Manufacturing method of electronic device

Abstract

To prevent the types of packages from increasing according to size variation of sensors and circuit boards.SOLUTION: A manufacturing method of an electronic device is provided. A first electronic device comprises a first sensor, a second sensor, a first circuit board, and a first package. A second electronic device comprises a third sensor, a fourth sensor, a second circuit board, and a second package. The first package and the second package have the same size in a plan view. The second sensor is smaller in size than the fourth sensor in the plan view while the first circuit board and the second circuit board have the same size in the plan view. The manufacturing method includes mounting the first circuit board and then the second sensor on the first package, and mounting the fourth sensor and then the second circuit board on the second package.SELECTED DRAWING: Figure 23

Description

Technical Field

[0001] The present invention relates to a method for manufacturing an electronic device.

Background Art

[0002] Patent Document 1 discloses, as an example of an electronic device, a composite sensor in which an angular velocity sensor, an acceleration sensor, and a circuit board are housed in one package. Angular velocity and acceleration are one of the physical quantities.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Even for sensors that detect the same type of physical quantity, the size of the sensor may vary depending on the required detection accuracy and the like. The types of packages tend to increase according to the size variations of the sensors and the circuit boards.

Means for Solving the Problems

[0005] A method for manufacturing electronic devices is a method for manufacturing a plurality of electronic devices including a first electronic device and a second electronic device. The first electronic device includes a first sensor for detecting a first physical quantity, a second sensor for detecting a second physical quantity different from the first physical quantity, a first circuit board electrically connected to the first sensor and the second sensor, and a first package for housing the first sensor, the second sensor, and the first circuit board. The second electronic device includes a third sensor for detecting the first physical quantity, a fourth sensor for detecting the second physical quantity, a second circuit board electrically connected to the third sensor and the fourth sensor, and a second package for housing the third sensor, the fourth sensor, and the second circuit board. In a plan view, the size of the first package is the same as the size of the second package, in a plan view, the size of the first sensor is the same as the size of the third sensor, in a plan view, the size of the second sensor is smaller than the size of the fourth sensor, in a plan view, the size of the first circuit board is the same as the size of the second circuit board, mounting the second sensor on the first circuit board after mounting the first circuit board on the first package, and mounting the second circuit board on the fourth sensor after mounting the fourth sensor on the second package.

Brief Description of the Drawings

[0006]

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Embodiments for Carrying Out the Invention

[0007] As shown in FIG. 1, the first electronic device 1 has a first case 2 and a lid 3. The lid 3 is placed on the first case 2. The first case 2 is an example of the first package. As shown in FIG. 2, the second electronic device 10 has a second case 4 and a lid 3. The lid 3 is placed on the second case 4. The second case 4 is an example of the second package. The lid 3 of the first electronic device 1 and the lid 3 of the second electronic device 10 are the same component. In FIGS. 1 and 2, the X-axis, Y-axis, and Z-axis are appended. The X-axis, Y-axis, and Z-axis are coordinate axes that are perpendicular to each other. For the figures shown after FIGS. 1 and 2, the X-axis, Y-axis, and Z-axis are appended as necessary. In this case, the X-axis, Y-axis, and Z-axis in each figure correspond to the X-axis, Y-axis, and Z-axis in FIGS. 1 and 2. FIG. 1 shows a state in which the first electronic device 1 is placed on the XY plane defined by the X-axis and the Y-axis. FIG. 2 shows a state in which the second electronic device 10 is placed on the XY plane defined by the X-axis and the Y-axis.

[0008] In the following, when the X-axis, Y-axis, and Z-axis are shown in the figure or description indicating the components and units of the first electronic device 1, it means the X-axis, Y-axis, and Z-axis in the state where the components and units are incorporated into the first electronic device 1. When the X-axis, Y-axis, and Z-axis are shown in the figure or description indicating the components and units of the second electronic device 10, it means the X-axis, Y-axis, and Z-axis in the state where the components and units are incorporated into the second electronic device 10. Arrows are attached to the X-axis, Y-axis, and Z-axis respectively. In each of the X-axis, Y-axis, and Z-axis, the direction of the arrow indicates the + (positive) direction, and the direction opposite to the direction of the arrow indicates the - (negative) direction. The Z-axis is an axis perpendicular to the XY plane. The figure when looking at each of the first electronic device 1 and the second electronic device 10 in the -Z direction is a plan view.

[0009] As shown in FIG. 3, the first electronic device 1 further includes a first electronic component 5, a second electronic component 6, and a third electronic component 7. The first electronic component 5 is an example of a first sensor. The second electronic component 6 is an example of a second sensor. The third electronic component 7 is an example of a first circuit board. The first electronic component 5, the second electronic component 6, and the third electronic component 7 are housed inside the first case 2. A concave cavity 8 is formed in the first case 2. The first electronic component 5, the second electronic component 6, and the third electronic component 7 are housed in the cavity 8 of the first case 2.

[0010] The first case 2 can be formed, for example, by firing a ceramic substrate. The cavity 8 can be formed by laminating a plurality of ceramic substrates. The lid 3 can employ, for example, various metal plates. With the first electronic component 5, the second electronic component 6, and the third electronic component 7 housed in the cavity 8 of the first case 2, the first case 2 is closed by the lid 3. The first case 2 and the lid 3 are joined to each other, for example, by seam welding.

[0011] The first electronic component 5 and the second electronic component 6 are each a sensor that detects the movement of an object on which the first electronic device 1 is installed. The first electronic component 5 detects the angular velocity of the object. The second electronic component 6 detects the acceleration of the object. Angular velocity is an example of a first physical quantity. Acceleration is an example of a second physical quantity. The third electronic component 7 is a circuit board that controls the first electronic component 5 and the second electronic component 6. The third electronic component 7 processes the detection signals output from the first electronic component 5 and the second electronic component 6. The third electronic component 7 controls the signals for driving the first electronic component 5 and the second electronic component 6.

[0012] The first electronic component 5 detects the angular velocity of an object around the Z-axis. In this embodiment, the first electronic component 5 is a gyro sensor. The second electronic component 6 includes three acceleration sensors. The three acceleration sensors are an acceleration sensor that detects acceleration along the Y-axis, an acceleration sensor that detects acceleration along the X-axis, and an acceleration sensor that detects acceleration along the Z-axis. As the acceleration sensor, for example, a capacitance-type acceleration sensor can be adopted. Further, as the acceleration sensor, for example, a crystal acceleration sensor can also be adopted.

[0013] All of the three acceleration sensors may be capacitance-type acceleration sensors. All of the three acceleration sensors may be crystal acceleration sensors. The three acceleration sensors may be a mixture of capacitance-type acceleration sensors and crystal acceleration sensors. In this embodiment, all of the three acceleration sensors are capacitance-type acceleration sensors. The number of acceleration sensors included in the second electronic component 6 is not limited to three. The number of acceleration sensors included in the second electronic component 6 may be two. The number of acceleration sensors included in the second electronic component 6 may be one.

[0014] The third electronic component 7 is composed of, for example, an IC (Integrated Circuit). The third electronic component 7 processes various signals output from the first electronic component 5 and the second electronic component 6. The third electronic component 7 includes various circuits for processing various signals output from the first electronic component 5 and the second electronic component 6. Various circuit elements that constitute various circuits are formed in the third electronic component 7. The second electronic component 6 is located in the +Z direction of the third electronic component 7. The second electronic component 6 is mounted in the +Z direction of the third electronic component 7.

[0015] As shown in FIG. 4, the first case 2 has a bottom surface 11, a first stepped portion 12, and a second stepped portion 13 inside the cavity 8. The bottom surface 11 constitutes the bottom of the cavity 8. The first stepped portion 12 is located in the +Z direction of the bottom surface 11. The first stepped portion 12 surrounds the bottom surface 11 along the inner circumference of the cavity 8 in plan view. The first stepped portion 12 is formed in a frame shape surrounding the bottom surface 11 of the cavity 8 in plan view. The second stepped portion 13 is located in the +Z direction of the first stepped portion 12.

[0016] As shown in FIG. 5, the second stepped portion 13 is provided at least at two locations facing each other with the bottom surface 11 interposed therebetween in plan view. In FIG. 5, for easy understanding of the configuration, the second stepped portion 13 is hatched. Except for the location where the sensor wiring 18 described later is provided in the second stepped portion 13, the first stepped portion 12 projects more inside the cavity 8 than the second stepped portion 13. When the first case 2 is viewed in plan view, the bottom surface 11, the first stepped portion 12, and the second stepped portion 13 can be visually recognized. In plan view, the first stepped portion 12 is located outside the bottom surface 11. The second stepped portion 13 is provided at a position overlapping the first stepped portion 12 in plan view. The second stepped portion 13 overlaps a part of the first stepped portion 12 in plan view.

[0017] Various electrodes and wirings are formed on the first case 2. A power supply wiring 15 is formed on the bottom surface 11. Various terminal electrodes (not shown) are formed on the back surface of the first case 2. The power supply wiring 15 is electrically connected to the terminal electrodes formed on the back surface of the first case 2 via a wiring pattern (not shown). A drive voltage for driving the first electronic device 1 is applied to the power supply wiring 15. In addition to the terminal electrodes connected to the power supply wiring 15, terminal electrodes for outputting detection signals output from the first electronic component 5 and the second electronic component 6 are also formed on the back surface of the first case 2. The terminal electrodes formed on the back surface of the first case 2 include a ground terminal grounded to a reference potential.

[0018] As shown in FIG. 4, a plurality of first electrode pads 17 are formed on the first-stage portion 12. The third electronic component 7 is electrically connected to the plurality of first electrode pads 17. A plurality of sensor wirings 18 are formed on the second-stage portion 13. The first electronic component 5 is electrically connected to the plurality of sensor wirings 18. A part of the plurality of first electrode pads 17 is electrically connected to a part of the plurality of sensor wirings 18 via a wiring pattern (not shown). Various electrical signals are transmitted and received between the first electronic component 5 and the third electronic component 7 via a part of the plurality of first electrode pads 17 and a part of the plurality of sensor wirings 18.

[0019] As shown in FIG. 6, the third electronic component 7 is disposed on the bottom surface 11 of the cavity 8. The third electronic component 7 is located in the +Z direction of the bottom surface 11. The third electronic component 7 has a plurality of electrode pads 20. The electrode pad 20 is an example of a bonding pad. A wire 21 is connected to each of the electrode pads 20. The plurality of electrode pads 20 of the third electronic component 7 are electrically connected to the first electrode pads 17 by the wires 21 respectively. As shown in FIG. 7, the second electronic component 6 is disposed in the +Z direction of the third electronic component 7. The second electronic component 6 is placed on the third electronic component 7. The second electronic component 6 is electrically connected to the third electronic component 7 by the plurality of wires 21.

[0020] As shown in FIG. 8, the third electronic component 7 is joined to the bottom surface 11 of the cavity 8 by a die attach film 22. The second electronic component 6 is joined to the third electronic component 7 by a die attach film 23. The die attach film 23 is an example of a first die attach film. The second electronic component 6 protrudes from the third electronic component 7 in the -Y direction. A part of the second electronic component 6 protrudes from the third electronic component 7 in the -Y direction. That is, when viewed in plan in the -Z direction, a part of the second electronic component 6 is located outside the region overlapping the third electronic component 7.

[0021] As shown in FIG. 9, the first electronic component 5 includes a sensor element 25 and a support portion 26. The sensor element 25 has a vibrating piece 31. The vibrating piece 31 is formed from a crystal substrate. The vibrating piece 31 is formed from, for example, a Z-cut crystal substrate. In the present embodiment, the vibrating piece 31 has a double T-shaped structure. The support portion 26 includes an insulating member 32 and a plurality of leads 33. The plurality of leads 33 includes a first drive lead 33A, a second drive lead 33B, a first detection lead 33C, a second detection lead 33D, a first ground lead 33E, and a second ground lead 33F.

[0022] The insulating member 32 is formed from, for example, a polyimide resin or the like. The insulating member 32 is formed in a sheet shape. A metal wiring pattern (not shown) is printed on the insulating member 32. The plurality of leads 33 are electrically connected to the wiring pattern of the insulating member 32. A device hole 34 is formed in the insulating member 32. The plurality of leads 33 extend from the insulating member 32 toward the inside of the device hole 34 in a plan view. The plurality of leads 33 are bent. The plurality of leads 33 project in the +Z direction from the insulating member 32 toward the inside of the device hole 34. The support portion 26 is a TAB (Tape Automated Bonding) tape. The plurality of leads 33 are spaced apart from each other. The end portion 35 of each of the plurality of leads 33 is located inside the device hole 34 in a plan view. The end portion 35 is located in the +Z direction from the insulating member 32. The sensor element 25 is electrically connected to the end portions 35 of the plurality of leads 33.

[0023] As shown in FIG. 10, the sensor element 25 includes a first driving unit 41, a second driving unit 42, an angular velocity detection unit 43, a first connecting arm 44, and a second connecting arm 45. The first driving unit 41 includes a first driving arm 41A and a second driving arm 41B. The second driving unit 42 includes a third driving arm 42A and a fourth driving arm 42B. The angular velocity detection unit 43 includes a base 46, a first detection arm 43A, and a second detection arm 43B. The first detection arm 43A extends in the +X direction from the base 46. The second detection arm 43B extends in the -X direction from the base 46. The first driving unit 41 is located in the +Y direction of the angular velocity detection unit 43. The second driving unit 42 is located in the -Y direction of the angular velocity detection unit 43.

[0024] The first driving unit 41 is connected to the base 46 by the first connecting arm 44. The second driving unit 42 is connected to the base 46 by the second connecting arm 45. The first connecting arm 44 extends in the +Y direction from the base 46. The second connecting arm 45 extends in the -Y direction from the base 46. The first driving arm 41A extends in the +X direction from the first connecting arm 44. The second driving arm 41B extends in the -X direction from the first connecting arm 44. The first driving unit 41 can also be regarded as being divided into the first driving arm 41A and the second driving arm 41B with the first connecting arm 44 as the boundary. The third driving arm 42A extends in the +X direction from the second connecting arm 45. The fourth driving arm 42B extends in the -X direction from the second connecting arm 45. The second driving unit 42 can also be regarded as being divided into the third driving arm 42A and the fourth driving arm 42B with the second connecting arm 45 as the boundary.

[0025] The first driving unit 41 has a first driving electrode 51 and a second driving electrode 52. The second driving unit 42 also has a first driving electrode 51 and a second driving electrode 52. The first driving electrode 51 of the first driving unit 41 and the first driving electrode 51 of the second driving unit 42 are electrically connected to each other. The first driving electrode 51 is an electrode common to the first driving unit 41 and the second driving unit 42. The second driving electrode 52 of the first driving unit 41 and the second driving electrode 52 of the second driving unit 42 are electrically connected to each other. The second driving electrode 52 is an electrode common to the first driving unit 41 and the second driving unit 42.

[0026] The angular velocity detection unit 43 includes a first detection electrode 53, a second detection electrode 54, and a common electrode 55. The first detection electrode 53 is provided on the first detection arm 43A. The second detection electrode 54 is provided on the second detection arm 43B. The common electrode 55 is provided on the first detection arm 43A and the second detection arm 43B. The common electrode 55 of the first detection arm 43A and the common electrode 55 of the second detection arm 43B are electrically connected to each other. The first detection electrode 53 is provided on the surface of the first detection arm 43A facing the +Z direction. The surface facing the +Z direction is also called the main surface 56 of the vibrating piece 31. The second detection electrode 54 is provided on the main surface 56 of the second detection arm 43B. The common electrode 55 of the first detection arm 43A is provided on the side surface of the first detection arm 43A facing the +Y direction. The common electrode 55 of the second detection arm 43B is provided on the side surface of the second detection arm 43B facing the +Y direction. The common electrode 55 is grounded to the ground which is the reference potential.

[0027] The first drive electrode 51 is provided on the first drive arm 41A, the second drive arm 41B, the third drive arm 42A, and the fourth drive arm 42B. The second drive electrode 52 is also provided on the first drive arm 41A, the second drive arm 41B, the third drive arm 42A, and the fourth drive arm 42B. The first drive electrode 51 of the first drive arm 41A and the first drive electrode 51 of the second drive arm 41B are both provided on the main surface 56. The second drive electrode 52 of the first drive arm 41A and the second drive electrode 52 of the second drive arm 41B are both provided on the side surface facing the +Y direction.

[0028] The first drive electrode 51 of the third drive arm 42A and the first drive electrode 51 of the fourth drive arm 42B are both provided on the side surface facing the -Y direction. The second drive electrode 52 of the third drive arm 42A and the second drive electrode 52 of the fourth drive arm 42B are both provided on the main surface 56. An alternating excitation signal is applied between the first drive electrode 51 and the second drive electrode 52. The arrangement of the first drive electrode 51 and the arrangement of the second drive electrode 52 are opposite to each other between the first drive unit 41 and the second drive unit 42.

[0029] With this electrode arrangement, as shown in FIG. 11, the first drive unit 41 and the second drive unit 42 vibrate symmetrically with respect to the axis L1 along the X-axis passing through the angular velocity detection unit 43. The fact that the first drive unit 41 and the second drive unit 42 vibrate symmetrically with respect to the axis L1 means that the first drive arm 41A and the third drive arm 42A approach or separate from each other. The fact that the first drive unit 41 and the second drive unit 42 vibrate symmetrically with respect to the axis L1 means that the second drive arm 41B and the fourth drive arm 42B approach or separate from each other.

[0030] When an angular velocity around the Z-axis is generated in the sensor element 25 when the first drive unit 41 and the second drive unit 42 vibrate, a Coriolis force acts on the first drive unit 41 and the second drive unit 42. Due to the Coriolis force acting on the first drive unit 41 and the second drive unit 42, the first detection arm 43A and the second detection arm 43B vibrate. When the first detection arm 43A and the second detection arm 43B vibrate, detection signals are output from the first detection electrode 53 and the second detection electrode 54, respectively. The detection signal output from the first detection electrode 53 and the detection signal output from the second detection electrode 54 are in antiphase with each other.

[0031] The detection signal output from the first detection electrode 53 is called the first detection signal. The detection signal output from the second detection electrode 54 is called the second detection signal. The first detection signal and the second detection signal constitute a differential signal. The angular velocity is detected based on a differential amplification signal that is a signal obtained by amplifying the difference between the first detection signal and the second detection signal. When an angular velocity around the Z-axis is generated in the sensor element 25, the first detection signal and the second detection signal are in antiphase with each other. At this time, the differential amplification signal of the first detection signal and the second detection signal is amplified to twice the first detection signal or the second detection signal. The angular velocity is detected based on this differential amplification signal.

[0032] When no angular velocity is generated in the sensor element 25, that is, when the sensor element 25 is in a stationary state, both the first detection signal and the second detection signal become the reference potential. When the sensor element 25 is in a stationary state, the differential amplification signal of the first detection signal and the second detection signal is not output. Therefore, the angular velocity is not detected. When the sensor element 25 makes a linear motion along the Y-axis, the first detection signal and the second detection signal are in the same phase with each other. Therefore, the first detection signal and the second detection signal are canceled out by differential amplification. Therefore, the angular velocity is not detected.

[0033] As shown in FIG. 12, the support portion 26 includes a first drive terminal 61, a second drive terminal 62, a first detection terminal 63, a second detection terminal 64, a first ground terminal 65, and a second ground terminal 66. The first drive terminal 61, the second drive terminal 62, the first detection terminal 63, the second detection terminal 64, the first ground terminal 65, and the second ground terminal 66 are provided on the surface of the insulating member 32 facing the -Z direction. The first drive terminal 61, the second drive terminal 62, the first detection terminal 63, the second detection terminal 64, the first ground terminal 65, and the second ground terminal 66 are terminal electrodes formed on the insulating member 32.

[0034] The first drive terminal 61 is electrically connected to the first drive electrode 51 shown in FIG. 10 via the first drive lead 33A. The second drive terminal 62 is electrically connected to the second drive electrode 52 shown in FIG. 10 via the second drive lead 33B. The first detection terminal 63 is electrically connected to the first detection electrode 53 shown in FIG. 10 via the first detection lead 33C. The second detection terminal 64 is electrically connected to the second detection electrode 54 shown in FIG. 10 via the second detection lead 33D. The first ground terminal 65 is electrically connected to the common electrode 55 shown in FIG. 10 via the first ground lead 33E. The second ground terminal 66 is a spare terminal electrode. The second ground terminal 66 is grounded to the ground potential. The second ground terminal 66 may be electrically connected to the sensor element 25 via the second ground lead 33F.

[0035] A drive signal, which is an excitation signal, is applied from a third electronic component 7 to a first drive terminal 61 and a second drive terminal 62 shown in FIG. 12. The drive signal is applied from the first drive terminal 61 to a first drive electrode 51 via a first drive lead 33A. The drive signal is applied from the second drive terminal 62 to a second drive electrode 52 via a second drive lead 33B. A first detection signal output from the first detection electrode 53 is input to the third electronic component 7 via a first detection lead 33C and a first detection terminal 63. A second detection signal output from the second detection electrode 54 is input to the third electronic component 7 via a second detection lead 33D and a second detection terminal 64. The common electrode 55 is grounded to a ground potential via a first ground lead 33E and a first ground terminal 65.

[0036] As shown in FIG. 13, a first drive pad 71, a second drive pad 72, a first detection pad 73, a second detection pad 74, a first ground pad 75, and a second ground pad 76 are formed on a second-stage portion 13 of the first case 2. The first drive pad 71, the second drive pad 72, the first detection pad 73, the second detection pad 74, the first ground pad 75, and the second ground pad 76 are formed on a surface facing the +Z direction of the second-stage portion 13. The first drive pad 71, the second drive pad 72, the first detection pad 73, the second detection pad 74, the first ground pad 75, and the second ground pad 76 each extend along the XY plane. The first drive pad 71, the second drive pad 72, the first detection pad 73, the second detection pad 74, the first ground pad 75, and the second ground pad 76 are each a part of the sensor wiring 18 shown in FIG. 4.

[0037] The first electronic component 5 is mounted on a first drive pad 71, a second drive pad 72, a first detection pad 73, a second detection pad 74, a first ground pad 75, and a second ground pad 76 shown in FIG. 13. The first drive terminal 61 shown in FIG. 12 is electrically connected to the first drive pad 71 by a bonding material such as solder. The second drive terminal 62 is electrically connected to the second drive pad 72 by a bonding material such as solder. The first detection terminal 63 is electrically connected to the first detection pad 73 by a bonding material such as solder. The second detection terminal 64 is electrically connected to the second detection pad 74 by a bonding material such as solder. The first ground terminal 65 is electrically connected to the first ground pad 75 by a bonding material such as solder. The second ground terminal 66 is electrically connected to the second ground pad 76 by a bonding material such as solder.

[0038] As shown in FIG. 14, the second electronic component 6 includes a first acceleration sensor 81, a second acceleration sensor 82, and a third acceleration sensor 83. The first acceleration sensor 81 detects acceleration along the Z axis. The second acceleration sensor 82 detects acceleration along the X axis. The third acceleration sensor 83 detects acceleration along the Y axis. The first acceleration sensor 81, the second acceleration sensor 82, and the third acceleration sensor 83 are formed on a single silicon substrate 84. A plurality of electrode pads 85 are formed on the silicon substrate 84.

[0039] In the example shown in FIG. 14, the first acceleration sensor 81, the second acceleration sensor 82, and the third acceleration sensor 83 are arranged along the X axis. The first acceleration sensor 81 is located in the +X direction of the second acceleration sensor 82. The second acceleration sensor 82 is located in the +X direction of the third acceleration sensor 83. The arrangement order of the first acceleration sensor 81, the second acceleration sensor 82, and the third acceleration sensor 83 is not limited to the example shown in FIG. 14. The arrangement order of the first acceleration sensor 81, the second acceleration sensor 82, and the third acceleration sensor 83 can adopt any arrangement order.

[0040] As shown in FIG. 15, the first acceleration sensor 81 includes a fixed electrode portion 90, a fixed electrode portion 91, a movable body MB, a fixed electrode fixing portion 92, and a fixed electrode fixing portion 93. The fixed electrode portion 90 has a plurality of fixed electrodes 94, and the fixed electrode portion 91 has a plurality of fixed electrodes 95. The movable body MB includes a movable electrode portion 96 and a movable electrode portion 97. The movable electrode portion 96 of the movable body MB includes a movable electrode 98. The movable electrode portion 97 includes a movable electrode 99. The fixed electrodes 94, the fixed electrodes 95, the movable electrode 98, and the movable electrode 99 are each electrically connected to the electrode pads 85 shown in FIG. 14. The movable electrode portion 96 and the movable electrode portion 97 are each an example of a detection portion.

[0041] The movable body MB moves relative to the silicon substrate 84 in accordance with an externally applied acceleration or the like. The first acceleration sensor 81 has a support beam 101 and a fixing portion 102. The movable body MB is connected to the silicon substrate 84 via the support beam 101 and the fixing portion 102. The support beam 101 is, for example, a torsion spring. One end of the support beam 101 is connected to the fixing portion 102, and the other end is connected to the movable body MB. The fixing portion 102 is an example of an anchor portion.

[0042] The fixing portion 102 is electrically connected to the movable body MB via the support beam 101. When the support beam 101 is twisted in response to an externally applied acceleration or the like, the movable body MB can perform a seesaw motion with respect to the silicon substrate 84. Along with the seesaw motion of the movable body MB, the capacitance between the fixed electrode portion 90 and the movable electrode portion 96 and the capacitance between the fixed electrode portion 91 and the movable electrode portion 97 change. The changes in the capacitance between the fixed electrode portion 90 and the movable electrode portion 96 and the capacitance between the fixed electrode portion 91 and the movable electrode portion 97 can be electrically detected via the electrode pads 85 shown in FIG. 14. According to the first acceleration sensor 81, the acceleration along the Z-axis can be detected based on the changes in the capacitance between the fixed electrode portion 90 and the movable electrode portion 96 and the capacitance between the fixed electrode portion 91 and the movable electrode portion 97.

[0043] As shown in FIG. 16, the second acceleration sensor 82 includes a movable electrode support portion 105, a fixed portion 102, a plurality of support springs 106, and a wiring structure SA. The movable electrode support portion 105 extends along the X-axis. The fixed portion 102 is provided on one end side of the movable electrode support portion 105. The fixed portion 102 fixes the movable electrode portion 96 via the support springs 106. Two of the plurality of support springs 106 extend from the fixed portion 102. The remaining two of the plurality of support springs 106 extend from the other end of the movable electrode support portion 105 opposite to the fixed portion 102. Each of the plurality of support springs 106 is connected to the movable body MB.

[0044] The two fixed electrode portions 90 are located on opposite sides of each other with the movable electrode support portion 105 interposed therebetween. The two fixed electrode portions 90 are respectively provided with a fixed electrode 94 and a fixed electrode 107 having different polarities from each other. The movable electrode portions 96 located on opposite sides of each other with the movable electrode support portion 105 interposed therebetween respectively have a movable electrode 98 and a movable electrode 108. The movable electrode 98 and the fixed electrode 94 form a pair. The movable electrode 108 and the fixed electrode 107 form a pair. The fixed portion 102 of the movable electrode portion 96 and the fixed electrode fixing portion 92 of the fixed electrode portion 90 are each a cantilever structure with a single-point support. The fixed electrode fixing portion 92 is provided adjacent to both sides of the fixed portion 102.

[0045] When an acceleration along the X-axis is applied, the movable electrode portion 96 vibrates along the X-axis with respect to the silicon substrate 84. At this time, the capacitance between the movable electrode 98 and the fixed electrode 94 and the capacitance between the movable electrode 108 and the fixed electrode 107 change. The changes in the capacitance between the movable electrode 98 and the fixed electrode 94 and the capacitance between the movable electrode 108 and the fixed electrode 107 can be electrically detected via the electrode pads 85 shown in FIG. 14. According to the second acceleration sensor 82, the acceleration along the X-axis can be detected based on the changes in the capacitance between the movable electrode 98 and the fixed electrode 94 and the capacitance between the movable electrode 108 and the fixed electrode 107.

[0046] As shown in FIG. 17, in the third acceleration sensor 83, the movable electrode support portion 105 extends along the Y-axis. The third acceleration sensor 83 has the same configuration as the second acceleration sensor 82 shown in FIG. 16. That is, the second acceleration sensor 82 and the third acceleration sensor 83 are the same elements as each other. The third acceleration sensor 83 has a different arrangement direction from that of the second acceleration sensor 82 as shown in FIG. 17. When an acceleration is applied to the third acceleration sensor 83, the movable electrode portion 96 vibrates along the Y-axis with respect to the silicon substrate 84.

[0047] At this time, the capacitance between the movable electrode 98 and the fixed electrode 94, and the capacitance between the movable electrode 108 and the fixed electrode 107 change. The changes in the capacitance between the movable electrode 98 and the fixed electrode 94, and the capacitance between the movable electrode 108 and the fixed electrode 107 can be electrically detected via the electrode pad 85 shown in FIG. 14. According to the third acceleration sensor 83, the acceleration along the Y-axis can be detected based on the changes in the capacitance between the movable electrode 98 and the fixed electrode 94, and the capacitance between the movable electrode 108 and the fixed electrode 107.

[0048] As shown in FIG. 18, the second electronic component 6 further includes a cavity substrate 111 and a cap substrate 112. The cavity substrate 111 is located in the -Z direction of the silicon substrate 84. The cap substrate 112 is located in the +Z direction of the silicon substrate 84. The silicon substrate 84 is sandwiched between the cavity substrate 111 and the cap substrate 112. A cavity 113 is formed in the cavity substrate 111. A plurality of support portions 114 are formed in the cavity 113. The support portions 114 protrude in the +Z direction from the bottom of the cavity 113.

[0049] The cavity 113 is formed with the same number of support portions 114 as the number of fixing portions 102 included in the silicon substrate 84. Each fixing portion 102 of the first acceleration sensor 81, the second acceleration sensor 82, and the third acceleration sensor 83 is joined to each of the plurality of support portions 114 by an adhesive 115. Each fixing portion 102 is fixed by each support portion 114. The cap substrate 112 covers the first acceleration sensor 81, the second acceleration sensor, and the third acceleration sensor 83 from the +Z direction.

[0050] The cap substrate 112 is joined to the silicon substrate 84 via a glass frit 116. Thereby, the region surrounded by the cavity substrate 111 and the cap substrate 112 is maintained airtight. An insulating layer 117 is interposed between the glass frit 116 and the silicon substrate 84. Various electrodes formed on the silicon substrate 84 are electrically connected to the electrode pads 85 via wirings 118 passing between the insulating layer 117 and the glass frit 116.

[0051] As shown in FIG. 19, in the first electronic device 1, all the fixing portions 102 of the second electronic component 6 are positioned in the +Z direction of the third electronic component 7. The third electronic component 7 exists in the -Z direction of each fixing portion 102 of the second electronic component 6. That is, when viewed in plan in the -Z direction, all the fixing portions 102 of the second electronic component 6 are positioned within the region overlapping the third electronic component 7. With this configuration, since the fixing portions 102 of the second electronic component 6 can be supported by the third electronic component 7, the detection accuracy of the second electronic component 6 is likely to be stabilized.

[0052] As shown in FIG. 20, the second electronic device 10 further includes a fourth electronic component 121, a fifth electronic component 122, and a sixth electronic component 123. The fourth electronic component 121 is an example of a third sensor. The fifth electronic component 122 is an example of a fourth sensor. The sixth electronic component 123 is an example of a second circuit board. The fourth electronic component 121, the fifth electronic component 122, and the sixth electronic component 123 are housed inside the second case 4. A concave cavity 8 is formed in the second case 4. The fourth electronic component 121, the fifth electronic component 122, and the sixth electronic component 123 are housed in the cavity 8 of the second case 4. In plan view, the size of the second case 4 is the same as the size of the first case 2. In this embodiment, the first case 2 and the second case 4 are the same components as each other. For this reason, regarding the configuration of the second case 4, detailed description is omitted by attaching the same reference numerals as the configuration of the first case 2.

[0053] The fourth electronic component 121 and the fifth electronic component 122 are each a sensor that detects the movement of the object on which the second electronic device 10 is installed. The fourth electronic component 121 detects the angular velocity of the object. The fifth electronic component 122 detects the acceleration of the object. The sixth electronic component 123 is a circuit board that controls the fourth electronic component 121 and the fifth electronic component 122. The sixth electronic component 123 processes the detection signals output from the fourth electronic component 121 and the fifth electronic component 122. The sixth electronic component 123 controls the signals for driving the fourth electronic component 121 and the fifth electronic component 122.

[0054] The fourth electronic component 121 detects the angular velocity around the Z axis of the object. In this embodiment, the fourth electronic component 121 is a gyro sensor. In plan view, the size of the fourth electronic component 121 is the same as the size of the first electronic component 5. In this embodiment, the first electronic component 5 and the fourth electronic component 121 are the same components as each other. For this reason, regarding the configuration of the fourth electronic component 121, detailed description is omitted by attaching the same reference numerals as the configuration of the first electronic component 5.

[0055] The fifth electronic component 122 includes three acceleration sensors. The three acceleration sensors are an acceleration sensor that detects acceleration along the Y-axis, an acceleration sensor that detects acceleration along the X-axis, and an acceleration sensor that detects acceleration along the Z-axis. As the acceleration sensor, for example, a capacitance-type acceleration sensor can be adopted. Further, as the acceleration sensor, for example, a crystal acceleration sensor can also be adopted. In plan view, the size of the fifth electronic component 122 is larger than the size of the second electronic component 6. That is, in plan view, the size of the second electronic component 6 is smaller than the size of the fifth electronic component 122. The fifth electronic component 122 has the same configuration as the second electronic component 6 except for the different sizes. Therefore, regarding the configuration of the fifth electronic component 122, detailed description is omitted by attaching the same reference numerals as the configuration of the second electronic component 6.

[0056] The sixth electronic component 123 is composed of, for example, an IC (Integrated Circuit). The sixth electronic component 123 processes various signals output from the fourth electronic component 121 and the fifth electronic component 122. The sixth electronic component 123 includes various circuits for processing various signals output from the fourth electronic component 121 and the fifth electronic component 122. Various circuit elements constituting various circuits are formed in the sixth electronic component 123. The sixth electronic component 123 is located in the +Z direction of the fifth electronic component 122. The sixth electronic component 123 is mounted in the +Z direction of the fifth electronic component 122. In plan view, the size of the sixth electronic component 123 is the same as the size of the third electronic component 7. Regarding the same configuration as that of the third electronic component 7 among the configuration of the sixth electronic component 123, detailed description is omitted by attaching the same reference numerals as the configuration of the third electronic component 7.

[0057] As shown in FIG. 21, in plan view, the size of the sixth electronic component 123 is smaller than the size of the fifth electronic component 122. In plan view, a plurality of electrode pads 20 of the sixth electronic component 123 are located within a region overlapping the fifth electronic component 122. With this configuration, since the plurality of electrode pads 20 of the sixth electronic component 123 can be supported by the fifth electronic component 122, it is easy to be stable when connecting the wire 21 to the electrode pads 20.

[0058] As shown in FIG. 22, the fifth electronic component 122 is joined to the bottom surface 11 of the cavity 8 by a die attach film 125. The sixth electronic component 123 is joined to the fifth electronic component 122 by a die attach film 126. The die attach film 126 is an example of a second die attach film.

[0059] A method for manufacturing the first electronic device 1 and the second electronic device 10 will be described. As shown in FIG. 23, the manufacturing method of the first electronic device 1 and the second electronic device 10 includes a step S1, a step S2, a step S3, and a step S4. In step S1, when it is determined that the first electronic device 1 is the object to be manufactured, the process proceeds to step S2. Step S2 is a step of manufacturing the first electronic device 1 by housing the first electronic component 5, the second electronic component 6, and the third electronic component 7 in the first case 2.

[0060] When it is determined NO in step S1, the process proceeds to step S3. In step S3, when it is determined that the second electronic device 10 is the object to be manufactured, the process proceeds to step S4. Step S4 is a step of manufacturing the second electronic device 10 by housing the fourth electronic component 121, the fifth electronic component 122, and the sixth electronic component 123 in the second case 4. When it is determined NO in step S3, the manufacturing of the first electronic device 1 and the second electronic device 10 is not carried out.

[0061] As shown in FIG. 24, the manufacturing method of the first electronic device 1 includes a step S101, a step S102, a step S103, a step S104, a step S105, and a step S106. The manufacturing method of the first electronic device 1 shown in FIG. 24 shows the detailed flow of step S2 shown in FIG. 23. That is, step S2 includes step S101, step S102, step S103, step S104, step S105, and step S106 shown in FIG. 24.

[0062] Step S101 is a step of bonding the third electronic component 7 to the bottom surface 11 of the first case 2 with a die attach film 22. Step S102, which is the step following step S101, is a step of bonding the second electronic component 6 to the third electronic component 7 with a die attach film 23. In step S102, the second electronic component 6 is bonded to the +Z direction of the third electronic component 7 with the die attach film 23. In step S102, when the second electronic component 6 is mounted in the +Z direction of the third electronic component 7, in a plan view, the fixing portion 102 of the second electronic component 6 is overlapped with the third electronic component 7.

[0063] Step S103, which is the step following step S102, is a step of connecting the electrode pad 20 of the third electronic component 7 and the first electrode pad 17 with a wire 21. Step S104, which is the step following step S103, is a step of electrically connecting the third electronic component 7 and the second electronic component 6 with a wire 21. In steps S103 and S104, the wire 21 is connected by performing wire bonding with a bonding machine.

[0064] Step S105, which is the step following step S104, is a step of mounting the first electronic component 5 on the second step portion 13 of the first case 2. Step S106, which is the step following step S105, is a step of bonding the lid 3 to the first case 2. Step S106 may be performed in an atmospheric pressure environment or in a pressure environment lower than the atmospheric pressure. Thus, the first electronic device 1 is manufactured.

[0065] As shown in FIG. 25, the manufacturing method of the second electronic device 10 includes step S201, step S202, step S203, step S204, step S205, and step S206. The manufacturing method of the second electronic device 10 shown in FIG. 25 shows the detailed flow of step S4 shown in FIG. 23. That is, step S4 includes step S201, step S202, step S203, step S204, step S205, and step S206 shown in FIG. 25.

[0066] Step S201 is a step of bonding a fifth electronic component 122 to the bottom surface 11 of the second case 4 with a die attach film 125. Step S202, which is the step following step S201, is a step of bonding a sixth electronic component 123 to the fifth electronic component 122 with a die attach film 126. In step S202, the sixth electronic component 123 is bonded to the fifth electronic component 122 in the +Z direction of the fifth electronic component 122 by the die attach film 126. In step S202, when mounting the sixth electronic component 123 in the +Z direction of the fifth electronic component 122, in a plan view, a plurality of electrode pads 20 of the sixth electronic component 123 are positioned within a region overlapping the fifth electronic component 122. Thereby, since the plurality of electrode pads 20 of the sixth electronic component 123 can be supported by the fifth electronic component 122, it is easy to be stable when connecting the wire 21 to the electrode pad 20.

[0067] Step S203, which is the step following step S202, is a step of electrically connecting the fifth electronic component 122 and the sixth electronic component 123 with a wire 21. Step S204, which is the step following step S203, is a step of connecting the electrode pad 20 of the sixth electronic component 123 and the first electrode pad 17 with a wire 21. In steps S203 and S204, the wire 21 is connected by performing wire bonding with a bonding machine.

[0068] Step S205, which is the step following step S204, is a step of mounting a fourth electronic component 121 on the second step portion 13 of the second case 4. Step S206, which is the step following step S205, is a step of bonding a lid 3 to the second case 4. Step S206 may be performed in an atmospheric pressure environment or in a pressure environment lower than atmospheric pressure. Thus, the second electronic device 10 is manufactured.

[0069] According to the manufacturing methods of the first electronic device 1 and the second electronic device 10, both the first case 2 and the second case 4, which have the same size in plan view, can accommodate both the second electronic component 6 and the fifth electronic component 122, which have different sizes in plan view. That is, according to the manufacturing methods of the first electronic device 1 and the second electronic device 10, it is possible to accommodate the fifth electronic component 122 in the first case 2 and also to accommodate the second electronic component 6 in the second case 4. According to this manufacturing method, it is easy to avoid an increase in the types of packages according to the size variations of sensors and circuit boards.

Description of Signs

[0070] 1…First electronic device, 2…First case, 3…Lid, 4…Second case, 5…First electronic component, 6…Second electronic component, 7…Third electronic component, 8…Cavity, 10…Second electronic device, 11…Bottom surface, 12…First stepped portion, 13…Second stepped portion, 15…Power wiring, 17…First electrode pad, 18…Sensor wiring, 20…Electrode pad, 21…Wire, 22…Die attach film, 23…Die attach film, 25…Sensor element, 26…Support portion, 31…Vibrating piece, 32…Insulating member, 33…Lead, 33A…First drive lead, 33B…Second drive lead, 33C…First detection lead, 33D…Second detection lead, 33E…First ground lead, 33F…Second ground lead, 34…Device hole, 35…End portion, 41…First drive portion, 41A…First drive arm, 41B…Second drive arm, 42…Second drive portion, 42A…Third drive arm, 42B…Fourth drive arm, 43…Angular velocity detection portion, 43A…First detection arm, 43B…Second detection arm, 44…First connecting arm, 45…Second connecting arm, 46…Base portion, 51…First drive electrode, 52…Second drive electrode, 53…First detection electrode, 54…Second detection electrode, 55…Common electrode, 56…Main surface, 61…First drive terminal, 62…Second drive terminal, 63…First detection terminal, 64…Second detection terminal, 65…First ground terminal, 66…Second ground terminal, 71…First drive pad, 72…Second drive pad, 73…First detection pad, 74…Second detection pad, 75…First ground pad, 76…Second ground pad, 81…First acceleration sensor, 82…Second acceleration sensor, 83…Third acceleration sensor, 84…Silicon substrate, 85…Electrode pad, 90…Fixed electrode portion, 91…Fixed electrode portion, 92…Fixed electrode fixing portion, 93…Fixed electrode fixing portion, 94…Fixed electrode, 95…Fixed electrode, 96…Movable electrode portion, 97…Movable electrode portion, 98…Movable electrode, 99…Movable electrode, 101…Support beam, 102…Fixing portion, 105…Movable electrode support portion, 106…Support spring, 107…Fixed electrode, 108…Movable electrode, 111…Cavity substrate, 112…Cap substrate, 113…Cavity, 114…Support portion, 115…Adhesive, 116…Glass frit, 117…Insulating layer, 118…Wiring, 121…Fourth electronic component, 122…Fifth electronic component, 123…Sixth electronic component, 125…Die attach film, 126…Die attach film, MB…Movable body, SA…Wiring structure body.

Claims

1. A method for manufacturing a plurality of electronic devices including a first electronic device and a second electronic device, comprising: The first electronic device includes a first sensor that detects a first physical quantity, a second sensor that detects a second physical quantity different from the first physical quantity, a first circuit board electrically connected to the first sensor and the second sensor, and a first package that houses the first sensor, the second sensor, and the first circuit board; The second electronic device includes a third sensor that detects the first physical quantity, a fourth sensor that detects the second physical quantity, a second circuit board electrically connected to the third sensor and the fourth sensor, and a second package that houses the third sensor, the fourth sensor, and the second circuit board; In a plan view, the size of the first package is the same as the size of the second package; In a plan view, the size of the first sensor is the same as the size of the third sensor; In a plan view, the size of the second sensor is smaller than the size of the fourth sensor; In a plan view, the size of the first circuit board is the same as the size of the second circuit board; After mounting the first circuit board on the first package, mounting the second sensor on the first circuit board; After mounting the fourth sensor on the second package, mounting the second circuit board on the fourth sensor; A method for manufacturing an electronic device.

2. The second circuit board has a plurality of bonding pads; When mounting the second circuit board on the fourth sensor, in a plan view, overlapping the plurality of bonding pads with the fourth sensor; The method for manufacturing an electronic device according to claim 1.

3. The second sensor includes a detection part that is displaced according to the second physical quantity and an anchor part that supports the detection part; When mounting the second sensor on the first circuit board, in a plan view, overlapping the anchor part with the first circuit board; The method for manufacturing an electronic device according to claim 1.

4. When mounting the second sensor on the first circuit board, positioning a part of the second sensor outside a region overlapping the first circuit board in a plan view; The method for manufacturing an electronic device according to claim 3.

5. Bonding the first circuit board and the second sensor with a first die attach film; joining the fourth sensor and the second circuit board with a second die attach film; The method of manufacturing an electronic device according to claim 1.

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