Semiconductor manufacturing apparatus and manufacturing method of semiconductor device

Abstract

To provide a semiconductor manufacturing apparatus and a manufacturing method of a semiconductor device in which in-plane uniformity of processing for a wafer can be improved.SOLUTION: A semiconductor manufacturing apparatus according to an embodiment comprises: a processing tank that stores a processing liquid for processing a wafer and circulates the stored processing liquid; a first belt conveyor that is arranged to extend in a vertical direction within the processing tank; a second belt conveyor that is arranged to extend in a vertical direction within the processing tank; and a driving control unit that controls to perform opening / closing operation of the first belt conveyor and the second belt conveyor to support by sandwiching an end of the wafer, and controls to rotate and drive the first belt conveyor and the second belt conveyor.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] Embodiments of the present invention relate to a semiconductor manufacturing apparatus and a method for manufacturing a semiconductor device.

Background Art

[0002] Conventionally, there has been a semiconductor manufacturing apparatus that immerses a wafer in a processing liquid to perform cleaning and etching processes. In such a semiconductor manufacturing apparatus, the processing liquid is discharged from a jet pipe to circulate the processing liquid in the processing tank. For example, near the discharge port of the jet pipe, since the temperature of the processing liquid, the concentration and flow rate of the etchant are high, the etching rate increases. Therefore, a difference occurs in the processing amount (for example, the etching amount) above and below the wafer, resulting in a decrease in the in-plane uniformity of the processing on the wafer.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] One embodiment aims to provide a semiconductor manufacturing apparatus and a method for manufacturing a semiconductor device capable of improving the in-plane uniformity of processing on a wafer.

Means for Solving the Problems

[0005] A semiconductor manufacturing apparatus according to one embodiment includes a processing tank that stores a processing liquid for processing a wafer and circulates the stored processing liquid, a first belt conveyor disposed in the processing tank so as to extend in the vertical direction, a second belt conveyor disposed in the processing tank so as to extend in the vertical direction, A drive control unit that controls the first belt conveyor and the second belt conveyor to open and close so as to sandwich and support the end portion of the wafer, and controls the first belt conveyor and the second belt conveyor to rotate. The drive control unit With the end portion of the wafer immersed in the processing liquid stored in the processing tank sandwiched and supported by the first belt conveyor and the second belt conveyor, the first belt conveyor and the second belt conveyor are rotationally driven to rotate the wafer around an axis perpendicular to the surface of the wafer and move the wafer in the vertical direction.

Brief Description of the Drawings

[0006]

Figure 1

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Figure 9

[0007] Hereinafter, with reference to the accompanying drawings, a semiconductor manufacturing apparatus and a method for manufacturing a semiconductor device according to an embodiment will be described in detail. Note that the present invention is not limited by these embodiments.

[0008] (First Embodiment) Here, FIG. 1 is a configuration diagram of a semiconductor manufacturing apparatus 100 according to the first embodiment schematically showing an example of a state of processing a wafer. FIG. 2 is a top view schematically showing an example of a configuration focusing on a first region Q1 of the semiconductor manufacturing apparatus 100 shown in FIG. 1. FIG. 3 is a cross-sectional view schematically showing an example of a configuration focusing on a second region Q2 of the semiconductor manufacturing apparatus 100 shown in FIG. 1. FIG. 4A is a cross-sectional view schematically showing an example of a configuration focusing on a third region Q3 of the semiconductor manufacturing apparatus 100 shown in FIG. 1. FIG. 4B is a cross-sectional view schematically showing another example of a configuration focusing on the third region Q3 of the semiconductor manufacturing apparatus 100 shown in FIG. 1. FIG. 5 is a diagram schematically showing an example of a state of cleaning a wafer with a processing liquid in a processing tank in the semiconductor manufacturing apparatus 100 shown in FIG. 1.

[0009] For simplicity, in FIGS. 1 to 4, the processing liquid stored in the processing tank S of the semiconductor manufacturing apparatus 100 is not shown. Further, for simplicity, in FIG. 1, the auxiliary tank Sa, the jet pipe H, and the discharge part Sa of the processing tank S shown in FIG. 5 are omitted. Also, for simplicity, in FIG. 5, the first belt conveyor B1, the second belt conveyor B2, the drive control unit DX, and the lifter L shown in FIG. 1 are omitted. In addition, for convenience, the configuration may be omitted in each drawing.

[0010] Also, the configuration of the semiconductor manufacturing apparatus 100 according to this first embodiment is an example of the configuration of a batch-type apparatus for processing a plurality of wafers, but is not limited to this configuration. For example, it may be a single-wafer type apparatus.

[0011] [Semiconductor Manufacturing Apparatus] For example, as shown in FIGS. 1 to 5, the semiconductor manufacturing apparatus 100 includes a processing tank S, a first belt conveyor B1, a second belt conveyor B2, a drive control unit DX, and a lifter L.

[0012] This semiconductor manufacturing apparatus 100 uses a processing liquid, which is a chemical solution such as a cleaning liquid or an etching liquid, to perform a process such as an etching process or a cleaning process on the wafer W. In this case, the processing liquid is, for example, a chemical solution such as hydrofluoric acid, phosphoric acid, or a mixed acid containing metal.

[0013] [Processing Tank S] The processing tank S stores a processing liquid for processing the wafer W and circulates the stored processing liquid.

[0014] This processing tank S includes, for example, an auxiliary tank Sa, a jet pipe H, and a discharge part K, as shown in FIG. 5.

[0015] The discharge part K discharges, for example, as shown in FIG. 5, the processing liquid that has overflowed from the processing tank S to the auxiliary tank Sa toward the wafer W through the jet pipe H.

[0016] In particular, the discharge unit K discharges the processing liquid toward the wafer W such that the processing liquid circulates through the inside of the processing tank S while passing over the surface of the wafer W, with the end portion of the wafer W immersed in the processing liquid being supported by sandwiching between the first belt conveyor B1 and the second belt conveyor B2.

[0017] [First Belt Conveyor] Further, as shown in FIG. 1 for example, the first belt conveyor B1 is arranged to extend in the vertical direction (Z direction) inside the processing tank S.

[0018] The upper part of this first belt conveyor B1 is located above the upper part of the processing tank S. And the upper part of the first belt conveyor B1 is movable relative to the processing tank S in the lateral direction (for example, the X direction orthogonal to the Z direction). The lower part of the first belt conveyor B1 is fixed to the housing of the processing tank S.

[0019] Further, this first belt conveyor B1 includes, for example, a first belt BX having a groove Bm formed on the surface Ba for supporting the end portion of the wafer W in the lateral direction (X direction orthogonal to the Z direction), similar to the example of the second belt conveyor B2 shown in FIG. 2. This first belt BX1 is made of a material having flexibility, chemical resistance, and heat resistance such as polyvinyl alcohol (PVA), for example, according to the application.

[0020] Furthermore, as shown in FIG. 1 for example, this first belt conveyor B1 includes a first upper rotating shaft G11 and a first lower rotating shaft G21.

[0021] And the first upper rotating shaft G11 is located at the upper part of the first belt conveyor B1 and extends in the lateral direction (Y direction orthogonal to the X direction and the Z direction). Further, this first upper rotating shaft G11 is in contact with the first belt BX1 inside the first belt BX1.

[0022] Similar to the example of the second upper rotation axis G12 shown in FIG. 3, irregularities are formed on the surface of this first upper rotation axis G11, and the irregularities mesh with the irregularities formed on the inner surface of the first belt BX1.

[0023] When the first upper rotation axis G11 of this first belt conveyor B1 rotates, the first belt BX1 rotates, and the first belt conveyor B1 is rotationally driven.

[0024] Also, the first lower rotation axis G21 is located at the lower part of the first belt conveyor B1 and extends in the lateral direction (Y direction). Further, the first lower rotation axis G21 is in contact with the first belt BX1 inside the first belt BX1 and is fixed to the housing of the processing tank S.

[0025] [Second Belt Conveyor] Also, the second belt conveyor B2 is arranged, for example, as shown in FIG. 1, to extend in the vertical direction (Z direction in FIG. 1) within the processing tank S.

[0026] The upper part of this second belt conveyor B2 is located, for example, as shown in FIG. 1, above the upper part of the processing tank S. The upper part of the second belt conveyor B2 is movable relative to the processing tank S in the lateral direction (for example, the X direction in FIG. 1). The lower part of the second belt conveyor B2 is fixed to the housing of the processing tank S.

[0027] For example, as shown in FIG. 2, this second belt conveyor B2 includes a second belt BX2 in which a groove Bm for supporting the lateral (X direction in FIG. 2) end of the wafer W is formed on the surface BA. This second belt BX2 is made of a material having flexibility, chemical resistance, and heat resistance, such as polyvinyl alcohol (PVA), depending on the application.

[0028] Then, the above-described first belt conveyor B1 and second belt conveyor B2 are closed so as to sandwich and support the end portion of the wafer W. The wafer W is supported by the groove Bm of the first belt BX1 of the above-described first belt conveyor B1 and the groove Bm of the second belt BX2 of the second belt conveyor B2.

[0029] Further, as shown in FIG. 1 for example, the second belt conveyor B2 includes a second upper rotating shaft G12 and a second lower rotating shaft G22.

[0030] The second upper rotating shaft G12 is located at the upper part of the second belt conveyor B2 and extends in the Y direction. Further, the second upper rotating shaft G12 is in contact with the second belt BX2 inside the second belt BX2. In the example shown in FIG. 3, unevenness G12a is formed on the surface of the second upper rotating shaft G12, and the unevenness G12a meshes with the unevenness BX2a formed on the inner surface of the second belt BX2. Note that the unevenness inside the second belt BX2 shown in FIG. 3 may have another shape or may not be formed.

[0031] When the second upper rotating shaft G12 of the second belt conveyor B2 rotates, the second belt BX2 rotates, and the second belt conveyor B2 is rotationally driven.

[0032] Further, as shown in FIG. 1 for example, the second lower rotating shaft G22 is located at the lower part of the second belt conveyor B2 and extends in the lateral direction (Y direction). Further, the second lower rotating shaft G22 is in contact with the second belt BX2 inside the second belt BX2 and is fixed to the housing of the processing tank S.

[0033] Here, in the example shown in FIG. 4A, unevenness G22a is formed on the surface of the second lower rotating shaft G22, and the unevenness G22a meshes with the unevenness BX2a formed on the inner surface of the second belt BX2. In this case, the second lower rotating shaft G22 rotates about the Y direction in a state where the position is fixed to the housing of the processing tank S as the second belt BX2 rotates.

[0034] On the other hand, in the example shown in FIG. 4B, the surface of the second lower rotation axis G22 is not formed with irregularities. In this case, the second lower rotation axis G22 may not rotate or may rotate about the Y direction while being fixed in position to the housing of the processing tank S even when the second belt BX2 rotates.

[0035] Note that the first belt conveyor B1 and the second belt conveyor B2 may be provided with a fixing plate (not shown) for ensuring their rigidity inside. For example, this fixing plate may be made of a material such as fluororesin or quartz.

[0036] [Lifter] In addition, the lifter L moves the wafer W from above into the processing tank S and immerses it in the processing liquid in order to process the wafer W. On the other hand, the lifter L pulls up the processed wafer W upward from inside the processing tank S.

[0037] This lifter L includes a support portion LS that supports the wafer W from below, for example, when moving the wafer W in the vertical direction (Z direction).

[0038] [Drive control unit] The drive control unit DX is configured to open and close, for example, as shown in FIG. 1, the first belt conveyor B1 and the second belt conveyor B2 so as to support the wafer W with the ends of the wafer W sandwiched therebetween. Further, the drive control unit DX may control the operation of the lifter L together with the control of the operations of the first belt conveyor B1 and the second belt conveyor B2 as necessary.

[0039] As shown in FIG. 1, the drive control unit DX controls the opening and closing operations of the first belt conveyor B1 and the second belt conveyor B2 by moving the first upper rotation axis G11 and the second upper rotation axis G12 in the lateral direction.

[0040] For example, the drive control unit DX is configured to control from the closed state to the open state by driving the upper part of the first belt conveyor B1 and the upper part of the second belt conveyor B2 to move apart from each other.

[0041] On the other hand, the drive control unit DX is configured to control from the open state to the closed state by driving the upper part of the first belt conveyor B1 and the upper part of the second belt conveyor B2 to approach each other.

[0042] In particular, the drive control unit DX operates from the open state to the closed state so as to support the first belt conveyor B1 and the second belt conveyor B2 while sandwiching the end portion of the wafer W with the lifter L moving the wafer W into the processing tank S from above.

[0043] In this way, the drive control unit D controls, by this opening and closing operation, to a state where the end portion of the wafer W immersed in the processing liquid stored in the processing tank S is sandwiched and supported by the first belt conveyor B1 and the second belt conveyor B2. In particular, the drive control unit DX moves the upper part of the first belt conveyor B1 and the upper part of the second belt conveyor B2 so as to adjust the pressure for sandwiching and supporting the end portion of the wafer W by the first belt conveyor B1 and the second belt conveyor B2.

[0044] Furthermore, the drive control unit DX is configured to control to rotationally drive the first belt conveyor B1 and the second belt conveyor B2.

[0045] The drive control unit DX controls the rotational drive of the first belt conveyor B1 and the second belt conveyor B2 by rotating the first upper rotation shaft G11 and the second upper rotation shaft G12 shown in FIG. 1 to rotate the first belt BX1 and the second belt BX2.

[0046] Note that this drive control unit DX may include a motor (not shown) that rotates the first upper rotation shaft G11 and the second upper rotation shaft G12 to rotationally drive the first belt conveyor B1 and the second belt conveyor B2.

[0047] Incidentally, the drive control unit DX may reverse the rotation direction of the wafer W while sandwiching and supporting the edge of the wafer W immersed in the processing liquid between the first belt conveyor B1 and the second belt conveyor B2.

[0048] In this way, the drive control unit D rotates the first belt conveyor B1 and the second belt conveyor B2 while sandwiching and supporting the edge of the wafer W immersed in the processing liquid stored in the processing tank S between the first belt conveyor B1 and the second belt conveyor B2. In this manner, the drive control unit D rotates the wafer W about the direction (Y direction) perpendicular to the surface of the wafer W and moves the wafer W in the vertical direction (Z direction).

[0049] Here, as described above, in the semiconductor manufacturing apparatus 100 according to the first embodiment, the processing liquid is discharged from the jet pipe to circulate the processing liquid in the processing tank. For example, near the discharge portion K of the jet pipe H, since the temperature of the processing liquid, the concentration and flow rate of the etchant are high, the etching rate will increase.

[0050] However, this semiconductor manufacturing apparatus 100 rotates the first belt conveyor B1 and the second belt conveyor B2 while sandwiching and supporting the edge of the wafer W immersed in the processing liquid stored in the processing tank S between the first belt conveyor B1 and the second belt conveyor B2, thereby rotating the wafer W about the direction (Y direction) perpendicular to the surface of the wafer W and moving the wafer W in the vertical direction (Z direction).

[0051] Thereby, since the rotation direction of the wafer W can be controlled during processing, the wafer W can be lowered, raised, and rotated during processing. Therefore, since the position where the processing liquid hits the wafer W is dispersed, the difference in the in-plane processing amount (for example, etching amount) in the vertical and horizontal directions of the wafer W becomes smaller.

[0052] That is, the semiconductor manufacturing apparatus 100 according to the first embodiment can improve the in-plane uniformity of the processing on the wafer W.

[0053] [Method for manufacturing a semiconductor device] Next, as described above, with reference to FIGS. 6A to 9, an example of a method for manufacturing a semiconductor device using the semiconductor manufacturing apparatus 100 according to the first embodiment will be described. FIGS. 6A to 9 are explanatory diagrams showing an example of a manufacturing process of a semiconductor device by the semiconductor manufacturing apparatus 100 according to the first embodiment shown in FIG. 1.

[0054] Note that in FIGS. 6A to 9, for simplicity, the drive control unit DX is omitted, and the configurations of the first and second belt conveyors B1 and B2 are simplified and shown.

[0055] First, as shown in FIG. 6A, for example, the wafer W is delivered to the lifter L so that the wafer W processed in the previous process is supported by the support portion LS of the lifter L.

[0056] Next, as shown in FIG. 6B, the drive control unit DX lowers the lifter L and rotationally drives the first and second belt conveyors in accordance with the operation of the lifter L. If necessary, the drive control unit DX operates the first belt conveyor B1 and the second belt conveyor B2 in an open state at the end of the wafer W so that the wafer W can be moved from the lifter L between the first and second belt conveyors B1 and B2 in the processing tank S.

[0057] Thereafter, the drive control unit DX operates the first belt conveyor B1 and the second belt conveyor B2 from the open state to the closed state so as to sandwich and support the end of the wafer W in a state where the wafer W is moved into the processing tank S from above by the lifter L.

[0058] Next, as shown in FIG. 7A, the drive control unit DX rotationally drives the first and second belt conveyors B1 and B2 so as to slightly lift the wafer W from the lifter L. Alternatively, with the wafer W supported by the first and second belt conveyors B1 and B2, the drive control unit DX may further lower the lifter L so as to slightly lift the wafer W from the lifter L.

[0059] As a result, the wafer W is separated from the lifter L and is supported by the first and second belt conveyors B1 and B2.

[0060] Next, as shown in FIG. 7B, the drive control unit D rotationally drives the first belt conveyor B1 and the second belt conveyor B2 while sandwiching and supporting the end portion of the wafer W immersed in the processing liquid stored in the processing tank S by the first belt conveyor B1 and the second belt conveyor B2, thereby rotating the wafer W about the direction (Y direction) perpendicular to the surface of the wafer W and moving the wafer W in the vertical direction (Z direction) (oscillating up and down).

[0061] As described above, the drive control unit DX may reverse the rotation direction of the wafer W while sandwiching and supporting the end portion of the wafer W immersed in the processing liquid by the first belt conveyor B1 and the second belt conveyor B2.

[0062] As a result, the positions where the processing liquid hits the wafer W are dispersed, so that the difference in the in-plane processing amount (for example, etching amount) in the vertical and horizontal directions of the wafer W is reduced.

[0063] Next, as shown in FIG. 8A, the drive control unit DX rotationally drives the first and second belt conveyors B1 and B2 so as to load the wafer W onto the lifter L. Alternatively, the drive control unit DX may further raise the lifter L with the wafer W supported by the first and second belt conveyors B1 and B2 so as to load the wafer W onto the lifter L. As a result, the wafer W is loaded onto the lifter L.

[0064] Next, as shown in FIG. 8B, the drive control unit DX raises the lifter L and rotationally drives the first and second belt conveyors in accordance with the rise of the wafer W due to the rise of the lifter L. If necessary, the drive control unit DX operates the first belt conveyor B1 and the second belt conveyor B2 from a closed state in which the end portions of the wafer W are sandwiched and supported to an open state so that the processed wafer W can be pulled upward from the processing tank S by the lifter L.

[0065] Next, as shown in FIG. 9, the drive control unit DX further raises the lifter L with the wafer W supported by the support portion LS of the lifter L. Then, the processed wafer W will be delivered from the lifter L to the next process.

[0066] Thus, in the method of manufacturing a semiconductor device using the semiconductor manufacturing apparatus 100 according to the first embodiment, the end portions of the wafer W immersed in the processing liquid stored in the processing tank S are sandwiched and supported by the first belt conveyor B1 and the second belt conveyor B2, and the first belt conveyor B1 and the second belt conveyor B2 are rotationally driven. In this way, the wafer W is rotated about the direction (Y direction) perpendicular to the surface of the wafer W and the wafer W is moved in the vertical direction (Z direction).

[0067] As a result, the positions where the processing liquid hits the wafer W are dispersed, so that the difference in the in-plane processing amount (for example, etching amount) in the vertical and horizontal directions of the wafer W becomes small.

[0068] As described above, according to the method of manufacturing a semiconductor device using the semiconductor manufacturing apparatus according to the present embodiment, the in-plane uniformity of the processing on the wafer W can be improved.

[0069] Although some embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalent scope thereof.

Explanation of Reference Numerals

[0070] 100 Semiconductor manufacturing apparatus S Processing tank B1 First belt conveyor B2 Second belt conveyor DX Drive control unit L Lifter

Claims

1. A processing tank for storing a processing liquid for processing a wafer and circulating the stored processing liquid; A first belt conveyor disposed to extend in the vertical direction in the processing tank; A second belt conveyor disposed to extend in the vertical direction in the processing tank; A drive control unit that opens and closes the first belt conveyor and the second belt conveyor so as to sandwich and support an end portion of the wafer, and controls to rotationally drive the first belt conveyor and the second belt conveyor; The drive control unit: While sandwiching and supporting an end portion of the wafer immersed in the processing liquid stored in the processing tank by the first belt conveyor and the second belt conveyor, by rotationally driving the first belt conveyor and the second belt conveyor, the wafer is rotated about an axis perpendicular to the surface of the wafer and the wafer is moved in the vertical direction; A semiconductor manufacturing apparatus characterized by the above.

2. The drive control unit moves the upper part of the first belt conveyor and the upper part of the second belt conveyor so as to adjust the pressure for sandwiching and supporting an end portion of the wafer by the first belt conveyor and the second belt conveyor. The semiconductor manufacturing apparatus according to claim 1, characterized by the above.

3. The drive control unit: Controls from a closed state to an open state by driving so that the upper part of the first belt conveyor and the upper part of the second belt conveyor are separated; On the other hand, controls from an open state to a closed state by driving so that the upper part of the first belt conveyor and the upper part of the second belt conveyor approach each other. The semiconductor manufacturing apparatus according to claim 1, characterized by the above.

4. To process the wafer, a lifter is further provided to move the wafer into the processing tank from above and immerse it in the processing liquid, and to lift the processed wafer upward from the processing tank. In a state where the wafer is moved into the processing tank from above by the lifter, the drive control unit operates the first belt conveyor and the second belt conveyor from an open state to a closed state so as to sandwich and support the end portion of the wafer. The drive control unit operates from a closed state in which the end portion of the wafer is sandwiched and supported by the first belt conveyor and the second belt conveyor to an open state, and causes the lifter to lift the processed wafer upward from the processing tank. The semiconductor manufacturing apparatus according to claim 1, characterized in that.

5. The processing tank is provided with a discharge unit that discharges the processing liquid overflowing from the processing tank toward the wafer so that the processing liquid circulates through the surface of the wafer in the processing tank while the end portion of the wafer immersed in the processing liquid is sandwiched and supported by the first belt conveyor and the second belt conveyor. The semiconductor manufacturing apparatus, characterized in that.

6. A semiconductor device manufacturing method using a semiconductor manufacturing apparatus including a processing tank for storing a processing liquid for processing a wafer and circulating the stored processing liquid, a first belt conveyor disposed in the processing tank so as to extend in the vertical direction, a second belt conveyor disposed in the processing tank so as to extend in the vertical direction, and a drive control unit that controls the opening and closing operations of the first belt conveyor and the second belt conveyor so as to sandwich and support the end portion of the wafer and rotationally drive the first belt conveyor and the second belt conveyor. The driving control unit rotates the first belt conveyor and the second belt conveyor while sandwiching and supporting an end portion of the wafer immersed in the processing liquid stored in the processing tank by the first belt conveyor and the second belt conveyor, thereby rotating the wafer about an axis perpendicular to the surface of the wafer and moving the wafer in the vertical direction. A method of manufacturing a semiconductor device, characterized by the above.

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