Work system for substrate

Abstract

To previously prevent a stop of a work system for a substrate due to an inappropriate brightness.SOLUTION: A work system for a substrate, comprises: a mark camera unit 40; a movable device 30; a camera adjustment tool 70; and a control device 50. The mark camera unit 40 includes: a mark camera 41; a mark camera light source 42. The movable device 30 includes a light source control substrate 35 that controls the mark camera light source 42. The camera adjustment tool 70 is used for an adjustment of a camera, that is performed in a single body of the mark camera unit 40. The control device 50 performs a light amount adjustment by a combination of the mark camera unit 40 and the light source control substrate 35. The camera adjustment tool 70 remains a first adjustment completion certification indicating a camera adjustment completion certification after a completion of the camera adjustment in the mark camera unit 40. The control device 50 remains a second adjustment completion certification indicating a light amount adjustment completion after the completion of a light amount adjustment in the mark camera unit 40.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The technology disclosed in this specification relates to a substrate handling system.

Background Art

[0002] Conventionally, as an example of a substrate handling system that performs predetermined work on a substrate arranged in the XY plane, there is known one including a head unit equipped with a mark camera unit and an XY robot that moves in the XY plane. The mark camera unit has a mark camera and a mark camera light source, and also includes a relatively large control board. The XY robot includes an X-axis direction drive unit that moves the head unit in the X-axis direction and a Y-axis direction drive unit that moves the head unit in the Y-axis direction. Note that the head unit and the mark camera unit are mounted on the X-axis direction drive unit.

[0003] Also, conventionally, in order to miniaturize / lighten the mark camera unit, it has been proposed to separate the above control board from the mark camera unit and arrange it on the head unit side. By the way, there are individual differences (for example, variations in brightness) in the mark camera light sources. For this reason, conventionally, after adjusting the light amount in a state where the mark camera and the mark camera light source are assembled (that is, in the state of the mark camera unit), the mark camera unit is mounted on the actual machine (that is, the head unit). Note that, as this type of conventional technology, for example, what is disclosed in Patent Document 1 is known.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, individual differences exist not only in the mark camera light source but also in the control board (specifically, the light source control board). Therefore, even after mounting on the actual machine, if the light amount is not adjusted, the appropriate brightness may not be achieved. If it is not adjusted to the appropriate brightness, there is a problem that, depending on the subject (for example, a mark attached to the board), due to an image processing error or the like, the system may stop. Therefore, this specification provides a technique capable of preventing the stop of the substrate work system caused by inappropriate brightness.

Means for Solving the Problems

[0006] This specification discloses a substrate work system that performs predetermined work on a substrate arranged in the XY plane. The substrate work system includes a mark camera unit, a moving device, a camera adjustment jig, and a control device. The mark camera unit has a mark camera that images a mark attached to the substrate and a mark camera light source that illuminates the substrate. The moving device has a light source control board that controls the mark camera light source and is mounted with the mark camera unit, and moves in the XY plane together with the mark camera unit. The camera adjustment jig is used for camera adjustment performed with the mark camera unit alone before being mounted on the moving device, and writes the adjustment result of the camera adjustment into a storage unit in the mark camera. The control device performs light amount adjustment in combination with the mark camera unit and the light source control board after being mounted on the moving device. After completion of the camera adjustment, the camera adjustment jig leaves a first adjustment completed certificate indicating that the camera adjustment with the mark camera unit alone has been completed in the mark camera unit. After completion of the light amount adjustment in combination with the mark camera unit and the light source control board, the control device leaves a second adjustment completed certificate indicating that the light amount adjustment in the combination has been completed in the mark camera unit. Therefore, according to the above-described configuration, it is possible to prevent the stop of the substrate work system caused by inappropriate brightness.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Mode for Carrying Out the Invention

[0008] (Aspect 1) In the substrate-facing work system disclosed in this specification, the control device checks the presence or absence of a first adjusted certificate before adjusting the light quantity in combination with the mark camera unit and the light source control board. If there is no first adjusted certificate, the control device may instruct to perform camera adjustment with the mark camera unit alone using a camera adjustment jig. With such a configuration, it is possible to prevent forgetting to perform camera adjustment with the mark camera unit alone. (Aspect 2) In the substrate-facing work system disclosed in this specification, the control device checks the presence or absence of a second adjusted certificate at a predetermined timing after the mark camera unit is mounted on the moving device. If there is no second adjusted certificate, the control device may instruct to perform light quantity adjustment in combination with the mark camera unit and the light source control board. With such a configuration, it is possible to prevent forgetting to perform light quantity adjustment in combination with the mark camera unit and the light source control board. (Aspect 3) In the substrate-facing work system disclosed in this specification, the camera adjustment jig may write a first flag as the first adjusted certificate to the storage device in the mark camera unit, and the control device may write a second flag as the second adjusted certificate to the storage device in the mark camera unit. With such a configuration, it is possible to determine which light quantity adjustment is being performed based on the state of the flag. (Aspect 4) In the substrate-facing work system disclosed in this specification, the storage unit and the storage device may be a non-volatile memory in the mark camera. (Aspect 5) The substrate-facing work system disclosed in this specification is a component mounting system, and the moving device may be equipped with a mounting head that performs the work of mounting components on the substrate.

[0009] (Example) Hereinafter, the component mounting system (an example of the substrate-facing work system) of this example will be described with reference to the drawings. The component mounting system is a system that performs a predetermined work (specifically, the mounting work of component 2 (refer to FIG. 1)) on substrate 1 arranged in the XY plane. Further, the component mounting system is configured by arranging a plurality of mounters 10 (refer to FIG. 1) along the conveyance direction of substrate 1.

[0010] As shown in FIG. 1, the mounter 10 includes a plurality of component feeders 11, a substrate conveyance device 12, a parts camera 13, a head unit 21, an XY robot 30 (moving device), etc. Note that specific examples of component 2 include, for example, semiconductor packages such as QFP (Quad Flat Package) and BGA (Ball Grid Array), and chip components such as chip resistors and chip capacitors.

[0011] Each component feeder 11 houses a plurality of components 2. The component feeder 11 is detachably attached to the feeder holding portion 14 and supplies the component 2 to the head unit 21. The component feeder 11 of this example is a tape-type feeder that houses a plurality of components 2 on a tape.

[0012] The substrate conveyance device 12 is a device that performs the work of carrying substrate 1 into the work position A1 in the mounter 10, the work of positioning substrate 1 before component mounting at the work position A1, and the work of carrying out substrate 1 from the work position A1 after component mounting. The substrate conveyance device 12 of this example can be configured by, for example, a pair of belt conveyors, a support device (not shown) that is attached to the belt conveyor and supports substrate 1 from below, and a drive device (not shown) that drives the belt conveyor.

[0013] The component camera 13 is located between the component feeder 11 and the substrate transfer device 12, and is provided at a position below the movement path of the head unit 21. The component camera 13 images the component 2 adsorbed by the head unit 21 from below. The component camera 13 is configured using an imaging device such as a CMOS (Complementary Metal Oxide Semiconductor) or a CCD (Charge Coupled Device), for example.

[0014] The head unit 21 includes a mounting head 22 and a mark camera unit 40. The mounting head 22 is attached to the lower surface side of the head unit 21 and is for performing the operation of mounting the component 2 on the substrate 1. The mounting head 22 also includes a plurality of suction nozzles 23. Each suction nozzle 23 is moved up and down in the vertical direction (Z-axis direction) by an actuator (not shown) housed in the mounting head 22 and is configured to be able to adsorb the component 2.

[0015] To mount the component 2 on the substrate 1 by the head unit 21, first, the suction nozzle 23 is moved downward until the suction surface of the suction nozzle 23 contacts the component 2 housed in the component feeder 11. Next, the component 2 is adsorbed by the suction nozzle 23, and the suction nozzle 23 is moved upward. When the process of adsorbing the component 2 by the suction nozzle 23 is completed, the XY robot 30 is driven to position the head unit 21 with respect to the substrate 1. Then, the component 2 is mounted on the substrate 1 by lowering the suction nozzle 23 toward the substrate 1.

[0016] As shown in FIGS. 1 and 2, the mark camera unit 40 has a mark camera 41 and a mark camera light source 42. The mark camera 41 moves above the substrate 1 carried into the working position A1 by the substrate transfer device 12 and images marks (not shown) attached to the substrate 1. The mark camera 41 is configured using an imaging element such as a CMOS or a CCD, for example. Further, a control board (not shown) is provided inside the mark camera 41. The control board has a function of transmitting the image captured by the mark camera 41 to the substrate (common substrate 33) on the XY robot 30 side.

[0017] As shown in FIG. 2, the mark camera light source 42 has a function of illuminating the substrate 1. The mark camera light source 42 is composed of a side-emitting light source substrate 43 and an epi-illumination light source substrate 44. A plurality of side-emitting light sources 45 are mounted on the side-emitting light source substrate 43, and a plurality of epi-illumination light sources 46 are mounted on the epi-illumination light source substrate 44. Each side-emitting light source 45 and each epi-illumination light source 46 are configured using an element such as an LED (Light Emitting Diode), for example.

[0018] As shown in FIG. 1, the XY robot 30 moves the mark camera unit 40 between above the component feeder 11 and above the substrate 1 by moving in the XY plane together with the head unit 21 (and the mark camera unit 40). The XY robot 30 is housed inside the housing 15 and is disposed above the substrate 1. Further, the XY robot 30 includes an X-axis direction drive unit 31 and a Y-axis direction drive unit 32. The X-axis direction drive unit 31 is a device that moves the head unit 21 in the X-axis direction, which is the conveyance direction of the substrate 1. The mounting head 22 and the mark camera unit 40 are mounted on the X-axis direction drive unit 31. The Y-axis direction drive unit 32 is a device that moves the head unit 21 in the Y-axis direction intersecting the conveyance direction of the substrate 1.

[0019] As shown in FIG. 3, the head unit 21 has a relatively large control board, specifically, a common board 33, an X-axis extension board 34, and a light source control board 35. The common board 33 has a main CPU, a power supply, a clock, a reset IC, a ROM, etc. mounted thereon. The common board 33 has a function of converting the image transmitted from the mark camera 41 into a signal for sending it to the X-axis extension board 34 via the cable 36. The X-axis extension board 34 has a function of I / O control, specifically, of exchanging signals with the light source control board 35 and I / O devices (not shown) existing around it. The light source control board 35 has a function of controlling the mark camera light source 42. In addition, a fan 37 for cooling the main CPU of the common board 33 and the like is provided in the head unit 21.

[0020] As shown in FIG. 4, the mounter 10 is provided with a control device 50. The control device 50 is composed of a computer constituted by a CPU 51, a ROM 52, a RAM 53, a memory 54, an input / output interface 55, etc. Also, a board transfer device 12, a parts camera 13, an XY robot 30, and a mark camera unit 40 are connected to the control device 50. Note that the mark camera 41 is provided with a CPU 61, an EEPROM 62, etc. The EEPROM 62 has a function as a storage device in the mark camera unit 40, specifically, as a storage unit in the mark camera 41. Data and the like used when the CPU 61 controls the operation of the mark camera 41 are written in the EEPROM 62. Note that the EEPROM 62 is a non-volatile memory in the mark camera 41.

[0021] Furthermore, the component mounting system is equipped with a camera adjustment jig 70. The camera adjustment jig 70 is used when adjusting the light quantity in a state where the mark camera 41 and the mark camera light source 42 are assembled (i.e., in the state of the mark camera unit 40). Also, the camera adjustment jig 70 includes a power supply for the mark camera, a computer 71 (personal computer), a monitor, a jig body, a power box, and the like. The power supply for the mark camera is for supplying power to the mark camera 41. The computer 71 controls the mark camera 41. The monitor displays the image captured by the mark camera 41 and the adjustment items by the camera adjustment jig 70. The jig body is set in a state where the mark camera 41 and the mark camera light source 42 are assembled.

[0022] Next, a method for camera adjustment and light quantity adjustment will be described. First, the camera adjustment (single unit adjustment) performed by the mark camera 40 alone before mounting on the head unit 21 will be described. Specifically, first, the mark camera unit 40 having the mark camera 41 and the mark camera light source 42 is attached to the jig body of the camera adjustment jig 70. Then, the computer 71 of the camera adjustment jig 70 executes camera adjustment in step S10 of FIG. 5. For example, the computer 71 of the camera adjustment jig 70 adjusts the brightness of each side illumination light source 45 and each epi-illumination light source 46, specifically, so that the current value of the current for lighting each side illumination light source 45 and each epi-illumination light source 46 is within a predetermined range. Also, the computer 71 of the camera adjustment jig 70 adjusts so that the height of the focus of the mark camera 41, the inclination of the optical axis of the mark camera 41, the inclination of the mark camera 41 itself, and the resolution of the mark camera 41 are each within a predetermined range. Furthermore, the computer 71 of the camera adjustment jig 70 adjusts so that the magnitude of the distortion of the image captured by the mark camera 41 is within a predetermined range. Also, the operator visually confirms that all the light sources 45, 46 (LEDs) are lit.

[0023] In the subsequent step S20, after the completion of the camera adjustment, the computer 71 of the camera adjustment jig 70 stores the adjustment result (adjustment value) of the camera adjustment in the EEPROM 62 in the mark camera 41. In the subsequent step S30, after the completion of the camera adjustment, the computer 71 of the camera adjustment jig 70 sets "J" as a first flag (an example of a first adjustment completed certificate) indicating that the camera adjustment of the mark camera unit 40 alone has been completed (stores it at a predetermined address in the EEPROM 62). The mark camera unit 40 for which such camera adjustment (individual adjustment) has been performed is equipped on the head unit 21 by the operator and is connected to the common substrate 33, the X-axis extension substrate 34, and the light source control substrate 35 of the head unit 21.

[0024] In the subsequent step S40, before performing the light amount adjustment (combined adjustment) in combination with the mark camera unit 40 and the light source control substrate 35 in the XY robot 30, the control device 50 of the component mounting system (mounting machine 10) determines whether or not the first flag ("J") is present (i.e., stored) in the EEPROM 62. If it is determined that the first flag is not present, the control device 50 transfers to the process of step S10 and instructs the operator to perform the camera adjustment (individual adjustment) using the camera adjustment jig 70. On the other hand, if it is determined that the first flag is present, the control device 50 transfers to the process of step S50.

[0025] In step S50, the control device 50 executes a predetermined program to perform light quantity adjustment after mounting on the head unit 21. In the subsequent step S60, after the completion of the light quantity adjustment in step S50, the control device 50 sets "M" as a second flag (an example of a second adjusted certificate) indicating that the light quantity adjustment in combination with the mark camera unit 40 and the light source control board 35 has been completed (stores it at a predetermined address in the EEPROM 62). Note that "M" may be overwritten at the address where "J" is stored in the EEPROM 62. On the other hand, if "J" is not stored in the EEPROM 62, it is determined that some malfunction has occurred, and an adjustment instruction is displayed on a monitor (not shown) to prompt the operator. Then, the operator who sees the adjustment instruction will remove the mark camera unit 40 from the head unit 21 and perform adjustment work using the camera adjustment jig 70 and the like.

[0026] In the subsequent step S70, the control device 50 determines whether the second flag is stored in the EEPROM 62 at a predetermined timing after the mark camera unit 40 is mounted on the head unit 21. If it is determined that there is no second flag, the control device 50 transfers to the process of step S50 and instructs to perform light quantity adjustment. On the other hand, if it is determined that there is a second flag, the control device 50 determines that the light quantity adjustment has been completed and ends the process here.

[0027] As described above, in the component mounting system of this embodiment, the camera adjustment jig 70 is used for camera adjustment performed by the mark camera unit 40 alone before being mounted on the XY robot 30, and the adjustment result of the camera adjustment is written into the storage unit in the mark camera 41. At this time, after the completion of the camera adjustment, the camera adjustment jig 70 leaves a first flag indicating that the camera adjustment of the mark camera unit 40 alone has been completed in the mark camera unit 40. Further, after the mark camera unit 40 is mounted on the XY robot 30, the control device 50 performs light amount adjustment in combination with the mark camera unit 40 and the light source control board 35. Then, after the completion of the light amount adjustment in combination with the mark camera unit 40 and the light source control board 35, the control device 50 leaves a second flag indicating that the light amount adjustment in this combination has been completed in the mark camera unit 40. Therefore, when there is the first flag, it can be confirmed that the camera adjustment (single adjustment) has been completed, and when there is the second flag, it can be confirmed that the light amount adjustment (combined adjustment) has been completed. Thus, it is possible to prevent an image processing error caused by the inability to image the mark on the substrate 1 when the brightness (light amount) is not appropriately adjusted. Therefore, it is possible to prevent the component mounting system from stopping due to an image processing error in advance.

[0028] In the component mounting system of this embodiment, before performing light amount adjustment in combination with the mark camera unit 40 and the light source control board 35, the control device 50 checks the presence or absence of the first flag (see step S40 in FIG. 5). When there is no first flag, the control device 50 instructs the camera adjustment jig 70 to perform camera adjustment of the mark camera unit 40 alone. As a result, there is no omission in the camera adjustment (single adjustment), so that the light amount adjustment (combined adjustment) after mounting the mark camera unit 40 can be performed with confidence. Further, the control device 50 checks the presence or absence of the second flag at a predetermined timing after the mark camera unit 40 is mounted on the XY robot 30 (see step S70 in FIG. 5), and when there is no second flag, the control device 50 instructs to perform light amount adjustment (combined adjustment). Therefore, there is no omission in the light amount adjustment (combined adjustment). From the above, the camera adjustment and the light amount adjustment can be surely performed.

[0029] In the component mounting system of this embodiment, the EEPROM 62 not only functions as a storage unit in the mark camera 41 but also functions as a storage device in the mark camera unit 40. Therefore, it is not necessary to separately provide a storage unit for writing the adjustment result of camera adjustment and a storage device for writing the first flag and the second flag.

[0030] As described above, the embodiments have been described, but the specific embodiments are not limited to the above embodiments. In the above embodiment, the EEPROM 62 has both the function as a storage unit in the mark camera 41 and the function as a storage device in the mark camera unit 40, but the configuration is not limited to this. For example, in other embodiments, the storage device in the mark camera unit 40 may be different from the storage unit in the mark camera 41. For example, a memory chip mounted on the side illumination light source substrate 43 or the epi-illumination light source substrate 44 may be used as the storage device, or a memory provided in the mark camera light source 42 may be used as the storage device.

[0031] In the above embodiment, the electromagnetic first flag is used as the first inspected certificate, and the electromagnetic second flag is used as the second inspected certificate, but the configuration is not limited to this. For example, in other embodiments, physical members such as seals and pins may be used as the inspected certificates. When using a physical member as the inspected certificate, the presence or absence of the member can be detected by a detection means such as a conduction sensor.

[0032] In the above embodiment, the substrate processing system is a component mounting system having a mounter 10 that performs an operation of mounting the component 2 on the substrate 1, but the configuration is not limited to this. For example, in other embodiments, it may be a substrate processing system other than the component mounting system (for example, a system having a screen printer that performs an operation of printing solder on the substrate 1).

[0033] The specific examples of the present invention have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above. The technical elements described in this specification or the drawings exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Also, the technology illustrated in this specification or the drawings can achieve multiple purposes simultaneously, and achieving one of those purposes itself has technical utility.

Explanation of Reference Numerals

[0034] 1: Substrate 2: Component 22: Mounting head 30: XY robot as a moving device 35: Light source control substrate 40: Mark camera unit 41: Mark camera 42: Mark camera light source 50: Control device 62: Memory unit and EEPROM as a storage device 70: Camera adjustment jig

Claims

1. A system for performing a predetermined operation on a substrate disposed in the XY plane, comprising: a mark camera unit having a mark camera for imaging a mark attached to the substrate and a mark camera light source for illuminating the substrate; a moving device on which the mark camera unit is mounted and having a light source control board for controlling the mark camera light source, the moving device moving in the XY plane together with the mark camera unit; a camera adjustment jig used for camera adjustment performed by the mark camera unit alone before being mounted on the moving device, the camera adjustment jig writing an adjustment result of the camera adjustment into a storage unit in the mark camera; a control device for performing light amount adjustment in combination with the mark camera unit and the light source control board after being mounted on the moving device; after completion of the camera adjustment, the camera adjustment jig leaves a first adjustment completed certificate indicating that the camera adjustment of the mark camera unit alone has been completed in the mark camera unit; after completion of the light amount adjustment in combination with the mark camera unit and the light source control board, the control device leaves a second adjustment completed certificate indicating that the light amount adjustment in the combination has been completed in the mark camera unit; A substrate working system.

2. Before performing light amount adjustment in combination with the mark camera unit and the light source control board, the control device checks for the presence or absence of the first adjustment completed certificate, and if the first adjustment completed certificate is absent, instructs the camera adjustment jig to perform the camera adjustment of the mark camera unit alone. The substrate working system according to claim 1.

3. At a predetermined timing after the mark camera unit is mounted on the moving device, the control device checks for the presence or absence of the second adjustment completed certificate, and if the second adjustment completed certificate is absent, instructs to perform light amount adjustment in combination with the mark camera unit and the light source control board. The substrate working system according to claim 1.

4. The camera adjustment jig writes a first flag as the first adjustment completed certificate into a storage device in the mark camera unit, and the control device writes a second flag as the second adjustment completed certificate into the storage device in the mark camera unit. The substrate working system according to any one of claims 1 to 3.

5. The storage unit and the storage device are non-volatile memories in the mark camera. The substrate working system according to claim 4.

6. The substrate-facing operation system is a component mounting system, The substrate-facing operation system according to any one of claims 1 to 3, wherein the moving device is equipped with a mounting head that performs an operation of mounting components on the substrate.

Images