Sensor

Abstract

To provide a sensor to prevent short-circuit failure of a conductive film pattern, despite the formation of the conductive film pattern on a surface with a crease.SOLUTION: A sensor 10 includes a base material 20 having a surface 24 where a crease is formed along a first direction D1 in a plan view, and a conductive film pattern 40 formed on the surface 24 and including two electrode film parts 41 connecting positions different from each other in an in-plane direction of the surface 24, with a shape longer than a line connecting the positions with the conductive path lengths being different, and a resistance film part 42 electrically connecting the two electrode film parts 41. In the shape of the conductive film pattern 40, one optional line parallel to the first direction D1 passes a conductive path central line 43 of the conductive film pattern zero times or once and does not pass twice or more.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a sensor having a conductive film pattern. [Background technology]

[0002] Known sensors, such as pressure sensors, have circuits formed from conductive film patterns on the surface of a substrate made of metal, semiconductor, insulating material, etc. Some circuits use the piezoresistive effect (also called the piezoresistance effect) to detect the distortion of the substrate (also called a membrane or diaphragm) through resistance changes.

[0003] However, in conventional sensors, for example, the surface is smoothed to a state called a mirror surface, and then a conductive film pattern is formed on the smoothed surface of the substrate. However, the processing step of mirror-finishing the surface of the substrate takes time and costs money, and there are problems in terms of productivity. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2020-148480 A Summary of the Invention [Problem to be solved by the invention]

[0005] The inventors attempted to fabricate a sensor by forming a conductive film pattern on a surface on which streaks are formed, but found that etching residues and the like are likely to occur in the process of forming the conductive film pattern, which is likely to cause short-circuit defects. The present disclosure has been made in view of such circumstances, and provides a sensor that can prevent short-circuit defects of the conductive film pattern even though the conductive film pattern is formed on a surface on which streaks are formed. [Means for solving the problem]

[0006] In order to achieve the above object, the sensor according to the present disclosure comprises: A substrate having a surface on which streaks are formed along a first direction in a plan view; a conductive film pattern formed on the surface, the conductive film pattern connecting different positions in an in-plane direction of the surface in a shape such that the length of a conductive path is longer than the length of a straight line connecting the different positions; The shape of the conductive film pattern is characterized in that any straight line parallel to the first direction passes through the center line of the conductive path of the conductive film pattern 0 or 1 time, but does not pass through it more than twice.

[0007] The sensor according to the present disclosure has a conductive film pattern that connects different positions in a shape in which the length of the conductive path is longer than the length of a straight line connecting the different positions, and the shape of the conductive film pattern is such that any one straight line parallel to the first direction in which the streaks are formed does not pass through the conductive path center line more than twice. By forming the conductive film pattern in such a shape, even if a conductive film pattern having a long conductive path in a narrow area is formed on a surface where etching residues tend to occur in the first direction, such a sensor can preferably prevent the occurrence of short-circuit defects in the conductive film pattern. This is because, since the shape of the conductive film pattern is such that any one straight line parallel to the first direction does not pass through the conductive path center line more than twice, even if etching residues of the conductive film occur along the first direction, the etching residues do not pass through the conductive path center line more than twice, and therefore the formation of a short path due to etching residues can be prevented in one conductive film pattern.

[0008] The sensor according to the present disclosure may have a plurality of the conductive film patterns, The plurality of conductive film patterns may include a first conductive film pattern that connects a first position to a second position, which are mutually different positions in an in-plane direction of the surface, in a first shape in which the length of the conductive path is longer than the length of a straight line connecting the first position to the second position, and a second conductive film pattern that connects a third position to a fourth position, which are mutually different positions in an in-plane direction of the surface, in a second shape in which the length of the conductive path is longer than the length of a straight line connecting the third position to the fourth position, Any straight line parallel to the first direction may either pass through the first conductive film pattern but not through the second conductive film pattern, pass through the second conductive film pattern but not through the first conductive film pattern, or pass through neither the first conductive film pattern nor the second conductive film pattern, or may not pass through both the first conductive film pattern and the second conductive film pattern.

[0009] Such a sensor can prevent the formation of a short path between a first conductive film pattern and a second conductive film pattern, which are different conductive film patterns, due to etching residue of the conductive film, and can effectively prevent the occurrence of short defects between the different conductive film patterns.

[0010] Also, for example, the plurality of conductive film patterns may include a third conductive film pattern that connects a fifth position to a sixth position, which are different positions in an in-plane direction of the surface, in a third shape in which the length of the conductive path is longer than the length of a straight line connecting the fifth position to the sixth position, The center-to-center distance along the first direction between the first conductive film pattern and the second conductive film pattern may be shorter than the center-to-center distance along the first direction between the first conductive film pattern and the third conductive film pattern and the center-to-center distance along the first direction between the second conductive film pattern and the third conductive film pattern.

[0011] With such a sensor, the formation of a short path caused by remaining conductive film etching between the first conductive film pattern and the second conductive film pattern, which are close to each other in the first direction, can be prevented, thereby preventing the occurrence of short circuit defects throughout the sensor.

[0012] The sensor according to the present disclosure may have a plurality of the conductive film patterns. Any straight line parallel to the first direction may pass through any one of the plurality of conductive film patterns, or may pass through none of the plurality of conductive film patterns, and may not pass through two or more of the plurality of conductive film patterns.

[0013] With such a sensor, even in a case where a large number of conductive film patterns are present, it is possible to prevent the problem of short paths being formed between different conductive film patterns due to residual conductive film etching, and to effectively prevent the occurrence of short circuits between different conductive film patterns.

[0014] Furthermore, for example, the surface roughness Ra of the surface in a second direction perpendicular to the first direction within the plane of the surface may be 0.05 μm or more and 1 μm or less.

[0015] When the surface roughness Ra is equal to or greater than a predetermined value, etching residue of the conductive film is likely to occur along the first direction, and therefore the effect of forming the conductive film pattern as described above is particularly large. In addition, by setting the surface roughness Ra to a predetermined value or less, it is possible to form a thin conductive film pattern with high accuracy.

[0016] For example, the substrate may be a metal substrate. A base insulating film may be formed between the surface and the conductive film pattern, The thickness of the base insulating film may be 1 to 10 times the surface roughness Ra.

[0017] By making the thickness of the base insulating film a predetermined multiple or more of the surface roughness Ra, it is possible to suitably ensure insulation between the metal base material and the conductive film pattern. In addition, when the thickness of the base insulating film is a predetermined multiple or less of the surface roughness Ra, the surface of the base insulating film is likely to have undulations that trace the streaks of the base material surface, and etching residue of the conductive film is likely to occur along the first direction, so that the effect of forming the conductive film pattern as described above is particularly large. [Brief description of the drawings]

[0018] [Figure 1] FIG. 1 is a schematic cross-sectional view of a sensor according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is an enlarged schematic view of the vicinity of the substrate surface in the sensor shown in FIG. [Figure 3A] FIG. 3A is a plan view of a conceptual diagram illustrating the state of streaks formed on the surface of the base material shown in FIG. [Figure 3B] FIG. 3B is a cross-sectional view of a conceptual diagram illustrating the state of streaks formed on the surface of the base material shown in FIG. [Figure 4] FIG. 4 is a conceptual diagram showing an example of a laminate state of a conductive film pattern and the like formed on the surface of the base material shown in FIG. [Diagram 5] FIG. 5 is an enlarged schematic view of the vicinity of the substrate surface in the sensor according to the second embodiment. [Figure 6] FIG. 6 is an enlarged schematic view of the vicinity of the substrate surface in the sensor according to the third embodiment. [Figure 7] FIG. 7 is an enlarged schematic view of the vicinity of the substrate surface in the sensor according to the fourth embodiment. [Figure 8] FIG. 8 is an enlarged schematic view of the vicinity of the substrate surface in the sensor according to the fifth embodiment. [Figure 9] FIG. 9 is an enlarged schematic view of the vicinity of the substrate surface in the sensor according to the sixth embodiment. [Figure 10] FIG. 10 is an enlarged schematic view of the vicinity of the substrate surface in the sensor according to the seventh embodiment. [Figure 11]FIG. 11 is an enlarged schematic view of the vicinity of the substrate surface in the sensor according to the eighth embodiment. [Figure 12] FIG. 12 is an enlarged schematic view of the vicinity of the substrate surface in the sensor according to the ninth embodiment. [Figure 13] FIG. 13 is an enlarged schematic view of the vicinity of the substrate surface in a sensor according to a comparative example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] Hereinafter, the present disclosure will be described based on the embodiments shown in the drawings. 1 is a schematic cross-sectional view of a sensor 10 according to a first embodiment of the present disclosure. The sensor 10 has a sensor body 18 including a substrate 20 and a conductive film pattern 40, a connection member 12 in which a flow path 12b for transmitting pressure to the substrate 20 is formed, a pressing member 14 for fixing the sensor body 18 to the connection member 12, a substrate portion 90 that is wired to the conductive film pattern 40 provided on the substrate 20, and the like.

[0020] 1, a screw groove 12a for fixing the sensor 10 to the object to be measured is formed on the outer periphery of the connection member 12. By fixing the sensor 10 via the screw groove 12a, a flow path 12b formed inside the connection member 12 is airtightly connected to a pressure chamber filled with the fluid to be measured.

[0021] 1, the substrate 20 has a cylindrical outer shape with a bottom (upper bottom) also called a stem, and the sensor 10 including the substrate 20 is provided at one end of the flow path 12b in the connection member 12. The substrate 20 has a flange portion 21 at its opening side (Z-axis negative direction side), and the flange portion 21 is sandwiched between the pressing member 14 and the connection member 12, thereby fixing the substrate 20 to the connection member 12. The opening of the substrate 20 and the flow path 12b of the connection member 12 are airtightly connected by the pressing member 14, and the pressure of the fluid to be measured is transmitted to a bottom wall portion 22 (also called a membrane) of the substrate 20.

[0022] In the first embodiment, the sensor 10 is used as a pressure sensor for measuring the pressure of a fluid in a pressure chamber. However, the sensor according to the present disclosure is not limited to a pressure sensor, but includes sensors other than pressure sensors such as strain gauges (see FIG. 12). The shape of the substrate 20 shown in FIG. 1 is not limited to a stem shape, but may have other shapes having a portion such as a bottom wall portion 22 that deforms when subjected to a force from a measurement target, and may be a flat plate as shown in FIG. 12. Examples of materials for the substrate 20 include, but are not limited to, metal materials such as stainless steel, ceramics such as silicon carbide, and semiconductor materials such as silicon. Furthermore, it is preferable to use austenitic SUS304, 316 or precipitation hardened SUS630, 631 as the material of the substrate, since these materials have excellent high-temperature characteristics when the measurement environment of the sensor 10 is under high-temperature conditions.

[0023] Fig. 2 is an enlarged schematic plan view of the sensor body 18 of the sensor 10 shown in Fig. 1, viewed from the outer bottom surface 24 side of the bottom wall portion 22 of the substrate 20. As can be seen from Figs. 1 and 2, the outer bottom surface 24 of the substrate 20 is the surface opposite to the pressure-receiving inner surface 23 that contacts the measurement fluid in the substrate 20, and the outer bottom surface 24 deforms according to the pressure of the measurement fluid. A conductive film pattern 40 is formed on the outer bottom surface 24 of the substrate 20, and the sensor 10 can detect a change in the resistance value of the conductive film pattern 40 accompanying the deformation of the outer bottom surface 24 and calculate the pressure of the measurement fluid.

[0024] Although not shown in Fig. 2, on the outer bottom surface 24, which is the surface of the base material 20, streaks 25 (see Fig. 3) are formed along the first direction D1 when viewed in a plan view from a direction perpendicular to the outer bottom surface 24. Fig. 3A is an enlarged plan view of a portion of the outer bottom surface 24 of the base material 20, and Fig. 3B is an enlarged cross-sectional view showing the streaks 25 on the outer bottom surface 24. As shown in Fig. 3A, when the outer bottom surface 24 of the base material 20 is enlarged, it can be seen that the streaks 25, which are made up of numerous fine streaks, are formed over the entire outer bottom surface 24.

[0025] As shown in Fig. 3B, the streaks 25 are observed as undulations formed on the outer bottom surface 24 in an enlarged cross section, and can also be considered to be numerous linear flaws that are approximately parallel to the first direction D1 in a plan view. Examples of the undulations that constitute such streaks 25 include grinding marks formed in the grinding direction when the base material 20 is produced, and rolling marks formed in the rolling direction during rolling, and these are formed intermittently or continuously on the entire outer bottom surface 24. If multiple types of streaks that are formed in different directions in a plan view are formed intermittently or continuously on the entire outer bottom surface 24 (the surface of the base material), the direction of one type of streaks that has deeper unevenness is considered to be the first direction D1. For example, in the case where grinding marks having a depth of 0.1 to 1.0 μm and polishing marks having a depth of 0.01 to 0.1 μm are formed on the outer bottom surface, the direction of the grinding marks having a depth of 0.1 to 1.0 μm is considered to be the first direction D1.

[0026] In the sensor 10, the surface roughness Ra of the outer bottom surface 24 in the second direction D2 perpendicular to the first direction D1 within the plane of the outer bottom surface 24 is preferably 0.05 μm or more and 1 μm or less. When the surface roughness Ra of the outer bottom surface 24 is a predetermined value or more, etching residue 45 of the conductive film (see FIG. 4) is likely to occur along the first direction D1, and therefore the effect of preventing short circuit defects caused by the etching residue 45 is particularly large. In addition, by setting the surface roughness Ra to a predetermined value or less, it is possible to form a thin conductive film pattern 40 with high accuracy.

[0027] The streaks 25 formed on the outer bottom surface 24 can be eliminated by mirror-polishing the outer bottom surface 24 before forming the base insulating film 30 and the conductive film pattern 40 (see FIG. 4) on the outer bottom surface 24, but the processing time and cost required to eliminate the streaks 25 by mirror-polishing the outer bottom surface 24 results in reduced productivity. On the other hand, productivity can be improved by forming the base insulating film 30 and the conductive film pattern 40 (see FIG. 4) on the outer bottom surface 24 while the streaks 25 are still formed, as in the substrate 20 according to the first embodiment.

[0028] The conductive film pattern 40 shown in FIG. 2 is formed on the outer bottom surface 24 (above in the film stacking direction) with the base insulating film 30 sandwiched therebetween. FIG. 4 is an enlarged cross-sectional view of the periphery of the outer bottom surface 24 of the sensor 10 shown in FIG. 2. The base insulating film 30 is formed on the entire outer bottom surface 24, and ensures insulation between the outer bottom surface 24 of the base material 20 and the conductive film pattern 40. In this way, in the sensor 10, the base insulating film 30 is formed between the outer bottom surface 24 and the conductive film pattern 40, and the conductive film pattern 40 is indirectly formed on the outer bottom surface 24. However, the sensor 10 is not limited to this, and the conductive film pattern 40 may be directly formed on the outer bottom surface 24 in cases where the material of the base material 20 has insulating properties or the outer bottom surface 24 is subjected to insulating treatment.

[0029] The thickness T (average value) of the base insulating film 30 is not particularly limited, but can be, for example, 1 to 10 times the surface roughness Ra of the outer bottom surface 24 shown in FIG. 3. When the thickness T of the base insulating film 30 is a predetermined multiple or more of the surface roughness Ra of the outer bottom surface 24, the insulation between the base material 20, which is a metal base material, and the conductive film pattern 40 can be suitably secured. In addition, when the thickness T of the base insulating film 30 is a predetermined multiple or less of the surface roughness Ra of the outer bottom surface 24, undulations tracing the streaks 25 of the outer bottom surface 24 are likely to occur on the surface of the base insulating film 30 on the conductive film pattern 40 side, and etching residues 45 of the conductive film are likely to occur along the first direction D1, so that the effect of preventing the occurrence of short circuit defects due to the etching residues 45 is particularly large.

[0030] 2 and 4 may be made of silicon oxide, silicon nitride, alumina, or the like, but is not particularly limited as long as it is an insulating material. The method for forming the base insulating film 30 is not particularly limited, but may be, for example, a sputtering method, a vacuum deposition method, a CVD method, or a sol-gel method. In addition, the base insulating film 30 may be made by a method that provides good coverage, such as a TEOS-CVD method, and the sensor according to the present disclosure can suitably prevent the occurrence of short circuit defects in such cases.

[0031] 2 connects a first position 24a and a second position 24b, which are different positions in the in-plane direction of the outer bottom surface 24 when viewed from a direction perpendicular to the outer bottom surface 24, in a shape in which the length of the conductive path is longer than the length of a straight line connecting the first position 24a and the second position 24b, which are different positions. By forming the conductive film pattern 40 in such a shape, a long conductive path can be formed in a narrow area, and the detection sensitivity by the conductive film pattern 40 can be improved.

[0032] The conductive film pattern 40 has a meandering shape in which the conductive path has a folded (or meandering) shape, which is preferable because it can form a narrow and long conductive path in a narrow area. However, the conductive film pattern 40 is not limited to a meandering shape, and may have other shapes (see FIG. 11, etc.) that connect the first position 24a and the second position 24b in a detour with respect to a straight line. The same applies to the other embodiments.

[0033] As shown in FIG. 2, the conductive film pattern 40 has two electrode film portions 41 and a resistive film portion 42 that electrically connects the two electrode film portions 41. The two electrode film portions 41 are formed so as to include a first position 24a and a second position 24b when viewed from a direction perpendicular to the outer bottom surface 24. External wiring (not shown) is connected to the two electrode film portions 41 by wire bonding or the like. The resistive film portion 42 has a rectangular wave shape or a meandering shape in which the first direction D1 is the amplitude direction, and forms a conductive path narrower than the electrode film portion 41 to electrically connect the two electrode film portions 41.

[0034] The conductive film pattern 40 is a pattern made of a conductive film, and may be made of a single or one type of film, or may be made of multiple or many types of films, as long as it forms a conductive path connecting the first position 24a and the second position 24b. The electrode film portion 41 and the resistive film portion 42 of the conductive film pattern 40 shown in FIG. 2 may be made of the same material, or may be made of different materials. Examples of the material of the resistive film portion 42 of the conductive film pattern 40 according to the embodiment include metals such as Cr, Ni, Al, and Cu, and strain-resistant film materials containing Cr, at least one of Ni, Al, and Cu, and at least one of N and O, and examples of the material of the electrode film portion 41 of the conductive film pattern 40 include good conductor metals such as Al and Au.

[0035] The shape of the conductive film pattern 40 shown in Fig. 2 is such that any one straight line parallel to the first direction D1 passes through the conductive path center line 43 of the conductive film pattern 0 or 1 time, but does not pass through it twice or more. In other words, the shape of the conductive film pattern 40 shown in Fig. 2 is such that all straight lines parallel to the first direction D1 pass through the conductive path center line 43 of the conductive film pattern 0 or 1 time, but does not pass through it twice or more. Meanwhile, Fig. 13 is a conceptual diagram of a sensor 110 having a conductive film pattern 140 according to a comparative example, and the amplitude direction of the conductive film pattern 140 shown in Fig. 13 is perpendicular to the first direction D1.

[0036] The conductive film pattern 140 according to the comparative example shown in FIG. 13 has a shape in which a straight line 195 parallel to the first direction D1 passes through the conductive path center line 143 five times as indicated by a circle in the figure. In this way, the conductive film pattern 140 in which a predetermined straight line 195 parallel to the first direction D1 passes through it two or more times has a higher risk of short circuit defects compared to the conductive film pattern 40 shown in FIG. 2. The reason for this is that, as shown in FIG. 4, in the conductive film patterns 40 and 140 formed on the surface (outer bottom surface 24) on which the streaks 25 are formed, there is a high risk of etching residues 45 extending in the first direction D1 corresponding to the undulating shape constituting the streaks 25 being generated. That is, the film that is the base of the conductive film patterns 40 and 140 generates locally thick portions on the streaks 25 during its formation, and when it is removed by etching or the like, the thick portions may remain as etching residues 45.

[0037] As described above, in the conductive film pattern 140 of the comparative example, it is difficult to eliminate the possibility of the occurrence of elongated etched residues of conductive material along the first direction D1 as shown by the straight line 195 in FIG. 13. If etched residues of conductive material along the straight line 195 occur, the etched residues will cause a problem of short-circuiting the conductive path of the conductive film pattern 140.

[0038] On the other hand, the conductive film pattern 40 shown in FIG. 2 has a shape in which any one straight line parallel to the first direction D1 does not pass through the conductive path center line 43 two or more times. In the sensor 10 having such a conductive film pattern 40, even if an etching residue of the conductive material along the first direction D1 occurs, the etching residue 45 passes through the conductive path zero or one time, so that the problem of the etching residue 45 forming a short path of the conductive path in the conductive film pattern 40 can be prevented. Note that the form in which a predetermined straight line parallel to the first direction D1 passes through the conductive path center line 43 of the conductive film pattern once includes a form in which a predetermined straight line parallel to the first direction D1 intersects the conductive path center line 43 once in a plan view, and a form in which a predetermined straight line parallel to the first direction D1 continuously overlaps the conductive path center line along the first direction D1 in a plan view.

[0039] The sensor 10 shown in Figures 1 to 4 is manufactured, for example, by the following manufacturing process. First, in manufacturing the sensor 10, a base material 20 as shown in Figures 1 and 3 is prepared. The base material 20 is manufactured, for example, by performing mechanical processing such as pressing, cutting, and polishing on a predetermined metal material. At this time, the outer bottom surface 24 shown in Figure 3 is not mirror-polished, but is left in a state in which the streaks 25 remain, thereby simplifying the manufacturing process.

[0040] Next, a multi-layered film that is the base of the insulating film 30 and the conductive film pattern 40 is formed on the outer bottom surface 24 of the substrate 20, and then the formed film is subjected to microfabrication using semiconductor processing techniques including etching, etc., to form the insulating film 30 and the conductive film pattern 40. Through these steps, a sensor body 18 including the substrate 20 as shown in FIG. 2 is obtained. Furthermore, as shown in FIG. 1, the sensor body 18 including the substrate 20 is fixed to a connection member 12 or the like, and the substrate part 90 and the electrode film part 41 of the conductive film pattern 40 are wired by wire bonding or the like, thereby manufacturing a sensor 10 as shown in FIG. 1. An insulating protective layer 35 as shown in FIG. 4 may be formed on the conductive film pattern 40. The protective layer 35 is not shown in the figures other than FIG. 4.

[0041] 13, the sensor 10 obtained in this manner has a shape in which any one straight line parallel to the first direction D1 does not pass through the center line of the conductive path two or more times. As a result, even if an etching residue 45 of conductive material along the first direction D1 occurs in the manufacturing process of the sensor 10, the etching residue 45 passes through the conductive path zero or one time, thereby preventing the problem of the etching residue 45 forming a short path in the conductive path of the conductive film pattern 40.

[0042] Second embodiment 5 is an enlarged schematic plan view of a sensor main body of a sensor 210 according to the second embodiment, viewed from the outer bottom surface 24 side of the bottom wall portion 22 of the substrate 20. The sensor 210 according to the second embodiment is similar to the sensor 10 according to the first embodiment, except that the shape of the conductive film pattern 240 is different. The explanation of the sensor 210 according to the second embodiment will focus on the differences from the sensor 10, and a description of the commonalities with the sensor 10 will be omitted.

[0043] The conductive film pattern 240 of the sensor 210 shown in FIG. 5 is also formed on the in-plane direction of the outer bottom surface 24 of the substrate 20 (see FIG. 1) with the base insulating film 30 sandwiched therebetween, similar to the conductive film pattern 40 shown in FIG. 2. The conductive film pattern 240 connects a first position 224a and a second position 224b, which are different positions in the in-plane direction of the outer bottom surface 24, in a shape in which the length of the conductive path is longer than the length of a straight line connecting the first position 24a and the second position 24b. In the conductive film pattern 40 shown in FIG. 2, the straight line connecting the first position 24a and the second position 24b is perpendicular to the first direction D1, but in the conductive film pattern 240, the straight line connecting the first position 224a and the second position 224b is oblique to the first direction D1.

[0044] The conductive film pattern 240 has two electrode film portions 241 and a resistive film portion 242 that electrically connects the two electrode film portions 241. The two electrode film portions 241 are each formed to include a first position 224a and a second position 224b when viewed from a direction perpendicular to the outer bottom surface 24. The resistive film portion 242 has a rectangular wave shape or a meandering shape in which the first direction D1 is the amplitude direction, and forms a conductive path narrower than the electrode film portion 241 to electrically connect the two electrode film portions 241.

[0045] 2, the shape of the conductive film pattern 240 shown in Fig. 5 is such that any straight line parallel to the first direction D1 passes through the conductive path center line 243 of the conductive film pattern 240 zero or one time, but does not pass through it two or more times. The sensor 210 having the conductive film pattern 240 also has the same effect as the sensor 10 according to the first embodiment.

[0046] 2 and 5, the shapes of the conductive film patterns 40, 240 are not particularly limited, and various shapes that connect the first positions 24a, 224a and the second positions 24b, 224b in a shape longer than a straight line can be adopted. In addition, the first positions 24a, 224a and the second positions 24b, 224b where the conductive film patterns 40, 240 form conductive paths can also be any positions different from each other in the in-plane direction of the outer bottom surface 24.

[0047] Third embodiment 6 is an enlarged schematic plan view of a sensor main body of a sensor 310 according to the third embodiment, viewed from the outer bottom surface 24 side of the bottom wall portion 22 of the substrate 20. The sensor 310 according to the third embodiment is similar to the sensor 10 according to the first embodiment, except that the sensor 310 has a plurality of conductive film patterns including a first conductive film pattern 350 and a second conductive film pattern 360. The description of the sensor 310 according to the third embodiment will focus on the differences from the sensor 10, and a description of the commonalities with the sensor 10 will be omitted.

[0048] Similarly to the conductive film pattern 40 shown in FIG. 2, the first conductive film pattern 350 and the second conductive film pattern 360 of the sensor 310 shown in FIG. 6 are formed on the outer bottom surface 24 (see FIG. 1) of the substrate 20 with the base insulating film 30 sandwiched therebetween. The first conductive film pattern 350 connects a first position 324a and a second position 324b, which are different positions in the in-plane direction of the outer bottom surface 24, in a first shape in which the length of the conductive path is longer than the length of a straight line connecting the first position 324a and the second position 324b. The second conductive film pattern 360 connects a third position 324c and a fourth position 324d, which are different positions in the in-plane direction of the outer bottom surface 24, in a second shape in which the length of the conductive path is longer than the length of a straight line connecting the third position 324c and the fourth position 324d.

[0049] The first conductive film pattern 350 and the second conductive film pattern 360 are formed with their positions shifted so as not to overlap each other when viewed from a direction perpendicular to the outer bottom surface 24. The first conductive film pattern 350 has two electrode film portions 351 and a resistive film portion 352 that electrically connects the two electrode film portions 351. The second conductive film pattern 360 has two electrode film portions 361 and a resistive film portion 362 that electrically connects the two electrode film portions 361. The resistive film portion 352 of the conductive film pattern 350 has a rectangular wave shape or a meandering shape in which the first direction D1 is the amplitude direction, and forms a conductive path narrower than the electrode film portion 351 to electrically connect the two electrode film portions 351. The resistive film portion 362 of the conductive film pattern 360 has a rectangular wave shape or a meandering shape with the first direction D1 being the amplitude direction, and forms a conductive path narrower than the electrode film portion 361 to electrically connect the two electrode film portions 361. The sensor 310 can determine the pressure of the fluid to be detected by using both the detection signal from the first conductive film pattern 350 and the detection signal from the second conductive film pattern 360.

[0050] Like the conductive film pattern 40 shown in FIG. 2, the first and second shapes of the first and second conductive film patterns 350, 360 shown in FIG. 6 are shaped such that any straight line parallel to the first direction D1 passes through the conductive path center line of the conductive film pattern (the center line of the conductive path connecting two different positions (see FIGS. 2, 5, etc.)) zero or one time, but not two or more times. The sensor 310 having the first and second conductive film patterns 350, 360 also achieves the same effects as the sensor 10 in terms of commonalities with the sensor 10 of the first embodiment.

[0051] Fourth embodiment 7 is an enlarged schematic plan view of a sensor main body of a sensor 410 according to the fourth embodiment, viewed from the outer bottom surface 24 side of the bottom wall portion 22 of the substrate 20. The sensor 410 according to the fourth embodiment is similar to the sensor 10 according to the first embodiment, except that the sensor 410 according to the fourth embodiment has a plurality (four) of conductive film patterns including a first conductive film pattern 450, a second conductive film pattern 460, a third conductive film pattern 470, and a fourth conductive film pattern 480. The sensor 410 according to the fourth embodiment will be described mainly with respect to differences from the sensor 10, and a description of commonalities with the sensor 10 will be omitted.

[0052] Each of the first to fourth conductive film patterns 450, 460, 470, and 480 of the sensor 410 shown in FIG. 7 is formed on the outer bottom surface 24 (see FIG. 1) of the substrate 20 with the base insulating film 30 sandwiched therebetween, similar to the conductive film pattern 40 shown in FIG. 2. The first conductive film pattern 450 connects a first position 424a and a second position 424b, which are different positions in the in-plane direction of the outer bottom surface 24, in a first shape in which the length of the conductive path is longer than the length of a straight line connecting the first position 424a and the second position 424b. The second conductive film pattern 460 connects a third position 424c and a fourth position 424d, which are different positions in the in-plane direction of the outer bottom surface 24, in a second shape in which the length of the conductive path is longer than the length of a straight line connecting the third position 424c and the fourth position 424d.

[0053] 7 connects a fifth position 424e and a sixth position 424f, which are different positions in the in-plane direction of the outer bottom surface 24, in a third shape in which the length of the conductive path is longer than the length of a straight line connecting the fifth position 424e and the sixth position 424f. Also, the fourth conductive film pattern 480 connects a seventh position 424g and an eighth position 424h, which are different positions in the in-plane direction of the outer bottom surface 24, in a fourth shape in which the length of the conductive path is longer than the length of a straight line connecting the seventh position 424g and the eighth position 424h.

[0054] The first to fourth conductive film patterns 450, 460, 470, 480 are formed at different positions so as not to overlap each other when viewed from a direction perpendicular to the outer bottom surface 24. The first conductive film pattern 450 has two electrode film portions 451 and a resistive film portion 452 that electrically connects the two electrode film portions 451. The second conductive film pattern 460 has two electrode film portions 461 and a resistive film portion 462 that electrically connects the two electrode film portions 461. The third conductive film pattern 470 has two electrode film portions 471 and a resistive film portion 472 that electrically connects the two electrode film portions 471. The fourth conductive film pattern 480 has two electrode film portions 481 and a resistive film portion 482 that electrically connects the two electrode film portions 481. The resistive film portion 452 of the first conductive film pattern 450 has a rectangular wave shape or a meandering shape with the first direction D1 being the amplitude direction, and forms a conductive path narrower than the electrode film portion 451 to electrically connect the two electrode film portions 451. The resistive film portion 462 of the second conductive film pattern 460 has a rectangular wave shape or a meandering shape with the first direction D1 being the amplitude direction, and forms a conductive path narrower than the electrode film portion 461 to electrically connect the two electrode film portions 461. The resistive film portion 472 of the third conductive film pattern 470 has a rectangular wave shape or a meandering shape with the first direction D1 being the amplitude direction, and forms a conductive path narrower than the electrode film portion 471 to electrically connect the two electrode film portions 471. The resistive film portion 482 of the fourth conductive film pattern 480 has a rectangular wave shape or a meandering shape with the first direction D1 being the amplitude direction, and forms a conductive path narrower than the electrode film portions 481 to electrically connect the two electrode film portions 481. The sensor 410 forms a bridge circuit using detection signals from, for example, the first to fourth conductive film patterns 450, 460, 470, 480, and can accurately determine the pressure of the fluid to be detected.

[0055] Like the conductive film pattern 40 shown in FIG. 2, each of the first to fourth shapes of the first to fourth conductive film patterns 450, 460, 470, 480 shown in FIG. 7 has a shape in which any straight line parallel to the first direction D1 passes through the conductive path center line of the conductive film pattern (the center line of the conductive path connecting two different positions (see FIGS. 2, 5, etc.)) zero or one time, but does not pass through it two or more times. The sensor 410 having the first to fourth conductive film patterns 450, 460, 470, 480 also achieves the same effects as the sensor 10 in terms of commonalities with the sensor 10 according to the first embodiment.

[0056] Fifth embodiment 8 is an enlarged schematic plan view of a sensor main body of a sensor 510 according to the fifth embodiment, as viewed from the outer bottom surface 24 side of the bottom wall portion 22 of the substrate 20. The sensor 510 according to the fifth embodiment is similar to the sensor 410 according to the fourth embodiment, except that the arrangement of the multiple (four) conductive film patterns including a first conductive film pattern 550, a second conductive film pattern 560, a third conductive film pattern 570, and a fourth conductive film pattern 580 is different. The sensor 510 according to the fifth embodiment will be described mainly with respect to the differences from the sensor 410, and a description of the commonalities with the sensor 410 will be omitted.

[0057] Each of the first to fourth conductive film patterns 550, 560, 570, and 580 of the sensor 510 shown in FIG. 8 is formed on the outer bottom surface 24 (see FIG. 1) of the substrate 20 with the base insulating film 30 sandwiched therebetween, similar to the conductive film pattern 40 shown in FIG. 2. The first conductive film pattern 550 connects a first position 524a and a second position 524b, which are different positions in the in-plane direction of the outer bottom surface 24, in a first shape in which the length of the conductive path is longer than the length of a straight line connecting the first position 524a and the second position 524b. The second conductive film pattern 560 connects a third position 524c and a fourth position 524d, which are different positions in the in-plane direction of the outer bottom surface 24, in a second shape in which the length of the conductive path is longer than the length of a straight line connecting the third position 524c and the fourth position 524d.

[0058] 8 connects a fifth position 524e and a sixth position 524f, which are different positions in the in-plane direction of the outer bottom surface 24, in a third shape in which the length of the conductive path is longer than the length of a straight line connecting the fifth position 524e and the sixth position 524f. Also, the fourth conductive film pattern 580 connects a seventh position 524g and an eighth position 524h, which are different positions in the in-plane direction of the outer bottom surface 24, in a fourth shape in which the length of the conductive path is longer than the length of a straight line connecting the seventh position 524g and the eighth position 524h.

[0059] The first to fourth conductive film patterns 550, 560, 570, 580 are formed at different positions so as not to overlap each other when viewed from a direction perpendicular to the outer bottom surface 24. The first conductive film pattern 550 has two electrode film portions 551 and a resistive film portion 552 that electrically connects the two electrode film portions 551. The second conductive film pattern 560 has two electrode film portions 561 and a resistive film portion 562 that electrically connects the two electrode film portions 561. The third conductive film pattern 570 has two electrode film portions 571 and a resistive film portion 572 that electrically connects the two electrode film portions 571. The fourth conductive film pattern 580 has two electrode film portions 581 and a resistive film portion 582 that electrically connects the two electrode film portions 581. The resistive film portion 552 of the first conductive film pattern 550 has a rectangular wave shape or a meandering shape with the first direction D1 being the amplitude direction, and forms a conductive path narrower than the electrode film portion 551 to electrically connect the two electrode film portions 551. The resistive film portion 562 of the second conductive film pattern 560 has a rectangular wave shape or a meandering shape with the first direction D1 being the amplitude direction, and forms a conductive path narrower than the electrode film portion 561 to electrically connect the two electrode film portions 561. The resistive film portion 572 of the third conductive film pattern 570 has a rectangular wave shape or a meandering shape with the first direction D1 being the amplitude direction, and forms a conductive path narrower than the electrode film portion 571 to electrically connect the two electrode film portions 571. The resistive film portion 582 of the fourth conductive film pattern 580 has a rectangular wave shape or a meandering shape with the first direction D1 being the amplitude direction, and forms a conductive path narrower than the electrode film portions 581 to electrically connect the two electrode film portions 581. The sensor 510 forms a bridge circuit using detection signals from, for example, the first to fourth conductive film patterns 550, 560, 570, 580, and can accurately determine the pressure of the fluid to be detected.

[0060] Similarly to the conductive film pattern 40 shown in FIG. 2, each of the first to fourth shapes of the first to fourth conductive film patterns 550, 560, 570, 580 shown in FIG. 8 has a shape in which any straight line parallel to the first direction D1 passes through the conductive path center line of the conductive film pattern (the center line of the conductive path connecting two different positions (see FIG. 2, FIG. 5, etc.)) zero or one time, but does not pass through it two or more times. Also, in the sensor 510 shown in FIG. 8, the first conductive film pattern 550 and the second conductive film pattern 560, which have a short center-to-center distance along the first direction D1, are arranged with their positions shifted in the second direction D2 so that they do not overlap each other when viewed from the first direction D1.

[0061] 8, any one straight line parallel to the first direction D1 passes through the first conductive film pattern 550 and does not pass through the second conductive film pattern 560, passes through the second conductive film pattern 560 and does not pass through the first conductive film pattern 550, or passes through neither the first conductive film pattern 550 nor the second conductive film pattern 560, but does not pass through both the first conductive film pattern 550 and the second conductive film pattern 560. In other words, in the sensor 510 shown in FIG. 8, any one of all straight lines parallel to the first direction D1 passes through the first conductive film pattern 550 and does not pass through the second conductive film pattern 560, passes through the second conductive film pattern 560 and does not pass through the first conductive film pattern 550, or passes through neither the first conductive film pattern 550 nor the second conductive film pattern 560, but does not pass through both the first conductive film pattern 550 and the second conductive film pattern 560. Such a sensor 10 can prevent the formation of a short path between different conductive film patterns 550, 560 due to the etching residue 45 of the conductive film (see FIG. 4), and can effectively prevent the occurrence of short defects between the different conductive film patterns 550, 560.

[0062] Moreover, the center-to-center distance along the first direction D1 between the first conductive film pattern 550 and the second conductive film pattern 560 is shorter than the center-to-center distance along the first direction D1 between the first conductive film pattern 550 and the third conductive film pattern 570 and the fourth conductive film pattern 580, and the center-to-center distance along the first direction D1 between the second conductive film pattern 560 and the third conductive film pattern 570 and the fourth conductive film pattern 580. According to such a sensor 510, it is possible to prevent the formation of a short path caused by the etching residue 45 of the conductive film between the first conductive film pattern 550 and the second conductive film pattern 560, which have a close center-to-center distance along the first direction D1, and therefore it is possible to prevent the occurrence of short circuit defects and to prevent the sensor from becoming large. Although the first conductive film pattern 550 and the third conductive film pattern 570 overlap each other in some parts when viewed from the first direction D1, the risk of short circuit defects occurring is relatively small since the center-to-center distance along the first direction D1 is relatively large.

[0063] The sensor 510 having the first to fourth conductive film patterns 550, 560, 570, 580 also exhibits the same effects as the sensor 410 in common with the sensor 410 according to the fourth embodiment.

[0064] Sixth embodiment 9 is an enlarged schematic view of a sensor main body of a sensor 610 according to the sixth embodiment, viewed from the outer bottom surface 24 side of the bottom wall portion 22 of the substrate 20. The sensor 610 according to the sixth embodiment is similar to the sensor 310 according to the third embodiment, except that the arrangement of the multiple conductive film patterns including the first conductive film pattern 650 and the second conductive film pattern 660 is different. The sensor 610 according to the sixth embodiment will be described mainly with respect to the differences from the sensor 310, and a description of the commonalities with the sensor 310 will be omitted.

[0065] The first conductive film pattern 650 and the second conductive film pattern 660 of the sensor 610 shown in FIG. 9 are formed on the outer bottom surface 24 (see FIG. 1) of the substrate 20 with the base insulating film 30 sandwiched therebetween, similar to the conductive film pattern 40 shown in FIG. 2. The first conductive film pattern 650 connects a first position 624a and a second position 624b, which are different positions in the in-plane direction of the outer bottom surface 24, in a first shape in which the length of the conductive path is longer than the length of a straight line connecting the first position 624a and the second position 624b. The second conductive film pattern 660 connects a third position 624c and a fourth position 624d, which are different positions in the in-plane direction of the outer bottom surface 24, in a second shape in which the length of the conductive path is longer than the length of a straight line connecting the third position 624c and the fourth position 624d.

[0066] The first conductive film pattern 650 and the second conductive film pattern 660 are formed with their positions shifted so as not to overlap each other when viewed from a direction perpendicular to the outer bottom surface 24. The first conductive film pattern 650 has two electrode film portions 651 and a resistive film portion 652 that electrically connects the two electrode film portions 651. The second conductive film pattern 660 has two electrode film portions 661 and a resistive film portion 662 that electrically connects the two electrode film portions 661. The resistive film portion 652 of the first conductive film pattern 650 has a rectangular wave shape or a meandering shape in which the first direction D1 is the amplitude direction, and forms a conductive path narrower than the electrode film portion 651 to electrically connect the two electrode film portions 651. The resistive film portion 662 of the second conductive film pattern 660 has a rectangular wave shape or a meandering shape with the first direction D1 being the amplitude direction, and forms a conductive path narrower than the electrode film portion 661 to electrically connect the two electrode film portions 661. The sensor 610 can determine the pressure of the fluid to be detected by using both the detection signal from the first conductive film pattern 650 and the detection signal from the second conductive film pattern 660.

[0067] Similarly to the conductive film pattern 40 shown in FIG. 2, the first and second shapes of the first and second conductive film patterns 650, 660 shown in FIG. 9 are shaped such that any straight line parallel to the first direction D1 passes through the conductive path center line of the conductive film pattern (the center line of the conductive path connecting two different positions (see FIG. 2, FIG. 5, etc.)) zero or one time, but does not pass through it two or more times. Furthermore, unlike the first and second conductive film patterns 350, 360 shown in FIG. 6, the first conductive film pattern 650 and the second conductive film pattern 660 of the sensor 610 shown in FIG. 9 are arranged with their positions shifted in the second direction D2 so as not to overlap each other when viewed from the first direction D1.

[0068] 9, any one straight line parallel to the first direction D1 passes through either one of the plurality of conductive film patterns 650, 660, or passes through none of the plurality of conductive film patterns 650, 660, but does not pass through two or more of the plurality of conductive film patterns 650, 660. According to such a sensor 610, even in the case where two or more conductive film patterns 650, 650 are provided, the problem of a short path being formed between different conductive film patterns 650, 660 due to the etching residue 45 of the conductive film can be prevented, and the occurrence of a short circuit defect between the different conductive film patterns 650, 660 can be suitably prevented.

[0069] 6, the two conductive film patterns 350, 360 overlap each other when viewed from the first direction D1. Therefore, there is a risk that a short path caused by the etching residue 45 of the conductive film may be formed between the two conductive film patterns 350, 360. However, if a short path is formed between the two conductive film patterns 350, 360, this can be relatively easily found by checking the electrical continuity between one of the two electrode film portions 351 and one of the two electrode film portions 361. Therefore, the effect of the sensor 310 in preventing the formation of a short path inside each of the conductive film patterns 350, 360 is great.

[0070] The sensor 610 having the first and second conductive film patterns 650, 660 also exhibits the same effects as the sensor 310 in terms of the points in common with the sensor 310 according to the third embodiment.

[0071] Seventh embodiment 10 is an enlarged schematic view of a sensor main body of a sensor 710 according to the seventh embodiment, viewed from the outer bottom surface 24 side of the bottom wall portion 22 of the substrate 20. The sensor 710 according to the seventh embodiment is similar to the sensor 510 according to the fifth embodiment, except that the arrangement of the multiple (four) conductive film patterns including a first conductive film pattern 750, a second conductive film pattern 760, a third conductive film pattern 770, and a fourth conductive film pattern 780 is different. The sensor 710 according to the seventh embodiment will be described mainly with respect to the differences from the sensor 510, and a description of the commonalities with the sensor 510 will be omitted.

[0072] Each of the first to fourth conductive film patterns 750, 760, 770, and 780 of the sensor 710 shown in FIG. 10 is formed on the outer bottom surface 24 (see FIG. 1) of the substrate 20 with the base insulating film 30 sandwiched therebetween, similar to the conductive film pattern 40 shown in FIG. 2. The first conductive film pattern 750 connects a first position 724a and a second position 724b, which are different positions in the in-plane direction of the outer bottom surface 24, in a first shape in which the length of the conductive path is longer than the length of a straight line connecting the first position 724a and the second position 724b. The second conductive film pattern 760 connects a third position 724c and a fourth position 724d, which are different positions in the in-plane direction of the outer bottom surface 24, in a second shape in which the length of the conductive path is longer than the length of a straight line connecting the third position 724c and the fourth position 724d.

[0073] 10 connects a fifth position 724e and a sixth position 724f, which are different positions in the in-plane direction of the outer bottom surface 24, in a third shape in which the length of the conductive path is longer than the length of a straight line connecting the fifth position 724e and the sixth position 724f. Also, a fourth conductive film pattern 780 connects a seventh position 724g and an eighth position 724h, which are different positions in the in-plane direction of the outer bottom surface 24, in a fourth shape in which the length of the conductive path is longer than the length of a straight line connecting the seventh position 724g and the eighth position 724h.

[0074] The first to fourth conductive film patterns 750, 760, 770, and 780 are formed at different positions so as not to overlap each other when viewed from a direction perpendicular to the outer bottom surface 24. The first conductive film pattern 750 has two electrode film portions 751 and a resistive film portion 752 that electrically connects the two electrode film portions 751. The second conductive film pattern 760 has two electrode film portions 761 and a resistive film portion 762 that electrically connects the two electrode film portions 761. The third conductive film pattern 770 has two electrode film portions 771 and a resistive film portion 772 that electrically connects the two electrode film portions 771. The fourth conductive film pattern 780 has two electrode film portions 781 and a resistive film portion 782 that electrically connects the two electrode film portions 781. The resistive film portion 752 of the first conductive film pattern 750 has a rectangular wave shape or a meandering shape with the first direction D1 being the amplitude direction, and forms a conductive path narrower than the electrode film portion 751 to electrically connect the two electrode film portions 751. The resistive film portion 762 of the second conductive film pattern 760 has a rectangular wave shape or a meandering shape with the first direction D1 being the amplitude direction, and forms a conductive path narrower than the electrode film portion 761 to electrically connect the two electrode film portions 761. The resistive film portion 772 of the third conductive film pattern 770 has a rectangular wave shape or a meandering shape with the first direction D1 being the amplitude direction, and forms a conductive path narrower than the electrode film portion 771 to electrically connect the two electrode film portions 771. The resistive film portion 782 of the fourth conductive film pattern 780 has a rectangular wave shape or a meandering shape with the first direction D1 being the amplitude direction, and forms a conductive path narrower than the electrode film portions 781 to electrically connect the two electrode film portions 781. The sensor 710 forms a bridge circuit using detection signals from, for example, the first to fourth conductive film patterns 750, 760, 770, 780, and can accurately determine the pressure of the fluid to be detected.

[0075] Similarly to the conductive film pattern 40 shown in FIG. 2, each of the first to fourth shapes of the first to fourth conductive film patterns 750, 760, 770, 780 shown in FIG. 10 has a shape in which any straight line parallel to the first direction D1 passes through the conductive path center line of the conductive film pattern (the center line of the conductive path connecting two different positions (see FIG. 2, FIG. 5, etc.)) zero or one time, but does not pass through it two or more times. Also, in the sensor 710 shown in FIG. 10, the first to fourth conductive film patterns 750, 760, 770, 780 are arranged with their positions shifted in the second direction D2 so that they do not overlap each other when viewed from the first direction D1.

[0076] 10, any one straight line parallel to the first direction D1 passes through any one of the plurality of conductive film patterns 750, 760, 770, 780, or passes through none of the plurality of conductive film patterns 750, 760, 770, 780, but does not pass through two or more of the plurality of conductive film patterns 750, 760, 770, 780. According to such a sensor 710, even when two or more conductive film patterns 750, 760, 770, 780 are provided, the problem of a short path being formed between different conductive film patterns 750, 760, 770, 780 due to the etching residue 45 of the conductive film can be prevented, and the occurrence of a short circuit defect between the different conductive film patterns 750, 760, 770, 780 can be suitably prevented.

[0077] The sensor 710 having the first to fourth conductive film patterns 750, 760, 770, 780 also exhibits the same effects as the sensor 510 in terms of the points in common with the sensor 510 according to the fifth embodiment.

[0078] Eighth embodiment 11 is an enlarged schematic view of a sensor main body of a sensor 810 according to the eighth embodiment, viewed from the outer bottom surface 24 side of the bottom wall portion 22 of the substrate 20. The sensor 810 according to the eighth embodiment is similar to the sensor 710 according to the seventh embodiment, except that the shapes of the multiple (four) conductive film patterns including a first conductive film pattern 850, a second conductive film pattern 860, a third conductive film pattern 870, and a fourth conductive film pattern 880 are different. The sensor 810 according to the eighth embodiment will be described mainly with respect to the differences from the sensor 710, and a description of the commonalities with the sensor 710 will be omitted.

[0079] Each of the first to fourth conductive film patterns 850, 860, 870, and 880 of the sensor 810 shown in FIG. 11 is formed on the outer bottom surface 24 (see FIG. 1) of the substrate 20 with the base insulating film 30 sandwiched therebetween, similar to the conductive film pattern 40 shown in FIG. 2. The first conductive film pattern 850, like the first conductive film pattern 750 shown in FIG. 10, connects a first position 824a and a second position 824b, which are different positions in the in-plane direction of the outer bottom surface 24, in a first shape in which the length of the conductive path is longer than the length of a straight line connecting the first position 824a and the second position 824b. The same is true for the second shape of the second conductive film pattern 860, the third shape of the third conductive film pattern 870, and the fourth shape of the fourth conductive film pattern 880.

[0080] The first conductive film pattern 850 has two electrode film portions 851 and a resistive film portion 852 that electrically connects the two electrode film portions 851. The second conductive film pattern 860 has two electrode film portions 861 and a resistive film portion 862 that electrically connects the two electrode film portions 861. The third conductive film pattern 870 has two electrode film portions 871 and a resistive film portion 872 that electrically connects the two electrode film portions 871. The fourth conductive film pattern 880 has two electrode film portions 881 and a resistive film portion 882 that electrically connects the two electrode film portions 881. The resistive film portions 852, 862, 872, and 882 of the conductive film patterns 850, 860, 870, and 880 are U-shaped with the interrupted portions facing the first direction D1. Such conductive film patterns 850, 860, 870, and 880 do not form conductive paths as long as the meandering conductive film patterns 750, 760, 770, and 780 shown in FIG. 10, but have a folded shape like the conductive film patterns 750, 760, 770, and 780, and depending on the required performance of the sensor 810, such conductive film patterns 850, 860, 870, and 880 may be appropriate.

[0081] Like the conductive film pattern 40 shown in FIG. 2, the first to fourth shapes of the first to fourth conductive film patterns 850, 860, 870, and 880 shown in FIG. 11 are each shaped such that any straight line parallel to the first direction D1 passes through the conductive path center line of the conductive film pattern (the center line of the conductive path connecting two different positions (see FIG. 2, FIG. 5, etc.)) zero or one time, but does not pass through it two or more times.

[0082] The sensor 810 having the first to fourth conductive film patterns 850, 860, 870, 880 also exhibits the same effects as the sensor 710 in terms of the points in common with the sensor 710 according to the seventh embodiment.

[0083] Ninth embodiment 12 is an enlarged schematic diagram of a sensor body of a sensor 910 according to the ninth embodiment, viewed from a surface 924 side of a substrate 920. On the surface 924 of the substrate 920, streaks are formed along a first direction D1 in a plan view viewed from a direction perpendicular to the surface 924, similar to the outer bottom surface 24 of the substrate 20 shown in FIG. 3. The sensor 910 according to the ninth embodiment is similar to the sensor 10 according to the first embodiment, except that the sensor 910 is a strain gauge. The explanation of the sensor 910 according to the ninth embodiment will focus on the differences from the sensor 10, and the explanation of the commonalities with the sensor 10 will be omitted.

[0084] The sensor 910 has a conductive film pattern 940, which connects a first position 924a and a second position 924b, which are different positions in an in-plane direction of the surface 924, in a shape such that the length of the conductive path is longer than the length of a straight line connecting the first position 924a and the second position 924b.

[0085] The conductive film pattern 940 has two electrode film portions 941 and a resistive film portion 942 that electrically connects the two electrode film portions 941. The two electrode film portions 941 are each formed to include a first position 924a and a second position 924b when viewed from a direction perpendicular to the surface 924. The resistive film portion 942 has a rectangular wave shape or a meandering shape in which the first direction D1 is the amplitude direction, and forms a conductive path narrower than the electrode film portion 941 to electrically connect the two electrode film portions 941.

[0086] The sensor 910 functions as a strain gauge that detects strain occurring in the substrate 920 by connecting external wiring (not shown) to the two electrode film portions 941 and detecting the resistance of the conductive film pattern 940. The shape of the conductive film pattern 940 shown in Fig. 12 is also a shape in which any straight line parallel to the first direction D1 passes through the conductive path center line of the conductive film pattern 0 or 1 time, but does not pass through it two or more times, similar to the conductive film pattern 40 shown in Fig. 2. The sensor 910 having the conductive film pattern 940 also exhibits the same effects as the sensor 10 according to the first embodiment with respect to points in common with the sensor 10 according to the first embodiment.

[0087] Although the sensor according to the present disclosure has been described above with reference to a number of embodiments, it goes without saying that the technical scope of the sensor according to the present disclosure is not limited to the above-mentioned embodiments, but includes many other embodiments and modifications. For example, the number of conductive film patterns formed on the outer bottom surface 24 of the substrate 20 or the surface 924 of the substrate 920 is not limited to 1, 2, or 4, but may be 3 or 5 or more conductive film patterns formed on the outer bottom surface 24 of the substrate 20 or the surface 924 of the substrate 920. [Explanation of symbols]

[0088] 10, 110, 210, 310, 410, 510, 610, 710, 810, 910...Sensor 12...Connecting member 12a...Thread groove 12b...Flow path 14…Restraining member 18…Sensor body 20, 920...Base material 21...Flange section 22...Bottom wall 23…Pressure-receiving inner surface 24…Outer bottom surface 924…Surface 24a, 224a, 324a, 424a, 524a, 624a, 724a, 824a, 924a... 1st position 24b, 224b, 324b, 424b, 524b, 624b, 724b, 824b, 924b…2nd position 324c, 424c, 524c, 624c, 724c… 3rd position 324d, 424d, 524d, 624d, 724d… 4th position 424e, 524e, 724e…5th position 424f, 524f, 724f…6th position 424g, 524g, 724g…7th position 424h, 524h, 724h…8th position 25...Stripes 30, 930...Base insulating film 40, 140, 240, 940...Conductive film pattern 41, 241, 361, 461, 561, 661, 761, 861, 941, 351, 451, 551, 651, 751, 851, 471, 571, 771, 871, 481, 581, 781, 881... Electrode membrane part 42, 242, 942, 352, 452, 552, 652, 752, 852, 362, 462, 562, 662, 762, 862, 472, 572, 772, 872, 482, 582, 782, 882...Resistive film part 43, 143, 243...Center line of conductive path 45...Etching remains 350, 450, 550, 650, 750, 850...First conductive film pattern 360, 460, 560, 660, 760, 860...Second conductive film pattern 470, 570, 770, 870...Third conductive film pattern 480, 580, 780, 880...4th conductive film pattern 90…Board section D1…first direction D2…Second direction 195...straight line

Claims

1. A substrate having a surface on which streaks are formed along a first direction in a plan view; a conductive film pattern formed on the surface, the conductive film pattern connecting different positions in an in-plane direction of the surface in a shape such that a length of a conductive path is longer than a length of a straight line connecting the different positions; The shape of the conductive film pattern is such that any straight line parallel to the first direction passes through the center line of the conductive path of the conductive film pattern 0 or 1 time, but does not pass through it more than twice.

2. The conductive film pattern includes a plurality of conductive film patterns, the plurality of conductive film patterns include a first conductive film pattern that connects a first position to a second position, which are mutually different positions in the in-plane direction, in a first shape in which the length of a conductive path is longer than the length of a straight line connecting the first position to the second position, and a second conductive film pattern that connects a third position to a fourth position, which are mutually different positions in the in-plane direction, in a second shape in which the length of a conductive path is longer than the length of a straight line connecting the third position to the fourth position, 2. The sensor of claim 1, wherein any straight line parallel to the first direction either passes through the first conductive film pattern but not through the second conductive film pattern, passes through the second conductive film pattern but not through the first conductive film pattern, or passes through neither the first conductive film pattern nor the second conductive film pattern, but does not pass through both the first conductive film pattern and the second conductive film pattern.

3. the plurality of conductive film patterns include a third conductive film pattern that connects a fifth position to a sixth position, which are mutually different positions in the in-plane direction, in a third shape in which a length of a conductive path is longer than a length of a straight line connecting the fifth position to the sixth position; 3. The sensor of claim 2, wherein a center-to-center distance along the first direction between the first conductive film pattern and the second conductive film pattern is shorter than a center-to-center distance along the first direction between the first conductive film pattern and the third conductive film pattern and a center-to-center distance along the first direction between the second conductive film pattern and the third conductive film pattern.

4. The conductive film pattern includes a plurality of conductive film patterns, 2. The sensor of claim 1, wherein any straight line parallel to the first direction either passes through any one of the plurality of conductive film patterns or passes through none of the plurality of conductive film patterns, but does not pass through more than two of the plurality of conductive film patterns.

5. 2. The sensor according to claim 1, wherein a surface roughness Ra of the surface in a second direction perpendicular to the first direction in the plane of the surface is not less than 0.05 μm and not more than 1 μm.

6. the substrate is a metal substrate; a base insulating film is formed between the surface and the conductive film pattern; 6. The sensor according to claim 5, wherein the thickness of the base insulating film is 1 to 10 times the surface roughness Ra.

Images