Retaining jig, manufacturing method for plate-like glass member using retaining jig, and sputtering device with retaining jig

Abstract

To provide a retaining jig that makes it easy to put a glass member in and out when retaining the glass member and can suppress the glass member from moving.SOLUTION: There is provided a retaining jig 101 that retains a substrate Ga which is a plate-like glass member in an upright state in in-line conveyance of the substrate Ga, and comprises an upper retaining member 111 which retains an upper part of the substrate Ga and a lower retaining member 112 which retains a lower part of the substrate Ga, wherein the upper retaining member 111 has a press member 121 which can swing in a front-rear direction and a block 122 which is arranged behind the press member 121, and retains the substrate Ga between the press member 121 and a block 122 when retaining the upper part of the substrate Ga.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a holding jig for holding a plate-shaped glass member in an upright state, a method for manufacturing a plate-shaped glass member using the holding jig, and a sputtering apparatus including the holding jig.

Background Art

[0002] Conventionally, in a sputtering apparatus, a substrate holder, which is a kind of holding jig for holding a plate-shaped glass member in an upright state, is disposed on the front surface of a mounting member composed of a flat plate-shaped electrode provided in a vacuum chamber, and sputtering is performed on the surface of the glass member held by the substrate holder. A method for manufacturing a plate-shaped glass member is known (see, for example, Patent Document 1).

[0003] In addition, as a holding jig for holding a plate-shaped glass member, a configuration having a groove and holding the glass member so as to be sandwiched between both side surfaces of the groove is known (see, for example, Patent Document 2).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the prior art, in order for the holding jig for holding to securely hold the glass member, the size of the holding jig becomes large, resulting in a shaded portion of the holding jig. It was difficult to apply a film to the shaded portion of the holding jig, and there was a possibility that a portion that could not exhibit the desired optical characteristics of the glass member would be formed. Further, in the prior art, play was provided in the groove of the holding jig for holding in consideration of the workability of taking in and out the glass member. In this case, due to the provision of play, the glass member may move within the play, increasing the possibility of variations in optical characteristics and film formation defects due to dust adhesion.

[0006] The present invention has been made in view of such current problems, and an object thereof is to provide a holding jig that facilitates the insertion and removal of a glass member and can suppress the movement of the glass member when the glass member is held, a manufacturing method of a plate-shaped glass member using the holding jig, and a sputtering apparatus including the holding jig.

Means for Solving the Problems

[0007] The problems to be solved by the present invention are as described above. Next, means for solving these problems will be described.

[0008] The holding jig according to Embodiment 1 of the present invention is a holding jig that holds the plate-shaped glass member in an upright state when the glass member is vertically conveyed, an upper holding member that holds the upper portion of the glass member, and a lower holding member that holds the upper portion of the glass member, and the upper holding member has a pressing member that can swing in the front-rear direction and a block disposed on the rear side of the pressing member, and when holding the upper portion of the glass member, the glass member is held between the pressing member and the block.

[0009] According to such a configuration, by setting the glass member with the pressing member opened to the front side, it becomes easier to arrange the glass member, and by sandwiching it with the block in a state where the pressing member is closed to the rear side, it is possible to support the glass member while preventing its movement.

[0010] Further, in the holding jig of Mode 2, in Mode 1, it is preferable that the lower holding member has a support member swingable in the front-rear direction and a block disposed on the rear side of the support member.

[0011] According to such a configuration, by arranging the glass member with the support member swung to the front side, it becomes easier to arrange the glass member, and by sandwiching it with the block in a state where the glass member is swung to the rear side, it is possible to support the glass member while preventing its movement.

[0012] Further, in the holding jig of Mode 3, in Mode 2, it is preferable that the support member has a support groove having a U-shaped cross section.

[0013] According to such a configuration, by inserting the glass member into the U-shaped support groove with the support member swung to the front side, it becomes easier to arrange the glass member.

[0014] Further, in the holding jig of Mode 4, in any one of Modes 1 to 3, it is preferable to have a biasing member that biases the pressing member rearward.

[0015] According to such a configuration, by biasing the pressing member rearward, it is possible to support the glass member while preventing its movement by sandwiching it with the block in a state where the glass member is swung to the rear side.

[0016] Further, in the manufacturing method of the glass member of Mode 5, it is a manufacturing method of the glass member using the holding jig of any one of Modes 1 to 4, and when the plate-shaped glass member is conveyed in-line, the glass member is held in an upright state using the holding jig. It includes a film-forming step of forming a film on the plate-shaped glass member in the upright state by sputtering.

[0017] According to such a configuration, when the glass member is conveyed in-line, it can be supported while preventing the movement of the glass member. Further, since the plate-shaped glass substrate can be firmly held in the upright state, a film can be uniformly formed on the plate-shaped glass substrate.

[0018] Further, the sputtering apparatus of Embodiment 6 is a sputtering apparatus including a holding jig of any one of Embodiments 1 to 4, which includes a conveying conveyor for conveying the plate-shaped glass member in one direction.

[0019] According to such a configuration, during conveyance by the conveying conveyor that conveys in one direction, the glass member can be supported while preventing its movement.

Advantages of the Invention

[0020] As an effect of the present invention, the following effects are achieved.

[0021] According to the holding jig according to the present invention, the manufacturing method of the plate-shaped glass member using the holding jig, and the sputtering apparatus including the holding jig, it is easy to take in and out the glass member, and when the glass member is held, the movement of the glass member can be suppressed.

Brief Description of the Drawings

[0022]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0023] Next, embodiments of the invention will be described. In each of the drawings referred to in the embodiments and the like, members having substantially the same function will be referred to by the same reference numerals. Also, the drawings referred to in the embodiments and the like are schematically described.

[0024] The method for manufacturing a plate-shaped glass member of the present invention is a method for manufacturing a film-coated substrate G having a thin film (functional film) Gb formed on the surface of the plate-shaped glass member.

[0025] Here, the plate-shaped glass member is, for example, a substrate Ga. For the substrate Ga, for example, a glass substrate typified by a flat panel display (FPD) such as a liquid crystal display, a plasma display, or an organic EL display, an image sensor, a cover glass for a portable electronic device, or the like can be adopted. Also, the shape of the substrate Ga is not particularly limited, such as a disk shape, a rectangular plate shape, a polygonal shape, or a shape that is curved as a whole. However, the substrate Ga in the present embodiment is a rectangular member.

[0026] Note that the material of the substrate Ga is not limited to the present embodiment, and for example, ceramics, resin, or the like may be adopted.

[0027] Also, for the functional film Gb formed on the main surface Ga1 of the substrate Ga, for example, an antireflection film for reducing the reflectance, a half mirror film, or a reflective film for increasing the reflectance, a single-layer film composed of a single film-forming material, a multilayer film composed of a plurality of film-forming materials, or the like may be used. Alternatively, it may be a single-layer film having other functions, such as a transparent conductive film, an antistatic film, an electromagnetic wave shielding film, a heat ray shielding film, and an antifouling film.

[0028] Regarding these antireflection films, half mirror films, and reflection films, for example, they are generally formed as dielectric multilayer films in which a low refractive index film having a relatively low refractive index and a high refractive index film having a relatively high refractive index are alternately laminated.

[0029] The manufacturing method of the substrate G with a film includes a film forming step using a sputtering apparatus provided with a holding jig.

[0030] In the film forming step, a film (not shown) such as a near-infrared cut film or an antireflection film is formed on the main surface Ga1 of the substrate Ga by a vacuum evaporation method or a sputtering method. After the necessary film formation is completed, the substrate Ga with the functional film Gb is washed and dried. Thereby, the substrate G with a film is completed.

[0031] In the present embodiment, in the film forming step, the sputtering method is used. Here, the sputtering apparatus 1 used in the sputtering method will be described with reference to FIG. 1.

[0032] The sputtering apparatus 1 in the present embodiment is an apparatus for manufacturing a substrate G with a film having a thin film (functional film) Gb by forming a film forming material on the main surface Ga1 of the substrate Ga conveyed in a predetermined direction (the direction of arrow A in the figure) by sputtering using the magnetron method.

[0033] The substrate Ga is conveyed in a predetermined direction (the direction of arrow A) while being held together by a plurality of (four in the present embodiment) holding jigs 101.

[0034] The sputtering apparatus 1 mainly includes a vacuum chamber 2 that functions as a film forming chamber capable of maintaining a vacuum state inside, and a cathode unit 3 that serves as an electrode for depositing a film forming material on the main surface Ga1 of the substrate Ga introduced into the vacuum chamber 2.

[0035] The vacuum chamber 2 is configured in a hollow box shape made of members such as stainless steel or aluminum, and inside thereof, a conveying means (not shown) for conveying the substrate Ga in a predetermined direction (the direction of arrow A) is arranged.

[0036] Here, the sputtering apparatus 1 in the present embodiment is of an in-line type, and as the above-described conveying means, a conveying conveyor or the like for conveying the substrate Ga in one direction can be adopted.

[0037] Note that the substrate Ga passes through a position (hereinafter, appropriately referred to as "opposing position P1") where it is in an opposed state with respect to at least the target plate 31 of the cathode unit 3 described later by the above-described conveying means, and is conveyed such that the conveying direction at the opposing position P1 is a predetermined direction (the direction of arrow A). The substrate Ga is conveyed in one direction by the above-described conveying means (conveying conveyor) so as to pass through the opposing position P1 along the predetermined direction (the direction of arrow A).

[0038] The vacuum chamber 2 includes a pressure reducing means 21 for reducing the atmosphere inside the vacuum chamber 2 to a vacuum state, a sputtering gas supply means 22 for introducing a sputtering gas into the inside, and the like.

[0039] The pressure reducing means 21 is composed of, for example, a vacuum pump 21a such as a cryopump and piping members 21b, etc., and the vacuum pump 21a is in communication with the inside of the vacuum chamber 2 via the piping member 21b.

[0040] Then, when the vacuum pump 21a operates, the air inside the vacuum chamber 2 is exhausted (pressure reduced) via the piping member 21b, and the atmosphere inside is changed to a predetermined vacuum state.

[0041] The sputtering gas supply means 22 includes an Ar gas cylinder 22a which is a supply source of a sputtering gas for discharge composed of Ar gas, and an oxygen gas cylinder 22b which is a supply source of a reactive gas composed of oxygen gas. These Ar gas cylinders 22a and oxygen gas cylinders 22b are connected in parallel to each other via piping members 22c and the like and communicate with the inside of the vacuum chamber 2. Also, in the piping member 22c, mass flow controllers 22d, 22d are provided near the Ar gas cylinder 22a and the oxygen gas cylinder 22b so that the introduction flow rates (the flow rates introduced into the inside of the vacuum chamber 2) of these gas cylinders 22a, 22b can be individually adjusted, and a gas introduction nozzle 22e is provided at the end on the inside of the vacuum chamber 2.

[0042] Then, after the atmosphere inside the vacuum chamber 2 is shifted to a predetermined vacuum state by the above-described decompression means 21, the respective mass flow controllers 22d, 22d are controlled, and Ar gas and oxygen gas at a predetermined flow rate are introduced into the inside of the vacuum chamber 2 through the gas introduction nozzle 22e. Thereby, the inside of the vacuum chamber 2 is filled with Ar gas at a predetermined concentration and set to a predetermined degree of vacuum.

[0043] The cathode unit 3 is arranged in a direction orthogonal to a predetermined direction (the direction of arrow A) at the facing position P1.

[0044] On the other hand, the substrate Ga is held in advance by a holding jig 101 in a state of standing upright in the above-described orthogonal direction (see FIG. 2), and these substrates Ga are conveyed together with the holding jig 101 in a predetermined direction (the direction of arrow A) and pass through the facing position P1.

[0045] In the sputtering apparatus 1 having such a configuration, the film formation process on the main surface Ga1 of the substrate Ga is carried out according to the following procedure.

[0046] That is, first, in the decompression means 21, the vacuum pump 21a is in an operating state, and the atmosphere inside the vacuum chamber 2 is in a predetermined vacuum state. Also, through the gas introduction nozzle 22e of the sputtering gas supply means 22, a predetermined flow rate of Ar gas and oxygen gas has already been introduced into the interior of the vacuum chamber 2, and the interior is filled with Ar gas at a predetermined concentration and is in a state set to a predetermined degree of vacuum. Furthermore, the cathode unit 3 is in a state where no voltage has been applied yet.

[0047] In the sputtering apparatus 1 in such a state, when the substrate Ga held by the holding jig 101 is introduced into the interior of the vacuum chamber 2, a predetermined voltage is applied to the cathode unit 3 respectively, and the film formation process is started.

[0048] When the film formation process is started, the substrate Ga is conveyed in a predetermined direction (the direction of arrow A) by the above-described conveying means together with the holding jig 101. The substrate Ga conveyed by the above-described conveying means then passes through the opposing position P1. Thereafter, until the film thickness of the film-forming material formed on the main surface Ga1 of the substrate Ga reaches a predetermined thickness, it is continuously conveyed by the above-described conveying means and repeatedly passes through the opposing position P1. And when the film thickness of the film-forming material formed on the main surface Ga1 of the substrate Ga reaches a predetermined thickness and the film-attached substrate G having the functional film Gb is produced, the film formation process in the sputtering apparatus 1 ends, and the application of voltage to the cathode unit 3 stops.

[0049] Next, when the substrate Ga is conveyed in-line, the holding jig 101 for holding the substrate Ga in an upright state will be described with reference to FIGS. 2 to 6. The holding jig 101 includes an upper holding member 111 that holds the upper part of the substrate Ga and a lower holding member 112 that holds the upper part of the substrate Ga. The upper holding member 111 and the lower holding member are formed of a resin having heat resistance. By being formed of a resin having heat resistance, it is possible to prevent the holding jig from being damaged even in an atmosphere heated up to 150°C.

[0050] As shown in Figures 3 and 4, the upper holding member 111 is a member that holds the upper edge of the rectangular substrate Ga, and has a pressing member 121 that can swing in the front-to-back direction, a block 122 arranged on the rear side of the pressing member 121, and a biasing member 123 that biases the pressing member 121 in the rear direction. When the upper part of the substrate Ga is held, the substrate Ga is held between the pressing member 121 and the block 122 .

[0051] The holding member 121 is fixed to a biasing member 123 fixed to the upper end of the holding jig 101. The holding member 121 is formed in a plate shape, and has a substrate contact portion 121a at its lower portion. The block 122 is a member that comes into contact with the rear surface of the substrate Ga when the substrate Ga is in an upright position. The block 122 is disposed below the holding member 121 and is a massive member that has at least a flat contact surface 122a on its front surface.

[0052] The biasing member 123 is a hinge-shaped torsion spring, one end of which is fixed to the upper end of the holding jig 101 and the other end of which is fixed to the rear surface of the pressing member 121. More specifically, the other end of the biasing member 123 is fixed to the upper part of the pressing member 121, and when the pressing member 121 is pushed rearward against the biasing force, the upper part of the pressing member 121 swings rearward beyond the center of the biasing member 123, and the lower part of the pressing member 121 swings forward beyond the center of the biasing member 123.

[0053] 5 and 6, the lower holding member 112 has a support member 125 that is swingable in the front-rear direction, a block 126 arranged on the rear side of the support member 125, and a hinge member 127 that swingably supports the support member 125. The lower holding member 112 is a member that holds the lower side of the rectangular substrate Ga, and two lower holding members 112 are provided on both the left and right sides.

[0054] The support member 125 has a support groove 125a that is U-shaped in cross section. The support groove 125a is a groove for holding a glass plate material at the front and rear surfaces. The support groove 125a is inclined so that the front-to-rear width direction decreases toward the bottom. The width direction length at the bottom of the support groove 125a is formed to be the same as the thickness of the substrate Ga or 1.1 times or less.

[0055] The block 126 is a member that comes into contact with the rear surface of the substrate Ga when the substrate Ga is in an upright position. The block 126 is disposed above the support member 125 and is a massive member that has at least a flat contact surface 126a on its front surface.

[0056] Furthermore, the hinge member 127 is a member that supports the support member 125 so as to be swingable in the front-rear direction. One end of the hinge member 127 is fixed to the lower end of the holding jig 101, and the other end is fixed to the rear surface of the support member 125. Note that the center of gravity of the support member 125 when the substrate Ga is supported in an upright state is located rearward of the rotation center of the hinge member 127, and when the substrate Ga is supported in an upright state, the support member 125 is less likely to swing forward.

[0057] Next, a method for setting the substrate Ga in an upright position using the holding jig 101 will be described with reference to FIGS.

[0058] When mounting the substrate Ga on the holding jig 101, the support member 125 is swung forward to insert the lower end of the substrate Ga into the support groove as shown in Fig. 5. The substrate Ga is fixed in a state inclined forward. At this time, the lower part of the pressing member 121 is swung forward as shown in Fig. 3.

[0059] 6, with the substrate Ga inserted, the support member 125 is moved backward to place the substrate Ga in an upright position. At this time, the center of gravity of the substrate Ga and the support member 125 is located rearward of the rotation center of the hinge member 127, so that the substrate Ga is unlikely to tilt forward again.

[0060] As shown in FIG. 4, the upper end of the substrate Ga in the upright state is held by the holding member 121. Due to the biasing force that causes the holding member 121 to swing backward, the upper end of the substrate Ga is clamped between the holding member 121 and the block 122.

[0061] With this configuration, when setting the substrate Ga on the holding jig 101, it can be easily set by swinging the upper holding member 121. Also, when the substrate Ga is held by the holding jig 101, the movement of the substrate Ga can be suppressed by the holding jig 101. The lower end portion of the substrate Ga is supported by the support groove 125a of the support member 125 so as not to move in the front-rear direction, and the upper end portion of the substrate Ga is clamped by the holding member 121 and the block 122 due to the biasing force of the holding member 121.

[0062] As described above, in the holding jig 101 in the present embodiment, when in-line transporting the substrate Ga, which is a plate-shaped glass member, it is a holding jig 101 that holds the substrate Ga in an upright state, and includes an upper holding member 111 that holds the upper part of the substrate Ga and a lower holding member 112 that holds the lower part of the substrate Ga. The upper holding member 111 has a holding member 121 that can swing in the front-rear direction and a block 122 disposed on the rear side of the holding member 121. When holding the upper part of the substrate Ga, the substrate Ga is held between the holding member 121 and the block 122. With this configuration, by setting the substrate Ga with the holding member 121 opened to the front side, it becomes easier to arrange the substrate Ga, and by clamping it with the block 122 with the holding member 121 closed to the rear side, it can be supported while preventing the movement of the substrate Ga.

[0063] Also, it is preferable that the lower holding member 112 has a support member 125 that can swing in the front-rear direction and a block 126 disposed on the rear side of the support member 125. By configuring in this way, by arranging the substrate Ga in a state where the support member 125 is swung forward, it becomes easier to arrange the substrate Ga. Also, by sandwiching the substrate Ga with the block 126 in a state where the support member 125 is swung backward, it is possible to support the substrate Ga while preventing its movement.

[0064] Also, it is preferable that the support member 125 has a support groove 125a with a U-shaped cross-section in a sectional view. By configuring in this way, by inserting the substrate Ga into the U-shaped support groove 125a in a state where the support member 125 is swung forward, it becomes easier to arrange the substrate Ga.

[0065] Also, it is preferable to have a biasing member 123 that biases the pressing member 121 backward. By configuring in this way, by biasing the pressing member 121 backward, it is possible to support the glass member while preventing its movement by sandwiching it with the block 122 in a state where the substrate Ga is swung backward.

[0066] Also, in the method for manufacturing a glass article in this embodiment, when the substrate Ga is in-line conveyed, a film forming step of holding the substrate Ga in an upright state using the holding jig 101 and forming a functional film Gb on the upright substrate Ga by sputtering is provided. By configuring in this way, when the substrate Ga is in-line conveyed, it is possible to support the substrate Ga while preventing its movement. Also, since the substrate Ga can be firmly held in an upright state, a film can be uniformly formed on the substrate Ga.

[0067] Also, the sputtering apparatus 1 in this embodiment includes a conveyance conveyor that conveys the substrate Ga in one direction. By configuring in this way, when conveying by the conveyance conveyor that conveys in one direction, it is possible to support the substrate Ga while preventing its movement.

Explanation of Reference Numerals

[0068] 1 Sputtering apparatus 101 Holding jig 111 Upper holding member 112 Lower holding member 121 Pressing member 122 Block 123 Biasing member 125 Support member 125a Support groove 126 Block 127 Hinge member G Substrate with film Ga Substrate (plate - like glass member) Gb Functional film (thin film)

Claims

1. A holding jig for holding a plate-shaped glass member in an upright state when the plate-shaped glass member is conveyed in-line, comprising an upper holding member for holding the upper part of the glass member, and a lower holding member for holding the lower part of the glass member. The upper holding member has a pressing member swingable in the front-rear direction and a block disposed on the rear side of the pressing member, and holds the glass member between the pressing member and the block when holding the upper part of the glass member. Holding jig.

2. The lower holding member has a support member swingable in the front-rear direction and a block disposed on the rear side of the support member. The holding jig according to claim 1.

3. The support member has a support groove having a U-shaped cross section in a sectional view. The holding jig according to claim 2.

4. having a biasing member for biasing the pressing member rearward. The holding jig according to claim 1.

5. In a method for manufacturing a plate-shaped glass member using the holding jig according to any one of claims 1 to 4, when the plate-shaped glass member is conveyed in-line, the glass member is held in an upright state using the holding jig, and a film forming step of forming a film on the plate-shaped glass member in an upright state by sputtering is provided. Method for manufacturing a plate-shaped glass member.

6. A sputtering apparatus comprising the holding jig according to any one of claims 1 to 4, and comprising a conveying conveyor for conveying the plate-shaped glass member in one direction. Sputtering apparatus.

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