Pickup device of semiconductor chip and pickup method of semiconductor chip

Abstract

To provide a dicing tape peeling device which peels a dicing tape from a semiconductor chip without fail, and to provide a pickup device including the dicing tape peeling device and a dicing tape peeling method.SOLUTION: A dicing tape peeling device includes: decompressing means 200 which decompresses the base material surface D2 side of a dicing tape D where semiconductor chips C are fixed to an adhesion surface D1; and compressing means 400 which compresses the adhesion surface D1 side. The decompressing means 200 decompresses a space S1 formed between the dicing tape D supported by a plurality of projection parts 320 formed at a supporting platform 300 and a groove part 330, and the compressing means 400 compresses a space S2 formed between the compressing means 400 and the adhesion surface D1 to peel the dicing tape D from the semiconductor chips C.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a dicing tape peeling device, a semiconductor chip pickup device, and a dicing tape peeling method for peeling a dicing tape to which a semiconductor chip is fixed from a semiconductor chip before picking up the semiconductor chip manufactured by dicing a wafer. [Background technology]

[0002] Semiconductor chips are manufactured by cutting (dicing) a wafer, which is made by thinly slicing an ingot made of single crystal silicon or the like, into individual pieces. Dicing is performed with the wafer fixed to the adhesive surface of a dicing tape, and the fabricated chips are also held on this adhesive surface. After dicing, the dicing tape is stretched (expanded) to increase the spacing between adjacent chips to make them easier to remove. Then, the chips are picked up one by one from the adhesive surface of the dicing tape by a transfer head provided in a pickup device, and transferred to a tray, substrate, or the like.

[0003] However, if the adhesion between the adhesive surface of the dicing tape and the chip is strong, a problem may occur in that the chip cannot be picked up by the transfer head. Therefore, a pickup device has been proposed that weakens the adhesion between the chip and the dicing tape to ensure that the pickup can be performed. For example, a pickup device has been proposed that includes a holding stage having a plurality of grooves provided on the surface that holds the semiconductor chip (dicing tape), at least one vent hole connected to the groove, and an apex formed by the end of the opening side of the groove and in point contact with the semiconductor chip held on the holding stage, and after the semiconductor chip is held on the apex of the holding stage, the space surrounded by the groove and the dicing tape is depressurized through the vent hole, thereby peeling off the part of the dicing tape other than the part that comes into contact with the apex of the holding stage from the semiconductor chip, thereby preventing pickup failure. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2013-4697 A Summary of the Invention [Problem to be solved by the invention]

[0005] According to the pickup device of Patent Document 1, the space created between the supported surface, which is the side of the dicing tape opposite to the surface to which the wafer is attached, and the groove in the holding stage is reduced in pressure, causing deformation of the dicing tape so that it can be peeled off from the semiconductor chip.

[0006] However, simply peeling the dicing tape from the supported surface of the semiconductor chip may result in only localized peeling. In particular, the dicing tape is more difficult to peel off near the portion that comes into contact with the apex of the holding stage than other portions because the apex presses down more strongly on the dicing tape. For this reason, in order to more accurately pick up the chips, it is necessary to minimize the unpeeled portion of the dicing tape from the semiconductor chip.

[0007] Therefore, the present invention provides a dicing tape peeling device that reliably peels a dicing tape from a semiconductor chip, a semiconductor chip pick-up device including the same, and a dicing tape peeling method. [Means for solving the problem]

[0008] The dicing tape peeling device of the present invention is a dicing tape peeling device that peels off a dicing tape having a semiconductor chip cut out from a wafer and fixed to its adhesive surface from the semiconductor chip, and is equipped with a support base having a plurality of protrusions that support the semiconductor chip via the dicing tape by abutting their tips against a substrate surface that is the surface opposite to the adhesive surface, a groove formed between the plurality of protrusions, and an air intake hole drilled in the groove, a pressure reduction means that is arranged below the support base and reduces the pressure in the space of the groove blocked by the dicing tape placed on the support base through the air intake hole, and a pressure reduction means that is arranged above the support base and forms a space between the dicing tape placed on the support base and pressurizes the space.

[0009] The dicing tape peeling device according to the present invention (hereinafter, for convenience, simply referred to as the peeling device) is mainly characterized in that it is provided with a decompression means for decompressing the space formed between the dicing tape supported by the multiple protrusions of the support base and the groove, and a pressurization means for pressurizing the space formed above the dicing tape placed on the support base. Therefore, according to the present invention, a force acting in a peeling direction to peel the dicing tape from the semiconductor chip is applied to both the adhesive surface (the surface to which the semiconductor chip is fixed) and the base material surface (the surface to which the multiple protrusions of the support base abut) of the dicing tape placed on the support base, so that the dicing tape can be strongly peeled off from the semiconductor chip.

[0010] At least one of the pressure reducing means and the pressure applying means may include a heater that heats the dicing tape.

[0011] The dicing tape can be heated by providing a heater to at least one of the pressure reducing means and the pressure applying means, which are respectively arranged above and below the support table. With this configuration, if the dicing tape is made of a heat peelable adhesive tape, the adhesive strength can be reduced by heating, so that it can be easily peeled off from the semiconductor chip.

[0012] The wafer may further include a support position changing means for changing the position at which the protrusion contacts the base surface by moving either the support table or the dicing tape in a horizontal direction.

[0013] By moving the dicing tape relative to the support table and bringing the protrusions into contact with multiple points on the substrate surface, the peeling action from the semiconductor chip by the pressure reducing means and pressure applying means works over a wide area of ​​the dicing tape. In other words, by changing the areas where the protrusions come into contact with the substrate surface and applying a peeling force, the dicing tape can be peeled off completely.

[0014] A semiconductor chip pick-up device of the present invention includes the dicing tape peeling device according to any one of claims 1 to 3, and a suction nozzle that picks up the semiconductor chip from the dicing tape.

[0015] According to the pick-up device of the present invention, a force acting in a peeling direction to peel the dicing tape from the semiconductor chip is applied to both the adhesive surface and the base surface of the dicing tape, so that the dicing tape can be peeled off reliably from the semiconductor chip, thereby enabling the semiconductor chip to be picked up accurately.

[0016] The pickup device may further include a shift mechanism for relatively moving the pressure means from above the semiconductor chip.

[0017] This makes it possible to remove the pressure means from above the semiconductor chip after the dicing tape has been peeled off, and instead, a transfer head equipped with a suction nozzle can be positioned to perform pick-up.

[0018] In addition, the dicing tape peeling method of the present invention is a dicing tape peeling method using the dicing tape peeling device described in any one of claims 1 to 3, and includes a reduced pressure peeling step in which a force is applied to the dicing tape in the peeling direction from the side of the base material surface by reducing the pressure in the space of the groove portion blocked by the dicing tape placed on the support table through the air intake hole, and a pressure peeling step in which a space is formed above the dicing tape placed on the support table and pressure is applied to the space by applying a force to the dicing tape in the peeling direction from the side of the adhesive surface.

[0019] According to the dicing tape peeling method of the present invention, a force acting in the peeling direction to peel the dicing tape from the semiconductor chip is applied from both the adhesive surface and the base surface of the dicing tape, so that the dicing tape can be peeled strongly from the semiconductor chip, thereby enabling the subsequent pick-up of the semiconductor chip to be performed accurately. Effect of the Invention

[0020] According to the dicing tape peeling device, semiconductor chip pick-up device, and dicing tape peeling method of the present invention, a support base is formed with a plurality of protrusions that support the semiconductor chip via the dicing tape, grooves formed between the plurality of protrusions, and an air intake hole in the grooves, the sealed space formed by the base surface of the supported dicing tape and the grooves is depressurized by the depressurizing means, and further, a pressure means forms a sealed space above the semiconductor chip C supported by the support base and applies pressure, thereby applying a force acting in the peeling direction to both sides of the dicing tape. This ensures that the dicing tape is peeled off from the semiconductor chip, making it possible to accurately pick up the semiconductor chip afterwards. [Brief description of the drawings]

[0021] [Figure 1]1(a), (b), and (c) are schematic cross-sectional views illustrating the configuration and operation of a dicing tape peeling device according to Example 1. [Diagram 2] 1A and 1B are schematic perspective views of a support base constituting the dicing tape peeling device according to Example 1, and FIG. 1B is a schematic perspective view of a protruding portion. [Diagram 3] 1 is a schematic plan view of a support table constituting the dicing tape peeling device according to Example 1. FIG. [Figure 4] 4(a), (b), and (c) are schematic partial cross-sectional views of a support base illustrating the process in which a dicing tape is peeled off in the dicing tape peeling device according to Example 1. FIG. [Diagram 5] 1(a) and 1(b) are schematic perspective views showing a semiconductor chip pick-up device equipped with a dicing tape peeling device according to a first embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] The present invention relates to a dicing tape peeling device that peels off a dicing tape having a semiconductor chip cut from a wafer and fixed to its adhesive surface from the semiconductor chip, a semiconductor chip pickup device that uses the peeling device, and a dicing tape peeling method performed by the peeling device.

[0023] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. EXAMPLES

[0024] 1 shows a dicing tape peeling device 1 according to this embodiment (hereinafter, for convenience, simply referred to as peeling device 1). The peeling device 1 peels off the semiconductor chips C obtained by cutting a semiconductor wafer fixed to an adhesive surface D1 of a dicing tape D with a laser beam or a blade from the adhesive surface D1. The peeling device 1 includes an expanding ring 100, a decompression means 200, a support stand 300, and a pressurization means 400.

[0025] The expand ring 100 holds a circular dicing tape D by sandwiching, from above and below, a wafer ring (not shown) attached to the periphery of the dicing tape D. A lifting means (not shown) is connected to the expand ring 100.

[0026] The decompression means 200 includes a decompression chamber 210 disposed inside the expanding ring 100 and a decompression pump (not shown). The decompression chamber 210 forms a sealed space below the dicing tape D held by the expanding ring 100. As shown in FIG. 1(a) and FIG. 1(b), the decompression chamber 210 includes a flat portion 211 formed to have substantially the same size and shape as the base surface D2 of the dicing tape D, and a peripheral wall portion 212 suspended upward from the periphery of the flat portion 211. The flat portion 211 is provided with a decompression port 213 to which a decompression pump (not shown) is connected, and a rod insertion hole 214 through which a lifting rod 350a supporting a support stand 300 (described later) is inserted.

[0027] The support stand 300 is disposed inside the decompression chamber 210. As shown in Figures 2 and 3, the support stand 300 includes a base 310, a plurality of protrusions 320, a groove 330, and an air intake hole 340.

[0028] The base 310 is formed in a rectangular shape in plan view, which is the same as the arrangement shape of the semiconductor chips C fixed to the adhesive surface D1 of the dicing tape D, and an electric heating wire heater H1 is provided inside. A lifting rod 350a provided in the lifting means 350 is connected to the bottom surface of the base 310, thereby allowing the base 310 to move up and down. The base 310 may be in the shape of a disk larger than the arrangement shape of the semiconductor chips C. The electric heating wire heater H1 may be provided inside the base 310 or may be provided in the pressure reducing means 200. For example, the pressure reducing means 200 may be provided with a support member that supports the support table 300 from below, and the support table 300 may be heated by the electric heating wire heater H1 provided inside the support member.

[0029] The protrusions 320 support the semiconductor chips C via the dicing tape D by contacting the base surface D2 of the dicing tape D held by the expand ring 100. As shown in FIG. 2 to FIG. 4, the protrusions 320 are formed in a substantially quadrangular pyramid shape, and a plurality of protrusions 320 are arranged at equal intervals vertically and horizontally on the upper surface of the base 310. The size and arrangement interval of the protrusions 320 are not particularly limited, but it is preferable that the size and arrangement interval are set so that the protrusions 320 and the semiconductor chips C have three or more contact points. If the number of contact points is less than three, the semiconductor chips C are not firmly supported and become unstable, and if the number of contact points is more than three, the peeling by the pressure reducing means 200 described later is not performed sufficiently. The shape of the protrusions 320 is not particularly limited as long as it has a tip shape that can make the contact area as small as possible without damaging the dicing tape D.

[0030] As shown in Fig. 2(b), grooves 330 are made up of gaps formed between multiple protrusions 320, and are arranged to form a lattice when base 310 is viewed from above, as shown in Fig. 3. Air intake holes 340 are drilled through base 310 at positions corresponding to the four corners of protrusions 320 on the bottom surface of grooves 330, and connect grooves 330 to the bottom surface of base 310.

[0031] The pressurizing means 400 includes a pressurizing chamber 410 that forms a sealed space above the dicing tape D held by the expanding ring 100. The pressurizing chamber 410 includes a flat portion 411 that is formed to have substantially the same size and shape as the flat portion 211 of the decompression chamber 210, and a peripheral wall portion 412 that is suspended downward from the periphery of the flat portion 411. The flat portion 411 includes a pressurizing port 413 to which a pressurizing pump (not shown) is connected, and a lamp heater H2. The pressurizing means 400 is also provided with an elevating means (not shown) that elevates the pressurizing chamber 410, and the pressurizing chamber 410 is movable up and down between the pressurizing chamber 410 and the decompression chamber 210.

[0032] Next, a peeling step (a method for peeling a dicing tape) performed by the peeling device 1 will be described with reference to Fig. 1. First, as shown in Fig. 1(a), the dicing tape D with the semiconductor chips C fixed to its adhesive surface D1 is held by an expanding ring 100 and set above a support stand 300. Next, as shown in Fig. 1(b), an elevating means (not shown) connected to the expanding ring 100 is operated to lower the expanding ring 100 while holding the dicing tape D. Then, the dicing tape D is stretched with the abutment portion between the base surface D2 of the dicing tape D and the edge portion 212a of the peripheral wall portion 212 of the decompression chamber 210 as a fulcrum, and the interval between the semiconductor chips C fixed to the adhesive surface D1 is widened (expanding step).

[0033] 1(c), the support table 300 is raised via the lifting rod 350a, and the top of the protrusion 320 comes into contact with the base surface D2 of the dicing tape D (support table contact step). Then, the top of the protrusion 320 supports the bottom surface of the semiconductor chip C via the dicing tape D, and a space S1 sealed by the groove 330 and the dicing tape D is formed.

[0034] Meanwhile, in the pressurizing means 400, a lifting means (not shown) connected to the pressurizing chamber 410 is operated to lower the edge 412a of the peripheral wall 412 to a height position where it contacts the adhesive surface D1 of the dicing tape D (pressurizing means sealing step). At this time, a space S2 sealed by the pressurizing chamber 410 and the dicing tape D is formed.

[0035] In this state, when a decompression pump (not shown) is operated, the bottom surface of the support table 300 (the bottom surface of the base 310) is sucked through the decompression port 213, and further, the space S1 is decompressed through the intake holes 340 that penetrate to the bottom surface of the base 310 (decompression peeling step). When the space S1 is decompressed, a force that pulls the dicing tape D downward (in the peeling direction) is applied. At this time, the support table 300 is in a heated state by the built-in electric heating wire heater H1, and the dicing tape D is heated through the protrusions 320 (first heating step).

[0036] Furthermore, when a pressure pump (not shown) is operated, pressure is applied inside the pressure chamber 410 via the pressure port 413, and a downward force acts on the dicing tape D (pressure peeling step). At this time, the dicing tape D is heated by the lamp heater H2 provided in the pressure chamber 410 (second heating step).

[0037] 4 shows the steps of peeling the dicing tape D from the semiconductor chip C by the peeling device 1 in order. Fig. 4(a) shows the state of the dicing tape D when the protrusions 320 of the support stand 300 come into contact with the substrate surface D2 (support stand contact step). At this time, the pressure in the space S1 by the pressure reducing means 200 and the pressure in the space S2 by the pressure applying means 400 have not yet been applied, and only the heating of the dicing tape D by the electric heating wire heater H1 and the lamp heater H2 has been performed (first heating step, second heating step).

[0038] 4(b) shows the state of the dicing tape D when both the decompression of the space S1 by the decompression means 200 (decompression peeling step) and the pressurization of the space S2 by the pressurization means 400 (pressure peeling step) are performed. The dicing tape D is exposed to both a force P1 that pulls the dicing tape D downward (in the peeling direction) from the base material surface D2 side by the decompression of the space S1, and a force P2 that pressurizes the space S2 downward (in the peeling direction) from the adhesive surface D1 side. Therefore, the adhesive force of the adhesive surface D1 to the semiconductor chip C is defeated by the action of both pressures, and the dicing tape D is peeled off from the semiconductor chip C.

[0039] 4(c) shows the state of the dicing tape D after it has been peeled off from the semiconductor chip C and the decompression by the decompression means 200 and the pressurization by the pressurization means 400 have been stopped. The dicing tape D that has been peeled off from the semiconductor chip C by the decompression force in the space S1 and the pressurization force in the space S2 becomes loose as a result of the strong tensile force acting on it. As a result, the dicing tape D remains in the state in which it has been peeled off from the semiconductor chip C.

[0040] 5 shows a pickup device 2 including a peeling device 1. As shown in FIGS. 5(a) and 5(b), the pickup device 2 includes a peeling unit 10 including the peeling device 1, a stand unit 20, and a transfer unit 30.

[0041] The peeling device 1 included in the peeling unit 10 includes the expand ring 100, the decompression means 200, the support base 300, and the pressurizing means 400 described above. Among these, the decompression section 11 including the expand ring 100, the decompression means 200, and the support base 300 is slidably connected to a rail 12 extending along the Y direction shown in FIG. 5, and is movable by a driving means (not shown). On the other hand, the pressurizing section 13 including the pressurizing means 400 is disposed in the vicinity of one end 12a of the rail 12, and is disposed at a position where the pressurizing means 400 is disposed directly above the dicing tape D when the decompression section 11 moves to the one end 12a. The rail 12 and the driving means (not shown) constitute a shift mechanism that relatively moves the pressurizing means 400 from above the semiconductor chip C. By providing such a shift mechanism, the pressurizing means 400 can be relatively moved from above the semiconductor chip C held by the decompression section 11 to change the position of the pressurizing means 400. This prevents the pressure means 400 from interfering with the picking up of the semiconductor chip C, which will be described later.

[0042] The stand unit 20 is used to place trays, substrates, etc., to which the semiconductor chips C that have completed the peeling process by the peeling unit 10 are to be transferred. The stand unit 20 includes a base 21 and rails 22. As shown in Fig. 5, the top surface of the base 21 is a mounting surface 21a on which the trays, substrates, etc. are placed, and the base 21 is slidably connected to the rails 22 extending along the Y direction shown in Fig. 5, and is movable by a driving means (not shown).

[0043] The transfer unit 30 is disposed on the side of the other end 12b of the rail 12 and the other end 22b of the rail 22, and includes a transfer head 31, a rail 32, and a pair of legs 33. The transfer head 31 includes a suction nozzle 31a for suctioning and holding the semiconductor chip C. The rail 32 extends along the X direction shown in FIG. 5, and is connected to the rail 12 and the rail 22 so that the transfer head 31 can move across the rail 12 and the rail 22 by a driving means (not shown). The pair of legs 33 are erected on the sides of the other end 12b and the other end 22b of the rail 12 and the rail 22, and both ends of the rail 32 are fixed to the upper ends of the respective legs. As a result, the transfer head 31 moves to a position directly above the peeling unit 10 and the stand unit 20, which are disposed on the other end 12b side of the rail 12 and the other end 22b side of the rail 22, respectively.

[0044] Next, a pick-up step (semiconductor chip pick-up method) of the semiconductor chip C by the pickup device 2 will be described. In Fig. 5(a), a peeling step of the dicing tape D is performed by the peeling unit 10. That is, the decompression unit 11 and the pressure unit 13 apply decompression (decompression peeling step) and pressure (pressure peeling step) to the dicing tape D, and the dicing tape D is peeled off from the semiconductor chip C.

[0045] Meanwhile, a tray T to which the semiconductor chip C is to be transferred is placed on the placement surface 21a of the stand unit 20. When the peeling step is completed, as shown in Fig. 5(b), the peeling unit 10 and the stand unit 20 are moved to the other ends 12b and 22b of the rails 12 and 22, respectively, and are positioned directly below the transfer head 31 and rail 32 of the transfer unit 30. Then, the transfer head 31 is moved onto the peeling unit 10, and the semiconductor chip C is picked up by suction and holding with the suction nozzle 31a (pickup step).

[0046] The transfer head 31 holding the semiconductor chip C is moved directly above the stand unit 20, and after placing the semiconductor chip C on the tray T, the suction hold is released to complete the transfer of the semiconductor chip C (transfer step). Here, the positioning when the suction nozzle 31a of the transfer head 31 sucks the semiconductor chip C and the positioning when the semiconductor chip C is placed on the tray T are performed by a combination of the movement of the transfer head 31 in the X direction along the rail 32 and the movement of the pressure reducing unit 11 and the platform unit 21 in the Y direction along the rail 12 and the rail 22.

[0047] After the transfer is completed, the transfer head 31 is returned to directly above the peeling unit 10, and the above operation is repeated until all the semiconductor chips C have been transferred from the dicing tape D. When all the semiconductor chips C fixed to the dicing tape D have been transferred, the dicing tape D held in the peeling device 1 is replaced with a dicing tape D to which new semiconductor chips C have been fixed, and a peeling process of the dicing tape D is performed on the new semiconductor chips C. In addition, when a predetermined number of semiconductor chips C have been transferred to the tray T, the tray T is replaced with a new one.

[0048] The peeling process and the pick-up process, respectively performed by the peeling device 1 and the pick-up device 2, are automated by a computer (not shown) executing a control program while collecting various information from cameras, sensors, etc. installed to detect the state of the semiconductor chip C.

[0049] The peeling device 1 and the pickup device 2 of the first embodiment are provided with a pressure reducing means 200 for reducing the pressure of the space S1 formed by the dicing tape D placed on the support table 300 and the grooves 330 formed between the dicing tape D and the multiple protrusions 320 that support the semiconductor chips C via the dicing tape D, and a pressure applying means 400 for forming and applying pressure to the space S2 above the dicing tape D placed on the support table 300, so that a force acting in the peeling direction can be applied to both the adhesive surface D1 and the base material surface D2 of the dicing tape D. As a result, the dicing tape D is strongly peeled off from the semiconductor chips C, so that the pickup of the semiconductor chips C performed by the pickup device 2 can be performed accurately. EXAMPLES

[0050] The delamination device of Example 2 is an improvement over the delamination device 1 of Example 1, and other configurations are the same as those of Example 1. Therefore, in this example, only the changes from Example 1 will be described, and the description of the other configurations will be omitted.

[0051] In the second embodiment, a support position changing means is provided on the support table 300 in the peeling apparatus 1 of the first embodiment. The support position changing means moves the dicing tape D relative to the support table 300 to change the position where the protrusions 320 abut against the base surface D2, and is configured to drive either the expand ring 100 or the support table 300 to move in the horizontal direction. The support position changing means will be described with reference to FIG. 4 used in the first embodiment. As shown in FIG. 4(a), from a state where the base surface D2 of the dicing tape D and the protrusions 320 abut against each other, the support table 300 can be moved slightly in the horizontal direction A (for example, a distance half the distance of the arrangement interval of the protrusions 320) or the expand ring holding the dicing tape D can be moved in the horizontal direction A to change the position where the semiconductor chip C is supported by the protrusions 320. By carrying out the peeling process before and after changing the position supported by the protrusion 320, the peeling action by the pressure reducing means and the pressure applying means works on a wide area of ​​the dicing tape D, so that the unpeeled portions of the dicing tape D are reduced, and the semiconductor chips C can be picked up more accurately.

[0052] The present invention is not limited to the above-described embodiments, and various modifications and combinations are possible within the scope of the claims and the scope of the embodiments, and these modifications and combinations are also included in the scope of the rights.

[0053] For example, the shape of the protrusion 320 in the above embodiment may be formed into another polygonal pyramid shape such as a triangular pyramid, a cone shape, etc. Furthermore, the number of air intake holes 340 provided in the groove 330 may be increased or decreased, and the arrangement positions may be changed. [Explanation of symbols]

[0054] 1 Peeling device 2 Pick-up device 31a Suction nozzle 200 Pressure reduction means 300 Support stand 320 Protrusion 330 Groove 340 Air Intake Hole 400 Pressurizing means C. Semiconductor chip D Dicing Tape D1 Adhesive side D2 Base material side H1 Electric Wire Heater (Heater) H2 Lamp Heater (Heater)

Claims

1. A dicing tape peeling device that peels off a dicing tape having a semiconductor chip cut from a wafer and fixed to an adhesive surface of the dicing tape from the semiconductor chip, comprising: a support base including a plurality of protrusions for supporting the semiconductor chip via the dicing tape by bringing the tips of the protrusions into contact with a substrate surface that is the surface opposite to the adhesive surface, a groove formed between the plurality of protrusions, and an air intake hole formed in the groove; a pressure reducing means for reducing the pressure of the space of the groove portion closed by the dicing tape placed on the support table through the air intake hole; a pressure applying means disposed above the support table and applying pressure to the dicing tape placed on the support table to form a space between the dicing tape and the support table, and applying pressure to the space.

2. 2. The dicing tape peeling device according to claim 1, wherein at least one of the pressure reducing means and the pressure applying means includes a heater for heating the dicing tape.

3. The dicing tape peeling device according to claim 1, further comprising a support position changing means for changing the position at which the protrusion contacts the base material surface by moving at least one of the support table or the dicing tape horizontally.

4. 4. A semiconductor chip pick-up device comprising: the dicing tape peeling device according to claim 1; and a suction nozzle for picking up the semiconductor chip from the dicing tape.

5. 5. The semiconductor chip pickup device according to claim 4, further comprising a shift mechanism for relatively moving said pressure means from above said semiconductor chip.

6. 4. A dicing tape peeling method using the dicing tape peeling device according to claim 1, comprising: a vacuum peeling step of applying a force to the dicing tape in the peeling direction from the side of the base material surface by reducing the pressure in the space of the groove portion blocked by the dicing tape placed on the support table through the air intake hole; and a pressure peeling step of applying a force to the dicing tape in the peeling direction from the side of the adhesive surface by forming a space above the dicing tape placed on the support table and pressurizing the space.

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