Electronic device

Abstract

To provide a new electronic device or an electronic device in a novel form.SOLUTION: An electronic device comprises a ring portion and a display portion. The display portion is flexible and has an upper surface and a first side surface in contact with at least one side of the upper surface. The first side surface has a curve surface, the upper surface is provided with a first display region while the first side surface is provided with a second display region, and the first display region and the second display region are continuously provided. The electronic device is attached to the finger of a user when the finger is in contact with the ring portion.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] One embodiment of the present invention is an electronic device, a display device, a light-emitting device, a power storage device, a driving method thereof, or or a method for producing the same.

[0002] In this specification, electronic equipment refers to any device that operates when power is supplied. Electronic devices having a power supply, electronic devices having, for example, a storage battery as a power supply, and electro-optical devices In addition, the above-mentioned information terminal device having a storage battery is an electronic device. The technical field of one embodiment of the invention disclosed in the present specification and the like is not limited to the above. Alternatively, one aspect of the present invention relates to a process, a machine, Related to the manufacture or composition of matter Therefore, the technical field of one embodiment of the present invention disclosed in this specification is , semiconductor devices, display devices, liquid crystal display devices, light-emitting devices, lighting devices, power storage devices, memory devices, imaging Examples of the imaging device include a driving method thereof and a manufacturing method thereof. do. [Background technology]

[0003] In recent years, display devices that are worn on the human body, such as head-mounted display devices (glasses type), have been proposed. These are called head-mounted displays or wearable displays. There are also wearable devices in the form of watches (also called wristbands), which are used in conjunction with tablet devices. It is used in response to

[0004] In addition, input devices such as a keyboard and a mouse are connected to a notebook personal computer. Tablets are more portable than notebook personal computers, so Tablet terminals that allow touch input are becoming more and more popular. This allows input operations to be performed.

[0005] In addition, electronic book readers equipped with a flexible display device are disclosed in Patent Documents 1 and 2. is disclosed in. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Patent Publication No. 2010-282181 [Patent Document 2] Patent Publication No. 2010-282183 Summary of the Invention [Problem to be solved by the invention]

[0007] In order to make the display device worn on the human body more comfortable for the user, it is necessary to reduce its weight. Furthermore, there is a demand for smaller size and lighter weight of the entire electronic device, including the display device drive unit and power supply. It is necessary to make this a reality.

[0008] An object of one embodiment of the present invention is to provide a novel electronic device. An object of one embodiment is to provide an electronic device having a novel structure.

[0009] Another object of one embodiment of the present invention is to provide a novel display device. An object of one embodiment of the present invention is to provide a display device having a novel structure.

[0010] Another object of one embodiment of the present invention is to provide a novel input device. An object of one embodiment of the present invention is to provide an input device having a novel structure.

[0011] Another object of one embodiment of the present invention is to provide an electronic device that is worn on a finger when used. It shall be one.

[0012] Another object of one embodiment of the present invention is to provide a power storage device that is worn on a finger. It shall be one of the following.

[0013] The description of these problems does not preclude the existence of other problems. It is not necessary for one embodiment to solve all of these problems. The subject matter will be self-evident from the description, drawings, claims, etc. Other issues can be extracted from the drawings, claims, etc. [Means for solving the problem]

[0014] One aspect of the present invention is a display device having a ring portion and a display portion fixed to the ring portion, The device has a top surface and a first side surface that is in contact with at least one side of the top surface, and the first side surface is a curved surface. A first display area is provided on the top surface, and a second display area is provided on the first side surface. The electronic device has a first display area and a second display area that are provided continuously.

[0015] In the above configuration, the first side surface includes a part of a side surface of a circular cylinder or an elliptical cylinder. The shape of the first side surface may be a part of the side surface of a circular cylinder or an elliptical cylinder.

[0016] In the above configuration, the ring portion has a band-shaped region, and the width of the band-shaped region of the ring portion is is smaller than the width of the display.

[0017] In the above configuration, the ring portion includes a secondary battery, and the secondary battery is electrically connected to the display portion. Connected.

[0018] In the above configuration, the electronic device can be worn on a user's finger by contacting the ring portion. It is preferable that the object is not limited to a finger, but may be a robot's limb, a pet's limb, or a pet's limb. The electronic device may be attached to a collar. It is also possible to attach it to animals kept in captivity.

[0019] In order to realize a lightweight and compact information terminal, a ring-type information terminal is provided. For example, A display unit and a power source are provided on the ring part containing the precious metal. Alternatively, a display unit and a power source are fixed to the ring part containing the precious metal. The display and power supply are mounted on the base. When the power supply is mounted on the base, small electronic devices Therefore, the capacity of the built-in secondary battery is limited. Instead of a wide (less than 5mm) band, a wide (5mm or more) ring shape is used, and one finger is placed along the skin. By arranging one or more secondary batteries around the device, battery capacity can be secured.

[0020] In addition, if the material that comes into contact with your fingers contains lead or other substances, there is a risk of developing a metal allergy. Gold, silver, aluminum, plastic, silicone rubber, etc. are used as materials for the ring part. Secondary batteries can generate heat, so to avoid feeling heat on your finger when wearing the device, The materials used for the parts are titanium, platinum, plastic, silicone rubber, etc., which have low thermal conductivity. There are.

[0021] The secondary battery to be placed around the finger may be a plurality of small secondary batteries or a curved battery. Alternatively, a thin secondary battery having a shape similar to that of the battery may be provided.

[0022] In addition, the thickness of a person's fingers is easily variable, for example, the size changes slightly between morning and night. The material of the ring is more flexible than precious metals (silicone rubber, polyethylene terephthalate). The ring may be made of any material, such as phthalate, polyethylene, or leather. It is preferable that the secondary battery inside is deformable. The use of a battery can provide a comfortable fit for the user.

[0023] One embodiment of the invention disclosed in this specification is a display device including a ring portion and a display portion fixed to the ring portion. The ring portion has a band-shaped region, and the ring portion includes a secondary battery therein, and the secondary battery The display unit is electrically connected to the ring unit, and the ring unit is made of a flexible material. The secondary battery is a positive electrode. and an electronic device in which the negative electrode is surrounded by a film.

[0024] In the above configuration, the display unit has a top surface and a first side surface that is in contact with at least one side of the top surface. , the first side has a curved surface, and a first display area is provided on the upper surface, A second display area is provided on the first display area, and the first display area and the second display area are provided continuously. Since display areas are also provided on the sides, the display area can be expanded.

[0025] In addition, the cross-sectional shape of the finger is elliptical, the thickness of the finger is not uniform, and the joints are thicker. Therefore, it is preferable to have a size that allows the thickest part of the finger to pass through in order to fit the finger. If the width is between 47mm and 60mm, the inner diameter of the ring frame, i.e., the approximate circumference of the finger, The diameter of the sphere is between 15 mm and 19 mm.

[0026] It is also preferable that the display unit of the ring-type information terminal has a curved surface. When a touch input unit is provided to input operations, the display unit of the ring-type information terminal is small. Therefore, if the display unit is flat, it is difficult to operate it with fingertips. Therefore, it is difficult to manufacture a display unit having a curved surface, for example, a display unit having curved sides. When the touch panel is used as a display unit, scrolling of the screen is performed using the touch input unit on the side of the display unit. If the decision input is made using the touch input section on the top surface of the display, various operation inputs are possible. For example, a ring-type information terminal is worn on the left hand, and the side of the display is touched with the thumb of the right hand. By pressing the button, the number displayed on the top of the display can be scrolled on the side. By changing the position of the key and touching the top surface with the index finger of your right hand, you can enter the desired number. It is also possible to enter phone numbers manually.

[0027] In order to wear the device on the hand, the size of the small information terminal is limited, so the display part is curved. It is useful for users to have a touch screen that allows them to carry out complex touch inputs with their fingertips.

[0028] The structure of the ring-type information terminal is a ring part, a base fixed to the ring part, and For example, the display unit may be mounted directly on the ring portion. In addition, a removable attachment is provided on the base, allowing small information to be stored even when the attachment is removed. The display unit may function as a news terminal. The orientation may be changed according to the orientation of the user's finger. For example, right-handed and left-handed people can choose their preferred display orientation and input operation. You can create.

[0029] When a ring-type information terminal is designed so that the ring unit and the display unit can be separated, If it is removable, it will be easier to charge it and perform maintenance such as repairs. Not only does it have a built-in secondary battery in the main unit, but it also has a built-in secondary battery in the display unit, so it can also be used to power other devices. If the battery is configured to supply power, it can also function as a spare battery for other information terminals. Since it is a small electronic device, the capacity of the built-in secondary battery is limited. The secondary battery on the seat side can be replaced along with the ring part, allowing for extended use.

[0030] In addition, if the ring unit and the display unit can be separated, the speaker can be used as a ring-type information terminal. If you install it and attach it to your ear, you can attach a microphone to the ring part and It can also be used as a telephone by bringing the finger wearing the earbud close to your mouth and talking.

[0031] In addition, the capacity of the built-in secondary battery is limited, so if the battery capacity runs out, In order to support this, a connector for connecting a cord supplying power from another information terminal, Alternatively, an antenna for enabling wireless charging may be provided on the ring-type information terminal.

[0032] In addition, the ring-type information terminal is not limited to being used independently, but can be combined with other electronic devices. For example, when using a head-mounted display device, the user To perform input operations, a ring-type information terminal is worn on one or both hands, and illuminated The display of the device is sensed by an optical sensor installed in the head-mounted display device. The device recognizes the position of your hand and allows you to use that hand movement to perform input operations.

[0033] A head-mounted display device that limits the field of view by covering the visual fields of both eyes and their surroundings. In the case of a type that displays images by pressing buttons on the device, you can operate it by voice. The cover obscures the surroundings, and the user must operate the device without being able to see the surroundings. The user can wear a ring-type information terminal on one or both hands and turn on the illuminated display of the information terminal. It is also possible to sense and display the position of the hand by overlaying it on the video display.

[0034] The ring-type information terminal is a flexible display device with a touch input unit (realizing power saving). (Active matrix type display device having organic light emitting EL element that can be bent) This was achieved for the first time by combining it with a thin secondary battery that can withstand high temperatures, making it lightweight and compact. It is now possible to do so. Effect of the Invention

[0035] According to one embodiment of the present invention, a novel electronic device can be provided. The present invention can provide an electronic device having a novel configuration.

[0036] According to one embodiment of the present invention, a novel display device can be provided. One embodiment of the present invention can provide a display device having a novel configuration.

[0037] According to one aspect of the present invention, a novel input device can be provided. One aspect of the invention is to provide an input device having a novel form.

[0038] Alternatively, according to one aspect of the present invention, an electronic device that is worn on a finger when used can be provided. Cut.

[0039] According to one embodiment of the present invention, a power storage device that is worn on a finger can be provided. can.

[0040] The description of these effects does not preclude the existence of other effects. An embodiment does not necessarily have to have all of these effects. The above will become apparent from the description in the specification, drawings, claims, etc. It is possible to extract other effects from the descriptions in the claims, etc. [Brief description of the drawings]

[0041] [Figure 1] 1A to 1C are a perspective view, a top view, and a cross-sectional view illustrating an electronic device of one embodiment of the present invention. [Diagram 2] 1A to 1C are a perspective view, a top view, and a cross-sectional view illustrating an electronic device of one embodiment of the present invention. [Diagram 3] 1A to 1C are a perspective view, a top view, and a cross-sectional view illustrating an electronic device of one embodiment of the present invention. [Figure 4] 1A to 1C are a perspective view, a top view, and a cross-sectional view illustrating an electronic device of one embodiment of the present invention. [Diagram 5] 1A to 1C are cross-sectional views illustrating a method for manufacturing an electronic device according to one embodiment of the present invention. [Figure 6] 1A and 1B are a top view and a cross-sectional view illustrating an electronic device of one embodiment of the present invention. [Figure 7] 1A and 1B are perspective views of an electronic device of one embodiment of the present invention and a diagram illustrating how the electronic device is attached. [Figure 8] 1A and 1B are perspective views illustrating electronic devices according to one embodiment of the present invention. [Figure 9] FIG. 1 illustrates one embodiment of the present invention. [Figure 10] 1A to 1C are a perspective view, a top view, and a cross-sectional view illustrating an electronic device of one embodiment of the present invention. [Figure 11] 1A and 1B are schematic diagrams illustrating application examples in which a plurality of electronic devices of one embodiment of the present invention are attached. [Figure 12] FIG. 1 is a perspective view illustrating one embodiment of the present invention. [Figure 13]1A and 1B are a top view and a cross-sectional view illustrating an electronic device of one embodiment of the present invention. [Figure 14] FIG. 1 illustrates an example of a display portion of one embodiment of the present invention. [Figure 15] 3 shows a configuration example of a display panel according to the embodiment. [Figure 16] 3 shows a configuration example of a display panel according to the embodiment. [Figure 17] 1A and 1B are diagrams illustrating an example of a display panel according to an embodiment. [Figure 18] 1A and 1B are diagrams illustrating an example of a display panel according to an embodiment. [Figure 19] FIG. 1 illustrates an appearance of a storage battery according to one embodiment of the present invention. [Figure 20] FIG. 1 is a cross-sectional view of a storage battery according to one embodiment of the present invention. [Figure 21] FIG. 4 is a diagram for explaining the radius of curvature of a surface. [Figure 22] FIG. 2 is a diagram for explaining the radius of curvature of a film. [Diagram 23] 1A and 1B are a perspective view and a top view illustrating an electronic device of one embodiment of the present invention. [Figure 24] 1A and 1B are a perspective view and a top view illustrating an electronic device of one embodiment of the present invention. [Figure 25] 1A and 1B are a perspective view and a top view illustrating an electronic device of one embodiment of the present invention. [Figure 26] 1A and 1B are cross-sectional views illustrating electronic devices according to one embodiment of the present invention. [Figure 27] 1A and 1B are perspective views illustrating electronic devices according to one embodiment of the present invention. [Figure 28] FIG. 1 is a block diagram illustrating one embodiment of the present invention. [Figure 29] FIG. 1 is a conceptual diagram illustrating one embodiment of the present invention. [Diagram 30] FIG. 1 is a circuit diagram illustrating one embodiment of the present invention. [Diagram 31] FIG. 1 is a circuit diagram illustrating one embodiment of the present invention. [Diagram 32] FIG. 1 is a conceptual diagram illustrating one embodiment of the present invention. [Diagram 33] FIG. 1 is a block diagram illustrating one embodiment of the present invention. [Diagram 34] 1 is a flowchart illustrating one embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0042] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following description, and various modifications in form and details are possible by those skilled in the art. The present invention is not limited to the description of the following embodiments. It is not something that can be done.

[0043] In the configuration of the invention described below, the same parts or parts having similar functions are The same reference numerals are used in common between different drawings, and the repeated explanations are omitted. When referring to a function, the hatch pattern may be the same and no particular symbol may be used.

[0044] In each figure described in this specification, the size, layer thickness, or area of ​​each component is indicated by the following formula: The figures may be exaggerated for clarity and are not necessarily limited to scale. stomach.

[0045] In this specification, ordinal numbers such as "first" and "second" are used to avoid confusion of components. The numbers are added for the purpose of convenience and are not intended to be limiting.

[0046] The words "membrane" and "layer" may be interchangeable depending on the circumstances. For example, the term "conductive layer" may be replaced with "conductive Alternatively, for example, the term "insulating film" may be used. In some cases, the terminology may be changed to the term "insulating layer."

[0047] In this specification, "parallel" means that two straight lines are arranged at an angle of -10° or more and 10° or less. Therefore, it includes the case where the angle is between -5° and 5°. "Parallel" refers to two lines that are arranged at an angle between -30° and 30°. Also, "perpendicular" means that two straight lines are arranged at an angle of 80° or more and 100° or less. Therefore, it also includes the case where the angle is between 85° and 95°. This refers to a state in which two straight lines are arranged at an angle of 60° or more and 120° or less.

[0048] In this specification, a connector, such as an FPC (F lexible printed circuit) or TCP (Tape Car The module has a printed wiring board (PCB) attached to the TCP. or a COG (Chip On Glass) on a substrate on which a display element is formed. The module in which IC (integrated circuit) is directly mounted using the Glass method includes a display device. This may be the case.

[0049] (Embodiment 1) In this embodiment, an example of an electronic device 100 according to one embodiment of the present invention is shown. For example, it can be worn on a finger.

[0050] FIG. 1A is a perspective view of an electronic device 100. The electronic device 100 includes a display unit 102 and The electronic device 100 may also have a housing 126. As shown in FIG. 1(C) and FIG. 1(D), the display unit 102 is disposed, for example, on the outside of the housing 126. In addition, when the display unit 102 is provided on the outside of the housing 126, A second housing may be provided in contact with the outside of the display unit 102. Alternatively, a protective cover may be provided on the display unit 102. A bar or the like may also be provided.

[0051] The display unit 102 has a display area on a flexible film. The display unit 102 is provided with one or more display devices on a flexible film. A driving circuit may be included.

[0052] FIG. 1B is a top view of the electronic device 100. FIG. 1C is a top view of the electronic device 100 shown in FIG. FIG. 1(D) shows a cross section taken along dashed line C-D in FIG. 1(B), respectively. In Figure 1(B), the dashed line A-B and the dashed line C-D are approximately perpendicular to each other. do.

[0053] As shown in FIG. 1(A) and FIG. 1(C), the display unit 102 has a top surface and at least The first side surface is in contact with one of the sides. The outermost surface of the display part that overlaps the seat part is called the top surface. In addition, the first side surface has a curved surface. The display unit 102 has a second side surface that is curved and generally faces the first side surface. Moreover, the display unit 102 may have a back surface that faces a part of the top surface.

[0054] The first side surface and the second side surface have a shape of a part of the side surface of, for example, a cylinder or an elliptical cylinder. In addition, the first side surface and the second side surface may be curved surfaces whose radius of curvature changes continuously, for example. The first side surface and the second side surface may have a shape such that the first side surface and the second side surface are formed in ... second side surface and the It is preferable that the curved surface has a tangent line whose inclination changes continuously from the top surface to the bottom surface. The first side surface and the second side surface have a corner between the upper surface and the side surface, or between the side surface and the lower surface, for example. It is preferable that these surfaces are continuous.

[0055] In particular, the shapes of the first side surface and the second side surface are obtained by deforming the plane without expanding or contracting. It is preferred that the adhesive has a developable surface that can be used to apply the adhesive.

[0056] Here, an example in which the display unit 102 of the electronic device 100 has two sides has been described. The display unit 102 may have three or more sides.

[0057] In FIG. 1A, the protrusion on the first side of the display unit 102 is a ring unit 12. 1(C), the curved direction of the convex portion of the curved surface of the second electrode 5 is different from that of the first electrode 5. The first side surface and the second side surface are, for example, curved in a direction of the ring portion 125 along a dashed line A-B. This includes a portion that is approximately perpendicular to the direction.

[0058] As shown in FIG. 1C, the electronic device 100 includes a circuit board 106 and a circuit board 107. It is preferable that the circuit board 106 and the circuit board 107 are disposed inside the housing 126. It is preferable that the ion exchange resin is located in the region of the ion exchange resin.

[0059] The circuit board 106 is, for example, a flexible resin film on which wiring is provided. PC (Flexible Printed Circuit Board) The circuit board 106 can be electrically connected to a drive circuit of the display unit, for example. It is preferred that the cascade is connected to

[0060] For example, when the electronic device 100 has a storage battery, the circuit board 107 electrically connects the storage battery to the It is preferable to connect the circuit board 107 to a power supply from a storage battery, for example. A converter circuit is preferably provided.

[0061] The display unit 102 has a display panel. The display unit 102 also has a touch sensor on its surface. It is preferable that the fluorine-containing polymer has a fluorine-containing fluorine atom.

[0062] The display panel has a display area on a flexible film. The display panel is provided with one or more driving electrodes on a flexible film. The circuit may include:

[0063] The touch sensor of the display unit 102 may be, for example, a sheet-shaped capacitive type. The touch sensor may be provided on the display panel. There are surface capacitive types, projected capacitive types, etc.

[0064] The projected capacitive type is mainly classified into self-capacitance type, mutual capacitance type, etc., which differ mainly in the driving method. The mutual capacitance method is preferable because it enables simultaneous multi-point detection.

[0065] Alternatively, the display panel itself may have a touch sensor function. An in-cell type touch panel may be used. A touch sensor of a volume type may be applied, or an optical touch sensor using a photoelectric conversion element may be applied. In addition, a power generation system including a power generation element using a photoelectric conversion element may be used in an electronic device. The electronic device 100 may be equipped with not only a touch sensor but also other sensors. (Pulse sensor, temperature sensor, location information detection sensor (GPS, etc.), acceleration sensor, and A speed sensor may be included.

[0066] As shown in FIG. 1D, the display unit 102 and the housing 126 are provided on a ring portion 125. It is preferable that

[0067] The electronic device 100 can be used by being worn on a finger, for example. As shown in FIG. 1D, the ring portion 125 of the electronic device 100 is shaped to fit, for example, a finger. It is preferable that

[0068] In addition, it is preferable that the ring portion 125 has a rounded surface. 25 preferably has a shape that conforms to the side surface of an elliptical cylinder, for example. The shape of the portion 125 is not limited to a circular ring shape, but may be an arch shape or a shape like the letter "C." The shape may be a circular shape, an ellipse, or a cut-off ellipse.

[0069] In addition, it is preferable that the ring portion 125 has flexibility. This makes it easy to put on and take off from, for example, a finger. When attaching or detaching the child device 100, most of the areas in the cross-sectional shape have a large radius of curvature. It is preferable that the shape does not deform but has a bending edge.

[0070] The housing 126 may be flexible, for example. In some cases, the display unit 102 can be bent in the CD direction shown in FIG. By bending 102, for example, when attaching or detaching the display unit 102 to or from a finger, the display unit 102 is prevented from being broken. This is preferable because it may be less likely to occur.

[0071] The housing 126 may be made of, for example, glass, quartz, plastic, a flexible plate, or a resin adhesive. Examples include laminated films, paper containing fibrous materials, and base films. Examples of the glass include barium borosilicate glass, aluminoborosilicate glass, and soda lime glass. Examples of flexible substrates, laminated films, and base films include Examples of such materials include polyethylene terephthalate (PET), polyethylene Polyethylene naphthalate (PEN), Polyethersulfone (PES), Polytetrafluoroethylene Examples of plastics include PTFE (Polyethylene) and acrylic. Synthetic resins such as polypropylene, polyester, poly Examples include polyvinyl fluoride, polyvinyl chloride, etc. Also, examples include polyamide, poly Examples include polyimide, aramid, epoxy, and inorganic deposition films. Steel, stainless steel foil, plate, tungsten, tungsten Plates with foils, papers or semiconductors (eg single crystal or silicon) etc. may be used.

[0072] The ring portion 125 can be made of a material such as gold, silver, aluminum, or plastic. Materials used include silicone rubber, polyethylene terephthalate, polyethylene, and leather. Secondary batteries can generate heat, so to avoid feeling heat on your finger when wearing the device, The material of part 125 is titanium, platinum, plastic, silicone rubber, etc., which have low thermal conductivity. etc. are used.

[0073] The secondary battery is provided inside the housing or inside the ring portion 125. The battery may be a plurality of small secondary batteries, or a thin secondary battery having a curved shape. A pond may also be provided.

[0074] In addition, the thickness of a person's fingers is easily variable, for example, the size changes slightly between morning and night. The material of the ring part 125 is more flexible than precious metals (silicone rubber, polyethylene, etc.). It is preferable to form the material from a material such as polyethylene terephthalate, polyethylene, leather, etc. It is preferable that the secondary battery or the like provided inside the ring portion 125 is deformable. As the secondary battery provided inside the ring portion 125, a bendable secondary battery is used. When used, it can provide a comfortable fit for the user.

[0075] Alternatively, an alloy material having high elasticity may be used, for example, a material made of zirconium, copper, and nickel. We use an amorphous alloy (also called metallic glass) containing titanium. This amorphous alloy has a temperature of 100°C at room temperature. It is an amorphous alloy that has a glass transition region at 0.05°C and is also called bulk-solidifying amorphous alloy. The alloy has a substantially amorphous atomic structure. At least a portion of the housing is formed by solidification casting. The alloy material is poured into the mold and solidified to form a part of the housing with bulk solidified amorphous alloy. Amorphous alloys include zirconium, copper, nickel, titanium, as well as beryllium, silicon, , niobium, boron, gallium, molybdenum, tungsten, manganese, iron, cobalt, The alloy may contain tritium, vanadium, phosphorus, carbon, etc. This includes both complete solid solution alloys with a phase structure and partial solutions with two or more phases. By using an amorphous alloy for the ring portion 125, a housing having high elasticity can be realized. By using this amorphous alloy, it is possible to realize a ring part 125 that is flexible yet strong. Additionally, an amorphous alloy can also be used for the housing 126.

[0076] In addition, the material that can be used for the ring portion 125 can also be used for the housing 126. If the same material is used for the housing 126 and the ring portion 125, the joint The grooves are not noticeable, and uneven wear on the contact areas can be prevented.

[0077] A modified example of the cross section shown in FIG. 1(C) is shown in FIG. 26. In FIG. 1(C), the cross section of the side of the display unit is In contrast to the semicircular shape shown in FIG. 26(A), the cross section of the side of the display unit is shaped like a quarter circle. As shown in Fig. 26B and Fig. 26C, one of the sides of the display unit In FIG. 26(B), the curved side is a semicircle. In FIG. 26(C), the curved side has a cross section that follows a quarter circle.

[0078] 2A is a perspective view of the electronic device 100. FIG. 2B is a top view of the electronic device 100. FIG. 2(C) is a cross-section taken along the dashed line A-B in FIG. 2(B), and FIG. 2(D) is a cross-section taken along the dashed line A-B in FIG. 2(B) and 2(C) are cross-sectional views taken along dashed line C-D in FIG. The electronic device includes a display unit 102, a housing 126, and a ring unit 125. The display unit 102 is a curved The display unit 102 has a curved surface and faces approximately in the same direction as the first side surface. In comparison with the electronic device 100 shown in FIG. 2(A) shows a difference in the orientation of the display unit 102 when viewed from above, for example, by 90 degrees. For example, the first side surface and the second side surface have a surface that is approximately perpendicular to the dashed line C-D. .

[0079] As shown in FIG. 1A and FIG. 2A, the display unit 102 has, for example, a substantially rectangular upper surface and It has a first side surface and a second side surface that contact two opposing sides of the top surface.

[0080] Here, the top surface is a display area 151, the first side surface is a display area 152, and the second side surface is a display area 153. 53, and preferably a plurality of display areas are provided.

[0081] The display area 152 is formed by a first side surface and an upper surface of the display unit 102 adjacent to the first side surface. The display area 153 may be provided on two surfaces, the first surface and the second surface. The second side surface may be adjacent to the first side surface and may be provided across two surfaces, i.e., a lower surface facing the upper surface. stomach.

[0082] With this configuration, unlike conventional electronic devices, the display unit 102 can be displayed only on the upper surface of the display unit 102. In particular, it is possible to display on two or more sides of the display unit 102. Providing a display area along the side is preferable since it increases the variety of displays.

[0083] A display area 151 is provided on the top surface of the display unit 102, and each display area is arranged along the side surface. The areas may be used as independent display areas to display different images, etc., or any of them may be used as separate display areas. A single image or the like may be displayed across two or more display areas. For example, The image to be displayed in the display area 151 provided on the top surface is displayed on a display panel provided along the side surface of the display unit 102. Alternatively, the images may be displayed continuously in the display area 152 or the like.

[0084] In addition, in the display unit 102 of the electronic device, the first side surface and the second side surface having a curved surface are When the display area is provided only on the upper surface of the display unit 102, In comparison, the area of ​​the display region of the display unit 102 can be made larger.

[0085] Modified examples of the cross sections shown in Figs. 1(B) and (C) are shown in Figs. 13(A-1) and (B-1). In FIG. 13(A-1) and (B-1), the width 201 of the display unit 102 is The width 203 of the top surface of the display unit 102 is wider than the width 202 of the ring unit 125. 5 is narrower than width 202.

[0086] Another modification of the cross section shown in Figs. 1(B) and (C) is shown in Figs. 13(A-2) and (B-2). In FIG. 13(A-2) and (B-2), the width 201 of the display unit 102 is The width 203 of the top surface of the display unit 102 is wider than the width 202 of the ring unit 125. Here, the width 203 of the top surface of the display unit 102 is wider than the width 202 of the ring unit 125. If the width is wider than this, it may be easier for the device to touch parts of your fingers when you put it on. Even in such a case, the side surface of the display unit 102 is curved and rounded. Therefore, high wearability can be achieved.

[0087] FIG. 8 shows an example of a state in which the display unit 102 of the electronic device 100 shown in FIG. 1 and FIG. In FIG. 8A, a display area 151 provided on the upper surface of the display unit 102 displays image information. Information 167, text information 162, and a plurality of icons associated with applications, etc. 161, etc. are displayed. The display area 152 provided on the side of the display unit 102 displays the app In addition, the display area 161 shows icons associated with the application, etc. 52 includes a button for powering the electronic device 100 and a button for locking and starting the screen. It is preferable to provide buttons or the like for operating the device using a touch sensor. It is preferable to use a button that can be operated by a touch sensor. Compared to a physically installed button, the button part and the connection to the button are Therefore, the volume occupied by the peripheral portion of the electronic device 100 can be made smaller. This is preferable because the thickness of the electronic device 100 can be made thinner. For example, the electronic device 100 can be easily attached to a finger. The touch panel may have both a sensor-operable button and a mechanical button.

[0088] In addition, when a call or email is received, not only the display area 151 but also the display area In the display area provided along the side of the area 152, sender information (e.g., the sender's name, A telephone number, an email address, etc. may be displayed. This shows an example in which caller information is displayed in a scrolling manner in the display area 152 when a call is received. do.

[0089] Also, as shown in FIG. 8B, image information is continuously displayed in the display areas 151 to 153. The display area 151 to the display area 153 may be connected to the display area 167, the icon 161, or the like. By using it as a continuous display area, the display area can be used more widely. For example, compared to a case where only the display area 151 is used to display image information 167, In addition, the display area can be viewed from a wider angle, improving visibility.

[0090] The display area of ​​the display unit 102 may be a circular or elliptical display area. FIG. 25(A) is a top view of the display unit 102 before it is installed in the housing 126. 1 to 4 show electronic devices 100 each having a display unit 102 with a circular display area. Among the display areas (B) to (F), FIG. 25(D) shows a display area with three circular display areas (display area The figures show an example having a display area 151, a display area 152 and a display area 153, and the other figures show a circular In the example shown, there are two display areas (display area 151 and display area 152). The display area 152 and the display area 153 have curved surfaces. In Fig. 25(C), a curved surface is placed on the side surface that is in contact with the right side of the In FIG. 25(D), the side surface has a curved surface that is in contact with the top surface and the left and right sides of the top surface. In FIG. 25(E), the upper surface and the side surface having a curved surface contacting the lower side of the upper surface are shown. In FIG. 25(F), An example is shown in which a display area is provided on the top surface and a side surface having a curved surface in contact with the upper edge of the top surface.

[0091] In addition, during standby time when the electronic device is not in use, The display of the display area 151 provided along the side is turned off (for example, black display), and It is also possible to display information only in the display area 152, etc., which is larger than the other areas. By not displaying "1", it is possible to reduce power consumption during standby.

[0092] It should be noted that electronic device 100 does not necessarily need to have display area 153.

[0093] The electronic device 100 may also have a button. FIG. 23B shows an example in which the child device 100 has a button 128. 23(C) and (D) show the top view of the child device 100. The buttons 128 shown in FIGS. 23(A) to 23(D) are enlarged views of the areas enclosed by the dashed lines. 1 shows an example of a button called a crown, but the shape and function of the button are not limited to this.

[0094] FIG. 24A shows an example in which the electronic device 100 shown in FIG. FIG. 24B shows a top view of the electronic device 100 shown in FIG. 24A. Additionally, the electronic device 100 may have a button 128 on the side. The button 128 may be, for example, The mechanical buttons mentioned above may also be used.

[0095] A modified example of the electronic device 100 shown in FIG. 2(A) is shown in FIG. A cutout is provided in a portion of the first side, in this case about half of the upper side, and a button 1 is provided in that area. An example of setting 28 is shown below.

[0096] FIG. 9(A) shows an example in which the electronic device 100 is worn on the index finger of the left hand. 9(A) shows an enlarged view of the area of ​​electronic device 100 enclosed by the dashed line in FIG. 9(A).

[0097] For example, by displaying the sender information when receiving the above-mentioned mail in the display area 152, Easy to see.

[0098] Also, for example, a display area 153 may be used as lighting as shown in FIG. 9(B).

[0099] The display unit 102 of the electronic device 100 shown in FIG. 1 and FIG. 2 is provided on the outside of the housing 126. Here, as shown in FIG. 3, the display unit 102 is mounted on a housing 126. When the display unit 102 is provided inside the housing 126, It is preferable that the transparent member has light-transmitting properties.

[0100] 3A is a perspective view of the electronic device 100. FIG. 3B is a top view of the electronic device 100. FIG. 3(C) is a cross-section taken along the dashed line A-B in FIG. 3(B), and FIG. 3(D) is a cross-section taken along the dashed line A-B in FIG. The electronic device 100 has a display unit 102 and a cross section taken along a dashed line CD in FIG. The display unit 102 includes a housing 126, a circuit board 106, and a circuit board 107. The display unit 102 has a curved surface and faces approximately in the same direction as the first side surface. As shown in FIGS. 3(C) and (D), the display unit 1 may have a second side surface. At least a part of the circuit board 106 and the circuit board 102 are located inside the housing 126. The circuit board 107 is preferably located inside the housing 126. It is preferable that the display unit 102 is electrically connected to the display unit 102.

[0101] By providing the display unit 102 inside the housing 126, a robust structure can be achieved. In some cases, the display unit 102 is less likely to break when it collides with another object due to a crash or collision.

[0102] FIG. 4A is a perspective view of the electronic device 100. FIG. 4B is a perspective view of the electronic device 100. FIG. 4(C) is a top view of the cross section taken along the dashed line A-B shown in FIG. 4(B). 4(B) and 4(C) show cross sections taken along dashed line C-D in FIG. The display unit 102 has a generally rectangular upper surface, and has first to third side surfaces that contact the four sides of the upper surface. The first side surface and the fourth side surface are curved. and the second side surface has a surface that is approximately perpendicular to the dashed line A-B, as shown in FIG. The third side and the fourth side are, for example, as shown in FIG. 4(D), approximately perpendicular to the dashed line C-D. In this way, the display area is provided on the top surface and the first to fourth side surfaces. This is preferable since it increases the variety of displays.

[0103] Text information 164 and the like flows (transitions) across multiple display areas of the electronic device 100. In this way, the display unit 102 can be displayed on two or more screens. By displaying the information, the user can see the information regardless of the orientation of the electronic device, for example, when receiving a call. It can prevent you from missing out.

[0104] Here, as shown in the example of FIG. 6, in the electronic device 100, the end of the ring portion 125 is connected to the housing. 6A shows the top surface of the electronic device 100. 6(B) and (C) are the same as those shown by dashed lines AB and CD in FIG. 6(A). FIG. 6(D) shows a top view of the electronic device 100, and FIGS. 6(E) and 6(F) show 6(A) to (C) are cross sections shown by dashed lines AB and CD in FIG. ) shows an example in which the ring portion 125 is provided in contact with the lower surface of the housing 126. 4D) to 4F show examples in which the ring portion 125 is provided in contact with the side surface of the housing 126.

[0105] FIG. 7B shows an example of a ring-type electronic device 101 worn on a finger.

[0106] The electronic device 101 is an example of an electronic device that is partially different in configuration from the electronic device 100. As shown in FIG. 1, the display unit 109 has a curved surface, and the electronic device 101 has a cylindrical housing 105 at one end. The cylindrical housing 105 can also be called a ring. The housing 105 is made of silicone rubber. The display unit 109 is made of a flexible material such as rubber, and the display unit 109 is made of a plastic film. A passive matrix or active matrix display device using an electroluminescent element is used. In addition, the display unit 109 is flexible and at least a part of the display unit 109 overlaps with the display unit 109. In addition, a thin secondary battery is provided between the display unit 109 and the finger 116. A lithium-ion secondary battery sealed in a laminate film is used.

[0107] FIG. 7C shows a case where a ring-shaped electronic device 101 is attached to a finger and another device 117 is attached to the finger. For example, a watch or a watch-type information terminal worn on the wrist is shown. The electronic device 10 can change the display of the ring-type electronic device 101 by transmitting the A transmitter / receiver circuit may be provided in the battery 1. Also, when the capacity of either secondary battery decreases, Power may be supplied to one side wirelessly, or by connecting via a power cord or the like.

[0108] FIG. 10A shows an example of a perspective view of the electronic device 100. FIG. 10B shows the same as FIG. 10(B) shows a top view of the electronic device 100 shown in FIG. FIG. 10(D) shows an enlarged view of the area surrounded by the dashed line in FIG. 10(B). In the example shown in FIG. 10B, the cross section of the electronic device 100 is annular. 2 is a display area 151 having an arch-shaped cross section and a display and a display area 152 having a curved surface extending from the side surface to the rear surface of the display unit 102.

[0109] In FIG. 10, the display area is provided only on the side of the display unit 102. For example, a display area 152 may be provided adjacent to the display area 151. A third display area may be provided.

[0110] As shown in FIG. 10D, the electronic device 100 includes a display unit inside the ring unit 125. FPC 104 electrically connected to 102, and circuit board 1 electrically connected to FPC 104 107 and a storage battery 108 electrically connected to the circuit board 107.

[0111] Here, the storage battery 108 is, for example, a thin storage battery using a laminate film for its exterior. By using a flexible laminate film for the exterior, In this way, the storage battery 108 can be flexible. Button type batteries, square type batteries, cylindrical type batteries, etc. can be used. FIG. 10D shows an example in which a thin flexible storage battery is used as the storage battery 108. is doing.

[0112] In addition, in the examples of the electronic device 100 shown in FIGS. 1 to 6 and 9, the electronic device 10 It is preferable that the storage battery 108 is included. Here, by using a thin storage battery having flexibility as the storage battery 108, Here, by using a thin, flexible storage battery as the storage battery 108, The storage battery can be arranged to fit the curved surfaces of the display unit 102, the housing 126, etc. The storage battery 108 is flexible and therefore easily deformed. After arranging the board 106 and the circuit board 107, the battery is deformed to fit the empty space. The pond 108 can be disposed. Therefore, the thickness of the electronic device 100 can be reduced. This is sometimes preferable.

[0113] Next, an example of a method for manufacturing the electronic device 100 will be described with reference to FIGS. FIG. 5(B-1) to (B-3) are cross-sectional views of the electronic device 100 shown in FIG. 1(C). 1(D) shows a cross section of the electronic device 100 and a method for manufacturing the same.

[0114] First, as shown in FIGS. 5(A-1) and 5(B-1), a display unit 102, a housing 126, Here, an example in which the housing 126 has an opening is shown, but the housing 126 does not have an opening. The housing 126 has a rounded portion 136 in the cross section shown in FIG. A circuit board 106 is connected to the display unit 102. The display unit 102 is flexible. A method for manufacturing the flexible display portion 102 will be described later.

[0115] Next, as shown in FIG. 5(A-2), the display unit 1 is attached to the outside of the housing 126 along the AB direction. Here, for example, the adhesive between the housing 126 and the display unit 102 is provided. A layer may be provided to bond the display unit 102 to the outside of the housing 126. By providing the display unit 102 so as to be in contact with the outside of the display unit 126, a display unit having a curved surface on the side surface can be obtained. A portion 102 can be formed.

[0116] Next, as shown in FIGS. 5(A-3) and (B-3), The display unit 102 is provided on the ring unit 125. Here, for example, the display unit 102 and the ring unit An adhesive layer may be provided between the display unit 102 and the ring unit 125 to bond them together.

[0117] Through the steps described above, the electronic device 100 shown in FIGS. 1 to 4 can be manufactured.

[0118] In addition, in the case where the electronic device 100 shown in FIG. 10A is provided with a display unit 102, FIG. 14A is a top view of the display unit 102. The display unit 102 includes: It is preferable that the display device has a display area 151 and a display area 152. When providing 152, a housing 126 having a curved side surface is prepared, and the housing 126 is provided with a curved side surface. In addition, for example, the display unit 102 may be modified as shown in FIG. As shown in FIG. 1B, a gap 135 may be provided in the area where the display area 152 is provided. By providing the mask 135, wrinkles or the like may be less likely to occur in the display area 152, which is preferable. I wish.

[0119] Next, FIG. 11(A) shows an example in which electronic devices are attached to each of the five fingers 116 of the left hand. The display unit 109 can be illuminated to display an image. The movement of the finger 116 is obtained as data by sensing the movement of the finger 116 using an image sensor or the like. In particular, since the display unit 109 can be made to emit light even in a dark place, it is possible to easily capture an image. The location can be determined by the means.

[0120] In FIG. 11B, the electronic device attached to the hand is connected to another device 118, e.g. When placed on the display unit 119 of the tablet information terminal, the light sensor built into the display unit 119 This shows an example in which the position is specified by sensing light emitted from the display unit 109. In this case, it is also possible to perform input operations on the tablet information terminal without contact. .

[0121] In FIG. 11C, an image sensor 121 of a glasses-type electronic device 122 is used. This shows an example of inputting data into a tablet information terminal. The device 118 is placed on the display unit 119 of a tablet information terminal. This indicates that the images are captured so as to overlap when viewed from the image sensor 121. Even if the electronic device and the display unit 119 of the tablet information terminal are far apart, the image sensor 12 1 shows an example in which the position is identified by sensing light emitted from a display unit 109. In this case, it is also possible to input data into the tablet information terminal without contact. In addition, although an example using a tablet information terminal was shown here, it is also possible to use a projector or other device. The display on the screen is the same as the display on the hand-worn electronic device. The position of the part 109 can be related to the position on the screen. The input operation is not limited to being performed using multiple ring-type information terminals, but may be performed by multiple people. It is also possible to have multiple people wear multiple electronic devices on their fingers, move their hands, and You can also enjoy games and other activities on a shared display screen.

[0122] The screen size of the electronic device 100 when the display unit 102 is provided will be described. Since the screen size (X×Y) is between 47mm and 60mm, the maximum screen size is X=47mm. mm or more and 60 mm or less, and Y = 20 mm or more and 30 mm or less. The size refers to the size when the screen is flat, not the size when the screen has a curved surface. In addition, a plurality of display units may be provided in one electronic device. For example, The electronic device may have a second display portion.

[0123] In addition, the thinnest part of the electronic device 100 in which the display unit 102 is provided is set to 5 mm or less. The thickest part of the electronic device 100 is the display unit 102 and the circuit board 106. The connection part with the wire can be less than 1 cm.

[0124] Additionally, the total weight of the electronic device 100 can be less than 100 g.

[0125] [Display panel configuration example] Next, a configuration example of the display panel of the display unit 102 will be described with reference to the drawings.

[0126] FIG. 15A is a schematic top view of a display panel 110 exemplified below. The display device 10 includes a flexible substrate 120 and a plurality of pixels formed on the substrate 120. The display panel 110 has a first display area 111, a second display area 112, and a third display area 113 and a fourth display area 114. Note that, for clarity, each display area is shown as are clearly indicated by different hatching patterns.

[0127] The first display area 111 has a quadrilateral shape. The second display area 112 has 1, the first display area 111 is provided with a first side 131, which is adjacent to one of the four sides that define the outline of the first display area 111. The first side 13 of each of the first display area 111 and the second display area 112 is It is preferable that the widths of the third display area 113 and the third display area 114 are the same in the direction parallel to the screen 1. The first display area 11 is provided adjacent to a second side 132 that is adjacent to the first side 131. It is preferable that the widths of the first and third display areas 113 in a direction parallel to the second side 132 are the same. In addition, a second display area is provided at the angle (first angle) formed by the first side 131 and the second side 132. One of the corners of the first display area 112 and one of the corners of the third display area 113 are aligned with each other. It is preferred.

[0128] As shown in FIG. 15A, a first side 131 and a second side 132 form a first In a region facing the first display region 111 across the corner, a notch 138 is formed in the substrate 120. By providing the cutout portion 138 in this manner, the second display area 112 and The third display area 113 can be curved in different directions.

[0129] In FIG. 15A, a fourth side 133 is in contact with the third side 133 opposite to the first side 131. The fourth display area 114 is provided at one corner of the second display area 114. It is preferable that the second angle formed by the first side 132 and the third side 133 coincides with the second angle. In the region facing the first display region 111 across the substrate 120, the above-mentioned notch portion 1 With this configuration, the fourth display area 114 is The third display area 113 can be curved in a different direction.

[0130] In addition, a part of the substrate 120 is provided with an FPC 10 for supplying signals and power for driving the pixels. In FIG. 15(A), an IC 12 mounted on an FPC 103 by the COF method is shown. However, if IC 123 is not required, it may be omitted. Alternatively, the IC 123 may be mounted directly on the FP 20 by using the COF method. It is preferable that the width of the second display area C103 is smaller than the width of the first display area 111. The first display area 111 is flat, and the second display area 112 and the fourth display area 114 are curved. When the FPC 103 is used as a substrate, the joint between the FPC 103 and the substrate 120 does not bend, and the FPC This can prevent the film 103 from peeling off.

[0131] FIG. 15(B) is an enlarged schematic top view of region A in FIG. 15(A).

[0132] In the configuration shown in FIG. 15B, the first display area 111 and the second display area 112 a first driving circuit 141 that outputs signals for driving the pixels included therein; A second driver circuit 142 outputs a similar signal to the third display area 113. The first driving circuit 141 is provided along the side of the second display area 112 opposite to the first side 131. The second driving circuit 142 is disposed on the first side 131 of the third display area 113. The first driving circuit 141 and the second driving circuit 142 is electrically connected by wiring 145, and input from FPC 103 is received via wiring 145. The input signal can be provided to a second driver circuit 142 .

[0133] FIG. 15(C) shows a configuration different from that shown in FIG. 15(B). 5(C), a drive circuit 143 is provided instead of the first drive circuit 141. The driving circuit 143 drives the pixels included in the first display area 111 and the second display area 112. The third display region 113 is driven by a driving signal. The signal output from the driving circuit 143 is input to the wiring 14 6, and outputs the signals to wirings electrically connected to pixels in the third display area 113. It is possible.

[0134] The first drive circuit 141, the second drive circuit 142, and the drive circuit 143 are, for example, A circuit that functions as either a driver circuit or a source driver circuit can be used. In this case, IC123 is used as a source driver circuit. It is preferable that the ion exchange membrane has a function as a ion exchange membrane.

[0135] In this example, a so-called driver-integrated display panel is provided with a driving circuit on the substrate 120. However, a configuration not including a drive circuit may also be used.

[0136] In this manner, the third display region 113 is a first display region that outputs a signal for driving the pixels included in the third display region 113. The second driver circuit 142 or the wiring 146 for supplying a signal for driving the pixel is connected to the first driver circuit 142. By providing the cutout 138 along one side of the display area 113, the area of ​​the cutout 138 can be increased. This makes it possible to reduce the area of ​​the non-display section relative to the surface area of ​​the display panel 110. In addition, when the third display area 113 is curved in a direction parallel to the second side 132, as shown in FIG. As shown in FIG. 15(C), it is preferable to have a configuration in which no drive circuit is provided in the bending section. As a result, the electrical characteristics of semiconductor elements such as transistors in the drive circuits change due to the stress. This configuration may cause the output signal from the driver circuit to become unstable. This can prevent the device from becoming fixed.

[0137] In addition, although a configuration having first to fourth display areas is shown in FIG. The display device may have a third display area, or a fifth display area 115. FIG. 16A shows a schematic top view of the fifth display region 115. The wiring and the driving circuit between the fifth display area 115 and the second display area 112 are configured as follows. 15B or 15C may be used.

[0138] FIG. 16B shows an example of a configuration in which an FPC 103a is provided. For example, the display has a function of supplying signals and power to each of the driving circuits exemplified above. If the panel does not have a driver circuit, mount the IC on the FPC103a using the COF method or similar. Good too.

[0139] Here, the pixels included in each display area provided on the display panel 110 and the It is preferable to use an oxide semiconductor for a semiconductor device such as a transistor to be used in the semiconductor device. It is preferable to use an oxide semiconductor having a larger band gap than silicon for the silicon. If a semiconductor material with a wider band gap and lower carrier density than that of a capacitor is used, This is preferable because it can reduce the current when the transistor is in the off state.

[0140] For example, the oxide semiconductor may contain at least indium (In) or It is preferable that the material contains zinc (Zn). More preferably, the material contains In-M-Zn oxide (wherein M is A). (metals such as l, Ti, Ga, Ge, Y, Zr, Sn, La, Ce or Hf) Contains oxides.

[0141] In particular, the semiconductor layer has a plurality of crystal parts, and the crystal parts have a c-axis aligned with a surface on which the semiconductor layer is formed. or oriented perpendicular to the upper surface of the semiconductor layer and having no grain boundary between adjacent crystal portions. An oxide semiconductor film is preferably used.

[0142] Such an oxide semiconductor does not have crystal grain boundaries, so that when the display panel is curved, The occurrence of cracks in the oxide semiconductor film due to stress is suppressed. Such oxide semiconductors are suitable for use in display panels that are flexible and can be curved when used. There can be.

[0143] By using such materials for the semiconductor layer, the fluctuation of electrical characteristics is suppressed, and reliability is improved. This allows for high-performance transistors.

[0144] In addition, due to its low off-state current, the charge stored in the capacitance through the transistor can be released for a long period of time. By applying such a transistor to a pixel, It is also possible to stop the driving circuit while maintaining the grayscale of the image displayed in the display area. As a result, it is possible to realize electronic equipment with extremely reduced power consumption.

[0145] Regarding preferred forms of oxide semiconductors applicable to the semiconductor layer and methods for forming the same, This will be explained in detail in a later embodiment.

[0146] In addition to the display device, the electronic device according to one embodiment of the present invention may include other semiconductor circuits, such as an overcharge It also includes a control circuit to prevent this, as well as sensors such as an image sensor, a gyro sensor, and an acceleration sensor. The device may be equipped with a touch panel or the like. It may also be used to measure pulse and surface temperature by touching a part of the human body. For example, a display device may be provided. By mounting an image sensor on the camera, the captured image can be displayed on a display device. By incorporating sensors such as gyro sensors and acceleration sensors, finger-worn electronic devices can be It can save power by switching between on and off states depending on the orientation and movement. By mounting a touch panel, the electronic device can be operated by touching a desired position on the touch panel. In addition to the display device, the above-mentioned configuration can also include a By installing memory and a CPU, it is also possible to create a wearable computer.

[0147] In addition, the electronic device of one embodiment of the present invention can be used as a display unit of a finger-worn electronic device, The electronic device of one embodiment of the present invention can be used as a sub-display by using both the display portion of the information terminal and the electronic device of one embodiment of the present invention. It can also function as a

[0148] In addition, on the display unit of the ring-type information terminal, the user is included in the ring-type information terminal. It is possible to display light or images of a desired color selected from image data stored in the memory. .

[0149] In this embodiment, an example of a ring-type information terminal worn on one human finger has been shown. Without being limited thereto, a display unit is provided on a frame made up of multiple rings that are connected to be worn on two or more fingers. In this case, the width of the display unit may be larger than two or more fingers.

[0150] In the present embodiment, an example of a ring-type information terminal worn on a human finger is shown. The present invention is not limited to this, and may be applied to a ring-type information terminal that is attached to the finger of a robot. In this case, The size of the robot's fingers may be larger than that of a human's. Alternatively, the information terminal may be attached to the collar of a pet animal. It can store information such as the identification information, contact information, and location of lost pets. In addition, the present invention is not limited to pets, and may be used for animals kept in zoos, etc. It is also possible to attach it to animals kept in zoos. Since it is difficult to identify some animals, small information terminals are attached to the wrists or ankles of the animals. It is useful to distinguish between animals and animals by their wrists and ankles, which are easier to distinguish than human fingers. Sometimes it can be larger.

[0151] (Embodiment 2) In this embodiment, a specific example of a display panel included in an electronic device of one embodiment of the present invention will be described. Reveal.

[0152] [Example 1] FIG. 17A shows a plan view of a display panel. An example of a cross-sectional view between the color filter and the display panel shown in Example 1 is shown in FIG. This is a top emission type display panel using a liquid crystal display method. For example, a panel is structured to express one color using three sub-pixels of R (red), G (green), and B (blue). You can also choose from R (red), G (green), B (blue), and W (white), or R (red), G (green), and B (blue) A configuration in which one color is expressed by four sub-pixels of Y (yellow), Y (yellow), etc. can be applied. However, colors other than RGBW may be used, for example, yellow, cyan, magenta, etc. It may be configured as such.

[0153] The display panel shown in FIG. 17A includes a light-emitting section 804, a driving circuit section 806, and an FPC (Flexible Printed Circuit). The light emitting unit 804 and the driving circuit The light emitting elements and transistors included in the circuit section 806 are formed on the substrate 801, the substrate 803, and the sealing layer 804. It is sealed by 823.

[0154] The display panel shown in FIG. 17(C) includes a substrate 801, an adhesive layer 811, an insulating layer 813, and a plurality of A transistor, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light-emitting elements, and an insulating layer 8 21, sealing layer 823, overcoat 849, coloring layer 845, light-shielding layer 847, insulating layer 84 3, adhesive layer 841, and substrate 803. Sealing layer 823, overcoat 849, insulating layer The edge layer 843, adhesive layer 841, and substrate 803 are transparent to visible light.

[0155] The light emitting portion 804 is a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. The light-emitting element 830 includes a lower electrode 83 on an insulating layer 817. 1, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821. Preferably, the upper electrode 835 is transparent to visible light.

[0156] The light-emitting section 804 includes a colored layer 845 overlapping the light-emitting element 830 and a layer overlapping the insulating layer 821. The colored layer 845 and the light-shielding layer 847 are covered with an overcoat 849. The space between the light emitting element 830 and the overcoat 849 is filled with a sealing layer 823. There are.

[0157] The insulating layer 815 has an effect of suppressing diffusion of impurities into a semiconductor that constitutes a transistor. The insulating layer 817 has a planarizing function to reduce surface irregularities caused by the transistor. It is preferable to select an insulating layer having

[0158] The driving circuit section 806 is formed by forming a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. In FIG. 17C, the driver circuit portion 806 includes a plurality of transistors. One transistor is shown.

[0159] The insulating layer 813 and the substrate 801 are bonded together by an adhesive layer 811. The insulating layer 813 and the substrate 803 are bonded together by the adhesive layer 841. If a film with low water permeability is used for 843, impurities such as water may be easily absorbed into the light emitting element 830 or the transistor 820. This is preferable because it is possible to prevent objects from entering the display panel and the reliability of the display panel is increased.

[0160] The conductive layer 857 transmits signals (video signals, clock signals, switch signals, etc.) from the outside to the driving circuit section 806. The external input terminal is electrically connected to an external input terminal that transmits a signal (such as a start signal or a reset signal) or a potential. Here, an example is shown in which an FPC808 is provided as an external input terminal. In order to prevent this, the conductive layer 857 is made of the same material and the same wiring as the electrodes and wiring used in the light-emitting section and the driving circuit section. In this embodiment, the conductive layer 857 is formed in the transistor 820. This shows an example in which the electrode is made of the same material and in the same process as the electrode to be used.

[0161] In the display panel shown in FIG. 17C, the connector 825 is located on the substrate 803. 825 includes the substrate 803, the adhesive layer 841, the insulating layer 843, the sealing layer 823, the insulating layer 817, and The connecting body 814 is connected to the conductive layer 857 through an opening provided in the insulating layer 815. 25 is connected to the FPC 808. The FPC 808 and the conductive layer 857 are connected to each other via the connector 825. When the conductive layer 857 and the substrate 803 overlap, the substrate 803 is opened. By using a substrate having an opening, the conductive layer 857, the connection 825, and the F The PC808 can be electrically connected.

[0162] In the specific example 1, the insulating layer 813, the transistor 820, the light-emitting element 820, and the like are formed on a highly heat-resistant substrate. A substrate 830 is prepared, the prepared substrate is peeled off, and an insulating layer 8 is formed on a substrate 801 using an adhesive layer 811. 13, a transistor 820, and a light-emitting element 830 are transposed to produce a display panel. In addition, in the specific example 1, the insulating layer 843 and the colored layer 845 are formed on a highly heat-resistant substrate. A light-shielding layer 847 is formed, the formed substrate is peeled off, and the light-shielding layer 847 is formed on the substrate 803 using the adhesive layer 841. A display panel can be produced by transposing the insulating layer 843, the colored layer 845, and the light-shielding layer 847. It shows.

[0163] When using a material with low heat resistance (such as resin) for the substrate, the substrate is exposed to high temperatures during the manufacturing process. Since it is difficult to form a semiconductor substrate, there are limitations on the conditions for forming transistors and insulating layers on the substrate. When using a highly water-permeable material (such as resin) for the substrate, high temperatures are applied to form a low-permeability film. In the manufacturing method of this embodiment, a transistor is preferably formed on a manufacturing substrate having high heat resistance. Since it is possible to manufacture highly reliable transistors and transistors with sufficient water permeability by applying high temperatures, Then, the film with low adhesion can be transferred to the substrate 801 or the substrate 803. In this way, a highly reliable display panel can be manufactured. A display panel that is lightweight, thin, and highly reliable can be realized. The details of the manufacturing method will be described later. do.

[0164] [Example 2] FIG. 17B shows a plan view of the display panel. An example of a cross-sectional view of the gap is shown in FIG. This is a top-emission type display panel using a color filter method. Only the points that differ from Example 1 will be described in detail, and the points in common with Example 1 will be omitted.

[0165] The display panel shown in FIG. 17(D) differs from the display panel shown in FIG. 17(C) in the following respects. .

[0166] The display panel shown in FIG. 17D has a spacer 827 over the insulating layer 821. By providing the spacer 827, the distance between the substrate 801 and the substrate 803 can be adjusted.

[0167] In addition, in the display panel shown in FIG. 17D, the substrate 801 and the substrate 803 are different in size. The connection body 825 is located on the insulating layer 843 and does not overlap the substrate 803. Through openings provided in the edge layer 843, the sealing layer 823, the insulating layer 817, and the insulating layer 815, The conductive layer 857 is connected to the substrate 803. Since there is no need to provide an opening in the substrate 803, There are no restrictions on materials.

[0168] [Example 3] FIG. 18A shows a plan view of the display panel. An example of a cross-sectional view of the space between the display panel and the display panel is shown in FIG. The display panel used is a top-emission type.

[0169] The display panel shown in FIG. 18A includes a light-emitting portion 804, a driving circuit portion 806, and an FPC 808. The light emitting element and the transistor included in the light emitting portion 804 and the driving circuit portion 806 are mounted on a substrate 8 01, and is sealed by a substrate 803, a frame-shaped sealing layer 824, and a sealing layer 823.

[0170] The display panel shown in FIG. 18(C) includes a substrate 801, an adhesive layer 811, an insulating layer 813, and a plurality of A transistor, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light-emitting elements, and an insulating layer 8 21, a sealing layer 823, a frame-shaped sealing layer 824, and a substrate 803. The substrate 803 is transparent to visible light.

[0171] The frame-shaped sealing layer 824 is preferably a layer having a higher gas barrier property than the sealing layer 823. This makes it possible to prevent moisture and oxygen from entering the display panel from the outside. This makes it possible to realize a highly reliable display panel.

[0172] In the third specific example, the light emitted from the light emitting element 830 is taken out from the display panel through the sealing layer 823. Therefore, it is preferable that the sealing layer 823 has a higher light-transmitting property than the frame-shaped sealing layer 824. In addition, it is preferable that the sealing layer 823 has a higher refractive index than the frame-shaped sealing layer 824. In addition, the sealing layer 823 has a smaller volume shrinkage during hardening than the frame-shaped sealing layer 824. is preferred.

[0173] The light emitting portion 804 is a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. The light-emitting element 830 includes a lower electrode 83 on an insulating layer 817. 1, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821. Preferably, the upper electrode 835 is transparent to visible light.

[0174] The driving circuit section 806 is formed by forming a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. In FIG. 18C, the driver circuit portion 806 includes a plurality of transistors. One transistor is shown.

[0175] The insulating layer 813 and the substrate 801 are bonded together by an adhesive layer 811. If a film with low water permeability is used, impurities such as water may penetrate into the light emitting element 830 and the transistor 820. This is preferable because it can suppress the intrusion of foreign matter and improve the reliability of the display panel.

[0176] The conductive layer 857 serves as an external input terminal for transmitting signals and potentials from the outside to the driving circuit section 806. Electrically connect. Here, an example is shown in which an FPC808 is provided as an external input terminal. Here, the conductive layer 857 is made of the same material as the electrode of the transistor 820. An example produced using the same process is shown below.

[0177] In the display panel shown in FIG. 18C, the connector 825 is located on the substrate 803. 825 is a substrate 803, a sealing layer 823, an insulating layer 817, and an opening provided in the insulating layer 815. The connector 825 is connected to the conductive layer 857 through a hole. The connector 825 is connected to the FPC 808. The FPC 808 and the conductive layer 857 are electrically connected via the connector 825.

[0178] In the specific example 3, the insulating layer 813, the transistor 820, the light-emitting element 820, and the like are formed on a highly heat-resistant substrate. A substrate 830 is prepared, the prepared substrate is peeled off, and an insulating layer 8 is formed on a substrate 801 using an adhesive layer 811. 13, a transistor 820, and a light-emitting element 830 are transposed to produce a display panel. Since transistors and other devices can be manufactured on a heat-resistant substrate, Therefore, it is possible to form a highly reliable transistor and a film with sufficiently low water permeability. By transferring them to the substrate 801, a highly reliable display panel can be manufactured. As a result, in one embodiment of the present invention, a display panel that is lightweight or thin and has high reliability can be realized. Cut.

[0179] [Example 4] FIG. 18B shows a plan view of the display panel. An example of a cross-sectional view between the color filters is shown in FIG. This is a bottom-emission display panel that uses the method.

[0180] The display panel shown in FIG. 18(D) includes a substrate 801, an adhesive layer 811, an insulating layer 813, and a plurality of A transistor, a conductive layer 857, an insulating layer 815, a colored layer 845, an insulating layer 817a, and an insulating layer 8 17b, a conductive layer 816, a plurality of light-emitting elements, an insulating layer 821, a sealing layer 823, and a substrate 803 The substrate 801, the adhesive layer 811, the insulating layer 813, the insulating layer 815, the insulating layer 817a, And the insulating layer 817b transmits visible light.

[0181] The light emitting portion 804 is a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. The light-emitting element 830 includes an insulating layer A lower electrode 831 on the lower electrode 831, an EL layer 833 on the lower electrode 831, and The lower electrode 831 is a source electrode of the transistor 820 or The end of the lower electrode 831 is covered with an insulating layer 821. The upper electrode 835 is preferably reflective to visible light. The lower electrode 831 is preferably transparent to visible light. The position where the colored layer 845 overlapping the light emitting element 830 is provided is not particularly limited. For example, Between the insulating layer 817a and the insulating layer 817b, between the insulating layer 815 and the insulating layer 817a, etc. Good.

[0182] The driving circuit section 806 is formed by forming a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. In FIG. 18D, the driver circuit portion 806 includes a plurality of transistors. Two transistors are shown.

[0183] The insulating layer 813 and the substrate 801 are bonded together by an adhesive layer 811. When a film with low water permeability is used, the light emitting element 830 and the transistors 820 and 822 are not exposed to water or other impurities. This is preferable because it is possible to prevent the intrusion of impurities and to increase the reliability of the display panel.

[0184] The conductive layer 857 serves as an external input terminal for transmitting signals and potentials from the outside to the driving circuit section 806. Electrically connect. Here, an example is shown in which an FPC808 is provided as an external input terminal. In addition, the conductive layer 857 is formed of the same material and in the same process as the conductive layer 816. Here is an example.

[0185] In the specific example 4, the insulating layer 813, the transistor 820, the light-emitting element 820, and the like are formed on a highly heat-resistant substrate. The substrate is peeled off, and an insulating layer is formed on the substrate 801 using the adhesive layer 811. A display panel that can be manufactured by transposing 813, a transistor 820, a light-emitting element 830, etc. Since transistors and other devices can be manufactured on a heat-resistant substrate, they can be manufactured without being exposed to high temperatures. This makes it possible to form highly reliable transistors and films with sufficiently low water permeability. By transferring these to the substrate 801, a highly reliable display panel can be manufactured. As a result, in one embodiment of the present invention, a display panel that is lightweight or thin and has high reliability can be realized. It can be realized.

[0186] [Example 5] FIG. 18E shows an example of a display panel different from the specific examples 1 to 4.

[0187] The display panel shown in FIG. 18(E) includes a substrate 801, an adhesive layer 811, an insulating layer 813, a conductive layer 814, conductive layer 857a, conductive layer 857b, light-emitting element 830, insulating layer 821, sealing layer 82 3, and a substrate 803.

[0188] The conductive layer 857a and the conductive layer 857b function as external connection electrodes of the display panel. , and can be electrically connected to FPC, etc.

[0189] The light emitting element 830 includes a lower electrode 831, an EL layer 833, and an upper electrode 835. The end of the bottom electrode 831 is covered with an insulating layer 821. The type of the light-extracting side is the top-emission type, the dual-emission type, or the top-emission type. The electrodes, the substrate, the insulating layer, etc. are each transparent to visible light. and electrically connect it to.

[0190] The substrate from which the light is extracted has a hemispherical lens and a microlens array as a light extraction structure. For example, the resin-based film may have a film having a concave-convex structure, a light-diffusing film, or the like. The lens or film is placed on a plate, and the refractive index is the same as that of the substrate or the lens or film. By bonding the light-extraction structure using an adhesive having such properties, a light-extraction structure can be formed.

[0191] The conductive layer 814 is not necessarily required, but it is preferable to reduce the voltage drop caused by the resistance of the lower electrode 831. For the same purpose, the upper electrode 835 and the A conductive layer for electrical connection is formed on the insulating layer 821, the EL layer 833, the upper electrode 835, etc. It may be provided.

[0192] The conductive layer 814 may be made of copper, titanium, tantalum, tungsten, molybdenum, chromium, or neodymium. Materials selected from the group consisting of aluminum, scandium, nickel, and aluminum, or materials containing these as main components The conductive layer 814 can be formed as a single layer or a stacked layer using an alloy material or the like. For example, the thickness can be 0.1 μm or more and 3 μm or less, and preferably, 0.1 μm or more and 0.5 μm or less. It is less than .5μm.

[0193] A paste (such as silver paste) is used as the material for the conductive layer electrically connected to the upper electrode 835. When the conductive layer is heated, the metal constituting the conductive layer becomes granular and aggregates. This results in a structure with many gaps, making it difficult for the EL layer 833 to completely cover the conductive layer, and This is preferable because it makes it easier to electrically connect the conductive layer to the conductive layer.

[0194] In Example 5, an insulating layer 813, a light-emitting element 830, and the like are fabricated on a highly heat-resistant fabrication substrate. The substrate is peeled off, and an insulating layer 813 and a light-emitting element 83 are formed on the substrate 801 using an adhesive layer 811. This shows a display panel that can be manufactured by transposing 0, etc. By applying high temperature to form a film with sufficiently low water permeability and transferring it to the substrate 801, reliability is improved. Thus, in one embodiment of the present invention, a display panel that is lightweight or thin can be manufactured. Moreover, a highly reliable display panel can be realized.

[0195] In this embodiment, a light-emitting element is used as a display element. The embodiment is not limited thereto.

[0196] For example, in this specification, a display element, a display device which is a device having a display element, a light-emitting The light-emitting device may be used in various forms or in various configurations. A display element, a display device, a light-emitting element, or a light-emitting device can have various elements. , EL (electroluminescence) elements (EL elements containing organic and inorganic materials, organic EL elements, inorganic EL elements), LEDs (white LEDs, red LEDs, green LEDs, blue LEDs, etc.) ), transistors (transistors that emit light according to electric current), electron-emitting devices, liquid crystal devices, Dye ink, electrophoretic element, grating light valve (GLV), plasma display Display using PDP and MEMS (Micro-Electro-Mechanical Systems) Element, Digital Micromirror Device (DMD), DMS (Digital Microsha MIRASOL (registered trademark), IMOD (Interference Modulator) shutter type MEMS display element, optical interference type MEMS display element, Using electrowetting elements, piezoelectric ceramic displays, and carbon nanotubes In addition to these, the display element has at least one electric or magnetic The display medium has a contrast, brightness, reflectance, transmittance, etc. that change depending on the action of the light. An example of a display device using an EL element is an EL display. An example of a display device using emission elements is a field emission display (FE D) or SED type flat panel display (SED: Surface-conductio n Electron-emitter Display) and others. An example of such a display device is a liquid crystal display (transmissive liquid crystal display, semi-transmissive liquid crystal display, etc.). Display, reflective LCD display, direct-view LCD display, projection LCD display Display using electronic ink, electronic powder, or electrophoretic elements. An example of a display device is electronic paper. In order to realize a projection type liquid crystal display, a part or all of the pixel electrodes are reflective electrodes. For example, a part or the whole of the pixel electrode may be In this case, the reflective electrode may have a thickness of 100 nm or less. It is also possible to provide a memory circuit such as an SRAM. This further reduces power consumption. When using an LED, it is possible to reduce the amount of light emitted by the LED. Graphene or graphite may be arranged. Graphene or graphite may be arranged in multiple layers. In this way, by providing graphene or graphite, On top of that, a nitride semiconductor, for example, an n-type GaN semiconductor layer having a crystal, can be easily formed. Furthermore, a p-type GaN semiconductor layer having crystals can be formed on the film. In addition, graphene and graphite can be used to form LEDs. An AlN layer may be provided between the GaN semiconductor layer and the GaN-type semiconductor layer. The dielectric layer may be formed by MOCVD. However, by providing graphene, The GaN semiconductor layer in the photodiode can also be formed by sputtering.

[0197] [Example of materials] Next, materials that can be used for the light-emitting panel will be described. The explanation of the configuration may be omitted.

[0198] The substrate can be made of materials such as glass, quartz, organic resin, metal, and alloy. The substrate on the side from which light from the optical element is extracted is made of a material that is translucent to the light.

[0199] In particular, it is preferable to use a flexible substrate. For example, a substrate made of organic resin or a flexible material may be used. Any thickness of glass, metal or alloy may be used.

[0200] Since organic resin has a smaller specific gravity than glass, when organic resin is used as a flexible substrate, This is preferable because it allows the light-weight light-emitting panel to be made lighter than when glass is used.

[0201] It is preferable to use a highly tough material for the substrate. This makes it possible to achieve excellent impact resistance and fracture resistance. For example, organic resin substrates and thin metal substrates can be used. By using an alloy substrate, it is lighter and less susceptible to breakage than when using a glass substrate. It is possible to realize a light-emitting panel.

[0202] Metallic and alloy materials have high thermal conductivity and can easily conduct heat across the entire substrate, making it possible to This is preferable because it can suppress local temperature rises in the panel. The thickness of the substrate is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 50 μm or less. It is more preferable to do so.

[0203] The material constituting the metal substrate or alloy substrate is not particularly limited. For example, aluminum Metals such as aluminum, copper, iron, titanium, nickel, etc., or one or more metals selected from these metals The alloy may be, for example, an aluminum alloy or a stainless steel alloy. For example, a polysilicon film or the like can be preferably used.

[0204] In addition, if a material with high thermal emissivity is used for the substrate, the surface temperature of the light-emitting panel will increase. For example, the substrate can be thermally bonded to a metal substrate, and the damage to the light-emitting panel and the deterioration of its reliability can be suppressed. A stack of layers with high emissivity (for example, metal oxides or ceramic materials can be used) It may also be of this structure.

[0205] As a material having flexibility and light transmission, for example, polyethylene terephthalate (PE T), polyester resins such as polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin Resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, Styrene resin, polyamide-imide resin, polyvinyl chloride resin, polytetrafluoroethylene In particular, it is preferable to use a material with a low thermal expansion coefficient. For example, polyamide-imide resin, polyimide resin, PET, etc. can be suitably used. In addition, resin-impregnated fibrous substrates (also called prepregs) and inorganic fillers are used to make organic resins. It is also possible to use substrates that have been mixed with grease to reduce their thermal expansion coefficient.

[0206] As for the flexible substrate, the layer using the above material acts as a hard layer to protect the surface of the device from scratches. Coating layers (e.g., silicon nitride layers, etc.) and layers of materials that can disperse pressure (e.g., aramid layers, etc.) The insulating layer may be laminated with a layer of a polymeric mide resin or the like.

[0207] The flexible substrate may be used by laminating a plurality of layers. In particular, a structure having a glass layer is preferable. This will improve the barrier properties against water and oxygen, making it possible to create a highly reliable light-emitting panel. can.

[0208] For example, a flexible substrate in which a glass layer, an adhesive layer, and an organic resin layer are laminated from the side closer to the light emitting element is The thickness of the glass layer is preferably 20 μm or more and 200 μm or less. The thickness of the glass layer is preferably 25 μm or more and 100 μm or less. A glass layer having such a thickness is highly resistant to water and oxygen. The organic resin layer can be made thicker than 1 mm thick and has high barrier properties against water and flexibility. The thickness of the thin film is set to 0 μm or more and 200 μm or less, and preferably 20 μm or more and 50 μm or less. By placing the mechanical resin layer on the outside of the glass layer, breakage or cracks in the glass layer are suppressed. The mechanical strength can be improved by using such a composite material of glass material and organic resin. By applying this to the substrate, it is possible to create a highly reliable and flexible light-emitting panel. can.

[0209] For the adhesive layer and sealing layer, there are photo-curable adhesives such as UV-curable adhesives, reaction-curable adhesives, and heat-curable adhesives. Various curing adhesives such as adhesives, anaerobic adhesives, etc. can be used. The following resins are available: epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, Imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin Examples of the resin include ethylene vinyl acetate (EVA) resin. In particular, the permeability of epoxy resin and the like is improved. A material with low wettability is preferable. A two-part mixed resin may also be used. etc. may also be used.

[0210] The resin may contain a desiccant. For example, an oxide of an alkaline earth metal (an acid The material used is one that adsorbs moisture by chemical adsorption, such as calcium chloride or barium oxide. Alternatively, materials such as zeolite and silica gel can absorb water by physical adsorption. If a desiccant is included, impurities such as moisture can be prevented from adsorbing to the functional element. This is preferable because it is possible to suppress the intrusion of foreign matter and improve the reliability of the light-emitting panel.

[0211] In addition, by mixing a filler having a high refractive index or a light scattering material into the resin, a light emitting element can be formed. For example, titanium oxide, barium oxide, Zeolite, zirconium, etc. can be used.

[0212] The structure of the transistor in the light-emitting panel is not particularly limited. For example, a staggered transistor The transistor may be a top gate transistor or an inverted staggered transistor. The transistor may have either a top gate type or a bottom gate type structure. The semiconductor material is not particularly limited, and examples thereof include silicon, germanium, silicon carbide, and gallium nitride. Indium, gallium, etc., or In-Ga-Zn-based metal oxides, etc. Alternatively, an oxide semiconductor containing at least one of lithium and zinc may be used.

[0213] The crystallinity of the semiconductor material used in the transistor is not particularly limited. A semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single crystal semiconductor, or a semiconductor having a partially crystalline region) If a semiconductor having crystallinity is used, the This is preferable because it is possible to suppress deterioration of the resistor characteristics.

[0214] Here, transistors used in pixels, driving circuits, touch sensors, etc., which will be described later, It is preferable to use an oxide semiconductor for any semiconductor device. It is preferable to use an oxide semiconductor with a larger band gap than silicon. When a semiconductor material with a wide gap and low carrier density is used, the off state of a transistor This is preferable because it can reduce the current in the

[0215] For example, the oxide semiconductor may contain at least indium (In) or It is preferable that the material contains zinc (Zn). More preferably, the material contains In-M-Zn oxide (wherein M is A). (metals such as l, Ti, Ga, Ge, Y, Zr, Sn, La, Ce or Hf) Contains oxides.

[0216] In particular, the semiconductor layer has a plurality of crystal parts, and the crystal parts have a c-axis aligned with a surface on which the semiconductor layer is formed. or oriented perpendicular to the upper surface of the semiconductor layer and having no grain boundary between adjacent crystal portions. An oxide semiconductor film is preferably used.

[0217] Such an oxide semiconductor does not have crystal grain boundaries, so that when the display panel is curved, The occurrence of cracks in the oxide semiconductor film due to stress is suppressed. Such oxide semiconductors are suitable for use in display panels that are flexible and can be curved when used. There can be.

[0218] By using such materials for the semiconductor layer, the fluctuation of electrical characteristics is suppressed, and reliability is improved. This allows for high-performance transistors.

[0219] In addition, due to its low off-state current, the charge stored in the capacitance through the transistor can be released for a long period of time. By applying such a transistor to a pixel, It is also possible to stop the driving circuit while maintaining the grayscale of the image displayed in the display area. As a result, it is possible to realize electronic equipment with extremely reduced power consumption.

[0220] In order to stabilize the characteristics of the transistor, it is preferable to provide an undercoat film. , silicon oxide film, silicon nitride film, silicon oxynitride film, silicon nitride oxide film, etc. The base film can be formed by a single layer or a multilayer structure using an organic insulating film. , CVD (Chemical Vapor Deposition) method (Plasma CVD method, thermal CVD method, MOCVD (Metal Organic CVD) method, etc.), ALD (Atomic Layer Deposition), coating, printing, etc. In addition, the undercoat film does not have to be provided if it is not necessary. The layer 813 can also serve as an underlayer for the transistor.

[0221] The light-emitting element may be a self-emitting element that is illuminated by a current or a voltage. The category includes devices whose light intensity can be controlled. For example, light-emitting diodes (LEDs), organic An EL element, an inorganic EL element, etc. can be used.

[0222] The light-emitting elements are top emission type, bottom emission type, and dual emission type. The electrode on the light extraction side is made of a conductive film that transmits visible light. In addition, it is preferable to use a conductive film that reflects visible light for the electrode on the side from which light is not extracted. stomach.

[0223] The conductive film that transmits visible light is, for example, indium oxide or indium tin oxide (ITO). Indium Tin Oxide, Indium Zinc Oxide, Zinc Oxide, Gallium-doped It can be formed using zinc oxide with added metals. It can also be formed using gold, silver, platinum, magnesium , nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, if Metallic materials such as titanium, alloys containing these metallic materials, or nitrides of these metallic materials (e.g. For example, titanium nitride can be used by forming it thin enough to have light transmission properties. A laminated film of the above materials can also be used as the conductive layer. For example, a layer of silver and magnesium It is preferable to use a laminated film of an alloy of tungsten and ITO, since the electrical conductivity can be increased. Graphene or the like may also be used.

[0224] The conductive film that reflects visible light is made of, for example, aluminum, gold, platinum, silver, nickel, tungsten, etc. Metallic materials such as stainless steel, chromium, molybdenum, iron, cobalt, copper, or palladium, or In addition, the above-mentioned metal materials and alloys may be used. Tungsten, neodymium, germanium, etc. may be added. Aluminum alloys such as tungsten alloys, aluminum-nickel alloys, and aluminum-neodymium alloys Alloys containing palladium (aluminum alloys), silver and copper alloys, silver, palladium and copper alloys, It can be formed using an alloy containing silver, such as an alloy of silver and magnesium. The alloy is preferable because of its high heat resistance. By laminating the metal oxide film, the oxidation of the aluminum alloy film can be suppressed. Examples of materials for the metal film and metal oxide film include titanium and titanium oxide. A conductive film that transmits visible light and a film made of a metal material may be laminated. For example, silver and ITO A laminated film of an alloy of silver and magnesium and ITO, or the like can be used.

[0225] The electrodes may be formed by vapor deposition or sputtering. The shape is created using a discharge method such as the ink jet method, a printing method such as the screen printing method, or a plating method. It can be achieved.

[0226] A voltage higher than the threshold voltage of the light emitting element is applied between the lower electrode 831 and the upper electrode 835. When this occurs, holes are injected into the EL layer 833 from the anode side, and electrons are injected from the cathode side. The electrons and holes are recombined in the EL layer 833, and the light-emitting material contained in the EL layer 833 emits light. It shines.

[0227] The EL layer 833 has at least a light-emitting layer. The EL layer 833 has the following layers other than the light-emitting layer: Materials with high hole injection properties, materials with high hole transport properties, hole blocking materials, materials with high electron transport properties A material with high electron injection properties or a bipolar material (with high electron transport and hole transport properties) The layer may further include a layer containing a material such as a metal.

[0228] The EL layer 833 can be made of either a low molecular weight compound or a high molecular weight compound. The layers constituting the EL layer 833 may each be formed by deposition (vacuum deposition). It can be formed by methods such as the transfer method, printing method, inkjet method, coating method, etc. Cut.

[0229] When a white-emitting light-emitting element is used as the light-emitting element 830, two types of It is preferable that the light emitting device includes two or more luminescent materials. White light can be obtained by selecting luminescent materials so that the light is complementary in color. For example, they emit light of R (red), G (green), B (blue), Y (yellow), O (orange), etc. or luminescence that contains two or more of the R, G, and B spectral components It is preferable that the light emitting element 830 contains two or more of the above substances. The light has two or more peaks within the visible light wavelength range (e.g., 350 nm to 750 nm). It is preferable to use a light emitting element having a peak in the yellow wavelength region. The emission spectrum of the material has spectral components in the green and red wavelength regions. It is preferred.

[0230] More preferably, the EL layer 833 is a light-emitting layer including a light-emitting material that emits light of one color and a light-emitting layer including a light-emitting material that emits light of another color. It is preferable that the light-emitting layer is laminated with a light-emitting layer containing a light-emitting material that emits light of E The plurality of light-emitting layers in the L layer 833 may be laminated in contact with each other or may be laminated with a separation layer therebetween. For example, a separation layer may be provided between the fluorescent light-emitting layer and the phosphorescent light-emitting layer. It may also be composed of.

[0231] The separation layer is configured to convert the excited state of a phosphorescent material generated in the phosphorescent-emitting layer into the fluorescent material in the fluorescent-emitting layer. Preventing energy transfer (especially triplet energy transfer) to optical materials through the Dexter mechanism The separation layer only needs to be a few nm thick. Specifically, it is 0. 1nm to 20nm, or 1nm to 10nm, or 1nm to 5nm The separation layer may be a single material (preferably a bipolar material) or a plurality of materials. (preferably a hole transporting material and an electron transporting material).

[0232] The separation layer may be formed using a material contained in the light-emitting layer that is in contact with the separation layer. This makes it easier to fabricate the light-emitting device and reduces the driving voltage. When the separation layer is made of a host material, an assist material, and a phosphorescent material (guest material), The separation layer may be formed of a host material and an assist material. The phosphorescent layer has a region that does not contain the material, and the phosphorescent layer has a region that contains the phosphorescent material. It is possible to deposit the separation layer and the phosphorescent layer with or without the phosphorescent material. This configuration makes it possible to form the separation layer and the phosphorescent layer in the same chamber. This makes it possible to reduce manufacturing costs.

[0233] The light emitting element 830 may be a single element having one EL layer, or may be a multi-element element having multiple EL layers. The device may be a tandem device in which an EL layer is laminated via a charge generating layer.

[0234] It is preferable that the light emitting element is provided between a pair of insulating films having low water permeability. This makes it possible to prevent impurities such as water from entering the light emitting element, thereby preventing a decrease in the reliability of the light emitting device. Can be controlled.

[0235] Insulating films with low water permeability include silicon nitride films and silicon oxynitride films, which are made of nitrogen and silicon. and films containing nitrogen and aluminum, such as an aluminum nitride film. A silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may also be used.

[0236] For example, the amount of water vapor that passes through a low-permeability insulating film is 1×10 -5 [g / (m2 ·day )] or less, preferably 1 × 10 -6 [g / (m 2 ·day)] or less, preferably 1× 10 -7 [g / (m 2 ·day)] or less, and more preferably 1×10 -8 [g / (m 2 · day)] or less.

[0237] It is preferable to use an insulating film with low water permeability for the insulating layer 813 and the insulating layer 843.

[0238] The insulating layer 815 may be, for example, a silicon oxide film, a silicon oxynitride film, or an aluminum oxide film. In addition, an inorganic insulating film such as an inorganic film can be used. The insulating layer 817b may be made of, for example, polyimide, acrylic, polyamide, or polyimide. Organic materials such as amide and benzocyclobutene resins can be used. Low dielectric constant materials (low-k materials) can be used. In addition, multiple insulating films can be stacked. Each insulating layer may be formed by

[0239] The insulating layer 821 is formed using an organic insulating material or an inorganic insulating material. For example, polyimide resin, polyamide resin, acrylic resin, siloxane resin, epoxy resin, etc. In particular, photosensitive resin materials can be used. It is preferable that the side wall of the opening is formed as an inclined surface having a continuous curvature. I wish.

[0240] The method for forming the insulating layer 821 is not particularly limited, but may be a photolithography method, a sputtering method, or the like. , deposition method, droplet ejection method (inkjet method, etc.), printing method (screen printing, offset printing It is advisable to use a printing method, etc.

[0241] The spacer 827 may be formed using an inorganic insulating material, an organic insulating material, a metal material, or the like. For example, inorganic insulating materials and organic insulating materials can be used for the insulating layer. Examples of metal materials that can be used include titanium and aluminum. The spacer 827 containing a conductive material and the upper electrode 835 are electrically connected to each other. This makes it possible to suppress a potential drop caused by the resistance of the upper electrode 835. The shape of the 27 may be either a forward taper shape or a reverse taper shape.

[0242] For light-emitting panels that function as electrodes or wiring of transistors or auxiliary electrodes of light-emitting elements The conductive layer used may be, for example, molybdenum, titanium, chromium, tantalum, tungsten, or aluminum. Metal materials such as aluminum, copper, neodymium, scandium, etc., or alloy materials containing these elements The conductive layer can be formed as a single layer or a laminated layer using a conductive metal oxide. The conductive metal oxide may be indium oxide (In 2 O 3 etc. ), tin oxide (SnO 2 etc.), zinc oxide (ZnO), ITO, indium zinc oxide (I n 2 O 3 -ZnO, etc.) or these metal oxide materials containing silicon oxide are used. It is possible.

[0243] The colored layer is a colored layer that transmits light of a specific wavelength band. For example, A red (R) color filter transmits light in the green wavelength range, and a green (G) color filter transmits light in the green wavelength range. A blue (B) color filter that transmits light in the blue wavelength band is used. Each color layer can be formed by using various materials and by printing, inkjet printing, photolithography, etc. They are formed at desired positions by an etching method using a graphic technique or the like.

[0244] The light-shielding layer is provided between adjacent colored layers. The light-shielding layer blocks light from the adjacent light-emitting elements. The colored layer is provided with an end portion that is light-shielding to suppress color mixing between adjacent light-emitting elements. By providing the light-shielding layer so as to overlap the light-shielding layer, it is possible to suppress light leakage. Materials that block light emitted from the light-emitting element can be used, including, for example, metal materials, pigments, and dyes. The black matrix may be formed using a resin material that includes the light-shielding layer. If the light emitting portion is provided in an area other than the light emitting portion, unintended light leakage due to guided light can be suppressed. This is preferable.

[0245] In addition, an overcoat may be provided to cover the colored layer and the light-shielding layer. By doing so, it is possible to prevent impurities contained in the colored layer from diffusing into the light emitting element. The overcoat is made of a material that transmits light emitted from the light emitting element, such as silicon nitride. It uses inorganic insulating films such as silicon oxide films, and organic insulating films such as acrylic films and polyimide films. Alternatively, the insulating film may have a laminated structure of an organic insulating film and an inorganic insulating film.

[0246] In addition, when the material for the sealing layer is applied onto the colored layer and the light-shielding layer, the material for the overcoat is It is preferable to use a material that has high wettability with respect to the material of the sealing layer. As the substrate, an oxide conductive film such as an ITO film or a metal film such as an Ag film that is thin enough to have transparency is used. It is preferred to use a membrane.

[0247] The connector is a paste or sheet made of a thermosetting resin mixed with metal particles. For example, a material that exhibits anisotropic conductivity when bonded by heat and pressure can be used. For example, particles with layers of two or more metals, such as nickel particles coated with gold, are used. It is preferable to use a material in which the surface of a granular resin is coated with a metal. I wish.

[0248] This embodiment mode can be freely combined with other embodiment modes.

[0249] (Embodiment 3) In this embodiment, an example of a method for charging a power storage device by wireless power supply will be described. Wireless power supply can use electric fields, magnetic fields, electromagnetic waves, etc.

[0250] The electronic device according to one embodiment of the present invention receives an electric field, a magnetic field, an electromagnetic wave, or the like from an antenna, a coil, or the like. In addition, the electronic device of one embodiment of the present invention preferably includes a charging device. It is preferable to have a sensor.

[0251] By using a coupling coil and a coupling capacitor, it is possible to charge the storage device without contact. In addition, the coupling coil can be changed into an antenna. Here, a secondary battery is used as the power storage device. Here is an example of using the charger. The primary coil of the charger and the secondary coil of the electronic device are magnetically coupled to each other. The magnetic field generated by the primary coil generates a voltage in the secondary coil, using electromagnetic induction. Charging is achieved by transmitting power to the secondary coil without contact. Since it is preferable to provide the coil in contact with the filter, the coil of the electronic device is also flexible. It is preferable to provide the antenna in the electronic device. This is also fine.

[0252] When an antenna is provided on the secondary battery of a finger-mounted electronic device having a display module, The charging of the secondary battery is not limited to the charging by contact, but may be provided with a memory and may transmit and receive electronic data. Or, by providing a GPS function, it can acquire location information and GPS time and display the location and clock. An antenna may be provided to enable the above.

[0253] For safety reasons, the input / output terminals for charging or discharging the secondary battery are exposed so that they may come into contact with any part of the human body. If the input / output terminals are exposed, rain or other water may damage the input / output terminals. There is a risk of short-circuiting the power cord or electric shock if the input / output terminals come into contact with the human body. If so, the input / output terminals can be configured not to be exposed on the surface of the electronic device.

[0254] Note that the present embodiment is the same as that of the first embodiment except that an antenna, a coil, and a wireless power supply converter are provided. Therefore, other detailed description will be omitted here.

[0255] According to the first embodiment, a power storage device, here a secondary battery, is fixed on the plate, and a display is placed on the secondary battery. The secondary battery preferably has a curved shape. It is preferable that the secondary battery is flexible. The wireless power converter and antenna are also installed so that they overlap partly with the display. Fix.

[0256] The wireless power supply converter and antenna weigh less than 10g, and the total weight is almost the same as in the first embodiment. The weight can be made almost the same.

[0257] FIG. 12 is a schematic diagram of an electronic device 400 having an antenna (not shown) and a charger 401. When the electronic device 400 is placed on the charger 401, power is supplied from the antenna of the charger 401. can be supplied to the electronic device 400 to charge the secondary battery of the electronic device 400.

[0258] In addition, information such as the remaining charge and the time remaining until full charge is displayed on the display unit of the electronic device 300. It is possible to display it.

[0259] This embodiment mode can be freely combined with other embodiment modes.

[0260] (Embodiment 4) In this embodiment, a flexible storage battery 10 that can be used in one embodiment of the present invention will be described. Let me explain number 8.

[0261] In this embodiment, a flexible storage battery 108 is used with an exterior body made of a film. An example of using a thin secondary battery is shown in FIG. 19. The cross sections cut along the chain lines A1-A2 and B1-B2 in FIG. 19 are shown in FIG. 20(A) and This is shown in FIG. 20(B).

[0262] The thin secondary battery is composed of a sheet-shaped positive electrode 1203, a sheet-shaped negative electrode 1206, and a separator. A positive electrode lead electrode is connected to the positive electrode 1207, an electrolyte 1208, an exterior body 1209 made of a film, and a positive electrode lead electrode. The positive electrode 1510 is provided in the outer casing 1209, and the negative electrode lead electrode 1511 is provided in the outer casing 1209. A separator 1207 is disposed between the battery 1203 and the negative electrode 1206. An electrolyte 1208 is poured into the inside of 209. The positive electrode 1203 is and a positive electrode active material layer 1202. The negative electrode 1206 has a negative electrode current collector 1204 and a negative electrode active material layer 1202. It has a material layer 1205 .

[0263] The materials for the positive electrode current collector 1201 and the negative electrode current collector 1204 are selected from those having remarkable properties in a power storage device. There are no particular limitations as long as the material exhibits high electrical conductivity without causing chemical changes. For example, gold, platinum, Metals such as zinc, iron, nickel, copper, aluminum, titanium, and tantalum, and their alloys (e.g. stainless steel) or alloys of these metals with other metals can be used. Also, it improves the heat resistance of silicon, titanium, neodymium, scandium, molybdenum, etc. Aluminum alloys with added elements can be used. Also, they react with silicon to form silicon. It may be formed of a metal element that reacts with silicon to form a silicide. The metallic elements that can be used are zirconium, titanium, hafnium, vanadium, niobium, and tantalum. The materials include zinc, chromium, molybdenum, tungsten, cobalt, and nickel. 01, and the negative electrode current collector 1204 may be in the form of a foil, a plate (sheet), a mesh, a cylinder, a coil, The positive electrode collector may be in the form of a punched metal, an expanded metal, or the like. The current collector 1201 and the negative electrode current collector 1204 have a thickness of 5 μm or more and 30 μm or less. It would be good to do so.

[0264] The positive electrode active material layer 1202 is made of a material capable of inserting and removing carrier ions. For example, an olivine type crystal structure, a layered rock salt type crystal structure, or a sintered rock salt type crystal structure can be used. Lithium-containing materials with a Pinel-type crystal structure are available. For example, alkali metals (such as lithium, sodium, potassium, etc.), alkaline earth metals Metals (e.g. calcium, strontium, barium, etc.), beryllium, magnesium etc. can be used.

[0265] When lithium is used as the carrier ion, the positive electrode active material is, for example, LiFe O 2 , LiCoO 2 , LiNiO 2 , LiMn 2 O 4 , V 2 O 5 , Cr 2 O 5 , MnO 2 Compounds such as the above can be used.

[0266] or lithium-containing complex phosphate (general formula LiMPO 4 (M is Fe(II), Mn( The general formula LiM PO 4 A representative example is LiFePO 4 , LiNiPO 4 , LiCoPO 4 , LiMn PO 4 , Life a Ni b PO 4 , Life a Co b PO 4 , Life a Mn b PO 4 , LiNi a Co b PO 4 , LiNi a Mn b PO 4 (a+b is less than or equal to 1, 0 <a<1、0< b<1), LiFe c Ni d Co e PO 4 , Life c Ni dMn e PO 4 、LiNi c Co d Mn e PO 4 (c + d + e is 1 or less, 0 < c < 1, 0 < d < 1, 0 < e < 1), L iFe f Ni g Co h Mn i PO 4 (f + g + h + i is 1 or less, 0 < f < 1, 0 < g < 1 , 0 < h < 1, 0 < i < 1) etc. exist.

[0267] In particular, LiFePO 4 satisfies well the requirements for the cathode active material, such as safety, stability, high capacity density, high potential, and the presence of lithium ions that can be extracted during initial oxidation (charging), and is thus preferable.

[0268] Examples of the lithium-containing material having a layered rock salt-type crystal structure include lithium cobaltate (LiCoO 2 ), LiNiO 2 , LiMnO 2 , Li 2 MnO 3 which can be used. Also, NiCo-based such as LiNi 0.8 Co 0.2 O 2 etc. (general formula: LiNi x Co 1 -x O 2 (0 < x < 1)), LiNi 0.5 Mn 0.5 O 2 etc. NiMn-based (general formula: LiNi x Mn 1-x O 2 (0 < x < 1)), LiNi 1 / 3 Mn 1 / 3 Co 1 / 3 O 2 NiMnCo series (also called NMC) such as LiNi x Mn y Co 1-x-y O 2 (x>0, y>0, x+y<1) can be used. 0.8 Co 0.15 Al 0.05 )O 2 , Li 2 MnO 3 -LiMO 2 (M=Co, Ni, Mn, etc.) can be used.

[0269] Examples of lithium-containing materials having a spinel-type crystal structure include LiMn 2 O 4 , Li 1+x Mn 2-x O 4 (0 <x<2)、LiMn 2-x Al x O 4 (0 <x<2)、 LiMn 1.5 Ni 0.5 O 4 etc.

[0270] LiMn 2 O 4 Lithium-containing materials with spinel-type crystal structures containing manganese such as , a small amount of lithium nickel oxide (LiNiO 2 Or LiNi 1-x MO 2 (M=Co, Al, etc.) Mixing with ) has the advantage of suppressing the elution of manganese and the decomposition of the electrolyte. preferable.

[0271] In addition, the positive electrode active material is a compound having the general formula Li (2-j) MSiO 4 (M is Fe(II), M Lithium-containing materials such as one or more of n(II), Co(II), and Ni(II), where 0≦j≦2 The general formula Li (2-j) MSiO 4 A representative example is Li (2- j) FeSiO 4 , Li (2-j) NiSiO 4 , Li (2-j) CoSiO 4 , Li ( 2-j) MnSiO 4 , Li (2-j) Fe k Ni l SiO 4 , Li (2-j) Fe k C o l SiO 4 , Li (2-j) Fe k Mn l SiO 4 , Li (2-j) Ni k Co l S O 4 , Li (2-j) Ni k Mn l SiO 4 (k+l is 1 or less, 0 <k<1、0<l<1 ), Li (2-j) Fe m Ni n Co q SiO 4 , Li (2-j) Fe m Ni n Mn q S iO 4 , Li (2-j) Ni m Co n Mn q SiO 4 (m+n+q is less than or equal to 1, 0 <m<1 , 0 <n<1、0<q<1)、Li (2-j) Fe r Ni s Co t Mn u SiO 4 (r+ Lithium such as s + t + u ≤ 1, 0 < r < 1, 0 < s < 1, 0 < t < 1, 0 < u < 1) compounds can be used as materials.

[0272] Also, as the positive electrode active material, A x M 2 (XO 4 ) 3 (A = Li, Na, Mg, M = Fe, Mn, Ti, V, Nb, Al, X = S, P, Mo, W, As, Si) represented by the general formula NASICON-type compounds can be used. Examples of NASICON-type compounds include Fe 2 (MnO 4 ) 3 , Fe 2 (SO 4 ) 3 , Li 3 Fe 2 (PO 4 ) 3 etc. Also, as the positive electrode active material and, Li 2 MPO 4 F, Li 2 MP 2 O 7 , Li 5 MO 4 (M = Fe, Mn) represented by the general formula compounds, NaF 3 , FeF 3 etc. perovskite-type fluorides, TiS 2 , MoS 2 etc. metal chalcogenides (sulfides, selenides, tellurides), LiMVO 4 etc. materials having an inverse spinel-type crystal structure, vanadium oxide-based (V O 2 , V 5 , V 6 O 13 , LiV 3 O 8 etc.), manganese oxides, organic sulfur compounds, etc. can be used.

[0273] In addition to the above-mentioned positive electrode active material, the positive electrode active material layer 1202 contains a material for improving the adhesion of the active material. and a conductive assistant for increasing the conductivity of the positive electrode active material layer 1202. It may have.

[0274] The negative electrode active material layer 1205 is formed by dissolving or depositing a metal that becomes a carrier ion, or Materials that allow anion insertion and removal can be used. For example, lithium gold Metals, carbon materials, metallic materials, non-metallic materials, etc. can be used.

[0275] Lithium metal has a low redox potential (-3.045 V vs. the standard hydrogen electrode) and is lightweight. and high specific capacity per volume (3860mAh / g and 2062mAh / cm 3 ) is therefore preferable.

[0276] Carbon materials include graphite, graphitizable carbon (soft carbon), and non-graphitizable carbon (hard carbon). Examples of nanofibers include graphene, carbon nanotubes, graphene, and carbon black.

[0277] Graphite includes mesocarbon microbeads (MCMB), coke-based artificial graphite, and pitted graphite. These include artificial graphite such as titanium-based artificial graphite, and natural graphite such as spheroidized natural graphite.

[0278] Graphite is formed when lithium ions are inserted into graphite (lithium-graphite intercalation compound is formed) It has a low potential similar to that of lithium metal (0.3 V or less vs. Li / Li + ).this This allows the lithium-ion secondary battery to exhibit a high operating voltage. Relatively high capacity per unit volume, small volume expansion, inexpensive, and compared to lithium metal Therefore, it is preferable since it has an advantage of being highly safe.

[0279] In addition, as the negative electrode active material, the dissolution and precipitation of metals that become carrier ions, or the The material can be used to insert and remove lithium ions. In the case of ions, for example, Mg, Ca, Al, Si, Ge, Sn, Pb, Sb, As, A material containing at least one of Bi, Ag, Au, Zn, Cd, Hg, and In, etc. These elements have a large capacity compared to carbon, and silicon in particular has a theoretical The capacity is 4200mAh / g, which is extremely high. Therefore, the use of silicon as the negative electrode active material It is preferable that the metal which becomes the carrier ion is dissolved or precipitated, or the carrier ion is inserted. Examples of materials that can be inserted and removed include SiO, Mg 2 Si, Mg 2 Ge, Sn O, SnO 2 , Mg 2 Sn, SnS 2 , V 2 Sn 3 , FeSn 2 , CoSn 2 , Ni 3 S n 2 , Cu 6 Sn 5 , Ag 3 Sn, Ag 3 Sb, Ni 2 MnSb, CeSb 3 , LaSn 3 , La 3 Co 2 Sn 7 , CoSb 3 , InSb, SbSn, etc. can be used.

[0280] Titanium dioxide (TiO 2 ), lithium titanium oxide (Li 4 Ti 5 O 12), lithium-graphite intercalation compound (Li x C 6 ), niobium pentoxide (Nb 2 O 5 ), tungsten oxide (WO 2 ), molybdenum oxide (MoO 2 ) and other oxides. can be done.

[0281] In addition, the negative electrode active material is a complex nitride of lithium and transition metals, Li 3 N-type structure Li 3-x M x N (M=Co, Ni, Cu) can be used. For example, Li 2. 6 Co 0.4 N 3 has a large charge / discharge capacity (900mAh / g, 1890mAh / cm 3 )of This is preferable.

[0282] When a composite nitride of lithium and transition metals is used, the negative electrode active material contains lithium ions, , V that does not contain lithium ions as the positive electrode active material 2 O 5 , Cr 3 O 8 Combined with materials such as In addition, when a material containing lithium ions is used as the positive electrode active material, However, by first removing the lithium ions from the positive electrode active material, As the nitride, a complex nitride of lithium and a transition metal can be used.

[0283] In addition, a material that undergoes a conversion reaction can be used as the negative electrode active material. For example, lithium oxide such as cobalt oxide (CoO), nickel oxide (NiO), and iron oxide (FeO) A transition metal oxide that does not undergo an alloying reaction with the metal may be used as the negative electrode active material. Further materials that can cause reactions include Fe 2 O 3 ,CuO,Cu 2 O, RuO 2 , Cr 2 O 3 Oxides such as CoS 0.89 , NiS, CuS and other sulfides, Zn 3 N 2 , Cu 3 N, Ge 3 N 4 Nitrides such as NiP 2 , FeP 2 , CoP 3 Phosphides such as FeF 3 , BiF 3 This also occurs with fluorides such as those mentioned above. However, since the electric potential of the above fluorides is high, they are not used as positive electrode active materials. It's fine.

[0284] In addition to the above-mentioned negative electrode active material, the negative electrode active material layer 1205 contains a material for improving the adhesion of the active material. and a conductive assistant for increasing the conductivity of the negative electrode active material layer 1205. It may have.

[0285] The electrolyte 1208 is capable of moving carrier ions as an electrolyte. In addition, a material having carrier ions can be used. When the electrolyte is on, a typical example is LiPF 6 , LiClO 4 , Li(FS O 2 ) 2 N, LiAsF 6 , LiBF 4 , LiCF 3 SO 3 , Li(CF 3 SO 2 ) 2 N , Li(C 2 F 5 SO 2 )2 N, etc. These electrolytes are or two or more of them may be used in any combination and ratio. In order to make the material more stable, a small amount (1 wt%) of vinylene carbonate (VC) was added to the electrolyte. may be added to reduce decomposition of the electrolyte.

[0286] As a solvent for the electrolyte 1208, a material that allows the movement of carrier ions is used. The solvent for the electrolyte is preferably an aprotic organic solvent. Examples are ethylene carbonate (EC), propylene carbonate, dimethyl carbonate, nitrate, diethyl carbonate (DEC), γ-butyrolactone, acetonitrile, dimethicone These include methoxyethane and tetrahydrofuran. One or more of these can be used. In addition, by using a polymer material that gels as a solvent for the electrolyte, it is possible to reduce leakage and other problems. The safety of the battery is improved. In addition, the battery can be made thinner and lighter. Representative examples of materials include silicone gel, acrylic gel, acrylonitrile gel, and poly Ethylene oxide gel, polypropylene oxide gel, fluorine polymer gel In addition, ionic liquids (melting point at room temperature) that are flame-retardant and non-volatile are used as solvents for electrolytes. By using one or more salts, the internal temperature of the battery is prevented from rising due to internal short circuits or overcharging. Even if the temperature rises, it can prevent the battery from exploding or catching fire.

[0287] The separator 1207 may be, for example, an insulator. For example, cellulose (paper), polypropylene or polyethylene with holes, etc. can be used. This can be done.

[0288] A secondary battery is made of a thin, flexible film (e.g., a laminate film) as an exterior body. A laminate film is a laminated film made of a base film and an adhesive synthetic resin film. It refers to a laminated film of two or more types. The base film is PET or PB. Polyesters such as T, polyamides such as nylon 6 and nylon 66, and inorganic deposition films As the adhesive synthetic resin film, polyethylene, polypropylene, etc. may be used. Polyolefin, acrylic synthetic resin, epoxy synthetic resin, etc. can be used. The film is laminated to the object to be treated by thermocompression bonding using a laminating device. It is preferable to apply an anchor coating agent as a pretreatment before the lamination process. The adhesive between the anchor film and the object to be treated can be strengthened. For example, an isocyanate type may be used.

[0289] In the above configuration, the exterior body 1209 of the secondary battery has a radius of curvature of 30 mm or more, preferably a curved The film that is the exterior of the secondary battery can deform within a radius of 10 mm or more. In the case of a secondary battery with a laminated structure, the battery is curved. The cross-sectional structure is that the exterior film is sandwiched between two curved lines.

[0290] The radius of curvature of a surface will be described with reference to FIG. 21. In FIG. 21(A), a curved surface 170 A part of a curve 1702 included in a surface 1700 is cut into a plane 1701 that cuts through 0. Approximate the arc and set the radius of the circle as the radius of curvature 1703 and the center of the circle as the center of curvature 1704. FIG. 21(B) shows a top view of the curved surface 1700. FIG. 21(C) shows the curved surface 1700 on a flat surface 1701. The cross-sectional view of 1700 is shown. When cutting a curved surface with a plane, the angle of the plane to the curved surface is The radius of curvature of the curve that appears in the cross section will differ depending on the cutting position and the etc., the smallest radius of curvature is taken as the radius of curvature of the surface.

[0291] The secondary battery, which sandwiches electrodes and electrolyte (1805) between two films as the exterior body, is curved. In this case, the radius of curvature 1802 of the film 1801 on the side closer to the center of curvature 1800 of the secondary battery is smaller than the radius of curvature 1804 of the film 1803 on the side farther from the center of curvature 1800 ( FIG. 22(A). When a secondary battery is curved to have an arc-shaped cross section, the center of curvature is 1800°. The surface of the film is subjected to compressive stress, and the surface of the film far from the center of curvature 1800 is subjected to tension stress. Tensile stress is applied (Figure 22(B)). The pattern formed on the surface of the exterior body is a concave or convex pattern. When this is formed, even if compressive or tensile stress is applied, the effects of strain are not observed. Therefore, the secondary battery can be prevented from being damaged by the external casing on the side closer to the center of curvature. The radius of curvature can be deformed within a range of 30 mm or more, preferably 10 mm or more.

[0292] The cross-sectional shape of the secondary battery is not limited to a simple arc shape, and may be a shape that includes a partial arc. For example, the shape shown in FIG. 22(C), a wavy shape (FIG. 22(D)), an S-shape, etc. In the case where the curved surface of the secondary battery has a shape having a plurality of centers of curvature, Among the radii of curvature at each of the centers of curvature, the surface with the smallest radius of curvature is 2 The radius of curvature of the outer casing closest to the center of curvature of one outer casing is 30 mm or more, preferably 10 mm The secondary battery can be deformed within the above range.

[0293] This embodiment mode can be freely combined with other embodiment modes.

[0294] (Embodiment 5) When a plurality of battery cells are used in the finger ring type electronic device described in the above embodiment, A battery management unit (BMU) that can be used in combination with the cells A battery control unit (BMU) and a transistor suitable for the circuit constituting the battery control unit The transistor will be described with reference to FIG. 28 to FIG. 34. In this embodiment, in particular, The battery control unit of the power storage device having battery cells connected to each other will be described.

[0295] When multiple battery cells connected in series are repeatedly charged and discharged, the characteristics between the battery cells The capacity (output voltage) varies depending on the variation in the The total discharge capacity depends on the battery cells with smaller capacity. Also, if charging is performed based on a battery cell with a smaller capacity, the charging In addition, if charging is performed based on the battery cell with the larger capacity, it may result in overcharging. There is a risk that this may happen.

[0296] Therefore, the battery control unit of the power storage device having battery cells connected in series is It has the function of aligning the capacity variation between battery cells, which can cause overcharging. The circuit configuration for aligning the capacitance variation between the resistors, capacitors, or inductors can be used. There are other methods such as the transistor method, but here we use a transistor with a small off-current to reduce the variation in capacitance. An example of a circuit configuration that can be made uniform will be described below.

[0297] As a transistor with low off-state current, a transistor having an oxide semiconductor in a channel formation region is OS transistors with low off-state current are preferred. By using it in the circuit configuration of the battery control unit of the device, the amount of charge leaking from the battery is reduced, This makes it possible to suppress the decrease in capacity over time.

[0298] The oxide semiconductor used in the channel formation region is In-M-Zn oxide (M is Ga, Sn, Y, Zr, La, Ce, or Nd) is used to form an oxide semiconductor film. In the target, the atomic ratio of metal elements is In:M:Zn=x 1 :y 1 :z 1 So, 、 x 1 / y 1 is 1 / 3 or more and 6 or less, and further 1 or more and 6 or less, and z 1 / y 1 is 1 It is preferable that z is 3 or more and 6 or less, and more preferably 1 or more and 6 or less. 1 / y 1 1 or more When the content is 6 or less, a CAAC-OS film is easily formed as the oxide semiconductor film.

[0299] Here, the CAAC-OS film will be described.

[0300] The CAAC-OS film is one of oxide semiconductor films having a plurality of crystal parts aligned along the c-axis.

[0301] Transmission Electron Microscope (TEM) A bright-field image and a combined diffraction pattern of the CAAC-OS film were obtained by using a microscope. By observing the TEM image, multiple crystalline regions can be confirmed. On the other hand, the high-resolution TEM image also shows clear boundaries between crystals, i.e., grain boundaries. Therefore, the CAAC-OS film is It can be said that the decrease in electron mobility caused by grain boundaries is unlikely to occur.

[0302] When a high-resolution TEM image of the cross section of the CAAC-OS film was observed from a direction approximately parallel to the sample surface, It can be seen that the metal atoms are arranged in layers in the crystal part. Each layer of metal atoms is The CAAC-OS film is formed on the surface (also called the surface on which the film is formed) or on the upper surface. The CAAC-OS film has a shape similar to that of the crystalline silicon film, and is aligned parallel to the surface on which the CAAC-OS film is formed or the upper surface.

[0303] On the other hand, a high-resolution TEM image of the plane of the CAAC-OS film was observed from a direction approximately perpendicular to the sample surface. It was confirmed that the metal atoms in the crystals were arranged in triangular or hexagonal shapes. However, there is no regularity in the arrangement of metal atoms between different crystal parts.

[0304] X-ray diffraction (XRD) was performed on the CAAC-OS film. For example, InGaZnO 4 CAAC-OS film with crystals In the out-of-plane analysis, a peak was observed at a diffraction angle (2θ) of approximately 31°. This peak may appear in InGaZnO 4 It is assigned to the (009) plane of the crystal of From this, it can be seen that the crystals of the CAAC-OS film have a c-axis orientation, and the c-axis is approximately aligned on the surface on which the film is formed or on the upper surface. You can see that it is oriented vertically.

[0305] In addition, InGaZnO 4 Out-of-plane synthesis of CAAC-OS films with crystallites In the analysis by , in addition to the peak at 2θ near 31°, a peak also appeared at 2θ near 36°. The peak at 2θ of around 36° may be due to the c-axis orientation in some parts of the CAAC-OS film. The CAAC-OS film contains crystals that do not have a 2θ of around 31°. It is preferred that the spectrum exhibits a peak and does not exhibit a peak at 2θ of around 36°.

[0306] The CAAC-OS film is an oxide semiconductor film with a low concentration of impurities. The impurities include hydrogen, carbon, and The elements are other than the main components of the oxide semiconductor film, such as silicon and transition metal elements. The elements that bond to oxygen more strongly than the metal elements that form the oxide semiconductor film, such as arsenic, are oxidized. By removing oxygen from the oxide semiconductor film, the atomic arrangement of the oxide semiconductor film is disrupted, reducing its crystallinity. In addition, heavy metals such as iron and nickel, argon, and carbon dioxide have an atomic radius of Since the molecular radius is large, when the cation is contained in the oxide semiconductor film, the The impurities in the oxide semiconductor film may cause the atomic arrangement to be disturbed, which may result in a decrease in crystallinity. Objects can act as carrier traps or carrier generation sources.

[0307] The CAAC-OS film is an oxide semiconductor film having a low density of defect states. Oxygen vacancies in the semiconductor film can become carrier traps or trap hydrogen, It can be a carrier source.

[0308] A material with a low impurity concentration and a low defect level density (few oxygen vacancies) is called a high-purity intrinsic or The term "substantially high-purity intrinsic" refers to a highly-purified intrinsic oxide semiconductor film. Since there are fewer carrier generation sources, the carrier density can be reduced. The transistor including the oxide semiconductor film has electrical characteristics in which the threshold voltage is negative ( Also called normally-on.) In addition, high purity intrinsic or substantially high purity The highly intrinsic oxide semiconductor film has few carrier traps. The transistors using the thin film have small fluctuations in electrical characteristics and are highly reliable. Note that it takes a certain time for charges trapped in the carrier traps in the oxide semiconductor film to be released. The time when the charge is released is long, and it may behave as if it is a fixed charge. A transistor using an oxide semiconductor film having a high density of defect states has unstable electrical characteristics. This may be the case.

[0309] In addition, the electrical characteristics of transistors using CAAC-OS films were improved by irradiation with visible light or ultraviolet light. The fluctuation is small.

[0310] Note that an OS transistor is a transistor having silicon in a channel formation region (a Si transistor). Since the band gap is larger than that of a conventional transistor, dielectric breakdown does not occur when a high voltage is applied. When battery cells are connected in series, a voltage of several hundred volts is generated. The circuit configuration of the battery control unit of the power storage device applied to such a battery cell includes the above-mentioned OS It is suitable to configure the circuit using a transistor.

[0311] FIG. 28 shows an example of a block diagram of a power storage device. A terminal pair BT01, a terminal pair BT02, a switching control circuit BT03, and a switching circuit BT0 4, a switching circuit BT05, a transformer control circuit BT06, and a transformer circuit BT07, and a battery unit BT08 including a plurality of connected battery cells BT09.

[0312] In addition, in the power storage device BT00 of FIG. 28, the terminal pair BT01 and the terminal pair BT02 are A switching control circuit BT03, a switching circuit BT04, a switching circuit BT05, and a transformer control The part consisting of the circuit BT06 and the transformer circuit BT07 is called the battery control unit. It is possible.

[0313] The switching control circuit BT03 controls the operation of the switching circuits BT04 and BT05. Specifically, the switching control circuit BT03 controls the measured voltage of each battery cell BT09. Based on the voltage, the battery cells to be discharged (discharging battery cell group) and the battery cells to be charged (charging battery cell group) are selected. Determine the number of cells (pond cell group).

[0314] Furthermore, the switching control circuit BT03 controls the determined discharge battery cell group and charge battery cell group. Based on the group, the control signal S1 and the control signal S2 are output. This control signal S1 connects the terminal pair BT01 and the discharge battery cell group. The control signal S2 is a signal that controls the switching circuit BT04 so as to connect the This control signal S2 is output to the switching circuit BT05. This is a signal that controls the switching circuit BT05 to connect the group.

[0315] The switching control circuit BT03 includes switching circuits BT04, BT05, and Considering the configuration of the transformer circuit BT07, between the terminal pair BT01 and the discharge battery cell group, or between the terminal Control is performed so that terminals of the same polarity are connected between the child pair BT02 and the charging battery cell group. It generates a signal S1 and a control signal S2.

[0316] The operation of the switching control circuit BT03 will now be described in detail.

[0317] First, the switching control circuit BT03 measures the voltage of each of the multiple battery cells BT09. The switching control circuit BT03 then selects, for example, the battery cell BT09 having a voltage equal to or higher than a predetermined threshold. High voltage battery cells (high voltage cells), battery cells BT09 with voltages below a certain threshold are classified as low voltage It is determined to be a battery cell (low voltage cell).

[0318] There are various methods for determining whether a cell is a high-voltage cell or a low-voltage cell. For example, the switching control circuit BT03 selects the most highly charged battery cell BT09 from among multiple battery cells. The voltage of each battery cell BT0 is set based on the voltage of the battery cell BT09 with the highest or lowest voltage. 9 may be determined to be a high-voltage cell or a low-voltage cell. In this case, the switching control circuit BT03 determines whether the voltage of each battery cell BT09 is equal to or greater than a predetermined ratio of the reference voltage. By doing so, it is possible to determine whether each battery cell BT09 is a high-voltage cell or a low-voltage cell. Then, the switching control circuit BT03 switches between the discharging battery cell group and the charging battery cell group based on the result of this judgment. The pond cell group is determined.

[0319] In addition, among the multiple battery cells BT09, high voltage cells and low voltage cells are mixed in various states. For example, the switching control circuit BT03 can select the voltage between high-voltage cells and low-voltage cells. The part with the largest number of high-voltage cells connected in series is the discharge battery cell group. The switching control circuit BT03 charges the part with the most low-voltage cells connected in series. The switching control circuit BT03 detects battery cells that are close to being overcharged or overdischarged. Even if the battery cell BT09 is preferentially selected as the discharge battery cell group or the charge battery cell group, good.

[0320] Here, an example of the operation of the switching control circuit BT03 in this embodiment will be described with reference to FIG. FIG. 29 is a diagram for explaining an example of the operation of the switching control circuit BT03. For convenience of explanation, FIG. 29 shows an example in which four battery cells BT09 are connected in series. Reveal.

[0321] First, in the example of FIG. 29(A), if the voltages of the battery cells a to d are voltages Va to Vd, then In other words, the relationship of Va=Vb=Vc>Vd is satisfied when three consecutive high voltages The high-voltage cells a to c and one low-voltage cell d are connected in series. The control circuit BT03 determines three consecutive high voltage cells a to c as a discharge battery cell group. In addition, the switching control circuit BT03 determines the low voltage cell d as the charging battery cell group. .

[0322] Next, the example of FIG. 29(B) shows a case where the relationship is Vc>Va=Vb>>Vd. That is, between two consecutive low voltage cells a and b, one high voltage cell c, and one over-discharge The nearby low-voltage cell d is connected in series. In this case, the switching control circuit BT03 The high-voltage cell c is determined as the discharge battery cell group. Since the low-voltage cell d is close to being over-discharged, it is not the two consecutive low-voltage cells a and b that are The charging cell d is preferentially determined as the charging battery cell group.

[0323] Finally, the example in FIG. 29(C) shows a case where the relationship Va>Vb=Vc=Vd holds. That is, one high-voltage cell a and three consecutive low-voltage cells b to d are connected in series. In this case, the switching control circuit BT03 determines the high voltage cell a as the discharge battery cell group. The switching control circuit BT03 also controls the charging of three consecutive low-voltage cells b to d. Determined as a battery cell group.

[0324] The switching control circuit BT03 determines the results as shown in the examples of FIGS. Based on this, information indicating the discharge battery cell group to which the switching circuit BT04 is connected is set. The control signal S1 and information indicating the charging battery cell group to which the switching circuit BT05 is connected are set. The control signal S2 thus determined is sent to the switching circuit BT04 and the switching circuit BT05. Each is output.

[0325] The above is a detailed explanation of the operation of the switching control circuit BT03.

[0326] The switching circuit BT04 is in response to a control signal S1 output from the switching control circuit BT03. The connection destination of the terminal pair BT01 is the discharge battery cell determined by the switching control circuit BT03. Set the rule group.

[0327] The terminal pair BT01 is composed of a pair of terminals A1 and A2. Either one of the terminals A1 and A2 is connected to the most upstream (high voltage) of the discharge battery cell group. The other terminal is connected to the positive terminal of the battery cell BT09 located at the lowest position in the discharge battery cell group. By connecting it to the negative terminal of the battery cell BT09 located downstream (low potential side), The switch circuit BT04 is set to the control signal S1. The obtained information can be used to identify the position of the discharging battery cell group.

[0328] The switching circuit BT05 is in response to a control signal S2 output from the switching control circuit BT03. The connection destination of the terminal pair BT02 is determined by the switching control circuit BT03. Set the rule group.

[0329] The terminal pair BT02 is composed of the pair of terminals B1 and B2. Either of these terminals B1 and B2 is connected to the most upstream (high voltage) of the charging battery cell group. The other terminal is connected to the positive terminal of the battery cell BT09 located at the By connecting it to the negative terminal of the battery cell BT09 located downstream (low potential side), The switch circuit BT05 is set to the control signal S2. The position of the rechargeable battery cell group can be recognized using the obtained information.

[0330] FIG. 30 and FIG. 3 are circuit diagrams showing configuration examples of the switching circuits BT04 and BT05. Shown in 1.

[0331] In FIG. 30, the switching circuit BT04 includes a plurality of transistors BT10 and a bus BT11 and The bus BT11 is connected to the terminal A1. 2 is connected to the terminal A2. One of them is alternately connected to the buses BT11 and BT12. The other of the sources or drains of the multiple transistors BT10 is connected to two adjacent It is connected between battery cells BT09.

[0332] Among the multiple transistors BT10, the transistor BT10 located at the most upstream The other of the source and drain is the positive electrode of the battery cell BT09 located at the most upstream of the battery unit BT08. The transistor BT10 located at the most downstream side is connected to the terminal. The other of the source and drain of the transistor BT10 is located at the most downstream of the battery unit BT08. It is connected to the negative terminal of battery cell BT09.

[0333] The switching circuit BT04 is configured to control a control signal S1 to be applied to the gates of a plurality of transistors BT10. In response, one of the plurality of transistors BT10 connected to the bus BT11 and the bus B and one of the plurality of transistors BT10 connected to T12 are respectively brought into a conductive state. This connects the discharge battery cell group to the terminal pair BT01. The positive terminal of the battery cell BT09, which is located most upstream in the battery group, is connected to the terminal A1 or A 2. Also, the battery cell located most downstream in the discharge battery cell group is connected to either The negative terminal of the BT09 terminal is the other of the terminals A1 or A2 of the terminal pair, i.e., the positive terminal The terminal that is not connected to the

[0334] It is preferable to use an OS transistor for the transistor BT10. Since the off-state current of the capacitor is small, the amount of charge leaking from the battery cells that do not belong to the discharge battery cell group is reduced. This suppresses the decrease in capacitance over time. Dielectric breakdown is unlikely to occur when voltage is applied. Therefore, the output voltage of the discharge battery cell group is large. However, the transistor BT10 that is in a non-conducting state is connected to the battery cell BT09 and the terminal pair It is possible to insulate the BT01.

[0335] In addition, in FIG. 30, the switching circuit BT05 includes a plurality of transistors BT13 and a current control The bus BT15 and the bus BT16 are connected to the switch BT14 and the bus BT16. 16 is disposed between the plurality of transistors BT13 and the current control switch BT14. The source or drain of each of the transistors BT13 is alternately connected to the bus The sources of the transistors BT13 and BT16 are connected to the The other drain is connected between two adjacent battery cells BT09.

[0336] Among the multiple transistors BT13, the transistor BT13 located at the most upstream The other of the source and drain is the positive electrode of the battery cell BT09 located at the most upstream of the battery unit BT08. The transistor BT13 located at the most downstream side is connected to the terminal. The other of the source and drain of the transistor BT13 is located at the most downstream of the battery unit BT08. It is connected to the negative terminal of battery cell BT09.

[0337] The transistor BT13 is an OS transistor, similar to the transistor BT10. Since the off-state current of the OS transistor is small, it is preferable that the OS transistor does not belong to the rechargeable battery cell group. This reduces the amount of charge leaking from the battery cell and suppresses the decrease in capacity over time. In addition, OS transistors are less susceptible to dielectric breakdown when high voltages are applied. A transistor BT that is in a non-conducting state even if the voltage for charging the battery cell group is large. 13 can be electrically insulated from the battery cell BT09 to which the terminal pair BT02 is connected.

[0338] The current control switch BT14 includes a switch pair BT17 and a switch pair BT18. Switch pair BT17 and switch pair BT18 each consist of two switches connected in parallel. One end of each of the two switches included in the switch pair BT17 is connected to a terminal B1. The other end of one switch included in the switch pair BT17 is connected to the bus B The other end of the other switch in switch pair BT17 is connected to bus BT16. The two switches in the switch pair BT18 are connected to The other end of one of the switches included in the switch pair BT18 is connected to the child B2. The other end of the other switch is connected to bus BT15, and the other end of the other switch is connected to bus BT16.

[0339] The switches in the switch pairs BT17 and BT18 are transistors BT10 Similarly to the transistor BT13, an OS transistor is preferably used.

[0340] The switching circuit BT05 switches the transistor BT13 and the current control By controlling the combination of on / off states of the switch BT14, and terminal pair BT02.

[0341] As an example, the switching circuit BT05 is configured to switch the charging battery cell group and the terminal pair BT0 as follows: Connect 2.

[0342] The switching circuit BT05 is configured to control a control signal S2 to be applied to the gates of a plurality of transistors BT13. In response, the positive terminal of the battery cell BT09 located most upstream in the charging battery cell group is connected. The switching circuit BT05 turns on the transistor BT13 that is connected to the In response to a control signal S2 applied to the gate of the transistor BT13, Transistor BT13 connected to the negative terminal of the most downstream battery cell BT09 is put into a conductive state.

[0343] The polarity of the voltage applied to terminal pair BT02 is the same as that of the discharge battery cell group connected to terminal pair BT01. The method of charging the rechargeable battery cell group may vary depending on the configuration of the transformer circuit BT07. To allow current to flow in the same direction, terminals of the same polarity must be connected between terminal pair BT02 and the charging battery cells. Therefore, the current control switch BT14 is controlled by the control signal S2 as follows: Depending on the polarity of the voltage applied to the terminal pair BT02, the switch pair BT17 and the switch pair BT It is controlled to switch between each of the 18 connection destinations.

[0344] As an example, a voltage is applied to the terminal pair BT02 such that the terminal B1 is positive and the terminal B2 is negative. In this case, the most downstream battery cell BT09 of the battery unit BT08 When the battery cell group is a charging battery cell group, the switch pair BT17 is turned on / off by the control signal S2. That is, the switch pair BT17 is controlled to be connected to the positive terminal of the switch pair BT09. The switch connected to the bus BT16 is turned on, and the bus BT1 of the switch pair BT17 is turned on. On the other hand, the switch pair BT18 is in the OFF state when the control signal S2 In other words, the switch is controlled so as to be connected to the negative terminal of the battery cell BT09. The switch connected to the bus BT15 of the switch pair BT18 is turned on, The switch connected to the bus BT16 of the terminal pair T18 is turned off. Between the BT02 and the charging battery cell group, terminals with the same polarity are connected. The direction of the current flowing from the BT02 pair is controlled so that it charges the battery cell group. will be done.

[0345] In addition, the current control switch BT14 is not the switching circuit BT05 but the switching circuit BT In this case, the operation of the current control switch BT14, the control signal S1 By controlling the polarity of the voltage applied to the terminal pair BT01 according to The current control switch BT14 controls the polarity of the voltage applied to the terminal pair B It controls the direction of the current flowing from T02 to the charging battery cell group.

[0346] FIG. 31 shows a configuration example of the switching circuit BT04 and the switching circuit BT05, which is different from that shown in FIG. FIG.

[0347] In FIG. 31, the switching circuit BT04 includes a plurality of transistor pairs BT21 and a bus BT24. The bus BT24 is connected to the terminal A1. BT25 is connected to the terminal A2. Each of them is branched by the transistor BT22 and the transistor BT23. Either the source or the drain of the BT22 is connected to the bus BT24. Either the source or the drain of the transistor BT23 is connected to the bus BT25. The other ends of the multiple transistor pairs are connected between two adjacent battery cells BT09. Among the multiple transistor pairs BT21, the transistor located at the most upstream The other end of the pair BT21 is connected to the positive terminal of the battery cell BT09 located at the most upstream of the battery unit BT08. In addition, among the multiple transistor pairs BT21, the transistor located at the most downstream The other end of the resistor pair BT21 is connected to the negative electrode of the battery cell BT09 located at the most downstream of the battery unit BT08. is connected to the terminal.

[0348] The switching circuit BT04 switches between the transistor BT22 and the transistor BT31 in response to the control signal S1. By switching the conductive / non-conductive state of BT23, the connection of the transistor pair BT21 is The connection destination is switched to either terminal A1 or terminal A2. If T22 is conductive, transistor BT23 is non-conductive and is connected to terminal On the other hand, if the transistor BT23 is in a conductive state, the transistor BT22 The transistors BT22 and BT23 are non-conductive and connected to the terminal A2. Which of the transistors BT23 is turned on is determined by a control signal S1.

[0349] Two transistor pairs BT21 are used to connect the terminal pair BT01 to the discharge battery cell group. In detail, the connection destination of the two transistor pairs BT21 is determined based on the control signal S1. are determined, the discharge battery cell group and the terminal pair BT01 are connected. One of the transistor pairs BT21 is connected to the terminal A1, and the other is connected to the terminal A2 by the control signal S1.

[0350] The switching circuit BT05 includes a plurality of transistor pairs BT31, a bus BT34, and a bus BT The bus BT34 is connected to the terminal B1. The bus BT35 includes: One end of each of the transistor pairs BT31 is connected to the terminal B2. The transistor BT32 branches off the transistor BT33. One end of the branched signal is connected to a bus BT34. One of the branched ends is connected to a bus BT35. The other ends of the BT09 are connected between two adjacent battery cells BT09. The other end of the transistor pair BT31 located at the most upstream of the transistor pairs BT31 is It is connected to the positive terminal of the battery cell BT09 located at the most upstream of the battery unit BT08. Among the multiple transistor pairs BT31, other than the transistor pair BT31 located at the most downstream The end of the battery unit BT08 is connected to the negative terminal of the battery cell BT09 located at the most downstream side of the battery unit BT08. .

[0351] The switching circuit BT05 switches between the transistor BT32 and the transistor BT33 in response to the control signal S2. By switching the conductive / non-conductive state of BT33, the connection of the transistor pair BT31 is The connection destination is switched to either terminal B1 or terminal B2. If T32 is conductive, transistor BT33 is non-conductive and is connected to terminal Conversely, if the transistor BT33 is in a conductive state, the transistor BT32 The transistors BT32 and BT33 are non-conductive and connected to the terminal B2. Which of the transistors BT33 is turned on is determined by a control signal S2.

[0352] Two transistor pairs, BT31, are used to connect the terminal pair BT02 to the charging battery cells. In detail, the connection destination of the two transistor pairs BT31 is determined based on the control signal S2. By determining the terminal pair BT02, the rechargeable battery cell group is connected to the terminal pair BT02. One of the transistor pairs BT31 is connected to terminal B1, and the other is connected to terminal B2 by the control signal S2.

[0353] The two transistor pairs BT31 are connected to the terminal pair BT02. Specifically, terminal B1 is the positive terminal and terminal B2 is the negative terminal. When such a voltage is applied to the terminal pair BT02, the upstream transistor pair BT31 Therefore, the transistor BT32 is turned on and the transistor BT33 is turned off. On the other hand, the downstream transistor pair BT31 is controlled by the control signal S2. The transistor BT33 is controlled to be in a conductive state and the transistor BT32 is controlled to be in a non-conductive state. It is controlled by the signal S2. Also, the voltage at terminal B1 becomes negative and the voltage at terminal B2 becomes positive. When a voltage is applied to the terminal pair BT02, the upstream transistor pair BT31 The control circuit 14 controls the transistor BT33 to be conductive and the transistor BT32 to be non-conductive. On the other hand, the downstream transistor pair BT31 is controlled by the transistor A control signal S2 is supplied to the transistor BT32 so that the transistor BT32 is in a conductive state and the transistor BT33 is in a non-conductive state. In this way, the same The terminals with polarity are connected together. The direction of the current flowing from the terminal pair BT02 is the charging The battery cell group is controlled in a charging direction.

[0354] The transformer control circuit BT06 controls the operation of the transformer circuit BT07. , the number of battery cells BT09 included in the discharge battery cell group and the number of battery cells BT09 included in the charge battery cell group Based on the number of cells BT09, a transformer signal S3 is generated to control the operation of the transformer circuit BT07. This is then output to the transformer circuit BT07.

[0355] The number of battery cells BT09 included in the discharge battery cell group is equal to the number of battery cells BT09 included in the charge battery cell group. If the number of battery cells is greater than the number of BT09, an excessively large charging voltage will be applied to the battery cell group. Therefore, the transformer control circuit BT06 is The transformer circuit BT07 is designed to step down the discharge voltage (Vdis) to a level that allows the cells to be charged. It outputs a control transformer signal S3.

[0356] In addition, the number of battery cells BT09 included in the discharge battery cell group is If the number of battery cells is less than or equal to BT09, the charge required to charge the battery cell group is Therefore, the voltage transformer control circuit BT06 detects excess voltage in the charging battery cell group. The transformer circuit BT is designed to boost the discharge voltage (Vdis) to a level where an excessive charge voltage is not applied. 07.

[0357] The voltage value considered to be the excessive charging voltage is the voltage of the battery cell BT09 used in the battery module BT08. This can be determined in consideration of product specifications, etc. Also, the voltage step-up and step-down can be performed by the transformer circuit BT07. The voltage thus obtained is applied to the terminal pair BT02 as the charging voltage (Vcha).

[0358] An example of the operation of the transformer control circuit BT06 in this embodiment will now be described with reference to FIGS. 32(A) to (C) show the discharge described in FIG. An example of the operation of the voltage transformer control circuit BT06 corresponding to the battery cell group and the charge battery cell group will be described. 32(A) to (C) are conceptual diagrams illustrating the battery control unit BT41. As described above, the battery control unit BT41 has a terminal pair BT01 and a terminal pair B T02, a switching control circuit BT03, a switching circuit BT04, and a switching circuit BT0 5, a transformer control circuit BT06, and a transformer circuit BT07.

[0359] In the example shown in FIG. 32(A), three consecutive high voltages are Cells a to c and one low-voltage cell d are connected in series. In this case, as shown in FIG. As explained above with reference to FIG. 1, the switching control circuit BT03 controls the high voltage cells a to c to a discharge voltage The low-voltage cell d is determined as the battery cell group, and the low-voltage cell d is determined as the charging battery cell group. The control circuit BT06 is based on the number of battery cells BT09 included in the discharge battery cell group. , the discharge voltage (Vdi Calculate the conversion ratio N from s to the charging voltage (Vcha).

[0360] The number of battery cells BT09 included in the discharge battery cell group is equal to the number of battery cells BT09 included in the charge battery cell group. When the number of the battery cells is larger than the number of the BT09, the discharge voltage is directly applied to the terminal pair BT02 without being transformed. When this voltage is applied, a current is applied to the battery cell BT09 in the charging battery cell group via the terminal pair BT02. There is a possibility that an excessive voltage is applied. Therefore, in the case shown in FIG. The charge voltage (Vcha) applied to the terminal pair BT02 is set higher than the discharge voltage (Vdis). In order to charge the battery cell group, the charging voltage must be stepped down. The total voltage of the battery cells BT09 in the battery cell group must be greater than the total voltage of the battery cells BT09. The voltage control circuit BT06 is based on the number of battery cells BT09 included in the discharge battery cell group. The conversion ratio N is set to be larger than the ratio of the number of battery cells BT09 included in the charging battery cell group at the time of Set it up.

[0361] The transformer control circuit BT06 determines the number of battery cells BT09 included in the discharge battery cell group as a standard. The conversion ratio N is set to 1 for the ratio of the number of battery cells BT09 included in the charging battery cell group when At this time, the charging voltage is preferably set to be about 10% higher than the voltage of the charging battery cell group. However, the charging voltage is actually equal to the voltage of the charging battery cell group. The control circuit BT06 controls the voltage of the battery cells to be equal to the charging voltage according to the conversion ratio N. This current flows to charge the battery cell group. The set value will be used.

[0362] In the example shown in FIG. 32(A), the number of battery cells BT09 included in the discharge battery cell group is 3. Since the number of battery cells included in the charging battery cell group is one, the voltage transformation control circuit The BT06 calculates a conversion ratio N that is slightly larger than 1 / 3. BT06 converts the discharge voltage into a charge voltage by converting the discharge voltage into a charge voltage according to the conversion ratio N. The transformer circuit BT07 outputs the transform signal S3 to the transformer circuit BT07. The charging voltage applied to the terminal pair BT02 is then applied to the terminal pair BT02. The battery cell BT09 included in the charging battery cell group is charged by the charging voltage.

[0363] In the examples shown in FIG. 32(B) and FIG. 32(C), the conversion ratio N In the examples shown in FIG. 32(B) and FIG. 32(C), The number of battery cells BT09 included in the charging battery cell group is less than or equal to the number of battery cells BT09 included in the charging battery cell group. Therefore, the conversion ratio N is 1 or more. The inverter outputs a transformer signal S3 which boosts the load voltage and converts it into a charging voltage.

[0364] The transformer circuit BT07 adjusts the discharge voltage applied to the terminal pair BT01 based on the transformer signal S3. The transformer circuit BT07 converts the converted charging voltage into a terminal pair BT0 2. Here, the transformer circuit BT07 connects the terminal pair BT01 and the terminal pair BT02. This allows the transformer circuit BT07 to be electrically isolated from the lowest discharge battery cell group. The absolute voltage of the negative terminal of the battery cell BT09 located downstream and the most downstream of the charging battery cells This prevents a short circuit caused by a difference in absolute voltage between the negative terminal of the battery cell BT09 located at the Then, as described above, the transformer circuit BT07 converts the total voltage of the discharge battery cell group into the total voltage of the discharge battery cell group based on the transformer signal S3. The discharge voltage, which is the measured voltage, is converted into a charge voltage.

[0365] The transformer circuit BT07 is, for example, an insulated DC (Direct Current)-DC In this case, the transformer control circuit BT06 is an isolated DC- The signal that controls the on / off ratio (duty ratio) of the DC converter is the transformation signal S3. By outputting this, the charging voltage converted by the transformer circuit BT07 is controlled.

[0366] In addition, there are three types of isolated DC-DC converters: flyback type, forward type, RCC ( Ring Choke Converter, push-pull, half-blade There are various types of inverters, such as full-bridge inverter and ridge inverter, depending on the desired output voltage. The appropriate method is selected based on the result.

[0367] The configuration of the transformer circuit BT07 using an isolated DC-DC converter is shown in Fig. 33. The C-DC converter BT51 has a switch unit BT52 and a transformer unit BT53. The switch BT52 is a switch that switches the operation of the isolated DC-DC converter on and off. For example, MOSFET (Metal-Oxide-Semiconductor tor Field-Effect Transistor) and bipolar transistors The switch unit BT52 is realized by using a transformer or the like. Based on the transformer signal S3 that controls the on / off ratio, the isolated DC-DC converter The switch BT51 is periodically switched between the on and off states. Various configurations are possible depending on the type of isolated DC-DC converter used. BT53 converts the discharge voltage applied from the terminal pair BT01 into a charge voltage. The transformer section BT53 operates in conjunction with the on / off state of the switch section BT52. The discharge voltage is converted to a charge voltage according to the on / off ratio. This charge voltage is In the switching period of 2, the longer the on-state time, the larger the capacitance becomes. The voltage is increased as the time during which the switch unit BT52 is in the ON state becomes shorter in the switching period. When using an isolated DC-DC converter, the transformer section BT53 Internally, terminal pair BT01 and terminal pair BT02 can be insulated from each other.

[0368] The flow of processing by the power storage device BT00 in this embodiment will be described with reference to FIG. 10 is a flowchart showing the flow of processing performed by the power storage device BT00.

[0369] First, the power storage device BT00 acquires the voltage measured for each of the plurality of battery cells BT09 (step Step S001). The power storage device BT00 aligns the voltages of the multiple battery cells BT09. It is determined whether or not a start condition for the operation is satisfied (step S002). For example, the difference between the maximum and minimum voltages measured for each of the battery cells BT09 is a predetermined If the start condition is not met (step S0 02:NO), the voltage of each battery cell BT09 is balanced, so the storage On the other hand, if the start condition is satisfied (step S 002: YES), the power storage device BT00 executes a process to make the voltages of the battery cells BT09 uniform. In this process, the power storage device BT00 performs the following on the basis of the measured voltage of each cell. It is determined whether the battery cell BT09 is a high-voltage cell or a low-voltage cell (step S003). The power storage device BT00 determines the discharge battery cell group and the charge battery cell group based on the determination result. (Step S004). Furthermore, the power storage device BT00 sets the determined discharge battery cell group as A control signal S1 that sets the connection destination of the terminal pair BT01, and a terminal A control signal S2 is generated to set the connection destination of the pair BT02 (step S005). The BT00 outputs the generated control signals S1 and S2 to the switching circuit BT04 and the switching circuit BT05. Then, the terminal pairs are output to the switching circuit BT05 by the switching circuit BT04. BT01 is connected to the discharge battery cell group, and the terminal pair BT02 is connected to the terminal pair BT03 by the switching circuit BT05. and the discharge battery cell group are connected (step S006). The number of battery cells BT09 included in the rechargeable battery cell group and the number of battery cells Based on the number of BT09, a transformed signal S3 is generated (step S007). The power storage device BT00 adjusts the discharge voltage applied to the terminal pair BT01 based on the transformation signal S3. The charge voltage is converted to a charging voltage and applied to the terminal pair BT02 (step S008). The charge of the battery cells is transferred to the charging battery cells.

[0370] In addition, in the flowchart of FIG. 34, multiple steps are listed in order, but each step The order in which the steps are executed is not limited to the order listed.

[0371] As described above, according to this embodiment, when transferring charges from the discharge battery cell group to the charge battery cell group, Like the capacitor method, the charge from the discharged battery cells is first stored and then transferred to the charging battery cells. This eliminates the need for a structure that emits electrons into a group. This increases the charge transfer efficiency per unit time. In addition, the switching circuits BT04 and BT05 can improve the Among the discharge battery cell group and the charge battery cell group, the battery cells connected to the transformer circuit are individually can be switched to.

[0372] Furthermore, the number of battery cells BT09 included in the discharge battery cell group is calculated by the transformer circuit BT07. Based on the number of battery cells BT09 included in the charging battery cell group, the number of terminals BT01 is printed on the terminal pair BT01. The applied discharge voltage is converted to a charge voltage and applied to the terminal pair BT02. Regardless of the selection of the battery cell BT09 on the power supply side and the charging side, the charge transfer can be performed without any problem. It can be realized.

[0373] Furthermore, by using OS transistors for the transistors BT10 and BT13, As a result, leakage occurs from the battery cell BT09 that does not belong to the charging battery cell group or the discharging battery cell group. This reduces the charge of the battery cell BT09, which does not contribute to charging or discharging. In addition, the OS transistor has a This causes the temperature of the battery cell BT09 to rise, However, normal operation, such as switching between conductive and non-conductive states according to the control signals S1 and S2, is also possible. It is possible to do so.

[0374] This embodiment mode can be freely combined with other embodiment modes. [Explanation of symbols]

[0375] 100 Electronic equipment 101 Electronic equipment 102 Display section 103 FPC 103a FPC 104 IC 105 Case 106 Circuit Board 107 Circuit Board 108 Battery 109 Display section 110 Display Panel 111 Display area 112 Display area 113 Display area 114 Display area 115 Display area 116 fingers 117 Devices 118 Devices 119 Display section 120 Substrate 121 Image sensor 122 Electronic equipment 125 Ring section 126 Case 131 sides 132 sides 133 sides 135 Break 138 copies 141 Drive circuit 142 Drive circuit 143 Drive circuit 145 Wiring 146 Wiring 151 Display area 152 Display area 153 Display area 161 Icons 162 Text information 164 Text information 167 Image information 300 Electronic equipment 400 Electronic equipment 1201 Positive electrode current collector 1202 Cathode active material layer 1203 Positive electrode 1204 Negative electrode current collector 1205 Negative electrode active material layer 1206 negative electrode 1207 Separator 1208 Electrolyte 1209 Exterior body

Claims

1. A ring portion and A display portion fixed to the ring portion, the display unit has a top surface and a first side surface in contact with at least one side of the top surface; The first side surface has a curved surface, a first display area is provided on the top surface; a second display area is provided on the first side surface; The electronic device, wherein the first display area and the second display area are provided contiguously.

2. The electronic device according to claim 1 , wherein the first side surface includes a part of a side surface of a circular cylinder or an elliptical cylinder.

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