Temperature bath

Abstract

To provide a temperature bath capable of uniformizing temperature of an entire sample.SOLUTION: A temperature bath is provided, comprising a heat transfer member 10 having a bottom wall 20 and side walls 21 that are integrally structured, a recess 5 surrounded by the bottom wall 20 and the side walls 21, and a heat source member 11 for heating and / or cooling the heat transfer member 10.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an apparatus capable of placing a specimen in a desired temperature environment.

Background Art

[0002] In recent years, research on communication technology and computer control technology has been active. For example, electronic devices used in IoT (Internet of Things) and autonomous driving are being developed every day. These electronic devices may be used in various temperature environments. Therefore, it may be necessary to evaluate the temperature characteristics of the electronic devices themselves, as well as semiconductors, electronic components, materials, etc. that are these components, or to investigate the influence on the temperature environment. In addition, there may be cases where it is desired to know physical changes such as deformation and warping of substrates when exposed to high-temperature or low-temperature environments.

[0003] A heating and cooling test apparatus that can be used for this application is disclosed in Patent Document 1. The heating and cooling test apparatus disclosed in Patent Document 1 has a plate for placing a specimen attached to the upper surface of a Peltier module. The heating and cooling test apparatus disclosed in Patent Document 1 has a plate for placing a specimen in an exposed state and does not have a member covering the plate.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the heating and cooling test apparatus described in Patent Document 1, the temperature of the plate is controlled by the Peltier module on the back surface. The specimen is placed on the plate and receives heat conduction directly from the plate. In the heating and cooling test apparatus described in Patent Document 1, since the lower surface side of the specimen is in contact with the plate, it is adjusted to a desired temperature. However, the upper surface side of the specimen is strongly affected by the ambient air temperature and may be different from the temperature of the lower surface side.

[0006] The present invention focuses on the above points and aims to provide a temperature bath capable of making the temperature of the entire specimen uniform.

Means for Solving the Problem

[0007] An aspect for solving the above problem is a temperature bath characterized by having a heat transfer member with an integral structure of a bottom wall and a side wall, a recess formed by the bottom wall and the side wall, and a heat source member for heating and / or cooling the heat transfer member. An aspect for solving the above problem is a temperature bath having a bottom wall, a heat transfer member with an integral structure of the bottom wall and four side walls connected to the bottom side of the bottom wall, a recess formed by the bottom wall and the four side walls and having an upper surface that is open on the upper side of the side walls, a heat source member that contacts a surface of the bottom wall located on the side opposite to the recess and heats and / or cools the heat transfer member, and a lid member that can open and close the upper surface of the recess.

[0008] The temperature bath of this aspect has a recess, and a specimen is placed in the recess. In the temperature bath of this aspect, the recess is composed of a heat transfer member with an integral structure of a bottom wall and a side wall. The heat transfer member receives heating and cooling from the heat source member and has its surface temperature adjusted. Since the bottom wall and the side wall of the heat transfer member have an integral structure, the heat flow between the bottom wall and the side wall is smooth, and the temperatures of the bottom wall and the side wall are substantially equal. The specimen is also temperature-adjusted by the radiant heat from the side wall. However, in the temperature tank of this embodiment, since the temperatures of the bottom wall and the side wall are substantially equal, the temperature on the upper surface side of the specimen also becomes close to the temperature on the lower surface side. Since the space inside the recess is surrounded by the bottom wall and the side wall, the air temperature in the space becomes close to the temperature of the inner wall of the recess. Therefore, the specimen inside the recess is placed in an environment substantially the same as the installation surface (lower surface) for parts other than the installation surface, and the temperature of the entire specimen can be made uniform.

[0009] In the above-described embodiment, it is desirable that at least one of the side walls has a non-uniform thickness.

[0010] In each of the above-described embodiments, it is desirable that at least one of the side walls has a greater thickness in the bottom region than in any other region.

[0011] In the temperature tank of this embodiment, since the thickness of the bottom region of the side wall is relatively large, the heat flow between the bottom wall and the side wall is smooth, and the temperatures of the bottom wall and the side wall become substantially equal.

[0012] In each of the above-described embodiments, it is desirable that the plane cross-sectional area of at least one of the side walls is smaller on the upper side than on the bottom side.

[0013] In the temperature tank of this embodiment, since the plane cross-sectional area of the bottom region of the side wall is relatively large, the heat flow between the bottom wall and the side wall is smooth, and the temperatures of the bottom wall and the side wall become substantially equal.

[0014] In each of the above-described embodiments, it is desirable that there is a stepped portion on the inner surface of the recess.

[0015] According to this embodiment, the specimen can be placed hollow using the stepped portion.

[0016] In each of the above-described aspects, it is desirable to have a lid member capable of sealing the recess with the lid member, and for the lid member to have a window enabling observation of the interior of the recess from the outside.

[0017] The temperature chamber of this aspect has a lid member and can seal the recess with the lid member, so the interior of the recess is blocked from the outside and the influence of the outside air can be reduced. In addition, since there is a window, it is possible to observe the interior of the recess from the outside even when the recess is sealed. In each of the above-described aspects, it is desirable for the heat transfer member to have a seamless integral structure. In each of the above-described aspects, it is desirable for the lid member to be plate-shaped. In each of the above-described aspects, it is desirable for the lid member to be attached via a hinge. In each of the above-described aspects, it is desirable to have a main body box made of a heat insulating material, with a recess in the main body box and the heat transfer member disposed in the recess. In each of the above-described aspects, it is desirable to have a closing device for pulling the lid member toward the heat transfer member side and tightening it.

Advantages of the Invention

[0018] When the temperature chamber of the present invention is used, the temperature of the entire test specimen can be made relatively uniform.

Brief Description of the Drawings

[0019]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0020] Hereinafter, embodiments of the present invention will be described. The temperature tank 1 of the present embodiment is composed of a main body 2 and a lid member 3 as shown in Figs. 1 and 2. The main body 2 has a recess 5 with an open upper surface, and a specimen 100 (Fig. 5) is disposed in the recess 5. The main body 2 is formed by inserting a heat transfer member 10, a heat source member 11, and a heat sink 12 into a main body box 6 made of a heat insulating material. In the present embodiment, the above-described recess 5 is provided in the heat transfer member 10. The lid member 3 is attached to the main body 2 and opens and closes the upper surface of the recess 5. A window 15 is provided in the lid member 3. Hereinafter, each member will be described.

[0021] The heat transfer member 10 has an outer shape with a rectangular parallelepiped contour as shown in Figs. 2 and 3, and a recess 5 with an open upper surface is formed in the heat transfer member 10. The heat transfer member 10 has a bottom wall 20 and four side walls 21 surrounding the bottom wall 20 as shown in Figs. 2 and 3, and the recess 5 is surrounded by the bottom wall 20 and the four side walls 21. The heat transfer member 10 of the present embodiment has an integral structure of the bottom wall 20 and the four side walls 21.

[0022] The manufacturing method of the heat transfer member 10 is not limited, but in the present embodiment, it is made by cutting a metal block having excellent thermal conductivity such as aluminum or copper alloy. That is, a metal block is cut to form a rectangular parallelepiped outer shape, and a rectangular parallelepiped-shaped hole serving as the concave portion 5 is provided in the rectangular parallelepiped member. Therefore, the heat transfer member 10 has a seamless integral structure. As another manufacturing method of the heat transfer member 10, it is conceivable to separately mold the bottom wall 20 and the four side walls 21 and integrate them by welding or the like. Also, by bending or forging, the bottom wall 20 and the four side walls 21 can be formed into the heat transfer member 10 having an integral structure.

[0023] The heat transfer member 10 adopted in the present embodiment has a non-uniform thickness of the side wall 21. As shown in FIG. 2, the thickness is different between the lower region 25 on the bottom side and the upper region 26 on the opening side. Specifically, the lower region 25 of the heat transfer member 10 is thicker than the upper region 26. That is, in the side wall 21, the thickness of the wall in the bottom side region is thicker than any other region of the side wall 21.

[0024] The ratio of the thickness is not limited, but in the present embodiment, the thickness of the lower region 25 is the same as that of the bottom wall 20, and the upper region 26 is thinner than that. As shown in FIG. 4, the planar cross-sectional area of the side wall 21 is smaller on the upper side (see FIG. 4(a)) than on the bottom side (see FIG. 4(b)). In the present embodiment, the wall thickness of the lower region 25 of the side wall 21 is uniformly thick. Also, the wall thickness of the upper region 26 of the side wall 21 is uniformly thin. Therefore, at the boundary between the two, the inner surface forms a stepped portion 30. In the heat transfer member 10 of the present embodiment, the upper region 26 of the side wall 21 is cut more than the lower region 25, and the area of the inner surface in contact with the air in the concave portion 5 is large. That is, the heat transfer member 10 of the present embodiment has a larger inner surface area of the side wall 21 than that having a structure with a uniform side wall thickness.

[0025] In the present embodiment, a temperature sensor 22 is attached to the bottom wall 20 of the heat transfer member 10. The position of the temperature detection portion (not shown) of the temperature sensor 22 is near the center of the bottom wall 20.

[0026] The heat source member 11 is a Peltier member incorporating a Peltier element. The Peltier member has a Peltier element sandwiched between two metal plates. By energizing the Peltier element, one metal plate generates heat and its temperature rises, while the other metal plate absorbs heat and its temperature drops.

[0027] The heat sink 12 is a tank for storing a refrigerant such as water, and as shown in FIG. 3, it has a water inlet pipe 32 and a drain pipe 33.

[0028] The main body box 6 is a box made of a heat insulating material and constitutes the outer shell of the main body part 2. The main body box 6 is generally in the shape of a rectangular parallelepiped, and a recess 35 is provided in the central part. Also, openings 37 and 38 through which the water inlet pipe 32 and the drain pipe 33 of the heat sink 12 are inserted are provided on one side surface of the main body box 6. A hinge 40 is provided on one side edge at the upper part of the main body box 6, and an engaging part 41 is provided on the other side. A handle 27 is provided on the opposing wall surfaces of the main body box 6.

[0029] As shown in FIGS. 2 and 3, in the main body part 2, the heat transfer member 10 is arranged in the recess 35 of the main body box 6, and the heat sink 12 and the heat source member 11 are arranged between the inner bottom 42 of the main body box 6 and the bottom wall 20 of the heat transfer member 10. In this embodiment, one surface of the heat source member 11 is in direct contact with the bottom surface of the heat transfer member 10, and the heat sink 12 is in direct contact with the other surface of the heat source member 11.

[0030] The lid member 3 is a plate-shaped member having a lower surface that matches the upper surface of the main body part 2. A window 15 is provided on the lid member 3. The window 15 is formed by fitting glass plates 45 and 46 into a rectangular opening 43 that penetrates the inside and outside and is provided at the center of the lid member 3. Both of the glass plates 45 and 46 are quartz glasses with high heat resistance and high light transmittance. There is a gap 50 between the glass plates 45 and 46, and dry air is supplied into the gap 50 from a supply port (not shown). By supplying dry air into the gap 50 between the glass plates 45 and 46, clouding and condensation of the glass plates 45 and 46 can be prevented.

[0031] A handle 47 is provided on one side of the lid member 3. Also, two sets of toggle mechanism type closing devices 48 are provided on the same side. A packing 51 is provided on the lower surface of the lid member 3 as shown in FIG. 2.

[0032] The lid member 3 is attached to the main body 2 via a hinge 40 and can open and close the recess 5 of the main body 2. By opening the lid member 3, the recess 5 of the main body 2 is opened, and by closing the lid member 3, the recess 5 can be sealed. In this embodiment, since the packing 51 is provided on the lid member 3, the inside of the recess 5 becomes airtight by closing the lid member 3. When closing the lid member 3, the closing device 48 is engaged with the engaging portion 41 of the main body 2, and the closing device 48 is set in the posture shown in FIG. 1. As a result, the lid member 3 is pulled and tightened to the main body 2 by the toggle mechanism.

[0033] Next, the usage method and operation of the temperature chamber 1 of this embodiment will be described. The temperature chamber 1 of this embodiment can perform an environmental test on a specimen 100 such as an electronic component or a substrate. As a first step, the specimen 100 is placed in the recess 5. For example, as shown in FIG. 5(a), the specimen 100 is placed on the bottom wall 20 of the recess 5. The specimen 100 may be placed on the bottom wall 20 via a sheet 101 or paste having excellent heat conduction as shown in FIG. 5(a), or the specimen 100 may be placed directly on the bottom wall 20.

[0034] Then, the lid member 3 is closed to seal the recess 5, and the heat source member 11 is energized. A control device (not shown) monitors the detected temperature of the temperature sensor 22, and the energization amount of the heat source member 11 is PID controlled so that the detected temperature of the temperature sensor 22 becomes a desired temperature. The heat source member 11 is a Peltier member and can heat or cool the heat transfer member 10. As an example, it is energized in a direction in which the surface of the heat source member 11 on the side of the heat transfer member 10 becomes a low temperature state. In this case, cooling water is passed through the heat sink 12. When the heat source member 11 is energized to make the surface of the heat source member 11 on the side of the heat transfer member 10 a low temperature state, the temperature of the opposite surface rises, but this heat is taken away by the heat sink 12 and exhausted to the outside.

[0035] By energizing the heat source member 11, heat moves from the heat transfer member 10 to the heat source member 11. Although heat moves from the high temperature side to the low temperature side, for convenience of explanation, it is expressed that the cold heat moves from the heat source member 11 to the heat transfer member 10. According to this expression, by energizing the heat source member 11, the temperature of one surface of the heat source member 11 decreases, and the cold heat moves from the heat source member 11 to the heat transfer member 10.

[0036] The cold heat moves to the bottom wall 20 of the heat transfer member 10 with which the heat source member 11 is in contact, and spreads from the bottom wall 20 to the side wall 21. Here, the heat transfer member 10 adopted in the present embodiment has a structure in which the bottom wall 20 and the four side walls 21 are integrally formed without joints, so the heat flow between the bottom wall 20 and the four side walls 21 is smooth. In addition, the heat transfer member 10 adopted in the present embodiment has a thick connection portion between the side wall 21 and the bottom wall 20, and a large moving surface through which the cold heat passes. Therefore, the thermal resistance between the bottom wall 20 and the four side walls 21 is small, the heat flow between the bottom wall 20 and the four side walls 21 becomes smoother, and the temperature of the side wall 21 becomes approximately the same as the temperature of the bottom wall 20.

[0037] The specimen 100 is substantially in contact with the bottom wall 20 of the heat transfer member 10, and the lower surface of the specimen 100 substantially directly receives the cold heat from the bottom wall 20. On the one hand, since the temperature of the side wall 21 approximates the temperature of the bottom wall 20, the upper surface and the side surfaces of the specimen 100 are cooled by radiant heat. Further, since the temperature of the side wall 21 approximates the temperature of the bottom wall 20, the temperature of the space within the recess 5 approximates the temperature of the bottom wall 20, and the upper surface and the side surfaces of the specimen 100 are cooled. As a result, the temperatures of the upper and lower surfaces of the specimen 100 become close to each other.

[0038] In the embodiment described above, the specimen 100 is placed on the bottom wall 20 of the recess 5. However, as shown in FIG. 5(b), the specimen 100 can also be placed at a hollow position by utilizing the stepped portion 30. In the embodiment shown in FIG. 5(b), the net-shaped holding plate 102 is placed on the stepped portion 30, the holding plate 102 is held at a position separated from the bottom wall 20 in the height direction, and the specimen 100 is placed on the holding plate 102. As a result, the specimen 100 is held at the hollow position of the recess 5.

[0039] The heat transfer member 10 described above has a structure in which the wall thickness of the lower region 25 and the wall thickness of the upper region 26 are different with the stepped portion 30 as the boundary, and it has a two-stage structure with different thicknesses in the lower region 25 and the upper region 26. However, the wall thicknesses may differ in three or more stages.

[0040] In the heat transfer member 10 described above, the wall thickness of the lower region 25 of the side wall 21 is the same at any position and is uniformly thick, and the wall thickness of the upper region 26 of the side wall 21 is the same at any position and is uniformly thin. The present invention is not limited to this cross-sectional shape. For example, like the heat transfer member 60 shown in FIG. 6(a), the cross-sectional shape of the inner wall surface may be an inclined surface 65. The heat transfer member 60 of the present embodiment also has a non-uniform thickness of the side wall 21, and the lower region 25 is thicker than the upper region 26. That is, the bottom-side region of the side wall 21 has a wall thickness thicker than any other region of the side wall 21. The planar cross-sectional area of the side wall 21 is smaller on the upper side than on the bottom side.

[0041] Also, for example, like the heat transfer member 61 shown in FIG. 6(b), the cross-sectional shape of the inner wall surface may be a curved surface 66. The side wall 21 is thinnest in the intermediate region between the upper region and the lower region. The lower region of the side wall 21 is thicker than the intermediate region in terms of wall thickness. In the heat transfer member 61 of this embodiment as well, the thickness of the side wall 21 is non-uniform, and the lower region is thicker than the intermediate region where the wall thickness is the thinnest. That is, the bottom-side region of the side wall 21 has a thicker wall thickness than any other region. The planar cross-sectional area of the side wall 21 is smaller at the intermediate height compared to the bottom side. Furthermore, like the heat transfer member 62 shown in FIG. 6(c), protrusions 55 may be provided on the inner wall surface. In the heat transfer member 62 shown in FIG. 6(c), steps are formed on the inner surface by the protrusions 55.

[0042] Also, like the heat transfer member 63 shown in FIG. 7, longitudinal grooves 57 may be provided on the side wall 21. In the heat transfer member 63 of this embodiment, the side wall 21 is fin-shaped (wing-shaped) and has a large contact area with air, making it easy for the temperature of the space inside the recess 5 to approach the temperature of the inner wall of the heat transfer member 63.

[0043] In the embodiments described above, the cross-sectional shapes of the four side walls 21 are the same, but different shapes may be mixed. For example, the inner surface of any one of the side walls may be a straight vertical surface. That is, any one of the side walls may have a uniform thickness. Also, the thicknesses of all the side walls may be uniform.

[0044] In the above-described embodiments, the temperature sensor 22 is attached to the bottom wall 20 of the heat transfer member 10, but the attachment position of the temperature sensor 22 is arbitrary, and the temperature sensor 22 may be attached to the side wall 21. Also, a temperature sensor 22 may be attached to the specimen 100 and controlled so that the temperature of the specimen 100 reaches a desired temperature. As another example, a temperature sensor 22 may be installed inside the recess 5 and controlled so that the temperature of the internal space reaches a desired temperature.

[0045] In the embodiment described above, the lid member 3 is provided with the window 15, and the inside of the temperature chamber 1 can be visually observed. However, the presence or absence of the window 15 is arbitrary. The use of the temperature chamber 1 is not limited. Even when the temperature chamber 1 is used for environmental testing, the test method is arbitrary. For example, the temperature of the recess 5 may be kept constant to examine the change of the specimen 100. Also, like in a thermal cycle test, the temperature of the recess 5 may be repeatedly changed between a high temperature environment and a low temperature environment to examine the change of the specimen 100.

[0046] In the above-described embodiment, a Peltier member is used as the heat source member 11, but a refrigeration device or an electric heater can also be used instead of the Peltier member. However, since the refrigeration device is accompanied by vibration, it is recommended to adopt a Peltier member without vibration.

[0047] The temperature chamber 1 of the present embodiment can increase the rate of temperature change of the heat transfer member 10 etc. and the rate of temperature change of the internal air. In the temperature chamber 1 of the present embodiment, the uniformization of the surface temperature of the heat transfer member 10 is promoted, and the temperature of the internal air also becomes relatively uniform. Also, in the temperature chamber 1 described above, since the thickness of the upper side of the side wall 21 of the heat transfer member 10 etc. is thin, the heat capacity of the heat transfer member 10 etc. is relatively small. Therefore, the temperature change of the heat transfer member 10 is relatively fast. Also, the heat transfer member 10 etc. described above has a larger area of the inner surface in contact with the air in the recess 5 on the upper side than on the bottom side. Therefore, the heat transfer from the side wall 21 to the air in the recess 5 is promoted, and the temperature change of the air in the recess 5 becomes relatively fast. Also, the heat transfer member 10 etc. adopted in the temperature chamber 1 described above thickens the thickness of the lower part of the side wall 21 and secures the cross-sectional area of the connection region between the bottom wall 20 and the side wall 21. Therefore, the thermal resistance between the bottom wall 20 and the side wall 21 is small, and the heat transfer from the bottom wall 20 to the side wall 21 is not hindered. Therefore, the temperature change of the heat transfer member 10 etc. and the temperature change of the air in the recess 5 become relatively fast. Also, according to the above-described aspect, since the temperature of the heat transfer member 10 is made uniform, it is possible to prevent the temperature from becoming excessively high or excessively low in part, and the thickness of the heat insulating material can be reduced. Therefore, the outer shape of the entire apparatus can be made smaller. According to the structure including the step portion 30 and the protrusion 55, the specimen 100 can be held at a hollow height using the step portion 30 or the like. Also, a shelf for installing the specimen 100 can be provided using the step portion 30 or the like. Since the temperature chamber 1 described above has a large opening, it is possible to install a larger specimen 100.

Explanation of Reference Numerals

[0048] 1 Temperature chamber 2 Main body portion 3 Cover member 5 Recess 6 Main body box 10, 60, 61, 62, 63 Heat transfer member 11 Heat source member 12 Heat sink 15 Window 20 Bottom wall 21 Side wall 25 Lower region 26 Upper region 30 Step portion 100 Specimen

Claims

1. A heat transfer member having a bottom wall and four side walls that are connected to the bottom wall at the bottom side and have an integral structure; a recess surrounded by the bottom wall and the four side walls, the recess having an open upper surface on the upper side of the side walls; a heat source member that contacts a surface of the bottom wall that is located on the opposite side to the recessed portion and heats and / or cools the heat transfer member; A temperature chamber having a lid member capable of opening and closing the upper surface of the recess.

2. The temperature chamber according to claim 1 , wherein the heat transfer member is of a seamless integral structure.

3. The temperature chamber according to claim 1 or 2, wherein the cover member is plate-shaped.

4. 4. The temperature chamber according to claim 1, wherein the cover member is attached via a hinge.

5. 5. The temperature chamber according to claim 1, further comprising a main body box made of a heat insulating material, the main body box having a recess, and the heat transfer member being disposed in the recess.

6. 6. The temperature chamber according to claim 1, further comprising a closing device for pulling the lid member toward the heat transfer member and tightening it.

Images