Sensor and metal mold

Abstract

To achieve a sensor that is applicable to estimation of a heat transfer coefficient.SOLUTION: A sensor (80) comprises: a film (82a) that is in contact with liquid and is bent by a pressing force from the liquid; and a laser displacement gauge (82b) that projects light on the film (82a) and receives light reflected from the film (82a) to detect the amount of bend of the film (82a).SELECTED DRAWING: Figure 14

Description

Technical Field

[0001] The present invention relates to a sensor and a mold.

Background Art

[0002] Conventionally, methods for simulating the flow state and solidification behavior of a melt during mold forming have been actively studied. Since the flow state and solidification behavior of the melt are affected by the metal part of the mold and the respective temperatures of the melt, in this simulation method, it is important to accurately estimate the respective temperature distributions (hereinafter abbreviated as "temperature distribution") of the metal part and the melt.

[0003] In the estimation of the temperature distribution, it is necessary to estimate the heat transfer coefficient (HTC) at the interface between the metal part and the melt as a premise. The heat transfer coefficient is a value representing the ease of heat transfer at the interface and changes depending on the contact state between the metal part and the melt. Here, since the contact state between the metal part and the melt changes over time and also varies depending on the contact location, it has been difficult to estimate the heat transfer coefficient.

[0004] To solve this problem, various studies have been conducted. For example, Non-Patent Document 1 discloses the results of investigating the influence of the reduction in the heat transfer coefficient due to the formation of an air gap on the temperature history, shrinkage cavity prediction parameters, etc. in the solidification analysis of castings.

Prior Art Documents

Non-Patent Documents

[0005]

Non-Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] The investigation method disclosed in Non-Patent Document 1 estimates the heat transfer coefficient by analyzing a model of the heat transfer coefficient that depends on the air gap amount at the time of air gap generation. Therefore, in this investigation method, it is necessary to measure the air gap amount as a premise for estimating the heat transfer coefficient. However, measuring the air gap amount is time-consuming in preparation and is also difficult to measure itself. Therefore, it has not always been easy to estimate the heat transfer coefficient using the investigation method disclosed in Non-Patent Document 1.

[0007] One aspect of the present invention has been made in view of the above-described problems, and an object thereof is to realize a sensor or the like applicable to the estimation of the heat transfer coefficient.

Means for Solving the Problems

[0008] A sensor according to one aspect of the present invention includes a membrane that contacts a fluid and is bent by a pressing force from the fluid, and a laser displacement meter that projects light onto the membrane and receives the light reflected from the membrane to detect the amount of bending of the membrane.

Effects of the Invention

[0009] According to one aspect of the present invention, a sensor or the like applicable to the estimation of the heat transfer coefficient can be realized.

Brief Description of the Drawings

[0010]

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Embodiment for Carrying Out the Invention

[0011] 〔Embodiment 1〕 <Overview of the Simulation Device> The simulation device 100 according to Embodiment 1 of the present invention is a device that simulates the flow state and solidification behavior of molten metal 50 (melt) during die casting. In this embodiment, a tablet terminal will be described as an example of the simulation device 100. The simulation device 100 may be, for example, a smartphone or a desktop personal computer in addition to the tablet terminal. Details of the molten metal 50 will be described later.

[0012] As shown in FIG. 1, the simulation device 100 includes an input unit 1, an output unit 2, a storage unit 3, a control device 4, a first sensor 10, and a second sensor 20. The input unit 1 receives operation inputs from a user or the like. The output unit 2 outputs the results of various processes performed by the simulation device 100. In this embodiment, the simulation device 100 includes a touch panel in which the input unit 1 and the display unit as the output unit 2 are integrated.

[0013] Note that the input unit 1 and the display unit (output unit 2) may be physically separated. Further, the input unit 1 may be, for example, a keyboard or a pointing device. The output unit 2 may be, for example, a communication unit that wirelessly transmits (or wired transmits) the results of various processes performed by the simulation device 100 to an external communication device (not shown), or may be a printer.

[0014] The first sensor 10 is a component of the simulation device 100 that measures temperatures Tmp1 to Tmp6 (first temperatures), temperature Tcp (second temperature), and contact pressure Fp. Specifically, the temperatures Tmp1 to Tmp6 are six temperatures of temperature Tmp1, Tmp2, Tmp3, Tmp4, Tmp5, and Tmp6.

[0015] The first sensor 10 includes a first temperature measurement unit 11, a first pressure measurement unit 12, and a first sensor main body 13 described below. The first temperature measurement unit 11 measures temperatures Tmp1 to Tmp6 and Tcp, and the first pressure measurement unit 12 measures the contact pressure Fp. Details of the temperatures Tmp1 to Tmp6 and Tcp, and the contact pressure Fp will be described later.

[0016] The second sensor 20 is a component of the simulation device 100 that measures temperatures Tmd1 to Tmd6 (first temperatures), temperature Tcd (second temperature), and contact pressure Fd. Specifically, the temperatures Tmd1 to Tmd6 are six temperatures, namely, temperatures Tmd1, Tmd2, Tmd3, Tmd4, Tmd5, and Tmd6.

[0017] The second sensor 20 includes a second temperature measurement unit 21, a second pressure measurement unit 22, and a second sensor main body 23 described below. The second temperature measurement unit 21 measures temperatures Tmd1 to Tmd6 and Tcd, and the second pressure measurement unit 22 measures the contact pressure Fd. Details of the temperatures Tmd1 to Tmd6 and Tcd, and the contact pressure Fd will be described later.

[0018] In this embodiment, the first and second temperature measurement units 11 and 21 are thermocouples. The first and second temperature measurement units 11 and 21 may be, for example, radiation thermometers or thermometers using optical fibers, but it is preferable to use thermocouples in consideration of measurement accuracy. Also, in this embodiment, the first and second pressure measurement units 12 and 22 are strain gauges. The first and second pressure measurement units 12 and 22 may be, for example, piezoelectric elements.

[0019] The storage unit 3 is a storage device that stores various data used by the simulation device 100. The control device 4 is, for example, a CPU (Central Processing Unit), and comprehensively controls each part constituting the simulation device 100. The control device 4 includes a first estimation device 30 (estimation device) and a second estimation device 60 (behavior estimation device).

[0020] The first estimation device 30 estimates the second heat transfer coefficient data hd-2, hpl-2, and hpu-2, which will be described later. Details of the estimation process of the first estimation device 30 will be described later. The second estimation device 60 estimates the respective temperature distributions of the mold 40 and the molten metal 50 during mold forming using the second heat transfer coefficient data hd-2, hpl-2, and hpu-2 estimated by the first estimation device 30. Further, the second estimation device 60 estimates the solidification behavior of the molten metal 50 during mold forming from the respective temperature distributions estimated by the first estimation device 30.

[0021] Specifically, the second estimation device 60 defines a solidification temperature according to the type of the molten metal 50, a solid fraction corresponding to the solidification temperature, and the like. Next, the second estimation device 60 estimates the solidification behavior of the molten metal 50 for each time step based on the respective temperature distributions for each time step, which will be described later. The method for estimating the solidification behavior is not particularly limited. For example, the law of conservation of energy may be used as a basic equation for heat transfer estimation, or the forward Euler method, the Crank-Nicolson method, or the like may be used as a numerical solution method for differential equations. Further, as a method for handling solidification, the temperature recovery method, the equivalent specific heat method, the enthalpy method, or the like may be used.

[0022] Note that the first and second estimation devices 30 and 60 do not necessarily have to be built into the control device 4, and it is sufficient if the simulation device 100 includes these devices in some manner. Also, the simulation device 100 does not necessarily have to include the first and second estimation devices 30 and 60, and for example, it may function as a server that stores the respective data of the first and second estimation devices 30 and 60. In this case, a simulation system may be constructed using the first and second sensors 10 and 20, the first and second estimation devices 30 and 60, and the simulation device 100.

[0023] The first estimation device 30 includes a temperature acquisition unit 31, a pressure acquisition unit 32, a generation unit 33, a first estimation unit 34, and a second estimation unit 35. The temperature acquisition unit 31 acquires each temperature value of the temperatures Tmp1 to Tmp6 and Tcp measured by the first sensor 10 from the first sensor 10, and acquires each temperature value of the temperatures Tmd1 to Tmd6 and Tcd measured by the second sensor 20 from the second sensor 20. Hereinafter, each temperature value acquired by the temperature acquisition unit 31 from the first sensor 10 is referred to as "temperature data Tmp1-1 to Tmp6-1 and Tcp-1 (first temperature data, second temperature data)". Also, each temperature value acquired by the temperature acquisition unit 31 from the second sensor 20 is referred to as "temperature data Tmd1-1 to Tmd6-1 and Tcd-1 (first temperature data, second temperature data)".

[0024] The pressure acquisition unit 32 acquires the pressure value of the contact pressure Fp measured by the first sensor 10 from the first sensor 10, and acquires the pressure value of the contact pressure Fd measured by the second sensor 20 from the second sensor 20. Hereinafter, the pressure value acquired by the pressure acquisition unit 32 from the first sensor 10 is referred to as "contact pressure data Fp-1 (pressure data)". Also, the pressure value acquired by the pressure acquisition unit 32 from the second sensor 20 is referred to as "contact pressure data Fd-1 (pressure data)". Each data acquired by each of the temperature acquisition unit 31 and the pressure acquisition unit 32 may be temporarily stored in the storage unit 3.

[0025] In this embodiment, each of the temperature acquisition unit 31 and the pressure acquisition unit 32 acquires data from the first and second sensors 10 and 20 at a plurality of time steps at regular intervals. Also, each of the temperature acquisition unit 31 and the pressure acquisition unit 32 acquires data from the first and second sensors 10 and 20 by data reception via wireless communication. This data reception may be performed by wired communication.

[0026] Note that the first estimation device 30 may calculate each of the contact pressure data Fd-1 and Fp-1 using each temperature data acquired by the temperature acquisition unit 31. In this case, the first estimation device 30 may not have the pressure acquisition unit 32.

[0027] The generation unit 33 generates an upper punch side basic data set (basic data set) by determining first heat transfer coefficient data hpu-1 using a plurality of temperature data acquired by the temperature acquisition unit 31. The first heat transfer coefficient data hpu-1 is a value indicating the first heat transfer coefficient on the upper punch side between the upper punch 42 and the molten metal 50 at the first interface Si1. The first heat transfer coefficient on the upper punch side is a value representing the ease of heat transfer at the first interface Si1. In the present embodiment, the generation unit 33 acquires data from the temperature acquisition unit 31 at a plurality of time steps at regular intervals, and determines the first heat transfer coefficient data hpu-1 for each time step.

[0028] The upper punch side basic data set is a data set in which contact pressure data Fp-1 and first heat transfer coefficient data hpu-1 are associated with each other. In the present embodiment, the generation unit 33 generates the upper punch side basic data set by determining the first heat transfer coefficient data hpu-1 and acquiring the contact pressure data Fp-1 from the pressure acquisition unit 32. Also in the present embodiment, the generation unit 33 acquires data from the pressure acquisition unit 32 at a plurality of time steps at regular intervals. Therefore, the upper punch side basic data set of the present embodiment has a configuration including a plurality of combinations of the contact pressure data Fp-1 and the first heat transfer coefficient data hpu-1 in one time step.

[0029] The generation unit 33 generates a die side basic data set (basic data set) by the same generation method as the upper punch side basic data set. The die side basic data set is a data set in which contact pressure data Fd-1 and first heat transfer coefficient data hdu-1 are associated with each other.

[0030] The generation unit 33 generates a lower punch side basic data set (basic data set) in the same generation method as the upper punch side basic data set. The lower punch side basic data set is a data set in which the contact pressure data Fp-1 and the first heat transfer coefficient data hpl-1 are associated with each other. In the present embodiment, the generation unit 33 determines the first heat transfer coefficient data hpl-1, and by regarding the contact pressure data Fp-1 acquired from the pressure acquisition unit 32 as the pressure value of the contact pressure acting on the third interface Si3, generates the lower punch side basic data set.

[0031] Note that each of the above-described basic data sets does not necessarily have to be generated by the generation unit 33. For example, each of the above-described basic data sets may be stored in advance in the storage unit 3 or an external server or the like, and may be read from the storage unit 3 or the like when the first estimation unit 34 performs the estimation process. Also, for example, an external information processing device may generate each of the above-described basic data sets, and the first estimation unit 34 may acquire the data from the information processing device during the estimation process. Details of the determination processes of the first to third interfaces Si1 to Si3 and the first heat transfer coefficient data hd-1, hpl-1, and hpu-1 by the generation unit 33 will be described later.

[0032] The first estimation unit 34 estimates the correlation between the contact pressure data Fp-1 and the first heat transfer coefficient data hpu-1 using the upper punch side basic data set generated by the generation unit 33. The first estimation unit 34 estimates the correlation between the contact pressure data Fd-1 and the first heat transfer coefficient data hd-1 using the die side basic data set generated by the generation unit 33. The first estimation unit 34 estimates the correlation between the contact pressure data Fp-1 and the first heat transfer coefficient data hpl-1 using the lower punch side basic data set generated by the generation unit 33. Details of the estimation process by the first estimation unit 34 will be described later.

[0033] The second estimation unit 35 estimates the second heat transfer coefficient data hd-2 from the estimated contact pressure data Fd-2 (specific pressure data) using the die-side estimated correlation relationship (estimated correlation relationship). The die-side estimated correlation relationship is the correlation between the contact pressure data Fd-1 estimated by the first estimation unit 34 and the first heat transfer coefficient data hd-1. The second heat transfer coefficient data hd-2 is the estimated value of the first heat transfer coefficient data hd-1 corresponding to the estimated contact pressure data Fd-2.

[0034] The second estimation unit 35 may select the estimated contact pressure data Fd-2 from among a plurality of contact pressure data Fd-1 included in the die-side basic data set. The second estimation unit 35 may use the value received by the input unit 1 as the estimated contact pressure data Fd-2 when the input unit 1 receives an input operation of the estimated contact pressure data Fd-2. The second estimation unit 35 may use the contact pressure data Fd-1 acquired from the pressure acquisition unit 32 as the estimated contact pressure data Fd-2. The same applies to the estimated contact pressure data Fp-2 described below.

[0035] Also, the second estimation unit 35 estimates the second heat transfer coefficient data hpu-2 from the estimated contact pressure data Fp-2 (specific pressure data) using the upper punch-side estimated correlation relationship (estimated correlation relationship). The upper punch-side estimated correlation relationship is the correlation between the contact pressure data Fp-1 estimated by the first estimation unit 34 and the first heat transfer coefficient data hpu-1. The second heat transfer coefficient data hpu-2 is the estimated value of the first heat transfer coefficient data hpu-1 corresponding to the estimated contact pressure data Fp-2.

[0036] Furthermore, the second estimation unit 35 estimates the second heat transfer coefficient data hpl-2 from the estimated contact pressure data Fp-2 using the lower punch-side estimated correlation relationship (estimated correlation relationship). The lower punch-side estimated correlation relationship is the correlation between the contact pressure data Fp-1 estimated by the first estimation unit 34 and the first heat transfer coefficient data hpl-1. The second heat transfer coefficient data hpl-2 is the estimated value of the first heat transfer coefficient data hpl-1 corresponding to the estimated contact pressure data Fp-2. Details of the estimation process by the second estimation unit 35 will be described later.

[0037] <Die and Contact Pressure> (Die) The die 40 is a metal mold used for manufacturing products by press working. In this embodiment, the forming material of the die 40 is carbon steel. As shown in FIG. 2, the die 40 includes a die 41, an upper punch 42 (metal part), and a lower punch 43 (metal part).

[0038] The die 41 is a hollow cylindrical mold, and the hollow part of the die 41 is cylindrical. On the inner side surface of the die 41 forming the hollow part, any one of various release agents such as water-soluble release agent, oil-based release agent, BN (boron nitride) spray, and black body spray is applied as required. A hole 41Y is formed in the metal part 41X of the die 41 in a direction perpendicular to the central axis of the die 41. The hole 41Y is a cylindrical hole having a size that allows the second sensor 20 to be inserted and removed, and penetrates from the outer side surface of the metal part 41X to the hollow part. In a state where the second sensor 20 is housed and set in the hole 41Y, as shown by reference numeral 202 in FIG. 2, the surface of the second sensor 20 (specifically, the second sensor body 23 described later) facing the molten metal 50 is flush with the inner side surface of the upper punch 42.

[0039] The upper punch 42 is a cylindrical mold having a size that can be inserted into and removed from the hollow part of the die 41. When setting the upper punch 42 in the die 41, the upper punch 42 is inserted through the upper opening in the hollow part. A hole 42X is formed in the upper punch 42 in a direction parallel to the central axis of the upper punch 42. The hole 42X is a cylindrical hole having a size that allows the first sensor 10 to be inserted and removed, and penetrates from the upper end surface to the lower end surface of the upper punch 42. Also, the central axis of the hole 42X coincides with the central axis of the upper punch 42. In a state where the first sensor 10 is housed and set in the hole 42X, as shown by reference numeral 202 in FIG. 2, the surface of the first sensor 10 (specifically, the first sensor body 13 described later) facing the molten metal 50 is flush with the lower end surface of the upper punch 42.

[0040] Note that the holes 41Y in the die 41 and the holes 42X in the upper punch 42 do not necessarily have to penetrate through. In this case, the thickness from the bottom surface of the non-penetrating hole 41Y to the inner side surface of the die 41 may be a thickness that can obtain the same measurement accuracy as that of the second sensor 20 when the second sensor 20 is set in the hole 41Y in the embodiment. Similarly, the thickness from the bottom surface of the non-penetrating hole 42X to the lower end surface of the upper punch 42 may be a thickness that can obtain the same measurement accuracy as that of the first sensor 10 when the first sensor 10 is set in the hole 42X in the embodiment.

[0041] The lower punch 43 is also a cylindrical mold with a size that can be inserted into and removed from the hollow portion of the die 41, similar to the upper punch 42. When setting the lower punch 43 in the die 41, the lower punch 43 is inserted from the lower opening in the hollow portion. Then, as shown by reference numeral 201 in FIG. 2, the lower punch 43 is housed in the hollow portion so that the lower end surface of the lower punch 43 is flush with the lower end surface of the die 41.

[0042] Casting (pressure casting) by press working using the mold 40 is performed as follows. First, the die 41 with the lower punch 43 housed in the hollow portion is set in a hydraulic press (not shown). Next, the molten metal 50 is poured into the hollow portion from the upper opening in the hollow portion. In this embodiment, the molten metal 50 is a molten metal of an aluminum alloy die-cast such as ADC12. The molten metal 50 may be a molten metal of other die-cast alloys such as a zinc alloy die-cast.

[0043] Next, the upper punch 42 is inserted from the upper opening in the hollow portion and brought into contact with the molten metal 50, and then the upper punch 42 is pressed vertically downward by a hydraulic press. That is, in the pressing process by the upper punch 42, the space 40X surrounded by the metal portion 41X of the die 41, the upper punch 42, and the lower punch 43 is filled with the molten metal 50. Also, in this process, the central axes of the die 41, the upper punch 42, and the lower punch 43 all coincide. This coincident central axis becomes the central axis AX of the mold 40. Finally, the upper punch 42 pressurizes the molten metal 50 while solidifying the molten metal 50, thereby completing a pre-finished molded body (not shown).

[0044] Note that the "orthogonal", "parallel", "coincident", and "flush" in the aforementioned "orthogonal to the central axis", "parallel to the central axis", "coincident with the central axis", and "flush with the inner side surface / lower end surface" do not strictly require "orthogonal", "parallel", "coincident", and "flush" in the strict sense. It suffices that they are "orthogonal", "parallel", "coincident", and "flush" at the visual recognition level, and it is a concept including dimensional errors and the like. This also applies to the following explanations.

[0045] The mold 40 does not necessarily have to be for press working. For example, when manufacturing a product using a molten resin (melt) instead of the molten metal 50, an injection molding die may be used as the mold 40. Further, the mold 40 does not have to be composed of the die 41, the upper punch 42, and the lower punch 43. The mold 40 may be of any shape and structure as long as each of the first and second estimation devices 30 and 60 can execute an estimation process.

[0046] (Contact pressure) As described above, the first pressure measurement unit 12 of the first sensor 10 measures the contact pressure Fp, and the second pressure measurement unit 22 of the second sensor 20 measures the contact pressure Fd. The contact pressure Fp is the pressure acting on the first interface Si1 shown by reference numeral 202 in FIG. 2. The contact pressure Fd is the pressure acting on the second interface Si2 shown by reference numeral 202 in FIG. 2. Note that in reference numeral 202 in FIG. 2, a gap is formed between the die 41, the upper punch 42, the lower punch 43, and the molten metal 50. This is for convenience of explanation, and actually, the die 41, the upper punch 42, and the lower punch 43 are in contact with the molten metal 50. The same applies to FIG. 13.

[0047] The first interface Si1 is a concept composed of a surface Sp1 in contact with the molten metal 50 in each of the first sensor 10 and the upper punch 42, and a surface Sc1 in contact with each of the first sensor 10 and the upper punch 42 in the molten metal 50. The "surface Sp1 in contact with the molten metal 50 in each of the first sensor 10 and the upper punch 42" is specifically composed of a surface facing the molten metal 50 in the first sensor 10 (the first sensor body 13 described later) and the lower end face of the upper punch 42. In the following description, this surface is referred to as the "first contact surface Sp1". The "surface Sc1 in contact with each of the first sensor 10 and the upper punch 42 in the molten metal 50" is specifically the upper end face of the molten metal 50, and is referred to as the "second contact surface Sc1" in the following description.

[0048] From the above definition of the first interface Si1, the "contact pressure Fp" refers to two pressures: the contact pressure Fp acting from the first contact surface Sp1 toward the second contact surface Sc1, and the contact pressure Fp acting from the second contact surface Sc1 toward the first contact surface Sp1. Here, the pressure Fpx acting from the second contact surface Sc1 on the surface facing the molten metal 50 in the first sensor 10 also becomes the contact pressure Fp. In the present embodiment, since the contact pressure Fp is measured based on the distortion of the first sensor 10 (specifically, the first sensor body 13 described later) caused by the pressure acting on the first sensor 10, the pressure Fpx is regarded as the "contact pressure Fp" in the following description.

[0049] The second interface Si2 is a concept composed of a surface Sd in contact with the molten metal 50 in each of the second sensor 20 and the die 41, and a surface Sc2 in contact with each of the second sensor 20 and the die 41 in the molten metal 50. The "surface Sd in contact with the molten metal 50 in each of the second sensor 20 and the die 41" is specifically composed of the surface facing the molten metal 50 in the second sensor 20 (the second sensor body 23 to be described later) and the inner side surface of the die 41. In the following description, this surface is referred to as the "third contact surface Sd". The "surface Sc2 in contact with each of the second sensor 20 and the die 41 in the molten metal 50" is specifically the side surface of the molten metal 50, and is referred to as the "fourth contact surface Sc2" in the following description.

[0050] From the definition of the aforementioned second interface Si2, simply the "contact pressure Fd" refers to two pressures, namely, the contact pressure Fd acting from the third contact surface Sd toward the fourth contact surface Sc2 and the contact pressure Fd acting from the fourth contact surface Sc2 toward the third contact surface Sd. Here, the pressure Fdx acting from the fourth contact surface Sc2 on the surface facing the molten metal 50 in the second sensor 20 also becomes the contact pressure Fd. In this embodiment, since the contact pressure Fd is measured based on the distortion of the second sensor 20 (specifically, the second sensor body 23 to be described later) caused by the pressure acting on the second sensor 20, the pressure Fdx is referred to as the "contact pressure Fd" in the following description.

[0051] The third interface Si3 is composed of a surface Sp2 in contact with the molten metal 50 in the lower punch 43 and a surface Sc3 in contact with the lower punch 43 in the molten metal 50. The "surface Sp2 in contact with the molten metal 50 in the lower punch 43" is specifically the upper end surface of the lower punch 43, and is referred to as the "fifth contact surface Sp2" in the following description. The "surface Sc3 in contact with the lower punch 43 in the molten metal 50" is specifically the lower end surface of the molten metal 50, and is referred to as the "sixth contact surface Sc3" in the following description.

[0052] Then, at the first interface Si1, the second interface Si2, and the third interface Si3, an interface between the entire metal part of the mold 40 and the molten metal 50 is formed. In the present embodiment, the simulation apparatus 100 performs various processes on the assumption that the contact pressure Fp (specifically, the pressure Fpx) also acts on the third interface Si3 without measuring the contact pressure acting on the third interface Si3.

[0053] <Specific structures of the first and second sensors> (Specific structure of the first sensor) The first sensor 10 has a first sensor body 13 as shown in FIG. 3. The first sensor body 13 is a solid rod-shaped member and is composed of a plurality of cylindrical portions with different outer diameters. The central axes of the plurality of cylindrical portions coincide, and this coincident central axis becomes the central axis AX1 of the first sensor body 13. In the present embodiment, the first sensor body 13 is formed of the same carbon steel as the mold 40.

[0054] Also, in the present embodiment, as shown by reference numeral 301 in FIG. 3, a pair of first pressure measurement portions 12 are provided on the first sensor body 13. Specifically, the two first pressure measurement portions 12 constituting this pair are arranged at symmetric positions with respect to the central axis AX1 in the first sensor body 13 when viewed from the extending direction of the central axis AX1.

[0055] The aforementioned "symmetric positions with respect to the central axis AX1 in the first sensor body 13" are positions that satisfy the following two conditions (i) and (ii) when the first sensor body 13 is viewed from the extending direction of the central axis AX1. Condition (i) is that a straight line (hereinafter, "virtual line") connecting the centers of gravity of the two first pressure measurement portions 12 constituting the pair intersects the central axis AX1. Condition (ii) is that the intersection point of the virtual line of condition (i) and the central axis AX1 is the midpoint of the virtual line.

[0056] Also, these two first pressure measurement units 12 are arranged at symmetric positions with respect to the central axis AX1 in the first sensor body 13 even when viewed from a direction orthogonal to the extending direction of the central axis AX1. The "symmetric positions with respect to the central axis AX1 in the first sensor body 13" means positions that satisfy the aforementioned condition (ii) and the following condition (iii) when the first sensor body 13 is viewed from a direction orthogonal to the extending direction of the central axis AX1. Condition (iii) is that the virtual line of condition (i) is orthogonal to the central axis AX1.

[0057] Furthermore, these two first pressure measurement units 12 are arranged at positions separated by a predetermined distance from the end face of the first sensor body 13 facing the molten metal 50. The "predetermined distance" varies depending on the sizes of the first sensor body 13 and the mold 40, the measurement accuracy of the first pressure measurement unit 12, etc., but it suffices that a distance that is not greatly affected by the temperature change of the molten metal 50 is ensured. The same applies to the second pressure measurement unit 22 for such an arrangement.

[0058] The number and arrangement mode of the first pressure measurement units 12 are not limited to the examples of this embodiment. For example, only one first pressure measurement unit 12 may be provided in the first sensor body 13, or a plurality of pairs of first pressure measurement units 12 may be provided. Furthermore, the two first pressure measurement units 12 constituting a pair may not be arranged at symmetric positions with respect to the central axis AX1 in the first sensor body 13. The same applies to the second pressure measurement unit 22.

[0059] Furthermore, in the present embodiment, seven first temperature measurement units 11 are provided in the first sensor 10, and the first sensor 10 measures the temperature at seven locations shown by reference numeral 302 in FIG. 3. Specifically, the first sensor 10 measures the temperature at three locations on the central axis AX1. These three locations are provided in the order of measurement locations Pcp, Pmp1, and Pmp2 from the position on the molten metal 50 side. The measurement location Pcp is provided in the molten metal 50 and near the end face of the first sensor body 13 that contacts the molten metal 50. Hereinafter, the temperature of the molten metal 50 measured at the measurement location Pcp is defined as temperature Tcp. The measurement location Pmp1 is provided near the boundary between the cylindrical portion (hereinafter, "first cylindrical portion") including the end face that contacts the molten metal 50 and the cylindrical portion adjacent to the first cylindrical portion (hereinafter, "second cylindrical portion"). Hereinafter, the temperature of the first sensor body 13 measured at the measurement location Pmp1 is defined as temperature Tmp1.

[0060] Here, since the first sensor body 13 is formed of the same carbon steel as the mold 40, in the present embodiment, the temperature of the first sensor body 13 is regarded as the temperature of the upper punch 42 (that is, the mold 40). Therefore, the temperature Tmp1 is the temperature of the upper punch 42. The measurement location Pmp2 is provided closer to the central portion side of the first sensor body 13 in the direction of the central axis AX1 than the measurement location Pmp1. Hereinafter, the temperature of the upper punch 42 measured at the measurement location Pmp2 is defined as temperature Tmp2.

[0061] In addition, the first sensor 10 measures the temperature at four locations near the boundary between the first cylindrical portion and the second cylindrical portion. All of these four locations are provided on the side surface of the second cylindrical portion. And when the first sensor body 13 is viewed from the extending direction of the central axis AX1, the angle formed by a straight line that virtually connects one of two adjacent locations and the central axis AX1 and a straight line that virtually connects the other and the central axis AX1 is 90°.

[0062] The above four locations are provided in the clockwise order of measurement locations Pmp3, Pmp6, Pmp4, and Pmp5 when viewed from the extending direction of the central axis AX1 of the first sensor body 13. Hereinafter, the temperatures of the upper punch 42 measured at the measurement locations Pmp3, Pmp4, Pmp5, and Pmp6 are defined as temperatures Tmp3, Tmp4, Tmp5, and Tmp6, respectively.

[0063] (Specific Structure of the Second Sensor) The second sensor 20 has a second sensor body 23 as shown in FIG. 4. The second sensor body 23 is a solid bar-shaped member, and both ends are cylindrical. On the other hand, the body portion sandwiched between both ends is an elongated flat plate shape, and the shape of the end face in the thickness direction of the body portion is a curved surface shape corresponding to the outer shape of both ends. The central axes of both ends and the body portion coincide, and this coincident central axis becomes the central axis AX2 of the second sensor body 23. Among the end faces of both ends of the second sensor body 23, the end face that contacts the molten metal 50 has a curved surface shape corresponding to the shape of the inner side surface of the die 41. In the present embodiment, the second sensor body 23 is also formed of the same carbon steel as the mold 40, similar to the first sensor body 13.

[0064] Also, in the present embodiment, as shown by reference numeral 401 in FIG. 4, a pair of second pressure measurement portions 22 are provided on the second sensor body 23. Specifically, the two second pressure measurement portions 22 constituting this pair are arranged at symmetric positions with respect to the central axis AX2 in the second sensor body 23 when viewed from either the extending direction of the central axis AX2 of the second sensor body 23 or the direction orthogonal to the extending direction. The meaning of "symmetric positions with respect to the central axis AX2 in the second sensor body 23" is the same as that of "symmetric positions with respect to the central axis AX1 in the first sensor body 13" described above.

[0065] Furthermore, in the present embodiment, seven second temperature measurement units 21 are provided in the second sensor 20, and the second sensor 20 measures the temperature at seven locations shown by reference numeral 402 in FIG. 4. Specifically, the second sensor 20 measures the temperature at three locations on the central axis AX2. These three locations are provided in the order of measurement locations Pcd, Pmd1, and Pmd2 from the position on the molten metal 50 side. The measurement location Pcd is provided in the molten metal 50 and near the end face of the second sensor body 23 that contacts the molten metal 50. Hereinafter, the temperature of the molten metal 50 measured at the measurement location Pcd is defined as temperature Tcd. The measurement location Pmd1 is provided near the boundary between the end portion including the end face that contacts the molten metal 50 (hereinafter, "molten metal side end portion") and the main body portion. Hereinafter, the temperature of the second sensor body 23 measured at the measurement location Pmd1 is defined as temperature Tmd1.

[0066] Here, since the second sensor body 23 is also formed of the same carbon steel as the mold 40, in the present embodiment, the temperature of the second sensor body 23 is regarded as that of the die 41 (i.e., the mold 40). Therefore, the temperature Tmd1 is the temperature of the die 41. The measurement location Pmd2 is provided closer to the central portion side in the direction of the central axis AX2 in the second sensor body 23 than the measurement location Pmd1. Hereinafter, the temperature of the die 41 measured at the measurement location Pmd2 is defined as temperature Tmp2.

[0067] In addition, the second sensor 20 measures the temperature at four locations near the boundary between the molten metal side end portion and the main body portion. Two of these four locations are provided on one plane of the main body portion, and the remaining two locations are provided on the other plane. Moreover, when the second sensor body 23 is viewed from the extending direction of the central axis AX2, the angle formed by a straight line that virtually connects one of two adjacent locations and the central axis AX2 and a straight line that virtually connects the other and the central axis AX2 is 90°.

[0068] The above four locations are provided in the clockwise order of measurement locations Pmd3, Pmd5, Pmd4, and Pmd6 when viewed from the extending direction of the central axis AX2 at the molten metal side end of the second sensor body 23. Hereinafter, the temperatures of the die 41 measured at the measurement locations Pmd3, Pmd4, Pmd5, and Pmd6 are defined as temperatures Tmd3, Tmd4, Tmd5, and Tmd6, respectively.

[0069] <Temperature Measurement and Pressure Measurement> (Temperature Measurement) In the present embodiment, as shown by reference numerals 501 and 502 in FIG. 5, the simulation device 100 measures temperatures at a total of 21 locations, 14 locations on the mold 40 side and 7 locations on the molten metal 50 side. The arrangement of the total 21 measurement locations is such that three measurement locations Pcn, Pmn-1, and Pmn-2 (n: natural number from 1 to 7) shown by reference numeral 503 in FIG. 5 are provided linearly in both plan view and front view. And a total of 7 groups of measurement locations composed of these three measurement locations are provided.

[0070] Hereinafter, the three measurement locations Pcn, Pmn-1, and Pmn-2 are abbreviated as "measurement locations Pcn, ~Pmn-2". Also, the temperature measured at the measurement location Pcn is defined as temperature Tcn, the temperature measured at the measurement location Pmn-1 is defined as temperature Tmn-1, and the temperature measured at the measurement location Pmn-2 is defined as temperature Tmn-2.

[0071] In the present embodiment, as shown by reference numeral 503 in FIG. 5, the measurement location Pcn is provided at a position 2 mm from the first mold surface toward the molten metal 50 side. The measurement location Pmn-1 is provided at a position 2 mm from the first mold surface toward the mold 40 side. The measurement location Pmn-2 is provided at a position 6 mm from the first mold surface toward the mold 40 side. Here, the "first mold surface" refers to any one of the first contact surface Sp1, the third contact surface Sd, or the fifth contact surface Sp2.

[0072] The measurement points Pc1 to Pm1-2 are provided on the central axis AX in both the plan view and the front view. As shown by reference numeral 502 in FIG. 5, the measurement point Pc1 is provided near the first interface Si1 inside the molten metal 50, and the measurement points Pm1-1 and Pm1-2 are provided inside the upper punch 42.

[0073] The measurement point Pc1 is the measurement point Pcp at which the first sensor 10 measures temperature, and the temperature Tc1 measured at the measurement point Pc1 becomes the temperature Tcp. The measurement point Pm1-1 is the measurement point Pmp1 at which the first sensor 10 measures temperature, and the temperature Tm1-1 measured at the measurement point Pm1-1 becomes the temperature Tmp1. The measurement point Pm1-2 is the measurement point Pmp2 at which the first sensor 10 measures temperature, and the temperature Tm1-2 measured at the measurement point Pm1-2 becomes the temperature Tmp2.

[0074] The measurement points Pc2 to Pm2-2 are provided on a straight line (not shown) parallel to the central axis AX in both the plan view and the front view, as shown by reference numerals 501 and 502 in FIG. 5. Further, as shown by reference numeral 502 in FIG. 5, the vertical positions of the measurement points Pc2 to Pm2-2 in the front view are the same as those of the measurement points Pc1 to Pm1-2, and they are provided closer to the die 41 side than the measurement points Pc1 to Pm1-2.

[0075] The measurement points Pc3 to Pm3-2 are provided on a straight line (not shown) that is parallel to the central axis AX in the plan view and orthogonal to the central axis AX in the front view, as shown by reference numerals 501 and 502 in FIG. 5. The measurement point Pc3 is provided near the second interface Si2 inside the molten metal 50, and the measurement points Pm1-1 and Pm1-2 are provided inside the upper punch 42. Also, the measurement point Pc3 is provided near the measurement point Pc2. The measurement points Pm1-2, Pm2-2, Pc3 to Pm3-2 are provided on the same straight line, as shown by reference numeral 502 in FIG. 5.

[0076] The measurement points Pc4 to Pm4-2 and the measurement points Pc5 to Pm5-2 are provided on a straight line that is parallel to the central axis AX in a plan view and orthogonal to the central axis AX in a front view, similar to the measurement points Pc3 to Pm3-2. As shown by reference numeral 502 in FIG. 5, the horizontal positions in the front view of the measurement points Pc4 to Pm4-2 are the same as those of the measurement points Pc3 to Pm3-2. The measurement points Pc4 to Pm4-2 are provided below the measurement points Pc3 to Pm3-2 in the front view, and the measurement points Pc5 to Pm5-2 are provided below the measurement points Pc4 to Pm4-2 in the front view.

[0077] The measurement points Pc3 to Pm3-2 and the measurement points Pc5 to Pm5-2 are provided at the same position in a plan view as shown by reference numeral 501 in FIG. 5. On the other hand, the measurement points Pc4 to Pm4-2 are provided at a position where the angle formed by the straight line including the measurement points Pc4 to Pm4-2 and the straight line including the measurement points Pc3 to Pm3-2 is 45° in a plan view.

[0078] The measurement point Pc4 is the measurement point Pcd at which the second sensor 20 measures the temperature, and the temperature Tc4 measured at the measurement point Pc4 becomes the temperature Tcd. The measurement point Pm4-1 is the measurement point Pmd1 at which the second sensor 20 measures the temperature, and the temperature Tm4-1 measured at the measurement point Pm4-1 becomes the temperature Tmd1. The measurement point Pm4-2 is the measurement point Pmd2 at which the second sensor 20 measures the temperature, and the temperature Tm4-2 measured at the measurement point Pm4-2 becomes the temperature Tmd2.

[0079] The measurement points Pc6 to Pm6-2 are provided on a straight line parallel to the central axis AX in both a plan view and a front view, similar to the measurement points Pc2 to Pm2-2, as shown by reference numerals 501 and 502 in FIG. 5. The measurement points Pc2 to Pm2-2 and the measurement points Pc6 to Pm6-2 are provided at the same position in a plan view as shown by reference numeral 501 in FIG. 5. As shown by reference numeral 502 in FIG. 5, the measurement point Pc6 is provided near the third interface Si3 inside the molten metal 50, and the measurement points Pm6-1 and Pm6-2 are provided inside the lower punch 43.

[0080] The measurement points Pc7 to Pm7-2 are provided on the central axis AX in both the plan view and the front view, as shown by reference numerals 501 and 502 in Fig. 5, in the same manner as the measurement points Pc1 to Pm1-2. The measurement points Pc1 to Pm1-2 and the measurement points Pc7 to Pm7-2 are provided at the same positions in the plan view as shown by reference numeral 501 in Fig. 5. Also, as shown by reference numeral 502 in Fig. 5, the vertical positions in the front view of the measurement points Pc7 to Pm7-2 are the same as those of the measurement points Pc6 to Pm6-2.

[0081] In each of the die 41, the upper punch 42, and the lower punch 43, through holes and non-through holes (both not shown) for measuring temperatures other than the temperatures Tc1 to Tm1-2 and Tc4 to Tm4-2 among the temperatures measured at a total of 21 measurement points are formed. Then, thermocouples (not shown) inserted into these holes measure temperatures other than the temperatures Tc1 to Tm1-2 and Tc4 to Tm4-2. The measurement results of these thermocouples, that is, the temperature data of the temperatures other than the temperatures Tc1 to Tm1-2 and Tc4 to Tm4-4 among the temperatures measured at a total of 21 measurement points, are transmitted to the temperature acquisition unit 31 by wireless communication or wired communication.

[0082] Hereinafter, the temperature values of the temperatures Tc1 to Tc7, Tm1-1 to Tm7-1, and Tm1-2 to Tm7-2 acquired by the temperature acquisition unit 31 are referred to as "temperature data Tc1' to Tc7' (second temperature data), Tm1-1' to Tm7-1', and Tm1-2' to Tm7-2' (first temperature data)".

[0083] Here, the temperature data Tc1´ is the same as the temperature data Tcp-1, the temperature data Tm1-1´ is the same as the temperature data Tmp1-1, and the temperature data Tm1-2´ is the same as the temperature data Tmp2-1. In the following description, the names will be unified as "temperature data Tc1´, Tm1-1´, and Tm1-2´". Also, the temperature data Tc4´ is the same as the temperature data Tcd-1, the temperature data Tm4-1´ is the same as the temperature data Tmd1-1, and the temperature data Tm4-2´ is the same as the temperature data Tmd2-1. In the following description, the names will be unified as "temperature data Tc4´, Tm4-1´, and Tm4-2´".

[0084] (Pressure measurement) The first and second sensors 10 and 20 convert the contact pressures Fd and Fp from the strain values ε (unit: μST) measured by strain gauges as the first and second pressure measurement units 12 and 22. As shown in FIG. 6, the strain gauge also changes in gauge factor (a coefficient representing the sensitivity of the strain gauge) according to the temperature change. Therefore, in this embodiment, in order to accurately convert the contact pressures Fd and Fp from the strain value ε measured by the strain gauge, the first and second sensors 10 and 20 are compressed in advance at a plurality of temperatures.

[0085] Specifically, each of the first and second sensors 10 and 20 is compressed at room temperature (293K in this embodiment) and at a plurality of temperatures higher than room temperature (with a constant increase in temperature), and the compression characteristics at each temperature are specified. Then, based on the compression characteristics at the plurality of temperatures specified in this preprocessing, the correlation between the strain generated in each of the first and second sensors 10 and 20 and the compression stress σ (unit: MPa) acting on these sensors is calibrated. The first and second sensors 10 and 20 use the compression stress σ converted from the strain value ε after the above calibration as the contact pressures Fd and Fp.

[0086] (Determination of the first heat transfer coefficient data using a three-dimensional unsteady heat transfer model) The generation unit 33 determines the first heat transfer coefficient data hd-1 that constitutes the die-side basic data set by representing the heat transfer in the vicinity of each of the first to third interfaces Si1 to Si3 using a three-dimensional unsteady heat transfer model. The generation unit 33 determines the first heat transfer coefficient data hpu-1 that constitutes the upper punch-side basic data set. The generation unit 33 determines the first heat transfer coefficient data hpl-1 that constitutes the lower punch-side basic data set.

[0087] Specifically, the generation unit 33 determines the first heat transfer coefficient data h3-1, h4-1, and h5-1 as the first heat transfer coefficient data hd-1. The generation unit 33 determines the first heat transfer coefficient data h1-1 and h2-1 as the first heat transfer coefficient data hpu-1. The generation unit 33 determines the first heat transfer coefficient data h6-1 and h7-1 as the first heat transfer coefficient data hpl-1.

[0088] The first heat transfer coefficient data h1-1 is the first heat transfer coefficient data in the interface region between the measurement location Pc1 and Pm1-1. The first heat transfer coefficient data h2-1 is the first heat transfer coefficient data in the interface region between the measurement location Pc2 and Pm2-1. The first heat transfer coefficient data h3-1 is the first heat transfer coefficient data in the interface region between the measurement location Pc3 and Pm3-1. The first heat transfer coefficient data h4-1 is the first heat transfer coefficient data in the interface region between the measurement location Pc4 and Pm4-1. The first heat transfer coefficient data h5-1 is the first heat transfer coefficient data in the interface region between the measurement location Pc5 and Pm5-1. The first heat transfer coefficient data h6-1 is the first heat transfer coefficient data in the interface region between the measurement location Pc6 and Pm6-1. The first heat transfer coefficient data h7-1 is the first heat transfer coefficient data in the interface region between the measurement location Pc7 and Pm7-1.

[0089] (Die model) The generation unit 33 generates a three-dimensional model of the mold 40 (hereinafter, "mold model") as shown in FIG. 7, and determines the first heat transfer coefficient data h1-1 to h7-1 using this mold model. The mold model is an eighth model of the entire mold 40 when it is assumed that the mold 40 is equally divided into eight parts in the direction of the central axis AX (see FIG. 2). The mold model includes an eighth model of the entire molten metal 50 (hereinafter, "molten metal model") and is assumed to be placed under air.

[0090] The mold model may be generated by the generation unit 33 or may be stored in the storage unit 3 in advance. When the mold model is stored in the storage unit 3, the generation unit 33 reads the mold model from the storage unit 3 when determining each first heat transfer coefficient data. Alternatively, the generation unit 33 may acquire the data of the mold model from an external server or the like.

[0091] The mold model is composed of a plurality of hexahedral elements as shown by reference numeral 701 in FIG. 7. In addition, element numbers i are assigned to the mold model in the radial direction from the central axis AX, element numbers j are assigned in the circumferential direction of the mold 40, and element numbers k are assigned in the direction of the central axis AX. For the entire mold model, element number i = 1 to 15, element number j = 1 to 6, and element number k = 1 to 35, and the total number of elements constituting the mold model (including the molten metal model) is 3240.

[0092] The measurement points Pcn to Pmn-2 (n: natural number from 1 to 7) are displayed at the respective positions shown by reference numeral 702 in FIG. 7 when using the mold model with a total of 3240 elements. Reference numeral 702 in FIG. 7 is a side view of the mold model, that is, a view showing the outer side surface of each element with j = 1 in the mold model.

[0093] In reference numeral 702 of FIG. 7, measurement points Pc4 to Pm4-2 are shown at the position of j = 1 for convenience of explanation. Actually, the measurement points Pc4 to Pm4-2 are located at j = 6. As shown in reference numeral 702 of FIG. 7, the mold model shall handle the measurement points Pc1 to Pm1-2 and Pc7 to Pm7-2 as positions of i = 1 for convenience of calculation. Actually, the measurement points Pc1 to Pm1-2 and Pc7 to Pm7-2 are provided on the central axis AX.

[0094] (Details of the determination process of the first heat transfer coefficient data) Hereinafter, with reference to the flowchart shown in FIG. 8, the determination process of the first heat transfer coefficient data h1-1 to h7-1 using the mold model will be described. The generation unit 33 determines the first heat transfer coefficient data h1-1 from among the first heat transfer coefficient data h1-1 to h7-1 (S101). First, when determining the first heat transfer coefficient data h1-1, the generation unit 33 specifies only the temperature data of a plurality of elements (hereinafter, "target elements") including the molten metal side unit contact surface among the elements constituting the molten metal model in the mold model. The molten metal side unit contact surface is the surface of the elements constituting a part of each of the second, fourth, and sixth contact surfaces Sc1, Sc2, and Sc3.

[0095] Specifically, the generation unit 33 acquires the temperature data Tc1' to Tc7' at a certain time step (time point) from the temperature acquisition unit 31. The temperature data Tc1' to Tc7' are the temperature values of the target elements provided with the measurement points Pc1 to Pc7 among the plurality of target elements. Further, the generation unit 33 calculates the temperature data at a certain time step of the target elements other than the target elements provided with the measurement points Pc1 to Pc7 among the plurality of target elements (hereinafter, "unmeasured elements") using the following formula (1) (S111).

[0096]

Equation

[0097] Tcp: Temperature data [K] at a certain time step of the unmeasured element Tci: Among the plurality of target elements, the target element (natural number i = 1 to 7) provided with measurement points Pc1 to Pc7 di: Distance [mm] between each of the measurement points Pc1 to Pc7 and the centroid of the non-measured element m: Parameter representing weight (can be arbitrarily set. Preferably 0 ≦ m ≦ 1) Next, the generation unit 33 sets the first heat transfer coefficient data h1-1 to h7-1 at a certain time step. For example, when the input unit 1 receives a setting operation for the first heat transfer coefficient data h1-1 to h7-1, the value received by the input unit 1 may be used as the setting value for the first heat transfer coefficient data h1-1 to h7-1. Also, for example, the generation unit 33 may set the first heat transfer coefficient data h1-1 to h7-1 by reading the setting value previously stored in the storage unit.

[0098] Also, the generation unit calculates all the unit first heat transfer coefficient data other than the first heat transfer coefficient data h1-1 to h7-1 using the following formula (2) (S112).

[0099]

Equation

[0100] hip: Unit first heat transfer coefficient data [W / (m 2 ·K)] hi: First heat transfer coefficient data h1-1 to h7-1 [W / (m 2 ·K)] The unit first heat transfer coefficient data is the first heat transfer coefficient data in the unit interface area, and includes the first heat transfer coefficient data h2-1 to h7-1 in S112. The unit interface area is composed of a surface (hereinafter, "die-side unit contact surface") that constitutes a part of each of the first, third, and fifth contact surfaces Sp1, Sd, and Sp2 included in one element on the die 40 side, and a molten metal-side unit contact surface facing the die-side unit contact surface. Note that the first heat transfer coefficient data between the die model and the air is uniformly set to 50 W / (m 2 ·K).

[0101] Next, the generation unit 33 estimates the temperature data T for all elements (hereinafter, "die-side elements") that constitute the model part other than the molten metal model in the die model, using the following formulas (3) to (5). i、j、k ´ (S113). The estimated temperature data T i、j、k ´ is an estimated value of the temperature data (first temperature data) of the die-side elements at the time when a certain period of time has elapsed from a certain time step (hereinafter, "next time step").

[0102]

Equation

[0103] T i、j、k ´: Estimated temperature data of die-side elements [K] T i、j、k : Temperature data of die-side elements and target elements at a certain time step [K] i: Element number in the radial direction from the central axis AX j: Element number in the circumferential direction of the die 40 k: Element number in the direction of the central axis AX C: Δt / Cm [(sec·m 3 ) / J] Δt: Certain time (required time between time steps) [sec] Cm: Heat capacity of the die 40 [J / m 3 R: Thermal resistance in the unit interface area [(m 2 ·K) / W] Δrj: Length in the radial direction from the central axis AX [m] Δθ: Angle in the circumferential direction of the die 40 [rad] Δz: Length in the direction of the central axis AX [m]

[0104]

Equation

[0105] h: First heat transfer coefficient data h1-1 to h7-1 [W / (m 2 ·K)] ​λc: Thermal conductivity of the molten metal 50 [W / (m·K)] λm: Thermal conductivity of the mold 40 [W / (m·K)]

[0106]

Number

[0107] When calculating the estimated temperature data T i、j、k ´, when the unit interface area is formed between the mold-side element and the target element, the above-described formulas (3) and (4) are used. Also, when the unit interface area is formed between the mold-side elements, the generation unit 33 uses the above-described formulas (3) and (5).

[0108] Next, the generation unit 33 calculates the difference between the estimated temperature data Te1-1´ at the measurement location Pm1-1 and the temperature data Tm1-1´ at the measurement location Pm1-1 in the next time step among the calculated plurality of estimated temperature data T i、j、k ´. Similarly, the generation unit 33 calculates all 14 types of differences up to the difference between the estimated temperature data Te7-2´ at the measurement location Pm7-2 and the temperature data Tm7-2´ at the measurement location Pm7-2 in the next time step. Then, the generation unit 33 calculates the evaluation function e by summing the absolute values of these 14 types of differences.

[0109] Next, the generation unit 33 changes the value of the first heat transfer coefficient data h1-1 and calculates the evaluation function e again. The generation unit 33 repeats the calculation of this evaluation function e a plurality of times to specify the value of the first heat transfer coefficient data h1-1 at which the value of the evaluation function e becomes minimum (S114).

[0110] Specifically, as shown in FIG. 9, (A) the generation unit 33 calculates the evaluation function e1 using the first heat transfer coefficient data h1-1 (hereinafter, “first heat transfer coefficient data h1-11”) set at a certain time step. Next, (B) the generation unit 33 calculates the evaluation function e2 using the first heat transfer coefficient data h1-1 (hereinafter, “first heat transfer coefficient data h1-12”) changed by the change amount Δh from the first heat transfer coefficient data h1-11.

[0111] Regarding the change amount Δh from the first heat transfer coefficient data h1-11 in the first heat transfer coefficient data h1-12, when the input unit 1 receives a setting operation for the change amount Δh, the generation unit 33 may use the value received by the input unit 1 as the set value of the change amount Δh. Also, for example, the generation unit 33 may set the value of the change amount Δh by reading out the set value previously stored in the storage unit.

[0112] Next, (C) the generation unit 33 compares the magnitudes of the values of the evaluation function e1 and the evaluation function e2. When the value of the evaluation function e1 is smaller, a value M×Δh obtained by multiplying the aforementioned change amount Δh by a coefficient M (-1 < M < 0) is added to the first heat transfer coefficient data h1-11 to obtain new first heat transfer coefficient data h1-12'. Then, an evaluation function e2' is calculated using this first heat transfer coefficient data h1-12', and the magnitudes of the values of the evaluation function e1 and the evaluation function e2' are compared. On the other hand, if the value of the evaluation function e2 is smaller, the aforementioned change amount Δh is added to the first heat transfer coefficient data h1-12 to obtain first heat transfer coefficient data h1-13. Then, an evaluation function e3 is calculated using this first heat transfer coefficient data h1-13, and the magnitudes of the values of the evaluation function e2 and the evaluation function e3 are compared.

[0113] Hereinafter, the generation unit 33 repeats the above-mentioned processes (B) and (C), and ends this repetition process when the value of M×Δh becomes equal to or less than a predetermined threshold value (which can be arbitrarily set).

[0114] Also, for example, the generation unit 33 may calculate a plurality of evaluation functions e in advance, and extract the one with the smallest value from among the calculated plurality of evaluation functions e. Specifically, as shown by reference numeral 1001 in FIG. 10, (D) the generation unit 33 determines the number of evaluation functions e11 to be the subject of one extraction process, and repeats each of the processes S112 to S114 until the determined number of evaluation functions e11 is obtained. Each time the generation unit 33 repeats each of the processes S112 to S114, the first heat transfer coefficient data h1-1 is increased by the change amount Δh1.

[0115] Regarding the determination of the number of evaluation functions e11 to be subjected to one extraction process, the generation unit 33 may use the value received by the input unit 1 as the number of evaluation functions e11 when the input unit 1 receives a setting operation for the number. Also, for example, the generation unit 33 may set the number of evaluation functions e11 by reading out the numerical value of the number previously stored in the storage unit.

[0116] Next, as shown by reference numeral 1002 in FIG. 10, (E) the generation unit 33 extracts the evaluation function emin1 with the smallest value from among the plurality of evaluation functions e11 obtained in the process of (D), and then calculates the same number of evaluation functions e22 to be subjected to the second extraction process as the evaluation functions e11. The generation unit 33 sequentially increases and decreases the first heat transfer coefficient data h1-1 corresponding to the evaluation function emin1 by the change amount Δh2 with the value of the evaluation function emin1 as the median value, thereby obtaining a predetermined number of evaluation functions e22. Here, the absolute value of the change amount Δh2 is smaller than the absolute value of the change amount Δh1.

[0117] Next, (F) the generation unit 33 extracts the evaluation function emin2 with the smallest value from among the plurality of evaluation functions e22 obtained in the process of (E), and then calculates the same number of evaluation functions e33 to be subjected to the third extraction process as the evaluation functions e11 and e22. The generation unit 33 sequentially increases and decreases the first heat transfer coefficient data h1-1 corresponding to the evaluation function emin2 by the change amount Δh3 with the value of the evaluation function emin2 as the median value, thereby obtaining a predetermined number of evaluation functions e33. Here, the absolute value of the change amount Δh3 is smaller than the absolute value of the change amount Δh2.

[0118] Hereinafter, the generation unit 33 repeats each process of (F) described above and ends this repetitive process when the value of Δh3 becomes equal to or less than a predetermined threshold value (which can be arbitrarily set).

[0119] The generation unit 33 identifies the first heat transfer coefficient data h1-1 by repeating the processes of S112 to S114, and temporarily stores the identified first heat transfer coefficient data h1-1 (hereinafter referred to as "first heat transfer coefficient data h1-1'") in the storage unit 3. The generation unit 33 may store these data in a memory (not shown) within the generation unit 33.

[0120] Similarly, the generation unit 33 identifies the first heat transfer coefficient data h2-1 according to the processing procedure of S111 to S115. At this time, for the calculation of the estimated temperature data T i、j、k ' of the "die side element" in the process of S112, the previously identified first heat transfer coefficient data h1-1' and the first heat transfer coefficient data h3-1 to h7-1 are used. The generation unit 33 temporarily stores the identified first heat transfer coefficient data h2-1 (hereinafter referred to as "first heat transfer coefficient data h2-1'") in the storage unit 3.

[0121] Similarly, the generation unit 33 identifies the first heat transfer coefficient data h3-1 according to the processing procedure of S111 to S115. At this time, for the calculation of the estimated temperature data T i、j、k ' of the "die side element" in the process of S112, the previously identified first heat transfer coefficient data h1-1' and h2-1', and the first heat transfer coefficient data h4-1 to h7-1 are used. The generation unit 33 temporarily stores the identified first heat transfer coefficient data h3-1 (hereinafter referred to as "first heat transfer coefficient data h3-1'") in the storage unit 3.

[0122] In this way, the generation unit 33 sequentially identifies the first heat transfer coefficient data up to h7-1 by using the first heat transfer coefficient data identified in the previous process as needed for the identification of the next first heat transfer coefficient data. In the following description, the first heat transfer coefficient data h7-1 identified by the generation unit 33 is referred to as "first heat transfer coefficient data h7-1'". The generation unit 33 temporarily stores the seven identified first heat transfer coefficient data in the storage unit 3.

[0123] Next, the generation unit 33 identifies the first heat transfer coefficient data h1-1 again according to the processing procedure of S111 to S115. At this time, for the calculation of the estimated temperature data T i、j、kFor the calculation of ´, the first heat transfer coefficient data h2-1´ to h7-1´ specified previously are used. The generation unit 33 temporarily stores the specified first heat transfer coefficient data h1-1 (hereinafter, “the first heat transfer coefficient data h1-1´´”) in the storage unit 3. Similarly, the generation unit 33 re-specifies up to the first heat transfer coefficient data h7-1 in the processing procedures of S111 to S115.

[0124] Next, the generation unit 33 determines whether the first heat transfer coefficient data h1-1 to h7-1 have converged (S108). Specifically, the generation unit 33 compares the first heat transfer coefficient data h1-1´ and h1-1´´ to specify the change amount of the first heat transfer coefficient data h1-1. Then, if the change amount of the specified first heat transfer coefficient data h1-1 is equal to or less than a threshold value (which can be arbitrarily set), the generation unit 33 determines that the first heat transfer coefficient data h1-1 has converged. The generation unit 33 determines whether each of the first heat transfer coefficient data h2-1 to h7-1 has converged in the same manner.

[0125] Next, the generation unit 33 acquires the contact pressure data Fp-1 at a certain time step from the pressure acquisition unit 32 and uses it as the configuration data of the upper punch side basic data set. Hereinafter, the upper punch side basic data set including the first heat transfer coefficient data h1-1 as the configuration data is referred to as the “first upper punch side basic data set”.

[0126] Similarly, the generation unit 33 selects the contact pressure data Fp-1 and the first heat transfer coefficient data h2-1 as the constituent data of the "second upper punch side basic data set". The generation unit 33 selects the contact pressure data Fd-1 and the first heat transfer coefficient data h3-1 as the constituent data of the "first die side basic data set". The generation unit 33 selects the contact pressure data Fd-1 and the first heat transfer coefficient data h4-1 as the constituent data of the "second die side basic data set". The generation unit 33 selects the contact pressure data Fd-1 and the first heat transfer coefficient data h5-1 as the constituent data of the "third die side basic data set". The generation unit 33 selects the contact pressure data Fp-1 and the first heat transfer coefficient data h6-1 as the constituent data of the "first lower punch side basic data set". The generation unit 33 selects the contact pressure data Fp-1 and the first heat transfer coefficient data h7-1 as the constituent data of the "second lower punch side basic data set".

[0127] If the answer is No in S108, the generation unit 33 performs each process of S101 to S107 again. On the other hand, if the answer is Yes in S108, the generation unit 33 updates the time step once (S109). If the updated time step is not the final time step (No in S110), the generation unit 33 performs each process after S101 again to determine the first heat transfer coefficient data h1-1 to h7-1 at the updated time step. If the updated time step is the final time step (Yes in S110), the generation unit 33 ends the determination process of the first heat transfer coefficient data h1-1 to h7-1.

[0128] <Estimation of the correlation between contact pressure data and first heat transfer coefficient data> The first estimation unit 34 estimates the correlation between the contact pressure data Fp-1 and the first heat transfer coefficient data h1-1 and h2-1 (hereinafter, the "first and second upper punch side correlations") using the first and second upper punch side basic data sets generated by the generation unit 33. The first estimation unit 34 estimates the correlation between the contact pressure data Fd-1 and the first heat transfer coefficient data h3-1 to h5-1 (hereinafter, the "first to third die side correlations") using the first to third die side basic data sets. The first estimation unit 34 estimates the correlation between the contact pressure data Fp-1 and the first heat transfer coefficient data h7-1 and h6-1 (hereinafter, the "first and second lower punch side correlations") using the first and second lower punch side basic data sets.

[0129] The estimation of the above-mentioned seven correlations by the first estimation unit 34 results in substantially the same result. Therefore, in the following description, the first upper punch side correlation is taken as an example, and the description of the other correlations is omitted. The first estimation unit 34 estimates the first upper punch side correlation by dividing it into three periods as shown in FIG. 11. The estimation process of the first estimation unit 34 described below corresponds to the process performed next when Yes in S110 is used with the flowchart of FIG. 8, and is an example of the first estimation step according to one aspect of the present invention.

[0130] First, the first estimation unit 34 estimates the first upper punch side correlation in the period (the "period I" in FIG. 11) from when the molten metal 50 is filled in the hollow portion of the die 41 where the lower punch 43 is set until before the upper punch 42 starts to pressurize the molten metal 50. In period I, since the upper punch 42 does not pressurize the molten metal 50, the contact pressure data Fp-1 becomes substantially 0. On the other hand, since the inner side surface of the die 41 is in contact with the molten metal 50, heat transfer occurs between the die 41 and the molten metal 50, the value of the temperature data Tc1´ decreases, and the value of the temperature data Tm1-1´ increases. Therefore, the first heat transfer coefficient data h1-1 does not become 0 even in period I.

[0131] From these analysis results, the first estimation unit 34 estimates that the first upper punch side correlation relationship in period I is the relationship of the intercept in the graph of FIG. 11. The relationship of the intercept in the graph of FIG. 11 estimated by the first estimation unit 34 is referred to as the "first estimated correlation relationship (estimated correlation relationship)".

[0132] Next, the first estimation unit 34 estimates the first upper punch side correlation relationship in the period (hereinafter referred to as "period II") from when the upper punch 42 starts to pressurize the molten metal 50 until the surface temperature of the molten metal 50 reaches the solidification temperature of the molding material of the molten metal 50. Specifically, the "surface temperature of the molten metal 50" refers to the temperature of the second contact surface Sc1 in the molten metal 50. During period II, the upper punch 42 continues to pressurize the molten metal 50 with a constant pressure.

[0133] In period II, the first heat transfer coefficient data h1-1 depends on the contact pressure data Fp-1 and does not substantially depend on the aforementioned solidification temperature. And the first heat transfer coefficient data h1-1 and the contact pressure data Fp-1 are in a substantially proportional relationship. Also, when the relationship between the first heat transfer coefficient data h1-1 and the contact pressure data Fp-1 is regarded as a linear function, the slope is a positive value and the absolute value varies according to the type of release agent and the surface roughness of the mold 40.

[0134] From these analysis results, the first estimation unit 34 estimates that the first upper punch side correlation relationship in period II is the relationship of a linear function (the slope is positive) in the graph of FIG. 11. Also, the first estimation unit 34 estimates that the slope of the linear function varies according to the type of release agent. The relationship of the linear function (the slope is positive) in the graph of FIG. 11 estimated by the first estimation unit 34 is referred to as the "second estimated correlation relationship (estimated correlation relationship)".

[0135] Next, the first estimation unit 34 estimates the first upper punch side correlation relationship in the period (hereinafter referred to as "period III") from when the surface temperature of the molten metal 50 becomes lower than the solidification temperature of the molding material of the molten metal 50 until the solidified molded body is taken out of the mold 40. During period III as well, the upper punch 42 continues to pressurize the molten metal 50 with a constant pressure as in period II.

[0136] In Period III, the first heat transfer coefficient data h1-1 depends on both the contact pressure data Fp-1 and the aforementioned solidification temperature. The relationship between the first heat transfer coefficient data h1-1 and the contact pressure data Fp-1 is represented by a linear function h1-1 = a × Fp-1 + b × Ts + c (a, b, c: coefficients; Ts: surface temperature of the molten metal 50).

[0137] From these analysis results, the first estimation unit 34 estimates that the first upper punch side correlation relationship in Period III has a relationship of a linear function (negative slope) in the graph of FIG. 11. The relationship of the linear function (negative slope) in the graph of FIG. 11 estimated by the first estimation unit 34 is referred to as the "third estimated correlation relationship (estimated correlation relationship)".

[0138] The first to third estimated correlation relationships derived by the first estimation unit 34 as estimation results are collectively referred to as the "first upper punch side estimated correlation relationship". Similarly, the first estimation unit 34 derives the "second upper punch side estimated correlation relationship", the "first to third die side estimated correlation relationships", and the "first and second lower punch side estimated correlation relationships" as estimation results.

[0139] The first upper punch side estimated correlation relationship and the second upper punch side estimated correlation relationship constitute the upper punch side estimated correlation relationship. The first die side estimated correlation relationship, the second die side estimated correlation relationship, and the third die side estimated correlation relationship constitute the die side estimated correlation relationship. The first lower punch side estimated correlation relationship and the second lower punch side estimated correlation relationship constitute the lower punch side estimated correlation relationship.

[0140] <Estimation of the Second Heat Transfer Coefficient Data Using the First to Third Estimated Correlation Relationships> The second estimation unit 35 appropriately estimates the second heat transfer coefficient data h1-2 to h7-2 using any one of the first and second upper punch side estimated correlation relationships, the first to third die side estimated correlation relationships, and the first and second lower punch side estimated correlation relationships. The second heat transfer coefficient data h1-2 and h2-2 are estimated values of the first heat transfer coefficient data h1-1 and h2-1 corresponding to the contact pressure data Fp-2 for estimation. The second heat transfer coefficient data h1-2 and the second heat transfer coefficient data h2-2 constitute the second heat transfer coefficient data hpu-2.

[0141] The second heat transfer coefficient data h3-2 to h5-2 are estimated values of the first heat transfer coefficient data h3-1 to h5-1 corresponding to the contact pressure data Fd-2 for estimation. The second heat transfer coefficient data h3-2, the second heat transfer coefficient data h4-2, and the second heat transfer coefficient data h5-2 constitute the second heat transfer coefficient data hd-2. The second heat transfer coefficient data h6-2 and h7-2 are estimated values of the first heat transfer coefficient data h6-1 and h7-2 corresponding to the contact pressure data Fd-2 for estimation. The second heat transfer coefficient data h6-2 and the second heat transfer coefficient data h7-2 constitute the second heat transfer coefficient data hpl-2.

[0142] For example, when estimating the heat transfer coefficient data in the interface region between the measurement locations Pc1 and Pm1-1 from the contact pressure data Fp-2 for estimation in the aforementioned period II, the second estimation unit 35 uses the second estimation correlation of the first upper punch side estimation correlation. Then, the second estimation unit 35 applies the contact pressure data Fp-2 for estimation to this second estimation correlation to estimate the second heat transfer coefficient data h1-2 corresponding to the contact pressure data Fp-2 for estimation in period II.

[0143] Also, for example, when estimating the heat transfer coefficient data in the interface region between the measurement locations Pc4 and Pm4-1 from the contact pressure data Fd-2 for estimation in the aforementioned period III, the second estimation unit 35 uses the third estimation correlation of the second die side estimation correlation. Then, the second estimation unit 35 applies the contact pressure data Fd-2 for estimation to this third estimation correlation to estimate the second heat transfer coefficient data h4-2 corresponding to the contact pressure data Fd-2 for estimation in period III.

[0144] The estimation process of the second estimation unit 35 illustrated above corresponds to the process performed next to the estimation process of the first estimation unit 34 when Yes in S110 is used with the flowchart of FIG. 8, and is an example of a second estimation step according to an aspect of the present invention.

[0145] Note that the second estimation unit 35 does not necessarily use only the seven estimated correlation relationships estimated by the first estimation unit 34 during the estimation process. Taking the first heat transfer coefficient data h1-1 as an example, the second estimation unit 35 may perform the estimation process using a data set including the first heat transfer coefficient data h1-1, the contact pressure data Fp-1, and the first upper punch side estimation correlation relationship estimated by the first estimation unit 34.

[0146] 〔Embodiment 2〕 Embodiment 2 of the present invention will be described below. For the sake of convenience of explanation, members having the same functions as those described in Embodiment 1 are denoted by the same reference numerals, and their descriptions will not be repeated. The same applies to Embodiment 3 described later.

[0147] The simulation device 200 according to Embodiment 2 of the present invention is different from the simulation device 100 according to Embodiment 1 of the present invention in that it estimates the temperature distribution of the mold 40a instead of the mold 40. Further, the simulation device 200 is also different from the simulation device 100 in that it is provided with a third sensor 80 instead of the first and second sensors 10 and 20.

[0148] <Mold and Temperature Measurement> (Mold) The mold 40a is a metal mold used for manufacturing products by gravity casting. The forming material of the mold 40a is carbon steel, the same as that of the mold 40. The mold 40a is composed of only the die 41a as shown by reference numerals 1201 and 1202 in FIG. 12. The die 41a is a hollow cylindrical mold, and the hollow part of the die 41a is cylindrical, which is the same as that of the die 41 of the mold 40. Also, the inner side surface of the die 41a is coated with various release agents as needed, which is the same as that of the die 41.

[0149] On the side wall 41Xa-1 of the metal part 41Xa of the die 41a, as indicated by reference numeral 1202 in FIG. 12, a first hole 41Ya, a second hole 41Yb, a third hole 41Yc, and a fifth hole 41Ye are formed in a direction perpendicular to the central axis AX-1 of the die 41a (i.e., the mold 40a) in a front view. The first to third holes 41Ya to 41Yc are cylindrical holes sized to allow the later-described third sensor body 83 to be inserted and removed, and penetrate from the outer side surface of the side wall 41Xa-1 to the hollow portion of the die 41a. In the present embodiment, the diameters of the first to third holes 41Ya to 41Yc are all 20 mm.

[0150] Among the first to third holes 41Ya to 41Yc, the first hole 41Ya is formed at the uppermost position, and the third hole 41Yc is formed at the lowermost position. The second hole 41Yb is formed between the first hole 41Ya and the third hole 41Yc in the vertical direction. In the vertical direction, the shortest distance between the first hole 41Ya and the second hole 41Yb is substantially the same as the shortest distance between the second hole 41Yb and the third hole 41Yc.

[0151] The fifth hole 41Ye is a cylindrical upper hole with a diameter of 8 mm, which is smaller than the diameters of the first to third holes 41Ya to 41Yc, and an opening is formed on the outer side surface of the side wall 41Xa-1. The fifth hole 41Ye does not penetrate to the hollow portion of the die 41a, and the bottom 41Ye-1 of the fifth hole 41Ye is constituted by a part of the side wall 41Xa-1. The thickness of the bottom 41Ye-1 is 2 mm in the present embodiment. Also, the fifth hole 41Ye is formed in a portion between the second hole 41Yb and the third hole 41Yc on the side wall 41Xa-1 and in the vicinity of the second hole 41Yb in a front view.

[0152] The central axes of the first to third holes 41Ya to 41Yc intersect on the central axis AX-1 in a plan view, as indicated by reference numeral 1201 in FIG. 12. In a plan view, the angle formed by the central axis of the first hole 41Ya and the central axis of the second hole 41Yb is 30°, the angle formed by the central axis of the second hole 41Yb and the central axis of the third hole 41Yc is 30°, and the angle formed by the central axis of the first hole 41Ya and the central axis of the third hole 41Yc is 60°. Also, the central axis of the fifth hole 41Ye coincides with the central axis of the second hole 41Yb in a plan view.

[0153] On the bottom wall 41Xa-2 of the metal part 41Xa, as shown by reference numeral 1202 in FIG. 12, a fourth hole 41Yd, a sixth hole 41Yf, and a through hole 41Yg are formed in a direction parallel to the central axis AX-1 in a front view. The central axis of the fourth hole 41Yd coincides with the central axis AX-1. The fourth hole 41Yd is also a cylindrical hole large enough to insert and remove the third sensor body 83, similar to the first to third holes 41Ya to 41Yc, and penetrates from the outer bottom surface of the bottom wall 41Xa-2 to the hollow portion of the die 41a. The diameter of the fourth hole 41Yd is 20 mm, similar to the first to third holes 41Ya to 41Yc.

[0154] The sixth hole 41Yf is a cylindrical upper hole with a diameter of 8 mm, which is smaller than the diameters of the first to fourth holes 41Ya to 41Yd, and an opening is formed on the outer bottom surface of the bottom wall 41Xa-2. Also, the sixth hole 41Yf does not penetrate to the hollow portion of the die 41a, and the bottom 41Yf-1 of the sixth hole 41Yf is constituted by a part of the bottom wall 41Xa-2. The thickness of the bottom 41Yf-1 is 2 mm, similar to the bottom 41Ye-1 in this embodiment. Also, the sixth hole 41Yf is formed in the vicinity of the sixth hole 41Yf on the side of the bottom wall 41Xa-2 where each hole (the first to third holes 41Ya to 41yc and the fifth hole 41Ye) is formed in a front view. The central axis of the sixth hole 41Yf intersects the central axis of the first hole 41Ya in a plan view, as shown by reference numeral 1201 in FIG. 12.

[0155] The through hole 41Yg is a cylindrical upper hole with a diameter of 1.05 mm as shown by reference numeral 1202 in FIG. 12, and penetrates from the outer bottom surface of the bottom wall 41Xa-2 to the hollow portion of the die 41a. Also, the through hole 41Yg is formed in the vicinity of the side wall 41Xa-1 in a front view, and is formed in the vicinity of the first hole 41Ya in a plan view, as shown by reference numeral 1201 in FIG. 12. Of course, the formation positions, shapes, sizes, etc. of the first to sixth holes 41Ya to 41Yf and the through hole 41Yg are not limited to the examples of this embodiment.

[0156] In this embodiment, gravity casting using the mold 40a is performed as follows. First, the mold 40a is preheated to 573.15 K (300 °C). Next, as shown in Fig. 13, the molten metal 50 melted at 1023.15 K (750 °C) is poured into the hollow portion through the upper opening in the hollow portion, and the molten metal 50 is solidified in that state. Through these steps, a molded body (not shown) before finishing is completed. Further, a release agent is applied to the inner side surface of the die 41a of the mold 40a before gravity casting. Examples of the release agent applied to the mold 40a include BN spray and black body spray.

[0157] (Temperature measurement) The simulation device 200 includes a third sensor 80 as shown in Fig. 1 (details will be described later). In this embodiment, as shown by reference numeral 1202 in Fig. 12, the simulation device 200 measures the temperature with the third sensor 80 at a total of 12 locations, 8 locations on the mold 40a side and 4 locations on the molten metal 50 side. The arrangement of the total 12 measurement locations is such that the three measurement locations Pdn, Pen-1, and Pen-2 (n: natural number from 1 to 4) shown by reference numerals 1201 and 1202 in Fig. 12 are provided linearly in both plan view and front view. And a total of 4 groups of measurement locations consisting of these three measurement locations are provided.

[0158] Hereinafter, the three measurement locations Pdn, Pen-1, and Pen-2 will be abbreviated as "measurement locations Pdn, ~Pen-2". Also, the temperature value of the temperature Tdn measured at the measurement location Pdn is defined as temperature data Tdn' (second temperature data). The temperature value of the temperature Ten-1 measured at the measurement location Pen-1 is defined as temperature data Ten-1' (first temperature data). The temperature value of the temperature Ten-2 measured at the measurement location Pen-2 is defined as temperature data Ten-2' (first temperature data). Further, the three temperatures Tdn, Ten-1, and Ten-2 will be abbreviated as "temperatures Tdn, ~Ten-2", and the three temperature data Tdn', Ten-1', and Ten-2' will be abbreviated as "temperature data Tdn', ~Ten-2'".

[0159] In this embodiment, as shown by reference numeral 1203 in FIG. 12, the measurement point Pdn is provided at a position 2 mm from the inner side surface of the side wall 41Xa-1 or the inner bottom surface of the bottom wall 41Xa-2 (hereinafter collectively referred to as the "second mold surface") toward the molten metal 50 side. The measurement point Pen-1 is provided at a position 2 mm from the second mold surface toward the mold 40a side. The measurement point Pen-2 is provided at a position 6 mm from the second mold surface toward the mold 40a side.

[0160] As shown by reference numerals 1201 and 1202 in FIG. 12, the measurement point Pd1 is provided inside the molten metal 50 and in the vicinity of the measurement point Pe1-1. Pe1-1 and Pe1-2 are provided on the wall surface of the metal portion 41Xa that forms the first hole 41Ya. The measurement point Pd2 is provided inside the molten metal 50 and in the vicinity of the measurement point Pe2-1. Pe2-1 and Pe2-2 are provided on the wall surface of the metal portion 41Xa that forms the second hole 41Yb. The measurement point Pd3 is provided inside the molten metal 50 and in the vicinity of the measurement point Pe3-1. Pe3-1 and Pe3-2 are provided on the wall surface of the metal portion 41Xa that forms the third hole 41Yc.

[0161] The measurement points Pd4 to Pe4-2 are provided on a straight line parallel to the central axis AX-1 in both the plan view and the front view. This straight line parallel to the central axis AX-1 is located on the side wall 41Xa-1 side with respect to the central axis AX-1. Further, the measurement points Pd3 to Pe3-2 and Pd4 are provided on the same straight line (i.e., the central axis of the third hole 41Yc) in the plan view as shown by reference numeral 1201 in FIG. 12. Furthermore, the measurement point Pd4 is provided inside the molten metal 50 and in the vicinity of the measurement point Pe4-1 as shown by reference numeral 1202 in FIG. 12. The measurement points Pe4-1 and Pe4-2 are provided on the wall surface of the metal portion 41Xa that forms the fourth hole 41Yd.

[0162] In this embodiment, as shown in FIG. 13, the third sensor body 83 is accommodated in each of the first to fourth holes 41Ya to 41Yd, whereby the third sensor 80 is set in the mold 40a. Then, in a state where the third sensor 80 is set in the mold 40a, the third temperature measurement unit 81 (temperature measurement unit; details will be described later) of the third sensor 80 measures temperatures Td1 to Td4, Te1-1 to Te4-1, and Te1-2 to Te4-2.

[0163] The temperature acquisition unit 31 of the simulation device 200 shown in FIG. 1 acquires temperature data Td1´ to Td4´, Te1-1´ to Te4-1´, and Te1-2´ to Te4-2´ of the measurement results of the third temperature measurement unit 81 from the third temperature measurement unit 81.

[0164] The simulation device 200 includes a thermocouple (hereinafter, “fourth temperature measurement unit”) (not shown), and as indicated by reference numeral 1202 in FIG. 12, temperature measurement is performed by the fourth temperature measurement unit at a total of three locations inside and in the vicinity of the through hole 41Yg. Regarding the arrangement of the three measurement locations, the three measurement locations Pd5, Pe5-1, and Pe5-2 indicated by reference numerals 1201 and 1202 in FIG. 12 are provided linearly in both plan view and front view.

[0165] The measurement locations Pd5, Pe5-1, and Pe5-2 are all provided on the central axis of the through hole 41Yg. Also, the formation positions of the measurement locations Pd5, Pe5-1, and Pe5-2 coincide with the formation position of the measurement location Pd1 in plan view as indicated by reference numeral 1201 in FIG. 12. The measurement location Pd5 is provided at a position 2 mm from the inner bottom surface of the bottom wall 41Xa-2 toward the molten metal 50 side. The measurement location Pe5-1 is provided at a position 2 mm from the inner bottom surface of the bottom wall 41Xa-2 toward the mold 40a side. The measurement location Pe5-2 is provided at a position 6 mm from the inner bottom surface of the bottom wall 41Xa-2 toward the mold 40a side.

[0166] The fourth temperature measurement unit arranged at the measurement location Pd5 measures the temperature Te5, the fourth temperature measurement unit arranged at the measurement location Pe5-1 measures the temperature Te5-1, and the fourth temperature measurement unit arranged at the measurement location Pe5-2 measures the temperature Te5-2. The temperature acquisition unit 31 of the simulation device 200 acquires the temperature data Te5´, Te5-1´, and Te5-2´ of the measurement results of the fourth temperature measurement unit from the fourth temperature measurement unit. The temperature data Te5´ is the temperature value of the temperature Te5, the temperature data Te5-1´ is the temperature value of the temperature Te5-1, and the temperature data Te5-2´ is the temperature value of the temperature Te5-2.

[0167] For the sake of simplification of the illustration, the die 40a in FIG. 13 is illustrated such that the central axes of the first to sixth holes 41Ya to 41Yf and the through hole 41Yg are all on the cross-section of the metal portion 41Xa of the die 41a. Actually, the second hole 41Yb, the third hole 41Yc, and the fifth hole 41Ye are formed at the locations indicated by the reference numerals 1201 and 1202 in FIG. 12.

[0168] <Specific Structure and Pressure Measurement of the Third Sensor> (Specific Structure of the Third Sensor) The third sensor 80 is a component of the simulation device 200 that measures the temperatures Tdn, Ten-1, and Ten-2 (n: natural numbers from 1 to 4), and the contact pressures Fd1 to Fd4. The contact pressures Fd1 to Fd4 are four pressures, namely the contact pressures Fd1, Fd2, Fd3, and Fd4.

[0169] Specifically, the third sensor 80 set in the first hole 41Ya measures the temperature Td1, ~Te1-2, and the contact pressure Fd1. The third sensor 80 set in the second hole 41Yb measures the temperature Td2, ~Te2-2, and the contact pressure Fd2. The third sensor 80 set in the third hole 41Ya measures the temperature Td3, ~Te3-2, and the contact pressure Fd3. The third sensor 80 set in the fourth hole 41Ya measures the temperature Td4, ~Te4-2, and the contact pressure Fd4.

[0170] As shown by reference numeral 1401 in Fig. 14, the third sensor 80 includes a third temperature measurement unit 81, a third pressure measurement unit 82 (pressure measurement unit), and a third sensor body 83 (single member). The third temperature measurement unit 81 measures temperatures Td1 to Td4, Te1-1 to Te4-1, and Te1-2 to Te4-2. In the present embodiment, the third temperature measurement unit 81 is the same thermocouple as the first and second temperature measurement units 11 and 21. Also, each of the temperatures Te1-1 to Te4-1 and Te1-2 to Te4-2 measured by the third temperature measurement unit 81 is regarded as the temperature of the die 41a (i.e., the mold 40a).

[0171] The third sensor body 83 is a member having a hollow cylindrical shape. In the present embodiment, the third sensor body 83 is formed of the same carbon steel as the mold 40a, and has an outer diameter of 20 mm and an inner diameter of 10 mm. Also, as shown by reference numeral 1402 in Fig. 14, the length of the third sensor body 83 in the direction of the central axis AX3 thereof is substantially the same as the thickness of the side wall 41Xa-1. Of course, the material, shape, and size of the third sensor body 83 are not limited to the example of the present embodiment.

[0172] Three third temperature measurement units 81 are provided on the third sensor body 83, and the third sensor 80 measures temperature at three locations. These three locations are provided in the order of measurement locations Pdn, Pen-1, and Pen-2 (n: natural number from 1 to 4) from the position on the molten metal 50 side. Specifically, as shown by reference numerals 1201 and 1202 in Fig. 12, the measurement locations Pdn-1 and Pen-2 are provided on the wall surface of the metal portion 41Xa that forms each of the first to fourth holes 41Ya to 41Yd. The measurement location Pdn is provided inside the molten metal 50 and in the vicinity of the measurement location Pen-1.

[0173] In addition, the measurement points Pdn to Pen-2 (n is a natural number from 1 to 4) are provided on the same axis. The axes on which the measurement points Pdn to Pen-2 (n is a natural number from 1 to 3) are provided are orthogonal to the central axis AX-1 and are at the same height and parallel to the central axes of the first to third holes 41Ya to 41Yc in a front view. The axis (not shown) on which the measurement points Pd4 to Pe4-2 are provided is parallel to the central axis AX-1 in both a plan view and a front view. Note that in a state where the third sensor body 83 is housed in the first to fourth holes 41Ya to 41Yd, the central axis AX3 of the third sensor body 83 coincides with the central axes of the first to fourth holes 41Ya to 41Yd.

[0174] The third pressure measurement unit 82 measures the contact pressures Fd1 to Fd4. The contact pressures Fd1 to Fd3 are the pressures acting on the fourth interface Si4. Specifically, the contact pressure Fd1 is the pressure acting on the region facing the first hole 41Ya in the fourth interface Si4 as shown in FIG. 13. The contact pressure Fd2 is the pressure acting on the region facing the second hole 41Yb in the fourth interface Si4. The contact pressure Fd3 is the pressure acting on the region facing the third hole 41Yc in the fourth interface Si4.

[0175] The fourth interface Si4 is a concept composed of a surface Sd1 that contacts the molten metal 50 on the side wall 41Xa-1 and a surface Sc4 that contacts the side wall 41Xa-1 in the molten metal 50. Here, the "surface Sd1 that contacts the molten metal 50 on the side wall 41Xa-1" corresponds to the inner side surface of the side wall 41Xa-1. In the following description, this surface is referred to as the "fifth contact surface Sd1". The fifth contact surface Sd1 includes the surfaces 82a-1 of the three membranes 82a (details will be described later) that close the first to third holes 41Ya to 41Yc respectively, and the surface on the side of the third sensor body 83 that contacts the molten metal 50. Also, the "surface Sc4 that contacts the side wall 41Xa-1 in the molten metal 50" corresponds to the side surface of the molten metal 50. In the following description, this surface is referred to as the "sixth contact surface Sc4".

[0176] From the definition of the aforementioned fourth interface Si4, the "contact pressures Fd1 to Fd3" refer to two pressures, namely, the contact pressures Fd1 to Fd3 acting from the fifth contact surface Sd1 toward the sixth contact surface Sc4 and the contact pressures Fd1 to Fd3 acting from the sixth contact surface Sc4 toward the fifth contact surface Sd1.

[0177] The contact pressure Fd4 is the pressure acting on the fifth interface Si5 shown in FIG. 13. Specifically, the contact pressure Fd4 is the pressure acting on the region facing the fourth hole 41Yd in the fifth interface Si5. The fifth interface Si5 is a concept composed of a surface Sd2 that contacts the molten metal 50 on the bottom wall 41Xa-2 and a surface Sc5 that contacts the bottom wall 41Xa-2 in the molten metal 50.

[0178] Here, the "surface Sd2 that contacts the molten metal 50 on the bottom wall 41Xa-2" corresponds to the inner bottom surface of the bottom wall 41Xa-2. In the following description, this surface is referred to as the "seventh contact surface Sd2". The seventh contact surface Sd2 includes the surface 82a-1 and the surface on the side of the third sensor body 83 that contacts the molten metal 50. Also, the "surface Sc5 that contacts the bottom wall 41Xa-2 in the molten metal 50" corresponds to the lower end surface of the molten metal 50. In the following description, this surface is referred to as the "eighth contact surface Sc5".

[0179] From the definition of the aforementioned fifth interface Si5, the "contact pressure Fd4" refers to two pressures, namely, the contact pressure Fd4 acting from the seventh contact surface Sd2 toward the eighth contact surface Sc5 and the contact pressure Fd4 acting from the eighth contact surface Sc5 toward the seventh contact surface Sd2.

[0180] As shown by reference numeral 1401 in FIG. 14, the third pressure measurement unit 82 has a film 82a and a laser displacement meter 82b. The film 82a is attached to the third sensor body 83 and closes the opening on the molten metal 50 side of the third sensor body 83. The film 82a contacts the molten metal 50 poured into the mold 40a in a state where the third sensor body 83 is housed in the first to fourth holes 41Ya to 41Yd.

[0181] Before the third sensor 80 is set in the mold 40a, the film 82a has a flat plate shape indicated by the broken line of reference numeral 1402 in FIG. 14, and the surface 82a-1 on the side in contact with the molten metal 50 is flush with the surface on the side in contact with the molten metal 50 in the third sensor body 83. As shown by reference numeral 1402 in FIGS. 13 and 14, when the film 82a comes into contact with the molten metal 50, the surface 82a-1 is pressed by the molten metal 50 and bends so as to bulge outward from the mold 40a.

[0182] Hereinafter, the force with which the molten metal 50 in contact with the film 82a presses the film 82a is referred to as the "pressing force". Also, as shown in FIG. 13, the pressing force acting on the film 82a of the third pressure measuring unit 82 disposed in the first hole 41Ya is defined as the "pressing force Fdy-1". The pressing force acting on the film 82a of the third pressure measuring unit 82 disposed in the second hole 41Yb is defined as the "pressing force Fdy-2". The pressing force acting on the film 82a of the third pressure measuring unit 82 disposed in the third hole 41Yc is defined as the "pressing force Fdy-3". The pressing force acting on the film 82a of the third pressure measuring unit 82 disposed in the fourth hole 41Yd is defined as the "pressing force Fdy-4".

[0183] In order to avoid breakage of the film 82a during gravity casting, it is necessary that the film 82a does not react with the molten metal 50. In this embodiment, since the molten metal 50 is an aluminum alloy die-cast, it is necessary to select a material that does not react with aluminum and has a melting point higher than the temperature of the molten metal 50 during casting as the forming material of the film 82a.

[0184] Examples of the forming material of the film 82a include metal materials such as Ti (titanium), Zr (zirconium), Ta (tantalum), Ag (silver), Au (gold), Cr (chromium), Co (cobalt), Ni (nickel), and Pt (platinum). Examples of non-metals include woven fabrics of carbon fibers and ceramic papers. In particular, Mo (molybdenum), Nb (niobium), and W (tungsten) are preferred as the forming material of the film 82a. On the other hand, when using Fe (iron) and its alloys and Cu (copper) which easily react with aluminum, it is preferable to coat the surface of the film 82a with a release agent or apply a wear-resistant coating with a ceramic-based material.

[0185] Regarding the thickness of the film 82a, the thinner it is, the greater the amount of deflection when the same pressing force is applied, and thus higher resolution can be obtained. On the other hand, the thinner the film 82a becomes, the easier it is to be damaged. Therefore, it is preferable that the film 82a has a thickness that enables both resolution and resistance to damage to be within an acceptable range. In this embodiment, in comprehensive consideration of the above-mentioned precautions, a metal film made of Mo with a thickness of 10 μm or more is used as the film 82a.

[0186] The laser displacement meter 82b is a measuring device that non - contact measures the amount of deflection of the film 82a caused by the action of the pressing force. Specifically, the light from the light - projecting element is condensed by the light - projecting lens and projected onto the film 82a. Then, a part of the light reflected by the film 82a reaches the linear image sensor through the light - receiving lens, and the linear image sensor detects the deflection of the film 82a. When the amount of deflection of the film 82a increases or decreases, the light spot on the linear image sensor moves. Therefore, the laser displacement meter 82b detects this movement amount as the amount of deflection of the film 82a. The light - projecting element, the light - projecting lens, the light - receiving lens, and the linear image sensor are all components (not shown) of the laser displacement meter 82b. There is no limitation on the type of the laser displacement meter 82b, and a known laser displacement meter can be used.

[0187] (Pressure Measurement) First, insert the third sensor body 83 into the first to fourth holes 41Ya to 41Yd. Then, as shown by the reference numeral 1402 in FIG. 14, the third sensor body 83 is housed in the first to fourth holes 41Ya to 41Yd so that the surface 82a - 1 of the film 82a is flush with the fifth contact surface Sd1 (the inner side surface of the side wall 41Xa - 1).

[0188] Next, when the molten metal 50 is poured into the mold 40a, as shown in FIG. 13, a pressing force acts on the film 82a, causing the film 82a to bend convexly toward the outside of the mold 40a. The amount of this bending is measured by the third sensor 80. Specifically, the amount of displacement of the film 82a caused by the action of the pressing force is measured by the laser displacement meter 82b of the third pressure measurement unit 82. At the same time, the amount of displacement of each of the bottoms 41Ye-1 and 41Yf-1 caused by the thermal expansion of the metal part 41Xa is measured by the laser displacement meter 82b. The laser displacement meter 82b for measuring the amount of displacement described above is not provided in the third pressure measurement unit 82 but is used alone.

[0189] Then, the third sensor 80 measures the amount of bending of the film 82a by regarding the difference obtained by subtracting the amount of displacement of each of the bottoms 41Ye-1 and 41Yf-1 from the amount of displacement of the film 82a as the amount of bending of the film 82a. Note that it is not essential to consider the thermal expansion of the metal part 41Xa when measuring the amount of bending of the film 82a, and the amount of displacement of the film 82a caused by the action of the pressing force may be directly regarded as the amount of bending of the film 82a.

[0190] Next, the third sensor 80 converts the pressing forces Fdy-1 to Fdy-4 acting on the film 82a of each of the third sensor bodies 83 housed in the first to fourth holes 41Ya to 41Yd from the obtained amount of bending of the film 82a. As conversion methods, at least the following two types of methods can be mentioned.

[0191] As a first conversion method, a method using the following formulas (6) and (7) can be mentioned.

[0192]

Equation

[0193] W: Amount of bending of film 82a [μm] Po: Pressing force [Pa] E: Elastic modulus of film 82a [Pa] h: Thickness of film 82a [μm] ν: Poisson's ratio a: Radius of the diaphragm 82a [mm] r: Radial linear distance between the center of the diaphragm 82a and the measurement position (the position where the amount of deflection of the diaphragm 82a is measured) [mm] ρ: r / a A, B, C, D: Coefficients

[0194]

Equation

[0195] When the conversion unit (not shown) of the third sensor 80 calculates the pressing forces Fdy-1 to Fdy-4 acting on the diaphragm 82a of each of the third pressure measurement units 82 arranged in the first to third holes 41Ya to 41Yc, the above formula (6) is used. When calculating the pressing force Fdy-4 acting on the diaphragm 82a of the third pressure measurement unit 82 arranged in the fourth hole 41Yd, the conversion unit uses the above formula (7). The conversion unit is, for example, a CPU and is provided in the laser displacement meter 82b.

[0196] As a second conversion method, there is a method using the calibration graph shown in FIG. 15. Specifically, before pouring the molten metal 50, the low-melting-point metal molten metal 50a is poured into the calibration mold 40b shown in FIG. 16 in advance and gravity casting is performed.

[0197] The reason for using the low-melting-point metal molten metal 50a is as follows. That is, since the fluid in contact with the diaphragm 82a is the molten metal, the surface shape of the fluid becomes unchanged when it solidifies. Therefore, in the case of the molten metal, there is a possibility that the amount of deflection of the diaphragm 82a cannot be accurately measured due to solidification. In that regard, when the molten metal 50a is a high-melting-point metal such as an aluminum alloy (913.15 K (640 °C) in the case of an aluminum alloy), the portion of the molten metal 50a that comes into contact with the diaphragm 82a immediately after pouring becomes solid, and the measurement accuracy decreases at an early stage. Therefore, it is preferable to use the molten metal of a low-melting-point metal as the molten metal 50a. In the present embodiment, the molten metal of tin (melting point: 503.15 K (230 °C)) is used as the molten metal 50a.

[0198] The temperature of the molten metal 50a is the same as that of the molten metal 50, which is 1023.15 K. The mold 40b is the same as the mold 40a except that the first through third holes 41Ya to 41Yc, the fifth hole 41Ye, and the sixth hole 41Yf are not formed. Also, a third sensor 80 is set in the fourth hole 41Yd of the mold 40b to measure the amount of deflection of the film 82a caused by the pressing of the molten metal 50a and to measure the temperature of the film 82a. Regarding the temperature of the film 82a, the temperature Te4-1 at the measurement location Pe4-1 measured by the third temperature measurement unit 81 is regarded as the temperature of the film 82a. Then, while changing the pouring amount of the molten metal 50a, this gravity casting is performed multiple times.

[0199] Here, the pressing force Pi acting on the film 82a set in the mold 40b can be calculated by the formula Pi = l × g × hi (l: specific gravity of the molten metal 50a [kg / m 3 , g: gravitational acceleration [m / s 2 , hi: height of the molten metal 50a [m]). When the pouring amount of the molten metal 50a is changed, as in the example of FIG. 16, the height hi changes to h1 to h3 (h1 > h2 > h3), so the pressing force Pi acting on the film 82a also changes as the pressing forces P1 to P3 (P1 > P2 > P3). Also, the higher the temperature of the film 82a, the lower the elastic modulus of the film 82a. Therefore, as in the example of FIG. 15, even with the same pressing force Pi, the larger the temperature of the film 82a, the greater the amount of deflection of the film 82a.

[0200] From the above, by performing the gravity casting of the molten metal 50a using the mold 40b multiple times, for a plurality of different pressing forces Pi, a calibration graph showing the relationship between the amount of deflection of the film 82a and the temperature of the film 82a as shown in FIG. 15 can be generated. Regarding the data of the generated calibration graph, for example, it may be stored in a storage unit (not shown) of the third sensor 80, or it may be stored in a storage unit (not shown) built into the simulation device 200.

[0201] The conversion unit reads out the calibration graph from any of the aforementioned storage units, and compares the amount of deflection of the molten metal 50 measured by the third pressure measurement unit 82 and the temperature of the film 82a (i.e., temperature Te4-1) measured by the third temperature measurement unit 81 with the aforementioned graph. Then, the conversion unit converts the pressing forces Fdy-1 to Fdy-4 from the collation result.

[0202] Finally, the third sensor 80 measures the contact pressures Fd1 to Fd4 by regarding the obtained pressing forces Fdy-1 to Fdy-4 as the contact pressures Fd1 to Fd4. Specifically, the third sensor 80 regards the pressing force Fdy-1 as the contact pressure Fd1, the pressing force Fdy-2 as the contact pressure Fd2, the pressing force Fdy-3 as the contact pressure Fd3, and the pressing force Fdy-4 as the contact pressure Fd4. The pressure acquisition unit 32 of the simulation device 200 shown in FIG. 1 acquires the contact pressure data Fd1' to Fd4' of the contact pressures Fd1 to Fd4 measured by the third sensor 80 from the third sensor 80.

[0203] <Example of Processing Results by Simulation Device> Hereinafter, an example of the processing results by the simulation device 200 will be described with reference to FIGS. 12 and 17 to 19. Note that each graph example shown in FIGS. 17 to 19 is an example when the molten metal 50a is gravity cast using the mold 40a coated with the BN spray as the release agent.

[0204] First, the measurement result of the third pressure measurement unit 82 is as shown in the graph of FIG. 17. The horizontal axis of the graph shown in FIG. 17 represents the suitable elapsed time. The suitable elapsed time is the elapsed time from when the molten metal 50a starts to be poured into the mold 40a until before the molten metal 50a solidifies, and within this elapsed time range, the amount of deflection of the film 82a can be measured with high accuracy.

[0205] The suitable elapsed time varies depending on the type of the mold 40a, the constituent metal of the molten metal 50a, the casting conditions, and the like. In the present embodiment, the end point of the suitable elapsed time is set to 20 seconds from when the molten metal 50a starts to be poured into the mold 40a as shown in the graph of FIG. 17.

[0206] When the pouring of the molten metal 50a starts, it comes into contact with the molten metal 50a in the order of "the film 82a set in the fourth hole 41Yd → the film 82a set in the third hole 41Yc → the film 82a set in the second hole 41Yb → the film 82a set in the first hole 41Ya". Since the contact pressures Fd1 to Fd4 start to increase when the contact between the molten metal 50a and the film 82a begins, as shown in the graph of Fig. 17, the values start to increase in the order of approximately "contact pressure Fd4 → contact pressure Fd3 → contact pressure Fd2 → contact pressure Fd1".

[0207] The value that becomes the largest throughout the elapsed time is the contact pressure Fd4 which is the farthest from the upper surface of the molten metal 50a (= the height hi of the molten metal 50a). However, the maximum value of the contact pressure Fd4 is about 0.003 MPa in the example of Fig. 17, which is on the order of 1 / 1000 of the contact pressure in pressure casting. This is because in pressure casting, it is pressurized by a hydraulic press, while in gravity casting, it is only pressurized by the pressure corresponding to the weight of the molten metal.

[0208] Next, the first heat transfer coefficient data hd1 to hd5 continuously determined by the generation unit 33 of the simulation device 200 for each time step are as shown in the graph of Fig. 18. The graph shown in Fig. 18 shows the determination results up to the point when 50 seconds have elapsed since the pouring of the molten metal 50a into the mold 40a started.

[0209] As shown by reference numeral 1202 in FIG. 12, the first heat transfer coefficient data hd1 is a value indicating the heat transfer coefficient of the region facing the first hole 41Ya at the fourth interface Si4. The first heat transfer coefficient data hd2 is a value indicating the heat transfer coefficient of the region facing the second hole 41Yb at the fourth interface Si4. The first heat transfer coefficient data hd3 is a value indicating the heat transfer coefficient of the region facing the third hole 41Yc at the fourth interface Si4. The first heat transfer coefficient data hd4 is a value indicating the heat transfer coefficient of the region facing the fourth hole 41Yd at the fifth interface Si5. The first heat transfer coefficient data hd5 is a value indicating the heat transfer coefficient of the region facing the through hole 41Yg at the fifth interface Si5. The method for determining the first heat transfer coefficient data hd1 to hd5 is the same as that in Embodiment 1. As shown in the graph of FIG. 18, each first heat transfer coefficient data shows different behaviors depending on the calculation location.

[0210] Next, the correlation between the contact pressure data Fd1' to Fd4' estimated by the first estimation unit 34 of the simulation device 200 and the first heat transfer coefficient data hd1 to hd4 is as shown in the graph of FIG. 19. As shown in the graph of FIG. 19, even when minute contact pressures Fd1 to Fd4 act on the fourth and fifth interfaces Si4 and Si5 under gravity casting, the simulation device 200 can analyze the correlation between the contact pressure data Fd1' to Fd4' and the first heat transfer coefficient data hd1 to hd4.

[0211] 〔Embodiment 3〕 Embodiment 3 of the present invention will be described below. The simulation device 300 according to Embodiment 3 of the present invention is different from the simulation devices 100 and 200 in that the first estimation unit 34 constructs estimation models 34a, 34b, and 34c. Further, the simulation device 300 is also different from the simulation devices 100 and 200 in that the second estimation unit 35 estimates the second heat transfer coefficient data hd-2, hpu-2, and hpl-2 using the above-described respective estimation models.

[0212] Hereinafter, a series of processes until the simulation device 300 estimates the correlation between the contact pressure data and the first heat transfer coefficient data will be specifically described with reference to FIG. 1. A series of processes until the generation unit 33 of the simulation device 300 shown in FIG. 1 generates each basic data set is the same as in Embodiments 1 and 2.

[0213] The first estimation unit 34 that has received each basic data set from the generation unit 33 of the simulation device 300 constructs estimation models 34a, 34b, and 34c by machine learning. The estimation model 34a is a learned model obtained by machine learning using the die-side basic data set as teacher data. Using the estimated contact pressure data Fd-2 as input data, it outputs the second heat transfer coefficient data hd-2. The estimation model 34b is a learned model obtained by machine learning using the upper punch-side basic data set as teacher data. Using the estimated contact pressure data Fp-2 as input data, it outputs the second heat transfer coefficient data hpu-2. The estimation model 34c is a learned model obtained by machine learning using the lower punch-side basic data set as teacher data. Using the estimated contact pressure data Fp-2 as input data, it outputs the second heat transfer coefficient data hpl-2. The first estimation unit 34 of the simulation device 300 temporarily stores the constructed estimation models 34a to 34c in the storage unit 3.

[0214] The second estimation unit 35 of the simulation device 300 reads the estimation model 34a from the storage unit 3, inputs the estimated contact pressure data Fd-2 to the estimation model 34a, and obtains the second heat transfer coefficient data hd-2, thereby estimating the second heat transfer coefficient data hd-2. The aforementioned second estimation unit 35 reads the estimation model 34b from the storage unit 3, inputs the estimated contact pressure data Fp-2 to the estimation model 34b, and obtains the second heat transfer coefficient data hpu-2, thereby estimating the second heat transfer coefficient data hpu-2. The aforementioned second estimation unit 35 reads the estimation model 34c from the storage unit 3, inputs the estimated contact pressure data Fp-2 to the estimation model 34c, and obtains the second heat transfer coefficient data hpl-2, thereby estimating the second heat transfer coefficient data hpl-2.

[0215] There is no particular limitation on the method of machine learning performed by the first estimation unit 34 of the simulation device 300, and a known method such as a convolutional neural network can be adopted. In addition, each basic dataset used when the first estimation unit 34 of the simulation device 300 performs machine learning is not limited to only those generated immediately before the machine learning. For example, the first estimation unit 34 of the simulation device 300 may read out each basic dataset generated in the past from the storage unit 3 and use it for machine learning. Also, for example, the first estimation unit 34 of the simulation device 300 may use, for the machine learning, a combination of each basic dataset generated in the past and each basic dataset generated immediately before the machine learning.

[0216] The estimation models 34a to 34c are learned models that output second heat transfer coefficient data based on the estimated correlation between the contact pressure data and the first heat transfer coefficient data (i.e., the estimated correlation). Therefore, the estimation models 34a to 34c are the estimation results by the first estimation unit 34 of the simulation device 300. Thus, the simulation device 300 can estimate the correlation between the contact pressure data and the first heat transfer coefficient data by machine learning using each basic dataset. Also, the simulation device 300 can estimate each second heat transfer coefficient data by using the estimation models 34a to 34c.

[0217] 〔Example of Realization by Software〕 The functions of the simulation device 100 (hereinafter, “device 100”) can be realized by a program for causing a computer to function as the device 100. This program is a program for causing a computer to function as each control block of the device 100 (particularly, each part included in the first estimation device 30).

[0218] In this case, the apparatus 100 includes a computer having at least one control device (e.g., a processor) and at least one storage device (e.g., a memory) as hardware for executing the above-described program. By executing the above-described program with this control device and storage device, each function described in the above-described embodiments is realized.

[0219] The above-described program may be recorded on one or more computer-readable recording media, rather than temporarily. This recording medium may or may not be provided in the apparatus 100. In the latter case, the above-described program may be supplied to the apparatus 100 via any wired or wireless transmission medium.

[0220] Also, part or all of the functions in each control block of the apparatus 100 can also be realized by a logic circuit. For example, an integrated circuit in which a logic circuit functioning as each of the above-described control blocks is formed is also included in the scope of the present invention. In addition to this, for example, it is also possible to realize the functions of each of the above-described control blocks by a quantum computer.

[0221] 〔Example〕 <Instrument> The instruments used in this example are as follows. As the mold 40, a mold composed of a die 41 with a height of 100 mm and an outer diameter of 100 mm, an upper punch 42 with an outer diameter of 40 mm, and a lower punch 43 with a height of 50 mm and an outer diameter of 40 mm was used.

[0222] As the first sensor 10, one having a first sensor body 13 with an outer diameter of 12 mm at the first cylindrical portion, an outer diameter of 18 mm at the cylindrical portion with the largest outer diameter, and a total length of 150 mm was used. As the second sensor 20, one having a second sensor body 23 with an outer diameter of 12 mm at the molten metal side end portion and an outer diameter of 20 mm at the end portion on the opposite side of the molten metal side end portion and a total length of 128 mm was used. Also, strain gauges as the first and second pressure measurement units 12 and 22 were welded and attached at positions more than 60 mm away from the end surfaces of the first cylindrical portion and the molten metal side end portion, respectively.

[0223] In this embodiment, for each of the first and second sensors 10 and 20, the compression characteristics were specified every 50 K from room temperature to about 673 K. Then, the correlation between the strain generated in each of the first and second sensors 10 and 20 and the compression stress acting on these sensors was calibrated.

[0224] For each measurement location where temperature is not measured by the first and second sensors 10 and 20, through holes or non-through holes were formed at the locations of the die 41, the upper punch 42, and the lower punch 43 corresponding to each measurement location. Then, thermocouples similar to the first and second temperature measurement units 11 and 21 were inserted into these holes, and temperature was measured by arranging thermocouples at each measurement location.

[0225] <Casting method> In this embodiment, the die 41 with the lower punch 43 set in the hollow part was set in a hydraulic press, and the molten metal 50 (ADC12) at about 1023 K was poured into the hollow part. Next, while pressurizing the upper punch 42 with the hydraulic press, it was inserted into the hollow part to pressurize the molten metal 50. Then, while maintaining the state where the molten metal 50 was pressurized by the upper punch 42, the molten metal was solidified. Note that, except for the verification of the estimation result of the first estimation unit 34 described later, a black body spray was sprayed as a mold release agent on the inner side surface of the die 41. Also, the press load of the hydraulic press was set to 7.6 t.

[0226] <Investigation results and evaluation results> (Relationship between the first heat transfer coefficient data and the elapsed time) In this embodiment, the relationship between each of the first heat transfer coefficient data h1-1 to h7-1 determined by the generation unit 33 and the elapsed time was investigated. The "elapsed time" refers to the elapsed time since the molten metal 50 started to be poured into the die 41. As a result of the investigation, a graph as shown in FIG. 20 was obtained. As shown in the graph of FIG. 20, the values of the first heat transfer coefficient data h1-1 to h7-1 were different at any elapsed time. From this, it was found that the behavior of the first heat transfer coefficient data with time change differed depending on the measurement location of the temperature data. This is presumably due to the fact that the contact state between the mold 40 and the molten metal 50 differs depending on the measurement location of the temperature data.

[0227] (Comparison with the first heat transfer coefficient data determined using the one-dimensional unsteady heat conduction model) In this embodiment, for each of the first heat transfer coefficient data h1-1 to h3-1, the relationship between the value determined by the generation unit 33 using the determination method of this embodiment and the value determined using the one-dimensional unsteady heat conduction model and the elapsed time was investigated. The generation unit 33 calculated the first heat transfer coefficient data hm1-1 to hm3-1 using the one-dimensional unsteady heat conduction model by the method shown below. The first heat transfer coefficient data hm1-1 is the first heat transfer coefficient data h1-1 calculated using the one-dimensional unsteady heat conduction model. The first heat transfer coefficient data hm2-1 is the first heat transfer coefficient data h2-1 calculated using the one-dimensional unsteady heat conduction model. The first heat transfer coefficient data hm3-1 is the first heat transfer coefficient data h3-1 calculated using the one-dimensional unsteady heat conduction model.

[0228] In the following description, for the sake of simplicity of explanation, only the determination method of the first heat transfer coefficient data h1-1 will be described. The determination methods of the first heat transfer coefficient data h2-1 and h3-1 are substantially the same as the determination method of the first heat transfer coefficient data h1-1.

[0229] First, the generation unit 33 replaced the state in the vicinity of the interface region corresponding to the first heat transfer coefficient data h1-1 with an equivalent circuit 70 as shown in FIG. 21. The measurement location Pc is a general term for the measurement locations Pc1 to Pc3, and the temperature data Tc´ is a general term for the temperature data Tc1´ to Tc3´. The measurement location Pm1 is a general term for the measurement locations Pm1-1 to Pm3-1, and the temperature data Tm1´ is a general term for the temperature data Tm1-1´ to Tm3-1´. The measurement location Pm2 is a general term for the measurement locations Pm1-2 to Pm3-2, and the temperature data Tm2´ is a general term for the temperature data Tm1-2´ to Tm3-2´.

[0230] The thermal resistance RHTC is a general term for the thermal resistances RHTC1 to RHTC3. The thermal resistances RHTC1 to RHTC3 are the thermal resistances of the interface regions corresponding to the first heat transfer coefficient data h1-1 to h3-1, respectively. The thermal resistance R1 is a general term for the thermal resistances R11 to R13. The thermal resistance R11 is the thermal resistance between the measurement locations Pm1-1 and Pm1-2. The thermal resistance R12 is the thermal resistance between the measurement locations Pm2-1 and Pm2-2. The thermal resistance R13 is the thermal resistance between the measurement locations Pm3-1 and Pm3-2.

[0231] Next, the generation unit 33 acquired the temperature data Tc1´, Tm1-1´, and Tm1-2´ from the temperature acquisition unit 31 at a certain time step. Next, the generation unit 33 set the value of the thermal resistance RHTC1. In this embodiment, the generation unit 33 set the value received by the input unit 1 as the set value of the thermal resistance RHTC1 when the input unit 1 received an operation for setting the value of the thermal resistance RHTC1.

[0232] Next, the generation unit 33 calculated the estimated temperature data Tmpe1´ using the following formula (8) obtained by applying each temperature data acquired from the temperature acquisition unit 31, the thermal resistance RHTC1, and the one-dimensional unsteady heat conduction equation to the equivalent circuit 70. The estimated temperature data Tmpe1´ is the estimated temperature data at the measurement location Pm1-1. The estimated temperature data Tmpe1´, the estimated temperature data Tmpe2´ at the measurement location Pm2-1, and the estimated temperature data Tmde1´ at the measurement location Pm3-1 are collectively referred to as "estimated temperature data Tme´".

[0233] [Number]

[0234] Tme´: Presumed temperature data Tme´ [K] Tm1´: Temperature data Tm1´ at a certain time step Tm2´: Temperature data Tm2´ [K] at a certain time step Tc´: Temperature data Tc´ [K] at a certain time step RHTC: Thermal resistances RHTC1, RHTC2, and RHTC3 [(m 2 ·K) / W] β0, β1: Constants R1: Δx / λm [(m 2 ·K) / W] Δx: Distance between measurement points Pc and Pm1, distance between measurement points Pm1 and Pm2 [m] In this embodiment, the generation unit 33 used the equation obtained by applying the unsteady heat conduction equation in a one-dimensional orthogonal coordinate system to the equivalent circuit 70 as the aforementioned equation (8) to calculate the presumed temperature data Tmpe1´. When calculating the presumed temperature data Tmpe2´, the generation unit 33 also used the equation obtained by applying the unsteady heat conduction equation in a one-dimensional orthogonal coordinate system to the equivalent circuit 70 as the aforementioned equation (8). On the other hand, when calculating the presumed temperature data Tmde1´, the generation unit 33 used the equation obtained by applying the unsteady heat conduction equation in a one-dimensional cylindrical coordinate system to the equivalent circuit 70 as the aforementioned equation (8). Also, the generation unit 33 made the values of β0 and β1 different when calculating the presumed temperature data Tmde1´ and when calculating the presumed temperature data Tmpe1´ and Tmpe2´.

[0235] Next, the generation unit 33 calculated the difference between the calculated estimated temperature data Tmpe1' and the temperature data Tm1-1' (measured value) at the next time step. Then, the generation unit 33 determined whether the calculated difference was the smallest among the differences between the plurality of estimated temperature data Tmpe1' obtained by repeatedly performing the setting process of the thermal resistance RHTC1 and the calculation process using the above-mentioned formula (8) a plurality of times at this time step, and the above-mentioned temperature data Tm1-1'. When it was determined that it was not the smallest, the generation unit 33 recalculated the estimated temperature data Tmpe1', calculated the above-mentioned difference, and determined whether the difference was the smallest.

[0236] In this embodiment, the generation unit 33 recalculated the estimated temperature data Tmpe1' and the like by comparing the magnitudes of the values of the evaluation function e = |Tmpe1' - Tm1-1'| calculated a plurality of times at a certain time step among the plurality of evaluation functions e. The comparison method of the evaluation function e is the same as the comparison method of the evaluation function e described in this embodiment except that Δh is replaced with ΔRHTC1 (change amount of thermal resistance).

[0237] When it was determined that it was the smallest, the generation unit 33 calculated the first heat transfer coefficient data hm1-1 by substituting the value of the thermal resistance RHTC1 corresponding to the estimated temperature data Tmpe1' with the smallest difference into the following formula (9). The generation unit 33 calculated the first heat transfer coefficient data hm2-1 and hm3-1 in the same way.

[0238]

Equation

[0239] h: First heat transfer coefficient data hm1-1, hm2-1 and hm3-1 [W / (m 2 ·K)] Rc: Thermal resistance of the molten metal 50 [(m 2 ·K) / W] Rm: Thermal resistance of the mold 40 [(m 2 ·K) / W] When the calculation process of the first heat transfer coefficient data hm1-1 to hm3-1 at a certain time step is completed, the generation unit 33 updates the time step by one and determines whether the updated time step is the final time step. If the updated time step is not the final time step, the generation unit 33 calculates the first heat transfer coefficient data hm1-1 to hm3-1 at the updated time step. In this way, the calculation of the first heat transfer coefficient data hm1-1 to hm3-1 is repeated for each time step, and the generation unit 33 continues to calculate the first heat transfer coefficient data hm1-1 to hm3-1 until the final time step is reached.

[0240] As a result of the investigation, each graph shown in FIG. 22 was obtained. In the figure, "1D" indicates a value determined using a one-dimensional unsteady heat transfer model, and "3D" indicates a value determined by the determination method of the present embodiment. In each graph regarding the measurement points Pc2, ~Pm2-2 and Pc3, ~Pm3-2 in FIG. 22, the value of the first heat transfer coefficient data is generally larger for "1D" than for "3D". On the other hand, in the graph regarding the measurement points Pc1, ~Pm1-2 in FIG. 22, there was no significant difference in the value of the first heat transfer coefficient data between "1D" and "3D" regardless of the elapsed time.

[0241] This is presumably due to the fact that the heat transfer from the corner portion of the molten metal 50 including the measurement points Pc2 and Pc3 to the mold 40 was larger than the heat transfer from the other portions of the molten metal 50. That is, since the dies 41 and the upper punch 42 are present in the vicinity above and laterally of the aforementioned corner portion, it is presumed that heat transfer from the aforementioned corner portion to the dies 41 and the upper punch 42 was more likely to occur than in the other portions of the molten metal 50.

[0242] (Determination Accuracy of First Heat Transfer Coefficient Data) In this embodiment, the determination accuracy of the generation unit 33 was evaluated by calculating the error between the measured value of the temperature data at a specific location and the specific temperature data Tms´ using the first heat transfer coefficient data h1-1 to h7-1 determined by the generation unit 33. The specific temperature data Tms´ is the estimated temperature data Tme´ among a plurality of estimated temperature data Tme´ at a certain time step, for which the difference between the estimated temperature data Tme´ and the temperature data at the next time step is minimized. The "temperature data" in this case refers to the measured value of the temperature at the measurement location where the estimated temperature data Tme´ is estimated.

[0243] Hereinafter, the specific temperature data Tms´ at the measurement locations Pm1-1 to Pm7-1 is referred to as "specific temperature data Tms1-1´ to Tms7-1´", and the specific temperature data Tms´ at the measurement locations Pm1-2 to Pm7-2 is referred to as "specific temperature data Tms1-2´ to Tms7-2´".

[0244] Specifically, for a total of 14 locations including the measurement locations Pm1-1 to Pm7-1 and Pm1-2 to Pm7-2 shown in FIG. 5, the error between the measured value and the specific temperature data Tms´ was calculated. Also, in this embodiment, a series of processes related to the evaluation of the determination accuracy were performed using the simulation device 100.

[0245] In this embodiment, for the first heat transfer coefficient data h1-1, (i) the value when using the method (3D unsteady heat transfer model) of this embodiment was determined. Also, (ii) the value when using the aforementioned 1D unsteady heat transfer model was determined. Hereinafter, the first heat transfer coefficient data h1-1 in case (i) is referred to as "first heat transfer coefficient data h11", and the first heat transfer coefficient data h1-1 in case (ii) is referred to as "first heat transfer coefficient data h12". Further, as a comparative example, first heat transfer coefficient data with a constant value was used for the calculation of each specific temperature data. As the constant values, values of 2000, 5000, 10000, 20000, and 30000 W / (m 2 ·K) were set.

[0246] In this embodiment, as the measured values of the temperature data Tm1-1´ to Tm7-1´ and Tm1-2´ to Tm7-2´, the respective values acquired by the first and second sensors 10 and 20 were used. Also, in the cases of the aforementioned (i), (ii), and each comparative example, the specific temperature data Tms1-1´ to Tms7-1´ and Tms1-2´ to Tms7-2´ were calculated using the aforementioned formulas (3) to (5). In the case of the aforementioned (ii), each specific temperature data was calculated using the aforementioned formulas (8) and (9).

[0247] Next, by calculating seven types of average errors E1 to E7, the determination accuracy of the generation unit 33 in each of the aforementioned cases (i) and (iv), as well as each comparative example, was evaluated. The average error E1 is obtained by calculating the error between the measured value and the specific temperature data Tms´ in the case of the aforementioned (i) for each temperature data, and taking the average value of the calculated errors. The average error E2 is obtained by calculating the error between the measured value and the specific temperature data Tms´ in the case of the aforementioned (ii) for each temperature data, and taking the average value of the calculated errors.

[0248] The average errors E3 to E7 are obtained by calculating the error between the measured value and the specific temperature data Tms´ when the first heat transfer coefficient data is each of the aforementioned constant values for each temperature data, and taking the average value of the calculated errors. Specifically, the average errors E1 to E7 were calculated using the following formula (10).

[0249]

Equation

[0250] E: Average errors E1 to E7 [K] Tmes: Measured values of the temperature data Tm1-1´ to Tm7-1´ and Tm1-2´ to Tm7-2´ [K] Tcal: Specific temperature data Tms1-1´ to Tms7-1´ and Tms1-2´ to Tms7-2´ [K] In this embodiment, for the evaluation of the calculation accuracy, the average errors E1 to E7 for each time step were calculated, and the calculation results were plotted to create a graph. As a result, a graph as shown in FIG. 23 was obtained. The horizontal axis of the graph shown in FIG. 23 is the elapsed time since the molten metal 50 started to be poured into the die 41.

[0251] As shown in FIG. 23, the average error E1 had the smallest error among all the average errors regardless of the elapsed time. Also, for the average error E1, the error reached its maximum at the time when the elapsed time was about 11 seconds. However, the maximum value of the average error E1 was extremely small, about 3K. It was found that according to the method of this embodiment, the first heat transfer coefficient data can be determined with extremely high accuracy.

[0252] <Verification of Estimation Results> In this embodiment, the estimated correlation relationship, which is the estimation result of the first estimation unit 34, was verified. Specifically, first, for each of the first upper punch side estimated correlation relationship and the second die side estimated correlation relationship, the second estimated correlation relationship in period II was verified. As a premise, the first estimation unit 34 performed molding processing for three cases: (iii) when no release agent was applied to the inner side surface of the die 41, (iv) when a BN spray was sprayed, and (v) when a black body spray was sprayed. Specifically, for each of the above three cases, the load of the hydraulic press was set to five values of about 3t, about 4t, about 5t, about 6t, and about 7.5t for molding processing. Then, the above-described two second estimated correlation relationships were derived.

[0253] The estimation result of the first estimation unit 34 was obtained in the form of each graph in FIG. 24. As shown in FIG. 24, it was found that in any of the above-mentioned cases (iii) to (v), the second estimated correlation relationship can be approximated by a linear function with a positive slope. Also, the slope of this linear function was approximately 3251 in the case of (iii) above, approximately 1216 in the case of (iv) above, and approximately 696 in the case of (v) above. From this, it was found that the slope of the linear function approximately representing the second estimated correlation relationship changes according to the presence or absence of the mold release agent and the type of the mold release agent. Also, it was found that the slope of this linear function becomes the largest when the mold release agent is not applied to the inner side surface of the die 41 (the case of (iii) above).

[0254] Next, the third estimated correlation relationship in period III in the first upper punch side estimated correlation relationship was verified. As a premise, BN spray was sprayed on the inner side surface of the die 41. Also, the first estimation unit 34 derived the third estimated correlation relationship for each of the four cases of the numerical range of the contact pressure data Fp-1. The estimation result of the first estimation unit 34 was obtained in the form of the graph in FIG. 25. Note that the "molten metal surface temperature" on the horizontal axis of this graph represents the temperature at the measurement location Pc1.

[0255] As shown in FIG. 25, the first heat transfer coefficient data h1-1 decreased in value as the molten metal surface temperature decreased in any case of the numerical range of the contact pressure data Fp-1. Also, the slope (degree of decrease in value) of the first heat transfer coefficient data h1-1 increased as the value of the contact pressure data Fp-1 decreased. From these facts, it was found that the first heat transfer coefficient data is affected by the contact pressure data and the molten metal surface temperature.

[0256] Here, as an example, a case is cited where molding is performed by setting the load of the hydraulic press to five values of 3.3 t, 4.3 t, 5.3 t, 6.4 t, and 7.6 t using the mold 40 with BN spray sprayed on the inner side surface of the die 41. In this case, in the above-mentioned linear function h1-1 = a×Fp-1 + b×Ts + c, a = approximately 1362.02, b = approximately 3.86, c = approximately -1475.31, and the average error is approximately 3500 W / (m 2·K) was able to approximate the third estimated correlation relationship.

[0257] 〔Summary 1〕 The sensor according to Embodiment 1 of the present invention includes a film that comes into contact with a fluid and bends due to a pressing force from the fluid, and a laser displacement meter that projects light onto the film and receives the light reflected from the film to detect the amount of bending of the film.

[0258] The sensor according to Embodiment 2 of the present invention may, in Embodiment 1, detect a pressure value acting on an interface between a metal part of the mold and the melt filled in a space surrounded by the metal part, where the fluid is a melt filled in the mold.

[0259] The sensor according to Embodiment 3 of the present invention may, in Embodiment 2, be formed of at least one selected from the group consisting of Mo (molybdenum), Nb (niobium), W (tungsten), Ti (titanium), Zr (zirconium), Ta (tantalum), Ag (silver), Au (gold), Cr (chromium), Co (cobalt), Ni (nickel), Pt (platinum), and carbon fiber.

[0260] The sensor according to Embodiment 4 of the present invention may, in Embodiment 2 or 3, further include a plurality of temperature measurement parts at different positions from each other.

[0261] The sensor according to Embodiment 5 of the present invention may, in Embodiment 4, be composed of a first temperature measurement part located on the melt side of the film and a second temperature measurement part located on the mold side of the film among the plurality of temperature measurement parts.

[0262] The sensor according to Embodiment 6 of the present invention may, in Embodiment 4, be composed of a first temperature measurement part located on the melt side of the film and a plurality of second temperature measurement parts located on the mold side of the film among the plurality of temperature measurement parts, and the first temperature measurement part and the plurality of second temperature measurement parts may be located on the same axis.

[0263] The mold according to Aspect 7 of the present invention is a mold having a hollow portion into which the fluid is poured and including a plurality of sensors according to any one of Aspects 1 to 6.

[0264] 〔Second Summary〕 The estimation device according to Aspect 11 of the present invention uses a basic data set in which pressure data indicating a pressure value acting on an interface between a metal part of a mold and a melt filled in a space surrounded by the metal part and first heat transfer coefficient data indicating a first heat transfer coefficient between the metal part and the melt at the interface are associated with each other, and includes a first estimation unit that estimates a correlation between the pressure data and the first heat transfer coefficient data, and a second estimation unit that estimates second heat transfer coefficient data indicating a second heat transfer coefficient corresponding to the specific pressure data from the specific pressure data using an estimated correlation that is the correlation estimated by the first estimation unit.

[0265] According to the above configuration, if only the pressure data acting on the interface can be specified, the second heat transfer coefficient data corresponding to the pressure specified using the estimated correlation can be estimated. Thereby, the heat transfer coefficient of the interface can be easily estimated, and thus the respective temperature distributions of the metal part of the mold and the melt can be easily estimated.

[0266] The estimation device according to Aspect 12 of the present invention is the same as that in Aspect 11, except that the first estimation unit may estimate, as the estimated correlation, a first estimated correlation in a period from when the melt is filled in the space until a molding pressure for molding the melt is applied to the melt, a second estimated correlation in a period from when the molding pressure is applied to the melt until the surface temperature of the melt reaches the solidification temperature of the melt, and a third estimated correlation after the action of the molding pressure on the melt continues and the surface temperature becomes lower than the solidification temperature.

[0267] According to the above configuration, for example, compared with the case of estimating the estimation correlation relationship without considering at least one of the molding pressure and the solidification temperature, an estimation correlation relationship closer to the actual state of the melt molding can be estimated. Thereby, the estimation accuracy of the second heat transfer coefficient data using the estimation correlation relationship can be improved.

[0268] In the estimation device according to Aspect 13 of the present invention, in the above Aspect 11 or 12, the first estimation unit constructs an estimation model by machine learning using the basic data set as teacher data, and the second estimation unit inputs the specific pressure data into the estimation model, and the second heat transfer coefficient data output from the estimation model may be obtained to estimate the second heat transfer coefficient data.

[0269] According to the above configuration, the correlation between the contact pressure data and the first heat transfer coefficient data can be estimated by machine learning using the basic data set as teacher data. Also, the second heat transfer coefficient data can be estimated by using the estimation model.

[0270] The estimation device according to Aspect 14 of the present invention may further include, in any of the above Aspects 11 to 13, a temperature acquisition unit that acquires first temperature data indicating the temperature value of the first temperature of the metal part and second temperature data indicating the temperature value of the second temperature of the melt, and a generation unit that generates the basic data set by determining the first heat transfer coefficient using the first temperature data and the second temperature data acquired by the temperature acquisition unit.

[0271] According to the above configuration, compared with the case of using, for example, the actual value of the first heat transfer coefficient data determined by the generation unit in the past as the first heat transfer coefficient data constituting the basic data set, the first heat transfer coefficient data constituting the basic data set becomes a value reflecting the timely state of the interface. Thereby, the estimation accuracy of the estimation correlation relationship can be improved, and consequently, the estimation accuracy of the second heat transfer coefficient data can be improved.

[0272] In the estimator according to Aspect 15 of the present invention, in the above Aspect 14, the temperature acquisition unit acquires the first temperature data at a plurality of locations in the metal part and the second temperature data at a plurality of locations in the melt at regular intervals. The generation unit, for each of a plurality of locations in the metal part, uses the plurality of first temperature data and the plurality of second temperature data acquired by the temperature acquisition unit at a certain time point to calculate a plurality of estimated temperature data that are estimated values of the first temperature data at the time point when the certain time has elapsed from the certain time point, while changing the value of the first heat transfer coefficient data. The difference between the estimated temperature data and the first temperature data at the time point when the certain time has elapsed from the certain time point is calculated for each of the plurality of estimated temperature data. The first heat transfer coefficient data constituting the basic data set may be selected from the plurality of first heat transfer coefficient data whose values have been changed, using the plurality of differences calculated for each of the plurality of locations in the metal part.

[0273] According to the above configuration, the first heat transfer coefficient data constituting the basic data set can be determined in consideration of the plurality of differences calculated for each of the plurality of locations in the metal part. As a result, the first heat transfer coefficient data constituting the basic data set becomes a value that not only reflects the timely state of the interface but also accurately reflects the temperature distribution of the metal part. Therefore, the estimation accuracy of the second heat transfer coefficient data can be further improved.

[0274] The simulation device according to Aspect 16 of the present invention includes the estimator according to Aspect 11 and a behavior estimation device that estimates the solidification behavior of the melt using the second heat transfer coefficient data estimated by the estimator.

[0275] As Aspect 17 of the present invention, the estimator according to each aspect of the present invention may be realized by a computer. In this case, a control program for the estimator that realizes the estimator by operating the computer as each part (software element) included in the estimator, and a computer-readable recording medium on which it is recorded also fall within the scope of the present invention.

[0276] The data set according to Embodiment 18 of the present invention includes pressure data indicating a pressure value acting on an interface between a metal part of a mold and a melt filled in a space surrounded by the metal part, first heat transfer coefficient data indicating a first heat transfer coefficient between the metal part and the melt at the interface, and an estimated correlation relationship obtained by estimating a correlation relationship between the pressure data and the first heat transfer coefficient data. When an estimation device performs an estimation process of estimating second heat transfer coefficient data indicating a second heat transfer coefficient corresponding to specific pressure data from the specific pressure data using the estimated correlation relationship, the estimation device uses the data set.

[0277] According to the above configuration, the heat transfer coefficient of the interface can be easily estimated using the pressure data, the first heat transfer coefficient data, and the estimated correlation relationship included in the data set, and thus the respective temperature distributions of the metal part of the mold and the melt can be easily estimated.

[0278] The estimation method according to Embodiment 19 of the present invention includes a first estimation step of estimating a correlation relationship between pressure data indicating a pressure value acting on an interface between a metal part of a mold and a melt filled in a space surrounded by the metal part and first heat transfer coefficient data indicating a first heat transfer coefficient between the metal part and the melt at the interface, using a basic data set in which the pressure data and the first heat transfer coefficient data are associated with each other; and a second estimation step of estimating second heat transfer coefficient data indicating a second heat transfer coefficient corresponding to specific pressure data from the specific pressure data, using the estimated correlation relationship between the pressure data and the first heat transfer coefficient data estimated in the first estimation step.

Explanation of Reference Numerals

[0279] 30 First Estimation Device (Estimation Device) 31 Temperature Acquisition Unit 32 Pressure Acquisition Unit 33 Generation Unit 34 First Estimation Unit 35 Second Estimation Unit 40, 40a Mold 40X Space 41X, 41Xa metal parts 41Y, 42X holes 41Ya First hole 41Yb Second hole 41Yc Third hole 41Yd Fourth hole 42 Upper punch (metal part) 43 Lower punch (metal part) 50 Molten metal (melt) 60 Second estimation device (behavior estimation device) 81 Third temperature measurement part (temperature measurement part) 82 Third pressure measurement part (pressure measurement part) 82a Membrane 83 Third sensor body (single member) 100, 200, 300 Simulation devices hd-1, hpl-1, hpu-1, hd1, hd2, hd3, hd4, hd5 First heat transfer coefficient data hd-2, hpl-2, hpu-2 Second heat transfer coefficient data Fd-1, Fd1´, Fd4´, Fp-1 Contact pressure data (pressure data) Fd-2, Fp-2 Estimated contact pressure data (specific pressure data) Si1 First interface Si2 Second interface Te1-1´, Te4-1´, Te1-2´, Te4-2´, Tm1-1´, Tm2-1´, Tm3-1´, Tm4-1´, Tm5-1´, Tm6-1´, Tm7-1´, Tm1-2´, Tm2-2´, Tm3-2´, Tm4-2´, Tm5-2´, Tm6-2´, Tm7-2´ Temperature data (first temperature data) Tc1´, Tc2´, Tc3´, Tc4´, Tc5´, Tc6´, Tc7´, Td1´, Td4´ Temperature data (second temperature data) T i、j、k ´ Estimated temperature data

Claims

1. A membrane that comes into contact with a fluid and is deflected by a pressing force from the fluid; and a laser displacement meter that projects light onto the film and receives the light reflected from the film to detect the amount of deflection of the film.

2. the fluid is a melt to be filled into a mold, The sensor according to claim 1 , which detects a pressure value acting on an interface between a metal portion of the mold and the molten material filling a space surrounded by the metal portion.

3. 3. The sensor of claim 2, wherein the film is formed of at least one selected from the group consisting of Mo (molybdenum), Nb (niobium), W (tungsten), Ti (titanium), Zr (zirconium), Ta (tantalum), Ag (silver), Au (gold), Cr (chromium), Co (cobalt), Ni (nickel), Pt (platinum) and carbon fiber.

4. The sensor according to claim 2 or 3, further comprising a plurality of temperature measuring units at different positions.

5. The plurality of temperature measuring units include A first temperature measuring unit located on the melt side of the film; The sensor according to claim 4 , further comprising: a second temperature measuring portion located on the mold side relative to the film.

6. The plurality of temperature measuring units include A first temperature measuring unit located on the melt side of the film; and a plurality of second temperature measuring units located on the mold side relative to the film, The sensor according to claim 4 , wherein the first temperature measuring portion and the plurality of second temperature measuring portions are positioned on the same axis.

7. A mold having a hollow portion into which the fluid is poured, the mold comprising a plurality of sensors according to claim 1 .

Images