Substrate mounting stage, height position adjusting mechanism, and substrate processing apparatus

Abstract

To provide a substrate mounting stage, a height position adjusting mechanism, and a substrate processing apparatus in which height of a lifting pin can be adjusted in a narrow space.SOLUTION: A substrate mounting stage that mounts a substrate in a processing container comprises a mounting stage body, and a lifting mechanism which lifts the substrate with respect to the mounting stage body. The lifting mechanism has a plurality of lifting pins which are inserted into a plurality of insertion holes provided in the mounting stage body and support and lift the substrate. A height position adjusting mechanism which adjusts height positions of the lifting pins has: a base member which is in a cylindrical shape and attached in a state where an axial direction is vertical, and in which a screw is formed in an inner peripheral part; a height adjusting member which is screwed with an inner peripheral part of the base member, and vertically moves by being rotated to adjust the height of the lifting pins; and a fixing member which is screwed at a position above the height adjusting member of the inner peripheral part of the base member, and presses to fix the height adjusting member by being rotated.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to a substrate mounting table, a height position adjusting mechanism, and a substrate processing apparatus.

Background Art

[0002] For example, in a single-wafer type substrate processing apparatus, the substrate is processed while being placed on a substrate mounting table in a processing chamber. As the substrate mounting table, a type having an elevating mechanism for raising and lowering the substrate by raising and lowering lift pins during the transfer of the substrate is widely known (for example, Patent Documents 1 and 2).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a substrate mounting table, a height position adjusting mechanism, and a substrate processing apparatus capable of adjusting the height of lift pins in a narrow space.

Means for Solving the Problems

[0005] The substrate mounting table according to one aspect of the present disclosure is a substrate mounting table for performing processing on a substrate in a processing container in a substrate processing apparatus, and includes a mounting table main body and a lifting mechanism for lifting the substrate with respect to the mounting table main body. The lifting mechanism includes a plurality of lifting pins that are respectively inserted into a plurality of insertion holes provided in the mounting table main body and support and lift the substrate at their tips, a height position adjustment mechanism to which the lifting pins are detachably attached and that adjusts the height position of the lifting pins, a support member that supports the lifting pins via the height position adjustment mechanism, and a drive unit that raises and lowers the lifting pins via the support member. The height position adjustment mechanism includes a base member having a cylindrical shape and attached to the support member with its axial direction vertical, and having threads formed on its inner peripheral portion, a height adjustment member having a first hole portion into which the lifting pin is inserted, screwed into the inner peripheral portion of the base member, and moving up and down by being rotated to adjust the height of the lifting pin, and a fixing member having a second hole portion into which the lifting pin is inserted, screwed into an upper position of the inner peripheral portion of the base member above the height adjustment member, and pressing and fixing the height adjustment member by being rotated.

Effects of the Invention

[0006] According to the present disclosure, there are provided a substrate mounting table capable of adjusting the height of lifting pins in a narrow space, a height position adjustment mechanism, and a substrate processing apparatus.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Embodiments for Carrying Out the Invention

[0008] Hereinafter, embodiments will be specifically described with reference to the accompanying drawings.

[0009] <Substrate Processing System> FIG. 1 is a plan view schematically showing a substrate processing system equipped with a first temperature control device and a second temperature control device, which are substrate processing apparatuses according to an embodiment.

[0010] The substrate processing system 1 includes a processing unit 2 that performs a plurality of processes on a substrate in a vacuum, a loading / unloading unit 3 that loads and unloads the substrate to / from the processing unit 2, and a control unit 4. The substrate is not particularly limited, but is, for example, a semiconductor wafer.

[0011] The processing unit 2 includes a plurality (eight in this example) of processing modules PM1 to PM8 that perform film formation processing and the like on the substrate W, and a transfer unit 12 that has a plurality of transfer modules TM1 to TM4 that sequentially transfer the substrate W to / from these plurality of processing modules PM1 to PM8.

[0012] The processing modules PM1 to PM8 perform processing on the substrate in a vacuum, such as film formation processing for forming a film such as a magnetic film and associated processing. When performing film formation processing, it is possible to form a multilayer film by sequentially performing film formation processing with a plurality of processing modules. Examples of the associated processing include cleaning processing and preprocessing. Note that the number of processing modules is not limited to eight and may be set to the number required according to the processing.

[0013] The transfer modules TM1 to TM4 each have hexagonal containers 30a, 30b, 30c, and 30d that are held in a vacuum and transfer mechanisms 31a, 31b, 31c, and 31d provided in each container.

[0014] In addition, each of the transfer modules TM1 to TM4 is provided with a first temperature control device 41 and a second temperature control device 42 for temperature control of the substrate, as a substrate processing apparatus according to an embodiment. For example, the first temperature control device 41 is for heating the substrate, and the second temperature control device 42 is for cooling the substrate. Specifically, the first temperature control device 41 has a function of heating to a temperature required when transferring the substrate W to any of the processing modules, and the second temperature control device 42 has a function of cooling the substrate W that has become high temperature in any of the processing modules. The first temperature control device 41 and the second temperature control device 42 are the same in basic configuration except for the difference between the heating mechanism and the cooling mechanism. These function as the substrate processing apparatus of the present embodiment, and the detailed configuration will be described later.

[0015] Note that the containers 30a, 30b, 30c, and 30d communicate via the first temperature control device 41 and the second temperature control device 42.

[0016] The transfer unit 12 is formed by arranging a plurality of transfer modules TM1 to TM4 in a row in the Y direction in the figure, and the eight processing modules PM1 to PM8 are connected to both sides of the transfer unit 12, four each, via openable and closable gate valves G. The gate valves G of the processing modules PM1 to PM8 are opened when the transfer mechanism of the transfer module accesses the processing module and are closed when processing is being performed.

[0017] The loading / unloading unit 3 is connected to one end side of the processing unit 2. The loading / unloading unit 3 includes an atmospheric transfer chamber (EFEM) 21, three load ports 22, an aligner module 23, and two load lock modules LLM1 and LLM2 that are connected to the atmospheric transfer chamber 21, and a transfer device (not shown) provided in the atmospheric transfer chamber 21. Note that the number of load ports 22 is not limited to three.

[0018] The atmospheric transfer chamber 21 has a rectangular parallelepiped shape with the X direction in the drawing as the longitudinal direction. The load ports 22 are provided on the long side wall portion on the side opposite to the processing unit 2 of the atmospheric transfer chamber 21. Each load port 22 has a mounting table 25 and a transfer port 26. A FOUP 20, which is a storage container for storing a plurality of substrates (semiconductor wafers), is placed on the mounting table 25. The FOUP 20 on the mounting table 25 is connected to the atmospheric transfer chamber 21 in a sealed state through the transfer port 26.

[0019] The aligner module 23 is connected to one of the short side wall portions of the atmospheric transfer chamber 21. In the aligner module 23, alignment of the substrate W is performed.

[0020] The two load lock modules LLM1 and LLM2 are for enabling the transfer of the wafer W between the atmospheric transfer chamber 21 at atmospheric pressure and the transfer unit 12 in a vacuum atmosphere, and the pressure is variable between atmospheric pressure and a vacuum similar to that of the transfer unit 12. The two load lock modules LLM1 and LLM2 each have two transfer ports. One transfer port is connected to the long side wall portion on the processing unit 2 side of the atmospheric transfer chamber 21 via a gate valve G2, and the other transfer port is connected to the container 30a of the transfer module TM1 in the processing unit 2 via a gate valve G1.

[0021] The load lock module LLM1 is used when transferring the substrate W from the loading / unloading unit 3 to the processing unit 2, and the load lock module LLM2 is used when transferring the substrate W from the processing unit 2 to the loading / unloading unit 3.

[0022] The transfer device in the air transfer chamber 21 transfers the substrate W to the FOUP 20 on the load port 22, the load lock modules LLM1 and LLM2, and the aligner module 23. For example, it takes out the untreated wafer W from the FOUP 20 of the load port 22, transfers the substrate W to the load lock module LLM1, receives the processed substrate W existing in the load lock module LLM2, and transfers it to the FOUP 20 of the load port 22.

[0023] In the processing unit 2, on one side of the transfer unit 12, in order from the load lock module LLM1 side, the processing modules PM1, PM3, PM5, and PM7 are arranged, and on the other side of the transfer unit 12, in order from the load lock module LLM2 side, the processing modules PM2, PM4, PM6, and PM8 are arranged. Also, in the transfer unit 12, the transfer modules TM1, TM2, TM3, and TM4 are arranged in order from the load lock modules LLM1 and LLM2 sides.

[0024] The transfer mechanism 31a of the transfer module TM1 is accessible to the load lock modules LLM1 and LLM2, the processing modules PM1 and PM2, and the first and second temperature control devices 41 and 42 of the transfer module TM1. The transfer mechanism 31b of the transfer module TM2 is accessible to the processing modules PM1, PM2, PM3, and PM4, the first and second temperature control devices 41 and 42 of the transfer module TM1, and the first and second temperature control devices 41 and 42 of the transfer module TM2. The transfer mechanism 31c of the transfer module TM3 is accessible to the processing modules PM3, PM4, PM5, and PM6, the first and second temperature control devices 41 and 42 of the transfer module TM2, and the first and second temperature control devices 41 and 42 of the transfer module TM3. The transfer mechanism 31d of the transfer module TM4 is accessible to the processing modules PM5, PM6, PM7, and PM8, the first and second temperature control devices 41 and 42 of the transfer module TM3, and the first and second temperature control devices 41 and 42 of the transfer module TM4.

[0025] The control unit 4 controls each component of the substrate processing system 1, such as the transfer modules TM1 to TM4 (transfer mechanisms 31a to 31d), the transfer device in the atmospheric transfer chamber 21, the processing modules PM1 to PM8, the load lock modules LLM1 and LLM2, the gate valves G, G1, G2, and the first and second temperature control devices 41 and 42, etc. The control unit 4 is composed of a computer and includes a main control unit having a CPU, an input device, an output device, a display device, and a storage device. A storage medium storing a processing recipe is provided in the storage device. The main control unit causes the substrate processing system 1 to execute a predetermined operation based on the processing recipe called from the storage medium.

[0026] In the substrate processing system 1 configured as described above, first, the transfer device in the atmospheric transfer chamber 21 takes out the substrate W from the FOUP 20, and after transporting the taken-out substrate W to the aligner module 23 for alignment, it transports the substrate W to the load lock module LLM1. Then, after evacuating the load lock module LLM1, the substrate W is taken out by the transfer mechanism 31a of the transfer module TM1. Then, the substrate W is sequentially and serially transported to the processing modules PM1, PM3, PM5, PM7, PM8, PM6, PM4, and PM2 by the transfer mechanisms 31a to 31d of the transfer modules T1 to TM4. In each processing module, a predetermined process, such as a film forming process, is performed on the substrate W.

[0027] Also, before and after the processing of each processing module, if necessary, the substrate W is heated to the temperature required for processing by the first temperature control device 41 of each transfer module, or the substrate W that has become high temperature is cooled by the second temperature control device 42.

[0028] After the processing of the substrate W in the processing module PM2 is completed in this way, the substrate W is transported by the transfer mechanism 31a of the transfer module TM1 to the load lock module LLM2 held in a vacuum. Then, after bringing the load lock module LLM2 to atmospheric pressure, the substrate W is returned to the FOUP 20 by the transfer device in the atmospheric transfer chamber 21.

[0029] As described above, the substrate W can be sequentially and serially conveyed in a U shape to a plurality of processing modules to perform a series of processes, such as a film forming process.

[0030] <First temperature control device 41> Next, an example of the first temperature control device 41 will be described. FIG. 2 is a cross-sectional view showing an example of the first temperature control device 41. The first temperature control device 41 includes a processing container 51 that defines a processing chamber, a substrate mounting table 52 on which the substrate W is placed within the processing container 51, and a heater 53 as a processing mechanism for processing the substrate.

[0031] The substrate mounting table 52 includes a mounting table main body 61 and a lifting mechanism 71 that raises and lowers the substrate W with respect to the mounting table main body 61 by lifting pins 72.

[0032] The mounting table main body 61 includes a base portion 62 and an electrostatic chuck 63 provided thereon. The electrostatic chuck 63 has a structure in which an adsorption electrode 64 is embedded in an insulator, and the substrate W is electrostatically adsorbed by applying a DC voltage from a DC power source (not shown) to the adsorption electrode 64. Further, a heater 53 as a processing mechanism is provided on the mounting table main body 61. In this example, the heater 53 is embedded in the electrostatic chuck 63. The heater 53 may be embedded in the base portion 62. The heater 53 is configured to perform a heat treatment on the substrate W. The mounting table main body 61 is provided with a pin insertion hole 65 through which the lifting pins 72 of the lifting mechanism 71 described later are inserted. The mounting table main body 61 is supported by a support shaft 66 extending from the bottom of the processing container 51. The support shaft 66 has a hollow structure, and power supply lines to the adsorption electrode 64 of the electrostatic chuck 63 and power supply lines to the heater 53 are inserted therein.

[0033] The elevating mechanism 71 includes three (only two are shown) elevating pins 72 that support and elevate the substrate W at their tips, a height position adjusting mechanism 73 for adjusting the height positions of the elevating pins 72, a support arm 74 that supports the elevating pins 72, and a driving unit 75 that drives the elevating pins to move up and down via the support arm 74. The elevating pins 72 are detachably attached to the height position adjusting mechanism 73, inserted through the pin insertion holes 65 of the mounting table main body 61, and their tips are provided so as to be able to protrude and retract with respect to the substrate mounting surface. Then, by moving the elevating pins 72 up and down via the support arm 74 and the height position adjusting mechanism 73 by the driving unit 75, the substrate W is configured to be movable up and down. Specifically, with the elevating pins 72 raised by the driving unit 75, the substrate W conveyed by the conveying mechanism is received on the elevating pins 72, and the elevating pins 72 are lowered to lower the substrate W and place it on the mounting table main body 61. The height position adjusting mechanism 73 will be described in detail later.

[0034] The first temperature control device 41 further has, among other things, a loading / unloading port for loading and unloading the substrate W, a gate valve for opening and closing the loading / unloading port, an exhaust mechanism for individually exhausting the inside of the processing container 51 to control the pressure, and a mechanism for supplying a gas for controlling the pressure (none of which are shown).

[0035] In the first temperature control device 41 configured as described above, the substrate W is carried into the processing container 51 by the corresponding one of the conveying mechanisms 31a to 31d of the conveying modules TM1 to TM4. Then, the substrate W is lifted by the elevating mechanism 71 and placed on the mounting table main body 61, and electrostatically adsorbed by the electrostatic chuck 63. In this state, the inside of the processing container 51 is exhausted and a gas is supplied to control the pressure, and the substrate W is heat-treated by the heater 53 to adjust the temperature of the substrate W to a predetermined temperature. After the processing is completed, the substrate W is carried out by the corresponding conveying mechanism.

[0036] <The second temperature control device 42> Next, an example of the second temperature control device 42 will be described. FIG. 3 is a cross-sectional view showing an example of the second temperature control device 42. The basic configuration of the second temperature control device 42 is the same as that of the first temperature control device 41. Instead of the substrate stage 52 having the mounting table body 61 provided with the heater 53 as a processing mechanism in the first temperature control device 41, a substrate stage 52' having a mounting table body 61' provided with a refrigerant flow path for performing a cooling process on the substrate W as a processing mechanism is provided. Therefore, the same components as those in the first temperature control device 41 in FIG. 2 are denoted by the same reference numerals and the description thereof is omitted.

[0037] The second temperature control device 42 includes a processing container 51 similar to the first temperature control device 41, a substrate stage 52', and a refrigerant flow path 54 as a processing mechanism for processing the substrate.

[0038] The substrate stage 52' includes a mounting table body 61' and an elevating mechanism 71 for raising and lowering the substrate W with respect to the mounting table body 61'. The elevating mechanism 71 is configured in the same manner as the elevating mechanism 71 of the first temperature control device 41.

[0039] The mounting table body 61' includes a base portion 62' and an electrostatic chuck 63' provided thereon. The electrostatic chuck 63' has a structure in which an adsorption electrode 64 is embedded in an insulator. Further, a refrigerant flow path 54 as a processing mechanism is provided in the mounting table body 61'. In this example, the refrigerant flow path 54 is provided in the base portion 62'. The refrigerant flow path 54 may be provided in the electrostatic chuck 63'. By flowing refrigerant through the refrigerant flow path 54 from a refrigerant source (not shown) via a pipe (not shown), the substrate W can be cooled.

[0040] Note that the second temperature control device 42 may not have a gate valve, an exhaust mechanism for individually exhausting the inside of the processing container 51 to control the pressure, and a mechanism for supplying a gas for controlling the pressure.

[0041] In the second temperature control device 42 configured as described above, the substrate W is carried into the processing container 51 by the corresponding one of the transfer mechanisms 31a to 31d of the transfer modules TM1 to TM4. Then, the substrate W is lifted by the lifting mechanism 71 and placed on the mounting table main body 61', and electrostatically adsorbed by the electrostatic chuck 63'. In this state, the refrigerant is passed through the refrigerant flow path 54 to cool the substrate W, and the temperature of the substrate W is adjusted to a predetermined temperature. After the processing is completed, the substrate W is carried out by the corresponding transfer mechanism.

[0042] <Height position adjustment mechanism 73> Next, the height position adjustment mechanism 73 used in the first temperature control device 41 and the second temperature control device 42 will be described in detail.

[0043] FIG. 4 is a cross-sectional view showing the height position adjustment mechanism 73, and FIG. 5 is a partial cross-sectional perspective view showing a state where the lifting pin of the height position adjustment mechanism 73 is pulled out. The height position adjustment mechanism 73 adjusts the height position in advance so that the lifting pin 72 is at an appropriate height position where the substrate W can be smoothly transferred from the transfer mechanism to the mounting table main body. The height position adjustment mechanism 73 has the lifting pin 72 detachably mounted, and the adjustment of the height position of the lifting pin 72 is performed by a pin height position adjustment jig as described later with the lifting pin pulled out. As shown in FIGS. 4 and 5, the height position adjustment mechanism 73 includes a base member 81, a height adjustment member 82, and a fixing member 83.

[0044] The base member 81 has a cylindrical shape and is attached to the support arm 74 with its axial direction vertical, and a screw is formed on its inner peripheral portion.

[0045] The height adjustment member 82 is a height adjustment set screw for adjusting the height position of the lifting pin 72. It has a bottomed cylindrical shape, and a screw is formed on its outer peripheral portion and is configured as a nut that screws into the inner peripheral portion of the base member 81. By rotating it, it moves up and down to adjust the height position of the lifting pin 72. A hole portion 91 extending in the vertical direction is formed inside the height adjustment member 82. When the processing operation is performed, the lifting pin 72 is inserted into the hole portion 91 to support the lifting pin 72.

[0046] When adjusting the height position of the lifting pin 72, for example, the lifting pin 72 is pulled out from the height adjustment member 82, and a pin height position adjusting jig for adjusting the height position of the lifting pin 72 is attached to the height adjustment member 82 from above. Then, the height adjustment member 82 is configured to be rotatable by the pin height position adjusting jig and movable in the vertical direction, thereby adjusting the height of the pin height position adjusting jig and thus adjusting the height of the lifting pin 72. The upper part of the hole 91 is an engaging hole 92 with which the pin height position adjusting jig engages, and is configured as a hexagonal hole as shown in FIG. 5, for example. The hole 91 further has a circular small-diameter portion 93 communicating with the lower side of the engaging hole 92 and a circular large-diameter portion 94 communicating with the lower side of the small-diameter portion 93. When the lifting pin 72 is inserted, the lateral position of the lifting pin 72 is defined by the small-diameter portion 93.

[0047] The fixing member 83 is a fixing set screw for fixing the height adjustment member 82, has a cylindrical shape, and is configured as a nut with a screw formed on the outer peripheral portion and screwed to a position above the height adjustment member 82 on the inner peripheral portion of the base member 81. The fixing member 83 presses the height adjustment member 82 by being rotated and fixes it by the double-nut effect. A hole 95 extending in the vertical direction is formed inside the fixing member 83, and when performing the processing operation, the lifting pin 72 is inserted into the hole 95. When performing the height adjustment operation by the height adjustment member 82, the fixing member 83 is, for example, fitted with a fixing jig from above and rotated by the fixing jig when the position of the height adjustment member 82 is determined. The upper part of the hole 95 is an engaging hole 96 with which the fixing jig engages, and is configured as a hexagonal hole as shown in FIG. 5, for example. Thus, the fixing member 83 can be rotated by rotating the fixing jig with the engaging portion of the fixing jig engaged with the engaging hole. The hole 95 further has a circular hole portion 97 formed in a circular shape communicating with the lower side of the engaging hole 96. The circular hole portion 97 has a diameter through which the portion corresponding to the engaging hole 92 of the pin height position adjusting jig can pass.

[0048] <Adjustment of the height position of the lifting pin> Next, an example of the height position adjustment operation of the lifting pin 72 by the height position adjustment mechanism 73 will be described in detail.

[0049] FIG. 6 shows an example of a jig used when adjusting the height position of the lifting pin 72. (a) is the pin height position adjusting jig 101, and (b) is the fixing jig 102.

[0050] The pin height position adjusting jig 101 has a long shape imitating the lifting pin 72, and for example, it is designed such that the height position when mounted on the height position adjustment mechanism 73 is the same as the height position of the lifting pin 72. The pin height position adjusting jig 101 is provided with a protruding portion 101a that engages with the engaging hole 92 of the height adjusting member 82. The protruding portion 101a may have, for example, a hexagonal shape corresponding to the hexagonal hole of the engaging hole 92. A rotating jig (knob) for rotating the pin height position adjusting jig 101 can be mounted on the upper part of the pin height position adjusting jig 101. In the illustrated example, the pin height position adjusting jig 101 has a portion below the protruding portion 101a, but this portion may not be present.

[0051] The fixing jig 102 has a long cylindrical shape, and an insertion hole into which the pin height position adjusting jig 101 is inserted is formed inside. An engaging portion 102a that engages with the engaging hole 96 is provided at the lower end of the fixing jig 102. The engaging portion 102a has, for example, a hexagonal shape corresponding to the hexagonal hole of the engaging hole 96. Also, a head portion 102b to which a wrench for rotating the fixing jig 102 can be attached is provided at the upper end of the fixing jig 102. Note that the size of the engaging hole 96 may be the same as that of the engaging hole 92.

[0052] FIG. 7 is a process cross-sectional view showing an example of the flow when adjusting the height position of the lifting pin 72 using the pin height position adjusting jig 101 and the fixing jig 102 as described above.

[0053] First, as shown in FIG. 7(a), the lifting pin is removed from the height position adjustment mechanism 73.

[0054] Next, as shown in Fig. 7(b), the pin height position adjusting jig 101 is inserted and mounted from above onto the height adjusting mechanism 73 from which the lifting pin 72 has been removed. At this time, the pin height position adjusting jig 101 is inserted into the height adjusting mechanism 73 from above, and the protruding portion 101a is engaged with the engaging hole 92 of the hole portion 91. In this state, by rotating the pin height position adjusting jig 101, the height adjusting member 82 is rotated and moved up and down to adjust the height position of the pin height position adjusting jig 101. As described above, if the pin height position adjusting jig 101 is designed such that its height position becomes the same as the height position of the lifting pin 72, the height position of the lifting pin can be indirectly adjusted by adjusting the height position of the pin height position adjusting jig 101.

[0055] Next, as shown in Fig. 7(c), with the pin height position adjusting jig 101 still mounted, a fixing jig 102 is mounted on the height adjusting mechanism 73. Keeping the pin height position adjusting jig 101 mounted is to prevent the position of the height adjusting member 82 from shifting after the height adjustment is completed. At this time, the fixing jig 102 is lowered from above so that the pin height position adjusting jig 101 is inserted into the hole inside it and becomes coaxial, and the engaging portion 102a at its tip is engaged with the engaging hole 96. In this state, the fixing jig 102 is rotated to tighten the fixing member 83, and the height adjusting member 82 is fixed by the double nut effect.

[0056] Fig. 8 is a cross-sectional view showing an example of the state in which the pin height position adjusting jig 101 and the fixing jig 102 are mounted. As shown in Fig. 8, the pin height position adjusting jig 101 and the fixing jig 102 can access the height adjusting mechanism 73 through the pin insertion hole 65, for example, from above the mounting table body 61 (61´). Then, the pin height position adjusting jig 101 can adjust its height position by moving the height adjusting member 82 in the vertical direction by rotating the rotating jig (knob) 103. Also, the fixing jig 102 has a wrench 104 mounted on the head portion 102b, and can be rotated by the wrench 104 to rotate the fixing member 83 and fix the height adjusting member 82.

[0057] As described above, by adjusting the height position of the pin height position adjusting jig 101, the height position of the lifting pin 72 is indirectly adjusted. After that, the pin height position adjusting jig 101 and the fixing jig 102 are removed, and the lifting pin 72 is attached to the height position adjusting mechanism 73 to perform the actual process.

[0058] Conventionally, in a substrate processing apparatus, a substrate mounting table having a lifting mechanism for lifting a substrate by lifting pins during the transfer of the substrate has been widely used. Conventionally, as shown in FIG. 9, as the height position adjusting mechanism 173, it has generally been common to use a base member 181, a height adjusting set screw 182 provided in the base member 181, and a fixing set screw 183 for fixing the height adjusting set screw 182 from the lateral direction.

[0059] However, the first temperature control device 41 and the second temperature control device 42 are provided in the transfer module in order to efficiently perform heat treatment and cooling treatment before and after processing in the processing module, for example, film forming processing. Moreover, in order to perform temperature control with high precision, the structure is such that a substrate mounting table is provided in the processing container. For this reason, the space below the mounting table main body 61 (61') is extremely narrow, and it is extremely difficult to operate the fixing set screw from the lateral direction. Conventionally, there has been a technique for providing a substrate mounting table capable of performing temperature control in the transfer module (for example, Japanese Patent No. 5854741), but there has been no technique for providing a processing container for performing temperature control in the transfer module, and the problem of being unable to operate the fixing set screw in a narrow space has not been recognized.

[0060] Therefore, in order to solve such problems, the height position adjusting mechanism 73 is structured such that a height adjusting member 82, which is a height adjusting set screw, and a fixing member 83, which is a fixing set screw, are screwed together vertically to a screw formed on the inner peripheral portion of a cylindrical base member 81. Thereby, it is possible to access from above and operate the fixing member 83, and even if the space below the mounting table main body 61 (61') is narrow, the fixing member 83 can be easily operated.

[0061] Then, the height adjustment of the lifting pin 72 can be easily performed, for example, with the lifting pin 72 pulled out, by mounting the pin height position adjusting jig 101 on the height adjusting member 82 from above and rotating the height adjusting member 82 with the pin height position adjusting jig 101 to adjust its height position. Also, the fixing of the height adjusting member 82 can be easily performed, for example, by mounting the fixing jig 102 on the fixing member 83 from above and rotating the fixing member 83.

[0062] Conventionally, since the fixing set screw is operated from the lateral direction, it was necessary to remove members such as the mounting table body that obstructed the operation when adjusting the height of the lifting pin, which was cumbersome. In contrast, in this embodiment, the fixing jig 102 can access the fixing member 83 of the height position adjusting mechanism 73 through the pin insertion hole 65 from above the mounting table body 61 (61'), and the pin height position adjusting jig 101 can also access through the pin insertion hole 65. Therefore, it is not necessary to remove the mounting table body 61 (61').

[0063] Furthermore, since the pin height position adjusting jig 101 and the fixing jig 102 are coaxial, after adjusting the height adjusting member 82 with the pin height position adjusting jig 101, the fixing member 83 can be operated with the fixing jig 102 without removing the pin height position adjusting jig 101. For this reason, it is possible to fix with the fixing member 83 without causing displacement of the height adjusting member 82 with high precision, and it is possible to efficiently perform the height position adjustment of the lifting pin 72 and the fixing of the height adjusting member 82 by the fixing member 83.

[0064] <Other Applications> As described above, the embodiments have been explained, but the embodiments disclosed this time should be considered as illustrative in all respects and not restrictive. The above embodiments may be omitted, substituted, or changed in various forms without departing from the scope and gist of the appended claims.

[0065] For example, in the above embodiment, a processing system that sequentially and serially conveys and processes a substrate with respect to a plurality of processing modules applied to the substrate processing apparatus has been described, but the present invention is not limited thereto, and the substrate may be randomly conveyed to the plurality of processing modules.

[0066] In addition, although the temperature control device provided in the transfer module has been described as an example of the substrate processing apparatus, the present invention is not limited to that provided in the transfer module, nor is it limited to the temperature control device. Any substrate processing apparatus that raises and lowers the substrate by lifting pins and places the substrate on the mounting table body is applicable.

Explanation of Reference Numerals

[0067] 1; Processing system 2; Processing unit 3; Loading / unloading unit 4; Control unit 12; Transfer unit 30a, 30b, 30c, 30d; Container 31a, 31b, 31c, 31d; Transfer mechanism 41; First temperature control device (substrate processing apparatus) 42; Second temperature control device (substrate processing apparatus) 51; Processing container 52, 52´; Substrate mounting table 53; Heater (processing mechanism) 54; Refrigerant flow path (processing mechanism) 61, 61´; Mounting table body 65; Pin insertion hole 71; Lifting mechanism 72; Lifting pin 73; Height position adjustment mechanism 74; Support arm 75; Driving unit 81; Base member 82; Height adjustment member 83; Fixing member 91, 95; Hole portion 92, 96; Engaging hole 101; Pin height position adjustment jig 101a; Protrusion 102; Fixing jig 102a; engaging portion PM1~PM8; processing module TM1~TM4; transfer module W; substrate

Claims

1. In a substrate processing apparatus that processes a substrate in a processing chamber, a substrate mounting table for mounting the substrate in the processing chamber, comprising: a mounting table body; a lifting mechanism for lifting and lowering the substrate with respect to the mounting table body; the lifting mechanism comprising: a plurality of lifting pins respectively inserted into a plurality of insertion holes provided in the mounting table body and supporting and lifting the substrate at their tips; a height position adjusting mechanism to which the lifting pins are detachably attached and which adjusts the height position of the lifting pins; a support member for supporting the lifting pins via the height position adjusting mechanism; and a drive unit for lifting and lowering the lifting pins via the support member, wherein the height position adjusting mechanism comprises: a base member having a cylindrical shape, attached to the support member with its axial direction vertical, and having threads formed on its inner peripheral portion; a height adjustment member having a first hole portion into which the lifting pin is inserted, screwed into the inner peripheral portion of the base member, and moving up and down by being rotated to adjust the height of the lifting pin; a fixing member having a second hole portion into which the lifting pin is inserted, screwed into an upper position of the inner peripheral portion of the base member above the height adjustment member, and rotating to press and fix the height adjustment member; A substrate mounting table having the above.

2. The height adjustment of the lifting pin is performed by mounting a pin height position adjusting jig on the height adjustment member from above with the lifting pin pulled out, and rotating the height adjustment member by the pin height position adjusting jig to adjust the height position of the pin height position adjusting jig. The fixing of the height adjustment member is performed by mounting a fixing jig on the fixing member from above and rotating the fixing member. The substrate mounting table according to Claim 1.

3. The first hole portion of the height adjustment member has an engagement hole with which the pin height position adjusting jig engages, and the second hole portion of the fixing member has an engagement hole with which the fixing jig engages. The substrate mounting table according to Claim 2.

4. The pin height position adjusting jig and the fixing jig access the height position adjusting mechanism through the insertion hole from above the mounting table body. The substrate mounting table according to Claim 2.

5. ​ The fixing jig has an insertion hole into which the pin height position adjusting jig is inserted. With the pin height position adjusting jig mounted, the fixing jig is mounted on the fixing member such that the pin height position adjusting jig is inserted into the insertion hole and becomes coaxial with the pin height position adjusting jig. The substrate mounting table according to any one of claims 1 to 4.

6. In a substrate processing apparatus that processes a substrate in a processing chamber, in a substrate mounting table that mounts a substrate in the processing chamber, a plurality of lifting pins for lifting and lowering the substrate and mounting the substrate on the mounting table body are detachably mounted, and a height position adjusting mechanism for adjusting the height position of the lifting pins, A base member having a cylindrical shape and attached to a support member that supports the lifting pins with the axial direction vertical, and having threads formed on the inner peripheral portion, A height adjustment member having a first hole portion into which the lifting pin is inserted, screwed into the inner peripheral portion of the base member, and moved up and down by rotation to adjust the height of the lifting pin, A fixing member having a second hole portion into which the lifting pin is inserted, screwed to a position above the height adjustment member on the inner peripheral portion of the base member, and rotated to press and fix the height adjustment member, A height position adjusting mechanism having.

7. The height adjustment of the lifting pin is performed indirectly by mounting a pin height position adjusting jig on the height adjustment member from above with the lifting pin pulled out, and rotating the height adjustment member by the pin height position adjusting jig to adjust the height position of the pin height position adjusting jig. The fixing of the height adjustment member is performed by mounting a fixing jig on the fixing member from above and rotating the fixing member. The height position adjusting mechanism according to claim 6.

8. A substrate processing apparatus for processing a substrate, A processing chamber, A substrate mounting table for mounting a substrate in the processing chamber, A processing mechanism for processing the substrate, Comprising, The substrate mounting table, A mounting table body, An elevating mechanism for elevating the substrate with respect to the mounting table body, The elevating mechanism, Lifting pins respectively inserted into a plurality of insertion holes provided in the mounting table body, and supporting and lifting the substrate at their tips, A height position adjusting mechanism for detachably mounting the lifting pins and adjusting the height position of the lifting pins, A support member for supporting the lifting pins via the height position adjusting mechanism, And a drive unit for raising and lowering the lifting pins via the support member. The height position adjustment mechanism is a base member that is cylindrical, attached to the support member with its axial direction vertical, and has threads formed on its inner peripheral portion, a height adjustment member that has a first hole into which the lifting pin is inserted, is screwed into the inner peripheral portion of the base member, and moves up and down when rotated to adjust the height of the lifting pin, a fixing member that has a second hole into which the lifting pin is inserted, is screwed to a position above the height adjustment member on the inner peripheral portion of the base member, and presses and fixes the height adjustment member when rotated, and the substrate processing apparatus having the same.

9. The adjustment of the height of the lifting pin is performed by mounting a pin height position adjustment jig on the height adjustment member from above with the lifting pin pulled out, and rotating the height adjustment member by the pin height position adjustment jig to adjust the height position of the pin height position adjustment jig. The substrate processing apparatus according to claim 8, wherein the fixing of the height adjustment member is performed by mounting a fixing jig on the fixing member from above and rotating the fixing member.

10. The substrate processing apparatus according to claim 8, wherein the processing mechanism is a temperature adjustment mechanism provided on the mounting table main body.

11. The substrate processing apparatus according to claim 10, wherein the temperature adjustment mechanism has a heater for heating the substrate.

12. The substrate processing apparatus according to claim 10, wherein the temperature adjustment mechanism has a refrigerant flow path through which a refrigerant for cooling the substrate flows.

13. In a substrate processing system having a plurality of processing modules that perform processing on a substrate in a vacuum state, and a transfer module to which the plurality of processing modules are connected and that transfers the substrate to the plurality of processing modules in a vacuum state, the substrate processing apparatus according to any one of claims 10 to 12 provided in the transfer module.

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