Container and packaging system

Abstract

To provide a container and a packaging system that are advantageous in performing bonding processing on the container in a different method from thermal compression bonding.SOLUTION: A container B comprises a second adhesion part b2 bonded to a first adhesion part b1, and the second adhesion part b2 is bonded to the first adhesion part b1 through a pressure-sensitive adhesion layer L1 exhibiting bonding performance when pressure operates.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to containers and packaging systems. [Background technology]

[0002] In a packaging system, the mouth of a bag may be thermally sealed by a heat sealing device (see Patent Documents 1 and 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-189255 A [Patent Document 2] JP 2023-34272 A Summary of the Invention [Problem to be solved by the invention]

[0004] 2. Description of the Related Art Heat sealing, which has excellent adhesive properties and airtightness, is widely used in sealing processes for containers such as bags.

[0005] In heat sealing using thermal fusion, a high-temperature sealing member (pressurizing and heating device) is pressed against the adhesive portion of the container, so it is necessary to properly manage the temperature of the sealing member. For example, it is necessary to heat the sealing member to the desired sealing temperature, and to sufficiently lower the temperature of the sealing member from the sealing temperature for maintenance, etc., but these steps take a considerable amount of time.

[0006] Furthermore, the adhesive portion of the container against which the high-temperature sealing member is pressed undergoes thermal shrinkage, and depending on the material of the adhesive portion, wrinkles caused by the thermal shrinkage may become noticeable.

[0007] In addition, in heat sealing, in order to improve the reliability and stability of the seal, a high-temperature sealing member is pressed against the bonding portion of the container multiple times, or a low-temperature sealing member is pressed against the bonding portion after the high-temperature sealing member is pressed against the bonding portion to cool it. Thus, the heat sealing process cannot always be completed appropriately in a single processing step (e.g., a single processing station), and there are many cases where multiple processing steps (e.g., multiple processing stations) are required.

[0008] The present disclosure provides an advantageous technique for performing a container bonding process using a method other than thermocompression bonding. [Means for solving the problem]

[0009] One aspect of the present disclosure relates to a container comprising a second adhesive portion adhered to a first adhesive portion, the second adhesive portion being adhered to the first adhesive portion via a pressure-sensitive adhesive layer that exhibits adhesive performance when pressure is applied.

[0010] The pressure-sensitive adhesive layer may have a changeable adhesive strength to the first adhesive portion and the second adhesive portion depending on the magnitude of pressure applied thereto.

[0011] The pressure-sensitive adhesive layer may include an encapsulant in which the adhesive is encapsulated, the encapsulant causing the adhesive to flow out when a pressure greater than the rupture pressure is applied.

[0012] Another aspect of the present disclosure relates to a packaging system for performing processing using the container described above, the packaging system including a crimping unit for crimping the first adhesive portion and the second adhesive portion via a pressure-sensitive adhesive layer.

[0013] The pressing unit may include a high pressure device that applies a first pressure to the pressure-sensitive adhesive layer, and a low pressure device that applies a second pressure that is smaller than the first pressure to the pressure-sensitive adhesive layer.

[0014] The low pressure device may be located downstream of the high pressure device, and the pressure-sensitive adhesive layer may be applied with a second pressure after the first pressure has been applied.

[0015] The pressing unit may have a variable pressure device capable of changing the pressure applied to the pressure-sensitive adhesive layer.

[0016] The pressure-bonding unit may include a movable pressure device that is provided to be movable while applying pressure to the first adhesive portion, the second adhesive portion, and the pressure-sensitive adhesive layer.

[0017] The moving pressure device may apply a first pressure to the pressure-sensitive adhesive layer and then a second pressure to the pressure-sensitive adhesive layer that is less than the first pressure. Effect of the Invention

[0018] According to the present disclosure, there is provided an advantageous technique for performing a bonding process for a container using a method other than thermocompression bonding. [Brief description of the drawings]

[0019] [Figure 1] FIG. 1 is a front view showing an example of a bag (container). [Diagram 2] FIG. 2 is a front view showing another example of the bag. [Diagram 3] FIG. 3 is a diagram showing an example of a cross section of a bonded portion of a bag. [Figure 4] FIG. 4 is a diagram showing another example of a cross section of the adhesive portion of the bag. [Diagram 5] FIG. 5 is a plan view showing an outline of an example of a packaging system, which presses the mouth (adhesive portion) of a bag without applying heat. [Figure 6] FIG. 6 is a plan view showing an outline of another example of a packaging system, which presses the mouth portion (adhering portion) of a bag while applying heat thereto. [Figure 7] FIG. 7 is a plan view showing an outline of another example of a packaging system. [Figure 8] FIG. 8 is a plan view showing an outline of another example of a packaging system. [Figure 9] FIG. 9 is a plan view showing an outline of another example of a packaging system. [Figure 10]FIG. 10 is a schematic diagram of another example of a packaging system. [Figure 11] FIG. 11 is a schematic diagram of another example of a packaging system. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Hereinafter, embodiments of the present disclosure will be described by way of example with reference to the drawings.

[0021] The following description will be given of a case where a bag is used as a container, but the technology described below can be applied to any container other than a bag (for example, a tray, a cup, a bottle, a tube, and a film package (for example, a deep-drawn flat film), etc.). In this way, the containers to which the technology disclosed herein can be applied are not limited, and the container (particularly the bonding portion) can be made of resin (plastic), paper, and any other material. Therefore, the technology described below can be applied to containers such as paper packs (for example, box-shaped containers for sealing contents such as liquids), and bottles and tubes in which a lid member (for example, a film-like inner seal material) is attached to the opening to seal the opening.

[0022] Fig. 1 is a front view showing an example of a bag (container) B. Fig. 2 is a front view showing another example of the bag B. The bag B shown in Figs. 1 and 2 has a first body wall (front wall) b1 and a second body wall (rear wall) that are bonded together at part of their periphery. Note that while the first body wall b1 is visible in Figs. 1 and 2, the second body wall is hidden by the first body wall b1 and cannot be seen.

[0023] For example, after the contents are introduced into bag B through the mouth of bag B in an open state, a sealing process (adhesive process) may be performed to seal (adhere) the closed mouth (see Figure 1). In this case, the mouth of bag B used as the inlet for the contents becomes the adhesive part s.

[0024] Also, a sealing process (adhesive process) may be performed to attach a spout or other attachment bp to the opening of the bag body b0 of bag B (see Figure 2). In this case, the part of the bag body b0 where the attachment bp is attached (and in some cases the periphery of the attachment part) becomes the adhesive part s.

[0025] When the adhesive portion s of bag B needs to be opened by hand (see Figure 1), it is required that the adhesive treatment be performed so that the adhesive strength of the adhesive portion s is such that it can be opened by hand. On the other hand, when it is problematic that the adhesive portion s of bag B cannot be opened by hand (see Figure 2), it is required that the adhesive treatment be performed so that the adhesive strength of the adhesive portion s is such that it is difficult or impossible to open by hand.

[0026] Fig. 3 is a diagram showing an example of a cross section of the adhesive portion s of the bag B. Fig. 4 is a diagram showing another example of a cross section of the adhesive portion s of the bag B.

[0027] Bag B in the example shown in Figure 3 and the example shown in Figure 4 has a first main body wall portion (front wall portion) b1 and a second main body wall portion (rear wall portion) b2, and the second main body wall portion (second adhesive portion) b2 is adhered (particularly crimped) to the first main body wall portion (first adhesive portion) b1.

[0028] The first body wall portion b1 and the second body wall portion b2 each include a pressure-sensitive adhesive layer L1, a barrier layer L2, and a print layer L3.

[0029] The pressure-sensitive adhesive layer L1 forms the inner wall surface of the adhesive portion s of the bag B, and the pressure-sensitive adhesive layer L1 of the first body wall portion b1 and the pressure-sensitive adhesive layer L1 of the second body wall portion b2 face each other. The pressure-sensitive adhesive layer L1 may be provided only on the adhesive portion s of the bag B, or may be provided not only on the adhesive portion s but also on other portions, or the entire inner wall surface of the bag B may be formed by the pressure-sensitive adhesive layer L1.

[0030] The printed layer L3 forms the outer wall surface of at least the adhesive portion s of the bag B, and provides visual information (e.g., letters, symbols, and / or designs) that is visible from the outside. The barrier layer L2 is located between the pressure-sensitive adhesive layer L1 and the printed layer L3, and suppresses the permeation of at least some gases and liquids, for example, by suppressing the intrusion of outside air into the space inside the bag B (i.e., the space partitioned by the inner wall surface of the first body wall portion b1 and the inner wall surface of the second body wall portion b2).

[0031] The pressure-sensitive adhesive layer L1 of this embodiment does not exhibit adhesive performance unless pressure is applied under standard atmospheric pressure at room temperature (5 to 35°C), but exhibits adhesive performance when pressure is applied. The first body wall portion b1 and the second body wall portion b2 are bonded to each other via the pressure-sensitive adhesive layer L1.

[0032] The pressure-sensitive adhesive layer L1 may have any configuration. As an example, the pressure-sensitive adhesive layer L1 may be made of a material having a composition whose properties change to become adhesive when a pressure greater than a certain reference pressure is applied (see FIG. 3). Such a pressure-sensitive adhesive layer L1 may be made of an adhesive component called a pressure-sensitive adhesive, and may contain a component called a pressure-responsive resin.

[0033] 3 and 4, a desired amount of pressure can be applied to the pressure-sensitive adhesive layer L1 by sandwiching the first body wall b1 and the second body wall b2 with a pair of sealing members of the pressure-bonding unit 15. This pressure-bonding process does not utilize thermal melting of the pressure-sensitive adhesive layer L1, the first body wall b1, and the second body wall b2, and therefore does not require heating the pair of sealing members, and can be performed by sandwiching the first body wall b1 and the second body wall b2 with a pair of sealing members having the same temperature as the surroundings (for example, room temperature).

[0034] The adhesive strength of the pressure-sensitive adhesive layer L1 to the first body wall b1 and the second body wall b2 may vary depending on the magnitude of the pressure applied. In this case, the adhesive strength can be adjusted by controlling the pressure applied to the pressure-sensitive adhesive layer L1 from the pressure-bonding unit 15 (sealing member) during the pressure-bonding process. The pressure-sensitive adhesive layer L1 may contain, for example, a component whose wettability increases as the applied pressure increases, or a component whose wettability is suppressed and solidification is promoted by suppressing the applied pressure.

[0035] The pressure-sensitive adhesive layer L1 may also include inclusion bodies c in which an adhesive is enclosed, as shown in Fig. 4, and the inclusion bodies c may cause the adhesive to flow out when a pressure greater than the rupture pressure is applied. The rupture pressure referred to here is a pressure that causes the inclusion bodies c to rupture, and the magnitude of the pressure varies depending on the strength of the inclusion bodies c. The pressure-sensitive adhesive layer L1 shown in Fig. 4 includes a large number of inclusion bodies c arranged randomly, but the number and arrangement of the inclusion bodies c included in the pressure-sensitive adhesive layer L1 are not limited.

[0036] 3 and 4, the pressure-sensitive adhesive layer L1 is provided on both the first body wall portion (first adhesive portion) b1 and the second body wall portion (second adhesive portion) b2, but the pressure-sensitive adhesive layer L1 may be provided on only one of the first body wall portion b1 and the second body wall portion b2. For example, when another element (for example, see the attachment bp shown in FIG. 2) is pressure-bonded to the bag body b0 of the bag B, the pressure-sensitive adhesive layer L1 may be provided only on the bag body b0 side and the pressure-sensitive adhesive layer L1 may not be provided on the other element side, or the pressure-sensitive adhesive layer L1 may be provided only on the other element side and the pressure-sensitive adhesive layer L1 may not be provided on the bag body b0 side.

[0037] Furthermore, the contents contained in bag B are not limited, and for example, food, daily necessities, and electronic components (such as batteries) may be contained in bag B as the contents.

[0038] Next, a packaging system that processes the above-mentioned bag B (see Figs. 1 to 4) will be described by way of example.

[0039] FIG. 5 is a plan view showing an outline of an example of the packaging system 10, and shows the packaging system 10 which crimps the mouth portion (adhesive portion) of the bag B without applying heat.

[0040] The packaging system 10 shown in FIG. 5 includes a container conveying device 20 that conveys bags B (not shown in FIG. 5), and processing devices 21 to 28 that are provided along a conveying track for the bags B.

[0041] The example container conveying device 20 shown in Figure 5 has a rotating table and eight holding devices (e.g., gripper pairs that grip both sides of a bag B) installed at equal intervals (equally angular intervals) on the outer periphery of the rotating table, and the bags B held by each holding device are intermittently stopped in sequence at the first to eighth processing stations S1 to S8 in accordance with the intermittent rotation of the rotating table.

[0042] The first to eighth processing apparatuses 21 to 28 provided in the first to eighth processing stations S1 to S8 respectively include one or more processing devices that perform various processes on the bags B located in the corresponding processing station.

[0043] As an example, the first processing device 21 supplies the bag B to the holding device that is intermittently stopped at the first processing station S1 (bag supply station). The second processing device 22 performs printing on the bag B located with the holding device at the second processing station S2 (printing station). The third processing device 23 performs inspection (e.g., print inspection) of the bag B located with the holding device at the third processing station S3 (inspection station). The fourth processing device 24 opens the mouth (glued portion) of the bag B located with the holding device at the fourth processing station S4 (opening station). The fifth processing device 25 introduces contents through the opened mouth into the inner space of the bag B located with the holding device at the fifth processing station S5 (first contents introduction station). Similarly, the sixth processing device 26 introduces contents through the opened mouth into the inner space of the bag B located with the holding device at the sixth processing station S6 (second contents introduction station). The seventh processing device 27 removes dirt from the mouth of the bag B (for example, the inner wall surface forming the adhesive surface) located together with the holding device in the seventh processing station S7 (cleaning station) by air blowing or the like.

[0044] The eighth processing device 28 seals (adheses) the mouth (adhesive portion) of the bag B located together with the holding device at the eighth processing station S8 (sealing station (adhesive station)). The eighth processing device 28 of this embodiment is configured as a crimping unit 15 (see FIGS. 3 and 4) that crimps the first body wall b1 and the second body wall b2 via the above-mentioned pressure-sensitive adhesive layer L1. The bag B whose mouth has been sealed by the eighth processing device 28 is released from the holding device at the eighth processing station S8 and is sent from the eighth processing station S8 to a subsequent stage (e.g., another processing device or a collection box).

[0045] According to the packaging system 10 shown in FIG. 5, which thus pressurizes the first body wall portion (first adhesive portion) b1 and the second body wall portion b2 (second adhesive portion) via the pressure-sensitive adhesive layer L1, the sealing process (adhesive process) of the bag B can be completed in a single processing station (eighth processing station S8).

[0046] FIG. 6 is a plan view showing an outline of another example of the packaging system 10, and shows the packaging system 10 which presses the mouth portion (adhered portion) of the bag B while applying heat.

[0047] In the example shown in FIG. 6, elements that are the same as or correspond to those in the example shown in FIG. 5 described above are given the same reference numerals, and detailed description thereof will be omitted.

[0048] In the packaging system 10 shown in FIG. 6, similarly to the packaging system 10 shown in FIG. 5, the processing is performed by the first processing device 21 to the seventh processing device 27 in the first processing station S1 to the seventh processing station S7.

[0049] However, in the packaging system 10 shown in Figure 6, the sealing process (gluing process) for sealing (gluing) the mouth of the bag B is performed by heat sealing, and multiple processing stations (8th processing station S8, 9th processing station S9 and 10th processing station S10) are assigned to the sealing process.

[0050] That is, each bag B, together with the holding device, is stopped intermittently in sequence at the eighth processing station S8, the ninth processing station S9, and the tenth processing station S10. The eighth processing device 28 clamps the mouth of the bag B, which is located together with the holding device, with a pair of heated high-temperature sealing members (pressing unit 15 (see Figs. 3 and 4)) at the eighth processing station S8 (first heat sealing station) to thermally press the mouth (first heat sealing process). The ninth processing device 29 clamps the mouth of the bag B, which is located together with the holding device, with a pair of heated high-temperature sealing members to thermally press the mouth (second heat sealing process). The tenth processing device 30 clamps the mouth (particularly the heat-pressed portion) of the bag B, which is located together with the holding device, with a pair of low-temperature sealing members to press the mouth (cooling sealing process) while cooling the mouth (particularly the heat-pressed portion) at the tenth processing station S10 (cooling sealing station) (cooling sealing process).

[0051] By performing the heat sealing process multiple times in this manner, the mouth of bag B can be reliably heat-pressurized, and by cooling the mouth of bag B, the heat-pressurized state of the mouth can be stabilized.

[0052] As is clear from the comparison of the packaging systems 10 in Figures 5 and 6 described above, when the pressure-sensitive adhesive layer L1 is used to seal (adhere) the bags B (see Figure 5), the number of processing steps (and therefore the number of processing stations) required for the sealing process can be reduced compared to when the bag B is sealed by heat sealing (see Figure 6), which is advantageous in simplifying the sealing (adhere) process of the bags B. As a result, when the pressure-sensitive adhesive layer L1 is used to seal (adhere) the bags B (see Figure 5), the configuration of the packaging system 10 (particularly the processing devices required for the sealing (adhere) process (see the eighth processing device 28 to the tenth processing device 30)) can be simplified, which is advantageous in terms of making the sealing unit (pressure-bonding unit 15) more compact and saving space for the packaging system 10.

[0053] In particular, since the crimping unit 15 is configured by a single processing device (the eighth processing device 28 in Figure 5), the sealing process can be completed without transferring the bag B between devices, which reliably prevents the bag B from bending or wrinkling, which may occur when the bag B is transferred, and is advantageous in maintaining the appearance quality of the bag B.

[0054] Next, another example of the packaging system 10 that performs a sealing process (adhesive process) on the bag B using the pressure-sensitive adhesive layer L1 and crimps the mouth portion (adhesive portion) of the bag B without heating will be described.

[0055] Fig. 7 is a plan view showing an outline of another example of the packaging system 10. Fig. 8 is a plan view showing an outline of another example of the packaging system 10. In the packaging system 10 shown in Fig. 7 and Fig. 8, elements that are the same as or correspond to those in the packaging system 10 shown in Fig. 5 described above are given the same reference numerals, and detailed description thereof will be omitted.

[0056] In the packaging system 10 shown in Figures 7 and 8, multiple pressure devices 28a, 28b are provided as a crimping unit 15 that crimps the first body wall portion b1 and the second body wall portion b2 via a pressure-sensitive adhesive layer L1, and the sealing process (bonding process) is performed across multiple processing stations (8th to 10th processing stations S8 to S10).

[0057] Specifically, the pressure bonding unit 15 has a high pressure device 28a that applies a first pressure to the pressure-sensitive adhesive layer L1, and a low pressure device 28b that applies a second pressure smaller than the first pressure to the pressure-sensitive adhesive layer L1. In the example shown in Fig. 7, the high pressure device 28a is provided in the eighth processing station S8, and the low pressure device 28b is provided in each of the ninth processing station S9 and the tenth processing station S10. On the other hand, in the example shown in Fig. 8, the high pressure device 28a is provided in each of the eighth processing station S8 and the ninth processing station S9, and the low pressure device 28b is provided in the tenth processing station S10.

[0058] Thus, in the packaging system 10 shown in Figures 7 and 8, the low pressure device 28b is provided downstream of the high pressure device 28a, and a first pressure (high pressure) is applied to the pressure-sensitive adhesive layer L1 of the bag B, and then a second pressure (low pressure) is applied to the pressure-sensitive adhesive layer L1 of the bag B.

[0059] In this manner, by performing the process of bonding the first body wall portion b1 and the second body wall portion b2 via the pressure-sensitive adhesive layer L1 across multiple processing stations, the bonding process of the first body wall portion b1 and the second body wall portion b2 can be performed more reliably and more stably.

[0060] In particular, by applying a high pressure to the pressure-sensitive adhesive layer L1 and then applying a low pressure, the adhesive performance of the pressure-sensitive adhesive layer L1 is quickly and reliably exhibited by applying the high pressure, and then the adhesive state of the first body wall b1 and the second body wall b2 via the pressure-sensitive adhesive layer L1 can be stabilized by applying the low pressure. Therefore, the packaging system 10 as shown in Figures 7 and 8 is advantageous for realizing an adhesive process for bags B that is excellent in reliability, efficiency, and stability, and is also advantageous for processing bags B at high speed as a whole.

[0061] FIG. 9 is a plan view showing an outline of another example of the packaging system 10. As shown in FIG.

[0062] The packaging system 10 shown in Fig. 9 includes an equipment transfer unit 40 that movably supports a plurality of movable pressure devices 31. The equipment transfer unit 40 in the example of Fig. 9 includes a rotatable rotating table, and a plurality of movable pressure devices 31 arranged at equal intervals (equal angular intervals) are attached to the outer periphery of the rotating table.

[0063] The multiple mobile pressure devices 31 are provided as a bonding unit 15 that bonds the first body wall portion (first adhesive portion) b1 and the second body wall portion b2 (second adhesive portion) via the pressure-sensitive adhesive layer L1. Each mobile pressure device 31 moves along a circular orbit in response to the rotation (e.g., continuous (non-intermittent) rotation) of the rotary table of the device transport unit 40, and can also move while applying pressure to the first body wall portion b1, the second body wall portion b2, and the pressure-sensitive adhesive layer L1.

[0064] As an example, each moving pressurizing device 31 has a pair of sealing members (see reference numeral "15" in Figs. 3 and 4), and the pair of sealing members and the bag B move together with the bag B while the adhesive portion (e.g., the mouth portion) of the bag B being transported by the container conveying device 20 is sandwiched between the pair of sealing members. Although the container conveying device 20 is not shown in Fig. 9, the container conveying device 20 transports the bag B together with the holding device so that the bag B moves synchronously along the same track at the same timing and speed as the corresponding moving pressurizing device 31 (pair of sealing members) in part of the movement track of each moving pressurizing device 31. Each moving pressurizing device 31 (pair of sealing members) completes the adhesive process (from the start of the crimping process to the end of the crimping process) of the adhesive portion of the bag B while moving synchronously with the corresponding bag B.

[0065] In addition, each of the moving pressurizing devices 31 may maintain the pressure applied to the pressure-sensitive adhesive layer L1 of the bag B constant without changing it over time during the pressure-bonding process of the bonded portion of the bag B (for example, during the time interval from immediately after the start of the pressure-bonding process to immediately before the end of the pressure-bonding process), or may change it over time (for example, change it stepwise). For example, each of the moving pressurizing devices 31 may apply a first pressure (high pressure) to the pressure-sensitive adhesive layer L1 of the corresponding bag B, and then apply a second pressure (low pressure) smaller than the first pressure to the pressure-sensitive adhesive layer L1. In this case, as in the packaging system 10 shown in the above-mentioned Figures 7 and 8, the adhesive performance of the pressure-sensitive adhesive layer L1 can be quickly and reliably exhibited by applying a high pressure, and then the adhesive state of the first main body wall portion b1 and the second main body wall portion b2 can be stabilized by applying a low pressure.

[0066] The packaging system 10 shown in Fig. 9 described above is suitable not only for intermittent conveyance of the bags B to be processed, but also for continuous (non-intermittent) conveyance. In particular, when sealing (adhesive) the bags B by heat sealing, there is a concern that the movement drive of the movable pressure device 31 may be hindered by a heater wire or the like, and the mechanism for moving the movable pressure device 31 tends to become complicated. On the other hand, according to the present embodiment in which adhesive treatment of the bags B is performed using the pressure-sensitive adhesive layer L1, devices such as a heater wire required for heat sealing are not installed, and the movement (e.g. continuous rotational movement) of the movable pressure device 31 can be realized by a simple mechanism.

[0067] In the example shown in FIG. 9, each of the mobile pressure devices 31 cyclically moves in a single direction along a circular orbit, but the moving orbit and moving direction of the mobile pressure devices 31 are not limited.

[0068] Figures 10 and 11 are schematic diagrams showing another example of the packaging system 10. For ease of understanding, in Figures 10 and 11, the eighth processing station S8 to the tenth processing station S10 are shown arranged in a straight line, but the following description can also be applied to the case where the eighth processing station S8 to the tenth processing station S10 are arranged along a curve (see Figures 5 to 8).

[0069] In the example shown in Figs. 10 and 11, a plurality of moving pressurizing devices (ie, a first moving pressurizing device 31a and a second moving pressurizing device 31b) that move synchronously with each other are provided.

[0070] The first mobile pressurizing device 31a cyclically moves along a first moving track T1 between the ninth processing station S9 and the tenth processing station S10. The second mobile pressurizing device 31b cyclically moves along a second moving track T2 between the eighth processing station S8 and the ninth processing station S9.

[0071] 10, in a state in which two bags B1, B2 that have not yet been subjected to a sealing process (adhesive process) are placed in an eighth processing station S8 and a ninth processing station S9, respectively, the sealing process is started for the two bags B1, B2. That is, the mouth portion (adhesive portion) of bag B1 located in the ninth processing station S9 is sandwiched and pressurized by a first movable pressurizing device 31a (a pair of sealing members), and the mouth portion of bag B2 located in the eighth processing station S8 is sandwiched and pressurized by a second movable pressurizing device 31b (a pair of sealing members).

[0072] Then, simultaneously, the first mobile pressure device 31a moves together with the corresponding bag B1 from the 9th processing station S9 to the 10th processing station S10 while applying pressure to the mouth of the corresponding bag B1, and the second mobile pressure device 31b moves together with the corresponding bag B2 from the 8th processing station S8 to the 9th processing station S9 while applying pressure to the mouth of the corresponding bag B2 (see Figure 11).

[0073] Then, simultaneously, the first movable pressure device 31a moves away from the mouth of the corresponding bag B1 at the tenth processing station S10, and the second movable pressure device 31b moves away from the mouth of the corresponding bag B2 at the ninth processing station S9, completing the sealing process of bags B1 and B2.

[0074] In this manner, the bag B1 is sealed by the first mobile pressure device 31a following the bag B1 while it moves from the ninth processing station S9 to the packaging system 10. Meanwhile, the bag B2 is sealed by the second mobile pressure device 31b following the bag B2 while it moves from the eighth processing station S8 to the ninth processing station S9.

[0075] Thereafter, bags B1 and B2 that have been sealed are released from the holding device (not shown) at the tenth processing station S10 and released. That is, bag B1 that has been sealed by the first movable pressure device 31a is released from the holding device immediately after the sealing process is completed. Meanwhile, bag B2 that has been sealed by the second movable pressure device 31b is released from the holding device after being transported from the ninth processing station S9 to the tenth processing station S10. Therefore, when bag B0 is placed at the tenth processing station S10 in the state shown in FIG. 10, bag B0 is a bag that has been transported to the tenth processing station S10 after being sealed by the second movable pressure device 31b, and will then be released at the tenth processing station S10.

[0076] It should be noted that the bags that have been subjected to the sealing process by the second movable pressurizing device 31b may be promptly released from the holding device in the ninth processing station S9 after the sealing process is completed, and sent to the subsequent stage.

[0077] The first mobile pressurizing device 31a and the second mobile pressurizing device 31b move away from the bags B1, B2 at the ninth processing station S9 and the tenth processing station S10, respectively, and then move (return) to the eighth processing station S8 and the ninth processing station S9. At this time, the first mobile pressurizing device 31a and the second mobile pressurizing device 31b pass through a trajectory deviated from the movement trajectory of the new bag B (a trajectory positioned above the movement trajectory of bag B in the example shown in FIGS. 10 and 11) so as not to impede the movement of a new bag (see bag B3 in FIG. 11) that is transported to and placed at the eighth processing station S8 and the ninth processing station S9.

[0078] Therefore, bag B3 positioned at the eighth processing station S8 in the state shown in Figure 11 is transported to the ninth processing station S9 without undergoing a sealing process at the eighth processing station S8, and is sealed by the first movable pressure device 31a while being transported from the ninth processing station S9 to the tenth processing station S10.

[0079] 10 and 11, each of the movable pressure devices 31a, 31b may maintain the pressure applied to the pressure-sensitive adhesive layer L1 of the bag B constant without changing it over time during the pressure bonding process of the mouth portion (adhesive portion) of the bag B (for example, during the time interval from immediately after the start of the pressure bonding process to immediately before the end of the pressure bonding process), or may change it over time. For example, each of the movable pressure devices 31a, 31b may apply a first pressure (high pressure) to the pressure-sensitive adhesive layer L1 of the corresponding bag B, and then apply a second pressure (low pressure) smaller than the first pressure to the pressure-sensitive adhesive layer L1.

[0080] As described above, by using the pressure-sensitive adhesive layer L1, the bag B can be properly sealed (adhesive) by simply applying pressure to the bag B without heating the bag B, and there is no need to heat the sealing member (pressure bonding unit 15), which is required in the heat sealing process. Therefore, the bag B can be properly sealed without thermal shrinkage.

[0081] Furthermore, in each of the above-described embodiments, it is not necessary to "set the temperature of the sealing member (heater hot plate) to a high temperature at which bag B can be welded, and manage and control the temperature of the sealing member to maintain that set temperature," as was done in the heat sealing process. In particular, the temperature state of the sealing member in the heat sealing process has a significant effect on the sealed state of bag B, but can also change due to disturbances such as the environmental temperature, so strict temperature management and control of the sealing member is necessary to accurately seal bag B. On the other hand, in each of the above-described embodiments, such strict temperature management and control of the sealing member is not necessary.

[0082] In addition, in the heat sealing process, thermal energy loss is unavoidable in the high-temperature sealing member, and the thermal energy loss increases especially when the sealing member is kept at a high temperature even during the waiting period when the sealing process is not performed. On the other hand, by performing the adhesive process of the bag B using the pressure-sensitive adhesive layer L1 as described above, the sealing member is not actively heated or cooled, so that thermal energy loss does not occur.

[0083] Furthermore, using a heater to heat the sealing member in the heat sealing process can unnecessarily raise the temperature of the entire area (e.g., inside a factory) in which the packaging system 10 is installed. On the other hand, when the pressure-sensitive adhesive layer L1 is used, such a heater is not used, so it is possible to suppress the temperature rise in the entire area and lower the set temperature of the air conditioning equipment that regulates the temperature in the area, which is also advantageous in terms of the SDGs (Sustainable Development Goals).

[0084] In addition, when the sealing member is maintained at an electrically high temperature in the heat sealing process, there is a concern that contact with the sealing member may result in burns or electric shock, so in order to ensure safety, it is necessary to cover the sealing member with a cover or restrict people such as operators from entering the area where the sealing member is installed. In addition, in order to perform maintenance of the sealing member (for example, replacing the protective sheet on the sealer surface or cleaning the sealer surface), it is necessary to sufficiently lower the temperature of the sealing member. On the other hand, when the pressure-sensitive adhesive layer L1 is used, there is no need to raise the temperature of the sealing member to a high temperature, so safety is excellent, and restrictions on people entering the area where the packaging system 10 is installed can be relaxed, and maintenance of the sealing member can be performed at any time.

[0085] In addition, by using the pressure-sensitive adhesive layer L1, there is no need to heat the sealing member to the desired sealing temperature or to sufficiently lower the temperature of the sealing member from the sealing temperature for maintenance, etc., which is advantageous in terms of shortening the overall processing time.

[0086] In addition, the heater for heating the sealing member in the heat sealing process is a consumable item and therefore needs to be replaced periodically. Therefore, the above-mentioned embodiments, which do not require such a heater, are advantageous in terms of the maintenance cost and management effort of the device.

[0087] [Variations] The crimping unit 15 may have a single variable pressure device capable of changing the pressure applied to the pressure-sensitive adhesive layer L1 of the bag B. For example, the process in which the crimping unit 15 (eighth processing device 28) of the packaging system 10 shown in Fig. 5 crimps the mouth portion (adhesive portion) of the bag B may include a high-pressure step in which a first pressure is applied to the pressure-sensitive adhesive layer L1, and a low-pressure step in which a second pressure smaller than the first pressure is applied to the pressure-sensitive adhesive layer L1.

[0088] Furthermore, when performing the bonding process of the bag B using the pressure-sensitive adhesive layer L1 as described above, a liquid may be applied in advance to the bonding surface of the bag B to promote the bonding (adhesion) of the second adhesive portion to the first adhesive portion of the bag B. For example, steam may be blown onto the bonding surface of the bag B to also impart a thermal effect to the bonding surface.

[0089] Although the above describes an example in which the pressure applied to the pressure-sensitive adhesive layer L1 by the pressure-bonding unit 15 (a pair of sealing members) is variably changed under the control of a control unit (not shown), the control unit may change the pressure applied to the pressure-sensitive adhesive layer L1 in a manner different from the above example. For example, the control unit may perform control such that the magnitude of the pressure applied to the pressure-sensitive adhesive layer L1 by the pressure-bonding unit 15 (specifically, the pressure for sandwiching the bag B) is switched between three or more stages, or the time for which the pressure is applied to the pressure-sensitive adhesive layer L1 by the pressure-bonding unit 15 is changed.

[0090] The packaging system 10 may also include an inspection device (not shown) for inspecting the sealed state (adhesive state) of bag B and for checking the accuracy of the sealing process for bag B. Any inspection method can be adopted for such an inspection device, and for example, the device may measure the impact force (impact pressure) applied by a pair of sealing members to the sealed portion (adhesive portion) of bag B during the sealing process, and inspect the sealed state of bag B and the accuracy (precision) of the sealing process based on the measurement results (see, for example, JP 2023-34272 A).

[0091] In the examples shown in Figures 7 and 8 above, the pressures applied to the pressure-sensitive adhesive layer L1 are different between the multiple processing devices 28a, 28b provided in each of the multiple processing stations S8 to S9, but the same pressure may be applied to the pressure-sensitive adhesive layer L1 by the multiple processing devices provided in each of the multiple processing stations.

[0092] In addition, in order to prevent excessive pressure from acting locally on the bag B from the edge portions of the sealing members when the bag B is sandwiched between the pair of sealing members, the surface shape of the edge portions of the sealing members may be curved. This makes it possible to prevent damage (cuts, etc.) to the bag B from the edge portions of the sealing members.

[0093] It should be noted that the embodiments and modifications disclosed in this specification are merely illustrative and should not be construed as limiting in all respects. The above-mentioned embodiments and modifications can be omitted, substituted, and modified in various forms without departing from the scope and spirit of the appended claims. For example, the above-mentioned embodiments and modifications may be combined in whole or in part, and embodiments other than those described above may be combined with the above-mentioned embodiments or modifications. In addition, the effects of the present disclosure described in this specification are merely illustrative, and other effects may be obtained.

[0094] The technical category embodying the above technical idea is not limited. For example, the above technical idea may be embodied by a computer program for causing a computer to execute one or more procedures (steps) included in a method for manufacturing or using the above device. The above technical idea may also be embodied by a non-transitory recording medium readable by a computer on which such a computer program is recorded.

[0095] [Note] The disclosed technology can be embodied as follows.

[0096] [Item 1] A second adhesive portion is provided which is adhered to the first adhesive portion, The second adhesive portion is adhered to the first adhesive portion via a pressure-sensitive adhesive layer that exhibits adhesive properties when pressure is applied to the container.

[0097] [Item 2] 2. The container according to item 1, wherein the pressure-sensitive adhesive layer changes adhesive strength to the first adhesive portion and the second adhesive portion depending on the magnitude of pressure applied thereto.

[0098] [Item 3] 3. The container according to item 1 or 2, wherein the pressure-sensitive adhesive layer is an enclosure in which an adhesive is enclosed, and the enclosure causes the adhesive to flow out when a pressure greater than a rupture pressure is applied thereto.

[0099] [Item 4] A packaging system for performing processing using the container according to any one of items 1 to 3, A packaging system comprising a crimping unit that crimps the first adhesive portion and the second adhesive portion via the pressure-sensitive adhesive layer.

[0100] [Item 5] The packaging system according to item 4, wherein the crimping unit includes a high pressure device that applies a first pressure to the pressure-sensitive adhesive layer, and a low pressure device that applies a second pressure to the pressure-sensitive adhesive layer that is smaller than the first pressure.

[0101] [Item 6] 6. The packaging system according to item 5, wherein the low pressure device is provided downstream of the high pressure device, and the pressure-sensitive adhesive layer is applied with the second pressure after the first pressure is applied.

[0102] [Item 7] 7. The packaging system according to any one of items 4 to 6, wherein the pressure bonding unit has a variable pressure device capable of changing the pressure applied to the pressure-sensitive adhesive layer.

[0103] [Item 8] The packaging system according to any one of items 4 to 7, wherein the pressure-bonding unit has a movable pressure device that is provided so as to be movable while applying pressure to the first adhesive portion, the second adhesive portion, and the pressure-sensitive adhesive layer.

[0104] [Item 9] 9. The packaging system according to item 8, wherein the moving pressure device applies a first pressure to the pressure-sensitive adhesive layer and then applies a second pressure to the pressure-sensitive adhesive layer that is smaller than the first pressure. [Explanation of symbols]

[0105] 10 Packaging system, 15 Pressing unit, 20 Container conveying device, 21 First processing device, 22 Second processing device, 23 Third processing device, 24 Fourth processing device, 25 Fifth processing device, 26 Sixth processing device, 27 Seventh processing device, 28 Eighth processing device, 28a High pressure device, 28b Low pressure device, 29 Ninth processing device, 30 Tenth processing device, 31 Moving pressure device, 31a First moving pressure device, 31b Second moving pressure device, 40 Device transfer unit, B Bag, B0 Bag, B1 Bag, B2 Bag, B3 Bag, b0 Bag body, b1 First body wall, b2 Second body wall, bp Mounting device, c Enclosure, L1 Pressure sensitive adhesive layer, L2 Barrier layer, L3 Printing layer, s Adhesive portion, S1 First processing station, S2 Second processing station, S3 Third processing station, S4 Fourth processing station, S5 5th processing station, S6 6th processing station, S7 7th processing station, S8 8th processing station, S9 9th processing station, S10 10th processing station, T1 1st moving track, T2 2nd moving track

Claims

1. A second adhesive portion is provided which is adhered to the first adhesive portion, The second adhesive portion is adhered to the first adhesive portion via a pressure-sensitive adhesive layer that exhibits adhesive properties when pressure is applied to the container.

2. The container according to claim 1 , wherein the pressure-sensitive adhesive layer changes its adhesive strength to the first adhesive portion and the second adhesive portion depending on the magnitude of pressure applied thereto.

3. 2. The container according to claim 1, wherein the pressure-sensitive adhesive layer includes an enclosure in which an adhesive is enclosed, the enclosure causing the adhesive to flow out when a pressure greater than a rupture pressure is applied thereto.

4. A packaging system for carrying out a process using a container according to any one of claims 1 to 3, comprising: A packaging system comprising a crimping unit that crimps the first adhesive portion and the second adhesive portion via the pressure-sensitive adhesive layer.

5. The packaging system according to claim 4 , wherein the pressing unit includes a high pressure device that applies a first pressure to the pressure-sensitive adhesive layer, and a low pressure device that applies a second pressure less than the first pressure to the pressure-sensitive adhesive layer.

6. 6. The packaging system of claim 5, wherein the low pressure device is disposed downstream of the high pressure device, and the pressure-sensitive adhesive layer is applied with the second pressure after the first pressure is applied.

7. The packaging system according to claim 4 , wherein the pressing unit has a variable pressure device capable of changing the pressure applied to the pressure-sensitive adhesive layer.

8. The packaging system according to claim 4 , wherein the pressure bonding unit includes a movable pressure device that is movable while applying pressure to the first adhesive portion, the second adhesive portion, and the pressure-sensitive adhesive layer.

9. The packaging system of claim 8 , wherein the moving pressure device applies a first pressure to the pressure-sensitive adhesive layer and then applies a second pressure to the pressure-sensitive adhesive layer that is less than the first pressure.

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