Substrate processing apparatus and substrate processing method

Abstract

To provide a technology capable of reducing the difference in thermal history between substrates.SOLUTION: A substrate processing apparatus according to an embodiment of the present disclosure includes a first processing chamber that performs first processing all at once on multiple substrates held on a shelf-like manner on a substrate holder, a load lock chamber located below the first processing chamber and whose interior is connected to the first processing chamber, and a drive mechanism that moves the substrate holder up and down and horizontally.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus and a substrate processing method.

Background Art

[0002] An apparatus is known that carries a substrate holder on which a plurality of substrates are mounted into a processing chamber and performs processing on the plurality of substrates collectively (see, for example, Patent Document 1). The substrate holder is carried into the processing chamber by, for example, a boat elevator.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technique capable of reducing the difference in thermal history between substrates.

Means for Solving the Problems

[0005] A substrate processing apparatus according to an aspect of the present disclosure includes a first processing chamber that collectively performs a first process on a plurality of substrates held in a shelf shape on a substrate holder, a load lock chamber located below the first processing chamber and having an interior communicating with the interior of the first processing chamber, and a drive mechanism that moves the substrate holder up and down and horizontally.

Effects of the Invention

[0006] According to the present disclosure, the difference in thermal history between substrates can be reduced.

Brief Description of the Drawings

[0007]

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Modes for Carrying Out the Invention

[0008] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In all the accompanying drawings, the same or corresponding members or components are denoted by the same or corresponding reference numerals, and redundant descriptions are omitted.

[0009] 〔First Embodiment〕 With reference to FIGS. 1 to 4, a substrate processing apparatus 100 according to the first embodiment will be described. The substrate processing apparatus 100 includes a processing chamber 110, a load lock chamber 120, a dedicated transfer chamber 130, a substrate transfer chamber 160, and a control unit 190.

[0010] The processing chamber 110 can be depressurized inside. The processing chamber 110 can accommodate a substrate holder WB therein. The substrate holder WB holds a plurality of substrates W in a shelf shape. Although five substrates are shown in FIGS. 1 to 4, the number of substrates W is not limited. Inside the processing chamber 110, a plurality of substrates W held by the substrate holder WB are processed collectively. An inlet / outlet 110a for carrying the substrate holder WB in and out is provided at the lower part of the processing chamber 110. A gas nozzle 111, an exhaust device 112, and a heater 113 are provided in the processing chamber 110.

[0011] The gas nozzle 111 is provided around the substrate holder WB located inside the processing chamber 110. The gas nozzle 111 discharges the processing gas from the gas source GS1 toward the substrate holder WB and the substrates W from around the substrate holder WB located inside the processing chamber 110. The processing gas is selected according to the type of processing. The gas nozzle 111 may be one or two or more.

[0012] The exhaust device 112 evacuates the inside of the processing chamber 110 to depressurize the inside of the processing chamber 110. The exhaust device 112 includes, for example, a vacuum pump and a pressure control valve. The exhaust device 112 controls the inside of the processing chamber 110 to a desired pressure by adjusting the opening degree of the pressure control valve while evacuating the inside of the processing chamber 110 with the vacuum pump.

[0013] The heater 113 is provided inside the processing chamber 110. The heater 113 may be provided around the substrate holder WB located inside the processing chamber 110. The heater 113 heats the substrate holder WB and the substrate W to a desired temperature from around the substrate holder WB located inside the processing chamber 110.

[0014] The load lock chamber 120 is located below the processing chamber 110. The load lock chamber 120 can be depressurized inside. The load lock chamber 120 can accommodate the substrate holder WB inside. An inlet / outlet 120a for carrying in and out the substrate holder WB is provided at the upper part of the load lock chamber 120. The inside of the load lock chamber 120 communicates with the inside of the processing chamber 110 via the inlet / outlet 110a and the inlet / outlet 120a. The substrate holder WB is carried into the processing chamber 110 from inside the load lock chamber 120 via the inlet / outlet 110a and the inlet / outlet 120a. The substrate holder WB is carried out from the processing chamber 110 into the load lock chamber 120 via the inlet / outlet 110a and the inlet / outlet 120a. Inside the load lock chamber 120, the loading of the substrate W onto the substrate holder WB and the unloading of the substrate W from the substrate holder WB are performed. An inlet / outlet 120b for carrying in and out the substrate W is provided on the side wall on the negative X-axis side of the load lock chamber 120. The substrate W is carried into the load lock chamber 120 from inside the substrate transfer chamber 160 via the inlet / outlet 120b. The substrate W is carried out from the load lock chamber 120 into the substrate transfer chamber 160 via the inlet / outlet 120b. The load lock chamber 120 is provided with a drive mechanism 121, a shutter 124, and an exhaust device 126.

[0015] The drive mechanism 121 is configured to move the substrate holder WB up and down and horizontally. The drive mechanism 121 is configured to move the substrate holder WB up and down between the inside of the processing chamber 110 and the inside of the load lock chamber 120. The drive mechanism 121 is configured to move the substrate holder WB horizontally inside the load lock chamber 120. The drive mechanism 121 may be configured to move the substrate holder WB horizontally inside the processing chamber 110. The drive mechanism 121 has a support part 122 and an articulated arm 123.

[0016] The support portion 122 supports the substrate holder WB. The support portion 122 includes a lid 122a, a seal member 122b, a rotating shaft 122c, and a support arm 122d. In a state where the substrate holder WB is positioned in the processing chamber 110 (FIG. 4), the lid 122a hermetically seals the carry-in outlet 110a and the carry-in outlet 120a using the seal member 122b. Thereby, the inside of the processing chamber 110 is hermetically sealed. The seal member 122b is, for example, an O-ring. A through hole that penetrates the lid 122a in the vertical direction is provided at the center of the lid 122a. The rotating shaft 122c is inserted into the through hole. The gap between the lid 122a and the rotating shaft 122c is sealed by a magnetic fluid seal. The rotating shaft 122c rotatably supports the substrate holder WB around the vertical axis M11. The support arm 122d is connected to the lower portion of the rotating shaft 122c. The support arm 122d supports the rotating shaft 122c.

[0017] The articulated arm 123 may be a vertical articulated arm. In this case, since torque is always applied to the joint portion, the backlash of the gear is canceled and the positioning accuracy is improved. The base end of the articulated arm 123 is fixed to the side wall on the positive side in the X-axis direction of the load lock chamber 120, and the tip end is connected to the support arm 122d. The articulated arm 123 moves the support portion 122 up and down and horizontally by pivoting about the base end as a pivot center.

[0018] The multi-joint arm 123 moves the substrate holder WB up and down between the processing position and the unloading position by moving the support part 122 up and down. As shown in FIG. 4, the processing position may be a position where the entire substrate holder WB is housed in the processing chamber 110 and the lid 122a airtightly closes the carry-in outlet 110a and the carry-in outlet 120a. As shown in FIG. 3, the unloading position may be a position directly below the processing position, and may be a position where the entire substrate holder WB is housed in the load lock chamber 120 (see the substrate holder WB shown by the solid line in FIG. 3). The multi-joint arm 123 carries the substrate holder WB from the unloading position to the processing position by raising the support part 122. The multi-joint arm 123 unloads the substrate holder WB from the processing position to the unloading position by lowering the support part 122. The multi-joint arm 123 may horizontally move the substrate holder WB inside the processing chamber 110 by horizontally moving the support part 122.

[0019] The multi-joint arm 123 horizontally moves the substrate holder WB between the unloading position and the transfer position by horizontally moving the support part 122. The transfer position is a position where the horizontal position is different from that of the unloading position. As shown in FIGS. 2 and 3, the transfer position may be a position where a part of the substrate holder WB faces the carry-in outlet 120b. The transfer position may include a plurality of positions that are different in the vertical direction. The plurality of positions include a first position and a second position. The first position is a position where most of the substrate holder WB is in the load lock chamber 120 and the upper part of the substrate holder WB is in the dedicated transfer chamber 130 (FIG. 2). The second position is a position where the entire substrate holder WB is in the load lock chamber 120 (see the substrate holder WB shown by the broken line in FIG. 3). The multi-joint arm 123 may move the substrate holder WB up and down between the first position and the second position included in the transfer position by moving the support part 122 up and down.

[0020] The multi-joint arm 123 may include a refrigerant flow path through which refrigerant flows inside. In this case, since the heat of the multi-joint arm 123 can be dissipated even in a vacuum atmosphere, the positioning accuracy can be maintained.

[0021] The multi-joint arm 123 includes a base end portion 123a, a first arm 123b, and a second arm 123c.

[0022] The base end portion 123a is fixed to the side wall on the positive X-axis side of the load lock chamber 120. The first arm 123b is rotatable relative to the base end portion 123a about the rotation axis M12. The second arm 123c is rotatable relative to the first arm 123b about the rotation axis M13 and is also rotatable relative to the support arm 122d about the rotation axis M14. The multi-joint arm 123 moves the substrate holder WB among a plurality of positions including a processing position, an unloading position, and a transfer position by independently rotating the first arm 123b and the second arm 123c.

[0023] The shutter 124 is configured to be horizontally movable along the Y-axis direction between a position closing the carry-in outlet 110a and the carry-in outlet 120a and a position closing the opening 130a. As shown in FIGS. 2 and 3, for example, when the substrate holder WB is outside the processing chamber 110, the shutter 124 moves to a position closing the carry-in outlet 110a and the carry-in outlet 120a to airtightly close the carry-in outlet 110a and the carry-in outlet 120a. As shown in FIG. 4, for example, when the substrate holder WB is inside the processing chamber 110, the shutter 124 moves to a position closing the opening 130a to airtightly close the opening 130a.

[0024] The evacuation device 126 evacuates the inside of the load lock chamber 120 to reduce the pressure inside the load lock chamber 120. The evacuation device 126 includes, for example, a vacuum pump and a pressure control valve. The evacuation device 126 controls the inside of the load lock chamber 120 to a desired pressure by adjusting the opening degree of the pressure control valve while evacuating the inside of the load lock chamber 120 with the vacuum pump.

[0025] The dedicated transfer chamber 130 is located above the load lock chamber 120, and its interior communicates with the inside of the load lock chamber 120. The dedicated transfer chamber 130 is located on the side of the processing chamber 110. The dedicated transfer chamber 130 may be located on the negative side in the Y-axis direction of the processing chamber 110. An opening 130a for passing the substrate holder WB is provided at the lower part of the dedicated transfer chamber 130. The dedicated transfer chamber 130 is configured to be able to accommodate a part of the substrate holder WB inside. For example, as shown in FIG. 2, when the substrate W is carried in or out at the position of the lower part of the substrate holder WB at the transfer position through the carry-in / carry-out port 120b, the dedicated transfer chamber 130 accommodates the upper part of the substrate holder WB. Thereby, it is possible to prevent the substrate holder WB from contacting the ceiling of the load lock chamber 120.

[0026] The substrate transfer chamber 160 is connected to the negative side in the X-axis direction of the load lock chamber 120. The interior of the substrate transfer chamber 160 can be depressurized. A substrate transfer robot 161 is provided in the substrate transfer chamber 160. An exhaust device may be provided in the substrate transfer chamber 160.

[0027] The substrate transfer robot 161 is provided inside the substrate transfer chamber 160. The substrate transfer robot 161 carries the substrate W into the substrate holder WB at the transfer position through the carry-in / carry-out port 120b, and carries out the substrate W held by the substrate holder WB at the transfer position through the carry-in / carry-out port 120b. The substrate transfer robot 161 may include a horizontal articulated arm.

[0028] The control unit 190 may apply a computer having one or more processors 191, a memory 192, an input / output interface (not shown), and an electronic circuit. The processor 191 is a combination of one or more of a CPU, an ASIC, an FPGA, a circuit composed of a plurality of discrete semiconductors, etc. The memory 192 includes a volatile memory and a non-volatile memory (for example, a compact disk, a DVD, a hard disk, a flash memory, etc.), and stores a program for operating the substrate processing apparatus 100 and a recipe such as process conditions of the process. The processor 191 controls each component of the substrate processing apparatus 100 by executing the program and the recipe stored in the memory 192, and performs various processes.

[0029] As described above, according to the first embodiment, the substrate processing apparatus 100 includes a processing chamber 110, a load lock chamber 120, and a drive mechanism 121. The processing chamber 110 performs batch processing on a plurality of substrates W held in a shelf shape by a substrate holder WB. The load lock chamber 120 is located below the processing chamber 110, and its interior communicates with the interior of the processing chamber 110. The drive mechanism 121 moves the substrate holder WB up and down and horizontally. In this case, the substrates W can be loaded onto and unloaded from the substrate holder WB in a state where the entire substrate holder WB is carried out of the processing chamber 110. Therefore, the difference in the thermal history between the substrates W held by the substrate holder WB can be reduced. Also, by horizontally moving the substrate holder WB inside the processing chamber 110, the film thickness distribution of the film applied to the substrate W can be adjusted.

[0030] In the first embodiment, the case where the articulated arm 123 has two arms (the first arm 123b and the second arm 123c) has been described, but the number of arms constituting the articulated arm 123 is not limited to this. The articulated arm 123 may have three or more arms.

[0031] 〔Second Embodiment〕 With reference to FIGS. 5 to 8, the substrate processing apparatus 200 according to the second embodiment will be described. The substrate processing apparatus 200 is different from the substrate processing apparatus 100 in a configuration having a second processing chamber 230 instead of the dedicated transfer chamber 130. Hereinafter, the description will focus on the configuration different from that of the substrate processing apparatus 100.

[0032] The substrate processing apparatus 200 includes a processing chamber 110, a load lock chamber 120, a second processing chamber 230, a substrate transfer chamber 160, and a control unit 190.

[0033] The second processing chamber 230 is located above the load lock chamber 120, and its interior communicates with that of the load lock chamber 120. The second processing chamber 230 is located on the side of the processing chamber 110. The second processing chamber 230 may be located on the negative side in the Y-axis direction of the processing chamber 110. The interior of the second processing chamber 230 can be depressurized. At the lower part of the second processing chamber 230, a loading / unloading port 230a for loading and unloading the substrate holder WB is provided. The second processing chamber 230 is configured to be able to accommodate the entire substrate holder WB therein.

[0034] For example, as shown in FIG. 6, when the substrate W is loaded or unloaded through the loading / unloading port 120b at the position of the lower part of the substrate holder WB at the transfer position, the second processing chamber 230 accommodates the upper part of the substrate holder WB. Thereby, it is possible to prevent the substrate holder WB from contacting the ceiling of the load lock chamber 120.

[0035] In the second processing chamber 230, a plurality of substrates W held by the substrate holder WB are processed collectively. In this case, the entire substrate holder WB is accommodated inside the second processing chamber 230. The processing performed in the second processing chamber 230 may be different from the processing performed in the processing chamber 110. The processing performed in the processing chamber 110 may include a film forming process. The processing performed in the second processing chamber 230 may include an annealing process and a pre-cleaning process.

[0036] The second processing chamber 230 is provided with a heater 233. The second processing chamber 230 may be provided with a gas nozzle, an exhaust device, etc.

[0037] The heater 233 is provided inside the second processing chamber 230. The heater 233 may be provided around the substrate holder WB located inside the second processing chamber 230. The heater 233 heats the substrate holder WB and the substrate W to a desired temperature from around the substrate holder WB located inside the second processing chamber 230.

[0038] The multi-joint arm 123 moves the substrate holder WB up and down between the processing position and the unloading position by moving the support part 122 up and down. As shown in FIG. 8, the processing position may be a position where the entire substrate holder WB is accommodated in the processing chamber 110 and the lid 122a airtightly closes the loading inlet 110a and the loading inlet 120a. As shown in FIG. 7, the unloading position may be a position directly below the processing position, which is a position where the entire substrate holder WB is accommodated in the load lock chamber 120 (refer to the substrate holder WB shown by the solid line in FIG. 7). The multi-joint arm 123 loads the substrate holder WB from the unloading position to the processing position by raising the support part 122. The multi-joint arm 123 unloads the substrate holder WB from the processing position to the unloading position by lowering the support part 122. The multi-joint arm 123 may horizontally move the substrate holder WB inside the processing chamber 110 by horizontally moving the support part 122.

[0039] The multi-joint arm 123 horizontally moves the substrate holder WB between the unloading position and the transfer position by horizontally moving the support part 122. The transfer position is a position where the horizontal position is different from that of the unloading position. As shown in FIGS. 6 and 7, the transfer position may be a position where a part of the substrate holder WB faces the loading inlet 120b. The transfer position may include a plurality of positions different in the vertical direction. The plurality of positions includes a first position and a second position. The first position is a position where most of the substrate holder WB is in the load lock chamber 120 and the upper part of the substrate holder WB is in the dedicated transfer chamber 130 (FIG. 6). The second position is a position where the entire substrate holder WB is in the load lock chamber 120 (refer to the substrate holder WB shown by the broken line in FIG. 7). The multi-joint arm 123 may move the substrate holder WB up and down between the first position and the second position included in the transfer position by moving the support part 122 up and down.

[0040] The multi-joint arm 123 moves the substrate holder WB up and down between the transfer position and the second processing position by moving the support part 122 up and down. The second processing position may be a position directly above the transfer position and a position where the entire substrate holder WB is accommodated in the second processing chamber 230. The multi-joint arm 123 carries the substrate holder WB from the transfer position to the second processing position by raising the support part 122. The multi-joint arm 123 unloads the substrate holder WB from the second processing position to the transfer position by lowering the support part 122. The multi-joint arm 123 may horizontally move the substrate holder WB inside the second processing chamber 230 by horizontally moving the support part 122.

[0041] The shutter 124 is configured to be horizontally movable along the Y-axis direction between a position closing the carry-in outlets 110a and 120a and a position closing the carry-in outlet 230a. As shown in FIGS. 6 and 7, for example, when the substrate holder WB is outside the processing chamber 110, the shutter 124 moves to a position closing the carry-in outlets 110a and 120a and hermetically closes the carry-in outlets 110a and 120a using the seal member 125. As shown in FIG. 8, for example, when the substrate holder WB is inside the processing chamber 110, the shutter 124 moves to a position closing the carry-in outlet 230a and hermetically closes the carry-in outlet 230a using the seal member 125. The seal member 125 is, for example, an O-ring.

[0042] As described above, according to the second embodiment, the substrate processing apparatus 200 includes the processing chamber 110, the load lock chamber 120, and the drive mechanism 121. The processing chamber 110 collectively processes a plurality of substrates W held in a shelf shape on the substrate holder WB. The load lock chamber 120 is located below the processing chamber 110 and its interior communicates with the inside of the processing chamber 110. The drive mechanism 121 moves the substrate holder WB up and down and horizontally. In this case, the same effects as those of the first embodiment can be obtained.

[0043] According to the second embodiment, the substrate processing apparatus 200 includes the second processing chamber 230. In this case, different processes can be performed on each substrate W without replacing the substrate W held on the substrate holder WB.

[0044] 〔Third Embodiment〕 Referring to FIG. 9, the substrate processing apparatus 300 according to the third embodiment will be described. The substrate processing apparatus 300 is different from the substrate processing apparatus 100 in a configuration including a drive mechanism 321 having a lifting drive mechanism 323 and a horizontal drive mechanism 324 instead of the drive mechanism 121 having the articulated arm 123. Hereinafter, the description will focus on the configuration different from that of the substrate processing apparatus 100.

[0045] The drive mechanism 321 includes a support portion 122, a lifting drive mechanism 323, and a horizontal drive mechanism 324.

[0046] The lifting drive mechanism 323 includes a guide rail 323a and a support arm 323b. The guide rail 323a has a lower end fixed to the bottom wall of the load lock chamber 120 and extends along the vertical direction. The support arm 323b moves up and down along the guide rail 323a. The lifting drive mechanism 323 may include a boat elevator.

[0047] The horizontal drive mechanism 324 includes a guide rail 324a and a support portion 324b. The guide rail 324a is fixed to the support arm 323b and extends along the Y-axis direction. The support portion 324b moves horizontally in the Y-axis direction along the guide rail 324a. The support portion 324b supports the support portion 122. The horizontal drive mechanism 324 may include a ball screw.

[0048] The drive mechanism 321 moves the substrate holder WB among a plurality of positions including a processing position, an unloading position, and a transfer position by moving the horizontal drive mechanism 324 up and down by the lifting drive mechanism 323 and moving the support portion 122 horizontally by the horizontal drive mechanism 324.

[0049] As described above, according to the third embodiment, the substrate processing apparatus 300 includes a processing chamber 110, a load lock chamber 120, and a drive mechanism 321. The processing chamber 110 performs batch processing on a plurality of substrates W held in a shelf shape by a substrate holder WB. The load lock chamber 120 is located below the processing chamber 110, and its interior communicates with the interior of the processing chamber 110. The drive mechanism 321 moves the substrate holder WB up and down and horizontally. In this case, the same effects as those of the first embodiment can be obtained.

[0050] 〔Fourth Embodiment〕 Referring to FIGS. 10 to 15, the substrate processing apparatus 400 according to the fourth embodiment will be described. FIG. 10 is a side view showing the substrate processing apparatus 400 according to the fourth embodiment. FIGS. 11 to 13 are longitudinal sectional views showing the substrate processing apparatus 400 according to the fourth embodiment. FIGS. 14 and 15 are cross-sectional views showing the substrate processing apparatus 400 according to the fourth embodiment. FIG. 10 corresponds to a side view taken along the line A-A in FIG. 14. FIGS. 11 and 12 correspond to cross-sectional views taken along the line B-B in FIG. 14. FIG. 13 corresponds to a cross-sectional view taken along the line C-C in FIG. 15.

[0051] The substrate processing apparatus 400 includes a processing chamber 410 and a load lock chamber 420.

[0052] The processing chamber 410 is provided with a reaction tube 411, a gas nozzle 412, and an exhaust pipe 413.

[0053] The reaction tube 411 can be depressurized inside. The reaction tube 411 can accommodate a substrate holder WB inside. The substrate holder WB holds a plurality of substrates W in a shelf shape. Inside the reaction tube 411, batch processing is performed on the plurality of substrates W held by the substrate holder WB. A carry-in / outlet 411a for carrying the substrate holder WB in and out is provided at the lower part of the reaction tube 411.

[0054] The gas nozzle 412 discharges a processing gas into the reaction tube 411. The processing gas is selected according to the type of processing. The gas nozzle 412 may be one or two or more.

[0055] The exhaust pipe 413 has one end connected to the reaction tube 411 and the other end connected to a vacuum pump (not shown). The vacuum pump evacuates the inside of the reaction tube 411 through the exhaust pipe 413 to reduce the pressure inside the reaction tube 411. A valve 414 is provided in the exhaust pipe 413. The valve 414 controls the exhaust conductance by adjusting the opening degree.

[0056] The load lock chamber 420 is located below the processing chamber 410. The load lock chamber 420 can be depressurized inside. The load lock chamber 420 can accommodate a substrate holder WB inside. An inlet / outlet 420a for carrying the substrate holder WB in and out is provided at the upper part of the load lock chamber 420. The inside of the load lock chamber 420 communicates with the inside of the reaction tube 411 through the inlet / outlet 411a and the inlet / outlet 420a. The substrate holder WB is carried into the reaction tube 411 from inside the load lock chamber 420 through the inlet / outlet 411a and the inlet / outlet 420a. The substrate holder WB is carried out of the reaction tube 411 into the load lock chamber 420 through the inlet / outlet 411a and the inlet / outlet 420a. Inside the load lock chamber 420, the substrate W is carried onto the substrate holder WB and carried out from the substrate holder WB. An inlet / outlet 420b for carrying the substrate W in and out is provided on the side wall on the negative X-axis side of the load lock chamber 420. The substrate W is carried into the load lock chamber 420 from inside a substrate transfer chamber (not shown) through the inlet / outlet 420b. The substrate W is carried out of the load lock chamber 420 into the substrate transfer chamber through the inlet / outlet 420b. A drive mechanism 421 is provided in the load lock chamber 420.

[0057] The drive mechanism 421 moves the substrate holder WB up and down and horizontally. The drive mechanism 421 is configured to move the substrate holder WB up and down between the inside of the reaction tube 411 and the inside of the load lock chamber 420. The drive mechanism 421 is configured to move the substrate holder WB horizontally inside the load lock chamber 420. The drive mechanism 421 may be configured to move the substrate holder WB horizontally inside the reaction tube 411.

[0058] The drive mechanism 421 moves the substrate holder WB up and down between the processing position and the unloading position. The processing position may be a position where the entire substrate holder WB is accommodated in the reaction tube 411 as shown in FIG. 11. The unloading position is a position directly below the processing position as shown in FIG. 12, and as shown in FIGS. 12 and 14, the central axis C12 of the substrate holder WB may be shifted to the negative side in the Y-axis direction with respect to the central axis C11 of the processing chamber 410. The unloading position may be a position where the entire substrate holder WB is accommodated in the load lock chamber 420 as shown in FIG. 12.

[0059] The drive mechanism 421 moves the substrate holder WB horizontally between the unloading position and the transfer position. The transfer position is a position where the horizontal position is different from that of the unloading position. The transfer position may be a position shifted to the positive side in the Y-axis direction with respect to the unloading position as shown in FIG. 13. The transfer position may be a position where the central axis C12 of the substrate holder WB coincides with the central axis C11 of the processing chamber 410 as shown in FIGS. 13 and 15.

[0060] As described above, according to the fourth embodiment, the substrate processing apparatus 400 includes a processing chamber 410, a load lock chamber 420, and a drive mechanism 421. The processing chamber 410 performs batch processing on a plurality of substrates W held in a shelf shape on the substrate holder WB. The load lock chamber 420 is located below the processing chamber 410, and its interior communicates with the inside of the processing chamber 410. The drive mechanism 421 moves the substrate holder WB up and down and horizontally. In this case, the same effects as those of the first embodiment can be obtained.

[0061] According to the fourth embodiment, the central axis C12 of the reaction tube 411 can be arranged to be displaced horizontally with respect to the central axis C11 of the processing chamber 410. In this case, the degree of freedom in layout such as the position where the gas nozzle 412 is provided and the position where the exhaust pipe 413 is provided is improved. Further, the degree of freedom in layout of the mounting position when attaching the plasma generation unit to the reaction tube 411 is improved. For example, when the diameter of the exhaust pipe 413 is increased, as shown in FIG. 10, in the Y-axis direction, the exhaust pipe 413 may be attached outside the outer end of the reaction tube 411. In this case, by displacing the central axis C12 of the reaction tube 411 in the negative Y-axis direction with respect to the central axis C11 of the processing chamber 410, the reaction tube 411 and the exhaust pipe 413 can be arranged without increasing the width of the processing chamber 410 in the Y-axis direction.

[0062] 〔Fifth Embodiment〕 With reference to FIGS. 16 to 19, a substrate processing apparatus 500 according to the fifth embodiment will be described. FIG. 16 is a plan view showing the substrate processing apparatus 500 according to the fifth embodiment. FIG. 17 is a cross-sectional view taken along line II-II of FIG. 16. FIG. 18 is a cross-sectional view taken along line III-III of FIG. 16. FIG. 18(a) shows a case where the first boat 533 is being carried in and out with respect to the processing module 530. FIG. 18(b) shows a case where the first processing container 531 is being carried in and out with respect to the processing module 530. FIG. 19 is a cross-sectional view taken along line IV-IV of FIG. 16.

[0063] The substrate processing apparatus 500 includes a transfer module 520, a processing module 530, an exhaust unit 540, and a gas supply unit 550.

[0064] The transfer module 520 is arranged adjacent to the first side wall 530a of the processing module 530. The transfer module 520 transfers the substrate W to the processing module 530. The transfer module 520 includes a load port 521, a stocker 522, and a substrate transfer device 523.

[0065] The load port 521 is arranged on the negative side in the X-axis direction of the transfer module 520. A plurality (for example, two) of load ports 521 are arranged along the Y-axis direction. However, the number of load ports 521 is not particularly limited. A cassette C is placed on the load port 521. The cassette C houses a plurality of (for example, 25) substrates W. The cassette C is loaded and unloaded with respect to the load port 521. The cassette C holds each substrate W horizontally. The cassette C is, for example, a FOUP (Front Opening Unified Pod).

[0066] The stockers 522 are arranged in a plurality (for example, two) along the Z-axis direction on the negative side in the X-axis direction of the transfer module 520. The stockers 522 are arranged in a plurality (for example, two) along the Z-axis direction on the positive side in the X-axis direction of the transfer module 520. A plurality of stockers 522 may be arranged in the Y-axis direction. However, the number of stockers 522 is not particularly limited. The stockers 522 temporarily store the cassettes C.

[0067] The substrate transfer device 523 transfers the substrate W between the cassette C placed on the load port 521, the first port 533, and the second port 534. The substrate transfer device 523, for example, transfers a plurality of substrates W simultaneously. For example, the substrate transfer device 523 takes out the substrate W before being processed from the cassette C placed on the load port 521 and transfers it to the first port 533 and the second port 534. For example, the substrate transfer device 523 takes out the substrate W after being processed from the first port 533 and the second port 534 and transfers it to the cassette C placed on the load port 521.

[0068] The transfer module 520 may have a cassette transfer device that transfers the cassette C between the load port 521 and the stockers 522. The transfer module 520 may have a loader for delivering substrates between the substrate transfer device 523 separately from the load port 521.

[0069] The processing module 530 includes a processing chamber A1 and a load lock chamber A2. The processing chamber A1 and the load lock chamber A2 are adjacent in the Z-axis direction. The load lock chamber A2 is located on the negative side of the processing chamber A1 in the Z-axis direction. The processing module 530 has a first side wall 530a and a second side wall 530b. The first side wall 530a is located on the negative side of the processing module 530 in the X-axis direction. The second side wall 530b is located on the positive side of the processing module 530 in the X-axis direction. The first side wall 530a and the second side wall 530b are separated in the X-axis direction. The first side wall 530a and the second side wall 530b each extend from the negative end to the positive end of the processing module 530 in the Y-axis direction. The first side wall 530a and the second side wall 530b each extend from the lower end of the load lock chamber A2 to the upper end of the processing chamber A1.

[0070] The processing module 530 includes a first processing container 531, a second processing container 532, a first boat 533, a second boat 534, a first drive mechanism 535, a second drive mechanism 536, a maintenance door 537, and a clean unit 538.

[0071] The first processing container 531 and the second processing container 532 are arranged in the processing chamber A1. The first processing container 531 and the second processing container 532 are arranged between the first side wall 530a and the second side wall 530b in the X-axis direction. The first processing container 531 and the second processing container 532 are arranged adjacent to each other in the Y-axis direction.

[0072] The first processing container 531 is heated by a heater (not shown). The first processing container 531 is configured to accommodate the first boat 533 holding the substrate W. Inside the first processing container 531, a processing gas is supplied from the gas supply unit 550. The processing gas is selected according to the type of processing. The processing gas supplied into the first processing container 531 is discharged by the exhaust unit 540. Inside the first processing container 531, a desired process is performed on the substrate W held by the first boat 533 by the processing gas supplied from the gas supply unit 550. The second processing container 532 may have the same configuration as the first processing container 531.

[0073] The first boat 533 holds a plurality of substrates W in a shelf shape along the Z-axis direction. The first boat 533 is movable between a delivery position (the position shown in FIG. 17), a processing position, and a loading / unloading position (the position shown in FIG. 18(a)). The delivery position is a position on the negative Z-axis side of the processing module 530 and at the center in the Y-axis direction of the processing module 530 (refer to the first boat 533 shown by the dashed line in FIG. 16). The processing position is a position accommodated in the first processing container 531 and is a position above the delivery position. The loading / unloading position is a position on the negative Z-axis side of the processing module 530 and at the center in the Y-axis direction of the processing module 530. The loading / unloading position may be shifted to the positive X-axis side from the delivery position. In this case, it is easy to load / unload the first boat 533 with respect to the processing module 530.

[0074] For example, when the first boat 533 delivers the substrate W to / from the substrate transfer device 523, it moves to the delivery position. For example, when the first boat 533 performs a desired process on the substrate W, it moves to the processing position. For example, when the first boat 533 is unloaded from the processing module 530 for maintenance, it moves to the loading / unloading position.

[0075] The second boat 534 holds a plurality of substrates W in a shelf shape along the Z-axis direction. The second boat 534 is movable between a delivery position, a processing position (the positions shown in FIGS. 18(a) and 18(b)), and a loading / unloading position. The delivery position is a position on the negative Z-axis side of the processing module 530 and at the center in the Y-axis direction of the processing module 530 (refer to the second boat 534 indicated by the broken line in FIG. 16). The delivery position may be the same as the delivery position of the first boat 533. In this case, a mechanism for moving the substrate transfer device 523 along the Y-axis direction becomes unnecessary. Therefore, the length of the processing module 530 in the Y-axis direction can be shortened. Also, the stroke of the substrate transfer device 523 can be shortened. Therefore, the transfer time of the substrate W by the substrate transfer device 523 can be shortened. The processing position is a position accommodated in the second processing container 532 and above the delivery position. The loading / unloading position is a position on the negative Z-axis side of the processing module 530 and at the center in the Y-axis direction of the processing module 530. The loading / unloading position may be a position on the positive X-axis side of the processing module 530. In this case, it is easy to load and unload the second boat 534 with respect to the processing module 530. The loading / unloading position of the second boat 534 may be the same position as the loading / unloading position of the first boat 533.

[0076] For example, when the second boat 534 delivers the substrate W to / from the substrate transfer device 523, it moves to the delivery position. For example, when the second boat 534 performs a desired process on the substrate W, it moves to the processing position. For example, when the second boat 534 is carried out of the processing module 530 for maintenance, it moves to the loading / unloading position.

[0077] The first drive mechanism 535 is configured to move the first boat 533 up and down and horizontally. The first drive mechanism 535 is configured to move the first boat 533 at least between the delivery position and the processing position. The first drive mechanism 535 may include a boat elevator. The first drive mechanism 535 may also include an articulated arm. The first drive mechanism 535 may include a lifting drive mechanism for moving the first boat 533 up and down and a horizontal drive mechanism for moving the first boat 533 horizontally. The first drive mechanism 535 may be configured to move the first boat 533 between the delivery position, the processing position, and the loading / unloading position.

[0078] The second drive mechanism 536 is configured to move the second boat 534 up and down and horizontally. The second drive mechanism 536 is configured to move the second boat 534 at least between the delivery position and the processing position. The second drive mechanism 536 may include a boat elevator. The second drive mechanism 536 may also include an articulated arm. The second drive mechanism 536 may include a lifting drive mechanism for moving the second boat 534 up and down and a horizontal drive mechanism for moving the second boat 534 horizontally. The second drive mechanism 536 may be configured to move the second boat 534 between the delivery position, the processing position, and the loading / unloading position.

[0079] A maintenance opening 530c is provided in the second sidewall 530b. The maintenance opening 530c is provided on the negative side in the Z-axis direction of the second sidewall 530b. The maintenance opening 530c is provided at the same height position as the load lock chamber A2. The maintenance opening 530c is provided including an intermediate position between the first processing container 531 and the second processing container 532 in the Y-axis direction. The maintenance opening 530c is provided between the first exhaust box 541a and the second exhaust box 542a in the Y-axis direction. The maintenance opening 530c is an opening for maintaining the processing module 530. The maintenance opening 530c is a common opening used when loading and unloading the first processing container 531, the second processing container 532, the first boat 533, and the second boat 534 with respect to the processing module 530. For this reason, the maintenance opening 530c has a size through which the first processing container 531, the second processing container 532, the first boat 533, and the second boat 534 can pass.

[0080] For example, the maintenance opening 530c is used when carrying out the first processing container 531 from the inside of the processing module 530 for replacement due to damage of the first processing container 531 or for cleaning of the first processing container 531. For example, the maintenance opening 530c is used when carrying out the second processing container 532 from the inside of the processing module 530 for replacement due to damage of the second processing container 532 or for cleaning of the second processing container 532. For example, the maintenance opening 530c is used when carrying out the first boat 533 (the second boat 534) from the inside of the processing module 530 for replacement due to damage of the first boat 533 (the second boat 534) or for cleaning of the first boat 533 (the second boat 534).

[0081] The maintenance door 537 opens and closes the maintenance opening 530c by rotating horizontally. The maintenance door 537 has a hinge 537a and a door body 537b. The hinge 537a connects the second side wall 530b and the door body 537b. The hinge 537a is provided, for example, on the negative side in the Y-axis direction. The door body 537b may be horizontally rotatable with respect to the second side wall 530b via the hinge 537a. When the door body 537b is opened, the first processing container 531, the second processing container 532, the first boat 533, and the second boat 534 can be carried in and out through the maintenance opening 530c. In FIG. 16, the door body 537b in the open state is shown by a solid line, the door body 537b in the closed state is shown by a dashed line, and the locus of the tip of the door body 537b when the door body 537b is opened and closed is shown by a dotted line.

[0082] The clean unit 538 is attached to the door body 537b. The clean unit 538 is configured to circulate clean air in the load lock chamber A2. The clean air is, for example, an inert gas. The clean air supplied into the load lock chamber A2 is exhausted from the load lock chamber A2 by an exhaust portion (not shown) provided on the first side wall 530a facing the clean unit 538, and is re-supplied into the load lock chamber A2 from the clean unit 538.

[0083] The exhaust unit 540 has a first exhaust box 541a, a first exhaust pipe 541b, a first pressure control valve 541c, a second exhaust box 542a, a second exhaust pipe 542b, and a second pressure control valve 542c.

[0084] The first exhaust box 541a is arranged adjacent to the second side wall 530b on the positive side in the Y-axis direction of the processing module 530. The first exhaust pipe 541b connects the exhaust port 531a of the first processing container 531 and a vacuum pump (not shown). A portion between one end and the other end of the first exhaust pipe 541b is accommodated inside the first exhaust box 541a. The first pressure control valve 541c is provided inside the first exhaust box 541a. The first pressure control valve 541c is interposed in the middle of the first exhaust pipe 541b. The first pressure control valve 541c controls the pressure inside the first processing container 531 to a desired pressure.

[0085] The second exhaust box 542a is arranged adjacent to the second side wall 530b on the negative side in the Y-axis direction of the processing module 530. The second exhaust box 542a is arranged at an interval in the Y-axis direction with respect to the first exhaust box 541a. The first exhaust box 541a and the second exhaust box 542a may be arranged to be line-symmetrical with respect to a virtual line L that is equidistant from the centers of the first processing container 531 and the second processing container 532. The region between the first exhaust box 541a and the second exhaust box 542a becomes a maintenance region where the maintenance opening 530c is exposed. The second exhaust pipe 542b connects the exhaust port 532a of the second processing container 532 and a vacuum pump (not shown). A portion between one end and the other end of the second exhaust pipe 542b is accommodated inside the second exhaust box 542a. The second pressure control valve 542c is provided inside the second exhaust box 542a. The second pressure control valve 542c is interposed in the middle of the second exhaust pipe 542b. The second pressure control valve 542c controls the pressure inside the second processing container 532 to a desired pressure.

[0086] The gas supply unit 550 includes a first supply box 551a, a first supply unit 551b, first supply pipes 551c and 551d, and first supply valves 551e and 551f.

[0087] The first supply box 551a is arranged adjacent to the positive X-axis side of the first exhaust box 541a. The first supply unit 551b is housed inside the first supply box 551a. The first supply pipes 551c and 551d connect the first supply unit 551b and a nozzle (not shown) that supplies a processing gas to the inside of the first processing container 531, respectively. A first supply valve 551e is interposed in the first supply pipe 551c. A first supply valve 551f is interposed in the first supply pipe 551d. A mass flow controller (not shown) may be interposed in the first supply pipe 551c and the first supply pipe 551d. The first supply unit 551b supplies a processing gas to the inside of the first processing container 531 via the first supply pipes 551c and 551d.

[0088] The gas supply unit 550 includes a second supply box 552a, a second supply unit (not shown), a second supply pipe (not shown), and a second supply valve (not shown).

[0089] The second supply box 552a is arranged adjacent to the positive X-axis side of the second exhaust box 542a. The second supply unit, the second supply pipe, and the second supply valve may have the same configuration as the first supply unit 551b, the first supply pipes 551c and 551d, and the first supply valves 551e and 551f.

[0090] As described above, according to the fifth embodiment, the substrate processing apparatus 500 includes a processing chamber A1, a load lock chamber A2, a first drive mechanism 535, and a second drive mechanism 536. In the processing chamber A1, a first processing container 531 and a second processing container 532 are arranged. In the first processing container 531, a plurality of substrates W held in a shelf shape on the first boat 533 are processed collectively. In the second processing container 532, a plurality of substrates W held in a shelf shape on the second boat 534 are processed collectively. The load lock chamber A2 is located below the processing chamber A1 and its interior communicates with the processing chamber A1. The first drive mechanism 535 moves the first boat 533 up and down and horizontally. The second drive mechanism 536 moves the second boat 534 up and down and horizontally. In this case, the same effects as those of the first embodiment can be obtained.

[0091] According to the fifth embodiment, the first boat 533 and the second boat 534 can be moved to the same delivery position by the first drive mechanism 535 and the second drive mechanism 536. In this case, a mechanism for moving the substrate transfer device 523 along the Y-axis direction becomes unnecessary. Therefore, the length of the processing module 530 in the Y-axis direction can be shortened. Also, the stroke of the substrate transfer device 523 can be shortened. Therefore, the transfer time of the substrate W by the substrate transfer device 523 can be shortened.

[0092] The embodiments disclosed this time should be considered as illustrative in all respects and not restrictive. The above embodiments may be omitted, replaced, or changed in various forms without departing from the scope and spirit of the appended claims.

Description of Reference Numerals

[0093] 100, 200, 300, 400, 500 Substrate processing apparatus 110, 410, A1 Processing chamber 120, 420, A2 Load lock chamber 121, 321, 421 Drive mechanism 535 First drive mechanism 536 Second drive mechanism W Substrate WB Substrate holder

Claims

1. A first processing chamber for collectively performing a first process on a plurality of substrates held in a shelf shape by a substrate holder; A load lock chamber located below the first processing chamber and having an interior communicating with the interior of the first processing chamber; A drive mechanism for moving the substrate holder up and down and horizontally; A substrate processing apparatus comprising the above.

2. The drive mechanism is configured to move the substrate holder up and down between the first processing chamber and the load lock chamber, The substrate processing apparatus according to Claim 1.

3. The drive mechanism is configured to move the substrate holder horizontally inside the load lock chamber, The substrate processing apparatus according to Claim 1.

4. The drive mechanism is configured to move the substrate holder horizontally inside the first processing chamber, The substrate processing apparatus according to Claim 1.

5. The load lock chamber can be depressurized, The substrate processing apparatus according to Claim 1.

6. The drive mechanism is configured to move the substrate holder between a processing position where the first process is performed and a transfer position where the substrates are loaded or unloaded with respect to the substrate holder, The horizontal positions of the processing position and the transfer position are different, The substrate processing apparatus according to Claim 1.

7. The drive mechanism includes an articulated arm for moving the substrate holder up and down and horizontally, The substrate processing apparatus according to Claim 1.

8. The drive mechanism, An elevating drive mechanism for moving the substrate holder up and down, A horizontal drive mechanism for moving the substrate holder horizontally, The substrate processing apparatus according to Claim 1 including the above.

9. A second processing chamber is provided above the load lock chamber and on the side of the first processing chamber, and has an interior communicating with the interior of the load lock chamber, The second processing chamber is configured to be able to accommodate at least a part of the substrate holder, The substrate processing apparatus according to any one of Claims 1 to 8.

10. The second processing chamber is configured to be able to accommodate a part of the substrate holder, The substrate processing apparatus according to Claim 9.

11. The second processing chamber is configured to be able to accommodate the entire substrate holder, The substrate processing apparatus according to Claim 9.

12. Moving a substrate holder holding a plurality of substrates in a shelf shape to a processing position; Collectively performing a process on the plurality of substrates held by the substrate holder at the processing position; After the process, moving the substrate holder to an unloading position directly below the processing position; Moving the substrate holder at the unloading position to a transfer position shifted horizontally with respect to the unloading position; Removing the plurality of substrates held by the substrate holder at the transfer position from the substrate holder; A substrate processing method comprising the above steps.

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