Mounting device and method for controlling mounting device

Abstract

To mount a large electronic component without increasing a device.SOLUTION: A mounting device includes: a mounting head; a nozzle supported by the mounting head and holding an electronic component; a nozzle moving device for moving the nozzle in an axial direction with respect to the mounting head; a camera supported by the mounting head, the camera taking an image of a substrate with the electronic component mounted therein; and a camera moving device for moving the camera in a vertical direction with respect to the nozzle.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The technology disclosed in this specification relates to a mounting apparatus and a method for controlling the mounting apparatus.

Background Art

[0002] In the manufacturing process of electronic devices, a mounting apparatus for mounting electronic components on a substrate is used. In the mounting apparatus, a mounting head having a nozzle for holding an electronic component moves relative to a substrate supported on a stage, and conveys and mounts the electronic component adsorbed at the tip of the nozzle to a predetermined mounting position on the substrate. In such a mounting apparatus, a camera for photographing below the mounting head is mounted on the mounting head when recognizing an alignment mark on the substrate or teaching the adsorption position of the electronic component to the nozzle (for example, Patent Documents 1 and 2).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] When a camera is mounted on the mounting head as in the prior art, when mounting a large electronic component, the movement path of the mounting head may become complicated so as not to collide with the electronic components already mounted on the substrate. In addition, when using a camera with a long focal length, there are problems such as increased cost, increased size of the mounting head, and increased height of the apparatus itself.

[0005] The technology disclosed in this specification aims to mount a large electronic component without increasing the size of the apparatus.

Means for Solving the Problems

[0006] This specification discloses an implementation device. The implementation device includes an implementation head, a nozzle supported by the implementation head for holding an electronic component, a nozzle moving device for axially moving the nozzle with respect to the implementation head, a camera supported by the implementation head for photographing a substrate on which the electronic component is to be implemented from above, and a camera moving device for vertically moving the camera with respect to the nozzle.

Advantages of the Invention

[0007] According to the technology disclosed in this specification, large electronic components can be implemented without increasing the size of the device.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Modes for Carrying Out the Invention

[0009] Hereinafter, embodiments will be described with reference to the drawings. In the embodiments, an XYZ orthogonal coordinate system is defined, and the positional relationships of each part will be described with reference to this XYZ orthogonal coordinate system. The direction parallel to the X-axis of a predetermined plane is defined as the X-axis direction. The direction parallel to the Y-axis of the predetermined plane orthogonal to the X-axis is defined as the Y-axis direction. The direction parallel to the Z-axis orthogonal to the predetermined plane is defined as the Z-axis direction. The rotation direction or inclination direction centered on the Z-axis direction is defined as the θZ direction. In the embodiments, the predetermined plane is parallel to the horizontal plane. The Z-axis is parallel to the vertical axis, and the Z-axis direction is the up-down direction. The +Z side is the upper side, and the -Z side is the lower side. Note that the predetermined plane may be inclined with respect to the horizontal plane. Also, in the embodiments, the predetermined plane including the X-axis and the Y-axis is appropriately referred to as the XY plane.

[0010] [Mounting Device] FIG. 1 is a side view schematically showing a mounting device 10 according to an embodiment. FIG. 2 is a plan view schematically showing the mounting device 10 according to the embodiment. The mounting device 10 is a device for mounting electronic components 2 on a substrate 1.

[0011] As shown in FIGS. 1 and 2, the mounting device 10 includes a base member 12, a transfer device 14, a stage 16, a stage moving device 18, a component supply device 20, a mounting head 22, a head moving device 24, a chamber 28, and a control device 50.

[0012] The base member 12 supports each of the transfer device 14, the stage 16, the stage moving device 18, the component supply device 20, the mounting head 22, and the head moving device 24.

[0013] The transfer device 14 transfers the substrate 1 supplied to the mounting device 10 to a processing position where the mounting head 22 performs the mounting process of the electronic component 2. The processing position is defined in the transfer path of the transfer device 14. In the embodiment, the transfer device 14 transfers the substrate 1 in the X-axis direction.

[0014] The transfer device 14 has a transfer belt 14A that transfers the substrate 1 in the X-axis direction and a guide member 14B that guides the substrate 1.

[0015] The guide member 14B is long in the X-axis direction. A pair of guide members 14B are provided. The pair of guide members 14B are separated from each other in the Y-axis direction. One of the guide members 14B is disposed on the +Y side of the substrate 1. The other guide member 14B is disposed on the -Y side of the substrate 1.

[0016] The conveyor belt 14A is annular. A pair of conveyor belts 14A are provided. The conveyor belt 14A is supported by the guide member 14B via a driving pulley and a driven pulley. The conveyor belt 14A is wound around the driving pulley and the driven pulley. One of the conveyor belts 14A is supported by one of the guide members 14B. The other conveyor belt 14A is supported by the other guide member 14B.

[0017] Of the pair of conveyor belts 14A, the conveyor belt 14A disposed on the +Y side supports the +Y side end of the lower surface of the substrate 1. The conveyor belt 14A disposed on the -Y side supports the -Y side end of the lower surface of the substrate 1. When the driving pulley rotates by a drive motor (not shown), the substrate 1 is conveyed in the X-axis direction.

[0018] By an actuator (not shown), one of the guide members 14B is movable in the Y-axis direction with respect to the other guide member 14B. When one of the guide members 14B and the other guide member 14B are separated from each other in the Y-axis direction, the support of the substrate 1 by the conveyor belt 14A is released.

[0019] The stage 16 supports the substrate 1. The stage 16 supports the substrate 1 conveyed to the processing position from the -Z side.

[0020] The stage moving device 18 moves the stage 16. In the embodiment, the stage moving device 18 moves the stage 16 in each of the Y-axis direction and the Z-axis direction. The stage moving device 18 includes a Y-axis motor that generates power for the stage 16 to move in the Y-axis direction and a Z-axis motor that generates power for the stage 16 to move in the Z-axis direction.

[0021] After the substrate 1 is transported to the processing position by the transport device 14, the stage 16 moves in the +Z direction by the stage moving device 18, so that the stage 16 supports the substrate 1 from below, and the substrate 1 is transferred from the transport device 14 to the stage 16. Next, when the guide member 14B on the +Y side moves in the Y-axis direction so as to be separated from the other guide member 14B, the support of the substrate 1 by the transport belt 14A is released. Further, the stage 16 moves in the +Z direction to support the substrate 1, and the support of the substrate 1 by the transport belt 14A is released.

[0022] When transferring the substrate 1 from the stage 16 to the transport device 14, the stage 16 moves in the -Y direction until one side of the substrate 1 comes onto the transport belt 14A, and the guide member 14B on the +Y side moves to the -Y side until the opposite side of the substrate 1 comes onto the transport belt 14A. When the stage 16 moves in the -Z direction by the stage moving device 18, the support of the substrate 1 by the stage 16 is released, and the substrate 1 is supported by the transport belt 14A.

[0023] The component supply device 20 supplies the electronic components 2. The component supply device 20 includes a plurality of tape feeders. The tape feeder holds a plurality of electronic components 2. The component supply device 20 supplies at least one of the plurality of electronic components 2 to the supply position. The component supply device 20 is arranged on the -Y side of the transport device 14. Note that the component supply device 20 may be arranged on each of the +Y side and the -Y side of the transport device 14.

[0024] The mounting head 22 mounts the electronic components 2 on the substrate 1. The mounting head 22 supports the nozzle 30 and the camera 40. The mounting head 22 holds the electronic component 2 supplied from the component supply device 20 by the nozzle 30 and mounts it on the substrate 1. The mounting head 22 is movable between the supply position where the electronic component 2 is supplied from the component supply device 20 and the processing position where the substrate 1 is arranged. The mounting head 22 holds the electronic component 2 supplied to the supply position by the nozzle 30, moves to the processing position, and then mounts it on the surface of the substrate 1 arranged at the processing position.

[0025] The head moving device 24 moves the mounting head 22. In the embodiment, the head moving device 24 moves the mounting head 22 in each of the X-axis direction and the Y-axis direction. The head moving device 24 includes an X-axis moving device 24X that moves the mounting head 22 in the X-axis direction and a Y-axis moving device 24Y that moves the mounting head 22 in the Y-axis direction. Each of the X-axis moving device 24X and the Y-axis moving device 24Y includes an actuator. The X-axis moving device 24X is connected to the mounting head 22. By the operation of the X-axis moving device 24X, the mounting head 22 moves in the X-axis direction. The Y-axis moving device 24Y is connected to the mounting head 22 via the X-axis moving device 24X. By the operation of the Y-axis moving device 24Y causing the X-axis moving device 24X to move in the Y-axis direction, the mounting head 22 moves in the Y-axis direction.

[0026] The chamber 28 has an internal space in which the base member 12, the transfer device 14, the stage 16, the stage moving device 18, the component supply device 20, the mounting head 22, and the head moving device 24 are respectively accommodated.

[0027] Also, a dispenser (not shown) may be accommodated in the internal space of the chamber 28. The dispenser applies cream solder to the substrate 1. The dispenser moves in each of the X-axis direction, the Y-axis direction, and the Z-axis direction on the +Z side of the transfer device 14. The dispenser and the mounting head 22 are movable separately. After the cream solder is applied to the surface of the substrate 1 by the dispenser, the electronic component 2 is mounted on the substrate 1 by the mounting head 22.

[0028] [Mounting head] FIG. 3 is a diagram schematically showing the mounting head 22 according to the embodiment. As shown in FIG. 3, a nozzle 30 and a camera 40 are arranged on the mounting head 22. In the embodiment, the nozzle 30 includes two nozzles 30 at positions separated by a predetermined distance in the X-axis direction.

[0029] The nozzle 30 releasably holds the electronic component 2. The nozzle 30 is a suction nozzle that suction-holds the electronic component 2. An opening 30A is provided at the lower end of the nozzle 30.

[0030] The nozzle 30 is connected to the lower end of the shaft 32. The shaft 32 is supported by the mounting head 22 such that the axis is parallel to the Z-axis direction. The nozzle 30 is attached to the shaft 32 such that the axis is parallel to the vertical direction. One shaft 32 is provided for each nozzle 30. The plurality of nozzles 30 are connected to each of the plurality of shafts 32.

[0031] The mounting head 22 has a nozzle moving device 34 for moving the nozzle 30. The nozzle moving device 34 moves the shaft 32 in each of the Z-axis direction and the θZ direction. The nozzle moving device 34 is supported by the mounting head 22. One nozzle moving device 34 is provided for each shaft 32. The plurality of nozzle moving devices 34 are connected to each of the plurality of shafts 32.

[0032] The nozzle 30 is supported by the mounting head 22 via the shaft 32 and the nozzle moving device 34. The nozzle moving device 34 moves the nozzle 30 by moving the shaft 32 in the Z-axis direction and the θZ direction. The nozzle 30 is supported by the mounting head 22 so as to be able to move up and down and rotate about the axis. The nozzle 30 can be moved in each of the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction by the head moving device 24 and the nozzle moving device 34. When the nozzle 30 moves, the electronic component 2 held by the nozzle 30 can also be moved in each of the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction.

[0033] The opening 30A of the nozzle 30 is connected to the vacuum system through the inside of the shaft 32. With the lower end of the nozzle 30 in contact with the electronic component 2, the suction operation from the opening 30A provided at the lower end of the nozzle 30 is performed, whereby the electronic component 2 is adsorbed and held at the lower end of the nozzle 30. When the suction operation from the opening 30A is released, the electronic component 2 is released from the nozzle 30.

[0034] In an embodiment, the nozzle 30 has a plurality of suction portions (openings 30A) arranged side by side in the horizontal direction. The plurality of suction portions may be arranged so as to be aligned only in one horizontal direction, or may be arranged so as to be two-dimensionally aligned in the horizontal plane direction. The nozzle 30 having the plurality of openings 30A can stably adsorb, hold, and convey the upper surface of the large electronic component 2 by the plurality of openings 30A adsorbing it.

[0035] Note that the number of nozzles 30 is not limited to two, and may be three or more. The three or more nozzles 30 may be arranged in a single row, or may be arranged in two or more rows. Further, the nozzle 30 may be a gripper nozzle that holds the electronic component 2 with it sandwiched therebetween.

[0036] The camera 40 photographs the substrate 1 and the electronic component 2. The camera 40 is, for example, an OCC (Optical Camera Communication) camera. The camera 40 photographs in the -Z direction.

[0037] The camera 40 is connected to the lower end portion of the support member 42. The mounting head 22 has a camera moving device 44 that moves the camera 40. The camera moving device 44 moves the support member 42 in the Z-axis direction. The camera moving device 44 is supported by the mounting head 22 so as to be able to move up and down.

[0038] The camera 40 is supported by the mounting head 22 via the support member 42 and the camera moving device 44. The camera moving device 44 moves the camera 40 by moving the support member 42 in the Z-axis direction. The camera 40 is movable in each of the X-axis direction, the Y-axis direction, and the Z-axis direction by the head moving device 24 and the camera moving device 44.

[0039] In the embodiment, the camera 40 is arranged between the two nozzles 30. Note that the camera 40 is preferably arranged at the center of the plurality of nozzles 30 in a plan view. For example, when eight nozzles 30 are arranged in a single row, it is preferable that four nozzles 30, the camera 40, and four nozzles 30 are arranged in this order.

[0040] In a state where the nozzle 30 and the camera 40 are each at the uppermost +Z side raised position, the lower end of the camera 40 is positioned above the lower end (opening 30A) of the nozzle 30. That is, the camera 40 can be retracted above the electronic component 2 adsorbed and held by the nozzle 30.

[0041] In the embodiment, the camera 40 photographs the surface of the substrate 1 supported by the stage 16 from the +Z side of the substrate 1. The camera 40 can photograph, for example, the alignment marks provided on the surface of the substrate 1. In the embodiment, the camera 40 photographs the upper surface of the electronic component 2 held by the component supply device 20 from the +Z side of the electronic component 2. The camera 40 can photograph, for example, the adsorption position of the electronic component 2 held by the component supply device 20. By moving in the Z-axis direction, the camera 40 can clearly photograph from at least the height of the surface of the substrate 1 supported by the stage 16 to the height of the upper surface of the large electronic component 2 held by the component supply device 20 without increasing the focal length of the camera 40 itself.

[0042] FIG. 4 is a diagram for explaining the operation during photographing. In the example shown in FIG. 4, a situation of photographing the surface of the substrate 1 supported by the stage 16 is shown.

[0043] The camera 40 is supported by the mounting head 22 at a position where the lower end is retracted above the lower end of the nozzle 30 when the mounting head 22 moves onto the substrate 1 supported by the stage 16. When starting photographing by the camera 40, the camera moving device 44 lowers the camera 40 in the -Z direction. The lower end of the camera 40 descends to a position below the lower end (opening 30A) of the nozzle 30. Thereby, the camera 40 can adjust the height and focus on the surface of the substrate 1 within the moving range of the camera 40.

[0044] In the example shown in FIG. 4, the situation of photographing the surface of the substrate 1 has been described. However, the same applies when photographing the electronic component 2 held by the component supply device 20 to confirm the adsorption position of the electronic component 2, or when photographing the electronic component 2 mounted on the substrate 1 to confirm the mounting position of the electronic component 2. That is, during normal times, the camera 40 is retracted upward to avoid interference between the camera 40 and the electronic component 2, and during photographing, the camera 40 is lowered to focus on the photographing object at a low position. Alternatively, the camera 40 may be retracted upward only when interference with the electronic component 2 is predicted.

[0045] FIG. 5 is a diagram for explaining the operation during component adsorption. In the example shown in FIG. 5, the situation of adsorbing and holding the electronic component 2 held by the component supply device 20 with the nozzle 30 is shown.

[0046] The head moving device 24 moves the mounting head 22 to the component supply device 20. At this time, if the camera 40 is in the lowered position, the camera moving device 44 raises the camera 40 in the +Z direction and retracts it so that the lower end of the camera 40 is positioned above the lower end of the nozzle 30 at the highest raised position. The nozzle moving device 34 lowers the nozzle 30 in the -Z direction until the opening 30A (see FIG. 3) of the nozzle 30 abuts against the upper surface of the electronic component 2. By supplying a vacuum pressure to the opening 30A of the nozzle 30, the electronic component 2 is sucked at the opening 30A.

[0047] The nozzle moving device 34 raises the nozzle 30 in the +Z direction to a predetermined height. The electronic component 2 is sucked and held at the lower end portion of the nozzle 30 and is lifted in the +Z direction together with the nozzle 30. At this time, since the lower end of the camera 40 is positioned above the lower end of the nozzle 30 and the upper surface of the electronic component 2 is positioned below the lower end of the camera 40, even if the electronic component 2 held by the nozzle 30 is a long object long in the X-axis direction, interference with the camera 40 can be prevented.

[0048] FIG. 6 is a diagram for explaining the operation during imaging while a component is being adsorbed. In the example shown in FIG. 6, a situation is shown where the nozzle 30 is in a state of adsorbing and holding the electronic component 2, and the electronic component 2 held by the component supply device 20 is imaged.

[0049] For example, after adsorbing and holding the electronic component 2 with one nozzle 30 (the right - hand nozzle 30 in FIG. 6), a situation where the adsorption and holding of the electronic component 2 with the other nozzle 30 (the left - hand nozzle 30 in FIG. 6) fails is assumed. In such a situation, due to an error in adsorption and holding, the operation of the mounting device 10 temporarily stops, and in order for the operator to check the adsorption position, the camera 40 may be used to check the adsorption position of the electronic component 2 that was supposed to be adsorbed and held by the other nozzle 30 while the electronic component 2 is still adsorbed and held by one nozzle 30.

[0050] In such a case, if the electronic component 2 adsorbed and held by one nozzle 30 is a long object that is long in the X - axis direction, there is a possibility of interference with the electronic component 2 when the camera 40 is lowered. Therefore, the nozzle moving device 34 rotates one nozzle 30 by 90 degrees around the axis (θZ direction). The electronic component 2 held by one nozzle 30 rotates 90 degrees in the θZ direction together with the nozzle 30. As a result, the electronic component 2 retreats from the area directly below the camera 40. After that, similar to the normal imaging, the camera moving device 44 lowers the camera 40 in the - Z direction.

[0051] [Control device] The control device 50 shown in FIG. 2 controls each part of the mounting device 10. The control device 50 includes at least one processor, a main memory, a storage, and an interface. The processor is a CPU (Central Processing Unit). The main memory includes a non-volatile memory such as a ROM (Read Only Memory) and a volatile memory such as a RAM (Random Access Memory). Examples of the storage include a hard disk drive (HDD), a solid state drive (SSD), a magnetic disk, a magneto-optical disk, a CD-ROM, and a DVD-ROM. The interface includes an input / output circuit. The functions of the processor are stored in the storage as a program. The processor reads the program from the storage, expands it in the main memory, and executes processing according to the program.

[0052] [Mounting Process] FIG. 7 is a flowchart showing the mounting process according to the embodiment. The processing of the flowchart shown in FIG. 7 is executed by the control device 50 of the mounting device 10 in accordance with a program stored in advance. In the mounting process, the suction position of the electronic component 2 in the component supply device 20, the mounting coordinates of the electronic component 2 on the substrate 1, etc. are assumed to be stored in the mounting device 10 in advance by teaching performed before the mounting process shown in FIG. 7.

[0053] The substrate 1 is conveyed to the mounting device 10. The control device 50 controls the head movement device 24 to move the mounting head 22 to the imaging start position by the camera 40 above the substrate 1 (step SA1). The imaging start position indicates, for example, a position where the imaging area by the camera 40 includes one of the corners of the substrate 1.

[0054] The control device 50 controls the camera movement device 44 to move the camera 40 in the -Z direction (step SA2). The lower end of the camera 40 descends to a position below the lower end (opening 30A) of the nozzle 30. Thereby, the focus of the camera 40 is adjusted to the height of the surface of the substrate 1.

[0055] The control device 50 causes the camera 40 to photograph the surface of the substrate 1 (step SA3). Specifically, the mounting head 22 is moved in the X-axis direction and the Y-axis direction by the head moving device 24, and the camera 40 photographs the entire surface of the substrate 1 while changing the photographing position. The image photographed by the camera 40 is output to the control device 50. The control device 50 processes the image and detects the alignment mark.

[0056] When the photographing of the entire surface of the substrate 1 is completed and the alignment mark is recognized, the control device 50 controls the camera moving device 44 to move the camera 40 in the +Z direction (step SA4). The lower end of the camera 40 rises to a position above the lower end of the nozzle 30 at the most raised position. Thereby, the camera 40 retreats above the electronic component 2 held by suction by the nozzle 30.

[0057] The control device 50 sets the execution number i to i = 1 and starts loop processing (step SA5). In the loop processing, while i ≦ n holds, the processing from step SA6 to step SA9 is repeatedly executed n times. Here, n is the number of electronic components 2 to be mounted on the substrate 1, and i is the order in which the electronic components 2 are mounted at predetermined mounting positions on the substrate 1.

[0058] The control device 50 controls the head moving device 24 to move the mounting head 22 to the component supply position of the i-th electronic component 2 held by the component supply device 20 (step SA6). At this time, the height of the moving mounting head 22 is set within a range where the lower end of the nozzle 30 does not interfere with the electronic component 2 according to the height of the electronic component 2 held by the component supply device 20. In step SA4, since the camera 40 is retracted above the lower end of the nozzle 30, similarly, the camera 40 also does not interfere with the electronic component 2.

[0059] The control device 50 controls the nozzle moving device 34 to move the nozzle 30 in the -Z direction until the opening 30A (see FIG. 3) of the nozzle 30 abuts against the upper surface of the electronic component 2. Due to the vacuum pressure supplied to the opening 30A of the nozzle 30, the nozzle 30 adsorbs the electronic component 2 at the opening 30A (step SA7). The control device 50 controls the nozzle moving device 34 to move the nozzle 30 in the +Z direction to lift the i-th electronic component 2 from the component supply device 20.

[0060] The control device 50 controls the head moving device 24 to move the mounting head 22 to the mounting position on the substrate 1 of the electronic component 2 to be mounted in the i-th position (step SA8). At this time, the height of the moving mounting head 22 is set within a range where the electronic component 2 held by the nozzle 30 does not interfere with the electronic component 2 already mounted on the substrate 1, according to the height of the electronic component 2 already mounted on the substrate 1 and the height of the electronic component 2 held by the nozzle 30. In step SA4, since the camera 40 is retracted above the lower end of the nozzle 30, similarly, the camera 40 also does not interfere with the electronic component 2 already mounted on the substrate 1.

[0061] The control device 50 controls the nozzle moving device 34 to move the nozzle 30 in the -Z direction until the i-th electronic component 2 adsorbed and held by the nozzle 30 abuts against the mounting position on the surface of the substrate 1. The control device 50 stops the vacuum pressure supplied to the opening 30A of the nozzle 30 to release the adsorption and holding of the i-th electronic component 2 by the nozzle 30. The control device 50 controls the nozzle moving device 34 to move the nozzle 30 in the +Z direction. Thereby, the i-th electronic component 2 is mounted on the substrate 1 (step SA9).

[0062] The control device 50 re-sets the execution number i as i = i + 1 in the loop process and returns to step SA6. When the processes from step SA6 to step SA7 are executed n times and all the electronic components 2 are mounted at each predetermined position on the substrate 1, the loop process ends (step SA8).

[0063] In the above description, the electronic components 2 are described as being transported and mounted one by one. However, when the mounting head 22 has a plurality of nozzles 30 as in the embodiment, the processes from step SA6 to step SA9 may be executed collectively for each number of nozzles 30.

[0064] Also, when the mounting apparatus 10 has a dispenser, in the above process, before mounting the electronic component 2 at a predetermined mounting position on the substrate 1, the cream solder is applied to the corresponding area of the substrate 1 by the dispenser. For example, after step SA4, the cream solder may be applied collectively to the application areas corresponding to all n electronic components 2, or the application of the cream solder and the mounting of the electronic component 2 may be repeated for each one electronic component 2.

[0065] [Camera activation process during temporary stop of the apparatus] FIG. 8 is a flowchart showing the confirmation process at the time of adsorption failure. The process of the flowchart shown in FIG. 8 is executed by the control device 50 of the mounting apparatus 10 in accordance with a program stored in advance. For example, in step SA7 of the flowchart shown in FIG. 7, when the adsorption of the electronic component 2 by the nozzle 30 fails, the mounting apparatus 10 temporarily stops the mounting process. At this time, the control device 50 starts the process of the flowchart shown in FIG. 8, for example, by receiving a predetermined operation for confirming the adsorption position by the camera 40.

[0066] The control device 50 determines whether there is a nozzle 30 that has adsorbed the electronic component 2 (step SB1). For example, in the mounting apparatus 10 having two nozzles 30 of the embodiment, after adsorbing and holding the electronic component 2 with one nozzle 30 and then failing to adsorb and hold the electronic component 2 with the other nozzle 30, since one nozzle 30 has adsorbed the electronic component 2, it is determined that there is a nozzle 30 that has adsorbed the electronic component 2. The determination in step SB1 is made based on, for example, a preset control program for the mounting process and the progress status of the process so far.

[0067] When the control device 50 determines that there is no nozzle 30 that has adsorbed the electronic component 2 (step SB1; No), it proceeds to step SB2. When the control device 50 determines that there is a nozzle 30 that has adsorbed the electronic component 2 (step SB1; Yes), it determines whether the camera 40 may interfere with the electronic component 2 (step SB2). For example, when the electronic component 2 adsorbed and held by the nozzle 30 is an elongated object that is long in the X-axis direction and a part of the electronic component 2 is located directly below the camera 40, it is determined that the camera 40 may interfere with the electronic component 2. The determination in step SB2 is made, for example, based on the information of the electronic component 2 stored in advance.

[0068] When the control device 50 determines that the camera 40 is unlikely to interfere with the electronic component 2 (step SB2; No), it proceeds to step SB3. When the control device 50 determines that the camera 40 may interfere with the electronic component 2 (step SB2; Yes), it rotates the nozzle 30 that has adsorbed the electronic component 2 by 90 degrees around the axis (θZ direction) (step SB3). The control device 50 controls the nozzle moving device 34 to rotate the nozzle 30 by 90 degrees around the axis (θZ direction). The electronic component 2 adsorbed and held by the nozzle 30 rotates by 90 degrees in the θZ direction together with the nozzle 30. Thereby, the electronic component 2 retreats from the area directly below the camera 40.

[0069] The control device 50 moves the camera 40 downward (step SB4). The control device 50 controls the camera moving device 44 to lower the camera 40 in the -Z direction.

[0070] The control device 50 causes the camera 40 to photograph the electronic component 2 that has failed to be adsorbed (step SB5). The photographing area by the camera 40 may be arbitrarily changed by the operator. That is, during the photographing by the camera 40, the mounting head 22 may be moved by a manual operation by the operator.

[0071] [Effect] As described above, according to the present embodiment, since the camera 40 can be moved in the Z-axis direction with respect to the nozzle 30, when the nozzle 30 holds the electronic component 2, the camera 40 can be moved above the lower end of the nozzle 30, and when the camera 40 photographs the substrate 1 or the like, the camera 40 can be moved downward so as to be in focus. As a result, even if the mounting head 22 is at a high position to avoid large electronic components 2, it is possible to focus on the imaging target without using a camera 40 with a long focal length. Therefore, it is possible to mount large electronic components 2 without complicating the movement path of the mounting head 22 so that the camera 40 does not collide with the electronic components 2 already mounted on the substrate 1 or increasing the size of the apparatus by mounting a camera 40 with a long focal length.

[0072] Further, the camera 40 of the embodiment can be moved above the lower end of the nozzle 30 in a state where the nozzle 30 is at the position where it has risen to the most +Z side. Therefore, the camera 40 can be retracted above the lower end of the nozzle 30 regardless of the height of the nozzle 30. For this reason, the movement path of the mounting head 22 can be set according to the height of the nozzle 30. Further, while the nozzle 30 holds the electronic component 2, it can be retracted above the electronic component 2 held by the nozzle 30.

[0073] Further, in the embodiment, a plurality of nozzles 30 are arranged at positions separated in the horizontal direction, and the camera 40 is arranged at the center of the plurality of nozzles 30 in a plan view. Thereby, when thermal expansion is caused in the support member of the nozzle 30 of the mounting head 22 due to environmental changes such as temperature and humidity, it is possible to suppress the influence of the change in the relative distance between each nozzle 30 and the camera 40.

[0074] Also, in the embodiment, it is also possible to operate the camera 40 while the nozzle 30 holds the electronic component 2. In such a case, if a part of the electronic component 2 held by the nozzle 30 is located directly below the camera 40, when the camera 40 is lowered, it will interfere with the electronic component 2. Therefore, by rotating the nozzle 30 around its axis, the short side direction of the electronic component 2 can be aligned with the direction in which the nozzle 30, the camera 40, and the electronic component 2 are aligned, and the electronic component 2 can be retracted from directly below the camera 40.

[0075] [Other Embodiments] As described above, the embodiments of the present application have been described, but the present invention is not limited by the contents of these embodiments. The above-described embodiments and modifications can be appropriately combined within a range that does not cause contradictions in the processing contents. In addition, the above-described components include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those within the so-called equivalent range. Furthermore, the above-described components can be appropriately combined. Furthermore, various omissions, substitutions, or changes of the components can be made without departing from the gist of the above-described embodiments.

[0076] For example, among the processes described in the above embodiment, all or part of the processes described as being automatically performed can be manually performed, or all or part of the processes described as being manually performed can be automatically performed by a known method. In addition, regarding the processing procedures, specific names, and information including various data and parameters shown in the above document and drawings, they can be arbitrarily changed unless otherwise specified. For example, the various information shown in each figure is not limited to the illustrated information.

[0077] Moreover, each component of each illustrated device is functionally conceptual and does not necessarily have to be physically configured as shown in the figures. That is, the specific form of the distribution and integration of each device is not limited to that shown in the figures, and all or part of it can be functionally or physically distributed and integrated in any unit according to various loads, usage conditions, etc. Further, the above-described control device 50 may be configured by a plurality of computers divided into several functions, may exist separately via a network, and some functions of the computer may be possessed by a cloud server that executes various functions in the form of cloud computing. Also, the program may be distributed to the control device 50 via a network.

Description of Reference Numerals

[0078] 1... Substrate, 2... Electronic component, 10... Mounting device, 12... Base member, 14... Conveying device, 14A... Conveyor belt, 14B... Guide member, 16... Stage, 18... Stage moving device, 20... Component supply device, 22... Mounting head, 24... Head moving device, 24X... X-axis moving device, 24Y... Y-axis moving device, 28... Chamber, 30... Nozzle, 30A... Opening, 32... Shaft, 34... Nozzle moving device, 40... Camera, 42... Support member, 44... Camera moving device, 50... Control device.

Claims

1. An implementation head, a nozzle supported by the implementation head for holding an electronic component, a nozzle moving device for axially moving the nozzle with respect to the implementation head, a camera supported by the implementation head for photographing a substrate on which the electronic component is to be mounted from above, a camera moving device for vertically moving the camera with respect to the nozzle, and an implementation device.

2. The camera is movable above the lower end of the nozzle at the highest raised position, The implementation device according to claim 1.

3. When the nozzle holds the electronic component, the camera moving device moves the camera above the lower end of the nozzle, The implementation device according to claim 1.

4. When the camera photographs the substrate, the camera moving device moves the camera downward, The implementation device according to claim 1.

5. The nozzle includes a plurality of nozzles arranged at horizontally separated positions, The camera is arranged at the center of the plurality of nozzles in plan view, The implementation device according to claim 1.

6. When starting photographing by the camera while at least one of the plurality of nozzles holds the electronic component, and a part of the electronic component held by the nozzle is directly below the camera, The nozzle moving device rotates the nozzle 90 degrees around its axis, The implementation device according to claim 5.

7. Moving the implementation head to a predetermined photographing position by a camera for photographing a substrate on which an electronic component is to be mounted from above, supported by the implementation head; Causing the camera to photograph the substrate while the camera is moved downward with respect to a nozzle supported by the implementation head and holding the electronic component; Causing the nozzle to hold the electronic component while the camera is moved above the nozzle; and including A control method for an implementation device.

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