Substrate processing device and display method

Abstract

To provide a substrate processing device and a display method that can let a user know capability corresponding to a recipe in advance.SOLUTION: A substrate processing device 100 comprises an input part 180, a control part 102, and a display part 170. The input part 180 receives input of a recipe R, defining processing details, by a user. The control part 102 predicts capability in processing a substrate based upon the input recipe R. The display part 170 displays the predicted capability.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus and a display method.

Background Art

[0002] A substrate processing apparatus that processes a substrate using a processing liquid is known. The substrate processing apparatus is installed in a clean room of a factory. The processing liquid is supplied from a power facility installed in the factory to the substrate processing apparatus (see, for example, Patent Document 1).

[0003] Patent Document 1 describes a substrate processing apparatus that sequentially conveys a plurality of substrate groups each composed of a plurality of substrates to a plurality of processing units and performs predetermined processing on the plurality of substrate groups. The substrate processing apparatus described in Patent Document 1 obtains the power consumption amount of predetermined power for each unit time according to the recipe for each substrate group. Then, the power consumption amount is accumulated for each unit time to obtain the total power consumption amount, and the input timing of the substrate group is corrected so that the total consumption amount is within a predetermined range.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] By the way, the recipe may be changed by the user. In this case, the amount of power used when processing the substrate changes with the change of the recipe.

[0006] However, in the substrate processing apparatus of Patent Document 1, it is difficult for the user to know in advance how much power will be used when the recipe is changed.

[0007] The present invention has been made in view of the above problems, and an object thereof is to provide a substrate processing apparatus and a display method capable of allowing a user to know in advance the amount of power used according to a recipe.

Means for Solving the Problems

[0008] According to an aspect of the present invention, a substrate processing apparatus includes an input unit, a prediction unit, and a display unit. The input unit receives an input by a user of a recipe that defines processing content. The prediction unit predicts the amount of power used when processing a substrate based on the input recipe. The display unit displays the predicted amount of power used.

[0009] In a certain embodiment, the prediction unit may predict the amount of power used when processing one lot of the substrates including one or more of the substrates based on the input recipe.

[0010] In a certain embodiment, the prediction unit may predict, as the amount of power used, the amount of processing power used according to the processing of the substrate and the amount of standby power used regardless of the processing of the substrate based on the input recipe.

[0011] In a certain embodiment, the display unit may display the amount of processing power and the amount of standby power.

[0012] In a certain embodiment, the substrate processing apparatus may include a first supply unit and a second supply unit. The first supply unit may supply a first processing liquid to the substrate when executing the input recipe. The second supply unit may not supply a second processing liquid to the substrate when executing the input recipe, and may supply the second processing liquid to the substrate when executing a recipe different from the input recipe. The amount of standby power used when processing the substrate based on the input recipe may include the amount of power used to drive the second supply unit.

[0013] In one embodiment, when a plurality of the recipes are input to the input unit, the prediction unit may predict a plurality of the amounts of power consumption based on the plurality of recipes, and the display unit may display the predicted plurality of amounts of power consumption.

[0014] In one embodiment, the display unit may display the input recipe. When a plurality of the recipes are input to the input unit, the display unit may display, in an emphasized manner, different portions of the plurality of recipes.

[0015] In one embodiment, the amount of power consumption may include at least one of an amount of clean air, an exhaust amount, an amount of cooling water, and an amount of warm water. The prediction unit may convert at least one of the amount of clean air, the exhaust amount, the amount of cooling water, and the amount of warm water into an amount of electric power. The display unit may display the amount of electric power as the amount of power consumption.

[0016] In one embodiment, the amount of power consumption may include at least one of an amount of electric power, an amount of clean air, an exhaust amount, an amount of cooling water, and an amount of warm water. The prediction unit may convert at least one of the amount of electric power, the amount of clean air, the exhaust amount, the amount of cooling water, and the amount of warm water into an amount of carbon dioxide emissions. The display unit may display the amount of carbon dioxide emissions as the amount of power consumption.

[0017] According to another aspect of the present invention, a display method includes a step of receiving an input by a user of a recipe that defines processing content, a step of predicting an amount of power consumption when processing a substrate based on the input recipe, and a step of displaying the predicted amount of power consumption.

Advantages of the Invention

[0018] According to the present invention, it is possible to provide a substrate processing apparatus and a display method capable of predicting an amount of power consumption according to a recipe.

Brief Description of the Drawings

[0019]

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Mode for Carrying Out the Invention

[0020] Hereinafter, embodiments of the substrate processing apparatus and display method according to the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiments, and can be implemented in various modes without departing from the gist thereof. In addition, descriptions of overlapping parts may be omitted as appropriate. In the drawings, the same or corresponding parts are denoted by the same reference numerals and the description thereof will not be repeated.

[0021] First, with reference to FIG. 1, the substrate processing apparatus 100 and the utility equipment 2000 of the present embodiment will be described. FIG. 1 is a diagram showing the substrate processing apparatus 100 and the utility equipment 2000 of the present embodiment. As shown in FIG. 1, the substrate processing apparatus 100 processes a substrate W (see FIG. 2) using the utility equipment 2000 in a factory.

[0022] The substrate processing apparatus 100 processes the substrate W (see FIG. 2) using, for example, a processing liquid. Although not shown, a plurality of substrate processing apparatuses 100 are installed in the factory.

[0023] The utility equipment 2000 includes, for example, a power supply equipment 2001, a gas supply equipment 2002, a liquid supply equipment 2003, a gas discharge equipment 2004, and a liquid discharge equipment 2005. In the present embodiment, the utilities used by the substrate processing apparatus 100 include the power consumed by the substrate processing apparatus 100, the gas and liquid supplied to the substrate processing apparatus 100, and the gas and liquid discharged from the substrate processing apparatus 100.

[0024] The power supply facility 2001 supplies power to the substrate processing apparatus 100. The gas supply facility 2002 supplies gas to the substrate processing apparatus 100. The gas is not particularly limited, and includes, for example, clean air and inert gas. The inert gas supplied by the gas supply facility 2002 includes, for example, nitrogen gas. The liquid supply facility 2003 supplies liquid to the substrate processing apparatus 100. The liquid supplied by the liquid supply facility 2003 includes, for example, processing liquid, pure water (hereinafter sometimes referred to as DIW), and cooling water. The pure water is, for example, deionized water. The pure water may be, for example, normal temperature water or warm water (hereinafter sometimes referred to as HDIW). As the cooling water, for example, industrial water may be used, or pure water at normal temperature may be used.

[0025] Gas is discharged from the substrate processing apparatus 100 to the gas discharge facility 2004. Liquid is discharged from the substrate processing apparatus 100 to the liquid discharge facility 2005.

[0026] The substrate processing apparatus 100 includes a power supply unit 200, a gas supply unit 300, a liquid supply unit 400, a gas discharge unit 500, and a liquid discharge unit 600. The power supply unit 200 supplies the power supplied from the power supply facility 2001 to each part of the substrate processing apparatus 100 via an electric cable. The gas supply unit 300 supplies the gas supplied from the gas supply facility 2002 to each part of the substrate processing apparatus 100 via piping or the like. The liquid supply unit 400 supplies the liquid supplied from the liquid supply facility 2003 to each part of the substrate processing apparatus 100 via piping or the like. Gas is discharged from each part of the substrate processing apparatus 100 to the gas discharge unit 500 via piping or the like. Further, the gas discharge unit 500 discharges the gas from each part of the substrate processing apparatus 100 to the gas discharge facility 2004 via piping or the like. Liquid is discharged from each part of the substrate processing apparatus 100 to the liquid discharge unit 600 via piping or the like. Further, the liquid discharge unit 600 discharges the liquid from each part of the substrate processing apparatus 100 to the liquid discharge facility 2005 via piping or the like.

[0027] Further, the substrate processing apparatus 100 includes a control device 101, a power meter 150, a flow meter 160, a display unit 170, and an input unit 180.

[0028] The control device 101 controls the operations of each part of the substrate processing device 100. The control device 101 includes a control unit 102 and a storage unit 103. Note that the control unit 102 is an example of the "prediction unit" of the present invention.

[0029] The control unit 102 has a processor. The control unit 102 has, for example, a CPU (Central Processing Unit) or an MPU (Micro Processing Unit). Alternatively, the control unit 102 may have a general-purpose arithmetic unit or a dedicated arithmetic unit. The control unit 102 may further have an NPU (Neural Network Processing Unit).

[0030] The storage unit 103 stores data and computer programs. The storage unit 103 has a main storage device. The main storage device is, for example, a semiconductor memory. The storage unit 103 may further have an auxiliary storage device. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 103 may have a removable medium. The control unit 102 controls the operations of each part of the substrate processing device 100 based on the data and computer programs stored in the storage unit 103.

[0031] Specifically, the storage unit 103 stores a recipe and a control program. The recipe defines the processing content and processing procedure of the substrate W. The recipe also indicates processing conditions and various setting values.

[0032] The control unit 102 controls the operations of each part of the substrate processing device 100 based on the recipe and the control program. Also, in the present embodiment, the control unit 102 predicts the amount of power used when processing the substrate W based on the recipe input by the user to the input unit 180, and causes the display unit 170 to display an image based on the predicted amount of power used. A method for predicting the amount of power used based on the recipe input to the input unit 180 will be described later.

[0033] The power meter 150 measures the power used (consumed) by the substrate processing apparatus 100. The power meter 150 outputs the measurement result to the control device 101. In this embodiment, a plurality of power meters 150 are provided. The power meters 150 are arranged in each part of the substrate processing apparatus 100 and measure the power used in each part of the substrate processing apparatus 100. The control unit 102 can calculate the power used by the entire substrate processing apparatus 100 by summing up the measurement results of the plurality of power meters 150.

[0034] The flow meter 160 measures the flow rates of gases and liquids. The flow meter 160 outputs the measurement result to the control device 101. In this embodiment, a plurality of flow meters 160 are provided. The flow meters 160 are arranged in the piping of each part of the substrate processing apparatus 100 and measure the flow rate of the gas or liquid flowing through the piping. In this embodiment, the flow meter 160 includes flow meters 160a to 160k, which will be described later.

[0035] The display unit 170 displays various information. In this embodiment, the display unit 170 displays, for example, a recipe setting screen. The display unit 170 has, for example, a liquid crystal display or an organic EL (electroluminescence) display. The screen displayed by the display unit 170 will be described later.

[0036] The input unit 180 receives an input from the user and outputs information indicating the input result to the control device 101. For example, the input unit 180 receives an input by the user such as a recipe that defines the processing content. The user can, for example, create and register a new recipe or change a part of a registered recipe using the input unit 180. Also, the input unit 180 includes, for example, a touch panel and a pointing device. The touch panel is arranged, for example, on the display surface of the display unit 170. The input unit 180 and the display unit 170 constitute, for example, a graphical user interface.

[0037] Further, in the present embodiment, the control unit 102 controls each part of the substrate processing apparatus 100. The control unit 102 controls the power supply unit 200, the gas supply unit 300, and the liquid supply unit 400 to supply power, gas, and liquid to each part of the substrate processing apparatus 100. The control unit 102 controls the gas discharge unit 500 and the liquid discharge unit 600 to discharge the gas and liquid used in each part of the substrate processing apparatus 100 to the gas discharge facility 2004 and the liquid discharge facility 2005, respectively.

[0038] Measurement results are input to the control unit 102 from the power meter 150 and the flow meter 160, and input information is input from the input unit 180. The control unit 102 causes the display unit 170 to display a predetermined image.

[0039] In the present embodiment, the control unit 102 predicts the amount of power required when processing the substrate W based on the recipe input to the input unit 180. Then, the control unit 102 controls the display unit 170 to display the predicted amount of power. Accordingly, the display unit 170 displays the predicted amount of power. Further, in the present embodiment, the control unit 102 predicts the amount of power required when processing a lot of substrates W including one or more substrates W based on the recipe input to the input unit 180.

[0040] In the present embodiment, as described above, the control unit 102 that predicts the amount of power required when processing the substrate W based on the input recipe and the display unit 170 that displays the predicted amount of power are provided. Accordingly, the user can know in advance the amount of power corresponding to the recipe.

[0041] Also, as described above, the control unit 102 predicts the amount of power required when processing a lot of substrates W including one or more substrates W based on the input recipe. Accordingly, the user can easily know the amount of power required when processing one lot.

[0042] Next, with reference to FIG. 2, the substrate processing apparatus 100 of the present embodiment will be described. FIG. 2 is a schematic diagram of the substrate processing apparatus 100 of the present embodiment. Specifically, FIG. 2 is a schematic plan view of the substrate processing apparatus 100.

[0043] As shown in FIG. 2, the substrate processing apparatus 100 is a single-wafer type apparatus that processes substrates W one by one. Typically, the substrate W is substantially disk-shaped.

[0044] The substrate W is, for example, a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell. In the present embodiment, the substrate W is a semiconductor wafer.

[0045] The substrate processing apparatus 100 includes a plurality of processing units 10, a fluid cabinet 110, a plurality of fluid boxes 120, a plurality of load ports LP, an indexer robot IR, a center robot CR, and a control device 101.

[0046] Each of the load ports LP stores a plurality of substrates W stacked thereon. Specifically, each of the load ports LP stores 1 lot (e.g., 25 substrates) of substrates W stacked thereon. The indexer robot IR transports the substrate W between the load port LP and the center robot CR. The center robot CR transports the substrate W between the indexer robot IR and the processing unit 10. Each of the processing units 10 supplies a processing liquid to the substrate W to perform processing on the substrate W. The fluid cabinet 110 stores the processing liquid. The processing liquid includes, for example, a chemical solution, a rinse solution, a removal solution, and / or a water repellent. The fluid cabinet 110 stores the processing liquid. Note that the fluid cabinet 110 may store a gas.

[0047] The plurality of processing units 10 form a plurality of towers TW (four towers TW in FIG. 2) arranged so as to surround the center robot CR in a plan view. Each tower TW includes a plurality of processing units 10 stacked vertically (three processing units 10 in FIG. 2). The fluid boxes 120 respectively correspond to the plurality of towers TW. The processing liquid in the fluid cabinet 110 is supplied to all the processing units 10 included in the tower TW corresponding to the fluid box 120 via any one of the fluid boxes 120.

[0048] The control device 101 controls the operations of each part of the substrate processing apparatus 100. For example, the control device 101 controls the load port LP, the indexer robot IR, and the center robot CR.

[0049] Subsequently, referring to FIG. 3, the processing unit 10 of the present embodiment will be described. FIG. 3 is a schematic diagram of the processing unit 10 of the present embodiment. Specifically, FIG. 3 is a schematic cross-sectional view of the processing unit 10.

[0050] As shown in FIG. 3, in the present embodiment, the processing liquid includes, for example, an etching liquid, and the processing unit 10 executes an etching process. The substrate W is processed (etched) by the etching liquid. The etching liquid is a chemical solution. The etching liquid is, for example, a mixture of hydrofluoric acid and nitric acid (a mixture of hydrofluoric acid (HF) and nitric acid (HNO 3 ), hydrofluoric acid, buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), phosphoric acid (H 3 PO 4 ), SC1 (a mixture of ammonia and hydrogen peroxide solution), SC2 (a mixture of hydrochloric acid and hydrogen peroxide solution), SPM (a mixture of sulfuric acid and hydrogen peroxide solution), or ammonia, etc.

[0051] The processing unit 10 includes a chamber 11 and a substrate holding unit 20.

[0052] Chamber 11 has a substantially box shape with an internal space. Chamber 11 houses substrate W. Here, the substrate processing apparatus 100 is a single-wafer type that processes substrates W one by one, and one substrate W is housed in chamber 11 at a time. Substrate W is housed in chamber 11 and processed within chamber 11. At least a part of each of the substrate holding unit 20, chemical solution supply unit 30, first rinse solution supply unit 50, and second rinse solution supply unit 60 is housed in chamber 11.

[0053] The substrate holding unit 20 holds substrate W. The substrate holding unit 20 horizontally holds substrate W such that the upper surface (front surface) Wa of substrate W faces upward and the lower surface (back surface) Wb of substrate W faces vertically downward. Also, the substrate holding unit 20 rotates substrate W while holding it. The substrate holding unit 20 rotates substrate W while keeping it held.

[0054] For example, the substrate holding unit 20 may be a clamping type that clamps the edge of substrate W. Alternatively, the substrate holding unit 20 may have any mechanism for holding substrate W from the lower surface Wb. For example, the substrate holding unit 20 may be a vacuum type. In this case, the substrate holding unit 20 horizontally holds substrate W by adsorbing the central portion of the lower surface Wb of substrate W, which is a non-device formation surface, to the upper surface. Alternatively, the substrate holding unit 20 may combine a clamping type in which a plurality of chuck pins contact the peripheral end surface of substrate W and a vacuum type.

[0055] For example, the substrate holding unit 20 includes a spin base 21, a chuck member 22, a shaft 23, a spin motor 24, and a housing 25. The chuck member 22 is provided on the spin base 21. The chuck member 22 chucks substrate W. Typically, a plurality of chuck members 22 are provided on the spin base 21.

[0056] The shaft 23 extends vertically along the rotation axis AX. The spin base 21 is coupled to the upper end of the shaft 23. Substrate W is placed above the spin base 21.

[0057] The spin base 21 is disk-shaped. The chuck member 22 horizontally supports the substrate W. The shaft 23 extends downward from the central portion of the spin base 21. The spin motor 24 applies a rotational force to the shaft 23. The spin motor 24 rotates the shaft 23 in the rotational direction to rotate the substrate W and the spin base 21 about the rotation axis AX. The housing 25 houses the shaft 23 and the spin motor 24.

[0058] The liquid supply unit 400 (see FIG. 1) includes a chemical liquid supply unit 30, a first rinse liquid supply unit 50, and a second rinse liquid supply unit 60.

[0059] The chemical liquid supply unit 30 supplies a chemical liquid (here, an etching liquid) to the substrate W. Typically, the chemical liquid supply unit 30 supplies the chemical liquid to the upper surface Wa of the substrate W.

[0060] The chemical liquid is not particularly limited, but for example, it is SPM. The temperature of the SPM supplied to the substrate W is not particularly limited, but for example, it is 80°C or higher and less than 120°C. Note that the temperature of the SPM supplied to the substrate W may be 120°C or higher, or may be 150°C or higher. Also, the temperature of the SPM supplied to the substrate W may be 180°C or higher, or may be 200°C or higher.

[0061] The chemical liquid supply unit 30 includes a pipe 32 and a nozzle 36. The nozzle 36 discharges the chemical liquid onto the upper surface Wa of the substrate W. The nozzle 36 is connected to the pipe 32. The chemical liquid is supplied to the pipe 32.

[0062] In the present embodiment, the chemical liquid supply unit 30 further includes a sulfuric acid supply unit 410 and a hydrogen peroxide water supply unit 430. The pipe 32 is connected to the sulfuric acid supply unit 410 and the hydrogen peroxide water supply unit 430. Sulfuric acid is supplied from the sulfuric acid supply unit 410 to the pipe 32, and hydrogen peroxide water is supplied from the hydrogen peroxide water supply unit 430 to the pipe 32. The pipe 32 supplies SPM, which is a mixture of sulfuric acid and hydrogen peroxide water, to the nozzle 36. Note that the sulfuric acid in the sulfuric acid supply unit 410 is not included in the working solution.

[0063] The nozzle 36 may be configured to be movable relative to the substrate W. In the present embodiment, the chemical liquid supply unit 30 further includes a nozzle moving unit 38. The nozzle moving unit 38 may move the nozzle 36 up and down, or may horizontally rotate the nozzle 36 around the rotation axis. The nozzle moving unit 38 moves the nozzle 36 up and down. For example, the nozzle moving unit 38 includes a ball screw mechanism and an electric motor that applies a driving force to the ball screw mechanism. Also, the nozzle moving unit 38 horizontally rotates the nozzle 36. For example, the nozzle moving unit 38 includes an electric motor.

[0064] Note that the chemical liquid supply unit 30 may supply a chemical liquid other than the etching liquid to the substrate W. Further, the substrate processing apparatus 100 may include a processing liquid supply unit that supplies a processing liquid other than the chemical liquid instead of the chemical liquid supply unit 30. Details of the configuration of the sulfuric acid supply unit 410 and the hydrogen peroxide water supply unit 430 will be described later.

[0065] The first rinse liquid supply unit 50 supplies a rinse liquid to the substrate W. Typically, the first rinse liquid supply unit 50 supplies the rinse liquid to the upper surface Wa of the substrate W.

[0066] Examples of the rinse liquid include deionized water (DIW) at room temperature, warm water (HDIW), carbonated water, electrolyzed ion water, ozone water, diluted hydrochloric acid water, or reduced water (hydrogen water). In the present embodiment, the rinse liquid supplied by the first rinse liquid supply unit 50 is deionized water (DIW) at room temperature.

[0067] The first rinse liquid supply unit 50 includes a pipe 52 and a nozzle 56. The nozzle 56 discharges the rinse liquid onto the upper surface Wa of the substrate W. The nozzle 56 is connected to the pipe 52. The rinse liquid is supplied to the pipe 52 from a supply source.

[0068] The nozzle 56 may be configured to be movable relative to the substrate W. In the present embodiment, the first rinse liquid supply unit 50 further includes a nozzle moving unit 58. The nozzle moving unit 58 may move the nozzle 56 up and down, or may horizontally rotate the nozzle 56 around the rotation axis. The nozzle moving unit 58 is configured in the same manner as the nozzle moving unit 38, for example.

[0069] Further, the first rinse liquid supply unit 50 further includes a valve 54. The valve 54 is attached to the pipe 52. The valve 54 opens and closes the flow path of the pipe 52. The type of the valve 54 is not particularly limited, but in the present embodiment, it is an air valve driven by a pneumatic actuator.

[0070] A flow meter 160a is attached to the pipe 52. The flow meter 160a measures the amount of the rinse liquid passing through the pipe 52. The flow meter 160a outputs the measurement result to the control unit 102. In the present embodiment, the flow meter 160a (160) measures the volume of the fluid flowing per unit time.

[0071] The second rinse liquid supply unit 60 supplies the rinse liquid to the substrate W. Typically, the second rinse liquid supply unit 60 supplies the rinse liquid to the upper surface Wa of the substrate W.

[0072] For example, examples of the rinse liquid supplied by the second rinse liquid supply unit 60 include deionized water (DIW) at room temperature, warm water (HDIW), carbonated water, electrolyzed ion water, ozone water, diluted hydrochloric acid water, or reduced water (hydrogen water). In the present embodiment, the rinse liquid supplied by the second rinse liquid supply unit 60 is warm water (HDIW).

[0073] The second rinse liquid supply unit 60 includes a pipe 62 and a nozzle 66. The nozzle 66 discharges the rinse liquid onto the upper surface Wa of the substrate W. The nozzle 66 is connected to the pipe 62. The rinse liquid is supplied to the pipe 62.

[0074] In the present embodiment, the second rinse liquid supply unit 60 further includes a warm water supply unit 450. The pipe 62 is connected to the warm water supply unit 450. Warm water is supplied from the warm water supply unit 450 to the pipe 62. The pipe 62 supplies the warm water to the nozzle 66.

[0075] The nozzle 66 may be configured to be movable with respect to the substrate W. In the present embodiment, the second rinse liquid supply unit 60 further includes a nozzle moving unit 68. The nozzle moving unit 68 may move the nozzle 66 up and down, or may horizontally rotate the nozzle 66 around the rotation axis. The nozzle moving unit 68 is configured in the same manner as, for example, the nozzle moving unit 38. Details of the warm water supply unit 450 will be described later.

[0076] The gas supply unit 300 (see FIG. 1) includes a blower unit 12 and an inert gas supply unit 70. The gas supply unit 300 also includes air valves provided in each part of the substrate processing apparatus 100 and an air supply unit (not shown) that supplies clean air to an air-driven pump.

[0077] The blower unit 12 is disposed above or on the upper part of the chamber 11. For example, the blower unit 12 is disposed on the top surface of the chamber 11. The blower unit 12 sends clean air into the chamber 11. The blower unit 12 includes, for example, a fan filter unit (FFU). A downflow is formed in the chamber 11 by the blower unit 12 and an exhaust device 80 described later. A flow meter 160 (see FIG. 1) is provided in the blower unit 12. The flow meter 160 measures the air volume of the blower unit 12 and outputs the measurement result to the control unit 102.

[0078] The inert gas supply unit 70 supplies an inert gas to the substrate W. The type of the inert gas is not particularly limited, and is, for example, nitrogen gas. The inert gas supply unit 70 includes a pipe 72, a valve 74, and a nozzle 76.

[0079] The nozzle 76 discharges an inert gas to the lower surface Wb of the substrate W. The nozzle 76 discharges an inert gas, for example, to the central part of the substrate W. The nozzle 76 has a discharge port and discharges an inert gas from the discharge port. The nozzle 76 discharges an inert gas, for example, in a vertically upward direction or a horizontal direction. The nozzle 76 is connected to the pipe 72. An inert gas is supplied to the pipe 72 from a supply source.

[0080] Valve 74 is attached to pipe 72. Valve 74 opens and closes the flow path of pipe 72. The type of valve 74 is not particularly limited, but in this embodiment, it is an air valve.

[0081] A flow meter 160b is attached to pipe 72. Flow meter 160b measures the amount of inert gas passing through pipe 72. Flow meter 160b outputs the measurement result to control unit 102.

[0082] Gas discharge unit 500 (see FIG. 1) includes an exhaust device 80. Exhaust device 80 includes an exhaust pipe 81 and an exhaust fan 82. Exhaust pipe 81 is arranged to penetrate the side wall of chamber 11. Exhaust pipe 81 communicates the inside and outside of chamber 11. Exhaust fan 82 discharges the air in chamber 11 to the outside of chamber 11 through exhaust pipe 81. Exhaust fan 82 can change the exhaust volume by changing the rotation speed. Exhaust fan 82 is arranged, for example, at the inlet of exhaust pipe 81, inside exhaust pipe 81, or at the outlet of exhaust pipe 81. In this embodiment, exhaust fan 82 is arranged inside exhaust pipe 81. Note that in this embodiment, the rotation speed means the number of rotations per minute (rpm). Also, in this embodiment, the exhaust volume means the amount (volume) of gas discharged per unit time. The detailed configuration of exhaust device 80 will be described later.

[0083] Further, processing unit 10 further includes a cup 90. Cup 90 collects the processing liquid scattered from substrate W. Cup 90 moves up and down. For example, cup 90 vertically rises upward to the side of substrate W during the period when chemical liquid supply unit 30, first rinse liquid supply unit 50, and / or second rinse liquid supply unit 60 supplies chemical liquid and / or rinse liquid to substrate W. In this case, cup 90 collects the chemical liquid and / or rinse liquid scattered from substrate W due to the rotation of substrate W. Also, cup 90 descends vertically downward from the side of substrate W when the period in which chemical liquid supply unit 30, first rinse liquid supply unit 50, and / or second rinse liquid supply unit 60 supplies chemical liquid and / or rinse liquid to substrate W ends.

[0084] The liquid discharge unit 600 (see FIG. 1) includes a liquid discharge device 190. The liquid discharge device 190 discharges the processing liquid collected by the cup 90 to the outside of the substrate processing apparatus 100. Details of the configuration of the liquid discharge device 190 will be described later.

[0085] The substrate processing apparatus 100 of the present embodiment is suitably used for manufacturing semiconductor elements provided with semiconductors. Typically, in a semiconductor element, a conductive layer and an insulating layer are laminated on a base material. The substrate processing apparatus 100 is suitably used for cleaning and / or processing (for example, etching, property change, etc.) of the conductive layer and / or the insulating layer during the manufacture of semiconductor elements.

[0086] Next, with reference to FIG. 4, a substrate processing method by the substrate processing apparatus 100 will be described. FIG. 4 is a flowchart showing the substrate processing method by the substrate processing apparatus 100 of the present embodiment. The substrate processing method of the substrate processing apparatus 100 includes steps S101 to S107. Steps S101 to S107 are executed by the control unit 102.

[0087] As shown in FIG. 4, in step S101, the substrate W is carried into the chamber 11. Under the control of the control unit 102, the center robot CR carries the substrate W into the chamber 11, and the substrate holding unit 20 holds the carried-in substrate W.

[0088] Next, in step S102, rotation of the substrate W is started. Under the control of the control unit 102, the substrate holding unit 20 starts rotating the substrate W while holding the substrate W.

[0089] Next, in step S103, a chemical solution is supplied to the substrate W to process the substrate W. Under the control of the control unit 102, the chemical solution supply unit 30 supplies a chemical solution (SPM) from the nozzle 36 to the substrate W rotating by the substrate holding unit 20. Then, when a predetermined time has elapsed after the control unit 102 starts supplying the chemical solution, the supply of the chemical solution is stopped. Note that the chemical solution supply unit 30 is an example of the "first supply unit" of the present invention, and SPM is an example of the "first processing solution" of the present invention.

[0090] Next, in step S104, a rinse liquid is supplied to the substrate W to perform a rinse process on the substrate W. Under the control of the control unit 102, the first rinse liquid supply unit 50 or the second rinse liquid supply unit 60 supplies the rinse liquid to the substrate W. In the present embodiment, while the first rinse liquid supply unit 50 supplies a rinse liquid (pure water) to the substrate W, the second rinse liquid supply unit 60 does not supply a rinse liquid (warm water) to the substrate W. In this case, the first rinse liquid supply unit 50 is an example of the "first supply unit" of the present invention, and pure water (DIW) is an example of the "first processing liquid" of the present invention. Also, the second rinse liquid supply unit 60 is an example of the "second supply unit" of the present invention, and warm water is an example of the "second processing liquid" of the present invention. Then, when a predetermined time has elapsed since the start of the supply of the rinse liquid, the control unit 102 stops the supply of the rinse liquid.

[0091] Next, in step S105, the substrate W is dried. Under the control of the control unit 102, the substrate holding unit 20 increases the rotation speed of the substrate W to blow off the rinse liquid on the substrate W by centrifugal force.

[0092] Next, in step S106, the rotation of the substrate W is stopped. Under the control of the control unit 102, the substrate holding unit 20 stops the rotation of the substrate W.

[0093] Next, in step S107, the substrate W is taken out from the processing unit 10. Under the control of the control unit 102, the substrate holding unit 20 releases the holding of the substrate W, and the center robot CR takes out the substrate W from the chamber 11. Thereafter, the substrate W is conveyed to the outside of the substrate processing apparatus 100 via the indexer robot IR.

[0094] As described above, the processing of the substrate W is completed. Here, for ease of understanding, a method of processing one substrate W in one chamber 11 has been described. However, since the substrate processing apparatus 100 of the present embodiment has, for example, 12 chambers 11, one lot (for example, 25 sheets) of substrate W is processed in parallel by the 12 chambers 11.

[0095] Next, with reference to FIG. 5, the sulfuric acid supply section 410 and the hydrogen peroxide solution supply section 430 of the chemical solution supply section 30 will be described. FIG. 5 is a schematic diagram showing the configuration of the sulfuric acid supply section 410 and the hydrogen peroxide solution supply section 430 of the chemical solution supply section 30.

[0096] As shown in FIG. 5, the sulfuric acid supply section 410 supplies sulfuric acid toward the nozzle 36. In the present embodiment, the sulfuric acid supply section 410 supplies sulfuric acid within a predetermined temperature range higher than room temperature toward the nozzle 36. Specifically, the sulfuric acid supply section 410 includes a supply tank 411, a circulation pipe 412, a heater 413, a pump 414, a valve 415, and a thermometer 416.

[0097] The supply tank 411 stores a chemical solution (here, sulfuric acid). In the present embodiment, the supply tank 411 stores sulfuric acid. The circulation pipe 412 is a tubular member such as a pipe. A flow path through which the chemical solution flows is formed inside the circulation pipe 412. The circulation pipe 412 has an upstream end portion 412a and a downstream end portion 412b. The circulation pipe 412 communicates with the supply tank 411. Specifically, the upstream end portion 412a and the downstream end portion 412b of the circulation pipe 412 communicate with the supply tank 411.

[0098] The heater 413 adjusts the temperature of the chemical solution by heating the chemical solution in the circulation pipe 412. The heater 413 maintains the temperature of the chemical solution within a certain temperature range (for example, 60 ± 5°C) higher than room temperature.

[0099] The pump 414 sends the chemical solution in the supply tank 411 to the circulation pipe 412. The type of the pump 414 is not particularly limited. For example, it may be an electrically driven pump or an air-driven pump. In the present embodiment, the pump 414 is, for example, an air-driven pump. When the pump 414 operates, the chemical solution in the supply tank 411 is sent to the upstream end 412a of the circulation pipe 412. The chemical solution sent to the upstream end 412a flows through the circulation pipe 412 and returns to the supply tank 411 from the downstream end 412b. By continuously operating the pump 414, the chemical solution continuously flows in the circulation pipe 412 from the upstream end 412a toward the downstream end 412b. As a result, the chemical solution circulates through the circulation pipe 412.

[0100] The valve 415 opens and closes the flow path of the circulation pipe 412. The type of the valve 415 is not particularly limited. In the present embodiment, it is an air valve.

[0101] The thermometer 416 measures the temperature of the chemical solution in the supply tank 411. The thermometer 416 outputs the measurement result to the control unit 102. The control unit 102 controls the heating by the heater 413 based on the measurement result of the thermometer 416. When the measurement result of the thermometer 416 is lower than the predetermined temperature range, the control unit 102 heats the chemical solution by the heater 413.

[0102] The sulfuric acid supply unit 410 further includes a supply pipe 417 and a valve 418.

[0103] The supply pipe 417 branches from the circulation pipe 412. The supply pipe 417 connects the circulation pipe 412 and the pipe 32. The supply pipe 417 supplies a part of the chemical solution flowing through the circulation pipe 412 to the pipe 32.

[0104] The valve 418 opens and closes the flow path of the supply pipe 417. The type of the valve 418 is not particularly limited. In the present embodiment, it is an air valve.

[0105] A flow meter 160c is attached to the supply pipe 417. The flow meter 160c measures the amount of sulfuric acid passing through the supply pipe 417. The flow meter 160c outputs the measurement result to the control unit 102.

[0106] Further, the sulfuric acid supply unit 410 further includes a cooling water pipe 421 and a valve 422. Cooling water is supplied to the cooling water pipe 421 from a supply source (liquid supply facility 2003). The cooling water pipe 421 passes through the supply tank 411 from the supply source and extends outside the substrate processing apparatus 100. The cooling water passing through the inside of the cooling water pipe 421 lowers the temperature of the sulfuric acid inside the supply tank 411.

[0107] The valve 422 opens and closes the flow path of the cooling water pipe 421. The type of the valve 422 is not particularly limited, but in the present embodiment, it is an air valve. The control unit 102 controls the opening and closing of the valve 422 based on the measurement result of the thermometer 416. When the measurement result of the thermometer 416 is higher than a predetermined temperature range, the control unit 102 opens the valve 422 to lower the temperature of the sulfuric acid with the cooling water.

[0108] A flow meter 160d is attached to the cooling water pipe 421. The flow meter 160d measures the amount of cooling water passing through the cooling water pipe 421. The flow meter 160d outputs the measurement result to the control unit 102.

[0109] The hydrogen peroxide water supply unit 430 supplies, for example, room-temperature hydrogen peroxide water toward the nozzle 36. Note that the hydrogen peroxide water supply unit 430 may supply, for example, hydrogen peroxide water at a temperature higher than room temperature toward the nozzle 36. Specifically, the hydrogen peroxide water supply unit 430 includes a supply pipe 437 and a valve 438.

[0110] The supply pipe 437 connects a supply source (liquid supply facility 2003) of hydrogen peroxide water and the pipe 32. The supply pipe 437 supplies the hydrogen peroxide water from the supply source to the pipe 32.

[0111] Valve 438 opens and closes the flow path of supply pipe 437. The type of valve 438 is not particularly limited, but in this embodiment, it is an air valve.

[0112] A flow meter 160e is attached to supply pipe 437. Flow meter 160e measures the amount of hydrogen peroxide water passing through supply pipe 437. Flow meter 160e outputs the measurement result to control unit 102.

[0113] Note that sulfuric acid supply unit 410 and hydrogen peroxide water supply unit 430 are installed in fluid cabinet 110.

[0114] Next, with reference to FIG. 6, hot water supply unit 450 will be described. FIG. 6 is a schematic diagram showing the configuration of hot water supply unit 450.

[0115] As shown in FIG. 6, hot water supply unit 450 supplies hot water within a predetermined temperature range higher than room temperature toward nozzle 66. Specifically, hot water supply unit 450 includes supply tank 451, circulation pipe 452, heater 453, pump 454, valve 455, and thermometer 456.

[0116] Supply tank 451 stores hot water. Circulation pipe 452 is a tubular member such as a pipe. A flow path through which hot water flows is formed within circulation pipe 452. Circulation pipe 452 has an upstream end portion 452a and a downstream end portion 452b. Circulation pipe 452 communicates with supply tank 451. Specifically, the upstream end portion 452a and the downstream end portion 452b of circulation pipe 452 communicate with supply tank 451.

[0117] Heater 453 adjusts the temperature of the hot water by heating the hot water within circulation pipe 452. Heater 453 maintains the temperature of the hot water within a certain temperature range (for example, 60 ± 5°C) higher than room temperature.

[0118] The pump 454 sends the warm water in the supply tank 451 to the circulation pipe 452. The type of the pump 454 is not particularly limited. For example, it may be an electric-driven pump or an air-driven pump. In this embodiment, the pump 454 is, for example, an air-driven pump. When the pump 454 operates, the warm water in the supply tank 451 is sent to the upstream end 452a of the circulation pipe 452. The warm water sent to the upstream end 452a flows through the circulation pipe 452 and returns to the supply tank 451 from the downstream end 452b. By continuously operating the pump 454, the warm water continuously flows in the circulation pipe 452 from the upstream end 452a toward the downstream end 452b. As a result, the warm water circulates through the circulation pipe 452.

[0119] The valve 455 opens and closes the flow path of the circulation pipe 452. The type of the valve 455 is not particularly limited. In this embodiment, it is an air valve.

[0120] The thermometer 456 measures the temperature of the warm water in the supply tank 451. The thermometer 456 outputs the measurement result to the control unit 102. The control unit 102 controls the heating by the heater 453 based on the measurement result of the thermometer 456. When the measurement result of the thermometer 456 is lower than a predetermined temperature range, the control unit 102 heats the warm water by the heater 453.

[0121] The warm water supply unit 450 further includes a supply pipe 457 and a valve 458.

[0122] The supply pipe 457 branches from the circulation pipe 452. The supply pipe 457 connects the circulation pipe 452 and the pipe 62. The supply pipe 457 supplies a part of the warm water flowing through the circulation pipe 452 to the pipe 62.

[0123] The valve 458 opens and closes the flow path of the supply pipe 457. The type of the valve 458 is not particularly limited. In this embodiment, it is an air valve.

[0124] A flow meter 160f is attached to the supply pipe 457. The flow meter 160f measures the amount of hot water passing through the supply pipe 457. The flow meter 160f outputs the measurement result to the control unit 102.

[0125] Moreover, the hot water supply unit 450 further includes a cooling water pipe 461 and a valve 462. Cooling water is supplied to the cooling water pipe 461 from a supply source (liquid supply facility 2003). The cooling water pipe 461 passes through the supply tank 451 from the supply source and extends outside the substrate processing apparatus 100. The cooling water passing through the inside of the cooling water pipe 461 lowers the temperature of the hot water inside the supply tank 451.

[0126] The valve 462 opens and closes the flow path of the cooling water pipe 461. The type of the valve 462 is not particularly limited, but in this embodiment, it is an air valve. The control unit 102 controls the opening and closing of the valve 462 based on the measurement result of the thermometer 456. When the measurement result of the thermometer 456 is higher than a predetermined temperature range, the control unit 102 opens the valve 462 to lower the temperature of the hot water with the cooling water.

[0127] A flow meter 160g is attached to the cooling water pipe 461. The flow meter 160g measures the amount of cooling water passing through the cooling water pipe 461. The flow meter 160g outputs the measurement result to the control unit 102.

[0128] Note that the hot water supply unit 450 is installed inside the fluid cabinet 110.

[0129] Next, with reference to FIG. 7, the exhaust device 80 and the drain device 190 will be described. FIG. 7 is a schematic diagram showing the structure around the exhaust device 80 and the drain device 190.

[0130] As shown in FIG. 7, the exhaust pipe 81 of the exhaust device 80 has a common pipe 81a, a first branch pipe 81b, a second branch pipe 81c, and a third branch pipe 81d. The first branch pipe 81b, the second branch pipe 81c, and the third branch pipe 81d are connected to the common pipe 81a. For example, a first gas containing an acid component, a second gas containing an alkali component, and a third gas containing an organic component flow through the common pipe 81a. On the other hand, for example, the first gas containing an acid component flows through the first branch pipe 81b. For example, the second gas containing an alkali component flows through the second branch pipe 81c. For example, the third gas containing an organic component flows through the third branch pipe 81d. The first branch pipe 81b, the second branch pipe 81c, and the third branch pipe 81d discharge the gas to the outside of the substrate processing apparatus 100 (the gas discharge facility 2004). In this embodiment, a gas containing almost no acid component, alkali component, and organic component (downflow during non-substrate processing, etc.) also flows through the first branch pipe 81b. Therefore, the first gas includes a gas containing almost no acid component, alkali component, and organic component.

[0131] In addition to the exhaust pipe 81 and the exhaust fan 82 (see FIG. 3), the exhaust device 80 further includes valves 83a, 83b, and 83c.

[0132] The valve 83a is attached to the first branch pipe 81b. The valve 83a opens and closes the flow path of the first branch pipe 81b.

[0133] A flow meter 160h is attached to the first branch pipe 81b. The flow meter 160h measures the amount of gas passing through the first branch pipe 81b. The flow meter 160h outputs the measurement result to the control unit 102.

[0134] The valve 83b is attached to the second branch pipe 81c. The valve 83b opens and closes the flow path of the second branch pipe 81c.

[0135] A flow meter 160i is attached to the second branch pipe 81c. The flow meter 160i measures the amount of gas passing through the second branch pipe 81c. The flow meter 160i outputs the measurement result to the control unit 102.

[0136] The valve 83c is attached to the third branch pipe 81d. The valve 83c opens and closes the flow path of the third branch pipe 81d.

[0137] A flow meter 160j is attached to the third branch pipe 81d. The flow meter 160j measures the amount of gas passing through the third branch pipe 81d. The flow meter 160j outputs the measurement result to the control unit 102.

[0138] The types of the valves 83a to 83c are not particularly limited, but in the present embodiment, they are air valves.

[0139] The liquid discharge device 190 includes a pipe 191, a liquid discharge tank 192, a valve 193, and a pump 194. The upstream end of the pipe 191 is connected to the chamber 11, and the downstream end of the pipe 191 is disposed outside the substrate processing apparatus 100. The pipe 191 discharges the liquid collected by the cup 90 to the outside of the substrate processing apparatus 100 (liquid discharge facility 2005).

[0140] The liquid discharge tank 192 is disposed in the middle of the pipe 191. The liquid discharge tank 192 stores the liquid discharged from the chamber 11.

[0141] The valve 193 is attached to the pipe 191. Specifically, the valve 193 is attached to a portion of the pipe 191 upstream of the liquid discharge tank 192. The valve 193 opens and closes the flow path of the pipe 191.

[0142] The pump 194 is attached to the pipe 191. Specifically, the pump 194 is attached to a portion of the pipe 191 that is downstream of the drainage tank 192. The pump 194 sends the liquid in the drainage tank 192 to the outside of the substrate processing apparatus 100. The type of the pump 194 is not particularly limited, and for example, it may be an electric-driven pump or an air-driven pump. In the present embodiment, the pump 194 is, for example, an air-driven pump.

[0143] The drainage device 190 further includes a thermometer 195, a cooling water pipe 196, and a valve 197. The thermometer 195 measures the temperature of the processing liquid in the drainage tank 192. The thermometer 195 outputs the measurement result to the control unit 102.

[0144] Cooling water is supplied to the cooling water pipe 196 from a supply source (liquid supply facility 2003). The cooling water pipe 196 extends from the supply source through the drainage tank 192 to the outside of the substrate processing apparatus 100. The cooling water passing through the inside of the cooling water pipe 196 lowers the temperature of the liquid inside the drainage tank 192.

[0145] The valve 197 opens and closes the flow path of the cooling water pipe 196. The type of the valve 197 is not particularly limited, but in the present embodiment, it is an air valve. The control unit 102 controls the opening and closing of the valve 197 based on the measurement result of the thermometer 195. When the measurement result of the thermometer 195 is higher than a predetermined temperature (for example, 120°C), the control unit 102 opens the valve 197 to lower the temperature of the liquid with the cooling water.

[0146] A flow meter 160k is attached to the cooling water pipe 196. The flow meter 160k measures the amount of cooling water passing through the inside of the cooling water pipe 196. The flow meter 160k outputs the measurement result to the control unit 102.

[0147] Next, the control unit 102 of the present embodiment will be further described. As described above, the control unit 102 predicts the amount of power used when processing the substrate W based on the recipe input to the input unit 180. In the present embodiment, the amount of power used includes the amount of processing power used according to the processing of the substrate W and the amount of standby power used regardless of the processing of the substrate W. It can be said that the amount of processing power is the amount of power directly used for the processing of the substrate W, and the amount of standby power is the amount of power not directly used for the processing of the substrate W. Also, it can be said that the amount of processing power is the amount of power used according to the recipe, and the amount of standby power is the amount of power used regardless of the recipe.

[0148] The amount of processing power includes, for example, the amount of processing power consumption, the amount of gas supply during processing, the amount of liquid supply during processing, the amount of gas discharge during processing, and the amount of liquid discharge during processing, which will be described later. The amount of standby power includes, for example, the amount of standby power consumption, the amount of gas supply during standby, the amount of liquid supply during standby, the amount of gas discharge during standby, and the amount of liquid discharge during standby, which will be described later.

[0149] Specifically, the control unit 102 calculates the amount of power used in each part of the substrate processing apparatus 100. The amount of power is, for example, a value obtained by summing the product of the power consumption and time in each part of the substrate processing apparatus 100. In the present embodiment, the control unit 102 includes the amount of processing power used according to the processing of the substrate W and the amount of standby power used regardless of the processing of the substrate W.

[0150] The amount of processing power includes, for example, the amount of power consumed by the spin motor 24 of the substrate holding unit 20. Also, the amount of processing power includes, for example, the amount of power consumed to open and close the valves 418 and 438 when the chemical solution supply unit 30 supplies the chemical solution to the substrate W. Also, the amount of processing power includes, for example, the amount of power consumed when driving the pump 414 of the chemical solution supply unit 30. Also, the amount of processing power includes, for example, the amount of power consumed when driving the nozzle moving unit 38.

[0151] The standby power consumption includes, for example, the power consumption in the chamber 11 that does not contain the substrate W when the substrate W is replaced or the like. Further, the standby power consumption includes, for example, the power consumption for driving the supply unit of the processing liquid that is not used for substrate processing. Specifically, assume that the recipe input to the input unit 180 is the recipe R1 that supplies SPM and normal-temperature pure water (DIW) to the substrate W while not supplying warm water (HDIW). When processing the substrate W according to this recipe R1, warm water is not used for processing the substrate W, but the heater 453 of the warm water supply unit 450 consumes power to maintain the warm water at a constant temperature. At this time, the amount of power for heating the warm water is the power consumption. Note that the warm water is supplied to the substrate W when executing a recipe different from the recipe R1.

[0152] Further, the control unit 102 calculates the amount of gas supplied by the gas supply unit 300 (the blower unit 12, the inert gas supply unit 70, etc.) to each part of the substrate processing apparatus 100. The amount of gas supplied by the gas supply unit 300 to each part of the substrate processing apparatus 100 is, for example, a value obtained by summing the products of the gas flow rate and time in each part of the substrate processing apparatus 100. In the present embodiment, the control unit 102 calculates the amount supplied by the gas supply unit 300 for each type of gas. For example, the control unit 102 calculates the amount of clean air and the amount of nitrogen gas supplied by the gas supply unit 300.

[0153] Further, in the present embodiment, the control unit 102 includes the amount of gas used according to the processing of the substrate W (hereinafter sometimes referred to as the gas supply amount during processing) and the amount of gas used regardless of the processing of the substrate W (hereinafter sometimes referred to as the gas supply amount during standby).

[0154] The gas supply amount during processing includes, for example, the amount of nitrogen gas supplied from the nozzle 76 of the inert gas supply unit 70 to the lower surface Wb of the substrate W, and the amount of clean air used to open and close the valves 418 and 438 when the chemical liquid supply unit 30 supplies the chemical liquid to the substrate W.

[0155] The gas supply amount during standby includes, for example, the amount of clean air supplied from the blower unit 12 into the chamber 11.

[0156] Further, the control unit 102 calculates the amount of liquid supplied by the liquid supply unit 400 (chemical liquid supply unit 30, first rinse liquid supply unit 50, and second rinse liquid supply unit 60) to each part of the substrate processing apparatus 100. The amount of liquid supplied by the liquid supply unit 400 to each part of the substrate processing apparatus 100 is, for example, a value obtained by summing the products of the liquid flow rate and time in each part of the substrate processing apparatus 100. In the present embodiment, the control unit 102 calculates the amount supplied by the liquid supply unit 400 for each type of liquid. For example, the control unit 102 calculates the amount of hydrogen peroxide water, the amount of sulfuric acid, the amount of cooling water (DIW), and the amount of warm water (HDIW) supplied by the liquid supply unit 400.

[0157] Also, in the present embodiment, the control unit 102 includes the amount of liquid used according to the processing of the substrate W (hereinafter sometimes referred to as the liquid supply amount during processing) and the amount of liquid used regardless of the processing of the substrate W (hereinafter sometimes referred to as the liquid supply amount during standby).

[0158] The liquid supply amount during processing includes, for example, the amount of hydrogen peroxide water supplied from the hydrogen peroxide water supply unit 430 to the nozzle 76, and the amount of pure water (DIW) supplied by the first rinse liquid supply unit 50 to the substrate W.

[0159] The liquid supply amount during standby includes, for example, the amount of cooling water flowing through the cooling water pipe 421 of the sulfuric acid supply unit 410, and the amount of cooling water flowing through the cooling water pipe 461 of the warm water supply unit 450.

[0160] Further, the control unit 102 calculates the amount of gas discharged by the gas discharge unit 500 (exhaust device 80) to the outside of the substrate processing apparatus 100. The amount of gas discharged by the gas discharge unit 500 to the outside of the substrate processing apparatus 100 is, for example, the product of the gas flow rate and time in each of the first branch pipe 81b, second branch pipe 81c, and third branch pipe 81d of the exhaust device 80. In the present embodiment, the control unit 102 calculates the amount discharged by the gas discharge unit 500 for each of the first gas, second gas, and third gas.

[0161] In addition, in the present embodiment, the control unit 102 includes the amount of gas discharged according to the processing of the substrate W (hereinafter, may be referred to as the gas discharge amount during processing), and the amount of gas discharged regardless of the processing of the substrate W (hereinafter, may be referred to as the gas discharge amount during standby).

[0162] The gas discharge amount during processing includes, for example, the amount of gas flowing through the first branch pipe 81b, the second branch pipe 81c, and the third branch pipe 81d connected to the chamber 11 that houses and processes the substrate W.

[0163] The gas discharge amount during standby includes, for example, the amount of gas flowing through the first branch pipe 81b, the second branch pipe 81c, and the third branch pipe 81d connected to the chamber 11 that does not house the substrate W, such as when the substrate W is being exchanged.

[0164] In addition, the control unit 102 calculates the amount of liquid discharged by the liquid discharge unit 600 (drainage device 190) to the outside of the substrate processing apparatus 100. The amount of liquid discharged by the liquid discharge unit 600 to the outside of the substrate processing apparatus 100 is, for example, the total value of the product of the liquid flow rate and time in the pipe 191 of the drainage device 190.

[0165] In the present embodiment, the control unit 102 includes the amount of liquid discharged according to the processing of the substrate W (hereinafter, may be referred to as the liquid discharge amount during processing), and the amount of liquid discharged regardless of the processing of the substrate W (hereinafter, may be referred to as the liquid discharge amount during standby).

[0166] The liquid discharge amount during processing includes, for example, the amount of liquid flowing through the pipe 191 connected to the chamber 11 that does not house and process the substrate W.

[0167] The liquid discharge amount during standby includes, for example, the amount of liquid flowing through the pipe 191 when the substrate W is not being processed in any of the chambers 11. In the present embodiment, the liquid discharge amount during standby is, for example, zero.

[0168] In this embodiment, as described above, the control unit 102 predicts the amount of power required for processing the substrate W, namely, the processing power amount and the standby power amount, based on the input recipe. Therefore, the control unit 102 can predict the standby power amount that cannot be read from the recipe in addition to the processing power amount that can be read to a certain extent based on the input recipe.

[0169] Also, as described above, the standby power amount when processing the substrate W based on the input recipe R1 includes the power amount for driving (e.g., heating) the hot water supply unit 450 that does not supply liquid (hot water) to the substrate W. Therefore, the control unit 102 can more accurately predict the power amount used in the substrate processing apparatus 100 when processing the substrate W.

[0170] Next, with reference to FIG. 8, the image displayed on the display unit 170 will be described. FIG. 8 is a diagram showing an example of the image displayed on the display unit 170.

[0171] As shown in FIG. 8, the display unit 170 displays an image i100 for setting and / or changing a recipe. The image i100 includes a name input field i101, a processing content input field i102, a button i103, and a prediction result display field i104.

[0172] The name input field i101 is a field for the user to input the name of the recipe. The user inputs the name of the recipe by operating the input unit 180. Note that the user may input the name of the recipe using, for example, a keyboard or the like. Also, the name input field i101 may be a pull-down menu, and the user may be able to select (input) the name of a recipe registered in the past.

[0173] The processing content input field i102 is a field for the user to input the processing content for the substrate W. The processing content includes, for example, the rotation speed (rotation rate) of the substrate W, the type of processing liquid, the discharge amount of the processing liquid, and the discharge time of the processing liquid. For example, the vertical axis "1, 2, 3 ···" of the processing content input field i102 indicates the processing steps, and the horizontal axis "A, B, C ···" indicates the processing items. The user inputs the processing content by operating the input unit 180. Note that the user may also input the processing content using a keyboard or the like.

[0174] In addition, the processing content input field i102 displays the processing content corresponding to the name input in the name input field i101. Specifically, when the user inputs the name of a registered recipe in the name input field i101 or selects the name of a registered recipe using the pull-down menu, the display unit 170 displays the processing content corresponding to the recipe in the processing content input field i102.

[0175] In this embodiment, the user can change the processing content displayed in the processing content input field i102 using the input unit 180. When the user changes the processing content, the changed processing content is displayed in the processing content input field i102.

[0176] Note that in this embodiment, the recipe obtained by the user inputting the processing content in the processing content input field i102 is the "recipe input in the input unit 180". Also, the recipe displayed in the processing content input field i102 when the user inputs a name in the name input field i101 is the "recipe input in the input unit 180". That is, in this embodiment, the recipe input in the input unit 180 includes the recipe obtained by the user inputting the processing content in the name input field i101 and the recipe obtained by the user inputting a name in the name input field i101.

[0177] Button i103 is a button for calculating the amount of power consumption according to the recipe (processing content) displayed in the processing content input field i102. Specifically, when button i103 is clicked by the user, control unit 102 calculates and predicts the amount of power consumption required by substrate processing apparatus 100 based on the recipe displayed in processing content input field i102. At this time, control unit 102 may calculate the amount of power consumption required when processing one substrate W, or may calculate the amount of power consumption required when processing one lot (here, 25 sheets) of substrate W. In the present embodiment, control unit 102 calculates the amount of power consumption required when processing one lot (here, 25 sheets) of substrate W. Note that the method for calculating the amount of power consumption by control unit 102 will be described later.

[0178] The prediction result display field i104 displays the predicted amount of power consumption. Specifically, when control unit 102 calculates and predicts the amount of power consumption according to the recipe displayed in processing content input field i102, control unit 102 controls display unit 170 to display the prediction result in prediction result display field i104.

[0179] Next, with reference to FIGS. 9 to 14, the image displayed in prediction result display field i104 will be described. FIGS. 9 to 14 are diagrams showing an example of the image displayed in prediction result display field i104.

[0180] As shown in FIG. 9, display unit 170 displays the predicted amount of power consumption based on the recipe input to input unit 180. Specifically, display unit 170 displays the predicted amount of power, the predicted amount of clean air, the predicted amount of nitrogen gas, the predicted amount of exhaust gas, the predicted amount of cooling water, and the predicted amount of hot water. Note that in FIG. 9, the amount of power is the total value of the processing power amount and the standby power amount.

[0181] In this embodiment, as shown in FIG. 10, the display unit 170 may separately display the amount of power used according to the processing of the substrate W and the amount of standby power used regardless of the processing of the substrate W. Specifically, the control unit 102 separately calculates the amount of processing power and the amount of standby power as the amount of power required when processing the substrate W based on the recipe input to the input unit 180. Then, the control unit 102 controls the display unit 170 to separately display the amount of processing power and the amount of standby power.

[0182] In this embodiment, as described above, by the display unit 170 displaying the amount of processing power and the amount of standby power, the user can easily know the amount of processing power and the amount of standby power. Therefore, when, for example, changing the recipe, the user can easily know the amount by which the amount of processing power increases or decreases and the amount by which the amount of standby power increases or decreases.

[0183] Also, in this embodiment, as shown in FIG. 11, the display unit 170 may display the amount of power obtained by converting the predicted amount of clean air, the predicted amount of nitrogen gas, the predicted amount of exhaust gas, the predicted amount of cooling water, and the predicted amount of hot water into electric power. Specifically, the amount of power includes at least one of the amount of clean air, the amount of nitrogen gas, the amount of exhaust gas, the amount of cooling water, and the amount of hot water, and the control unit 102 converts at least one of the amount of clean air, the amount of nitrogen gas, the amount of exhaust gas, the amount of cooling water, and the amount of hot water into electric power. In this embodiment, the amount of power includes the amount of clean air, the amount of nitrogen gas, the amount of exhaust gas, the amount of cooling water, and the amount of hot water, and the control unit 102 converts the amount of clean air, the amount of nitrogen gas, the amount of exhaust gas, the amount of cooling water, and the amount of hot water into electric power. Then, the display unit 170 displays the converted amount of electric power as the amount of power. Note that the display unit 170 also displays the amount of electric power used in each part of the substrate processing apparatus 100, similar to FIGS. 9 and 10.

[0184] Further, the display unit 170 may display the total value of the amount of electric power used in each part of the substrate processing apparatus 100 and the converted amount of electric power.

[0185] The method of converting the amount of clean air, the amount of nitrogen gas, the amount of exhaust gas, the amount of cooling water, and the amount of hot water into electric power is not particularly limited. For example, the calculation formula of SEMI (Semiconductor Equipment and Materials International) standard S23 may be used, or a calculation formula or coefficient determined in advance by the user may be used. These calculation formulas or coefficients may be stored in the storage unit 103 in advance.

[0186] In addition, when the predicted amount of clean air, the predicted amount of nitrogen gas, the predicted amount of exhaust gas, the predicted amount of cooling water, and the predicted amount of hot water are converted into electric power and displayed on the display unit 170, as described with reference to FIG. 10, the processing power consumption and the standby power consumption may be separately displayed on the display unit 170.

[0187] In the present embodiment, as described above, the control unit 102 may convert at least one of the clean air amount, the exhaust gas amount, the cooling water amount, and the hot water amount into electric power. The display unit 170 may display the electric power as the power consumption. With this configuration, the user can compare the environmental loads using the same index (electric power). Therefore, the user can easily change the recipe, for example, to reduce the environmental load.

[0188] Also, in this embodiment, as shown in FIG. 12, the display unit 170 may display the predicted power consumption, the predicted amount of clean air, the predicted amount of nitrogen gas, the predicted amount of exhaust gas, the predicted amount of cooling water, and the predicted amount of hot water, which are converted into carbon dioxide emissions. Specifically, the power consumption includes at least one of the power consumption, the amount of clean air, the amount of nitrogen gas, the amount of exhaust gas, the amount of cooling water, and the amount of hot water, and the control unit 102 converts at least one of the amount of clean air, the amount of nitrogen gas, the amount of exhaust gas, the amount of cooling water, and the amount of hot water into carbon dioxide emissions. In this embodiment, the power consumption includes the power consumption, the amount of clean air, the amount of nitrogen gas, the amount of exhaust gas, the amount of cooling water, and the amount of hot water, and the control unit 102 converts the power consumption, the amount of clean air, the amount of nitrogen gas, the amount of exhaust gas, the amount of cooling water, and the amount of hot water into carbon dioxide emissions. Then, the display unit 170 displays the converted carbon dioxide emissions as the power consumption.

[0189] Further, the display unit 170 may display the total value of the converted carbon dioxide emissions.

[0190] The method of converting the power consumption, the amount of clean air, the amount of nitrogen gas, the amount of exhaust gas, the amount of cooling water, and the amount of hot water into carbon dioxide emissions is not particularly limited. For example, the conversion coefficient disclosed by the Ministry of Economy, Trade and Industry may be used, or a calculation formula or coefficient determined in advance by the user may be used. These calculation formulas or coefficients may be stored in the storage unit 103 in advance.

[0191] In addition, when the predicted amount of clean air, the predicted amount of nitrogen gas, the predicted amount of exhaust gas, the predicted amount of cooling water, and the predicted amount of hot water are converted into carbon dioxide emissions and displayed on the display unit 170, as described with reference to FIG. 10, the processing power consumption and the standby power consumption may be separately displayed on the display unit 170.

[0192] In this embodiment, as described above, the control unit 102 may convert at least one of the amount of electric power, the amount of clean air, the amount of exhaust gas, the amount of cooling water, and the amount of warm water into the amount of carbon dioxide emissions. The display unit 170 may display the amount of carbon dioxide emissions as the amount of power consumption. With such a configuration, the user can compare the environmental loads using the same index (the amount of carbon dioxide emissions). Therefore, the user can easily change the recipe, for example, so as to reduce the environmental load.

[0193] Also, in this embodiment, as shown in FIG. 13, when a plurality of recipes are input to the input unit 180, the display unit 170 may compare and display the predicted amounts of power consumption based on the plurality of recipes. Specifically, the display unit 170 may, for example, arrange and display the amounts of power consumption based on a plurality of recipes (recipe R1, recipe R2) within one screen.

[0194] In this embodiment, as described above, when a plurality of recipes are input to the input unit 180, the control unit 102 predicts the amount of power consumption for each of the plurality of recipes, and the display unit 170 displays the predicted amounts of power consumption for the plurality of recipes. Such a configuration enables, for example, the user to easily compare the amount of power consumption by a new recipe with the amount of power consumption by a registered recipe when creating a new recipe. Then, the user can reduce the environmental load, for example, by using a recipe with a lower amount of power consumption.

[0195] Also, in the present embodiment, when a plurality of recipes are input to the input unit 180, the display unit 170 may display by emphasizing different parts of the plurality of recipes. Specifically, as shown in FIG. 14, when a plurality (here, two) of recipes (Recipe R1, Recipe R2) are input to the input unit 180, the control unit 102 compares the plurality of recipes and controls the display unit 170 so as to surround different parts from each other with a frame formed by a thick line of a color other than black (such as yellow). This highlighting by the frame or the like may be performed for both of the two recipes, or may be performed for only one of the two recipes. Note that the control unit 102 may control the display unit 170 to display only the recipe whose processing content has been changed. In this case, the highlighting by the frame or the like is performed for only the one displayed recipe.

[0196] In the present embodiment, as described above, when a plurality of recipes are input to the input unit 180, by the display unit 170 displaying by emphasizing different parts of the plurality of recipes, the user can easily find different parts of the plurality of recipes. Therefore, for example, it becomes easier for the user to compare the changed processing content and the amount of power consumption. Thus, for example, the user can easily know which processing content should be changed and how to change it in order to reduce the amount of power consumption.

[0197] Note that in the examples shown in FIGS. 9 to 14, only the amount of power consumption predicted by the control unit 102 is displayed, but the present invention is not limited to this. For example, after actually processing the substrate W using the recipe input by the user, the actually measured amount of power consumption may be displayed. In this case, the predicted amount of power consumption and the actually measured amount of power consumption may be displayed.

[0198] Next, with reference to FIG. 15, a method for displaying the predicted amount of power consumption based on the input recipe will be described. FIG. 15 is a flowchart showing the display method of the present embodiment. In the present embodiment, the display method of the predicted amount of power consumption includes steps S201 to S203. Note that step S201 is an example of the "receiving step" of the present invention. Step S202 is an example of the "predicting step" of the present invention. Step S203 is an example of the "displaying step" of the present invention.

[0199] As shown in FIG. 15, in step S201, the input unit 180 receives an input from the user. Specifically, the user inputs at least one recipe through the input unit 180. For example, the user inputs the processing content of the recipe through the input unit 180. Thereby, the input unit 180 receives the input from the user and outputs a signal corresponding to the received processing content to the control unit 102. The control unit 102 controls the display unit 170 to update the images displayed in the name input field i101 and the processing content input field i102 according to the input from the user.

[0200] Next, in step S202, the control unit 102 calculates the amount of power consumption based on the input recipe. Specifically, when the button i103 is clicked by the user, the control unit 102 calculates and predicts the amount of power consumption when processing the substrate W (here, 25 sheets) based on the recipe displayed in the processing content input field i102.

[0201] Next, in step S203, the display unit 170 displays the predicted amount of power consumption. Specifically, the control unit 102 controls the display unit 170 to display the predicted amount of power consumption. Thereby, for example, the images shown in FIGS. 9 to 14 are displayed on the display unit 170.

[0202] Next, with reference to FIG. 16, the learned model M will be described. FIG. 16 is a block diagram showing the control device 101.

[0203] In this embodiment, the control unit 102 calculates the amount of power consumption using the learned model M. Specifically, the storage unit 103 stores the learned model M and the recipe R. The learned model M is a model for predicting the amount of power consumption required when processing the substrate W based on the input recipe R. The control unit 102 inputs the recipe R input to the input unit 180 into the learned model M. As a result, the amount of power consumption is output from the learned model M. In this embodiment, the above-described amount of power consumption is output by the control unit 102 inputting the processing content displayed in the processing content input field i102 into the learned model M.

[0204] Continuing to refer to FIG. 16, a method for generating the learned model M will be described. The control unit 102 stores in the storage unit 103 a learning data set 103a in which the measurement results output from the power meter 150 and the flow meter 160 when actually processing the substrate W (here, one lot of substrate W) are associated with the recipe R based on a predetermined recipe R. By the control unit 102 executing processing for a plurality of lots based on a plurality of recipes R respectively, a plurality of measurement results and a plurality of recipes R are stored in the learning data set 103a in association with each other. The number of pairs of measurement results and recipes R included in the learning data set 103a is, for example, not less than several tens and not more than several hundreds.

[0205] The control unit 102 executes machine learning based on the data and computer program stored in the storage unit 103. Specifically, the control unit 102 executes machine learning using the learning data set 103a and the learning program. As a result, the learned model M is generated.

[0206] The learning program is a program for executing a machine learning algorithm to find a certain rule from the learning dataset 103a and generate a learned model M that represents the found rule. By executing the learning program by the control unit 102, the parameters of the inference program are adjusted by machine learning based on the learning dataset 103a. As a result, the learned model M is generated. The control unit 102 stores the generated learned model M in the storage unit 103.

[0207] The machine learning algorithm is not particularly limited as long as it is supervised learning. For example, it is a decision tree, a nearest neighbor method, a simple Bayes classifier, a support vector machine, or a neural network. Therefore, the learned model M includes a decision tree, a nearest neighbor method, a simple Bayes classifier, a support vector machine, or a neural network.

[0208] For example, a neural network includes an input layer, one or more intermediate layers, and an output layer. Specifically, the neural network is a deep neural network (DNN), a recurrent neural network (RNN), or a convolutional neural network (CNN), and performs deep learning. For example, a deep neural network includes an input layer, a plurality of intermediate layers, and an output layer.

[0209] Next, the update of the learned model M and the learning dataset 103a will be described. In the present embodiment, for example, every time one lot of substrates W is processed, the learned model M and the learning dataset 103a are updated.

[0210] Specifically, every time the control unit 102 processes one lot of substrates W, it associates the measurement results output from the power meter 150 and the flow meter 160 with the recipe R for processing the substrates W, and adds them to the learning dataset 103a.

[0211] Further, the control unit 102 updates the learned model M by further performing machine learning based on the updated learning dataset 103a. In the present embodiment, the control unit 102 updates the learned model M by further performing machine learning using the set of the added measurement results and the recipe R. Thereby, the prediction accuracy using the learned model M can be further improved.

[0212] As described above, the embodiments of the present invention have been described with reference to the drawings. However, the present invention is not limited to the above-described embodiments, and can be implemented in various forms without departing from the gist thereof. Further, the plurality of components disclosed in the above embodiments can be modified as appropriate. For example, a component among all the components shown in a certain embodiment may be added to the components of another embodiment, or some of the components among all the components shown in a certain embodiment may be deleted from the embodiment.

[0213] The drawings schematically show each component mainly for facilitating the understanding of the invention, and the thickness, length, number, interval, etc. of each illustrated component may be different from the actual ones for convenience in drawing preparation. Also, the configuration of each component shown in the above embodiment is an example and is not particularly limited, and it goes without saying that various changes can be made without substantially departing from the effects of the present invention.

[0214] For example, in the above embodiment, an example in which the substrate processing apparatus 100 is a single-wafer type apparatus that processes the substrates W one by one has been shown, but the present invention is not limited thereto, and the substrate processing apparatus 100 may be a so-called batch type apparatus that processes a plurality of substrates W collectively.

[0215] In the above embodiment, an example in which the control unit 102 of the substrate processing apparatus 100 generates a learned model M or updates the learned model M has been described. However, the present invention is not limited to this. For example, a learning apparatus capable of transmitting and receiving data to and from the substrate processing apparatus 100 may be provided. Then, the control unit of the learning apparatus may generate the learned model M or update the learned model M. In this case, a substrate processing system may be configured by the substrate processing apparatus 100 and the learning apparatus.

[0216] In the above embodiment, an example in which the control unit 102 predicts the power consumption amount using the machine-learned learned model M has been described. However, the present invention is not limited to this. For example, an arithmetic expression for predicting the processing power consumption amount and the standby power consumption amount is created in advance based on the measurement results output from the power meter 150 and the flow meter 160 when the substrate W was processed in the past and the recipe for processing the substrate W, and the power consumption amount may be predicted using this arithmetic expression.

[0217] In the above embodiment, an example in which the power consumption amount includes the processing power consumption amount and the standby power consumption amount has been shown. However, the present invention is not limited to this. For example, the power consumption amount may include the processing power consumption amount and may not include the standby power consumption amount.

[0218] In the above embodiment, an example in which different parts of a plurality of recipes are highlighted and displayed with reference to FIG. 14 has been shown. However, the present invention is not limited to this. For example, when changing with respect to a reference recipe, there may be a case where the processing time such as etching is shortened with the intention of reducing power consumption. In this case, there is a risk that a desired etching result cannot be obtained. Therefore, among the changed parts of the recipe, the parts that cause the desired result not to be obtained may be further highlighted and displayed using, for example, red or the like. Also, only the parts of the changed parts of the recipe that cause the desired result not to be obtained may be highlighted and displayed.

Industrial Applicability

[0219] The present invention is useful in the field of processing substrates.

Explanation of Signs

[0220] 30: Chemical solution supply unit (first supply unit) 50: First rinse solution supply unit (first supply unit) 60: Second rinse solution supply unit (second supply unit) 100: Substrate processing apparatus 102: Control unit (prediction unit) 170: Display unit 180: Input unit R, R1, R2: Recipe S201: Step (receiving step) S202: Step (predicting step) S203: Step (displaying step) W: Substrate

Claims

1. An input unit that receives an input from a user of a recipe that defines processing content, A prediction unit that predicts the amount of power used when processing a substrate based on the input recipe, A display unit that displays the predicted amount of power used A substrate processing apparatus comprising:

2. The prediction unit predicts the amount of power used when processing the substrates in one lot including one or more of the substrates based on the input recipe. The substrate processing apparatus according to claim 1.

3. The prediction unit predicts, as the amount of power used, the amount of processing power used according to the processing of the substrate and the amount of standby power used regardless of the processing of the substrate based on the input recipe. The substrate processing apparatus according to claim 1.

4. The display unit displays the amount of processing power used and the amount of standby power used. The substrate processing apparatus according to claim 3.

5. A first supply unit that supplies a first processing liquid to the substrate when executing the input recipe, A second supply unit that does not supply a second processing liquid to the substrate when executing the input recipe and supplies the second processing liquid to the substrate when executing a recipe different from the recipe Comprising: The amount of standby power used when processing the substrate based on the input recipe includes the amount of power used to drive the second supply unit. The substrate processing apparatus according to claim 3.

6. When a plurality of the recipes are input to the input unit, the prediction unit predicts a plurality of the amounts of power used based on the plurality of recipes, The display unit displays the plurality of predicted amounts of power used. The substrate processing apparatus according to any one of claims 1 to 5.

7. The display unit, Displays the input recipe, When a plurality of the recipes are input to the input unit, the display unit highlights and displays different portions of the plurality of recipes. The substrate processing apparatus according to claim 6.

8. The amount of power used includes at least one of the amount of clean air, the amount of exhaust gas, the amount of cooling water, and the amount of warm water, The prediction unit converts at least one of the amount of clean air, the amount of exhaust gas, the amount of cooling water, and the amount of warm water into an amount of electric power, The display unit displays the amount of electric power as the amount of power used. The substrate processing apparatus according to any one of claims 1 to 5.

9. The amount of power used includes at least one of the amount of electric power, the amount of clean air, the amount of exhaust gas, the amount of cooling water, and the amount of warm water, The prediction unit converts at least one of the amount of electric power, the amount of clean air, the amount of exhaust gas, the amount of cooling water, and the amount of warm water into the amount of carbon dioxide emissions. The display unit displays the amount of carbon dioxide emissions as the amount of power consumption. The substrate processing apparatus according to any one of claims 1 to 5. **Claim 10** A step of receiving an input by a user of a recipe that defines a processing content; A step of predicting the amount of power consumption when processing a substrate based on the input recipe; A step of displaying the predicted amount of power consumption And a display method.

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