Temperature sensor

Abstract

To provide a temperature sensor whose thermal responsiveness can be improved.SOLUTION: A temperature sensor 1 includes a temperature transducer 3, and a case that accommodates the temperature transducer 3 and having a first region and a second region different from the first region on an outer surface. The case includes a case part including a front surface including the first region and having a first thermal conductivity, and formed of resin, and a case part 22 including a substrate 23 having a front surface 23a including the second region and having a second thermal conductivity higher than the first thermal conductivity, and a back surface facing the surface 23a. The temperature transducer 3 is mounted on the back surface of the substrate 23.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a temperature sensor. [Background technology]

[0002] A known temperature sensor includes a temperature sensing element, a case made of metal that contains the temperature sensing element, and a filler made of resin that fills the inside of the case (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6371002 Summary of the Invention [Problem to be solved by the invention]

[0004] When detecting the temperature of an object, the case of the above-mentioned temperature sensor is in contact with the object. The thermal conduction path from the object to the temperature sensing element includes the case and the filler. Generally, resin has a lower thermal conductivity than that of metal. Therefore, the above-mentioned temperature sensor has room for improvement in terms of thermal responsiveness.

[0005] An object of one aspect of the present invention is to provide a temperature sensor capable of improving thermal response. [Means for solving the problem]

[0006] A temperature sensor according to one embodiment includes at least one temperature sensing element and a case that houses the at least one temperature sensing element and includes on its outer surface a first region and a second region different from the first region. The case includes a first case portion and a second case portion. The first case portion includes a surface that includes the first region and has a first thermal conductivity, and is made of resin. The second case portion includes a substrate that includes the second region and has a surface that has a second thermal conductivity greater than the first thermal conductivity, and a back surface that faces the front surface. The at least one temperature sensing element is mounted on the back surface of the substrate.

[0007] In the one aspect, the substrate included in the second case portion includes a surface including the second region of the outer surface of the case and a back surface opposite the surface. At least one temperature-sensing element is mounted on the back surface of the substrate. A heat transfer path from the surface of the substrate to the at least one temperature-sensing element includes the substrate, but does not include the first case portion made of resin. The surface of the substrate has a second thermal conductivity that is greater than the first thermal conductivity of the surface including the first region of the outer surface. In the one aspect, when detecting the temperature of an object, the surface of the substrate, rather than the first case portion, is brought into contact with the object, so that heat from the object is easily transferred to the at least one temperature-sensing element. Therefore, the one aspect can improve thermal responsiveness.

[0008] In order to improve the accuracy of temperature detection by a temperature sensor, it is necessary to maintain the object and the temperature sensor in contact with each other. For this reason, when the temperature sensor is brought into contact with the object, a holder is sometimes used to hold the temperature sensor on the object. The holder is in contact with the object and the case. A configuration in which the case can be deformed to match the shape of the portion of the holder that is in contact with the temperature sensor tends to reliably maintain the object and the case in contact with each other. In the one aspect, the first case part is made of resin. For example, when the holder abuts against the first case part, the first case part may deform to conform to the shape of the part of the holder that abuts against the first case part. Therefore, the one aspect can reliably maintain the state in which the object and the first case part abut against each other. The one aspect can improve the accuracy of temperature detection.

[0009] In the above aspect, the first case portion may be formed with an engagement portion that engages with a holder that holds the temperature sensor. The configuration in which the engaging portion is formed on the first case portion can more reliably maintain the state in which the object and the first case portion are in contact with each other, and therefore this configuration can further improve the accuracy of temperature detection.

[0010] In the one aspect, the substrate may include a side surface connecting the front surface and the back surface. The first case portion may include a plurality of wall portions facing the side surface and spaced apart from each other along the side surface. A portion of the side surface may be exposed between adjacent wall portions of the plurality of wall portions. The configuration in which the first case portion includes the plurality of wall portions increases the connection strength between the first case portion and the second case portion. Therefore, the first case portion and the second case portion are unlikely to peel off from each other. The configuration in which a part of the side surface is exposed between adjacent wall portions among the plurality of wall portions can increase the heat collection performance of the substrate. Therefore, this configuration can further improve the thermal responsiveness.

[0011] In the above aspect, the substrate may include a metal plate including a first main surface including the surface and a second main surface opposite to the first main surface. The configuration in which the substrate includes the above-mentioned metal plate easily and reliably realizes a surface having the second thermal conductivity greater than the first thermal conductivity.

[0012] In the above-mentioned one aspect, the substrate may include an insulating layer disposed on the second main surface of the metal plate. The at least one temperature sensitive element may be disposed on the insulating layer. The configuration in which the at least one temperature-sensitive element is disposed on the insulating layer reliably maintains electrical insulation between the at least one temperature-sensitive element and the metal plate.

[0013] In one aspect, the substrate may include a conductor layer disposed on an insulating layer, and the at least one temperature sensitive element may be mounted on the conductor layer. A configuration in which at least one temperature-sensing element is mounted on the conductor layer easily and reliably realizes a configuration in which at least one temperature-sensing element is electrically mounted on a substrate, even in a configuration in which an insulating layer is disposed on a metal plate.

[0014] The one aspect above may include a conductor having a first end located within the case and electrically connected to at least one temperature sensing element, and a second end exposed from the case. The configuration including the above-mentioned conducting wire simply and reliably realizes a configuration for leading a signal line electrically connected to at least one temperature sensing element to the outside of the case including the first case portion and the second case portion.

[0015] In the above aspect, the at least one temperature sensitive element may include a plurality of temperature sensitive elements. The plurality of temperature sensitive elements may be mounted on a rear surface of the substrate. Effect of the Invention

[0016] One aspect of the present invention provides a temperature sensor that can improve thermal response. [Brief description of the drawings]

[0017] [Figure 1] FIG. 1 is a perspective view showing a temperature sensor according to an embodiment. [Diagram 2] FIG. 2 is a perspective view showing the temperature sensor according to the present embodiment. [Diagram 3] FIG. 3 is a perspective view showing the configuration of the substrate and the temperature sensitive element. [Figure 4] FIG. 4 is a diagram showing a cross-sectional configuration of the temperature sensor according to this embodiment. [Diagram 5]FIG. 5 is a diagram showing a cross-sectional configuration of the temperature sensor according to this embodiment. [Figure 6] FIG. 6 is a perspective view showing the configuration of the temperature sensor, the holder, and the target object according to this embodiment. [Figure 7] FIG. 7 is a plan view showing the configuration of the temperature sensor and the holder according to the present embodiment. [Figure 8] FIG. 8 is a perspective view showing a temperature sensor according to a modified example of this embodiment. [Figure 9] FIG. 9 is a plan view showing a configuration of a temperature sensor and a holder according to a modified example of this embodiment. [Figure 10] FIG. 10 is a plan view showing the configuration of the substrate and the temperature sensitive element. [Figure 11] FIG. 11 is a plan view showing the configuration of the substrate and the temperature sensitive element. [Figure 12] FIG. 12 is a plan view showing the configuration of the substrate and the temperature sensitive element. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same elements or elements having the same functions will be denoted by the same reference numerals, and duplicated description will be omitted.

[0019] The configuration of a temperature sensor 1 according to this embodiment will be described with reference to Figs. 1 to 5. Figs. 1 and 2 are perspective views showing the temperature sensor according to this embodiment. Fig. 3 is a perspective view showing the configuration of a substrate and a temperature sensing element. Figs. 4 and 5 are diagrams showing a cross-sectional configuration of the temperature sensor according to this embodiment. As shown in Figs. 1 to 3, the temperature sensor 1 includes a case 2, a temperature sensing element 3, and a conducting wire 4.

[0020] The case 2 houses the temperature sensing element 3. When the temperature sensor 1 detects the temperature of an object, the case 2 faces the object. When the temperature sensor 1 detects the temperature of the object, the case 2 may abut against the object. When a holder is used to hold the temperature sensor 1 to the object when detecting the temperature of the object, the case 2 abuts against the holder. The case 2 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes, for example, a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges.

[0021] The case 2 includes a pair of side surfaces 2a, 2b, a pair of side surfaces 2c, and a pair of end surfaces 2d. The pair of side surfaces 2a, 2b face each other in a first direction D1. The pair of side surfaces 2c face each other in a second direction D2. The pair of end surfaces 2d face each other in a third direction D3. In this embodiment, the first direction D1, the second direction D2, and the third direction D3 are perpendicular to each other. In the case 2, one of the pair of side surfaces 2a, 2b and the pair of side surfaces 2c faces the target object, and another side surface different from the side surface faces the holder. In this embodiment, the side surface 2b faces the target object, and the side surface 2a faces the holder. An opening is formed in one of the pair of end surfaces 2d, and a conductive wire 4 is inserted into the opening.

[0022] The outer surface of the case 2 includes a pair of side surfaces 2a, 2b, a pair of side surfaces 2c, and a pair of end surfaces 2d. The outer surface of the case 2 is divided into a region R1 and a region R2 different from the region R1. That is, the case 2 includes an outer surface including the region R1 and the region R2. In this embodiment, the side surface 2a, the pair of side surfaces 2c, and the pair of end surfaces 2d form the region R1, and the side surface 2b forms the region R2.

[0023] In the temperature sensor 1, the case 2 is composed of a case portion 21 and a case portion 22. That is, the case 2 includes the case portion 21 and the case portion 22. In this embodiment, the case portion 21 and the case portion 22 are integrally formed. The case portion 21 includes a surface 21a, a pair of side surfaces 21b facing each other, and a pair of end surfaces 21c facing each other. The surface 21a is perpendicular to the first direction D1. The pair of side surfaces 21b face each other in the second direction D2. The pair of end surfaces 21c face each other in the third direction D3.

[0024] The surface 21a has a pair of long sides and a pair of short sides. The surface 21a has a rectangular shape having a pair of long sides and a pair of short sides. That is, the case portion 21 has a rectangular shape having a pair of long sides and a pair of short sides in a plan view. The rectangular shape includes, for example, a shape in which each corner is chamfered and a shape in which each corner is rounded. In this embodiment, the long side direction of the surface 21a is the third direction D3, and the short side direction of the surface 21a is the second direction D2.

[0025] The surface 21a may have four sides that are the same length. That is, the surface 21a may have a square shape. The case portion 21 may have a square shape in a plan view. The surface 21a may have a circular shape. The case portion 21 may have a circular shape in a plan view. The circular shape includes, for example, a perfect circle shape, an oval shape, and an ellipse shape.

[0026] The pair of side surfaces 21b extend in the first direction D1 from corresponding long sides of the pair of long sides of the surface 21a. The pair of side surfaces 21b also extend in the third direction D3. The pair of end surfaces 21c extend in the first direction D1 from corresponding short sides of the pair of short sides of the surface 21a. The pair of end surfaces 21c also extend in the second direction D2.

[0027] The case portion 21 further includes a plurality of walls W1 and a plurality of walls W2. The plurality of walls W1 are provided on a pair of side surfaces 21b. The plurality of walls W1 are provided, for example, on an end of the side surface 21b opposite the surface 21a in the first direction D1 and approximately in the center in the third direction D3. In this embodiment, two walls W1 are provided on each of the pair of side surfaces 21b. The two walls W1 provided on each side surface 21b extend in the first direction D1 and are spaced apart from each other in the third direction D3.

[0028] The multiple wall portions W2 are provided on the pair of end faces 21c. The multiple wall portions W2 are provided, for example, on the end of the end face 21c opposite the face 21a in the first direction D1 and approximately in the center in the second direction D2. In this embodiment, two wall portions W2 are provided on one of the pair of end faces 21c. The two wall portions W2 provided on the one end face 21c extend in the first direction D1 and face each other in the third direction D3.

[0029] The surface of the case portion 21 includes a face 21a, a pair of side faces 21b, and a pair of end faces 21c. The surface of the case portion 21 constitutes a part of the outer surface of the case 2. In this embodiment, the face 21a constitutes the side face 2a of the case 2, the pair of side faces 21b constitutes the pair of side faces 2c of the case 2, and the pair of end faces 21c constitutes the pair of end faces 2d of the case 2. That is, in this embodiment, the face 21a, the pair of side faces 21b, and the pair of end faces 21c of the case portion 21 constitute a region R1 included in the outer surface of the case 2. Therefore, in this embodiment, the face 21a, the pair of side faces 21b, and the pair of end faces 21c include the region R1.

[0030] The case portion 21 is made of resin. The resin includes, for example, polypropylene resin or polyphenylene sulfide resin. The thermal conductivity of the resin is, for example, 0.3 W / (m·K) or more and 1 W / (m·K) or less. In this embodiment, the case portion 21 is made of polypropylene resin. The thermal conductivity of the polypropylene resin is, for example, 0.5 W / (m·K). The thermal conductivity of each of the surfaces of the case portion 21, i.e., the face 21a, the pair of side faces 21b, and the pair of end faces 21c, is, for example, 0.3 W / (m·K) or more and 1 W / (m·K) or less. The thermal conductivity of the surface of the case portion 21 made of polypropylene resin is, for example, 0.5 W / (m·K).

[0031] The case portion 22 includes a substrate 23. As shown in Fig. 3 and Fig. 4, the substrate 23 includes a front surface 23a, a back surface 23b, a side surface 23c, and a side surface 23d. In this embodiment, the substrate 23 includes a pair of side surfaces 23c and a pair of side surfaces 23d.

[0032] The front surface 23a and the back surface 23b have a pair of long sides and a pair of short sides. The front surface 23a and the back surface 23b have a rectangular shape having a pair of long sides and a pair of short sides. That is, the case portion 22 has a rectangular shape having a pair of long sides and a pair of short sides in a plan view. In this embodiment, the long side direction of the front surface 23a and the back surface 23b is the third direction D3, and the short side direction of the front surface 23a and the back surface 23b is the second direction D2.

[0033] The front surface 23a and the back surface 23b may have four sides that are the same length. That is, the front surface 23a and the back surface 23b may have a square shape. The case portion 22 may have a square shape in a plan view. The front surface 23a and the back surface 23b may have a circular shape. The case portion 22 may have a circular shape in a plan view. The circular shape includes, for example, a perfect circle shape, an oval shape, and an ellipse shape.

[0034] The back surface 23b faces the front surface 23a. In this embodiment, the back surface 23b faces the front surface 23a in the first direction D1. The back surface 23b is covered by the case portion 21. In this embodiment, the back surface 23b is in contact with the case portion 21, and the entire back surface 23b is covered by the case portion 21.

[0035] The side surface 23c extends in the first direction D1 so as to connect the front surface 23a and the back surface 23b. The side surface 23c connects the front surface 23a and the back surface 23b. The side surface 23c also extends in the third direction D3. The side surface 23c is covered by the case portion 21. In this embodiment, the side surface 23c includes a portion covered by the case portion 21 and a portion not covered by the case portion 21. The portion of the side surface 23c not covered by the case portion 21 is exposed between the adjacent wall portions W1. That is, in this embodiment, a part of the side surface 23c is exposed between the adjacent wall portions W1. As described above, the side surface 23c also extends in the third direction D3. Therefore, it can be said that the multiple wall portions W1 spaced apart from each other in the third direction D3 face the side surface 23c and are spaced apart from each other along the side surface 23c.

[0036] The side surface 23d extends in the first direction D1 so as to connect the front surface 23a and the back surface 23b. The side surface 23d also connects the front surface 23a and the back surface 23b. The side surface 23d also extends in the second direction D2. The side surface 23d is also covered by the case portion 21. The side surface 23d does not have to be covered by the case portion 21. In this embodiment, one of the pair of side surfaces 23d is covered by the case portion 21. The one side surface 23d includes a portion covered by the case portion 21 and a portion not covered by the case portion 21. The portion of the one side surface 23d that is not covered by the case portion 21 is exposed between the adjacent wall portions W2. That is, in this embodiment, a part of the one side surface 23d is exposed between the adjacent wall portions W2. As described above, the side surface 23d also extends in the second direction D2. Therefore, it can be said that the multiple wall portions W2 spaced apart from one another in the second direction D2 face the side surface 23d and are spaced apart from one another along the side surface 23d.

[0037] Furthermore, in this embodiment, the other side surface 23d of the pair of side surfaces 23d is not covered by the case portion 21. The other side surface 23d is entirely exposed from the case portion 21. The other side surface 23d may be covered by the case portion 21, similar to the one side surface 23d.

[0038] The surface of the case portion 22 includes the surface 23a and the side surface 23d of the pair of side surfaces 23d that is not covered by the case portion 21. The surface of the case portion 22, like the surface of the case portion 21, constitutes a part of the outer surface of the case 2. In this embodiment, the surface 23a constitutes the side surface 2b of the case 2, and the other side surface 23d, together with the end surface 21c, constitutes the corresponding end surface 2d of the pair of end surfaces 2d of the case 2. That is, in this embodiment, the surface 23a constitutes the region R2 included in the outer surface of the case 2, and the side surface 23d that is not covered by the case portion 21 constitutes the region R1 included in the outer surface of the case 2 together with the surface 21a, the pair of side surfaces 21b, and the pair of end surfaces 21c. Therefore, in this embodiment, the surface 23a includes the region R2, and the other side surface 23d includes the region R1 together with the surface 21a, the pair of side surfaces 21b, and the pair of end surfaces 21c. For example, if case part 21 constitutes a first case part, then case part 22 constitutes a second case part.

[0039] In this embodiment, the substrate 23 further includes a metal plate 24, an insulating layer 25, conductor layers 26 and 27, and an insulating layer 28. The metal plate 24 includes a main surface 24a, a main surface 24b, a pair of side surfaces 24c, and a pair of side surfaces 24d. In this embodiment, the main surface 24a constitutes the surface 23a. That is, in this embodiment, the main surface 24a includes the surface 23a of the substrate 23. As described above, the surface 23a constitutes the region R2 and the side surface 2b, so in this embodiment, it can be said that the main surface 24a constitutes the region R2 and the side surface 2b. In this embodiment, it can also be said that the main surface 24a includes the region R2. As described above, in this embodiment, when the temperature sensor 1 detects the temperature of the object, the side surface 2b faces the object. Therefore, in this embodiment, when the temperature sensor 1 detects the temperature of the object, the surface 23a faces the object. When the temperature sensor 1 detects the temperature of an object, the surface 23a may be in contact with the object. The principal surface 24b faces the principal surface 24a. In the present embodiment, the principal surface 24b faces the principal surface 24a in the first direction D1. The principal surface 24b is covered by the case portion 21. For example, when the principal surface 24a constitutes the first principal surface, the principal surface 24b constitutes the second principal surface.

[0040] Each of the main surfaces 24a, 24b has a pair of long sides and a pair of short sides. Each of the main surfaces 24a, 24b has a rectangular shape having a pair of long sides and a pair of short sides. That is, the metal plate 24 has a rectangular shape in a plan view. In this embodiment, the long side direction of each of the main surfaces 24a, 24b is the third direction D3, and the short side direction of each of the main surfaces 24a, 24b is the second direction D2.

[0041] Each of the main surfaces 24a, 24b may have four sides that are the same length as each other. That is, each of the main surfaces 24a, 24b may have a square shape. The metal plate 24 may have a square shape in a plan view. Alternatively, each of the main surfaces 24a, 24b may have a circular shape. The metal plate 24 may have a circular shape in a plan view.

[0042] The pair of side surfaces 24c extend in the first direction D1 so as to connect the main surface 24a and the main surface 24b. The pair of side surfaces 24c also extend in the third direction D3. In this embodiment, the pair of side surfaces 24c constitute the pair of side surfaces 23c. That is, in this embodiment, the pair of side surfaces 24c includes the pair of side surfaces 23c of the substrate 23. In this embodiment, a part of the side surface 24c is exposed between the adjacent wall portions W1.

[0043] The pair of side surfaces 24d extend in the first direction D1 so as to connect the main surface 24a and the main surface 24b. The pair of side surfaces 24d also extend in the second direction D2. In this embodiment, the pair of side surfaces 24d constitute the pair of side surfaces 23d. That is, in this embodiment, the pair of side surfaces 24d includes the pair of side surfaces 23d of the substrate 23. As described above, the side surfaces 23d that are not covered by the case portion 21 among the pair of side surfaces 23d constitute the region R1 and the end surface 2d. Therefore, in this embodiment, it can be said that the side surfaces 24d that constitute the side surfaces 23d that are not covered by the case portion 21 among the pair of side surfaces 24d constitute the region R2 and the end surface 2d. In this embodiment, it can be said that the corresponding side surfaces 24d among the pair of side surfaces 24d include the region R1. In this embodiment, a part of the side surface 24d is exposed between the adjacent wall portions W2.

[0044] In this embodiment, the metal plate 24 is made of aluminum. The thermal conductivity of aluminum is, for example, 239 W / (m·K). The thermal conductivity of the main surface 24a of the metal plate 24 made of aluminum is, for example, 239 W / (m·K). As described above, the main surface 24a includes the surface 23a of the substrate 23. Therefore, the thermal conductivity of the surface 23a is, for example, 239 W / (m·K). The thermal conductivity of the surface 23a is higher than the thermal conductivity of the surface of the case portion 21. For example, when the thermal conductivity of the surface of case portion 21 is the first thermal conductivity, the thermal conductivity of surface 23a is the second thermal conductivity.

[0045] In this embodiment, the thickness of the case portion 21 is greater than the thickness of the metal plate 24. The thickness of the case portion 21 is, for example, twice or more the thickness of the metal plate 24. The thickness of the case portion 21 is defined, for example, by the length from the back surface 23b to the surface 21a in the first direction D1. The thickness of the case portion 21 is, for example, twice or more and ten times or less the thickness of the metal plate 24. In this embodiment, the thickness of the case portion 21 is 3.8 times the thickness of the metal plate 24. The thickness of the metal plate 24 is, for example, 0.5 mm or more and 2.0 mm or less. In this embodiment, the thickness of the metal plate 24 is 1.0 mm.

[0046] As shown in FIG. 4 and FIG. 5, the insulating layer 25 is disposed on the main surface 24b. The insulating layer 25 is in contact with the main surface 24b. The insulating layer 25 covers the entire main surface 24b. The main surface 24a, the pair of side surfaces 24c, and the pair of side surfaces 24d of the metal plate 24 are exposed from the insulating layer 25. The insulating layer 25 is made of, for example, an organic insulating material or an inorganic insulating material. The insulating layer 25 is made of, for example, an epoxy resin. The insulating layer 25 may be made of, for example, an acrylic resin or a polyimide resin. The thickness of the insulating layer 25 is smaller than the thickness of the metal plate 24. The thickness of the insulating layer 25 is, for example, 50 μm or more and 200 μm or less. In this embodiment, the thickness of the insulating layer 25 is 100 μm.

[0047] The conductor layers 26, 27 are disposed on the insulating layer 25. The conductor layers 26, 27 are in contact with the insulating layer 25. The insulating layer 25 electrically insulates the metal plate 24 from the conductor layers 26, 27. The conductor layers 26 and 27 are spaced apart. In this embodiment, the conductor layers 26 and 27 are spaced apart in the second direction D2. The conductor layers 26, 27 have a thickness of, for example, 10 μm or more and 100 μm or less. In this embodiment, the conductor layers 26, 27 have a thickness of 35 μm. The conductor layers 26 and 27 are substantially congruent.

[0048] In this embodiment, the conductor layers 26, 27 are made of copper. The thermal conductivity of copper is, for example, 393 W / (m·K). The thermal conductivity of the conductor layers 26, 27 made of copper is, for example, 393 W / (m·K). In this embodiment, the thermal conductivity of the conductor layers 26, 27 is greater than the thermal conductivity of the surface 23a.

[0049] As shown in FIG. 3, the conductor layer 26 includes a pair of pads 26a, 26b and a connecting line 26c. In this embodiment, the conductor layer 26 includes only the pair of pads 26a, 26b and the connecting line 26c. The pair of pads 26a, 26b are spaced apart in the third direction D3. The connecting line 26c connects the pads 26a and 26b. The connecting line 26c is located between the pads 26a and 26b in the third direction D3. The pads 26a and 26b are electrically connected by the connecting line 26c. The pair of pads 26a, 26b and the connecting line 26c are integrally formed.

[0050] Each of the pads 26a, 26b has a rectangular shape. Each of the pads 26a, 26b has a pair of sides facing each other and a pair of sides facing each other. In this embodiment, the pad 26a has a square shape, and the pad 26b has a rectangular shape. The long side direction of the pad 26b is the third direction D3, and the short side direction of the pad 26b is the second direction D2. The pad 26a may have a rectangular shape, and the pad 26b may have a square shape.

[0051] The connecting line 26c extends linearly between the pads 26a and 26b. In this embodiment, the connecting line 26c has two portions extending at an angle with respect to the second direction D2 and the third direction D3, and a portion extending in the third direction D3, which are alternately positioned. The two portions inclined with respect to the second direction D2 and the third direction D3 are directly connected to the corresponding one of the pads 26a and 26b.

[0052] The conductor layer 27 includes a pair of pads 27a, 27b and a connecting line 27c. In this embodiment, the conductor layer 27 includes only the pair of pads 27a, 27b and the connecting line 27c. The pair of pads 27a, 27b are spaced apart in the third direction D3. The connecting line 27c connects the pads 27a and 27b. The connecting line 27c is located between the pads 27a and 27b in the third direction D3. The pads 27a and 27b are electrically connected by the connecting line 27c. The pair of pads 27a, 27b and the connecting line 27c are integrally formed.

[0053] Each of the pads 27a and 27b has a rectangular shape. Each of the pads 27a and 27b has a pair of sides facing each other and a pair of sides facing each other. In this embodiment, the pad 27a has a square shape, and the pad 27b has a rectangular shape. The long side direction of the pad 27b is the third direction D3, and the short side direction of the pad 27b is the second direction D2. The pad 27a may have a rectangular shape, and the pad 27b may have a square shape.

[0054] The connecting line 27c extends linearly between the pads 27a and 27b. In this embodiment, the connecting line 27c has two portions extending at an angle with respect to the second direction D2 and the third direction D3, and a portion extending in the third direction D3, which are alternately positioned. The two portions inclined with respect to the second direction D2 and the third direction D3 are directly connected to the corresponding one of the pads 27a and 27b.

[0055] The insulating layer 28 is disposed on the insulating layer 25 and on the connecting lines 26c and 27c. The insulating layer 28 is in contact with the insulating layer 25 and the connecting lines 26c and 27c. The insulating layer 28 covers the regions of the insulating layer 25 exposed from the conductor layers 26 and 27 and the connecting lines 26c and 27c. The insulating layer 28 has openings at positions corresponding to the pads 26a, 26b, 27a, and 27b. That is, four openings are formed in the insulating layer 28. The pads 26a, 26b, 27a, and 27b are exposed from the insulating layer 28. In this embodiment, the pads 26a, 26b, 27a, and 27b of the conductor layers 26 and 27, together with the insulating layer 28, constitute the back surface 23b of the substrate 23. That is, in this embodiment, the conductor layers 26 and 27 and the insulating layer 28 include the back surface 23b. The insulating layer 28 is made of an organic insulating material or an inorganic insulating material. The insulating layer 28 is made of, for example, a resist material. The insulating layer 28 has a thickness of, for example, 5 μm or more and 40 μm or less. In this embodiment, the insulating layer 28 has a thickness of 10 μm.

[0056] In this embodiment, the temperature sensing element 3 is a laminated chip thermistor. As shown in Figs. 3 to 5, the temperature sensing element 3 includes an element body 31, a pair of external electrodes 32, and internal electrodes 33 and 34. The element body 31 has, for example, a rectangular parallelepiped shape. In this embodiment, the longitudinal direction of the element body 31 is the second direction D2, and the lateral direction of the element body 31 is the third direction D3. The pair of external electrodes 32 are formed at both ends of the element body 31 in the second direction D2. The internal electrode 33 is connected to one of the pair of external electrodes 32. The internal electrode 34 is connected to the other of the pair of external electrodes 32. The internal electrode 33 and the internal electrode 34 are arranged in the element body 31 so as to face each other in the first direction D1. The element body 31 includes a region sandwiched between the internal electrode 33 and the internal electrode 34. This region mainly exerts the characteristics of the temperature sensing element 3. The temperature sensitive element 3 functions as a thermistor by utilizing the temperature change in resistance of the above region. The temperature sensitive element 3 is known in the art and will not be described in further detail.

[0057] The temperature sensor 3 is mounted on the conductor layers 26 and 27. In this embodiment, the temperature sensor 3 is mounted on the pad 26a of the conductor layer 26 and the pad 27a of the conductor layer 27 by the solder 50. That is, in this embodiment, the temperature sensor 3 is solder-mounted on the pads 26a and 27a. One external electrode 32 is connected to the pad 26a by the solder 50, and the other external electrode 32 is connected to the pad 27a by the solder 50. The temperature sensor 3 is connected between the conductor layer 26 and the conductor layer 27. One external electrode 32 is electrically connected to the pad 26b through the pad 26a and the connecting line 26c. The other external electrode 32 is electrically connected to the pad 27b through the pad 27a and the connecting line 27c.

[0058] As described above, the pads 26a, 26b, 27a, and 27b of the conductor layers 26 and 27, together with the insulating layer 28, form the rear surface 23b of the substrate 23. Therefore, it can be said that the temperature sensing element 3 mounted on the pads 26a and 27a is mounted on the rear surface 23b of the substrate 23.

[0059] In this embodiment, the conductor 4 includes a conductor 41 and a conductor 42. As shown in FIG. 3, the conductor 41 is connected to the pad 26b. The conductor 41 includes an end 41a and an end 41b. The end 41a is located inside the case 2 and is connected to the pad 26b. In this embodiment, the end 41a is connected to the pad 26b by the solder 60. This allows the conductor 41 to be connected to the temperature sensing element 3 through the connection line 26c and the pad 26a. The end 41b is exposed from the case 2 and is connected to, for example, an external device that acquires a signal from the temperature sensing element 3. For example, in the conductor 41, when the end 41a constitutes a first end, the end 41b constitutes a second end.

[0060] The conductor 42 is connected to the pad 27b. The conductor 42 includes an end 42a and an end 42b. The end 42a is located inside the case 2 and is connected to the pad 27b. In this embodiment, the end 42a is also connected to the pad 27b by solder 60. This allows the conductor 42 to be connected to the temperature sensing element 3 through the connecting line 27c and the pad 27a. The end 42b is exposed from the case 2 and is connected to, for example, the external device that acquires a signal from the temperature sensing element 3. For example, in the conductor 42, when the end 42a constitutes a first end, the end 42b constitutes a second end. 4 and 5, the solders 50 and 60 are omitted.

[0061] Next, the configuration when the temperature sensor 1 detects the temperature of the object 100 and the state in which the temperature sensor 1 is attached to the object 100 will be described with reference to Figures 6 and 7. Figure 6 is a perspective view showing the configurations of the temperature sensor, holder, and object according to this embodiment. Figure 7 is a plan view showing the configurations of the temperature sensor and holder according to this embodiment.

[0062] First, a configuration for detecting the temperature of the object 100 by the temperature sensor 1 will be described. In this embodiment, as shown in FIG. 6, the temperature sensor 1 detects the temperature of the object 100 in a state in which it is in contact with the object 100. The temperature sensor 1 may detect the temperature of the object 100 in a state in which it faces the object 100. The object 100 has, for example, a cylindrical shape. In this case, the object 100 includes, for example, a pipe for plumbing. The object 100 may have a shape other than a cylindrical shape.

[0063] In this embodiment, when the temperature sensor 1 is brought into contact with the object 100, a holder 200 is used to hold the temperature sensor 1 on the object 100. The holder 200 may also be used when the temperature sensor 1 is placed opposite the object 100. The holder 200 includes a portion 210 and a portion 220 that face each other and hold the temperature sensor 1, and a portion 230 that connects the portion 210 and the portion 220. When the holder 200 holds the temperature sensor 1, the portions 210 and 220 are brought into contact with the temperature sensor 1.

[0064] 6 and 7, in this embodiment, the portion 210 includes a region 210a and a region 210b. The region 210a is curved in an arc shape away from the portion 220 in the direction in which the portion 210 and the portion 220 face each other. The region 210b is curved in an arc shape toward the portion 220 in the direction in which the portion 210 and the portion 220 face each other. That is, the portion 210 has a substantially S-shape when viewed from a direction perpendicular to the direction in which the portion 210 and the portion 220 face each other. In this embodiment, when the holder 200 holds the temperature sensor 1, the region 210b of the portion 210 abuts against the temperature sensor 1.

[0065] In this embodiment, portion 220 includes region 220a and region 220b. Region 220a extends substantially perpendicular to portion 230 from one end of portion 230 in the direction in which portions 210 and 220 face each other. Region 220b is bent so as to move away from portion 210 in the direction in which portions 210 and 220 face each other. In this embodiment, when holder 200 holds temperature sensor 1, region 220a of portion 220 abuts against temperature sensor 1. The portion 230 has a rectangular shape. One end of the portion 230 is connected to the portion 210, and the other end is connected to the portion 220.

[0066] The portion 210 and the portion 220 have spring properties. The portion 210 and the portion 220 are elastically deformable. For example, when the portion 210 and the portion 220 are pushed in a direction away from each other, the portion 210 and the portion 220 are elastically deformed so as to move away from each other. In this case, a reaction force accompanying the elastic deformation of the portion 210 and a reaction force accompanying the elastic deformation of the portion 220 act on an object pushing the portion 210 and the portion 220. In other words, a force in a direction in which the portion 210 and the portion 220 face each other acts on the object pushing the portion 210 and the portion 220 from the portion 210 and the portion 220.

[0067] The holder 200 further includes a portion 240 extending from an end of the portion 230 closer to the portion 210 and spaced apart from the portion 210, and a portion 250 contacting the object 100. In this embodiment, the holder 200 includes two portions 240. The two portions 240 are positioned so as to be spaced apart from each other with the portion 210 in between. The portion 250 faces the portion 230. The shape of the portion 250 corresponds to the shape of the object 100. As described above, the object 100 has a cylindrical shape. Therefore, in this embodiment, the portion 250 has a substantially arcuate shape.

[0068] In this embodiment, the portion 250 also has spring properties. Therefore, the portion 250 can also be elastically deformed. For example, when the portion 250 is pushed in a direction away from the portion 230, the portion 250 elastically deforms in the direction away from the portion 230. In this case, a reaction force caused by the elastic deformation of the portion 250 acts on an object pushing the portion 250. In other words, a force in a direction from the portion 250 toward the portion 230 acts on the object pushing the portion 250.

[0069] Next, a state in which the temperature sensor 1 is attached to the object 100 will be described. When attaching the temperature sensor 1 to the object 100, first, the temperature sensor 1 is pushed between the parts 210 and 220. In this embodiment, the case part 21 is pushed between the parts 210 and 220 so that the surface 21a of the case part 21 abuts against the part 230. In this state, the direction in which the parts 210 and 220 face each other is the second direction D2, and the direction perpendicular to the direction in which the parts 210 and 220 face each other is the third direction D3.

[0070] When case portion 21 is pressed between portion 210 and portion 220, portion 210 and portion 220 are elastically deformed so as to move away from each other. In this case, region 210b of portion 210 and region 220a of portion 220 abut against side surface 21b of case portion 21, and a reaction force caused by the elastic deformation of portion 210 and portion 220 acts on case portion 21. That is, a force from portion 210 toward portion 220 and a force from portion 220 toward portion 210 act on temperature sensor 1. As a result, temperature sensor 1 is held between portion 210 and portion 220.

[0071] As described above, the case portion 21 is made of resin. Therefore, when the temperature sensor 1 is held by the holder 200, the shape of the case portion 21 is deformed to follow the shape of the portion 210 or the portion 220 that abuts against the temperature sensor 1. In this embodiment, the side surface 21b of the case portion 21 abuts against the region 210b of the portion 210 and the region 220a of the portion 220. As described above, the region 210b is curved toward the portion 220 in the second direction D2, and the region 220a extends in the third direction D3. Therefore, when the temperature sensor 1 is held by the holder 200, the shape of the side surface 21b that abuts against the region 210b is deformed to follow the region 210b. In this embodiment, as shown in FIG. 7, the shape of the side surface 21b is deformed to be recessed from the side surface 21b to the inside of the case portion 21 in the second direction D2, following the region 210b.

[0072] Next, the temperature sensor 1 is brought into contact with the object 100 while being held by the holder 200. When the temperature sensor 1 is brought into contact with the object 100, for example, the object 100 is pushed in between the region 220b and the tip of the portion 250. When the object 100 is pushed in between the region 220b and the tip of the portion 250, the portion 250 is elastically deformed so as to move away from the portion 230. In this case, a reaction force caused by the elastic deformation of the portion 250 acts on the object 100. That is, a force acting in a direction from the portion 250 toward the portion 230 acts on the object 100. As a result, the surface 23a of the substrate 23 is brought into contact with the object 100. In this state, the portion 230 is in contact with the surface 21a of the case portion 21, and the portion 250 is in contact with the object 100. Therefore, when the temperature sensor 1 is brought into contact with the object 100 , the holder 200 is brought into contact with both the temperature sensor 1 and the object 100 .

[0073] As described above, in the temperature sensor 1, the substrate 23 included in the case part 22 includes the surface 23a including the region R2 of the outer surface of the case 2 and the back surface 23b facing the surface 23a. The temperature sensor 3 is mounted on the back surface 23b of the substrate 23. The heat transfer path from the surface 23a of the substrate 23 to the temperature sensor 3 includes the substrate 23, but does not include the case part 21 made of resin. The surface 23a of the substrate 23 has a thermal conductivity higher than that of the surface 21a, the pair of side surfaces 21b, and the pair of end surfaces 21c including the region R1 of the outer surface of the case 2. In the temperature sensor 1, when detecting the temperature of the object 100, the surface 23a of the substrate 23, not the case part 21, is abutted against the object 100, so that the heat of the object 100 is easily transferred to the temperature sensor 3. Therefore, the temperature sensor 1 can improve thermal responsiveness.

[0074] In order to improve the accuracy of temperature detection by the temperature sensor 1, it is necessary to maintain the object 100 and the temperature sensor 1 in contact with each other. For this reason, when the temperature sensor 1 is brought into contact with the object 100, a holder 200 for holding the temperature sensor 1 on the object 100 may be used. The holder 200 abuts against the object 100 and the case 2. A configuration in which the case 2 can deform to follow the shape of the portion of the holder 200 that abuts against the temperature sensor 1 tends to reliably maintain the object 100 and the case 2 in contact with each other. In the temperature sensor 1, the case portion 21 is made of resin. In the temperature sensor 1, the holder 200 abuts against the case portion 21, so that the case portion 21 deforms to follow the shape of the region 210b of the holder 200 that abuts against the case portion 21. Therefore, the temperature sensor 1 can reliably maintain the state in which the object 100 and the case portion 21 abut against each other. The temperature sensor 1 can improve the accuracy of temperature detection.

[0075] In the temperature sensor 1, the substrate 23 includes side surfaces 23c and 23d connecting the front surface 23a and the back surface 23b. The case portion 21 includes a plurality of wall portions W1 facing the side surface 23c and spaced apart from each other along the side surface 23c, and a plurality of wall portions W2 facing the side surface 23d and spaced apart from each other along the side surface 23d. A portion of the side surface 23c is exposed between adjacent wall portions W1 among the plurality of wall portions W1. A portion of the side surface 23d is exposed between adjacent wall portions W2 among the plurality of wall portions W2. The temperature sensor 1 enhances the connection strength between the case portion 21 and the case portion 22. Therefore, the case portion 21 and the case portion 22 are unlikely to peel off from each other. The temperature sensor 1 in which a part of the side surface 23c is exposed between adjacent wall portions W1 among the plurality of wall portions W1 and a part of the side surface 23d is exposed between adjacent wall portions W2 among the plurality of wall portions W2 can enhance the heat collection performance on the substrate. Therefore, the temperature sensor 1 can further improve the thermal responsiveness.

[0076] In the temperature sensor 1, the substrate 23 may include a metal plate 24 including a main surface 24a that includes a surface 23a, and a main surface 24b that faces the main surface 24a. The temperature sensor 1 easily and reliably realizes the surface 23a having a thermal conductivity higher than the thermal conductivity of the face 21a of the case portion 21, the pair of side faces 21b, and the pair of end faces 21c.

[0077] In the temperature sensor 1, the substrate 23 includes an insulating layer 25 disposed on a main surface 24b of the metal plate 24. The temperature sensitive element 3 is disposed on the insulating layer 25. The temperature sensor 1 reliably maintains electrical insulation between the temperature sensitive element 3 and the metal plate 24 .

[0078] In the temperature sensor 1, the substrate 23 includes conductor layers 26, 27 disposed on an insulating layer 25. The temperature sensitive element 3 is mounted on the conductor layers 26, 27. Even in a configuration in which the insulating layer 25 is disposed on the metal plate 24, the temperature sensor 1 easily and reliably realizes a configuration in which the temperature sensitive element 3 is electrically mounted on the substrate 23.

[0079] The temperature sensor 1 includes conductors 41 and 42 having ends 41 a and 42 a located within the case 2 and electrically connected to the temperature sensing element 3 , and ends 41 b and 42 b exposed from the case 2 . The temperature sensor 1 simply and reliably realizes a configuration in which the signal line electrically connected to the temperature sensitive element 3 is led out of the case 2 including the case portion 21 and the case portion 22.

[0080] Next, the configuration of a temperature sensor 1 according to a modified example of this embodiment will be described with reference to Figs. 8 and 9. Fig. 8 is a perspective view showing a temperature sensor according to this modified example. Fig. 9 is a plan view showing the configuration of a temperature sensor and a holder according to this modified example. This modified example differs from the above-described embodiment in terms of the configuration of the case portion 21. The following mainly describes the differences between the above-described embodiment and this modified example.

[0081] In this modification, the case portion 21 is formed with an engagement portion 21d that engages with the holder 200. As shown in FIG. 8, the engagement portion 21d is formed on a side surface 21b of the case portion 21. In this modification, the engagement portion 21d is formed on one of the pair of side surfaces 21b. The engagement portion 21d is formed on the one side surface 21b so as to extend in the third direction D3. In this modification, the engagement portion 21d is formed so as to be recessed from the side surface 21b to the inside of the case portion 21 in the second direction D2 in correspondence with the shape of the region 210b of the holder 200 that contacts the case portion 21. Therefore, the engagement portion 21d in this modification can also be said to be a recess formed on the side surface 21b.

[0082] When the temperature sensor 1 is held by the holder 200, the engagement portion 21d engages with the region 210b, as shown in Fig. 9. In this modification as well, the shape of the case portion 21 changes such that the shape of the side surface 21b follows the shape of the region 210b when the temperature sensor 1 is held by the holder 200. That is, in this modification, the engagement portion 21d changes shape so as to be recessed further inward from the side surface 21b into the case portion 21, following the shape of the region 210b.

[0083] In this modification, the case portion 21 is formed with an engagement portion 21d that engages with a holder 200 that holds the temperature sensor 1. This modification can more reliably maintain the state in which the target object 100 and the case portion 21 are in contact with each other, and therefore can further improve the accuracy of temperature detection.

[0084] Next, the configuration of a temperature sensor 1 according to a modified example of this embodiment will be described with reference to Fig. 10. Fig. 10 is a plan view showing the configuration of the substrate and the temperature sensing element. This modified example differs from the above-described embodiment in terms of the configuration of the temperature sensing element. The following mainly describes the differences between the above-described embodiment and this modified example.

[0085] In this modification, the temperature sensor 1 includes a temperature sensor 3A and a temperature sensor 3B instead of the temperature sensor 3. That is, in this modification, the temperature sensor 1 includes a plurality of temperature sensors 3A and 3B. The configurations of the temperature sensor 3A and the temperature sensor 3B are similar to the configuration of the temperature sensor 3 described above. Therefore, the temperature sensor 3A includes an element body 31A and a pair of external electrodes 32A, and the temperature sensor 3B includes an element body 31B and a pair of external electrodes 32B. Although not shown, the temperature sensor 3A further includes a pair of internal electrodes facing each other in the element body 31A, and the temperature sensor 3B further includes a pair of internal electrodes facing each other in the element body 31B.

[0086] In this modification, the temperature sensing element 3A and the temperature sensing element 3B are electrically connected in series. In this modification, in order to realize the above configuration, the substrate 23 further includes a conductor layer 29. The conductor layer 29 is disposed on the insulating layer 25, similar to the conductor layers 26 and 27. The conductor layer 29 is in contact with the insulating layer 25. The conductor layer 29 is spaced apart from the conductor layers 26 and 27. In this modification, the conductor layer 29 is spaced apart from the conductor layers 26 and 27 in the second direction D2. The thickness of the conductor layer 29 is, for example, not less than 10 μm and not more than 100 μm. In this embodiment, the thickness of the conductor layer 29 is 35 μm.

[0087] In this modification, conductor layer 29 is made of copper, similar to conductor layers 26 and 27. As described above, the thermal conductivity of copper is, for example, 393 W / (m·K). Conductor layer 29 made of copper has a thermal conductivity of, for example, 393 W / (m·K). In this modification, the thermal conductivity of conductor layer 29 is greater than the thermal conductivity of surface 23a.

[0088] In this modification, the conductor layer 29 includes a pad 29a. The pad 29a is located between the pad 26a and the pad 27a in the second direction D2. The pad 29a has a pair of sides facing each other in the second direction D2 and a pair of sides facing each other in the third direction D3. In this modification, the pad 29a has a square shape. The pad 29a may have a rectangular shape.

[0089] In this modification, an opening is also formed in the insulating layer 28 at a position corresponding to the pad 29a. That is, five openings are formed in the insulating layer 28. The pad 29a is exposed from the insulating layer 28. In this modification, the pad 29a of the conductor layer 29, together with the pads 26a, 26b, 27a, and 27b of the conductor layers 26 and 27 and the insulating layer 28, constitutes the back surface 23b of the substrate 23. That is, in this embodiment, the conductor layers 26, 27, and 29 and the insulating layer 28 include the back surface 23b.

[0090] In this modification, the temperature sensing elements 3A and 3B are mounted on the conductor layer 29 in addition to the conductor layers 26 and 27. One external electrode 32A of the temperature sensing element 3A is mounted on the pad 26a by solder 50, and the other external electrode 32A of the temperature sensing element 3A is mounted on the pad 29a by solder 70. One external electrode 32B of the temperature sensing element 3B is mounted on the pad 27a by solder 50, and the other external electrode 32B of the temperature sensing element 3B is mounted on the pad 29a by solder 70.

[0091] The one external electrode 32A is electrically connected to the pad 26b through the pad 26a and the connecting line 26c. The one external electrode 32B is electrically connected to the pad 27b through the pad 27a and the connecting line 27c. The other external electrode 32A and the other external electrode 32B are electrically connected to each other through the pad 29a. This realizes a configuration in which the temperature sensing element 3A and the temperature sensing element 3B are electrically connected in series.

[0092] As described above, the pad 29a of the conductor layer 29, together with the pads 26a, 26b, 27a, and 27b of the conductor layers 26 and 27 and the insulating layer 28, constitute the rear surface 23b of the substrate 23. Therefore, it can be said that the pads 26a, 27a, and the temperature sensitive devices 3A and 3B mounted on the pad 29a are mounted on the rear surface 23b of the substrate 23.

[0093] Next, the configuration of a temperature sensor 1 according to a modified example of this embodiment will be described with reference to Fig. 11. Fig. 11 is a plan view showing the configuration of a substrate and a temperature sensor. This modified example differs from the modified example described above in that the electrical connection relationship between the temperature sensor 3A and the temperature sensor 3B is different. The following mainly describes the differences between the modified example described above and this modified example.

[0094] In this modification, the temperature sensing element 3A and the temperature sensing element 3B are electrically connected in parallel. In this modification, in order to realize the above configuration, the conductor layer 29 includes pads 29b and 29c instead of the pad 29a. The pads 29b and 29c are located between the connecting line 26c and the connecting line 27c in the second direction D2. The pads 29b and 29c are spaced apart from each other in the second direction D2. The pad 29b is electrically connected to the connecting line 26c. The pad 29b is also electrically connected to the pads 26a and 26b through the connecting line 26c. The pad 29c is electrically connected to the connecting line 27c. The pad 29c is also electrically connected to the pads 27a and 27b through the connecting line 27c.

[0095] The pads 29b and 29c have a pair of sides facing each other in the second direction D2 and a pair of sides facing each other in the third direction D3. In this modification, the pads 29b and 29c are square-shaped. The pads 29b and 29c may be rectangular-shaped.

[0096] In this modification, openings are also formed in the insulating layer 28 at positions corresponding to the pads 29b and 29c. That is, six openings are formed in the insulating layer 28. The pads 29b and 29c are exposed from the insulating layer 28. In this modification, the pads 29b and 29c of the conductor layer 29, together with the pads 26a, 26b, 27a, and 27b of the conductor layers 26 and 27 and the insulating layer 28, constitute the back surface 23b of the substrate 23. That is, in this embodiment, the conductor layers 26, 27, and 29 and the insulating layer 28 include the back surface 23b.

[0097] In this modification, the temperature sensing element 3A is mounted on the conductor layers 26, 27. The temperature sensing element 3A is mounted on the pads 26a and 27a by solder 50. As shown in Fig. 10, one external electrode 32A of the temperature sensing element 3A is connected to the pad 26a by the solder 50, and the other external electrode 32A of the temperature sensing element 3A is connected to the pad 27a by the solder 50.

[0098] The temperature sensing element 3B is mounted on the conductor layer 29. The temperature sensing element 3B is mounted on the pads 29b and 29c by solder 80. One external electrode 32B of the temperature sensing element 3B is connected to the pad 29a by the solder 80, and the other external electrode 32B of the temperature sensing element 3B is connected to the pad 29b by the solder 80.

[0099] As described above, the pad 29a is electrically connected to the pad 26a through the connecting line 26c, and the pad 29b is electrically connected to the pad 27a through the connecting line 27c, thereby realizing a configuration in which the temperature sensing element 3A and the temperature sensing element 3B are electrically connected in parallel.

[0100] As described above, the pads 29b and 29c of the conductor layer 29, together with the pads 26a, 26b, 27a and 27b of the conductor layers 26 and 27 and the insulating layer 28, constitute the rear surface 23b of the substrate 23. Therefore, it can be said that the temperature sensing element 3A mounted on the pads 26a and 27a and the temperature sensing element 3B mounted on the pads 29b and 29c are mounted on the rear surface 23b of the substrate 23.

[0101] Next, the configuration of a temperature sensor 1 according to a modified example of this embodiment will be described with reference to Fig. 12. Fig. 12 is a plan view showing the configuration of the substrate and the temperature sensing element. This modified example differs from the above-described embodiment in terms of the configuration of the temperature sensing element, the configuration of the conductor layer, and the configuration of the conductor wire. The following mainly describes the differences between the above-described embodiment and this modified example.

[0102] In this modification, the temperature sensor 1 includes a temperature sensor 3C in addition to the temperature sensor 3. That is, in this modification, the temperature sensor 1 includes a plurality of temperature sensors 3, 3C. The temperature sensor 3C has a configuration similar to that of the temperature sensor 3. Thus, the temperature sensor 3C includes an element body 31C, a pair of external electrodes 32C, and a pair of internal electrodes facing each other within the element body 31C.

[0103] In this modification, the temperature sensing element 3 and the temperature sensing element 3C are not electrically connected. In this modification, in order to realize the above configuration, the substrate 23 further includes conductor layers 26C and 27C. The conductor layer 26C has a configuration similar to that of the conductor layer 26, and is not electrically connected to the conductor layers 26 and 27. The conductor layer 26C includes a pair of pads 26Ca and 26Cb and a connecting line 26Cc. The conductor layer 27C has a configuration similar to that of the conductor layer 27, and is not electrically connected to the conductor layers 26 and 27. The conductor layer 27C includes a pair of pads 27Ca and 27Cb and a connecting line 27Cc.

[0104] In this modification, the insulating layer 28 has openings formed at positions corresponding to the pads 26Ca, 26Cb, 27Ca, and 27Cb. That is, eight openings are formed in the insulating layer 28. The pads 26Ca, 26Cb, 27Ca, and 27Cb are exposed from the insulating layer 28. In this modification, the pads 26Ca, 26Cb, 27Ca, and 27Cb of the conductor layers 26C and 27C, together with the pads 26a, 26b, 27a, and 27b of the conductor layers 26 and 27 and the insulating layer 28, constitute the back surface 23b of the substrate 23. That is, in this embodiment, the conductor layers 26, 27, 26C, and 27C and the insulating layer 28 include the back surface 23b.

[0105] The temperature sensor 3C is mounted on the conductor layers 26C and 27C. In this modification, the temperature sensor 3C is mounted on the pad 26Ca of the conductor layer 26C and the pad 27Ca of the conductor layer 27C by the solder 50C. One external electrode 32C is connected to the pad 26Ca by the solder 50C, and the other external electrode 32C is connected to the pad 27Ca by the solder 50C. The temperature sensor 3C is connected between the conductor layer 26C and the conductor layer 27C. One external electrode 32C is electrically connected to the pad 26Cb through the pad 26Ca and the connecting line 26Cc. The other external electrode 32C is electrically connected to the pad 27Cb through the pad 27Ca and the connecting line 27Cc.

[0106] As described above, the pads 26Ca, 26Cb, 27Ca, and 27Cb of the conductor layers 26C and 27C, the pads 26a, 26b, 27a, and 27b of the conductor layers 26 and 27, and the insulating layer 28 constitute the rear surface 23b of the substrate 23. Therefore, it can be said that the temperature sensing element 3C mounted on the pads 26Ca and 27Ca is also mounted on the rear surface 23b of the substrate 23.

[0107] Furthermore, in this modification, the conductor 4 further includes a conductor 41C and a conductor 42C. The conductor 41C has a configuration similar to that of the conductor 41, and the conductor 42C has a configuration similar to that of the conductor 42. That is, the conductor 41C includes an end 41Ca located within the case 2 and connected to the pad 26Cb, and an end exposed from the case 2. Similarly, the conductor 42C includes an end 42Ca located within the case 2 and connected to the pad 27Cb, and an end exposed from the case 2. As a result, the conductor 41C is connected to the temperature sensing element 3C through the connection line 26Cc and the pad 26Ca, and the conductor 42C is connected to the temperature sensing element 3C through the connection line 27Cc and the pad 27Ca.

[0108] The above describes the embodiments and modifications of the present invention, but the present invention is not necessarily limited to the above-described embodiments and modifications, and various modifications are possible without departing from the spirit of the present invention.

[0109] In the temperature sensor 1, the case portion 21 does not need to be formed with the engagement portion 21d that engages with the holder 200. As described above, the temperature sensor 1 in which the engagement portion 21d is formed in the case portion 21 can further improve the accuracy of temperature detection.

[0110] In the temperature sensor 1, the case portion 21 may not include the multiple wall portions W1, W2. A part of the side surface 23c may not be exposed between adjacent wall portions W1 of the multiple wall portions W1. A part of the side surface 23d may not be exposed between adjacent wall portions W2 of the multiple wall portions W2. The temperature sensor 1 in which a part of the side surface 23c is exposed between adjacent wall portions W1 of the multiple wall portions W1 and a part of the side surface 23d is exposed as described above between adjacent wall portions W2 of the multiple wall portions W2 can further improve thermal responsiveness as described above.

[0111] As will be understood from the above description of the embodiments and modifications, this specification includes disclosure of the following aspects. (Appendix 1) At least one temperature sensitive element; a case that houses the at least one temperature-sensing element and has an outer surface including a first region and a second region different from the first region; The case is a first case portion including the first region and a surface having a first thermal conductivity, the first case portion being made of resin; a second case portion including a substrate including a surface including the second region and having a second thermal conductivity greater than the first thermal conductivity, and a back surface opposite the surface; A temperature sensor, wherein the at least one temperature sensitive element is mounted on the back surface of the substrate. (Appendix 2) The temperature sensor according to claim 1, wherein the first case portion is formed with an engagement portion that engages with a holder that holds the temperature sensor. (Appendix 3) the substrate includes a side surface connecting the front surface and the back surface; the first case portion includes a plurality of walls facing the side surface and spaced apart from one another along the side surface; 3. The temperature sensor according to claim 1, wherein a portion of the side surface is exposed between adjacent wall portions among the plurality of wall portions. (Appendix 4) The temperature sensor according to any one of appendices 1 to 3, wherein the substrate includes a metal plate including a first main surface including the surface and a second main surface opposite to the first main surface. (Appendix 5) the substrate includes an insulating layer disposed on the second main surface of the metal plate; 5. The temperature sensor of claim 4, wherein the at least one temperature sensing element is disposed on the insulating layer. (Appendix 6) the substrate includes a conductor layer disposed on the insulating layer; 6. The temperature sensor of claim 5, wherein the at least one temperature sensing element is mounted on the conductor layer. (Appendix 7) The temperature sensor described in any one of appendices 1 to 6, further comprising a conductor having a first end located within the case and electrically connected to the at least one temperature sensing element, and a second end exposed from the case. (Appendix 8) The at least one temperature sensitive element includes a plurality of temperature sensitive elements, The temperature sensor according to any one of claims 1 to 7, wherein the plurality of temperature sensitive elements are mounted on a rear surface of the substrate. [Explanation of symbols]

[0112] 1...temperature sensor, 2...case, 3, 3A, 3B, 3C...temperature sensing element, 4...conductor, 21...case part, 21d...engagement part, 22...case part, 23...substrate, 23a...surface, 23b...back side, 23c, 23d...side, 24...metal plate, 25...insulating layer, 26, 26C, 27, 27C...conductor layer, 41, 41C, 42, 42C...conductor, 41a, 41Ca, 42a, 42Ca...end, 41b, 42b...end, 200...holder, R1...area, R2...area, W1, W2...wall part.

Claims

1. At least one temperature sensitive element; a case that houses the at least one temperature-sensing element and has an outer surface including a first region and a second region different from the first region; The case is a first case portion including the first region and a surface having a first thermal conductivity, the first case portion being made of resin; a second case portion including a substrate including a surface including the second region and having a second thermal conductivity greater than the first thermal conductivity, and a back surface opposite the surface; A temperature sensor, wherein the at least one temperature sensitive element is mounted on the back surface of the substrate.

2. The temperature sensor according to claim 1 , wherein the first case portion is formed with an engagement portion that engages with a holder that holds the temperature sensor.

3. the substrate includes a side surface connecting the front surface and the back surface; the first case portion includes a plurality of walls facing the side surface and spaced apart from one another along the side surface; The temperature sensor according to claim 1 , wherein a portion of the side surface is exposed between adjacent ones of the plurality of wall portions.

4. The temperature sensor according to claim 1 , wherein the substrate includes a metal plate including a first main surface including the surface and a second main surface opposite to the first main surface.

5. the substrate includes an insulating layer disposed on the second main surface of the metal plate; The temperature sensor according to claim 4 , wherein the at least one temperature sensitive element is disposed on the insulating layer.

6. the substrate includes a conductor layer disposed on the insulating layer; The temperature sensor of claim 5 , wherein the at least one temperature sensitive element is mounted on the conductive layer.

7. The temperature sensor of any one of claims 1 to 6, further comprising a conductor having a first end located within the case and electrically connected to the at least one temperature sensing element, and a second end exposed from the case.

8. The at least one temperature sensitive element includes a plurality of temperature sensitive elements, The temperature sensor according to claim 1 , wherein the plurality of temperature sensitive elements are mounted on a rear surface of the substrate.

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