Mold coil, reactor, and method for manufacturing modl coil and reactor

Abstract

To provide a mold coil and a reactor with an excellent production efficiency by reducing the number of components, and a method for manufacturing the mold coil and the reactor.SOLUTION: The mold coil includes: a coil 1; an upper cover 2 covering the upper surface of the coil 1; a sensor 4 for detecting the physical quantity of the mold coil; and a coil mold resin for covering at least a part of the coil 1, at least a part of the upper cover 2, and at least a part of the sensor 4. The sensor 4 includes a detection unit 41 and a lead wire 42 for connecting the detection unit 41 and the connector 43 to each other. The upper cover 2 has a hole in which the detection unit 41 is inserted. The hold is in contact with the detection unit 41. The lead wire 42 is not covered with the coil mold resin.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a molded coil and a reactor provided with a sensor, and a method for manufacturing the molded coil and the reactor.

Background Art

[0002] Coil components such as reactors are used in various applications such as OA equipment, solar power generation systems, and automobiles. The coil component is formed by winding a coil around the outer periphery of a core made of a magnetic material. Further, a resin member is provided between the core and the coil to insulate the core and the coil.

[0003] In recent years, molded coils in which a coil is molded with a resin of a resin member have been used everywhere. A molded coil in which the inner peripheral surface and the outer peripheral surface of the coil are covered with a resin member is produced by arranging the coil at a predetermined position in a mold, injecting the resin into the mold, and solidifying it.

[0004] A sensor may be provided in the coil component. The sensor is composed of a detection unit that detects a physical quantity of the coil component, for example, temperature, a connector that connects to an external device, and a lead wire whose one end is connected to the detection unit and the other end is connected to the connector. The lead wire is composed of a metal wire and a covering portion made of an insulating member that covers the metal wire. When a sensor is provided in the coil component, the sensor may also be covered with a resin together with the coil during the molding for producing the molded coil.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] When the sensor is coated with the coil by mold forming, the lead wire may be agitated by the injection pressure of the resin, and the lead wire may be disconnected. In addition, there is a risk that the coated portion of the lead wire will melt due to the heat of the resin. Therefore, before mold forming with the coil, a method of protecting the sensor has been proposed by mold forming the sensor alone or by producing a separate sensor cover and attaching the sensor cover to the sensor.

[0007] However, in these methods, the number of parts increases. In addition, since there are a process of mold forming the sensor alone and a process of attaching the sensor cover to the sensor, the number of processes also increases.

[0008] The present invention has been made to solve the above problems, and an object thereof is to provide a mold coil, a reactor, and a method for manufacturing a mold coil and a reactor that reduce the number of parts and have good production efficiency.

Means for Solving the Problems

[0009] The mold coil of the present invention includes a coil, a cover that covers the upper surface of the coil, a sensor that detects a physical quantity of the mold coil, and a coil mold resin that covers at least a part of each of the coil, the cover, and the sensor. The sensor has a detection unit, a connector to which a terminal of an external device is connected, and a lead wire that connects the detection unit and the connector. The cover has a hole into which the detection unit is inserted, the hole is in contact with the detection unit, and the lead wire is not covered with the coil mold resin.

[0010] In addition, the reactor of the present invention is characterized by including the above mold coil and a core that contains a magnetic material and to which the mold coil is attached.

[0011] The manufacturing method of the mold coil of the present invention includes a cover mounting step of mounting a cover on the coil, a sensor press-fitting step of press-fitting the detection part of the sensor into the hole of the cover after the cover mounting step, and a molding step of covering at least a part of each of the coil, the cover, and the detection part with coil mold resin by mold molding after the sensor press-fitting step, wherein the lead wire of the sensor is not covered by the coil mold resin.

[0012] The manufacturing method of the reactor of the present invention is characterized by including an assembling step of assembling a core to the mold coil manufactured by the above method.

Effects of the Invention

[0013] According to the present invention, it is possible to obtain a mold coil and a reactor with reduced number of parts and high production efficiency, as well as a manufacturing method of the mold coil and the reactor.

Brief Description of the Drawings

[0014]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Mode for Carrying Out the Invention

[0015] (Embodiment) The mold coil according to the embodiment will be described with reference to the drawings. FIG. 1 is an exploded perspective view showing the state before the cover is attached to the coil. FIG. 2 is a perspective view showing the state where the cover is attached to the coil 1. In each drawing, for ease of understanding, the thickness, dimensions, positional relationship, ratio, shape, etc. may be emphasized and shown, and the present invention is not limited to those emphasized.

[0016] The mold coil 10 is a main component of coil components such as a reactor (see FIG. 10). The mold coil 10 includes a coil 1. The mold coil 10 is produced by molding the coil 1.

[0017] The coil 1 is composed of a single conductive member insulated with enamel or the like. The coil 1 is formed by winding the conductive member in a cylindrical shape while shifting the winding position in the winding axis direction. The conductive member is, for example, a rectangular wire, and the coil 1 is an edgewise coil in which the wide surface of the conductive member extends in a direction orthogonal to the winding axis of the coil 1. Note that the coil 1 may be a flatwise coil. Also, as the conductive member, a round wire may be used.

[0018] Two coils 1 are provided. The two coils 1 are arranged side by side such that the side surfaces of the coils 1 parallel to the winding axis face each other. In the present embodiment, the two coils 1 are a connected coil formed by being connected by a connecting wire 11.

[0019] As shown in FIG. 2, a part of the surface of the coil 1 is covered by the upper cover 2 and the lower cover 3. The upper cover 2 and the lower cover 3 prevent the mold, the pressing member, etc. from directly contacting the coil 1 during molding. The upper cover 2 and the lower cover 3 are configured as separate bodies. The upper cover 2 is disposed on the upper surface side of the coil 1, and the lower cover 3 is disposed on the lower surface side of the coil 1. Note that the vertical direction is a direction orthogonal to the winding axis direction and the lateral direction of the coil 1, and among the coil end faces, the face facing the upper mold during molding is the upper face, and the face facing the lower mold is the lower face.

[0020] The upper cover 2 and the lower cover 3 are made of resin. Examples of the type of resin include epoxy resin, unsaturated polyester resin, urethane resin, BMC (Bulk Molding Compound), PPS (Polyphenylene Sulfide), PBT (Polybutylene Terephthalate), etc.

[0021] FIG. 3 is a perspective view of the upper cover 2. The upper cover 2 has an upper surface covering portion 21 and a connecting portion 22. The upper surface covering portion 21 covers the upper surface of the coil 1. Two upper surface covering portions 21 are provided, and each upper surface covering portion 21 covers the upper surface of each coil 1. A rounded upper mold contact portion 211 having a rounded rectangular corner is formed on the upper surface covering portion 21. The upper mold contact portion 211 protrudes upward from the upper surface covering portion 21 and is one step higher than the other upper surface covering portions 21. The upper mold contact portion 211 contacts the upper mold of the mold during molding.

[0022] The connecting portion 22 is provided between the two upper surface covering portions 21. The connecting portion 22 connects the two upper surface covering portions 21. The connecting portion 22 has a lead wire accommodating portion 23 formed by notching the upper surface of the connecting portion 22 in the direction of the lower surface of the coil 1. The lead wire accommodating portion 23 is disposed near the center of the connecting portion 22 in the lateral direction of the coil 1.

[0023] Figure 4 is an enlarged view of the lead wire accommodating portion 23. The lead wire accommodating portion 23 has a lead wire placement portion 231 and side walls 232. The lead wire placement portion 231 is a bottom surface formed by notching the upper surface of the connecting portion 22. The lead wire placement portion 231 is a rectangular flat surface. The long side of the lead wire placement portion 231 is parallel to the reel. The lead wire placement portion 231 places the lead wire 42 of the sensor 4.

[0024] The side walls 232 rise from the edges of the side of the lead wire placement portion 231 parallel to the reel direction. The side walls 232 prevent the lead wire 42 of the sensor 4 from moving in the side-by-side direction of the coils 1 and coming into contact with the coils 1.

[0025] A hole 24 is formed in the lead wire placement portion 231. The hole 24 is arranged between the coils 1. The hole 24 is rectangular. The size of the hole 24 is the same as or slightly smaller than the detection portion 41 of the sensor 4. Slightly smaller means a size such that the detection portion 41 of the sensor 4 can be inserted into the hole 24. The detection portion 41 of the sensor 4 is inserted into the hole 24. It is preferable that the size of the hole 24 is slightly smaller than the detection portion 41 of the sensor 4. Since the detection portion 41 and the hole 24 can be brought into closer contact and abutment, it is possible to effectively suppress the resin from flowing into the hole 24 during the molding process.

[0026] Figure 5 is a cross-sectional view taken along the line A-A in Figure 2, and is an enlarged view of the portion where the detection portion 41 of the sensor 4 is inserted into the hole 24. The inner peripheral surface forming the hole 24 becomes a contact surface 241 that abuts against the detection portion 41 of the sensor 4. Four contact surfaces 241 are provided. Two of the four contact surfaces 241 abut against the wide surfaces of the detection portion 41, and the remaining two abut against the narrow surfaces of the detection portion 41. That is, the hole 24 is in contact with the detection portion 41 over the entire circumference. Above the contact surface 241, there is a tapered surface 244. That is, it tapers towards the hole 24.

[0027] FIG. 6 is a perspective view of the upper cover 2 as seen from the lower surface side. FIG. 7 is an enlarged view of the contact surface 241 of the hole 24 with the broken-line circled portion in FIG. 6 enlarged. As shown in FIG. 7, a notch 242 is formed in the contact surface 241. One notch 242 is formed in each contact surface 241, and a total of two notches are provided. The notches 242 are arranged opposite to each other. The notch 242 is formed in the contact surface 241 that contacts the wide surface of the detection unit 41. The notch 242 is generally triangular when viewed from the side-by-side direction of the coils 1. A part of the protrusion 411 formed on the detection unit 41 of the sensor 4 described later enters the notch 242.

[0028] A protrusion interference portion 243 that interferes with the protrusion 411 is formed in the notch 242 when attempting to extract the detection unit 41 from the hole 24. The protrusion interference portion 243 is the peripheral walls of two sides that form the triangular notch 242. That is, two protrusion interference portions 243 are provided and are in an inverted V shape. It is preferable that the protrusion 411 always contacts the protrusion interference portion 243 in a state where the detection unit 41 is inserted into the support portion 251. In this case, the position of the detection unit 41 is regulated, and it is possible to prevent the detection unit 41 from moving during mold forming.

[0029] As shown in FIG. 6, a plate-like portion 25 is provided below the connecting portion 22. The plate-like portion 25 is connected to the lower part of the connecting portion 22. The plate-like portion 25 extends from the lower part of the connecting portion 22 toward the lower surface of the coil 1. The plate-like portion 25 is disposed between the coils 1. The plate-like portion 25 has a thin plate shape. The wide surface of the plate-like portion 25 is orthogonal to the arrangement direction of the coils 1.

[0030] The plate-like portion 25 has a support portion 251 that supports the detection unit 41 of the sensor 4 protruding from the hole 24. The support portion 251 communicates with the hole 24 and is formed by notching the plate-like portion 25 from the hole 24 toward the lower surface of the coil 1. The support portion 251 is provided between the coils 1.

[0031] The support portion 251 extends obliquely from the hole 24. The support portion 251 is formed by a pair of guides 252 and a tip contact portion 253. The guide 252 is connected to a contact surface 241 that contacts the narrow-width surface of the detection portion 41. The guide 252 extends obliquely from the contact surface 241 toward the lower surface of the coil 1.

[0032] The pair of guides 252 are arranged oppositely. A gap for accommodating the detection portion 41 of the sensor 4 is provided between the pair of guides 252. FIG. 8 is a diagram showing a state in which the detection portion 41 of the sensor 4 is inserted into the support portion 251. As shown in FIG. 8, the detection portion 41 of the sensor 4 is inserted into the gap between the guides 252, and the guides 252 contact the detection portion 41. More specifically, the guide 252 contacts the narrow-width surface of the detection portion 41. The guide 252 guides the detection portion 41 inserted into the hole 24.

[0033] The tip contact portion 253 is provided between the pair of guides 252. Each end portion of the tip contact portion 253 is connected to each guide 252. The tip contact portion 253 contacts the tip surface of the detection portion 41 of the sensor 4 inserted into the hole 24. Note that the support portion 251 does not cover the wide-width surface of the detection portion 41. In other words, when the detection portion 41 is inserted into the support portion 251, the wide-width surface of the detection portion 41 is not covered by the support portion 251 and is exposed. However, the wide-width surface of the detection portion 41 is covered by a coil mold resin 5 described later.

[0034] As shown in FIGS. 1 and 2, the lower cover 3 is disposed on the lower surface of the coil 1. The lower cover 3 is composed of two parts, a first lower cover 31 and a second lower cover 32. The first lower cover 31 and the second lower cover 32 cover the surface of the coil 1 movably in the winding axis direction. That is, the first lower cover 31 and the second lower cover 32 do not interfere even when attached to the coil 1. Therefore, it is possible to compress the length of the coil 1 in the winding axis direction to a desired length with a pressing member or the like and perform mold forming.

[0035] The first lower cover 31 and the second lower cover 32 each have two lower mold abutting portions 33 and two annular surface protection portions 34. The lower mold abutting portion 33 is disposed on the lower surface of the coil 1. The lower mold abutting portion 33 abuts against the lower mold of the mold during molding. The lower mold abutting portions 33 of the first lower cover 31 and the second lower cover 32 form a frame shape when fitted together. By each lower mold abutting portion 33 abutting against the lower mold of the mold, it is possible to prevent the coil mold resin 5 from flowing into the frame of the lower mold abutting portion 33. That is, the lower surface of the coil 1 is not covered by the coil mold resin 5 and is exposed.

[0036] The annular surface protection portion 34 covers the annular surface of the coil 1 orthogonal to the winding axis. Two annular surface protection portions 34 are provided and each covers the annular surface of the coil 1 orthogonal to the winding axis. The annular surface protection portion 34 abuts against a pressing member that presses the coil 1 in the winding axis direction during molding. As shown in FIG. 1, the second lower cover 32 has an inner peripheral surface cover 35 that covers the inner peripheral surface of the coil 1.

[0037] The sensor 4 detects a physical quantity related to the mold coil 10. The sensor 4 is, for example, a temperature sensor that detects the temperature of the mold coil 10. The sensor 4 has a detection unit 41, a lead wire 42, and a connector 43.

[0038] The detection unit 41 detects a physical quantity related to the mold coil 10. In the present embodiment, the detection unit 41 is an element that detects the temperature of the mold coil 10, and for example, a thermistor can be used. The detection unit 41 is disposed between two provided coils 1. The detection unit 41 is generally in the shape of a rectangular parallelepiped.

[0039] The detection unit 41 is inserted into the support portion 251 from the hole 24 and supported by the support portion 251 (see FIG. 8). That is, the tip surface of the detection unit 41 abuts against the tip abutting portion 253. Also, a pair of narrow surfaces of the detection unit 41 respectively abut against a pair of guides 252. Further, the detection unit 41 abuts against a contact surface 241 that is the inner peripheral surface of the hole 24.

[0040] FIG. 9 is an enlarged view of the detection unit 41 of the sensor 4. As shown in FIG. 9, projections 411 are formed on the wide surface of the detection unit 41. Two projections 411 are provided and are formed on each of the wide surfaces of the detection unit 41. The projections 411 project from the wide surface of the detection unit 41 toward the coil 1. The projections 411 only need to project to such an extent that they catch on the lower surface constituting the hole 24 when the detection unit 41 is inserted into the support portion 251. If the projections 411 project too long, it becomes difficult to insert the detection unit 41 into the hole 24, which is not preferable. A part of the projections 411 is accommodated inside the notch 242 of the hole 24 when the detection unit 41 is supported by the support portion 251.

[0041] As shown in FIGS. 1 and 2, one end of the lead wire 42 is connected to the detection unit 41, and the other end is connected to the connector 43. The lead wire 42 is composed of a metal wire and a coating portion that coats it. As the material of the metal wire, copper, nickel, aluminum, silver, gold, or a combination of two or more of these can be included. As the metal wire, a single wire alone or a stranded wire formed by combining a plurality of wires can be used. The coating portion coats the metal wire with an insulating member such as vinyl, silicone rubber, or fluororubber. The lead wire 42 is accommodated in a space surrounded by the lead wire placement portion 231 and the side wall 232. All of the lead wires 42 are not coated with the coil molding resin 5.

[0042] The connector 43 is a member that is connected to the connector of an external device. The connector 43 is configured to be detachable from the connector of the external device. The information detected by the detection unit 41 is transmitted to an external device connected to the connector 43 via the lead wire 42 and the connector 43. The connector 43 is locked and fixed to a connector locking portion formed in the coil molding resin 5.

[0043] FIG. 10 is a perspective view showing the overall configuration of the mold coil 10. The coil mold resin 5 coats at least a part of the coil 1, the upper cover 2, and the lower cover 3, respectively. In the present embodiment, since the upper mold contact portion 211 and the upper surface of the lead wire housing portion 23 are in contact with the mold, they are not coated with the coil mold resin 5. Further, the coil mold resin 5 is also formed between the coils 1 and coats the wide surface of the detection portion 41 protruding from the hole 24. In other words, the sensor 4 is not coated with the coil mold resin 5 except for the detection portion 41 protruding from the hole 24. An injection mark G indicating the position where the resin was injected during the mold molding is formed on the coil mold resin 5.

[0044] The coil mold resin 5 is made of resin. Examples of the type of resin include epoxy resin, unsaturated polyester resin, urethane resin, BMC (Bulk Molding Compound), PPS (Polyphenylene Sulfide), PBT (Polybutylene Terephthalate), and the like.

[0045] The coil mold resin 5 is provided with a connector locking portion for fixing the connector 43. Further, one bus bar 8 for connecting to the lead wire of one coil 1 is embedded in the coil mold resin 5.

[0046] Such a mold coil 10 is used as a component of the reactor 9. The reactor 9 is formed by assembling the core 6 to the mold coil 10. FIG. 11 is a perspective view showing the overall configuration of the reactor 9. As shown in FIG. 11, the reactor 9 includes a core 6 and a core mold resin 7.

[0047] The core 6 contains a magnetic material. As the core 6, a powder compact core, a ferrite core, a laminated steel plate, a metal composite core, or the like can be used. The metal composite core is a magnetic material formed by kneading magnetic powder and resin and curing the resin.

[0048] The core 6 is composed of a pair of U-shaped core members each having a pair of leg portions and a yoke portion connecting the pair of leg portions. By joining the leg portions of the U-shaped core members to each other, the core 6 becomes annular. The coil 1 is mounted on the leg portions of the core 6.

[0049] Note that a spacer may be inserted between the leg portions of each other. As the spacer, a non-magnetic material, ceramic, non-metal, resin, carbon fiber, or a composite material of two or more of these or gap paper can be used. In this way, by interposing the spacer, a magnetic gap with a predetermined width is provided to prevent a decrease in the inductance of the reactor. Also, an air gap may be provided without using a spacer.

[0050] The core 6 is covered with a core mold resin 7. The core 6 is molded by the core mold resin 7 to form a mold core. In the present embodiment, the core mold resin 7 covers only the yoke portion and does not cover the leg portions of the core 6, but it may cover the leg portions.

[0051] The core mold resin 7 is made of resin. Examples of the type of resin constituting the core mold resin 7 include epoxy resin, unsaturated polyester resin, urethane resin, BMC (Bulk Molding Compound), PPS (Polyphenylene Sulfide), PBT (Polybutylene Terephthalate), and the like.

[0052] (Manufacturing method) Next, the manufacturing method of the mold coil 10 of the present embodiment will be described. The manufacturing method of the mold coil 10 of the present embodiment includes a cover mounting step, a sensor press-fitting step, and a mold step.

[0053] The cover mounting step is a step of mounting the upper cover 2 and the lower cover 3 on the coil 1. First, the first lower cover 31, which is one of the two divided lower covers 3, is mounted on the coil 1. Then, the other second lower cover 32 is fitted to the first lower cover 31 so as to be movable in the winding axis direction. After that, the upper cover 2 is mounted at a predetermined position on the upper surface of the coil 1.

[0054] After going through the cover mounting step, the process proceeds to the sensor press-fitting step. The sensor press-fitting step is a step of inserting the detection unit 41 into the hole 24 and housing the detection unit 41 in the support portion 251. The user inserts the detection unit 41 into the hole 24 from the opposite surface of the surface of the detection unit 41 that is connected to the lead wire 42 (hereinafter sometimes referred to as the "tip surface"). Since the size of the hole 24 is the same as or slightly smaller than that of the detection unit 41, the detection unit 41 is inserted into the hole 24 by press-fitting. Even if the size of the hole 24 is the same as that of the detection unit 41, since the protrusion 411 is formed on the detection unit 41, it still has to be press-fitted.

[0055] After inserting the detection unit 41 into the hole 24, the detection unit 41 is further pushed in. At this time, the detection unit 41 is guided by the pair of guides 252 of the support portion 251. When the pushing of the detection unit 41 continues, the tip surface of the detection unit 41 abuts against the tip contact portion 253 of the support portion 251. Taking this as a signal, the user ends the pushing. In this state, the tip surface of the detection unit 41 abuts against the tip contact portion 253. Also, the pair of narrow surfaces of the detection unit 41 are respectively in contact with the guides 252. In particular, since the hole 24 is slightly smaller than the detection unit 41, the contact surface 241 is in contact with the detection unit 41 in a closely attached state.

[0056] Also, immediately before or simultaneously with the tip surface of the detection unit 41 abutting against the tip contact portion 253 of the support portion 251, the protrusion 411 formed on the wide surface of the detection unit 41 overrides the inner peripheral surface (contact surface 241) of the hole 24 by snap fit, and at least a part of the protrusion 411 enters into the notch 242. Thereby, even if an attempt is made to pull out the detection unit 41 from the hole 24, the protrusion 411 interferes with the protrusion interference portion 243.

[0057] After the sensor press-fitting process, the process proceeds to the molding process. The molding process is a process of injecting resin into a mold that houses the coil 1 and curing the injected resin. First, the coil 1 is placed on the lower mold. Then, the upper mold is covered from above the upper surface of the coil 1 and fitted to the lower mold. In this state, in order to compress the coil 1 in the winding axis direction, the annular surface protection portion 34 may be pressed by a pressing member.

[0058] Then, the resin that constitutes the coil mold resin 5 is injected into the mold from the gate (the location where the injection mark G is formed). The resin is injected from above downward. The resin injected into the mold is filled from below upward, covers the plate-like portion 25, and covers the detection portion 41 of the sensor 4 housed in the support portion 251. Further, the liquid level of the resin rises and reaches below the hole 24.

[0059] However, since the contact surface 241 between the detection portion 41 of the sensor 4 and the hole 24 is in contact, the resin is prevented from flowing into the hole 24. Therefore, the resin is prevented from flowing into the lead wire housing portion 23, and the lead wire is prevented from being agitated by the resin. Also, it prevents the coating portion of the lead wire 42 from melting due to the heat of the resin. When the injection of the resin is completed and the resin cures, the coil mold resin 5 is formed. By going through the molding process, a molded coil 10 in which the lead wire 42 of the sensor 4 is not covered with the coil mold resin 5 is produced.

[0060] Then, the reactor 9 is produced by going through an assembly process of assembling the core 6 to this molded coil 10. In the assembly process, as in this embodiment, a molded core obtained by molding the core 6 with the core mold resin 7 may be assembled to the molded coil 10. Also, without producing a molded core, the core 6 may be assembled to the molded coil 10 by molding the molded coil 10 and the core 6.

[0061] (Effect) As described above, the mold coil 10 of the present embodiment includes a coil 1, an upper cover 2 that covers the upper surface of the coil 1, a sensor 4 that detects the physical quantity of the mold coil 10, and a coil mold resin 5 that covers at least a part of each of the coil 1, the upper cover 2, and the sensor 4. The sensor 4 has a detection unit 41 and a lead wire 42 that connects the detection unit 41 and a connector 43. The upper cover 2 has a hole 24 into which the detection unit 41 is inserted. The hole 24 is in contact with the detection unit 41. Only the portion of the detection unit 41 protruding from the hole 24 is covered with the coil mold resin 5, and the lead wire 42 is not covered with the coil mold resin.

[0062] Thus, since the hole 24 and the detection unit 41 are in contact with each other, when molding, it is possible to prevent the resin constituting the coil mold resin 5 from flowing from the hole 24 into the lead wire accommodating portion 23. As a result, it is possible to prevent the lead wire from being blown by the injection pressure or the coating of the lead wire from melting due to the heat of the resin. In addition, a sensor cover for protecting the sensor 4, the sensor 4, its mounting process, and the process of previously covering the sensor with a mold resin are also unnecessary, so the number of parts and the working process can be reduced, the cost can be reduced, and the workability can be improved.

[0063] In particular, when the size of the hole 24 is slightly smaller than that of the detection unit 41, the hole 24 and the detection unit 41 are in closer contact with each other, so that it is possible to more effectively prevent the resin from flowing from the hole 24 into the lead wire accommodating portion 23.

[0064] The hole 24 has a contact surface 241 that contacts the detection unit 41, and the upper cover 2 has a pair of guides 252 that are connected to the contact surface 241 and guide the detection unit 41 inserted from the hole 24. The pair of guides 252 are in contact with the detection unit.

[0065] Thereby, the detection unit 41 inserted into the hole 24 is inserted between the coils 1 along the guides 252, so that the detection unit 41 is accurately arranged at a predetermined position. Therefore, the physical quantity of the mold coil 10, that is, the temperature of the coil 1 in the present embodiment, can be detected more accurately by the detection unit 41.

[0066] Further, the detection unit 41 of the portion protruding from the hole 24 (the portion accommodated in the support portion 251) is affected by the injection pressure of the resin during the mold forming. However, since the pair of guides 252 and the detection unit 41 are in contact, the contact area increases compared to the case where only the contact surface 241 of the hole 24 is in contact. Therefore, it is possible to further suppress the detection unit 41 from moving due to the injection pressure.

[0067] The upper cover 2 has a tip contact portion 253 provided between the pair of guides 252, and the tip contact portion 253 is in contact with the tip surface of the detection unit 41 inserted from the hole 24. Thereby, when the detection unit 41 comes into contact with the tip contact portion 253, it serves as a signal of the completion of the insertion. Therefore, the user can easily perform the insertion operation of the detection unit 41.

[0068] Also, during the mold forming, the resin is gradually filled from the lower mold toward the upper mold. At this time, if the tip surface of the detection unit 41 is exposed, there is a risk that the tip surface of the detection unit 41 is pushed up and the detection unit 41 moves in a direction to come out of the hole 24. However, as in this embodiment, by providing the tip contact portion 253 and bringing the tip contact portion 253 into contact with the tip surface of the detection unit 41, it is possible to suppress the resin from hitting the tip surface of the detection unit 41, and it is possible to suppress a force from acting on the detection unit 41 in the upward pushing direction during the mold forming. Therefore, it is possible to prevent the detection unit 41 from coming out of the hole 24. Further, since the position of the detection unit 41 is regulated, the detection unit 41 can be arranged at a predetermined position.

[0069] The detection unit 41 has a protrusion 411, and a notch 242 is provided in the contact surface 241 of the hole 24. At least a part of the protrusion 411 is accommodated inside the notch 242. That is, the protrusion 411 of the detection unit 41 interferes with the protrusion interference portion 243 that constitutes the notch 242. Therefore, even if the detection unit 41 moves due to the mold forming, since the protrusion 411 interferes with the protrusion interference portion 243, further movement is prevented. As a result, it is possible to more effectively prevent the detection unit 41 from coming out of the hole 24.

[0070] In particular, in the state where the detection unit 41 is inserted into the support unit 251, the protrusion interference part 243 always has the protrusion 411 in contact with the protrusion interference part 243. In this case, the position of the detection unit 41 is restricted, and it is possible to prevent the detection unit 41 from moving during the mold forming. The temperature can be measured at a desired position with respect to the coil 1, and the temperature can be detected with higher accuracy.

[0071] (Other embodiments) In this specification, embodiments of the present invention have been described, but these embodiments are presented as examples and are not intended to limit the scope of the invention. The above-described embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. The embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and its equivalent scope.

[0072] In the above embodiment, the sensor press-fitting step is performed after the cover mounting step, but the sensor press-fitting step may be performed first. That is, before mounting the upper cover 2 on the coil 1, the detection unit 41 is press-fitted into the hole 24, and the detection unit 41 is supported by the support unit 251. Then, the upper cover 2 in which the detection unit 41 and the contact surface 241 are in close contact by press-fitting may be mounted on the coil 1.

[0073] In the above embodiment, the pair of guides 252 extend obliquely and the support unit 251 is formed obliquely, but the present invention is not limited thereto. For example, the guide 252 may extend along the vertical direction. In this case, the notch 242 may not be provided. Since the detection unit 41 is vertically arranged, the protrusion 411 can be hooked on the lower surface forming the hole 24 without providing the notch 242. That is, the lower surface forming the hole 24 becomes the protrusion interference part 243. When the notch 242 is provided, the shape of the notch 242 may be a rectangular shape instead of a triangular shape.

Explanation of reference numerals

[0074] 10 Mold coil 1 Coil 11 Connecting wire 2 Upper cover 21 Upper surface covering part 211 Upper mold contact part 22 Connecting part 23 Lead wire housing part 231 Lead wire placement part 232 Side wall 24 Hole 241 Contact surface 242 Notch 243 Protrusion interference part 244 Tapered surface 25 Plate-like part 251 Support part 252 Guide 253 Tip contact part 3 Lower cover 31 First lower cover 32 Second lower cover 33 Lower mold contact part 34 Annular surface protection part 4 Sensor 41 Detection part 411 Protrusion 42 Lead wire 43 Connector 5 Coil molded resin 6 Core 61 Leg part 62 Yoke part 63, 64 U-shaped core members 7 Core molded resin 8 Bus bar 9 Reactor G Injection mark

Claims

1. A coil, a cover covering the upper surface of the coil, a sensor for detecting a physical quantity of the molded coil, a coil molding resin covering at least a part of each of the coil, the cover, and the sensor, comprising: The sensor has a detection part, a connector to which a terminal of an external device is connected, and a lead wire connecting the detection part and the connector, and has: The cover has a hole into which the detection part is inserted, The hole is in contact with the detection part, The lead wire is not covered by the coil molding resin, A molded coil characterized by the above.

2. The hole has a contact surface that contacts the detection part, The cover has a guide that is connected to the contact surface, extends toward the lower surface of the coil, and guides the detection part inserted into the hole, A pair of the guides are provided, The pair of guides are arranged opposite to each other and are in contact with the detection part, The molded coil according to claim 1, characterized by the above.

3. The cover has a tip contact part provided between the pair of guides, The tip contact part is in contact with the detection part inserted from the hole, The molded coil according to claim 2, characterized by the above.

4. The detection part has a protrusion, The hole has a contact surface that contacts the detection part, A notch is provided in the contact surface, At least a part of the protrusion is accommodated inside the notch, The molded coil according to claim 1, characterized by the above.

5. A reactor comprising the molded coil according to any one of claims 1 to 4 and a core containing a magnetic material and on which the molded coil is mounted. characterized by the above.

6. A cover mounting step of mounting a cover on the coil, After the cover mounting step, a sensor press-fitting step of press-fitting a detection part of the sensor into a hole of the cover, After the sensor press-fitting step, a molding step of covering at least a part of each of the coil, the cover, and the detection part with a coil molding resin by molding, including: The lead wire of the sensor is not covered by the coil molding resin, A method for manufacturing a molded coil, characterized by the above.

7. The hole has a contact surface that contacts the detection part, The cover has a guide that is connected to the contact surface, extends toward the lower surface of the coil, and guides the detection part inserted into the hole, A pair of the guides are provided, The pair of guides are arranged opposite to each other and are in contact with the detection unit. The method for manufacturing a mold coil according to claim 6, characterized in that.

8. The cover has a tip contact portion provided between the pair of guides. The tip contact portion is in contact with the detection unit inserted through the hole. The method for manufacturing a mold coil according to claim 7, characterized in that.

9. The detection unit has a protrusion. The hole has a contact surface that contacts the detection unit. A notch is provided in the contact surface. At least a part of the protrusion is accommodated inside the notch. The method for manufacturing a mold coil according to claim 6, characterized in that.

10. Including an assembling step of assembling a core to the mold coil according to any one of claims 6 to 9. The method for manufacturing a reactor, characterized in that.

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