Substrate separation device

Abstract

To provide a substrate separation device capable of suppressing infiltration of liquid between a chuck and a substrate.SOLUTION: A substrate separation device according to the embodiment includes: a first chuck that sucks and holds one side of a bonded substrate formed by bonding a pair of substrates together; a second chuck that sucks and holds the other side of the bonded substrate; an exhaust part connected to the first chuck and the second chuck; a drive part that rotates the first chuck and the second chuck; and a nozzle for jetting liquid onto a side surface of the bonded substrate. The first chuck has a first recess connected to the exhaust part and a second recess. The first recess is open to a first surface of the bonded substrate side of the first chuck. The second recess is open to a region between the region where the first recess is open and a peripheral edge of the first surface.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] SUMMARY OF THE DISCLOSURE An embodiment of the present invention relates to a substrate separation apparatus. [Background technology]

[0002] For example, a technique has been proposed in which a pair of substrates are bonded together, the bonded pair of substrates are separated, and a layer formed on one substrate is transferred to the other substrate. This technique is used, for example, in the manufacture of semiconductor devices having a three-dimensional structure.

[0003] In this case, a liquid ejection device may be used to separate the bonded substrates. For example, the bonded substrates are sandwiched between a pair of chucks, the bonded substrates are rotated by rotating the chucks, and high-pressure liquid is ejected onto the sides of the rotating substrates to separate the bonded substrates. In this case, the bonded substrates are vacuum-adsorbed to the chuck, which makes it possible to prevent the bonded substrates from shifting from their original positions.

[0004] However, the liquid sprayed onto the side surface of the bonded substrates may get into the gap between the chuck and the substrate. Since the substrates are vacuum-adsorbed to the chuck, if the liquid gets into the gap between the chuck and the substrate, the force holding the substrates may decrease, and the bonded substrates may become misaligned. If the bonded substrates become misaligned, uniform separation may be hindered, reducing the separation efficiency or causing damage to the substrates. Therefore, there has been a demand for the development of a substrate separating device that can prevent liquid from entering between the chuck and the substrate. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 11-005064 Summary of the Invention [Problem to be solved by the invention]

[0006] An object of the present invention is to provide a substrate separating apparatus capable of suppressing the intrusion of liquid between the chuck and the substrate. [Means for solving the problem]

[0007] The substrate separation device according to the embodiment includes a first chuck for suction-holding one side of a bonded substrate formed by bonding a pair of substrates, a second chuck for suction-holding the other side of the bonded substrate, an exhaust unit connected to the first chuck and the second chuck, a drive unit for rotating the first chuck and the second chuck, and a nozzle for spraying liquid onto the side of the bonded substrate. The first chuck has a first recess connected to the exhaust unit and a second recess. The first recess opens onto a first surface of the first chuck on the bonded substrate side. The second recess opens onto a region of the first surface between a region where the first recess opens and a periphery of the first surface. Effect of the Invention

[0008] According to an embodiment of the present invention, a substrate separating apparatus is provided that can suppress the intrusion of liquid between the chuck and the substrate. [Brief description of the drawings]

[0009] [Figure 1] 1 is a schematic diagram illustrating a substrate separating apparatus according to an embodiment of the present invention; [Diagram 2] 1 is a schematic perspective view illustrating the configuration of a chuck. FIG. [Diagram 3] 3 is a schematic cross-sectional view of the chuck in FIG. 2 taken along line AA. [Figure 4] 11A and 11B are schematic perspective views illustrating the configuration of a chuck according to another embodiment. [Diagram 5] 5 is a schematic cross-sectional view of the chuck in FIG. 4 taken along line BB. [Figure 6] 5A and 5B are schematic cross-sectional views illustrating the configuration of a chuck according to another embodiment. [Figure 7] 1A to 1H are schematic views illustrating the operation of the substrate separating apparatus. [Figure 8] 10 is a flowchart illustrating a procedure for separating bonded substrates. [Figure 9] 1A to 1C are schematic views for illustrating separation of bonded substrates. [Figure 10] 1A to 1C are schematic views for illustrating separation of bonded substrates. [Figure 11] 1A to 1C are schematic views for illustrating separation of bonded substrates. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and detailed description thereof will be omitted as appropriate.

[0011] The bonded substrate 100 separated by the substrate separating apparatus 1 according to the present embodiment includes, for example, a substrate 101 and a substrate 102 bonded to one surface side of the substrate 101. The substrate 101 and the substrate 102 may be, for example, semiconductor wafers. A porous layer is provided on one surface of the substrate 101, and a single crystal Si layer is provided on the porous layer. A single crystal Si layer is provided on one surface of the substrate 102. An insulating layer is provided on the single crystal Si layer of the substrate 101 or on the single crystal Si layer of the substrate 102. The substrate 101 and the substrate 102 are bonded together via the insulating layer. However, the bonded substrate 100 is not limited to the illustrated example. The bonded substrate 100 may be a substrate in which a substrate 101 and a substrate 102 are bonded together with an insulating layer or the like interposed therebetween.

[0012] FIG. 1 is a schematic view illustrating a substrate separating apparatus 1 according to the present embodiment. As shown in FIG. 1, the substrate separating apparatus 1 includes a base 10, a holding unit 20, a positioning unit 30, a separating unit 40, and a controller 50, for example.

[0013] The base 10 can be provided, for example, at a location where the substrate separating apparatus 1 is installed. A holding section 20, a positioning section 30, and a separating section 40 can be provided on one surface of the base 10. In addition, a base 10a facing the base 10 can be provided. A chuck 21 (corresponding to an example of a second chuck), a support section 22, a chuck 23 (corresponding to an example of a first chuck), a driving section 24, and a moving section 25, which will be described later, are provided between the base 10a and the base 10. The base 10a can be integrated with the base 10 via, for example, a stand (not shown) or the like.

[0014] The holding unit 20 includes, for example, a chuck 21, a support unit 22, a chuck 23, a driving unit 24, a moving unit 25, and an exhaust unit 26.

[0015] The chuck 21 is provided on the substrate 101 side of the bonded substrate 100. The chuck 21 suction-holds one surface of the bonded substrate 100 formed by bonding a pair of substrates 101, 102 together. The chuck 21 can be, for example, a vacuum chuck. The configuration of the chuck 21 will be described in detail later.

[0016] The support portion 22 rotatably supports the chuck 21. The support portion 22 is provided on, for example, the base 10a. The support unit 22 includes, for example, a rotation shaft 22a and a rotation mechanism 22b.

[0017] The rotating shaft 22a extends along the central rotation axis 1a of the substrate separating apparatus 1. A chuck 21 is provided on one end side of the rotating shaft 22a. The other end side of the rotating shaft 22a is connected to a rotating mechanism 22b.

[0018] The rotation mechanism 22b rotates the chuck 21 in synchronization with the chuck 23 described later. The rotation mechanism 22b has a synchronous transmission member such as a timing belt or a timing pulley. The synchronous transmission member is connected to the rotation shaft 22a on which the chuck 21 is provided and to the drive unit 24 described later. In this manner, the drive unit 24 can rotate the chuck 21 simultaneously and at the same rotation speed as the chuck 23 described later. This can simplify the configuration of the rotation mechanism 22b and the control software, and ultimately reduce the manufacturing cost of the substrate separation apparatus 1.

[0019] The chuck 23 is provided on the substrate 102 side of the bonded substrate 100. The chuck 23 adsorbs and holds the other surface of the bonded substrate 100 (the surface opposite to the surface on the substrate 101 side). The chuck 23 can be, for example, a vacuum chuck. In this case, as shown in FIG. 1, the chuck 23 adsorbs and holds the surface of the bonded substrate 100 on the lower side in the direction of gravity. Therefore, when the bonded substrate 100 is separated into the substrate 101 and the substrate 102, the chuck 23 holds the substrate 102 on the reference side. The configuration of the chuck 23 will be described in detail later.

[0020] The driving unit 24 rotates the chuck 23 and rotates the chuck 21 in synchronization with the chuck 23 via the rotation mechanism 22b and the rotating shaft 22a. Therefore, the driving unit 24 can rotate the bonded substrate 100 gripped by the chuck 23 and the chuck 21. The driving unit 24 can also control the number of rotations of the bonded substrate 100 and control the start and stop of the rotation. The driving unit 24 can include, for example, a control motor such as a servo motor and a rotating shaft 24a. The chuck 23 is provided on one end side of the rotating shaft 24a. The other end side of the rotating shaft 24a is connected to the control motor via a conductive member or the like.

[0021] 1, the central axis of the rotation shaft 22a, the central axis of the chuck 21, the central axis of the chuck 23, and the central axis of the rotation shaft 24a overlap with the rotation central axis 1a. That is, these central axes are arranged to be coaxial. Therefore, when the bonded substrate 100 is rotated, it is possible to suppress the relative position between the chuck 21 and the chuck 23 from being shifted in the direction perpendicular to the rotation central axis 1a.

[0022] The moving unit 25 moves the driving unit 24 in a direction along the rotation central axis 1a. The moving unit 25, for example, raises and lowers the driving unit 24. Since the driving unit 24 (rotation axis 24a) is provided with a chuck 23, the distance between the chuck 23 and the chuck 21 in the direction along the rotation central axis 1a can be changed by moving the driving unit 24 with the moving unit 25. Therefore, the moving unit 25 can grip and release the bonded substrate 100 by the chuck 23 and the chuck 21. The moving unit 25 can have, for example, a driving mechanism such as an air cylinder or a hydraulic cylinder, and a guide mechanism for moving the driving unit 24 linearly.

[0023] The exhaust unit 26 is connected to the chuck 21 via a piping member such as a rotary joint provided on the support unit 22. The exhaust unit 26 sucks air so that the pressure between the chuck 21 and the bonded substrate 100 (substrate 101) becomes negative. The exhaust unit 26 is also connected to the chuck 23 via a piping member such as a rotary joint provided on the drive unit 24. The exhaust unit 26 sucks air so that the pressure between the chuck 23 and the bonded substrate 100 (substrate 102) becomes negative. The exhaust unit 26 has an exhaust device such as a vacuum pump.

[0024] Furthermore, a gas-liquid separator may be provided between the chucks 21 and 23 and an exhaust device such as a vacuum pump.

[0025] Also, a pressure control device can be provided at least one between the chuck 21 and the gas-liquid separator and between the chuck 23 and the gas-liquid separator. If a pressure control device is provided, it becomes possible to control the chucking forces of the chucks 21 and 23.

[0026] The positioning unit 30 positions the bonded substrate 100 in a direction perpendicular to the rotation central axis 1a. The positioning unit 30 adjusts the position of the bonded substrate 100 so that the center of the bonded substrate 100 overlaps with the rotation central axis 1a.

[0027] The positioning portion 30 has, for example, a pin 31, an arm 32, a moving portion 33, a moving portion 34, a guide 35, and an absorbing portion 36. A plurality of sets of the pin 31, the arm 32, the moving portion 33, the guide 35, and the absorbing portion 36 can be provided.

[0028] The pin 31 has, for example, a columnar shape and extends in a direction along the rotation central axis 1a. A side surface of the pin 31 contacts a side surface of the laminated substrate 100. The pin 31 can be provided, for example, at the upper end of the arm 32. When viewed from a direction along the rotation central axis 1a, the multiple pins 31 can be provided at positions that are rotationally symmetric with respect to the rotation central axis 1a.

[0029] The arm 32 is plate-shaped and extends in a direction parallel to the central axis of rotation 1a. The moving unit 33 moves the arm 32 in a direction along the central axis of rotation 1a. For example, the moving unit 33 raises and lowers the arm 32. The moving unit 33 has a driving mechanism such as an air cylinder or a hydraulic cylinder.

[0030] The moving unit 34 can be provided for each of the arms 32. The moving unit 34 has, for example, a link mechanism or a cam mechanism, and simultaneously changes the positions of the arms 32 in a direction perpendicular to the rotation axis 1a. For example, the moving unit 34 moves the arms 32 toward the rotation axis 1a, so that the pins 31 press the side of the bonded substrate 100 toward the rotation axis 1a. The pins 31 press the side of the bonded substrate 100 toward the rotation axis 1a, so that the center of the bonded substrate 100 overlaps with the rotation axis 1a. That is, the position of the bonded substrate 100 is performed. Also, for example, the moving unit 34 moves the arms 32 in a direction away from the rotation axis 1a, so that the pins 31 are separated from the side of the bonded substrate 100.

[0031] The guides 35 are provided between each of the multiple arms 32 and the moving unit 34. The guides 35 guide the movement of the arms 32 in the direction along the rotation central axis 1a. The guides 35 may be, for example, linear guides. If the guides 35 are provided, the relative positions between the arms 32 and the moving unit 34 in the direction along the rotation central axis 1a can be changed arbitrarily.

[0032] The absorbing unit 36 ​​is provided between the arm 32 and the moving unit 33. The absorbing unit 36 ​​absorbs changes in position between the arm 32 and the moving unit 33 in a direction perpendicular to the rotation central axis 1a. The absorbing unit 36 ​​may include an elastic body such as rubber or a spring. If the absorbing unit 36 ​​is provided, even if the position between the moving unit 33 and the arm 32 shifts in the direction perpendicular to the rotation central axis 1a, the amount of shift can be absorbed by the moving unit 34.

[0033] The separating unit 40 sprays high-pressure liquid 40a onto the side surface of the rotating bonded substrate 100 to separate the bonded substrate 100 into the substrate 101 and the substrate 102. The liquid 40a is sprayed toward a layer (e.g., a porous layer or a single crystal Si layer) provided between the substrate 101 and the substrate 102. The liquid 40a can be, for example, water such as ultrapure water. When the liquid 40a is water, the separating unit 40 can be a so-called water jet device.

[0034] The separation unit 40 includes, for example, a nozzle 41, a liquid supply unit 42, and a movement unit 43. The nozzle 41 is cylindrical and has an ejection port 41a at one end. The diameter of the ejection port 41a is, for example, about 0.1 mm to 1 mm. The thickness of the end of the nozzle 41 where the ejection port 41a is provided is, for example, about 1 cm to 5 cm. By setting the thickness of the end of the nozzle 41 in this manner, even if the liquid 40a is ejected at high pressure, the nozzle 41 can be prevented from being damaged. In the direction along the rotation central axis 1a, the central axis of the ejection port 41a of the nozzle 41 is located between the substrate 101 and the substrate 102. In addition, the central axis of the ejection port 41a of the nozzle 41 can be, for example, approximately parallel to the surface 23b (corresponding to an example of the first surface) of the chuck 23 on the bonded substrate 100 side.

[0035] The liquid supply unit 42 supplies high-pressure liquid 40a to the nozzle 41. The pressure of the liquid 40a is, for example, about 15 MPa to 90 MPa. The flow rate of the liquid 40a is about 60 mL / min to 150 mL / min. The liquid supply unit 42 is connected, for example, via a high-pressure pipe to an end of the nozzle 41 opposite to the end where the injection port 41a is provided. The liquid supply unit 42 may be provided with, for example, a tank for storing the liquid 40a, a high-pressure pump for supplying the liquid 40a stored in the tank to the nozzle 41, a flow control valve for controlling the flow rate and pressure of the liquid 40a supplied to the nozzle 41, and a switching valve for switching between supply and stop of the liquid 40a.

[0036] The moving unit 43 moves the position of the nozzle 41 (ejection port 41a) in a plane perpendicular to the rotation central axis 1a. The moving unit 43 moves the position of the nozzle 41 (ejection port 41a) in a direction along a tangent to the periphery of the bonded substrate 100 and in a direction toward the central axis (rotation central axis 1a) of the bonded substrate 100. The moving unit 43 can be, for example, an XY table or a robot capable of controlling two or more axes. The moving unit 43 can be provided on the base 10 via, for example, a stand 43a.

[0037] The controller 50 includes, for example, a calculation unit such as a CPU (Central Processing Unit) and a storage unit such as a memory. The controller 50 is, for example, a computer. The controller 50 controls the operation of each element provided in the substrate separating apparatus 1 based on a control program stored in the storage unit.

[0038] Next, the configurations of the chucks 21 and 23 will be further described. The configurations of the chuck 21 and the chuck 23 may be the same or different. In the following, a case where the chuck 21 and the chuck 23 have the same configuration will be described. In this case, as described above, the chuck 23 holds the substrate 102, which is located on the lower side in the direction of gravity and serves as the reference side in the separation process. Therefore, in the following, the chuck 23 will be mainly described.

[0039] FIG. 2 is a schematic perspective view illustrating the configuration of the chuck 23. FIG. 3 is a schematic cross-sectional view of the chuck 23 in FIG. 2 taken along the line AA. 2 and 3, the chuck 23 has a plate shape. When viewed from a direction along the central axis 23a of the chuck 23, the shape of the chuck 23 may be, for example, circular. The dimension of the chuck 23 in a direction perpendicular to the central axis 23a may be smaller than the dimension of the bonded substrate 100 (see FIG. 1).

[0040] The surface 23b of the chuck 23 facing the bonded substrate 100 can be a flat surface. The chuck 23 is provided with at least one hole 23c opening on the surface 23b. The chuck 23 illustrated in FIG. 2 and FIG. 3 is provided with one hole 23c provided at the position of the central axis 23a and four holes 23c provided at positions rotationally symmetrical about the central axis 23a. The number and arrangement of the holes 23c are not limited to those illustrated, and can be appropriately changed depending on the size of the bonded substrate 100, etc. The hole 23c is connected to the exhaust unit 26, for example, via a piping member such as a rotary joint provided in the drive unit 24.

[0041] Also, at least one recess 23d can be provided on the surface 23b. In this case, if multiple recesses 23d are provided, the suction force can be increased. The recess 23d opens on the surface 23b. The recess 23d does not open on the side of the chuck 23 facing the surface 23b. The recess 23d communicates with the hole 23c. The recess 23d is connected to the exhaust unit 26 via the hole 23c. The recess 23d functions as a suction groove for suctioning the laminated substrate 100. When viewed from the direction along the central axis 23a, the outline of the outer side of the recess 23d can be made similar to the outline of the periphery of the surface 23b. For example, in the case of the chuck 23 illustrated in FIG. 2, when viewed from the direction along the central axis 23a, the outline of the outer side of the recess 23d can be made circular. In this way, it is easy to make the suction force around the central axis 23a uniform.

[0042] Furthermore, when multiple recesses 23d are provided, at least one recess 23d1 that communicates with the recesses 23d can be provided. The recess 23d1 can be opened to the surface 23b. If the recess 23d1 is provided, it becomes easy to communicate the multiple recesses 23d with the hole 23c. Furthermore, if the recess 23d1 is open to the surface 23b, the recess 23d1 can be made to function as an adsorption groove. Therefore, the adsorption force can be increased.

[0043] In addition, when multiple recesses 23d1 are provided, the multiple recesses 23d1 can be provided at positions that are rotationally symmetrical about the central axis 23a. In this way, it is easy to make the suction force around the central axis 23a uniform. In addition, in FIG. 2, at least one end of the recess 23d1 is directly connected to the hole 23c, but both ends of the recess 23d1 may be connected to the recess 23d.

[0044] The dimensions, number, arrangement, etc. of the recesses 23d, the recesses 23d1, and the holes 23c can be appropriately changed depending on the dimensions of the surface 23b of the chuck 23, the required holding force, etc. These can be appropriately determined, for example, by performing experiments or simulations.

[0045] There are no particular limitations on the material of the chuck 23 as long as it has chemical and physical resistance to the sprayed liquid 40a. The material of the chuck 23 can be, for example, a metal such as stainless steel.

[0046] Here, the liquid 40a sprayed from the separation unit 40 may infiltrate between the chuck 23 and the bonded substrate 100 (substrate 102). The liquid 40a that has reached at least one of the recesses 23d and 23d1 can be discharged by, for example, a gas-liquid separator provided in the exhaust unit 26.

[0047] However, even if the gas-liquid separator can protect an exhaust device such as a vacuum pump provided in the exhaust section 26, if the liquid 40a enters at least one of the recesses 23d, 23d1, and the hole 23c, the force (adsorption force) holding the bonded substrate 100 may decrease. If the force holding the bonded substrate 100 decreases, the position of the bonded substrate 100 with respect to the rotation center axis 1a may shift. If the position of the bonded substrate 100 shifts, uniform separation may be hindered, reducing the separation efficiency, or at least one of the substrates 101 and 102 may be damaged.

[0048] Therefore, as shown in Fig. 2 and Fig. 3, at least one recess 23e (corresponding to an example of a second recess) is provided in the chuck 23. The recess 23e opens to the surface 23b. The recess 23e can be provided in the vicinity of the periphery of the surface 23b. For example, the recess 23e opens to a region between the region of the surface 23b where the recess 23d, the recess 23d1, and the hole 23c open and the periphery of the surface 23b. The recess 23e does not communicate with the recess 23d, the recess 23d1, and the hole 23c.

[0049] As shown in Fig. 2, the recess 23e has, for example, a frame shape and surrounds the area where the recess 23d, the recess 23d1, and the hole 23c are open. The recess 23e extends, for example, along the periphery of the surface 23b. In this case, the outline of the outer edge of the recess 23e when viewed from the direction along the central axis 23a can be similar to the outline of the periphery of the surface 23b. For example, in the case of the chuck 23 illustrated in Fig. 2, the outline of the outer edge of the recess 23e when viewed from the direction along the central axis 23a can be circular.

[0050] When a plurality of recesses 23e are provided, the plurality of recesses 23e can be arranged in a direction perpendicular to the central axis 23a. In this case, the plurality of recesses 23e can be provided concentrically with the central axis 23a as the center.

[0051] If the recess 23e is provided near the periphery of the surface 23b, even if the liquid 40a penetrates between the chuck 23 and the bonded substrate 100 (substrate 102), the infiltrated liquid 40a can be captured by the recess 23e. Therefore, even if the liquid 40a penetrates between the holding part 20 (chuck 23) and the bonded substrate 100 (substrate 102), the infiltrated liquid 40a can be prevented from reaching the recess 23d, the recess 23d1, and the hole 23c. If the infiltrated liquid 40a can be prevented from reaching the recess 23d, the recess 23d1, and the hole 23c, the force (adsorption force) holding the bonded substrate 100 can be prevented from decreasing. As a result, it is possible to prevent the position of the bonded substrate 100 relative to the rotation center axis 1a from being shifted, which hinders uniform separation and reduces the separation efficiency, or to prevent damage to at least one of the substrates 101 and 102.

[0052] Furthermore, when the liquid 40a is sprayed by the liquid supply unit 42, the bonded substrate 100 is rotating. Therefore, the liquid 40a captured by the recess 23e is discharged to the outside of the bonded substrate 100 by centrifugal force. Therefore, it is possible to further prevent the liquid 40a from reaching the recess 23d, the recess 23d1, and the hole 23c. In this case, for example, the distance between the recess 23e and the periphery of the surface 23b can be made shorter than the distance between the recess 23e and the recess 23d. In this way, it becomes easier to discharge the liquid 40a trapped in the recess 23e to the outside of the chuck 23.

[0053] A plurality of recesses may be arranged along the periphery of surface 23b. This arrangement also prevents infiltrating liquid 40a from reaching recesses 23d, 23d1, and holes 23c. However, if recess 23e is a frame extending along the periphery of surface 23b, liquid 40a can be more reliably prevented from reaching the region where recesses 23d, 23d1, and holes 23c are provided.

[0054] The dimensions (width and depth), arrangement, number, etc. of the recesses 23e can be appropriately changed depending on the pressure and flow rate of the ejected liquid 40a, the required holding power (adsorption power), etc. For example, these can be appropriately determined by performing experiments and simulations.

[0055] Although the configuration of the chuck 23 has been illustrated above, the chuck 21 may have a similar configuration. For example, the chuck 21 may have a recess 23d (corresponding to an example of a third recess), a recess 23d1, and a hole 23c connected to the exhaust unit 26, and a recess 23e (corresponding to an example of a fourth recess). The recess 23d opens on the surface of the chuck 21 facing the bonded substrate 100 (corresponding to an example of a second surface). The recess 23e opens on the surface of the chuck 21 facing the bonded substrate 100 in a region between the region where the recess 23d, the recess 23d1, and the hole 23c open and the periphery of the surface. Moreover, the recess 23e can have a frame shape and surround the area where the recess 23d, the recess 23d1, and the hole 23c are open. Moreover, the recess 23e can be configured to extend along the periphery of the surface of the chuck 21 on the bonded substrate 100 side. Moreover, the distance between the recess 23e and the periphery of the surface of the chuck 21 facing the bonded substrate 100 can be made shorter than the distance between the recess 23e and the recess 23d.

[0056] However, the configuration of chuck 21 may be different from the configuration of chuck 23. For example, the outer dimensions of chuck 21, and the dimensions, number, and arrangement of recesses 23d, recesses 23d1, holes 23c, and recesses 23e may be different from those of chuck 23.

[0057] For example, as described above, the chuck 23 holds the substrate 102 on the reference side (the substrate 102 on the lower side in the direction of gravity) when separating the bonded substrate 100 into the substrates 101 and 102. For this reason, the dimension of the surface 23b of the chuck 23 in the direction perpendicular to the rotation central axis 1a may be made larger than the dimension of the surface of the chuck 21 on the bonded substrate 100 side (the surface that adsorbs the substrate 101). In this way, the posture of the bonded substrate 100 can be stabilized during separation processing.

[0058] Also, the recess 23e for capturing the liquid 40a may be omitted from the chuck 21. That is, the recess 23e may be provided only in the chuck 23. If the recess 23e is not provided in the chuck 21, the liquid 40a sprayed from the separation unit 40 is likely to penetrate between the chuck 21 and the bonded substrate 100 (substrate 101), and the holding force of the chuck 21 may be weakened. However, as long as the holding force (adsorption force) of the chuck 23 that holds the surface on the lower side in the gravity direction, which is the reference for the separation process, is not reduced, even if the holding force of the chuck 21 is weakened, it is possible to suppress the position of the bonded substrate 100 from shifting relative to the rotation center axis 1a.

[0059] That is, the recess 23e can be provided at least in the chuck 23. However, if the recess 23e is provided in the chuck 23 and the chuck 21, even if the liquid 40a permeates into either the chuck 23 or the chuck 21 and the holding force (adsorption force) of one of the chucks is reduced, it is possible to suppress the position of the bonded substrate 100 from shifting with respect to the rotation central axis 1a.

[0060] FIG. 4 is a schematic perspective view illustrating the configuration of a chuck 123 according to another embodiment. FIG. 5 is a schematic cross-sectional view of the chuck 123 in FIG. 4 taken along the line BB. As shown in FIG. 4 and FIG. 5, the chuck 123 may further include a hole 23e1 in addition to the chuck 23 described above. At least one hole 23e1 may be provided. One end of the hole 23e1 communicates with the recess 23e. For example, one end of the hole 23e1 may communicate with the vicinity of the bottom surface of the recess 23e. The other end of the hole 23e1 opens to the side surface of the chuck 123. When a plurality of holes 23e1 are provided, the plurality of holes 23e1 may be arranged along the side surface of the chuck 123. In this case, the plurality of holes 23e1 may be provided at positions that are rotationally symmetrical with respect to the central axis 23a.

[0061] If the hole 23e1 is provided, the liquid 40a captured in the recess 23e can be easily discharged to the outside of the chuck 123 by centrifugal force. Therefore, the liquid 40a captured in the recess 23e can be further prevented from reaching the recess 23d, the recess 23d1, and the hole 23c, so that the force (adsorption force) for holding the bonded substrate 100 can be further prevented from decreasing. As a result, it is possible to further prevent the position of the bonded substrate 100 relative to the rotation center axis 1a from being shifted, which hinders uniform separation and reduces the separation efficiency, or to further prevent damage to at least one of the substrates 101 and 102.

[0062] When the recess 23e is provided in the chuck 21, the chuck 21 can be provided with a hole 23e1.

[0063] The opening size, arrangement, number, etc. of the holes 23e1 can be appropriately changed according to the pressure and flow rate of the ejected liquid 40a, the required holding power (adsorption power), etc. For example, these can be appropriately determined by performing experiments and simulations.

[0064] 6A and 6B are schematic cross-sectional views illustrating the configurations of chucks 123a and 123b according to other embodiments. As shown in FIG. 6(A), the chuck 123a may further include an inclined surface 23e2 in addition to the above-described chuck 23. The inclined surface 23e2 may be provided on the entire peripheral area of ​​the chuck 123a, or may be provided on a partial area. The inclined surface 23e2 may be a flat surface or a curved surface. The inclined surface 23e2 is inclined in a direction away from the surface 23b as it approaches the peripheral edge of the surface 23b.

[0065] 6B, the chuck 123b may be the chuck 23 described above with a step 23e3 added thereto. The step 23e3 may be provided in the entire peripheral region of the chuck 123b, or may be provided in a partial region. The distance between the surface 23b of the chuck 123b and the step 23e3 is shorter than the distance between the surface 23b of the chuck 123b and the bottom surface of the recess 23e.

[0066] If the inclined surface 23e2 and the step 23e3 are provided, the liquid 40a captured in the recess 23e can be easily discharged to the outside of the chucks 123a and 123b by centrifugal force. Therefore, the liquid 40a captured in the recess 23e can be further prevented from reaching the recess 23d, the recess 23d1, and the hole 23c, so that the force (adsorption force) for holding the bonded substrate 100 can be further prevented from decreasing. As a result, it is possible to further prevent the position of the bonded substrate 100 relative to the rotation center axis 1a from being shifted, which hinders uniform separation and reduces the separation efficiency, or to further prevent damage to at least one of the substrates 101 and 102.

[0067] When the recess 23e is provided in the chuck 21, the chuck 21 may be provided with an inclined surface 23e2 or a step 23e3.

[0068] The dimensions, arrangement, number, etc. of the inclined surface 23e2 and the steps 23e3 can be appropriately changed depending on the pressure and flow rate of the ejected liquid 40a, the required holding power (adsorption power), etc. For example, these can be appropriately determined by performing experiments and simulations. Also, the holes 23e1, the inclined surfaces 23e2, and the steps 23e3 may be used in appropriate combination.

[0069] Next, the operation of the substrate separating apparatus 1, that is, the method of separating the bonded substrate 100, will be described. 7(A) to (H) are schematic views for illustrating the action of the substrate separating apparatus 1. In FIG. FIG. 8 is a flow chart illustrating a procedure for separating the bonded substrate 100. As shown in FIG.

[0070] As shown in FIG. 7(A), when the substrate separating apparatus 1 is started, the pin 31, the arm 32, and the chuck 23 are at their lowermost positions.

[0071] Next, as shown in FIG. 7(B) and step S101 in FIG. Next, as shown in FIG. 7(C) and step S102 in FIG. 8, the arm 32 on which the bonded substrate 100 is placed is raised to a predetermined position.

[0072] 7(D), the chuck 23 moves up and comes into contact with the bonded substrate 100 (substrate 102). At this time, a small gap is formed between the bonded substrate 100 and the arm 32. 7(E) and step S103 in Fig. 8, the bonded substrate 100 is positioned. For example, the pins 31 are moved toward the rotation axis 1a, and the pins 31 press the side surfaces of the bonded substrate 100 to align the center of the bonded substrate 100 with the position of the rotation axis 1a.

[0073] Next, as shown in FIG. 7(F), the multiple pins 31 are moved in a direction away from the rotation central axis 1a. Next, as shown in FIG. 7(G) and step S104 in FIG. 8, the arm 32 is lowered to transfer the bonded substrate 100 to the chuck 23. 7(H) and step S105 in FIG. 8, the chuck 23 is further raised to hold the bonded substrate 100 between the chuck 21 and the chuck 23. At this time, the bonded substrate 100 is vacuum-adsorbed by the chuck 21 and the chuck 23.

[0074] Next, as shown in steps S106 to S113 of FIG. 8, a separation step of the bonded substrate 100 is performed. 9 to 11 are schematic views illustrating the separation of the bonded substrate 100. FIG. It should be noted that the shaded areas in FIGS. 9 to 11 represent separated regions.

[0075] In the process of separating the bonded substrate 100, first, the chuck 21 and the chuck 23 are rotated to rotate the bonded substrate 100 that is attracted and held by the chuck 21 and the chuck 23 (step S106 in FIG. 8).

[0076] Next, as shown in FIG. 9 and steps S107 to S109 in FIG. 8, a separation start step is performed. 9, the nozzle 41 is moved to the vicinity of the periphery of the bonded substrate 100, and liquid 40a is sprayed from the nozzle 41 to a predetermined position on the side of the bonded substrate 100, between the substrates 101 and 102. At this time, since the bonded substrate 100 is rotating, separation can be performed over the entire periphery of the bonded substrate 100.

[0077] Next, as shown in FIGS. 10, 11, and steps S110 to S113 in FIG. 8, separation of the bonded substrate 100 is advanced to separate the bonded substrate 100 into the substrate 101 and the substrate 102. As shown in FIG. 8, the nozzle 41 is moved to follow the separated region, and separation can be performed in the region between the periphery and the central region of the bonded substrate 100. Then, as shown in FIG. 11, the liquid 40a is sprayed from the nozzle 41 toward the center of the bonded substrate 100, and separation can be performed in the central region of the substrate 100.

[0078] In such a separation process of the bonded substrate 100, the nozzle 41 can be moved in an arc-shaped trajectory from a separation start position to a separation position at the center of the bonded substrate 100, as shown in Fig. 9. In addition, the nozzle 41 is moved so that the distance d between the nozzle 41 and the bonded substrate 100 is approximately constant. If the nozzle 41 is moved so that the distance d is approximately constant, the ejection port 41a of the nozzle 41 can be brought as close as possible to the side surface of the bonded substrate 100.

[0079] Moreover, since the liquid 40a is sprayed while the nozzle 41 is moved along the above-mentioned arc-shaped trajectory, the liquid 40a is sprayed toward a region Ra that is a part of the periphery of the bonded substrate 100. The region Ra is a region that includes an arc with a central angle of 90 degrees on the periphery of the bonded substrate 100. Moreover, since the bonded substrate 100 is rotating during separation of the region Ra, separation can be performed in the entire region of the bonded substrate 100.

[0080] As described above, the liquid 40a that has entered between the chuck 23 and the substrate 102 is captured by the recess 23e and is discharged by centrifugal force to the outside of the chuck 23. Therefore, it is possible to suppress a decrease in the force (adsorption force) that holds the bonded substrate 100 (substrate 102).

[0081] Moreover, when the recess 23e is also provided in the chuck 21, the liquid 40a that has entered between the chuck 21 and the substrate 101 is captured by the recess 23e and is discharged by centrifugal force to the outside of the chuck 21. Therefore, it is possible to suppress a decrease in the force (adsorption force) that holds the bonded substrate 100 (substrate 101).

[0082] 11 and steps S112 to S114 in FIG. 8, when separation has progressed to the center of the bonded substrate 100, spraying of the liquid 40a from the nozzle 41 is stopped. After separation of the bonded substrate 100 is completed, the nozzle 41 returns to a standby position separated from the bonded substrate 100 (see FIG. 9). Then, the rotation of the chucks 21 and 23 is stopped, thereby stopping the rotation of the bonded substrate 100 that has been separated. Thereafter, the vacuum suction of the chucks 21 and 23 is released, and the steps illustrated in FIGS. 7(B) to (H) are carried out in the reverse order starting from the step in FIG. 7(H). Then, the bonded substrate 100 which has been separated is carried out from the substrate separating apparatus 1 by the carrying device 200. In this manner, the bonded substrate 100 can be separated.

[0083] Although the embodiments have been described above, the present invention is not limited to these descriptions. With respect to the above-described embodiments, those skilled in the art may add or remove components or modify the design, or add or omit processes or change conditions, as appropriate, and these are also included within the scope of the present invention as long as they incorporate the characteristics of the present invention. For example, the shape, size, material, arrangement, and the like of each element included in the substrate separating apparatus 1 are not limited to those exemplified, and can be changed as appropriate. Furthermore, the elements of each of the above-described embodiments can be combined to the greatest extent possible, and combinations of these are also included within the scope of the present invention as long as they include the features of the present invention. [Explanation of symbols]

[0084] 1 Substrate separation device, 1a rotation axis, 20 holding part, 21 chuck, 23 chuck, 23b surface, 23c hole, 23d recess, 23d1 recess, 23e recess, 23e1 hole, 23e2 inclined surface, 23e3 step, 24 drive part, 26 exhaust part, 30 positioning part, 40 separation part, 40a liquid, 41 nozzle, 42 liquid supply part, 50 controller, 100 bonded substrate, 101 substrate, 102 substrate, 123 chuck, 123a chuck, 123b chuck

Claims

1. a first chuck for suction-holding one surface of a bonded substrate formed by bonding a pair of substrates; a second chuck for suction-holding the other surface of the bonded substrate; an exhaust connected to the first chuck and the second chuck; A drive unit that rotates the first chuck and the second chuck; A nozzle for spraying a liquid onto a side surface of the bonded substrate; Equipped with the first chuck has a first recess connected to the exhaust section and a second recess; The first recess opens to a first surface of the first chuck on the bonded substrate side, A substrate separating apparatus, wherein the second recess opens in a region of the first surface between a region where the first recess opens and a periphery of the first surface.

2. 2. The substrate separating apparatus according to claim 1, wherein the first chuck further includes a hole having one end connected to the second recess and the other end opening to a side surface of the first chuck.

3. 3. The substrate separating apparatus according to claim 1, wherein the second recess has a frame shape and surrounds an area where the first recess is open.

4. The substrate separating apparatus according to claim 1 , wherein the second recess extends along a periphery of the first surface.

5. 3. The substrate separating apparatus according to claim 1, wherein a distance between the second recess and a periphery of the first surface is shorter than a distance between the second recess and the first recess.

6. the second chuck has a third recess connected to the exhaust section and a fourth recess, The third recess opens to a second surface of the second chuck on the bonded substrate side, 2. The substrate separating apparatus according to claim 1, wherein the fourth recess is open to a region of the second surface between a region where the third recess is open and a periphery of the second surface.

7. 7. The substrate separating apparatus according to claim 6, wherein the second chuck further includes a hole having one end connected to the fourth recess and the other end opening to a side surface of the second chuck.

8. 8. The substrate separating apparatus according to claim 6, wherein the fourth recess has a frame shape and surrounds an area where the third recess is open.

9. The substrate separating apparatus according to claim 6 or 7, wherein the fourth recess extends along a periphery of the second surface.

10. 8. The substrate separating apparatus according to claim 6, wherein a distance between the fourth recess and a periphery of the second surface is shorter than a distance between the fourth recess and the third recess.

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