Heat radiator

Abstract

To improve the maintainability of a heat radiator.SOLUTION: A heat radiator includes: a heat radiating member having a first surface on which a heat-generating component is disposed, and a planar second surface opposite to the first surface; and a thermally conductive housing including a base part having a planar placement surface on which the heat radiating member is placed via heat dissipation grease on the second surface side. The heat radiating member includes a protruding part so as to extend from the second surface toward the first surface in at least a portion on one end thereof. The housing includes a side wall part provided so as to face the protruding part in a state where the heat radiating member is arranged on the placement surface of the housing via the heat dissipation grease. The heat radiator includes a lateral movement mechanism that separates the protruding part from the side wall part in a direction parallel to the placement surface so as to allow the heat radiating member arranged on the placement surface of the housing via the heat dissipation grease to perform parallel movement on the placement surface.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a heat dissipation device.

Background Art

[0002] In recent years, electronic devices have tended to be miniaturized, and their interiors have been made denser. Such electronic devices usually include high heat-generating components such as a CPU (Central Processing Unit) and an FPGA (Field Programmable Gate Array). In order to dissipate the heat generated by the heat-generating components, a heat dissipation device is provided.

[0003] As an example of such a heat dissipation device, there is one described in Patent Document 1. This heat dissipation device includes a heat dissipation plate on which a heat-generating component is disposed, and a cooling case on which the heat dissipation plate is disposed via a heat dissipation grease.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The above prior art documents are incorporated herein by reference.

[0006] The following analysis was made by the inventor of the present invention.

[0007] Once the heat dissipation plate as described above is attached to the case, it is not removed from the case, but it may be necessary to remove it from the case in order to improve maintainability or the like.

[0008] In order to remove the heat sink from the case, the heat dissipation device described in Patent Document 1 has a removal mechanism for separating the heat sink and the case in a direction perpendicular to the contact surface between the heat sink and the case.

[0009] However, the heat sink and the case may be adhered by the heat dissipation grease disposed therebetween and may not be easily separated.

[0010] In such a case, when the above removal mechanism is used, the heat sink may not withstand the load of peeling off the adhesion of the heat dissipation grease when the heat sink and the case are separated, and may be deformed or destroyed, and ultimately may have to be replaced with a new one.

[0011] An object of the present disclosure is to provide a heat dissipation device that can contribute to improving maintainability and the like.

Means for Solving the Problems

[0012] According to one aspect of the present disclosure, a heat dissipation device is provided. The heat dissipation device includes a heat dissipation member having a first surface on which a heat generating component is disposed and a planar second surface facing the first surface, and a thermally conductive housing having a base portion having a planar mounting surface on which the heat dissipation member is disposed via heat dissipation grease on the second surface side. including. The heat dissipation member has a protruding portion configured to extend in a direction from the second surface toward the first surface at at least a part of one end portion thereof. The housing has a side wall portion provided so as to face the protruding portion in a state where the heat dissipation member is disposed on the mounting surface of the housing via heat dissipation grease. The heat dissipation device includes a lateral movement mechanism for separating the protruding portion and the side wall portion in a direction parallel to the mounting surface so that the heat dissipation member disposed on the mounting surface of the housing via heat dissipation grease moves parallel on the mounting surface.

Effects of the Invention

[0013] The present disclosure or its perspective can contribute to improving maintainability and the like.

Brief Description of the Drawings

[0014]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Modes for Carrying Out the Invention

[0015] Preferred embodiments of the present disclosure are shown below, but the present disclosure is not limited thereto. (Embodiment 1) Refer to one perspective of the above-described present disclosure. (Embodiment 2) In the heat dissipation device described in the above Embodiment 1, the lateral movement mechanism includes a through hole of the protrusion formed in a direction parallel to the placement surface, and a shaft member configured to be insertable into the through hole, having an end portion that abuts against the side wall portion, and configured to be able to press the side wall portion through the end portion. Preferably, it includes the above. (Embodiment 3) In the heat dissipation device described in the above Embodiment 2, the through hole has a female screw, and preferably, the shaft member is a bolt having a male screw that screws into the female screw. (Embodiment 4) In the heat dissipation device described in the above Embodiment 1, the lateral movement mechanism includes a through hole of the side wall portion formed in a direction parallel to the placement surface, and A shaft member configured to be insertable into the through hole, having an end portion that abuts against the protruding portion, and configured to be able to press the protruding portion through the end portion Preferably includes. (Form 5) In the heat dissipation device according to the above Form 4, The through hole has a female screw, The shaft member is preferably a bolt having a male screw that screws into the female screw. (Form 6) In the heat dissipation device according to the above Form 3 or 5, The female screw is preferably the female screw of a nut press-fitted into the through hole. (Form 7) In the heat dissipation device according to the above Form 1, The protruding portion is preferably formed by bending and standing up a portion extending from at least a part of the one end portion. (Form 8) In the heat dissipation device according to the above Form 1, The heat dissipation member is preferably a plate-shaped member. (Form 9) In the heat dissipation device according to the above Form 1, The heat dissipation member is preferably a vapor chamber. (Form 10) In the heat dissipation device according to the above Form 1, The housing preferably has at least one cooling fin on the side facing the placement surface of the base portion.

[0016] Note that the present disclosure can also be embodied as a computer-executable program, and the program can be recorded on a computer-readable non-transitory (non-transitory) storage medium. That is, the present disclosure can also be embodied as a computer program product. The program is input into a computer device through an input device or externally via a communication interface, stored in a storage device, drives a processor according to predetermined steps or processes, and can display the processing results including intermediate states step by step via a display device as needed, or communicate with devices inside or outside the device (including a computer) via a communication interface, whether wired or wireless. A computer device for that purpose typically includes, as an example, a processor, a storage device, an input device, a communication interface, and, if necessary, a display device that can be connected to each other by a bus.

[0017] The following describes an overview of the present disclosure. Note that the drawing reference numerals appended to this overview are solely for assisting in the understanding of the present disclosure and are not intended to limit the present disclosure to the illustrated embodiments.

[0018] Furthermore, in the following description and drawings, the same or common functional elements are appended with the same drawing reference numerals.

[0019] FIG. 1 is a conceptual diagram of a part of an example of the heat dissipation device of the present disclosure.

[0020] The illustrated heat dissipation device 1 includes a heat dissipation member 2, a housing 3, and a lateral movement mechanism 4.

[0021] (Heat dissipation member 2) The heat dissipation member 2 has a first surface 2a on which heat-generating components 6 such as a CPU, FPGA, etc. are disposed, and a planar second surface 2b facing the first surface 2a.

[0022] The first surface 2a of the heat radiating member 2 can be formed in a planar shape, and in this case, the heat radiating member 2 is configured as a plate-like member. The plate-like heat radiating member 2 is, for example, a vapor chamber (see FIG. 5 for a specific example thereof). However, other types of heat radiating members can also be used as long as they have a shape or structure that allows for parallel movement or sliding on the base portion 3a of the housing 3.

[0023] Further, the shape of the first surface 2a of the heat radiating member 2 is not limited to a planar shape and can be any shape as long as the heat generating component 6 can be disposed thereon.

[0024] The heat radiating member 2 is, in particular, a rectangular or square plate-like member. However, the heat radiating member 2 only needs to be capable of parallel movement or sliding on the placement surface 3b of the base portion 3a of the housing 3, and thus can be a plate-like member of any shape such as a circle, an ellipse, or a polygon other than a rectangle or a square.

[0025] The heat radiating member 2 is formed of, in particular, a metal or alloy such as copper or aluminum, but can be formed of any material with high thermal conductivity. In the case where the heat radiating member 2 is formed of a material with low strength that may be deformed, broken, etc. by the action of a force applied by, for example, the lateral movement mechanism 4, the heat radiating member 2 can be configured to be at least partially surrounded by a reinforcing member (such as a frame) formed of a material with high strength such as metal. Further, such a reinforcing member is also applicable to the heat radiating member 2 formed of a material with high strength.

[0026] The heat radiating member 2 has a protruding portion 2c configured to extend in a direction from the second surface 2b toward the first surface 2a at at least a part of one end thereof.

[0027] The protruding portion 2c can be formed by bending and standing up a portion extending from at least a part of one end of the heat radiating member 2. Further, the protruding portion 2c can also be formed by bending and standing up a portion extending from at least a part of one end of a reinforcing member for the heat radiating member 2. Alternatively, for example, it is also possible to fixedly provide a plate-like member made of metal bent in an L shape at at least a part of one end of the heat radiating member 2 or its reinforcing member.

[0028] Note that the heat dissipation member 2 is disposed on the mounting surface 3b of the base portion 3a of the housing 3 via the heat dissipation grease 5. Therefore, the "planar" second surface 2b in the present disclosure is not limited to a "plane" in a strict sense, and may have deformations such as unevenness and curvature within a range where the heat dissipation member 2 can slide or shift on the mounting surface 3b of the base portion 3a of the housing 3. Accordingly, the "parallel" in the present disclosure is not limited to "parallel" in a strict sense, and may have an inclination or the like within a range where the heat dissipation member 2 can slide or shift on the mounting surface 3b of the base portion 3a of the housing 3.

[0029] (Housing 3) The housing 3 includes a base portion 3a having a planar mounting surface 3b on which the heat dissipation member 2 is disposed via the heat dissipation grease 5 on the side of the second surface 2b thereof.

[0030] The housing 3 further has a side wall portion 3c provided so as to face the protruding portion 2c of the heat dissipation member 2, that is, to extend in the protruding direction of the protruding portion, in a state where the heat dissipation member 2 is disposed on the mounting surface 3b of the housing 3 via the heat dissipation grease 5.

[0031] The housing 3 is a member having thermal conductivity, particularly made of metal, but can be manufactured from any material as long as it has a high thermal conductivity.

[0032] The housing 3 can further have at least one cooling fin on the side facing the mounting surface 3b of the base portion 3a for improving heat dissipation or the like. Note that instead of or in addition to the cooling fins, other types of cooling means, such as a heat pipe, a vapor chamber, etc., may be provided.

[0033] Note that as described above, the heat dissipation member 2 is disposed on the mounting surface 3b of the base portion 3a of the housing 3 via the heat dissipation grease 5. Therefore, the "planar" mounting surface 3b is not limited to a "plane" in a strict sense, and may have deformations such as unevenness and curvature within a range where the heat dissipation member 2 can move parallel or slide on the base portion 3a of the housing 3.

[0034] (Lateral movement mechanism) The lateral movement mechanism 4 is configured to separate the protruding portion 2c of the heat dissipation member 2 from the side wall portion 3c of the housing 3 in a direction parallel to the mounting surface 3b of the housing 3 so that the heat dissipation member 2 disposed via the heat dissipation grease 5 on the mounting surface 3b of the housing 3 moves in parallel on the mounting surface 3b.

[0035] Due to this separation by the lateral movement mechanism 4, as shown in FIG. 2 for example, the heat dissipation member 2 is displaced in a parallel or lateral direction on the heat dissipation grease 5, so that a force is applied to the heat dissipation grease 5 in the shearing direction, and the adhesive force of the heat dissipation grease 5 is weakened. As a result, the peeling of the heat dissipation member 2 from the housing 3 or its mounting surface 3b is facilitated, deformation, breakage, etc. of the heat dissipation member 2 during this peeling are avoided, and the heat dissipation member 2 can be reused. Note that the substrate 7 shown in FIG. 2 is a substrate on which heat generating components such as FPGAs are mounted.

[0036] As the lateral movement mechanism 4, any mechanism or device (such as a lever mechanism) capable of separating the protruding portion 2c of the heat dissipation member 2 from the side wall portion 3c of the housing 3 can be used, and for example, the following can be used.

[0037] (An example of the lateral movement mechanism) FIG. 3 shows an example of the lateral movement mechanism.

[0038] The illustrated lateral movement mechanism 40 includes a through hole 41 formed in the protruding portion 20c of the heat dissipation member 20 (or its reinforcing member) and a shaft member 42.

[0039] The through hole 41 is formed in a direction parallel to the mounting surface 30b of the housing 30. The shaft member 42 is configured to be insertable into the through hole 41 and has one end portion 42a that abuts against the side wall portion 30c of the housing 30, and is configured to be able to press the side wall portion 30c by this one end portion 42a.

[0040] In the lateral movement mechanism 40 of this example, for example, by using a drive mechanism (such as a lever mechanism) fixedly provided on the protruding portion 20c of the heat dissipation member 20, the side wall portion 30c of the housing 30 is pressed by a shaft member 42 whose one end portion 42a is in contact with the side wall portion 30c of the housing 30. As a reaction, the protruding portion 20c is separated from the side wall portion 30c. As a result, the heat dissipation member 20 arranged via the heat dissipation grease 5 on the placement surface 30b of the housing 30 moves parallel in a direction away from the side wall portion 30c on the placement surface 30b. Thereby, a force in the shearing direction is applied to the heat dissipation grease 5.

[0041] (Modification example) In the lateral movement mechanism 40 of this example, in particular, the through hole 41 formed in the protruding portion 20c can have an internal thread (not shown), and correspondingly, the shaft member 42 can be configured as a bolt (symbolically shown by the head shown by a broken line in FIG. 3) having an external thread (not shown) that screws into the internal thread of the through hole 41.

[0042] Note that the internal thread of the through hole 41 in the protruding portion 20c can be directly formed on the inner peripheral surface of the through hole 41, but it can also be configured as the internal thread of a nut (such as a self-fastener) press-fitted into the through hole 41.

[0043] In the lateral movement mechanism 40 of this modification example, since a required force can be applied to the side wall portion 30c of the housing 30 simply by rotating the bolt as the shaft member 42, a large-scale drive mechanism (such as a lever mechanism) to be provided on the protruding portion 20c of the heat dissipation member 20 becomes unnecessary, and the structure becomes simple.

[0044] (Another example of the lateral movement mechanism) FIG. 4 shows another example of the lateral movement mechanism.

[0045] The illustrated lateral movement mechanism 400 includes a through hole 401 formed in the side wall portion 300c of the housing 300 and a shaft member 402.

[0046] The through hole 401 is formed in a direction parallel to the mounting surface 300b of the housing 300. The shaft member 402 is configured to be insertable into the through hole 401, and has one end 402a that abuts against the protruding portion 200c of the heat radiating member 200 (or its reinforcing member), and the protruding portion 200c can be pressed by this one end 402a.

[0047] In the lateral movement mechanism 400 of this example, for example, by using a drive mechanism (such as a lever mechanism) fixedly provided on the side wall portion 300c of the housing 300, the protruding portion 200c is pressed by the shaft member 402 whose one end 402a abuts against the protruding portion 200c of the heat radiating member 200. As a result, the protruding portion 200c separates from the side wall portion 300c. As a result, the heat radiating member 200 arranged via the heat radiating grease 5 on the mounting surface 300b of the housing 300 moves parallel in a direction away from the side wall portion 300c on the mounting surface 300b. Thereby, a force in the shearing direction is applied to the heat radiating grease 5.

[0048] (Modification example) In the lateral movement mechanism 400 of this example, in particular, the through hole 401 formed in the side wall portion 300c can have an internal thread (not shown), and correspondingly, the shaft member 402 can be configured as a bolt (symbolically shown by the head shown by the broken line in FIG. 4) having an external thread (not shown) that screws into the internal thread of the through hole 401.

[0049] Note that the internal thread of the through hole 401 in the side wall portion 300c can be directly formed on the inner peripheral surface of the through hole 401, but can also be configured as the internal thread of a nut (such as a self-fastener) press-fitted into the through hole 401.

[0050] In the lateral movement mechanism 400 of this modification example, since a required force can be applied to the protruding portion 200c of the heat radiating member 200 simply by rotating the bolt as the shaft member 402, a large-scale drive mechanism (such as a lever mechanism) to be provided on the side wall portion 300c of the housing 300 is unnecessary, and the structure is simplified.

[0051] (Another example of the heat dissipation device) In addition to the above-described lateral movement mechanism that relatively moves the heat radiating member and the housing in the horizontal direction, the heat radiating device may also include a vertical movement mechanism (not shown) that moves the heat radiating member in the vertical direction with respect to the housing in order to peel the heat radiating member from the housing after weakening the adhesive force of the heat dissipation grease 5 by this horizontal movement. For an example of this vertical movement mechanism, refer to Patent Document 1, for example.

[0052] (A specific example) FIG. 5 shows a specific example of a vapor chamber as an example of the heat radiating member 100. In the illustrated vapor chamber, the vapor chamber body 102 is reinforced by a reinforcing member 110, and a protruding portion 102c having a through hole formed by bending and standing up an extending portion is provided at the end on the left side of the drawing.

[0053] FIG. 6 is an enlarged view of the protruding portion 102c shown in FIG. 5. In this protruding portion 102c, a self-fastener 120 into which a bolt is screwed is press-fitted into the through hole.

[0054] Note that the drive mechanism of the lateral movement mechanism that separates the protruding portion of the heat radiating member and the side wall portion of the housing, particularly the drive mechanism of the shaft member that can be provided on the protruding portion of the heat radiating member or the side wall portion of the housing, and further, the above-described vertical movement mechanism can also be configured as an electric device such as a motor. In this case, the control of the electric device, particularly the control of the feeding of the shaft member by the electric device (control of the magnitude of the applied force, the moving distance, the moving speed, etc.) can also be performed by a control circuit provided inside or outside the heat radiating device.

[0055] The above-described control circuit can be configured using so-called hardware resources (information processing devices, computers), and those having the configuration illustrated in FIG. 7 can be used. For example, the hardware resource 1000 can include a processor 1001, a memory 1002, a network interface 1003, etc. that are interconnected by an internal bus 1004.

[0056] However, the configuration shown in FIG. 7 is not intended to limit the hardware configuration of the hardware resource 1000. The hardware resource 1000 may include hardware not shown (for example, an input / output interface). For the processor 1001, for example, a CPU (Central Processing Unit), an MPU (Micro Processor Unit), a GPU (Graphics Processing Unit), etc. can be used.

[0057] Also, for the memory 1002, for example, a RAM (Random Access Memory), a ROM (Read Only Memory), an HDD (Hard Disk Drive), an SSD (Solid State Drive), etc. can be used. Here, a predetermined threshold value regarding the above-mentioned predetermined physical quantity can be stored in the memory 1002, and a control program for performing the above-mentioned control can also be stored.

[0058] Furthermore, for the network interface 1003, for example, a LAN (Local Area Network) card, a network adapter, a network interface card, etc. can be used.

[0059] Furthermore, the functions of the hardware resource 1000 are realized by a processing module. The processing module is realized, for example, by the processor 1001 executing a program stored in the memory 1002. Also, the program can be downloaded via a network or updated using a storage medium storing the program. Furthermore, the above-mentioned processing module may be realized by a semiconductor chip. That is, the functions performed by the above-mentioned processing module may be realized as long as software is executed in some hardware.

[0060] Some or all of the above-described embodiments may be described as follows in the appended claims, but are not limited thereto. [Appended Claim 1] A heat dissipation member having a first surface on which a heat generating component is disposed and a planar second surface facing the first surface, and a thermally conductive housing including a base portion having a planar mounting surface on which the heat dissipation member is disposed via a heat dissipation grease on the second surface side. A heat dissipation device including the above. The heat dissipation member has a protruding portion configured to extend in a direction from the second surface toward the first surface at at least a part of one end portion thereof. The housing has a side wall portion provided so as to face the protruding portion in a state where the heat dissipation member is disposed on the mounting surface of the housing via a heat dissipation grease. The heat dissipation device includes a lateral movement mechanism that separates the protruding portion and the side wall portion in a direction parallel to the mounting surface so that the heat dissipation member disposed on the mounting surface of the housing via a heat dissipation grease moves parallel on the mounting surface. [Appendix 2] In the heat dissipation device according to Appendix 1, The lateral movement mechanism includes a through hole of the protruding portion formed in a direction parallel to the mounting surface, and a shaft member configured to be insertable into the through hole, having an end portion that abuts against the side wall portion, and configured to be able to press the side wall portion via the end portion. including. [Appendix 3] In the heat dissipation device according to Appendix 2, The through hole has a female screw; The shaft member is a bolt having a male screw that screws into the female screw. [Appendix 4] In the heat dissipation device according to Appendix 1, The lateral movement mechanism includes a through hole of the side wall portion formed in a direction parallel to the mounting surface, and a shaft member configured to be insertable into the through hole, having an end portion that abuts against the protruding portion, and configured to be able to press the protruding portion via the end portion. including. [Appendix 5] In the heat dissipation device according to Appendix 4, The through hole has a female screw; The shaft member is a bolt having a male thread that screws into the female thread. [Appendix 6] In the heat dissipation device according to Appendix 3 or 5, The female thread is the female thread of a nut press-fitted into the through hole. [Appendix 7] In the above heat dissipation device, The protruding portion is formed by bending and standing up a portion extending from at least a part of the one end portion. [Appendix 8] In the above heat dissipation device, The heat dissipation member is a plate-like member. [Appendix 9] In the above heat dissipation device, The heat dissipation member is a vapor chamber. [Appendix 10] In the above heat dissipation device, The housing has at least one cooling fin on the side facing the placement surface of the base portion. [Appendix 11] In the above heat dissipation device, The protruding portion is formed by an L-shaped member fixedly provided on at least a part of the one end portion. [Appendix 12] The above heat dissipation device includes a vertical movement mechanism that moves the heat dissipation member in the vertical direction with respect to the housing in order to separate the heat dissipation member from the housing.

[0061] Within the framework of the entire disclosure of the present invention (including the claims), further modifications and adjustments of the embodiments or examples can be made based on its basic technical idea. Also, within the framework of the entire disclosure of the present invention, various combinations, or selections (including partial deletion) of various disclosure elements (including each element of each claim, each element of each embodiment or example, each element of each drawing, etc.) are possible. That is, the present invention naturally includes all various deformations and modifications that could be made by those skilled in the art in accordance with the entire disclosure including the claims and the technical idea.

Explanation of Reference Numerals

[0062] 1 Heat dissipation device 2 Heat dissipation member 2a First surface 2b Second surface 2c Protruding portion 3 Housing 3a Base Bottom 3b Placement Surface 3c Side Wall Portion 4 Lateral Movement Mechanism 5 Heat Dissipating Grease 6 Heat Generating Component 7 Substrate 20, 200 Heat Dissipating Member 20c, 200c Protrusion 30, 300 Housing 30b, 300b Placement Surface 30c, 300c Side Wall Portion 40, 400 Lateral Movement Mechanism 41, 401 Through Hole 42, 402 Shaft Member 42a, 402a One End Portion of Shaft Member 100 Heat Dissipating Member 102 Vapor Chamber Body 102c Protrusion 110 Reinforcing Member 120 Self - Fastener 1000 Hardware Resource 1001 Processor 1002 Memory 1003 Network Interface 1004 Internal Bus

Claims

1. A heat dissipation member having a first surface on which a heat generating component is disposed and a planar second surface facing the first surface, and A thermally conductive housing having a base portion having a planar mounting surface on which the heat dissipation member is disposed via a heat dissipation grease on the second surface side. A heat dissipation device including: The heat dissipation member has a protruding portion configured to extend in a direction from the second surface toward the first surface at at least a part of one end portion thereof. The housing has a side wall portion provided so as to face the protruding portion in a state where the heat dissipation member is disposed on the mounting surface of the housing via a heat dissipation grease. The heat dissipation device includes a lateral movement mechanism that separates the protruding portion and the side wall portion in a direction parallel to the mounting surface so that the heat dissipation member disposed on the mounting surface of the housing via a heat dissipation grease moves parallel on the mounting surface. A heat dissipation device, characterized in that.

2. In the heat dissipation device according to claim 1, The lateral movement mechanism is A through hole of the protruding portion formed in a direction parallel to the mounting surface, and A shaft member configured to be insertable into the through hole, having an end portion that abuts against the side wall portion, and configured to be able to press the side wall portion via the end portion. Including A heat dissipation device, characterized in that.

3. In the heat dissipation device according to claim 2, The through hole has a female thread, The shaft member is a bolt having a male thread that screws into the female thread. A heat dissipation device, characterized in that.

4. In the heat dissipation device according to claim 1, The lateral movement mechanism is A through hole of the side wall portion formed in a direction parallel to the mounting surface, and A shaft member configured to be insertable into the through hole, having an end portion that abuts against the protruding portion, and configured to be able to press the protruding portion through the end portion including a heat dissipation device, characterized in that. **Claim 5** In the heat dissipation device according to claim 4, the through hole has a female thread, the shaft member is a bolt having a male thread that screws into the female thread a heat dissipation device, characterized in that. **Claim 6** In the heat dissipation device according to claim 3 or 5, the female thread is the female thread of a nut press-fitted into the through hole a heat dissipation device, characterized in that. **Claim 7** In the heat dissipation device according to claim 1, the protruding portion is formed by bending and standing up a portion extending from at least a part of the one end portion a heat dissipation device, characterized in that. **Claim 8** In the heat dissipation device according to claim 1, the heat dissipation member is a plate-shaped member a heat dissipation device, characterized in that. **Claim 9** In the heat dissipation device according to claim 1, the heat dissipation member is a vapor chamber a heat dissipation device, characterized in that. **Claim 10** In the heat dissipation device according to claim 1, the housing has at least one cooling fin on the side facing the placement surface of the base portion a heat dissipation device, characterized in that.

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