Multilayer electronic component

Abstract

To provide a multilayer electronic component that has excellent reliability, upper and lower parts made easily distinguishable while reducing acoustic noise.SOLUTION: A stacked electronic component includes: a body that includes a capacitance formation part including a dielectric layer and an internal electrode arranged alternately with the dielectric layer in a first direction, an upper cover part arranged above the capacitance formation part in the first direction, a lower cover part arranged below the capacitance formation part in the first direction, and an identification part arranged above the upper cover part in the first direction; and an external electrode arranged on the body. An average thickness of the lower cover part may be greater than that of the upper cover part. The identification part may include a water-repellent substance and a non-conductive heat-resistant paint.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multi-Layered Ceramic Capacitor (MLCC), a type of multi-layered electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones to charge and discharge electricity.

[0003] Multilayer ceramic capacitors have the advantages of being small yet having high capacitance and being easy to mount, and therefore can be used as components of various electronic devices. As various electronic devices such as computers and mobile devices become smaller and have higher output, there is an increasing demand for smaller multilayer ceramic capacitors with higher capacitance.

[0004] When DC and AC voltages are applied to a multilayer ceramic capacitor having overlapping internal electrodes sandwiching dielectric layers, a piezoelectric phenomenon occurs between the internal electrodes, generating vibrations.

[0005] The vibration tends to be more pronounced when the dielectric constant of the dielectric layer is higher and the chip size is relatively large for the same capacitance. The vibration is transmitted from the external electrodes of the multilayer ceramic capacitor to the printed circuit board on which the multilayer ceramic capacitor is mounted. At this time, the printed circuit board vibrates, generating noise.

[0006] That is, when the noise generated by the vibration of the printed circuit board is within the audible frequency range (20 to 20,000 Hz), the vibration noise gives people an unpleasant sensation. Such a sound is called acoustic noise.

[0007] In order to reduce such acoustic noise, a technology has been developed in which the lower part of the capacitance forming part is laminated thickly and a light cover is placed under the capacitance forming part in addition to a lower cover part to identify the lower part of the capacitance forming part.

[0008] However, in order to realize the sensitivity required to identify the lower part of the capacitance forming part, the light cover must be made thick, which reduces design freedom, and since it is not easy to ensure the thickness of the upper cover part, there are problems in that the moisture resistance reliability is reduced.

[0009] Therefore, there is a need to develop a structure that can ensure reliable moisture resistance while reducing acoustic noise. [Prior art documents] [Patent documents]

[0010] [Patent Document 1] Korean Patent Publication No. 10-2014-0012577 Summary of the Invention [Problem to be solved by the invention]

[0011] One of the various objects of the present invention is to provide a multilayer electronic component having excellent reliability.

[0012] Among the various objects of the present invention is to reduce acoustic noise in laminated electronic components.

[0013] One of the various objects of the present invention is to easily distinguish between the upper and lower portions of a laminated electronic component.

[0014] However, the object of the present invention is not limited to the above-mentioned contents, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0015] A multilayer electronic component according to one embodiment of the present invention includes a main body including a capacitance forming portion including a dielectric layer and internal electrodes arranged alternately with the dielectric layer in a first direction, an upper cover portion arranged at an upper portion of the capacitance forming portion in the first direction, a lower cover portion arranged at a lower portion of the capacitance forming portion in the first direction, and an identification portion arranged at an upper portion of the upper cover portion in the first direction, and an external electrode arranged on the main body, wherein an average thickness of the lower cover portion is greater than an average thickness of the upper cover portion, and the identification portion may include a water-repellent material and a non-conductive heat-resistant paint. Effect of the Invention

[0016] One of the various effects of the present invention is that it is possible to improve the moisture resistance reliability of a multilayer electronic component.

[0017] One of the various effects of the present invention is that it can reduce acoustic noise in multilayer electronic components.

[0018] One of the advantages of the present invention is that it allows easy distinction between the upper and lower parts of a multilayer electronic component.

[0019] However, the various yet significant advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief description of the drawings]

[0020] [Figure 1] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Diagram 2] 2 is a schematic cross-sectional view taken along line II' of FIG. 1. [Diagram 3] 2 is a schematic cross-sectional view taken along line II-II' in FIG. 1. [Figure 4] 1 is a diagram showing a multilayer electronic component according to another embodiment of the present invention, the diagram corresponding to FIG. 2. [Diagram 5] FIG. 1 is a schematic perspective view of a conventional multilayer electronic component. [Figure 6] FIG. 6 is a schematic cross-sectional view taken along line III-III' in FIG. 5. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] Hereinafter, the embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention may be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0022] In addition, in the drawings, parts that are not relevant to the description are omitted in order to clearly explain the present invention, and the size and thickness of each component shown in the drawings are arbitrarily shown for the convenience of explanation, so the present invention is not necessarily limited by the drawings. Furthermore, components having the same function within the same concept are described using the same reference numerals. Furthermore, throughout the specification, when a part "includes" a certain component, it does not mean that the part excludes other components, but that the part may further include other components, unless otherwise specified to the contrary.

[0023] In the drawings, the first direction can be defined as the stacking direction or thickness (T) direction, the second direction can be defined as the length (L) direction, and the third direction can be defined as the width (W) direction.

[0024] Multilayer Electronic Components FIG. 1 is a schematic perspective view of a multilayer electronic component according to one embodiment of the present invention, FIG. 2 is a schematic cross-sectional view taken along line I-I' in FIG. 1, and FIG. 3 is a schematic cross-sectional view taken along line II-II' in FIG. 1.

[0025] A multilayer electronic component 100 according to one embodiment of the present invention will be described in detail below with reference to Figures 1 to 3. Also, a multilayer ceramic capacitor (hereinafter referred to as "MLCC") will be described as an example of the multilayer electronic component, but the present invention is not limited thereto.

[0026] A multilayer electronic component 100 according to one embodiment of the present invention includes a main body 110 including a capacitance forming portion Ac including a dielectric layer 111 and internal electrodes 121, 122 arranged alternately with the dielectric layer in a first direction, an upper cover portion 112 arranged at an upper portion of the capacitance forming portion in the first direction, a lower cover portion 113 arranged at a lower portion of the capacitance forming portion in the first direction, and an identification portion 140 arranged at an upper portion of the upper cover portion in the first direction, and external electrodes 131, 132 arranged on the main body, wherein an average thickness tc2 of the lower cover portion is greater than an average thickness tc1 of the upper cover portion, and the identification portion 140 may include a water-repellent material and a non-conductive heat-resistant paint.

[0027] FIG. 5 is a schematic perspective view of a conventional multilayer electronic component 200, and FIG. 6 is a schematic cross-sectional view taken along line III-III' in FIG.

[0028] 5 and 6, in the conventional multilayer electronic component 200, the lower part of the capacitance forming part Ac is laminated thickly in order to reduce acoustic noise, and in addition to a lower cover part 213 having the same composition as the active part, a light cover 214 for identifying the lower part of the capacitance forming part is disposed below the capacitance forming part, thereby distinguishing the upper and lower parts of the multilayer electronic component 200.

[0029] However, in order to achieve the sensitivity required to distinguish between the upper and lower parts of the multilayer electronic component 200, the light cover 214 must be made thicker than the lower cover part 213 as shown in FIG. 6, which reduces the degree of freedom in design. In addition, it is not easy to ensure the thickness of the upper cover part 212, which reduces the moisture resistance reliability.

[0030] Meanwhile, in the present invention, by disposing an identification part 140 including a water-repellent material and a non-conductive heat-resistant paint on the upper part of the first direction of the upper cover part 112, it is possible to reduce acoustic noise while ensuring moisture resistance reliability.

[0031] Hereinafter, each component included in the multilayer electronic component 100 according to one embodiment of the present invention will be described.

[0032] The body 110 may have dielectric layers 111 and internal electrodes 121 and 122 stacked alternately.

[0033] Although there is no particular limitation on the specific shape of the body 110, the body 110 may be hexahedral or a similar shape as shown in the figure. Due to shrinkage of the ceramic powder contained in the body 110 during the firing process, the body 110 may not be a hexahedral shape with perfectly straight lines, but may be substantially hexahedral.

[0034] The main body 110 may have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4, and facing each other in the third direction.

[0035] As a marginal region where the internal electrodes 121 and 122 are not disposed overlaps the dielectric layer 111, a step is generated due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface and the third to fifth surfaces and / or the corners connecting the second surface and the third to fifth surfaces may have a shape that is shrunk toward the center in the first direction of the main body 110 when viewed based on the first surface or the second surface. Alternatively, due to a shrinkage behavior during the sintering process of the main body, the corners connecting the first surface 1 and the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 and / or the corners connecting the second surface 2 and the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 may have a shape that is shrunk toward the center in the first direction of the main body 110 when viewed based on the first surface or the second surface. Alternatively, in order to prevent chipping defects, the corners connecting each surface of the body 110 may be rounded through a separate process, so that the corners connecting the first surface and the third to sixth surfaces and / or the corners connecting the second surface and the third to sixth surfaces may have a rounded shape.

[0036] On the other hand, in order to suppress steps caused by the internal electrodes 121, 122, if the internal electrodes are cut after lamination so as to be exposed on the fifth surface 5 and the sixth surface 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated in the third direction (width direction) on both side surfaces of the capacitance forming portion Ac to form margin portions 114, 115, the portions connecting the first surface to the fifth surface and the sixth surface and the portions connecting the second surface to the fifth surface and the sixth surface may not have a contracted shape.

[0037] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM). There is no particular need to limit the number of laminated dielectric layers, and this can be determined in consideration of the size of the laminated electronic component. For example, the main body can be formed by laminating 400 or more dielectric layers.

[0038] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate (BaTiO3)-based powder can be used as the ceramic powder. More specifically, the ceramic powder can be one or more of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1).

[0039] The average thickness td of the dielectric layer 111 does not need to be particularly limited and can be arbitrarily set according to desired characteristics and applications. For example, it can be 100 μm or less.

[0040] Here, the average thickness td of the dielectric layer 111 means the size in the first direction of the dielectric layer 111 disposed between the internal electrodes 121 and 122. The average thickness of the dielectric layer 111 can be measured by scanning the cross-sections in the first and second directions of the main body 110 with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the thickness can be measured at a number of points of one dielectric layer 111, for example, 30 points at equal intervals in the second direction, and the average value can be measured. The 30 points at equal intervals can be specified by the capacitance forming portion Ac described later. Also, by extending such average value measurement to 10 dielectric layers 111 and measuring the average value, the average thickness of the dielectric layer 111 can be further generalized.

[0041] The body 110 may include a capacitance forming portion Ac in which a capacitance is formed, the capacitance forming portion Ac including a first internal electrode 121 and a second internal electrode 122 arranged to face each other across a dielectric layer 111, and cover portions 112, 113 formed at the upper and lower portions of the capacitance forming portion Ac in a first direction.

[0042] The capacitance forming portion Ac is a portion that contributes to forming the capacitance of the capacitor, and may be formed by repeatedly stacking a plurality of first internal electrodes 121 and second internal electrodes 122 with the dielectric layer 111 interposed therebetween.

[0043] The cover parts 112 and 113 may include an upper cover part 112 disposed at an upper part of the capacitance forming part Ac in the first direction and a lower cover part 113 disposed at a lower part of the capacitance forming part Ac in the first direction.

[0044] The upper cover part 112 and the lower cover part 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the capacitance forming part Ac in the thickness direction, respectively, and may basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0045] The upper cover part 112 and the lower cover part 113 do not include an internal electrode and may include the same material as the dielectric layer 111 .

[0046] That is, the upper cover part 112 and the lower cover part 113 may include a ceramic material, for example, a barium titanate (BaTiO3) based ceramic material.

[0047] In one embodiment, the average thickness tc2 of the lower cover portion 113 may be greater than the average thickness tc1 of the upper cover portion 112. This can reduce acoustic noise.

[0048] In one embodiment, when the average thickness of the upper cover part is tc1, the average thickness of the lower cover part is tc2, and the average thickness of the identification part is tc3, (tc1+tc3) / tc2 may be less than or equal to 0.85. If tc1 / tc2 exceeds 0.85, the effect of reducing acoustic noise may be insufficient.

[0049] Furthermore, tc1 / tc2 may be 0.43 or more and 0.85 or less. If tc1 / tc2 exceeds 0.85, the effect of reducing acoustic noise is insufficient, and if it is less than 0.43, there is a risk of reduced moisture resistance reliability.

[0050] Here, the average thickness tc1 of the upper cover part 112 may mean the average size of the upper cover part 112 in the first direction, and the average thickness tc2 of the lower cover part 113 may mean the average size of the lower cover part 113 in the first direction.

[0051] On the other hand, there is no need to particularly limit the average thickness tc1 of the upper cover portion and the average thickness tc2 of the lower cover portion, and they can be appropriately selected depending on the size of the multilayer electronic component.

[0052] For example, when the multilayer electronic component is 1005 size (length 1.0 mm, width 0.5 mm), the average thickness of the upper cover part may be 58 μm or more and 88 μm or less, and the average thickness of the lower cover part may be 104 μm or more and 134 μm or less.

[0053] If the average thickness of the upper cover portion is less than 58 μm, there is a risk that the moisture resistance reliability will decrease, and if it exceeds 88 μm, there is a risk that the thickness of the multilayer electronic component will be too thick.

[0054] If the average thickness of the lower cover portion is less than 104 μm, the effect of reducing acoustic noise is insufficient, and if it exceeds 134 μm, the thickness of the multilayer electronic component may be too thick.

[0055] In one embodiment, when the average thickness of the capacitance forming portion is tac and the average thickness of the lower cover portion is tc2, tac / tc2 may be 4 or more and 7 or less.

[0056] The identification unit 140 is disposed on the upper portion of the upper cover unit 112 in the first direction, and may include a water repellent material and a non-conductive heat resistant paint.

[0057] If the lower cover part 113 is made thicker than the upper cover part 112 in order to reduce acoustic noise, most of the moisture resistance reliability may occur in the upper cover part because the moisture penetration path in the upper cover part 112 is short. According to an embodiment of the present invention, the identification part 140 includes a water repellent material and is disposed on the upper cover part 112, which is thinner than the lower cover part, thereby blocking the moisture penetration path and improving the moisture resistance reliability.

[0058] Furthermore, when the light cover 214 is used to distinguish between the upper and lower parts of the multilayer electronic component 100, the light cover 214 is generally formed by laminating one or more dielectric layers to which an element for realizing different hues is added. However, in order to ensure the sensitivity for distinguishing between the upper and lower parts, the light cover 214 needs to be thick, and therefore the light cover 214 must be positioned below the multilayer electronic component 100, which reduces the design freedom of the multilayer electronic component.

[0059] Meanwhile, according to an embodiment of the present invention, the identification portion 140 includes a non-conductive heat-resistant paint, so that the upper and lower portions of the multilayer electronic component 100 can be identified with a thin thickness, thereby replacing the conventional thick light cover 214.

[0060] In one embodiment, when the average thickness of the upper cover part is tc1 and the average thickness of the identification part is tc3, tc3 / tc1 may be 0.21 or more and 0.83 or less. If tc3 / tc1 exceeds 0.83, the effect of reducing acoustic noise is insufficient, and if it is less than 0.21, the moisture resistance reliability may be reduced.

[0061] As an example of a method for measuring tc3, tc1, tac, and tc2, the above-mentioned can be measured on a cross section cut in the first and second directions from the center of the third direction of the main body as shown in FIG. 2. An optical microscope, a scanning electron microscope, etc. can be used as the measuring equipment. The first-direction sizes of the identifier 140, the upper cover part 112, the capacitance forming part Ac, and the lower cover part 113 can be measured at five points equally spaced in the second direction on the cross sections in the first and second directions, and the average values ​​of the first-direction sizes can be calculated to obtain tc3, tc1, tac, and tc2. The first-direction size of the upper cover part can be the size in the first direction from the interface with the identifier 140 to the internal electrode arranged at the top in the first direction, and the first-direction size of the lower cover part can be the size in the first direction from the first surface to the internal electrode arranged at the bottom in the first direction.

[0062] In the present invention, the non-conductive heat-resistant paint contained in the identification portion 140 may refer to a material that does not become electrically conductive while maintaining its existing color even when heat-treated at a temperature of 100°C or more and 1400°C or less.

[0063] In one embodiment, the non-conductive heat-resistant paint included in the identification portion 140 may have a different brightness or color from that of the lower cover portion 113. Also, the non-conductive heat-resistant paint included in the identification portion 140 may have a different brightness or color from that of the upper cover portion 112.

[0064] A specific example of the non-conductive heat-resistant paint contained in the identification unit 140 is one that contains one or more of Ba, Si, and Al. Furthermore, the non-conductive heat-resistant paint may contain an inorganic ceramic element even if it does not contain Ba, Si, or Al. This allows the light cover 214 to achieve sensitivity equal to or greater than that of the conventional thick light cover 214, even if it is thin.

[0065] In the present invention, the water-repellent material contained in the recognition unit 140 may refer to a material having a contact angle with water of 100 degrees or more.

[0066] In one embodiment, the water-repellent material included in the identifier 140 includes one or more of silicon (Si) and fluorine (F), which allows the identifier 140 to have water-repellent properties. More specifically, the identifier 140 may include one or more of a silicon-based hydrocarbon compound and a fluorine-based hydrocarbon compound.

[0067] The method of forming the identification portion 140 does not need to be particularly limited, and for example, it can be formed by mixing a non-conductive heat-resistant paint and a water-repellent material and then applying the mixture to the upper portion of the first direction of the upper cover portion 112.

[0068] In one embodiment, the identification portion 140 may be disposed to cover the entire upper portion of the upper cover portion 112 in the first direction.

[0069] However, the present invention is not limited to this. Referring to FIG. 4, which is a drawing corresponding to FIG. 2, as a multilayer electronic component according to another embodiment of the present invention, the identification unit 140 is arranged to cover only a portion of the upper part in the first direction of the upper cover part 112, and the area of ​​the upper part in the first direction of the upper cover part 112 that is not covered by the identification unit 140 can be covered by the external electrodes 131, 132.

[0070] More specifically, the main body 110 includes a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in the third direction, the external electrodes 131, 132 are disposed on the third surface and the fourth surface and extend to parts of the first surface, the second surface, the fifth surface and the sixth surface, and the identification unit 140 is disposed in an area of ​​the second surface that is not covered by the external electrodes 131, 132.

[0071] Moreover, margin portions 114 and 115 can be disposed on the side surfaces of the capacitance forming portion Ac.

[0072] The margin portions 114, 115 may include a first margin portion 114 disposed on the fifth surface 5 of the body 110 and a second margin portion 115 disposed on the sixth surface 6. That is, the margin portions 114, 115 may be disposed on both end surfaces of the ceramic body 110 in the width direction.

[0073] The margin portions 114, 115 may refer to the regions between both ends of the first internal electrode 121 and the second internal electrode 122 and the boundary surface of the body 110 in a cross-section of the body 110 cut in the width-thickness (WT) direction, as shown in FIG. 3.

[0074] The margins 114 and 115 essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0075] The margin portions 114 and 115 may be formed by applying a conductive paste to the ceramic green sheet except for the areas where the margin portions are to be formed, to form internal electrodes.

[0076] In addition, in order to suppress steps caused by the internal electrodes 121, 122, the laminated internal electrodes can be cut so as to be exposed on the fifth surface 5 and the sixth surface 6 of the main body, and then a single dielectric layer or two or more dielectric layers can be laminated in the third direction (width direction) on both side surfaces of the capacitance forming portion Ac to form margin portions 114, 115.

[0077] On the other hand, there is no need to particularly limit the width of the marginal portions 114, 115. However, in order to more easily achieve a smaller size and higher capacity of the multilayer electronic component, the average width of the marginal portions 114, 115 can be 600 μm or less.

[0078] The average width of the margin portions 114, 115 may mean the average size in the third direction of the region where the internal electrode is spaced from the fifth surface and the average size in the third direction of the region where the internal electrode is spaced from the sixth surface, and may be the average value of the sizes in the third direction of the margin portions 114, 115 measured at five equally spaced points on the side of the capacitance forming portion Ac.

[0079] Therefore, in one embodiment, the average size in the third direction of the regions where the internal electrodes 121 and 122 are spaced apart from the fifth and sixth faces may be 600 μm or less.

[0080] The internal electrodes 121, 122 may include a first internal electrode 121 and a second internal electrode 122. The first internal electrodes 121 and the second internal electrodes 122 are alternately arranged to face each other with the dielectric layer 111 constituting the main body 110 interposed therebetween, and may be exposed to a third surface 3 and a fourth surface 4 of the main body 110, respectively.

[0081] The first internal electrode 121 may be spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and exposed through the fourth surface 4. A first external electrode 131 may be disposed on the third surface 3 of the body and connected to the first internal electrode 121, and a second external electrode 132 may be disposed on the fourth surface 4 of the body and connected to the second internal electrode 122.

[0082] That is, the first internal electrode 121 is connected to the first external electrode 131 but not to the second external electrode 132, and the second internal electrode 122 is connected to the second external electrode 132 but not to the first external electrode 131. Therefore, the first internal electrode 121 may be formed to be spaced apart by a certain distance on the fourth surface 4, and the second internal electrode 122 may be formed to be spaced apart by a certain distance on the third surface 3. In addition, the first internal electrode 121 and the second internal electrode 122 may be disposed to be spaced apart from the fifth and sixth surfaces of the body 110.

[0083] The conductive metal contained in the internal electrodes 121, 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but the present invention is not limited thereto.

[0084] The average thickness te of the internal electrodes does not need to be particularly limited. In this case, the thickness of the internal electrodes 121, 122 may refer to the size of the internal electrodes 121, 122 in the first direction. For example, the average thickness te of the internal electrodes may be 0.05 μm to 3.0 μm.

[0085] Here, the average thickness te of the internal electrodes may be measured by scanning the cross sections of the body 110 in the first and second directions with a scanning electron microscope (SEM) with a magnification of 10,000. More specifically, the thickness may be measured at a number of points of one internal electrode 121, 122, for example, 30 points equally spaced in the second direction, and an average value may be measured. The 30 equally spaced points may be designated as the capacitance forming portion Ac. Furthermore, if such an average value measurement is extended to 10 internal electrodes 121, 122 to measure the average value, the average thickness of the internal electrodes 121, 122 may be further generalized.

[0086] The external electrodes 131 , 132 may be disposed on the body 110 .

[0087] As a specific example, the external electrodes 131, 132 may be disposed on the third surface 3 and the fourth surface 4 of the body 110. The external electrodes 131, 132 may include a first external electrode 131 and a second external electrode 132 disposed on the third surface 3 and the fourth surface 4 of the body 110, respectively, and connected to the first internal electrode 121 and the second internal electrode 122, respectively.

[0088] In this embodiment, a structure in which the multilayer electronic component 100 has two external electrodes 131, 132 is described, but the number and shapes of the external electrodes 131, 132 can be changed depending on the configuration of the internal electrodes 121, 122 and other purposes.

[0089] Meanwhile, the external electrodes 131 and 132 may be formed using any material having electrical conductivity, such as a metal, and the specific material may be determined taking into consideration electrical characteristics, structural stability, etc., and may further have a multi-layer structure.

[0090] For example, the external electrodes 131 and 132 may include electrode layers 131a and 132a disposed on the body 110 and plating layers 131b and 132b formed on the electrode layers 131a and 132a.

[0091] As a more specific example of the electrode layers 131a and 132a, the electrode layers 131a and 132a may be firing electrodes including a conductive metal and glass, or resin-based electrodes including a conductive metal and resin.

[0092] The electrode layers 131a and 132a may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body, and may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto the fired electrode.

[0093] The conductive metal contained in the electrode layers 131a and 132a may be any material having excellent electrical conductivity, and is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof.

[0094] The plating layers 131b and 132b serve to improve mounting characteristics. The type of the plating layers 131b and 132b is not particularly limited, and may be a plating layer containing one or more of Ni, Sn, Pd, and alloys thereof, and may be formed of multiple layers.

[0095] As a more specific example of the plating layers 131b, 132b, the plating layers 131b, 132b may be Ni plating layers or Sn plating layers, and may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layers 131a, 132a, or in a form in which a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. The plating layers 131b, 132b may also include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0096] (Experimental Example) Sample chips were prepared by varying the average thickness tc3 of the identification portion, the average thickness tc1 of the upper cover portion, and the average thickness tc2 of the lower cover portion, and then the moisture resistance reliability and acoustic noise were evaluated. The results are shown in Table 1 below.

[0097] For the moisture resistance reliability, 1,200 sample chips were prepared for each test number, and then the sample chips were mounted on three boards, each with 20 channels and 20 chips per channel, i.e., 400 chips per board. After that, a voltage of 1.2 Vr was applied for 24 hours at a temperature of 85°C and a relative humidity of 85%, and sample chips whose insulation resistance value had fallen to 5 orders of magnitude or less compared to the initial value were judged to be defective, and the number of sample chips judged to be defective was recorded.

[0098] Acoustic noise was measured using GRAS' 40HF equipment under the following conditions: DC-BIAS 3V, AC Voltage (Peak to Peak): 1Vp-p, Frequency: 400Hz~20kHz (Sine Sweep), 400Hz~10kHz (low freq.), 400Hz~20kHz (all freq.).

[0099] [Table 1]

[0100] Referring to Table 1 above, it can be seen that when tc3 / tc1 is less than 0.21, poor moisture resistance reliability occurs, and when it exceeds 0.83, the acoustic noise exceeds 29 dB, and the acoustic noise suppression effect is insufficient.

[0101] On the other hand, it can be confirmed that in test numbers 5 to 9 in which tc3 / tc1 was 0.21 or more and 0.83 or less, no failure in moisture resistance reliability occurred and acoustic noise was also suppressed.

[0102] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments and the accompanying drawings, but is limited by the scope of the accompanying claims. Therefore, various substitutions, modifications, and changes can be made by a person having ordinary knowledge in the art within the scope of the technical idea of ​​the present invention described in the claims, and these also belong to the scope of the present invention.

[0103] In addition, the expression "one embodiment" used in the present disclosure does not mean the same embodiment, but is provided to emphasize and describe each unique feature that is different from the others. However, the above-mentioned one embodiment does not exclude being realized in combination with the features of another embodiment. For example, even if a matter described in a specific embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description that is opposite or contradictory to the matter in the other embodiment.

[0104] The terms used in the present disclosure are merely used to describe one embodiment and are not intended to limit the present disclosure. In this case, a singular expression includes a plural expression unless the context clearly indicates otherwise. [Explanation of symbols]

[0105] 100 Multilayer electronic components 110 Main unit 111 Dielectric layer 112 Upper cover part 113 Lower cover part 140 Identification unit 114, 115 Margin 121, 122 Internal electrode 131, 132 External electrode 131a, 132a electrode layer 131b, 132b plating layer

Claims

1. a main body including a capacitance forming portion including a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction, an upper cover portion arranged at an upper portion of the capacitance forming portion in the first direction, a lower cover portion arranged at a lower portion of the capacitance forming portion in the first direction, and an identification portion arranged at an upper portion of the upper cover portion in the first direction; an external electrode disposed on the body; the average thickness of the lower cover portion is greater than the average thickness of the upper cover portion; The identification portion includes a water-repellent material and a non-conductive heat-resistant paint.

2. 2. The multilayer electronic component according to claim 1, wherein tc3 / tc1 is equal to or greater than 0.21 and equal to or less than 0.83, where tc1 is an average thickness of said upper cover portion and tc3 is an average thickness of said identification portion.

3. 2. The multilayer electronic component according to claim 1, wherein, when an average thickness of the upper cover portion is tc1, an average thickness of the lower cover portion is tc2, and an average thickness of the identification portion is tc3, (tc1+tc3) / tc2 is 0.43 or more and 0.85 or less.

4. 2. The multilayer electronic component according to claim 1, wherein tac / tc2 is 4 or more and 7 or less, where tac is an average thickness of said capacitance forming portion and tc2 is an average thickness of said lower cover portion.

5. 2. The multilayer electronic component according to claim 1, wherein the average thickness of the identification portion is 10 μm or more and 40 μm or less.

6. 2. The multilayer electronic component according to claim 1, wherein the upper cover portion has an average thickness of 58 μm or more and 88 μm or less.

7. 2. The multilayer electronic component according to claim 1, wherein the average thickness of the lower cover portion is 104 μm or more and 134 μm or less.

8. The multilayer electronic component according to claim 1 , wherein the non-conductive heat-resistant paint has a different brightness or color from that of the lower cover portion.

9. 2. The multilayer electronic component according to claim 1, wherein the non-conductive heat-resistant paint contains at least one of Ba, Si, Al, and inorganic ceramic elements.

10. The multilayer electronic component according to claim 1 , wherein the water-repellent material contains at least one of Si and F.

11. 2. The multilayer electronic component according to claim 1, wherein the water repellent material includes at least one of a silicon-based hydrocarbon compound and a fluorine-based hydrocarbon compound.

12. The multilayer electronic component according to claim 1 , wherein the identification portion is disposed so as to cover an entire upper portion of the upper cover portion in the first direction.

13. 2. The multilayer electronic component according to claim 1, wherein the identification portion is arranged to cover only a portion of an upper portion of the upper cover portion in the first direction, and an area of ​​the upper portion of the upper cover portion in the first direction that is not covered by the identification portion is covered by the external electrode.

14. the main body includes a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, and facing each other in the third direction, 14. The multilayer electronic component according to claim 1, wherein the external electrodes are arranged on the third surface and the fourth surface and extend onto parts of the first surface, the second surface, the fifth surface, and the sixth surface, and the identification portion is arranged in a region of the second surface that is not covered by the external electrodes.

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