Two-chamber reactor for epitaxial deposition of semiconductor material on substrates
The double-chamber reactor with independent heating and cooling systems for each chamber addresses the maintenance downtime issue in existing reactors, enabling continuous operation and improving throughput and footprint efficiency.
Patent Information
- Application Number
- JP2024189051
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-10-31
- Filing Date
- 2024-10-28
- Publication Date
- 2025-05-15
AI Technical Summary
Existing epitaxial deposition reactors for semiconductor materials, particularly silicon carbide, often require significant maintenance downtime as both reaction chambers typically need to be shut down for maintenance, reducing overall reactor throughput and increasing footprint.
A double-chamber reactor design with independent induction heating and liquid cooling systems for each chamber, featuring a common coolant reservoir with independent compartments that allow for simultaneous operation and maintenance of one chamber while the other is being maintained.
This design enables continuous epitaxial deposition processing in one chamber while the other is undergoing maintenance, improving reactor throughput and reducing the overall footprint, while also ensuring efficient cooling and heating of each chamber independently.
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Figure 2025076367000001_ABST
Abstract
Description
[Technical field]
[0001] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Below, a reactor for epitaxial deposition of semiconductor material onto a substrate is described.
[0002] In particular, the semiconductor material deposited is silicon carbide, although other materials are not excluded.
[0003] The substrate onto which it is deposited is typically composed of silicon carbide, although other materials are not excluded. [Background technology]
[0004] Reactors for the epitaxial deposition of silicon carbide have long been known.
[0005] In order to increase the throughput of a reactor, it is generally known to provide the reactor with at least two reaction chambers.
[0006] The advantage of having one (at least) two-chamber reactor instead of two one-chamber reactors is that it avoids duplication of components per reactor, i.e. some components can potentially be used for both chambers. This also reduces the reactor footprint, i.e. the footprint of a two-chamber reactor is smaller than the sum of the footprints of two one-chamber reactors.
[0007] From a design perspective, it is conceptually possible to start with a single-chamber reactor design and then consider how to integrate two (or more) reactors.
[0008] It is therefore desirable to integrate the reactor as much as possible.
[0009] In particular, it is desirable for each reaction chamber to be separately and independently serviceable, i.e., while maintenance is being performed on one chamber, the other chamber is operational and can be used to perform epitaxial deposition processes. Summary of the Invention [Means for solving the problem]
[0010] Some examples of the innovative dual chamber reactor include a first reaction chamber, a second reaction chamber, an inductive heating system for the first reaction chamber and the second reaction chamber, and a liquid cooling system for the first reaction chamber and the second reaction chamber, the liquid cooling system including a reservoir for containing and recirculating a cooling liquid, the reservoir including a first reservoir compartment and a second reservoir compartment in fluid communication with each other.
[0011] Another example of an innovative dual chamber reactor design comprises a first reaction chamber extending along a first longitudinal direction, a second reaction chamber extending along a second longitudinal direction, an inductive heating system for the first reaction chamber and the second reaction chamber, and a liquid cooling system for the first reaction chamber and the second reaction chamber, the first longitudinal direction and the second longitudinal direction being parallel, the first reaction chamber and the second reaction chamber being disposed side by side in two spaces and separated by at least a metal plate, the metal plate being configured to mechanically and / or fluidly and / or magnetically isolate each reaction chamber from each other.
[0012] Examples of innovative dual chamber reactor designs will become more apparent from the following detailed description, which should be considered in conjunction with the accompanying drawings, in which: [Brief description of the drawings]
[0013] [Figure 1] 1 shows a schematic of some aspects of an example of an innovative two-chamber reactor design. [Diagram 2] 1 shows another embodiment of an example of an innovative two-chamber reactor design, shown diagrammatically (and from above). DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0014] As can be easily understood, there are various ways of actually designing the innovative dual chamber reactor, which are defined in their main advantageous aspects in the appended claims and are not limited by either the following detailed description or the accompanying drawings.
[0015] It should also be noted that the technical features exemplified below in relation to the specific embodiments are not considered to be closely related to each other and therefore are not considered to be binding on each other, even if they can be advantageously combined.
[0016] 1 and 2 show schematic diagrams of different aspects of the same example reactor 1000 design for epitaxial deposition of semiconductor material onto a substrate.
[0017] The reactor 1000 comprises a first reaction chamber 100 and a second reaction chamber 200. According to other design examples, the number of reaction chambers may be three or more.
[0018] Additionally, the reactor 1000 includes a chamber heating system and a chamber cooling system. The heating system typically includes separate and / or independent components for each chamber. The cooling system typically includes separate and / or independent components for each chamber, while also typically including at least one common reservoir.
[0019] In Fig. 2, the heating system is indicated diagrammatically with the reference number 300. Fig. 1 diagrammatically shows some possible components of the heating system 300, in particular (at least) one inductor 310 associated with or forming part of the first chamber, and (at least) one inductor 320 associated with or forming part of the second chamber 200, as well as a power supply system 330 supplying power to the inductors 310 and 320. Inductive heating of reaction chambers of epitaxial reactors, in particular hot-wall type chambers used for depositing silicon carbide, is known per se, so further details will be omitted here.
[0020] In Fig. 2, the cooling system is indicated generally with the reference number 400. Fig. 1 again generally illustrates some possible components of the cooling system 400, which will be described in more detail below. Fig. 2 is intended to show generally the flow of a coolant, specifically water, which first enters a hollow-walled (typically quartz) tube (element 110 of chamber 100 and element 210 of chamber 200), then flows through the tube and finally exits the tube. Typically, the cooling system 400 is designed to recirculate the coolant, as shown in Fig. 2.
[0021] Referring to FIG. 1, the reactor 1000 includes: a first reaction chamber 100, a second reaction chamber 200; - an induction heating system for the first reaction chamber 100 and the second reaction chamber 200 (e.g., components 310, 320 and 330); a liquid cooling system for the first reaction chamber 100 and the second reaction chamber 200;
[0022] The heating system typically includes a power supply system 330 consisting of a first power supply 331 for heating the first reaction chamber 100 and a second power supply 332 for heating the second reaction chamber 200 .
[0023] The cooling system comprises a reservoir 450 designed to contain and recirculate a cooling fluid. The reservoir 450 comprises a first reservoir compartment 452 and a second reservoir compartment 454, which are in fluid communication with each other. In the example of Fig. 1, the bottom of the first reservoir compartment 452 and the bottom of the second reservoir compartment 454 are flat and are juxtaposed. Thus, the bottom of the reservoir 450 is flat.
[0024] The first storage compartment 452 and the second storage compartment 454 may be in fluid communication via conduits and / or valves and / or walls. In the example of Figure 1, such fluid communication occurs via a wall 456 of a predetermined height.
[0025] Advantageously, the first storage compartment 452 and the second storage compartment 454 are in fluid communication at a predefined height, specifically from the height of the bottom of said storage 450, which corresponds to the height of the wall 456 from the bottom of the storage 450, which is flat and unique in this example, as shown in FIG. 1. This means that the storage 450 acts as a common storage for the chambers 100 and 200 when the liquid level is higher than the predefined height. If for any reason, specifically due to a breakdown or rupture, the liquid level in the storage 450 falls below this predefined height, each of the storage compartments becomes independent from each other, allowing independent liquid recirculation cooling, specifically the first compartment 452 for the first chamber 100 and the second compartment 454 for the second chamber 200.
[0026] In the example reactor design shown in FIG. 1, reaction chamber 100 and reaction chamber 200 respectively comprise hollow wall tubes 110 and 210 with cavities in the tubes providing annular ducts running in the same longitudinal direction as the tubes, or substantially the entire length of the tubes. Each of the tubes' hollow walls is cooled by a cooling fluid flowing in the cavity. The cooling system is configured such that the coolant, specifically water, flows first from reservoir 450 to tubes 110 and 210 and then back from tubes 110 and 210 to reservoir 450. In the example of FIG. 1, the coolant enters the hollow wall tubes from one side and exits from the other side, absorbing heat along this path and then increasing in temperature. If the inlet temperature is, for example, 20° C., the outlet temperature can be, for example, 30-40° C.
[0027] In the example reactor shown in Fig. 1, the circulation of the cooling fluid is achieved by a pump. Specifically, the cooling system comprises a first pump 410 and a second pump 420, where the first pump 410 is in fluid communication with the first storage compartment 452 and the second pump 420 is in fluid communication with the second storage compartment 454. Preferably, the first pump 410 and the second pump 420 suck the coolant from the bottom of the first storage compartment 452 and the second storage compartment 454, respectively, and direct the coolant to the reaction chamber, specifically the chamber tube.
[0028] In Fig. 1, a return conduit is shown diagrammatically dropping directly into the reservoir compartment from above and carrying the coolant from the reaction chamber, specifically the chamber conduit, into the reservoir, although alternative configurations of such a return conduit are foreseeable.
[0029] Advantageously, the cooling system comprises a liquid cooler, which, depending on how it is constructed, comprises several components. Such a liquid cooler has the purpose of lowering the temperature of the coolant that leaves the reaction chamber, in particular the chamber tube. In fact, as mentioned above, the coolant enters the reaction chamber and, since it warms up as it removes heat from the reaction chamber, it is advantageous to force-cool it before re-entering the reaction chamber, in particular the chamber tube.
[0030] According to a first design, the liquid cooler comprises a first heat exchanger 431 configured to cool the coolant directed to the first tube 110 via a flow of water from outside the reactor 1000, which flow is shown diagrammatically in Fig. 1 by a line associated with the letter designation "H2O" (bottom of Fig. 1). The heat exchanger 431 in Fig. 1 is shown diagrammatically as an element in contact with a conduit leaving the first pump 410. In this case, the coolant is cooled by said heat exchanger after leaving the reservoir 450, specifically the first reservoir section 452.
[0031] According to a second design, the liquid cooler comprises a second heat exchanger 432 configured to cool the coolant directed to the second tube 210 via a flow of water from outside the reactor 1000, such flow being diagrammatically indicated in FIG. 1 by a line associated with the letter designation "H2O" (at the bottom of FIG. 1). The heat exchanger 432 in FIG. 1 is diagrammatically indicated as an element in contact with the conduit leaving the second pump 420. In this case, the coolant is cooled by said heat exchanger after leaving the reservoir 450, specifically the second reservoir section 454.
[0032] According to a third design, the liquid cooler comprises a third heat exchanger 435 configured to cool the coolant present in the reservoir 450 via a flow of water from outside the reactor 1000, such flow being diagrammatically shown in FIG. 1 by a line associated with the letter designation "H2O" (bottom of FIG. 1). The heat exchanger 435 in FIG. 1 is intended to cool both the coolant present in the reservoir compartment 452 and in the reservoir compartment 454. Although the heat exchanger 435 in FIG. 1 is diagrammatically shown as an element in contact with both the bottom of the reservoir 450, specifically the bottom of the reservoir compartment 452 and the bottom of the reservoir compartment 454, the heat exchanger may additionally or alternatively be in contact with the side walls of the reservoir 450, specifically the reservoir compartment 452 and / or the reservoir compartment 454. Alternatively, for example, the heat exchanger may consist of one or more coiled conduits inside reservoir 450, specifically reservoir compartment 452 and / or reservoir compartment 454, intended to facilitate the flow of water from outside the reactor.
[0033] According to a fourth design, the liquid cooler comprises a fourth heat exchanger 433 configured to cool the coolant from the first tube 110 via a flow of water from outside the reactor 1000, such flow being diagrammatically indicated in FIG. 1 by a line associated with the letters "H2O" (at the bottom of FIG. 1). The heat exchanger 433 in FIG. 1 is diagrammatically indicated as an element in contact with the conduit exiting from the tube 110. In this case, the coolant is cooled by said heat exchanger before returning to the reservoir 450, specifically to the first reservoir section 452.
[0034] According to a fifth embodiment, the liquid cooler comprises a fifth heat exchanger 434 configured to cool the coolant from the second tube 210 via a flow of water from outside the reactor 1000, such flow being diagrammatically represented in FIG. 1 by a line associated with the letters "H2O" (bottom of FIG. 1). The heat exchanger 434 in FIG. 1 is diagrammatically represented as an element in contact with the conduit leaving the tube 210. In this case, the coolant is cooled by said heat exchanger before returning to the reservoir 450, specifically to the second reservoir section 454.
[0035] Typically, when there are exchangers 431 and 432, Among various possibilities, it may be envisaged, for example, that A) only exchanger 435, or B) only exchangers 431 and 432, or C) exchangers 431, 432 and 435, or D) only exchangers 433 and 434, or E) exchangers 433, 434 and 435, or F) all exchangers 431, 432 and 433, 434 and 435 are provided.
[0036] The above is the cooling of each chamber, and specifically each chamber tube, under normal operating conditions.
[0037] Such cooling systems are advantageous because the capacity of the coolant is known and / or controlled or controllable, the temperature of the coolant (at various points in the circuit) may be known and / or controlled or controllable, and the flow (pressure and / or velocity) of the coolant (at various points in the circuit) may be known and / or controlled or controllable.
[0038] Such cooling systems are also advantageous because they are at least partially "redundant" due to the division of the tank into (partially) independent compartments, and, in particular, are open circuited, making it possible to maintain adequate, i.e. low and controlled, pressure to protect the typically quartz reaction chamber tubes.
[0039] However, it may be desirable to require cooling of each chamber even in the event of failure and / or malfunction of such a cooling system, i.e. a cooling system using a coolant contained in a tank and recirculated, for example via one or more pumps.
[0040] In practice, it should be noted that temperatures inside the reaction chamber can reach very high values (e.g., at least 1000°C and up to 1600°C or more for epitaxial deposition of silicon carbide at pressures between 0.1 and 1.0 atmospheres) and that flammable (e.g., hydrogen and / or methane) and / or toxic (e.g., silane) gases can flow into the reaction chamber.
[0041] Therefore, it is advantageous for the cooling system to also include other components.
[0042] Essentially, in the event of a cooling system failure (e.g., malfunction of pump 410 or pump 420, or a rupture in reservoir compartment 452 or reservoir compartment 454, or a rupture in tube 110 or tube 210) or malfunction (e.g., malfunction of pump 410 and / or pump 420), one or each chamber may be cooled in the other way. In this context, a "break" (e.g., of a tank or tank compartment or pipe) is defined as an event that results in the leakage of fluid (even if small), which may occur, for example, at a fluid junction.
[0043] For example, the cooling system may be configured to allow cooling water taken from a water stream outside the reactor 1000 (this flow is shown diagrammatically in FIG. 1 by a line associated with the letter designation "H2O") to flow into tube 110 and / or tube 210. This should normally only be done under certain conditions, in particular in case of failure or malfunction. The supply of this water flow can be selectively performed via manually and / or electrically controlled valves (not shown in FIG. 1), e.g., the control of these valves can be performed, for example, by an electronic control system (not shown in FIG. 1). In FIG. 1, the ability to send H2O water (directly) to chambers 100 and 200 is represented by two horizontal arrows (at the bottom of FIG. 1) coming from block 437 and a vertical arrow coming from block 437 into chambers 100 and 200. It should be noted that block 437 is not strictly necessary, but is illustrated below.
[0044] In this case, the cooling system is typically configured to drain the cooling water from the tubes 110 and / or 210. This outflow may be directed to a reservoir 450, as shown in FIG. 1. Alternatively, it may be directed to a special drain, precisely because the cooling water comes from outside the reactor 1000. This outflow may be selectively performed via manually and / or electrically controlled valves (not shown in FIG. 1), for example, the control of these valves may be performed, for example, by an electronic control system (not shown in FIG. 1). In FIG. 1, the ability to drain water (directly) from the chambers 100 and 200 is represented by the upper vertical arrows leaving the chambers.
[0045] Note that although the water and coolant pipe inlets are shown separate in FIG. 1 (specifically in the following figures), they could alternatively each run through the same conduit.
[0046] Note that although in FIG. 1 (and in the figures below specifically) the water and coolant pipe outlets are shown separate, they could alternatively each run through the same conduit.
[0047] The cooling system may be configured to treat water from outside the reactor before it enters the tubes of the reactor chamber, which may be, for example, physical filtration.
[0048] The cooling system may be configured to reduce the pressure of water from outside the reactor before it enters the chamber tube in the reactor. Because the chamber tube is fragile, it is possible to deliver water at a relatively low pressure (e.g., 0.2-1.7 bar, such as 1.5 bar), while the water taken from outside may be at a relatively high pressure (e.g., 3-6 bar, such as 4 bar).
[0049] In FIG. 1, block 437, for example, is designed to provide both water treatment (eg, water treatment such as water filtration) and water pressure reduction.
[0050] Referring to FIG. 2, the reactor 1000 (as already partially shown in FIG. 1) comprises: a first reaction chamber 100 extending along a first longitudinal direction L1; a second reaction chamber 200 extending along a second longitudinal direction L2; an inductive heating system 300 for the first reaction chamber 100 and for the second reaction chamber 200; a liquid flow cooling system 400 for the first reaction chamber 100 and for the second reaction chamber 200, The first longitudinal direction L1 and the second longitudinal direction L2 are parallel to each other.
[0051] The first reaction chamber 100 and the second reaction chamber 200 are disposed adjacent to and spaced apart from each other in two spaces 180 and 280 .
[0052] The separation is provided by one or more (typically metal) plates and / or one or more (typically metal) panels.
[0053] This separation is used to mechanically and / or fluidically and / or magnetically separate the reaction chambers.
[0054] Specifically, a metal plate 510 is required corresponding to at least the reaction chambers 100 and 200, and this metal plate 510 is configured to at least magnetically separate the reaction chambers from each other.
[0055] The possibility of magnetic isolation is related to the fact that the heating system 300 is inductive (magnetic), and therefore requires at least one inductor for each chamber. As can be seen in the figures, the inductors are typically solenoids that surround the chamber tubes and are oriented along the longitudinal direction of the tubes.
[0056] To achieve good magnetic insulation, the material of the metal plate 510 preferably has high magnetic permeability.
[0057] To achieve good magnetic insulation, the material of the metal plate 510 is preferably aluminum or permalloy, more preferably aluminum.
[0058] To provide good magnetic insulation, the metal plate 510 is preferably solid and has a thickness of 5-10 mm.
[0059] As can be seen in Fig. 2, the separation between the two gaps 180 and 280 may require both a metal plate 510 for magnetic isolation and one or more metal panels 520 and 530 for mechanical and / or fluidic isolation. As can be seen in Fig. 2, the plates are arranged to isolate not only magnetically but also mechanically and fluidically. As can be seen in Fig. 2, the panels are arranged to isolate mechanically and fluidly.
[0060] The possibility of mechanical separation is related to the creation of two separate spaces and is relevant not only for the operation of each chamber but also for maintenance purposes.
[0061] The possibility of fluid separation is associated with the possibility of (undesirable) gas leakage from the chamber, which may lead to an explosion.
[0062] For clarity (as may not be apparent from FIG. 2 ), it should be noted that plate 510 is centrally disposed (with respect to the support plane of the reactor), at least a first panel (specifically panel 520) is downwardly disposed (with respect to the support plane of the reactor), and at least a second panel (specifically panel 530) is upwardly disposed (with respect to the support plane of the reactor).
[0063] Both the plates and any panels are preferably solid, but may be provided with (small) openings for routing cables and / or conduits.
[0064] In Fig. 2, a system 700 for managing the exhaust gases leaving the reaction chambers is shown diagrammatically, showing the walls of its housing, which is, for example, box-shaped. Only one system is shown for all reaction chambers. In this design, the system is partly located in the area of the first reaction chamber 100 and partly in the area of the second reaction chamber 200. The surrounding wall of the implant 700 also contributes to the separation of the two spaces 180 and 280.
[0065] It can be seen that in the reactor 1000 shown in FIG. 2, in addition to the spaces 180 and 280 housing the reaction chambers 100 and 200, there are other spaces, in particular "maintenance spaces" (610, 620 and 630), i.e. spaces where personnel can perform maintenance operations on the reactor, in particular on the reaction chambers of the reactor.
[0066] Typically, openable panels are provided for entering the maintenance space, some of which can or should be fitted with an alarm device, while other panels may also be openable.
[0067] Wall 510 and / or panels 520 and 530 allow safe maintenance operations to be performed on one reaction chamber while the other chamber remains fully operational.
[0068] It is preferred that there is at least one maintenance space, ie at least one space in addition to the space for the reaction chamber.
[0069] In general, in innovative reactors: a first maintenance space 610 is arranged on a first side of the reactor and adjacent to the space 180 of the first reaction chamber 100; and / or a second maintenance space 620 is arranged on a second side of the reactor and adjacent to the space 280 of the second reaction chamber 200; and / or - A third maintenance space 630 is located at the front or rear of the reactor and is adjacent to both spaces 180 and 280 of the reaction chambers 100 and 200.
[0070] Space 630 is useful, for example, for evacuating the reaction chamber 100 or 200 to perform maintenance operations on the reaction chamber (particularly its gas inlet assembly) by means of a special slide on which the reaction chamber 100 or 200 can be placed and moved into space 630. When the first maintenance space and / or the second maintenance space (610, 620) are used, a third maintenance space may be adjacent to spaces 180 and 610 and / or spaces 280 and 620, as needed.
[0071] Space 610 is useful, for example, when performing maintenance work on reaction chamber 100, and in particular its gas exhaust assembly (not shown in FIG. 2), which may be referred to as an "exhaust cylinder" that is axially aligned with the reaction chamber near system 700 and may be cylindrical in shape.
[0072] Space 620 is useful, for example, when performing maintenance work on reaction chamber 200, and in particular its gas exhaust assembly (not shown in FIG. 2), which may be referred to as an "exhaust cylinder" that is axially aligned with the reaction chamber near system 700 and may be cylindrical in shape.
[0073] It will be apparent that the reactor 1000 may advantageously include both the components shown in FIG. 1 and the components shown in FIG. 2, as well as other components.
[0074] The reactor 1000 may be protected by a shell, which may be continuous or partially interrupted and may consist of one or more outer panels that may laterally surround the reactor to provide the sides of the shell. The one or more outer panels may also cover the top and bottom of the reactor when erected for operation to provide the top and bottom of the shell.
[0075] The top of the reactor shell advantageously comprises at least two panels adapted to swing open in the event of an overpressure condition of the reactor (or an explosion occurring). For example, the at least two panels may be hinged and adapted to open to provide a safety vent when the pressure inside the reactor exceeds a predetermined value.
Claims
1. A reactor (1000) for epitaxial deposition of a semiconductor material onto a substrate, comprising: The reactor comprises: A first reaction chamber (100); A second reaction chamber (200); an induction heating system for the first reaction chamber (100) and the second reaction chamber (200); a liquid flow cooling system for the first reaction chamber (100) and the second reaction chamber (200); the liquid flow cooling system comprising a reservoir (450) designed to contain and recirculate a cooling liquid; the reservoir (450) comprises a first reservoir compartment (452) and a second reservoir compartment (454); The first storage compartment (452) and the second storage compartment (454), are in fluid communication with each other.
2. 2. The reactor (1000) of claim 1, wherein the first storage compartment (452) and the second storage compartment (454) are in fluid communication via a conduit and / or a valve and / or a wall (456).
3. 3. The reactor (1000) of claim 1 or 2, wherein the first storage compartment (452) and the second storage compartment (454) are in fluid communication at a predetermined height from a bottom level of the storage section (450).
4. the first reaction chamber (100) comprises a first hollow wall tube (110), the first hollow wall tube being designed to be cooled by passing a cooling fluid through it; the second reaction chamber (200) comprises a second hollow wall tube (210), the second hollow wall tube being designed to be cooled by passing a cooling fluid through it; 3. The reactor (1000) of claim 1 or 2, wherein the liquid flow cooling system is configured to flow coolant first from the reservoir (450) into the first hollow wall tube (110) and the second hollow wall tube (210) and then from the first hollow wall tube (110) and the second hollow wall tube (210) into the reservoir (450).
5. 5. The reactor (1000) of claim 4, wherein the liquid flow cooling system comprises a first pump (410) and a second pump (420), the first pump (410) in fluid communication with the first reservoir compartment (452) and the second pump (420) in fluid communication with the second reservoir compartment (454).
6. The reactor (1000) of claim 4, wherein the liquid flow cooling system comprises a liquid cooler (431, 432, 433, 434, 435).
7. 7. The reactor (1000) of claim 6, wherein the liquid cooler comprises a first heat exchanger (431) configured to cool the cooling liquid directed to the first hollow wall tube (110) via a flow of water from outside the reactor (1000) and / or a second heat exchanger (432) configured to cool the cooling liquid directed to the second hollow wall tube (210) via a flow of water from outside the reactor (1000).
8. 7. The reactor (1000) of claim 6, wherein the liquid cooler comprises a third heat exchanger (435) configured to cool the cooling liquid present in the reservoir (450) via a flow of water from outside the reactor (1000).
9. 7. The reactor (1000) of claim 6, wherein the liquid cooler comprises a fourth heat exchanger (433) configured to cool the cooling liquid from the first hollow wall tube (110) via a flow of water from outside the reactor (1000) and / or a fifth heat exchanger (434) configured to cool the cooling liquid from the second hollow wall tube (210) via a flow of water from outside the reactor (1000).
10. 5. The reactor (1000) of claim 4, wherein the liquid flow cooling system is configured to flow cooling water taken from a water flow external to the reactor (1000) into the first hollow wall tube (110) and / or the second hollow wall tube (210) under predetermined conditions.
11. 11. The reactor (1000) of claim 10, wherein the liquid flow cooling system is configured to treat (437) water from outside the reactor (1000) before it flows into the first hollow wall tube (110) and / or the second hollow wall tube (210).
12. 11. The reactor (1000) of claim 10, wherein the liquid flow cooling system is configured to reduce pressure (437) before flowing water from outside the reactor (1000) into the first hollow wall tube (110) and / or the second hollow wall tube (210).
13. 11. The reactor (1000) of claim 10, wherein the liquid flow cooling system is configured to flow cooling water from the first hollow wall tube (110) and / or the second hollow wall tube (210) into the reservoir (450).
14. 11. The reactor (1000) of claim 10, wherein the liquid flow cooling system is configured to discharge cooling water from the first hollow wall tube (110) and / or the second hollow wall tube (210) to an outlet when cooling water is taken in from outside the reactor (1000).
15. A reactor (1000) for epitaxial deposition of a semiconductor material onto a substrate, comprising: The reactor comprises: a first reaction chamber (100) extending along a first longitudinal direction (L1); a second reaction chamber (200) extending along a second longitudinal direction (L2); an inductive heating system (300) for the first reaction chamber (100) and the second reaction chamber (200); a liquid flow cooling system (400) for the first reaction chamber (100) and the second reaction chamber (200); The first longitudinal direction (L1) and the second longitudinal direction (L2) are parallel to each other, The reactor (1000), wherein the first reaction chamber (100) and the second reaction chamber (200) are arranged adjacent to each other in two spaces (180, 280) and are separated by metal plates (510) corresponding to at least each reaction chamber (100, 200), and the metal plates (510) are configured to at least magnetically separate each reaction chamber (100, 200) from each other.
16. The reactor (1000) of claim 15, wherein the metal plate (510) is constructed from a high magnetic permeability material.
17. 17. The reactor (1000) of claim 15 or 16, wherein the metal plate (510) is made of aluminum or permalloy.
18. The reactor (1000) of claim 15 or 16, wherein the metal plate (510) is solid and has a thickness of 5 to 10 mm.
19. 17. The reactor (1000) of claim 15 or 16, wherein the metal plate (510) and one or more metal panels (520, 530) are arranged to mechanically and / or fluidically separate the two spaces (180, 280) from each other.
20. 20. The reactor (1000) of claim 19, wherein the metal plate (510) is centrally disposed and at least a first panel (520) is disposed below and / or at least a second panel (530) is disposed above.
21. The reactor (1000) of claim 15 or 16, further comprising at least one service space (610, 620, 630).
22. a first maintenance space (610) is located adjacent to the space (180) of the first reaction chamber (100) corresponding to a first side of the reactor; and / or a second maintenance space (620) is located adjacent to the space (280) of the second reaction chamber (200) corresponding to a second side of the reactor; and / or 22. The reactor (1000) of claim 21, wherein a third maintenance space (630) is located at the front or rear of the reactor and adjacent to both spaces (180, 280) of each reaction chamber (100, 200).