Optical module

Abstract

To provide an optical module having improved new constitution.SOLUTION: An optical module comprises, for example,: an optical component; a waveguide substrate that has an optical waveguide having optically connected optical components; a first component that serves as a heat generation component mounted in the waveguide substrate; a second component that is mounted in the waveguide substrate; and a cooling mechanism that cools at least the first component. In the optical module, the waveguide substrate has a first surface directing at a first direction, the first component is attached onto the first surface, and the cooling mechanism may be positioned so as to overlap the first component in the first direction, and may be positioned in such a way as to overlap only the first component of the first component and second component in the first direction. Further, in the optical module, a first portion of the waveguide substrate may intervene between the first component and the cooling mechanism.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an optical module.

Background Art

[0002] Conventionally, an optical module including a light-emitting element and optical components has been known (for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In this type of optical module, for example, it would be beneficial to obtain an optical module with an improved configuration that can reduce the number of components or be made smaller. Also, when the optical module includes components that require cooling, it would be beneficial if the components can be cooled more efficiently.

[0005] Therefore, one of the problems of the present invention is to obtain a novel optical module with an improved configuration.

Means for Solving the Problems

[0006] The optical module of the present invention includes, for example, an optical component, a waveguide substrate having an optical waveguide to which the optical component is optically connected, a first component as a heat-generating component mounted on the waveguide substrate, a second component mounted on the waveguide substrate, and a cooling mechanism for cooling at least the first component.

[0007] In the optical module, the waveguide substrate has a first surface facing a first direction, the first component is mounted on the first surface, and the cooling mechanism may be positioned to overlap the first component in the first direction.

[0008] In the optical module, the cooling mechanism may be positioned to overlap only the first component among the first component and the second component in the first direction.

[0009] In the optical module, a first portion of the waveguide substrate may be interposed between the first component and the cooling mechanism.

[0010] The optical module may include a heat radiating member that releases heat generated in the second component.

[0011] In the optical module, the cooling mechanism is displaced in one of the first direction and the direction opposite to the first direction with respect to the first component, and the heat radiating member is displaced in the other of the first direction and the direction opposite to the first direction with respect to the second component.

[0012] In the optical module, a second portion of the waveguide substrate may be interposed between the second component and the heat radiating member.

[0013] The optical module may include a wiring substrate having a wiring electrically connected to a conductor of the second component.

[0014] In the optical module, a third portion of the waveguide substrate may be interposed between the second component and the wiring substrate.

[0015] In the optical module, the cooling mechanism is displaced in one of the first direction and the direction opposite to the first direction with respect to the first component, and the wiring substrate is displaced in the other of the first direction and the direction opposite to the first direction with respect to the second component.

[0016] In the optical module, a first heat conduction suppression portion having a lower thermal conductivity than other portions of the waveguide substrate may be provided at a portion between the first component and the second component of the waveguide substrate.

[0017] The optical module includes a housing that houses the first component, the second component, and the cooling mechanism, and the housing may have a first wall that is thermally connected to the cooling mechanism and a second wall that is thermally connected to the second component.

[0018] In the optical module, the first wall and the second wall may be located on opposite sides with respect to the waveguide substrate.

[0019] In the optical module, at least a part of the second wall may be constituted by the waveguide substrate.

[0020] In the optical module, a second heat conduction suppression portion having a lower thermal conductivity than other portions of the housing may be provided at a position between the first wall and the second wall of the housing.

[0021] In the optical module, a plurality of terminals electrically connected to the conductor of the second component may be arranged in a grid pattern on a surface of the second wall opposite to the waveguide substrate.

Effects of the Invention

[0022] According to the present invention, for example, an optical module having an improved novel configuration can be obtained.

Brief Description of the Drawings

[0023]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

MODE FOR CARRYING OUT THE INVENTION

[0024] Exemplary embodiments of the present invention are disclosed below. The configurations of the embodiments shown below, as well as the actions and results (effects) brought about by the configurations, are examples. The present invention can be realized by configurations other than those disclosed in the following embodiments. Further, according to the present invention, it is possible to obtain at least one of various effects (including derivative effects) obtained by the configuration.

[0025] The plurality of embodiments shown below have the same configuration. Therefore, according to the configuration of each embodiment, the same actions and effects based on the same configuration can be obtained. Further, in the following, the same reference numerals are given to those same configurations, and redundant explanations may be omitted.

[0026] In this specification, ordinal numbers can be given for convenience in distinguishing directions, parts, members, mechanisms, etc. Further, ordinal numbers do not indicate priorities or orders, nor do they specify numbers.

[0027] In addition, each figure is schematic, and the dimensions in the figures may differ from the actual dimensions. In each figure, the X direction is represented by arrow X, the Y direction is represented by arrow Y, and the Z direction is represented by arrow Z. The X direction, Y direction, and Z direction intersect each other and are orthogonal to each other.

[0028] [First Embodiment] FIG. 1 is a side view (partial cross-sectional view) showing the internal configuration of the optical module 100A (100) according to the first embodiment.

[0029] As shown in FIG. 1, the optical module 100A includes a housing 10. The housing 10 has a bottom wall 10a, a peripheral wall 10b, and a top wall 10c. The bottom wall 10a has a substantially rectangular and plate-like shape. The bottom wall 10a intersects and is substantially orthogonal to the Z direction and extends in the X direction and the Y direction. The peripheral wall 10b extends from the edge of the bottom wall 10a with a substantially constant thickness along the Z direction. The peripheral wall 10b may also be referred to as a side wall. The top wall 10c has a substantially rectangular and plate-like shape. Further, the top wall 10c intersects and is substantially orthogonal to the Z direction and extends in the X direction and the Y direction.

[0030] An opening 10d is provided in the peripheral wall 10b. The opening 10d is, for example, a slit or a through hole. In this embodiment, for example, the optical fiber 42 and the flexible printed wiring board 50 penetrate through the opening 10d. Note that the opening 10d may be sealed with a sealing material. In this case, the sealing material may be made of a material having a lower thermal conductivity than other parts of the housing 10. The flexible printed wiring board 50 is an example of a wiring board.

[0031] The bottom wall 10a can be made of a material with high thermal conductivity such as, for example, copper tungsten (CuW), copper molybdenum (CuMo), aluminum oxide (Al 2 O 3 ) and the like. Also, the peripheral wall 10b and the top wall 10c can be made of, for example, Fe-Ni-Co alloy, aluminum oxide (Al 2 O3 ) can be made of a material with a low coefficient of thermal expansion, such as

[0032] The periphery of the top wall 10c, also referred to as a lid, overlaps with the Z-direction edge of the peripheral wall 10b in the Z direction. By joining the periphery of the top wall 10c and the Z-direction edge of the peripheral wall 10b, a housing chamber for accommodating components and devices is formed within the housing 10. Note that the inside of the housing chamber (inside the housing 10) may be hermetically sealed, and in that case, for example, a gas such as an inert gas or air may be accommodated.

[0033] A waveguide substrate 20A (20) on which an optical waveguide 21 is formed is accommodated within the housing 10. Various components are mounted on the waveguide substrate 20.

[0034] FIG. 2 is a plan view of the internal configuration of the optical module 100, and is a plan view of the substrate assembly excluding the housing 10. The optical module 100 has the same components and functions as those in International Publication No. 2020 / 138337. In the present embodiment, as shown in FIG. 2, a modulator driver 31, a transimpedance amplifier 32, a modulator 33, a coherent receiver 34, and a chip on submount 35 are mounted on the waveguide substrate 20. However, it is not limited thereto, and components other than these may be mounted on the waveguide substrate 20.

[0035] The waveguide substrate 20, which is referred to as a silicon photonics substrate, has a core that constitutes an optical waveguide 21. The chip-on-submount 35 (laser element) is optically connected to each of the modulator 33 and the coherent receiver 34 via the optical waveguide 21. Further, the modulator 33 is optically connected to the optical fiber 42 via the optical waveguide 21, and the coherent receiver 34 is optically connected to the optical fiber 42 via the optical waveguide 21. The modulator 33, the coherent receiver 34, and the chip-on-submount 35 are examples of optical components. The optical fiber 42 is connected to the waveguide substrate 20 via the capillary portion 41. Note that the optical module 100 may further include a wavelength locker for controlling the wavelength of the laser element as an optical component, and the wavelength locker may be mounted on the waveguide substrate 20.

[0036] As shown in FIGS. 1 and 2, the waveguide substrate 20 extends intersecting and substantially orthogonal to the Z direction, and has a surface 20a located at an end in the Z direction and a surface 20b located at an end in the opposite direction of the Z direction. The surfaces 20a and 20b intersect and are orthogonal to the Z direction. Further, recesses 20c and 20d that are recessed from the surface 20a in the opposite direction of the Z direction are provided in the waveguide substrate 20. The modulator driver 31, the transimpedance amplifier 32, the modulator 33, and the coherent receiver 34 are mounted on the bottom surface 20c1 of the recess 20c via a bonding material such as an adhesive or solder. Further, the chip-on-submount 35 is mounted on the bottom surface 20d1 of the recess 20d via a bonding material such as an adhesive or solder. The ends of the optical waveguide 21 that are optically connected to the modulator 33, the coherent receiver 34, and the chip-on-submount 35 are exposed at the end surface 20c2 in the X direction of the recess 20c and the end surface 20d2 in the opposite direction of the X direction of the recess 20d. According to such a configuration, by appropriately setting the relative positions of the bottom surfaces 20c1 and 20d1 with respect to the optical waveguide 21, each of the modulator 33, the coherent receiver 34, and the chip-on-submount 35 can be accurately positioned with respect to the optical waveguide 21, and thus, the coupling efficiency between each of the modulator 33, the coherent receiver 34, and the chip-on-submount 35 and the optical waveguide 21 can be easily increased. Note that there may be no walls adjacent to the recesses 20c and 20d in the Y direction or the opposite direction of the Y direction, and the bottom surfaces 20c1 and 20d1 may be provided as steps between the surface 20a or the surface 20b. In this case, the bottom surfaces 20c1 and 20d1 may also be referred to as step surfaces. The bottom surfaces 20c1 and 20d1 are each an example of a first surface facing the Z direction in the present embodiment.

[0037] The chip-on-submount 35 has a laser element and a submount on which the laser element is mounted. The laser element is, for example, a wavelength tunable laser element. The submount is made of a material having a high thermal conductivity and conducts the heat generated in the laser element more efficiently to the side opposite to the laser element.

[0038] The laser light output from the laser element of the chip-on-submount 35 is input to the coherent receiver 34 via the optical waveguide 21. Further, the laser light from the optical fiber 42 is also input to the coherent receiver 34 via the optical waveguide 21. The coherent receiver 34 includes, for example, a 90-degree optical hybrid and a balanced photodiode, and outputs a current signal corresponding to the processed light obtained by the interference of the two input laser lights. The current signal is input to the transimpedance amplifier 32. The transimpedance amplifier 32 outputs a voltage signal corresponding to the input current signal.

[0039] The modulator 33 modulates the laser light output from the laser element of the chip-on-submount 35 according to an electrical signal and outputs the laser light as an optical signal. The laser light output from the modulator 33 is input to the optical fiber 42 via the optical waveguide 21. The modulator driver 31 controls the operation of the modulator 33.

[0040] The modulator driver 31, the transimpedance amplifier 32, the modulator 33, the coherent receiver 34, and the chip-on-submount 35 each generate heat according to their operations. Among them, the chip-on-submount 35 generates a relatively large amount of heat. Further, the chip-on-submount 35 requires temperature adjustment in order to suppress changes in the wavelength of the laser light and ensure the required control accuracy of the wavelength.

[0041] Therefore, as shown in FIG. 1, in the present embodiment, a TEC 60 (thermoelectric cooler, cooling mechanism) is provided corresponding to the chip-on-submount 35. The TEC 60 has a Peltier element, and transfers heat from the heat-generating component by the operation of the Peltier element. With such a configuration, it becomes easier to suppress the change in the wavelength of the laser light output from the chip-on-submount 35 and to ensure the required control accuracy of the laser light. The chip-on-submount 35 is an example of a heat-generating component and an example of a first component. On the other hand, in the present embodiment, the modulator driver 31, the transimpedance amplifier 32, the modulator 33, and the coherent receiver 34, which are not actively cooled by the TEC 60, are examples of second components. Hereinafter, the modulator driver 31, the transimpedance amplifier 32, the modulator 33, and the coherent receiver 34 may be simply referred to as second components. Further, the TEC 60 is an example of a cooling mechanism.

[0042] In the present embodiment, a first portion 20e of the waveguide substrate 20 is interposed between the TEC 60 and the chip-on-submount 35, and the heat generated in the chip-on-submount 35 is transmitted to the TEC 60 via the first portion 20e. Note that the first portion 20e may be provided with vias made of, for example, a copper-based material having a higher thermal conductivity than other portions of the waveguide substrate 20 and penetrating in the Z direction as a heat conduction portion.

[0043] Further, the TEC 60 is provided on the bottom wall 10a and is interposed between the first portion 20e and the bottom wall 10a. In this case, the heat generated in the chip-on-submount 35 is transmitted to the bottom wall 10a via the first portion 20e and the TEC 60, and is released from the bottom wall 10a to the outside of the housing 10. The bottom wall 10a is an example of a first wall.

[0044] Thus, in this embodiment, the first portion 20e of the waveguide substrate 20 is interposed between the chip-on-submount 35 and the TEC 60. According to such a configuration, by mounting the chip-on-submount 35 on the bottom surface 20d1, it is possible to secure the required coupling efficiency between the chip-on-submount 35 and the optical waveguide 21 while ensuring the cooling effect by the TEC 60. Further, the TEC 60 can be used as a support member for the bottom wall 10a (housing 10) of the substrate assembly including the waveguide substrate 20. As a result, the configuration of the optical module 100 can be further simplified to the extent that the support member can be eliminated or reduced.

[0045] In the Z direction, the TEC 60 overlaps only the chip-on-submount 35 (the first component) among the modulator driver 31, the transimpedance amplifier 32, the modulator 33, the coherent receiver 34 (the above second components), and the chip-on-submount 35 (the first component). According to such a configuration, the heat generated in the chip-on-submount 35 can be more efficiently dissipated by the TEC 60, and it becomes easier to improve the accuracy of temperature control of the TEC 60 and thus the wavelength control of the laser light.

[0046] On the other hand, a heat dissipation member 70, such as a heat conduction sheet, is provided between the second components, such as the modulator driver 31 and the transimpedance amplifier 32, and the top wall 10c. In this case, the heat generated in the second component is transmitted to the top wall 10c via the heat dissipation member 70 and is released from the top wall 10c to the outside of the housing 10. In this embodiment, the heat dissipation member 70 is interposed between the modulator driver 31 and the transimpedance amplifier 32 and the top wall 10c, but it is not limited thereto, and the heat dissipation member 70 may be interposed between another second component, such as the modulator 33 or the coherent receiver 34, and the top wall 10c. The top wall 10c is an example of the second wall.

[0047] Here, as shown in FIG. 1, the TEC 60 is positioned offset in the direction opposite to the Z direction with respect to the chip-on-submount 35, and the heat dissipation member 70 is positioned offset in the Z direction with respect to the second component. In such a configuration, the direction in which the heat generated in the chip-on-submount 35 is transferred (the direction opposite to the Z direction) and the direction in which the heat generated in the second component is transferred (the Z direction) are different from each other. If these heats were transferred in the same direction as each other, for example, it would be difficult to secure the required heat transfer rate in the heat transfer path, and there would be a risk of a decrease in heat dissipation efficiency. In this regard, according to the present embodiment, since the heat generated in the chip-on-submount 35 and the heat generated in the second component are transferred in different directions from each other, it becomes easier to more efficiently perform the cooling of the chip-on-submount 35 and the heat dissipation from the second component. The Z direction is an example of the first direction.

[0048] Also, as described above, an opening 10d is provided in the peripheral wall 10b of the housing 10. The opening 10d suppresses heat conduction between the bottom wall 10a and the top wall 10c. According to such a configuration, it is possible to suppress the thermal connection between the heat transfer path of the heat generated in the chip-on-submount 35 and the heat transfer path of the heat generated in the second component, so that it becomes easier to more efficiently perform the cooling of the chip-on-submount 35 and the heat dissipation from the second component. The opening 10d is an example of the second heat conduction suppression portion.

[0049] [Second Embodiment] FIG. 3 is a side view (partial cross-sectional view) showing the internal configuration of the optical module 100B (100) of the second embodiment.

[0050] The optical module 100B includes the same components as the optical module 100A of the first embodiment. However, as shown in FIG. 3, the structure of the waveguide substrate 20B (20) and the mounting forms of the modulator driver 31, the transimpedance amplifier 32, the modulator 33, and the coherent receiver 34 (second component) with respect to the waveguide substrate 20B are different from those of the first embodiment.

[0051] Specifically, in the waveguide substrate 20B, the concave portion 20c is provided so as to be recessed in the Z direction from the surface 20b facing the opposite direction of the Z direction, and its bottom surface 20c1 faces the opposite direction of the Z direction. The second component is mounted on the bottom surface 20c1.

[0052] In this case, the heat generated in the second component is transferred to the top wall 10c via the second portion 20g between the surface 20a and the bottom surface 20c1 of the waveguide substrate 20B and the heat dissipation member 70. Note that a via made of, for example, a copper-based material having a higher thermal conductivity than other parts of the waveguide substrate 20 and penetrating in the Z direction may be provided in the second portion 20g as a heat conduction part.

[0053] Also according to this embodiment, the same effects as those of the first embodiment can be obtained by the TEC 60 mainly provided corresponding to the chip on submount 35 and the heat dissipation member 70 provided corresponding to the second component.

[0054] In addition, in this embodiment, the second portion 20g of the waveguide substrate 20 is interposed between the second component and the heat dissipation member 70. If the heat dissipation member 70 is in direct contact with the second component, a pressing force from the heat dissipation member 70 to the second component acts. If the pressing force is large, the internal stress of the second component increases, and conversely, if the pressing force is small, the thermal resistance between the second component and the heat dissipation member 70 increases. Further, when the heat dissipation member 70 is in contact with a plurality of second components, there is also a possibility that variations in the surface pressure depending on the location between the second component and the heat dissipation member 70, and thus variations in thermal resistance occur. In this regard, according to this embodiment, since the heat dissipation member 70 comes into contact with the second portion 20g of the waveguide substrate 20, heat dissipation from the second component can be performed more efficiently without a pressing force acting from the heat dissipation member 70 to the second component and without causing variations depending on the location even for a plurality of second components.

[0055] [Third Embodiment] FIG. 4 is a side view (partial cross-sectional view) showing the internal configuration of the optical module 100C(100) of the third embodiment.

[0056] The optical module 100C has the same components as the optical module 100B of the second embodiment. However, as shown in FIG. 4, it is different from the second embodiment in that a wiring board 80 is provided between the second part 20g and the top wall 10c.

[0057] The wiring board 80 has a base 81 made of an insulator and a plurality of wirings 82 made of conductors. Each of the wirings 82 is electrically connected to the electrode (conductor) of the second component via a conductor 20h (not shown in FIG. 4, see FIG. 6) in the second part 20g of the waveguide substrate 20B (20). The second part 20g is an example of the third part.

[0058] Furthermore, in the present embodiment, a part of the top wall 10c of the housing 10 is constituted by a wiring board 90. The wiring board 90 has a base 91 made of an insulator and a plurality of wirings 92 made of conductors. Each of the wirings 92 is electrically connected to the wiring 82 of the wiring board 80. Note that not all of the top wall 10c needs to be the wiring board 90 as shown in FIG. 4, and a part of the top wall 10c may be the wiring board 90.

[0059] FIG. 5 is a plan view of the top wall 10c of the optical module 100C of the present embodiment. As shown in FIGS. 4 and 5, a plurality of terminals 11 are provided on the surface 10c1 of the wiring board 90 that becomes the outer surface of the housing 10. Each of the plurality of terminals 11 is electrically connected to the wiring 92. The plurality of terminals 11 are, for example, a plurality of solder balls arranged in a grid pattern, constituting a so-called ball grid array. The terminal 11 can also be referred to as an external terminal.

[0060] Also according to the present embodiment, the same effects as those of the first embodiment can be obtained by the TEC60 mainly provided corresponding to the chip on submount 35.

[0061] In addition, in the present embodiment, a wiring board 80 having a wiring 82 electrically connected to a conductor of a second component is provided inside the housing 10. Also, a second portion 20g (third portion) of the waveguide substrate 20 is interposed between the second component and the wiring board 80. Further, at least a part of the top wall 10c of the housing 10 is constituted by the wiring board 90. According to such a configuration, it is possible to eliminate or reduce bonding wires electrically connected to the conductor of the second component, so that the number of components can be reduced and the manufacturing labor can be reduced.

[0062] In addition, in the present embodiment, the TEC 60 is positioned offset in the direction opposite to the Z direction with respect to the chip-on-submount 35, and the wiring board 80 is positioned offset in the Z direction with respect to the second component. The wiring board 80 has thermal conductivity. In particular, the conductor of the wiring board 80 is made of a material having a relatively high thermal conductivity, such as a copper-based material. Therefore, even in such a configuration, similar to the first embodiment and the second embodiment, the direction in which the heat generated in the chip-on-submount 35 is transferred (the direction opposite to the Z direction) and the direction in which the heat generated in the second component is transferred (the Z direction) are different from each other, and the cooling of the chip-on-submount 35 and the heat dissipation of the second component can be performed more efficiently, respectively. Note that between the second portion 20g and the top wall 10c, the wiring board 80 and the heat dissipation member 70 may be arranged side by side in a direction intersecting the Z direction.

[0063] Also, as shown in FIG. 4, an intervening portion 10e is provided on the peripheral wall 10b between the bottom wall 10a side and the top wall 10c side. This intervening portion 10e is made of a material with a lower thermal conductivity than other parts of the housing 10. The intervening portion 10e is made of, for example, a synthetic resin material. The intervening portion 10e suppresses heat conduction between the bottom wall 10a and the top wall 10c. According to such a configuration, it is possible to suppress the thermal connection between the heat transfer path generated by the chip-on-submount 35 and the heat transfer path generated by the second component, so that the cooling of the chip-on-submount 35 and the heat dissipation from the second component can be performed more efficiently respectively. The intervening portion 10e is an example of a second heat conduction suppression portion. In the example of FIG. 4, a second heat conduction suppression portion is provided on a part of the peripheral wall 10b, but it is not limited to this, and the entire peripheral wall 10b may be made of a material with a lower thermal conductivity than other parts of the housing 10 as the second heat conduction suppression portion.

[0064] [Fourth Embodiment] FIG. 6 is a side view (partial cross-sectional view) showing the internal configuration of the optical module 100D (100) according to the fourth embodiment.

[0065] The optical module 100D includes the same components as the optical module 100C of the third embodiment. However, as shown in FIG. 6, a part of the top wall 10c is constituted by the waveguide substrate 20D (20). Specifically, the second part 20g of the waveguide substrate 20 and the surrounding sealing material 12 constitute the top wall 10c. Also, the terminal 11 is provided on the second part 20g. The terminal 11 is electrically connected to the electrode (conductor) of the second component via the conductor 20h in the second part 20g. Note that, as shown in FIG. 6, a part of the top wall 10c may not be the waveguide substrate 20D, or the entire top wall 10c may be the waveguide substrate 20. Also, the sealing material 12 can be made of a material with a lower thermal conductivity than other parts of the housing 10, for example, a synthetic resin material. In this case, the sealing material 12 is an example of a second heat conduction suppression portion.

[0066] Also according to this embodiment, the same effects as those of the first embodiment can be obtained by the TEC 60 provided mainly corresponding to the chip on submount 35.

[0067] Further, in this embodiment, at least a part of the top wall 10c is constituted by the waveguide substrate 20D(20). According to such a configuration, since the wiring boards 80 and 90 of the third embodiment can be eliminated, the configuration of the optical module 100 can be further simplified, and the optical module 100 can be configured to be smaller and more compact. In addition, the labor and cost required for manufacturing the optical module 100 can be further reduced.

[0068] [Fifth Embodiment] FIG. 7 is a plan view of a part of a substrate assembly as the internal configuration of the optical module 100E(100) of the fifth embodiment.

[0069] In the optical module 100E, the waveguide substrate 20E(20) is provided with a plurality of through holes 20i penetrating the waveguide substrate 20E in the Z direction. The plurality of through holes 20i are arranged so as to surround the periphery of the chip on submount 35. These through holes 20i are provided at a portion between the chip on submount 35 and the second component in the waveguide substrate 20E.

[0070] According to such a configuration, since it is possible to suppress the thermal connection between the heat transfer path generated in the chip on submount 35 and the heat transfer path generated in the second component, it becomes easier to more efficiently perform the cooling of the chip on submount 35 and the heat dissipation from the second component. The through holes 20i are also referred to as openings and are an example of the first heat conduction suppression portion.

[0071] [Sixth Embodiment] FIG. 8 is a plan view of a part of a substrate assembly as the internal configuration of the optical module 100F(100) of the sixth embodiment.

[0072] In the optical module 100F, the waveguide substrate 20F (20) is provided with a plurality of slits 20j and through holes 20i that penetrate the waveguide substrate 20E in the Z direction. The plurality of slits 20j and through holes 20i are arranged so as to surround the periphery of the chip-on-submount 35. These slits 20j and through holes 20i are provided at a portion of the waveguide substrate 20F that is between the chip-on-submount 35 and the second component.

[0073] Even with such a configuration, similar to the fifth embodiment, it is possible to suppress the thermal connection between the heat transfer path generated at the chip-on-submount 35 and the heat transfer path generated at the second component. Therefore, it becomes easier to more efficiently perform the cooling of the chip-on-submount 35 and the heat dissipation from the second component. The slit 20j is also referred to as an opening and is an example of a first heat conduction suppression portion.

[0074] Note that members made of a material having a lower thermal conductivity than other portions of the waveguide substrate 20, for example, a synthetic resin material, may be inserted into the through holes 20i and the slits 20j. In this case, the inserted member is an example of a first heat conduction suppression portion.

[0075] [Seventh Embodiment] FIG. 9 is a plan view of the top wall 10c of the optical module 100G (100) of the present embodiment. As shown in FIG. 9, the housing 10 may be provided with a plurality of pins 13 for power supply or signal transmission. Also in this case, by having the same internal configuration as the optical modules 100A and 100B of the first embodiment and the second embodiment, the same effects as those of the embodiment can be obtained.

[0076] As described above, embodiments of the present invention have been illustrated. However, the above embodiments are merely examples and are not intended to limit the scope of the invention. The above embodiments can be implemented in various other forms, and various omissions, replacements, combinations, and changes can be made without departing from the gist of the invention. Also, each configuration, shape, etc. of the specifications (structure, type, direction, model, size, length, width, thickness, height, number, arrangement, position, material, etc.) can be appropriately changed and implemented.

[0077] For example, in this embodiment, the first component was a chip on a submount, but it is not limited thereto, and other forms of light-emitting units or light-emitting components may be used, or other heat-generating components such as semiconductor optical amplifiers may be used. Also, the first component does not have to be an active optical component.

Explanation of Reference Numerals

[0078] 10... Housing 10a... Bottom Wall (First Wall) 10b... Peripheral Wall 10c... Top Wall (Second Wall) 10c1... Surface 10d... Opening (Second Heat Conduction Suppression Portion) 10e... Intervening Portion (Second Heat Conduction Suppression Portion) 11... Terminal 12... Sealing Material 13... Pin 20, 20A, 20B, 20D~20F... Optical Waveguide Substrate 20a... Surface 20b... Surface 20c... Recess 20c1... Bottom Surface 20c2... End Surface 20d... Recess 20d1... Bottom Surface (First Surface) 20d2... End Surface 20e... First Portion 20g... Second Portion (Third Portion) 20h... Conductor 20i... Through-Hole (First Heat Conduction Suppression Portion) 20j... Slit (First Heat Conduction Suppression Portion) 21... Optical Waveguide 31…Modulator Driver (Second Component) 32…Transformer Impedance Amplifier (Second Component) 33…Modulator (Second Component) 34…Coherent Receiver (Second Component) 35…Chip on Submount (Heat - generating Component, First Component) 41…Capillary Section 42…Optical Fiber 50…Flexible Printed Wiring Board 60…TEC (Cooling Mechanism) 70…Heat - dissipating Member 80…Wiring Board 81…Base 82…Wiring 90…Wiring Board 91…Base 92…Wiring 100, 100A~100F…Optical Module X…Direction Y…Direction Z…Direction (First Direction)

Claims

1. Optical components; a waveguide substrate having an optical waveguide to which the optical component is optically connected; a first component as a heat generating component mounted on the waveguide substrate; a second component mounted on the waveguide substrate; A cooling mechanism that cools at least the first component; An optical module comprising:

2. the waveguide substrate has a first surface facing a first direction; The first component is mounted on the first surface, The optical module according to claim 1 , wherein the cooling mechanism is positioned so as to overlap the first component in the first direction.

3. The optical module according to claim 2 , wherein the cooling mechanism is positioned so as to overlap only the first component out of the first component and the second component in the first direction.

4. The optical module according to claim 3 , wherein the first portion of the waveguide substrate is interposed between the first component and the cooling mechanism.

5. 4. The optical module according to claim 2, further comprising a heat dissipation member for dissipating heat generated in the second component.

6. the cooling mechanism is positioned offset with respect to the first component in one of the first direction and a direction opposite to the first direction, The optical module according to claim 5 , wherein the heat dissipation member is positioned offset with respect to the second component in the other of the first direction and a direction opposite to the first direction.

7. The optical module according to claim 5 , wherein the second portion of the waveguide substrate is interposed between the second component and the heat dissipation member.

8. 4. The optical module according to claim 3, further comprising a wiring board having wiring electrically connected to the conductor of the second component.

9. The optical module according to claim 8 , wherein a third portion of the waveguide substrate is interposed between the second component and the wiring board.

10. the cooling mechanism is positioned offset with respect to the first component in one of the first direction and a direction opposite to the first direction, The optical module according to claim 8 , wherein the wiring board is positioned offset with respect to the second component in the other of the first direction and a direction opposite to the first direction.

11. 2. The optical module according to claim 1, wherein a first heat conduction suppressing portion having a lower thermal conductivity than other portions of the waveguide substrate is provided in a portion of the waveguide substrate between the first component and the second component.

12. a housing that houses the first component, the second component, and the cooling mechanism, The optical module according to claim 1 , wherein the housing has a first wall thermally connected to the cooling mechanism and a second wall thermally connected to the second component.

13. The optical module according to claim 12 , wherein the first wall and the second wall are located on opposite sides of the waveguide substrate.

14. The optical module according to claim 13 , wherein at least a portion of the second wall is comprised of the waveguide substrate.

15. 13. The optical module according to claim 12, wherein a second heat conduction suppressing portion having a lower thermal conductivity than other portions of the housing is provided at a position of the housing between the first wall and the second wall.

16. The optical module according to claim 12 , wherein a plurality of terminals electrically connected to the conductor of the second component are arranged in a grid pattern on a surface of the second wall opposite to the waveguide substrate.

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