Printer and printing system

Abstract

To prevent a paste returned to a mask from a squeegee which had performed a solder cutting operation previously from adhering again to a squeegee which has performed the solder cutting operation subsequently.SOLUTION: A printer is configured to repeatedly execute an application operation of applying a solder paste Pst to a substrate KB by causing a first squeegee 32A and a second squeegee 32B disposed to face each other to alternately scrape the solder paste Pst supplied onto a mask 14 in opposite directions. When performing the solder cutting operation by using each of the first squeegee 32A and the second squeegee 32B, the printer performs, using the first squeegee 32A, the solder cutting operation in the vicinity of an end position of the application operation performed by the first squeegee 32A, and meanwhile, performs, by using the second squeegee 32B, the solder cutting operation in the vicinity of an end position of the application operation performed by the second squeegee 32B.SELECTED DRAWING: Figure 16

Description

[Technical field]

[0001] The present invention relates to a printing device that prints solder paste on a substrate using a mask, and a printing system that is configured to include this printing device. [Background technology]

[0002] Conventionally, there is known a printing device that applies solder paste to a substrate by sliding a squeegee on a mask provided with pattern openings. In a printing device, the substrate is usually clamped by two clampers and brought into contact with the lower surface of the mask, and the squeegee is moved between the areas on the mask where the two clampers are in contact (clamper contact areas). In addition, there is a type of printing device that has two squeegees arranged opposite to each other and is capable of scraping the solder paste with one of the two squeegees selected. In such a dual squeegee type printing device having two squeegees, the solder paste is scraped on the mask alternately and in opposite directions while the squeegee used to scrape the solder paste is alternately switched to repeat the application operation.

[0003] Some printing devices are equipped with a solder recovery unit that temporarily recovers the solder paste on the mask when the mask is replaced due to a change in the model being produced, etc., in order to reuse the solder paste on the mask. The solder recovery unit recovers the solder paste by scooping it up with a plate-shaped member at the end position (clamper contact area) of the last application operation performed before the solder paste recovery. Before the solder paste is recovered, a solder cutting operation is performed to return at least a part of the solder paste adhering to the squeegee to the mask side to prevent the paste adhering to the squeegee from dripping (for example, see Patent Document 1 below). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2022 / 085268 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the printing device described in Patent Document 1, when performing the solder cutting operation with both squeegees, the two squeegees are each moved up and down near the paste mass collected by the solder recovery unit. This causes a problem in that the solder paste returned to the mask in the previous solder cutting operation may reattach to the squeegee that performed the subsequent solder cutting operation, and the reattached paste may drip and soil the printing device.

[0006] Therefore, an object of the present invention is to provide a printing device and printing system that can prevent a situation in which paste that has been returned to the mask from a squeegee that has previously performed a solder cutting operation re-adheres to a squeegee that subsequently performs a solder cutting operation. [Means for solving the problem]

[0007] The printing device of the present invention has a first squeegee and a second squeegee arranged opposite each other, and repeatedly performs a coating operation in which solder paste supplied onto a mask is scraped up alternately and in opposite directions by the first squeegee and the second squeegee to apply the solder paste to a substrate through a pattern opening provided in the mask.When a solder cutting operation is performed for each of the first squeegee and the second squeegee to return at least a portion of the adhered solder paste to the mask side, for the first squeegee, the solder cutting operation is performed near the end position of a first coating operation, which is a coating operation performed by the first squeegee, and for the second squeegee, the solder cutting operation is performed near the end position of a second coating operation, which is a coating operation performed by the second squeegee.

[0008] The printing system of the present invention is a printing system comprising the printing device of the present invention described above, a mask storage device that stores a replacement mask, and a mask replacement means that replaces a used mask installed at a mask installation position of the printing device with a replacement mask stored in the mask storage device, wherein before the used mask is moved from the mask installation position by the mask replacement means, the printing device performs the solder cutting operation for each of the first squeegee and the second squeegee, and then the solder recovery unit recovers the solder paste on the used mask. Effect of the Invention

[0009] According to the present invention, it is possible to prevent a situation in which the paste, which has been returned to the mask from the squeegee that has previously performed the solder cutting operation, re-adheres to the squeegee that has subsequently performed the solder cutting operation. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a perspective view showing an outline of a configuration of a printing system according to an embodiment of the present invention; [Diagram 2] FIG. 1 is a side view showing an outline of a printing system according to an embodiment of the present invention; [Diagram 3] FIG. 1 is a side view of a printing device provided in a printing system according to an embodiment of the present invention. [Figure 4] FIG. 1 is a plan view showing a mask provided in a printing apparatus according to an embodiment of the present invention together with a guide rail. [Diagram 5] 1A and 1B are diagrams illustrating the operation of a print head provided in a printing device according to an embodiment of the present invention. [Figure 6] 1A and 1B are diagrams illustrating the operation of a mask operating cylinder provided in a printing device according to an embodiment of the present invention to position a mask at a mask installation position. [Figure 7] 1A and 1B are diagrams showing the operation of a mask operation cylinder provided in a printing device according to an embodiment of the present invention, moving a mask from a mask installation position; [Figure 8] FIG. 1 is a block diagram showing a control system of a printing system according to an embodiment of the present invention. [Figure 9] FIG. 1 is a side view showing a state in which a substrate is clamped by a clamper in a printing device according to an embodiment of the present invention. [Figure 10] FIG. 1 is a side view showing a state in which a substrate clamped by a clamper is brought into contact with the lower surface of a mask by a printing apparatus according to an embodiment of the present invention. [Figure 11] 5A, 5B, and 5C are side views showing a coating operation by a first squeegee provided in a printing device according to an embodiment of the present invention. [Figure 12] 5A, 5B, and 5C are side views showing a coating operation by a second squeegee provided in a printing device according to an embodiment of the present invention. [Figure 13] 1A, 1B, and 1C are diagrams showing a flow of a solder paste recovery operation by a solder recovery unit included in a printing device according to an embodiment of the present invention; [Figure 14] 5A, 5B, and 5C are side views showing the flow of a solder cutting operation for a first squeegee included in a printing device according to an embodiment of the present invention. [Figure 15] 5A, 5B, and 5C are side views showing the flow of a solder cutting operation for a second squeegee included in a printing device according to an embodiment of the present invention. [Figure 16] 5A to 5F are side views showing the operation of a first squeegee and a second squeegee immediately before a solder recovery unit included in a printing device according to an embodiment of the present invention performs a solder recovery operation. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 and FIG. 2 show a printing system 1 according to an embodiment of the present invention. The printing system 1 includes a printing device 2 and a mask storage device 3 provided adjacent to the printing device 2, and repeatedly performs a printing operation of printing a solder paste Pst such as solder on an electrode pattern DK provided on the upper surface of a substrate KB brought in from the outside and carrying it out to the outside. In this embodiment, for convenience of explanation, the direction in which the substrate KB is transported (horizontal direction as seen from the operator OP) is defined as the X direction. In addition, the direction perpendicular to the X direction in the horizontal plane (front-rear direction as seen from the operator OP) is defined as the Y direction, and the up-down direction is defined as the Z direction. Furthermore, in the Y direction, the side facing the mask storage device 3 from the printing device 2 is defined as the rear side (rear side), and the side facing the printing device 2 from the mask storage device 3 is defined as the front side (near side).

[0012] 1 and 2, the printing device 2 includes a substrate holding unit 11 that holds a substrate KB, and a substrate holding unit movement mechanism 12 that moves the substrate holding unit 11 in the X, Y, and Z directions (see also FIG. 3). A pair of guide rails 13 are provided above the substrate holding unit 11 and extend in the Y direction, and a mask 14 is supported in a horizontal position by the pair of guide rails 13.

[0013] 1 and 2, a print head 15 is provided above the guide rail 13 (see also FIG. 3). A connecting base 16 is provided at the rear of the print head 15 so as to be movable in the Y direction. A solder recovery section 17 and a mask operation cylinder 18 are provided on the connecting base 16. The connecting base 16 cannot move on its own, but moves in the Y direction together with the print head 15 by connecting section 16B provided at the front end to the rear end of the print head 15. A mask drawer and storage section 19 is provided in the area between the guide rail 13 and the board holding section 11 (FIG. 2).

[0014] 3, the substrate holding unit 11 includes a pair of conveyors 21, a lifting base 22, a lifter 23, a lower support unit 24, and a pair of clampers 25. The pair of conveyors 21 are disposed opposite each other in the Y direction, and transport the substrate KB sent from the outside in the X direction.

[0015] The lifting base 22 is made of a plate-shaped member, and is supported in a horizontal position by the substrate holder moving mechanism 12. The lifter 23 is attached to the lifting base 22, and moves the lower support part 24 relative to the lifting base 22 in the Z direction.

[0016] The lower support portion 24 includes a block-shaped base portion 24a extending along the XY plane, and a plurality of support pins 24b attached to the upper surface of the base portion 24a. The lower support portion 24 supports the lower surface of the substrate KB by abutting the upper ends of the plurality of support pins 24b against the lower surface of the substrate KB.

[0017] The pair of clampers 25 are disposed facing each other in the Y direction. Each of the pair of clampers 25 is freely movable in the Y direction (toward or away from each other), and is supported by the lower support 24 to clamp the substrate KB from the Y direction (front-to-back direction). The substrate-holding-part moving mechanism 12 moves the lift base 22 in the horizontal plane (XY plane) and in the Z direction, thereby moving the entire substrate holding part 11 in the X, Y and Z directions.

[0018] 4, a pair of guide rails 13 are disposed facing each other in the X direction, and each guide rail 13 is formed in an L-angle shape and extends in the Y direction. The mask 14 is supported at both ends in the X direction by the pair of guide rails 13, and can be moved by sliding along the guide rails 13 in the Y direction.

[0019] 4, the mask 14 has a rectangular shape and is supported by a rectangular frame 14W. The mask 14 is made of a plate-like member and has a pattern opening 14H in the center that corresponds to the electrode pattern DK of the substrate KB. Of the four sides of the frame 14W, the mask 14 has two sides that extend in the Y direction and face each other in the X direction, which are supported by a pair of guide rails 13. The mask 14 is positioned at a predetermined position (mask installation position MSI; FIG. 3) above the substrate holding part 11.

[0020] 3, the print head 15 comprises a head base 31 extending in the X direction, and a squeegee block 32L provided on the head base 31. The head base 31 is moved in the Y direction by a print head moving mechanism 15K comprised of a ball screw mechanism or the like. The squeegee block 32L comprises two squeegees 32 at each of its front and rear portions.

[0021] In Fig. 3, the two squeegees 32 provided in the squeegee block 32L are composed of a first squeegee 32A located on the near side (front) as viewed from the operator OP and having an inclined shape that approaches the near side as it goes downward, and a second squeegee 32B located on the far side (rear) as viewed from the operator OP and having an inclined shape that moves away from the near side as it goes downward. As shown in Fig. 3, the first squeegee 32A and the second squeegee 32B are arranged so that they have a diverging shape in which the distance between them increases as they go downward in a side view seen from the X direction.

[0022] 3, two squeegee control cylinders 33 (a front squeegee control cylinder 33A and a rear squeegee control cylinder 33B) are provided on the head base 31. The piston rods 33R of the two squeegee control cylinders 33 both extend below the head base 31, and the squeegee block 32L is attached to the lower ends of the two piston rods 33R via a link mechanism 34.

[0023] 5(a) and (b), the squeegee block 32L can be changed in height and inclination (tilt about an axis along the X direction) via the link mechanism 34 by adjusting the downward projection length of the piston rod 33R of each of the front squeegee control cylinder 33A and the rear squeegee control cylinder 33B from the standby position (FIG. 3) where the entire squeegee block 32L is in a horizontal position. In detail, the squeegee block 32L can be brought into a forward lowered position by making the projection length of the piston rod 33R of the front squeegee control cylinder 33A longer than the projection length of the piston rod 33R of the rear squeegee control cylinder 33B (FIG. 5(a)). Conversely, the squeegee block 32L can be brought into a rear lowered position by making the projection length of the piston rod 33R of the rear squeegee control cylinder 33B longer than the projection length of the piston rod 33R of the front squeegee control cylinder 33A (FIG. 5(b)).

[0024] By lowering the squeegee block 32L forward (FIG. 5(a)), the lower end of the first squeegee 32A can be brought into contact with the upper surface of the mask 14. Then, by moving the squeegee block 32L rearward in this state, the solder paste Pst on the mask 14 can be scraped rearward. Also, by lowering the squeegee block 32L rearward (FIG. 5(b)), the lower end of the second squeegee 32B can be brought into contact with the upper surface of the mask 14. Then, by moving the squeegee block 32L forward in this state, the solder paste Pst on the mask 14 can be scraped rearward.

[0025] 2, the mask operation cylinder 18 is provided on the connecting base 16 and extends in the vertical direction. The mask operation cylinder 18 has a piston rod (operation rod 18R) that can freely advance and retreat downward. In an operation such as replacing the mask 14, the mask operation cylinder 18 performs an operation of moving a new mask 14 pulled out from the mask storage device 3 to the mask installation position MSI (FIG. 6(a)→FIG. 6(b)), and an operation of moving a used mask 14 from the mask installation position MSI to the mask storage device 3 (FIG. 7(a)→FIG. 7(b)).

[0026] 2 and 3, the solder recovery unit 17 includes a scraper lifting cylinder 17S that is provided on the connecting base 16 and moves a piston rod (scraper operating rod 17R) downward and backward, and a scraper 17P that is provided at the lower end of the scraper operating rod 17R. The scraper 17P is made of a plate-shaped member whose lower end extends obliquely forward.

[0027] During the mask 14 replacement operation, the mask pull-out storage section 19 moves in the Y direction in the rear area of ​​the guide rails 13 to store and pull out the mask 14 relative to the mask storage device 3. The mask 14 storage operation is an operation of returning the used mask 14, which has been moved by the mask operating cylinder 18 from the mask installation position MSI to the mask storage device 3 side, to the mask storage device 3, and the mask pull-out operation is an operation of pulling out a new mask 14 from the mask storage device 3.

[0028] 1 and 2, the mask storage device 3 includes a magazine 41 and a magazine elevator 42. The magazine 41 is made of a box-shaped member that is open on both the front and back sides. The magazine 41 is provided with a plurality of slots 41S aligned in the Z direction. Each slot 41S stores a plurality of types of replacement masks 14 corresponding to the type of substrate KB to be produced (FIG. 2).

[0029] 1 and 2, the magazine elevator 42 can raise and lower a table 42B that extends along a horizontal plane. The magazine 41 is placed on the table 42B, and the magazine elevator 42 raises and lowers the magazine 41 by moving the table 42B in the vertical direction (arrow A shown in FIG. 2).

[0030] 8, a control unit 50 provided in the printing system 1 controls each of the operations of the conveyor 21 provided in the substrate holding unit 11 to transport the substrate KB, the lifter 23 to raise and lower the support unit 24, the clamper 25 to clamp the substrate KB, and the substrate holding unit 11 to move in the X, Y, and Z directions by the substrate holding unit movement mechanism 12. The control unit 50 also controls each of the operations of adjusting the attitude of the squeegee block 32L provided in the print head 15 by the two squeegee control cylinders 33, moving the print head 15 by the print head movement mechanism 15K, raising and lowering the scraper 17P by the scraper lift cylinder 17S, moving the mask 14 by the mask operation cylinder 18, moving the mask 14 by the mask drawer and storage unit 19, and raising and lowering the magazine 41 by the magazine elevator 42.

[0031] 8, the control unit 50 includes a storage unit 51. The control unit 50 outputs commands to the above-mentioned respective units according to a task execution program 52 stored in the storage unit 51. The printing system 1 operates based on the individual commands output from the control unit 50 to execute a printing task.

[0032] When the printing system 1 executes a printing job to print solder paste Pst on the board KB, the control unit 50 first reads the type of mask 14 (the mask 14 to be used) specified in the job execution program 52. Then, based on the information on the type of mask 14 that has been read, the control unit 50 operates the magazine elevator 42 and the mask drawer / storage unit 19 to draw out the mask 14 to be used from the mask storage device 3.

[0033] After the mask 14 to be used is pulled out from the mask storage device 3 by the mask pull-out storage unit 19, the control unit 50 connects the connection base 16 to the head base 31 of the print head 15. Then, the control unit 50 causes the operation rod 18R to protrude downward from the mask operation cylinder 18, and moves the mask operation cylinder 18 in the manner described above (FIG. 6(a) → FIG. 6(b)), thereby placing the mask 14 at the mask placement position MSI.

[0034] After placing the mask 14 at the mask placement position MSI, the control unit 50 causes the conveyor 21 to carry in the substrate KB sent from outside the printing apparatus 2, and positions the substrate KB at a position below the mask 14. Once the substrate KB is positioned below the mask 14, the control unit 50 actuates the lifter 23 to raise the lower support portion 24. As a result, the substrate KB is supported (supported) from below by the lower support portion 24 and lifted (arrow B shown in FIG. 9), and once the upper surface of the substrate KB is at the same height as the upper surface of the clamper 25, the lifting of the lower support portion 24 by the lifter 23 is stopped.

[0035] After the control unit 50 stops the lifting of the lower support unit 24, it causes the clamper 25 to clamp both ends of the substrate KB (arrow C shown in FIG. 9). After the substrate KB is clamped, the substrate holder moving mechanism 12 lifts the entire substrate holder 11, and the upper surface of the substrate KB contacts the lower surface of the mask 14 (arrow D shown in FIG. 10). Hereinafter, of the planar view area of ​​the mask 14 shown in FIG. 4, the area with which the upper surface of the front clamper 25 contacts is referred to as the "front clamper contact area 14Rf," and the area with which the upper surface of the rear clamper 25 contacts is referred to as the "rear clamper contact area 14Rr."

[0036] When the board KB comes into contact with the mask 14, solder paste Pst is supplied onto the upper surface of the mask 14. The solder paste Pst is supplied manually by an operator OP or automatically by a solder paste supplying device (not shown) provided in the printing system 1. The solder paste Pst is supplied to one of the front clamper contact area 14Rf and the rear clamper contact area 14Rr on the mask 14, but in this embodiment, the solder paste Pst is supplied to the front clamper contact area 14Rf, which is the side closer to the operator OP.

[0037] Once the solder paste Pst has been supplied to the mask 14, the control unit 50 causes the squeegee block 32L to perform a coating operation to coat the solder paste Pst on the board KB through the pattern openings 14H of the mask 14. In the coating operation, the control unit 50 moves the print head 15 alternately in the Y direction and in the opposite direction while switching the position of the squeegee block 32L.

[0038] When causing the squeegee block 32L (i.e., the two squeegees 32) to perform a coating operation, the control unit 50 first operates the two squeegee control cylinders 33 to lower the lower end of the squeegee 32 to be used in the coating operation (hereinafter referred to as the "used squeegee 32U") of the two squeegees 32 provided in the squeegee block 32L, and bring it into contact with the upper surface of the mask 14. Here, as described above, the solder paste Pst is supplied first to the front clamper contact region 14Rf, so that the first squeegee 32U to be used is the first squeegee 32A (FIG. 11(a)).

[0039] When the lower end of the first squeegee 32A, which is the squeegee 32U in use, comes into contact with the upper surface of the mask 14, the control unit 50 moves the print head 15 in the Y direction (rearward) (FIG. 11(a)→FIG. 11(b)), and the first squeegee 32A scrapes the solder paste Pst on the front clamper contact area 14Rf to the rear clamper contact area 14Rr. The movement of the solder paste Pst on the mask 14 during this time fills the pattern openings 14H with the solder paste Pst, and the solder paste Pst is applied to the electrode patterns DK on the board KB through the pattern openings 14H. Such an application operation of the solder paste Pst by the first squeegee 32A is hereinafter referred to as the "first application operation."

[0040] When the solder paste Pst has been applied to the electrode pattern DK on the substrate KB, the control unit 50 positions the squeegee block 32L, which has completed the application operation (first application operation), in the standby position (FIG. 11(c)). Then, the substrate holder moving mechanism 12 lowers the substrate holder 11 (arrow E shown in FIG. 11(c)), and the substrate KB is separated from the mask 14 in a "plate release" process. The conveyor 21 is then operated to transport the substrate KB to the outside. This completes the printing operation for one substrate KB.

[0041] After the control unit 50 has carried out the board KB on which the printing operation has been performed, it carries in the next board KB to which the solder paste Pst is to be applied in the manner described above, holds it using the board holding unit 11, and brings it into contact with the lower surface of the mask 14 (arrow F shown in FIG. 12(a)). Then, it moves the print head 15 so that the second squeegee 32B, which is the next squeegee 32U to be used, is positioned above the solder paste Pst, and then it lowers the lower end of the second squeegee 32B to abut against the upper surface of the mask 14 (rear clamper contact area 14Rr) (FIG. 12(a)).

[0042] When the lower end of the second squeegee 32B, which is the squeegee 32U in use, comes into contact with the upper surface of the mask 14, the control unit 50 moves the print head 15 in the Y direction (forward) (FIG. 12(a)→FIG. 12(b)), and the second squeegee 32B scrapes the solder paste Pst on the rear clamper contact area 14Rr to the front clamper contact area 14Rf. The movement of the solder paste Pst on the mask 14 during this time fills the pattern openings 14H with the solder paste Pst, and the solder paste Pst is applied to the electrode patterns DK on the board KB through the pattern openings 14H. Such an application operation of the solder paste Pst by the second squeegee 32B is hereinafter referred to as the "second application operation."

[0043] Once the solder paste Pst has been applied to the electrode pattern DK on the substrate KB, the control unit 50 positions the squeegee block 32L, which has completed the application operation (second application operation), in a standby position (FIG. 12(c)). Then, the substrate holder moving mechanism 12 lowers the substrate holder 11 (arrow E shown in FIG. 12(c)), and performs mask release to separate the substrate KB from the mask 14. Thereafter, the printing operation on the substrate KB is repeatedly performed using the same procedure as described above.

[0044] In this manner, the printing system 1 (printing device 2) in this embodiment has two squeegees 32 (a first squeegee 32A and a second squeegee 32B) arranged opposite each other, and is configured to repeatedly perform an application operation in which the solder paste Pst supplied onto the mask 14 is scraped up alternately and in opposite directions by the two squeegees 32, thereby applying the solder paste Pst to the substrate KB through the pattern opening 14H provided in the mask 14.

[0045] When the printing operation by the printer 2 is repeatedly performed and it becomes necessary to change the type of the board KB, the control unit 50 operates the magazine elevator 42, the mask drawer and storage unit 19, the print head 15, and the mask operation cylinder 18 to move the used mask 14 from the mask installation position MSI and return it to the magazine 41, and to pull out a new mask 14 from the magazine 41 and install it at the mask installation position MSI, thereby performing a mask 14 replacement operation. In this mask 14 replacement operation, before the used mask 14 is moved from the mask installation position MSI, the control unit 50 causes the solder recovery unit 17 to perform a solder recovery operation to recover the solder paste Pst on the mask 14.

[0046] When the control unit 50 causes the solder recovery unit 17 to perform a solder recovery operation, it first connects the connection base 16 to the head base 31 of the print head 15, and then moves the print head 15 (i.e., the solder recovery unit 17) so that the scraper 17P is positioned above and behind the solder paste Pst to be recovered. Then, the control unit 50 lowers the scraper 17P using the scraper lift cylinder 17S, and brings the bottom end of the scraper 17P into contact with the mask 14 (FIG. 13(a)). At this time, the bottom end of the scraper 17P is made to contact a position on the mask 14 behind the solder paste Pst to be recovered.

[0047] When the lower end of the scraper 17P comes into contact with the mask 14, the control unit 50 moves the print head 15 forward (FIG. 13(b)), while raising the scraper 17P using the scraper lift cylinder 17S, so that the scraper 17P scoops up the solder paste Pst (FIG. 13(c)). As a result, the solder paste Pst on the used mask 14 is collected by the solder collection unit 17.

[0048] After the solder paste Pst on the used mask 14 is collected by the solder collection unit 17, the control unit 50 moves the print head 15 to a position forward of the mask 14. Then, when a new mask 14 is placed at the mask placement position MSI, the control unit 50 positions the print head 15 above the new mask 14 and lowers the solder paste Pst onto the new mask 14. At this time, the control unit 50 operates the print head 15 and the solder collection unit 17 in the reverse order to the procedure used to collect the solder paste Pst from the used mask 14. The area on the new mask 14 onto which the solder paste Pst is lowered is the area (front clamper contact area 14Rf) that the front clamper 25 comes into contact with when the new board KB comes into contact with the mask 14 in a clamped state.

[0049] In the printing system 1 (printing device 2) in this embodiment, the solder recovery unit 17 recovers the solder paste Pst as described above, but before that, an operation (solder cutting operation) is performed to return at least a part of the solder paste Pst attached to each of the two squeegees 32 (the first squeegee 32A and the second squeegee 32B) to the mask 14 side. The solder cutting operation is performed, for example, by moving the squeegee 32 (the first squeegee 32A or the second squeegee 32B) in the vertical direction so that the solder paste Pst attached to the squeegee 32 touches the mask 14. The solder cutting operation is an operation necessary to prevent a situation in which the solder paste Pst drips from the squeegee 32 and soils the printing device 2 during replacement of the mask 14, etc.

[0050] When performing the solder cutting operation for the first squeegee 32A, the control unit 50 raises the squeegee block 32L that has completed the first application operation to a standby position above the rear clamper contact area 14Rr (FIG. 14(a)), and then lowers the first squeegee 32A toward a position closer to the board KB side (front) than the solder paste Pst that has been moved to the rear clamper contact area 14Rr by the first application operation. When a part of the solder paste Pst that has been attached to the first squeegee 32A comes into contact with the upper surface of the mask 14 (FIG. 14(b)), the control unit 50 raises the squeegee block 32L to a standby position (FIG. 14(c)). As a result, at least a part of the solder paste Pst that has been attached to the first squeegee 32A is returned to the mask 14 side, and the first squeegee 32A is in a state of being solder cut.

[0051] On the other hand, when performing the solder cutting operation for the second squeegee 32B, the control unit 50 raises the squeegee block 32L that has completed the second application operation to a standby position above the front clamper contact area 14Rf (FIG. 15(a)), and then lowers the second squeegee 32B toward a position on the board KB side (rear) of the solder paste Pst that has been moved to the front clamper contact area 14Rf by the second application operation. When a part of the solder paste Pst that has been attached to the second squeegee 32B comes into contact with the upper surface of the mask 14 (FIG. 15(b)), the control unit 50 raises the squeegee block 32L to a standby position (FIG. 15(c)). As a result, at least a part of the solder paste Pst that has been attached to the second squeegee 32B is returned to the mask 14 side, and the second squeegee 32B is in a state of being solder cut.

[0052] The above-mentioned solder cutting operation can be performed at any timing, such as immediately after the first application operation is completed for the first squeegee 32A and immediately after the second application operation is completed for the second squeegee 32B, but is usually performed immediately before the recovery operation of the solder paste Pst is performed by the solder recovery section 17 (immediately after the first application operation by the first squeegee 32A and immediately after the second application operation by the second squeegee 32B which is performed immediately after the first application operation). To explain the control of the squeegees 32 (first squeegee 32A and second squeegee 32B) in this case, the control unit 50 first causes the first squeegee 32A to perform a first coating operation (Figure 11(a) → Figure 11(b) → Figure 11(c), Figure 16(a)), and when the first coating operation by the first squeegee 32A is completed, causes the first squeegee 32A to perform a solder cutting operation near the end position of the first coating operation (Figure 14(a) → Figure 14(b) → Figure 14(c), Figure 16(b) → Figure 16(c)).

[0053] After the control unit 50 causes the first squeegee 32A to perform the solder cutting operation, it then causes the second squeegee 32B to perform the second application operation (FIG. 16(d)). At this time, the control unit 50 controls the print head 15 (squeegee block 32L) so that the solder paste Pst returned to the mask 14 side by the solder cutting operation performed by the first squeegee 32A is scraped forward by the second squeegee 32B (i.e., in the second application operation) together with the solder paste Pst scraped backward in the first application operation (FIG. 16(d)). Then, when the second application operation by the second squeegee 32B is completed, the control unit 50 causes the second squeegee 32B to perform the solder cutting operation near the end position of the second application operation (FIG. 15(a)→FIG. 15(b)→FIG. 15(c), FIG. 16(e)→FIG. 16(f)).

[0054] As a result, when the solder cutting operation is completed for both of the two squeegees 32 (the first squeegee 32A and the second squeegee 32B), almost all of the solder paste Pst on the mask 14 is gathered in the front clamper contact area 14Rf (FIGS. 15(c) and 16(f)). For this reason, in the printing device 2 (printing system 1) in this embodiment, the solder recovery unit 17 scoops up the solder paste Pst gathered in the front clamper contact area 14Rf with the scraper 17P (FIGS. 13(a)→13(b)→13(c)), so that it is possible to recover most of the solder paste Pst on the mask 14. During the recovery of the solder paste Pst and during the replacement work of the mask 14, the solder paste Pst does not drip from either of the two squeegees 32, and it is possible to prevent the printing device 2 from being soiled by the solder paste Pst dripping from the squeegee 32.

[0055] As described above, the printing system 1 in this embodiment includes a printing device 2, a mask storage device 3 that stores a replacement mask 14, and a mask operation cylinder 18 and a mask drawer storage section 19 as mask replacement means that replaces a used mask 14 installed at the mask installation position MSI of the printing device 2 with a replacement mask 14 stored in the mask storage device 3. Before the used mask 14 is moved from the mask installation position MSI by the mask replacement means, the printing device 2 performs a solder cutting operation on each of the two squeegees 32 (the first squeegee 32A and the second squeegee 32B), and then the solder recovery section 17 recovers the solder paste Pst on the used mask 14.

[0056] In the above description, the recovery operation of the solder paste Pst is performed on the front clamper contact area 14Rf, but this is because the solder paste Pst is collected in the front clamper contact area 14Rf before the recovery operation of the solder paste Pst is performed. Therefore, if the solder paste Pst is collected in the rear clamper contact area 14Rr, the recovery operation of the solder paste Pst will be performed on the rear clamper contact area 14Rr.

[0057] As described above, in the printing system 1 (printing device 2) in this embodiment, when performing a solder cutting operation for returning at least a part of the attached solder paste Pst to the mask 14 side for each of the two squeegees 32 (the first squeegee 32A and the second squeegee 32B), the first squeegee 32A performs the solder cutting operation near the end position (rear clamper contact area 14Rr) of the first application operation, which is the application operation performed by the first squeegee 32A, and the second squeegee 32B performs the solder cutting operation near the end position (front clamper contact area 14Rf) of the second application operation, which is the application operation performed by the second squeegee 32B. That is, the first squeegee 32A and the second squeegee 32B perform solder cutting at different positions on the mask 14.

[0058] Therefore, when a solder cutting operation is performed for one of the two squeegees 32 (the first squeegee 32A and the second squeegee 32B), the one squeegee 32 does not come into contact with the solder paste Pst returned to the mask 14 side by the solder cutting operation performed earlier for the other squeegee 32, and this does not cause the solder paste Pst to re-adhere to the squeegee 32 that has once performed the solder cutting operation. Therefore, according to the printing system 1 (printing device 2) in this embodiment, it is possible to prevent the solder paste Pst returned to the mask 14 from the squeegee 32 that previously performed the solder cutting operation from re-adhering to the squeegee 32 that subsequently performed the solder cutting operation, and thus it is possible to prevent the printing device 2 from being soiled by the solder paste Pst dripping from the squeegee 32.

[0059] Although the embodiment of the present invention has been described so far, the present invention is not limited to the above, and various modifications are possible. For example, in the above embodiment, the solder cutting operation is described as an operation of moving the squeegee 32 close to the mask 14 (lowering it) and then moving it away from the mask 14 (raising it), but other operations may be used as long as at least a part of the solder paste Pst attached to the squeegee 32 can be returned to the mask 14 side.

[0060] Furthermore, in the above-described embodiment, the print head 15 is configured such that the two squeegees 32 (first squeegee 32A and second squeegee 32B) are each configured as part of a single squeegee block 32L, and the lower ends of each of the two squeegees 32 are selectively abutted against the mask 14 by tilting (rotating) the squeegee block 32L. However, this configuration is just one example, and the print head 15 may also be configured to have two squeegees that can be raised and lowered individually, and the lower ends of each of the two squeegees are abutted against the mask 14 by raising and lowering these two squeegees individually. [Industrial Applicability]

[0061] To provide a printing device and a printing system capable of preventing a situation in which paste, which has been returned to a mask from a squeegee that has previously performed a solder cutting operation, re-adheres to a squeegee that has subsequently performed a solder cutting operation. [Explanation of symbols]

[0062] 1 Printing System 2 Printing device 3 Mask storage device 14 Mask 14H pattern opening 14Rf Front clamper contact area 14Rr Rear clamper contact area 15 Print Head 17 Solder recovery section 17P scraper 18 Mask operation cylinder (mask replacement means) 19 Mask drawer storage section (mask replacement means) 25 Clamper 32 Squeegee 32U Squeegee used 32A First Squeegee 32B Second Squeegee 33 Squeegee control cylinder 50 Control section MSI mask installation position Pst solder paste KB board OP Operator

Claims

1. A printing device having a first squeegee and a second squeegee arranged opposite to each other, which repeatedly performs an application operation of applying solder paste onto a substrate through a pattern opening provided in the mask by alternately scraping the solder paste supplied onto the mask in opposite directions with the first squeegee and the second squeegee, A printing device in which, when a solder cutting operation is performed for each of the first squeegee and the second squeegee to return at least a portion of the adhered solder paste to the mask side, the solder cutting operation is performed for the first squeegee near the end position of a first application operation, which is a application operation performed by the first squeegee, and the solder cutting operation is performed for the second squeegee near the end position of a second application operation, which is a application operation performed by the second squeegee.

2. 2. The printing device of claim 1, wherein when the solder cutting operation is performed with the first squeegee and then the solder paste is scraped up by a second application operation with the second squeegee, the second squeegee scrapes up the solder paste that was returned to the mask side by the solder cutting operation performed with the first squeegee together with the solder paste scraped up by the first application operation in the second application operation.

3. 3. The printing device according to claim 2, further comprising a solder recovery unit that recovers the solder paste on the mask, the solder recovery unit recovering both the solder paste scraped up by the second application operation by the second squeegee and the solder paste returned to the mask by the solder cutting operation performed by the second squeegee.

4. 2. The printing apparatus according to claim 1, wherein the first squeegee is disposed in front of an operator who operates the printing apparatus, and the second squeegee is disposed behind the operator.

5. 4. A printing system comprising: the printing device according to claim 3; a mask storage device for storing a replacement mask; and a mask exchange means for exchanging a used mask placed at a mask placement position of the printing device with the replacement mask stored in the mask storage device, A printing system in which, before a used mask is moved from the mask installation position by the mask replacement means, the printing device performs the solder cutting operation for each of the first squeegee and the second squeegee, and then the solder recovery unit recovers the solder paste on the used mask.

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