Chamfering device, chamfering method and monocrystalline silicon block manufacturing method

Abstract

To provide a chamfering device that can easily chamfer an outer peripheral edge on an end face of a columnar block, a chamfering method and a monocrystalline silicon block manufacturing method.SOLUTION: A chamfering device has: a drive rotor which rotates a columnar block by transmitting circumferential rotational force to the outer peripheral surface of the block; a processing tool for processing the block; and a mobile device which moves the processing tool in an axial direction with respect to the block according to a position of the block in the axial direction. The chamfering device chamfers the outer peripheral edge of the end face of the block by the processing tool and the mobile device while rotating the block by the drive rotor.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a chamfering device, a chamfering method, and a method for manufacturing a single crystal silicon block. [Background technology]

[0002] 2. Description of the Related Art There is known a chamfering device having a machining tool for machining a block and a moving device for moving the machining tool relative to the block (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2009-233794 A Summary of the Invention [Problem to be solved by the invention]

[0004] It may be preferable if the outer peripheral edge of the end face of the cylindrical block can be easily chamfered.

[0005] SUMMARY OF THE PRESENT DISCLOSURE An object of the present invention is to provide a chamfering device, a chamfering method, and a method for manufacturing a single crystal silicon block, which are capable of easily chamfering the outer peripheral edge of the end face of a cylindrical block. [Means for solving the problem]

[0006] One aspect of the present invention is as follows.

[0007] [1] a driving rotor that rotates a cylindrical block by transmitting a rotational force in a circumferential direction to an outer peripheral surface of the block; A processing tool for processing the block; a moving device that moves the machining tool in the axial direction relative to the block in accordance with an axial position of the block, a chamfering device that chamfers an outer peripheral edge of an end face of the block using the processing tool and the moving device while rotating the block using the driving rotor.

[0008] [2] The chamfering device described in [1], wherein the outer peripheral surface of the block is placed on the driving rotor.

[0009] [3] a rotor drive device that rotates the drive rotor, The chamfering device according to [1] or [2], wherein the rotor drive device can rotate the drive rotor to either one side or the other side.

[0010] [4] The chamfering device described in any one of [1] to [3], further comprising a lower driven rotor which is another rotor that is positioned offset in the circumferential direction of the block with respect to the driving rotor, on which the outer peripheral surface of the block is placed and which follows the outer peripheral surface of the block.

[0011] [5] the processing tool is a grindstone having a flat processing surface for chamfering the block, The chamfering device according to any one of [1] to [4], further comprising a grindstone driving device that rotates the machining tool around a rotation axis perpendicular to the machining surface, and an oscillating device that oscillates the machining tool parallel to the machining surface.

[0012] [6] A chip collection port located below the machining tool; a processing tool cover that covers the processing tool and guides chips generated by chamfering by the processing tool to the chip collection port, The chamfering device according to any one of [1] to [5], wherein the processing tool is moved in the axial direction together with the chip collecting port by the moving device.

[0013] [7] a chip collection tube having a first end forming the chip collection port; a suction device that draws air from the chip collection port through the second end of the chip collection pipe, The chamfering device described in [6], wherein the chip collection pipe has a flexible portion between the first end and the second end, and deformation of the flexible portion allows the machining tool to move along with the chip collection port from a standby position to a machining start position corresponding to the position of the end face of the block.

[0014] [8] the processing tool is a grindstone having a flat processing surface for chamfering the block, The chamfering device described in [6] or [7], wherein the machining tool cover has a pair of side walls facing each other horizontally and each located on a plane including the machining surface of the machining tool, a top wall located above the machining tool of the pair of side walls and located on the plane including the machining surface, a back wall located on the opposite side of the block as viewed from the machining surface and connected to the pair of side walls and the top wall, and an opening formed below the machining surface of the machining tool and serving as a path for the chips to move.

[0015] [9] a chip collection tube having a first end forming the chip collection port; a suction device that draws air from the chip collection port through the second end of the chip collection pipe, The chamfering device according to [8], wherein the chip collection tube has a flange portion at the first end.

[0016]

[10] The outer peripheral surface of the block is placed on the driving rotor, a lower driven rotor that is a rotor that is disposed at a position shifted in the circumferential direction of the block with respect to the driving rotor, and that is placed on the outer circumferential surface of the block and driven by the outer circumferential surface of the block; an upper driven rotor that restricts upward movement of the block by contacting an upper surface of the outer circumferential surface of the block and that is another rotor that follows the outer circumferential surface of the block, The chamfering device according to any one of [1] to [9], wherein the processing tool is moved together with the upper driven rotor by the moving device.

[0017]

[11] a detector that moves with the machining tool and detects when a relative distance in the axial direction between the outer circumferential edge of the end face of the block and the machining tool reaches a predetermined distance; The chamfering device according to any one of [1] to

[10] , wherein the moving device moves the machining tool from a standby position to a machining start position specified by a detection result by the detector.

[0018]

[12] a first machining tool, a second machining tool, a first moving device for moving the first machining tool, and a second moving device for moving the second machining tool; The chamfering device described in any one of [1] to

[11] , wherein, while rotating the block by the driving rotor, chamfering is performed on the outer peripheral edge of a first end face of the block by the first machining tool and the first moving device, and chamfering is performed on the outer peripheral edge of a second end face of the block by the second machining tool and the second moving device.

[0019]

[13] The chamfering device described in

[12] , wherein, while rotating the block by the driving rotor, chamfering of the outer peripheral edge of the first end face of the block is performed simultaneously by the first machining tool and the first moving device, and chamfering of the outer peripheral edge of the second end face of the block is performed simultaneously by the second machining tool and the second moving device.

[0020]

[14] The chamfering device according to any one of [1] to

[13] , further comprising a length measuring device for measuring the length of the block in the axial direction.

[0021]

[15] A chamfering method using a chamfering device, comprising the steps of: The chamfering device includes: a driving rotor that rotates a cylindrical block by transmitting a rotational force in a circumferential direction to an outer peripheral surface of the block; A processing tool for processing the block; a moving device that moves the machining tool in the axial direction relative to the block in accordance with an axial position of the block, The chamfering method includes a chamfering step of chamfering an outer peripheral edge of an end face of the block by using the machining tool and the moving device while rotating the block by the driving rotor.

[0022]

[16] the processing tool is a grindstone having a flat processing surface for chamfering the block, The chamfering device includes a grindstone driving device that rotates the processing tool around a rotation axis perpendicular to the processing surface, and an oscillating device that oscillates the processing tool parallel to the processing surface, The chamfering method according to

[15] , wherein the chamfering step is performed while the machining tool is rotated by the grindstone driving device and oscillated by the oscillating device.

[0023]

[17] the chamfering device has a detector that moves with the machining tool and detects when a relative distance in the axial direction between the outer circumferential edge of the end face of the block and the machining tool reaches a predetermined distance; The chamfering method according to

[15] or

[16] , further comprising a machining start position moving step of moving the machining tool from a standby position to a machining start position identified by the detection result by the detector.

[0024]

[18] the chamfering device includes a first processing tool, a second processing tool, a first moving device for moving the first processing tool, and a second moving device for moving the second processing tool; The chamfering method described in any one of

[15] to

[17] , wherein the chamfering step includes chamfering the outer peripheral edge of a first end face of the block by the first machining tool and the first moving device, and chamfering the outer peripheral edge of a second end face of the block by the second machining tool and the second moving device, while rotating the block by the driving rotor.

[0025]

[19] The chamfering method described in

[18] , wherein the chamfering step includes simultaneously chamfering the outer peripheral edge of the first end face of the block using the first machining tool and the first moving device, and chamfering the outer peripheral edge of the second end face of the block using the second machining tool and the second moving device, while rotating the block using the driving rotor.

[0026]

[20] a chamfer width measuring step of measuring a difference between a chamfer width of the outer peripheral edge at the first end face of the block and a chamfer width of the outer peripheral edge at the second end face of the block after the chamfering step; The chamfering method according to

[18] or

[19] , wherein when the magnitude of the difference in the chamfer width measured in the chamfer width measurement step is equal to or greater than a threshold value, the rotation direction of the block is reversed and the chamfering step is performed.

[0027] [twenty one] A method for producing a single crystal silicon block, comprising chamfering a single crystal silicon block as the block by using the chamfering method according to any one of

[15] to

[20] . Effect of the Invention

[0028] According to the present invention, it is possible to provide a chamfering device, a chamfering method, and a method for manufacturing a single crystal silicon block, which are capable of easily chamfering the outer peripheral edge of the end face of a cylindrical block. [Brief description of the drawings]

[0029] [Figure 1]1 is a front view showing a chamfering device according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a right side view of the chamfering device shown in FIG. [Diagram 3] FIG. 2 is a top view of the chamfering device shown in FIG. [Figure 4] 2 is a perspective view of a processing area of ​​the chamfering device shown in FIG. 1. [Diagram 5] 2 is an explanatory diagram for explaining a measurement procedure of a length measuring device of the chamfering device shown in FIG. 1. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0030] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0031] 1 to 4, in one embodiment of the present invention, a chamfering device 1 includes a driving rotor 3, which is a rotor that rotates the block 2 by transmitting a rotational force in the circumferential direction to an outer peripheral surface 2a of a cylindrical block 2, a machining tool 4 that processes the block 2, and a moving device 5 that moves the machining tool 4 in the axial direction relative to the block 2 according to the axial position of the block 2, and chamfers an outer peripheral edge 2c of an end face 2b of the block 2 with the machining tool 4 and the moving device 5 while rotating the block 2 with the driving rotor 3. In this embodiment, the direction along the central axis O of the block 2 is referred to as the axial direction, and the direction going around the central axis O is referred to as the circumferential direction.

[0032] According to the above configuration, the chamfering can be performed while rotating the block 2 in the circumferential direction, so that the chamfering device 1 can easily chamfer the outer circumferential edge 2c of the end face 2b of the cylindrical block 2.

[0033] An outer peripheral surface 2a of the block 2 is placed on the driving rotor 3. According to the above configuration, the block 2 can be rotated in the circumferential direction with a simple structure. The driving rotor 3 is a roller having an axis parallel to the central axis O in this embodiment.

[0034] The chamfering device 1 has a rotor drive device 6 that rotates the drive rotor 3, and the rotor drive device 6 can rotate the drive rotor 3 to either one side or the other side. With the above configuration, the block 2 can be rotated to either one side in the circumferential direction or the other side in the circumferential direction as necessary. In this embodiment, the rotor drive device 6 is composed of a power source 6a and a power transmission mechanism 6b. In this embodiment, the power source 6a is a fluid pressure type or electric type rotary motor.

[0035] The chamfering device 1 has a lower driven rotor 7, which is another rotor that is disposed at a position offset in the circumferential direction of the block 2 with respect to the driving rotor 3, on which the outer peripheral surface 2a of the block 2 is placed and which is driven by the outer peripheral surface 2a of the block 2. With the above-described configuration, the block 2 can be rotated in the circumferential direction while being stably held with a simple structure. In this embodiment, the lower driven rotor 7 is a roller having an axis parallel to the central axis O.

[0036] The processing tool 4 is a grindstone having a planar processing surface 4a for chamfering the block 2, and the chamfering device 1 has a grindstone driving device 8 that rotates the processing tool 4 about a rotation axis P perpendicular to the processing surface 4a, and an oscillation device 9 that oscillates the processing tool 4 parallel to the processing surface 4a (for example, horizontally). According to the above configuration, it is possible to perform chamfering while suppressing uneven wear of the processing surface 4a of the grindstone by the oscillation.

[0037] The chamfering device 1 has a chip collection port 10a located below the machining tool 4, and a machining tool cover 11 that covers the machining tool 4 and guides chips generated by chamfering with the machining tool 4 to the chip collection port 10a, and the machining tool 4 moves in the axial direction together with the chip collection port 10a by the moving device 5. According to the above configuration, chips generated by chamfering with the machining tool 4 can be collected in the chip collection port 10a, making it possible to easily dispose of the chips.

[0038] The chamfering device 1 includes a chip collecting tube 10 having a first end 10b forming a chip collecting port 10a, and a suction device 12 that sucks air from the chip collecting port 10a through a second end 10c (opposite to the first end 10b) of the chip collecting tube 10. The chip collecting tube 10 has a flexible portion 10d between the first end 10b and the second end 10c, and allows the machining tool 4 to move with the chip collecting port 10a from a standby position to a machining start position corresponding to the position of the end face 2b of the block 2 by deformation of the flexible portion 10d. With the above configuration, efficient collection of chips by suction can be achieved with a simple structure. In this embodiment, the flexible portion 10d has a folded portion 10e that folds back in a U-shape in the axial direction, forming a bellows shape.

[0039] The machining tool 4 is a grindstone having a planar machining surface 4a for chamfering the block 2, and the machining tool cover 11 has a pair of side walls 11a that face each other horizontally and are located on a plane including the machining surface 4a of the machining tool 4, a top wall 11b that is located above the machining tool 4 of the pair of side walls 11a and is located on a plane including the machining surface 4a, a back wall 11c that is located on the opposite side of the block 2 as viewed from the machining surface 4a and is connected to the pair of side walls and the top wall 11b, and an opening 11d that is formed below the machining surface 4a of the machining tool 4 and serves as a moving path for the chips. According to the above configuration, the machining tool cover 11 can guide the chips to the chip collecting port 10a well. The machining device cover 11 may have a configuration having a lower wall that has the opening 11d and surrounds the chip collecting port 10a. In this case, the opening 11d may be configured to be a circle of the same size as the chip collecting port 10a.

[0040] The chamfering device 1 includes a chip collecting pipe 10 having a first end 10b forming a chip collecting port 10a, and a suction device 12 that draws air from the chip collecting port 10a through a second end 10c of the chip collecting pipe 10, the chip collecting pipe 10 having a flange at the first end 10b. According to the above configuration, the chips can be more effectively guided to the chip collecting port 10a by the suction device 12, the machining tool cover 11, and the flange.

[0041] The chamfering device 1 has a lower driven rotor 7, which is a rotor that is shifted in position relative to the driving rotor 3 in the circumferential direction of the block 2 and on which the outer peripheral surface 2a of the block 2 is placed and that follows the outer peripheral surface 2a of the block 2, and an upper driven rotor 13, which is another rotor that restricts the upward movement of the block 2 by contacting the upper surface of the outer peripheral surface 2a of the block 2 and follows the outer peripheral surface 2a of the block 2, and the machining tool 4 moves together with the upper driven rotor 13 by the moving device 5. According to the above configuration, in addition to the restriction by the driving rotor 3 and the lower driven rotor 7 against the downward movement of the block 2, the upper driven rotor 13 can also restrict the upward movement of the block 2, so that the block 2 can be rotated in the circumferential direction while being held more stably. In this embodiment, the upper driven rotor 13 is a roller having an axis parallel to the central axis O. The upper driven rotor 13 may be configured to be pressed against the upper surface of the block 2 in order to easily restrict the upward movement of the block 2.

[0042] The chamfering device 1 has a first upper driven rotor 13 and a second upper driven rotor 13 that are arranged at positions offset from each other in the circumferential direction. According to the above configuration, the block 2 can be rotated in the circumferential direction while being more stably held by the driving rotor 3, the lower driven rotor 7, the first upper driven rotor 13, and the second upper driven rotor 13.

[0043] The chamfering device 1 has a detector 14 that moves with the machining tool 4 and detects when the relative axial distance between the outer peripheral edge 2c of the end face 2b of the block 2 and the machining tool 4 reaches a predetermined distance, and the moving device 5 moves the machining tool 4 from a standby position to a machining start position specified by the detection result by the detector 14. With the above configuration, the machining tool 4 can be easily moved to an appropriate position according to the axial position of the block 2. In this embodiment, the detector 14 detects the presence of an object in a direction intersecting (preferably perpendicular) to the axial direction. In this embodiment, the detector 14 is an opposed type consisting of a transmitter 14a and a receiver 14b that face each other.

[0044] The moving device 5 has a base 5a and a linear motion device 5b that moves the base 5a in the axial direction, and the grindstone driving device 8, the swinging device 9, the processing tool cover 11, a portion of the chip collecting pipe 10 located closer to the chip collecting port 10a than the flexible portion 10d, and a holder that holds the detector 14 and the upper driven rotor 13 are attached integrally to the base 5a. With the above configuration, the moving device 5 can be realized with a simple structure. In this embodiment, the power source of the linear motion device 5b is a fluid pressure type or electric type rotary motor.

[0045] The chamfering device 1 has a first machining tool 4, a second machining tool 4, a first moving device 5 for moving the first machining tool 4, and a second moving device 5 for moving the second machining tool 4. While rotating the block 2 by the driving rotor 3, the first machining tool 4 and the first moving device 5 chamfer the outer peripheral edge 2c of the first end face 2b of the block 2, and the second machining tool 4 and the second moving device 5 chamfer the outer peripheral edge 2c of the second end face 2b (opposite the first end face 2b) of the block 2. With the above configuration, the outer peripheral edges 2c of both end faces 2b of the block 2 can be easily chamfered. In this embodiment, the machining tool 4 shown in FIG. 4 arranged on the right side (the right side in FIG. 1) is the first machining tool 4, and the machining tool 4 arranged on the left side is the second machining tool 4.

[0046] While rotating the block 2 with the driving rotor 3, the chamfering device 1 simultaneously chamfers the outer peripheral edge 2c of the first end face 2b of the block 2 with the first processing tool 4 and the first moving device 5, and chamfers the outer peripheral edge 2c of the second end face 2b of the block 2 with the second processing tool 4 and the second moving device 5. According to the above configuration, chamfering is performed by sandwiching the block 2 with the processing tools 4 from the left and right while rotating, so that the pressing force of the processing tools 4 against the block 2 for chamfering can be easily made uniform on the left and right, thereby reducing the difference in the amount of chamfering on the left and right.

[0047] The chamfering device 1 has a length measuring device 15 that measures the axial length of the block 2. According to the above configuration, the axial length of the block 2 when chamfering is completed can be easily grasped. In this embodiment, the length measuring device 15 is composed of a first distance sensor 15a arranged on one axial side of the block 2 and a second distance sensor 15b arranged on the other axial side of the block 2. As shown in FIG. 5, when the axial length of the block 2 is D, the distance between the first distance sensor 15a and the end face 2b on one axial side of the block 2 is A, the distance between the second distance sensor 15b and the end face 2b on the other axial side of the block 2 is B, and the distance between the first distance sensor 15a and the second distance sensor 15b is C, the relationship D=C-(A+B) is established, and since C is known, D can be grasped by measuring A with the first distance sensor 15a and measuring B with the second distance sensor 15b. In this embodiment, the first distance sensor 15a and the second distance sensor 15b are each a reflective type.

[0048] The operation of the chamfering device 1 (rotating body driving device 6, moving device 5, detector 14, grinding wheel driving device 8, oscillating device 9, suction device 12, length measuring device 15, etc.) is controlled by a control device (computer) not shown. In this embodiment, the chamfering device 1 has a door section 16 that opens and closes the processing area R in which the block 2 is placed. The operation of the door section 16 is controlled by the control device in this embodiment. In this embodiment, the door section 16 is composed of a pair of left and right sliding doors 16a that are provided spanning from the front of the chamfering device 1 to the rear of the chamfering device 1, and the suction device 12 is arranged on the rear side of the chamfering device 1.

[0049] 1 to 4, in this embodiment, the chamfering method uses a chamfering device 1, and the chamfering device 1 has a driving rotor 3, which is a rotor that rotates the block 2 by transmitting a rotational force in the circumferential direction to the outer peripheral surface 2a of the cylindrical block 2, a processing tool 4 that processes the block 2, and a moving device 5 that moves the processing tool 4 in the axial direction relative to the block 2 according to the axial position of the block 2, and the chamfering method has a chamfering step in which the processing tool 4 and the moving device 5 chamfer the outer peripheral edge 2c of the end face 2b of the block 2 while rotating the block 2 by the driving rotor 3. According to the above configuration, the block 2 can be chamfered while rotating in the circumferential direction, so that a chamfering method that can easily chamfer the outer peripheral edge 2c of the end face 2b of the cylindrical block 2 can be realized.

[0050] The processing tool 4 is a grindstone having a planar processing surface 4a for chamfering the block 2, and the chamfering device 1 has a grindstone driving device 8 that rotates the processing tool 4 around a rotation axis P perpendicular to the processing surface 4a, and a swinging device 9 that swings the processing tool 4 parallel to the processing surface 4a, and the chamfering step is performed while the processing tool 4 is rotated by the grindstone driving device 8 and swings by the swinging device 9. According to the above configuration, chamfering can be performed while suppressing uneven wear of the processing surface 4a of the grindstone by the swinging.

[0051] The chamfering device 1 has a detector 14 that moves with the machining tool 4 and detects when the relative axial distance between the outer peripheral edge 2c of the end face 2b of the block 2 and the machining tool 4 reaches a predetermined distance, and the chamfering method has a machining start position moving step of moving the machining tool 4 from a standby position to a machining start position specified by the detection result by the detector 14. With the above configuration, the machining tool 4 can be easily moved to an appropriate position according to the axial position of the block 2.

[0052] The chamfering device 1 has a first machining tool 4, a second machining tool 4, a first moving device 5 for moving the first machining tool 4, and a second moving device 5 for moving the second machining tool 4, and in the chamfering step, while rotating the block 2 by the driving rotor 3, the first machining tool 4 and the first moving device 5 chamfer the outer peripheral edge 2c of the first end face 2b of the block 2, and the second machining tool 4 and the second moving device 5 chamfer the outer peripheral edge 2c of the second end face 2b of the block 2. With the above configuration, the outer peripheral edges 2c of both end faces 2b of the block 2 can be easily chamfered.

[0053] In the chamfering step, while rotating the block 2 by the driving rotor 3, the first machining tool 4 and the first moving device 5 chamfer the outer peripheral edge 2c of the first end face 2b of the block 2, and the second machining tool 4 and the second moving device 5 chamfer the outer peripheral edge 2c of the second end face 2b of the block 2 simultaneously. With the above configuration, the difference in the amount of chamfering between the left and right sides can be reduced.

[0054] The chamfering method includes a chamfering width measuring step for measuring the difference between the chamfer width W (see FIG. 5) of the outer peripheral edge 2c at the first end face 2b of the block 2 and the chamfer width W of the outer peripheral edge 2c at the second end face 2b of the block 2 after the chamfering step, and when the magnitude of the difference in the chamfer width W measured in the chamfering width measuring step is equal to or greater than a threshold value, the rotation direction of the block 2 is reversed and the chamfering step is performed. With the above configuration, it is possible to suppress the difference in the chamfer width W that occurs when the block 2 moves to one axial side or the other axial side as the block 2 rotates to one side in the circumferential direction due to the surface condition of the outer peripheral surface 2a of the block 2. Such a movement occurs, for example, when the outer peripheral surface 2a of the block 2 is formed as a very shallow spiral groove centered on the central axis O by cutting in a pre-chamfering process, due to a screw-like action occurring between the roller as the driving rotor 3 and the outer peripheral surface 2a of the block 2 during the rotation of the block 2 during chamfering.

[0055] In the present embodiment, the method for manufacturing a single crystal silicon block uses the chamfering method of the present embodiment to chamfer a single crystal silicon block as a block 2. According to the above configuration, it is possible to realize a method for manufacturing a single crystal silicon block that can easily chamfer the outer periphery 2c of the end face 2b of the cylindrical block 2.

[0056] Although the embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment, and the above-described embodiment can be modified in various ways without departing from the gist of the present invention. [Explanation of symbols]

[0057] 1 Chamfering device 2 Blocks 2a Outer surface 2b End face 2c Outer rim 3 Drive Rotor 4 Processing tools 4a Machining surface 5. Mobile Devices 5a base 5b Linear motion device 6 Rotating body drive unit 6a Power source 6b Power transmission mechanism 7 Lower driven rotor 8 Grindstone drive unit 9. Rocking device 10. Chip collecting pipe 10a Chip collection port 10b 1st end 10c 2nd end 10d flexible part 10e Folded part 11 Machining tool cover 11a Side wall 11b Top wall 11c back wall 11d Open area 12 Suction device 13 Upper driven rotor 14 Detector 14a Transmitter 14b Receiver 15 Length measuring device 15a First distance sensor 15b Second distance sensor 16 Door section 16a Sliding door A, B, C, D Distance O center axis P Rotation axis R machining area W chamfer width

Claims

1. a driving rotor that rotates a cylindrical block by transmitting a rotational force in a circumferential direction to an outer peripheral surface of the block; A processing tool for processing the block; a moving device that moves the machining tool in the axial direction relative to the block in accordance with an axial position of the block, a chamfering device that chamfers an outer peripheral edge of an end face of the block using the processing tool and the moving device while rotating the block using the driving rotor.

2. The chamfering device of claim 1 , wherein the outer peripheral surface of the block is mounted on the driving rotor.

3. a rotor drive device that rotates the drive rotor, The chamfering device according to claim 1 , wherein the rotary body drive device is capable of rotating the driving rotary body to either one side or the other side.

4. 2. The chamfering device according to claim 1, further comprising a lower driven rotor, which is another rotor that is positioned offset in the circumferential direction of the block relative to the driving rotor, on which the outer peripheral surface of the block is placed and which is driven by the outer peripheral surface of the block.

5. the processing tool is a grindstone having a flat processing surface for chamfering the block, 2. The chamfering device according to claim 1, further comprising: a grindstone driving device that rotates the processing tool about a rotation axis perpendicular to the processing surface; and an oscillating device that oscillates the processing tool parallel to the processing surface.

6. A chip collection port located below the machining tool; a processing tool cover that covers the processing tool and guides chips generated by chamfering by the processing tool to the chip collection port, The chamfering device according to claim 1 , wherein the processing tool is moved in the axial direction by the moving device, carrying the chip collecting port with it.

7. a chip collection tube having a first end defining the chip collection opening; a suction device for drawing air from the chip collection port through the second end of the chip collection tube; 7. The chamfering device according to claim 6, wherein the chip collection pipe has a flexible portion between the first end and the second end, and deformation of the flexible portion allows the machining tool to move together with the chip collection port from a standby position to a machining start position corresponding to the position of the end face of the block.

8. the processing tool is a grindstone having a flat processing surface for chamfering the block, The chamfering device according to claim 6, wherein the machining tool cover has a pair of side walls that face each other horizontally and are each located on a plane including the machining surface of the machining tool, a top wall that is located above the machining tool of the pair of side walls and is located on the plane including the machining surface, a back wall that is located on the opposite side of the block as viewed from the machining surface and is connected to the pair of side walls and the top wall, and an opening formed below the machining surface of the machining tool and serving as a path for the chips to move.

9. a chip collection tube having a first end defining the chip collection opening; a suction device for drawing air from the chip collection port through the second end of the chip collection tube; The chamfering device of claim 8 , wherein the chip collection tube has a collar at the first end.

10. The outer peripheral surface of the block is placed on the driving rotor, a lower driven rotor that is a rotor that is disposed at a position shifted in the circumferential direction of the block with respect to the driving rotor, and that is placed on the outer circumferential surface of the block and driven by the outer circumferential surface of the block; an upper driven rotor that restricts upward movement of the block by contacting an upper surface of the outer circumferential surface of the block and that is another rotor that follows the outer circumferential surface of the block, The chamfering device according to claim 1 , wherein the processing tool is moved by the moving device together with the upper driven rotor.

11. a detector that moves with the machining tool and detects when a relative distance in the axial direction between the outer circumferential edge of the end face of the block and the machining tool reaches a predetermined distance; The chamfering device according to claim 1 , wherein the moving device moves the machining tool from a standby position to a machining start position specified by a detection result by the detector.

12. a first machining tool, a second machining tool, a first moving device for moving the first machining tool, and a second moving device for moving the second machining tool; 2. The chamfering device according to claim 1, wherein, while rotating the block by the driving rotor, chamfering is performed on the outer peripheral edge of the first end face of the block by the first machining tool and the first moving device, and chamfering is performed on the outer peripheral edge of the second end face of the block by the second machining tool and the second moving device.

13. The chamfering device of claim 12, wherein, while rotating the block by the driving rotor, chamfering of the outer peripheral edge of the first end face of the block by the first machining tool and the first moving device, and chamfering of the outer peripheral edge of the second end face of the block by the second machining tool and the second moving device are simultaneously performed.

14. 2. The chamfering device of claim 1, further comprising a length measuring device for measuring the axial length of the block.

15. A chamfering method using a chamfering device, comprising the steps of: The chamfering device includes: a driving rotor that rotates a cylindrical block by transmitting a rotational force in a circumferential direction to an outer peripheral surface of the block; A processing tool for processing the block; a moving device that moves the machining tool in the axial direction relative to the block in accordance with an axial position of the block, The chamfering method includes a chamfering step of chamfering an outer peripheral edge of an end face of the block by using the machining tool and the moving device while rotating the block by the driving rotor.

16. the processing tool is a grindstone having a flat processing surface for chamfering the block, The chamfering device includes a grindstone driving device that rotates the processing tool around a rotation axis perpendicular to the processing surface, and an oscillating device that oscillates the processing tool parallel to the processing surface, The chamfering method according to claim 15, wherein the chamfering step is performed while the machining tool is rotated by the grindstone driving device and oscillated by the oscillating device.

17. the chamfering device has a detector that moves with the machining tool and detects when a relative distance in the axial direction between the outer circumferential edge of the end face of the block and the machining tool reaches a predetermined distance; The chamfering method according to claim 15, further comprising a machining start position moving step of moving the machining tool from a standby position to a machining start position specified by a detection result by the detector.

18. the chamfering device includes a first processing tool, a second processing tool, a first moving device for moving the first processing tool, and a second moving device for moving the second processing tool; The chamfering method according to claim 15, wherein the chamfering step includes chamfering the outer peripheral edge of the first end face of the block by the first machining tool and the first moving device, and chamfering the outer peripheral edge of the second end face of the block by the second machining tool and the second moving device, while rotating the block by the driving rotor.

19. 19. The chamfering method according to claim 18, wherein the chamfering step includes simultaneously performing chamfering of the outer peripheral edge of the first end face of the block by the first machining tool and the first moving device, and chamfering of the outer peripheral edge of the second end face of the block by the second machining tool and the second moving device, while rotating the block by the driving rotor.

20. a chamfer width measuring step of measuring a difference between a chamfer width of the outer circumferential edge at the first end face of the block and a chamfer width of the outer circumferential edge at the second end face of the block after the chamfering step; The chamfering method according to claim 18 , further comprising the step of: reversing a rotation direction of the block and performing the chamfering step when the difference in the chamfer width measured in the chamfer width measuring step is equal to or greater than a threshold value.

21. A method for manufacturing a single crystal silicon block, comprising: chamfering the single crystal silicon block as the block by using the chamfering method according to claim 15.

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