Probe card for testing semiconductor device

Abstract

To relate to a probe card mounted in a tester device for measuring the electrical characteristics of a semiconductor chip formed on a semiconductor substrate, and to provide a probe card for testing a semiconductor device, which, when a probe portion of the probe card comes into contact with an inner pad of the semiconductor device, enables the probe portion to stably come into contact with the inner pad without being pushed from the pad of the semiconductor device.SOLUTION: A probe card for testing an electrical characteristics of a semiconductor device includes: a plate-shaped support body; a circuit board located at an outer side of the support body; a first probe portion that is electrically connected to the circuit board and comes into contact with a first position of the semiconductor device; a second probe portion that is electrically connected to the circuit board and comes into contact with a second position of the semiconductor device; a first support portion supporting the first probe portion and having a first space portion at a central side; and a second support portion located on the first support portion, supporting the second probe portion, and having a second space portion at the central side.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a probe card that is mounted on a tester device for measuring electrical characteristics of a semiconductor chip formed on a semiconductor substrate. [Background technology]

[0002] The EDS (Electrical Die Sorting) process is an electrical characteristic test carried out between the FAB process and the packaging process in the form of the final product. By testing the electrical characteristics of these semiconductor devices (integrated circuit chips as an example), it is possible to confirm whether each semiconductor device (chip) has reached the desired quality level.

[0003] Specifically, an electrical characteristic test is used to check whether each semiconductor device implemented on the wafer has reached a desired quality level. Specifically, an electrical characteristic test is used to determine whether each semiconductor device implemented on the wafer passes or fails by determining whether it meets a desired electrical characteristic specification level. Rejected chips are marked with a special marking (inking). Chips determined to be defective in this way can be removed from subsequent processes to increase manufacturing efficiency.

[0004] Thus, the EDS process is a necessary process to increase semiconductor yield as the final test (packaging process is carried out for chips that pass).Semiconductor yield is calculated as a percentage of the number of good chips produced compared to the maximum number of chips designed on one wafer, and is directly linked to semiconductor productivity.

[0005] This EDS process can be carried out by contacting a probe card connected to a test device with a wafer on which semiconductor devices are manufactured. Numerous fine pins on the probe card contact the pads of each semiconductor device manufactured on the wafer to send electricity, and the defective chips can be selected based on the signal.

[0006] Fig. 1 is a schematic cross-sectional view showing a main part of a typical probe card, and Fig. 2 is a schematic cross-sectional view showing a state in which a probe part of the typical probe card is in contact with a semiconductor device.

[0007] A typical probe card 1 may include a first probe portion 13 and a second probe portion 14 connected to a printed circuit board (not shown). The first probe portion 13 and the second probe portion 14 are supported by one support portion 11. In this case, the first probe portion 13 and the second probe portion 14 may be supported by the support portion 11 by an adhesive portion 12 such as epoxy.

[0008] The probe card 1 including the first probe portion 13 and the second probe portion 14 can contact a semiconductor device 2 such as an integrated circuit chip to perform an EDS test. One semiconductor device 2 may have an outer pad 22 and an inner pad 23. From the viewpoint of the semiconductor device 2, the inner pad 23 may be a pad located toward the center of the chip.

[0009] To perform EDS testing of the semiconductor device 2, the first probe portion 13 may contact the outer pad 22 and the second probe portion 14 may contact the inner pad 23.

[0010] 2, the second probe portion 14 may come into contact with the inner pad 23 at a relatively long distance from the adhesive portion 12. At this time, a large deviation a in the vertical movement of the bent end portion of the second probe portion 14 may occur. As a result, when the second probe portion 14 comes into contact with the inner pad 23, a phenomenon may occur in which the end portion of the second probe portion 14 is pushed inward in a direction b.

[0011] In this way, when the beam length corresponding to the length from the end of the support part 11 to the bent part of the second probe part 14 becomes long, a phenomenon may occur in which the end (needle) of the second probe part 14 is pushed, causing the end (needle) of the second probe part 14 to move up and down at the bent part, resulting in deviation.

[0012] Thus, methods to solve these problems emerge. Summary of the Invention [Problem to be solved by the invention]

[0013] According to one embodiment of the present invention, a probe card for testing a semiconductor device is provided that enables stable contact without being pushed by the pad of the semiconductor device when the probe portion of the probe card contacts the inner pad of the semiconductor device.

[0014] Also, the present invention provides a probe card for testing a semiconductor device, which can reduce a beam length corresponding to the length from an end of a support part of the probe card to a bent part of a probe part.

[0015] The present invention also provides a probe card for testing semiconductor devices that can stably contact and test a large number of semiconductor devices simultaneously. [Means for solving the problem]

[0016] As a first aspect of the present invention for achieving the above-mentioned object, the present invention provides a probe card for testing electrical characteristics of a semiconductor device, the probe card including: a support; a circuit board located outside the support; a first probe portion electrically connected to the circuit board and contacting a first position of the semiconductor device; a second probe portion electrically connected to the circuit board and contacting a second position of the semiconductor device; a first support portion supporting the first probe portion and having a first space portion exposing the first probe portion at a center side; and a second support portion located on the first support portion and supporting the second probe portion and having a second space portion exposing the second probe portion coaxially with the center side.

[0017] In an exemplary embodiment, the first support portion and the second support portion may have the same inclined surface with respect to the plate shape of the support body.

[0018] In an exemplary embodiment, the second support portion may be located so as to extend toward the center side relative to the first space portion more than the first support portion.

[0019] In an exemplary embodiment, the first support may be positioned to overlap the second support.

[0020] In an exemplary embodiment, the first support and the second support may be provided as ceramic rings.

[0021] In an exemplary embodiment, the second probe portion may be located more inward than the first probe portion with respect to the first space portion or the second space portion.

[0022] In an exemplary embodiment, the first probe portion may be positioned to extend inwardly from an end of the first support portion by a first length.

[0023] In an exemplary embodiment, the second probe portion may be positioned to extend inwardly from an end of the second support portion by a second length.

[0024] In an exemplary embodiment, the first space portion may be coaxial with the second space portion.

[0025] In an exemplary embodiment, the size of the first space portion may be greater than the size of the second space portion.

[0026] In an exemplary embodiment, at least two or more of the first space portions and the second space portions may be provided in parallel.

[0027] As a second aspect of the present invention for achieving the aforementioned object, the present invention provides a probe card for testing electrical characteristics of a semiconductor device, which can be configured to include a support, a circuit board located outside the support, a first support portion supported by the support and having a first space portion at its center, a second support portion located on the first support portion and having a second space portion at its center, a first probe portion electrically connected to the circuit board and supported by the first support portion, and a second probe portion electrically connected to the circuit board and supported by the second support portion.

[0028] In an exemplary embodiment, the first probe portion may contact a first position of the semiconductor device, and the second probe portion may contact a second position of the semiconductor device.

[0029] In an exemplary embodiment, the second position may be located more inward than the first position with respect to the first space portion or the second space portion.

[0030] As a third aspect of the present invention for achieving the aforementioned object, a probe card for testing electrical characteristics of a semiconductor device includes a first probe portion that contacts a first position of the semiconductor device, a second probe portion that contacts a second position of the semiconductor device that is located more inward than the first position, a first support portion that supports the first probe portion and has a first space portion on its central side, and a second support portion that is located on the first support portion and supports the second probe portion and has a second space portion on its central side that is coaxial with the first space portion, wherein the first probe portion is located extending inward a first length from the first space portion, and the second probe portion is located extending inward a second length from the second space portion. Effect of the Invention

[0031] The exemplary embodiment of the present invention provides the following advantages.

[0032] First, according to an embodiment of the present invention, when the probe portion of the probe card contacts the inner pad of the semiconductor device, the probe portion can stably contact the inner pad of the semiconductor device without being pushed by the pad of the semiconductor device.

[0033] Also, the beam length, which corresponds to the length from the end of the support part of the probe card to the bent part of the probe, can be reduced.

[0034] Also, a large number of semiconductor devices can be stably contacted and tested simultaneously.

[0035] Therefore, it is possible to test an integrated circuit (IC) having a pad (island pad) on the central side (inside) of a semiconductor device. Also, there is an advantage that restrictions on pad layout during chip design are reduced.

[0036] In addition, according to another embodiment of the present invention, there are additional technical effects not described in this specification, which can be understood by those skilled in the art through the entire content of the specification and drawings. [Brief description of the drawings]

[0037] [Figure 1] 1 is a schematic cross-sectional view showing a main part of a typical probe card. [Diagram 2] 1 is a schematic cross-sectional view showing a state in which a probe portion of a typical probe card is in contact with a semiconductor device. [Diagram 3] 1 is a schematic plan view showing a probe card according to one embodiment of the present invention; [Figure 4] 1 is a cross-sectional schematic diagram illustrating a probe card according to an embodiment of the present invention. [Diagram 5] 1 is a schematic cross-sectional view showing a state in which a probe card according to an embodiment of the present invention contacts a semiconductor device. [Figure 6] 1 is an exploded perspective view of a probe card according to an embodiment of the present invention, viewed from a first direction. [Figure 7] 2 is an exploded perspective view of a probe card according to an embodiment of the present invention, seen from a second direction. FIG. [Figure 8] 2 is a perspective view of a probe card according to an embodiment of the present invention seen from a second direction. [Figure 9]1 is an exploded perspective view of a probe card according to another embodiment of the present invention, viewed from a first direction. [Figure 10] 11 is an exploded perspective view of a probe card according to another embodiment of the present invention, seen from a second direction. [Figure 11] 11 is a perspective view of a probe card according to another embodiment of the present invention, seen from a second direction. [Figure 12] 13 is a plan view showing a state in which a first probe portion and a second probe portion are coupled to a probe card according to another embodiment of the present invention. FIG. [Figure 13] 13 is a plan view showing a state in which a first probe portion and a second probe portion are coupled to a probe card according to another embodiment of the present invention. FIG. [Figure 14] 13 is a plan view showing a state in which a first probe portion and a second probe portion are coupled to a probe card according to another embodiment of the present invention. FIG. [Figure 15] 13 is a perspective view showing a state in which a first probe portion and a second probe portion are coupled to a probe card according to another embodiment of the present invention. FIG. [Figure 16] FIG. 13 is a conceptual diagram showing an inspection method according to an embodiment different from the embodiment of the present invention. [Figure 17] FIG. 13 is a conceptual diagram showing an inspection method according to an embodiment different from the embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0038] Hereinafter, the embodiments disclosed in this specification will be described in detail with reference to the accompanying drawings, and the same or similar components will be given the same reference numbers regardless of the reference numbers, and duplicated descriptions will be omitted. The suffixes "module" and "part" for components used in the following description are given or mixed in consideration of the ease of writing the specification, and do not have meanings or roles that are distinguished from each other.

[0039] Furthermore, in describing the embodiments disclosed in this specification, if it is determined that a specific description of related publicly known technology may obscure the gist of the embodiments disclosed in this specification, such detailed description will be omitted.

[0040] It should also be noted that the accompanying drawings are intended to facilitate understanding of the embodiments disclosed in this specification, and should not be construed as limiting the technical ideas disclosed in this specification.

[0041] Although each drawing is described for the convenience of explanation, it is also within the scope of the present invention for a person skilled in the art to combine at least two or more drawings to embody other embodiments.

[0042] Additionally, when an element, such as a layer, region, or substrate, is referred to as being "on" another component, it will be understood that this may be directly on the other element, or there may be intermediate elements in between.

[0043] Figure 3 is a schematic plan view of a probe card according to an embodiment of the present invention. Figure 4 is a schematic cross-sectional view of a probe card according to an embodiment of the present invention.

[0044] 3 and 4, a probe card 10 according to an embodiment of the present invention can test electrical characteristics of a semiconductor device 20. As an example, an Electrical Die Sorting (EDS) process can be performed using the probe card 10.

[0045] Here, the semiconductor device 20 is, for example, an integrated circuit chip (IC chip), and Fig. 4 shows a schematic diagram of a unit semiconductor device 20 implemented on a wafer. For example, the semiconductor device 20 may have a first pad 22 located at a first position and a second pad 23 located at a second position. For example, the unit semiconductor device 20 may have the first pad 22 located on the outside and the second pad 23 located inside the first pad 22.

[0046] Such a probe card 10 may include a plate-shaped support 300, a circuit board 200 located outside the support 300, and an inner core structure 100 including support portions 110, 120 supporting probe portions 130, 140 electrically connected to the circuit board 200.

[0047] Although not separately illustrated, the circuit board 200 may be, for example, a printed circuit board (PCB), and may be electrically connected to a test device capable of testing the semiconductor device 20. Details regarding this will be omitted.

[0048] In the probe card 10, the support 300 may be formed in a plate shape. The circuit board 200 may be located outside the support 300. As an example, the circuit board 200 may be located outside the support 300 so as to surround the outside of the support 300. In an exemplary embodiment, the circuit board 200 may be provided in an annular shape (doughnut shape). In FIG. 4, the size of the circuit board 200 is diagrammatically shown reduced compared to FIG. 2.

[0049] The probe card 10 may include a first probe portion 130 electrically connected to the circuit board 200 and in contact with a first position of the semiconductor device 20, and a second probe portion 140 electrically connected to the circuit board 200 and in contact with a second position of the semiconductor device 20. As an example, the first probe portion 130 may contact an outer pad 22 (first pad) of the semiconductor device 20, and the second probe portion 140 may contact an inner pad 23 (second pad) of the semiconductor device 20.

[0050] The probe card 10 may also include a first support portion 120 that supports the first probe portion 130 and has a first space portion 121a at its center, and a second support portion 110 that is positioned on the first support portion 120, supports the second probe portion 140, and has a second space portion 111a at its center.

[0051] The first probe portion 130, the second probe portion 140, and the first support portion 120 and the second support portion 110 supporting the first probe portion 130 and the second probe portion 140, respectively, can be referred to as a core structure 100. Here, the reference numerals of the first support portion 120 and the second support portion 110 are set for convenience according to the connection distance from the support 300.

[0052] 4, as an example, the first support 120 and the second support 110 may have the same inclined surface with respect to the plate shape of the support 300. Meanwhile, as another example, the first support 120 and the second support 110 may have different inclined surfaces with respect to the plate shape of the support 300.

[0053] In an exemplary embodiment, the second support 110 may be extended and positioned further inward than the first support 120 with respect to the first space 121a. As an example, the second support 110 may be extended and positioned further inward than the first support 120 with respect to the center of the probe card 10 as a reference in order to support the second probe 140 that contacts the second pad 23 located on the inner side of the semiconductor device 20. This prevents unnecessary external force from being applied to the second probe 140 that contacts the second pad 23 located on the inner side of the semiconductor device 20, and allows the second probe 140 to be stably supported by the second support 110. This will be described in detail later.

[0054] 4, the first support 120 may be positioned overlapping the second support 110. One side of the second support 110 may be supported by the support 300, and the other side of the second support 110 may support the second probe 140. At the same time, the first support 120 may be positioned adjacent to or in contact with the other side of the second support 110. At least a portion of the second support 110 may overlap with the first support 120. For example, the second support 110 may have a larger area, and the first support 120 may be positioned on a portion of the area.

[0055] FIG. 5 is a schematic cross-sectional view showing a state in which a probe card according to an embodiment of the present invention comes into contact with a semiconductor device.

[0056] Referring to FIG. 5, the probe card 10 is shown in contact with the semiconductor device 20 for testing the semiconductor device 20.

[0057] Specifically, the end of the first probe portion 130 is in contact with the outer pad 22 (first pad) of the semiconductor device 20, and the second probe portion 140 is in contact with the inner pad 23 (second pad) of the semiconductor device 20.

[0058] At this time, the end side of the first probe portion 130 is supported by the first support portion 120, and therefore can be in stable contact with the first pad 22. In addition, the end side of the second probe portion 140 is supported by the second support portion 110, and therefore can be in stable contact with the second pad 23.

[0059] The first probe portion 130 may be positioned by extending inward from the end 121 of the first support portion 120 by a first length L1. That is, the first probe portion 130 may be positioned by being exposed from the end 121 of the first support portion 120 and exposed on the first space portion 121a. Also, the second probe portion 140 may be positioned by extending inward from the end 111 of the second support portion 110 by a second length L2. That is, the second probe portion 140 may be positioned by being exposed from the end 111 of the second support portion 110 and exposed on the second space portion 111a. In this manner, the portion extended from the end 111 or 121 side may be referred to as a beam length.

[0060] According to an embodiment of the present invention, the lengths L1, L2 of these beams may be shortened so that the first support portion 120 and the second support portion 110 can stably support the end sides of the first probe portion 130 and the second probe portion 140, respectively. When the beam lengths are shortened in this manner, the pad 23 (second pad) on the inside of the semiconductor device 20 and the second probe portion 140 can stably contact each other without the end being pressed when they come into contact with each other.

[0061] In particular, according to the embodiment of the present invention, the second support part 110 separately forms an inclined surface to stably support the end side of the second probe part 140. If the second support part 110 were not present, the second probe part 140 would be supported by the first support part 120 and would come into contact with the inner pad 23, but according to the embodiment of the present invention, since the second probe part 140 is supported by the second support part 110, the length of the beam is shortened and the second probe part 140 can be stably supported.

[0062] Although not separately illustrated, the first probe portion 130 may be attached to the first support portion 120 by an adhesive such as epoxy and may be firmly supported, and the second probe portion 140 may be attached to the second support portion 110 by an adhesive such as epoxy and may be firmly supported.

[0063] In an exemplary embodiment, the first support 120 and the second support 110 may be provided in the form of a ceramic ring. As an example, the first support 120 may be made of a ring-shaped ceramic having a first space 121a at the center. Also, the second support 110 may be made of a ring-shaped ceramic having a second space 111a at the center.

[0064] The first space 121a may be located coaxially with the second space 111a. For example, the first space 121a and the second space 111a may be coupled to each other coaxially.

[0065] 4 and 5, the size of the first space 121a may be larger than the size of the second space 111a. This is because the second probe portion 140, which contacts the second pad 23 located on the inside, is located on the inside of the second space 111a.

[0066] Fig. 6 is an exploded perspective view of a probe card according to an embodiment of the present invention as viewed from a first direction. Fig. 7 is an exploded perspective view of a probe card according to an embodiment of the present invention as viewed from a second direction. Fig. 8 is an exploded perspective view of a probe card according to an embodiment of the present invention as viewed from a second direction.

[0067] 6, specific shapes of the first support 120 and the second support 110 are shown as an exemplary embodiment. Here, the first support 120 may be coupled onto the second support 110. The second support 110 and the first support 120 may be coupled by a pin 150.

[0068] The second support part 110 may have inclined surfaces 112 protruding from a base surface 114 at a center side 115 of each side of the end part 111, and may meet each other at the center to form a second space 111a. A pinhole 113 to which a pin 150 is coupled may be located in the base surface 114. The second probe part 140 may be supported on the inclined surfaces 112. As described above, the second probe part 140 may be supported on the inclined surfaces 112 by an adhesive such as epoxy.

[0069] The first support part 120 coupled to the second support part 110 may have a coupling hole 122 to which the second probe part 140 is coupled, located at a position corresponding to the inclined surface 112 of the second support part 110. A support surface 123 may be formed by extending inward from the first space part 121a of the first support part 120.

[0070] In this manner, the coupling holes 122 to which the second probe portion 140 is coupled are coupled to the center sides 115 of the respective sides on the end side, so that the first support portion 120 and the second support portion 110 can be firmly coupled to each other.

[0071] 7, it can be seen that the outer surface of the first support 120 itself forms an inclined surface to support the first probe portion 130. An end side of the first probe portion 130 may be provided to protrude inward from the first space portion 121a. That is, the end side of the first probe portion 130 may be provided to protrude inward from the end 121 of the first support 120.

[0072] As described above, the second probe portion 140 is shown supported by the inclined surface 112 of the second support portion 110. The second probe portion 140 may be extended in a direction opposite to the protruding direction through the coupling hole 122 and connected to the circuit board 200.

[0073] When the first support 120 and the second support 110 are coupled together, and the first probe portion 130 and the second probe portion 140 are coupled to the first support 120 and the second support 110, respectively, the state shown in FIG. 8 may be obtained.

[0074] In the above-described state, when the first probe portion 130 and the second probe portion 140 contact the first pad 22 and the second pad 23 of the semiconductor device 20, the end portion is not pushed and the contact is stable, so that the electrical characteristics of the semiconductor device 20 can be inspected.

[0075] Fig. 9 is an exploded perspective view of a probe card according to another embodiment of the present invention as viewed from a first direction, Fig. 10 is an exploded perspective view of a probe card according to another embodiment of the present invention as viewed from a second direction, and Fig. 11 is a perspective view of a probe card according to another embodiment of the present invention as viewed from a second direction.

[0076] 9 to 11 show a core structure 101 of a probe card according to another embodiment of the present invention. The core structure 101 according to this embodiment may be provided with a plurality of first spaces 124a and second spaces 118a to which the first probe portions 130 and second probe portions 140 can be coupled. This allows a plurality of semiconductor devices 20 to be simultaneously tested by a group of a plurality of first probe portions 130 and second probe portions 140 coupled to the plurality of first spaces 124a and second spaces 118a.

[0077] 9 to 11, as an example, three sets of the above-mentioned first probe portion 130 and second probe portion 140 are provided, and three semiconductor devices 20 can be contacted simultaneously to simultaneously inspect these three semiconductor devices 20. Here, a state in which three sets of the first probe portion 130 and the second probe portion 140 are provided is shown as an example, but it goes without saying that a different number of sets of the first probe portion 130 and the second probe portion 140 can be provided.

[0078] 9, the second support portion 110a is formed with three sets of inclined surfaces 116. Also, the end 118 of each inclined surface 116 is formed in a V-shape, and when the ends 118 of the two inclined surfaces 116 meet each other, a square second space portion 118a can be formed.

[0079] 10, the first support 120a has three first spaces 124a arranged in parallel, and one side of each of the first spaces 124a may have a coupling hole 125 (see FIG. 10) to which the inclined surface 116 of the second support 110a is coupled.

[0080] Referring to FIG. 11, the second support 110a and the first support 120a may be combined to form a core structure 101 capable of testing three semiconductor devices 20 simultaneously.

[0081] The second support portion 110a may have inclined surfaces 116 protruding from a center side 119 of each side of the end portion 118, and may meet each other at the center to form a second space portion 118a. The second probe portion 140 may be supported on the inclined surfaces 116. As described above, the second probe portion 140 may be supported on the inclined surfaces 116 by an adhesive such as epoxy.

[0082] The first support 120a coupled to the second support 110a may have a coupling hole 125 to which the second probe 140 is coupled, located at a position corresponding to the inclined surface 116 of the second support 110a.

[0083] In this way, the coupling holes 125 to which the second probe portion 140 is coupled are coupled to the center side 119 of each side of the end portion side, and the first support portion 120a and the second support portion 110a can be firmly coupled by a stepped coupling. At this time, the first support portion 120a and the second support portion 110a can be coupled by a pin (not shown) and a pinhole 126, as in the case of the first embodiment. That is, the first support portion 120a and the second support portion 110a can be coupled to each other by another pin. Referring to FIG. 9, the pinhole 126 formed in the second support portion 110a is indicated. Although not separately illustrated, a pinhole to which a pin is coupled can also be formed in the second support portion 110a.

[0084] 12 to 14 are plan views showing a state in which the first probe portion and the second probe portion are coupled to a probe card according to another embodiment of the present invention.

[0085] 12 exemplarily illustrates a state in which the second probe unit 140 is coupled to the second support unit 110a, and FIG 13 exemplarily illustrates a state in which the first probe unit 130 is coupled to the first support unit 120a.

[0086] FIG. 14 exemplarily shows a core structure 101 formed by the coupling of the first support portion 120a and the second support portion 110a and the coupling of the first probe portion 130 and the second probe portion 140. As shown in FIG.

[0087] FIG. 15 is a perspective view showing a state in which a first probe portion and a second probe portion are coupled to a probe card according to another embodiment of the present invention.

[0088] Referring to FIG. 15, the core structure 101 formed by the combination of the first support portion 120a and the second support portion 110a and the combination of the first probe portion 130 and the second probe portion 140 is shown in more detail.

[0089] The first probe portion 130 may be supported by an outer surface of the first support portion 120a. A first space portion 124a may be formed in the first support portion 120a, and the first probe portion 130 may extend to the inside of the first space portion 124a so that the probe may be positioned therein.

[0090] The second probe portion 140 may be supported by the inclined surface 116 of the second support portion 110a. An end portion 118 of the inclined surface 116 forms a second space portion 118a, and the probe of the second probe portion 140 may be located inside the second space portion 118a. Also, an inner space of an end portion 124 of the first support portion 120a forms a first space portion 124a, and the probe of the first probe portion 130 may be located inside the second space portion 118a.

[0091] 16 and 17 are conceptual diagrams showing an inspection method according to an embodiment different from the embodiment of the present invention.

[0092] 16, the probe card 10 includes one test area 102 (site 1) as in the embodiment of the present invention described above, and can test a unit semiconductor device using the one test area 102.

[0093] Meanwhile, referring to FIG. 17, the probe card 10 includes three inspection areas 102, 103, and 104 (Site 1, Site 2, and Site 3) as in the other embodiments of the present invention described above, and three unit semiconductor devices can be inspected using the three inspection areas 102, 103, and 104.

[0094] As described above, according to the embodiment of the present invention, ceramic ring-shaped support parts are provided on two axes, and the beam length of the probe part located on the inside can be minimized.

[0095] In this way, when the beam length is shortened, when the probe portion comes into contact with the pad inside (at the center) of the semiconductor device, the end of the probe portion is not pushed, and the contact can be made stably.

[0096] Therefore, it is possible to test an integrated circuit (IC) having a pad (island pad) on the central side (inside) of the semiconductor device. Also, there is an advantage that restrictions on pad layout during chip design are reduced.

[0097] The above description is merely an illustrative example of the technical concept of the present invention, and a person having ordinary knowledge in the technical field to which the present invention pertains may make various modifications and variations without departing from the essential characteristics of the present invention.

[0098] Therefore, the embodiments disclosed in the present invention are intended to explain the technical idea of ​​the present invention and are not intended to limit the scope of the technical idea of ​​the present invention.

[0099] The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the present invention. [Explanation of symbols]

[0100] 10: Probe card 20: Semiconductor device 100: Core structure 110:Second support part 111a: Second space part 120: 1st support part 121a: First space part 130: 1st probe part 140:Second probe part

Claims

1. In a probe card for testing electrical characteristics of a semiconductor device, A support; A circuit board located outside the support; a first probe portion electrically connected to the circuit board and contacting a first position of a semiconductor device; a second probe portion electrically connected to the circuit board and contacting a second position of the semiconductor device; a first support portion that supports the first probe portion and has a first space portion at a center side through which the first probe portion is exposed; a second support portion located on the first support portion to support the second probe portion, and having a second space portion through which the second probe portion is exposed coaxially with the central side.

2. The probe card according to claim 1 , wherein the second support portion is extended toward the center of the first space portion more than the first support portion.

3. The probe card according to claim 1 , wherein the first support portion is positioned to overlap the second support portion.

4. The probe card according to claim 1 , wherein the first support portion and the second support portion are provided in the form of a ceramic ring.

5. 2. The probe card according to claim 1, wherein the second probe portion is located on an inner side of the first space portion or the second space portion relative to the first probe portion.

6. The probe card of claim 1 , wherein the first probe portion is positioned to extend inward from an end of the first support portion by a first length.

7. The probe card of claim 1 , wherein the second probe portion is positioned to extend inward from an end of the second support portion by a second length.

8. 2. The probe card according to claim 1, wherein the second space is smaller in size than the first space.

9. The probe card according to claim 1 , wherein at least two of the first space portions and the second space portions are provided in parallel.

10. In a probe card for testing electrical characteristics of a semiconductor device, A support; A circuit board located outside the support; a first support portion supported by the support body and having a first space portion on a central side; a second support portion located on the first support portion and having a second space portion on a central side; a first probe portion electrically connected to the circuit board and supported by the first support portion; a second probe portion electrically connected to the circuit board and supported by the second support portion.

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