De-icing system

Abstract

To provide a system for heating an outer surface of a bulk medium.SOLUTION: A system includes two or more joining strips attached to a bulk medium at intervals from each other. Each of the joining strips has a multilayer structure extending along a surface of the bulk medium and forms a power transmission line in conjunction with the bulk medium. The multilayer structure includes a first dielectric layer on the bulk medium, a conductive layer on the first dielectric layer, a second dielectric layer on the conductive layer, and a conductive shield layer on the second dielectric layer. A power control system is joined to the conductive layer of each joining strip and the bulk medium. The power control system is configured to heat the bulk medium by supplying current to the joining strip.SELECTED DRAWING: Figure 19

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of U.S. patent application Ser. No. 62 / 723,270, filed Aug. 27, 2018. No. 6,396,633, filed on Oct. 23, 2003, the contents of which are incorporated herein by reference in their entirety.

[0002] The present invention relates to a system for heating an electrically conductive material. [Background technology]

[0003] Many conductive surfaces, such as those in cars, aircraft, and satellites, encounter cold or icy conditions during daily use. The accumulation of ice or water on the conductive surfaces of these structures can lead to inefficient or even dangerous operating conditions. For example, ice buildup on an aircraft's wings can reduce lift and cause resistance. The force may increase.

[0004] Many of these structures either lack heating systems or are fitted with bulky electronics and other equipment. The use of such bulky devices is prohibited in the industry. This is becoming a challenge for Summary of the Invention

[0005] The present invention discloses techniques for heating conductive surfaces. These techniques are generally A high-frequency alternating current ("AC") signal (e.g., 1 kHz or greater) is used to transmit a signal through a conductive bulk medium ( Shape the current density in a target area of ​​a conductive material (e.g., conductive material) to induce Joule heating in the medium .

[0006] Joule heating, also known as ohmic heating or resistive heating, is the generation of heat by passing an electric current through a conductor. The amount of heat generated by a conductive medium is a function of the amount of current passing through it. Based on the quantity and the electrical resistance of the medium. As a result, heating can be controlled (e.g., increased or decreased) by adjusting the current, voltage, resistance, or combinations thereof.

[0007] The resistance of a given conductor can be increased by restricting the volume within the conductor through which current can flow and increasing the length through which current flows. Embodiments of the present invention can be configured to generate heat within a bulk medium, for example, by manipulating the mechanism that shapes (e.g., contracts, extends, etc.) the current within a conductive medium (e.g., a bulk medium, a conductor) using, for example, the skin effect and the proximity effect. Both effects rely on passing a high-frequency AC current through the conductive medium to be heated. The skin effect utilizes the tendency for alternating current to be distributed within a conductor such that the current density increases near the surface of the conductor and decreases deeper within the conductor, thereby suppressing the flow of current. Using the proximity effect, the current flowing through a conductor can be further suppressed by placing another AC current path near the existing current flowing through the conductor. The proximity effect also has the function of lengthening the current path.

[0008] For example, embodiments of the present invention are configured to increase the resistance of the bulk medium along the current path through the bulk medium by suppressing the flow of current along the current path. As a result, this embodiment provides increased heating performance to the conductive medium while reducing the current required to generate heat. That is, by increasing the effective resistance of the conductive medium along a specific current path, the current required to generate Joule heat within the medium can be made less than would otherwise be the case.

[0009] Generally, in a first aspect, a system for heating a bulk medium includes two or more electrodes spaced apart from each other and coupled to the bulk medium, and a power control system coupled to the electrodes. The power control system is configured to generate an effective resistance of the bulk medium along a current path between the electrodes by shaping the density of the current within the bulk medium. In this aspect, the power control system shapes the density of the current within the depth of the bulk medium by adjusting the skin depth of the current along the current path and shapes the density of the current in a direction transverse to the current path by adjusting the proximity effect of the current.

[0010] A second general aspect can be embodied in a system for heating a bulk medium that includes two or more electrodes spaced apart from each other and coupled to the bulk medium, and a power control system coupled to the electrodes. The power control system is configured to heat the bulk medium by shaping the density of the current along a current path between the electrodes, thereby generating an effective resistance greater than the direct current (DC) resistance of the bulk medium along the current path within the bulk medium. In this aspect, the power control system shapes the density of the current within the depth of the bulk medium by adjusting the skin depth of the current and shapes the density of the current in a direction transverse to the current path by adjusting the proximity effect of the current.

[0011] A third general aspect can be embodied in a system that includes two or more electrodes configured to be coupled to a bulk medium and a power control system coupled to the electrodes. The power control system shapes the density of the current along a current path through the bulk medium between the electrodes, whereby ​​​​​​​​​​​​​​​generate an effective resistance along the current path that is greater than the resistance of the bulk medium to DC current configured to heat the bulk medium thereby. In this aspect, the power control system shapes the density of the current within the depth of the bulk medium by adjusting the skin depth of the current, and also shapes the current density in a direction across part of the current path by adjusting the proximity effect of the current .

[0012] A fourth general aspect can be embodied in a system including two or more electrodes spaced apart from each other and coupled to a bulk medium, and a power control system coupled to the electrodes . The power control system is configured to generate an AC current signal along a current path through the bulk medium between the electrodes at a frequency greater than 1 kHz and less than 300 GHz, and to generate a second current path located along the current path through the bulk medium, proximate to the surface of the bulk medium . .

[0013] A fifth general aspect can be embodied in a heating system including two or more electrodes spaced apart from each other and coupled to a bulk medium, a power control system coupled to the electrodes and configured to generate an AC current signal along a current path through the bulk medium to heat the bulk medium, an impedance tuning network (IAN) coupled between the heating control system and the electrodes and configured to tune the impedance of the heating control system to correspond to the impedance of the bulk medium , and .

[0014] A sixth general aspect can be embodied in a heating system including two or more electrodes coupled to a bulk medium and spaced apart from each other. Each of the two or more electrodes is at least ​​​​​​Including a material with conductivity comparable to that of the bulk medium, reducing the contact resistance between the electrode and the bulk medium A power control system coupled to the bulk medium by a method and configured to couple to an electrode shapes the density of current along the current path between the electrodes, thereby generating an effective resistance greater than the resistance of the bulk medium to direct current (DC) along the current path in the bulk medium to heat the bulk medium. The heating system in this embodiment shapes the density of the current by adjusting the skin depth of the current along the current path. along the current path between the electrodes, thereby generating an effective resistance greater than the resistance of the bulk medium to direct current (DC) along the current path in the bulk medium to heat the bulk medium. along the current path in the bulk medium to heat the bulk medium. The heating system in this embodiment shapes the density of the current by adjusting the skin depth of the current along the current path. The heating system in this embodiment shapes the density of the current by adjusting the skin depth of the current along the current path.

[0015] A seventh general aspect can be embodied in a de-icing system for an aircraft that includes two or more electrodes spaced apart from each other and coupled to a part of the aircraft. The power control system is configured to heat the bulk medium by shaping the density of the current along the current path through the bulk medium between the electrodes, generating an AC current signal at a frequency of 1 MHz to 50 MHz along the current path through a part of the aircraft between the electrodes. By this frequency, the skin depth of the current along the current path is adjusted to shape the density of the current in a first direction, and at least a part of the current path through a part of the aircraft provides a second current path located within 10 cm of the surface of a part of the aircraft. By adjusting the proximity effect of the current along a part of the current path due to the proximity of the second current path to the surface of a part of the aircraft, the density of the current is shaped in a second different direction. A seventh general aspect can be embodied in a de-icing system for an aircraft that includes two or more electrodes spaced apart from each other and coupled to a part of the aircraft. The power control system is configured to heat the bulk medium by shaping the density of the current along the current path through the bulk medium between the electrodes, generating an AC current signal at a frequency of 1 MHz to 50 MHz along the current path through a part of the aircraft between the electrodes. By this frequency, the skin depth of the current along the current path is adjusted to shape the density of the current in a first direction, and at least a part of the current path through a part of the aircraft provides a second current path located within 10 cm of the surface of a part of the aircraft. By adjusting the proximity effect of the current along a part of the current path due to the proximity of the second current path to the surface of a part of the aircraft, the density of the current is shaped in a second different direction. A seventh general aspect can be embodied in a de-icing system for an aircraft that includes two or more electrodes spaced apart from each other and coupled to a part of the aircraft. The power control system is configured to heat the bulk medium by shaping the density of the current along the current path through the bulk medium between the electrodes, generating an AC current signal at a frequency of 1 MHz to 50 MHz along the current path through a part of the aircraft between the electrodes. By this frequency, the skin depth of the current along the current path is adjusted to shape the density of the current in a first direction, and at least a part of the current path through a part of the aircraft provides a second current path located within 10 cm of the surface of a part of the aircraft. By adjusting the proximity effect of the current along a part of the current path due to the proximity of the second current path to the surface of a part of the aircraft, the density of the current is shaped in a second different direction. A seventh general aspect can be embodied in a de-icing system for an aircraft that includes two or more electrodes spaced apart from each other and coupled to a part of the aircraft. The power control system is configured to heat the bulk medium by shaping the density of the current along the current path through the bulk medium between the electrodes, generating an AC current signal at a frequency of 1 MHz to 50 MHz along the current path through a part of the aircraft between the electrodes. By this frequency, the skin depth of the current along the current path is adjusted to shape the density of the current in a first direction, and at least a part of the current path through a part of the aircraft provides a second current path located within 10 cm of the surface of a part of the aircraft. By adjusting the proximity effect of the current along a part of the current path due to the proximity of the second current path to the surface of a part of the aircraft, the density of the current is shaped in a second different direction. A seventh general aspect can be embodied in a de-icing system for an aircraft that includes two or more electrodes spaced apart from each other and coupled to a part of the aircraft. The power control system is configured to heat the bulk medium by shaping the density of the current along the current path through the bulk medium between the electrodes, generating an AC current signal at a frequency of 1 MHz to 50 MHz along the current path through a part of the aircraft between the electrodes. By this frequency, the skin depth of the current along the current path is adjusted to shape the density of the current in a first direction, and at least a part of the current path through a part of the aircraft provides a second current path located within 10 cm of the surface of a part of the aircraft. By adjusting the proximity effect of the current along a part of the current path due to the proximity of the second current path to the surface of a part of the aircraft, the density of the current is shaped in a second different direction. A seventh general aspect can be embodied in a de-icing system for an aircraft that includes two or more electrodes spaced apart from each other and coupled to a part of the aircraft. The power control system is configured to heat the bulk medium by shaping the density of the current along the current path through the bulk medium between the electrodes, generating an AC current signal at a frequency of 1 MHz to 50 MHz along the current path through a part of the aircraft between the electrodes. By this frequency, the skin depth of the current along the current path is adjusted to shape the density of the current in a first direction, and at least a part of the current path through a part of the aircraft provides a second current path located within 10 cm of the surface of a part of the aircraft. By adjusting the proximity effect of the current along a part of the current path due to the proximity of the second current path to the surface of a part of the aircraft, the density of the current is shaped in a second different direction. A seventh general aspect can be embodied in a de-icing system for an aircraft that includes two or more electrodes spaced apart from each other and coupled to a part of the aircraft. The power control system is configured to heat the bulk medium by shaping the density of the current along the current path through the bulk medium between the electrodes, generating an AC current signal at a frequency of 1 MHz to 50 MHz along the current path through a part of the aircraft between the electrodes. By this frequency, the skin depth of the current along the current path is adjusted to shape the density of the current in a first direction, and at least a part of the current path through a part of the aircraft provides a second current path located within 10 cm of the surface of a part of the aircraft. By adjusting the proximity effect of the current along a part of the current path due to the proximity of the second current path to the surface of a part of the aircraft, the density of the current is shaped in a second different direction. A seventh general aspect can be embodied in a de-icing system for an aircraft that includes two or more electrodes spaced apart from each other and coupled to a part of the aircraft. The power control system is configured to heat the bulk medium by shaping the density of the current along the current path through the bulk medium between the electrodes, generating an AC current signal at a frequency of 1 MHz to 50 MHz along the current path through a part of the aircraft between the electrodes. By this frequency, the skin depth of the current along the current path is adjusted to shape the density of the current in a first direction, and at least a part of the current path through a part of the aircraft provides a second current path located within 10 cm of the surface of a part of the aircraft. By adjusting the proximity effect of the current along a part of the current path due to the proximity of the second current path to the surface of a part of the aircraft, the density of the current is shaped in a second different direction. A seventh general aspect can be embodied in a de-icing system for an aircraft that includes two or more electrodes spaced apart from each other and coupled to a part of the aircraft. The power control system is configured to heat the bulk medium by shaping the density of the current along the current path through the bulk medium between the electrodes, generating an AC current signal at a frequency of 1 MHz to 50 MHz along the current path through a part of the aircraft between the electrodes. By this frequency, the skin depth of the current along the current path is adjusted to shape the density of the current in a first direction, and at least a part of the current path through a part of the aircraft provides a second current path located within 10 cm of the surface of a part of the aircraft. By adjusting the proximity effect of the current along a part of the current path due to the proximity of the second current path to the surface of a part of the aircraft, the density of the current is shaped in a second different direction. A seventh general aspect can be embodied in a de-icing system for an aircraft that includes two or more electrodes spaced apart from each other and coupled to a part of the aircraft. The power control system is configured to heat the bulk medium by shaping the density of the current along the current path through the bulk medium between the electrodes, generating an AC current signal at a frequency of 1 MHz to 50 MHz along the current path through a part of the aircraft between the electrodes. By this frequency, the skin depth of the current along the current path is adjusted to shape the density of the current in a first direction, and at least a part of the current path through a part of the aircraft provides a second current path located within 10 cm of the surface of a part of the aircraft. By adjusting the proximity effect of the current along a part of the current path due to the proximity of the second current path to the surface of a part of the aircraft, the density of the current is shaped in a second different direction.

[0016] An eighth general aspect can be embodied in a system for heating the outer surface of a bulk medium. This system includes electrodes spaced apart from each other and attached to the bulk medium. It includes two or more coupling strips. Each coupling strip has a multilayer structure extending along the surface of the bulk medium and forms a transmission line in combination with the bulk medium. The multilayer structure includes a first dielectric layer on the bulk medium, a conductive layer on the first dielectric layer, a second dielectric layer on the conductive layer, and a conductive shielding layer on the second dielectric layer. The power control system is coupled to the conductive layer of each coupling strip and the bulk medium. The power control system is configured to heat the surface of the bulk medium by supplying current to the coupling strip. In various embodiments, the bulk medium can be the outer skin of an aircraft, the blade of a wind turbine, the roof of a building, or a transmission line. The ninth general aspect can be embodied in a system for heating the outer surface of a structure made of a non-conductive material. This structure includes a bulk conductive material embedded therein. This system includes two or more coupling strips spaced apart from each other and attached to the structure. Each coupling strip has a multilayer structure extending along the structure and forms a transmission line in combination with the bulk conductive material embedded in the structure. The multilayer structure includes a conductive layer covering the bulk conductive material and a first dielectric layer between the bulk conductive material and the first conductive layer. The power control system is coupled to the conductive layer of each coupling strip and the structure. The power control system is configured to heat the surface of the structure by supplying current to the coupling strip. In various embodiments, the structure can be the outer skin of an aircraft, the blade of a wind turbine, the roof of a building, or a transmission line.

[0017]

[0018] ​​​​​​​​​​​​​​The tenth general aspect can be embodied in a method of installing a bulk media heating system. This method includes the step of obtaining coupling strips, each coupling strip including a multilayer structure including a first dielectric layer, a conductive layer covering the first dielectric layer, a conductive shield layer covering the conductive layer, and a second dielectric layer between the conductive layer and the conductive shield layer. This method includes the steps of spacing each coupling strip apart on the surface of the bulk media and positioning the first dielectric layer of each coupling strip between the bulk media and the conductive layer. This method includes the step of coupling the conductive layer of each coupling strip to a power control system configured to supply current to the coupling strip. In various embodiments, the bulk media includes the outer skin of an aircraft, the blade of a wind turbine, the roof of a building, or a transmission line. The subject matter described herein can be implemented to realize one or more of the following advantages. A lighter and smaller electrical system can be used to heat the conductor. Further, the heating can be localized to the target area, and overheating of the heating system circuit does not occur. Instead of generating heat with a heating element or heating layer attached to the bulk media, for example, the present heating system can be more efficient by directly generating heat in the bulk media itself (e.g., an aircraft wing). The present system may also require less current and voltage for heating, and there is a possibility of improved safety and reliability. In some embodiments, the stress on the components can also be reduced. The present system can be simpler, faster, or less expensive to install or modify. The present system can be less expensive and also require less maintenance. The tenth general aspect can be embodied in a method of installing a bulk media heating system. This method includes the step of obtaining coupling strips, each coupling strip including a multilayer structure including a first dielectric layer, a conductive layer covering the first dielectric layer, a conductive shield layer covering the conductive layer, and a second dielectric layer between the conductive layer and the conductive shield layer. This method includes the steps of spacing each coupling strip apart on the surface of the bulk media and positioning the first dielectric layer of each coupling strip between the bulk media and the conductive layer. This method includes the step of coupling the conductive layer of each coupling strip to a power control system configured to supply current to the coupling strip. In various embodiments, the bulk media includes the outer skin of an aircraft, the blade of a wind turbine, the roof of a building, or a transmission line. The tenth general aspect can be embodied in a method of installing a bulk media heating system. This method includes the step of obtaining coupling strips, each coupling strip including a multilayer structure including a first dielectric layer, a conductive layer covering the first dielectric layer, a conductive shield layer covering the conductive layer, and a second dielectric layer between the conductive layer and the conductive shield layer. This method includes the steps of spacing each coupling strip apart on the surface of the bulk media and positioning the first dielectric layer of each coupling strip between the bulk media and the conductive layer. This method includes the step of coupling the conductive layer of each coupling strip to a power control system configured to supply current to the coupling strip. In various embodiments, the bulk media includes the outer skin of an aircraft, the blade of a wind turbine, the roof of a building, or a transmission line. The tenth general aspect can be embodied in a method of installing a bulk media heating system. This method includes the step of obtaining coupling strips, each coupling strip including a multilayer structure including a first dielectric layer, a conductive layer covering the first dielectric layer, a conductive shield layer covering the conductive layer, and a second dielectric layer between the conductive layer and the conductive shield layer. This method includes the steps of spacing each coupling strip apart on the surface of the bulk media and positioning the first dielectric layer of each coupling strip between the bulk media and the conductive layer. This method includes the step of coupling the conductive layer of each coupling strip to a power control system configured to supply current to the coupling strip. In various embodiments, the bulk media includes the outer skin of an aircraft, the blade of a wind turbine, the roof of a building, or a transmission line. The tenth general aspect can be embodied in a method of installing a bulk media heating system. This method includes the step of obtaining coupling strips, each coupling strip including a multilayer structure including a first dielectric layer, a conductive layer covering the first dielectric layer, a conductive shield layer covering the conductive layer, and a second dielectric layer between the conductive layer and the conductive shield layer. This method includes the steps of spacing each coupling strip apart on the surface of the bulk media and positioning the first dielectric layer of each coupling strip between the bulk media and the conductive layer. This method includes the step of coupling the conductive layer of each coupling strip to a power control system configured to supply current to the coupling strip. In various embodiments, the bulk media includes the outer skin of an aircraft, the blade of a wind turbine, the roof of a building, or a transmission line. The tenth general aspect can be embodied in a method of installing a bulk media heating system. This method includes the step of obtaining coupling strips, each coupling strip including a multilayer structure including a first dielectric layer, a conductive layer covering the first dielectric layer, a conductive shield layer covering the conductive layer, and a second dielectric layer between the conductive layer and the conductive shield layer. This method includes the steps of spacing each coupling strip apart on the surface of the bulk media and positioning the first dielectric layer of each coupling strip between the bulk media and the conductive layer. This method includes the step of coupling the conductive layer of each coupling strip to a power control system configured to supply current to the coupling strip. In various embodiments, the bulk media includes the outer skin of an aircraft, the blade of a wind turbine, the roof of a building, or a transmission line. The tenth general aspect can be embodied in a method of installing a bulk media heating system. This method includes the step of obtaining coupling strips, each coupling strip including a multilayer structure including a first dielectric layer, a conductive layer covering the first dielectric layer, a conductive shield layer covering the conductive layer, and a second dielectric layer between the conductive layer and the conductive shield layer. This method includes the steps of spacing each coupling strip apart on the surface of the bulk media and positioning the first dielectric layer of each coupling strip between the bulk media and the conductive layer. This method includes the step of coupling the conductive layer of each coupling strip to a power control system configured to supply current to the coupling strip. In various embodiments, the bulk media includes the outer skin of an aircraft, the blade of a wind turbine, the roof of a building, or a transmission line. The tenth general aspect can be embodied in a method of installing a bulk media heating system. This method includes the step of obtaining coupling strips, each coupling strip including a multilayer structure including a first dielectric layer, a conductive layer covering the first dielectric layer, a conductive shield layer covering the conductive layer, and a second dielectric layer between the conductive layer and the conductive shield layer. This method includes the steps of spacing each coupling strip apart on the surface of the bulk media and positioning the first dielectric layer of each coupling strip between the bulk media and the conductive layer. This method includes the step of coupling the conductive layer of each coupling strip to a power control system configured to supply current to the coupling strip. In various embodiments, the bulk media includes the outer skin of an aircraft, the blade of a wind turbine, the roof of a building, or a transmission line.

[0019] The subject matter described herein can be implemented to realize one or more of the following advantages. A lighter and smaller electrical system can be used to heat the conductor. Further, the heating can be localized to the target area, and overheating of the heating system circuit does not occur. Instead of generating heat with a heating element or heating layer attached to the bulk media, for example, the present heating system can be more efficient by directly generating heat in the bulk media itself (e.g., an aircraft wing). The present system may also require less current and voltage for heating, and there is a possibility of improved safety and reliability. In some embodiments, the stress on the components can also be reduced. The present system can be simpler, faster, or less expensive to install or modify. The present system can be less expensive and also require less maintenance. The subject matter described herein can be implemented to realize one or more of the following advantages. A lighter and smaller electrical system can be used to heat the conductor. Further, the heating can be localized to the target area, and overheating of the heating system circuit does not occur. Instead of generating heat with a heating element or heating layer attached to the bulk media, for example, the present heating system can be more efficient by directly generating heat in the bulk media itself (e.g., an aircraft wing). The present system may also require less current and voltage for heating, and there is a possibility of improved safety and reliability. In some embodiments, the stress on the components can also be reduced. The present system can be simpler, faster, or less expensive to install or modify. The present system can be less expensive and also require less maintenance. The subject matter described herein can be implemented to realize one or more of the following advantages. A lighter and smaller electrical system can be used to heat the conductor. Further, the heating can be localized to the target area, and overheating of the heating system circuit does not occur. Instead of generating heat with a heating element or heating layer attached to the bulk media, for example, the present heating system can be more efficient by directly generating heat in the bulk media itself (e.g., an aircraft wing). The present system may also require less current and voltage for heating, and there is a possibility of improved safety and reliability. In some embodiments, the stress on the components can also be reduced. The present system can be simpler, faster, or less expensive to install or modify. The present system can be less expensive and also require less maintenance. The subject matter described herein can be implemented to realize one or more of the following advantages. A lighter and smaller electrical system can be used to heat the conductor. Further, the heating can be localized to the target area, and overheating of the heating system circuit does not occur. Instead of generating heat with a heating element or heating layer attached to the bulk media, for example, the present heating system can be more efficient by directly generating heat in the bulk media itself (e.g., an aircraft wing). The present system may also require less current and voltage for heating, and there is a possibility of improved safety and reliability. In some embodiments, the stress on the components can also be reduced. The present system can be simpler, faster, or less expensive to install or modify. The present system can be less expensive and also require less maintenance. The subject matter described herein can be implemented to realize one or more of the following advantages. A lighter and smaller electrical system can be used to heat the conductor. Further, the heating can be localized to the target area, and overheating of the heating system circuit does not occur. Instead of generating heat with a heating element or heating layer attached to the bulk media, for example, the present heating system can be more efficient by directly generating heat in the bulk media itself (e.g., an aircraft wing). The present system may also require less current and voltage for heating, and there is a possibility of improved safety and reliability. In some embodiments, the stress on the components can also be reduced. The present system can be simpler, faster, or less expensive to install or modify. The present system can be less expensive and also require less maintenance. The subject matter described herein can be implemented to realize one or more of the following advantages. A lighter and smaller electrical system can be used to heat the conductor. Further, the heating can be localized to the target area, and overheating of the heating system circuit does not occur. Instead of generating heat with a heating element or heating layer attached to the bulk media, for example, the present heating system can be more efficient by directly generating heat in the bulk media itself (e.g., an aircraft wing). The present system may also require less current and voltage for heating, and there is a possibility of improved safety and reliability. In some embodiments, the stress on the components can also be reduced. The present system can be simpler, faster, or less expensive to install or modify. The present system can be less expensive and also require less maintenance. The subject matter described herein can be implemented to realize one or more of the following advantages. A lighter and smaller electrical system can be used to heat the conductor. Further, the heating can be localized to the target area, and overheating of the heating system circuit does not occur. Instead of generating heat with a heating element or heating layer attached to the bulk media, for example, the present heating system can be more efficient by directly generating heat in the bulk media itself (e.g., an aircraft wing). The present system may also require less current and voltage for heating, and there is a possibility of improved safety and reliability. In some embodiments, the stress on the components can also be reduced. The present system can be simpler, faster, or less expensive to install or modify. The present system can be less expensive and also require less maintenance. The subject matter described herein can be implemented to realize one or more of the following advantages. A lighter and smaller electrical system can be used to heat the conductor. Further, the heating can be localized to the target area, and overheating of the heating system circuit does not occur. Instead of generating heat with a heating element or heating layer attached to the bulk media, for example, the present heating system can be more efficient by directly generating heat in the bulk media itself (e.g., an aircraft wing). The present system may also require less current and voltage for heating, and there is a possibility of improved safety and reliability. In some embodiments, the stress on the components can also be reduced. The present system can be simpler, faster, or less expensive to install or modify. The present system can be less expensive and also require less maintenance. The subject matter described herein can be implemented to realize one or more of the following advantages. A lighter and smaller electrical system can be used to heat the conductor. Further, the heating can be localized to the target area, and overheating of the heating system circuit does not occur. Instead of generating heat with a heating element or heating layer attached to the bulk media, for example, the present heating system can be more efficient by directly generating heat in the bulk media itself (e.g., an aircraft wing). The present system may also require less current and voltage for heating, and there is a possibility of improved safety and reliability. In some embodiments, the stress on the components can also be reduced. The present system can be simpler, faster, or less expensive to install or modify. The present system can be less expensive and also require less maintenance. It can also be facilitated. When retrofitting an existing system, this system is non-invasive obtainable. This system enables faster de-icing.

[0020] Details of one or more embodiments of the subject matter of this specification are set forth in the accompanying drawings and the following description. Other features, aspects, and advantages of the subject matter will become apparent from this description, the drawings, and the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0021]

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Mode for Carrying Out the Invention

[0022] The heating system of the present invention increases the effective electrical resistance of a conductive material (e.g., aluminum, carbon fiber composite material) using an AC current to heat them more easily. Generally the heat generated in the conductive material can be used to melt the ice formed on the surface of the conductive material. This heat can be used to keep the conductive material at a high temperature, prevent the deposition of vapor on the surface, and prevent the freezing of water on the surface, and prevent icing rain (e.g., snow, freezing rain, fog, ice crystal rain ) from icing on the surface. For example, the heat generated in the conductive material can conduct (e.g., spread) throughout the conductive material. Furthermore, the generated heat can cause convection across the interface between the conductive material and the liquid on its surface, for example, heating the liquid to prevent freezing.

[0023] Several electromagnetic effects can be induced to increase the effective resistance of a conductive material using an alternating current, thereby promoting heat generation by utilizing the Joule heat of the conductive material.​ It occurs. Such effects include skin effect, proximity effect, induction, eddy current, hysteresis loss, and dielectric loss. When the frequency of the current in the conductor is set to a sufficiently high value, due to the skin effect, most of the current passes through the skin of the conductive material, which is significantly thinner than the geometric thickness of the conductive material. Furthermore, by using a specific device geometry, a proximity effect can be generated within the conductive material, and this effect further suppresses the width of the current density, thereby further increasing the effective resistance along the current path within the conductive material. The combination of these two effects can be used to increase the electrical resistance of the conductive material to generate Joule heat. For example, Joule heat generally refers to the heat generated by passing an electric current through a conductor. The heat generated in a specific energized conductor is proportional to the product of the resistance of the material and the root mean square of the square of the amplitude of the current:

[0024] For example, Joule heat generally refers to the heat generated by passing an electric current through a conductor. The heat generated in a specific energized conductor is proportional to the product of the resistance of the material and the root mean square of the square of the amplitude of the current:

Number

[0025] The heat output from the heating element generally increases by increasing the current passing through the conductor and by using a heating element with a relatively high resistance. However, the embodiments of the present disclosure utilize specific electromagnetic phenomena (e.g., skin effect and proximity effect) to generate Joule heat by contracting the current density of the local current within the bulk medium. This contraction of the current density increases the effective resistance along the current path within the bulk medium. The individual effects may vary depending on the material and shape, but the effective resistance for a specific length along the current path through the bulk medium can generally be expressed as follows. in the bulk medium. This contraction of the current density increases the effective resistance along the current path within the bulk medium. The individual effects may vary depending on the material and shape, but the effective resistance for a specific length along the current path through the bulk medium can generally be expressed as follows. increases the effective resistance along the current path within the bulk medium. The individual effects may vary depending on the material and shape, but the effective resistance for a specific length along the current path through the bulk medium can generally be expressed as follows. increases the effective resistance along the current path within the bulk medium. The individual effects may vary depending on the material and shape, but the effective resistance for a specific length along the current path through the bulk medium can generally be expressed as follows. Although the individual effects can vary depending on the material and shape, the effective resistance for a specific length along the current path through the bulk medium can generally be expressed as follows. Although the individual effects can vary depending on the material and shape, the effective resistance for a specific length along the current path through the bulk medium can generally be expressed as follows. ​ [Number] Here, ρ represents the resistivity of the material through which current flows, l represents the length of the current path, and A eff represents the contracted cross-sectional area of the current density. Embodiments of the present disclosure utilize electromagnetic phenomena to reduce A eff to a cross-sectional area smaller than the cross-sectional area of the bulk medium along the current path, thereby increasing the effective resistance of the bulk medium relative to the effective resistance of the bulk medium for DC current.

[0026] Some embodiments of the present disclosure use these electromagnetic phenomena to increase the length of the current path through the bulk medium. For example, as described below with reference to FIG. 4D, using the techniques described herein, the current path between two electrodes attached to the bulk medium can be "induced" along a non-linear path (e.g., a meandering path). The non-linear path has an effective length (l ) that is longer than the generally substantially straight path that would be generated by the current passing between the two electrodes in the absence of electromagnetic effects such as the proximity effect. Thus, the system described herein can increase the effective length (l ) of the current path to be longer than the straight path that the current would take in the absence of the various systems and conductor arrangements described herein. eff ) can be generated. Therefore, the effective resistance (R ) can be increased by both contracting the effective cross-sectional area (A ) of the current flowing through the bulk medium and increasing the effective length (l eff ) through which the current passes through the bulk medium, thereby increasing the effective resistance of the bulk medium relative to the bulk medium for DC current. The effective cross-sectional area (A eff ) of the current flowing through the bulk medium can be reduced, and the effective length (l ) through which the current passes through the bulk medium can be increased, both of which can increase the effective resistance (R eff ) and thereby increase the effective resistance of the bulk medium relative to the bulk medium for DC current. eff ), which increases the effective resistance of the bulk medium relative to the bulk medium for DC current. can be further increased compared to the effective resistance. In such an embodiment, the effective resistance is Generally, it can be expressed as follows.

Number

[0027] As used herein, the skin effect generally refers to the non-uniform distribution of an alternating current within a conductor such that the current density increases near the surface of the conductor and decreases as the distance from the surface of the conductor increases. The strength of the skin effect increases with the frequency of the current and the conductivity of the material carrying the current. Some embodiments of the present disclosure can adjust the skin effect so that more current flows at a higher AC frequency on the outer surface of the conductor (e.g., the "skin depth").

[0028] Generally, the skin effect of a conductor can be expressed by the following formula.

Number

Number

[0029] In the case of an infinitely long and wide rectangular plate through which surface current flows, the skin effect can be expressed by the following formula can be.

Number

[0030] For example, the chart shown in FIG. 3 and described in detail below shows an example of the current density contraction within the depth of the material (e.g., skin depth) caused by the skin effect caused.

[0031] As used herein, the proximity effect generally refers to the effect of an AC current flowing through a first current path (e.g., a conductor) on the current density of an AC current flowing through a nearby second current path. For example For example, as shown in FIGS. 5A - 5B and described in detail below, the AC current in the first current path The current "concentrates" or contracts the density of the AC current in the second current path around the first current path Let. In embodiments of the present disclosure, for example, the density of the current passing through the bulk medium is "pulled" towards another conductor carrying an AC current when another conductor carrying an AC current is placed near the current passing through the bulk medium medium. The degree and direction of the current density contraction ( For example, concentration) caused by the proximity effect depends on several variables, such as the distance between two or more AC current paths The relative direction of travel of the currents flowing through the individual current paths, the frequency of the AC current in the current paths For example, concentration), and direction depend on several variables, such as the distance between two or more AC current paths, the relative direction of travel of the currents flowing through the individual current paths, the frequency of the AC current in the current paths between the distance between two or more AC current paths, the relative direction of travel of the currents flowing through the individual current paths, the frequency of the AC current in the current paths ​It depends on factors such as the number and the magnitude of the individual currents in the current path.

[0032] For clarity, the heating system of the present disclosure is described in the context of an exemplary situation of a de-icing and anti-icing system for the outer surface of an aircraft. However, the heating system of the present disclosure can be used for heating other situations, such as other aircraft, drones, wind turbines, cryogenic operating devices, heat pumps, automobiles, radio towers, the surfaces of railway lines, manned or unmanned military vehicles, roofs, or other conductive surfaces that benefit from the suppression of ice or water formation, but is not limited thereto. This heating system can be used for de-icing or anti-icing. In some embodiments, this heating system can be used to heat a low-conductivity material, for example, by adding a conductive layer on or inside a non-conductive material. Such embodiments can be used to heat the surfaces of roads (such as private roads), building materials, roofs, floors, or other low or non-conductive materials. It depends on factors such as the number and the magnitude of the individual currents in the current path. For clarity, the heating system of the present disclosure is described in the context of an exemplary situation of a de-icing and anti-icing system for the outer surface of an aircraft. However, the heating system of the present disclosure can be used for heating other situations, such as other aircraft, drones, wind turbines, cryogenic operating devices, heat pumps, automobiles, radio towers, the surfaces of railway lines, manned or unmanned military vehicles, roofs, or other conductive surfaces that benefit from the suppression of ice or water formation, but is not limited thereto. This heating system can be used for de-icing or anti-icing. In some embodiments, this heating system can be used to heat a low-conductivity material, for example, by adding a conductive layer on or inside a non-conductive material. Such embodiments can be used to heat the surfaces of roads (such as private roads), building materials, roofs, floors, or other low or non-conductive materials. For clarity, the heating system of the present disclosure is described in the context of an exemplary situation of a de-icing and anti-icing system for the outer surface of an aircraft. However, the heating system of the present disclosure can be used for heating other situations, such as other aircraft, drones, wind turbines, cryogenic operating devices, heat pumps, automobiles, radio towers, the surfaces of railway lines, manned or unmanned military vehicles, roofs, or other conductive surfaces that benefit from the suppression of ice or water formation, but is not limited thereto. This heating system can be used for de-icing or anti-icing. In some embodiments, this heating system can be used to heat a low-conductivity material, for example, by adding a conductive layer on or inside a non-conductive material. Such embodiments can be used to heat the surfaces of roads (such as private roads), building materials, roofs, floors, or other low or non-conductive materials. For clarity, the heating system of the present disclosure is described in the context of an exemplary situation of a de-icing and anti-icing system for the outer surface of an aircraft. However, the heating system of the present disclosure can be used for heating other situations, such as other aircraft, drones, wind turbines, cryogenic operating devices, heat pumps, automobiles, radio towers, the surfaces of railway lines, manned or unmanned military vehicles, roofs, or other conductive surfaces that benefit from the suppression of ice or water formation, but is not limited thereto. This heating system can be used for de-icing or anti-icing. In some embodiments, this heating system can be used to heat a low-conductivity material, for example, by adding a conductive layer on or inside a non-conductive material. Such embodiments can be used to heat the surfaces of roads (such as private roads), building materials, roofs, floors, or other low or non-conductive materials. For clarity, the heating system of the present disclosure is described in the context of an exemplary situation of a de-icing and anti-icing system for the outer surface of an aircraft. However, the heating system of the present disclosure can be used for heating other situations, such as other aircraft, drones, wind turbines, cryogenic operating devices, heat pumps, automobiles, radio towers, the surfaces of railway lines, manned or unmanned military vehicles, roofs, or other conductive surfaces that benefit from the suppression of ice or water formation, but is not limited thereto. This heating system can be used for de-icing or anti-icing. In some embodiments, this heating system can be used to heat a low-conductivity material, for example, by adding a conductive layer on or inside a non-conductive material. Such embodiments can be used to heat the surfaces of roads (such as private roads), building materials, roofs, floors, or other low or non-conductive materials. For clarity, the heating system of the present disclosure is described in the context of an exemplary situation of a de-icing and anti-icing system for the outer surface of an aircraft. However, the heating system of the present disclosure can be used for heating other situations, such as other aircraft, drones, wind turbines, cryogenic operating devices, heat pumps, automobiles, radio towers, the surfaces of railway lines, manned or unmanned military vehicles, roofs, or other conductive surfaces that benefit from the suppression of ice or water formation, but is not limited thereto. This heating system can be used for de-icing or anti-icing. In some embodiments, this heating system can be used to heat a low-conductivity material, for example, by adding a conductive layer on or inside a non-conductive material. Such embodiments can be used to heat the surfaces of roads (such as private roads), building materials, roofs, floors, or other low or non-conductive materials. For clarity, the heating system of the present disclosure is described in the context of an exemplary situation of a de-icing and anti-icing system for the outer surface of an aircraft. However, the heating system of the present disclosure can be used for heating other situations, such as other aircraft, drones, wind turbines, cryogenic operating devices, heat pumps, automobiles, radio towers, the surfaces of railway lines, manned or unmanned military vehicles, roofs, or other conductive surfaces that benefit from the suppression of ice or water formation, but is not limited thereto. This heating system can be used for de-icing or anti-icing. In some embodiments, this heating system can be used to heat a low-conductivity material, for example, by adding a conductive layer on or inside a non-conductive material. Such embodiments can be used to heat the surfaces of roads (such as private roads), building materials, roofs, floors, or other low or non-conductive materials. For clarity, the heating system of the present disclosure is described in the context of an exemplary situation of a de-icing and anti-icing system for the outer surface of an aircraft. However, the heating system of the present disclosure can be used for heating other situations, such as other aircraft, drones, wind turbines, cryogenic operating devices, heat pumps, automobiles, radio towers, the surfaces of railway lines, manned or unmanned military vehicles, roofs, or other conductive surfaces that benefit from the suppression of ice or water formation, but is not limited thereto. This heating system can be used for de-icing or anti-icing. In some embodiments, this heating system can be used to heat a low-conductivity material, for example, by adding a conductive layer on or inside a non-conductive material. Such embodiments can be used to heat the surfaces of roads (such as private roads), building materials, roofs, floors, or other low or non-conductive materials. For clarity, the heating system of the present disclosure is described in the context of an exemplary situation of a de-icing and anti-icing system for the outer surface of an aircraft. However, the heating system of the present disclosure can be used for heating other situations, such as other aircraft, drones, wind turbines, cryogenic operating devices, heat pumps, automobiles, radio towers, the surfaces of railway lines, manned or unmanned military vehicles, roofs, or other conductive surfaces that benefit from the suppression of ice or water formation, but is not limited thereto. This heating system can be used for de-icing or anti-icing. In some embodiments, this heating system can be used to heat a low-conductivity material, for example, by adding a conductive layer on or inside a non-conductive material. Such embodiments can be used to heat the surfaces of roads (such as private roads), building materials, roofs, floors, or other low or non-conductive materials.

[0033] As used herein, de-icing generally refers to the removal of snow, ice, or frost (collectively referred to as "ice") from the surface. In some embodiments, it is sufficient if the heating system can melt a part of the existing ice on the conductive surface. Thereafter, the ice is removed from the surface (for example, by sliding off the surface when the melting process starts and the bond between the ice and the surface breaks). As used herein, de-icing generally refers to the removal of snow, ice, or frost (collectively referred to as "ice") from the surface. In some embodiments, it is sufficient if the heating system can melt a part of the existing ice on the conductive surface. Thereafter, the ice is removed from the surface (for example, by sliding off the surface when the melting process starts and the bond between the ice and the surface breaks). As used herein, de-icing generally refers to the removal of snow, ice, or frost (collectively referred to as "ice") from the surface. In some embodiments, it is sufficient if the heating system can melt a part of the existing ice on the conductive surface. Thereafter, the ice is removed from the surface (for example, by sliding off the surface when the melting process starts and the bond between the ice and the surface breaks). As used herein, de-icing generally refers to the removal of snow, ice, or frost (collectively referred to as "ice") from the surface. In some embodiments, it is sufficient if the heating system can melt a part of the existing ice on the conductive surface. Thereafter, the ice is removed from the surface (for example, by sliding off the surface when the melting process starts and the bond between the ice and the surface breaks).

[0034] As used herein, anti-icing generally refers to the prevention of the formation or adhesion of snow, ice, or frost (collectively referred to as "ice") to the surface. In some embodiments, the heating system prevents the formation of ice on the surface (for example, from icing precipitation such as snow, frost, freezing rain, ice crystal rain, etc.), and prevents the accumulation of ice. As used herein, anti-icing generally refers to the prevention of the formation or adhesion of snow, ice, or frost (collectively referred to as "ice") to the surface. In some embodiments, the heating system prevents the formation of ice on the surface (for example, from icing precipitation such as snow, frost, freezing rain, ice crystal rain, etc.), and prevents the accumulation of ice. As used herein, anti-icing generally refers to the prevention of the formation or adhesion of snow, ice, or frost (collectively referred to as "ice") to the surface. In some embodiments, the heating system prevents the formation of ice on the surface (for example, from icing precipitation such as snow, frost, freezing rain, ice crystal rain, etc.), and prevents the accumulation of ice. Maintain a surface temperature high enough to prevent accumulation or formation.

[0035] FIG. 1 shows a block diagram of an exemplary heating system 100 for heating a bulk medium . The heating system 100 includes a power control system 104 coupled to electrodes 116 and 118 . The electrodes 116 and 118 are coupled to a target region of the bulk medium 102 (e.g., a part of an aircraft wing ). The power control system 104 generates an alternating current (AC current) (e.g., at a frequency of 1 kHz or higher) across a closed circuit via wires (or paths or cables ) 106, the bulk medium 102, and finally a wire (or return path) 108. The direction of the current 112 flowing through the wire is indicated by the dashed arrow.

[0036] In some embodiments, the heating system 100 can include the power control system 104, the electrodes 1 16 and 118, and dedicated cables (e.g., wires 108 and 106), but is not limited thereto. In some embodiments, the heating system is configured to be coupled to the electrodes 1 16 and 118. In some embodiments, the heating system is configured to be coupled to a special cable (e.g., 108 or 116) . In some embodiments, the power control system 104 can include a signal generation unit, a power supply , a signal conversion unit, an impedance adjustment network, a control unit, and a sensor, and has a specific configuration described in detail below, but is not limited thereto. As will be described in detail below, in some embodiments, the impedance adjustment network is an impedance matching network.

[0037] In some embodiments, electrodes 116 and 118 are contact electrodes. For example, electrodes 1 16 and 118 are physically connected to the bulk medium 102 to conduct current from the power control system 104 to the bulk medium. In some embodiments, electrodes 116 and 118 can be coupled to the bulk medium 102 but can also be electrically insulated from the bulk medium 102. For example, in such embodiments, electrodes 116 and 118 can magnetically induce current in the bulk medium 102 as the input and output of an induction coil disposed proximate to the bulk medium 102 102. 102.

[0038] The power control system 104 can supply a current at a high frequency (e.g., 1 kHz or higher) sufficient to contract the flow of current in the z - direction between electrodes 116 and 118 by adjusting the skin effect, thereby creating a high resistance in the bulk medium 102. The power control system 10 4 can provide an AC current with a frequency in the range of 1 kHz to 300 GHz. In some embodiments, in some embodiments, the current frequency is from 100 kHz to 450 MHz . In some embodiments, the current frequency is in the range of 1 MHz to 50 MHz, 100 MHz to 15 0 MHz, 200 MHz to 300 MHz, 400 MHz to 500 MHz, or 800 MHz to 1 GHz.

[0039] In some embodiments, the return path 108 is disposed proximate to the surface of the bulk medium 102. The proximity of the return path 108 to the surface of the bulk medium can be used to adjust the proximity effect of the current flowing between electrodes 116 and 118, thereby further suppressing the current and increasing the heating within the bulk medium. Utilizing the proximity effect ​ To shape the current flowing between electrodes 116 and 118, it is not necessary to use the return current path 108 from the circuit itself of the heating system. In some embodiments, another current path 122 (e.g., from a different circuit) can be disposed proximate to the bulk medium 102 (e.g., at a distance 120a). For example, if the distance 120 or 120a from the bulk medium 102 to the current path 108 or 122 is small enough, the proximity effect can be used to further suppress the current flowing through the bulk medium. For example, the distance 120 or 120a between the bulk medium and the path 108 (or 122) can be less than 1 m, or less than 50 cm, or less than 10 cm to create the proximity effect. If a closer distance is possible taking into full account the design constraints (e.g., when the wing of an airplane is the bulk medium and in this case the ribs or spars of the airplane do not interfere with the return path 108 / 122), the distance 120 (or 120a) can be less than 25 cm or less than 10 cm. The bulk medium 102 can include, but is not limited to, materials such as aluminum, metal alloys, carbon fiber composites, copper, silver, titanium, or steel. For example, the bulk medium can be any part of the airframe of an aircraft, such as the fuselage, wing, undercarriage, tail fin, etc. (e.g., the outermost shell or surface of the aircraft, also known as the "skin" of the airplane). The electrodes (116 and 118) can include, but are not limited to, aluminum, silver, copper, their alloys, or other conductive materials. In some embodiments, the electrode material For example, the distance 120 or 120a between the bulk medium and the path 108 (or 122) can be less than 1 m, or less than 50 cm, or less than 10 cm to create the proximity effect. If a closer distance is possible taking into full account the design constraints (e.g., when the wing of an airplane is the bulk medium and in this case the ribs or spars of the airplane do not interfere with the return path 108 / 122), the distance 120 (or 120a) can be less than 25 cm or less than 10 cm. For example, the distance 120 or 120a between the bulk medium and the path 108 (or 122) can be less than 1 m, or less than 50 cm, or less than 10 cm to create the proximity effect. If a closer distance is possible taking into full account the design constraints (e.g., when the wing of an airplane is the bulk medium and in this case the ribs or spars of the airplane do not interfere with the return path 108 / 122), the distance 120 (or 120a) can be less than 25 cm or less than 10 cm.

[0040] For example, the distance 120 or 120a between the bulk medium and the path 108 (or 122) can be less than 1 m, or less than 50 cm, or less than 10 cm to create the proximity effect. If a closer distance is possible taking into full account the design constraints (e.g., when the wing of an airplane is the bulk medium and in this case the ribs or spars of the airplane do not interfere with the return path 108 / 122), the distance 120 (or 120a) can be less than 25 cm or less than 10 cm. For example, the distance 120 or 120a between the bulk medium and the path 108 (or 122) can be less than 1 m, or less than 50 cm, or less than 10 cm to create the proximity effect. If a closer distance is possible taking into full account the design constraints (e.g., when the wing of an airplane is the bulk medium and in this case the ribs or spars of the airplane do not interfere with the return path 108 / 122), the distance 120 (or 120a) can be less than 25 cm or less than 10 cm. For example, the distance 120 or 120a between the bulk medium and the path 108 (or 122) can be less than 1 m, or less than 50 cm, or less than 10 cm to create the proximity effect. If a closer distance is possible taking into full account the design constraints (e.g., when the wing of an airplane is the bulk medium and in this case the ribs or spars of the airplane do not interfere with the return path 108 / 122), the distance 120 (or 120a) can be less than 25 cm or less than 10 cm. For example, the distance 120 or 120a between the bulk medium and the path 108 (or 122) can be less than 1 m, or less than 50 cm, or less than 10 cm to create the proximity effect. If a closer distance is possible taking into full account the design constraints (e.g., when the wing of an airplane is the bulk medium and in this case the ribs or spars of the airplane do not interfere with the return path 108 / 122), the distance 120 (or 120a) can be less than 25 cm or less than 10 cm. For example, the distance 120 or 120a between the bulk medium and the path 108 (or 122) can be less than 1 m, or less than 50 cm, or less than 10 cm to create the proximity effect. If a closer distance is possible taking into full account the design constraints (e.g., when the wing of an airplane is the bulk medium and in this case the ribs or spars of the airplane do not interfere with the return path 108 / 122), the distance 120 (or 120a) can be less than 25 cm or less than 10 cm. For example, the distance 120 or 120a between the bulk medium and the path 108 (or 122) can be less than 1 m, or less than 50 cm, or less than 10 cm to create the proximity effect. If a closer distance is possible taking into full account the design constraints (e.g., when the wing of an airplane is the bulk medium and in this case the ribs or spars of the airplane do not interfere with the return path 108 / 122), the distance 120 (or 120a) can be less than 25 cm or less than 10 cm.

[0041] The bulk medium 102 can include, but is not limited to, materials such as aluminum, metal alloys, carbon fiber composites, copper, silver, titanium, or steel. For example, the bulk medium can be any part of the airframe of an aircraft, such as the fuselage, wing, undercarriage, tail fin, etc. (e.g., the outermost shell or surface of the aircraft, also known as the "skin" of the airplane). The bulk medium 102 can include, but is not limited to, materials such as aluminum, metal alloys, carbon fiber composites, copper, silver, titanium, or steel. For example, the bulk medium can be any part of the airframe of an aircraft, such as the fuselage, wing, undercarriage, tail fin, etc. (e.g., the outermost shell or surface of the aircraft, also known as the "skin" of the airplane). The bulk medium 102 can include, but is not limited to, materials such as aluminum, metal alloys, carbon fiber composites, copper, silver, titanium, or steel. For example, the bulk medium can be any part of the airframe of an aircraft, such as the fuselage, wing, undercarriage, tail fin, etc. (e.g., the outermost shell or surface of the aircraft, also known as the "skin" of the airplane). The bulk medium 102 can include, but is not limited to, materials such as aluminum, metal alloys, carbon fiber composites, copper, silver, titanium, or steel. For example, the bulk medium can be any part of the airframe of an aircraft, such as the fuselage, wing, undercarriage, tail fin, etc. (e.g., the outermost shell or surface of the aircraft, also known as the "skin" of the airplane).

[0042] The electrodes (116 and 118) can include, but are not limited to, aluminum, silver, copper, their alloys, or other conductive materials. In some embodiments, the electrode material The electrodes (116 and 118) can include, but are not limited to, aluminum, silver, copper, their alloys, or other conductive materials. In some embodiments, the electrode material is at least as conductive as the bulk medium 102. In some embodiments, the electrodes 116 and 118 can be arranged in an array of electrodes. The electrodes can be coupled to the bulk medium in various ways, such as by bonding to the top or bottom surface of the medium or embedding within the medium.

[0043] The heating system 100 is configured to generate an effective resistance through the bulk medium 102 by shaping the density of the current flowing through the medium. In other words, in an aircraft application, the existing airframe of the aircraft is used as part of the electrical circuit of the heating system. The heating system 10 0 shapes the current density by adjusting the skin effect, proximity effect, or a combination thereof, increasing the effective resistance of the bulk medium 102 along the current path between electrodes 116 and 118. In some cases, the proximity effect can be utilized to direct the current path to heat a desired section of the bulk medium, for example, as seen in FIG. 4D. The desired heated section of the bulk medium can be referred to as the "target heating location" or "target location".

[0044] In some embodiments, an alternating current with a frequency of 1 kHz or more can be passed directly through the airframe of the aircraft. As a result, Joule heat is generated in the portion of the airframe near the surface through which the current flows. Additionally, the heat generated by the current spreads throughout the bulk medium 102 by conduction.

[0045] Referring to FIGS. 2A - 2B, the heating system 100 utilizes the skin effect to shape the current density through the target region 102 of the medium. Similar to FIG. 1, an AC current (direction 212) is supplied between electrodes 116 and 118 through the target region of the bulk medium 102. FIG. 2A shows the skin ​​​​The target of the bulk medium 102 when there is no effect (for example, when the current frequency is less than 1 kHz) is a schematic diagram showing the profile (for example, side view) of the current density 202 passing through the region. The current flows in the y direction (212), and most of the current flows within the volume of the medium 102 indicated by the arrow . For example, the current has a depth 206 of about 2 mm, for example, approximately the entire thickness of the bulk medium . Thus, FIG. 2A shows the operation of the system 100 where there is little or no shaping of the current density due to the skin effect .

[0046] FIG. 2B is a schematic diagram of the profile of the current density 202 resulting from applying a high-frequency AC current (for example, 1 kHz or more) between the electrodes . FIG. 2B shows the operation of the system 100 that shapes the current density due to the skin effect. For example, due to the skin effect caused by operating the heating system 100 at high frequency , the depth of the current density 2 02 flowing through the bulk medium 102 is contracted in the z direction and becomes a narrow region near the surface of the bulk medium 102. Further , since the effective resistance of the current flow region of the bulk medium 102 increases sufficiently, Joule heat can be obtained in this region, and the rest of the circuit (for example, wires, power supplies, inverters, regulation networks , workpieces, electrodes) will not overheat. The effective resistance of the bulk medium with respect to the AC current in the target region can be made larger than the resistance of the bulk medium with respect to the DC current. For example, the effective resistance can be made more than two orders of magnitude larger than the resistance of the bulk medium with respect to the DC current .

[0047] FIG. 3 is a plot showing the concentration of the current density (y-axis, normalized to 1) into the depth of the material (x-axis, normalized to 1) due to the skin effect as a function of the applied AC current . ​​。The current density decays exponentially along the thickness (z - direction) of the medium. As the frequency increases from 1 kHz to 10 MHz, the current density becomes more concentrated near the surface of the bulk medium 。Therefore, the higher the frequency, the more significant the attenuation. In other words, the skin effect contracts the current density so that the current passes through a thin layer near the surface of the bulk medium. Moreover, Joule heat is generated in this layer.

[0048] Figure 4A is a side view of a system 400 for further contracting the current density by utilizing the proximity effect. Similar to FIG. 1, electrodes 116 and 118 are attached to a bulk medium 102 (e.g., a target area on an airframe) and pass an AC signal (e.g., 1 kHz or higher) to generate a current density (or path) 410 in the direction 412 through the medium. The return path 108 is arranged within a distance 120 from the current path (or density) 410 in the medium and has a different direction 112 from the direction 412. In some embodiments, the return path 108 is electrically insulated from the bulk medium 102. The path 108 can be a wire or cable arranged within a distance 120 from the bulk medium 102. The return path 108 can be a wire or cable that completes the circuit of the system 400.

[0049] If the return path 108 is sufficiently close to the current path 410 (e.g., less than 50 cm), the AC current in the return path 108 contracts the current in the current path 410 in a direction across the flow of the current in the current path 410. In other words, by arranging the return path 108 sufficiently close to the current path 410, the cross - sectional area of the flow of the current in the current path 410 is contracted. For example, referring to FIGS. 4A - 4C, the current flows in two directions between the electrodes 116 and 118 (e.g., ​ For example, as shown in the figure, it contracts in the x-direction and z-direction. For example, as shown in FIG. 4D, the proximity effect contracts the current density 410 in either the x-direction or the y-direction depending on the direction of the current flow. For example, when the current flows in the x-direction, the proximity effect contracts the current in the y-direction. For example, the proximity effect mainly contracts the current in a direction transverse to the direction of the current flow, while the skin effect mainly contracts the current density within the depth of the bulk medium (e.g., in the z-direction as shown in FIGS. 2A and 2B). In some cases, the proximity effect can also be added to the contraction of the current density in the depth (e.g., the z-direction) of the bulk medium 102. For example, in embodiments that utilize both the skin effect and the proximity effect, the skin effect can also be enhanced. In some embodiments, the proximity effect can be used to define the direction of the current flow through the bulk medium (e.g., the path through which the current passes through the bulk medium 102).

[0050] FIGS. 4B - C are exemplary schematic views of the system 400 as viewed from above. Electrodes 116 and 118 are attached to the target region 102 of the bulk medium and pass an AC signal (e.g., 1 kHz or higher) to generate a current density (or current path) 410 in the direction 412 through the medium. The return path 108 is disposed in an xy plane (dotted line) different from the current path (or density) 410 within the bulk medium 102. In some embodiments, the current in the return path 108 is in a direction 112 different from the direction 412. For example, in some embodiments, the direction 112 of the current in the return path 108 is opposite to the direction 412 of the current in the current path 410. When the spacing between the current path 412 and the return path 108 is small enough (e.g., 50 cm) ​​​​​​​less than), the current flowing within the bulk medium 102 between electrodes 116 and 118 becomes concentrated near the return path wire due to proximity effect (e.g., contracting in the y and z directions) as shown in FIG. 4C. The greater the separation distance of the return path 108 from the bulk medium 102, the fewer current paths 412 within the bulk medium 102 are contracted, as shown in FIG. 4B.

[0051] FIG. 4D is an exemplary schematic view of another embodiment of system 450 as seen from above. Similar to the previous system 100, electrodes 116 and 118 are attached to the target region of the bulk medium 102. The return path 108 is arranged in an xy plane different from the current path 410 within the bulk medium 102 and is proximate to the bulk medium 102. The illustrated embodiment shows how the return path 108 (or another distinct current path) can be used to shape the path along which current 410 flows through the bulk medium 102. For example, by disposing a second current path (e.g., a current-carrying wire or cable such as the return path 108) proximate to the bulk medium 102, the proximity effect can be utilized to both contract the width of the current density across the direction of current flow and shape the current path 410 within the bulk medium 102. FIG. 4D also shows that the proximity effect contracts the current density along the current path 410 in a direction transverse to the direction of current flow. For example, in FIG. 4D, the current density along the current path 410 is contracted in a direction substantially perpendicular to the direction of current flow in each segment of the path 410, and the current path 410 within the bulk medium 102 conforms to the shape of the return path 108. More specifically, in section A of the current path 410, the electric The flow is guided to flow along the x-direction, and the current density is contracted in the y- and z-directions. In section B of the current path 410, the current is guided to flow along the y-direction. and the current density is contracted in the x- and z-directions.

[0052] As shown in FIG. 4D, the ability to shape the current path into a more complex shape by the proximity effect brings several advantages. First, such a path shape can be used to increase the effective current path length l. As described above, when the path length increases, the resistance increases and the Joule heat increases. Second, the shape of such a current path can be configured to direct the current to strategic locations for heating. Third, the shape of such a current path can be used to create regions (e.g., hot spots) where heating is increased at sharp corners of the current path.

[0053] The combination of the proximity effect and the skin effect can make the effective resistance of the bulk medium to the AC current in the target region greater than the resistance of the bulk medium to the DC current. For example the effective resistance can be made more than two orders of magnitude greater than the resistance of the bulk medium to the DC current.

[0054] FIGS. 5A - B are simulation diagrams showing the increase in the concentration of the current density in the bulk conductor target region 102 near the second conductor / path 1 08 as a function of the distance 120 between the conductors. The currents in the bulk conductor and the second path are sufficient to cause the proximity effect when the distance 120 decreases (e.g., above 1 kHz or 10 MHz). For example when the distance 120 is 20 cm, the current density 410, as shown in FIG. 5A, is in the x - y plane. remains substantially uniform. As shown in FIG. 5B, when the distance 120 is reduced to 2 cm, due to the proximity effect, a "crowding" or "shrinking" of the current 410 occurs around the return path 108 in the x-z plane. This is because most of the current 410 is concentrated in a narrow strip along the bulk conductor and is realized by following the path of the second conductor (108) (e.g., the return path or other current-carrying wires). In other words, the current 410 does not spread uniformly throughout the bulk medium but follows the path of minimum inductance. When the distance 120 is reduced to 2 cm, due to the proximity effect, a "crowding" or "shrinking" of the current 410 occurs around the return path 108 in the x-z plane. This is because most of the current 410 is concentrated in a narrow strip along the bulk conductor and is realized by following the path of the second conductor (108) (e.g., the return path or other current-carrying wires). In other words, the current 410 does not spread uniformly throughout the bulk medium but follows the path of minimum inductance. In some embodiments, similar to the path 122 in FIG. 1, wires other than the return path 108 are used to cause the proximity effect. In that case, the current oscillation of that wire may or may not be driven by the same system (e.g., the power control system 104) as paths 106 and 108. In that case, the proximity effect of the wire 122 depends on the distance from the current path 412 in the bulk conductor to the wire 112. Similar to the return path 108, the wire 122 needs to be close enough (e.g., less than 50 cm) to the path 412. In some embodiments, similar to the path 122 in FIG. 1, wires other than the return path 108 are used to cause the proximity effect.

[0055] In that case, the current oscillation of that wire may or may not be driven by the same system (e.g., the power control system 104) as paths 106 and 108. In that case, the proximity effect of the wire 122 depends on the distance from the current path 412 in the bulk conductor to the wire 112. Similar to the return path 108, the wire 122 needs to be close enough (e.g., less than 50 cm) to the path 412. In general, the power control system 104 supplies current to the bulk medium 102 through electrodes (e.g., 116 and 118) and dedicated conductors (e.g., dedicated wires or cables) to form a closed circuit (see FIG. 1). These three components will be described in more detail below. In general, the power control system 104 supplies current to the bulk medium 102 through electrodes (e.g., 116 and 118) and dedicated conductors (e.g., dedicated wires or cables) to form a closed circuit (see FIG. 1). These three components will be described in more detail below.

[0056] In some embodiments, the electrodes 116 and 118 include an array of input electrodes and output electrodes as shown in FIG. 6A. The electrode system 600 forms the electrode array 116. In some embodiments, the electrodes 116 and 118 include an array of input electrodes and output electrodes as shown in FIG. 6A. The electrode system 600 forms the electrode array 116. These three components will be described in more detail below.

[0057] In some embodiments, the electrodes 116 and 118 include an array of input electrodes and output electrodes as shown in FIG. 6A. The electrode system 600 forms the electrode array 116. Three input electrodes 116(1)-(3) and three output electrodes 118(1)-(3) that form the electrode array 118, which provide adjacent current paths 410 within the bulk medium. As described above The proximity effect of the current 112 in the return wire 108 contracts the current density 410 in the bulk medium As detailed above, the proximity effect of the current 112 in the return wire 108 contracts the current density 410 in the bulk medium

[0058] In general, various electrode shapes can be used to achieve the desired heating in the target region of the bulk medium 102. For example, as shown in FIG. 6B, the system 610 shows two electrode arrangements 116 and 118 used to supply current to the target region 102 of the bulk medium (with input / output wires 106 and 108). The electrode arrangements 11 6 and 118 may be an array of one or more electrodes as shown in FIG. 6A. FIGS. 6C -D are schematic diagrams of other electrode configurations 620 and 630 for heating, for example, the target region 120 of an aircraft wing. The electrode arrangements shown by 116, 118, and 640 may be a single electrode as shown in FIG. 6A, or an array of one or more electrodes as well. Details of the electrode shape and design are as follows In some embodiments, the bulk medium is the outer skin of an aircraft, and the target regions for heating include wings, fuselage, vertical tail, horizontal tail, windows, winglets, windshields, control surfaces (flaps, ailerons, rudders, elevators, air brakes, etc.), nose / nose cone, landing gear landing gear brakes, landing gear doors, engines and engine nacelles, AC inlets

[0059] and outlets, fuel tank vents, pitot heads, static ports, other antennas sensors, external lights, fuel tank vents, service panels, etc., but these are included landing gear, landing gear brakes, landing gear doors, engines and engine nacelles, AC inlets and outlets, fuel tank vents, pitot heads, static ports, other antennas sensors, external lights, fuel tank vents, service panels, etc., but these are is not limited. In other words, the proposed technology may, in some cases, include arranging electrodes inside the fuselage in one or more of the configurations shown in FIGS. 6A-6D. In some embodiments, the heating system 100 can generate Joule heat in a portion of the target area and then cause further heat diffusion by conduction within the material. In general, the power control system 104 includes a signal generation system designed to generate an alternating current (AC) electrical signal at a high frequency (e.g., 1 kHz or higher) and send it through the aforementioned target area 102 of the bulk medium. In some embodiments where the impedance of the target area is low (in some cases much lower than 1 Ω), the signal generation system is configured to generate and maintain a desired current level to generate Joule heat in the target area. In some cases, since the impedance of other parts of the system (such as conductors and wires for transmitting signals) exceeds zero, undesirable Joule heat is generated outside the target area due to the large current flowing through these parts. Therefore, in some embodiments, the signal generation system is designed such that high current is supplied only near the target area. In some embodiments, the signal generation system is designed such that high current is supplied only near the target area.

[0060] In general, the power control system 104 includes a signal generation system designed to generate an alternating current (AC) electrical signal at a high frequency (e.g., 1 kHz or higher) and send it through the aforementioned target area 102 of the bulk medium. In some embodiments where the impedance of the target area is low (in some cases much lower than 1 Ω), the signal generation system is configured to generate and maintain a desired current level to generate Joule heat in the target area. In some cases, since the impedance of other parts of the system (such as conductors and wires for transmitting signals) exceeds zero, undesirable Joule heat is generated outside the target area due to the large current flowing through these parts. Therefore, in some embodiments, the signal generation system is designed such that high current is supplied only near the target area. In some embodiments, the signal generation system is designed such that high current is supplied only near the target area. In some cases, since the impedance of other parts of the system (such as conductors and wires for transmitting signals) exceeds zero, undesirable Joule heat is generated outside the target area due to the large current flowing through these parts. Therefore, in some embodiments, the signal generation system is designed such that high current is supplied only near the target area. In some embodiments, the signal generation system is designed such that high current is supplied only near the target area. In some embodiments, the signal generation system is designed such that high current is supplied only near the target area.

[0061] In some embodiments, some or all of the elements / units of the signal generation system, as well as the conductive elements / cables connecting them, are designed to minimize the undesirable power losses that typically occur when sending high current and high frequency electromagnetic signals. In some embodiments, some or all of the elements / units of the signal generation system, as well as the conductive elements / cables connecting them, are designed to minimize the undesirable power losses that typically occur when sending high current and high frequency electromagnetic signals. In some embodiments, some or all of the elements / units of the signal generation system, as well as the conductive elements / cables connecting them, are designed to minimize the undesirable power losses that typically occur when sending high current and high frequency electromagnetic signals.

[0062] In some embodiments, the signal generation system can receive power from an existing power source (e.g., an existing electrical bus on an aircraft). In some embodiments, the system is a system In some embodiments, the signal generation system can receive power from an existing power source (e.g., an existing electrical bus on an aircraft). In some embodiments, the system is a system Use a dedicated battery or a dedicated power source that is part of the item. For example, such dedicated power sources can include, but are not limited to, fuel-based generators, solar power-based generators, wind power-based generators, gas power-based generators, etc. The signal generation system can be arranged within a circuit between a power source (e.g., an existing electrical bus, a dedicated battery, a dedicated power source) and the target area.

[0063] Furthermore, in some embodiments, the signal generation system exists as an independent unit and / or can include control circuits and devices embedded within a combination of other units that are part of the signal generation system.

[0064] In some embodiments, the heating system 100 is used to heat several separate target areas. In such cases, each element or unit of the heating system (e.g., a signal conversion unit, an impedance adjustment network, etc.) can be centralized throughout the system or distributed as one or more individual units for each target area or group of target areas. The centralized or distributed configuration can be used to improve, among other criteria, system functionality, energy efficiency, cost, regulatory compliance, weight, size, and complexity. For example, in some embodiments, the signal conversion unit is centralized, while the impedance adjustment network is distributed among one or more units for each target area. In some embodiments, the signal conversion unit is only partially centralized as a centralized TSP (“transformation to standard power”) sub-unit, while the ACG (“AC generation”) sub-unit The knitting is distributed as one or more subunits for each target area or group of target areas is. In some embodiments, the signal conversion unit is fully distributed, and each sub-unit is distributed to one or more subunits for each target area or group of target areas .

[0065] In some embodiments, the power control system 104 continuously supplies power to the target area 102 until the heating / de-icing / anti-icing operation is completed . In some embodiments, the system can turn the power on and off in an improved / efficient way (e.g., using a control unit) to achieve the desired heat generation and heat distribution in the conductive material 102 . For example, when the system is on, heat is generated at specific locations in the target area and conducted throughout the target area, "diffusing" to the rest of the target area . While the system is off, the generated heat continues to conduct within the target area .

[0066] In some embodiments, the system can have different power levels for the on state and periodically repeat different power levels for the off state in an improved way . In some embodiments, instead of a one-step power increment or decrement, a specific power level can be reached by a smooth increase or decrease in power . Such a pulse power system pattern can be fully pre-specified at the time of system construction or changed dynamically and improved based on a feedback loop that forms part of the system's control unit .

[0067] In some embodiments where the heating system includes multiple target areas, the above pulse power pattern ​​​​Since the ーン can be used asynchronously across all target regions, all target regions can be heated with the required amount of time while maintaining both the overall average and the overall instantaneous power levels below the set thresholds. For example, in the case of an aircraft de-icing system that heats both wings, the fuselage, and the horizontal and vertical stabilizers, such a stepped power pattern can be designed so that the system is turned on for only one target region at a time. In some embodiments the stepped power pattern powers on the system in the order of the left wing, the fuselage, the right wing, the vertical stabilizer, and the horizontal stabilizer. In some embodiments, improved timing can be used at each step to achieve the desired heat, average power, instantaneous power level, and acceptable heat distribution. In some embodiments, similar to the above pattern, any subset of the target regions can be heated at a specific time. In some embodiments, one or more units or elements mentioned as part of the design of the heating system have an enclosure. Such an enclosure can be designed for a single unit or any combination of units. In some embodiments the enclosure is designed to comply with environmental certification standards. For example, the enclosure can be designed to comply with standards such as non-flammability, protection from precipitation, mounting and

[0068] structural protection from external shocks and vibrations, electrical insulation, protection from external electromagnetic interference (「EMI」), shielding of the EMI radiation of the enclosed circuit, and thermal relief. In some embodiments, one or more units or elements mentioned as part of the design of the heating system have an enclosure. Such an enclosure can be designed for a single unit or any combination of units. In some embodiments the enclosure is designed to comply with environmental certification standards. For example, the enclosure can be designed to comply with standards such as non-flammability, protection from precipitation, mounting and

[0069] structural protection from external shocks and vibrations, electrical insulation, protection from external electromagnetic interference (「EMI」), shielding of the EMI radiation of the enclosed circuit, and thermal relief. In some embodiments, one or more units or elements mentioned as part of the design of the heating system have an enclosure. Such an enclosure can be designed for a single unit or any combination of units. In some embodiments the enclosure is designed to comply with environmental certification standards. For example, the enclosure can be designed to comply with standards such as non-flammability, protection from precipitation, mounting and structural protection from external shocks and vibrations, electrical insulation, protection from external electromagnetic interference (「EMI」), shielding of the EMI radiation of the enclosed circuit, and thermal relief. In some embodiments, one or more units or elements mentioned as part of the design of the heating system have an enclosure. Such an enclosure can be designed for a single unit or any combination of units. In some embodiments

[0070] In some embodiments, some enclosures can be designed to use the structure of a heated object (e.g., a bulk conductive material) as a heat sink. For example, one or more units of a heating system can be housed within a metal or conductive structure that is attached to have a high thermal conductivity with respect to the bulk medium in which it is placed. One possible advantage of this attachment is to provide the necessary cooling for the electronic device while heating the bulk medium. Another possible advantage of this design is that it reduces the weight of the heating system (or device) by eliminating the need for a separate heat sink to dissipate losses. In some embodiments, the target area can be used as part of the heat sink of the heating system unit. This use can improve the efficiency of the heating system because the circuit of the heating system will inevitably generate heat loss, which is conducted to the target area to heat them. In some embodiments, some enclosures can be designed to use the structure of a heated object (e.g., a bulk conductive material) as a heat sink. For example, one or more units of a heating system can be housed within a metal or conductive structure that is attached to have a high thermal conductivity with respect to the bulk medium in which it is placed. One possible advantage of this attachment is to provide the necessary cooling for the electronic device while heating the bulk medium. Another possible advantage of this design is that it reduces the weight of the heating system (or device) by eliminating the need for a separate heat sink to dissipate losses. In some embodiments, the target area can be used as part of the heat sink of the heating system unit. This use can improve the efficiency of the heating system because the circuit of the heating system will inevitably generate heat loss, which is conducted to the target area to heat them. In some embodiments, some enclosures can be designed to use the structure of a heated object (e.g., a bulk conductive material) as a heat sink. For example, one or more units of a heating system can be housed within a metal or conductive structure that is attached to have a high thermal conductivity with respect to the bulk medium in which it is placed. One possible advantage of this attachment is to provide the necessary cooling for the electronic device while heating the bulk medium. Another possible advantage of this design is that it reduces the weight of the heating system (or device) by eliminating the need for a separate heat sink to dissipate losses. In some embodiments, the target area can be used as part of the heat sink of the heating system unit. This use can improve the efficiency of the heating system because the circuit of the heating system will inevitably generate heat loss, which is conducted to the target area to heat them. In some embodiments, some enclosures can be designed to use the structure of a heated object (e.g., a bulk conductive material) as a heat sink. For example, one or more units of a heating system can be housed within a metal or conductive structure that is attached to have a high thermal conductivity with respect to the bulk medium in which it is placed. One possible advantage of this attachment is to provide the necessary cooling for the electronic device while heating the bulk medium. Another possible advantage of this design is that it reduces the weight of the heating system (or device) by eliminating the need for a separate heat sink to dissipate losses. In some embodiments, the target area can be used as part of the heat sink of the heating system unit. This use can improve the efficiency of the heating system because the circuit of the heating system will inevitably generate heat loss, which is conducted to the target area to heat them. In some embodiments, some enclosures can be designed to use the structure of a heated object (e.g., a bulk conductive material) as a heat sink. For example, one or more units of a heating system can be housed within a metal or conductive structure that is attached to have a high thermal conductivity with respect to the bulk medium in which it is placed. One possible advantage of this attachment is to provide the necessary cooling for the electronic device while heating the bulk medium. Another possible advantage of this design is that it reduces the weight of the heating system (or device) by eliminating the need for a separate heat sink to dissipate losses. In some embodiments, the target area can be used as part of the heat sink of the heating system unit. This use can improve the efficiency of the heating system because the circuit of the heating system will inevitably generate heat loss, which is conducted to the target area to heat them. In some embodiments, some enclosures can be designed to use the structure of a heated object (e.g., a bulk conductive material) as a heat sink. For example, one or more units of a heating system can be housed within a metal or conductive structure that is attached to have a high thermal conductivity with respect to the bulk medium in which it is placed. One possible advantage of this attachment is to provide the necessary cooling for the electronic device while heating the bulk medium. Another possible advantage of this design is that it reduces the weight of the heating system (or device) by eliminating the need for a separate heat sink to dissipate losses. In some embodiments, the target area can be used as part of the heat sink of the heating system unit. This use can improve the efficiency of the heating system because the circuit of the heating system will inevitably generate heat loss, which is conducted to the target area to heat them. In some embodiments, some enclosures can be designed to use the structure of a heated object (e.g., a bulk conductive material) as a heat sink. For example, one or more units of a heating system can be housed within a metal or conductive structure that is attached to have a high thermal conductivity with respect to the bulk medium in which it is placed. One possible advantage of this attachment is to provide the necessary cooling for the electronic device while heating the bulk medium. Another possible advantage of this design is that it reduces the weight of the heating system (or device) by eliminating the need for a separate heat sink to dissipate losses. In some embodiments, the target area can be used as part of the heat sink of the heating system unit. This use can improve the efficiency of the heating system because the circuit of the heating system will inevitably generate heat loss, which is conducted to the target area to heat them. In some embodiments, some enclosures can be designed to use the structure of a heated object (e.g., a bulk conductive material) as a heat sink. For example, one or more units of a heating system can be housed within a metal or conductive structure that is attached to have a high thermal conductivity with respect to the bulk medium in which it is placed. One possible advantage of this attachment is to provide the necessary cooling for the electronic device while heating the bulk medium. Another possible advantage of this design is that it reduces the weight of the heating system (or device) by eliminating the need for a separate heat sink to dissipate losses. In some embodiments, the target area can be used as part of the heat sink of the heating system unit. This use can improve the efficiency of the heating system because the circuit of the heating system will inevitably generate heat loss, which is conducted to the target area to heat them. In some embodiments, some enclosures can be designed to use the structure of a heated object (e.g., a bulk conductive material) as a heat sink. For example, one or more units of a heating system can be housed within a metal or conductive structure that is attached to have a high thermal conductivity with respect to the bulk medium in which it is placed. One possible advantage of this attachment is to provide the necessary cooling for the electronic device while heating the bulk medium. Another possible advantage of this design is that it reduces the weight of the heating system (or device) by eliminating the need for a separate heat sink to dissipate losses. In some embodiments, the target area can be used as part of the heat sink of the heating system unit. This use can improve the efficiency of the heating system because the circuit of the heating system will inevitably generate heat loss, which is conducted to the target area to heat them. In some embodiments, some enclosures can be designed to use the structure of a heated object (e.g., a bulk conductive material) as a heat sink. For example, one or more units of a heating system can be housed within a metal or conductive structure that is attached to have a high thermal conductivity with respect to the bulk medium in which it is placed. One possible advantage of this attachment is to provide the necessary cooling for the electronic device while heating the bulk medium. Another possible advantage of this design is that it reduces the weight of the heating system (or device) by eliminating the need for a separate heat sink to dissipate losses. In some embodiments, the target area can be used as part of the heat sink of the heating system unit. This use can improve the efficiency of the heating system because the circuit of the heating system will inevitably generate heat loss, which is conducted to the target area to heat them. In some embodiments, some enclosures can be designed to use the structure of a heated object (e.g., a bulk conductive material) as a heat sink. For example, one or more units of a heating system can be housed within a metal or conductive structure that is attached to have a high thermal conductivity with respect to the bulk medium in which it is placed. One possible advantage of this attachment is to provide the necessary cooling for the electronic device while heating the bulk medium. Another possible advantage of this design is that it reduces the weight of the heating system (or device) by eliminating the need for a separate heat sink to dissipate losses. In some embodiments, the target area can be used as part of the heat sink of the heating system unit. This use can improve the efficiency of the heating system because the circuit of the heating system will inevitably generate heat loss, which is conducted to the target area to heat them.

[0071] In some embodiments, multiple adhesives or attachment types can be used to attach the enclosure to the bulk medium. For example, an adhesive mainly used for maintaining mechanical rigidity can be used to hold its casing in place, and another adhesive (or interface agent) that provides a low thermal impedance path for the heat sink function of the enclosure can also be used. In some embodiments, multiple adhesives or attachment types can be used to attach the enclosure to the bulk medium. For example, an adhesive mainly used for maintaining mechanical rigidity can be used to hold its casing in place, and another adhesive (or interface agent) that provides a low thermal impedance path for the heat sink function of the enclosure can also be used. In some embodiments, multiple adhesives or attachment types can be used to attach the enclosure to the bulk medium. For example, an adhesive mainly used for maintaining mechanical rigidity can be used to hold its casing in place, and another adhesive (or interface agent) that provides a low thermal impedance path for the heat sink function of the enclosure can also be used. In some embodiments, multiple adhesives or attachment types can be used to attach the enclosure to the bulk medium. For example, an adhesive mainly used for maintaining mechanical rigidity can be used to hold its casing in place, and another adhesive (or interface agent) that provides a low thermal impedance path for the heat sink function of the enclosure can also be used. In some embodiments, multiple adhesives or attachment types can be used to attach the enclosure to the bulk medium. For example, an adhesive mainly used for maintaining mechanical rigidity can be used to hold its casing in place, and another adhesive (or interface agent) that provides a low thermal impedance path for the heat sink function of the enclosure can also be used.

[0072] In some embodiments, one or more units of a heating system can be measured for one or more measurements taken in the unit's circuit, surrounding cables, other units, or the target area. In some embodiments, one or more units of a heating system can be measured for one or more measurements taken in the unit's circuit, surrounding cables, other units, or the target area. configured to detect, for example, voltage, current, temperature, forward power, and reflected power, etc. but are not limited thereto. In some embodiments, such measured values are used to monitor the operating state of the unit and to control their operations, for improvement purposes, for example, switching and on / off switching of adjustable parts, output levels, and in-circuit control etc. (using a feedback mechanism) (see below for details of switching and control of adjustable parts in the dynamic adjustment network). The parameters to be controlled include power to the load and / or current to the load, voltage control of the adjustment network, and other related signals. In some embodiments, the measured values used as part of the above feedback loop can also include specific ice sensors that can be installed in or near the target area. Such

[0073] sensors can be used, for example, to notify the heating system and / or the user about the de-icing completion status, and can be used as input for adjusting the power level during de-icing and anti-icing operation phases. In some embodiments, the ice sensors can also be used to discriminate faults and service requests within the system. In some embodiments, the heating system can include a protocol converter control unit (or "control unit" or "control sub-unit") that receives inputs from the user (who can be a pilot or co-pilot in the case of an aircraft de-icing system) and / or the system's sensors and outputs control signals to all other units.

[0074] In some embodiments, the heating system can include a protocol converter control unit (or "control unit" or "control sub-unit") that receives inputs from the user (who can be a pilot or co-pilot in the case of an aircraft de-icing system) and / or the system's sensors and outputs control signals to all other units. and outputs control signals to all other units. In some embodiments, the input from the user can include an on / off state, a de-icing / anti-icing / off state, the target temperature of the target area, and the target output of the target area, but is not limited thereto. In some embodiments, the input from the sensor can include voltage, current, temperature, forward power and reflected power, impedance, and data from ice sensors, squat switches, various aircraft logic units, information from avionics, and other information, etc., but is not limited thereto. In some embodiments, the protocol converter unit is centrally arranged throughout the system. In some embodiments, one protocol converter control unit is distributed for each target area or group of target areas. In some embodiments, the user input can be transmitted to the control unit using a wired (e.g., a data transfer standard such as ARINC 429) or wireless (e.g., low-energy Bluetooth or Wi-Fi connection). In some embodiments, the user input device can be integrated into the system to be heated (e.g., integrated into the controls on the cockpit screen of an aircraft's de-icing system) or can be a separate device such as a touch

[0075] screen tablet (e.g., another tablet attached to the cockpit or a dedicated application installed on the pilot's touch screen tablet in the case of an aircraft's de-icing system). In some embodiments, the power control system 104 can use an existing electrical bus or a dedicated battery or any other power source of the heating system to generate current in the bulk medium. or Wi-Fi connection). In some embodiments, the user input device can be integrated into the system to be heated (e.g., integrated into the controls on the cockpit screen of an aircraft's de-icing system) or can be a separate device such as a touch screen tablet (e.g., another tablet attached to the cockpit or a dedicated application installed on the pilot's touch screen tablet in the case of an aircraft's de-icing system). screen tablet (e.g., another tablet attached to the cockpit or a dedicated application installed on the pilot's touch screen tablet in the case of an aircraft's de-icing system). screen tablet (e.g., another tablet attached to the cockpit or a dedicated application installed on the pilot's touch screen tablet in the case of an aircraft's de-icing system). screen tablet (e.g., another tablet attached to the cockpit or a dedicated application installed on the pilot's touch screen tablet in the case of an aircraft's de-icing system). screen tablet (e.g., another tablet attached to the cockpit or a dedicated application installed on the pilot's touch screen tablet in the case of an aircraft's de-icing system).

[0076] In some embodiments, the power control system 104 can use an existing electrical bus or a dedicated battery or any other power source of the heating system to generate current in the bulk medium. In some embodiments, the power control system 104 can use an existing electrical bus or a dedicated battery or any other power source of the heating system to generate current in the bulk medium. A signal conversion unit ("STU") or circuit that converts the signals of [the subject] into a desired high-frequency AC waveform is included. For example, in an aircraft application, the signal conversion unit can receive DC power available from the aircraft's electrical bus and convert it into the desired high-frequency AC signal. In another aircraft example, the signal conversion unit can receive power available from the aircraft's electrical bus in the form of an AC signal and convert it into the desired high-frequency AC signal. In some embodiments the signal conversion unit can draw DC power available from a dedicated battery or any dedicated power source (e.g., forming part of a heating system) and convert it into the desired high-frequency AC signal. In some embodiments, the dedicated battery or power source can be built into the same enclosure and / or circuit board as the signal conversion unit.

[0077] FIG. 7 is a schematic diagram of an exemplary signal conversion unit ("STU") 700 for the power control system 104, including main sub-units for conversion to standard power ("TSP") 710 and AC generation ("ACG" ") 720, and these sub-units are placed in front of the other circuits 730 of the remainder of the device 100. The power control system 104 can draw power from an existing power source as shown in FIG. 7.

[0078] FIG. 8 is a schematic diagram of an exemplary signal conversion unit ("STU") 800 for the power control system 104, including TSP 810, ACG 820, and a control sub-unit 830.

[0079] In some embodiments, TSP draws power from an existing power source or the battery of a heating system To draw out power and improve the operation of the ACG as well as the power transmission efficiency of the signal conversion unit, the power is converted to a standard input such as 250 VDC. In some embodiments, when an existing electrical bus supplies power to the TSP in the form of a 400 Hz, 115 VAC signal, the TSP includes a flyback converter with a filter such as a common mode choke on the output side to prevent the reach of electromagnetic interference or damage to the ACG.

[0080] In some embodiments, when an existing electrical bus supplies power to the TSP in the form of a 400 Hz, 115 VAC signal, the TSP includes a flyback converter with a filter such as a common mode choke on the output side to prevent the reach of electromagnetic interference or damage to the ACG. In some embodiments, when an existing electrical bus supplies power to the TSP in the form of a 400 Hz, 115 VAC signal, the TSP includes a flyback converter with a filter such as a common mode choke on the output side to prevent the reach of electromagnetic interference or damage to the ACG. In some embodiments, when an existing electrical bus supplies power to the TSP in the form of a 400 Hz, 115 VAC signal, the TSP includes a flyback converter with a filter such as a common mode choke on the output side to prevent the reach of electromagnetic interference or damage to the ACG. FIG. 9A is a schematic diagram of an exemplary TSP subunit 900 including a flyback converter 910 and a common mode choke 920. FIG. 9B is a schematic diagram of an exemplary flyback converter 910. In some embodiments, when an existing electrical bus supplies power to the TSP in the form of a 400 Hz, 115 VAC signal, the TSP includes a flyback converter with a filter such as a common mode choke on the output side to prevent the reach of electromagnetic interference or damage to the ACG.

[0081] In some embodiments, the TSP is a bridge rectifier that converts AC power from an existing power source to any DC voltage. In some embodiments, the TSP draws DC power from a battery or an existing power source (e.g., a typical 28 VDC in an aircraft) and converts it to a different DC voltage or an AC voltage. For example, DC-DC conversion is useful for powering the control unit and components of a heating system, in which case possible voltage levels include ±3.3 V, ±5 V, and / or ±12 V. Finally, in some embodiments, a power factor correction ("PFC") stage can be included in the design of the TSP depending on the power source. In some embodiments, the PFC can help correct for non-linear loads of the power source that may be required. Both active and passive PFC stages are available for use. In some embodiments, the PFC can help correct for non-linear loads of the power source that may be required. Both active and passive PFC stages are available for use. In some embodiments, the PFC can help correct for non-linear loads of the power source that may be required. Both active and passive PFC stages are available for use.

[0082] In some embodiments, the ACG uses the input power from the TSP and converts it to the desired high Convert to an alternating current (AC) signal. In some embodiments, the ACG is powered by the signal conversion unit designed to improve transmission efficiency. In some embodiments, the ACG includes a power amplifier or an AC or RF generator or oscillator.

[0083] In some embodiments, the main power amplification stage of the power amplifier is either "linear" or "switching" . The associated trade - offs between these two architectures can include efficiency, power handling, and linearity. Examples of linear amplifiers include Class - A, Class - B, and Class - C. Examples of switching amplifiers include Class - D, Class -E, and Class - F. In some embodiments, linear amplifiers have high linearity and low efficiency compared to switching amplifiers. Low efficiency can lead to problems such as difficult thermal management and the need for high - specification components. Low linearity can lead to problems such as increased harmonic components, compliance issues, reduced efficiency, and difficulties in physical and electrical layout design.

[0084] In some embodiments, the ACG includes a full - bridge Class - D amplifier. For example, the amplifier design uses a dual MOSFET transistor powered by a gate driver and a temperature - compensated crystal oscillator ( "TCXO") that generates the desired frequency. FIG. 10A is a schematic diagram of an exemplary ACG subunit 1000 that includes a Class - D amplifier 1010 with a dual MOSFET transistor, a temperature - controlled crystal oscillator ( "TCXO") 1020, and a gate driver 1030. FIG. 10B is an exemplary class using a dual MOSFET It is a theoretical schematic diagram of a D amplifier. In some embodiments, the full-bridge architecture provides a differential (balanced) drive function compared to the half-bridge architecture, and can provide four times the power output for a given bus voltage level under a given load. Differential drive can also be suitable for exhaust gas compliance under the balanced load state provided by the expected wing structure. Further, in some embodiments, the Class-D architecture can have a higher switch utilization than other switching architectures.

[0085] In some embodiments, within the Class-D architecture, many input parameters can be changed to improve the output parameters under a single-frequency drive. Examples of input parameters include dead time. Examples of output parameters include efficiency, peak component stress, etc.

[0086] In some embodiments, the Class-D architecture has a high switch utilization, completes the implementation of the reconstruction components, and can make them suitable for potential ASIC development. In such a development, all control components and power electronics can be integrated onto the same die or in an MCP (multi-chip package) for an SoC (system-on-chip) implementation. In some embodiments, the Class-D architecture has a distributed module that houses the SoC and support circuits mounted at various distributed locations of a given functional part of an aircraft.

[0087] In other embodiments, a single-switch architecture, such as Class-E or Class-F Other switching mode designs such as are utilized. In some embodiments, such an architecture may have the potential for higher switching frequency implementation, and the high side gate driver may become difficult or impractical. In some embodiments, due to potential limitations of Class-D implementation at high frequencies, a single switch architecture can be used instead as the frequency increases.

[0088] In some embodiments, harmonic reduction and elimination techniques are used together with the switch mode amplifier to mitigate the adverse effects of non-linear distortion inherent in some switching architectures. For example, harmonics can be removed during signal generation by changing the duty cycle of the base waveform, pulse blanking, and other techniques.

[0089] In some embodiments, the ACG includes transistors such as silicon MOSFETs. In some embodiments, the transistor is a gallium nitride (GaN) MOSFET. In certain embodiments, the GaN transistor has advantageous characteristics such as on-resistance, turn-on gate charge, reverse recovery charge, etc. In some embodiments, GaN is more suitable for higher frequencies.

[0090] In some embodiments, the TSP further includes a low power conversion ("LPC") stage, such as a linear regulator, to draw power from an existing power source and convert it into a power input signal suitable for elements such as a gate driver or crystal oscillator that drives the ACG. FIG. 10C is a schematic diagram of an exemplary ACG subunit 1050, which includes dual MOSFET transistors. ​​​​​​​​It includes a Class D amplifier 1010, a temperature-controlled crystal oscillator ("TCXO") 1020, a gate driver 1030, and an LPC1050.

[0091] In some embodiments, the AC generation subunit is placed near the target area. This possible advantage of the design is to limit the losses and emissions that occur when an alternating current is passed from the AC generation subunit to the target area via the adjustment network. In some embodiments, the TSP subunit can be placed near the AC generation unit, near an existing power supply or near a dedicated battery. If the TSP is close to the ACG, it can be integrated with the ACG, which may reduce the number and complexity of the modules within the system. If the TSP is close to an existing power supply or a dedicated battery, it can be designed to improve the power transmission from the power supply or battery to the AC G (improve efficiency and reduce EMI). For example, if the existing power supply supplies power in the form of 400 Hz, 115 VAC voltage, an AC-DC converter can be included in the TS P to convert the power supply voltage to 250 VDC, reduce the EMI caused by the alternating current, increase the voltage, and increase the efficiency by reducing the current flowing from the TSP to the ACG. For example, if the existing power supply supplies power in the form of 400 Hz, 115 VAC voltage, the TS P includes an AC-DC converter to convert the power supply voltage to 250 VDC, reduce the EMI caused by the alternating current, and increase the voltage and efficiency by reducing the current flowing from the TSP to the ACG. By reducing the EMI caused by the alternating current, increasing the voltage, and reducing the current flowing from the TSP to the ACG, the efficiency can be increased.

[0092] In some embodiments, the control subunit controls the status of the signal conversion unit, such as the on / off mode, power output, frequency, and other parameters, based on the input of relevant data available in the application for which the device (heating system) is being developed, and outputs a control signal to other signal conversion subunits such as the driver of the TSP or ACG. ​​In an example of an aircraft de-icing and anti-icing heating system, in some embodiments, data inputs include manual pilot inputs from cockpit switches, temperatures from in-cabin and out-cabin temperature sensors, wheel-on-weight status from squat switches, information from various aircraft logic units, information from avionics, feedback information from the device (heating system) itself, and other data. In some embodiments, the control subunit includes a microcontroller supervisor powered at a low power conversion (LPC) stage such as a linear regulator, draws power from an existing power source, converts it into an appropriate power input signal, and outputs control signals to the TSP and ACG. FIG. 11 is a schematic diagram of an exemplary control subunit 1100 including a microcontroller 1110 and a low power conversion stage (LPC) 1120.

[0093] In some embodiments, for example, in the case of a de-icing heating system retrofitted to an aircraft, the signal conversion unit can be installed in a central location near an available electrical bus. This can reduce the complexity of installation, labor time, and the cost of the unit. In some embodiments, the signal conversion unit is decentralized and installed near the target area. This shortens the length between the signal conversion unit and the target area that the AC signal has to travel, and can reduce the cost associated with the electromagnetic interference (''EMI'') shielding of the signal and the cable requirements for transmitting such AC signals.

[0094] In some embodiments, the heating system includes an impedance adjustment network (''IAN'') configured to adjust the output impedance of the heating system to a desired level.​​ has. For example, the IAN can be configured to adjust the output impedance of the heating system to correspond to the input impedance of the bulk medium being heated . For example, the I AN can be configured to adjust the impedance between the output of the heating system and the input of the bulk medium to be within a desired range with respect to each other. In some embodiments, the impedance matching network is configured to adjust the output impedance of the heating system to closely match the impedance of the bulk medium . In other words, the matching network is configured to match the output impedance of the STU (the "source") to the impedance of the target region ( the "load") within reasonable engineering tolerances. In some embodiments, matching the source impedance and the load impedance involves adjusting the source impedance of the heating system to be the complex conjugate of the impedance of the bulk medium . In some embodiments, the impedance matching network is adjusted such that the output impedance of the heating system is within 10 to 30% of the impedance of the bulk medium being heated .

[0095] FIG. 12 is a conceptual diagram of an adjustment network 1200 between a source 1210 and a load 1220 . FIG. 12 shows an adjustment network that receives input power from the STU (the "source") via an impedance-adjusted input port at the output of the STU and outputs power to the target region (the "load") via an impedance-adjusted output port configured to correspond to the target region .

[0096] Generally, for an AC signal, when the output impedance of the source corresponds to the impedance of the load ​​If not, some of the signal transmitted from the source to the load will not pass through the load but be reflected back to the source. In some embodiments, the impedance matching network can achieve several advantages, such as suppressing signal reflection and the increase of voltage standing waves, · reducing the terminal voltage of the heating system and the risk of arc discharge · improving the efficiency of the heating system · reducing the total output power required from the STU, thus reducing the size, weight, and cost of the STU · reducing stress on system components · improving reliability · reducing the temperature gradient of cables and bulk media and so on.

[0097] In some embodiments, the output impedance of the STU is higher than the impedance of the target area. In that case, the matching network converts the power of a relatively high voltage and low current from the STU into the power of a relatively low voltage and high current supplied to the target area. In these embodiments, this means that the large current is only supplied after the matching network, thus near the target area, reducing the joule loss in the rest of the SGU and improving the overall efficiency of the heating system.

[0098] In various embodiments, the matching network may be centrally located or distributed throughout the target area. By distributing the matching network, while enabling the cable to function as a filter, the impact of peak voltage, peak current, and / or temperature on specific components can potentially be reduced. Distributed placement can also add modularity to the system design, thereby improving the maintainability / replaceability of components. Additionally, distributed​ The configuration can place the system away from dangerous areas such as sensitive equipment and fuel tanks.

[0099] Furthermore, in some embodiments, the tuning network can be balanced by grounding the midpoint in the network, including additional capacitive components. When driven by a full differential source, this network operates in balance, enabling a high common-mode rejection ratio and excellent noise immunity. In some embodiments, such balance is not achieved, and the return path of the tuning network terminates at the circuit ground.

[0100] Generally, in some embodiments, the tuning network can include passive electronic components arranged in a specific building block configuration. For example, these building block configurations can include transformers, L-networks, π-networks, T-networks, and other configurations. FIGS. 13A - D are schematic diagrams of exemplary impedance tuning network building blocks.

[0101] In some embodiments, the tuning network of the heating system includes a passive tuning subunit. FIG. 14 is a schematic diagram of an exemplary tuning network unit 1400 including a passive tuning subunit 1410. In some embodiments, the passive tuning subunit can include one or more of the above building block configurations and other configurations together. In some embodiments, as the passive electronic components of the passive tuning subunit, for example, those with a high quality factor are selected to improve the efficiency of the network.

[0102] In some embodiments, the tuning network of the heating system can be designed to have a high quality factor (high -Q) or a low quality factor (low-Q). The high-Q tuning net work can be used to remove harmonic signal components. Since the harmonic components can be higher than in the case of a linear amplifier, filtering may be more advantageous in the design of a switching amplifier. However, a high-Q network can be more sensitive to component tolerances, operating variations in the external conditions, assembly variations, and other variations within the system. Therefore, a high-Q system can pose practical problems during system implementation. For example, in the case of a de-icing system for an aircraft wing, if the system is High-Q, the impedance tuning network can go out of tune due to small perturbations (such as flap movement), creating a risk of failure. Reducing the harmonic components outside the fundamental drive frequency can be beneficial both for regulatory certification and for practical design concerns, such as the presence of stray signals within the design, excessive stress on components (within peak or time-average ratings), instability of control algorithms, etc. In some cases, these sensitivity concerns can even be mitigated or eliminated by using dynamic tuning elements. In some embodiments, the design of the tuning network of the heating system can be based on the concepts of transmission line tuning. For example, the cable connections at the input and / or output of the tuning network can be considered part of the tuning network. In some embodiments, by selecting appropriate cable materials, form factors, dimensions, and lengths, appropriate impedance tuning can be achieved. the impedance tuning network can go out of tune due to small perturbations (such as flap movement), creating a risk of failure. Reducing the harmonic components outside the fundamental drive frequency can be beneficial both for regulatory certification and for practical design concerns, such as the presence of stray signals within the design, the impedance tuning network can go out of tune due to small perturbations (such as flap movement), creating a risk of failure. Reducing the harmonic components outside the fundamental drive frequency can be beneficial both for regulatory certification and for practical design concerns, such as the presence of stray signals within the design, the impedance tuning network can go out of tune due to small perturbations (such as flap movement), creating a risk of failure. Reducing the harmonic components outside the fundamental drive frequency can be beneficial both for regulatory certification and for practical design concerns, such as the presence of stray signals within the design, the impedance tuning network can go out of tune due to small perturbations (such as flap movement), creating a risk of failure. Reducing the harmonic components outside the fundamental drive frequency can be beneficial both for regulatory certification and for practical design concerns, such as the presence of stray signals within the design, the impedance tuning network can go out of tune due to small perturbations (such as flap movement), creating a risk of failure. Reducing the harmonic components outside the fundamental drive frequency can be beneficial both for regulatory certification and for practical design concerns, such as the presence of stray signals within the design, the impedance tuning network can go out of tune due to small perturbations (such as flap movement), creating a risk of failure. Reducing the harmonic components outside the fundamental drive frequency can be beneficial both for regulatory certification and for practical design concerns, such as the presence of stray signals within the design,

[0103] In some embodiments, the design of the tuning network of the heating system can be based on the concepts of transmission line tuning. For example, the cable connections at the input and / or output of the tuning network can be considered part of the tuning network. In some embodiments, by selecting appropriate cable materials, form factors, dimensions, and lengths, appropriate impedance tuning can be achieved. by selecting appropriate cable materials, form factors, dimensions, and lengths, appropriate impedance tuning can be achieved. by selecting appropriate cable materials, form factors, dimensions, and lengths, appropriate impedance tuning can be achieved. by selecting appropriate cable materials, form factors, dimensions, and lengths, appropriate impedance tuning can be achieved.

[0104] In some embodiments, the tuning network of the heating system is a dynamic tuning network including an active tuning subunit and a control subunit. FIG. 15A is a schematic diagram of an exemplary tuning network unit 1500 including an active tuning subunit 1510 and a control subunit 1520. In some embodiments, the active tuning subunit includes one or more tuning network configurations controlled by the control subunit. In some embodiments, passive electronic components of the active tuning network subunit are selected to have a high quality factor, for example, to improve the efficiency of the network. In some embodiments, the control subunit receives input data (such as forward power, reflected power, voltage standing wave ratio, etc.) from signals transmitted and received with the target area, and dynamically controls the active tuning network subunit to adjust impedance in real time. For example, such control can be realized through tuning elements included in the design of the active tuning network subunit. For example, the dynamic tuning elements can include tunable capacitors and / or tunable inductors. Further, examples of tunable elements include PIN diodes, BST capacitors, DTC (discrete tuning capacitors), varactor diodes, MEMS, ferroelectric varactors, ferromagnetic components, Y IG tuning filters, etc. Examples of evaluation criteria that can be considered during the evaluation of such devices include the operating frequency range, adjustment of DC voltage, adjustment of the linearity of the control signal, complexity of control, adjustment ratio of capacitance / inductance, tuning speed, quality factor (Q), switching life, power dissipation, etc. For example, such control can be realized through tuning elements included in the design of the active tuning network subunit. For example, the dynamic tuning elements can include tunable capacitors and / or tunable inductors. Further, examples of tunable elements include PIN diodes, BST capacitors, DTC (discrete tuning capacitors), varactor diodes, MEMS, ferroelectric varactors, ferromagnetic components, Y IG tuning filters, etc. Examples of evaluation criteria that can be considered during the evaluation of such devices include the operating frequency range, adjustment of DC voltage, adjustment of the linearity of the control signal, complexity of control, adjustment ratio of capacitance / inductance, tuning speed, quality factor (Q), switching life, power dissipation, etc. Examples of evaluation criteria that can be considered during the evaluation of such devices include the operating frequency range, adjustment of DC voltage, adjustment of the linearity of the control signal, complexity of control, adjustment ratio of capacitance / inductance, tuning speed, quality factor (Q), switching life, power dissipation, etc. Examples of evaluation criteria that can be considered during the evaluation of such devices include the operating frequency range, adjustment of DC voltage, adjustment of the linearity of the control signal, complexity of control, adjustment ratio of capacitance / inductance, tuning speed, quality factor (Q), switching life, power Packaging cost, power processing, power consumption, breakdown voltage, linearity, third-order inter cept (IP3), integration function, etc.

[0105] In some embodiments, using a control unit with feedback between the target area and the adjustment network can adapt the network to external changes that may affect the impedance of the target area or the STU output impedance, such as changes in the target area, the location of the heating system, the temperature and geometric configuration of the environment surrounding the system and the target area, and other parameters. In some embodiments, the adjustment network draws power from an existing power source and further includes a low-power conversion ("LPC") stage, such as a linear regulator, that converts it into a power input signal suitable for the control subunit. FIG. 15B is a schematic diagram of an exemplary adjustment network unit 1550 that includes an active adjustment subunit 1510, a low-power conversion stage ("LPC") 1560, and a control subunit 1520. In some embodiments, for all configurations and environmental conditions that may occur during the use of the heating system, special impedance measurements can be performed on the target area. These measurements enable the design of a dynamic adjustment network unit that is adapted to the narrowest impedance range that allows appropriate impedance adjustment across the entire spectrum of the above situations. In some embodiments, such a design improves the efficiency of the system while reducing the weight, complexity, and cost of the adjustment network by using algorithm optimization or computer simulation. In some embodiments, for all configurations and environmental conditions that may occur during the use of the heating system, special impedance measurements can be performed on the target area. These measurements enable the design of a dynamic adjustment network unit that is adapted to the narrowest impedance range that allows appropriate impedance adjustment across the entire spectrum of the above situations. In some embodiments, such a design improves the efficiency of the system while reducing the weight, complexity, and cost of the adjustment network by using algorithm optimization or computer simulation. In some embodiments, for all configurations and environmental conditions that may occur during the use of the heating system, special impedance measurements can be performed on the target area. These measurements enable the design of a dynamic adjustment network unit that is adapted to the narrowest impedance range that allows appropriate impedance adjustment across the entire spectrum of the above situations. In some embodiments, such a design improves the efficiency of the system while reducing the weight, complexity, and cost of the adjustment network by using algorithm optimization or computer simulation. In some embodiments, for all configurations and environmental conditions that may occur during the use of the heating system, special impedance measurements can be performed on the target area. These measurements enable the design of a dynamic adjustment network unit that is adapted to the narrowest impedance range that allows appropriate impedance adjustment across the entire spectrum of the above situations. In some embodiments, such a design improves the efficiency of the system while reducing the weight, complexity, and cost of the adjustment network by using algorithm optimization or computer simulation. In some embodiments, for all configurations and environmental conditions that may occur during the use of the heating system, special impedance measurements can be performed on the target area. These measurements enable the design of a dynamic adjustment network unit that is adapted to the narrowest impedance range that allows appropriate impedance adjustment across the entire spectrum of the above situations. In some embodiments, such a design improves the efficiency of the system while reducing the weight, complexity, and cost of the adjustment network by using algorithm optimization or computer simulation. In some embodiments, for all configurations and environmental conditions that may occur during the use of the heating system, special impedance measurements can be performed on the target area. These measurements enable the design of a dynamic adjustment network unit that is adapted to the narrowest impedance range that allows appropriate impedance adjustment across the entire spectrum of the above situations. In some embodiments, such a design improves the efficiency of the system while reducing the weight, complexity, and cost of the adjustment network by using algorithm optimization or computer simulation. In some embodiments, for all configurations and environmental conditions that may occur during the use of the heating system, special impedance measurements can be performed on the target area. These measurements enable the design of a dynamic adjustment network unit that is adapted to the narrowest impedance range that allows appropriate impedance adjustment across the entire spectrum of the above situations. In some embodiments, such a design improves the efficiency of the system while reducing the weight, complexity, and cost of the adjustment network by using algorithm optimization or computer simulation. is.

[0106] In some embodiments, for all configurations and environmental conditions that may occur during the use of the heating system, special impedance measurements can be performed on the target area. These measurements enable the design of a dynamic adjustment network unit that is adapted to the narrowest impedance range that allows appropriate impedance adjustment across the entire spectrum of the above situations. In some embodiments, such a design improves the efficiency of the system while reducing the weight, complexity, and cost of the adjustment network by using algorithm optimization or computer simulation. In some embodiments, for all configurations and environmental conditions that may occur during the use of the heating system, special impedance measurements can be performed on the target area. These measurements enable the design of a dynamic adjustment network unit that is adapted to the narrowest impedance range that allows appropriate impedance adjustment across the entire spectrum of the above situations. In some embodiments, such a design improves the efficiency of the system while reducing the weight, complexity, and cost of the adjustment network by using algorithm optimization or computer simulation. In some embodiments, for all configurations and environmental conditions that may occur during the use of the heating system, special impedance measurements can be performed on the target area. These measurements enable the design of a dynamic adjustment network unit that is adapted to the narrowest impedance range that allows appropriate impedance adjustment across the entire spectrum of the above situations. In some embodiments, such a design improves the efficiency of the system while reducing the weight, complexity, and cost of the adjustment network by using algorithm optimization or computer simulation. In some embodiments, for all configurations and environmental conditions that may occur during the use of the heating system, special impedance measurements can be performed on the target area. These measurements enable the design of a dynamic adjustment network unit that is adapted to the narrowest impedance range that allows appropriate impedance adjustment across the entire spectrum of the above situations. In some embodiments, such a design improves the efficiency of the system while reducing the weight, complexity, and cost of the adjustment network by using algorithm optimization or computer simulation. In some embodiments, for all configurations and environmental conditions that may occur during the use of the heating system, special impedance measurements can be performed on the target area. These measurements enable the design of a dynamic adjustment network unit that is adapted to the narrowest impedance range that allows appropriate impedance adjustment across the entire spectrum of the above situations. In some embodiments, such a design improves the efficiency of the system while reducing the weight, complexity, and cost of the adjustment network by using algorithm optimization or computer simulation. In some embodiments, for all configurations and environmental conditions that may occur during the use of the heating system, special impedance measurements can be performed on the target area. These measurements enable the design of a dynamic adjustment network unit that is adapted to the narrowest impedance range that allows appropriate impedance adjustment across the entire spectrum of the above situations. In some embodiments, such a design improves the efficiency of the system while reducing the weight, complexity, and cost of the adjustment network by using algorithm optimization or computer simulation. In some embodiments, for all configurations and environmental conditions that may occur during the use of the heating system, special impedance measurements can be performed on the target area. These measurements enable the design of a dynamic adjustment network unit that is adapted to the narrowest impedance range that allows appropriate impedance adjustment across the entire spectrum of the above situations. In some embodiments, such a design improves the efficiency of the system while reducing the weight, complexity, and cost of the adjustment network by using algorithm optimization or computer simulation. It is possible.

[0107] In some embodiments, a dedicated cable can be used in the heating system, and the cable can be specifically designed or selected at each stage to improve efficiency and shield the power signal transmitted to the target area. FIG. 16 is a schematic diagram of a cable stage in an exemplary heating system. In various embodiments, the cable stages of the heating system can be customized. For example, the cable (cable stage 1) 1630 between the power supply 1620 and the STU 1610, the cable (cable stage 2) 1660 within the STU between the TSP 1640 and the ACG 1650 sub-units, the cable (cable stage 3) 1680 between the STU 1610 and the tuning network 1670, and the cable (cable stage 4) 1695 between the tuning network 1670 and the target area 1690 can be included. FIG. 16 is a schematic diagram of a cable stage in an exemplary heating system. In various embodiments, the cable stages of the heating system can be customized. For example, the cable (cable stage 1) 1630 between the power supply 1620 and the STU 1610, the cable (cable stage 2) 1660 within the STU between the TSP 1640 and the ACG 1650 sub-units, the cable (cable stage 3) 1680 between the STU 1610 and the tuning network 1670, and the cable (cable stage 4) 1695 between the tuning network 1670 and the target area 1690 can be included.

[0108] Generally, the design of the dedicated cable for the entire heating system may involve various design considerations. In some embodiments, heat-related considerations may be involved. For example, in some embodiments, the cable connecting the tuning network to the target area (or passing near the target area and, in some cases, returning to the tuning network) can be fixed so that the heat flow from the cable to the target area increases. This is advantageous when a portion of the heat generated when current flows through the cable is recovered (otherwise lost) and transmitted to the target area for the purpose of generating heat, improving the efficiency of the system. This is advantageous when a portion of the heat generated when current flows through the cable is recovered (otherwise lost) and transmitted to the target area for the purpose of generating heat, improving the efficiency of the system. This is advantageous when a portion of the heat generated when current flows through the cable is recovered (otherwise lost) and transmitted to the target area for the purpose of generating heat, improving the efficiency of the system. This is advantageous when a portion of the heat generated when current flows through the cable is recovered (otherwise lost) and transmitted to the target area for the purpose of generating heat, improving the efficiency of the system.

[0109] In some embodiments, fasteners are used to route the cable near the target area. This can be achieved. In such cases, to improve thermal contact, a thermal conductive material with good thermal conductivity can be used to fill the air gap between the cable - fastener - target area interfaces. In some embodiments, the cable is directly attached to the target area. In such cases, to improve thermal contact, an adhesive with high thermal conductivity can be used to attach the cable to the contact area.

[0110] In some embodiments, the cable is directly attached to the target area. In such cases, to improve thermal contact, an adhesive with high thermal conductivity can be used to attach the cable to the contact area. In some embodiments, the cable is directly attached to the target area. In such cases, to improve thermal contact, an adhesive with high thermal conductivity can be used to attach the cable to the contact area. Furthermore, a thermal interface material with high thermal conductivity can be used to fill some or all of the remaining air gap between the cable and the target area. In some embodiments, depending on the unit, target area, or power source to which the cable is connected, different cross - sectional shapes and different cable form factors can be used.

[0111] In some embodiments, the cable is directly attached to the target area. In such cases, to improve thermal contact, an adhesive with high thermal conductivity can be used to attach the cable to the contact area. In some embodiments, depending on the unit, target area, or power source to which the cable is connected, different cross - sectional shapes and different cable form factors can be used. In some embodiments, the cable contains only the conductors, with or without a protective jacket (for electrical insulation and / or environmental protection against corrosion, humidity, extreme temperatures, friction, etc.). This configuration can be advantageous for a system that carries DC signals or transmits signals to the target area. In some embodiments, the cable contains only the conductors, with or without a protective jacket (for electrical insulation and / or environmental protection against corrosion, humidity, extreme temperatures, friction, etc.). This configuration can be advantageous for a system that carries DC signals or transmits signals to the target area.

[0112] In some embodiments, the cable is a coaxial cable. The coaxial cable includes a shield and can reduce EMI radiation during the transmission of AC signals and protect against EMI around the system during the transmission of any signal. In some embodiments, the cable is a coaxial cable. The coaxial cable includes a shield and can reduce EMI radiation during the transmission of AC signals and protect against EMI around the system during the transmission of any signal. In some embodiments, the cable is a coaxial cable. The coaxial cable includes a shield and can reduce EMI radiation during the transmission of AC signals and protect against EMI around the system during the transmission of any signal.

[0113] In some embodiments, the cable is a triaxial cable. This design can be beneficial for EMI protection and insulation during the transmission of any signal, more specifically, for example, during the transmission of balanced signals at the output of a balanced implementation of an adjustment network unit. In some embodiments, the cable is a triaxial cable. This design can be beneficial for EMI protection and insulation during the transmission of any signal, more specifically, for example, during the transmission of balanced signals at the output of a balanced implementation of an adjustment network unit. In some embodiments, the cable is a triaxial cable. This design can be beneficial for EMI protection and insulation during the transmission of any signal, more specifically, for example, during the transmission of balanced signals at the output of a balanced implementation of an adjustment network unit.

[0114] In some embodiments, the cable is a biaxial cable. This design may have advantages similar to those provided by a triaxial cable.

[0115] In some embodiments, different cable cross-sectional shapes can be used depending on the unit, target area, or power source to which the cable is connected.

[0116] In some embodiments, the cross-section of the conductor of the cable has a circular shape. This design has the advantage that, for coaxial / triaxial / biaxial form factors, the manufacturing cost is relatively low (the non-recurring engineering cost is low).

[0117] In some embodiments, the cross-section of the cable is flat and / or rectangular. For example, this cross-section can be an advantageous cable shape for the final stage of a system where the cable supplies current to a target area. At the final stage, the rectangular shape can reduce the proximity effect and skin effect on the current circulating within the cable, thus reducing losses and improving the efficiency of the system. Furthermore, this shape can reduce the total amount of conductive material required for the cable and potentially reduce the weight of the system, which is an important consideration in the case of an aircraft de-icing system.

[0118] In some embodiments, depending on the specific input and output currents and signals carried by the cable, and depending on its cross-sectional shape and other factors, the size of the cross-section can be selected to limit the operating temperature range (e.g., for compliance and determined by the materials used in the manufacture of the cable) and to reduce its weight and size.

[0119] In some embodiments, different cable shield types (and cross-sectional shapes) are used depending on the unit to which the cable is connected, the target area, or the power supply. In some embodiments, the cable does not include a shield. This may be advantageous in stages where DC current is being carried (and thus when EMI suppression requirements are low), and in stages where there is no need to carry return current (for example, in the latter stages of a system in embodiments where the target area carries the return current and nearby cables supply that current to the target area).

[0120] In some embodiments, a single shield is used. This is advantageous, for example, in cases where one shield layer is sufficient to comply with EMI / EMC requirements and other environmental requirements for the cable. In some embodiments, a dual shield is used. This can further reduce EMI radiation and lower the cable's EMI susceptibility by adding another shield layer. In some embodiments, more than triple shields are used. Additional shield layers are added for the same reasons as above. In some embodiments, for a particular target area, the cable supplying current to this area may follow different possible paths.

[0121] In some embodiments, the cable is routed from one side of the target area to the other side almost

[0122]

[0123]

[0124]

[0125] ​​​​​​​​​​They only follow linear paths. In some cases, these paths may be parallel. In some embodiments, the cable passes diagonally through the target area and is aligned at different points in the target area. This may, for example, produce more uniform heat across the surface of the target area. This helps to create relatively hot spots at desired locations where the cables cross.

[0126] In some embodiments, the cable may be routed in a zigzag type path, a serpentine path, or The design follows a path that can be modeled with a 2D spline curve or a 2D spline curve. Increasing the effectiveness of the system by lengthening the path the current must follow, and therefore the effective resistance This can be achieved, for example, by higher efficiency, lower current, and This may help achieve a more stable impedance regulation by the system.

[0127] In some embodiments, the cable path design may include these and other options. The approach is based on a combination of

[0128] In some embodiments, depending on the design, stage, and purpose of the cable, Different materials can be used for the manufacture of the.

[0129] Depending on local voltage, current, temperature, power, bend radius, durability requirements, and other criteria ,Improvements to the cable conductor material in terms of efficiency, conductivity, weight, cost, size and thermal aspects can be selected to be

[0130] In some embodiments, the conductive material is copper, silver, aluminum, carbon fiber composite, titanium. In some embodiments, the conductor is made of any of the aforementioned materials. It is made of and coated with other materials such as silver coating to improve the conductivity of the conductor surface.

[0131] In some embodiments, the conductor may be made of a solid material or more in the form of a wire. For example, in some embodiments, by using an insulating coating such as enamel, the wires can be insulated from each other. For example, using Litz wire can reduce the effects of skin and proximity effects within the cable.

[0132] In some embodiments (e.g., for coaxial / triaxial / biaxial cables), depending on local voltage, current, temperature, power, bend radius, durability requirements, and other criteria, the dielectric material of the cable can be selected to improve efficiency (e.g., by reducing dielectric loss), weight, cost, flexibility, maximum voltage tolerance, maximum power tolerance, temperature rating (due to high temperature tolerance and / or high heat capacity and / or low dielectric loss and / or good thermal conductivity of the cable), etc.

[0133] In some embodiments where transmission line tuning is used within a tuning network unit, the associated cable can also use a dielectric material selected to reach the desired impedance level. Exemplary materials include polyethylene and Teflon-based materials, as well as other materials.

[0134] In some embodiments, depending on local voltage, current, temperature, power, bend radius, durability requirements, and other criteria, the jacket material of the cable can be selected for weight, cost, flexibility, maximum ​​​​Voltage tolerance, temperature rating, and parameters such as heat conduction to a nearby heat sink (e.g., a target area used as a heat sink) are selected to be improved.

[0135] In some embodiments, where transmission line tuning is used as part of a tuning network, in addition to its dielectric, the length of the cable used for impedance tuning can be controlled to reach the target impedance level. For example, a cable that supplies current to a target area is used as part of a transmission line tuning system, an extra length is added for impedance tuning, and it is locally coiled to occupy less space.

[0136] In some embodiments, specific fastening techniques can be used to route the cable along the structure of the system. Such techniques can be selected to reduce installation cost and time, the weight of the system (by reducing the length of wire required and the weight of the fasteners), and to improve the desired electromagnetic effects and heat transfer of the cable in the vicinity of the target area.

[0137] In some embodiments, the fastener is selected to reduce the distance between the cable supplying power to the target area and the target area. This design can create a stronger proximity effect. In some embodiments, a conventional cable fastener design can be selected to shorten the cable - target area distance.

[0138] In some embodiments, the fastener is also used to enhance heat conduction from the cable to the target area.

[0139] ​​​​​​​​​​​​In some embodiments, the material of the fastener is selected to reduce the weight and cost of the system. This can be achieved, for example, by using composite materials. In some embodiments where the fastener is also used for heat conduction to the target area, a material having a high thermal conductivity (e.g., a metallic material that typically has a relatively high thermal conductivity) is selected. In some embodiments, the adhesive used to fix the fasteners to their bonding areas is selected to increase the bonding strength to the target area and ensure long-term bonding. The strength of the adhesive is beneficial when the bonding area is relatively small and relatively strong mechanical constraints occur in the bonding area. Further, in some embodiments where the fastener is used for heat conduction from the cable to the target area, an adhesive is also selected for increasing the thermal conductivity. In some embodiments, the material of the fastener is selected to reduce the weight and cost of the system. This can be achieved, for example, by using composite materials. In some embodiments where the fastener is also used for heat conduction to the target area, a material having a high thermal conductivity (e.g., a metallic material that typically has a relatively high thermal conductivity) is selected. In some embodiments, the material of the fastener is selected to reduce the weight and cost of the system. This can be achieved, for example, by using composite materials. In some embodiments where the fastener is also used for heat conduction to the target area, a material having a high thermal conductivity (e.g., a metallic material that typically has a relatively high thermal conductivity) is selected.

[0140] In some embodiments, the adhesive used to fix the fasteners to their bonding areas is selected to increase the bonding strength to the target area and ensure long-term bonding. The strength of the adhesive is beneficial when the bonding area is relatively small and relatively strong mechanical constraints occur in the bonding area. Further, in some embodiments where the fastener is used for heat conduction from the cable to the target area, an adhesive is also selected for increasing the thermal conductivity. In some embodiments, the adhesive used to fix the fasteners to their bonding areas is selected to increase the bonding strength to the target area and ensure long-term bonding. The strength of the adhesive is beneficial when the bonding area is relatively small and relatively strong mechanical constraints occur in the bonding area. Further, in some embodiments where the fastener is used for heat conduction from the cable to the target area, an adhesive is also selected for increasing the thermal conductivity. In some embodiments, the adhesive used to fix the fasteners to their bonding areas is selected to increase the bonding strength to the target area and ensure long-term bonding. The strength of the adhesive is beneficial when the bonding area is relatively small and relatively strong mechanical constraints occur in the bonding area. Further, in some embodiments where the fastener is used for heat conduction from the cable to the target area, an adhesive is also selected for increasing the thermal conductivity. In some embodiments, the adhesive used to fix the fasteners to their bonding areas is selected to increase the bonding strength to the target area and ensure long-term bonding. The strength of the adhesive is beneficial when the bonding area is relatively small and relatively strong mechanical constraints occur in the bonding area. Further, in some embodiments where the fastener is used for heat conduction from the cable to the target area, an adhesive is also selected for increasing the thermal conductivity. In some embodiments, the adhesive used to fix the fasteners to their bonding areas is selected to increase the bonding strength to the target area and ensure long-term bonding. The strength of the adhesive is beneficial when the bonding area is relatively small and relatively strong mechanical constraints occur in the bonding area. Further, in some embodiments where the fastener is used for heat conduction from the cable to the target area, an adhesive is also selected for increasing the thermal conductivity.

[0141] Finally, in some embodiments where the fastener is used for heat conduction from the cable to the target area, the gap in the area between the cable, the fastener, and the target area is filled with a thermally conductive thermal interface material to improve the heat flow from the cable to the target area. Finally, in some embodiments where the fastener is used for heat conduction from the cable to the target area, the gap in the area between the cable, the fastener, and the target area is filled with a thermally conductive thermal interface material to improve the heat flow from the cable to the target area. Finally, in some embodiments where the fastener is used for heat conduction from the cable to the target area, the gap in the area between the cable, the fastener, and the target area is filled with a thermally conductive thermal interface material to improve the heat flow from the cable to the target area.

[0142] In some embodiments, the cable is directly attached to the surrounding structure, such as a bulk medium, with an adhesive to enable better heat transfer from the cable to the structure to which the cable is attached. The adhesive is selected based on the same criteria as those used for the fasteners. In some embodiments, the cable is directly attached to the surrounding structure, such as a bulk medium, with an adhesive to enable better heat transfer from the cable to the structure to which the cable is attached. The adhesive is selected based on the same criteria as those used for the fasteners. In some embodiments, the cable is directly attached to the surrounding structure, such as a bulk medium, with an adhesive to enable better heat transfer from the cable to the structure to which the cable is attached. The adhesive is selected based on the same criteria as those used for the fasteners.

[0143] In some embodiments, the design of the cable assembly includes dividing a predetermined cable path into two or more separate sets of branches. This can be, for example, one adjustment network In some embodiments, the design of the cable assembly includes dividing a predetermined cable path into two or more separate sets of branches. This can be, for example, one adjustment network Embodiments where the workpiece sends current to a set of multiple target areas are beneficial. In such embodiments, one cable can be made the sole output of the conditioning network, and the cable can be split into separate branches that supply current to each of the multiple target areas such that the cable reaches the multiple target areas. In some embodiments, such splitting can be achieved by splitting the wire into several smaller wires than a given conductor, or if the split cable has wire conductors, sending a subset of the wires to each of the separate branches, or by using a power splitter. The power splitter is useful for controlling the amount of current, voltage, and power flowing through each of the branches into which the cable is split. Similarly, in some embodiments, two or more cables can be fused into a smaller number of cables, and signals from all of the fused cables can be accumulated. Such fusing can be achieved by fusing wires from a given conductor into other wires, regrouping subsets of different wires into a new wire cable, or by using a power combiner (e.g., the same device as the power splitter but used in the reverse direction). The power combiner is useful for controlling the amount of current, voltage, and power flowing through each of the branches where the cables are joined.

[0144]

[0145] In some embodiments, each cable segment of the heating system has its own cable design considerations.

[0146] In some embodiments, efficient power transmission from the power source to the TSP sub-unit is enabled. ​​​​​​​​​​​​​​Cable stage 1 is selected for this purpose. In some embodiments where the power supply outputs a DC current, cable stage 1 includes stranded copper wire insulated with a suitable material and has a total equivalent gauge suitable for the power, voltage, and current supplied to the TSP unit. In some embodiments where the power supply outputs a 400 Hz, 115 VAC signal, cable stage 1 includes copper stranded wire insulated with a suitable material and having a total equivalent gauge suitable for the power, voltage, and current supplied to the TSP unit. In some embodiments, cable stage 2 is selected to enable efficient power transfer from the TSP to the ACG subunit. In some embodiments where the TSP outputs power in the form of a 250 VDC signal, cable stage 2 includes copper stranded wire insulated with a suitable material and having a total equivalent gauge suitable for the power, voltage, and current supplied to the TSP unit. In some embodiments, cable stage 3 is selected and customized to enable efficient power transfer of a high-frequency AC power signal from the output of the STU to the conditioning network. For example, this cable can be designed to reduce the resistance and electromagnetic losses caused by the high frequency of the signal, shield external interference that can alter the signal integrity, and prevent signal leakage from the cable that can affect surrounding equipment and materials. In some embodiments, cable stage 3 is a high-output, high-frequency transmission line in the form of a customized coaxial cable. In some embodiments, this coaxial cable is a core conductor that carries the input signal of the conditioning network and is suitable for carrying power with low resistance loss. In some embodiments where the power supply outputs a 400 Hz, 115 VAC signal, cable stage 1 includes copper stranded wire insulated with a suitable material and having a total equivalent gauge suitable for the power, voltage, and current supplied to the TSP unit. In some embodiments where the power supply outputs a 400 Hz, 115 VAC signal, cable stage 1 includes copper stranded wire insulated with a suitable material and having a total equivalent gauge suitable for the power, voltage, and current supplied to the TSP unit. In some embodiments where the power supply outputs a 400 Hz, 115 VAC signal, cable stage 1 includes copper stranded wire insulated with a suitable material and having a total equivalent gauge suitable for the power, voltage, and current supplied to the TSP unit.

[0147] In some embodiments, cable stage 2 is selected to enable efficient power transfer from the TSP to the ACG subunit. In some embodiments where the TSP outputs power in the form of a 250 VDC signal, cable stage 2 includes copper stranded wire insulated with a suitable material and having a total equivalent gauge suitable for the power, voltage, and current supplied to the TSP unit. In some embodiments where the TSP outputs power in the form of a 250 VDC signal, cable stage 2 includes copper stranded wire insulated with a suitable material and having a total equivalent gauge suitable for the power, voltage, and current supplied to the TSP unit. In some embodiments where the TSP outputs power in the form of a 250 VDC signal, cable stage 2 includes copper stranded wire insulated with a suitable material and having a total equivalent gauge suitable for the power, voltage, and current supplied to the TSP unit. In some embodiments where the TSP outputs power in the form of a 250 VDC signal, cable stage 2 includes copper stranded wire insulated with a suitable material and having a total equivalent gauge suitable for the power, voltage, and current supplied to the TSP unit.

[0148] In some embodiments, cable stage 3 is selected and customized to enable efficient power transfer of a high-frequency AC power signal from the output of the STU to the conditioning network. For example, this cable can be designed to reduce the resistance and electromagnetic losses caused by the high frequency of the signal, shield external interference that can alter the signal integrity, and prevent signal leakage from the cable that can affect surrounding equipment and materials. For example, this cable can be designed to reduce the resistance and electromagnetic losses caused by the high frequency of the signal, shield external interference that can alter the signal integrity, and prevent signal leakage from the cable that can affect surrounding equipment and materials. For example, this cable can be designed to reduce the resistance and electromagnetic losses caused by the high frequency of the signal, shield external interference that can alter the signal integrity, and prevent signal leakage from the cable that can affect surrounding equipment and materials. For example, this cable can be designed to reduce the resistance and electromagnetic losses caused by the high frequency of the signal, shield external interference that can alter the signal integrity, and prevent signal leakage from the cable that can affect surrounding equipment and materials. In some embodiments, cable stage 3 is a high-output, high-frequency transmission line in the form of a customized coaxial cable. In some embodiments, cable stage 3 is a high-output, high-frequency transmission line in the form of a customized coaxial cable. In some embodiments, this coaxial cable is a core conductor that carries the input signal of the conditioning network and is suitable for carrying power with low resistance loss. A core conductor made of a stranded copper wire with a sufficient outer diameter, and a dielectric surrounding the core selected to enhance electrical insulation and maintain high voltage and high temperature ranges, a shield conductor made of twisted and braided copper with an equivalent gauge large enough to carry power with low resistive losses to provide a signal return path to the ACG, a first casing insulating the selected conductive shield to maintain high voltage and high temperature ranges, an external shield similar to the conductive shield but not directly conducting current, used to protect the cable from external interference and prevent leakage, and finally, a second casing similar to the first casing insulating the external shield. In some embodiments, cable section 4 is selected and customized to enable efficient transmission of high-frequency large current AC power signals from the tuning network to the target area. In some embodiments, this cable is designed to adjust the impedance between the tuning network and the target area, reduce resistive and electromagnetic losses caused by the high frequency of the signal, shield external interference that could alter the signal integrity, and prevent signal leakage from the cable that could affect surrounding equipment and materials. In some embodiments, cable section 4

[0149] is a high-power, high-frequency, and high-current transmission line in the form of a customized coaxial cable, and is similar to the embodiment of cable section 3 described above, except that it uses a larger conductor gauge and diameter and an additional silver coating on the same conductor to improve high-current performance and further reduce resistive losses. In some embodiments, cable section 4 is further customized based on the design of Litz wire. The purpose of such a design is to enable efficient transmission of high-frequency large current AC power signals from the tuning network to the target area. In some embodiments, this cable is designed to adjust the impedance between the tuning network and the target area, reduce resistive and electromagnetic losses caused by the high frequency of the signal, shield external interference that could alter the signal integrity, and prevent signal leakage from the cable that could affect surrounding equipment and materials. In some embodiments, cable section 4 is a high-power, high-frequency, and high-current transmission line in the form of a customized coaxial cable, and is similar to the embodiment of cable section 3 described above, except that it uses a larger conductor gauge and diameter and an additional silver coating on the same conductor to improve high-current performance and further reduce resistive losses. In some embodiments, cable section 4 is further customized based on the design of Litz wire. The purpose of such a design is to enable efficient transmission of high-frequency large current AC power signals from the tuning network to the target area. is a high-power, high-frequency, and high-current transmission line in the form of a customized coaxial cable, and is similar to the embodiment of cable section 3 described above, except that it uses a larger conductor gauge and diameter and an additional silver coating on the same conductor to improve high-current performance and further reduce resistive losses. In some embodiments, cable section 4 is further customized based on the design of Litz wire. The purpose of such a design is to improve high-current performance and further reduce resistive losses. In some embodiments, cable section 4 is further customized based on the design of Litz wire. The purpose of such a design is to improve high-current performance and further reduce resistive losses. In some embodiments, cable section 4 is further customized based on the design of Litz wire. The purpose of such a design is , individually insulated (e.g., using an enamel coating), and twisted or braided in a perfectly symmetrical manner to produce a conductor thinner than the skin depth from a brand, in order to reduce losses due to coil proximity and skin effect. By manufacturing a conductor with a thickness thinner than the skin depth from a brand that is twisted or braided in a perfectly symmetrical manner. This is to reduce losses due to coil proximity and skin effect.

[0150] Generally, an electrode includes a material through which current passes and allows current to enter or exit a target region in a bulk medium. In some embodiments, a connector is used to connect the electrode to the bulk medium. A connector refers to a fixture for connecting an electrode to a bulk medium. In some embodiments, the electrode and the connector are designed to reduce the contact resistance between the electrode and the bulk medium. In other words, the electrode is designed to smooth the potential difference generated between both ends of the target region with respect to a predetermined return path. If this contact resistance is higher than the resistance of the target region between two electrodes, more heat is generated at the contact point than along the target region, and the heating efficiency of the heating system decreases. For similar reasons, in some embodiments, the electrode and the connector are designed to reduce the contact resistance between the electrode and the wire (or cable) of the heating system. In some embodiments, the electrode and the connector are also designed to reduce electromagnetic losses (e.g., electromagnetic radiation). In some embodiments, a connector is used to connect the electrode to the bulk medium. A connector refers to a fixture for connecting an electrode to a bulk medium. In some embodiments, the electrode and the connector are designed to reduce the contact resistance between the electrode and the bulk medium. In other words, the electrode is designed to smooth the potential difference generated between both ends of the target region with respect to a predetermined return path. If this contact resistance is higher than the resistance of the target region between two electrodes, more heat is generated at the contact point than along the target region, and the heating efficiency of the heating system decreases. If this contact resistance is higher than the resistance of the target region between two electrodes, more heat is generated at the contact point than along the target region, and the heating efficiency of the heating system decreases. In some embodiments, for similar reasons, the electrode and the connector are designed to reduce the contact resistance between the electrode and the wire (or cable) of the heating system. For similar reasons, in some embodiments, the electrode and the connector are designed to reduce the contact resistance between the electrode and the wire (or cable) of the heating system. In some embodiments, the electrode and the connector are designed to reduce the contact resistance between the electrode and the wire (or cable) of the heating system. In some embodiments, the electrode and the connector are also designed to reduce electromagnetic losses (e.g., electromagnetic radiation).

[0151] In some embodiments, considerations for electrode design to achieve one or more of the above goals include: (1) selecting an electrode material with high conductivity, and (2) increasing the "actual" contact area between the electrode and the bulk medium, and between the electrode and the wire. In some embodiments, considerations for electrode design to achieve one or more of the above goals include: (1) selecting an electrode material with high conductivity, and (2) increasing the "actual" contact area between the electrode and the bulk medium, and between the electrode and the wire. In some embodiments, considerations for electrode design to achieve one or more of the above goals include: (1) selecting an electrode material with high conductivity, and (2) increasing the "actual" contact area between the electrode and the bulk medium, and between the electrode and the wire. The "actual" contact area is the microscopic metal-to-metal or material-to-material contact where current flows from one material to another. Touch is pointed to and often referred to as the "a spot". In some embodiments, the connector is also designed to achieve these goals.

[0152] In some embodiments, the material of the electrode can include silver, copper, aluminum, carbon fiber composite, ti tan, or alloys thereof.

[0153] In some embodiments, the electrode is part of a cable used to transmit current to the bulk medium.

[0154] In some embodiments, the shape of the electrode is designed to conform to a specific target area and / or reduce the contact resistance between the electrode and the bulk medium and / or reduce electromagnetic losses.

[0155] In some embodiments, the electrode is circular.

[0156] In some embodiments, the electrode is in the shape of the end of a cable used to transmit current to the bulk medium.

[0157] In some embodiments, a line electrode (e.g., a rectangular electrode with a length greater than its width) is used.

[0158] In some embodiments, an electrode in the shape of a 2D spline curve with a thin thickness (a third spatial dimension) is used.

[0159] In some embodiments, the target area can be connected by sandwiching a cable conductor between a connector plate and the target area. For example, a part of the side surface of the connector plate that contacts the target area can be milled. The conductor of the cable can be placed in this milled part. ​​​​ By installing in sections, the cable conductor can be connected to the target area. In this configuration Furthermore, the electrode connector plate can be clamped or adhered under the cable conductor, and there is no need to bend the connection to ensure proper coupling with the target area.

[0160] Generally, various implementation and design considerations of the electrodes and connectors are being considered.

[0161] FIG. 17 is a photograph of an exemplary circular stud electrode 1700 for a heating system 100. The electrode includes a circular ground stud coupled to a disk 1710 made of a conductive material (e.g., aluminum), on which a threaded conductive portion 1720 (e.g., aluminum) is mounted.

[0162] In some embodiments, the conductor of the cable connected to the target area via the electrode 1700 is wound around the threaded conductive portion 1720, placed flat, and covers a substantial portion of the surface areas of both the threaded conductive portion and the disk 1710. In some embodiments, nuts and washers are used on the threaded conductive portion 1720 to press the conductor against the disk 1710, which can guarantee a higher contact area and a lower contact resistance.

[0163] In some embodiments, the air gap between the washer, the cable, and the disk 1710 is filled with an electrically and / or thermally conductive thermal interface material, which guarantees an improvement in the thermal and / or electrical conductivity from the cable to the stud 1700.

[0164] In some embodiments, the circular stud electrode 1700 transfers heat from the cable to the target area to a specially selected adhesive having sufficient electrical and thermal conductivity to conduct the calling electrical signal and thus is attached to the target area. In some embodiments, the adhesive also has sufficient strength to withstand the torque generated by nuts and washers.

[0165] In some embodiments, the connector is a U-shaped fixture attached to the bulk medium and the electrode such that a significant compressive strength is provided between the electrode and the bulk medium.

[0166] In some embodiments, the materials of the electrodes and connectors can be selected to reduce their weight. In some embodiments, the material of the electrode is selected to reduce its weight and, in addition, to improve the electrical and / or thermal conductivity through the material. The improved conductivity can be advantageous for electrode designs (e.g., circular studs, one-plate designs) where the current flowing from the cable to the target area passes through the electrodes. In some embodiments, a specific enclosure is included as part of the connector and electrode design. For example, such an enclosure can be selected for environmental conditions including criteria such as thermal mitigation and / or insulation, electrical insulation, EMI shielding, corrosion protection, seismic and shock resistance, durability, protection from external contamination and deposits, etc.

[0167] In general, various adhesion configurations (and combinations thereof) between the electrodes and / or connectors and the bulk medium are contemplated. In some embodiments, these configurations reduce the contact resistance between the electrodes and the bulk medium and / or reduce electromagnetic losses. and the bulk medium and / or reduce electromagnetic losses. from external contamination and deposits, etc.

[0168] In general, various adhesion configurations (and combinations thereof) between the electrodes and / or connectors and the bulk medium are contemplated. In some embodiments, these configurations reduce the contact resistance between the electrodes and the bulk medium and / or reduce electromagnetic losses. and the bulk medium and / or reduce electromagnetic losses.

[0169] In some embodiments, the electrode is connected to the bulk medium using a brazed joint. FIG. 18A is a schematic diagram of an exemplary brazed joint attachment 1800 between an electrode 1802 and a target region 102 of a bulk medium that is part of a large bulk medium 1806. A brazing material is used to form the brazed joint portion 1804. For example, a low temperature brazing filler metal ( e.g., AL802) can be used to braze the electrode to the target region to create a low resistance contact. In some embodiments, the filler metal is coated with a flux to reduce oxidation (formation of an aluminum oxide layer at the brazing site). The flux is a material that dissolves oxides at high temperatures and prevents the surface from re - oxidizing until the filler metal wets the surface.

[0170] In some embodiments, the electrode and the target region are covered together under pressure and heating. For example, in some embodiments, a compressive force is applied between the electrode and the target region. Without being bound by theory, the compressive force can reduce the contact resistance between the electrode and the bulk medium according to the following equation.

Equation

[0171] In some embodiments, a mechanical fastening connector can be used to apply a compressive force to connect the electrode and the bulk medium. FIG. 18B is a schematic diagram of an exemplary attachment configuration 1820 between an electrode 1802 and a target region 102 that is part of a large bulk medium 1806. A solid ribbed bed 1822 is used to apply a compressive force to connect the electrode to the target region.

[0172] In some embodiments, a vacuum tape or the like can be used to hermetically seal the connection between the electrode and the target region. FIG. 18C is a schematic view of an exemplary mounting configuration 1840 between an electrode 1802 and a target region 102 that is part of a large bulk medium 180 6. An air seal tape 1842 is used to connect the electrode and the target region. After the air seal is complete, a suction device can be used to create a vacuum between the electrode and the target region, thereby pressing the two together. together. In some embodiments, the compressive force can be applied using a clamp that sandwiches the electrode and the target region, such as a C-clamp, which can increase the pressure at their interface. In some embodiments, the compressive force can be applied using a magnet or a magnetized surface. In some embodiments, either the surface of the electrode or the surface of the target region is magnetized, enabling an attractive force between the magnet and the electrode and / or the contact region, resulting in the desired compressive force. In some embodiments, two or more magnets are used, with the electrode and the target region sandwiched between them, enabling an attractive force between the magnets and resulting in the desired compressive force. In some embodiments, both the surface of the electrode and the surface of the target region are magnetized, enabling an attractive force between the electrode and the target region and resulting in the desired compressive force.

[0173] In some embodiments, the compressive force is applied by an external or internal compression fixing connector that adheres to the surface on or near the target region, converting the adhesive strength into the desired compressive force. In some embodiments, an adhesive (e.g., a curable adhesive) is combined with the fixture connector.

[0174] In some embodiments, the compressive force can be applied using a magnet or a magnetized surface. In some embodiments, either the surface of the electrode or the surface of the target region is magnetized, enabling an attractive force between the magnet and the electrode and / or the contact region, resulting in the desired compressive force. In some embodiments, two or more magnets are used, with the electrode and the target region sandwiched between them, enabling an attractive force between the magnets and resulting in the desired compressive force. In some embodiments, both the surface of the electrode and the surface of the target region are magnetized, enabling an attractive force between the electrode and the target region and resulting in the desired compressive force. In some embodiments, the compressive force is applied by an external or internal compression fixing connector that adheres to the surface on or near the target region, converting the adhesive strength into the desired compressive force. In some embodiments, an adhesive (e.g., a curable adhesive) is combined with the fixture connector. In some embodiments, the compressive force is applied by an external or internal compression fixing connector that adheres to the surface on or near the target region, converting the adhesive strength into the desired compressive force.

[0175] In some embodiments, the compressive force is applied by an external or internal compression fixing connector that adheres to the surface on or near the target region, converting the adhesive strength into the desired compressive force. In some embodiments, an adhesive (e.g., a curable adhesive) is combined with the fixture connector. In some embodiments, an adhesive (e.g., a curable adhesive) is combined with the fixture connector. It can be used by setting.

[0176] In some embodiments, one of the aforementioned methods or alternative techniques is used to partially or entirely embed the electrode in the bulk medium.

[0177] In some embodiments, a conductive material (e.g., graphene) is disposed between the electrode and the target region.

[0178] In some embodiments, the connector material used to connect the electrode to the target region is an adhesive selected to enhance strength and ensure a long-term bond to the target region. The strength of the adhesive may be advantageous in situations where the bonding area is relatively small and the mechanical constraints occurring in the bonding area are relatively strong (e.g., in the case of a U-shaped stud electrode). In one embodiment, if the electrode needs to be kept in a fixed position for curing of the adhesive after application of the adhesive, internal or external / disposable fixtures using the adhesive and mechanical forces can be used to keep the electrode in place.

[0179] In some embodiments, the connector material used to connect the electrode to the target region is also selected to have a higher thermal conductivity and / or electrical conductivity to improve the flow of current and heat from the cable to the target region. For example, the higher conductivity may be a consideration when the working electrode is attached such that the adhesive is positioned on the path of the current flowing from the cable / electrode to the target region (e.g., in the case of a working electrode being a circular stud electrode and a one-plate designed electrode). For this purpose, in some embodiments, nanomaterials (e.g., C NTs) are disposed between the electrode and the bulk medium. In some embodiments, the surface of the electrode and The portion of the surface of the bulk medium (e.g., the target region) that contacts the call electrode can be processed such that the "actual" contact region between them increases. can be processed such that the "actual" contact region between them increases.

[0180] In some embodiments, in combination with the above-described embodiments and other embodiments, the connector, the electrode, and a portion of the target region are covered with a material that reduces or eliminates electromagnetic losses. In some embodiments, in combination with the above-described embodiments and other embodiments, the connector, the electrode, and a portion of the target region are covered with a material that reduces or eliminates electromagnetic losses.

[0181] In some embodiments, any combination of the above methods is used with any embodiment of an electrode and a connector. For example, FIG. 18D is a schematic view of an exemplary combination attachment portion 1860 between an electrode 1802 and a target region 102 of a bulk medium 1806. This attachment portion includes a brazed joint 1804 and a solid rivet 1822. attachment portion includes a brazed joint 1804 and a solid rivet 1822. attachment portion includes a brazed joint 1804 and a solid rivet 1822.

[0182] In some embodiments, a connector / cable may not be required for the system because no physical contact is required to generate the desired current. In that case, in In some embodiments, a connector / cable may not be required for the system because no physical contact is required to generate the desired current. In that case, in some embodiments, the signal return path can be an additional portion of the wire that returns to the tuning network. some embodiments, the signal return path can be an additional portion of the wire that returns to the tuning network.

[0183] The embodiments of the heating system described herein can be used as a de-icing / anti-icing device for melting ice from the surface of an aircraft by supplying a high-frequency AC current to a target region of the aircraft's skin / fuselage (e.g., generating Joule heat). The heat generated in the target region of the fuselage is conducted to the surface of the fuselage and convects into the ice across the interface between the fuselage and the ice. In some The embodiments of the heating system described herein can be used as a de-icing / anti-icing device for melting ice from the surface of an aircraft by supplying a high-frequency AC current to a target region of the aircraft's skin / fuselage (e.g., generating Joule heat). The heat generated in the target region of the fuselage is conducted to the surface of the fuselage and convects into the ice across the interface between the fuselage and the ice. In some embodiments, the ice completely melts. In some embodiments, a portion of the ice (the layer in direct contact with the fuselage) melts, forming a layer of water between the ice and the fuselage, and the ice slides off or the aircraft embodiments, the ice completely melts. In some embodiments, a portion of the ice (the layer in direct contact with the fuselage) melts, forming a layer of water between the ice and the fuselage, and the ice slides off or the aircraft embodiments, the ice completely melts. In some embodiments, a portion of the ice (the layer in direct contact with the fuselage) melts, forming a layer of water between the ice and the fuselage, and the ice slides off or the aircraft from the aircraft. can be mechanically removed. In some embodiments, heating occurs before the ice is present to prevent the formation of ice.

[0184] In some embodiments, when the ice melts, a high-frequency AC current continues to be supplied, maintaining the generation of Joule heat within the body, and that heat is transferred to the water formed / remaining on the surface by conduction and convection.

[0185] Figures 19-32 provide examples of assemblies for conveying and supplying electromagnetic energy for a bulk media heating system. These assemblies (referred to herein as "coupling strips") are configured to function in a manner similar to a transmission line in combination with the bulk conductive media to which they are attached. For example, in some embodiments, by design of the coupling strip, the bulk media itself conducts current in a manner similar to the current flowing through a transmission line. The coupling strip can electromagnetically couple the AC signal from the line to the bulk media, thereby generating a corresponding current signal within the bulk media. Thus, in effect, the design of the coupling strip is such that it operates the bulk media (in combination with the coupling strip) as a transmission line, or forms a system in which the bulk media and the coupling strip operate together in a manner similar to a transmission line, and can be analyzed and designed as such.

[0186] For example, as described above, embodiments of the present disclosure are configured to generate heat within a bulk media by manipulating a mechanism for shaping the current (e.g., constricting, extending, etc.) within a conductive media (e.g., bulk media, conductor) using, for example, skin effect and proximity effect. This can be achieved. Both effects depend on passing a high-frequency AC current through the conductive medium to be heated. The skin effect utilizes the tendency of an alternating current ("AC") to distribute within a conductor such that the current density is maximum near the surface of the conductor and decreases as the depth of the conductor increases, thereby suppressing the flow of current. The proximity effect can be used to further suppress the current flowing through a conductor by placing another AC current path near the existing current flowing through the conductor. The proximity effect can also act to lengthen the current path. The coupling strip can be used to generate and control such effects in addition to the above-described system and process. For example, the coupling strip can be used in the various power control systems described above. For example, the coupling strip can be used in the various power control systems described above.

[0187] FIG. 19 is a cross-sectional view of an exemplary coupling strip 1900. The coupling strip 1900 can be used to supply a high-frequency current signal to a bulk medium, such as the outer skin 1902 of an aircraft, to heat the bulk medium. The coupling strip 1900 has a multilayer structure including a first dielectric layer 1908 on the bulk medium 1902, a conductive layer 1904 on the first dielectric layer 1908, a second dielectric layer 1908 on the conductive layer 1904, and a conductive shield layer 1906 on the second dielectric layer 1908. 4, and a conductive shield layer 1906 on the second dielectric layer 1908.

[0188] The first dielectric layer 1908 has a thickness D1. The conductive layer 1904 has a thickness D2. The second dielectric layer 1908 has a thickness D3. The conductive shield layer 1906 has a thickness D4. The overall thickness of the coupling strip 1900 is D5. The conductive layer 1904 is made of copper, a copper alloy (e.g., brass or bronze), silver, a silver alloy, aluminum, an aluminum alloy. Made of a conductive material including, but not limited to, gold, titanium, titanium alloy, chromium, nickel, nickel alloy, cobalt alloy, corrosion-resistant steel, graphite, or a combination thereof. The conductive shield layer 1906 can be made of a conductive material including, but not limited to, copper, copper alloy (e.g., brass or bronze), silver, silver alloy, aluminum, aluminum alloy, titanium, titanium alloy, chromium, nickel, nickel alloy, cobalt-based alloy, corrosion-resistant steel, graphite, or a combination thereof. In some embodiments, the conductive shield layer 1906 can be formed as a metal foil (e.g., copper foil or aluminum foil) or a woven metal layer. The dielectric layer 1908 can be made of a dielectric material including, but not limited to, Kapton, Mylar, polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), rubber, or a combination thereof. It can be made from a conductive material including, but not limited to, graphite, or a combination thereof. The conductive shield layer 1906 can be made of a conductive material including, but not limited to, copper, copper alloy (e.g., brass or bronze), silver, silver alloy, aluminum, aluminum alloy, titanium, titanium alloy, chromium, nickel, nickel alloy, cobalt alloy, corrosion-resistant steel, graphite, or a combination thereof. In some embodiments, the conductive shield layer 1906 can be formed as a metal foil (e.g., copper foil or aluminum foil) or a woven metal layer. The dielectric layer 1908 can be made of a dielectric material including, but not limited to, Kapton, Mylar, polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), rubber, or a combination thereof. The conductive shield layer 1906 can be made of a conductive material including, but not limited to, copper, copper alloy (e.g., brass or bronze), silver, silver alloy, aluminum, aluminum alloy, titanium, titanium alloy, chromium, nickel, nickel alloy, cobalt alloy, corrosion-resistant steel, graphite, or a combination thereof. In some embodiments, the conductive shield layer 1906 can be formed as a metal foil (e.g., copper foil or aluminum foil) or a woven metal layer. The dielectric layer 1908 can be made of a dielectric material including, but not limited to, Kapton, Mylar, polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), rubber, or a combination thereof. The conductive shield layer 1906 can be made of a conductive material including, but not limited to, copper, copper alloy (e.g., brass or bronze), silver, silver alloy, aluminum, aluminum alloy, titanium, titanium alloy, chromium, nickel, nickel alloy, cobalt alloy, corrosion-resistant steel, graphite, or a combination thereof. In some embodiments, the conductive shield layer 1906 can be formed as a metal foil (e.g., copper foil or aluminum foil) or a woven metal layer. The dielectric layer 1908 can be made of a dielectric material including, but not limited to, Kapton, Mylar, polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), rubber, or a combination thereof. The conductive shield layer 1906 can be made of a conductive material including, but not limited to, copper, copper alloy (e.g., brass or bronze), silver, silver alloy, aluminum, aluminum alloy, titanium, titanium alloy, chromium, nickel, nickel alloy, cobalt alloy, corrosion-resistant steel, graphite, or a combination thereof. In some embodiments, the conductive shield layer 1906 can be formed as a metal foil (e.g., copper foil or aluminum foil) or a woven metal layer. The dielectric layer 1908 can be made of a dielectric material including, but not limited to, Kapton, Mylar, polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), rubber, or a combination thereof. The conductive shield layer 1906 can be made of a conductive material including, but not limited to, copper, copper alloy (e.g., brass or bronze), silver, silver alloy, aluminum, aluminum alloy, titanium, titanium alloy, chromium, nickel, nickel alloy, cobalt alloy, corrosion-resistant steel, graphite, or a combination thereof. In some embodiments, the conductive shield layer 1906 can be formed as a metal foil (e.g., copper foil or aluminum foil) or a woven metal layer. The dielectric layer 1908 can be made of a dielectric material including, but not limited to, Kapton, Mylar, polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), rubber, or a combination thereof. The dielectric layer 1908 can be made of a dielectric material including, but not limited to, Kapton, Mylar, polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), rubber, or a combination thereof. The dielectric layer 1908 can be made of a dielectric material including, but not limited to, Kapton, Mylar, polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), rubber, or a combination thereof. The dielectric layer 1908 can be made of a dielectric material including, but not limited to, Kapton, Mylar, polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), rubber, or a combination thereof. It can be made from a dielectric material including, but not limited to, Kapton, Mylar, polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), rubber, or a combination thereof.

[0189] In some mounting embodiments, the bonding strip 1900 includes a protective layer on the conductive shield layer. For example, the protective layer can include one or more layers of polyurethane, polyfluoride, paint, paint substitute film, sealant, or a combination thereof, but is not limited thereto. In some mounting embodiments, the bonding strip 1900 includes a protective layer on the conductive shield layer. For example, the protective layer can include one or more layers of polyurethane, polyfluoride, paint, paint substitute film, sealant, or a combination thereof, but is not limited thereto. In some mounting embodiments, the bonding strip 1900 includes a protective layer on the conductive shield layer. For example, the protective layer can include one or more layers of polyurethane, polyfluoride, paint, paint substitute film, sealant, or a combination thereof, but is not limited thereto. In some mounting embodiments, the bonding strip 1900 includes a protective layer on the conductive shield layer. For example, the protective layer can include one or more layers of polyurethane, polyfluoride, paint, paint substitute film, sealant, or a combination thereof, but is not limited thereto.

[0190] As shown in FIG. 20, the bonding strip 1900 is disposed on the surface of a bulk medium such as the outer skin 2000 (e.g., a wing) of an aircraft, and can supply current to the bulk medium to generate and shape the flow of current within the bulk to heat the bulk medium. The bonding strip 1900 extends along the surface of the outer skin 2000 of the aircraft and is spaced apart from each other. As shown in FIG. 20, the bonding strip 1900 is disposed on the surface of a bulk medium such as the outer skin 2000 (e.g., a wing) of an aircraft, and can supply current to the bulk medium to generate and shape the flow of current within the bulk to heat the bulk medium. The bonding strip 1900 extends along the surface of the outer skin 2000 of the aircraft and is spaced apart from each other. As shown in FIG. 20, the bonding strip 1900 is disposed on the surface of a bulk medium such as the outer skin 2000 (e.g., a wing) of an aircraft, and can supply current to the bulk medium to generate and shape the flow of current within the bulk to heat the bulk medium. The bonding strip 1900 extends along the surface of the outer skin 2000 of the aircraft and is spaced apart from each other. As shown in FIG. 20, the bonding strip 1900 is disposed on the surface of a bulk medium such as the outer skin 2000 (e.g., a wing) of an aircraft, and can supply current to the bulk medium to generate and shape the flow of current within the bulk to heat the bulk medium. The bonding strip 1900 extends along the surface of the outer skin 2000 of the aircraft and is spaced apart from each other. In some implementations, one or more coupling strips 1900 are short circuits that conductively couple at least a portion of the coupling strip ( e.g., conductive layer 1904) to the bulk medium 1902. For example, the coupling strip 1900 terminates with an electrode as described above and forms a closed circuit (e.g., a short circuit) between the conductive layer 1904 included therein and the bulk medium 1902. For example, the coupling strip 1900 terminates with an electrode as described above and forms a closed circuit (e.g., a short circuit) between the conductive layer 1904 included therein and the bulk medium 1902. This can be done. The termination of the coupling strip 1900 is the far end of the strip on the side opposite to the end to which current is supplied (e.g., on the side opposite to the power input end). In some implementations, one or more coupling strips 1900 terminate in an open circuit. An open circuit termination means that the termination of the coupling strip 1900 remains open and is not connected to electrical ground through either the bulk medium 1902 or the conductive shield layer of the coupling strip 1900. In some implementations, one or more coupling strips 1900 terminate with an impedance adjustment component (e.g., a circuit element) connected between the coupling strip 1900 and the bulk medium 1902. For example, the coupling strip 1900 can terminate with a capacitive, resistive, or inductive termination. For example, circuit elements such as capacitors, inductors, or resistors can be connected between the conductive layer 1904 of the coupling strip 1900 and the bulk medium 1902. Referring to FIGS. 19 and 20, a power control system (e.g., the power control system 104 described above) is coupled to one end of each coupling strip to supply current to each coupling strip. For example, a power line from the power control system can be coupled to the conductive layer of each carrier strip 190 0, and the bulk medium 1902 (e.g., the aircraft skin 2000)

[0191] Referring to FIGS. 19 and 20, a power control system (e.g., the power control system 104 described above) is coupled to one end of each coupling strip to supply current to each coupling strip. For example, a power line from the power control system can be coupled to the conductive layer of each carrier strip 190 0, and the bulk medium 1902 (e.g., the aircraft skin 2000) ​​​​ One or both of which can be coupled to electrical ground.

[0192] The power control system supplies an AC current to each carrier strip 1900. For example, the power control system can supply an AC current at a frequency of 1 kHz to 450 MHz and in some embodiments, the frequency is from 1 MHz to 450 MHz. In some embodiments the frequency is from 1 kHz to 1 MHz. The power control system can be configured to provide an AC current of 0.1 ampere to 200 amperes to each coupling strip 1900. For example, the power source of the power control system and the electrical arrangement of the coupling strip 1900 can be configured to supply a desired amount of current (e.g., 0.1 ampere to 200 amperes) to each coupling strip 1900. As a general example, when the coupling strips 1900 are coupled to the power control system in series with each other, a 100 - ampere power source can be used to supply 100 amperes of current to each coupling strip 1900. When ten coupling strips 1900 are coupled to the power control system in parallel with each other, a 100 - ampere power source can be used to supply 10 amperes of current to each coupling strip 1900. Note that in this example, the impedance of each coupling strip is the same. As will be described below, the impedance of the coupling strip 1900 can be adjusted in various ways to control the current distribution between the coupling strips as desired or required for a particular heating application.

[0193] The AC current for heating the aircraft skin 1902 is provided through the conductive layer 1904. The AC current provided through the conductive layer 1904 generates a corresponding current within the aircraft skin 1902 (e.g., by capacitance and inductive coupling), as shown in FIGS. 22A-22B. FIGS. 22A-22B show the output plots of an electromagnetic finite element analysis (FEA) that simulates the operation of an exemplary coupling strip 1900 attached to a conductive bulk medium 1902. The bulk medium 1902 (e.g., simulated as the skin of an aircraft), the conductive layer 1904, and the conductive shield layer 1906 are shown in the plot figures shown in FIG. 22A. In FIG. 22B, the individual components of the coupling strip 1900 are not shown, and only the coupling strip 1900 (generally depicted) and the bulk medium 1902 are shown. The region indicated by 2206 in both plot figures represents the background environment (such as the atmosphere). Both plot figures show the normalized density (A / m ) of the current induced in the bulk medium 1902, indicated by the shaded region 2204. The current density of the bulk medium 1902 is maximum in a narrow region near the surface of the bulk medium 1902. Further, the plot figure of FIG. 22A shows the normalized electric field strength (light gray scale region 2202 ) within the dielectric layer of the coupling strip 1900. In particular, the conductive shield layer 1906 shields the surrounding environment 2206 from the electric field generated by the current passing through the conductive layer 1904, e.g., reducing or eliminating electromagnetic radiation and protecting the coupling strip 1900 from external electromagnetic interference. The bulk medium 1902 also functions as a shield layer by minimizing or blocking the electric field. Thus, the conductive shield layer 1906 and the bulk medium 1902 shield the electric field in an embodiment of the coupling strip 1900. lot figures. The bulk medium 1902 (e.g., simulated as the skin of an aircraft), the conductive layer 1904, and the conductive shield layer 1906 are shown in the plot figures shown in FIG. 22A. In FIG. 22B, the individual components of the coupling strip 1900 are not shown, and only the coupling strip 1900 (generally depicted) and the bulk medium 1902 are shown. The region indicated by 2206 in both plot figures represents the background environment (such as the atmosphere). Both plot figures show the normalized density (A / m ) of the current induced in the bulk medium 1902, indicated by the shaded region 2204. The current density of the bulk medium 1902 is maximum in a narrow region near the surface of the bulk medium 1902. Further, the plot figure of FIG. 22A shows the normalized electric field strength (light gray scale region 2202 ) within the dielectric layer of the coupling strip 1900. In particular, the conductive shield layer 1906 shields the surrounding environment 2206 from the electric field generated by the current passing through the conductive layer 1904, e.g., reducing or eliminating electromagnetic radiation and protecting the coupling strip 1900 from external electromagnetic interference. The bulk medium 1902 also functions as a shield layer by minimizing or blocking the electric field. Thus, the conductive shield layer 1906 and the bulk medium 1902 shield the electric field in an embodiment of the coupling strip 1900. In FIG. 22B, the individual components of the coupling strip 1900 are not shown, and only the coupling strip 1900 (generally depicted) and the bulk medium 1902 are shown. The region indicated by 2206 in both plot figures represents the background environment (such as the atmosphere). Both plot figures show the normalized density (A / m ) of the current induced in the bulk medium 1902, indicated by the shaded region 2204. The current density of the bulk medium 1902 is maximum in a narrow region near the surface of the bulk medium 1902. Further, the plot figure of FIG. 22A shows the normalized electric field strength (light gray scale region 2202 ) within the dielectric layer of the coupling strip 1900. In particular, the conductive shield layer 1906 shields the surrounding environment 2206 from the electric field generated by the current passing through the conductive layer 1904, e.g., reducing or eliminating electromagnetic radiation and protecting the coupling strip 1900 from external electromagnetic interference. The bulk medium 1902 also functions as a shield layer by minimizing or blocking the electric field. Thus, the conductive shield layer 1906 and the bulk medium 1902 shield the electric field in an embodiment of the coupling strip 1900. In both plot figures, the region indicated by 2206 represents the background environment (such as the atmosphere). Both plot figures show the normalized density (A / m ) of the current induced in the bulk medium 1902, indicated by the shaded region 2204. The current density of the bulk medium 1902 is maximum in a narrow region near the surface of the bulk medium 1902. Further, the plot figure of FIG. 22A shows the normalized electric field strength (light gray scale region 2202 2 ) within the dielectric layer of the coupling strip 1900. In particular, the conductive shield layer 1906 shields the surrounding environment 2206 from the electric field generated by the current passing through the conductive layer 1904, e.g., reducing or eliminating electromagnetic radiation and protecting the coupling strip 1900 from external electromagnetic interference. The bulk medium 1902 also functions as a shield layer by minimizing or blocking the electric field. Thus, the conductive shield layer 1906 and the bulk medium 1902 shield the electric field in an embodiment of the coupling strip 1900. 902 is maximum in a narrow region near the surface of the bulk medium 1902. Further, the plot figure of FIG. 22A shows the normalized electric field strength (light gray scale region 2202 ) within the dielectric layer of the coupling strip 1900. In particular, the conductive shield layer 1906 shields the surrounding environment 2206 from the electric field generated by the current passing through the conductive layer 1904, e.g., reducing or eliminating electromagnetic radiation and protecting the coupling strip 1900 from external electromagnetic interference. The bulk medium 1902 also functions as a shield layer by minimizing or blocking the electric field. Thus, the conductive shield layer 1906 and the bulk medium 1902 shield the electric field in an embodiment of the coupling strip 1900. ) within the dielectric layer of the coupling strip 1900. In particular, the conductive shield layer 1906 shields the surrounding environment 2206 from the electric field generated by the current passing through the conductive layer 1904, e.g., reducing or eliminating electromagnetic radiation and protecting the coupling strip 1900 from external electromagnetic interference. The bulk medium 1902 also functions as a shield layer by minimizing or blocking the electric field. Thus, the conductive shield layer 1906 and the bulk medium 1902 shield the electric field in an embodiment of the coupling strip 1900. generated electric field, e.g., reducing or eliminating electromagnetic radiation and protecting the coupling strip 1900 from external electromagnetic interference. The bulk medium 1902 also functions as a shield layer by minimizing or blocking the electric field. Thus, the conductive shield layer 1906 and the bulk medium 1902 shield the electric field in an embodiment of the coupling strip 1900. The bulk medium 1902 also functions as a shield layer by minimizing or blocking the electric field. Thus, the conductive shield layer 1906 and the bulk medium 1902 shield the electric field in an embodiment of the coupling strip 1900. The bulk medium 1902 also functions as a shield layer by minimizing or blocking the electric field. Thus, the conductive shield layer 1906 and the bulk medium 1902 shield the electric field in an embodiment of the coupling strip 1900. In an embodiment of the coupling strip 1900, the conductive shield layer 1906 and the bulk medium 1902 shield the electric field. can be useful for confinement within the coupling strip 1900 (e.g., between the conductive shield layer 1906 and the bulk medium 1902). This effect reduces or prevents electromagnetic interference between the heating system and other nearby electrical components. Embodiments of the coupling strip 1900 in combination with the bulk medium 1902 can achieve operating performance comparable to that of a stripline type transmission line. Referring back to FIG. 19, the heating effect of the carrier strip 1900 on the bulk medium, and the impedance of each coupling strip 1900 can be adjusted by changing the characteristics of the carrier strip, such as the thicknesses of the various layers 1904, 1906, and 1908, the width of the conductive layer, the layout of the conductive layer, the materials of each layer (including their permittivity and conductivity characteristics), etc., or by including impedance adjustment elements (capacitors, inductors, resistors, etc.). Further, the heating effect of the current generated in the bulk medium 1902 can also be changed by varying these characteristics that are useful for adjusting the proximity effect and path of the heating current passing through the bulk medium 1902 as described above.

[0194] For example, each of the layers 1904, 1906, 1908 can generally be formed with a thickness (D1 - D4) in the range between 0.1 mil and 1 inch, or in some embodiments, between 0.5 mil and 10 mil. In some implementations, the coupling strip 1900 can be formed with the conductive layer 1904 at different distances from the bulk medium 1902 and from the conductive shield layer 1906. In some implementations Referring back to FIG. 19, the heating effect of the carrier strip 1900 on the bulk medium, and the impedance of each coupling strip 1900 can be adjusted by changing the characteristics of the carrier strip, such as the thicknesses of the various layers 1904, 1906, and 1908, the width of the conductive layer, the layout of the conductive layer, the materials of each layer (including their permittivity and conductivity characteristics), etc., or by including impedance adjustment elements (capacitors, inductors, resistors, etc.). Further, the heating effect of the current generated in the bulk medium 1902 can also be changed by varying these characteristics that are useful for adjusting the proximity effect and path of the heating current passing through the bulk medium 1902 as described above. For example, each of the layers 1904, 1906, 1908 can generally be formed with a thickness (D1 - D4) in the range between 0.1 mil and 1 inch, or in some embodiments, between 0.5 mil and 10 mil. In some implementations, the coupling strip 1900 can be formed with the conductive layer 1904 at different distances from the bulk medium 1902 and from the conductive shield layer 1906. In some implementations Referring back to FIG. 19, the heating effect of the carrier strip 1900 on the bulk medium, and the impedance of each coupling strip 1900 can be adjusted by changing the characteristics of the carrier strip, such as

[0195] For example, each of the layers 1904, 1906, 1908 can generally be formed with a thickness (D1 - D4) in the range between 0.1 mil and 1 inch, or in some embodiments, between 0.5 mil and 10 mil. In some implementations, the coupling strip 1900 can be formed with the conductive layer 1904 at different distances from the bulk medium 1902 and from the conductive shield layer 1906. In some implementations For example, each of the layers 1904, 1906, 1908 can generally be formed with a thickness (D1 - D4) in the range between 0.1 mil and 1 inch, or in some embodiments, between 0.5 mil and 10 mil. In some implementations, the coupling strip 1900 can be formed with the conductive layer 1904 at different distances from the bulk medium 1902 and from the conductive shield layer 1906. In some implementations For example, each of the layers 1904, 1906, 1908 can generally be formed with a thickness (D1 - D4) in the range between 0.1 mil and 1 inch, or in some embodiments, between 0.5 mil and 10 mil. In some implementations, the coupling strip 1900 can be formed with the conductive layer 1904 at different distances from the bulk medium 1902 and from the conductive shield layer 1906. In some implementations For example, each of the layers 1904, 1906, 1908 can generally be formed with a thickness (D1 - D4) in the range between 0.1 mil and 1 inch, or in some embodiments, between 0.5 mil and 10 mil. In some implementations, the coupling strip 1900 can be formed with the conductive layer 1904 at different distances from the bulk medium 1902 and from the conductive shield layer 1906. In some implementations For example, each of the layers 1904, 1906, 1908 can generally be formed with a thickness (D1 - D4) in the range between 0.1 mil and 1 inch, or in some embodiments, between 0.5 mil and 10 mil. In some implementations, the coupling strip 1900 can be formed with the conductive layer 1904 at different distances from the bulk medium 1902 and from the conductive shield layer 1906. In some implementations In this state, these distances are associated in a ratio. For example, the coupling strip 1900 can be formed such that the relative thicknesses D1 and D3 of the dielectric layer 1908 are associated in a ratio. For example, in some embodiments, the ratio of D1:D3 can be in the range of 1:1 to 1:5. The ratio D1:D3 can be reversed, for example, in other embodiments, to be in the range of 1:1 to 5:1 in order to obtain a desired current density and / or impedance value for a given application. In one exemplary embodiment, D1 is 3 mils, D2 is 1 mil, D3 is 3 mils, and D4 is 1 mil. In another exemplary embodiment, D1 is 7.2 mils, D2 is 1.4 mils, D3 is 2.4 mils, D4 is 1.4 mils. In yet another exemplary embodiment, D1 is 1000 mils, D2 is 50 mils, D3 is 500 mils, and D4 is 50 mils. In yet another exemplary embodiment, D1 is 10 mils, D2 is 2.5 mils, D3 is 50 mils, and D4 is 2.5 mils. In yet another example, D1 is 2.4 mils, D2 is 1.4 mils, D3 is 7.2 mils, D4 is 1.4 mils. In still another example, D1 is 17.6 mils, D2 is 9.8 mils, D3 is 24.5 mils, and D4 is 9.8 mils. In yet another example, D1 is 100 mils, D2 is 20 mils, D3 is 250 mils, and D4 is 20 mils. In yet another example, D1 is 5.5 mils, D2 is 2.5 mils, D3 is 9.0 mils, and D4 is 2.5 mils. In still another example, D1 is 1.5 inches, D2 is 0.25 inches, D3 is 2.2 inches, and D4 is 0.25 inches. In yet another example, D1 is 3.8 mils, D2 is 2 mils, D3 is 3.8 mils, and D4 is 2 mils. In yet another example, D1 is 2.9 mils, D2 is 1.5 mils, D3 is 5.8 so that the relative thicknesses D1 and D3 of the dielectric layer 1908 are associated in a ratio. For example, in some embodiments, the ratio of D1:D3 can be in the range of 1:1 to 1:5. The ratio D1:D3 can, for example, be reversed in other embodiments to be in the range of 1:1 to 5:1 in order to obtain a desired current density and / or impedance value for a given application. In one exemplary embodiment, D1 is 3 mils, D2 is 1 mil, D3 is 3 mils, and D4 is 1 mil. In another exemplary embodiment, D1 is 7.2 mils D2 is 1.4 mils, D3 is 2.4 mils, D4 is 1.4 mils. In yet another exemplary embodiment, D1 is 1000 mils, D2 is 50 mils, D3 is 500 mils, and D4 is 5 0 mils. In yet another exemplary embodiment, D1 is 10 mils, D2 is 2.5 mils, D3 is 50 mils, and D4 is 2.5 mils. In yet another example, D1 is 2.4 mils D2 is 1.4 mils, D3 is 7.2 mils, D4 is 1.4 mils. In still another example, D 1 is 17.6 mils, D2 is 9.8 mils, D3 is 24.5 mils, and D4 is 9.8 mils In yet another example, D1 is 100 mils, D2 is 20 mils, D3 is 250 mils, and D4 is 20 mils. In yet another example, D1 is 5.5 mils, D2 is 2.5 mils, D 3 is 9.0 mils, and D4 is 2.5 mils. In still another example, D1 is 1.5 inches D2 is 0.25 inches, D3 is 2.2 inches, and D4 is 0.25 inches. In yet another example, D1 is 3.8 mils, D2 is 2 mils, D3 is 3.8 mils, and D4 is 2 mils. In yet another example, D1 is 2.9 mils, D2 is 1.5 mils, D3 is 5.8 Mill, and D4 is 2.5 mils. In yet other examples, D1 is 5 mils, D2 is 2.5 mils, D3 is 25 mils, and D4 is 1.5 inches. In yet another example, D1 is 1 1 mil, D2 is 3 mils, D3 is 5.5 mils, and D4 is 3 mils. In yet another example is, D1 is 21 mils, D2 is 1.5 mils, D3 is 7 mils, and D4 is 2.5 mils . In yet other examples, D1 is 10 mils, D2 is 2.5 mils, D3 is 2 mils, and D4 is 2.5 inches. In yet other examples, D1 is 4.5 inches, D2 is 0.25 inches, D3 is 1.5 inches, and D4 is 0.25 inches. In another example, D1 is 3 mils, D 2 is 1 mil, D3 is 3 mils, D4 is 1 mil. In yet another example, D1 is 10.2 mils , D2 is 3.5 mils, D3 is 40.8 mils, and D4 is 2.5 mils. In yet another example, D1 is 4.8 mils, D2 is 0.5 mils, D3 is 14.4 mils, and D4 is 0. 5 mils. In yet another example, D1 is 15 mils, D2 is 1.4 mils, D3 is 3 mils, D4 is 1.4 mils . In yet another example, D1 is 113 mils, D2 is 10 mils, D3 is 28.25 mils , and D4 is 10 mils. In yet another example, D1 is 127 mils, D2 is 5 mils, D3 is 254 mils, and D4 is 10 mils. In yet another example, D1 is 53 mils, D2 is 12 mils, D3 is 159 mils, and D4 is 12 mils. In yet another example, D1 is 13 mils, D2 is 1.4 mils, D3 is 2.6 mils, D4 is 1.4 mils. In yet another example is, D1 is 23 mils, D2 is 4 mils, D3 is 46 mils, and D4 is 4 mils. In yet another example, D1 is 11.5 mils, D2 is 2.8 mils, D3 is 57.5 mils, and D4 is 2.8 mils. In yet another example, D1 is 10 mils, D2 is 1.4 mils, D3 is 2.5 mils, and D4 is 1.4 mils.

[0196] Furthermore, the width of the conductive layer 1904 is generally in the range of several inches or several mils across the layer obtained. FIG. 21 shows top views of several exemplary bonding strips (Examples 1-9) to illustrate various configurations of the conductive layer 1904 within the bonding strip 1900. The bonding strip 1900 of FIG. 21 is shown, for illustration purposes, with the layers above the conductive layer 1904 (e.g., a second dielectric layer and a conductive shield layer) removed. The cross-sectional profile of the conductive layer 1904 can vary along its length. For example, the width of the conductive layer 1904 can be varied along its length to adjust the impedance of the bonding strip 1900 and, in some cases, to adjust the current density of the bulk medium and the conductive layer. Examples 1- 9 show several exemplary width variation patterns of the conductive layer 1904 of the bonding strip 1900. For example, the width of the conductive layer 1904 across the bonding strip 1900 can vary between a maximum width and a minimum width and. In some embodiments, the maximum width is only about 1.5 times the minimum width . In other embodiments, the maximum width can be 100 times the minimum width. For example, the width of the conductive layer 1904 shown in Example 1 can be 1.5 inches at its maximum position (e.g., the upper end) and 1 inch at its narrowest position (e.g., the lower end). In another example, the width of the conductive layer 1904 shown in Example 1 can be 1 inch at its maximum position (e.g., the upper end) and 10 mils at its narrowest position (e.g ., the lower end). In some implementations, the thickness of the conductive layer 1904 can vary along its length. For example Another example shows that the width of the conductive layer 1904 shown in Example 1 can be 1 inch at its maximum position (e.g., the upper end) and 10 mils at its narrowest position (e.g., the lower end). is 1.5 inches at its maximum position (e.g., the upper end) and 1 inch at its narrowest position (e.g., the lower end). In another example, the width of the conductive layer 1904 shown in Example 1 can be 1 inch at its maximum position (e.g., the upper end) and 10 mils at its narrowest position (e.g ., the lower end). can be 1 inch at its maximum position (e.g., the upper end) and 10 mils at its narrowest position (e.g., the lower end).

[0197] In some implementations, the thickness of the conductive layer 1904 can vary along its length. For example For example, the width of the conductive layer 1904 can vary along its length to adjust the impedance of the coupling strip 1900. In some implementations, both the thickness and width and material of the conductive layer 1904 can vary along its length.

[0198] In some implementations, the impedance of the coupling line 1900 can be adjusted by including impedance adjustment components (e.g., capacitors, inductors, and resistors) at one or more locations along the length of the conductive layer 1904. For example, the conductive layer can be divided into several segments along its length and those segments can be connected with one or more impedance adjustment components. For example, referring to Example 4 of the coupling strip in FIG. 21, the conductive layer 1904 can be divided into two segments in region 2102, and impedance adjustment components (e.g., capacitors, inductors, resistors, or combinations thereof) can be electrically connected between each segment. Alternatively, or additionally, the impedance adjustment components can be connected to the conductive layer as shunt elements between the conductive layer 1904 and either the bulk medium 1902 or the conductive shield layer 1906.

[0199]

[0199] In some implementations, the width, thickness, or both of the conductive shield layer 1906 can be changed along the length of the coupling strip 1900. In some implementations, the width, thickness, or both of the dielectric layer 1908 can be changed along the length of the coupling strip 1900. For example, in some embodiments, the conductive layer 1904, the dielectric layer 1908, and vary the cross-sectional area of the conductive shield layer 1906 along the length of the strip 1900 This can be done.

[0200] FIG. 23 shows layouts (layouts A-E) of some exemplary arrangements of the conductive layer 1904 within the coupling strip 1900. First, in a straight-line arrangement (shown in FIG. 21), the conductive layer 1904 extends linearly along the length of the coupling strip. Layouts A-E show coupling strips 1900 arranged such that the conductive layer 1904 extends along a non-linear pattern or path. Specifically, the examples shown in FIG. 23 show the conductive layer 1904 arranged in various different serpentine patterns. The illustrated serpentine patterns have segments of the conductive layer 1904 positioned side by side in the width direction of the coupling strip 1900. Such an arrangement allows the overall length of the coupling strip 1900 to be shortened while maintaining the desired overall length of the conductive layer 1904. In some applications, maintaining a relatively uniform length for the conductive layers 1904 of different coupling strips 1900 helps to maintain a consistent impedance between coupling strips 1900 of different lengths. For example, in each of layouts A and B, the conductive layer 1904 can be formed to have the same overall length. However, the overall length of the coupling strip 1900 in layout B can be shortened to half the length of a coupling strip 1900 having a conductive layer in a straight-line arrangement (such as shown in FIG. 21). Similarly, the overall length of the coupling strip 1900 in layout C can be shortened to one-third the length of a coupling strip 1900 having a conductive layer in a straight-line arrangement. Furthermore, coupling strips 1900 of shorter lengths can be placed in spatially constrained locations within an aircraft body. This can be done. For example, in each of layouts A and B, the conductive layer 1904 can be formed to have the same overall length. However, the overall length of the coupling strip 1900 in layout B can be shortened to half the length of a coupling strip 1900 having a conductive layer in a straight-line arrangement (such as shown in FIG. 21). Similarly, the overall length of the coupling strip 1900 in layout C can be shortened to one-third the length of a coupling strip 1900 having a conductive layer in a straight-line arrangement. can be achieved. For example, a bonding strip having conductive layers arranged according to layouts A to E 1900 shows that the bonding strip 1900 with a linear conductive layer arrangement is too long to fit It can be arranged in a narrow area of the wing (e.g., the wing tip).

[0201] Each of the layouts A to E shows a bonding strip 1900 having a conductive layer 1904 arranged along a non-linear path from the input end 2302 to the termination end 2304 Layout A shows a bonding strip 1900 having a double-layered conductive layer 1904. The conductive layer of layout A 1904 includes, for example, two segments arranged side by side along a U-shaped path from the input end 2302 to the termination end 2304 FIG. 24A shows a cross-sectional view of the bonding strip 1900 according to layout A along line A-A'.

[0202] Layout B shows a bonding strip 1900 having a triple-layered conductive layer 1904 The conductive layer 1904 of layout B includes, for example, three segments arranged side by side along an S-shaped path from the input end 2302 to the termination end 2304 FIG. 24B shows a cross-sectional view of the bonding strip 1900 according to layout B along line B-B'.

[0203] Layouts C and D show a bonding strip 1900 having different quadruple-layered conductive layers 1904 Each of the conductive layers 1904 of layouts C and D includes four segments arranged side by side In layout C, the segments of the conductive layer 1904 are arranged, for example, along an M-shaped path (or a W-shaped path ) from the input end 2302 to the termination end 2304. In layout D, the segments of the conductive layer 1904 are, for example, double-layered ​​​It is arranged as something folded back and arranged side by side. A similar technique can also be applied to the triple-layered conductive layer 1904 and it can also be folded back and arranged side by side. FIG. 24C shows a cross-sectional view along the C-C' line of the coupling strip 1900 according to layout C and layout D.

[0204] Layout E shows a more general arrangement of the conductive layer 1904. For example, layout E shows an example of the conductive layer 1904 in which a plurality of segments of different widths are arranged side by side with each other . Further, in some embodiments, the conductive layer 1904 can include interconnections 2306 between segments at various positions between the segments, as shown in layout E . In some embodiments, the coupling strip 1900 can also include a plurality of signal input terminals 2302.

[0205] FIG. 25A shows a cross-sectional view of an exemplary configuration for attaching the coupling strip 1900 to the bulk medium 1902. FIG. 25A shows a bottom mounting configuration. In the bottom mounting configuration , an adhesive 2502 is disposed between the bottom surface (e.g., the bottom dielectric layer) of the coupling strip 1900 and the surface of the bulk medium 1902 . For example, the adhesive can be a layer of double-sided adhesive (e.g., double-sided tape, etc.), resin, or epoxy, but is not limited thereto .

[0206] FIG. 25B shows a cross-sectional view of another exemplary configuration for attaching the coupling strip 1900 to the bulk medium 1902. FIG. 25B shows a top mounting configuration. In the top mounting configuration , an adhesive layer 2504 is applied on the coupling strip 1900 to attach the coupling strip 1900 to the outer skin 1902 of the aircraft. The adhesive layer 2504 is, for example, an adhesive coating It can be a film, an adhesive film, or a tape.

[0207] FIG. 26A is a cross-sectional view of a bonding strip 1900 with a double-sided adhesive bottom layer before being installed on a bulk medium 1902, and FIG. 26B is a cross-sectional view of the bonding strip 1900 of FIG. 26A installed on the bulk medium 1902. In some embodiments such as a bottom mounting configuration the bonding strip 1900 includes an adhesive bottom layer 2608. The adhesive bottom layer can be formed from a double-sided adhesive (e.g., a double-sided tape). In such embodiments, the double-sided adhesive can function as a lower dielectric layer (e.g., the lower dielectric layer 1908 in FIG. 19). In some mounting embodiments, the adhesive bottom layer 2608 can be, for example, an adhesive coating film or an adhesive film applied to the bottom surface of the lower dielectric layer 1908. Before installation, the bonding strip 1900 having the adhesive bottom layer 2608 can include a liner 2610 on the adhesive bottom layer 2608. The liner 2610 can be, for example, a release layer. For example, the liner 2610 can protect the adhesive bottom layer 2608 before installation. During installation, the liner 2610 is removed from the adhesive bottom layer 2608 to expose its adhesive surface, and the bonding strip 1900 can be attached to the surface of the bulk medium 1902. In some mounting embodiments, in order to attach the dielectric layer 1908 to the conductive layer 1904 and / or attach the conductive shield layer 1906 to the dielectric layer 1908, one or more adhesive layers 2604 and 2606 can be included. In some embodiments, the bonding strip 1900 includes a protective layer 2602 on the conductive shield layer 1906. For example, the protective layer 2602 can be polyurethane, polyfluoride, paint, a paint replacement film, etc.

[0208] In some mounting embodiments, in order to attach the dielectric layer 1908 to the conductive layer 1904 and / or attach the conductive shield layer 1906 to the dielectric layer 1908, one or more adhesive layers 2604 and 2606 can be included. In some embodiments, the bonding strip 1900 includes a protective layer 2602 on the conductive shield layer 1906. For example, the protective layer 2602 can be polyurethane, polyfluoride, paint, a paint replacement film, etc. For example, the protective layer 2602 can be polyurethane, polyfluoride, paint, a paint replacement film, It can include one or more layers of a sealant, or combinations thereof, but is not limited thereto.

[0209] In some applications, it may be necessary to heat a non-conductive bulk medium. In such cases, the heating systems and bonding strips described herein can be modified to heat such a non-conductive bulk medium. For example, an embedded layer can be used with a bonding strip heating system to heat a non-conductive bulk medium.

[0210] Figures 27A - 27F show cross-sectional views of various embodiments of an embedded bonding strip. Figure 2 7A shows a bonding strip 2700 similar to the bonding strip 1900 of Figure 19. Similar to the bonding strip 1900, the bonding strip 2700 has a multi-layer structure including a first dielectric layer 1908 on a bulk medium 1902, a conductive layer 1904 on the first dielectric layer 1908, a second dielectric layer 1908 on the conductive layer 1904, and a conductive shield layer 1906 on the second dielectric layer 198, and optionally a protective layer 2706 on the conductive shield layer 1906. The protective layer 2706 is similar to the protective layer 2602 described above. The bonding strip 2700 is attached to the surface of a non-conductive bulk medium 2702, which contains a bulk conductive material 2704 embedded therein, which is different from the bonding strip 1900 in this regard. For example, the bulk conductive material 2704 can be formed as a metal foil, a metal tape, or a metal layer embedded within the non-conductive bulk medium 2702. For example the non-conductive bulk medium 2702 has a bulk disposed between the layers of the non-conductive A layered material having a Cu conductive material 2704 (e.g., a carbon fiber composite, a glass fiber composite, or a Kevlar composite) is possible. The bulk conductive material 2704 can be made from a conductive layer such as copper, a copper alloy (e.g., brass or bronze), silver, a silver alloy, aluminum, an aluminum alloy, titanium, a titanium alloy, chromium, nickel, a nickel alloy, a cobalt-based alloy, a corrosion-resistant steel, graphite, or a combination thereof, but is not limited thereto. In each of the examples shown in FIGS. 27A - 27F, the AC current passing through the conductive layer 1904 of the bonding strip 2700 generates a heating current in the bulk conductive material 2704 rather than in the non-conductive bulk medium 2702. Next, the heat generated in the bulk conductive material 2704 conducts into the non-conductive bulk medium 2702 (e.g., by heat conduction). In some examples, when the non-conductive bulk medium exhibits some conductive behavior, heat is also generated in the non-conductive portion in addition to the bulk conductive material layer. FIG. 27B shows an embodiment of a bonding strip 2700 including only a protective layer 2706, a conductive layer 1904, and a dielectric layer 1908. In the bonding strip 2700, the protective layer 2706 is disposed on the conductive layer 1904, and the conductive layer 1904 is disposed on the dielectric layer 1908. The dielectric layer 1908 is separated from the embedded bulk conductive material 2704 by a portion of the non-conductive bulk medium 2702. FIG. 27C shows an embodiment of a bonding strip 2700 including a conductive layer 1904 embedded in a non-conductive bulk medium 2702. The bonding strip 2700 of FIG. 27C has a protective layer 2 The bulk conductive material 2704 can be made from a conductive layer such as copper, a copper alloy (e.g., brass or bronze), silver, a silver alloy, aluminum, an aluminum alloy, titanium, a titanium alloy, chromium, nickel, a nickel alloy, a cobalt-based alloy, a corrosion-resistant steel, graphite, or a combination thereof, but is not limited thereto.

[0211] In each of the examples shown in FIGS. 27A - 27F, the AC current passing through the conductive layer 1904 of the bonding strip 2700 generates a heating current in the bulk conductive material 2704 rather than in the non-conductive bulk medium 2702. Next, the heat generated in the bulk conductive material 2704 conducts into the non-conductive bulk medium 2702 (e.g., by heat conduction). In some examples, when the non-conductive bulk medium exhibits some conductive behavior, heat is also generated in the non-conductive portion in addition to the bulk conductive material layer. The bulk conductive material 2704 can be made from a conductive layer such as copper, a copper alloy (e.g., brass or bronze), silver, a silver alloy, aluminum, an aluminum alloy, titanium, a titanium alloy, chromium, nickel, a nickel alloy, a cobalt-based alloy, a corrosion-resistant steel, graphite, or a combination thereof, but is not limited thereto. In each of the examples shown in FIGS. 27A - 27F, the AC current passing through the conductive layer 1904 of the bonding strip 2700 generates a heating current in the bulk conductive material 2704 rather than in the non-conductive bulk medium 2702. Next, the heat generated in the bulk conductive material 2704 conducts into the non-conductive bulk medium 2702 (e.g., by heat conduction). In some examples, when the non-conductive bulk medium exhibits some conductive behavior, heat is also generated in the non-conductive portion in addition to the bulk conductive material layer. In each of the examples shown in FIGS. 27A - 27F, the AC current passing through the conductive layer 1904 of the bonding strip 2700 generates a heating current in the bulk conductive material 2704 rather than in the non-conductive bulk medium 2702. Next, the heat generated in the bulk conductive material 2704 conducts into the non-conductive bulk medium 2702 (e.g., by heat conduction). In some examples, when the non-conductive bulk medium exhibits some conductive behavior, heat is also generated in the non-conductive portion in addition to the bulk conductive material layer. In each of the examples shown in FIGS. 27A - 27F, the AC current passing through the conductive layer 1904 of the bonding strip 2700 generates a heating current in the bulk conductive material 2704 rather than in the non-conductive bulk medium 2702. Next, the heat generated in the bulk conductive material 2704 conducts into the non-conductive bulk medium 2702 (e.g., by heat conduction). In some examples, when the non-conductive bulk medium exhibits some conductive behavior, heat is also generated in the non-conductive portion in addition to the bulk conductive material layer. In each of the examples shown in FIGS. 27A - 27F, the AC current passing through the conductive layer 1904 of the bonding strip 2700 generates a heating current in the bulk conductive material 2704 rather than in the non-conductive bulk medium 2702. Next, the heat generated in the bulk conductive material 2704 conducts into the non-conductive bulk medium 2702 (e.g., by heat conduction). In some examples, when the non-conductive bulk medium exhibits some conductive behavior, heat is also generated in the non-conductive portion in addition to the bulk conductive material layer.

[0212] FIG. 27B shows an embodiment of a bonding strip 2700 including only a protective layer 2706, a conductive layer 1904, and a dielectric layer 1908. In the bonding strip 2700, the protective layer 2706 is disposed on the conductive layer 1904, and the conductive layer 1904 is disposed on the dielectric layer 1908. The dielectric layer 1908 is separated from the embedded bulk conductive material 2704 by a portion of the non-conductive bulk medium 2702. In the bonding strip 2700, the protective layer 2706 is disposed on the conductive layer 1904, and the conductive layer 1904 is disposed on the dielectric layer 1908. The dielectric layer 1908 is separated from the embedded bulk conductive material 2704 by a portion of the non-conductive bulk medium 2702. In the bonding strip 2700, the protective layer 2706 is disposed on the conductive layer 1904, and the conductive layer 1904 is disposed on the dielectric layer 1908. The dielectric layer 1908 is separated from the embedded bulk conductive material 2704 by a portion of the non-conductive bulk medium 2702. The dielectric layer 1908 is separated from the embedded bulk conductive material 2704 by a portion of the non-conductive bulk medium 2702. The dielectric layer 1908 is separated from the embedded bulk conductive material 2704 by a portion of the non-conductive bulk medium 2702.

[0213] FIG. 27C shows an embodiment of a bonding strip 2700 including a conductive layer 1904 embedded in a non-conductive bulk medium 2702. The bonding strip 2700 of FIG. 27C has a protective layer 2 In the bonding strip 2700 of FIG. 27C, the protective layer 2 It includes a conductive shield layer 1906, a dielectric layer 1908, and a conductive layer 1904. The bonding strip 2700 includes a protective layer 2706, a conductive shield layer 1906, and a dielectric layer 1908 is disposed on the conductive layer 1904. The conductive layer 1904 is embedded in a non-conductive bulk medium 2702 and is separated from a bulk conductive material 2704 by a portion of the non-conductive bulk medium 2702. For example, the conductive layer 1904 and the bulk conductive material 2704 can be disposed between different layers of the non-conductive bulk medium 2702 respectively.

[0214] FIG. 27D shows a variant of the bonding strip 2700 shown in FIG. 27C, but the protective layer 2 706, the conductive shield layer 1906, and the dielectric layer 1908 are absent.

[0215] FIG. 27E shows a variant of the bonding strip 2700 shown in FIG. 27D, in which the geometric arrangement of the conductive layer 19 04 and the bulk conductive material 2704 is reversed. That is, in the arrangement of the bonding strip 2700 shown in FIG. 27E, the bulk conductive material 2704 is disposed closer to the surface of the non-conductive bulk medium 2702 than the conductive layer 190 4.

[0216] FIG. 27F shows an embodiment of the bonding strip 2700 including a conductive layer 1904 and a conductive shield layer 1906 embedded in a non-conductive bulk medium 2702. In the bonding strip 2700 shown in FIG. 27F, a portion of the non-conductive bulk medium 2702 (e.g., a layer of the non-conductive bulk medium 2702) separates the conductive layer 1904 from the conductive shield layer 1906 and the bulk conductive material 2704. The non-conductive bulk medium 2702 serves the same purpose as the dielectric layer 1908 in the bonding strip 1900 shown in FIG. 19. ​

[0217] FIG. 28 shows a diagram of one embodiment of the coupling strip connector 2802. FIG. 2805 is a circuit diagram of the connector 2802. The connector 2802 includes an integrated impedance adjustment ne twork 2804. The impedance adjustment network 2804 is electrically coupled between the input signal in terface 2806 and the coupling strip 1900. For example, the input signal interface 2806 can be a coaxial cable connection. The input terminal 2810 of the input signal in terface 2806 (e.g., the center wire of the coaxial cable connection) is coupled to the conductive layer 1904 of the coupling strip 1900 by a lead 2808. The ground terminal 2814 of the input signal in terface 2806 (e.g., the shield of the coaxial cable connection) is coupled to one or both of the bulk medium 1902 or the conductive shield layer 1906 of the coupling strip 1 900 by one or more leads 2812. The impedance adjustment network 2804 is configured to adjust the input impedance of the coupling strip 1900 to a desired level measured at the input signal interface 2806. The impedance adjustment network 2804 can be a fixed or variable impedance

[0218] adjustment network. For example, the impedance adjustment network 2804 can be implemented as any of the impedance adjustment networks described with reference to FIGS. 12 - 15B. In FIG. 2850, the impedance adjustment network 2804 is coupled to ground and either the conductive shield layer 1906 of the coupling strip 1900 and the bulk medium 1902 (or the bulk conductive material 2704 when implemented for a non conductive bulk medium) or both. ​​​​​​ It is implemented as a parallel capacitor C1 connected between both of them.

[0219] FIG. 29 shows a diagram of another embodiment of the coupling strip connector 2902. The connector 29 02 includes, for example, two input signal interfaces 2906A and 2906B for chain-coupling a plurality of coupling strips 1900 together. FIG. 2905 is a circuit diagram of the connector 2902. The connector 2902 includes an integrated impedance adjustment network 2 904. The impedance adjustment network 2904 includes series and parallel impedance adjustment elements 2904A, 2904B, and 2904C electrically coupled between the input signal interfaces 2906A, 2906B and the coupling strip 1900. For example , the input signal interfaces 2906A and 2906B can be coaxial cable connections. The respective input terminals 22910 of the input signal interfaces 2906A, 2906B are coupled to the conductive layer 1904 of the coupling strip 1900 and are coupled to each other by wiring 2808. The respective ground terminals 2 914 of the input signal interfaces 2906A, 2906B are coupled to one or both of the bulk medium 1902 or the conductive shield layer 1906 of the coupling strip 1900 by one or more wirings 2912.

[0220] In FIG. 2950, the impedance adjustment network 2804 is a series capacitor C1 and two shunt capacitors C2, C3 connected between ground and either one or both of the conductive shield layer 1906 and the bulk medium 1902 (or the bulk conductive material 2704 when implemented for a non-conductive bulk medium) of the coupling strip 1900. It is implemented as follows.

[0221] FIG. 30 illustrates a first exemplary ballast using a bonding strip 1900 according to an embodiment of the present disclosure. FIG. 3 is a block diagram of a gas medium heating system 3000. A plurality of spaced apart and attached to a bulk medium 1902 (e.g., an aircraft wing). Each of the coupling strips 1900 includes a power control system 30 02. The power control system 3002 is the same as the power control system 104 described above. The power control system 3002 may be implemented as any one of the embodiments. The lip is supplied with AC current.

[0222] One end of each coupling strip 1900 (referred to herein as the "input end") is 3004 to the power control system 3002. In the illustrated example, The opposite end of the loop 1900 (herein, the "end") may be an open circuit end 3006 or a closed circuit end 3007. The joining strip 1900 has either one of the ends 3008. 1900 are arranged in an alternating pattern with each pair having a different type of termination. One coupling strip 1900 of an adjacent pair has an open circuit termination 3006 at its end, and the other The coupling strip 1900 has a closed termination 3008 at its end. The ends of the bonding strip 1900 are left open circuited and the bulk medium 1902 or bonding 1900 is electrically connected to ground via one of the conductive shielding layers of the In some embodiments, the closed termination 3008 is shown to be 0 and the conductive shielding layer of the bulk medium 1902 or bonding strip 1900. is a short circuit or open circuit with either one or both. In some embodiments, the closed circuit terminal 3008 is a capacitive terminal, and a capacitor is electrically connected between the conductive layer of the coupling strip 1900 and the electrical ground. For example, the capacitor is connected between the conductive layer of the coupling strip 1900 and either the bulk medium 1902 or the conductive shield layer of the coupling strip 1900. In some embodiments, the closed circuit terminal 3008 is an inductive terminal, and an inductor is connected between the conductive layer of the coupling strip 1900 and the electrical ground. For example, the inductor is connected between the conductive layer of the coupling strip 1900 and either the bulk medium 1902 or the conductive shield layer of the coupling strip 190 0. In some embodiments, the closed circuit terminal 3008 is a resistive terminal, and a resistor is connected between the conductive layer of the coupling strip 1900 and the electrical ground . For example, the resistor is connected between the conductive layer of the coupling strip 1900 and either the bulk medium 1902 or the conductive shield layer of the coupling strip 1900. In some embodiments, the closed circuit terminal 3008 is a resistive terminal, and a resistor is connected between the conductive layer of the coupling strip 1900 and the electrical ground . For example, the resistor is connected between the conductive layer of the coupling strip 1900 and either the bulk medium 1902 or the conductive shield layer of the coupling strip 1900.

[0223] To provide a desired input impedance to the power control system 3002, to provide a desired heating distribution throughout the bulk medium 1 902, or to provide a combination thereof, complementary terminal types can be applied to adjacent coupling strips 1900. For example , the coupling strip 1900 can be placed on the bulk medium 1902 in a pattern of adjacent coupling strips 1900 having complementary terminal types. For example, the terminals of adjacent coupling strips 1900 can be alternated between an open circuit terminal 3006 and a short circuit terminal (e.g., a closed circuit terminal 3008 implemented as a short circuit). In another example, the adjacent coupling strips 1900 can be alternated between an open circuit terminal 3006 and a short circuit terminal (e.g., a closed circuit terminal 3008 implemented as a short circuit). In another example, the adjacent coupling strips 1900 can be alternated between an open circuit terminal 3006 and a short circuit terminal (e.g., a closed circuit terminal 3008 implemented as a short circuit). In another example, the adjacent coupling The end of the combined strip 1900 can alternate between a closed - circuit termination 3008 implemented as a capacitive termination and an inductive closed - circuit termination 3008 implemented as a termination.

[0224] FIG. 31 is a block diagram of a second exemplary bulk media heating system 3100 using a combined strip 1900 according to an embodiment of the present disclosure. The heating system 3100 is similar to the heating system 3000 described above, but a control system 3102 configured to drive a variable termination 3106 attached to the end of each combined strip 1900 is added. The variable termination 3106 includes a switchable termination. In some implementations, the variable termination 31 06 is configured to switch between a short - circuit termination and an open - circuit termination. For example, the variable termination 3106 includes a controllable switch coupled between the conductive layer of the combined strip 1900 and electrical ground. The controllable switch can be implemented as an electronic switch (e.g., a transistor, a PIN diode, a thyristor, a silicon - controlled rectifier, etc.) or a mechanical switch (e.g., a relay). For example, the controllable switch is connected between the conductive layer of the combined strip 1900 and either the bulk media 1902 or the conductive shield layer of the combined strip 1900. The output of the control system is coupled to the control terminal of the controllable switch. The end of each combined strip 1900 can be changed between an open - circuit and a short - circuit by opening and closing the controllable switch (or by turning off or on an electronic switch). For example, the control system 3102 can control the variable termination of the combined strip 1900 to switch between an open - circuit and a short - circuit. by controlling the controllable switch. The output of the control system is coupled to the control terminal of the controllable switch.

[0225] The end of each combined strip 1900 can be changed between an open - circuit and a short - circuit by opening and closing the controllable switch (or by turning off or on an electronic switch). For example, the control system 3102 can control the variable termination of the combined strip 1900 to switch between an open - circuit and a short - circuit. by controlling the controllable switch. For example, the control system 3102 can control the variable termination of the combined strip 1900 Control the operation of 3106 and operate a controllable switch to form a bonding strip Change the termination type of 1900 as needed to heat the bulk medium 1902. The system 3102 can independently control the variable terminations 3106 of each bonding strip. In some embodiments, the control system 3102 can control a group (e.g., a pair or a larger group) of variable terminations 3106 of the bonding strip in synchronization with each other. In some embodiments, the control system 3102 can switch and control the variable terminations 3106 of one or more bonding strips 1 900 at regular intervals, e.g., in a regular operating cycle. The operating cycle for switching the variable termination 3106 can range from 0.01H z to 100 Hz. In some implementations, the control system 3102 controls the operation of the variable termination 3106 by alternately switching the variable termination 3106 between an open circuit termination and a closed circuit termination. For example, during the first half of the operating cycle, the control system 3102 switches half of the variable terminations 3106 to short circuit terminations and half of the variable terminations 3106 to open circuit terminations. Next, during the second half of the operating cycle, the control system 3102 controls the variable terminations 3106 such that the terminations that were open circuit terminations are switched to closed circuit terminations and vice versa. The operating cycle for switching the variable termination 3106 can range from 0.01 Hz to 100 Hz.

[0226] In some implementations, each pair of variable terminations 3106 of adjacent bonding strips 1900 is controlled to maintain opposite types of terminations. That is, the control system 3102

[0227] In some implementations, each pair of variable terminations 3106 of adjacent bonding strips 1900 is controlled to maintain opposite types of terminations. That is, the control system 3102 ​​​​​​​​In each adjacent pair, one coupling strip 1900 is configured as an open circuit at its end, and the other of the pair is configured as an open circuit at its end. The variable termination 3106 is configured such that the end of one of the coupling strips 1900 is configured as an open circuit. The termination is alternated every half of the operating cycle.

[0228] The control system 3102 includes one or more resistors configured to control the operation of the variable termination 3106. A computing device with one or more processors or microcontrollers For example, the control system 3102 may store instructions in memory (e.g., software code). The instructions, when executed by the control system 3102, include In some implementations, the power control System 3002 and control system 3102 are integrated into a common power and control system. It can be done.

[0229] In some implementations, the variable termination 3106 switches between capacitive and inductive termination. For example, the controllable switch may be configured to switch the conductive layer of the coupling strip 1900 Either couple to a capacitor connected to ground or connect the conductive layer of the coupling strip 1900 to ground. The inductor 10 can be configured to switch between coupling to the inductor 102 and coupling to the inductor 103 connected to the inductor 104. Thus, the ground is connected to the bulk medium 1902 or the conductive shield layer of the coupling strip 1900. Further, in such an embodiment, the control system 31 02 as described above to alternate variable termination 3106 between conductive and inductive termination. can be switched to.

[0230] In other implementations, the variable termination 3106 can be used to switch between different termination types, e.g., open circuit termination. between the capacitive termination, between the short - circuit termination and the inductive termination, between the open - circuit termination and the inductive termination, short - circuit termination and the capacitive termination, between the open - circuit termination and the resistive termination, between the short - circuit termination and the resistive termination, and also it can be changed to switch between these other combinations.

[0231] FIG. 32 is a block diagram of a third exemplary bulk media heating system 3200 using a coupling strip according to an embodiment of the present disclosure. The heating system 3200 is configured to alternately drive adjacent coupling strips 1900. The heating system 3200 is similar to the above - mentioned heating system 3000, but a control system 3202 configured to drive a switchable connector 3204 attached to the input end of each coupling strip is added. The switchable connector 3204 includes a controllable switch arranged to connect and disconnect the associated coupling strip 1900 to and from the power control system 3002. The controllable switch can be implemented as an electronic switch (e.g., transistor, power diode, thyristor, silicon - controlled rectifier, etc.) or a mechanical switch (e.g., relay). For example, the controllable switch is connected between the conductive layer of the coupling strip 1900 and the input terminal of the switchable connector 3204. The output of the control system is coupled to the control terminal of the controllable switch. The control system 3202 controls the operation of the switchable connector 3204 to alternately connect and disconnect the coupling strip 1900 to and from the power control system 3002, effectively turning the coupling strip 1900 on and off. For example, the control system 3202 switches between different states. For example, the controllable switch is connected between the conductive layer of the coupling strip 1900 and the input terminal of the switchable connector 3204. The output of the control system is coupled to the control terminal of the controllable switch. The control system 3202 controls the operation of the switchable connector 3204 to alternately connect and disconnect the coupling strip 1900 to and from the power control system 3002, effectively turning the coupling strip

[0232] 1900 on and off. For example, the control system 3202 switches the coupling strip 1900 to be alternately connected to and disconnected from the power control system 3002, effectively turning the coupling strip 1900 on and off. For example, the control system 3202 switches The possible connector 3204 can be controlled to alternately turn the coupling strip 1900 on and off. For example, the control system 3202 operates a controllable switch to control the operation of the switchable connector 3204 of the coupling strip 1900 to turn the coupling strip 1900 off and on as needed to heat the bulk medium 1902. In some embodiments, the control system 3102 can independently control the variable termination 3106 of each coupling strip. In some implementations, the control system 3102 can control the variable terminations 3106 of a group of coupling strips (e.g., a pair or a larger group) in synchronization with each other. In some embodiments, the control system 3102 can switch - control the variable terminations 3106 of one or more coupling strips 1900 at regular intervals, e.g., according to a normal operating cycle. The operating cycle for switching the variable termination 3106 can range from 0.01 Hz to 100 Hz. In some implementations, during the first half of the operating cycle, the control system 3202 turns on the coupling strip 1900 with an open - circuit termination 3006 and turns off the coupling strip 1900 with a closed - circuit termination 3008. Next, during the second half of the operating cycle, the control system 3202 switches the switchable connector 3204 to turn off the coupling strip 1900 with an open - circuit termination 3006 and turn on the coupling strip 1900 with a closed - circuit termination 3008. The control system 3202 is a computing device comprising one or more processors or microcontrollers configured to control the operation of the variable termination 3106. In some implementations, during the first half of the operating cycle, the control system 3202 turns on the coupling strip 1900 with an open - circuit termination 3006 and turns off the coupling strip 1900 with a closed - circuit termination 3008. Next, during the second half of the operating cycle, the control system 3202 switches the switchable connector 3204 to turn off the coupling strip 1900 with an open - circuit termination 3006 and turn on the coupling strip 1900 with a closed - circuit termination 3008. Then, during the second half of the operating cycle, the control system 3202 switches the switchable connector 3204 to turn off the coupling strip 1900 with an open - circuit termination 3006 and turn on the coupling strip 1900 with a closed - circuit termination 3008. The control system 3202 is a computing device comprising one or more processors or microcontrollers configured to control the operation of the variable termination 3106. Next, during the second half of the operating cycle, the control system 3202 switches the switchable connector 3204 to turn off the coupling strip 1900 with an open - circuit termination 3006 and turn on the coupling strip 1900 with a closed - circuit termination 3008. The control system 3202 is a computing device comprising one or more processors or microcontrollers configured to control the operation of the variable termination 3106.

[0233] The control system 3202 is a computing device comprising one or more processors or microcontrollers configured to control the operation of the variable termination 3106. The control system 3202 is a computing device comprising one or more processors or microcontrollers configured to control the operation of the variable termination 3106. It is possible. For example, the control system 3202 includes memory storage instructions (e.g., software code ), and when the instructions are executed by the control system 3202, they provide appropriate control signals to the controllable switches within the variable termination 3106. In some implementations, the power control system 3002 and the control system 3202 can be integrated into a common power and control system.

[0234] As used herein, the terms "vertical" or "substantially vertical" or "normal" or " substantially normal" refer to the relationship between two elements (e.g., lines, directions, axes, planes, surfaces, or components) that form an angle of 90 degrees within the allowable engineering or measurement tolerance range. For example, if the angle between the directions is within the allowable range of 90 degrees (e.g., ±1 to 2 degrees), the directions can be considered perpendicular to each other.

[0235] Although many specific details of the embodiments are included herein, these should not be construed as limitations on the scope of the invention or the claimable range, but rather as descriptions of the specific features inherent in the specific embodiments of a particular invention. The specific features described herein in the context of separate embodiments can also be implemented in combination in a single embodiment. Conversely, the various features described in the context of a single embodiment can also be implemented separately in multiple embodiments or in any suitable partial combination. Further, even if various features are described above as acting in a particular combination and were initially claimed as such, one or more features from the claimed combination can, in some cases, be deleted from that combination, and the claimed combination can be a partial combination or a partial combination ​​​​​​​​​​​It can be directed to variations of the race.

[0236] Similarly, although the operations are shown in the drawings in a particular order, this is not to be understood as requiring that such operations be performed in the particular order or sequence shown, or that all of the illustrated operations be performed. In certain situations, multitasking and parallel processing may be advantageous. Further, the separation of the various system modules and components in the above embodiments should not be understood as being required in all embodiments, and the described program co mponents and systems can generally be integrated into a single software and / or hardware product, or packaged into multiple software and / or hardware products. Although specific embodiments of the subject matter have been described, other embodiments are included in the following claims. For example, the operations recited in the claims can be performed in a different order and still achieve desirable results. As an example, the processes shown in the accompanying figures do not necessarily require the particular order or sequential order shown to achieve desirable results. In some cases, multitasking and parallel processing may be advantageous. In addition to the embodiments of the appended claims and the above embodiments, the embodiments numbered below are also innovative. Embodiment 1 is a system for heating the outer surface of a bulk medium, the system comprising mutually ... ...

[0237] Although specific embodiments of the subject matter have been described, other embodiments are included in the following claims. For example, the operations recited in the claims can be performed in a different order and still achieve desirable results. As an example, the processes shown in the accompanying figures do not necessarily require the particular order or sequential order shown to achieve desirable results. In some cases, multitasking and parallel processing may be advantageous. ... ... ... ... ...

[0238] In addition to the embodiments of the appended claims and the above embodiments, the embodiments numbered below are also innovative. ...

[0239] Embodiment 1 is a system for heating the outer surface of a bulk medium, the system comprising mutually including two or more coupling strips attached to the bulk medium at intervals, each coupling strip extending along the surface of the bulk medium and forming a power transmission line in combination with the bulk medium including a multilayer structure, the multilayer structure including a first dielectric layer on the bulk medium, a conductive layer on the first dielectric layer, a second dielectric layer on the conductive layer, and a conductive electrical shielding layer on the second dielectric layer, and each of the conductive layers of the coupling strips and a power control system coupled to the bulk medium, the power control system being configured to heat the surface of the bulk medium by supplying current to the coupling strips 。

[0240] Embodiment 2 is the system of Embodiment 1, and the power control system is configured to provide current to the coupling strips at an AC frequency of 1 kHz to 4 50 MHz.

[0241] Embodiment 3 is the system of either Embodiment 1 or 2, and the conductive layer is disposed within 1 inch of the bulk medium.

[0242] Embodiment 4 is the system of any one of Embodiments 1 to 3, and the power control system is configured to provide an AC current of 0.1 ampere to 200 amperes to each coupling strip 。

[0243] Embodiment 5 is the system of any one of Embodiments 1 to 4, and at least one of the conductive layers of the coupling strips is arranged in a serpentine pattern in which segments of the conductive layer are arranged side by side 。 placed.

[0244] Embodiment 6 is a system according to any one of Embodiments 1 to 5, wherein the conductive layer is separated from the bulk medium by a first distance, and the conductive shield layer is separated from the conductive layer by a second distance , and the range of the first distance to the second distance is from 1:1 to 1:5.

[0245] Embodiment 7 is a system according to any one of Embodiments 1 to 5, wherein the conductive layer is separated from the bulk medium by a first distance, and the conductive shield layer is separated from the conductive layer by a second distance , and the range of the first distance to the second distance is from 5:1 to 1:5.

[0246] Embodiment 8 is a system according to any one of Embodiments 1 to 5, wherein the conductive layer is separated from the bulk medium by a first distance, and the conductive shield layer is separated from the conductive layer by a second distance , and the range of the first distance to the second distance is from 1:1 to 5:1.

[0247] Embodiment 9 is a system according to any one of Embodiments 1 to 5, wherein the first dielectric layer has a first thickness, the second dielectric layer has a second thickness, and the ratio of the first thickness to the second thickness is from 1:1 to 1:5.

[0248] Embodiment 10 is a system according to any one of Embodiments 1 to 5, wherein the first dielectric layer has a first thickness, the second dielectric layer has a second thickness, and the ratio of the first thickness to the second thickness is from 1:1 to 5:1.

[0249] Embodiment 11 is a system according to any one of Embodiments 1 to 10, wherein at least one of the conductive layers of the bonding strip has a lateral width that varies along the length of the conductive layer.

[0250] Embodiment 12 is the system of Embodiment 11, and at least one of the bonding strips has a width that varies along the length of the conductive layer, and the width varies between a maximum width and a minimum width, and the maximum width is 1.5 to 100 times the minimum width.

[0251] Embodiment 13 is the system of Embodiment 11, and the width of the conductive layer varies between a maximum width and a minimum width and the maximum width is 1.5 to 100 times the minimum width.

[0252] Embodiment 14 is the system of any one of Embodiments 1 to 13, and at least one of the conductive layers of the bonding strip includes a plurality of segments, and one or a plurality of circuit elements are coupled between each pair of segments.

[0253] Embodiment 15 is the system of Embodiment 14, and the one or more circuit elements include capacitors.

[0254] Embodiment 16 is the system of any one of Embodiments 1 to 15, and at least one of the conductive layers of the bonding strip has a thickness that varies along the length of the conductive layer.

[0255] Embodiment 17 is the system of any one of Embodiments 1 to 16, and a bulk medium forms a second shield layer for the transmission line formed in combination with each of the bonding strips.

[0256] Embodiment 18 is the system of any one of Embodiments 1 to 17, and the conductive layer and the aforementioned conductive shield layer each include at least one of copper, silver, or aluminum.

[0257] Embodiment 19 is a system according to any one of Embodiments 1 to 18, wherein the conductive layer contains titanium and includes.

[0258] Embodiment 20 is a system according to any one of Embodiments 1 to 19, wherein the conductive shield layer includes at least one of a copper foil, an aluminum foil, or a braided shield material.

[0259] Embodiment 21 is a system according to any one of Embodiments 1 to 20,...

Claims

1. 1. A system for heating an aircraft skin, the system comprising: Two or more connecting strips attached to the skin of the aircraft at intervals, each A joining strip extends along a skin surface of the aircraft and couples with the skin of the aircraft. A multi-layer structure forming a power transmission line, the multi-layer structure comprising: a first dielectric layer on the skin of the aircraft; a conductive layer on the first dielectric layer; a second dielectric layer on the conductive layer; and a conductive shield layer on the second dielectric layer; and a power control system coupled to the conductive layer of each coupling strip and to the skin of the aircraft; the power control system supplies current to the coupling strip to control the power supply of the aircraft; configured to heat a surface of the outer shell; system.

2. The power control system supplies current to the coupling strip in the range of 1 kHz to 450 MHz AC 13. The system of claim 1, configured to provide at least one GHz frequency.

3. 2. The aircraft of claim 1, wherein the conductive layer is located within 1 inch of the aircraft skin. system.

4. The conductive layer of at least one of the connecting strips is such that a segment of the conductive layer The system of claim 1 , arranged in a side-by-side serpentine pattern.

5. the conductive layer is spaced a first distance from a skin of the aircraft; the conductive shield layer is spaced a second distance from the conductive layer; the ratio between the first distance and the second distance is in the range of 5:1 to 1:5; The system of claim 1 .

6. The conductive layer of at least one of the coupling strips is It has a variable width, the lateral width of the conductive layer varies between a maximum width and a minimum width; The maximum width is 1.5 to 100 times the minimum width. The system of claim 1 .

7. The conductive layer of at least one of the coupling strips includes a plurality of segments, 2. The method of claim 1, wherein one or more circuit elements are coupled between each pair of the segments. The system is as follows:

8. The skin of the aircraft is formed with the power transmission line in combination with each of the coupling strips. The system of claim 1 , further comprising:

9. The system of claim 1 , wherein the first dielectric layer comprises an adhesive.

10. The multi-layer structure further comprises: a first adhesion layer between the conductive layer and the second dielectric layer; and a second adhesion layer between the second dielectric layer and the conductive shielding layer; The system of claim 1 , comprising:

11. Each connecting strip includes a first end and a terminal end; The conductive layer of each coupling strip is coupled at the first end to the power control system. 、 At least one of the coupling strips includes a conductive path to electrical ground at the termination portion. 、 The system of claim 1 .

12. The system of claim 11 , wherein the electrical ground comprises an exterior skin of the aircraft.

13. The electrical ground includes the conductive shield layer of the at least one coupling strip. The system of claim 11 .

14. Each connecting strip includes a first end and the terminal end; the conductive layer of each coupling strip is coupled at the first end to the power control system; At least one of the coupling strips is disposed between the conductive layer and electrical ground at the termination portion.

13. The system of claim 1, further comprising an open circuit at

15. The system of claim 14 , wherein the electrical ground comprises an exterior skin of the aircraft.

16. The electrical ground includes the conductive shield layer of the at least one coupling strip. The system of claim 14 .

17. Each connecting strip has a first end and a terminal end; The conductive layer of each coupling strip is coupled at the first end to the power control system. 、 At least one of the coupling strips is disposed between the conductive layer and electrical ground at the termination portion. a circuit element coupled to said first input, said circuit element being a capacitor, an inductor, or a resistor The system of claim 1 , comprising at least one of:

18. Each connecting strip includes a first end and a terminal end; The conductive layer of each coupling strip is coupled at the first end to the power control system. 、 A first coupling strip of each adjacent pair of coupling strips is electrically connected to the conductive layer at the termination portion. alternating open circuits between the electrical and electrical grounds; The second coupling strip of each adjacent pair of coupling strips is electrically connected to the terminal end. Alternately, they contain conductive paths to ground. The system of claim 1 .

19. 2. The method of claim 1 , wherein the two or more coupling strips are electrically coupled to each other in parallel. The system is as follows:

20. 2. The method of claim 1 , wherein the two or more coupling strips are electrically coupled to each other in series. The system is as follows:

21. 1. A system for heating the exterior of an aircraft, the system comprising: an aircraft skin fabricated from a non-conductive material and having a bulk conductive material embedded therein; two or more connecting strips attached to the skin of the aircraft at spaced intervals; Including, Each joining strip extends along the skin of the aircraft and is embedded in the skin of the aircraft. a multi-layer structure that, in combination with a bulk conductive material, forms a power transmission line, said multi-layer structure comprising: a conductive layer overlying the bulk conductive material; a first dielectric layer between the bulk conductive material and the first conductive layer; Including, Further, a power control system coupled to the conductive layer of each coupling strip and to the skin of the aircraft. a power control system for supplying current to the coupling strips; and configured to heat a surface of the skin of the aircraft by heating the surface of the skin of the aircraft. system.

22. each joining strip extending along a surface of the skin of the aircraft; The multi-layer structure further comprises: a conductive shield layer on the conductive layer; a second dielectric layer between the conductive layer and the conductive shield layer; a protective layer on the conductive shield layer; 22. The system of claim 21, comprising:

23. the conductive layer is embedded within the skin of the aircraft; a first portion of the aircraft skin forming a first dielectric layer; The multi-layer structure further comprises: a conductive shielding layer embedded in the skin of the aircraft and covering the conductive layer; a second portion of the aircraft skin, the second portion being formed by the conductive layer and the conductive shielding layer; a second dielectric layer disposed between the first and second dielectric layers; 22. The system of claim 21, comprising:

24. The power control system supplies power to the coupling strip at AC frequencies between 1 kHz and 450 MHz.

22. The system of claim 21 configured to provide a flow.

25. 1. A method of installing an aircraft skin heating system, the method comprising: Each of them, A first dielectric layer; a conductive layer overlying the first dielectric layer; a conductive shield covering the conductive layer; and a second dielectric layer between the conductive layer and the conductive shield layer; obtaining a plurality of combined strips including: Each of the connecting strips is spaced apart from one another on the skin surface of the aircraft, and each connecting strip is the first dielectric layer of the strip being positioned between the skin of the aircraft and the conductive layer. and The conductive layer of each of the coupling strips is adapted to supply a current to the coupling strips. and coupling to a power control system configured to: A method comprising:

26. the first dielectric layer comprising a double-sided adhesive; The step of attaching each joining strip to the surface of the aircraft skin is Then, the liner is peeled off from the double-sided adhesive to expose the adhesive surface, and the adhesive surface is attached to the aircraft.

26. The method of claim 25, comprising the step of attaching the microbial composition to an exodermal surface of the microbial composition.

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