Inspection system, inspection method, and shell structure

Abstract

To provide a technique that enables accurate inspection of a substrate formed in a shell structure.SOLUTION: An inspection system includes a joining device that joins a substrate and a jig while bringing a conductive portion of the substrate into contact and conductive with the contact portion of the jig, and forms a shell structure with the electrode of the jig exposed, a transport module connected to the joining device and transporting the shell structure formed by the joining device, a determination unit that determines whether the joining condition of the shell structure formed by the joining device is normal or abnormal, and an inspection device connected to the transport module that inspects the substrate via the electrode of the jig of the shell structure determined to be normal by the determination unit.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to an inspection system, an inspection method, and a shell structure.

Background Art

[0002] Patent Document 1 discloses a manufacturing method of forming a shell structure by joining a contact jig (contact substrate) in order to suppress the needle pressure applied to a substrate from a probe of an inspection apparatus. The inspection apparatus of the inspection system contacts a probe with an electrode of the contact jig of the formed shell structure, transmits an electrical signal to a plurality of semiconductor devices of the substrate, and inspects the electrical characteristics of each semiconductor device.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technique capable of efficiently and accurately inspecting a substrate of a shell structure by forming the shell structure with a substrate and a jig.

Means for Solving the Problems

[0005] According to one aspect of the present disclosure, there is provided an inspection system including: a joining device that joins the substrate and the jig in a state where a conduction portion of the substrate and a contact portion of the jig are in contact and conduction, and forms a shell structure in which an electrode of the jig is exposed; a transport module connected to the joining device and transporting the shell structure formed by the joining device; a determination unit that determines whether the joining state of the shell structure formed by the joining device is normal or abnormal; and an inspection device connected to the transport module and inspecting the substrate via the electrode of the jig of the shell structure determined to be normal by the determination unit.

Advantages of the Invention

[0006] According to one aspect, a shell structure can be formed by a substrate and a jig, and the substrate of the shell structure can be inspected efficiently and accurately.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Modes for Carrying Out the Invention

[0008] Hereinafter, modes for carrying out the present disclosure will be described with reference to the drawings. In each drawing, the same components are denoted by the same reference numerals, and redundant descriptions may be omitted.

[0009] First, for the sake of facilitating the understanding of the inspection system 1 according to the present disclosure, the shell structure 100 created during inspection will be described with reference to FIGS. 1 and 2. FIG. 1 is a diagram showing the shell structure 100 according to an embodiment. FIG. 1(A) is a side cross-sectional view before the formation of the shell structure 100, and FIG. 1(B) is a side cross-sectional view after the formation of the shell structure 100. FIG. 2 is a plan view of the contact jig 110 applied to the shell structure 100.

[0010] The shell structure 100 is a structure created for the inspection of the substrate W and disassembled after the inspection of the substrate W. This shell structure 100 is formed by joining the substrate W to be inspected and the contact jig 110.

[0011] Examples of the substrate W to be inspected include a wafer in which a plurality of semiconductor devices as devices under test (DUTs) are arranged in a matrix. For example, the substrate W is formed of silicon, compound semiconductors (such as SiC, GaAs, SiC, GaN, InP, etc.). Note that the substrate W is not limited to a wafer and may also be a carrier having a semiconductor device, a glass substrate, a single chip, an electronic circuit board, or the like.

[0012] The substrate W includes a plate-shaped substrate body Wm and a plurality of conductive portions Wc. The substrate body Wm is formed in a perfect circular shape in plan view and has a plurality of semiconductor devices inside. The diameter of the substrate body Wm is set to, for example, 30 cm. The substrate body Wm has one surface Ws1 facing the contact jig 110 and the other surface Ws2 on the opposite side. Note that in FIG. 1(A), the one surface Ws1 and the other surface Ws2 are depicted as flat, but the one surface Ws1 and the other surface Ws2 may have irregularities according to each semiconductor device.

[0013] The plurality of conductive portions Wc are formed on one surface Ws1 of the substrate body Wm and are electrically conductive to appropriate semiconductor devices of the substrate body Wm. Examples of such conductive portions Wc include electrode pads of semiconductor devices and metal bumps. In FIG. 1(A), a form in which each conductive portion Wc is embedded in the substrate W is illustrated, but each conductive portion Wc may protrude from one surface Ws1 of the substrate W.

[0014] Each conductive portion Wc is formed of a metal material having conductivity such as aluminum (Al) or copper (Cu). Each conductive portion Wc is provided, for example, so as to be arranged side by side at intervals of 10 μm or less.

[0015] On the other hand, the contact jig 110 is detachably joined to the substrate W. The contact jig 110 includes a jig body 111, a plurality of contact portions 112, and a plurality of electrode pads 113.

[0016] The jig body 111 is formed in a perfect circular shape having substantially the same diameter as the substrate body Wm (see also FIG. 2) and constitutes a portion joined to the substrate body Wm. The thickness of the jig body 111 is formed to be thicker than the thickness of the substrate body Wm. The jig body 111 has a recess 111c inside an annular outer peripheral portion 111o. The recess 111c is formed on one surface 111s1 side of the jig body 111. Note that the jig body 111 may have a shape different from that of the substrate W, and may be formed, for example, in a perfect circular shape having a larger diameter than the substrate W or a polygonal shape such as a square shape.

[0017] In order to suppress displacement between the substrate W and the contact jig 110 in the temperature change of the shell structure 100, for example, a material having a coefficient of thermal expansion equivalent to that of the substrate body Wm is applied to the jig body 111. As an example, the jig body 111 can apply a contact substrate formed of the same material as the substrate body Wm. Alternatively, the jig body 111 may be constituted by a glass substrate having a coefficient of thermal expansion equivalent to that of the substrate W, or a substrate in which a semiconductor substrate and a glass substrate are laminated.

[0018] The plurality of contact portions 112 are pin-shaped members that extend linearly along the thickness direction of the jig body 111. The protruding end of each contact portion 112 contacts each conduction portion Wc by the joining of the substrate W and the contact jig 110. Therefore, each contact portion 112 is arranged at a position where it can face each conduction portion Wc of the substrate W.

[0019] Each contact portion 112 penetrates the solid portion of the jig body 111 and protrudes into the concave portion 111c. The extending length of each contact portion 112 is substantially equal to or slightly longer than the thickness of the jig body 111. Therefore, the protruding end of each contact portion 112 coincides with the opening of the concave portion 111c (one surface 111s1 of the jig body 111) or slightly protrudes from the opening. Also, each contact portion 112 can be elastically deformed as it comes into contact with each conduction portion Wc. Thereby, each contact portion 112 contacts each conduction portion Wc of the substrate W with an appropriate needle pressure (contact pressure).

[0020] The plurality of electrode pads 113 are formed on the other surface 111s2 of the jig body 111. The plurality of electrode pads 113 are set to have a larger interval than the interval between the conduction portions Wc of the substrate W and / or a larger area than the area of the conduction portions Wc. For example, the interval between each electrode pad 113 can be set to 50 μm to 500 μm. Each electrode pad 113 is formed of a metal material such as Al or Cu. The metal material of the electrode pad 113 may be plated with gold (Au) or the like.

[0021] Each electrode pad 113 is electrically connected to each contact portion 112. In FIG. 1, a form is shown in which each contact portion 112 extends linearly and each contact portion 112 and each electrode pad 113 are connected on the other surface 111s2, but the contact portion 112 may be bent or curved within the jig body 111. Thereby, even if the interval between each conduction portion Wc and the interval between each electrode pad 113 are different, each conduction portion Wc and each electrode pad 113 can be electrically conducted through each contact portion 112.

[0022] Further, the contact jig 110 insulates between the contact portions 112 adjacent to each other and between the electrode pads 113 adjacent to each other.

[0023] And, a joining portion 120 is formed on the outer peripheral portion 111o of one surface 111s1 of the contact jig 110. The outer peripheral portion 111o protrudes with respect to the bottom surface of the concave portion 111c and forms a portion that circulates annularly, and the joining portion 120 covers the entire protruding end surface of the outer peripheral portion 111o. Specifically, as will be described later, the joining portion 120 may be formed by an adhesive or may be a modified layer obtained by modifying the surface of the jig body 111.

[0024] One surface 111s1 of the contact jig 110 is joined to one surface Ws1 of the substrate W via the joining portion 120, thereby forming an internal space 101 that seals the concave portion 111c. In the internal space 101, the contact portions of the respective conduction portions Wc and the respective contact portions 112 are arranged. By joining the substrate W and the contact jig 110 in a reduced-pressure atmosphere, the internal space 101 can be maintained in a reduced-pressure atmosphere. The shell structure 100 can suppress oxidation from occurring due to exposing each conduction portion Wc to the atmosphere. Alternatively, the shell structure 100 may join the substrate W and the contact jig 110 in an inert gas atmosphere. Thereby, the shell structure 100 can maintain the internal space 101 in an inert gas atmosphere.

[0025] In addition, the contact jig 110 according to the present disclosure has a detection unit 115 that detects an index for determining the joining state between the substrate W and the contact jig 110. Examples of the index for determining the joining state include the pressure (needle pressure) applied from the contact portion 112 of the contact jig 110 to the substrate W, the internal pressure (degree of vacuum) of the sealed internal space 101, and the like. For this reason, the contact jig 110 is configured with a plurality of needle pressure sensors 116 and a space pressure sensor 117 as the detection unit 115.

[0026] Each needle pressure sensor 116 includes a sensor body 116a in the jig body 111 and a pin 116b protruding from the sensor body 116a into the recess 111c (see Fig. 1(A)). Further, the needle pressure sensor 116 has a connector 116c electrically connected to the sensor body 116a on the other surface 111s2 of the jig body 111. Each needle pressure sensor 116 configured as such can detect the pressure (needle pressure) of the pin 116b against the substrate W under the control of a needle pressure measuring instrument 52 (see Fig. 5) connected to the connector 116c.

[0027] The space pressure sensor 117 includes a detector 117a exposed in the recess 111c in the jig body 111 and a connector 117b electrically connected to the detector 117a on the other surface 111s2 of the jig body 111. Each space pressure sensor 117 configured as such can detect the pressure (internal pressure) in the internal space 101 between the substrate W and the contact jig 110 under the control of a pressure measuring instrument 53 (see Fig. 5) connected to the connector 117b.

[0028] As shown in Fig. 2, a plurality of needle pressure sensors 116 are provided near the center of the recess 111c and the outer peripheral portions 111o on the four sides of the recess 111c, with a total of five installed. By each needle pressure sensor 116 detecting the needle pressure at its respective position, the inspection system 1 can recognize the uneven load of each needle pressure sensor 116. On the other hand, one space pressure sensor 117 is provided at an intermediate position between two needle pressure sensors 116. Note that the number of needle pressure sensors 116 is not particularly limited, and for example, only one may be provided. The arrangement of each needle pressure sensor 116 and space pressure sensor 117 is also not particularly limited and may be designed arbitrarily.

[0029] The shell structure 100 formed in the inspection is basically configured as above. Hereinafter, an inspection system 1 for forming the shell structure 100 and performing an inspection will be described with reference to Fig. 3. Fig. 3 is a plan view schematically showing the overall configuration of the inspection system 1 according to the first embodiment.

[0030] 〔First Embodiment〕 The inspection system 1 according to the first embodiment has a plurality of contact jigs 110 stored therein, and while transporting the substrate W to each location in the inspection system 1, a shell structure 100 is formed and inspected, and after the inspection, the shell structure 100 is dismantled. The inspection system 1 includes a transport module 10, a reduction processing device (plasma processing device) 20, a position adjustment device 25, an adhesive application device 30, a bonding device 40, a shell structure determination device 50, an inspection device 60, a pre-peeling processing device 70, a peeling device 75, a jig cleaning device 80, and a substrate cleaning device 85. The inspection system 1 also includes a controller 90 that controls the operation of each device.

[0031] The transfer module 10 transfers the substrate W in three areas: a formation area 11 where the shell structure 100 is formed, an inspection area 12 where the substrate W is inspected, and a dismantling area 13 where the shell structure 100 is dismantled. The formation area 11, the inspection area 12, and the dismantling area 13 each extend linearly. The transfer module 10 connects the formation area 11 and the inspection area 12 perpendicularly, and also connects the inspection area 12 and the dismantling area 13 perpendicularly, so that the transfer module 10 has a substantially C-shape as a whole. Note that the formation area 11, the inspection area 12, and the dismantling area 13 are not limited to being continuous with each other, and may be provided at positions separated in part or in whole.

[0032] Each area of ​​the transport module 10 includes a floor frame 14 extending linearly and a transport device (not shown) that moves along the longitudinal direction of the floor frame 14. The floor frame 14 may be formed as a flat road surface or may have a guide rail depending on the transport mechanism of the transport device. The transport device transports the substrate W to a position facing each device by moving on the floor frame 14 while supporting the substrate W with an arm (not shown). Furthermore, the transport device loads and unloads the substrate W between each device by moving the arm back and forth at the position facing each device.

[0033] The forming area 11 is connected in order from the upstream side to the downstream side in the conveyance direction of the substrate W with a reduction treatment device 20, a position adjustment device 25, an adhesive application device 30, a bonding device 40, and a shell structure determination device 50 in order to form the shell structure 100. The forming area 11 has, for example, each device installed on both sides sandwiching the floor frame 14.

[0034] Further, the conveyance module 10 can depressurize the forming area 11 to a vacuum atmosphere, while leaving the inspection area 12 and the disassembly area 13 in the atmospheric atmosphere. Thereby, when forming the shell structure 100 in the forming area 11, the internal space 101 of the shell structure 100 can be easily made into a vacuum atmosphere. Note that the inspection system 1 may be configured to supply an inert gas such as nitrogen (N2) gas to form an inert gas atmosphere without making the forming area 11 into a vacuum atmosphere, thereby suppressing oxidation of the conduction part Wc. Also, in the inspection system 1, the area to be made into a vacuum atmosphere is not limited to the forming area 11, and for example, a vacuum atmosphere may be formed over the forming area 11, the inspection area 12, and the disassembly area 13.

[0035] The forming area 11 of the conveyance module 10 forms a space sealed from the outside, and includes a load lock module 15 at each of the entrance and the exit of the forming area 11. For example, the conveyance module 10 forms a space sealed over the entire length of the forming area 11 by side panels and ceiling panels covering the floor frame 14. When the load lock module 15 on the entrance side accommodates the substrate W conveyed from the outside, it depressurizes from the atmospheric atmosphere to the vacuum atmosphere, and then the substrate W is taken out by the conveyance device inside the forming area 11. When the load lock module 15 on the exit side accommodates the substrate W (shell structure 100) by the conveyance device inside the forming area 11, it pressurizes from the vacuum atmosphere to the atmospheric atmosphere, and then the substrate W is taken out by the conveyance device inside the inspection area 12.

[0036] On the other hand, only the inspection device 60 is connected to the inspection area 12. The transfer device in the inspection area 12 carries the shell structure 100 formed in the forming area 11 into the inspection device 60, and after the inspection in the inspection device 60, the shell structure 100 is transferred to the disassembly area 13.

[0037] In order to disassemble the shell structure 100, the disassembly area 13 is connected in order from the upstream side to the downstream side in the conveyance direction of the substrate W to the peeling pretreatment device 70, the peeling device 75, the jig cleaning device 80, and the substrate cleaning device 85. On the upstream side of the disassembly area 13 (or the downstream side or the upstream side of the inspection area 12), a buffer unit 16 for temporarily placing the shell structure 100 in the inspection area 12 is provided. In the disassembly area 13 as well, for example, each device is installed on both sides sandwiching the floor frame 14.

[0038] The reduction treatment device 20 installed in the forming area 11 plasma-treats the substrate W before forming the shell structure 100 to remove the oxide film formed on the surface of the conduction part Wc of the substrate W. For this reason, the substrate W with one surface Ws1 facing upward (facing the upper side in the vertical direction) is carried into the reduction treatment device 20. As the reduction treatment device 20, a well-known device can be applied. For example, by supplying an etching gas to generate plasma, the surface of the conduction part Wc formed of aluminum is etched. Needless to say, the type of the etching gas can be appropriately selected according to the material of the conduction part Wc. For example, a hydrogen-containing gas, a chlorine-containing gas, etc. can be applied. Preferably, as the etching gas, hydrogen gas that does not require decontamination and does not corrode the device may be applied. After the oxide film of the substrate W is removed, in order to move in the vacuum atmosphere of the forming area 11, re-oxidation is suppressed, and the shell structure 100 is formed.

[0039] The position adjustment device 25 is configured such that the substrate W with the oxide film removed is carried into it by the conveyance module 10. It detects the positional deviation and the circumferential orientation (posture) of the substrate W, and in cooperation with the conveyance device in the formation region 11, adjusts the positional deviation and posture of the substrate W. Further, the position adjustment device 25 reverses the substrate W with one surface Ws1 facing upward so that one surface Ws1 faces downward in order to join the substrate W and the contact jig 110 with the joining device 40. The conveyance device in the formation region 11 carries out the substrate W with one surface Ws1 facing downward and conveys it to the joining device 40.

[0040] The adhesive application device 30 is configured such that the contact jig 110 is conveyed by the conveyance device in the formation region 11, and an adhesive is applied to the surface of the outer peripheral portion 111o of the contact jig 110 to form the joint portion 120 (see FIG. 1(A)). In the embodiment, a UV curable resin is applied as the adhesive. The adhesive application device 30 has, for example, a nozzle (not shown) for applying the adhesive, and forms the joint portion 120 over the entire circumference in the circumferential direction of the protruding end surface of the outer peripheral portion 111o. The conveyance device in the formation region 11 carries out the contact jig 110 with the joint portion 120 formed thereon and conveys it to the joining device 40.

[0041] FIG. 4 is a side cross-sectional view schematically showing the joining device 40 of the inspection system 1. As shown in FIG. 4, the joining device 40 joins the substrate W and the contact jig 110 inside the processing container 41. The joining device 40 includes an upper chuck 42 for holding the substrate W, a lower chuck 43 for holding the contact jig 110, and a UV irradiation device 44 inside the processing container 41.

[0042] The upper chuck 42 holds the other surface Ws2 of the substrate W from above with one surface Ws1 of the substrate W facing downward. The upper chuck 42 is displaced vertically at a set position by a lifting mechanism (not shown). The lower surface of the upper chuck 42 is a suction surface 42a capable of sucking the substrate W. A plurality of suction tubes are connected to the suction surface 42a, and a suction pressure for vacuum-sucking the substrate W is applied through the suction tubes. Note that the upper chuck 42 may be an electrostatic chuck for electrostatically sucking the substrate W.

[0043] Further, the upper chuck 42 is provided with a plurality of holding pins (not shown) that move up and down in the vertical direction by a driving unit (not shown) and vacuum-adsorb the substrate W. Each holding pin protrudes from the adsorption surface 42a of the upper chuck 42 and adsorbs the substrate W disposed at the substrate transfer position by the transfer device. Then, the upper chuck 42 horizontally vacuum-adsorbs the substrate W on the adsorption surface 42a by raising each holding pin.

[0044] The lower chuck 43 holds one surface 111s1 of the contact jig 110 upward and the other surface 111s2 of the contact jig 110 from below. The lower chuck 43 is supported by a moving mechanism (not shown) that moves horizontally and vertically relative to the upper chuck 42. The moving mechanism of the lower chuck 43 conveys the contact jig 110 between the jig transfer position and the bonding position facing the upper chuck 42.

[0045] The lower chuck 43 is provided with a plurality of lift pins (not shown) that move up and down in the vertical direction. Each lift pin rises with respect to the contact jig 110 carried into the jig transfer position by the transfer device and receives the contact jig 110. The lower chuck 43 horizontally vacuum-adsorbs the contact jig 110 on the adsorption surface 43a by lowering each lift pin. Note that the lower chuck 43 may also apply an electrostatic chuck that electrostatically adsorbs the contact jig 110.

[0046] The bonding device 40 images the lower chuck 43 and the contact jig 110 with the upper camera 45 provided on the upper chuck 42, and images the upper chuck 42 and the substrate W with the lower camera 46 provided on the lower chuck 43. Then, the bonding device 40 aligns the reference point of the substrate W and the reference point of the contact jig 110 using the imaging information of the upper camera 45 and the imaging information of the lower camera 46, and adjusts the horizontal positions of the substrate W and the contact jig 110. Note that the bonding device 40 may place a bridge mechanism including the upper camera 45 and the lower camera 46 between the upper chuck 42 and the lower chuck 43 to image the substrate W and the contact jig 110.

[0047] Furthermore, the bonding device 40 raises the lower chuck 43 by the moving mechanism of the lower chuck 43, and brings the bonding portion 120 on the outer peripheral portion of the contact jig 110 into contact with the outer peripheral portion of the substrate W. As a result, the substrate W and the contact jig 110 are integrated in the Z-axis direction. Note that the bonding device 40 may lower the upper chuck 42, or may move both the upper chuck 42 and the lower chuck 43.

[0048] The UV irradiation device 44 irradiates UV light when bonding the substrate W and the contact jig 110 (for example, after the outer peripheral portion of the substrate W comes into contact with the contact jig 110). A plurality of UV irradiation devices 44 are provided along the circumferential direction on the sides of the upper chuck 42 and the lower chuck 43, and irradiate UV light from the entire circumferential direction. Alternatively, the UV irradiation device 44 may be configured to irradiate UV light while one or a plurality of devices move along the circumferential direction. The bonding portion 120 between the substrate W and the contact jig 110 is cured by receiving the UV light of the UV irradiation device 44, and bonds the substrate W and the contact jig 110.

[0049] By operating as described above, the bonding device 40 creates the shell structure 100 in which the substrate W and the contact jig 110 are bonded in a vacuum atmosphere (or an inert gas atmosphere). The shell structure 100 makes the conduction portion Wc non-exposed while exposing the electrode pads 113 of the contact jig 110, enabling inspection of the semiconductor device on the substrate W via the electrode pads 113. The inspection system 1 transports the shell structure 100 formed by the bonding device 40 to the shell structure determination device 50 by the transport device in the formation region 11, and determines the bonding state of the shell structure 100.

[0050] FIG. 5 is a side cross-sectional view schematically showing the shell structure determination device 50. As shown in FIG. 5, the shell structure determination device 50 includes a housing container 51 that houses the shell structure 100 (contact jig 110), a needle pressure measuring device 52, a pressure measuring device 53, and a determination unit 54.

[0051] The needle pressure measuring device 52 is connected to the connector 116c of each needle pressure sensor 116 of the shell structure 100 carried into the storage container 51. The needle pressure measuring device 52 measures the needle pressure of each needle pressure sensor 116 of the shell structure 100 by operating each needle pressure sensor 116 via the connector 116c, and transmits the measurement information to the determination unit 54.

[0052] The pressure measuring device 53 is connected to the connector 117b of the space pressure sensor 117 of the shell structure 100 carried into the storage container 51. The pressure measuring device 53 measures the space pressure by the space pressure sensor 117 of the shell structure 100 by operating each needle pressure sensor 116 via the connector 116c, and transmits the measurement information to the determination unit 54.

[0053] The determination unit 54 determines the joining state of the shell structure 100 based on the measurement information of the needle pressure measuring device 52 and the measurement information of the pressure measuring device 53. The determination unit 54 may be provided in the controller 90 instead of being provided in the shell structure determination device 50.

[0054] For example, the determination unit 54 preliminarily holds a needle pressure allowable range for comparing the needle pressure of the shell structure 100 and a space pressure allowable range for comparing the space pressure of the shell structure 100. The determination unit 54 compares the measurement information of each needle pressure with the needle pressure allowable range, and determines an abnormality in the joining state when each needle pressure is outside the needle pressure allowable range, and determines the normality of the joining state when each needle pressure is within the needle pressure allowable range. Alternatively, the determination unit 54 may be configured to calculate the difference (uneven load) between the minimum value and the maximum value of each needle pressure, determine an abnormality in the joining state when the difference exceeds the threshold value, and determine the normality of the joining state when the difference is equal to or less than the threshold value. Further, the determination unit 54 compares the measurement information of the space pressure with the space pressure allowable range, and determines an abnormality in the joining state when the space pressure is outside the space pressure allowable range, and determines the normality of the joining state when the space pressure is within the space pressure allowable range.

[0055] When the inspection system 1 determines an abnormality in the joined state of the shell structure 100, it disassembles the shell structure 100 and reforms the shell structure 100 without performing an inspection by the inspection device 60. Thereby, the inspection system 1 can avoid an abnormality in the electrical characteristics of the substrate W that occurs due to the abnormality in the joined state and stably inspect the substrate W.

[0056] Returning to FIG. 3, the inspection area 12 of the inspection system 1 conveys the shell structure 100 formed in the formation area 11 and inspects the substrate W of the shell structure 100 by the inspection device 60 installed in the inspection area 12.

[0057] As the inspection device 60, for example, a device including a tester (not shown) and a probe card (not shown) held by the tester is applied. The probe card has a plurality of probes (not shown) that can contact each electrode pad 113 where the shell structure 100 is exposed. The tester transmits an electrical signal to the conduction part Wc of the substrate W through the probes of the probe card, each electrode pad 113 of the shell structure 100, and each contact part 112, and receives a response signal from the substrate W, thereby inspecting the electrical characteristics of the semiconductor device of the substrate W. After the inspection by the inspection device 60, the shell structure 100 is conveyed to the disassembly area 13 by the conveying device in the inspection area 12.

[0058] When the shell structure 100 is conveyed by the conveying device in the disassembly area 13, the pre-disassembly treatment device 70 in the disassembly area 13 performs a pre-treatment on the shell structure 100. For example, as the pre-disassembly treatment device 70, a hot plate device that heats the shell structure 100 to a target temperature is applied. This target temperature is a temperature at which the adhesive force of the adhesive (UV curable resin) at the joint 120 can be reduced. Thereby, the joint 120 joining the substrate W and the contact jig 110 of the shell structure 100 is in a state where it can be easily peeled off.

[0059] The peeling device 75 in the disassembling area 13 peels the substrate W and the contact jig 110 as the shell structure 100 of the peeling pretreatment device 70 is conveyed by the conveying device in the disassembling area 13. For this peeling device 75, for example, a device that makes a blade enter the joint portion 120 from the side of the shell structure 100 and pulls up the substrate W upward with respect to the contact jig 110 is applied. Thereby, the substrate W and the contact jig 110 are smoothly peeled off.

[0060] The jig cleaning device 80 in the disassembling area 13 conveys the contact jig 110 peeled by the peeling device 75 and performs a process of removing the adhesive (joint portion 120) adhering to the contact jig 110. After the adhesive of this contact jig 110 is removed, the inspection system 1 can reuse the contact jig 110 for inspecting the substrate W by conveying the contact jig 110 to the adhesive application device 30. Note that the inspection system 1 may have a storage module for storing a plurality of contact jigs 110, store the contact jig 110 of the jig cleaning device 80 in the storage module, and convey the contact jig 110 from the storage module to the adhesive application device 30.

[0061] The substrate cleaning device 85 in the disassembling area 13 conveys the substrate W peeled by the peeling device 75 and performs a process of removing the adhesive (joint portion 120) adhering to the substrate W. After the adhesive of this substrate W is removed, the inspection system 1 conveys the substrate W to the downstream end of the disassembling area 13, thereby carrying out the substrate W from the transfer module 10 and accommodating the substrate W in a carrier such as a FOUP.

[0062] The controller 90 of the inspection system 1 is implemented by a computer including a processor, a memory, an input / output interface, a communication interface, etc., which are not shown in the figure. The processor is a combination of one or more of a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), a circuit composed of a plurality of discrete semiconductors, etc., and executes a program stored in the memory. The memory includes a main storage device composed of a semiconductor memory, etc., and an auxiliary storage device composed of a disk, a drive, a semiconductor memory (flash memory), etc.

[0063] The controller 90 of the inspection system 1 controls the operation of the transfer module 10 and each device, sequentially transfers a plurality of substrates W to form a shell structure 100, and controls the inspection device 60 to sequentially inspect the substrates W of the shell structure 100. Further, the controller 90 controls to sequentially peel the inspected shell structure 100 from the substrate W and the contact jig 110, and carry out the substrate W.

[0064] The inspection system 1 according to the embodiment is basically configured as described above, and its operation (inspection method) will be described below with reference to FIG. 6. FIG. 6 is a flowchart showing the inspection method according to the embodiment.

[0065] In the inspection method of the substrate W, the inspection system 1 executes the processing flow of steps S101 to S110 shown in FIG. 6 under the control of the controller 90.

[0066] First, the inspection system 1 transfers the substrate W to the reduction processing device 20 by the transfer module 10, and the reduction processing device 20 removes the oxide film of the conduction part Wc of the substrate W (step S101).

[0067] The inspection system 1 then conveys the substrate W from the reduction processing apparatus 20 to the position adjustment apparatus 25 by the conveyance module 10, aligns the position of the substrate W in the position adjustment apparatus 25, and inverts the substrate W (step S102). As a result, the substrate W is in a state where one surface Ws1 faces downward in the vertical direction.

[0068] Then, the inspection system 1 conveys the substrate W from the position adjustment apparatus 25 to the bonding apparatus 40 by the conveyance module 10, and bonds the substrate W and the contact jig 110 in the bonding apparatus 40 to form the shell structure 100 (step S103: the process of (A)). The contact jig 110 has an adhesive applied thereto in the adhesive application apparatus 30 in parallel with (or before) step S101 and step S102, and is conveyed to the bonding apparatus 40. As a result, in the bonding apparatus 40, the shell structure 100 in which the substrate W and the contact jig 110 are firmly bonded via the bonding portion 120 can be obtained.

[0069] After manufacturing the shell structure 100, the inspection system 1 conveys the shell structure 100 from the bonding apparatus 40 to the shell structure determination apparatus 50, and determines whether the bonding state of the shell structure 100 is normal (step S104: the process of (B)). Whether the shell structure 100 is normal or abnormal is determined by the determination unit 54 based on the detection information of the detection unit 115 of the shell structure 100 as described above. When the bonding state of the shell structure 100 is normal (step S104: YES), the inspection system 1 proceeds to step S105, while when the bonding state of the shell structure 100 is abnormal (step S104: NO), the inspection system 1 proceeds to step S109.

[0070] In step S105, the inspection system 1 conveys the shell structure 100 from the shell structure determination device 50 to the inspection device 60 by the conveyance module 10, and inspects the electrical characteristics of the substrate W through the shell structure 100 in the inspection device 60 ((C) process). During this inspection, while the inspection device 60 applies a large needle pressure from each probe to the electrode pad 113 of the shell structure 100, a weak needle pressure is applied to the conduction part Wc of the substrate W by the contact part 112. Therefore, the inspection device 60 can suppress damage to the conduction part Wc and inspect the substrate W favorably.

[0071] After the inspection of the substrate W, the inspection system 1 conveys the shell structure 100 from the inspection device 60 to the pre - peeling treatment device 70 by the conveyance module 10, and heats the shell structure 100 in the pre - peeling treatment device 70 to reduce the adhesive force of the adhesive (step S106).

[0072] Next, the inspection system 1 conveys the shell structure 100 from the pre - peeling treatment device 70 to the peeling device 75 by the conveyance module 10, and peels the shell structure 100 from the substrate W and the contact jig 110 in the peeling device 75 (step S107). The contact jig 110 peeled by this peeling device 75 is conveyed to the jig cleaning device 80 by the conveyance module 10, the adhesive is removed, and then it is conveyed again to the adhesive application device 30 by the conveyance module 10.

[0073] On the other hand, the inspection system 1 conveys the substrate W peeled by the peeling device 75 to the substrate cleaning device 85 by the conveyance module 10, and removes the adhesive by cleaning the substrate W in the substrate cleaning device 85 (step S108). As a result, the substrate W returns to the state before being carried into the inspection system 1 and is recovered as the substrate W after inspection.

[0074] Also, in step S104 of the inspection method, when an abnormality in the bonding state of the shell structure 100 is determined, the inspection system 1 proceeds to the process of disassembling the shell structure 100 without performing the inspection. For this reason, the inspection system 1 conveys the shell structure 100 from the shell structure determination device 50 to the pre-stripping treatment device 70 by the conveyance module 10, and heats the shell structure 100 in the pre-stripping treatment device 70 to reduce the adhesive strength of the adhesive (step S109).

[0075] Furthermore, the inspection system 1 conveys the shell structure 100 from the pre-stripping treatment device 70 to the stripping device 75 by the conveyance module 10, and strips the shell structure 100 from the substrate W and the contact jig 110 in the stripping device 75 (step S110: the process of (D)). The contact jig 110 stripped by this stripping device 75 is conveyed to the adhesive application device 30 after the adhesive is removed by the jig cleaning device 80, and the adhesive is applied. Also, the substrate W stripped by the stripping device 75 is conveyed to the bonding device 40 after the adhesive is removed by the substrate cleaning device 85. Thereby, the inspection system 1 can perform the bonding between the substrate W and the contact jig 110 (step S104) again in the bonding device 40, and can repeat the above-described processing flow.

[0076] As described above, the inspection method can stably perform the inspection of the substrate W while suppressing damage to the substrate W by forming the shell structure 100 in which the substrate W and the contact jig 110 are bonded. In particular, the inspection method can improve the throughput of the entire inspection by determining the bonding state of the shell structure 100 and not performing the inspection when an abnormality occurs in the bonding state of the shell structure 100.

[0077] Note that the inspection system 1 and the inspection method of the present disclosure are not limited to the above-described embodiment, and various modifications can be made. For example, the inspection device 60 of the inspection system 1 is not limited to a device that inspects the shell structures 100 (substrates W) one by one, and may be a device provided with multiple (a plurality of) inspection units that accommodate and inspect a plurality of shell structures 100.

[0078] Further, the function of determining the bonding state of the shell structure 100 is not limited to the shell structure determination device 50. For example, the contact jig 110 may apply a detection unit 115 having a wireless communication function and transmit the detection information of the detection unit to the controller 90 by wireless communication. The controller 90 can determine whether the bonding state of the shell structure 100 is normal or abnormal based on the received detection information.

[0079] 〔Second Embodiment〕 FIG. 7 is a plan view schematically showing the overall configuration of the inspection system 1A according to the second embodiment. The inspection system 1A according to the second embodiment is different from the inspection system 1 according to the first embodiment in that, without applying an adhesive as the joint portion 120 of the shell structure 100, the surface of the outer peripheral portion 111o of the contact jig 110 is activated and joined to the substrate W at room temperature. For this reason, the inspection system 1A includes a surface activation device 35 instead of the adhesive application device 30 and is configured not to include a peeling pretreatment device 70 (see FIG. 3). The transport module 10, reduction treatment device 20, position adjustment device 25, joining device 40, shell structure determination device 50, inspection device 60, peeling device 75, jig cleaning device 80, and substrate cleaning device 85 of the inspection system 1A are the same as those of the above-described inspection system 1. Therefore, detailed descriptions of these devices are omitted.

[0080] The surface activation device 35 of the inspection system 1A performs, for example, a modification process of cutting the bond of SiO2 on the surface of the contact jig 110 to form unbonded hands of Si, and further performs a hydrophilic treatment on one surface 111s1 of the contact jig 110. In the modification process, for example, oxygen gas is plasmaized in a reduced-pressure atmosphere to supply oxygen ions, thereby modifying one surface 111s1. In the hydrophilic treatment, for example, pure water is supplied to the modified one surface 111s1 to attach OH groups to the unbonded hands of Si. Thereby, the surface of the outer peripheral portion 111o of the contact jig 110 is activated. Note that the surface modification is not limited to being performed only on the contact jig 110 and may be performed on one surface Ws1 of the substrate W.

[0081] The bonding device 40 can form a shell structure 100 having a bonding portion 120 in which the substrate W and the contact jig 110 are firmly bonded by facing and bonding one surface Ws1 of the substrate W and one surface Ws1 of the surface-modified contact jig 110. Therefore, similar to the first embodiment, the inspection device 60 can satisfactorily inspect the electrical characteristics of the substrate W of the shell structure 100.

[0082] The shell structure 100 is conveyed to the peeling device 75 in the disassembly region 13 and is peeled by the peeling device 75 from the substrate W and the contact jig 110. The peeling device 75 can easily peel the two by causing a blade (not shown) to enter between the substrate W that is bonded at room temperature rather than by hydrophilic treatment and the contact jig 110.

[0083] As described above, even in the inspection system 1A according to the second embodiment, the shell structure 100 of the substrate W and the contact jig 110 can be easily formed, and the substrate W of the shell structure 100 can be inspected. In particular, the inspection system 1A can eliminate the application of the adhesive and make it easier to flatten the bonding surface, and can bond the substrate W and the contact jig 110 with high accuracy.

[0084] Further, the contact portion 112 of the contact jig 110 constituting the shell structure 100 is not limited to a pin shape that linearly protrudes within the concave portion 111c as shown in FIG. 1, and the contact portion 112 may be constituted by a cantilever or a double-cantilever structure. Hereinafter, this configuration will be described with reference to FIGS. 8(A) and 8(B).

[0085] FIG. 8(A) is an enlarged cross-sectional view showing the contact portion 112A of the contact jig 110A according to the first modification. The contact portion 112A of the contact jig 110A according to the first modification has a crank-shaped L-shaped pin 118 that contacts the conduction portion Wc of the substrate W and a support body 119A that supports the L-shaped pin 118. The support body 119A is formed in an L-shape that protrudes short from the bottom of the contact jig 110 and bends at an intermediate position, and is a cantilever that supports the L-shaped pin 118 on the side surface and the upper surface.

[0086] This support 119A elastically supports the contact with the conduction part Wc by the L-shaped pin 118. When a differential pressure is applied from the other surface Ws2 of the substrate W and the other surface 111s2 of the contact jig 110 to the space where the recess 111c is sealed, the support 119A can be appropriately deformed to maintain the contact state between the L-shaped pin 118 and the conduction part Wc. Note that the contact jig 110A may include another columnar support 119C (see the dotted line in FIG. 8(A)) that receives the load when the differential pressure is large.

[0087] FIG. 8(B) is a cross-sectional view showing an enlarged contact part 112B of the contact jig 110B according to the second modification. The contact part 112B of the contact jig 110B according to the second modification has a crank-shaped L-shaped pin 118 that contacts the conduction part Wc of the substrate W and a support 119B that supports the L-shaped pin 118. The support 119B is formed in a C shape with both ends connected to the bottom of the contact jig 110 while the middle is separated, and is a cantilever beam that supports the L-shaped pin 118 on the side surface and the upper surface.

[0088] Even with this support 119B, when a differential pressure is applied from the other surface Ws2 of the substrate W and the other surface 111s2 of the contact jig 110 to the space where the recess 111c is sealed, it can be appropriately deformed to maintain the contact state between the L-shaped pin 118 and the conduction part Wc. Note that the contact jig 110B may also include another columnar support 119C (see the dotted line in FIG. 8(B)) that receives the load when the differential pressure is large.

[0089] The technical idea and effects of the present disclosure described in the above embodiments will be described below.

[0090] The inspection systems 1 and 1A according to the first aspect of the present disclosure include a bonding device 40 that bonds the substrate W and the jig (contact jig 110) in a state where the conductive portion Wc of the substrate W and the contact portion 112 of the jig are in contact and electrically connected, and forms a shell structure 100 in which the electrodes (electrode pads 113) of the jig are exposed; a transfer module 10 connected to the bonding device 40 and configured to transfer the shell structure 100 formed by the bonding device 40; a determination unit 54 configured to determine whether the bonding state of the shell structure 100 formed by the bonding device 40 is normal or abnormal; and an inspection device 60 connected to the transfer module 10 and configured to inspect the substrate W via the electrodes of the jig of the shell structure 100 determined to be normal by the determination unit 54.

[0091] According to the above, the inspection systems 1 and 1A can inspect the substrate W while protecting the substrate W by inspecting the substrate W by the inspection device 60 after forming the shell structure 100 by the bonding device 40. In particular, the inspection systems 1 and 1A determine the bonding state of the shell structure 100 formed by the bonding device 40 by the determination unit 54, and inspect the normal shell structure 100 by the inspection device 60. Therefore, the inspection systems 1 and 1A can prevent inspection abnormalities from occurring by inspecting the substrate W of the abnormal shell structure 100, and thus can improve the inspection yield. In addition, it is not necessary to inspect the abnormal shell structure 100, and it is possible to improve the throughput of the entire inspection.

[0092] Further, the transfer module 10 includes a forming area 11 having the bonding device 40, an inspection area 12 having the inspection device 60, and a disassembling area 13 for separating the substrate W of the shell structure 100 and the jig (contact jig 110). The jig separated in the disassembling area 13 is transferred to the forming area 11 and reused. Thereby, the inspection systems 1 and 1A can suppress the number of jigs used for inspection, repeat the inspection of a plurality of substrates W, and reduce the cost of inspection.

[0093] In addition, the transfer module 10 forms a sealed space at least for the formation region 11, and makes the sealed space a vacuum atmosphere or supplies an inert gas to the sealed space. As a result, the inspection systems 1 and 1A can perform bonding with the jig (contact jig 110) while suppressing oxidation of the conduction part Wc of the substrate W, and can seal the conduction part Wc.

[0094] Further, when the determination unit 54 determines an abnormality of the shell structure 100, without performing an inspection by the inspection device 60, the substrate W and the jig (contact jig 110) are peeled off in the disassembly region 13, and the peeled substrate W and the jig are transferred to the formation region 11, and the shell structure 100 is formed again in the formation region 11. As a result, the inspection systems 1 and 1A can form the shell structure 100 again and perform an inspection on the shell structure 100 in which an abnormality in the bonding state has occurred.

[0095] In addition, the disassembly region 13 has a jig cleaning device 80 that cleans the jig (contact jig 110) after peeling. As a result, the inspection systems 1 and 1A can satisfactorily bond the substrate W and the jig even when the jig is reused.

[0096] In addition, the shell structure 100 accommodates a portion where the conduction part Wc and the contact part 112 come into contact with each other, has a sealed internal space 101, and an inspection part 115 that detects an index of the bonding state for determination by the determination part 54 is installed in the internal space 101. As a result, the inspection systems 1 and 1A can easily obtain an index of the bonding state of the shell structure 100 by the detection part 115.

[0097] In addition, the detection part 115 includes a needle pressure sensor 116 that detects the needle pressure applied by the contact part 112 of the jig (contact jig 110) to the substrate W. The inspection systems 1 and 1A can estimate the needle pressure applied to the conduction part Wc by using the detection information of the needle pressure sensor 116, and can determine whether the bonding state is normal or abnormal.

[0098] Further, the detection unit 115 includes a pressure sensor (space pressure sensor 117) that detects the internal pressure of the internal space 101. Thereby, the inspection systems 1 and 1A can estimate the degree of vacuum in the internal space 101 by using the detection information of the space pressure sensor 117, and can determine whether the joining state is normal or abnormal.

[0099] Further, a shell structure determination device 50 that is connected to the detection unit 115 and determines whether the joining state of the shell structure 100 is normal or abnormal is provided between the joining device 40 and the inspection device 60. Thereby, the inspection systems 1 and 1A can determine the joining state of the shell structure 100 formed by the joining device 40 in the shell structure determination device 50 before transporting it to the inspection device 60.

[0100] Further, the jig (contact jig 110) has supports 119A to 119C that elastically support contact portions 112A and 112B that contact the conduction portion Wc in the shell structure 100. Thereby, even when a differential pressure is generated between the internal space 101 and the outside of the substrate W and the jig, the supports 119A to 119C can elastically support the contact portions 112A and 112B to achieve contact with the conduction portion Wc and reduction of the needle pressure.

[0101] Further, a second aspect of the present disclosure is an inspection method for inspecting the electrical characteristics of a substrate W, including: (A) a step of joining the substrate W and the jig in a state where the conduction portion Wc of the substrate W and the contact portion 112 of the jig (contact jig 110) are in contact and conduction, and forming a shell structure 100 in which the electrode (electrode pad 113) of the jig is exposed; (B) a step of determining whether the joining state of the shell structure 100 is normal or abnormal after the step of (A); and (C) a step of inspecting the substrate W through the electrode of the jig of the shell structure 100 determined to have a normal joining state in the step of (B). Even in this case, the inspection method can accurately inspect the substrate W formed in the shell structure 100.

[0102] Further, the inspection method includes a step of separating the substrate W of the shell structure 100 and the jig (contact jig 110) whose joint state is determined to be abnormal in the steps (D) and (B). For the substrate W separated in the step (D), the steps (A) and (B) are performed, and further the step (C) or the step (D) is performed. Thereby, after separating the substrate W of the shell structure 100 for which an abnormality has been determined from the contact jig 110, the inspection method can form the shell structure 100 again and perform inspections and the like.

[0103] Further, a third aspect of the present disclosure is a shell structure 100 formed by joining a substrate W and a jig (contact jig 110). The substrate W has a conduction part Wc. The jig includes a contact part 112 that contacts and touches the conduction part Wc in a recess 111c on one surface 111s1 facing the conduction part Wc, a joining part 120 that joins to the substrate W outside the recess 111c on the one surface 111s1, and an electrode (electrode pad 113) that is electrically conductive with the contact part 112 on the other surface 111s2 opposite to the one surface 111s1. A detection part 115 capable of detecting an index of the joint state between the substrate W and the jig is provided in the recess 111c. Even in this case, the shell structure 100 can recognize the normality or abnormality of the joint state through the detection part 115, and it becomes possible to improve the accuracy of inspecting the substrate W.

[0104] The inspection systems 1 and 1A, the inspection method, and the shell structure 100 according to the embodiments disclosed this time are all illustrative and not restrictive in all respects. The embodiments can be modified and improved in various forms without departing from the scope and gist of the appended claims. The matters described in the above plurality of embodiments can also adopt other configurations and can be combined within a non - conflicting range.

Explanation of Reference Numerals

[0105] 1, 1A Inspection systems 10 Conveying module 40 Joining device 54 Determination part 60 Inspection device 100 Shell structure 110 Contact jig 112 Contact part 113 Electrode pad W substrate Wc Conductive part

Claims

1. A bonding apparatus that bonds the substrate and the jig in a state where the conductive portion of the substrate and the contact portion of the jig are in contact and electrically connected, and forms a shell structure in which the electrodes of the jig are exposed; A transfer module connected to the bonding apparatus and configured to transfer the shell structure formed by the bonding apparatus; A determination unit configured to determine whether the bonding state of the shell structure formed by the bonding apparatus is normal or abnormal; An inspection apparatus connected to the transfer module and configured to inspect the substrate through the electrodes of the jig of the shell structure determined to be normal by the determination unit; and An inspection system.

2. The transfer module includes a formation area having the bonding apparatus, an inspection area having the inspection apparatus, and a disassembly area for peeling the substrate and the jig of the shell structure, and transports the jig peeled in the disassembly area to the formation area to reuse the jig. The inspection system according to claim 1.

3. The transfer module forms a sealed space at least for the formation area, and makes the sealed space a vacuum atmosphere or supplies an inert gas to the sealed space. The inspection system according to claim 2.

4. When the determination unit determines an abnormality in the shell structure, the substrate and the jig are peeled in the disassembly area without performing an inspection by the inspection apparatus, and the peeled substrate and jig are transported to the formation area to reform the shell structure in the formation area. The inspection system according to claim 2.

5. The disassembly area includes a jig cleaning device for cleaning the jig after peeling. The inspection system according to claim 2.

6. The shell structure houses the portion where the conduction part and the contact part come into contact, has a sealed internal space, and has a detection part installed in the internal space for detecting an index of the joined state for determination by the determination part. The inspection system according to any one of claims 1 to 5.

7. The detection part includes a needle pressure sensor that detects the needle pressure applied by the contact part of the jig to the substrate. The inspection system according to claim 6.

8. The detection part includes a pressure sensor that detects the internal pressure of the internal space. The inspection system according to claim 6.

9. A shell structure determination device that is connected to the detection part and determines whether the joined state of the shell structure is normal or abnormal is provided between the joining device and the inspection device. The inspection system according to claim 6.

10. The jig has a support body that elastically supports the contact part that contacts the conduction part in the shell structure. The inspection system according to any one of claims 1 to 5.

11. An inspection method for inspecting the electrical characteristics of a substrate, comprising: (A) A step of joining the substrate and the jig in a state where the conduction part of the substrate and the contact part of the jig are in contact and conducting, and forming a shell structure in which the electrodes of the jig are exposed; (B) A step of determining whether the joined state of the shell structure is normal or abnormal after the step (A); (C) A step of inspecting the substrate through the electrodes of the jig of the shell structure determined to have a normal joined state in the step (B). Inspection method.

12. (D) a step of separating the substrate and the jig of the shell structure determined to have an abnormal joining state in the step (B); The steps (A) and (B) are performed on the substrate separated by the step (D), and further the step (C) or the step (D) is performed. The inspection method according to claim 11.

13. A shell structure formed by joining a substrate and a jig, The substrate has a conduction part, The jig is a contact part that contacts and conducts with the conduction part in a recess on one surface facing the conduction part; a joining part that joins to the substrate outside the recess on the one surface; and an electrode that is electrically conductive with the contact part on the other surface opposite to the one surface. A detection part capable of detecting an index of the joining state between the substrate and the jig is provided in the recess. Shell structure.

Images