibration sensors, The rotational speed calculation device according to claim 4 , wherein each of the two or more vibration sensors is provided corresponding to each of the plurality of rollers.

7. a first sound sensor that detects a sound generated when a notch on a peripheral edge of a substrate to be cleaned hits a roller that holds the peripheral edge of the substrate when the substrate is rotated by rotating the roller; a second sound sensor that detects a sound generated from a housing that defines a space in which the substrate is cleaned; a rotation speed calculation unit that calculates a rotation speed of the substrate based on the sound detected by the first sound sensor and the sound detected by the second sound sensor.

8. two or more sound sensors provided corresponding to two or more of the rollers, the sound sensors detecting a sound generated when a notch on a peripheral edge of a substrate hits each of the rollers when the substrate is rotated by rotating the rollers that hold the peripheral edge of the substrate; and a rotation speed calculation unit that calculates the rotation speed of the substrate based on the sounds detected by the two or more sound sensors.

9. The roller; a rotation drive unit that rotates the roller to rotate the substrate; a substrate cleaning tool that cleans the substrate by contacting the substrate to be cleaned while the substrate is rotated; A substrate cleaning apparatus comprising: the rotation speed calculation device according to claim 1 .

10. a substrate polishing apparatus for polishing a substrate; A substrate processing apparatus comprising: the substrate cleaning apparatus according to claim 9 , which cleans a substrate after polishing.

11. a first step of rotating a substrate to be cleaned by rotating a roller that holds a peripheral portion of the substrate; a second step of detecting vibrations generated when a notch on a peripheral edge of the substrate strikes the roller using a first vibration sensor; a third step of detecting vibration of a housing defining a space in which the substrate is cleaned by a second vibration sensor; and a fourth step of calculating a rotation speed of the substrate based on the vibrations detected by the first vibration sensor and the vibrations detected by the second vibration sensor.

12. a first step of rotating a substrate to be cleaned by rotating a plurality of rollers that hold a peripheral portion of the substrate; a second step in which two or more vibration sensors detect vibrations generated when the notch on the peripheral edge of the substrate contacts each of the plurality of rollers; and and a third step of calculating a rotation speed of the substrate based on the vibrations detected by the two or more vibration sensors.

13. a first step of rotating a substrate to be cleaned by rotating a roller that holds a peripheral portion of the substrate; a second step of detecting a sound generated by a notch on a peripheral edge of the substrate hitting the roller with a first sound sensor; a third step of detecting a sound generated from a housing defining a space in which the substrate is cleaned by a second sound sensor; and a fourth step of calculating a rotation speed of the substrate based on the sound detected by the first sound sensor and the sound detected by the second sound sensor.

14. a first step of rotating a substrate to be cleaned by rotating a plurality of rollers that hold a peripheral portion of the substrate; a second step of detecting sounds generated by the notches on the peripheral edge of the substrate hitting each of the plurality of rollers using two or more sound sensors; and a fourth step of calculating a rotation speed of the substrate based on the sounds detected by the two or more sound sensors.

Images