Multilayer type electronic component

Abstract

To provide a multilayer type electronic component in which the bending strength is excellent and the electric characteristic is excellent.SOLUTION: The multilayer type electronic component includes: a main body 110 including a dielectric layer and a plurality of internal electrodes 121 and 122 alternately disposed in a first direction and having first and second surfaces facing each other in the first direction, third and fourth surfaces coupled with the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces coupled with the first to fourth surfaces and facing each other in a third direction; and external electrodes disposed on the third and fourth surfaces. At least one of the internal electrodes has a main part 121a disposed at a central part of the main body in the second direction, a lead part 121b extending from the main part in the second direction, having a first end part 21a in contact with the external electrode, and separated from the fifth and sixth surfaces, and an extension part 121c extending from the main part in a direction opposite to the lead part, separated from the external electrode, and having a second end part 21b facing the first end part. When widths of the main part, the first end part, and the second end part in the third direction are W1, W2, and W3, respectively, W2>W3>W1 is satisfied.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-shaped capacitor that is mounted on a printed circuit board of various electronic products such as video devices like liquid crystal display (LCD) and plasma display panel (PDP), computers, smartphones, and mobile phones, and serves to charge or discharge electricity. Such a multilayer ceramic capacitor can be used as a component of various electronic devices due to its advantages of being small in size while ensuring high capacitance and being easy to mount.

[0003] On the other hand, when the printed circuit board on which the multilayer ceramic capacitor is mounted is deformed or vibrated, bending cracks may occur in the multilayer ceramic capacitor. Cracks generated in the multilayer ceramic capacitor may cause a decrease in insulation resistance due to external moisture or a short circuit of the internal electrodes, etc., which may reduce the electrical characteristics and reliability of the multilayer ceramic capacitor. Therefore, there is a situation where the development of a multilayer ceramic capacitor with excellent bending strength characteristics is required.

Summary of the Invention

Problems to be Solved by the Invention

[0004] One of the various objects of the present invention is to provide a multilayer electronic component with excellent bending strength.

[0005] One of the various objects of the present invention is to provide a multilayer electronic component with excellent electrical characteristics.

[0006] However, the object of the present invention is not limited to the above-described content and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Means for Solving the Problems

[0007] One embodiment of the present invention includes a dielectric layer and a plurality of internal electrodes alternately arranged with the dielectric layer in a first direction, a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, a fifth surface and a sixth surface connected from the first surface to the fourth surface and facing each other in a third direction, a main body, and external electrodes disposed on the third surface and the fourth surface. At least one of the plurality of internal electrodes includes a main portion disposed at a central portion of the main body in the second direction, a first end portion extending from the main portion in the second direction and contacting the external electrode, a lead portion spaced apart from the fifth surface and the sixth surface, and an extension portion extending from the main portion in a direction opposite to the lead portion, spaced apart from the external electrode, and having a second end portion facing the first end portion. When the width of the main portion in the third direction is W1, the width of the first end portion in the third direction is W2, and the width of the second end portion in the third direction is W3, a multilayer electronic component satisfying W2>W3>W1 is provided.

[0008] One embodiment of the present invention includes a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction. A main body in which a pair of internal electrodes and floating electrodes spaced apart from each other in the second direction are alternately arranged in the first direction with a dielectric layer therebetween, and a first external electrode and a second external electrode arranged on the third surface and the fourth surface, respectively. The pair of internal electrodes includes a first internal electrode including a first main portion and a first lead portion extending from the first main portion and having a first end portion in contact with the first external electrode, and a second internal electrode including a second main portion and a second lead portion extending from the second main portion and having a second end portion in contact with the second external electrode. The floating electrode includes a third main portion, a first extension portion extending from the third main portion in the direction of the first external electrode and spaced apart from the first external electrode, and a second extension portion extending from the third main portion in the direction of the second external electrode and spaced apart from the second external electrode. The first main portion and the third main portion are arranged at the central portion in the second direction of the main body. When the widths of the first main portion and the second main portion in the third direction are W11', the width of the third main portion in the third direction is W12', the widths of the first end portion and the second end portion in the third direction are W2', and the widths of both end portions of the floating electrode in the second direction in the third direction are W3', a laminated electronic component satisfying W2'>W11' and W3'>W12' is provided.

Advantages of the Invention

[0009] Among various effects of the present invention, a laminated electronic component excellent in bending strength can be provided.

[0010] Among various effects of the present invention, a laminated electronic component excellent in electrical characteristics can be provided.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Mode for Carrying Out the Invention

[0012] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. In addition, the embodiments of the present invention are provided to more fully explain the present invention to ordinary technicians. Therefore, the shape and size of elements in the drawings may be enlarged or reduced (or emphasized or simplified) for clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0013] In order to clearly describe the present invention in the drawings, parts not related to the description are omitted. The sizes and thicknesses of the illustrated components are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited by the illustration. Also, components having the same functions within the scope of the same concept can be described using the same reference numerals. Further, throughout the specification, when a part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0014] In the drawings, the first direction can be defined as the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0015] Multilayer electronic component FIG. 1 is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention, FIG. 2 is a cross-sectional view schematically showing a cut cross-section along the line I-I' of FIG. 1, FIG. 3 is a cross-sectional view schematically showing a cut cross-section along the line II-II' of FIG. 1, FIG. 4 is a cross-sectional view schematically showing a cut cross-section along the line III-III' of FIG. 2, FIG. 5 is a cross-sectional view schematically showing a cut cross-section along the line IV-IV' of FIG. 2, and FIG. 6 is a plan view schematically showing a state in which a first internal electrode and a second internal electrode of a multilayer electronic component according to an embodiment of the present invention overlap.

[0016] Hereinafter, with reference to FIGS. 1 to 6, a multilayer electronic component 100 according to an embodiment of the present invention will be described in detail. Also, a multilayer ceramic capacitor will be described as an example of the multilayer electronic component, but the present invention is not limited thereto and can also be applied to various multilayer electronic components, such as inductors, piezoelectric elements, varistors, or thermistors.

[0017] The size of the multilayer electronic component 100 does not particularly need to be limited. The maximum length of the multilayer electronic component 100 in the second direction can be, for example, 0.6 mm to 3.2 mm. The maximum width of the multilayer electronic component 100 in the third direction can be, for example, 0.3 mm to 1.6 mm.

[0018] Referring to FIGS. 1 to 3, the multilayer electronic component 100 according to an embodiment of the present invention may include a main body 110 including a dielectric layer 111 and internal electrodes 121 and 122, and external electrodes 131 and 132.

[0019] There is no particular limitation on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. By a polishing process for the corner portions of the main body 110 after firing, the main body 110 does not have a perfect straight hexahedron shape, but can have a substantially hexahedron shape.

[0020] The main body 110 can have a first surface 1 and a second surface 2 facing each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the third surface 3 and the fourth surface 4 from the first surface 1 and the second surface 2 and facing each other in the third direction.

[0021] The main body 110 can include a dielectric layer 111 and a plurality of internal electrodes 121 and 122 alternately arranged with the dielectric layer 111 in the first direction. The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated so that it is difficult to confirm without using a scanning electron microscope (SEM).

[0022] The average thickness td of the dielectric layer 111 does not particularly need to be limited. The average thickness td of the dielectric layer 111 can be, for example, 0.1 μm to 20 μm, 0.1 μm to 10 μm, 0.1 μm to 5 μm, 0.1 μm to 2 μm, or 0.1 μm to 0.4 μm.

[0023] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, or a strontium titanate-based material can be used. As an example of the ceramic powder, BaTiO 3 、BaTiO 3 in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved (Ba 1-x Ca x )TiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O 3 (0 < y < 1), etc. can be mentioned. As the organic solvent, ethanol or the like can be used, and as the binder, polyvinyl butyral or the like can be used. The organic solvent and the binder can be known substances used in the art.

[0024] The plurality of internal electrodes 121 and 122 can include, for example, a first internal electrode 121 and a second internal electrode 122 that are alternately arranged with the dielectric layer 111 interposed therebetween. That is, the first internal electrode 121 and the second internal electrode 122, which are a pair of electrodes having different polarities, can be arranged so as to face each other with the dielectric layer 111 interposed therebetween. The first internal electrode 121 and the second internal electrode 122 can be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0025] The first internal electrode 121 is spaced apart from the fourth surface 4 and can be connected to the first external electrode 131 on the third surface 3 side. The second internal electrode 122 is spaced apart from the third surface 3 and can be connected to the second external electrode 132 on the fourth surface 4 side.

[0026] The conductive metal contained in the internal electrodes 121 and 122 can be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and alloys thereof, and more preferably can contain Ni, but the present invention is not limited thereto.

[0027] The average thickness te of the internal electrodes 121 and 122 does not need to be particularly limited. The average thickness te of the internal electrodes 121 and 122 can be, for example, 0.1 μm to 3.0 μm, 0.1 μm to 1.0 μm, or 0.1 μm to 0.4 μm.

[0028] The internal electrodes 121 and 122 can be formed by applying a conductive paste for internal electrodes containing a conductive metal on the above ceramic green sheet with a predetermined thickness and firing. As the printing method of the conductive paste for internal electrodes, a screen printing method, a gravure printing method, or the like can be used, but the present invention is not limited thereto.

[0029] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 respectively represent the average thicknesses of the dielectric layer 111 and the internal electrodes 121 and 122 in the first direction. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be measured by scanning cross-sections in the first and second directions passing through the center in the third direction of the main body 110 with a scanning electron microscope (SEM) at a magnification of 10,000. More specifically, after measuring the thicknesses at a number of points on one dielectric layer 111, for example, 30 points at equal intervals in the second direction, the average thickness td of the dielectric layer 111 can be measured by taking the average value. Also, after measuring the thicknesses at a number of points on one internal electrode 121 or 122, for example, 30 points at equal intervals in the second direction, the average thickness te of the internal electrodes 121 and 122 can be measured by taking the average value. The 30 points at equal intervals can be specified in the capacitance forming portion Ac. On the other hand, after performing such average value measurements for 10 dielectric layers 111 and 10 internal electrodes 121 and 122 respectively and then measuring the average value, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be further generalized.

[0030] The main body 110 can include a capacitance forming portion Ac in which a capacitance is formed, which includes a first internal electrode 121 and a second internal electrode 122 that are arranged alternately with each other with the dielectric layer 111 interposed therebetween inside the main body 110, and a first cover portion 112 and a second cover portion 113 that are respectively arranged on both surfaces facing the first direction of the capacitance forming portion Ac. The cover portions 112 and 113 can basically play a role of preventing damage to the internal electrodes due to physical or chemical stress. The cover portions 112 and 113 can have a configuration similar to that of the dielectric layer 111 except that they do not include internal electrodes.

[0031] The average thickness tc of the cover portions 112 and 113 does not need to be particularly limited. The average thickness tc of the cover portions 112 and 113 can be, for example, 120 μm or less, 100 μm or less, 50 μm or less, or 20 μm or less. Here, the average thickness tc of the cover portions 112 and 113 means the respective average thicknesses of the first cover portion 112 and the second cover portion 113.

[0032] The average thickness tc of the cover portions 112 and 113 can mean the average thickness of the cover portions 112 and 113 in the first direction, and can be a value obtained by averaging the thicknesses in the first direction measured at five equally spaced points in the second direction in the cross-sections in the first and second directions passing through the center in the third direction of the main body 110.

[0033] The cover portions 112 and 113 can be formed by laminating a predetermined number of ceramic green sheets on both sides facing each other in the first direction of the capacitance forming portion Ac, on which the conductive paste for the internal electrodes is not applied, and then firing.

[0034] The main body 110 can include a first margin portion 114 and a second margin portion 115 respectively disposed on both sides facing each other in the third direction of the capacitance forming portion Ac. That is, the margin portions 114 and 115 can mean the regions between the interfaces of both ends of the internal electrodes 121 and 122 and the main body 110 in the cross-section obtained by cutting the main body 110 in the first and third directions.

[0035] The margin portions 114 and 115 can have a configuration similar to that of the dielectric layer 111, except that they do not include the internal electrodes 121 and 122. The margin portions 114 and 115 can basically serve to prevent damage to the internal electrodes 121 and 122 due to physical or chemical stress.

[0036] The average thickness of the margin portions 114 and 115 does not particularly need to be limited. The average thickness of the margin portions 114 and 115 can be 120 μm or less, 100 μm or less, 20 μm or less, or 15 μm or less, but the present invention is not limited thereto. Here, the average thickness tm of the margin portions 114 and 115 means the respective average thicknesses of the first margin portion 114 and the second margin portion 115.

[0037] The average thickness tm of the margin portions 114 and 115 can mean the average width of the margin portions 114 and 115 in the third direction, and can be a value obtained by averaging the widths in the third direction measured at five equally spaced points in the first direction in a cross-section in the first and third directions passing through the center in the second direction of the main body 110.

[0038] The margin portions 114 and 115 can be formed by applying and firing an electrically conductive paste for an internal electrode except where the margin portions are formed on the ceramic green sheet. Alternatively, in order to suppress the step due to the internal electrodes 121 and 122, after cutting so that the internal electrodes 121 and 122 are exposed on the fifth surface 5 and the sixth surface 6 of the main body after lamination, a single dielectric layer or two or more dielectric layers are laminated on both surfaces facing each other in the third direction of the capacitance forming portion Ac to form the margin portions 114 and 115.

[0039] The external electrodes 131 and 132 can be disposed on the third surface 3 and the fourth surface 4 of the main body 110 and can extend onto a part of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. Further, the external electrodes 131 and 132 can include a first external electrode 131 connected to the first internal electrode 121 and a second external electrode 132 connected to the second internal electrode 122. In the drawings, a structure in which the multilayer electronic component 100 has two external electrodes 131 and 132 is described, but the present invention is not limited thereto, and the number, shape, etc. of the external electrodes 131 and 132 can be changed according to the form of the internal electrodes 121 and 122 and other purposes.

[0040] The external electrodes 131 and 132 can include a base electrode layer 131a, 132a in contact with the internal electrodes 121, 122 and a plating layer 131b, 132b disposed on the base electrode layer 131a, 132a. That is, the first external electrode 131 can include a first base electrode layer 131a in contact with the first internal electrode 121 and a first plating layer 131b disposed on the first base electrode layer 131a, and the second external electrode 132 can include a second base electrode layer 132a in contact with the second internal electrode 122 and a second plating layer 132b disposed on the second base electrode layer 132a.

[0041] The base electrode layers 131a, 132a can include metal and glass. The base electrode layers 131a, 132a can be formed by dipping the third surface 3 and the fourth surface 4 of the main body 110 into a conductive paste containing metal powder and glass frit and then firing. The conductive metal contained in the base electrode layers 131a, 132a can include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, and / or an alloy containing these, but the present invention is not limited thereto.

[0042] On the other hand, the base electrode layers 131a, 132a can be composed of only one layer containing metal and glass, but the present invention is not limited thereto, and the base electrode layers 131a, 132a can have a multilayer structure. For example, the base electrode layers 131a, 132a can include a first layer containing metal and glass and a second layer disposed on the first layer and containing metal and resin.

[0043] The metal contained in the second layer is not particularly limited and can include one or more selected from the group consisting of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and alloys thereof. The resin contained in the second layer can include, for example, one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc. The second layer can be formed by applying and drying a conductive resin composition containing metal powder and resin on the first layer and then performing a curing heat treatment.

[0044] The plating layers 131b and 132b can improve the mounting characteristics. The types of the plating layers 131b and 132b are not particularly limited, and can be plating layers including Ni, Sn, Pd, and / or alloys containing these, and can also be formed of multiple layers. The plating layers 131b and 132b can be, for example, Ni plating layers or Sn plating layers, or can be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed. Also, the plating layers 131b and 132b can include multiple Ni plating layers and / or multiple Sn plating layers.

[0045] Hereinafter, with reference to FIGS. 4 to 6, the internal electrodes 121 and 122 of the stacked electronic component 100 according to an embodiment of the present invention will be described in more detail.

[0046] According to an embodiment of the present invention, at least one of the plurality of internal electrodes 121 and 122 can include a main portion 121a, 122a, a lead portion 121b, 122b, and an extension portion 121c, 122c. At least one of the plurality of first internal electrodes 121 can include a first main portion 121a, a first lead portion 121b, and a first extension portion 121c, and at least one of the plurality of second internal electrodes 122 can include a second main portion 122a, a second lead portion 122b, and a second extension portion 122c.

[0047] The main portions 121a and 122a can overlap in the first direction with the main portions of other adjacent internal electrodes among the plurality of internal electrodes 121 and 122. That is, the first main portion 121a can overlap with the second main portion 122a of the adjacent second internal electrode 122 in the first direction. The main portions 121a and 122a can basically serve to form the capacitance of the multilayer electronic component 100. The main portions 121a and 122a can have a rectangular shape perpendicular to the first direction. The main portions 121a and 122a can be arranged spaced apart from the outer surface of the main body 110, and the main portions 121a and 122a can be connected to the external electrodes 131 and 132 via the lead portions 121b and 122b. The main portions 121a and 122a can be arranged at the central portion of the main body 110 in the second direction.

[0048] The lead portions 121b and 122b can have first end portions 21a and 22a that extend from the main portions 121a and 122a in the second direction and contact the external electrodes 131 and 132. That is, the first lead portion 121b can have a first-1 end portion 21a that extends from the first main portion 121a in the second direction and contacts the first external electrode 131. The second lead portion 122b can have a first-2 end portion 22a that extends from the second main portion in the second direction and contacts the second external electrode 132. In order to improve the moisture resistance reliability of the multilayer electronic component 100 by limiting the surfaces where the internal electrodes 121 and 122 and the external electrodes 131 and 132 contact to the third surface 3 and the fourth surface 4 among the first surface 1, the second surface 2, the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 of the main body 110, the lead portions 121b and 122b can preferably be spaced apart from the fifth surface 5 and the sixth surface 6.

[0049] The extension portions 121c and 122c can extend from the main portions 121a and 122a in a direction opposite to the lead portions 121b and 122b and have second end portions 21b and 22b that face the first end portions 21a and 22a while being separated from the external electrodes 132 and 131. That is, the first extension portion 121c can extend from the first main portion 121a in a direction opposite to the first lead portion 121b and be separated from the second external electrode 132, and the second extension portion 122c can extend from the second main portion 122a in a direction opposite to the second lead portion 122b and be separated from the first external electrode 131. The first extension portion 121c can have a second - 1 end portion 21b that faces the first - 1 end portion 21a, and the second extension portion 122c can have a second - 2 end portion 22b that faces the first - 2 end portion 22a.

[0050] According to an embodiment of the present invention, when the widths of the main portions 121a and 122a in the third direction are W1, the widths of the first end portions 21a and 22a in the third direction are W2, and the widths of the second end portions 21b and 22b in the third direction are W3, it is possible to satisfy W2>W3>W1. By satisfying W2>W3>W1, the lead portions 121b and 122b and the extension portions 121c and 122c can effectively disperse the bending stress applied to the main body 110. Also, since the width W2 of the first end portions 21a and 22a in the third direction is larger than the width W1 of the main portions 121a and 122a in the third direction, the remaining organic substances in the dielectric layer 111 can be smoothly discharged during the firing process, the contact area between the internal electrodes 121 and 122 and the external electrodes 131 and 132 can be increased, and the equivalent series resistance (ESR) of the multilayer electronic component 100 can be reduced. Further, by limiting the region where the widths of the margin portions 114 and 115 in the third direction are minimized to the side of the first end portions 21a and 22a, it is possible to prevent the internal electrodes 121 and 122 from being exposed to the fifth surface 5 and the sixth surface 6 side due to process errors. Thereby, it is possible to prevent the moisture resistance reliability of the multilayer electronic component 100 from degrading.

[0051] On the one hand, the above W1 can, for example, represent the average width of the main portions 121a and 122a in the third direction. The above W1 can, for example, represent the value obtained by averaging the widths of the main portions 121a and 122a in the third direction measured at five equally spaced points in the second direction in the cross-section of the main body 110 in the second and third directions.

[0052] The above W1 does not particularly need to be limited. For example, when the width of the main body 110 in the third direction is Wo, the ratio (W1 / Wo) of the above W1 to the above Wo can be 0.4 to 0.8. When W1 / Wo is less than 0.4, there may be a problem that the capacitance of the stacked electronic component 100 excessively decreases. When W1 / Wo exceeds 0.8, the main portions 121a and 122a may be exposed to the fifth surface 5 and the sixth surface 6 sides according to process errors, and there may be a risk of deterioration of the reliability of the stacked electronic component 100 due to moisture penetration.

[0053] The above W2 does not particularly need to be limited. For example, the ratio (W2 / Wo) of the above W2 to the above Wo can be 0.85 to 0.99. When W2 / Wo is less than 0.85, the improvement in bending strength and the ESR reduction effect of the present invention may be slight. When W2 / Wo exceeds 0.99, the first end portions 21a and 22a may be exposed to the fifth surface 5 and the sixth surface 6 sides according to process errors, and there may be a risk of deterioration of the reliability of the stacked electronic component 100 due to moisture penetration.

[0054] On the one hand, the main body 110 can have a first corner portion C1 connecting between the third surface 3 and the fifth surface 5, a second corner portion C2 connecting between the third surface 3 and the sixth surface 6, a third corner portion C3 connecting between the fourth surface 4 and the fifth surface 5, and a fourth corner portion C4 connecting between the fourth surface 4 and the sixth surface 6. On the other hand, in order to prevent the phenomenon that the corner portions C1, C2, C3, and C4 of the main body 110 crack (so-called chipping defect), the process of polishing the fired main body 110 can be passed through. Thereby, the corner portions C1, C2, C3, and C4 can have a round shape.

[0055] The corner portions C1, C2, C3, and C4 are the portions of the main body 110 that are vulnerable to the penetration of moisture from the outside. Thus, when the first end portions 21a and 22a come into contact with the corner portions C1, C2, C3, and C4, the moisture resistance reliability of the multilayer electronic component 100 may decrease. Therefore, it is preferable that the first end portions 21a and 22a can be separated from the corner portions C1, C2, C3, and C4. That is, the first-1 end portion 21a can be separated from the first corner portion C1 and the second corner portion C2, and the first-2 end portion 22a can be separated from the third corner portion C3 and the fourth corner portion C4.

[0056] In one embodiment, the extension portions 121c and 122c can overlap with the lead portions of other adjacent internal electrodes among the plurality of internal electrodes 121 and 122 in the first direction. That is, the first extension portion 121c can overlap with the second lead portion 122b adjacent in the first direction in the first direction, and the second extension portion 122c can overlap with the first lead portion 121b adjacent in the first direction in the first direction. That is, not only the main portions 121a and 122a but also the lead portions 121b and 122b and the extension portions 121c and 122c can form the capacitance forming portion Ac to improve the capacitance of the multilayer electronic component 100.

[0057] In one embodiment, the widths of the lead portions 121b and 122b in the third direction gradually increase as they go from the main portions 121a and 122a toward the first end portions 21a and 22a, and the widths of the extension portions 121c and 122c in the third direction can gradually increase as they go from the main portions 121a and 122a toward the second end portions 21b and 22b. That is, the width of the first lead portion 121b in the third direction gradually increases as it goes from the first main portion 121a toward the first-1 end portion 21a, and the width of the second lead portion 122b in the third direction can gradually increase as it goes from the second main portion 122a toward the first-2 end portion 22a. The width of the first extension portion 121c in the third direction gradually increases as it goes from the first main portion 121a toward the second-1 end portion 21b, and the width of the second extension portion 122c in the third direction can gradually increase as it goes from the second main portion 122a toward the second-2 end portion 22b.

[0058] That is, the widths of the lead portions 121b and 122b and the extension portions 121c and 122c in the third direction gradually increase as they go toward the outside of the main body 110, so that the internal electrodes 121 and 122 can have a relatively large area, and thereby the bending stress applied to the main body 110 can be effectively dispersed. Also, as shown in FIG. 6, in the capacitance forming portion Ac, the widths of the regions where the lead portions 121b and 122b and the extension portions 122c and 121c overlap in the first direction also gradually increase as they go toward the outside of the main body 110, and thus the capacitance of the multilayer electronic component 100 can be effectively improved.

[0059] On the other hand, from the viewpoint of improving the bending strength of the multilayer electronic component 100, the first internal electrode 121 and the second internal electrode 122 can preferably be point-symmetrical to each other. Thereby, in one embodiment, the main portions 121a and 122a may not overlap in the first direction with the lead portions of the other adjacent internal electrodes among the plurality of internal electrodes 121 and 122. That is, the first main portion 121a may not overlap in the first direction with the second lead portion 122b of the second internal electrode 122 adjacent in the first direction. Also, in one embodiment, the main portions 121a and 122a may not overlap in the first direction with the extension portions of the other adjacent internal electrodes among the plurality of internal electrodes 121 and 122. That is, the first main portion 121a may not overlap in the first direction with the second extension portion 122c of the second internal electrode 122 adjacent in the first direction.

[0060] In one embodiment, the ends of the external electrodes 131 and 132 can overlap with the lead portions 121b and 122b in the third direction. For example, the end of the first external electrode 131 can overlap with the first lead portion 121b in the third direction, and the end of the second external electrode 132 can overlap with the second lead portion 122b in the third direction. For example, the maximum length L2 of the lead portions 121b and 122b in the second direction can be longer than the distance in the second direction from the third surface 3 or the fourth surface 4 to the ends of the external electrodes 131 and 132. Cracks generated in the main body 110 can generally propagate from the ends of the external electrodes 131 and 132. Since the ends of the external electrodes 131 and 132 overlap with the lead portions 121b and 122b in the third direction, the lead portions 121b and 122b having a width in the third direction wider than that of the main portions 121a and 122a can effectively relieve the bending stress propagated from the ends of the external electrodes 131 and 132 to the dielectric layer 111.

[0061] The lengths of the main portions 121a and 122a, the lead portions 121b and 122b, and the extension portions 121c and 122c in the second direction are not particularly limited. For example, when the length of the main portions 121a and 122a in the second direction is L1, the maximum length of the lead portions 121b and 122b in the second direction is L2, and the maximum length of the extension portions 121c and 122c in the second direction is L3, L1 > L2 > L3 can be satisfied. If L1 is smaller than L2 and / or L3, there may be a problem that the capacitance of the multilayer electronic component 100 decreases too much.

[0062] Although L2 is not particularly limited, when the length of the main body 110 in the second direction is Lo, the ratio (L2 / Lo) of L2 to Lo can be 0.05 to 0.30. If L2 / Lo is less than 0.05, the effect of improving the bending strength of the present invention may be slight. Also, if L2 / Lo exceeds 0.30, there may be a problem that the capacitance of the multilayer electronic component 100 decreases.

[0063] Although L3 is not particularly limited, the ratio of L3 to L2 (L3 / L2) can be 0.01 to 0.90. If L3 / L2 is less than 0.01, the improvement in bending strength and the effect of capacity improvement of the present invention may be slight. If L3 / L2 exceeds 0.90, there is a risk that the internal electrodes 121 and 122 may come into contact with the external electrodes 132 and 131 of the other polarity due to cutting error.

[0064] Although L1 is not particularly limited, the ratio of L1 to Lo (Lo / L1) can be 0.43 to 0.94.

[0065] FIG. 7 is a cross-sectional view schematically showing a multilayer electronic component according to another embodiment of the present invention, and is a drawing corresponding to FIG. 2. FIG. 8 is a cross-sectional view schematically showing a cut cross-section along the line V-V' of FIG. 7. FIG. 9 is a cross-sectional view schematically showing a cut cross-section along the line VI-VI' of FIG. 7. FIG. 10 is a plan view schematically showing a state in which a first internal electrode and a second internal electrode of a multilayer electronic component according to another embodiment of the present invention overlap each other, and is a drawing corresponding to FIG. 6.

[0066] Hereinafter, with reference to FIGS. 7 to 10, a multilayer electronic component 200 according to another embodiment of the present invention will be described. For the configurations that are the same as / similar to the configuration of the multilayer electronic component 100 described in FIGS. 1 to 6, the same / similar reference numerals are used, and duplicate descriptions are omitted.

[0067] A multilayer electronic component 200 according to an embodiment of the present invention may include a main body 210 including a dielectric layer 211, a pair of internal electrodes 221 and 222, and a floating electrode 223, and external electrodes 231 and 232.

[0068] The main body 210 may have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and facing each other in a third direction.

[0069] The main body 210 can have a pair of internal electrodes 221 and 222 spaced apart from each other in the second direction and a floating electrode 223 alternately arranged in the first direction with a dielectric layer 211 interposed therebetween. The pair of internal electrodes 221 and 222 can include, for example, a first internal electrode 221 and a second internal electrode 222 spaced apart from each other in the second direction. The first internal electrode 221 can be connected to the first external electrode 231 on the third surface 3 side, and the second internal electrode 222 can be connected to the second external electrode 232 on the fourth surface 4 side.

[0070] The main body 210 can include cover portions 212 and 213 disposed on the outermost internal electrodes 221 and 222 or the floating electrode 223 with respect to the first direction. That is, the main body 210 can include cover portions 212 and 213 disposed on the first surface 1 and the second surface 2 sides and not including electrodes. The main body 210 can include margin portions 214 and 215 disposed on the fifth surface 5 and the sixth surface 6 sides and not including electrodes.

[0071] The external electrodes 231 and 232 can include a first external electrode 231 and a second external electrode 232 disposed on the third surface 3 and the fourth surface 4, respectively. The first external electrode 231 can be connected to the first internal electrode 221, and the second external electrode 232 can be connected to the second internal electrode 222. The external electrodes 231 and 232 can include base electrode layers 231a and 232a in contact with the internal electrodes 221 and 222 and plating layers 231b and 232b disposed on the base electrode layers 231a and 232a.

[0072] The first internal electrode 221 can include a first main portion 221a and a first lead portion 221b extending from the first main portion 221a and having a first end portion 21a' in contact with the first external electrode 231. The second internal electrode 222 can include a second main portion 222a and a second lead portion 222b extending from the second main portion 222a and having a second end portion 22a' in contact with the second external electrode 232.

[0073] The floating electrode 223 can include a third main portion 223a, a first extension portion 223b that extends from the third main portion 223a in the direction of the first external electrode 231 and is spaced apart from the first external electrode 231, and a second extension portion 223c that extends from the third main portion 223a in the direction of the second external electrode 232 and is spaced apart from the second external electrode 232.

[0074] The first main portion 221a and the second main portion 222a can overlap the third main portion 223a in the first direction. That is, the first main portion 221a, the second main portion 222a, and the third main portion 223a basically play a role in forming the capacitance of the multilayer electronic component 200. By dividing the voltage applied to the multilayer electronic component 200 and applying it to the region where the first main portion 221a and the third main portion 223a overlap each other and the region where the second main portion 222a and the third main portion 223a overlap each other, the reliability of the multilayer electronic component 200 can be improved.

[0075] The first main portion 221a, the second main portion 222a, and the third main portion 223a can be arranged at the central portion of the main body 210 in the second direction. The first main portion 221a and the second main portion 222a can be arranged to face each other in the second direction while being spaced apart from each other at the central portion of the main body 210 in the second direction.

[0076] According to an embodiment of the present invention, when the widths of the first main portion 221a and the second main portion 222a in the third direction are W11', the width of the third main portion 223a in the third direction is W12', the widths of the first end portion 21a' and the second end portion 22a' in the third direction are W2', and the widths of both end portions 23a, 23b of the floating electrode 223 in the second direction in the third direction are W3', it is possible to satisfy W2'>W11' and W3'>W12'.

[0077] By satisfying W2'>W11' and W3'>W12', the lead portions 221b and 222b and the extension portions 223b and 223c can effectively disperse the bending stress applied to the main body 210. Also, since W2' is larger than W11', the remaining organic substances in the dielectric layer 211 can be smoothly discharged during the firing process, the contact area between the internal electrodes 221 and 222 and the external electrodes 231 and 232 can be increased, and the equivalent series resistance (ESR) of the multilayer electronic component 200 can be reduced. Further, by limiting the region where the width of the margin portions 214 and 215 in the third direction is minimized to the sides of the first end portion 21a' and the second end portion 22a', it is possible to prevent the internal electrodes 221 and 222 from being exposed to the fifth surface 5 and the sixth surface 6 due to process errors. Thereby, it is possible to prevent the moisture resistance reliability of the multilayer electronic component 200 from deteriorating. In one embodiment, W2'>W3' can be satisfied.

[0078] The above W11' and W12' do not need to be particularly limited. For example, when the width of the main body 210 in the third direction is Wo', the ratio (W11' / Wo') of the above W11' to the above Wo' can be 0.4 to 0.8, and the ratio (W12' / Wo') of the above W12' to the above Wo' can be 0.4 to 0.8. The ratio (W2' / Wo') of W2' to Wo' can be, for example, 0.85 to 0.99.

[0079] In one embodiment, the first extension portion 223b can overlap with the first lead portion 221b in the first direction, and the second extension portion 223c can overlap with the second lead portion 222b in the first direction. Thereby, the capacitance of the multilayer electronic component 200 can be improved.

[0080] In one embodiment, as the first lead portion 221b extends from the first main portion 221a toward the first end portion 21a', the width in the third direction gradually increases. As the second lead portion 222b extends from the second main portion 222a toward the second end portion 22a', the width in the third direction gradually increases. As the first extension portion 223b and the second extension portion 223c extend from the third main portion 223a toward both end portions 23a and 23b of the floating electrode 223 in the second direction, the width in the third direction can gradually increase. That is, the widths of the lead portions 221b and 222b and the extension portions 223b and 223c in the third direction gradually increase toward the outside of the main body 210, so that the internal electrodes 221 and 222 and the floating electrode 223 can have a relatively large area. Thereby, the bending stress applied to the main body 210 can be effectively dispersed. Also, as shown in FIG. 10, as the widths in the third direction of the regions where the lead portions 221b and 222b and the extension portions 223b and 223c overlap in the first direction gradually increase toward the outside of the main body 210, the capacitance of the multilayer electronic component 200 can be effectively improved.

[0081] In one embodiment, when the length of the third main portion 223a in the second direction is L1', the maximum length of the lead portions 221b and 222b in the second direction is L2', and the maximum length of the extension portions 223b and 223c in the second direction is L3', L1'>L2'>L3' can be satisfied. For example, when the length of the main body 210 in the second direction is Lo', the ratio (L2' / Lo') of L2' to the Lo' can be 0.05 to 0.30, and the ratio (L3' / L2') of the L3' to the L2' can be 0.01 to 0.90. Although the L1' is not particularly limited, the ratio (Lo' / L1') of the Lo' to the L1' can be 0.43 to 0.94.

[0082] The present invention is not limited by the above-described embodiments and the attached drawings, but is intended to be limited by the attached claims. Therefore, various forms of substitution, modification, and change can be made by those having ordinary knowledge in the technical field without departing from the technical idea of the present invention described in the claims, and this can also be said to belong to the scope of the present invention.

[0083] Note that the expression "an embodiment" does not mean the same embodiment, but is provided to emphasize and explain different unique features. However, the above-presented one embodiment does not exclude being implemented in combination with the features of another embodiment. For example, even if the matters described in a specific one embodiment are not described in another one embodiment, they can be understood as explanations related to the other one embodiment as long as there is no explanation contrary to or conflicting with those matters in the other one embodiment.

[0084] Furthermore, expressions such as first, second, etc. are used to distinguish one component from another component, and do not limit the order and / or importance, etc. of the corresponding components. In some cases, without departing from the scope of the rights, the first component can also be named the second component, and similarly, the second component can also be named the first component.

Explanation of Reference Numerals

[0085] 100, 200 Multilayer Electronic Component 110, 210 Body 111, 211 Dielectric Layer 112, 113, 212, 213 Cover Portion 114, 115, 214, 215 Margin Portion 121, 122, 221, 222 Internal Electrode 223 Floating Electrode 121a, 122a, 221a, 222a, 223a Main Portion 121b, 122b, 221b, 222b Lead Portion 121c, 122c, 223b, 223c Extension Portion 131, 132, 231, 232 External electrodes 131a, 132a, 231a, 232a Underlying electrode layers 131b, 132b, 231b, 232b Plating layers

Claims

1. a body including a dielectric layer and a plurality of internal electrodes alternately disposed with the dielectric layer in a first direction, the body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first, second, third and fourth surfaces and facing each other in the third direction; external electrodes disposed on the third surface and the fourth surface; At least one of the plurality of internal electrodes is a main portion disposed at a center of the body in the second direction; a lead portion extending from the main portion in the second direction and having a first end in contact with the external electrode and spaced apart from the fifth and sixth surfaces; and an extension portion extending from the main portion in a direction opposite to the lead portion, spaced apart from the external electrode, and having a second end facing the first end, a width of the main portion in the third direction being W1, a width of the first end portion in the third direction being W2, and a width of the second end portion in the third direction being W3, such that W2>W3>W1 is satisfied.

2. The multilayer electronic component according to claim 1 , wherein the extension portion overlaps with a lead portion of another adjacent one of the plurality of internal electrodes in the first direction.

3. the lead portion has a width in the third direction that gradually increases from the main portion toward the first end portion, The multilayer electronic component according to claim 1 , wherein the extension portion has a width that gradually increases in the third direction from the main portion toward the second end portion.

4. 2. The multilayer electronic component according to claim 1, wherein when the width of said main body in the third direction is Wo, a ratio (W1 / Wo) of said W1 to said Wo is 0.4 to 0.

8.

5. 2. The multilayer electronic component according to claim 1, wherein when the width of said main body in the third direction is Wo, a ratio (W2 / Wo) of said W2 to said Wo is 0.85 to 0.

99.

6. the main body has corner portions having rounded shapes connecting the third surface and the fifth surface, the third surface and the sixth surface, the fourth surface and the fifth surface, and the fourth surface and the sixth surface, The multilayer electronic component according to claim 1 , wherein the first end is spaced apart from the corner portion.

7. 2. The multilayer electronic component according to claim 1, wherein L1>L2>L3 is satisfied, where L1 is a length of the main portion in the second direction, L2 is a maximum length of the lead portion in the second direction, and L3 is a maximum length of the extension portion in the second direction.

8. 8. The multilayer electronic component according to claim 7, wherein when the length of the main body in the second direction is Lo, a ratio (L2 / Lo) of the L2 to the Lo is 0.05 to 0.

30.

9. 8. The multilayer electronic component according to claim 7, wherein a ratio of L3 to L2 (L3 / L2) is 0.01 to 0.

90.

10. The multilayer electronic component according to claim 1 , wherein ends of the external electrodes overlap with the lead portions in the third direction.

11. 10. The multilayer electronic component according to claim 1, wherein the main portion overlaps with a main portion of an adjacent internal electrode among the plurality of internal electrodes in the first direction, and does not overlap with a lead portion of the other internal electrode in the first direction.

12. 10. The multilayer electronic component according to claim 1, wherein the main portion overlaps with a main portion of an adjacent internal electrode among the plurality of internal electrodes in the first direction, and does not overlap with an extension portion of the adjacent internal electrode in the first direction.

13. a first surface and a second surface facing each other in a first direction; a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction; and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface, and the fourth surface and facing each other in a third direction; a main body in which a pair of an internal electrode and a floating electrode, which are spaced apart from each other in the second direction, are alternately arranged in the first direction with a dielectric layer interposed therebetween; a first external electrode and a second external electrode disposed on the third surface and the fourth surface, respectively; the pair of internal electrodes includes a first internal electrode including a first main part and a first lead part having a first end extending from the first main part and contacting the first external electrode, and a second internal electrode including a second main part and a second lead part extending from the second main part and having a second end contacting the second external electrode, the floating electrode includes a third main part, a first extension part extending from the third main part in a direction toward the first external electrode and spaced apart from the first external electrode, and a second extension part extending from the third main part in a direction toward the second external electrode and spaced apart from the second external electrode, the first main part, the second main part, and the third main part are disposed in a center part of the main body in a second direction, A multilayer electronic component in which, when the width of the first main part and the second main part in the third direction is W11', the width of the third main part in the third direction is W12', the width of the first end part and the second end part in the third direction is W2', and the width of both ends of the floating electrode in the second direction in the third direction is W3', W2' > W11' and W3' > W12' are satisfied.

14. the first extension portion overlaps with the first lead portion in the first direction; The multilayer electronic component according to claim 13 , wherein the second extension portion overlaps with the second lead portion in the first direction.

15. the first lead portion has a width in the third direction that gradually increases from the first main portion toward the first end portion, the second lead portion has a width in the third direction that gradually increases from the second main portion toward the second end portion, 15. The multilayer electronic component according to claim 13, wherein the first extension portion and the second extension portion have widths in the third direction that gradually increase from the third main portion toward both ends of the floating electrode in the second direction.

Images