Substrate processing device, substrate processing system, and substrate processing method

Abstract

To provide a device, a system, and a method that can perform processing using a dummy substrate while reducing an impact on the transportation of product substrates.SOLUTION: A substrate processing device 1 includes an indexer block 2 and a processing block 3 laterally adjacent to the indexer block. The processing block includes processing block layers BL, BU. The indexer block includes a carrier holding portion 25 for holding a carrier C that accommodates a substrate W, and an indexer robot 26. Each processing block layer includes a plurality of processing units 11L-13U, 21L-23U, a substrate placement portion 6L, 6U that temporarily holds substrates to be handed over to and from the indexer robot, a dummy substrate accommodation portion 7L, 7U that accommodates a dummy substrate DW, and a main transport robot 8L, 8U for transporting substrates.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an apparatus, a system, and a method for processing a substrate. Substrates to be processed include, for example, semiconductor wafers, substrates for flat panel displays (FPDs) such as liquid crystal display devices and organic electroluminescence (EL) display devices, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, substrates for solar cells, and the like.

Background Art

[0002] In the manufacturing process of semiconductor devices, a substrate processing apparatus for processing a substrate such as a semiconductor wafer is used. An example of such a substrate processing apparatus is disclosed in Patent Document 1. This substrate processing apparatus includes a carrier holding unit that holds a carrier for accommodating a substrate, a plurality of processing units that process the substrate, a transfer unit that transfers the substrate between the carrier and the processing units, and a control unit. When the continuous non-use time of the processing unit reaches a predetermined time, the control device requests the host device to load a dummy carrier holding a dummy substrate. When the dummy carrier is loaded into the carrier holding unit, the transfer unit transfers the dummy substrate from the dummy carrier to the processing unit. The processing unit is cleaned using the dummy substrate.

[0003] The transfer unit includes an index robot and a main transfer robot, and a transfer unit is arranged between them. The index robot transfers the substrate between the carrier and the transfer unit. The main transfer robot transfers the substrate between the transfer unit and the processing unit.

[0004] When a dummy carrier is placed in the carrier holding part, the index robot takes out the dummy substrate from the dummy carrier and conveys it to the transfer unit. The dummy substrate is conveyed from the transfer unit to the processing unit by the main transfer robot. When the unit cleaning process using the dummy substrate is completed, the main transfer robot takes out the dummy substrate from the processing unit and conveys it to the transfer unit. The dummy substrate is conveyed from the transfer unit to the dummy carrier by the index robot. When all the dummy substrates are accommodated in the dummy carrier, the dummy carrier is carried out from the carrier holding part.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] In this way, the dummy substrate is introduced from the outside of the substrate processing apparatus, conveyed through the same path as the product substrate to the processing unit, and carried out from the processing unit and accommodated in the dummy carrier. Therefore, both the index robot and the main transfer robot are used for the conveyance of the dummy substrate, and the dummy substrate is conveyed through the transfer unit. Thereby, it interferes with the conveyance of the product substrate, deteriorates the conveyance efficiency of the product substrate, and as a result, the improvement of productivity is hindered.

[0007]

[0008] ​In addition, until the dummy carrier is carried into the carrier holding unit, the dummy substrate is then transported from there to the processing unit, and after the processing in the processing unit is completed and the dummy substrate is accommodated in the carrier, the dummy carrier occupies the carrier holding unit. Therefore, since the occupation of the carrier holding unit by the dummy carrier continues, there is a risk that a waiting time will occur for the loading of the product substrate. Therefore, from this perspective as well, the improvement of productivity is hindered.

[0009] Therefore, one embodiment of the present invention provides a substrate processing apparatus, a substrate processing system, and a substrate processing method capable of performing processing using a dummy substrate in a processing unit while reducing the influence on the conveyance of the substrate for products.

Means for Solving the Problems

[0010] One embodiment of the present invention includes a carrier holding unit that holds a carrier accommodating a substrate or a dummy substrate, a processing unit that processes the substrate and executes processing using the dummy substrate, a dummy substrate accommodating unit that accommodates the dummy substrate, a substrate placement unit on which the substrate is placed, a first transfer unit that can access the processing unit, the dummy substrate accommodating unit, and the substrate placement unit and transfers the substrate between the processing unit and the substrate placement unit and transfers the dummy substrate between the processing unit, the dummy substrate accommodating unit, and the substrate placement unit, and a second transfer unit that can access the carrier holding unit and the substrate placement unit and transfers the substrate between the carrier holding unit and the substrate placement unit.

[0011] In one embodiment, the substrate processing apparatus includes a storage unit that stores usage history information of the dummy substrate accommodated in the dummy substrate accommodating unit, a usage expiration notification unit that notifies usage expiration information of the dummy substrate accommodated in the dummy substrate accommodating unit based on the usage history information stored in the storage unit, and a transfer control unit that controls the transfer of the substrate or the dummy substrate by the first transfer unit and the second transfer unit.

[0012] In one embodiment, the storage unit stores, as the usage history information, at least one piece of information among the number of times of use, the usage time, and the wear state of the dummy substrate.

[0013] In one embodiment, the storage unit stores the usage history information and usage deadline threshold information corresponding to the usage history information.

[0014] In one embodiment, the dummy substrate storage unit stores a plurality of dummy substrates, and the storage unit stores the usage history information and the usage deadline threshold information for each dummy substrate.

[0015] In one embodiment, a plurality of the processing units are provided, a correspondence relationship between the plurality of dummy substrates and the plurality of processing units is predetermined, and the storage unit stores information representing the correspondence relationship.

[0016] In one embodiment, the usage deadline notification unit compares the usage history information with the usage deadline threshold information and notifies usage deadline information of the dummy substrate based on the result of the comparison.

[0017] In one embodiment, the substrate processing apparatus further includes a notification unit that notifies a user of usage deadline information of the dummy substrate stored in the storage unit based on the usage history information stored in the storage unit.

[0018] One embodiment of the present invention provides a substrate processing system including a substrate processing apparatus having the above-described features, a carrier transfer unit that carries a recovery dummy carrier for storing a used dummy substrate into the carrier holding unit, and a host computer that receives the notification of the usage deadline information from the usage deadline notification unit, plans the transfer of the recovery dummy carrier to the carrier holding unit by the carrier transfer unit, and based on the plan, causes the carrier transfer unit to carry the recovery dummy carrier into the carrier holding unit and commands the substrate processing apparatus to perform the recovery transfer of the dummy substrate.

[0019] In one embodiment, the host computer obtains information regarding the recovery of the dummy substrate from the substrate processing apparatus to the recovery dummy carrier for the dummy substrate, plans the unloading of the recovery dummy carrier containing the used dummy substrate from the carrier holding portion by the carrier transfer unit, and based on the plan, causes the carrier transfer unit to unload the recovery dummy carrier from the carrier holding portion.

[0020] In one embodiment, the substrate processing system further includes a schedule creation unit that creates a transfer schedule for the substrate or the dummy substrate by the first transfer unit and the second transfer unit, and creates a transfer schedule for transferring the dummy substrate notified of the expiration information from the dummy substrate storage unit to the carrier holding portion for recovery. The schedule creation unit further creates a transfer schedule for transferring the available dummy substrate from the carrier holding portion to the dummy substrate storage unit.

[0021] In one embodiment, the carrier transfer unit operates to carry a supply dummy carrier containing an available dummy substrate into the carrier holding portion. The host computer plans the supply dummy carrier transfer for carrying the supply dummy carrier into the carrier holding portion by the carrier transfer unit, and based on the plan, causes the carrier transfer unit to carry the supply dummy carrier into the carrier holding portion and commands the substrate processing apparatus to supply and transfer the available dummy substrate.

[0022] In one embodiment, the host computer obtains information regarding the unloading of the dummy substrate from the supply dummy carrier from the substrate processing apparatus, plans the unloading of the supply dummy carrier from the carrier holding portion by the carrier transfer unit, and based on the plan, causes the carrier transfer unit to unload the supply dummy carrier from the carrier holding portion.

[0023] In one embodiment, the carrier transport unit transports a recovery dummy carrier or a supply dummy carrier between the carrier holding unit and a dummy carrier storage different from the carrier holding unit.

[0024] One embodiment of the present invention provides a substrate processing method including: a step of transporting a substrate by a first transport unit between a processing unit and a substrate placement unit; a step of processing the substrate transported by the first transport unit in the processing unit; a step of transporting a dummy substrate by the first transport unit between the processing unit and a dummy substrate storage unit; a step of performing dummy processing using the dummy substrate transported by the first transport unit in the processing unit; and a step of transporting a substrate by a second transport unit between a carrier held by a carrier holding unit and the substrate placement unit.

[0025] In one embodiment, the substrate processing method includes: a step of recording usage history information of a dummy substrate stored in the dummy substrate storage unit; a step of determining an expiration date of the dummy substrate based on the usage history information; and a recovery transport step of transporting and recovering a dummy substrate that has reached the expiration date from the dummy substrate storage unit to the carrier holding unit based on the determination of the expiration date.

[0026] In one embodiment, the substrate processing method further includes: a supply dummy carrier loading step of loading a supply dummy substrate containing usable dummy substrates into the carrier holding unit by a carrier transport unit; and a supply transport step of transporting usable dummy substrates from the carrier holding unit to the dummy substrate storage unit.

[0027] In one embodiment, the substrate processing method further includes a step of unloading the supply dummy carrier from the carrier holding unit by the carrier transport unit at a timing that coincides with the completion of unloading of the dummy substrate from the supply dummy carrier in the supply transport step.

[0028] In one embodiment, the substrate processing method further includes a step of loading a recovery dummy carrier for accommodating a used dummy substrate into the carrier holding unit by a carrier transfer unit, a recovery transfer step of transferring the used dummy substrate from the dummy substrate accommodating unit to the carrier holding unit and loading it into the recovery dummy carrier, and a step of unloading the recovery dummy carrier from the carrier holding unit by the carrier transfer unit at a timing that coincides with the completion of loading the dummy substrate into the recovery dummy carrier in the recovery transfer step.

[0029] In one embodiment, a plurality of the processing units are provided, and the dummy substrate accommodating unit accommodates a plurality of dummy substrates whose correspondence with the plurality of processing units is predetermined.

[0030] One embodiment of the present invention includes a carrier holding unit that holds a carrier accommodating a substrate or a dummy substrate, a processing unit that processes the substrate and executes a process using the dummy substrate, a dummy substrate accommodating unit that accommodates the dummy substrate, a substrate mounting unit on which the substrate is mounted, a first transfer unit that is accessible to the processing unit, the dummy substrate accommodating unit, and the substrate mounting unit, transfers the substrate between the processing unit and the substrate mounting unit, and transfers the dummy substrate between the processing unit, the dummy substrate accommodating unit, and the substrate mounting unit, a second transfer unit that is accessible to the carrier holding unit and the substrate mounting unit and transfers the substrate between the carrier holding unit and the substrate mounting unit, a storage unit that stores usage history information of the dummy substrate accommodated in the dummy substrate accommodating unit, an expiration notification unit that notifies expiration information of the dummy substrate accommodated in the dummy substrate accommodating unit based on the usage history information stored in the storage unit, and a schedule creation unit that creates a transfer schedule of the substrate or the dummy substrate by the first transfer unit and the second transfer unit, the schedule creation unit creating a transfer schedule for recovering the dummy substrate whose expiration information has been notified from the dummy substrate accommodating unit to the carrier holding unit, and a transfer control unit that controls the transfer of the substrate or the dummy substrate by the first transfer unit and the second transfer unit according to the transfer schedule created by the schedule creation unit. A substrate processing apparatus is provided.

[0031] According to this configuration, since the substrate processing apparatus is provided with the dummy substrate accommodating unit, when it becomes necessary to use the dummy substrate in the processing unit, the dummy substrate can be transferred between the dummy substrate accommodating unit and the processing unit without the involvement of the second transfer unit. Therefore, the transfer load of the second transfer unit can be reduced, and the process using the dummy substrate can be performed while reducing the influence on the transfer of the product substrate. Further, unlike the case of Patent Document 1, the carrier holding unit is not occupied by the dummy carrier accommodating the dummy substrate for a long time. Thereby, it is possible to suppress the occurrence of waiting time for the loading of the carrier accommodating the product substrate, which can contribute to the improvement of productivity.

[0032] And in this embodiment, the usage history information of the dummy substrate stored in the dummy substrate storage unit is stored in the storage unit, and based on this, the expiration information of the dummy substrate is notified. Further, a transfer schedule (recovery transfer schedule) for transferring and recovering the dummy substrate for which the expiration information has been notified from the dummy substrate storage unit to the carrier holding unit is created. By controlling the first transfer unit and the second transfer unit based on this transfer schedule, the dummy substrate for which the expiration information has been notified is transferred from the dummy substrate storage unit to the carrier holding unit and recovered. In this way, when the dummy substrate reaches its expiration date, the dummy substrate can be automatically discharged.

[0033] The notification of the expiration information may be to notify that the dummy substrate can no longer be used, or may be to notify that the dummy substrate will soon become unusable. The notification of the expiration information may take the form of a dummy substrate replacement request that requests the replacement of the dummy substrate. The dummy substrate replacement request may include a dummy substrate recovery request that requests the recovery of the used dummy substrate. The dummy substrate recovery request may be a dummy substrate recovery reservation that designates the recovery time of the used dummy substrate. Also, the dummy substrate replacement request may include a dummy substrate supply request that requests the supply of an unused dummy substrate. The dummy substrate supply request may be a dummy substrate supply reservation that designates the supply time of the unused dummy substrate.

[0034] In one embodiment of the present invention, the storage unit stores at least one of the number of uses, usage time, and wear state of the dummy substrate as the usage history information.

[0035] In one embodiment of the present invention, the storage unit stores the usage history information and usage expiration threshold information corresponding to the usage history information.

[0036] In one embodiment of the present invention, the dummy substrate storage unit stores a plurality of dummy substrates, and the storage unit stores the usage history information and the expiration threshold information for each dummy substrate. With this configuration, it is possible to manage the expiration date for each of the plurality of dummy substrates.

[0037] In one embodiment of the present invention, a plurality of the processing units are provided, a correspondence relationship between the plurality of dummy substrates and the plurality of processing units is predetermined, and the storage unit stores information representing the correspondence relationship.

[0038] In one specific example, a plurality of dummy substrates and a plurality of processing units are associated one-to-one. Thereby, since the dummy substrate is not shared by the plurality of processing units, it is possible to avoid the plurality of processing units from influencing each other via the dummy substrate. For example, even if the processing environment in one processing unit is contaminated, it is possible to avoid the contamination from being introduced into other processing units via the dummy substrate.

[0039] In one embodiment of the present invention, the expiration notification unit compares the usage history information and the expiration threshold information, and notifies the expiration information of the dummy substrate based on the result of the comparison. With this configuration, by comparing the usage history information and the expiration threshold information, it is possible to appropriately notify the expiration information of the dummy substrate.

[0040] In one embodiment of the present invention, the substrate processing apparatus further includes a notification unit that notifies the user of the expiration information of the dummy substrate stored in the dummy substrate storage unit based on the usage history information stored in the storage unit. With this configuration, it is possible to appropriately notify the user of the expiration information of the dummy substrate and arouse the user's attention.

[0041] One embodiment of the present invention provides a substrate processing system including a substrate processing apparatus having the above-described features, a carrier transfer unit configured to carry a recovery dummy carrier for accommodating used dummy substrates into the carrier holding unit, and a host computer configured to receive a notification of expiration information from the expiration notification unit, plan the transfer of the recovery dummy carrier to the carrier holding unit by the carrier transfer unit, based on the plan, cause the carrier transfer unit to carry the recovery dummy carrier into the carrier holding unit, and issue a command to the substrate processing apparatus to recover and transfer the dummy substrate.

[0042] According to this configuration, expiration information is notified from the substrate processing apparatus to the host computer. Then, the host computer plans the operation of the carrier transfer unit and controls the carrier transfer unit according to the plan, thereby carrying a recovery dummy carrier for recovering used dummy substrates into the carrier holding unit of the substrate processing apparatus. Therefore, based on the notification of the expiration information from the substrate processing apparatus to the host computer, the recovery dummy carrier can be supplied to the substrate processing apparatus at an appropriate time. That is, since the supply of the recovery dummy carrier is automatically and timely performed, the downtime of the substrate processing apparatus can be shortened, and its productivity can be improved.

[0043] In addition, since the host computer issues a command to the substrate processing apparatus to recover and transfer the dummy substrate, the substrate processing apparatus can plan and execute the recovery and transfer of the dummy substrate in a timely manner, that is, the transfer of the used dummy substrate from the dummy substrate storage unit to the recovery dummy carrier. That is, the timing of the loading of the recovery dummy carrier and the start of the recovery and transfer of the dummy substrate in the substrate processing apparatus can be coordinated. As a result, the time during which the recovery dummy carrier occupies the carrier holding unit can be shortened, so that the carrier holding unit can be quickly vacated for the carrier for accommodating product substrates. Thereby, the unprocessed product substrates can be efficiently loaded into the substrate processing apparatus, and the processed product substrates can be efficiently recovered, thus improving productivity.

[0044] In this specification, the "alignment" of timing does not necessarily mean a temporal coincidence, but rather means that corresponding events occur within a predetermined time allowed from the perspective of productivity.

[0045] In one embodiment of the present invention, the host computer obtains information regarding the recovery of the dummy substrate from the substrate processing apparatus to the recovery dummy carrier, plans the unloading of the recovery dummy carrier containing the used dummy substrate from the carrier holding portion by the carrier transfer unit, and based on the plan, causes the carrier transfer unit to unload the recovery dummy carrier from the carrier holding portion.

[0046] According to this configuration, information regarding the recovery of the dummy substrate to the recovery dummy carrier is provided from the substrate processing apparatus to the host computer, and in response, the host computer plans the unloading of the recovery dummy carrier by the carrier transfer unit and controls the carrier transfer unit according to the plan. Therefore, the recovery dummy carrier is automatically and timely unloaded from the carrier holding portion of the substrate processing apparatus. Specifically, the recovery dummy carrier can be unloaded from the carrier holding portion at a timing that aligns with the completion of the loading of the dummy substrate into the recovery dummy carrier. Thereby, the time during which the recovery dummy carrier occupies the carrier holding portion can be shortened, and the carrier holding portion can be promptly vacated for the carrier that accommodates the product substrate. Thereby, the unprocessed product substrate can be efficiently loaded into the substrate processing apparatus, and the processed product substrate can be efficiently recovered, thus improving productivity.

[0047] In one embodiment of the present invention, the schedule creation unit further creates a transfer schedule for transferring an available dummy substrate from the carrier holding unit to the dummy substrate storage unit. The carrier transfer unit operates to carry a supply dummy carrier containing an available dummy substrate into the carrier holding unit. The host computer plans the transfer of the supply dummy carrier to the carrier holding unit by the carrier transfer unit, and based on this plan, causes the carrier transfer unit to carry the supply dummy carrier into the carrier holding unit and commands the substrate processing apparatus to supply and transfer an available dummy substrate.

[0048] According to this configuration, the host computer creates a plan to transfer a supply dummy carrier containing an available dummy substrate to the carrier holding unit of the substrate processing apparatus by the carrier transfer unit, and controls the operation of the carrier transfer unit according to this plan. As a result, the supply dummy carrier is automatically and timely supplied to the substrate processing apparatus. In the substrate processing apparatus, a transfer schedule (supply transfer schedule) for transferring the dummy substrate from the supply dummy carrier to the dummy substrate storage unit is created, and the dummy substrate is transferred according to the transfer schedule. Specifically, an available dummy substrate is transferred from the supply dummy carrier to the dummy substrate storage unit by the first and / or second transfer unit. In this way, since the dummy substrate can be automatically and timely supplied to the substrate processing apparatus, for example, the downtime of the substrate processing apparatus due to a shortage of available dummy substrates can be reduced. Thereby, it is possible to contribute to an improvement in productivity.

[0049] In addition, since the host computer commands the substrate processing apparatus to supply and transfer a dummy substrate, the substrate processing apparatus can plan and execute the supply and transfer of the dummy substrate in a timely manner, that is, the transfer of the dummy substrate from the dummy carrier for supply of available dummy substrates to the dummy substrate storage section. Therefore, it is possible to start the supply and transfer of the dummy substrate in the substrate processing apparatus by matching the loading of the dummy carrier for supply with the timing. As a result, the time during which the dummy carrier for supply occupies the carrier holding section can be shortened, so that the carrier holding section can be promptly vacated for the carrier that houses the product substrate. Thereby, the unprocessed product substrate can be efficiently input into the substrate processing apparatus, and the processed product substrate can be efficiently recovered, so that the productivity can be improved.

[0050] In one embodiment of the present invention, the host computer obtains information regarding the unloading of the dummy substrate from the dummy carrier for supply from the substrate processing apparatus, plans the unloading of the dummy carrier for supply from the carrier holding section by the carrier transfer unit, and based on the plan, causes the carrier transfer unit to unload the dummy carrier for supply from the carrier holding section.

[0051] According to this configuration, information regarding the unloading of the dummy substrate from the dummy carrier for supply is given from the substrate processing apparatus to the host computer, and based on this, the host computer plans the unloading of the dummy carrier for supply and operates the carrier transfer unit according to the plan. Thereby, the dummy carrier for supply can be unloaded from the carrier holding section at a timing that matches the completion of the unloading of the dummy substrate from the dummy carrier for supply. In this way, the dummy carrier for supply can be automatically and timely unloaded from the carrier holding section of the substrate processing apparatus. Therefore, the time during which the dummy carrier for supplying the dummy substrate occupies the carrier holding section can be shortened, and the carrier holding section can be promptly vacated for holding the carrier that houses the product substrate. Thereby, the unprocessed product substrate can be efficiently input into the substrate processing apparatus, and the processed product substrate can be efficiently recovered, so that the productivity can be improved.

[0052] In one embodiment of the present invention, the carrier transfer unit transfers a dummy carrier for recovery or a dummy carrier for supply between the carrier holding unit and a dummy carrier storage place different from the carrier holding unit.

[0053] One embodiment of the present invention provides a substrate processing method including: a step of transferring a substrate by a first transfer unit between a processing unit and a substrate placement unit; a step of processing the substrate transferred by the first transfer unit in the processing unit; a step of transferring a dummy substrate by the first transfer unit between the processing unit and a dummy substrate storage unit; a step of performing dummy processing using the dummy substrate transferred by the first transfer unit in the processing unit; a step of transferring a substrate by a second transfer unit between a carrier held by a carrier holding unit and the substrate placement unit; a step of recording usage history information of the dummy substrate stored in the dummy substrate storage unit; a step of determining the expiration date of the dummy substrate based on the usage history information; a recovery transfer step of transferring a dummy substrate that has reached its expiration date from the dummy substrate storage unit to the carrier holding unit for recovery based on the determination of the expiration date; and a step of loading a dummy carrier for recovery for accommodating used dummy substrates into the carrier holding unit by a carrier transfer unit based on the determination of the expiration date.

[0054]

[0055] In one embodiment of the present invention, the substrate processing method further includes a supply dummy carrier loading step of loading a supply dummy substrate containing a usable dummy substrate into the carrier holding unit by the carrier transfer unit based on the determination of the expiration date, and a supply transfer step of transferring a usable dummy substrate from the carrier holding unit to the dummy substrate storage unit based on the determination of the expiration date.

[0056] In one embodiment of the present invention, the substrate processing method further includes a step of unloading the supply dummy carrier from the carrier holding unit by the carrier transfer unit at a timing that coincides with the completion of unloading the dummy substrate from the supply dummy carrier in the supply transfer step.

[0057] In one embodiment of the present invention, a plurality of the processing units are provided, and the dummy substrate storage unit stores a plurality of dummy substrates whose correspondence with the plurality of processing units is predetermined.

Brief Description of the Drawings

[0058]

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[0059] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0060] FIG. 1 is a schematic plan view showing the internal configuration of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic longitudinal sectional view taken along line II-II of FIG. 1. FIG. 3 is a schematic cross-sectional view taken along line III-III of FIG. 1. FIG. 4 is a schematic elevation view showing a part of the internal configuration as viewed from the IV direction of FIG. 1.

[0061] The substrate processing apparatus 1 includes an index block 2 and a processing block 3 adjacent to the index block 2 in the lateral direction (first horizontal direction X).

[0062] The index block 2 includes a plurality (four in this embodiment) of carrier holding portions 25 (load ports) and an index robot 26. Hereinafter, for convenience, the side of the carrier holding portion 25 with respect to the first horizontal direction X may be defined as the front, and the opposite side may be defined as the rear for explanation.

[0063] The plurality of carrier holders 25 are arranged along a second horizontal direction Y orthogonal to the first horizontal direction X. Each carrier holder 25 is configured to receive and hold a carrier C automatically conveyed by a carrier conveyance mechanism 300 (an example of a carrier conveyance unit) provided in the factory. Each carrier holder 25 is configured to hold one carrier C. The carrier C is a substrate container that houses a substrate W (product substrate) to be processed. An example of the carrier C is a FOUP (Front Opening Unified Pod). The carrier C is configured to hold a plurality of (for example, 25) substrates W in a stacked state. More specifically, the carrier C is configured to hold a plurality of substrates W in a stacked state along the vertical direction Z in a horizontal posture when held by the carrier holder 25. The carrier holder 25 is an example of a container holder that holds the carrier C which is a substrate container. The substrate W is, for example, a semiconductor wafer.

[0064] The indexer robot 26 is an example of a second conveyance unit. The indexer robot 26 is configured to access the carriers C respectively held by the plurality of carrier holders 25, carry in / out the substrate W, and convey the substrate W between the carrier holder 25 and the processing block 3. In this embodiment, the indexer robot 26 is an articulated arm robot having an articulated arm 27. Specifically, the indexer robot 26 includes an articulated arm 27 connecting a plurality of arms 28, one or more hands 29 coupled to the tip of the articulated arm 27, and a base portion 30 that supports the articulated arm 27 and moves up and down. The plurality of arms 28 and hands 29 constituting the articulated arm 27 are swingable about vertical swing axes set at their respective base ends, and although not shown, individual actuators (typically electric motors) for swinging each arm 28 and hand 29 are provided.

[0065] Processing block 3 includes a plurality of processing block layers BL and BU stacked in the vertical direction Z. In this embodiment, processing block 3 includes a first-layer (lower layer) processing block layer (hereinafter referred to as "first processing block layer BL") and a second-layer (upper layer) processing block layer stacked above it (hereinafter referred to as "second processing block layer BU"). Hereinafter, when distinguishing the components of the first processing block layer BL from those of the second processing block layer BU, reference signs with the English letter "L" at the end are used for the components of the first processing block layer BL, and reference signs with the English letter "U" at the end are used for the components of the second processing block layer BU. The same applies to the reference signs in the accompanying drawings.

[0066] The internal configurations of the first processing block layer BL and the second processing block layer BU in plan view are substantially the same. Therefore, it should be noted that in FIG. 1, by replacing the English letter "U" at the end of the reference sign with the English letter "L", the configuration (arrangement in plan view) of the first processing block layer BL is represented.

[0067] The first processing block layer BL includes a plurality (12 in this embodiment) of processing units 11L-13L, 21L-23L, 31L-33L, 41L-43L (hereinafter, when collectively referring to the processing units of the first processing block layer BL, they are called "processing units 11L-43L"). These constitute the first processing unit group. The first processing block layer BL further includes a substrate placement unit 6L, a dummy substrate storage unit 7L, and a main transfer robot 8L. The plurality of processing units 11L-43L perform processing on the substrate W. In this embodiment, each of the processing units 11L-43L is a single-wafer processing unit that processes one substrate W at a time. The substrate placement unit 6L is a unit for temporarily holding the substrate W that is transferred between the indexer robot 26 and the first processing block layer BL. The dummy substrate storage unit 7L is a unit for holding the dummy substrate DW that can be used in the processing units 11L-43L inside the substrate processing apparatus 1, and provides a standby location for the dummy substrate DW. The main transfer robot 8L is configured to be able to access the substrate placement unit 6L, the processing units 11L-43L, and the dummy substrate storage unit 7L. The main transfer robot 8L is an example of a first transfer unit that transfers the substrate W between the substrate placement unit 6L and the processing units 11L-43L, and transfers the dummy substrate DW between the dummy substrate storage unit 7L and the processing units 11L-43L.

[0068] The dummy substrate DW is a substrate having the same shape (e.g., circular) and size as the substrate W. Unlike the product substrate W supplied from the carrier C, the dummy substrate DW is not used in the actual manufacture of products. The dummy substrate DW is introduced into the processing units 11L-43L and used to perform pre-processing (preparation processing) for adjusting the environment inside the processing units 11L-43L, unit cleaning processing for cleaning the inside of the processing units 11L-43L, etc. The processing using the dummy substrate DW in this way is hereinafter referred to as "dummy processing". The aforementioned pre-processing and unit cleaning processing are maintenance processing for the maintenance of the processing units 11L-43L, and the dummy processing includes such maintenance processing.

[0069] The plurality of processing units 11L - 43L are arranged on both sides of the transfer space 52L along the transfer path 51L along which the substrate W is transferred by the main transfer robot 8L, facing the transfer space 52L. The transfer space 52L has a constant width in the second horizontal direction Y in plan view and extends linearly in a direction away from the index block 2 along the first horizontal direction X. The transfer space 52L has a height substantially equivalent to the height of the first processing block layer BL in the vertical direction Z. In plan view, on one side of the transfer space 52L, in order from the side closer to the index block 2, there are arranged a first liquid supply unit 91, a first processing unit stack S1L, a first exhaust unit 101, a second liquid supply unit 92, a second processing unit stack S2L, and a second exhaust unit 102 along the transfer path 51L. On the other side of the transfer space 52L, in order from the side closer to the index block 2, there are arranged a third exhaust unit 103, a third processing unit stack S3L, a third liquid supply unit 93, a fourth exhaust unit 104, a fourth processing unit stack S4L, and a fourth liquid supply unit 94 along the transfer path 51L. They are arranged so as to partition the substantially rectangular parallelepiped-shaped transfer space 52L.

[0070] The first to fourth processing unit stacks S1L - S4L each include a plurality of stages (three stages in this embodiment) of processing units 11L - 13L, 21L - 23L, 31L - 33L, 41L - 43L stacked in the vertical direction Z. The third processing unit stack S3L faces the first processing unit stack S1L with the transfer space 52L therebetween. The fourth processing unit stack S4L faces the second processing unit stack S2L with the transfer space 52L therebetween. Accordingly, the plurality of processing units 31L - 33L constituting the third processing unit stack S3L face the plurality of stages of processing units 11L - 13L constituting the first processing unit stack S1L with the transfer space 52L therebetween. Similarly, the plurality of stages of processing units 41L - 43L constituting the fourth processing unit stack S4L face the plurality of stages of processing units 21L - 23L constituting the second processing unit stack S2L with the transfer space 52L therebetween. In this embodiment, the first processing block layer BL includes twelve processing units 11L - 13L, 21L - 23L, 31L - 33L, 41L - 43L, and these are divided into three each and arranged in four processing unit stacks S1L - S4L.

[0071] The transfer space 52L is partitioned from above by an intermediate partition wall 16 arranged at a position aligned with the upper surfaces of the uppermost processing units 13L, 23L, 33L, 43L of each processing unit stack S1L - S4L, and is partitioned from below by a lower partition wall 15 arranged at a position aligned with the lower surfaces of the lowermost processing units 11L, 21L, 31L, 41L. All the processing units 11L - 43L have substrate loading / unloading ports 37 that open at positions facing the transfer space 52L. The main transfer robot 8L transfers the substrate W and the dummy substrate DW through the transfer space 52L, and loads / unloads the substrate W and the dummy substrate DW to / from each processing unit 11L - 43L via the substrate loading / unloading ports 37.

[0072] The substrate placement unit 6L is disposed between the index robot 26 and the main transfer robot 8L. More specifically, the substrate placement unit 6L is disposed at the end on the index robot 26 side within the transfer space 52L in a plan view. In this embodiment, the substrate placement unit 6L is located between the first liquid supply unit 91 and the third exhaust unit 103. The substrate placement unit 6L is disposed at a height between the intermediate partition wall 16 and the lower partition wall 15 with respect to the vertical direction Z. In this embodiment, the substrate placement unit 6L is disposed near the intermediate height within the height range from the intermediate partition wall 16 to the upper partition wall 17. The vertical position of the substrate placement unit 6L needs to be within a height range accessible by the index robot 26 and within a height range accessible by the main transfer robot 8L.

[0073] The substrate placement unit 6L includes an unprocessed substrate placement portion 61 on which the unprocessed substrate W is placed and a processed substrate placement portion 62 on which the processed substrate W is placed. The unprocessed substrate placement portion 61 and the processed substrate placement portion 62 are stacked in the vertical direction Z. It is preferable that the unprocessed substrate placement portion 61 is disposed above the processed substrate placement portion 62.

[0074] As shown in an enlarged configuration example in FIG. 5, the unprocessed substrate placement portion 61 and the processed substrate placement portion 62 include boxes 63, 64 that are open on both the index robot 26 side and the main transfer robot 8L side along the first horizontal direction X, and substrate holding shelves 65, 66 disposed inside the boxes 63, 64. The substrate holding shelves 65, 66 have a plurality (for example, 10) of substrate support members 67, 68 arranged in the vertical direction Z. Each substrate support member 67, 68 is configured to support the peripheral portion of the lower surface of one substrate W from below and hold the substrate W in a horizontal posture. Thereby, the unprocessed substrate placement portion 61 and the processed substrate placement portion 62 can each hold a plurality (for example, 10) of substrates W in a stacked state with a space therebetween in the vertical direction Z in a horizontal posture on their substrate holding shelves 65, 66.

[0075] As shown in FIG. 2, a window 4L corresponding to the substrate placement section 6L is formed so as to penetrate the rear partition wall 2a of the index block 2 and the front partition wall 3a of the processing block 3, that is, their adjacent partition walls. The index robot 26 can access the substrate placement section 6L through this window 4L and carry in / out the substrate W with respect to the substrate placement section 6L.

[0076] The dummy substrate storage section 7L is provided at a height different from that of the substrate placement section 6L, and in this embodiment, it is arranged below the substrate placement section 6L within the transport space 52L. The dummy substrate storage section 7L is provided so as to overlap the substrate placement section 6L in plan view. More specifically, when the substrate W is held on the substrate placement section 6L and the dummy substrate DW is held on the dummy substrate storage section 7L, the dummy substrate storage section 7L is arranged so that the substrate W and the dummy substrate DW overlap in plan view. The overlap between the substrate W and the dummy substrate DW in plan view may be a partial overlap or an overall overlap, that is, the dummy substrate DW may overlap almost entirely with the substrate W.

[0077] The dummy substrate storage section 7L is arranged between the lower partition wall 15 and the intermediate partition wall 16 and within the height range accessible by the main transfer robot 8L. In front of the dummy substrate storage section 7L, that is, on the index block 2 side, the rear partition wall 2a of the index block 2 and the front partition wall 3a of the processing block 3, that is, their adjacent partition walls are located. Windows corresponding to the dummy substrate storage section 7L are not provided in these partition walls. Therefore, in this embodiment, the index robot 26 cannot access the dummy substrate storage section 7L.

[0078] As shown in the enlarged configuration example in FIG. 6, the dummy substrate storage unit 7L includes a dummy substrate holding shelf 71. The configuration of the dummy substrate holding shelf 71 may be substantially the same as the configuration of the substrate holding shelves 65 and 66 of the substrate placement unit 6L. However, the number of dummy substrates DW that the dummy substrate holding shelf 71 can hold does not have to be equal to the number of substrates that the substrate holding shelves 65 and 66 can hold. Specifically, the dummy substrate holding shelf 71 has a plurality (for example, 12) of dummy substrate support members 72 arranged in the vertical direction. Each dummy substrate support member 72 is configured to support the lower peripheral edge of one dummy substrate DW from below and hold the dummy substrate DW in a horizontal posture. The dummy substrate storage unit 7L can hold a plurality (for example, 12) of dummy substrates DW in a stacked state with a space in the vertical direction Z in a horizontal posture on the dummy substrate holding shelf 71. That is, the dummy substrate storage unit 7L has a plurality of stages (the same number as the number of processing units provided in the first processing block layer BL in this embodiment) of slots (hereinafter referred to as "dummy substrate slots DL1-DL12") stacked in the vertical direction so as to accommodate each one dummy substrate DW in a horizontal posture. A dummy substrate sensor (not shown) for detecting the presence or absence of the dummy substrate DW in each of the dummy substrate slots DL1-DL12 may be provided. In this embodiment, unlike the substrate placement unit 6L, the dummy substrate storage unit 7L does not include a box surrounding the stored dummy substrate DW. Of course, such a box may be provided.

[0079] As shown in FIG. 2, the main transfer robot 8L is disposed within the transfer space 52L. The main transfer robot 8L includes a hand 81 that holds a single substrate in a horizontal posture, and a hand drive mechanism 82 that drives the hand 81. A plurality (for example, two) of hands 81 may be provided. The hand drive mechanism 82 can move the hand 81 in the horizontal directions X and Y and the vertical direction Z, and can turn the hand 81 around a vertical axis of rotation. The hand drive mechanism 82 includes two columns 83, a vertical movement section 84, a horizontal movement section 85, a rotation section 86, and a forward and backward movement section 87. The hand 81 is coupled to the forward and backward movement section 87. When a plurality of hands 81 are provided, it is preferable that a plurality of corresponding forward and backward movement sections 87 are provided.

[0080] The two columns 83 are arranged at intervals along the first horizontal direction X, and are respectively fixed to the side walls of the transfer space 52L. The two columns 83 extend along the vertical direction Z, and function as rails for guiding the vertical movement of the vertical movement section 84. The vertical movement section 84 extends in the first horizontal direction X across the two columns 83, and has a form of a rail whose both ends are coupled to the two columns 83. The vertical movement section 84 is configured to move vertically with respect to the columns 83 while being guided by the two columns 83. The horizontal movement section 85 is supported on the vertical movement section 84, and is configured to move in the first horizontal direction X with respect to the vertical movement section 84 while being guided by the vertical movement section 84. The rotation section 86 is supported on the horizontal movement section 85, and is configured to rotate around a vertical axis of rotation on the horizontal movement section 85. The forward and backward movement section 87 is coupled to the rotation section 86. The forward and backward movement section 87 moves forward and backward in the horizontal direction with respect to the axis of rotation, thereby moving the hand 81 forward and backward in the horizontal direction.

[0081] With such a configuration, the main transfer robot 8L can access the hand 81 to the substrate placement unit 6L and transfer the substrate W between the substrate placement unit 6L. The main transfer robot 8L can further access the hand 81 to any processing unit 11L-43L within the first processing block layer BL and transfer the substrate W or the dummy substrate DW between the processing unit 11L-43L. Also, the main transfer robot 8L can access the hand 81 to the dummy substrate storage unit 7L and transfer the dummy substrate DW between the dummy substrate storage unit 7L. And the main transfer robot 8L can transfer the substrates W, DW held by the hand 81 among the substrate placement unit 6L, the processing units 11L-43L, and the dummy substrate storage unit 7L within the first processing block layer BL.

[0082] Since the configuration of the second processing block layer BU is substantially the same as that of the first processing block layer BL, hereinafter, overlapping explanations will be omitted as much as possible, and different configurations will be mainly described. The configurations of the elements given the same names as in the case of the first processing block layer BL are substantially the same.

[0083] The second processing block layer BU includes a plurality (12 in this embodiment) of processing units 11U-13U, 21U-23U, 31U-33U, 41U-43U (hereinafter, when collectively referring to the processing units of the second processing block layer BU, they are referred to as "processing units 11U-43U"). These constitute the second processing unit group. The second processing block layer BU further includes a substrate placement unit 6U, a dummy substrate storage unit 7U, and a main transfer robot 8U. The first to fourth liquid supply units 91-94 and the first to fourth exhaust units 101-104 extend in the vertical direction Z across the first processing block layer BL and the second processing block layer BU.

[0084] The arrangement of the plurality of processing units 11U - 43U within the second processing block layer BU is substantially equivalent to the arrangement of the plurality of processing units 11L - 43L within the first processing block layer BL. The second processing block layer BU includes first to fourth processing unit stacks S1U - S4U, each of which comprises a plurality of stages (three stages in this embodiment) of processing units 11U - 13U, 21U - 23U, 31U - 33U, 41U - 43U stacked in the vertical direction Z.

[0085] In a plan view, the first to fourth processing unit stacks S1U - S4U of the second processing block layer BU are arranged so as to overlap with the first to fourth processing unit stacks S1L - S4L of the first processing block layer BL, respectively. Then, the first processing unit stacks S1L, S1U of the first and second processing block layers BL, BU are stacked in the vertical direction Z to form a first tower T1 in which a plurality of stages (six stages in this embodiment) of processing units 11L, 12L, 13L, 11U, 12U, 13U are stacked. Similarly, the second processing unit stacks S2L, S2U of the first and second processing block layers BL, BU are stacked in the vertical direction Z to form a second tower T2 in which a plurality of stages (six stages in this embodiment) of processing units 21L, 22L, 23L, 21U, 22U, 23U are stacked. Further, the third processing unit stacks S3L, S3U of the first and second processing block layers BL, BU are stacked in the vertical direction Z to form a third tower T3 in which a plurality of stages (six stages in this embodiment) of processing units 31L, 32L, 33L, 31U, 32U, 33U are stacked. Further still, the fourth processing unit stacks S4L, S4U of the first and second processing block layers BL, BU are stacked in the vertical direction Z to form a fourth tower T4 in which a plurality of stages (six stages in this embodiment) of processing units 41L, 42L, 43L, 41U, 42U, 43U are stacked.

[0086] The transfer space 52U that is partitioned within the second processing block layer BU to provide the transfer path 51U overlaps with the transfer space 52L of the first processing block layer BL. The transfer space 52U within the second processing block layer BU is partitioned from below by the intermediate partition wall 16 and from above by the upper partition wall 17. The upper partition wall 17 is disposed at a height that matches the upper surfaces of the uppermost processing units 13U, 23U, 33U, and 43U of the first to fourth towers T1 - T4.

[0087] The arrangement of the substrate placement part 6U in plan view is the same as that in the case of the first processing block layer BL. That is, the substrate placement part 6U is disposed between the index robot 26 and the main transfer robot 8U, and is disposed at the end on the index robot 26 side within the transfer space 52U. The substrate placement part 6U of the second processing block layer BU is arranged so as to overlap with the substrate placement part 6L of the first processing block layer BL in plan view. The substrate placement part 6U is disposed at a height between the intermediate partition wall 16 and the upper partition wall 17 with respect to the vertical direction Z. In this embodiment, the substrate placement part 6U is disposed below the intermediate height within the height range from the intermediate partition wall 16 to the upper partition wall 17. More specifically, the substrate placement part 6U is disposed at the highest position within the height range accessible by the index robot 26. The vertical position of the substrate placement part 6U needs to be within the height range accessible by the index robot 26 and also within the height range accessible by the main transfer robot 8U. Similar to the case of the first processing block layer BL, the substrate placement part 6U includes an unprocessed substrate placement part 61 on which the unprocessed substrate W is placed and a processed substrate placement part 62 on which the processed substrate W is placed. The configurations of the unprocessed substrate placement part 61 and the processed substrate placement part 62 are the same as those of the substrate placement part 6L of the first processing block layer BL (see FIG. 5).

[0088] A window 4U corresponding to the substrate placement part 6U is formed so as to penetrate the rear partition wall 2a of the index block 2 and the front partition wall 3a of the processing block 3, that is, their adjacent partition walls. The index robot 26 can access the substrate placement part 6U through this window 4U and carry in / out the substrate W with respect to the substrate placement part 6U.

[0089] The dummy substrate storage unit 7U is provided at a height different from that of the substrate placement unit 6U, and in this embodiment, it is disposed above the substrate placement unit 6U within the transport space 52U. The dummy substrate storage unit 7U is provided so as to overlap the substrate placement unit 6U in plan view. More specifically, when the substrate W is held on the substrate placement unit 6U and the dummy substrate DW is held on the dummy substrate storage unit 7U, the dummy substrate storage unit 7U is arranged such that the substrate W and the dummy substrate DW overlap in plan view. The overlap between the substrate W and the dummy substrate DW in plan view may be a partial overlap or an overall overlap, that is, the dummy substrate DW may overlap substantially the entire substrate W. The dummy substrate storage unit 7U is disposed at a height between the upper partition wall 17 and the intermediate partition wall 16 and within the height range accessible by the main transfer robot 8U. In front of the dummy substrate storage unit 7U, that is, on the side of the index block 2, the rear partition wall 2a of the index block 2 and the front partition wall 3a of the processing block 3, that is, their adjacent partition walls are arranged. Windows corresponding to the dummy substrate storage unit 7U are not provided in these partition walls 2a, 3a. Therefore, the index robot 26 cannot access the dummy substrate storage unit 7U.

[0090] The configuration of the dummy substrate storage unit 7U may be substantially the same as the configuration of the dummy substrate storage unit 7L in the first processing block layer BL (see FIG. 6). The dummy substrate storage unit 7U has a plurality of stages (the same number as the number of processing units provided in the second processing block layer BU in this embodiment) of slots (hereinafter referred to as "dummy substrate slots DU1 - DU12") stacked in the vertical direction so as to accommodate each dummy substrate DW in a horizontal posture. A dummy substrate sensor for detecting the presence or absence of the dummy substrate DW in each dummy substrate slot DU1 - DU12 may be provided.

[0091] The main transfer robot 8U is arranged within the transfer space 52U. The main transfer robot 8U includes a hand 81 that holds a single substrate in a horizontal posture, and a hand drive mechanism 82 that drives the hand 81. The hand drive mechanism 82 includes two support columns 83, a vertical movement part 84, a horizontal movement part 85, a rotation part 86, and a forward / backward movement part 87. These configurations are the same as those of the main transfer robot 8L in the first processing block layer BL. The main transfer robot 8U is configured to be able to access the substrate placement part 6U, the processing units 11U - 43U, and the dummy substrate storage part 7U. The main transfer robot 8U is an example of a first transfer unit that transfers the substrate W between the substrate placement part 6U and the processing units 11U - 43U, and transfers the dummy substrate DW between the dummy substrate storage part 7U and the processing units 11U - 43U.

[0092] The first processing block layer BL and the second processing block layer BU are partitioned by an intermediate partition wall 16, and it is not possible to transfer the product substrate W or the dummy substrate DW across this intermediate partition wall 16. In other words, the main transfer robot 8L in the first processing block layer BL is configured such that it cannot access any of the processing units 11U - 43U, the dummy substrate storage part 7U, and the substrate placement part 6U in the second processing block layer BU. Similarly, the main transfer robot 8U in the second processing block layer BU is configured such that it cannot access any of the processing units 11L - 43L, the dummy substrate storage part 7L, and the substrate placement part 6L in the first processing block layer BL.

[0093] The liquid supply units 91 - 94 partition a liquid pipe space that houses pipes for supplying the processing liquids used in the processing units 11L - 43L; 11U - 43U. The liquid pipe spaces partitioned by the respective liquid supply units 91 - 94 penetrate the first processing block layer BL and the second processing block layer BU in the vertical direction Z. In each of the liquid supply units 91 - 94, six processing units 11L, 12L, 13L, 11U, 12U, 13U; 21L, 22L, 23L, 21U, 22U, 23U; 31L, 32L, 33L, 31U, 32U, 33U; 41L, 42L, 43L, 41U, 42U, 43U, which are stacked in six stages in the vertical direction Z at the same position in plan view to form towers T1 - T4, are supplied with the processing liquid through pipes 56. The liquid supply units 91 - 94 may further accommodate processing liquid related devices such as valves provided in the middle of the pipes, flow meters, tanks for temporarily storing the processing liquid, and pumps for liquid feeding.

[0094] The exhaust units 101 - 104 partition an exhaust pipe space that houses pipes for exhausting the atmosphere inside the processing units. The exhaust pipe spaces partitioned by the respective exhaust units 101 - 104 penetrate the first processing block layer BL and the second processing block layer BU in the vertical direction Z. In each of the exhaust units 101 - 104, exhaust pipes 76 for guiding the exhaust from six processing units 11L, 12L, 13L, 11U, 12U, 13U; 21L, 22L, 23L, 21U, 22U, 23U; 31L, 32L, 33L, 31U, 32U, 33U; 41L, 42L, 43L, 41U, 42U, 43U, which are stacked in six stages in the vertical direction Z at the same position in plan view to form towers T1 - T4, to the exhaust facilities outside the substrate processing apparatus 1 are accommodated. The exhaust units 101 - 104 may further accommodate a switching mechanism 77 for switching the exhaust pipes 76 according to the type of processing (more specifically, the type of processing liquid) in the processing units. Although not shown, the exhaust unit 101 includes actuators for driving the switching mechanism 77.

[0095] The carrier transfer mechanism 300 (see FIG. 1) operates to carry the carrier C containing the unprocessed product substrate W into the carrier holding unit 25 and to carry out the carrier C containing the processed product substrate W from the carrier holding unit 25. Further, the carrier transfer mechanism 300 operates to carry the supply dummy carrier DC containing the unused dummy substrate DW into the carrier holding unit 25 and, after the unused dummy substrate DW is dispensed from the supply dummy carrier DC, to carry out the dummy carrier DC from the carrier holding unit 25. Furthermore, the carrier transfer mechanism 300 operates to carry the recovery dummy carrier DC for recovering the used dummy substrate DW into the carrier holding unit 25 and, after the used dummy substrate DW is accommodated in the recovery dummy carrier DC, to carry out the recovery dummy carrier DC from the carrier holding unit 25. The dummy carrier DC may have substantially the same configuration as the carrier C for the product substrate W.

[0096] The carrier transfer mechanism 300 typically includes an overhead hoist transport (OHT). The carrier transfer mechanism 300 transfers the carrier C between the carrier storage 350 and the carrier holding unit 25 (load port). Further, the carrier transfer mechanism 300 transfers the dummy carrier DC between the dummy carrier storage 351 and the carrier holding unit 25.

[0097] The carrier transfer mechanism 300 is controlled by the host computer 150 to transfer the carrier C and the dummy carrier DC. The host computer 150 is communicably connected to the controller 110 of the substrate processing apparatus 1 via the communication line 170.

[0098] The controller 110 controls the indexer robot 26 and the main transfer robots 8L, 8U to transfer the substrate W and the dummy substrate DW. Further, the controller 110 controls each part of the processing units 11L-43L, 11U-43U to execute substrate processing and dummy processing using the dummy substrate DW in the processing units 11L-43L, 11U-43U.

[0099] FIG. 7 is a schematic cross-sectional view for explaining a configuration example of processing units 11L-43L; 11U-43U (hereinafter, when collectively referred to, referred to as "processing unit 11L-43U"). The processing unit 11L-43U includes a unit partition wall 36 that forms a processing chamber 35 (chamber), a processing cup 39 disposed within the unit partition wall 36, a spin chuck 40 disposed within the processing cup 39, and a nozzle 55 that supplies a processing liquid to substrates W and DW held by the spin chuck 40.

[0100] The unit partition wall 36 includes, for example, a side wall 36a that is substantially rectangular in plan view, a top wall 36b that partitions the upper portion, and a bottom wall 36c that partitions the lower portion. One surface of the side wall 36a faces the transfer space 52U and extends along the first horizontal direction X and the vertical direction Z, and has a substrate loading / unloading port 37 for loading / unloading the substrates W and DW. The substrate loading / unloading port 37 may have a slot shape extending in the first horizontal direction X. A shutter 38 for opening and closing the substrate loading / unloading port 37 is disposed. The substrates W and DW are loaded through the substrate loading / unloading port 37 formed in the unit partition wall 36 and passed to the spin chuck 40.

[0101] The spin chuck 40 includes a spin base 45 that holds one substrate W or DW in a horizontal posture, and a spin motor 46 that rotates the spin base 45 about a vertical axis of rotation. The spin chuck 40 may be a vacuum type that adsorbs and holds the lower surface of the substrate W or DW on the upper surface of the spin base 45. Further, the spin base 45 has a circular planar shape corresponding to the substrate W or DW, and is provided with three or more holding pins spaced apart in the circumferential direction at its peripheral portion, and may constitute a mechanical type chuck that grips the substrate W or DW by these holding pins.

[0102] The processing unit 11L-43U includes one or more nozzles 55 that supply a processing liquid to the substrates W and DW held by the spin chuck 40. In this embodiment, a plurality of nozzles 55 are provided. These plurality of nozzles 55 may include a plurality of chemical liquid nozzles used to discharge respectively a plurality of types of chemical liquids.

[0103] The processing liquid is supplied from the nozzle 55 to the surfaces of the substrates W and DW held and rotated by the spin chuck 40. The nozzle 55 is connected to a processing liquid pipe 56 arranged through the liquid supply parts 91-94. The processing liquid pipe 56 is routed through the liquid supply parts 91-94 and connected to a processing liquid supply source 54. A valve 59 for opening and closing its flow path is interposed in the middle of the processing liquid pipe 56. Also, a pump 60 for sending the processing liquid toward the nozzle 55 is interposed in the middle of the processing liquid pipe 56. The valve 59 and the pump 60 are arranged in the liquid supply parts 91-94. The processing liquid supply source 54 supplies a chemical liquid such as an etching liquid and a rinse liquid such as pure water (deionized water). Depending on the type of the processing liquid, a plurality of processing liquid pipes 56 and corresponding plurality of nozzles 55 may be provided. Some or all of the plurality of nozzles 55 may have the form of a moving nozzle that moves above the substrates W and DW along the upper surfaces of the substrates W and DW. The moving nozzle may have a structure in which the proximal end of a horizontal nozzle arm 57 is supported by a swing shaft 58 arranged on the side of the spin chuck 40, and the swing shaft 58 is rotated around a vertical axis (see FIG. 1). Some or all of the plurality of nozzles 55 may be fixed nozzles with an invariant relative position with respect to the spin chuck 40.

[0104] The atmosphere inside the unit partition 36 is exhausted through an exhaust connection pipe 75 that penetrates the unit partition 36. The exhaust connection pipe 75 is connected to an exhaust pipe 76 arranged in the exhaust parts 101-104. The exhaust connection pipe 75 may be connected to a plurality of exhaust pipes 76 through a switching mechanism 77. The switching mechanism 77 operates, for example, to guide the exhaust from the exhaust connection pipe 75 to the exhaust pipe 76 pre-associated with the type of the processing liquid according to the type of the processing liquid (for example, the type of the chemical liquid) discharged from the plurality of nozzles 55.

[0105] FIG. 8 is a block diagram for explaining the configuration related to the control of the substrate processing apparatus 1. The substrate processing apparatus 1 includes a controller 110. The controller 110 may be a computer including a processor 111 (CPU) and a memory 112 (storage unit). The processor 111 executes a program 120 stored in the memory 112. Thereby, the controller 110 functions as a schedule creation unit that creates a transfer schedule for the substrate transfer operation of transferring the substrates W and DW by the indexer robot 26 and the main transfer robots 8L and 8U, and functions as a transfer control unit that controls the transfer of the substrates W and DW based on the created transfer schedule. Further, the controller 110 has a function as a substrate processing control unit that realizes the substrate processing operation of processing the substrate W by the processing units 11L - 43U. The controller 110 further has a function as a dummy processing control unit that realizes the dummy processing operation of executing dummy processing using the dummy substrate DW in the processing units 11L - 43U. For these substrate transfer operations, substrate processing operations, and dummy processing operations, the controller 110 controls various controlled objects provided in the substrate processing apparatus 1. The controlled objects include drive units provided in the indexer robot 26, the main transfer robots 8L and 8U, the processing units 11L - 43U, and the like. Further, the controlled objects of the controller 110 include the valves 59 and the pumps 60 arranged in the liquid supply units 91 - 94, and the actuators arranged in the exhaust units 101 - 104.

[0106] The memory 112 stores various types of data 130. The data 130 includes a product recipe 131 for processing the substrate W for the product and a dummy processing recipe 132 for dummy processing using the dummy substrate DW. The product recipe 131 is data that defines the transfer operation of the substrate W and the processing details for the substrate W. The dummy processing recipe 132 is data that defines the transfer operation of the dummy substrate DW and the processing details using the dummy substrate DW. When processing the substrate W, the controller 110 controls the controlled object according to the product recipe 131, and when performing dummy processing, the controller 110 controls the controlled object according to the dummy processing recipe 132.

[0107] The product recipe 131 may be provided by data communication from the host computer 150 communicably connected to the controller 110 and stored in the memory 112. Similarly, the dummy processing recipe 132 may be provided by communication from the host computer 150 and stored in the memory 112. Also, these recipes 131, 132 may be input or edited by the operator using the user interface 140 connected to the controller 110. The dummy processing recipe 132 may be automatically generated by the controller 110 according to the content of the product recipe 131. It is not necessary for either the product recipe 131 or the dummy processing recipe 132 to be of one type, and a plurality of product recipes 131 or a plurality of dummy processing recipes 132 may be stored in the memory 112. The user interface 140 includes, for example, an input device and a display device. The user interface 140 is an example of a notification unit that gives various warnings to the user. For example, when the dummy substrate DW reaches its expiration date and needs to be replaced, the user interface 140 displays a warning message or the like to notify the user.

[0108] For example, the dummy process recipe 132 includes a pre - process recipe that defines a pre - process for performing the same processes on the dummy substrate DW as on the product substrate W. The pre - process recipe may be a recipe in which, in the product recipe 131, the substrate to be carried into the processing units 11L - 43U is replaced from the product substrate W with the dummy substrate DW. Such a pre - process recipe may be automatically generated by the controller 110 based on the product recipe 131. For example, when performing a process of supplying a high - temperature processing liquid to the substrate W, by executing the pre - process, the high - temperature processing liquid can be guided to the nozzle 55, and the inside of the pipe 56 and the processing units 11L - 43U can be warmed by the high - temperature processing liquid. Thereby, a processing liquid at an appropriate temperature can be supplied to the product substrate W in an environment with appropriately temperature - controlled conditions. Thus, the pre - process is an example of a preparatory process for preparing the processing environment of the processing units 11L - 43U to appropriately process the product substrate W.

[0109] Also, the dummy process recipe 132 includes a unit cleaning recipe for holding the dummy substrate DW on the spin chuck 40 and cleaning the inside of the processing units 11L - 43U. The unit cleaning process performed according to the unit cleaning recipe is to hold the dummy substrate DW on the spin chuck 40 and rotate it, and in that state, supply a cleaning liquid (chemical solution or pure water) to the dummy substrate DW. Thereby, the cleaning liquid that receives centrifugal force on the dummy substrate DW scatters around the spin chuck 40 and cleans the inside of the processing cup 39. If necessary, by moving the processing cup 39 up and down, the incident position of the cleaning liquid on the inner wall surface of the processing cup 39 changes up and down, so that the inner wall surface of the processing cup 39 can be efficiently cleaned. Also, by moving the processing cup 39 up and down or moving the spin chuck 40 up and down, the dummy substrate DW can be disposed above the upper end of the processing cup 39, and the cleaning liquid can be supplied to the inside of the processing chamber 35 outside the processing cup 39 to clean the inside of the processing chamber 35.

[0110] The data 130 stored in the memory 112 further includes a dummy substrate table 133 that associates a plurality of processing units 11L-43U with the dummy substrate slots DL1-DL12 and DU1-DU12 of the dummy substrate accommodating portions 7L and 7U. Each of the plurality of dummy substrate slots DL1-DL12 and DU1-DU12 is assigned a unique dummy substrate slot number (dummy substrate slot identification information). And for each processing unit 11L-43U, one dummy substrate slot number is associated. The dummy substrate table 133 associates a plurality (12 in this embodiment) of processing units 11L-43U in the first processing block layer BL with a plurality (12 in this embodiment) of dummy substrate slot numbers in the dummy substrate accommodating portion 7L of the first processing block layer BL in a one-to-one manner. Also, the dummy substrate table 133 associates a plurality (12 in this embodiment) of processing units 11L-43U in the second processing block layer BU with a plurality (12 in this embodiment) of dummy substrate slot numbers in the dummy substrate accommodating portion 7U of the second processing block layer BU in a one-to-one manner. Therefore, the dummy substrate table 133 associates a plurality (24 in this embodiment) of processing units 11L-43U provided in the substrate processing apparatus 1 with a plurality (24 in this embodiment) of slot numbers in the dummy substrate accommodating portions 7L and 7U in a one-to-one manner.

[0111] The data 130 stored in the memory 112 further includes dummy substrate history data 134. The dummy substrate history data 134 includes data (usage history information) representing the usage history of the dummy substrates DW accommodated in the dummy substrate slots DL1 - DL12, DU1 - DU12 corresponding to the plurality of dummy substrate slot numbers of the dummy substrate accommodation units 7L, 7U. The usage history preferably includes at least one of the number of times of use (cumulative number of times) the dummy substrate DW was used in the processing units 11L - 43U, the usage time (cumulative time) the dummy substrate DW was used in the processing units 11L - 43U, and the history of the processing content received by the dummy substrate DW in the processing units 11L - 43U. The history of the processing content can be information representing the consumption state of the dummy substrate DW. The number of times of use and the usage time can also be information representing the consumption state of the dummy substrate DW. Another example of the information representing the consumption state of the dummy substrate DW can be the thickness of the dummy substrate DW. The thickness of the dummy substrate DW can be calculated from the usage history information, or can be detected, for example, by arranging dummy substrate thickness sensors in the dummy substrate accommodation units 7L, 7U.

[0112] The data 130 stored in the memory 112 includes threshold data 136 (usage expiration threshold information) to be compared with the dummy substrate history data 134 (especially the usage history information). The threshold data 136 may include a usage times threshold to be compared with the number of times of use, or may include a usage time threshold to be compared with the usage time. Also, the threshold data 136 may include a consumption state threshold to be compared with the consumption state of the dummy substrate DW. For example, based on the usage history information of the dummy substrate DW, the consumption state information of the dummy substrate DW can be calculated, and by comparing the consumption state information with the consumption state threshold, the usage expiration of the dummy substrate DW can be determined. The consumption state information of the dummy substrate DW may be the thickness of the dummy substrate DW.

[0113] The data 130 stored in the memory 112 further includes unit usage history data 135 representing the unit usage history of each processing unit 11L-43U. The unit usage history data 135 preferably includes the number of substrate processed by each processing unit 11L-43U and the non-use duration representing the continuous time during which each processing unit 11L-43U is not used for substrate processing. Since the internal environment of the processing unit 11L-43U gradually deteriorates by repeating substrate processing, it is preferable to set an appropriate upper limit on the number of substrates that can be continuously processed without maintenance. Also, the internal environment of the processing unit 11L-43U gradually deteriorates as the time during which the substrate W is not processed becomes longer. Specifically, the chemical solution attached to the inner wall of the processing cup 39 etc. dries and crystallizes, which may cause particles. Also, when a high-temperature processing solution having a temperature higher than room temperature is used, if the flow of the processing solution is blocked for a long time due to the continuation of the non-use state, the temperature of the pipe 56 or the nozzle 55 decreases. Therefore, when the processing solution is discharged next, the heat of the processing solution may be taken away by the pipe 56 or the nozzle 55, and the temperature of the processing solution immediately after discharge may become inappropriate. Therefore, it is also preferable to set an appropriate upper limit on the non-use duration. By comparing the unit usage history data 135 (number of substrate processed, non-use duration, etc.) with the corresponding set values, it is possible to determine whether maintenance is required for the processing unit 11L-43U.

[0114] FIG. 9 is a flowchart for explaining the operation of the controller 110 related to the dummy process. The controller 110 executes the process of FIG. 9 for each of the plurality of processing units 11L-43U in parallel or sequentially.

[0115] The controller 110 determines whether the processing of the substrate W for the product is being executed in the target processing unit 11L-43U (step A1). When the processing of the substrate W is completed in the processing unit 11L-43U and the processed substrate W is carried out from the processing unit 11L-43U (step A1: NO), the controller 110 refers to the unit usage history data 135 of the processing unit 11L-43U and determines whether the number of processed substrates has reached the set value (step A2). When the number of processed substrates is equal to or greater than the set value (step A2: YES), the controller 110 determines that the unit cleaning execution condition (an example of the maintenance execution condition) is satisfied, and executes a unit cleaning process (an example of the maintenance process) according to the unit cleaning recipe to clean the inside of the processing unit 11L-43U (step A3). Further, the controller 110 resets the number of processed substrates of the processing unit to the initial value (for example, 0) and updates the unit usage history data 135 (step A4).

[0116] The unit cleaning process is an example of a dummy process and includes a transfer schedule creation step A30, a dummy substrate loading step A31, a dummy processing step A32, and a dummy substrate storage step A33. The transfer schedule creation step A30 is a step of creating a transfer plan (transfer schedule) for the dummy process. The dummy substrate loading step A31 is a step of controlling the main transfer robots 8L and 8U according to the created transfer schedule. Thereby, the main transfer robots 8L and 8U carry out the dummy substrate DW from the corresponding dummy substrate slots DL1 - DL12 and DU1 - DU12, transfer it to the processing units 11L - 43U, and load it into the processing units. The dummy processing step A32 is a step of executing a process using the dummy substrate DW in the processing unit, and here it is an internal cleaning process of the processing unit. The dummy substrate storage step A33 is a step of carrying out the dummy substrate DW from the processing unit according to the transfer schedule after the cleaning inside the processing unit, and transferring and storing it to the original dummy substrate slots DL1 - DL12 and DU1 - DU12. The controller 110 refers to the dummy substrate table 133, identifies the dummy substrate slots DL1 - DL12 and DU1 - DU12 corresponding to the processing units 11L - 43U, and creates a transfer schedule for the dummy substrate loading step A31 and the dummy substrate storage step A33.

[0117] When the unit cleaning process is completed, the controller 110 determines whether preprocessing is necessary to adjust the processing environment (processing conditions) of the processing units 11L - 43U (steps A5, A6). Specifically, the controller 110 checks whether a processing request (processing reservation) for the product substrate has been given from the host computer 150 (step A5). When a processing request for the product substrate is given (step A5: YES), the controller 110 determines whether the unused duration of the processing unit 11L - 43U has reached the set value (step A6). If the unused duration is equal to or longer than the set value (step A6: YES), that is, if the processing unit 11L - 43U has not been used for the substrate W for products for a predetermined long time, the controller 110 determines that preprocessing is necessary, that is, the preprocessing execution condition (an example of the maintenance execution condition) is satisfied.

[0118] When it is determined that preprocessing is necessary, the controller 110 executes preprocessing according to the preprocessing recipe (step A7). Specifically, the controller 110 refers to the dummy substrate table 133, identifies the dummy substrate slots DL1 - DL12 and DU1 - DU12 corresponding to the processing unit 11L - 43U, and based on this, creates a transfer schedule for preprocessing (transfer schedule creation step A70). Then, the controller 110 controls the main transfer robots 8L and 8U according to the created transfer schedule, unloads the dummy substrate DW from the identified dummy substrate slot, and transfers the dummy substrate DW to the processing unit 11L - 43U (dummy substrate loading step A71). After the transfer, the host computer 150 executes the same processing on the dummy substrate DW in the processing unit 11L - 43U as the processing for the product substrate W (dummy processing step A72). When the processing is completed, the host computer 150 controls the main transfer robots 8L and 8U according to the transfer schedule, takes out the dummy substrate DW from the processing unit 11L - 43U, transfers it back to the original dummy substrate slot, and accommodates the dummy substrate DW in that dummy substrate slot (dummy substrate accommodation step A73). Thus, when the preprocessing is executed, the controller 110 resets the unused duration to the initial value (for example, 0) and updates the unit usage history data 135 (step A8).

[0119] As described above, when a processing request (processing reservation) for the product substrate W is given, the controller 110 executes pre-processing. The pre-processing includes the conveyance of the dummy substrate DW (step A71) and the dummy processing using the same (step A72). Therefore, while the carrier C accommodating the product substrate W is held by the carrier holding unit 25 and the indexer robot 26 takes out the substrate W to be processed from the carrier C and conveys it to the substrate mounting units 6L and 6U (substrate loading operation in step A20), or prior to that, the pre-processing (dummy substrate loading step A71 and / or dummy processing step A72) is executed. At this time, the indexer robot 26 is not involved in the conveyance of the dummy substrate DW. Therefore, the dummy substrate DW is conveyed inside the processing block 3 without inhibiting the conveyance of the product substrate W by the indexer robot 26, and the pre-processing is executed.

[0120] Incidentally, for convenience, FIG. 9 shows the product substrate W loading step A20 by the indexer robot 26, but this does not mean that the chronological relationship with the pre-processing step A7 is as shown in the figure. As described above, the product substrate loading step A20 can be (can start) prior to or in parallel with the pre-processing step A7, and the product substrate loading step A20 may also be (be started) after the pre-processing step A7.

[0121] The pre-processing recipe defines the pre-processing to be performed on the dummy substrate DW for the processing to be performed on the substrate W for the product. Therefore, by executing the pre-processing on the dummy substrate DW, the dummy substrate DW is consumed. Specifically, by performing pre-processing using a chemical solution having an etching action on the dummy substrate DW, the surface of the dummy substrate DW is etched and the thickness of the dummy substrate DW decreases. Therefore, when the pre-processing recipe is executed, the controller 110 updates the dummy substrate history data 134 of the dummy substrate slots DL1 - DL12 and DU1 - DU12 associated with the processing unit 11L - 43U (step A9). For example, when the dummy substrate history data 134 includes usage count data, the usage count data is incremented.

[0122] After the pre-treatment is completed, the controller 110 executes control according to the product recipe (step A12). Specifically, the controller 110 creates a transfer schedule for product substrate processing (transfer schedule creation step A120), and controls the index robot 26 and the main transfer robots 8L, 8U according to the transfer schedule. Then, the index robot 26 takes out the product substrate W from the carrier C and places it on the substrate placement units 6L, 6U. Then, the main transfer robots 8L, 8U take out the substrate W from the substrate placement units 6L, 6U and transfer it to the processing units 11L - 43U (substrate loading step A121). And in the processing units 11L - 43U, processing using a processing liquid (chemical solution, rinse solution, etc.) is performed on the substrate W (processing step A122). After the completion thereof, according to the transfer schedule, the main transfer robots 8L, 8U take out the processed substrate W and transfer it to the substrate placement units 6L, 6U, and the index robot 26 accommodates the processed substrate W in the carrier C (substrate accommodation step A123). When there are unprocessed substrates W (in the case of continuous processing of a plurality of substrates W) (step A13: YES), the same operation is repeated. During that time, when the number of substrates processed in the processing unit reaches the set value (step A14: YES), it returns to step A3 and unit cleaning processing is executed. When it is not continuous processing (step A13: NO), it returns and the processing from step A1 is repeated.

[0123] If there is no processing request (processing reservation) from the host computer 150 (step A5: NO), the controller 110 determines whether the duration of the standby state, that is, the non - use duration, has reached the set value (step A15). If the non - use duration has not reached the set value, it enters the standby state. When the non - use duration reaches the set value (step A15: YES), the controller 110 executes a pre - set maintenance process (step A16). The maintenance process may be a unit cleaning process. This unit cleaning process may be a process using the dummy substrate DW (a kind of dummy process) as in the case of step A3, or a process without using the dummy substrate DW. Also, the maintenance process may be a process similar to the pre - treatment. Also, the maintenance process may be other processes. The maintenance process is mainly a process for maintaining the environment in the processing chamber 35 of the processing units 11L - 43U in a state suitable for processing the product substrate W, and may be a process preset by the user of the substrate processing apparatus 1. When performing a dummy process using the dummy substrate DW as the maintenance process, the maintenance process includes a transfer schedule creation step A160 for creating a transfer plan (transfer schedule) for the process, a step A161 of taking out the dummy substrate DW from the corresponding dummy substrate slot and loading it into the processing unit according to the transfer plan, a step A162 of performing a dummy process using the dummy substrate DW in the processing unit, and a step A163 of accommodating the dummy substrate DW in the corresponding dummy substrate slot according to the transfer schedule after the process.

[0124] When there is no processing request (processing reservation) from the host computer 150, the controller 110 cannot automatically plan a pre - treatment similar to the product recipe 131. Therefore, even if the maintenance process (step A16) is executed at any time, when there is a processing request (processing reservation) from the host computer 150, it is preferable to execute the pre - treatment (step A7) corresponding to the product process.

[0125] The dummy substrate DW is introduced into the substrate processing apparatus 1 in advance and stored in the dummy substrate storage units 7L and 7U. Specifically, for example, a supply dummy carrier DC containing the dummy substrate DW is passed to the carrier holding unit 25 by a carrier transfer mechanism 300 (see FIG. 1) provided in the factory. The index robot 26 takes out the dummy substrate DW from the supply dummy carrier DC and transfers it to the substrate placement units 6L and 6U. The main transfer robot 8L of the first processing block layer BL transfers and stores the dummy substrate DW from the substrate placement unit 6L to the dummy substrate storage unit 7L. The main transfer robot 8U of the second processing block layer BU transfers and stores the dummy substrate DW from the substrate placement unit 6U to the dummy substrate storage unit 7U. The controller 110 creates a transfer schedule (supply transfer schedule) for introducing the dummy substrate DW, and achieves the transfer operations as described above by controlling the index robot 26 and the main transfer robots 8L and 8U according to the transfer schedule.

[0126] When a new dummy substrate DW is introduced and stored in the dummy substrate storage units 7L and 7U, the controller 110 resets the dummy substrate history data 134 corresponding to the dummy substrate slot in which the new dummy substrate DW is stored to the initial value.

[0127] When replacing the dummy substrate DW in the substrate processing apparatus 1, the dummy substrate DW is transported from the dummy substrate storage units 7L and 7U to the recovery dummy carrier DC held by the carrier holding unit 25 by the main transfer robots 8L and 8U and the indexer robot 26. Specifically, when the dummy substrate DW to be replaced is stored in the dummy substrate storage unit 7L of the first processing block layer BL, the main transfer robot 8L transports the dummy substrate DW from the dummy substrate storage unit 7L to the substrate placement unit 6L. When the dummy substrate DW to be replaced is stored in the dummy substrate storage unit 7U of the second processing block layer BU, the main transfer robot 8U transports the dummy substrate DW from the dummy substrate storage unit 7U to the substrate placement unit 6U. The indexer robot 26 transports and stores the dummy substrate DW placed on the substrate placement units 6L and 6U in the recovery dummy carrier DC held by the carrier holding unit 25. When a plurality of dummy substrates DW are to be replaced, the same operation is repeated. The controller 110 creates a transfer schedule (recovery transfer schedule) for replacing (discharging) the dummy substrate DW, and controls the indexer robot 26 and the main transfer robots 8L and 8U according to the transfer schedule, thereby achieving the transfer operation as described above.

[0128] Figures 10A and 10B are flowcharts for explaining the process related to the replacement of the dummy substrate in the substrate processing apparatus. Figure 10A shows an example of the process of the controller 110 of the substrate processing apparatus 1, and Figure 10B shows an example of the process of the host computer 150.

[0129] The controller 110 of the substrate processing apparatus 1 plans a dummy process (for example, cleaning of the processing unit using the dummy substrate DW. Dummy cleaning) (step S1), and updates the dummy substrate history data 134 in the memory 112 (step S2). The controller 110 further compares the dummy substrate history data 134 with the threshold data 136 to determine whether the dummy substrate DW has reached the expiration date (step S3).

[0130] As described above, the dummy substrate history data 134 is created for each slot of the dummy substrate storage units 7L and 7U, that is, for each dummy substrate DW, and represents the usage history of each dummy substrate DW. In this embodiment, a plurality of processing units and a plurality of slots of the plurality of dummy substrate storage units 7L and 7U are associated with each other in a one-to-one manner. Therefore, each dummy substrate DW is used for dummy processing in only one processing unit. Thus, when the controller 110 plans dummy processing (step S1), it updates the dummy substrate history data 134 (step S2), and based on the updated dummy substrate history data 134, determines whether the dummy substrate DW has reached the expiration date (step S3). For example, the dummy substrate history data 134 may include the usage count data of the dummy substrate DW. When the controller 110 plans dummy processing for a certain processing unit (step S1), it increments and updates the usage count data of the dummy substrate DW associated with the processing unit (step S2). Then, when the usage count data reaches a predetermined usage count threshold (an example of the threshold data 136), the controller 110 determines that the dummy substrate DW has reached the expiration date (step S3: YES).

[0131] When the dummy substrate DW reaches the expiration date (step S3: YES), the controller 110 plans to replace the dummy substrate DW (step S4). Further, the controller 110 displays on the user interface 140 that the dummy substrate DW has reached the expiration date, and gives a notification to alert the user (step S5). If the dummy substrate DW has not reached the expiration date (step S3: NO), the plan to replace the dummy substrate (step S4) and the notification for alerting (step S5) are omitted.

[0132] The controller 110 controls the conveyance of the dummy substrate DW and the processing in the processing unit according to the plan of the dummy process (step S6). Specifically, the controller 110 controls the main transfer robots 8L and 8U to transfer the dummy substrate DW from the dummy substrate storage units 7L and 7U to the processing unit, and controls the processing unit to execute processing (for example, chamber cleaning processing) using the dummy substrate DW.

[0133] When the controller 110 needs to replace the dummy substrate DW (step S7: YES), that is, when it plans to replace the dummy substrate DW (step S4), it sends a dummy substrate replacement request to the host computer 150 (step S8. Function as a usage expiration notice unit of the controller 110). When there is no plan to replace the dummy substrate DW (step S7: NO), the dummy substrate replacement request is not sent.

[0134] When there is a dummy substrate replacement request (step S11: YES), the host computer 150 determines whether to start replacing the dummy substrate DW (step S12). For example, when there is processing of the product substrate W that should be prioritized over the replacement of the dummy substrate DW, this determination is negative and the dummy substrate replacement request is put on hold. If it is determined that the replacement of the dummy substrate DW should be started (step S12: YES), the host computer 150 controls the carrier transfer mechanism 300 to transfer the recovery dummy carrier DC and the supply dummy carrier DC from the dummy carrier storage area 351 to the carrier holding unit 25 of the substrate processing apparatus 1.

[0135] More specifically, the host computer 150 determines whether there is a dummy carrier DC for collection in the dummy carrier storage area 351 (step S13). If not, it performs a process for preparing the dummy carrier DC for collection (step S14). This process may be an alarm process that prompts the user to prepare the dummy carrier DC for collection (notification that the dummy carrier DC for collection is necessary). After this process, the host computer 150 plans the conveyance of the dummy carrier DC for collection by the carrier conveyance mechanism 300 and instructs the carrier conveyance mechanism 300 to execute it (step S15). If there is a dummy carrier DC for collection in the dummy carrier storage area 351 (step S13: YES), the process of step S14 is omitted. Also, the host computer 150 determines whether there is a dummy carrier DC for supply in the dummy carrier storage area 351 (step S16). If not, it performs a process for preparing the dummy carrier DC for supply (step S17). This process may be an alarm process that prompts the user to prepare the dummy carrier DC for supply (notification that the dummy carrier DC for supply is necessary). After this process, the host computer 150 plans the conveyance of the dummy carrier DC for supply by the carrier conveyance mechanism 300 and instructs the carrier conveyance mechanism 300 to execute it (step S18). If there is a dummy carrier DC for supply in the dummy carrier storage area 351 (step S16: YES), the process of step S17 is omitted.

[0136] The plan for dummy substrate replacement by the controller 110 of the substrate processing apparatus 1 (step S4) includes creating a recovery conveyance schedule for conveying the dummy substrate DW that has reached the expiration date from the dummy substrate storage units 7L and 7U to the dummy carrier DC for collection when the dummy carrier DC for collection is held in the carrier holding unit 25. According to this recovery conveyance schedule, the controller 110 controls the main transfer robots 8L and 8U and the indexer robot 26. Thereby, the main transfer robots 8L and 8U convey the dummy substrate DW that has reached the expiration date from the dummy substrate storage units 7L and 7U to the substrate placement units 6L and 6U, and the indexer robot 26 conveys the dummy substrate DW from the substrate placement units 6L and 6U to the dummy carrier DC for collection.

[0137] The plan for dummy substrate replacement (step S4) by the controller 110 of the substrate processing apparatus 1 includes creating a supply transfer schedule for transporting an unused dummy substrate DW from the supply dummy carrier DC held by the carrier holding unit 25 to the dummy substrate storage units 7L and 7U when the supply dummy carrier DC is held by the carrier holding unit 25. According to this supply transfer schedule, the controller 110 controls the index robot 26 and the main transfer robots 8L and 8U. Thereby, the index robot 26 transports the unused dummy substrate DW from the supply dummy carrier DC to the substrate placement units 6L and 6U, and the main transfer robots 8L and 8U transport the dummy substrate DW from the substrate placement units 6L and 6U to the dummy substrate storage units 7L and 7U.

[0138] The operation of recovering the used dummy substrate DW and the operation of supplying the unused dummy substrate DW may be executed separately in time, or a part or all of these operations may be executed overlapping in time.

[0139] FIG. 11 is a time chart for explaining an example of a specific operation.

[0140] First, the dummy processing operation represented by the block with a lattice pattern in FIG. 11 is as follows. The dummy substrate DW corresponding to the processing unit for which dummy processing is to be performed is taken out from the dummy substrate storage units 7L and 7U by the main transfer robots 8L and 8U and carried into the target processing unit. When the processing (dummy processing) using the dummy substrate DW in the processing unit is completed, the dummy substrate DW is taken out by the main transfer robots 8L and 8U and stored in the dummy substrate storage units 7L and 7U.

[0141] When the dummy substrate DW reaches its expiration date due to this dummy process, the controller 110 of the substrate processing apparatus 1 plans the dummy process and, for example, when the dummy substrate DW is dispensed from the dummy substrate storage units 7L and 7U, transmits a dummy substrate replacement request (expiration date information) to the host computer 150 (time t1). Triggered by this, the dummy substrate recovery operation represented by the horizontally striped blocks in FIG. 11 is performed. The dummy substrate DW reaches its expiration date by being used one more time for the dummy process. That is, it reaches its expiration date after the dummy process performed after time t1.

[0142] Upon receiving the dummy substrate replacement request, the host computer 150 plans and executes the conveyance of the recovery dummy carrier DC while the dummy process is being performed in the substrate processing apparatus 1. That is, when receiving the dummy substrate replacement request at time t1, the host computer 150 executes the process for preparing the recovery dummy carrier DC during the period T1 (see step S14 in FIG. 10B). After the recovery dummy carrier DC is placed in the dummy carrier storage 351 at time t2, it commands the carrier conveyance mechanism 300 to convey the recovery dummy carrier DC. Thereby, during the period T2 from time t2, the carrier conveyance mechanism 300 conveys the recovery dummy carrier DC from the dummy carrier storage 351 to the carrier holding unit 25 of the substrate processing apparatus 1. That is, the carrier conveyance mechanism 300 takes out the recovery dummy carrier DC from the dummy carrier storage 351, conveys it to the substrate processing apparatus 1, and loads the recovery dummy carrier DC into the carrier holding unit LP1 which is one of the plurality of carrier holding units 25. When the recovery dummy carrier DC is loaded into the carrier holding unit 25, at time t3, the host computer 150 commands the controller 110 of the substrate processing apparatus 1 to recover and convey the dummy substrate DW.

[0143] It is preferable that the dummy process operation is completed during the aforementioned period T2. In other words, the host computer 150 preferably plans the conveyance of the recovery dummy carrier DC by the carrier conveyance mechanism 300 so that the recovery dummy carrier DC is conveyed to the carrier holding unit LP1 while the dummy process operation is being performed in the substrate processing apparatus 1. Then, it is preferable that the completion of the dummy process operation (accommodation of the dummy substrate DW to be replaced in the dummy substrate accommodation units 7L and 7U) and the loading of the recovery dummy carrier DC into the carrier holding unit 25 are completed almost synchronously.

[0144] The controller 110, which has been commanded to recover and convey the dummy substrate DW, creates a recovery conveyance schedule for conveying the used dummy substrate DW, which has been used for the dummy process and reached the expiration date, from the dummy substrate accommodation units 7L and 7U to the recovery dummy carrier DC after the used dummy substrate DW is accommodated in the dummy substrate accommodation units 7L and 7U, and executes the conveyance of the dummy substrate DW according to the recovery conveyance schedule. Specifically, after the used dummy substrate DW is accommodated in the dummy substrate accommodation units 7L and 7U, the main transfer robots 8L and 8U take out the used dummy substrate DW from the dummy substrate accommodation units 7L and 7U and place it on the substrate placement units 6L and 6U. The used dummy substrate DW is taken out by the index robot 26 and loaded into the recovery dummy carrier DC held in the carrier holding unit LP1. When the used dummy substrate DW is accommodated in the recovery dummy carrier DC, the controller 110 notifies the host computer 150 at time t5 that the recovery dummy carrier DC is in a state where it can be unloaded. In response to this notification, the host computer 150 instructs the carrier conveyance mechanism 300 to convey the recovery dummy carrier DC. Thereby, the carrier conveyance mechanism 300 unloads the recovery dummy carrier DC from the carrier holding unit 25 and conveys it to the dummy carrier storage area 351.

[0145] While the used dummy substrate DW is thus recovered, a dummy substrate supply operation for supplying an unused dummy substrate DW to be replaced with the used dummy substrate DW is executed. In FIG. 11, the dummy substrate supply operation is indicated by a hatched block.

[0146] The host computer 150 plans and executes the supply of the unused dummy substrate DW to the substrate processing apparatus 1. Specifically, the host computer 150 creates a plan for transporting the supply dummy carrier DC containing the unused dummy substrate DW from the dummy carrier storage 351 to the carrier holding unit 25 of the substrate processing apparatus 1, and in accordance with that plan, at time t4, it instructs the carrier transport mechanism 300 to transport the supply dummy carrier DC. Thereby, the carrier transport mechanism 300 takes out the supply dummy carrier DC from the dummy carrier storage 351, transports it to the substrate processing apparatus 1, and loads it into one of the plurality of carrier holding units 25, namely the carrier holding unit LP2. When the supply dummy carrier DC is loaded into the carrier holding unit LP2, at time t6, the host computer 150 commands the controller 110 of the substrate processing apparatus 1 to supply and transport the dummy substrate DW.

[0147] In FIG. 11, an example is shown in which the recovery dummy carrier DC and the supply dummy carrier DC are held in different carrier holding units LP1 and LP2. However, as a plan for loading the supply dummy carrier DC after the unloading of the recovery dummy carrier DC, the supply dummy carrier DC may be loaded into the carrier holding unit LP1 from which the recovery dummy carrier DC has been unloaded.

[0148] Upon receiving the supply transfer command for the dummy substrate DW, the controller 110 of the substrate processing apparatus 1 creates a supply transfer schedule for transferring the unused dummy substrate DW from the supply dummy carrier DC to the dummy substrate storage units 7L and 7U, and controls the index robot 26 and the main transfer robots 8L and 8U according to the supply transfer schedule. Accordingly, the index robot 26 takes out the unused dummy substrate DW from the supply dummy carrier DC and loads it into the substrate placement units 6L and 6U. Thereafter, the main transfer robots 8L and 8U transfer the unused dummy substrate DW from the substrate placement units 6L and 6U to the dummy substrate storage units 7L and 7U.

[0149] At time t7 after the unused dummy substrate DW has been unloaded from the supply dummy carrier DC, the controller 110 of the substrate processing apparatus 1 notifies the host computer 150 that the supply dummy carrier DC is in a state where it can be unloaded. Upon receiving this notification, the host computer 150 instructs the carrier transfer mechanism 300 to transfer the supply dummy carrier DC (at time t8). Thereby, the carrier transfer mechanism 300 unloads the supply dummy carrier DC from the carrier holding unit 25 of the substrate processing apparatus 1 and transfers it to the dummy carrier storage area 351.

[0150] In this way, through the communication between the controller 110 of the substrate processing apparatus 1 and the host computer 150, the recovery dummy carrier DC and the supply dummy carrier DC are timely loaded into and unloaded from the carrier holding unit 25 of the substrate processing apparatus 1 by the carrier transfer mechanism 300. Thereby, the replacement of the dummy substrate DW can be performed automatically and without delay. Also, since the time during which the dummy carrier DC occupies the carrier holding unit 25 can be shortened, the time available for using the carrier holding unit 25 for holding the carrier C that houses the product substrate W is increased. Thereby, productivity can be improved.

[0151] The dummy substrates DW may be replaced one by one, or a plurality of dummy substrates DW may be replaced collectively. In that case, a plurality of used dummy substrates DW are carried into a single recovery dummy carrier DC. Further, a supply dummy carrier DC containing a plurality of unused dummy substrates DW is carried into the carrier holding unit 25, and a plurality of dummy substrates DW are introduced from the supply dummy carrier DC into the dummy substrate accommodating portions 7L and 7U.

[0152] As described above, according to this embodiment, the processing blocks 3 adjacent to the index block 2 in the lateral direction are configured by stacking a plurality of processing block layers BL and BU in the vertical direction Z. And each of the processing block layers BL and BU is provided with dummy substrate accommodating portions 7L and 7U for accommodating the dummy substrates DW. Since the dummy substrates DW can be accommodated inside the processing block layers BL and BU, when it becomes necessary to use the dummy substrates DW in the processing units 11L - 43U, the dummy substrates DW can be transported between the dummy substrate accommodating portions 7L and 7U and the processing units 11L - 43U without the involvement of the index robot 26.

[0153] Therefore, the transport load of the index robot 26 can be reduced, so that processing using the dummy substrates DW can be performed while reducing the influence on the transport of the product substrate W. In particular, the transport load of the index robot 26 for transporting the substrate W between the plurality of processing block layers BL and BU each having a plurality of processing units 11L - 43L, 11U - 43U and the carrier holding unit 25 is extremely large. Therefore, by reducing the transport load of the index robot 26, the transport efficiency of the product substrate W is improved, and accordingly, the productivity can be enhanced. The main transport robots 8L and 8U of each processing block layer BL and BU are responsible for transporting the substrate W within the corresponding processing block layer BL and BU, so the transport load is smaller compared to the index robot 26. Therefore, the main transport robots 8L and 8U taking charge of transporting the dummy substrates DW inside the processing block layers BL and BU does not pose a major problem from the perspective of production efficiency.

[0154] Also, since the dummy substrate storage units 7L and 7U are within the processing block layers BL and BU, the transfer of the dummy substrate DW between the dummy substrate storage units 7L and 7U and the processing units 11L - 43U can be performed without passing through the substrate placement units 6L and 6U for substrate handover between the index robot 26 and the processing block layers BL and BU. Therefore, interference between the transfer of the dummy substrate DW and the transfer of the product substrate W can be reduced, improving the transfer efficiency of the product substrate W and accordingly enhancing productivity.

[0155] Furthermore, unlike the case of Patent Document 1, the carrier holding unit 25 is not occupied by the dummy carrier DC that houses the dummy substrate DW for a long time. Thereby, it is possible to suppress the occurrence of waiting time for the loading of the carrier C that houses the product substrate W, contributing to the improvement of productivity.

[0156] Also, in this embodiment, in each of the processing block layers BL and BU, a plurality of processing units 11L - 43L and 11U - 43U are arranged on both sides of the transfer paths 51L and 51U along which the substrate W is transferred by the main transfer robots 8L and 8U, and are stacked and arranged in the vertical direction Z. Therefore, the arrangement of the plurality of processing units 11L - 43U within the processing block layers BL and BU is designed so that the main transfer robots 8L and 8U can efficiently transfer the substrate. Thereby, it is possible to contribute to the improvement of productivity.

[0157] Also, in this embodiment, both the substrate placement units 6L and 6U and the dummy substrate storage units 7L and 7U are arranged between the index robot 26 and the main transfer robots 8L and 8U. Thereby, the transfer of the substrate W between the index robot 26 and the main transfer robots 8L and 8U via the substrate placement units 6L and 6U can be efficiently performed. And the dummy substrate storage units 7L and 7U can be arranged at positions that do not interfere with the transfer of the substrate W by the index robot 26 and the transfer of the substrate W by the main transfer robots 8L and 8U. Therefore, the dummy substrate DW can be held within the processing block layers BL and BU without affecting the transfer of the product substrate W.

[0158] More specifically, in this embodiment, the dummy substrate accommodating portions 7L and 7U and the substrate mounting portions 6L and 6U are three-dimensionally arranged with different heights from each other. Thereby, the dummy substrate accommodating portions 7L and 7U can be appropriately arranged in the processing block layers BL and BU by effectively using the space in the processing block layers BL and BU. As a result, an arrangement of the dummy substrate accommodating portions 7L and 7U that does not hinder the conveyance of the product substrate W is realized.

[0159] Furthermore, in this embodiment, the dummy substrate accommodating portions 7L and 7U are arranged so as to overlap the substrate mounting portions 6L and 6U in plan view. Thereby, the dummy substrate accommodating portions 7L and 7U are arranged by using the space above or below the substrate mounting portions 6L and 6U. Thereby, an arrangement of the dummy substrate accommodating portions 7L and 7U that does not hinder the conveyance of the product substrate W is realized, and the dummy substrate accommodating portions 7L and 7U can be arranged by effectively using the space in the processing block layers BL and BU. As described above, the arrangement in which the dummy substrate accommodating portions 7L and 7U overlap the substrate mounting portions 6L and 6U in plan view may specifically be an arrangement in which a part or all of the dummy substrates DW accommodated in the dummy substrate accommodating portions 7L and 7U overlap the substrate W held by the substrate mounting portions 6L and 6U.

[0160] More specifically, in this embodiment, the second processing block layer BU (upper processing block layer) is laminated on the first processing block layer BL (lower processing block layer). In the first processing block layer BL, the dummy substrate accommodating portion 7L is located below the substrate mounting portion 6L. On the other hand, in the second processing block layer BU, the dummy substrate accommodating portion 7U is located below the substrate mounting portion 6U. Thereby, the height difference between the substrate mounting portion 6L of the first processing block layer BL and the substrate mounting portion 6U of the second processing block layer BU can be reduced. Thereby, the vertical substrate conveyance stroke in the Z direction by the indexer robot 26 can be shortened, so that the conveyance load of the indexer robot 26 can be reduced. Therefore, the conveyance efficiency of the product substrate W can be increased, contributing to an improvement in productivity.

[0161] Also, in this embodiment, the dummy substrate accommodating portions 7L and 7U of each processing block layer BL and BU include a plurality of dummy substrate slots DL1 - DL12 and DU1 - DU12, the same number as the plurality of processing units 11L - 43L and 11U - 43U included in the corresponding processing block layer. And each dummy substrate slot DL1 - DL12 and DU1 - DU12 is configured to hold one dummy substrate DW. Thus, the same number of dummy substrates DW as the processing units 11L - 43L and 11U - 43U can be held within each processing block layer BL and BU. Therefore, if it becomes necessary to carry a dummy substrate DW into any of the processing units 11L - 43L and 11U - 43U, the main transfer robots 8L and 8U can promptly carry the dummy substrate DW into the corresponding processing unit to perform dummy processing. Since the index robot 26 is not involved in the loading of the dummy substrate DW, the influence on the transfer of the product substrate W can be suppressed or prevented.

[0162] Furthermore, in this embodiment, the plurality of processing units 11L - 43L and 11U - 43U of each processing block layer BL and BU and the plurality of dummy substrate slots DL1 - DL12 and DU1 - DU12 of the corresponding processing block layer are associated with each other on a one - to - one basis. And the main transfer robots 8L and 8U transfer the dummy substrate DW between the corresponding dummy substrate slots DL1 - DL12 and DU1 - DU12 and the processing units 11L - 43L and 11U - 43U. With this configuration, the dummy substrate DW held in the dummy substrate slot can be a dedicated dummy substrate for the corresponding processing unit. Thereby, the management of the usage history of the dummy substrate DW becomes easy.

[0163] Also, in this embodiment, when the dummy processing conditions (unit cleaning execution condition, preprocessing execution condition, maintenance execution condition) are satisfied, the controller 110 controls the main transfer robots 8L and 8U to transfer the dummy substrate DW from the dummy substrate storage units 7L and 7U to the processing units 11L - 43L and 11U - 43U, and executes dummy processing in the processing units. In this way, since the dummy processing can be started by transferring the dummy substrate DW within the processing block layers BL and BU, the dummy processing can be started promptly while suppressing or preventing the influence on the transfer of the substrate W for products.

[0164] Also, according to this embodiment, by the controller 110 controlling each part of the substrate processing apparatus 1, the following steps are executed. That is, within each processing block layer BL and BU, a dummy substrate loading step (steps A31, A71, A161) is executed in which the main transfer robots 8L and 8U load the dummy substrate DW stored in the dummy substrate storage units 7L and 7U within the processing block layer into any one of the plurality of processing units 11L - 43L and 11U - 43U within the processing block layer. Then, a dummy processing step (steps A32, A72, A162) is executed in which dummy processing is performed using the loaded dummy substrate DW within the processing unit. Further, after the dummy processing, a step is executed in which the main transfer robots 8L and 8U take out the dummy substrate DW from the processing unit and transfer it to the dummy substrate storage units 7L and 7U (steps A33, A73, A163). Also, a step is executed in which the substrate W placed on the substrate placement units 6L and 6U of the processing block layers BL and BU is loaded into any one of the plurality of processing units 11L - 43L and 11U - 43U of the processing block layers BL and BU (step A121). Then, a step is executed in which the loaded substrate W is processed within the processing unit (step A122). Thereby, while reducing the transfer load on the index robot 26, the processing using the dummy substrate DW can be performed in the processing units 11L - 43L and 11U - 43U of each processing block layer BL and BU. Thereby, the production efficiency can be improved.

[0165] Under the control of the controller 110, in parallel with the substrate loading step (step A20) in which the index robot 26 takes out the substrate W from the carrier C held by the carrier holding unit 25 and loads it into the substrate placement units 6L and 6U of any of the processing block layers BL and BU, or prior to the substrate loading step (step A20), the aforementioned dummy substrate loading step (step A71) may be executed. Thereby, while the substrate W for products is loaded into the processing block layers BL and BU by the index robot 26, the dummy substrate DW can be loaded into the processing units 11L-43L and 11U-43U within each of the processing block layers BL and BU. Since the index robot 26 does not have to be involved in the loading of the dummy substrate DW, the transfer of the dummy substrate DW within the processing block layers BL and BU can be performed without waiting for the transfer of the substrate W by the index robot 26 or in parallel with the transfer of the substrate. Therefore, the transfer load on the index robot 26 can be reduced, and the dummy substrate DW can be quickly transferred to the processing unit within the processing block layers BL and BU.

[0166] Furthermore, under the control of the controller 110, in parallel with the substrate loading step (step A20) in which the substrate W for products is loaded into the substrate placement units 6L and 6U by the index robot 26, or prior to the substrate loading step, the aforementioned dummy processing step (step A72) may be executed. Thereby, the transfer load on the index robot 26 can be reduced, and the dummy processing can be quickly started within the processing block layers BL and BU. For example, when a request for substrate processing is received from the host computer 150, in response thereto, the transfer of the dummy substrate DW and the subsequent dummy processing can be started at an appropriate time. Thereby, the environment within the processing units 11L-43L and 11U-43U can be adjusted at an appropriate time, so that when the carrier C containing the substrate W for products is loaded into the carrier holding unit 25, the processing of the substrate W can be started promptly. This can contribute to an improvement in productivity.

[0167] Also, in this embodiment, the usage history information (dummy substrate history data 134) of the dummy substrates DW stored in the dummy substrate storage units 7L and 7U is stored in the memory 112 of the controller 110, and based on this, a dummy substrate replacement request is sent to the host computer 150 (notification of expiration information). Further, a recovery transfer schedule for transporting and recovering the dummy substrate DW to be replaced from the dummy substrate storage units 7L and 7U to the carrier holding unit 25 is created. Based on this recovery transfer schedule, the main transfer robots 8L and 8U and the indexer robot 26 are controlled, so that the dummy substrate DW to be replaced is transported from the dummy substrate storage units 7L and 7U to the carrier holding unit 25 and recovered by the recovery dummy carrier DC. In this way, when the dummy substrate DW reaches its expiration date, the dummy substrate DW can be automatically discharged.

[0168] In this embodiment, the dummy substrate replacement request is an example of the notification of expiration information, and this dummy substrate replacement request notifies that the dummy substrate DW has become unusable or is expected to become unusable soon. In this embodiment, the dummy substrate replacement request is a dummy substrate recovery request that requests the recovery of the used dummy substrate DW. More precisely, since the dummy substrate replacement request requests the recovery of the used dummy substrate DW after the completion of the last dummy process, it can also be said that it is a dummy substrate recovery reservation that specifies the recovery time of the used dummy substrate DW. Also, in this embodiment, the dummy substrate replacement request is also a dummy substrate supply request that requests the supply of unused dummy substrates DW. And in this embodiment, since the dummy substrate replacement request requests the supply of unused dummy substrates DW to replace the dummy substrate DW that will become used after the completion of the last dummy process, it can also be said that it is a dummy substrate supply reservation that specifies the supply time of the unused dummy substrate DW.

[0169] Note that instead of determining the expiration date by the remaining one dummy process, the threshold data 136 can be determined so that the dummy substrate DW reaches the usage limit by executing the dummy process a predetermined number of times or more than twice. Thereby, since the replacement of the dummy substrate DW can be requested (reserved) to the host computer 150 with a margin, the collection plan of the used dummy substrate DW and the supply plan of the unused dummy substrate DW can be appropriately executed, and the dummy substrate DW can be collected and supplied in a timely manner.

[0170] Also, in this embodiment, a plurality of dummy substrates DW and a plurality of processing units are associated with each other on a one-to-one basis. Thereby, since the dummy substrate DW is not shared by a plurality of processing units, it is possible to avoid the plurality of processing units from affecting each other via the dummy substrate DW. For example, even if the processing environment in one processing unit is contaminated, it is possible to avoid the contamination from being brought into other processing units via the dummy substrate DW.

[0171] Also, in this embodiment, the host computer 150 that has received the dummy substrate replacement request from the substrate processing apparatus 1 plans the operation of the carrier transport mechanism 300 and controls the carrier transport mechanism 300 according to the plan, thereby carrying the recovery dummy carrier DC for recovering the used dummy substrate DW into the carrier holding unit 25 of the substrate processing apparatus 1. Therefore, based on the dummy substrate replacement request (notification of expiration date information) from the substrate processing apparatus 1 to the host computer 150, the recovery dummy carrier DC can be supplied to the substrate processing apparatus 1 at an appropriate time. That is, since the supply of the recovery dummy carrier DC is automatically and timely performed, the downtime of the substrate processing apparatus 1 can be shortened, and its productivity can be improved.

[0172] In addition, since the host computer 150 commands the substrate processing apparatus 1 to recover and convey the dummy substrate DW, the substrate processing apparatus 1 can plan and execute the recovery and conveyance of the dummy substrate DW in a timely manner, that is, the conveyance of the used dummy substrate DW from the dummy substrate storage units 7L and 7U to the recovery dummy carrier DC. That is, the timing of the loading of the recovery dummy carrier DC and the start of the recovery and conveyance of the dummy substrate DW within the substrate processing apparatus 1 can be coordinated. Furthermore, when the substrate processing apparatus 1 notifies the host computer 150 that the recovery of the dummy substrate DW onto the recovery dummy carrier DC is complete, the host computer 150 plans the unloading of the recovery dummy carrier DC by the carrier conveyance mechanism 300 and controls the carrier conveyance mechanism 300 according to the plan. Therefore, the recovery dummy carrier DC is automatically and timely unloaded from the carrier holding unit 25 of the substrate processing apparatus 1. Specifically, the recovery dummy carrier DC can be unloaded from the carrier holding unit 25 at a timing that coincides with the completion of the loading of the dummy substrate DW onto the recovery dummy carrier DC. In this way, the time during which the recovery dummy carrier DC occupies the carrier holding unit 25 can be shortened, so that the carrier holding unit 25 can be promptly vacated for the carrier C that houses the product substrate W. Thereby, the unprocessed product substrate W can be efficiently loaded into the substrate processing apparatus 1, and the processed product substrate W can be efficiently recovered, thus improving productivity.

[0173] Note that the "coordination" of timing does not necessarily mean a temporal coincidence, but rather means that corresponding events occur within a predetermined time allowed from the perspective of productivity. The predetermined time in this case is about 1 minute, for example. The same applies in the following description.

[0174] Furthermore, the host computer 150 creates a plan to cause the carrier transport mechanism 300 to transport a supply dummy carrier DC containing a usable dummy substrate DW to the carrier holding unit 25 of the substrate processing apparatus 1, and controls the operation of the carrier transport mechanism 300 according to the plan. As a result, the supply dummy carrier DC is automatically and timely supplied to the substrate processing apparatus 1. In the substrate processing apparatus 1, a supply transfer schedule for transferring the dummy substrate DW from the supply dummy carrier DC to the dummy substrate storage units 7L and 7U is created, and the dummy substrate DW is transferred according to the supply transfer schedule. In this way, since the dummy substrate DW can be automatically and timely supplied to the substrate processing apparatus 1, for example, the downtime of the substrate processing apparatus 1 due to a shortage of usable dummy substrates DW can be reduced. Thereby, it is possible to contribute to an improvement in productivity.

[0175] In addition, since the host computer 150 commands the substrate processing apparatus 1 to supply and transfer the dummy substrate DW, the substrate processing apparatus 1 can plan and execute the supply and transfer of the dummy substrate DW in a timely manner, that is, the transfer of the dummy substrate DW from the dummy carrier DC for supply of the available dummy substrate DW to the dummy substrate storage units 7L and 7U. Therefore, it is possible to start the supply and transfer of the dummy substrate DW in the substrate processing apparatus 1 by matching the loading of the dummy carrier DC for supply with the timing. Further, when the completion of the unloading of the dummy substrate DW from the dummy carrier DC for supply is notified from the substrate processing apparatus 1 to the host computer 150, based on this, the host computer 150 plans the unloading of the dummy carrier DC for supply and operates the carrier transfer mechanism 300 according to the plan. Thereby, the dummy carrier DC for supply can be unloaded from the carrier holding unit 25 at a timing that matches the completion of the unloading of the dummy substrate DW from the dummy carrier DC for supply. In this way, the dummy carrier DC for supply can be automatically and timely unloaded from the carrier holding unit 25 of the substrate processing apparatus 1. In this manner, the time during which the dummy carrier DC for supply occupies the carrier holding unit 25 can be shortened, and the carrier holding unit 25 can be promptly vacated for holding the carrier C that accommodates the product substrate W. Thereby, the unprocessed product substrate W can be efficiently input into the substrate processing apparatus 1, and the processed product substrate W can be efficiently recovered, so that the productivity can be improved.

[0176] FIG. 12 is an illustrative longitudinal sectional view for explaining the configuration of a substrate processing apparatus according to a second embodiment of the present invention, and shows the configuration in a longitudinal section corresponding to the longitudinal section of FIG. 2. Compared with the above-described first embodiment, in this embodiment, the intermediate partition wall 16 that divides the first processing block layer BL and the second processing block layer BU is removed. Further, the columns 83 that guide the vertical movement of the main transfer robots 8L and 8U extend vertically across the first processing block layer BL and the second processing block layer BU. Thereby, the main transfer robots 8L and 8U are configured to be able to move vertically with a larger stroke than in the case of the first embodiment. Of course, the controller 110 controls the operations of the main transfer robots 8L and 8U so that they do not interfere with each other.

[0177] Also, in this embodiment, the two substrate mounting portions 6U and 6L in the first embodiment are replaced by one substrate mounting portion 6. The substrate mounting portion 6 is shared by the first processing block layer BL and the second processing block layer BU. That is, the main transfer robot 8L of the first processing block layer BL can access the substrate mounting portion 6, and conveys the product substrate W between the substrate mounting portion 6 and the processing units 11L - 43L of the first processing block layer BL. Further, the main transfer robot 8L conveys the dummy substrate DW between the substrate mounting portion 6, the processing units 11L - 43L, and the dummy substrate storage portion 7L. Similarly, the main transfer robot 8U of the second processing block layer BU can access the substrate mounting portion 6, and conveys the product substrate W between the substrate mounting portion 6 and the processing units 11U - 43U of the second processing block layer BU. Further, the main transfer robot 8U conveys the dummy substrate DW between the substrate mounting portion 6, the processing units 11U - 43U, and the dummy substrate storage portion 7U.

[0178] The substrate mounting portion 6 includes an unprocessed substrate mounting portion 61 and a processed substrate mounting portion 62. However, since the substrate mounting portion 6 is shared by the first and second processing block layers BL and BU, it is preferable that the unprocessed substrate mounting portion 61 and the processed substrate mounting portion 62 each include substrate holding shelves 65 and 66 having more slots than in the case of the first embodiment. At least one (i.e., part or all) of the slots of the substrate holding shelves 65 and 66 provided in the substrate mounting portion 6 may be arranged to be accessible by both main transfer robots 8L and 8U. More specifically, at least one (i.e., part or all) of the slots of the substrate holding shelf 65 (see FIG. 5) of the unprocessed substrate mounting portion 61 may be arranged to be accessible by both main transfer robots 8L and 8U. Similarly, at least one (i.e., part or all) of the slots of the substrate holding shelf 66 (see FIG. 5) of the processed substrate mounting portion 62 may be arranged to be accessible by both main transfer robots 8L and 8U.

[0179] The substrate placement unit 6 is preferably arranged to be accessible by the index robot 26. More specifically, the index robot 26 is preferably configured to be able to access all the slots of the substrate holding shelves 65, 66 of the substrate placement unit 6 and carry in and out the product substrate W or the dummy substrate DW with respect to them.

[0180] FIG. 13 is a longitudinal sectional view for explaining the configuration of the substrate processing apparatus according to the third embodiment of the present invention, and shows the configuration in a longitudinal section corresponding to the longitudinal section of FIG. 2. In the first embodiment, windows 4L, 4U corresponding to the substrate placement units 6L, 6U are formed in the adjacent partition walls 2a, 3a of the index block 2 and the processing block 3, and windows corresponding to the dummy substrate storage units 7L, 7U are not formed. In contrast, in this embodiment, windows 5L, 5U corresponding to the dummy substrate storage units 7L, 7U are added to the partition walls 2a, 3a.

[0181] By providing such additional windows 5L, 5U, when introducing the dummy substrate DW into the processing block layers BL, BU, the index robot 26 can directly access the dummy substrate storage units 7L, 7U and carry in the dummy substrate DW. Further, when carrying out the used dummy substrate DW from the processing block layers BL, BU, the index robot 26 can directly access the dummy substrate storage units 7L, 7U and carry out the dummy substrate. When carrying in / out such a dummy substrate DW, neither of the main transfer robots 8L, 8U needs to be involved. Therefore, the transfer load of the main transfer robots 8L, 8U can be reduced to improve productivity.

[0182] FIG. 14 is a schematic plan view showing the internal configuration of a substrate processing apparatus according to a fourth embodiment of the present invention. In the first embodiment, the plurality of processing units 11L-43U are divided into a first processing unit group provided in the lower processing block layer BL and a second processing unit group provided in the upper processing block layer BU, and a horizontal intermediate partition 16 is provided between them. In contrast, in this embodiment, an intermediate partition 16 that vertically divides the space in the processing block 3 is not provided. Instead, a central partition 18 that horizontally divides the space in the processing block 3 is provided.

[0183] When viewed from the front in the first horizontal direction X from the carrier holding portion 25 side, the central partition 18 divides the space in the processing block 3 into left and right. The central partition 18 is a flat plate-shaped partition that extends along the first horizontal direction X and the vertical direction Z in the vicinity of the center of the processing block 3 with respect to the second horizontal direction Y (left-right direction). The central partition 18 forms a first processing block portion B1 disposed on one side thereof and a second processing block portion B2 disposed on the other side thereof. That is, the first processing block portion B1 and the second processing block portion B2 are disposed side by side with respect to each other. The plurality of processing units 11L-43U provided in the processing block 3 are divided into a first processing unit group G1 included in the first processing block portion B1 and a second processing unit group G2 included in the second processing block portion B2. Since the arrangement of the plurality of processing units 11L-43U is similar to that in the first embodiment, in FIG. 14, the same reference numerals as those in FIG. 1 are attached to the plurality of processing units 11L-43U. The first processing unit group G1 is composed of a plurality of processing units 11L, 12L, 13L, 11U, 12U, 13U; 21L, 22L, 23L, 21U, 22U, 23U that form the first tower T1 and the second tower T2. The second processing unit group G2 is composed of a plurality of processing units 31L, 32L, 33L, 31U, 32U, 33U; 41L, 42L, 43L, 41U, 42U, 43U that form the third tower T3 and the fourth tower T4.

[0184] Corresponding to the first processing unit group G1, a first main transfer robot 8A is provided on one side of the central partition wall 18. The first main transfer robot 8A operates within a first transfer space 53A partitioned between the central partition wall 18 and the first processing unit group G1. Thereby, the product substrate W and the dummy substrate DW are transferred through the first transfer space 53A. Similarly, corresponding to the second processing unit group G2, a second main transfer robot 8B is provided on the other side of the central partition wall 18. The second main transfer robot 8B operates within a second transfer space 53B partitioned between the central partition wall 18 and the second processing unit group G2. Thereby, the product substrate W and the dummy substrate DW are transferred through the second transfer space 53B. The configurations of the first main transfer robot 8A and the second main transfer robot 8B are substantially the same as those in the case of the second embodiment shown in FIG. 12, so the same reference numerals are assigned to the corresponding components and the description thereof is omitted. However, in this embodiment, the column 83 that guides the vertical movement is fixed to the central partition wall 18.

[0185] Furthermore, corresponding to the first processing unit group G1, a first substrate placement portion 6A is provided at an end adjacent to the index block 2 of the first transfer space 53A. Further, a first dummy substrate storage portion 7A is arranged above and / or below the first substrate placement portion 6A so as to partially or entirely overlap the first substrate placement portion 6A in plan view. Similarly, corresponding to the second processing unit group G2, a second substrate placement portion 6B is provided at an end adjacent to the index block 2 of the second transfer space 53B. Further, a second dummy substrate storage portion 7B is arranged above and / or below the second substrate placement portion 6B so as to partially or entirely overlap the second substrate placement portion 6B in plan view.

[0186] The first main transfer robot 8A can access a plurality of processing units constituting the first processing unit group G1, the first substrate placement unit 6A, and the first dummy substrate storage unit 7A. Thereby, the first main transfer robot 8A transfers the product substrate W between the plurality of processing units constituting the first processing unit group G1 and the first substrate placement unit 6A. Also, the first main transfer robot 8A transfers the dummy substrate DW among the plurality of processing units constituting the first processing unit group G1, the first substrate placement unit 6A, and the first dummy substrate storage unit 7A. In this embodiment, the first main transfer robot 8A cannot access any of the second processing unit group G2, the second substrate placement unit 6B, and the second dummy substrate storage unit 7B.

[0187] Similarly, the second main transfer robot 8B can access a plurality of processing units constituting the second processing unit group G2, the second substrate placement unit 6B, and the second dummy substrate storage unit 7B. Thereby, the second main transfer robot 8B transfers the product substrate W between the plurality of processing units constituting the second processing unit group G2 and the second substrate placement unit 6B. Also, the second main transfer robot 8B transfers the dummy substrate DW among the plurality of processing units constituting the second processing unit group G2, the second substrate placement unit 6B, and the second dummy substrate storage unit 7B. In this embodiment, the second main transfer robot 8B cannot access any of the first processing unit group G1, the first substrate placement unit 6A, and the first dummy substrate storage unit 7A.

[0188] The index robot 26 can access the carriers C, DC held by the carrier holding unit 25, the first substrate placement unit 6A, and the second substrate placement unit 6B, and transfers the product substrate W and the dummy substrate DW among them. In this embodiment, the index robot 26 cannot access any of the first dummy substrate storage unit 7A and the second dummy substrate storage unit 7B. Of course, the index robot 26 also cannot access the first processing unit group G1 and the second processing unit group G2.

[0189] This fourth embodiment is modified following the aforementioned second embodiment (see FIG. 12). Instead of the first substrate placement unit 6A and the second substrate placement unit 6B, an index robot 26, a first main transfer robot 8A, and a second main transfer robot 8B may be provided with a substrate placement unit that they can commonly access. For example, a notch may be provided at the end of the index block 2 side of the central partition wall 18 to arrange a substrate placement unit shared by the first processing unit group G1 and the second processing unit group G2.

[0190] Also, the fourth embodiment may be modified following the aforementioned third embodiment (see FIG. 13) such that the index robot 26 can access the first dummy substrate storage unit 7A and the second dummy substrate storage unit 7B. Thereby, the index robot 26 can carry in / out the dummy substrate DW to / from the first dummy substrate storage unit 7A and the second dummy substrate storage unit 7B without the involvement of the first main transfer robot 8A and the second main transfer robot 8B.

[0191] As described above, the four embodiments of this invention have been explained. However, this invention can also be implemented in other forms. For example, in the aforementioned first embodiment and the like, the configuration of the processing block 3 composed of stacking two layers of processing block layers BL and BU was shown. However, a processing block may be configured by stacking three or more layers of processing block layers. Also, in the aforementioned first embodiment and the like, an example of a processing unit arrangement in which each processing block layer BL and BU is stacked in three stages was shown. However, the processing units included in each processing block layer may be stacked in two stages, may be stacked in four or more stages, or all the processing units may be arranged in one stage. Further, in the aforementioned first embodiment and the like, an example in which the processing units 11L - 43U are arranged on both sides of the transfer paths 51L and 51U was shown. However, the processing units may be arranged on one side of the transfer paths 51L and 51U. Also, in the aforementioned first embodiment and the like, two processing units are arranged along the transfer paths 51L and 51U on one side of the transfer paths 51L and 51U. However, one processing unit may be arranged, or three or more processing units may be arranged.

[0192] Furthermore, in the above-described first embodiment and the like, the dummy substrate accommodating portions 7L and 7U of each processing block layer BL and BU are provided with the same number of dummy substrate slots DL1 - DL12 and DU1 - DU12 as the processing units 11L - 43L and 11U - 43U, and they correspond one-to-one to the processing units 11L - 43L and 11U - 43U. However, for example, the number of dummy substrate slots in each processing block layer BL and BU may be made less than the number of processing units, and one dummy substrate slot may be associated with a plurality of processing units.

[0193] Also, in the above-described embodiment, an example of a substrate processing apparatus having a configuration in which a plurality of processing units are divided into a plurality of processing unit groups has been shown. However, the present invention can also be applied to a substrate processing apparatus having a configuration in which a substrate W or a dummy substrate DW is conveyed by one main transfer robot for a plurality of processing units. Furthermore, the number of processing units may be 1.

[0194] In addition, various design changes can be made within the scope of the matters described in the claims.

Explanation of Reference Numerals

[0195] C Carrier DC Dummy Carrier W Substrate (Product Substrate) DW Dummy Substrate 1 Substrate Processing Apparatus 2 Indexer Block 25 Carrier Holding Portion 26 Indexer Robot 3 Processing Block BL First Processing Block Layer 11L - 13L Processing Unit 21L - 23L Processing Unit 31L - 33L Processing Unit 41L - 43L Processing Unit 6L Substrate Mounting Portion 7L Dummy Substrate Accommodating Portion DL1 - DL12 Dummy Substrate Slot 8L Main Transfer Robot 51L Conveyor Path 52L Conveyor Space BU Second Processing Block Layer 11U - 13U Processing Unit 21U - 23U Processing Unit 31U - 33U Processing Unit 41U - 43U Processing Unit 6U Substrate Placement Section 7U Dummy Substrate Storage Section DU1 - DU12 Dummy Substrate Slots 8U Main Conveyor Robot 51U Conveyor Path 52U Conveyor Space B1 First Processing Block Section B2 Second Processing Block Section G1 First Processing Unit Group G2 Second Processing Unit Group 8A First Main Conveyor Robot 8B Second Main Conveyor Robot 6 Substrate Placement Section 6A First Substrate Placement Section 6B Second Substrate Placement Section 7A First Dummy Substrate Storage Section 7B Second Dummy Substrate Storage Section 110 Controller 150 Host Computer 300 Carrier Conveyor Mechanism 351 Dummy Carrier Storage Area

Claims

1. a carrier holding portion that holds a carrier that houses a substrate or a dummy substrate; a processing unit for processing a substrate and performing a process using a dummy substrate; a dummy substrate accommodating portion for accommodating a dummy substrate; a substrate placement section on which a substrate is placed; a first transport unit that is accessible to the processing unit, the dummy substrate accommodation unit, and the substrate mounting unit, and that transports a substrate between the processing unit and the substrate mounting unit, and transports a dummy substrate between the processing unit, the dummy substrate accommodation unit, and the substrate mounting unit; a second transport unit that is accessible to the carrier holding unit and the substrate mounting unit and transports a substrate between the carrier holding unit and the substrate mounting unit; A substrate processing apparatus comprising:

2. a storage unit for storing usage history information of the dummy substrate accommodated in the dummy substrate accommodation unit; a usage expiration notification unit that notifies information about the expiration date of the dummy substrate accommodated in the dummy substrate accommodation unit based on the usage history information stored in the storage unit; a transport control unit that controls transport of a substrate or a dummy substrate by the first transport unit and the second transport unit; The substrate processing apparatus of claim 1 .

3. The substrate processing apparatus according to claim 2 , wherein the storage section stores at least one of information on the number of times the dummy substrate has been used, a usage time, and a wear state of the dummy substrate as the usage history information.

4. The substrate processing apparatus according to claim 2 , wherein the storage unit stores the usage history information and expiration date threshold information corresponding to the usage history information.

5. The substrate processing apparatus according to claim 4 , wherein the dummy substrate accommodation unit accommodates a plurality of dummy substrates, and the storage unit stores the usage history information and the expiration date threshold information for each dummy substrate.

6. The substrate processing apparatus according to claim 5 , further comprising a plurality of said processing units, a correspondence relationship between said plurality of dummy substrates and said plurality of processing units is determined in advance, and said storage unit stores information representing said correspondence relationship.

7. 7. The substrate processing apparatus according to claim 4, wherein the expiration date notification unit compares the usage history information with the expiration date threshold information, and notifies expiration date information of the dummy substrate based on a result of the comparison.

8. The substrate processing apparatus according to any one of claims 2 to 7, further comprising an alarm unit that notifies a user of expiration date information of the dummy substrate accommodated in the dummy substrate accommodating section based on usage history information stored in the memory section.

9. A substrate processing apparatus according to any one of claims 2 to 8, a carrier transport unit that transports a recovery dummy carrier for accommodating a used dummy substrate into the carrier holding unit; a host computer that receives notification of the expiration date information from the expiration date notification unit, plans a recovery dummy carrier transport for transporting the recovery dummy carrier to the carrier holding unit by the carrier transport unit based on the plan, causes the carrier transport unit to transport the recovery dummy carrier to the carrier holding unit, and commands the substrate processing apparatus to transport and recover a dummy substrate.

10. 10. The substrate processing system of claim 9, wherein the host computer obtains information regarding the recovery of dummy substrates to the recovery dummy carrier from the substrate processing apparatus, plans the removal of the recovery dummy carrier containing the used dummy substrate from the carrier holding portion by the carrier transport unit, and causes the carrier transport unit to remove the recovery dummy carrier from the carrier holding portion based on the plan.

11. a schedule creation unit that creates a transport schedule for the substrate or dummy substrate by the first transport unit and the second transport unit, the schedule creation unit creating a transport schedule for transporting the dummy substrate, for which the expiration date information has been notified, from the dummy substrate accommodation unit to the carrier holding unit and recovering the dummy substrate, 11. The substrate processing system according to claim 9, wherein the schedule creation unit further creates a transfer schedule for transferring a usable dummy substrate from the carrier holding unit to the dummy substrate accommodation unit.

12. the carrier transport unit operates to transport a supply dummy carrier housing a usable dummy substrate to the carrier holding unit; The substrate processing system according to any one of claims 9 to 11, wherein the host computer plans a supply dummy carrier transport for transporting a supply dummy carrier to the carrier holding section by the carrier transport unit, and based on the plan, causes the carrier transport unit to transport the supply dummy carrier to the carrier holding section, and instructs the substrate processing apparatus to supply and transport a usable dummy substrate.

13. 13. The substrate processing system of claim 12, wherein the host computer obtains information regarding the removal of the dummy substrate from the supply dummy carrier from the substrate processing apparatus, plans the removal of the supply dummy carrier from the carrier holding portion by the carrier transport unit, and causes the carrier transport unit to remove the supply dummy carrier from the carrier holding portion based on the plan.

14. The substrate processing system according to any one of claims 9 to 13, wherein the carrier transport unit transports a recovery dummy carrier or a supply dummy carrier between the carrier holding part and a dummy carrier storage area different from the carrier holding part.

15. transporting the substrate between the processing unit and the substrate mounting part by a first transport unit; processing the substrate transported by the first transport unit in the processing unit; transporting a dummy substrate between the processing unit and a dummy substrate accommodation unit by the first transport unit; performing a dummy process in the processing unit using a dummy substrate transported by the first transport unit; transporting a substrate between a carrier held by a carrier holding part and the substrate mounting part by a second transport unit; A method for processing a substrate, comprising:

16. a step of recording usage history information of the dummy substrate accommodated in the dummy substrate accommodating section; determining a usage period of the dummy substrate based on the usage history information; a recovery and transport step of transporting a dummy substrate that has reached its expiration date from the dummy substrate accommodation unit to the carrier holding unit and recovering the dummy substrate based on the determination of the expiration date; The method of claim 15 , comprising:

17. a supply dummy carrier carrying step of carrying a supply dummy substrate housing a usable dummy substrate into the carrier holding part by a carrier transport unit; 17. The substrate processing method according to claim 15, further comprising a supplying and transporting step of transporting a usable dummy substrate from the carrier holding part to the dummy substrate accommodation part.

18. 18. The substrate processing method according to claim 17, further comprising the step of unloading the supply dummy carrier from the carrier holding part by the carrier transport unit at a timing consistent with completion of unloading of the dummy substrate from the supply dummy carrier in the supply transport step.

19. a recovery dummy carrier carrying-in step of carrying a recovery dummy carrier for accommodating a used dummy substrate into the carrier holding section by a carrier transport unit; a recovery transport step of transporting a used dummy substrate from the dummy substrate accommodation section to the carrier holding section and loading the used dummy substrate into the recovery dummy carrier; The substrate processing method according to any one of claims 15 to 18, further comprising a step of transporting the recovery dummy carrier out of the carrier holding portion by the carrier transport unit at a timing consistent with completion of transporting the dummy substrate into the recovery dummy carrier in the recovery transport step.

20. A plurality of said processing units are provided, 20. The substrate processing method according to claim 15, wherein the dummy substrate accommodation section accommodates a plurality of dummy substrates having a predetermined correspondence with the plurality of processing units.

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