Wafer housing container processing device

Abstract

To effectively perform replacement of a gas in a housing space.SOLUTION: A wafer housing container processing device according to an embodiment processes a wafer housing container including a main body that houses a semiconductor wafer, and has a housing space that communicates with an open part; and a door that is attached to / detached from the open part, and includes: a mounting stage having a mounting surface mounting the wafer housing container; and a gas supply part that supplies an inactive gas to the wafer housing container mounted onto the mounting stage. The mounting stage mounts the door to the mounting surface in a state where the door and the main body are mounted. The gas supply part performs a processing for supplying the inactive gas via a gas supply port provided to a cross sectional surface crossing a surface having the open part of the main body.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] SUMMARY OF THE DISCLOSURE Embodiments of the present invention relate to a wafer container processing apparatus. [Background technology]

[0002] 2. Description of the Related Art Conventionally, there are wafer container processing apparatuses that perform various processes such as cleaning and drying on wafer containers such as front opening unified pods (FOUPs) that accommodate semiconductor wafers.

[0003] There is a technique for replacing the gas in the storage space by supplying an inert gas such as N2 to the storage space that stores wafers in the FOUP with the door attached to the main body of the FOUP (FOUP main body). For example, an input port for inputting the inert gas and an output port for outputting the gas in the storage space are provided on the bottom 20i of the FOUP main body 20a shown in FIG.

[0004] Here, the accuracy of the FOUP varies depending on the manufacturer. Therefore, in some of the multiple FOUPs, as shown in FIG. 8, a small gap 20j may occur between the FOUP body 20a and the door 20b. In addition, in some of the multiple FOUPs, a small gap 20j may occur between the FOUP body 20a and the door 20b due to aging or the like. Therefore, when replacing the gas in the storage space, the inert gas input from the input port may leak from the gap 20j. In this case, the gas in the storage space may not be replaced efficiently. Such a problem is not limited to FOUPs, but also exists in other wafer storage containers such as FOSBs (Front Opening Shipping Boxes). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2005-109523 A Summary of the Invention [Problem to be solved by the invention]

[0006] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a wafer storage container processing apparatus that can efficiently replace gas inside a wafer storage container. [Means for solving the problem]

[0007] In order to solve the above-mentioned problems and achieve the object, one embodiment of the present invention provides a wafer storage container processing apparatus for processing a wafer storage container having a main body for storing semiconductor wafers and having a storage space connected to an opening, and a door that is detachable from the opening, the apparatus comprising: a loading stage having a loading surface for loading the wafer storage container; and a gas supply unit that supplies an inert gas to the wafer storage container loaded on the loading stage, the loading stage being loaded such that the door is loaded on the loading surface with the door and the main body attached, and the gas supply unit performs processing to supply the inert gas through a gas supply port provided on an intersecting surface that intersects with the surface of the main body having the opening. Effect of the Invention

[0008] According to one aspect of the present invention, it is possible to provide a wafer storage container processing apparatus capable of efficiently replacing gas within a storage space. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view showing an example of a schematic configuration of a wafer container processing apparatus according to an embodiment. [Diagram 2] FIG. 2 is a perspective view of the buffer according to the embodiment. [Diagram 3] FIG. 3 is a perspective view of the buffer according to the embodiment. [Figure 4] FIG. 4 is a side view of the buffer according to the embodiment. [Diagram 5] FIG. 5 is a diagram for explaining an example of an arrangement of slots according to the embodiment. [Figure 6] FIG. 6 is a flowchart showing a flow of an example of a purging process executed by the wafer container processing apparatus according to the embodiment. [Figure 7] FIG. 7 is a side view of a buffer according to a modified example of the embodiment. [Figure 8] FIG. 8 is a diagram showing an example of the configuration of a wafer container. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of a wafer storage container processing apparatus disclosed in the present application will be described in detail with reference to the accompanying drawings. Note that the wafer storage container processing apparatus disclosed in the present application is not limited to the following embodiment. In the following embodiment, a wafer storage container that is the target of various processes such as cleaning and drying is described as a FOUP, but the wafer storage container that is the target of various processes is not limited to this. For example, the wafer storage container that is the target of various processes may be a FOSB. Note that the FOUP is provided with a flange 20c (see FIG. 8), and the FOUP is transported by being gripped by a robot or the like by this flange 20c.

[0011] (Embodiment) 1 is a plan view showing an example of a schematic configuration of a wafer container processing apparatus 1 according to an embodiment. The wafer container processing apparatus 1 is installed in, for example, a factory that manufactures semiconductor wafers, and cleans and dries wafer containers.

[0012] As shown in FIG. 1, the wafer container processing apparatus 1 includes a load port 2, a robot 3, a buffer (disassembly / connection stage) 4, a cleaning tank 5, a drying tank 6, an unload port 7, and a control unit 8.

[0013] The robot 3, buffer 4, cleaning tank 5, drying tank 6 and control unit 8 are provided inside the casing 1a of the wafer storage container processing apparatus 1. On the other hand, the load port 2 and unload port 7 are provided across the inside and outside of the casing 1a of the wafer storage container processing apparatus 1.

[0014] The load port 2 carries the FOUP 20 to be cleaned and dried, which is placed on the outside of the casing 1a of the load port 2, into the inside of the casing 1a. The FOUP 20 includes a FOUP body (shell) 20a and a door (lid) 20b. The FOUP body 20a has an opening (FOUP body opening) and a storage space for storing semiconductor wafers. The storage space is located inside the FOUP body opening and communicates with the FOUP body opening. The door 20b can be disassembled / connected to the FOUP body 20a, and when connected to the FOUP body 20a, the door 20b is attached to the FOUP body opening in a state in which it can be opened and closed. That is, the door 20b is detachable from the FOUP body opening. The FOUP body 20a is an example of a body. The FOUP body 20a is provided with a flange 20c. The flange 20c is a portion that is gripped (held) when the FOUP 20 is transported by an OHT (Overhead Hoist Transport) or a robot 3, and is provided on a surface of the FOUP body 20a that intersects with a surface having the FOUP body opening.

[0015] For example, the FOUP 20 transported by the OHT is placed on the load port 2 at a portion outside the casing 1a. For example, as shown in FIG. 1, the FOUP 20 is placed so that the door 20b of the FOUP 20 faces the shutter 2a provided at the opening 1b of the casing 1a. When the FOUP 20 is placed on the load port 2 in this manner, the shutter 2a rises. This allows the FOUP 20 to be carried into the casing 1a from the opening 1b. That is, the FOUP 20 is allowed to be carried into the wafer container processing apparatus 1. The FOUP 20 is then slid in the direction of the arrow 2b by the slide device of the load port 2. This allows the FOUP 20 to be carried into the casing 1a.

[0016] Sliding by the sliding device will be described. For example, a pin provided on the sliding device is inserted into a hole provided on the bottom surface 20g (see FIG. 3) of the FOUP 20, and the bottom surface 20g of the FOUP 20 is fixed to the sliding device. In this state, the sliding device is slid in the direction of the arrow 2b, and the FOUP 20 is also slid along with the movement of the sliding device. As a result, the FOUP 20 is placed on a predetermined portion inside the casing 1a of the load port 2. When the FOUP 20 is thus carried into the inside of the casing 1a, the shutter 2a descends and the opening 1b of the casing 1a is closed. The sliding device descends together with the pin to a position lower than the lower end of the shutter 2a (the bottom surface 20g of the FOUP 20) and returns to the original position outside the casing 1a.

[0017] The robot 3 transports the FOUP 20 to each section while gripping the flange 20c of the FOUP 20. The robot 3 is equipped with a robot arm 3a and a robot hand 3b (the gripping section of the robot 3). The robot 3 transports the FOUP 20 to each section by extending and retracting the robot arm 3a and rotating it while the robot hand 3b grips the flange 20c. When the robot 3 transports the door 20b alone that has been separated (disassembled) from the FOUP body 20a, it transports it by gripping both sides of the door 20b.

[0018] The buffer 4 is a placement table on which the FOUP 20 is placed, and disassembles (separates) the FOUP 20 into a FOUP body 20a and a door 20b, and connects the FOUP body 20a and the door 20b. For example, the FOUP 20 that has been brought into the casing 1a is transported to the buffer 4 by the robot 3. In this case, the buffer 4 disassembles the FOUP 20 into the FOUP body 20a and the door 20b. Note that disassembly can be rephrased as unlocking, and connection can be rephrased as locking.

[0019] The cleaning tank 5 is a tank for cleaning the FOUP 20. For example, the FOUP body 20a and the door 20b are separately transported to the cleaning tank 5 by the robot 3. The cleaning tank 5 performs a cleaning process on the FOUP 20 while holding the FOUP body 20a and the door 20b separately. That is, the cleaning tank 5 cleans the storage space while the FOUP body 20a and the door 20b are separated. For example, the cleaning tank 5 holds the door 20b in the cover part of the cleaning tank 5 and the FOUP body 20a in the tank part of the cleaning tank 5 (the cleaning tank main body of the cleaning tank 5), and while rotating them by a rotation mechanism (not shown), discharges a cleaning liquid (e.g., pure water) from a cleaning liquid nozzle onto each of the FOUP body 20a and the door 20b, thereby cleaning the FOUP 20. It is preferable that the cleaning tank 5 is arranged so that the FOUP opening of the FOUP body 20a faces downward, taking into consideration the dischargeability of the cleaning liquid. The cleaning tank 5 is, for example, an example of a cleaning unit.

[0020] Once cleaning of the FOUP 20 is complete in the cleaning tank 5, the FOUP body 20a and door 20b are then rotated in the cleaning tank 5 and dried by blowing dry air onto them. The drying in the cleaning tank 5 here is a process (temporary drying) for removing the cleaning liquid adhering to the FOUP 20. Once the temporary drying of the FOUP 20 in the cleaning tank 5 is complete, the robot 3 transports the FOUP body 20a and door 20b in the cleaning tank 5 separately to the drying tank 6.

[0021] The drying tank 6 is a device for vacuum drying (main drying) the FOUP 20. When the vacuum drying of the FOUP 20 is completed in the drying tank 6, the robot 3 transports the FOUP body 20a and the door 20b in the drying tank 6 separately onto the buffer 4. Then, the buffer 4 connects the FOUP body 20a and the door 20b. In this embodiment, after the main drying in the drying tank 6, an inert gas such as N2 is supplied to the storage space of the FOUP 20 in which the FOUP body 20a and the door 20b are connected on the buffer 4, thereby replacing the gas in the storage space. Such a gas replacement process is also called a purging process. The configuration of the buffer 4 and a specific example of the purging process performed by the buffer 4 will be described later.

[0022] The unload port 7 carries out the FOUP 20 that has been cleaned, vacuum dried, and purged and that has been placed by the robot 3 in the portion of the unload port 7 inside the casing 1a to the outside of the casing 1a.

[0023] For example, after the purging process, the FOUP 20 is transported by the robot 3 and placed in the inside of the casing 1a at the unload port 7. When the FOUP 20 is placed in the unload port 7 in this manner, the shutter 7a provided at the opening 1c of the casing 1a rises. This allows the FOUP 20 to be transported from the opening 1c to the outside of the casing 1a. That is, the FOUP 20 is allowed to be transported to the outside of the wafer container processing device 1. Then, the FOUP 20 is slid in the direction of the arrow 7b by the slide device of the unload port 7 (having a mechanism similar to that of the slide device of the load port 2), and the FOUP 20 is transported to the outside of the casing 1a. When the FOUP 20 is transported to the outside of the casing 1a in this manner, the shutter 7a descends to close the opening 1c of the casing 1a.

[0024] The control unit 8 controls the overall operation of the wafer container processing apparatus 1. For example, the control unit 8 controls the load port 2, the robot 3, the buffer 4, the cleaning tank 5, the drying tank 6, and the unload port 7 to operate the load port 2, the robot 3, the buffer 4, the cleaning tank 5, the drying tank 6, and the unload port 7 as described above. The control unit 8 also controls the gas supply nozzle 4c, the valves 4e1, 4f1, 4j1, the measurement unit 4h, etc., which will be described later.

[0025] For example, the control unit 8 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), a HDD (Hard Disk Drive), and a communication interface, all of which are connected via an internal bus.

[0026] The CPU executes various processes while using the memory area of ​​the RAM as a temporary storage area for data used in the various processes. The ROM and HDD store programs for executing various processes such as the above-mentioned purging process, and various databases and tables used when executing the various processes. The communication interface is an interface for communicating with the above-mentioned components of the wafer storage container processing device 1, and also for communicating with external devices connected to the wafer storage container processing device 1 via a network. For example, the communication interface is a network interface card.

[0027] Next, an example of the configuration of the buffer 4 according to the present embodiment will be described. Figs. 2, 3, and 4 are diagrams showing an example of the configuration of the buffer 4 according to the embodiment. Figs. 2 and 3 are perspective views of the buffer 4 according to the embodiment. Fig. 2 shows a state in which a FOUP 20 is not placed on the buffer 4, and Fig. 3 shows a state in which a FOUP 20 is placed on the buffer 4. Also, Fig. 4 is a side view of the buffer 4 according to the embodiment.

[0028] As shown in FIGS. 2, 3 and 4, the buffer 4 includes two latch keys 4a, two frames 4b, a gas supply nozzle 4c, a gas discharge nozzle 4d, a pipe 4e, a pipe 4f and a collection box 4g.

[0029] The latch key 4a rotates while inserted into a keyhole formed in the door 20b of the FOUP 20, thereby disassembling the FOUP 20 into the FOUP body 20a and the door 20b, or connecting the FOUP body 20a and the door 20b. For example, if the keyhole of the door 20b is a rectangular recess, the latch key 4a has a so-called T-shape with its head formed into a rectangular parallelepiped corresponding to the keyhole of the door 20b.

[0030] The two frames 4b have a so-called U-shape facing each other in a plan view. The two frames 4b are provided with the open sides of the U-shape facing each other, and the approximately annular shape formed by the two frames 4b has a size corresponding to the outer shape of the door 20b. The door 20b is placed on the annular shape formed by the two frames 4b. The two frames 4b are provided at a predetermined distance apart. Therefore, two gaps 4b1 are formed between the two frames 4b, and these gaps 4b1 are used as spaces for the robot arm 3a of the robot 3 to enter when the robot arm 3a places the door 20b on the frame 4b.

[0031] The placement surface of the door 20b is not limited to the shape of the two U-shaped frames 4b. For example, it may be a rectangular frame that does not have the gap 4b1 that is the space for the robot arm 3a to enter. When the FOUP 20 is placed on the two U-shaped frames 4b, if the gap between the FOUP body 20a and the door 20b exists in the gap 4b1 (the space for the robot arm 3a to enter), gas will leak from there. However, if the frame is rectangular and does not have the gap 4b1, gas leakage can be minimized. In this case, when only the door 20b is held by the robot hand 3b, it is desirable to newly provide a mechanism for lifting the door 20b and lift the door 20b by using this mechanism.

[0032] In this embodiment, after the FOUP 20 is fully dried in the drying tank 6, the robot 3 first grasps the door 20b from the drying tank 6 and transports the door 20b to the frame 4b of the buffer 4, and then places the door 20b on the frame 4b. Next, the robot 3 grasps the FOUP body 20a and transports it to the frame 4b and places the FOUP body 20a on the door 20b. At this time, the robot 3 places the FOUP body 20a on the door 20b in a state in which the FOUP body 20a is positioned relative to the door 20b.

[0033] When the FOUP body 20a is placed on the door 20b, the latch key 4a connects the FOUP body 20a and the door 20b together. As a result, the buffer 4 places the FOUP 20 such that the door 20b is placed on the placement surface (the upper surface of the frame 4b) with the door 20b and the FOUP body 20a attached. The buffer 4 also has an attachment / detachment function for locking / unlocking the door 20b to the FOUP body 20a when the door 20b is placed on the placement surface.

[0034] Here, a groove 4b2 is formed in the frame 4b. In addition, in this embodiment, when the FOUP body 20a and the door 20b are connected, a gap 20d is formed between the FOUP body 20a and the door 20b. In this embodiment, the groove 4b2 is formed in the frame 4b so that the space formed by the groove 4b2 communicates with the space of the gap 20d when the FOUP 20 is placed on the frame 4b. As shown in FIG. 2, the groove 4b2 is open only on the upper surface side of the frame 4b, and the end of the frame 4b on the gap 4b1 side is closed. In other words, when the FOUP 20 is placed on the upper surface of the frame 4b, the groove 4b2 is completely blocked.

[0035] 3, a gas supply port 20e and a gas exhaust port 20f are provided on a bottom surface 20g of the FOUP body 20a, i.e., a surface (intersecting surface) 20g intersecting with a surface having an opening. With the FOUP 20 placed on the frame 4b, a gas supply nozzle 4c is coupled (connected) to the gas supply port 20e, and a gas exhaust nozzle 4d is inserted into the gas exhaust port 20f. In other words, the gas supply nozzle 4c and the gas exhaust nozzle 4d are disposed at positions corresponding to the gas supply port 20e and the gas exhaust port 20f when the FOUP 20 is placed on the frame 4b.

[0036] The gas supply nozzle 4c is connected to a gas tank that stores an inert gas such as N2, and supplies the inert gas from the gas tank to the storage space of the FOUP body 20a via the gas supply port 20e. In this manner, the gas supply nozzle 4c supplies the inert gas to the storage space of the FOUP 20 placed on the buffer 4, thereby replacing the gas in the storage space. The gas supply nozzle 4c and the gas tank are, for example, an example of a gas supply unit.

[0037] As described above, the bottom surface 20g of the FOUP 20 (FOUP body 20a) is provided with a gas supply port 20e for supplying gas. When the door 20b is placed on the top surface of the frame 4b, which is the placement surface, the bottom surface 20g of the FOUP 20 (FOUP body 20a) on which the gas supply port 20e is provided is located on the left side of FIG. 4. When the FOUP 20 is placed on the frame 4b, which is the placement surface, as shown in FIG. 5, the slot (shelf) 20h of the FOUP body 20a, which has a planar shape on which a semiconductor wafer is placed, extends vertically. Therefore, if dust adheres to the slot 20h in the FOUP body 20a, the dust is easily moved to the door 20b side located below due to the force of the gas supply and gravity acting on the dust, and the dust can be prevented from remaining in the slot 20h. FIG. 5 is a diagram for explaining an example of the arrangement of the slot 20h according to the embodiment.

[0038] As shown in FIG. 4, the gas discharge nozzle 4d discharges gas present in the storage space of the FOUP body 20a through the gas discharge port 20f. The gas discharge nozzle 4d is connected to a piping 4e, and the piping 4e is connected to a collection box 4g. Therefore, the gas discharged from the storage space of the FOUP body 20a flows into the collection box 4g through the gas discharge port 20f, the gas discharge nozzle 4d, and the piping 4e. In this way, the collection box 4g collects the gas discharged from the storage space. A valve 4e1 is provided on the path through which the gas flows in the piping 4e, and the valve 4e1 adjusts the inflow of gas into the collection box 4g by opening and closing it.

[0039] In addition, a gas recovery pipe (pipe) 4f provided on the opposite side to the side where the frame 4b is provided is connected to the groove 4b2. That is, the space formed by the groove 4b2 communicates with the space inside the pipe 4f. A recovery box 4g is connected to the pipe 4f. The gas present in the groove 4b2 flows into the recovery box 4g through the pipe 4f. Therefore, the gas leaking from the gap 20d between the FOUP body 20a and the door 20b flows into the recovery box 4g through the groove 4b2 and the pipe 4f. In this way, the recovery box 4g recovers the gas leaking from the gap 20d. In addition, a valve 4f1 is provided on the path through which the gas flows in the pipe 4f, and the valve 4f1 adjusts the inflow of the gas into the recovery box 4g by opening and closing it. The valve 4f1 is provided between the point where the two pipes 4f that recover the gas from the groove 4b2 join together and the recovery box 4g.

[0040] In the groove 4b2, inert gas is discharged from the storage space of the FOUP body 20a through the gap 20d. Therefore, the space formed by the groove 4b2 gradually becomes positive pressure due to the discharged gas. The gas in the groove 4b2 is guided by this positive pressure to the recovery box 4g. A suction source such as a pump may be provided at the end of the pipe 4f so that the gas is actively recovered by the recovery box 4g. By suctioning with the suction source in this manner, the gas replacement efficiency can be improved.

[0041] As described above, because there is a small gap 20d between the door 20b and the FOUP body 20a, as the replacement of the gas in the storage space progresses, gas leaks from the storage space through the gap 20d. The leaking gas contains oxygen similar to that in the clean room in which the wafer storage container processing device 1 is installed, and also contains moisture similar to that in the clean room, immediately after the start of gas supply. However, as time passes after the start of supply, the inert gas supplied from the gas supply nozzle 4c gradually begins to leak out from the gap 20d.

[0042] The recovery box 4g recovers the gas and stores the recovered gas. For example, the recovery box 4g recovers the gas leaking from the gap 20d and the gas discharged from the gas discharge port 20f. That is, the recovery box 4g recovers a gas (mixed gas) in which the gas leaking from the gap 20d and the gas discharged from the gas discharge port 20f are mixed. In this way, the recovery box 4g recovers the gas leaking from the gap 20d between the FOUP body 20a and the door 20b, which is a gas present in the storage space replaced by the inert gas supplied from the gas supply nozzle 4c. The recovery box 4g also recovers the gas discharged from the gas discharge port 20f, which is a gas present in the storage space replaced by the inert gas supplied from the gas supply nozzle 4c. The recovery box 4g, the gas discharge port 20f, the pipes 4e, 4f, and the valves 4e1, 4f1 are, for example, an example of a gas recovery unit.

[0043] The collection box 4g includes a measurement unit 4h therein that measures the oxygen concentration of the gas stored in the collection box 4g. The measurement unit 4h measures the oxygen concentration at a predetermined time interval and transmits the measured oxygen concentration to the control unit 8. The measurement unit 4h is, for example, an oxygen concentration meter that measures the oxygen concentration of the gas and transmits the measured oxygen concentration to the control unit 8. The measurement unit 4h may be, for example, a hygrometer. In this case, the hygrometer measures the humidity of the gas and transmits the measured humidity to the control unit 8.

[0044] In addition, a pipe 4j for exhausting the collected gas is connected to the collection box 4g. A valve 4j1 is provided on the path of the gas flow in the pipe 4j. When the collected gas is exhausted, the gas flows in the pipe 4j with the valve 4j1 open. Here, a suction source such as a pump may be provided at the end of the pipe 4j so that the gas is actively exhausted. By suctioning with the suction source in this way, the gas exhaust efficiency can be improved.

[0045] The control unit 8 according to the present embodiment controls the supply of inert gas to the storage space based on the measured value transmitted from the measurement unit 4h. For example, the control unit 8 compares the measured value with a predetermined value, and when the measured value is equal to or greater than the predetermined value, controls the gas supply nozzle 4c to continue the supply of inert gas. On the other hand, when the measured value is below the predetermined value, it is considered that the storage space of the FOUP body 20a is filled with inert gas, and the control unit 8 controls the gas supply nozzle 4c to stop the supply of inert gas from the gas supply nozzle 4c. To explain this by taking a specific example, the control unit 8 compares the oxygen concentration with a first predetermined value, and when the oxygen concentration is below the first predetermined value, controls the gas supply nozzle 4c to stop the supply of inert gas. In addition, the control unit 8 compares the humidity with a second predetermined value, and when the humidity is below the second predetermined value, controls the gas supply nozzle 4c to stop the supply of inert gas. The specified values ​​(first specified value and second specified value) are the oxygen concentration values ​​and humidity values ​​that create an environment in which the components in the storage space can be maintained without oxidizing, and such oxygen concentration values ​​and humidity values ​​are determined in advance through experiments, simulations, etc.

[0046] Next, an example of a purging process performed by the wafer storage container processing apparatus 1 according to the present embodiment will be described. Fig. 6 is a flow chart showing the flow of an example of a purging process performed by the wafer storage container processing apparatus 1 according to the embodiment. The purging process shown in Fig. 6 is performed when vacuum drying of the FOUP 20 in the drying tank 6 is completed.

[0047] 6, in a buffer attachment process of step S101 of the purging process, the robot 3 separately transports the FOUP body 20a and the door 20b in the drying tank 6 onto the buffer 4. Then, the buffer 4 connects the FOUP body 20a and the door 20b.

[0048] Next, in a purge nozzle coupling process in step S102, with the FOUP 20 placed on the frame 4b, the gas supply nozzle 4c is coupled to the gas supply port 20e, and the gas exhaust nozzle 4d is inserted into the gas exhaust port 20f.

[0049] Next, in the gas replacement process of step S103, the gas supply nozzle 4c starts to supply the inert gas to the storage space of the FOUP body 20a, thereby starting to replace the gas in the storage space. In step S103, the control unit 8 opens the valves 4e1 and 4f1 and closes the valve 4j1. As a result, the collection box 4g starts to collect the above-mentioned mixed gas.

[0050] Next, in the purge completion confirmation process of step S104, if the measurement value transmitted from the measurement unit 4h is equal to or greater than a predetermined value, the control unit 8 controls the gas supply nozzle 4c to continue the supply of inert gas. On the other hand, if the measurement value is below the predetermined value, it is considered that the storage space of the FOUP body 20a is filled with inert gas, and therefore the control unit 8 controls the gas supply nozzle 4c to stop the supply of inert gas.

[0051] When the supply of inert gas is stopped, in the next step S105, the purge nozzle removal process, with the FOUP 20 placed on the frame 4b, the gas supply nozzle 4c is removed from the gas supply port 20e, and the gas exhaust nozzle 4d is removed from the gas exhaust port 20f.

[0052] Then, in the next step SS106, a buffer removal process, the robot 3 removes the FOUP 20 from the buffer 4, and transports the removed FOUP 20 to the unload port 7. Then, the FOUP 20 is carried out from the wafer container processing apparatus 1.

[0053] The wafer container processing apparatus 1 according to the embodiment has been described above.

[0054] Here, an example of a conventional wafer container processing apparatus and a conventional FOUP will be described. Conventionally, there is a technology for supplying an inert gas into a FOUP to replace the gas in the FOUP. However, if there is a small gap between the FOUP body and the door, the gas replacement may not be performed efficiently. Furthermore, since this gap differs depending on the individual FOUP, it is not possible to detect whether the gas replacement in each FOUP has been sufficiently performed. Also, it is possible to perform control such that the time when the gas replacement in the FOUP is expected to be completed is set as a predetermined time and the gas replacement in the FOUP is determined to be completed when the predetermined time has elapsed since the start of the supply of the inert gas. However, when performing such control, the predetermined time needs to be set to a time when the replacement is surely completed, so that it needs to be set longer. As a result, the inert gas is supplied for a longer time than the time when the replacement is actually completed, which results in waste in terms of cost and processing time.

[0055] Furthermore, conventional FOUPs are equipped with both a gas supply port for supplying an inert gas such as N2 gas, and a gas exhaust port for exhausting gas, and it is thought that it would be possible to detect whether gas replacement is complete by measuring the gas exhausted from the gas exhaust port. However, since both of these ports are provided on the same surface of the FOUP (the bottom surface of the FOUP, the surface that intersects with the surface of the opening where the door is attached) and these two ports are provided close to each other, a relatively large amount of inert gas may be exhausted from the gas exhaust port even if gas replacement inside the FOUP is not complete.

[0056] In addition, in conventional FOUPs, a large amount of inert gas is discharged from the gap between the FOUP door and the FOUP body, and measurement may not be possible if only a small amount of gas is discharged from the gas exhaust port. Therefore, even with this method, it is difficult to detect the gas replacement state inside the FOUP.

[0057] On the other hand, in the case of the present embodiment where the FOUP 20 is placed on the buffer 4 with the door 20b facing downwards during the purging process, the weight of the FOUP body 20a presses the door 20b against the frame 4b, bringing the FOUP body 20a and the door 20b into close contact with each other, thereby reducing the size of the gap 20d. This reduces the amount of gas leaking from the gap 20d. This allows the gas in the FOUP 20 to be replaced efficiently.

[0058] Furthermore, in the wafer storage container processing apparatus 1 of the embodiment, the FOUP 20 is positioned so that the FOUP body 20a and the door 20b are connected and the door 20b is placed on the frame 4b, so that the oxygen concentration and humidity in the storage space can be measured even if more gas comes out of the gap 20d between the door 20b and the FOUP body 20a than comes out of the gas exhaust port 20f.

[0059] Furthermore, as described above, by placing the FOUP 20 in the buffer 4 with the door 20b facing downwards and performing the purging process, the FOUP body 20a is placed so that the slot 20h extends vertically. Therefore, gravity acts on the debris in addition to the force of the gas supply, so that the debris in the slot 20h tends to move towards the door 20b, thereby preventing debris from remaining in the slot 20h.

[0060] Furthermore, if the FOUP 20 were placed so that the gas supply port 20e and the gas exhaust port 20f were on the bottom, it would be necessary to provide a member that covers the entire door 20b in order to catch the gas leaking from the gap 20d. However, according to this embodiment, the placement surface of the buffer 4 also serves to cover the door 20b, so it is sufficient to further provide a frame 4b that covers the gap 20d.

[0061] As described above, according to this embodiment, the gas in the FOUP 20 can be replaced efficiently.

[0062] Furthermore, compared to the conventional method of measuring only the gas discharged from one gas exhaust port, this embodiment measures the gas leaking from gap 20d in addition to gas exhaust port 20f, thereby improving the reliability of the measurement.

[0063] In addition, the buffer 4 has a function for attaching (connecting) the door 20b and the FOUP body 20a of the FOUP 20, so that gas replacement and the attachment of the door 10b and the FOUP body 20a can be performed simultaneously and in the same place, enabling efficient purging processing.

[0064] (Modification of the embodiment) Next, modified examples of the embodiment will be described. In the following description of the modified examples, configurations different from the above-described embodiment will be mainly described, and descriptions of configurations similar to the above-described embodiment may be omitted.

[0065] Fig. 7 is a side view of a buffer 4 according to a modified example of the embodiment. The buffer 4 according to the modified example shown in Fig. 7 differs from the buffer 4 according to the embodiment shown in Fig. 4 in that it further includes a flow meter 4e2 and a flow meter 4f2. Although not shown in Fig. 7, the buffer 4 according to the modified example also includes a flow meter (supply gas flow meter) provided on a path through which gas flows in the piping that connects the gas tank and the gas supply nozzle 4c.

[0066] The flow meter 4e2 is provided on the path through which the gas flows in the piping 4e, and measures the flow rate of the gas discharged from the gas discharge port 20f and flowing into the recovery box 4g at predetermined time intervals, and transmits the measured flow rate to the control unit 8.

[0067] The flow meter 4f2 is provided on the gas flow path of the pipe 4f, and measures the flow rate of gas leaking from the gap 20d and flowing into the recovery box 4g at predetermined time intervals, and transmits the measured flow rate to the control unit 8.

[0068] The supply gas flow meter measures the flow rate of the gas supplied from the gas tank to the gas supply nozzle 4 c at predetermined time intervals, and transmits the measured flow rate to the control unit 8 .

[0069] The control unit 8 according to the modified example performs various controls based on the flow rates transmitted from the flow meters 4e2 and 4f2 and the supply gas flow meter. For example, the control unit 8 performs control so as to output information indicating that gas is leaking according to the received flow rate every time the control unit 8 receives the flow rate transmitted from the flow meter 4f2.

[0070] To explain with a specific example, the control unit 8 compares the flow rate from the flowmeter 4f2 with a predetermined threshold value, and when the flow rate from the flowmeter 4f2 is equal to or greater than the predetermined threshold value, outputs information indicating that gas is leaking from the gap 20d by displaying the information on the display connected to the control unit 8. An example of the information indicating that gas is leaking from the gap 20d is a text data message saying, for example, "Gas is leaking." When the flow rate from the flowmeter 4f2 is equal to or greater than the predetermined threshold value, the control unit 8 transmits information indicating that gas is leaking and the flow rate from the flowmeter 4f2 together with an ID (Identification) for identifying the FOUP 20 placed on the buffer 4 to an external server that collectively manages the FOUP 20. As a result, the information and the flow rate from the flowmeter 4f2 are output to the external server. Then, the external server stores the ID, the information indicating that gas is leaking, and the flow rate of the leaking gas in association with each other. In addition, the history of gas leakage amounts for FOUPs 20 with the same ID may be recorded, and if the leakage amount increases over time, if the rate of increase exceeds a predetermined rate, or if the leakage amount exceeds a predetermined threshold, information to discontinue use of the FOUP 20 may be stored in association with the ID.

[0071] Moreover, the control unit 8 compares the total value of the flow rate from the flowmeter 4f2 and the flow rate from the flowmeter 4e2 with the flow rate from the supply gas flowmeter. Then, when the flow rate from the supply gas flowmeter is greater than the total value, the control unit 8 determines that gas may be leaking from a location other than the gas discharge port 20f. Therefore, when the flow rate from the supply gas flowmeter is greater than the total value, the control unit 8 displays information indicating that gas may be leaking on the display. An example of the information indicating that gas may be leaking is a text data message saying, "Gas may be leaking from a location other than the discharge port." When the flow rate from the supply gas flowmeter is greater than the total value, the control unit 8 transmits information indicating that gas may be leaking together with an ID for identifying the FOUP 20 placed on the buffer 4 to an external server that collectively manages the FOUP 20. As a result, the external server stores the ID and the information indicating that gas may be leaking in association with each other.

[0072] According to the modified example, the user of the wafer container processing apparatus 1 can properly grasp the status of various gas leaks, and can determine whether to continue using the FOUP 20 depending on the gas leak status. [Explanation of symbols]

[0073] 1 Wafer storage container processing equipment 4. Buffer 4a Latch key 4b frame 4b2 Groove 4c Gas supply nozzle 4e, 4f, 4j Piping 4e1,4f1,4j1 Valve 20 FOUP 20a FOUP body 20b Door 20d gap

Claims

1. 1. A wafer storage container processing apparatus for processing a wafer storage container having a main body for storing semiconductor wafers and having a storage space communicating with an opening, and a door detachable from the opening, a mounting table having a mounting surface on which the wafer container is placed; a gas supply unit that supplies an inert gas to the wafer container placed on the placement table, the wafer container is placed on the placement table such that the door is placed on the placement surface in a state where the door and the body are attached to each other; The gas supply unit supplies the inert gas through a gas supply port provided on an intersecting surface of the main body that intersects with the surface having the opening.

2. 2. The wafer container processing apparatus according to claim 1, wherein the mounting table has a detachable function for locking / unlocking the door with respect to the main body when the door is placed on the mounting surface.

3. a gas recovery unit that recovers in a box the gas present in the storage space that is replaced by the inert gas supplied from the gas supply unit and that has leaked from a gap between the main body and the door; and A measurement unit that measures at least one of an oxygen concentration and a humidity of the gas in the box; A control unit that controls the gas supply unit and the measurement unit, 2. The wafer storage container processing apparatus of claim 1, wherein the control unit controls the gas supply unit to stop supplying the inert gas from the gas supply unit when at least one of the oxygen concentration and the humidity measured by the measurement unit falls below a predetermined value.

4. a cleaning unit that cleans the storage space while the main body and the door are separated, 2. The wafer container processing apparatus according to claim 1, wherein the gas supply unit supplies the inert gas to the wafer container placed on the stage after cleaning by the cleaning unit.

5. The gas recovery unit further recovers gas discharged from a gas discharge port provided on the intersecting surface, 4. The wafer storage container processing apparatus of claim 3, wherein the measurement unit measures at least one of the oxygen concentration and the humidity of a mixed gas of the gas leaked from the gap and the gas discharged from the gas exhaust port, the mixed gas being recovered by the gas recovery unit.

6. a flow meter portion for measuring the flow rate of gas leaking from the gap; a control unit that controls the device to output information indicating that gas is leaking when the flow rate of the gas is equal to or greater than a predetermined threshold; The wafer container processing apparatus of claim 3 , further comprising:

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