Mounting device and method for controlling mounting device

Abstract

To rapidly correct a displacement in a turret-type mounting head.SOLUTION: A mounting device includes: a plurality of nozzles for holding an electronic component to be mounted on a substrate; a mounting head having a turret for supporting the nozzles at a peripheral part; a nozzle driving device for moving each of the nozzles relative to the turret in a direction parallel to a drive shaft and rotating the turret relative to the axis of rotation; an imaging device for imaging the electronic component supported by the mounting head and held by the nozzles, from a direction in parallel to the drive shaft of the nozzles; and a controller. The controller calculates and stores the displacement amount of the position of the electronic component from the initial position recognized from an image taken by the imaging device, and determines that it is necessary to perform correction processing of correcting the original point of the axis of rotation in the direction of rotation when the change amount of the displacement amount acquired last to a previous displacement amount is larger than a threshold value and the displacement directions are the same (positive or negative) in the nozzles used to calculates the displacement amount.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The technology disclosed in this specification relates to a mounting device and a control method for the mounting device.

Background Art

[0002] In the technical field related to mounting devices, a turret-type mounting head in which a plurality of nozzles are arranged in the circumferential direction is known (see, for example, Patent Document 1). In such a mounting head, a plurality of nozzles arranged around a turret base with a rotation axis inclined from the vertical direction pivot as the turret base rotates, and only the nozzle at the lowest position is configured such that the drive axis of the nozzle faces the vertical direction. The turret base pivots, for example, by gear drive.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in a turret-type mounting head, the origin of the rotation direction of the pivot axis may suddenly shift during production or after maintenance, so the displacement amount is periodically measured using a jig nozzle and angle correction is performed. Conventionally, correction is performed at predetermined intervals. However, if a gear shift occurs immediately after correction, production continues with the position of the drive axis of the nozzle shifted until the next correction cycle, which may cause a shift in the mounting position of the component and lead to poor quality.

[0005] The technology disclosed in this specification aims to quickly correct displacement when it occurs in a turret-type mounting head.

Means for Solving the Problems

[0006] This specification discloses a mounting device. The mounting device includes a plurality of nozzles for holding electronic components to be mounted on a substrate, a mounting head having a turret that supports the plurality of nozzles at a peripheral portion, a nozzle driving device that moves each of the plurality of nozzles in a direction parallel to a driving axis with respect to the turret and pivots the turret about a rotation axis, an imaging device that is supported by the mounting head and images the electronic component held by the nozzle from a direction parallel to the driving axis of the nozzle, and a control device. The control device calculates and stores a deviation amount from an initial position of the position of the electronic component recognized from an imaging image captured by the imaging device. In the plurality of nozzles for which the deviation amount has been calculated, when a change amount of the last obtained deviation amount with respect to the past deviation amount exceeds a threshold value and the positive and negative of the deviation direction are the same, it is determined that a correction process for correcting the origin of the rotation direction of the rotation axis is necessary.

Advantages of the Invention

[0007] According to the technology disclosed in this specification, when a positional deviation occurs in a turret-type mounting head, it can be quickly corrected.

Brief Description of the Drawings

[0008]

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DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments will be described with reference to the drawings. In the embodiments, an XgYgZg orthogonal coordinate system is defined, and the positional relationships of each part will be described with reference to this XgYgZg orthogonal coordinate system. The direction parallel to the Xg axis of a predetermined plane is defined as the Xg-axis direction. The direction parallel to the Yg axis of the predetermined plane orthogonal to the Xg axis is defined as the Yg-axis direction. The direction parallel to the Zg axis orthogonal to the predetermined plane is defined as the Zg-axis direction. The rotation direction or inclination direction centered on the Xg-axis direction is defined as the θXg direction. The rotation direction or inclination direction centered on the Yg-axis direction is defined as the θYg direction. The rotation direction or inclination direction centered on the Zg-axis direction is defined as the θZg direction. In the embodiments, the predetermined plane is parallel to the horizontal plane. The Zg axis is parallel to the vertical axis, and the Zg-axis direction is the up-down direction. The +Zg side is the upper side, and the -Zg side is the lower side. Note that the predetermined plane may be inclined with respect to the horizontal plane. Also, in the embodiments, the predetermined plane including the Xg axis and the Yg axis is appropriately referred to as the XgYg plane.

[0010] [Mounting Device] FIG. 1 is a side view schematically showing a mounting apparatus 1 according to an embodiment. FIG. 2 is a plan view schematically showing the mounting apparatus 1 according to the embodiment. The mounting apparatus 1 is an apparatus for mounting an electronic component C on a substrate P. As shown in FIGS. 1 and 2, the mounting apparatus 1 includes a base member 2, a substrate transfer device 3, a component supply device 4, a nozzle housing portion 51 that houses a nozzle 5 and an auxiliary jig nozzle J, a component storage portion 52 that stores the electronic component C, a mounting head 6 having the nozzle 5, a head moving device 7, a nozzle moving device 8, and a control device 9. Further, the mounting apparatus 1 further includes an operation device (not shown) for an operator to operate, a display device (not shown) for displaying various information, a warning device that generates an alarm by light or sound, and the like.

[0011] The base member 2 supports each of the substrate transfer device 3, the component supply device 4, the nozzle housing portion 51, the component storage portion 52, the mounting head 6, the head moving device 7, and the nozzle moving device 8.

[0012] The substrate transfer device 3 transfers the substrate P to the mounting area DM. The mounting area DM is defined in the transfer path of the substrate transfer device 3. In the embodiment, the substrate transfer device 3 transfers the substrate P in the Xg-axis direction. The substrate P before the electronic component C is mounted is carried into the substrate transfer device 3 from the -Xg side end of the base member 2. The substrate transfer device 3 transfers the carried-in substrate P in the +Xg direction and stops it in the mounting area DM. The mounting head 6 mounts the electronic component C on the surface of the substrate P disposed in the mounting area DM. The substrate transfer device 3 transfers the substrate P after the electronic component C is mounted in the +Xg direction. The substrate P after the electronic component C is mounted is carried out from the +Xg side end of the base member 2.

[0013] The component supply device 4 supplies the electronic component C to the supply area SM. The component supply device 4 includes a plurality of tape feeders. The supply area SM for the electronic component C is defined by the tape feeder. The tape feeder conveys a carrier tape that holds a plurality of electronic components C. When the carrier tape is conveyed, at least one of the plurality of electronic components C is supplied to the supply area SM. In the embodiment, the component supply device 4 is arranged on both the +Yg side and the -Yg side of the substrate transfer device 3. Note that the component supply device 4 may be arranged on either the +Yg side or the -Yg side of the substrate transfer device 3.

[0014] The nozzle 5 releasably holds the electronic component C. The nozzle 5 is a suction nozzle that suction-holds the electronic component C. An opening is provided at the tip of the nozzle 5. The opening of the nozzle 5 is connected to a vacuum system. With the tip of the nozzle 5 in contact with the electronic component C, the electronic component C is suction-held at the tip of the nozzle 5 by performing a suction operation from the opening provided at the tip of the nozzle 5. When the suction operation from the opening is released, the electronic component C is released from the nozzle 5. Note that the nozzle 5 may be a gripping nozzle that holds the electronic component C by sandwiching it.

[0015] The nozzle storage unit 51 stores the nozzle 5 and the auxiliary jig nozzle J for automatically controlling the attachment and detachment of the nozzle 5 and the auxiliary jig nozzle J to and from the mounting head 6. The nozzle storage unit 51 is arranged within the movable region of the mounting head 6. The mounting head 6 changes the nozzle 5 or the auxiliary jig nozzle J mounted in the nozzle storage unit 51. When the mounting device 1 changes the nozzle 5 mounted on the mounting head 6, changes from the nozzle 5 to the auxiliary jig nozzle J, or changes from the auxiliary jig nozzle J to the nozzle 5, the mounting head 6 is moved to a predetermined position of the nozzle storage unit 51 to release the mounted nozzle 5 or auxiliary jig nozzle J and mount a new nozzle 5 or auxiliary jig nozzle J. Note that the nozzle storage unit 51 may be provided separately for storing the nozzle 5 and for storing the auxiliary jig nozzle J.

[0016] The component storage unit 52 is a box that stores the electronic components C that the mounting head 6 holds with the nozzles 5 and does not mount on the substrate P. That is, in the mounting apparatus 1, it serves as a waste box for discarding the electronic components C that are not mounted on the substrate P. The nozzle storage unit 51 is disposed within the movable range of the mounting head 6. When there are electronic components C among the electronic components C held by the mounting head 6 that are not to be mounted on the substrate P, the mounting apparatus 1 moves the mounting head 6 to a position facing the component storage unit 52 and releases the held electronic components C, thereby dropping the electronic components C into the component storage unit 52.

[0017] The mounting head 6 holds the electronic components C supplied from the component supply device 4 with the nozzles 5 and mounts them on the substrate P. The mounting head 6 has a plurality of nozzles 5. The mounting head 6 can hold the held electronic components C under appropriate conditions (suction or gripping) by supplying air pressure to the mounted nozzles 5 for driving.

[0018] The mounting head 6 is movable between a supply area SM where the electronic components C are supplied and a mounting area DM where the substrate P is disposed. The supply area SM and the mounting area DM are defined at different positions within the XgYg plane. The mounting head 6 can be moved between the supply area SM and the mounting area DM in the Xg-axis direction, Yg-axis direction, and Zg-axis direction respectively by the head moving device 7. The mounting head 6 holds the electronic components C supplied to the supply area SM with the nozzles 5, moves to the mounting area DM, and then mounts them on the substrate P disposed in the mounting area DM.

[0019] The head moving device 7 can move the mounting head 6 in the Xg-axis direction, Yg-axis direction, and Zg-axis direction respectively. The head moving device 7 includes an Xg-axis moving device 71 that moves the mounting head 6 in the Xg-axis direction, a Yg-axis moving device 72 that moves the mounting head 6 in the Yg-axis direction, and a Zg-axis moving device 73 that moves the mounting head 6 in the Zg-axis direction.

[0020] The Zg-axis moving device 73 is connected to the mounting head 6. By driving the Zg-axis moving device 73, the mounting head 6 moves in the Zg-axis direction. The Xg-axis moving device 71 is connected to the mounting head 6 via the Zg-axis moving device 73. By driving the Xg-axis moving device 71, the Zg-axis moving device 73 moves in the Xg-axis direction, whereby the mounting head 6 moves in the Xg-axis direction. The Yg-axis moving device 72 is connected to the mounting head 6 via the Xg-axis moving device 71 and the Zg-axis moving device 73. By driving the Yg-axis moving device 72, the Xg-axis moving device 71 moves in the Yg-axis direction, whereby the mounting head 6 moves in the Yg-axis direction.

[0021] In the embodiment, the Yg-axis moving device 72 includes a pair of Yg-axis moving devices 72 and is supported by the support columns 21 arranged at each of the four corners of the base member 2. The Yg-axis moving device 72 includes, for example, a Yg-axis guide member extending in the Yg-axis direction, a Yg-axis slide member guided by the Yg-axis guide member and sliding in the Yg-axis direction, and a Yg-axis actuator that generates power for the Yg-axis slide member to move in the Yg-axis direction. The Yg-axis guide member is supported by two support columns 21 arranged in the Yg-axis direction. The Yg-axis slide member supports the Xg-axis moving device 71.

[0022] The Xg-axis moving device 71 includes an Xg-axis guide member supported by the Yg-axis slide member of the Yg-axis moving device 72 and extending in the Xg-axis direction, an Xg-axis slide member guided by the Xg-axis guide member and sliding in the Xg-axis direction, and an Xg-axis actuator that generates power for the Xg-axis slide member to move in the Xg-axis direction. The Xg-axis slide member supports the Zg-axis moving device 73.

[0023] The Zg-axis moving device 73 includes a Zg-axis guide member supported by the Xg-axis slide member of the Xg-axis moving device 71 and extending in the Zg-axis direction, a Zg-axis slide member guided by the Zg-axis guide member and sliding in the Zg-axis direction, and a Zg-axis actuator that generates power for the Zg-axis slide member to move in the Zg-axis direction. The Zg-axis slide member supports the mounting head 6.

[0024] [Mounting Head] FIG. 3 is a side view showing the mounting head 6 according to the embodiment. The mounting head 6 is of a turret type. As shown in FIG. 3, the mounting head 6 includes a housing 61, a rotor shaft 62, and a turret 63. Further, an imaging device 64 and a mirror 65 are disposed on the mounting head 6.

[0025] The housing 61 is connected to the Zg-axis moving device 73. The housing 61 supports the rotor shaft 62, the imaging device 64, and the mirror 65.

[0026] The rotor shaft 62 is supported by at least a part of the housing 61. The rotor shaft 62 is supported by the housing 61 so as to be rotatable about the rotation axis AX with the axis center as the rotation axis AX. The rotation axis AX is inclined with respect to the Zg axis. One end side of the rotor shaft 62 is supported by the housing 61, and the other end side supports the turret 63.

[0027] The turret 63 is supported by the housing 61 via the rotor shaft 62. The turret 63 supports a plurality of nozzles 5. The turret 63 rotates about the rotation axis AX. The plurality of nozzles 5 are arranged at intervals on the peripheral edge of the turret 63. As the turret 63 rotates about the rotation axis AX, the plurality of nozzles 5 move in the Zg-axis direction (vertical direction) while revolving around the rotation axis AX.

[0028] The nozzle 5 is movable in the axial direction parallel to the specified drive axis with respect to the turret 63. Further, the nozzle 5 is movable in the rotation direction about the drive axis. In the embodiment, the drive axis of the nozzle 5 is appropriately referred to as the Zc axis, the direction parallel to the Zc axis is appropriately referred to as the Zc-axis direction, and the rotation direction about the Zc axis is appropriately referred to as the θZc direction. Further, the turning direction about the rotation axis AX is appropriately referred to as the turning direction of the rotation axis AX.

[0029] When the nozzle 5 is disposed at the first position LP in the circumferential direction of the rotation axis AX, it is disposed at the lowest position in the turning path. When the nozzle 5 is disposed at the second position TP in the circumferential direction of the rotation axis AX, it is disposed at the uppermost position in the turning path. The first position LP and the second position TP are opposed to each other in the radial direction of the rotation axis AX. The drive axis of the nozzle 5 disposed at the first position LP is parallel to the Zg axis. The drive axis of the nozzle 5 disposed at the second position TP is inclined with respect to the Zg axis.

[0030] The imaging device 64 images the electronic component C held by the nozzle 5 at the second position TP from the Zc axis direction. The imaging device 64 is supported by the housing 61. A mirror 65 is disposed between the optical paths of the imaging device 64 and the nozzle 5. The imaging device 64 images the electronic component C held by the nozzle 5 from the Zc axis direction via the mirror 65.

[0031] The mirror 65 is supported by the housing 61. The mirror 65 is disposed below the imaging device 64. The optical axis of the optical system of the imaging device 64 is parallel to the reflection axis of the Zc axis reflected by the mirror 65. Note that the imaging device 64 may image the electronic component C held by the nozzle 5 from the Zc axis direction without passing through the mirror 65.

[0032] The nozzle moving device 8 is capable of moving the nozzle 5 in each of the turning direction of the rotation axis AX, the Zc axis direction, and the θZc direction. The nozzle moving device 8 includes a turning device 81 that moves the nozzle 5 in the turning direction of the rotation axis AX, a Zc axis moving device 82 that moves the nozzle 5 in the Zc axis direction, and a θZc moving device 83 that moves the nozzle 5 in the θZc direction.

[0033] The turning device 81 includes an actuator that generates power to rotate the turret 63 about the rotation axis AX. The turning device 81 is connected to the rotor shaft 62. The turning device 81 rotates the turret 63 by rotating the rotor shaft 62. The turret 63 rotates inside the housing 61. When the turret 63 rotates about the rotation axis AX, the plurality of nozzles 5 turn around the rotation axis AX.

[0034] The Zc-axis moving device 82 is provided for each of the plurality of nozzles 5. The Zc-axis moving device 82 includes an actuator that generates power to move the nozzle 5 in the Zc-axis direction. At least a part of the Zc-axis moving device 82 is disposed on the turret 63. The plurality of nozzles 5 are movable separately in the Zc-axis direction.

[0035] The θZc moving device 83 includes an actuator that generates power to move the nozzle 5 in the θZc direction. At least a part of the θZc moving device 83 is disposed on the turret 63. In the embodiment, the plurality of nozzles 5 move synchronously in the θZc direction.

[0036] The nozzle 5 is movable in each of the Xg-axis direction, Yg-axis direction, Zg-axis direction, the turning direction of the rotation axis AX, Zc-axis direction, and θZc direction by the head moving device 7 and the nozzle moving device 8. In the embodiment, the nozzles 5 are evenly provided around the rotation axis AX.

[0037] [Operation of the mounting head] FIG. 4 is a diagram for explaining the operation of the mounting head 6 according to the embodiment. In the example shown in FIG. 4, it is assumed that the mounting head 6 has 16 nozzles 5.

[0038] When the nozzle 5 is disposed at the first position LP, it holds the electronic component C supplied from the component supply device 4 to the supply area SM. The drive shaft of the nozzle 5 disposed at the first position LP and the Zg axis are parallel. The nozzle 5 can hold the electronic component C disposed in the supply area SM by moving in the Zc-axis direction.

[0039] The nozzle 5 that holds the electronic component C at the first position LP turns around the rotation axis AX by rotation centered on the rotation axis AX of the turret 63 and reaches the second position TP. When the nozzle 5 is disposed at the second position TP, the imaging device 64 images the electronic component C held by the nozzle 5. The imaging device 64 images the electronic component C before being mounted on the substrate P supplied from the supply area SM.

[0040] The nozzle 5 that has imaged the electronic component C held at the second position TP revolves around the rotation axis AX of the turret 63 by rotation about the rotation axis AX and returns to the first position LP. When the nozzle 5 is disposed at the first position LP, the electronic component C is mounted on the substrate P disposed in the mounting area DP. The drive axis of the nozzle 5 disposed at the first position LP and the Zg axis are parallel. The nozzle 5 can mount the electronic component C on the substrate P by moving in the Zc-axis direction.

[0041] [Auxiliary jig nozzle] FIG. 5 is a schematic diagram showing an auxiliary jig nozzle J according to the embodiment. The auxiliary jig nozzle J is a jig for detecting the position of the drive axis (Zc axis) of the nozzle 5 and measuring the origin position in the rotation direction of the rotation axis AX of the turret 63.

[0042] As shown in FIG. 5, the auxiliary jig nozzle J is mounted on the mounting head 6 instead of the nozzle 5. When the mounting device 1 performs measurement by the auxiliary jig nozzle J, the mounting head 6 is moved to the nozzle storage section 51, the nozzle 5 at the first position LP is released from the mounting head 6, and the auxiliary jig nozzle J is mounted instead at the mounting position of the nozzle 5. The axis center of the auxiliary jig nozzle J mounted on the mounting head 6 coincides with the Zc axis.

[0043] The auxiliary jig nozzle J has a reflecting surface JF orthogonal to the Zc axis at its lower end. The reflecting surface JF is detectable from the captured image captured by the imaging device 64. The auxiliary jig nozzle J is mounted on the mounting head 6 and is disposed at the second position TP shown in FIG. 4 by rotation about the rotation axis AX of the turret 63. The auxiliary jig nozzle J at the second position TP is imaged by the imaging device 64.

[0044] FIGS. 6 and 7 are diagrams showing an example of a captured image by the imaging device 64. As shown in FIGS. 6 and 7, at least the reflecting surface JF of the auxiliary jig nozzle J is imaged in the captured image.

[0045] As shown in FIG. 6, when the center of the auxiliary jig nozzle J is located at a predetermined reference point (the center in the embodiment) in the captured image, it indicates that there is no deviation in the drive axis (Zc axis) of the nozzle 5 and the origin position in the rotational direction of the rotation axis AX of the turret 63 is not deviated. As shown in FIG. 7, when the center of the auxiliary jig nozzle J is deviated from a predetermined origin in the captured image, it indicates that there is a deviation in the drive axis (Zc axis) of the nozzle 5 and the origin position in the rotational direction of the rotation axis AX of the turret 63 is deviated. Further, based on the direction and magnitude of the deviation of the center of the auxiliary jig nozzle J, the direction and magnitude of the deviation of the origin position in the rotational direction of the rotation axis AX of the turret 63 can be calculated.

[0046] [Control device] FIG. 8 is a functional block diagram showing the control device 9 according to the embodiment. The control device 9 includes a computer system. The control device 9 may be provided directly in the mounting device 1 or may exist separately via a network. In the embodiment, controlling the mounting head 6 includes controlling the head moving device 7. Controlling the nozzle 5 includes controlling the nozzle moving device 8.

[0047] The control device 9 includes a nozzle control unit 91, a mounting control unit 92, an imaging control unit 93, a component recognition unit 94, a jig center recognition unit 95, a deviation amount calculation unit 96, a deviation amount determination unit 97, a correction amount calculation unit 98, and a storage unit 99.

[0048] The nozzle control unit 91 controls the nozzle 5. The nozzle control unit 91 causes the upper surface of the electronic component C supplied to the supply area SM to be held by the nozzle 5 at the first position LP. The nozzle control unit 91 rotates the turret 63 and moves the nozzle 5 holding the electronic component C to the second position TP. The nozzle control unit 91 rotates the turret 63 and moves the nozzle 5 holding the electronic component C recognized by the imaging device 64 at the second position TP to the first position LP. The nozzle control unit 91 moves the nozzle 5 at the first position LP in the Zc axis direction and the θZc direction at a predetermined mounting position of the substrate P in the mounting area DM to mount the electronic component C on the substrate P.

[0049] The mounting control unit 92 controls the mounting head 6. The mounting control unit 92 moves the mounting head 6 to the supply area SM where the electronic component C is supplied, the mounting area DM where the substrate P is placed, the nozzle storage unit 51, and the component storage unit 52, respectively.

[0050] The imaging control unit 93 controls the imaging device 64. The imaging control unit 93 controls the imaging device 64 so that an imaging image of the electronic component C held by the nozzle 5 at the second position TP is acquired from the Zc-axis direction.

[0051] The component recognition unit 94 recognizes the electronic component C from the imaging image of the electronic component C captured by the imaging device 64. The component recognition unit 94 processes the imaging image by, for example, edge extraction or the like to recognize the electronic component C.

[0052] The jig center recognition unit 95 recognizes the center of the auxiliary jig nozzle J from the imaging image of the auxiliary jig nozzle J captured by the imaging device 64. The jig center recognition unit 95 processes the imaging image by, for example, edge extraction or the like to recognize the reflection portion JF of the auxiliary jig nozzle J, and estimates the center of the auxiliary jig nozzle J based on the image processing result.

[0053] The deviation amount calculation unit 96 calculates the deviation amount of the position of the electronic component C recognized by the component recognition unit 94 from the initial position. The deviation amount of the position of the electronic component C indicates, for example, the deviation amount between the adsorption position by the nozzle 5 preset by teaching and the actual adsorption position recognized from the imaging image. The deviation amount calculated here corresponds to the deviation amount of the drive shaft of the nozzle 5. The deviation amount calculation unit 96 calculates the deviation amount for at least two of the plurality of nozzles 5 in use. The deviation amount calculation unit 96 may calculate the deviation amount for all the nozzles 5 in use. In the embodiment, the deviation amount calculation unit 96 calculates the deviation amount in the X-axis direction. Further, the deviation amount calculation unit 96 calculates the median value of the deviation amounts for each nozzle 5 stored in the storage unit 99. The deviation amount calculation unit 96 may calculate the average value of the deviation amounts for each nozzle 5 stored in the storage unit 99.

[0054] The deviation amount determination unit 97 determines whether or not the change amount of the deviation amount exceeds a threshold value for the nozzle 5 for which the deviation amount calculation unit 96 has calculated the deviation amount. The threshold value is an arbitrary numerical value set in advance. The threshold value is based on the median value or the average value of the deviation amounts stored in the storage unit 99. That is, the deviation amount determination unit 97 determines that the change amount of the deviation amount exceeds the threshold value when the newly calculated deviation amount is greater than the numerical value obtained by adding the threshold value to the median value or the average value, or when the newly calculated deviation amount is less than the numerical value obtained by subtracting the threshold value from the median value or the average value.

[0055] When the change amount of the deviation amount of all the nozzles 5 exceeds the threshold value and the deviation directions are aligned with either the +X side or the -X side, the deviation amount determination unit 97 determines that a correction process for correcting the origin of the rotation direction of the rotation axis AX is necessary. In other words, the deviation amount determination unit 97 monitors the transition of the deviation amounts for all the nozzles 5, and when the deviation amounts of all the nozzles 5 change rapidly in the same direction and exceed the threshold value, the deviation amount determination unit 97 determines that a correction process for correcting the origin of the rotation direction of the rotation axis AX is necessary. When the change amount of the deviation amount exceeds the threshold value only for some of the nozzles 5, or when the change amount of the deviation amount of all the nozzles 5 exceeds the threshold value but the deviation directions are not aligned, it can be determined that a problem other than the deviation of the rotation direction of the rotation axis AX has occurred.

[0056] The correction amount calculation unit 98 calculates the correction amount of the origin of the rotation direction of the rotation axis AX based on the position of the center of the auxiliary jig nozzle J recognized by the jig center recognition unit 95. The correction amount calculation unit 98 calculates the correction amount of the origin of the rotation direction of the rotation axis AX such that the center position of the auxiliary jig nozzle J returns to the reference point based on the deviation amount of the center position of the auxiliary jig nozzle J with respect to a predetermined reference point in the captured image.

[0057] The storage unit 99 stores the deviation amounts calculated by the deviation amount calculation unit 96. The storage unit 99 stores and accumulates the deviation amounts for each of the plurality of nozzles 5 in use. The storage unit 99 stores at least either the median value or the average value of the deviation amounts for each of the nozzles 5 calculated by the deviation amount calculation unit 96. The storage unit 99 stores the threshold value of the change amount of the deviation amount.

[0058] Figures 9 and 10 are diagrams showing normal distribution curves corresponding to the histograms of the deviation amounts according to the embodiment. In FIGS. 9 and 10, the horizontal axis represents the deviation amount in the X-axis direction, and the vertical axis represents the number of data points.

[0059] In the example shown in FIG. 9, for the deviation amounts of three nozzles #01, #02, and #03 among the plurality of nozzles 5, normal distribution curves corresponding to the histograms of the past 100 data points are shown. The median MV1 of nozzle #01 is calculated by the deviation amount calculation unit 96. The median MV2 of nozzle #02 is calculated by the deviation amount calculation unit 96. The median MV3 of nozzle #03 is calculated by the deviation amount calculation unit 96.

[0060] FIG. 10 is a diagram in which data on the newly recognized and calculated deviation amounts is added to FIG. 9. The new deviation amount NV1 of nozzle #01 is calculated by the deviation amount calculation unit 96. The new deviation amount NV2 of nozzle #02 is calculated by the deviation amount calculation unit 96. The new deviation amount NV3 of nozzle #03 is calculated by the deviation amount calculation unit 96.

[0061] The deviation amount determination unit 97 determines whether or not the change amount of the new deviation amount NV1 with respect to the median MV1 of the accumulated deviation amount exceeds the threshold value for nozzle #01. The deviation amount determination unit 97 determines whether or not the change amount of the new deviation amount NV2 with respect to the median MV2 of the accumulated deviation amount exceeds the threshold value for nozzle #02. The deviation amount determination unit 97 determines whether or not the change amount of the new deviation amount NV3 with respect to the median MV3 of the accumulated deviation amount exceeds the threshold value for nozzle #03.

[0062] The deviation amount determination unit 97 determines whether or not the change amount of the deviation amount exceeds the threshold value for all the nozzles #01, #02, and #03. The deviation amount determination unit 97 determines whether or not the positive and negative of the deviation direction are the same for all the nozzles #01, #02, and #03. As shown in FIG. 10, when the deviation amount suddenly changes in the same direction for all the nozzles #01, #02, and #03, the deviation amount determination unit 97 determines that correction processing for correcting the origin of the rotation direction of the rotation axis AX is necessary.

[0063] [Implementation method] FIG. 11 is a flowchart showing the mounting process according to the embodiment. The process of the flowchart shown in FIG. 11 is executed by the control device 9 of the mounting device 1 in accordance with a program stored in advance. In the mounting process, the suction position of the electronic component C at the component supply device 4, the mounting coordinates of the electronic component C on the substrate P, etc. are assumed to be stored in the mounting device 1 in advance by teaching performed before the mounting process shown in FIG. 11.

[0064] The substrate P is conveyed to the mounting device 1. The substrate conveyance device 3 conveys the substrate P to the mounting area DM. Alignment processing of the substrate P is executed. The mounting control unit 92 controls the head movement device 7 to move the mounting head 6 to the supply area SM (step SA1).

[0065] The control device 9 sets the execution number i to i = 1 and starts loop processing (step SA2). In the loop processing, while i ≦ n holds, the process of step SA3 is repeatedly executed n times. Note that n is half the number of nozzles 5 to be used. That is, in the embodiment, an even number of nozzles 5 are used. i is the order in which the nozzles 5 are arranged in the circumferential direction of the turret 63 and is an ordinal number for identifying the nozzles 5.

[0066] The mounting control unit 92 controls the head movement device 7 to move the mounting head 6 to a position where the i-th nozzle 5 at the first position LP faces a predetermined electronic component C held by the component supply device 4. The nozzle control unit 91 controls the nozzle movement device 8 to suck the electronic component C with the i-th nozzle 5 at the first position LP (step SA3). The nozzle control unit 91 controls the nozzle movement device 8 to rotate the turret 63 so that the (i + 1)-th nozzle 5 moves to the first position LP.

[0067] The control device 9 resets the execution number i as i = i + 1 in the loop process and returns to step SA3. When the process of step SA3 is executed n times and the electronic component C is sucked by the nozzles 5 from the first to the n-th among the 2n nozzles 5, the loop process ends (step SA4).

[0068] The control device 9 resets the execution number i as i = 1 and starts the loop process (step SA5). In the loop process, while i ≤ n holds, the processes from step SA6 to step SA7 are repeatedly executed n times.

[0069] At the first position LP, the (n + i)-th nozzle 5 is located, and at the second position TP, the i-th nozzle 5 is located. The mounting control unit 92 controls the head movement device 7 to move the mounting head 6 to a position where the (n + i)-th nozzle 5 at the first position LP faces a predetermined electronic component C held by the component supply device 4. The nozzle control unit 91 controls the nozzle movement device 8 to suck the electronic component C with the (n + i)-th nozzle 5 at the first position LP (step SA6).

[0070] The imaging control unit 93 controls the imaging device 64 to image a predetermined imaging region including the electronic component C sucked and held by the i-th nozzle 5 at the second position TP. The component recognition unit 94 recognizes the electronic component C from the captured imaging image (step SA7). The nozzle control unit 91 controls the nozzle movement device 8 to rotate the turret 63 so that the (n + i + 1)-th nozzle 5 moves to the first position LP. Thereby, the (i + 1)-th nozzle 5 moves to the second position TP.

[0071] The control device 9 resets the number of executions i to i = i + 1 in the loop process and returns to step SA6. The processes from step SA6 to step SA7 are executed n times. When recognizing the electronic components C adsorbed and held by the nozzles 5 from the 1st to the nth among the 2n nozzles 5 and adsorbing the electronic components C with the nozzles 5 from the (n + 1)th to the 2nth, the loop process ends (step SA8).

[0072] The mounting control unit 92 controls the head moving device 7 to move the mounting head 6 to the mounting area DM of the substrate P (step SA9).

[0073] The control device 9 resets the number of executions i to i = 1 and starts the loop process (step SA10). In the loop process, while i ≤ n holds, the processes from step SA11 to step SA12 are repeatedly executed n times.

[0074] The i-th nozzle 5 is located at the first position LP, and the (n + i)-th nozzle 5 is located at the second position TP. The mounting control unit 92 controls the head moving device 7 to move the mounting head 6 to a position where the i-th nozzle 5 at the first position LP faces a predetermined mounting position on the substrate P. The nozzle control unit 91 controls the nozzle moving device 8 to mount the electronic component C adsorbed and held by the i-th nozzle 5 at the first position LP (step SA11).

[0075] The imaging control unit 93 controls the imaging device 64 to image a predetermined imaging area including the electronic component C adsorbed and held by the (n + i)-th nozzle 5 at the second position TP. The component recognition unit 94 recognizes the electronic component C from the captured imaging image (step SA12). The nozzle control unit 91 controls the nozzle moving device 8 to rotate the turret 63 so that the (i + 1)-th nozzle 5 moves to the first position LP. As a result, the (n + i + 1)-th nozzle 5 moves to the second position TP.

[0076] The control device 9 resets the execution count i to i = i + 1 in the loop process and returns to step SA11. The process from step SA11 to step SA12 is executed n times, and among the 2n nozzles 5, the electronic components C adsorbed and held by the nozzles 5 from the 1st to the nth are respectively mounted at predetermined mounting positions on the substrate P, and when the electronic components C adsorbed and held by the nozzles 5 from the (n + 1)th to the 2nth are recognized, the loop process ends (step SA13).

[0077] The control device 9 resets the execution count i to i = 1 and starts the loop process (step SA14). In the loop process, while i ≤ n holds, the process of step SA15 is repeatedly executed n times.

[0078] The (n + i)th nozzle 5 is located at the first position LP, and the ith nozzle 5 is located at the second position TP. The mounting control unit 92 controls the head movement device 7 to move the mounting head 6 to a position where the (n + i)th nozzle 5 at the first position LP faces a predetermined mounting position on the substrate P. The nozzle control unit 91 controls the nozzle movement device 8 to mount the electronic component C adsorbed and held by the (n + i)th nozzle 5 at the first position LP (step SA15).

[0079] The control device 9 resets the execution count i to i = i + 1 in the loop process and returns to step SA15. When the process of step SA15 is executed n times and the electronic components C adsorbed and held by the nozzles 5 from the (n + 1)th to the 2nth among the 2n nozzles 5 are respectively mounted at predetermined mounting positions on the substrate P, the loop process ends (step SA16).

[0080] When mounting more electronic components C on the substrate P than the number of nozzles 5, return to step SA1 and repeatedly execute the process of the flowchart shown in FIG. 11.

[0081] [Recognition Process] FIG. 12 is a flowchart showing the recognition process according to the embodiment. The recognition process shown in FIG. 12 is executed by the control device 9 of the mounting device 1 in accordance with a program stored in advance. The recognition process shown in FIG. 12 is executed in steps SA7 and SA12 in the process of the flowchart shown in FIG. 11.

[0082] The imaging control unit 93 controls the imaging device 64 to image a predetermined imaging region including the electronic component C held by suction on the nozzle 5 at the second position TP (step SB1). The imaging device 64 images the electronic component C from the Zc-axis direction of the nozzle 5 at the second position TP. In the embodiment, the imaging device 64 images the electronic component C from the Zc-axis direction via the mirror 65.

[0083] The component recognition unit 94 recognizes the electronic component C from the captured image of the electronic component C captured by the imaging device 64 (step SB2).

[0084] The deviation amount calculation unit 96 calculates the deviation amount of the position of the electronic component C recognized by the component recognition unit 94 (step SB3). In the embodiment, the deviation amount calculation unit 96 calculates the deviation amount in the X-axis direction. The deviation amount calculation unit 96 outputs the calculation result to the storage unit 99 together with the identification data of the nozzle 5. The storage unit 99 stores and accumulates the deviation amount for each nozzle 5.

[0085] [Determination Process] FIG. 13 is a flowchart showing the determination process according to the embodiment. The determination process shown in FIG. 13 is executed by the control device 9 of the mounting device 1 in accordance with a program stored in advance. The determination process shown in FIG. 13 is executed after the process of the flowchart shown in FIG. 11 or after the processes of steps SA7 and SA12.

[0086] The storage unit 99 stores the accumulated deviation amount data for each nozzle 5, the median value of the deviation amount for each nozzle 5, and a preset threshold value of the change amount of the deviation amount. In the following description, the median value of the deviation amount is used, but the average value of the deviation amount may be used instead.

[0087] The deviation amount determination unit 97 compares, for each of the plurality of nozzles 5 that have acquired the deviation amount of the electronic component C, the last acquired deviation amount with the median value of the deviation amounts stored in the storage unit 99. The deviation amount determination unit 97 determines whether there is a nozzle 5 in which the change amount of the last acquired deviation amount with respect to the median value of the deviation amounts exceeds a threshold value (step SC1).

[0088] When the deviation amount determination unit 97 determines that there is no nozzle 5 in which the change amount of the deviation amount exceeds the threshold value (step SC1; No), it ends the determination process shown in FIG. 13. When the deviation amount determination unit 97 determines that there is a nozzle 5 in which the change amount of the deviation amount exceeds the threshold value (step SC1; Yes), it determines whether the change amount of the deviation amount exceeds the threshold value for all the nozzles 5 that have acquired the deviation amount of the electronic component C (step SC2).

[0089] When the deviation amount determination unit 97 determines that there is a nozzle 5 in which the change amount of the deviation amount does not exceed the threshold value (step SC2; No), it proceeds to step SC5. When the deviation amount determination unit 97 determines that the change amount of the deviation amount exceeds the threshold value for all the nozzles 5 (step SC2; Yes), it determines whether the positive and negative of the deviation direction of the nozzles 5 are all the same (step SC3). In the embodiment, the deviation amount determination unit 97 determines whether the deviation directions are aligned on either the +X side or the -X side.

[0090] When the deviation amount determination unit 97 determines that the positive and negative of the deviation direction of the nozzles 5 are not aligned (step SC3; No), it proceeds to step SC5. When the deviation amount determination unit 97 determines that the positive and negative of the deviation direction of the nozzles 5 are all the same (step SC3; Yes), it determines that correction processing for correcting the origin of the rotation direction of the rotation axis AX is necessary, and proceeds to step SC4.

[0091] The control device 9 executes the correction processing (step SC4). The correction processing is executed, for example, according to the procedure of the flowchart shown in FIG. 14 described later.

[0092] Although there is a nozzle 5 in which the change amount of the deviation amount exceeds the threshold value, there is a nozzle 5 in which the change amount of the deviation amount does not exceed the threshold value, or when the positive and negative of the deviation direction of the nozzle 5 do not match, it can be determined that a problem other than the deviation in the rotation direction of the rotation axis AX has occurred. The control device 9 executes error notification processing (step SC5). The control device 9 notifies the operator that an error has occurred, for example, by causing a predetermined notification message to be displayed on a display device (not shown) of the mounting device 1 or causing a predetermined light or sound to be generated by a warning device (not shown) of the mounting device 1.

[0093] [Correction Processing] FIG. 14 is a flowchart showing the correction processing according to the embodiment. The correction processing shown in FIG. 14 is executed by the control device 9 of the mounting device 1 in accordance with a program stored in advance. The correction processing shown in FIG. 14 is executed in step SC4 shown in FIG. 13.

[0094] The mounting control unit 92 controls the head moving device 7 to move the mounting head 6 to the component storage unit 52 (step SD1).

[0095] The control device 9 releases the electronic component C from the nozzle 5 at the first position LP (step SD2). The electronic component C is put into the component storage unit 52.

[0096] The mounting control unit 92 controls the head moving device 7 to move the mounting head 6 to the nozzle storage unit 51 (step SD3). The nozzle 5 at the first position LP faces a predetermined storage position of the nozzle storage unit 51.

[0097] The nozzle control unit 91 controls the nozzle moving device 8 to store the nozzle 5 at the first position LP in a predetermined storage position of the nozzle storage unit 51 and detach it from the turret 63. The mounting control unit 92 controls the head moving device 7 to move the mounting head 6 to a position where the mounting position of the nozzle 5 at the first position LP on the turret 63 faces the auxiliary jig nozzle J. The nozzle control unit 91 controls the nozzle moving device 8 to mount the auxiliary jig nozzle J at the mounting position of the nozzle 5 at the first position LP. Thus, the nozzle 5 at the first position LP is replaced with the auxiliary jig nozzle J (step SD4).

[0098] The nozzle control unit 91 controls the nozzle moving device 8 to rotate the turret 63 so that the auxiliary jig nozzle J moves to the second position TP. The imaging control unit 93 controls the imaging device 64 to image a predetermined imaging area including the auxiliary jig nozzle J at the second position TP (step SD5).

[0099] The jig center recognition unit 95 recognizes the center of the auxiliary jig nozzle J from the captured image of the auxiliary jig nozzle J captured by the imaging device 64 (step SD6).

[0100] The correction amount calculation unit 98 calculates a correction amount of the origin in the rotation direction of the rotation axis AX based on the position of the center of the auxiliary jig nozzle J recognized by the jig center recognition unit 95 (step SD7). The control device 9 updates the information of the origin in the rotation direction of the rotation axis AX based on the calculated correction amount.

[0101] The nozzle control unit 91 controls the nozzle moving device 8 to rotate the turret 63 so that the auxiliary jig nozzle J moves to the first position LP. The nozzle control unit 91 controls the nozzle moving device 8 to store the auxiliary jig nozzle J at the first position LP in a predetermined storage position of the nozzle storage unit 51 and detach it from the turret 63. The mounting control unit 92 controls the head moving device 7 to move the mounting head 6 to a position where the mounting position of the nozzle 5 at the first position LP on the turret 63 faces the nozzle 5 stored in the nozzle storage unit 51. The nozzle control unit 91 controls the nozzle moving device 8 to mount the nozzle 5 at the mounting position of the nozzle 5 at the first position LP. Thus, the auxiliary jig nozzle J at the first position LP is replaced with the nozzle 5 (step SD8).

[0102] In addition, when there is a nozzle 5 that does not adsorb and hold the electronic component C at the start of the correction process, the auxiliary jig nozzle J may be mounted instead of the nozzle 5, and steps SD1 and SD2 may be omitted. When the correction process is required with all the nozzles 5 adsorbing and holding the electronic component C, since the electronic component C is released once in steps SD1 and SD2, after replacing the auxiliary jig nozzle J with the nozzle 5 in step SD8, the nozzle 5 adsorbs and holds the electronic component C again.

[0103] [Computer System] FIG. 15 is a block diagram showing a computer system 1000 according to the embodiment. The above-described control device 9 includes the computer system 1000. The computer system 1000 includes a processor 1001, a main memory 1002, a storage 1003, and an interface 1004. The functions of the control device 9 are stored in the storage 1003 as a computer program. The processor 1001 reads the computer program from the storage 1003 and expands it in the main memory 1002, and executes the above-described processing according to the computer program. Note that the computer program may be distributed to the computer system 1000 via a network.

[0104] The computer program can execute, in accordance with the above-described embodiment, imaging the electronic component C held by the nozzle 5 with the imaging device 64, recognizing the electronic component C from the captured image captured by the imaging device 64, calculating and storing the deviation amount of the recognized electronic component C from the initial position of the position, determining whether there is a nozzle 5 in which the change amount of the last acquired deviation amount with respect to the past deviation amount exceeds a threshold value, determining whether the change amount of the deviation amount exceeds the threshold value for all of the nozzles 5 among the nozzles 5 for which the deviation amount has been calculated, and determining whether the positive and negative of the deviation direction of the deviation amount are the same. Further, the computer program can execute imaging the auxiliary jig nozzle J with the imaging device 64, recognizing the center position of the auxiliary jig nozzle J from the captured image captured by the imaging device 64, and calculating a correction amount for correcting the origin of the rotation direction of the rotation axis AX based on the recognized center position of the auxiliary jig nozzle J.

[0105] [Effect] As described above, according to the present embodiment, for a plurality of nozzles 5, the transition of the deviation amount of the electronic component C held by the nozzle 5 is monitored, and by detecting that the deviation amount changes in the same direction and exceeds the threshold value for all of the plurality of nozzles 5, the positional deviation of the origin of the rotation direction of the rotation axis AX can be detected. The deviation amount of the electronic component C held by the nozzle 5 can be calculated based on the captured image captured by the imaging device 64, which is also mounted on the conventional mounting device 1 to confirm the holding position of the electronic component C. Therefore, the deviation amount can be calculated during normal mounting processing, and the transition of the deviation amount can be monitored in parallel with the mounting processing, so that when a positional deviation occurs, it is possible to quickly shift to the correction processing.

[0106] Also, according to the present embodiment, instead of the nozzle 5, the auxiliary jig nozzle J is imaged by the imaging device 64, and a correction amount for correcting the misalignment can be calculated based on the amount of movement of the center position of the auxiliary jig nozzle J in the captured image from the initial position. The replacement between the nozzle 5 and the auxiliary jig nozzle J can be automatically processed by a known nozzle replacement mechanism for nozzles 5. Also, the imaging of the auxiliary jig nozzle J can be realized by the imaging device 64 which is also mounted on the conventional mounting device 1. Therefore, even when the mounting process is temporarily stopped for the correction process, the correction process can be completed and the mounting process can be resumed without manual operation by the operator, so that rapid correction of the misalignment is possible.

[0107] [Other Embodiments] As described above, the embodiments of the present application have been described, but the present invention is not limited by the contents of these embodiments. The above-described embodiments and modifications can be appropriately combined within a range that does not conflict with the processing contents. Also, the above-described components include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those within a so-called equivalent range. Furthermore, the above-described components can be appropriately combined. Furthermore, various omissions, substitutions, or changes of the components can be made without departing from the gist of the above-described embodiments.

[0108] For example, in the embodiment, the median or average value of the misalignment amount data for a plurality of times acquired in the past is compared with the last acquired misalignment amount, but the misalignment amount data for one time acquired in the past may be compared with the last acquired misalignment amount. Also, the median or average value of the misalignment amount data for a plurality of times acquired in the past may be compared with the median or average value of the misalignment amount data for a plurality of times including the latest.

[0109] Also, among the various processes described in the above embodiments, all or part of the processes described as being automatically performed can be manually performed, or all or part of the processes described as being manually performed can be automatically performed by a known method. In addition, regarding the processing procedures, specific names, and information including various data and parameters shown in the above documents and drawings, they can be arbitrarily changed unless otherwise specified. For example, the various information shown in each figure is not limited to the illustrated information.

[0110] Moreover, each component of each device shown in the drawings is conceptually functional and does not necessarily have to be physically configured as shown in the drawings. That is, the specific form of the distribution and integration of each device is not limited to that shown, and all or part of it can be functionally or physically distributed and integrated in any unit according to various loads, usage conditions, etc. Further, the above-described control device 9 may be composed of a plurality of computers divided into several functions, may exist separately via a network, and some functions of the computer may be possessed by a cloud server that executes various functions in the form of cloud computing. Also, the program may be distributed to the control device 9 via a network.

Description of Reference Numerals

[0111] 1... mounting device, 2... base member, 3... substrate transfer device, 4... component supply device, 5... nozzle, 6... mounting head, 7... head moving device, 8... nozzle moving device, 9... control device, 21... support portion, 51... nozzle storage portion, 52... component storage portion, 61... housing, 62... rotor shaft, 63... turret, 64... imaging device, 65... mirror, 71... Xg-axis moving device, 72... Yg-axis moving device, 73... Zg-axis moving device, 81... turning device, 82... Zc-axis moving device, 83... θZc moving device, 91... nozzle control portion, 92... mounting control portion, 93... imaging control portion, 94... component recognition portion, 95... jig center recognition portion, 96... deviation amount calculation portion, 97... deviation amount determination portion, 98... correction amount calculation portion, 99... memory portion, 1000... computer system, 1001... processor, 1002... main memory, 1003... storage, 1004... interface, C... electronic component, DM... mounting area, J... auxiliary jig nozzle, JF... reflecting portion, LP... first position, P... substrate, SM... supply area, TP... second position.

Claims

1. A plurality of nozzles for holding electronic components to be mounted on a substrate, a mounting head having a turret that supports the plurality of nozzles at a peripheral portion, a nozzle driving device that moves each of the plurality of nozzles in a direction parallel to a driving axis with respect to the turret and rotates the turret about a rotation axis, an imaging device that is supported by the mounting head and images the electronic component held by the nozzle from a direction parallel to the driving axis of the nozzle, a control device, comprising: The control device: calculates and stores a deviation amount from an initial position of the position of the electronic component recognized from an imaging image captured by the imaging device, in the plurality of nozzles for which the deviation amount has been calculated, when a change amount of the last obtained deviation amount with respect to the past deviation amount exceeds a threshold value and the positive and negative of the deviation direction are the same, determines that a correction process for correcting an origin of a rotation direction of the rotation axis is necessary, a mounting device.

2. The control device: calculates and stores a median value or an average value of a plurality of deviation amounts calculated in the past for each of the plurality of nozzles, when a change amount of the last obtained deviation amount with respect to the median value or the average value exceeds a threshold value and the positive and negative of the deviation direction are the same, determines that a correction process for correcting an origin of a rotation direction of the rotation axis is necessary, The mounting device according to claim 1.

3. The control device: in all of the plurality of nozzles, when a change amount of the last obtained deviation amount with respect to the past deviation amount exceeds a threshold value and the positive and negative of the deviation direction are the same, determines that a correction process for correcting an origin of a rotation direction of the rotation axis is necessary, The mounting device according to claim 1.

4. further comprising an auxiliary jig nozzle that can be mounted in place of one of the plurality of nozzles, The control device: causes the imaging device to image the auxiliary jig nozzle, calculates a correction amount for correcting an origin of a rotation direction of the rotation axis based on a center position of the auxiliary jig nozzle recognized from an imaging image captured by the imaging device, The mounting device according to claim 1.

5. A plurality of nozzles for holding electronic components to be mounted on a substrate, a mounting head having a turret that supports the plurality of nozzles at a peripheral portion, a nozzle driving device that moves each of the plurality of nozzles in a direction parallel to a driving axis with respect to the turret and rotates the turret about a rotation axis, An imaging device that is supported by the mounting head and images the electronic component held by the nozzle from a direction parallel to the drive axis of the nozzle; A control method for a mounting device, comprising: imaging the electronic component held by the nozzle with the imaging device; recognizing the electronic component from the captured image captured by the imaging device; calculating and storing the amount of deviation of the recognized position of the electronic component from the initial position; determining whether there is a nozzle whose change amount of the deviation amount obtained last with respect to the past deviation amount exceeds a threshold value; determining whether the change amount of the deviation amount exceeds the threshold value for all the nozzles among the nozzles for which the deviation amount has been calculated; determining whether the positive and negative of the deviation direction of the deviation amount are the same; including; A control method for a mounting device.

6. The mounting device further includes an auxiliary jig nozzle that can be attached in place of one of the plurality of nozzles, imaging the auxiliary jig nozzle with the imaging device; recognizing the center position of the auxiliary jig nozzle from the captured image captured by the imaging device; calculating a correction amount for correcting the origin in the rotation direction of the rotation axis based on the recognized center position of the auxiliary jig nozzle; including; The control method for a mounting device according to claim 5.

Images