Component-embedded substrate and method for manufacturing the same

Abstract

To prevent filling resin containing electronic components from falling off from a substrate during manufacturing.SOLUTION: A component-incorporated substrate 1 is a component-embedded substrate in which an electronic component 7 is embedded via a filled resin 6 in an opening 5 for embedding an electronic component, the opening 5 being provided in a core material 4 consisting of a substrate 2 and copper foil 3 provided on an upper surface 2a and a lower surface 2b of the substrate. An upper surface 6a and a lower surface 6b of the filled resin and an upper surface 3a and a lower surface 3b of the copper foil of the core material form almost the same plane, and an electrolytic plating film 11 of a conductor circuit formed on the substrate of the core material covers at least a part of the upper surface and the lower surface of the filled resin. The electrolytic plating film covers the outer periphery of the filled resin on the upper and lower surfaces of the filled resin.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a component-embedded substrate in which an electronic component is embedded in an opening of a substrate via a filling resin, and to a method for manufacturing the same. [Background technology]

[0002] Conventionally, there is known a component-embedded board in which an electronic component is embedded in an opening of the board via a filling resin. As an example, in the technology disclosed in Patent Document 1, an opening on the bottom surface of the board is covered with a sheet material with an adhesive so that the adhesive faces inward, and the filling resin is filled into the inside of the opening with the electronic component adhered to the sheet material, and then hardened. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2002-204045 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the technology disclosed in Patent Document 1, electronic components are fixed inside the opening with a filled resin. During the manufacturing process of the component-embedded substrate, both the upper surface of the filled resin and the lower surface from which the sheet material has been removed are completely exposed to the opening. As a result, there are cases in which the filled resin containing the embedded electronic components falls off the substrate during manufacturing. [Means for solving the problem]

[0005] The component-embedded substrate of the present invention is a component-embedded substrate in which an electronic component is embedded, via a filled resin, in an opening for embedding an electronic component, which is provided in a core material consisting of a substrate and copper foil provided on the upper and lower surfaces of the substrate, wherein the upper and lower surfaces of the filled resin and the upper and lower surfaces of the copper foil of the core material form approximately the same plane, and an electrolytic plating film of a conductor circuit formed on the upper and lower surfaces of the substrate of the core material covers at least a portion of the upper and lower surfaces of the filled resin.

[0006] A method for manufacturing a component-embedded substrate according to the present invention is a method for manufacturing a component-embedded substrate in which an electronic component is embedded, via a filling resin, in an opening for embedding an electronic component, which is provided in a core material consisting of a substrate and copper foil provided on an upper surface and a lower surface of the substrate, the method comprising the steps of: forming an opening for embedding an electronic component in the core material; forming a tape on the lower surface of the core material to close the opening; arranging an electronic component in the opening on the tape; filling the opening with a filling resin and hardening it; polishing the upper surface of the filling resin and removing the tape, thereby making the upper and lower surfaces of the filling resin and the upper and lower surfaces of the copper foil of the core material substantially flush with each other. forming a through hole in the core material; forming a through hole conductor within the through hole and on the upper and lower surfaces of the core material and the filled resin; filling the through hole with resin in which the through hole conductor has been formed; forming an electrolytic plating film on the upper and lower surfaces of the resin in the through hole and on the upper and lower surfaces of the through hole conductor; and forming openings on the upper and lower surfaces of the through hole conductor and the electrolytic plating film through which the filled resin is exposed, so that the through hole conductor and the electrolytic plating film cover at least a portion of the upper and lower surfaces of the filled resin. [Brief description of the drawings]

[0007] [Figure 1] 1A to 1C are diagrams illustrating an embodiment of a component-embedded substrate according to the present invention. [Diagram 2] 4 is a diagram for explaining the positional relationship between an opening for embedding an electronic component and an electrolytic plating film in one embodiment of a component-embedded substrate according to the present invention. FIG. [Figure 3A] 1A to 1C are diagrams for explaining an embodiment of a method for manufacturing a component-embedded substrate according to the present invention. [Figure 3B] 1A to 1C are diagrams for explaining an embodiment of a method for manufacturing a component-embedded substrate according to the present invention. [Figure 3C] 1A to 1C are diagrams for explaining an embodiment of a method for manufacturing a component-embedded substrate according to the present invention. [Figure 3D] 1A to 1C are diagrams for explaining an embodiment of a method for manufacturing a component-embedded substrate according to the present invention. [Figure 3E] 1A to 1C are diagrams for explaining an embodiment of a method for manufacturing a component-embedded substrate according to the present invention. [Figure 3F] 1A to 1C are diagrams for explaining an embodiment of a method for manufacturing a component-embedded substrate according to the present invention. [Figure 3G] 1A to 1C are diagrams for explaining an embodiment of a method for manufacturing a component-embedded substrate according to the present invention. [Figure 3H] 1A to 1C are diagrams for explaining an embodiment of a method for manufacturing a component-embedded substrate according to the present invention. [Figure 3I] 1A to 1C are diagrams for explaining an embodiment of a method for manufacturing a component-embedded substrate according to the present invention. [Figure 3J] 1A to 1C are diagrams for explaining an embodiment of a method for manufacturing a component-embedded substrate according to the present invention. [Figure 3K] 1A to 1C are diagrams for explaining an embodiment of a method for manufacturing a component-embedded substrate according to the present invention. [Figure 3L] 1A to 1C are diagrams for explaining an embodiment of a method for manufacturing a component-embedded substrate according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] <About the component-embedded substrate of the present invention> An embodiment of the component-embedded substrate of the present invention will be described with reference to the drawings. In the examples shown in Figures 1, 2, and 3A to 3L, the dimensions of each member, particularly the height dimension, are shown as different from the actual dimensions in order to make the features of the present invention easier to understand.

[0009] FIG. 1 is a cross-sectional view for explaining one embodiment of the component-embedded substrate according to the present invention. In FIG. 1, a component-embedded substrate 1 is shown in which an electronic component 7 is embedded through a filled resin 6 in an opening 5 for embedding an electronic component, which is provided in a core material 4 consisting of a substrate 2 and copper foil 3 provided on an upper surface 2a and a lower surface 2b of the substrate 2. In the component-embedded substrate 1, a through-hole 8 is formed in the core material 4, a through-hole conductor 9 is formed on the inner wall of the through-hole 8 and on the copper foil 3 of the substrate 2, and a resin 10 is filled in the through-hole 8. Furthermore, an electrolytic plating film 11 is formed on the through-hole conductor 9 on the copper foil 3 to plate the through-hole 8, and a land is formed by the through-hole conductor 9 and the electrolytic plating film 11. The material of the electrolytic plating film 11 is preferably copper.

[0010] The feature of this embodiment of component-embedded substrate 1 according to the present invention is, first, that the upper surface 6a and the lower surface 6b of filled resin 6 form substantially the same plane as the upper surface 3a and the lower surface 3b of copper foil 3 of core material 4. Also, a land consisting of through-hole conductor 9 and electrolytic plating film 11 formed on substrate 2 of core material 4 covers at least a part of the upper surface 6a and the lower surface 6b of filled resin 6 (here, the outer periphery of filled resin 6).

[0011] Fig. 2 is a diagram for explaining the positional relationship between an opening for embedding an electronic component and an electrolytic plating film in one embodiment of a component-embedded substrate according to the present invention. In Fig. 2, electrolytic plating film 11 forming a land is formed on the outer periphery of filled resin 6 and is formed so as to cover opening 5 for embedding an electronic component, which is shown by a dotted line in the figure. Therefore, end 11-1 of electrolytic plating film 11 can hold the outer periphery of filled resin 6.

[0012] In the component-embedded substrate 1 according to the present invention shown in Fig. 1 and Fig. 2, the upper surface 6a and the lower surface 6b of the filling resin 6 and the upper surface 3a and the lower surface 3b of the copper foil 3 of the core material 4 form substantially the same plane, so that the lateral movement of the filling resin 6 fixing the electronic component 7 can be prevented. Furthermore, the land consisting of the through-hole conductor 9 and the electrolytic plating film 11 formed on the substrate 2 of the core material 4 covers at least a part of the upper surface 6a and the lower surface 6b of the filling resin 6 (here, the outer periphery of the filling resin 6), so that the filling resin 6 fixing the electronic component 7 does not come out of the opening 5 for electronic component embedding after the land is formed. Therefore, the filling resin 6 with the electronic component 7 embedded therein does not fall off from the substrate 2 during manufacturing.

[0013] <About the manufacturing method of the component-embedded substrate of the present invention> 3A to 3L are diagrams for explaining one embodiment of a method for manufacturing a component-embedded substrate according to the present invention. Hereinafter, the method for manufacturing a component-embedded substrate according to the present invention will be explained with reference to Figs. 3A to 3L. Note that any conventionally known method can be used for manufacturing and processing each member described below, and there are no special features in these respects.

[0014] First, as shown in Fig. 3A, a core material 4 is formed, which is made up of a substrate 2 and copper foil 3 provided on an upper surface 2a and a lower surface 2b of the substrate 2. Next, as shown in Fig. 3B, an opening 5 for incorporating an electronic component is formed in the core material 4. Next, as shown in Fig. 3C, a tape 21 is formed on the lower surface of the core material 4 so as to cover the opening 5, and an electronic component 7 is placed on an adhesive layer formed on an upper surface 21a of the tape 21 facing the opening 5.

[0015] Next, as shown in Fig. 3D, the opening 5 is filled with a filling resin 6 and the filling resin 6 is cured. Next, as shown in Fig. 3E, the filling resin 6 that protrudes from the upper part of the opening 5 is polished and removed. Next, as shown in Fig. 3F, the tape 21 is removed, so that the upper surface 6a and the lower surface 6b of the filling resin 6 and the upper surface 3a and the lower surface 3b of the copper foil 3 of the core material 4 are made substantially flush with each other.

[0016] Next, as shown in Fig. 3G, through-holes 8 are formed in core material 4 as through-holes that penetrate from the top surface to the bottom surface of core material 4. Next, as shown in Fig. 3H, through-hole conductors 9 are formed on the inner walls of through-holes 8 and on copper foil 3 of substrate 2. Next, as shown in Fig. 3I, resin 10 is filled into through-holes 8 with through-hole conductors 9 formed therein. Next, as shown in Fig. 3J, an electrolytic plating film 11 is formed on through-hole conductors 9 on copper foil 3 to cap-plate through-holes 8.

[0017] Next, as shown in Fig. 3K, openings 22 exposing filled resin 6 are formed in through-hole conductors 9 and electrolytic plating film 11, and lands consisting of through-hole conductors 9 and electrolytic plating film 11 cover at least a part of upper surface 6a and lower surface 6b of filled resin 6, as shown in a rectangular frame (dashed line) in Fig. 3K, thereby manufacturing component-embedded substrate 1 of the present invention shown in Fig. 1 and Fig. 2 described above. Thereafter, as shown in Fig. 3L, built-up layers 23 are formed above and below component-embedded substrate 1 as necessary. [Explanation of symbols]

[0018] 1. Substrate with embedded components 2. Board 2a Top side 2b Bottom side 3 Copper foil 4 Core material 5 aperture 6 Filling Resin 7. Electronic Components 8 Through Hole 9 Through-hole conductor 10 Resin 11 Electrolytic plating film 11-1 End 21 Tape 21a Top surface 22 Aperture 23 Build-up layer

Claims

1. A component-embedded substrate in which an electronic component is embedded through a filling resin in an opening for embedding the electronic component, the opening being provided in a core material made of a substrate and copper foil provided on an upper surface and a lower surface of the substrate, The upper and lower surfaces of the filling resin and the upper and lower surfaces of the copper foil of the core material form approximately the same plane, and the electrolytic plating film of the conductor circuit formed on the upper and lower surfaces of the substrate of the core material covers at least a portion of the upper and lower surfaces of the filling resin.

2. 2. The component-embedded substrate according to claim 1, wherein the electrolytic plating film covers an outer periphery of the filled resin on both the upper and lower surfaces of the filled resin.

3. 3. The component-embedded substrate according to claim 1, wherein the electrolytic plating film is an electrolytic copper plating film.

4. A method for manufacturing a component-embedded substrate, the method comprising: embedding an electronic component in an opening for embedding the electronic component through a filling resin, the opening being provided in a core material made of a substrate and copper foil provided on an upper surface and a lower surface of the substrate, the method comprising the steps of: forming an opening in the core material for incorporating an electronic component; forming a tape on a lower surface of the core material to close the opening, and arranging an electronic component in the opening on the tape; filling the opening with a filling resin and curing the resin; grinding the upper surface of the filled resin and removing the tape to make the upper and lower surfaces of the filled resin substantially flush with the upper and lower surfaces of the copper foil of the core material; forming a through hole in the core material; forming a through-hole conductor in the through-hole and on the upper and lower surfaces of the core material and the filling resin; filling a through hole in which the through hole conductor is formed with a resin; forming an electrolytic plating film on upper and lower surfaces of the resin in the through hole and on upper and lower surfaces of the through hole conductor; The method includes forming openings on the upper and lower surfaces of the through-hole conductor and the electrolytic plating film, exposing the filling resin, so that the through-hole conductor and the electrolytic plating film cover at least a portion of the upper and lower surfaces of the filling resin.

5. 5. The method for manufacturing a component-embedded substrate according to claim 4, wherein the electrolytic plating film covers an outer periphery of the filled resin on both the upper and lower surfaces of the filled resin.

6. 6. The method for manufacturing a component-embedded substrate according to claim 4, wherein the electrolytic plating film is an electrolytic copper plating film.

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