Substrate unit and imaging apparatus

Abstract

To provide a compact imaging apparatus capable of performing high function processing.SOLUTION: A substrate unit (11) includes a first substrate (13), a second substrate (14), and a holding member (15) for holding the first substrate and the second substrate. The first substrate and the second substrate are laminated in a predetermined direction by using the holding member. In the first substrate, a first electronic component (134) is arranged in a first surface and a second electronic component (133) electrically connected to the first electronic component is arranged in a second surface opposite to the first surface. A first connection member (143) which can be connected from the outside is arranged in the second substrate. The second substrate is arranged so as to face the second electronic component and fixed to the first substrate together with the holding member. In the first substrate, a second connection member (132) which can be electrically connected to the second substrate is arranged in the second surface.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a substrate unit and an imaging device.

Background Art

[0002] In recent years, with the spread of video viewing applications and video distribution services, the demand for imaging devices capable of shooting high-quality videos has been increasing. Therefore, a high-performance video processing IC is mounted on the control board inside the imaging device to realize suppression of imaging noise and improvement of resolution.

[0003] Patent Document 1 discloses a configuration in which a bypass capacitor is mounted in the vicinity of a video processing IC. Patent Document 2 discloses a configuration in which a video processing IC is mounted on one surface of a control board, and a card connector to which a non-volatile memory card such as an SD card is detachable is mounted on the other surface on the opposite side.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, with the configurations disclosed in Patent Document 1 and Patent Document 2, it is not possible to realize a substrate unit that enables small-sized and high-performance processing.

[0006] Therefore, the present invention can provide a substrate unit capable of small-sized and high-functional processing.

Means for Solving the Problems

[0007] As one aspect of the present invention, a substrate unit includes a first substrate, a second substrate, and a holding member that holds the first substrate and the second substrate. The first substrate and the second substrate are laminated in a predetermined direction using the holding member. On the first substrate, a first electronic component is disposed on a first surface, and a second electronic component electrically connected to the first electronic component is disposed on a second surface opposite to the first surface. On the second substrate, a first connection member connectable from the outside is disposed. The second substrate is disposed so as to face the second electronic component and is fixed to the first substrate together with the holding member. On the first substrate, a second connection member electrically connectable to the second substrate is disposed on the second surface.

[0008] Other objects and features of the present invention will be described in the following embodiments.

Effects of the Invention

[0009] According to the present invention, it is possible to provide a substrate unit capable of small-sized and high-functional processing.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Embodiments for Carrying Out the Invention

[0011] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that the embodiments described below are examples of means for realizing the present invention, and may be appropriately modified or changed depending on the configuration of the device to which the present invention is applied and various conditions. Also, the embodiments can be combined as appropriate.

[0012] First, referring to FIG. 1, the imaging device 100 in the present embodiment will be described. FIG. 1 is a block diagram of the imaging device 100. The optical system (imaging optical system) of the imaging device 100 includes a lens 901 and a shutter 902 having an aperture function. The imaging unit 903 includes an imaging element such as a CCD (Charge Coupled Device) sensor or a CMOS (Complementary Metal Oxide Semiconductor) sensor. The imaging unit 903 converts the optical image (subject image) formed by the optical system into an electrical signal.

[0013] The A / D conversion unit 904 is used when converting the analog signal output from the imaging unit 903 into a digital signal and when converting the analog signal output from the audio control unit 905 into a digital signal. The lens barrier 906 covers the imaging unit 903 including the lens 901 of the imaging device 100 to reduce their contamination and damage. The timing generation unit 907 is controlled by the memory control unit 908 and the system control unit 909, and supplies a clock signal and a control signal to the imaging unit 903, the audio control unit 905, the A / D conversion unit 904, and the D / A conversion unit 910.

[0014] The image processing unit 911 performs resizing processes such as predetermined pixel interpolation and reduction, and color conversion processes on the output data from the A / D conversion unit 904 and the data stored in the memory 912. Also, the image processing unit 911 performs a predetermined operation on the captured image data, and based on the obtained operation result, the system control unit 909 performs exposure control and distance measurement control. As a result, AF (Auto Focus) processing, AE (Automatic Exposure) processing, and EF (Flash Pre-Firing) processing in the TTL (Through-The-Lens) method are performed. Further, the image processing unit 911 performs a predetermined arithmetic processing using the captured image data, and also performs AWB (Auto White Balance) processing in the TTL method based on the obtained arithmetic result.

[0015] The output data from the A / D conversion unit 904 is written into the memory 912 via the image processing unit 911 and the memory control unit 908, or directly via the memory control unit 908. The memory 912 stores voice data recorded by the microphone 913, still images and moving images taken, and information attached to the image such as a file header when constituting an image file. The memory 912 has a storage capacity sufficient to store a predetermined number of still images, a moving image for a predetermined time, and voice.

[0016] The compression / decompression unit 914 compresses and decompresses image data by adaptive discrete cosine transform (ADCT) or the like. It reads the captured image stored in the memory 912 triggered by the shutter 902, performs compression processing, and writes the processed data into the memory 912. Also, the compression / decompression unit 914 reads the compressed image read from the memory 912 from a recording unit 915 including a recording medium, performs decompression processing, and writes the processed data into the memory 912. The image data written into the memory 912 by the compression / decompression unit 914 is filed in the file processing unit of the system control unit 909 and recorded in the recording unit 915 via the recording medium I / F 916. Also, the memory 912 also serves as a memory for image display, and the image data for display written into the memory 912 is displayed by the image display unit 917 via the D / A conversion unit 910.

[0017] The audio signal output from the microphone 913 is converted into a digital signal in the A / D conversion unit 904 via the audio control unit 905 composed of an amplifier and the like, and then stored in the memory 912 by the memory control unit 908. On the other hand, the audio data recorded in the recording unit 915 is read into the memory 912, and then the signal processed in the audio control unit 905 via the D / A conversion unit 910 is emitted by the speaker 918.

[0018] The system control unit 909 controls the entire imaging device 100. The system memory 919 stores constants, variables, programs, etc. for the operation of the system control unit 909. The non-volatile memory 920 is electrically erasable and recordable, and for example, an EEPROM or the like is used.

[0019] The shutter switch (SW1), shutter switch (SW2), and operation unit 921 are operation means for the user to input various operation instructions to the system control unit 909. The mode switching switch 922 is used by the user to switch the operation mode of the system control unit 909 to a still image shooting mode, continuous shooting (burst shooting) mode, video mode, playback mode, etc. The shutter switch (SW1) turns ON during the operation (half press) of the shutter button 923 provided on the imaging device 100. Then, it instructs the start of operations such as AF (auto focus) processing, AE (auto exposure) processing, AWB (auto white balance) processing, EF (flash pre-emission) processing, etc. The shutter switch (SW2) turns ON when the operation of the shutter button 923 is completed (fully pressed), and instructs the start of a series of imaging processes from the signal reading from the imaging unit 903 to writing the image data to the recording unit 915.

[0020] The operation unit 921 includes various buttons and a touch panel, etc. Specifically, the operation unit 921 includes, for example, an erase button, a menu button, a SET button, and a four-way key arranged in a cross shape. When the menu button is pressed, a menu screen enabling various settings is displayed on the image display unit 917. The user can intuitively perform various settings using the menu screen displayed on the image display unit 917 and the operation unit 921. Also, it is possible to detect the contact of the user's finger or pen with the image display unit 917 and determine the icons displayed on the image display unit 917 in the same way as the operation of switches such as buttons and dials or dials. Further, by using an operation member capable of detecting rotation such as a jog dial, it may be configured to perform the same operation as a two-way key.

[0021] The power button 924 switches the power on and off of the imaging device 100. The power control unit 925 is composed of a battery detection circuit, a DC-DC converter, a switch circuit for switching the circuit blocks to be energized, etc., and detects the presence or absence of battery attachment, the type of battery, and the remaining battery level. Also, based on the detection result and the instruction of the system control unit 909, it controls the DC-DC converter and supplies the necessary voltage to each unit including the recording unit 915 for the necessary period.

[0022] The power supply unit 926 consists of primary batteries such as alkaline batteries and lithium batteries, secondary batteries such as NiCd batteries, NiMH batteries, and Li-ion batteries, and AC adapters. The power supply unit 926 and the power control unit 925 are connected by a power connector on the camera side. The RTC 927 (Real Time Clock) holds a power supply unit internally separately from the power control unit 925 and continues to keep time even when the power supply unit 926 is off. The system control unit 909 performs timer control using the date and time acquired from the RTC 927 at startup. The recording medium attachment / detachment detection unit 928 detects whether the recording unit 915 is mounted in the recording medium slot. The communication unit 929 performs various communication processes such as RS232C, USB, IEEE1394, P1284, SCSI, modem, LAN, and wireless communication. Further, the imaging device 100 is configured to be capable of wireless communication with other devices (external devices) using the antenna 930 and the communication unit 929. The fan 931 is controlled (rotated / stopped and rotation speed) by the system control unit 909.

[0023] Next, with reference to FIG. 2, the outline of the internal configuration of the imaging device 100 will be described. FIG. 2 is an exploded perspective view showing a part of the internal configuration of the imaging device 100. Here, the detailed description of the overall structure of the imaging device 100 is omitted, and only the parts required for the description of the present embodiment will be described in detail.

[0024] The imaging device 100 is configured by arranging the lens barrel 20 and the battery box unit 10 adjacent to each other between the front cover 30 and the chassis 50. The battery box unit 10 has a control board (first board) 13. A connector 131 is mounted on the control board 13.

[0025] The lens barrel 20 is pre-assembled with flexible substrates 21 and 22. By connecting the flexible substrates 21 and 22 to the connector 131 respectively, the control board 13 and the lens barrel 20 are electrically connected. Also, the battery box unit 10 has an I / F cable connector (external interface connector) 136 to which an external I / F (interface) cable can be attached. The imaging device 100 has a side cover 40 disposed on the side surface of the housing, and the I / F cable connector 136 is exposed from an opening formed in the side cover 40, and an external I / F cable can be attached through this opening.

[0026] Next, with reference to FIGS. 3(a) and 3(b), the details of the battery box unit 10 will be described. FIG. 3(a) is a perspective view of the battery box unit 10. FIG. 3(b) is an exploded perspective view of the battery box unit 10.

[0027] The battery box unit 10 mainly includes a board unit (stacked unit) 11 and a battery box (housing structure) 12. The details of the configuration of the board unit 11 will be described later. The battery box 12 is provided with a battery chamber capable of accommodating a battery (not shown). Also, as described above, the battery box 12 mounts the I / F cable connector 136 to which an external I / F cable can be attached, and a flexible board or the like on which the I / F cable connector 136 is mounted. The board unit 11 is fixed and held to the battery box 12 by screws 17. After fixing the board unit 11 to the battery box 12, the battery box unit 10 is completed by performing a wiring operation of the above-described flexible board or the like to the board unit 11.

[0028] The battery box 12 supplies power to an external device connected via, for example, an external I / F cable according to the specifications of the imaging device 100. When charging is performed from an external power source via the external I / F cable, the battery box 12 may have a substrate on which electric circuits related to charging and power supply are mounted. The battery box 12 may also have a wireless electric circuit module and a wireless antenna module that perform wireless communication with an external device. Regarding these respective members, after fixing the substrate unit 11 to the battery box 12, wiring work is performed on the substrate unit 11 to be electrically connected to the substrate unit 11.

[0029] Next, with reference to FIGS. 4(a) and 4(b), details of the configuration of the substrate unit 11 will be described. FIGS. 4(a) and 4(b) are exploded perspective views of the substrate unit 11, and FIG. 4(a) and FIG. 4(b) show views seen from opposite directions.

[0030] The substrate unit 11 mainly includes a control substrate (first substrate) 13, a card media substrate (second substrate) 14, a holder (holding member) 15, and a flexible substrate 16. The control substrate 13 mounts a video processing IC (control circuit component, first electronic component) 134 and a memory 135. The video processing IC 134 has functions such as a system control unit 909, an image processing unit 911, and a memory control unit 908 (see FIG. 1). The memory 135 corresponds to the memory 912 shown in FIG. 1.

[0031] On the surface (second surface) of the control substrate 13 opposite to the plane (first surface) on which the video processing IC 134 is mounted, a plurality of electronic components (second electronic components) 133 are mounted. The electronic components 133 include passive elements such as ceramic capacitors and chip resistors, and include, for example, a bypass capacitor (for the power supply supplied to the video processing IC 134) electrically connected to the power supply terminal of the video processing IC 134. In the present embodiment, when viewed from a predetermined direction (Z-axis direction), at least a part of the electronic components 133 is arranged so as to overlap the outer shape of the video processing IC 134.

[0032] On the control board 13, on the surface (the second surface) where the electronic component 133 is mounted, a connector (the second connection member) 132 that can be electrically connected to the card media board 14 is mounted. The connector 132 has a structure of a board-to-board connector (the first board-to-board connector) and is configured to be electrically connectable to the flexible board 16.

[0033] The card media board 14 is a single-sided mounting board on which electronic components are mounted on only one side of the front and back board surfaces. The side of the card media board 14 facing the control board 13 is the non-mounted surface (the fourth surface), and the opposite side is the mounted surface (the third surface). On the mounted surface, a card connector (the first connection member that can be connected (accessed) from the outside) 143, a connector 141, etc. are mounted. That is, the card media board 14 has a surface (the third surface) on which at least one electronic component is mounted and a surface (the fourth surface) on the opposite side of the third surface where no electronic component is mounted, and the fourth surface and the electronic component 133 are arranged to face each other. In the present embodiment, when viewed in the Z-axis direction, at least a part of the video processing IC 134, the electronic component 133, and the card connector 143 are arranged so as to overlap each other.

[0034] The holder 15 further positions the control board 13 in a state of being partially fixed and held with the card media board 14 in advance, and fixes and holds the two boards of the control board 13 and the card media board 14 with the screw 17. That is, the holder 15 holds the control board 13 and the card media board 14, and the control board 13 and the card media board 14 are laminated in a predetermined direction (the Z-axis direction) using the holder 15. In the present embodiment, the card media board 14 is arranged to face the electronic component 133 and is fixed to the control board 13 together with the holder 15.

[0035] At both ends of the flexible substrate 16, connectors 161 and 162 are respectively mounted. Both connectors 161 and 162 have the structure of a board-to-board connector (second board-to-board connector). Connector 161 is configured to be engageable with connector 132, and connector 162 is configured to be engageable with connector 141. The control board 13 and the card media board 14 are electrically connected to each other via the flexible substrate 16. In the present embodiment, when viewed from the Z-axis direction, the flexible substrate 16 is disposed at a position that does not overlap with the card connector 143. Also in the present embodiment, a second board-to-board connector is disposed on the surface (fourth surface) of the card media board 14 on which no electronic components are mounted, and the first board-to-board connector is electrically connected to the second board-to-board connector.

[0036] The holder 15 has a plurality of receiving surfaces that can abut against the plane of the control board 13. The control board 13 and the card media board 14 are fixedly held by the holder 15 in a parallel posture. A plurality of openings 151 are formed in a part of the region of the holder 15 that faces the control board 13. When the control board 13 is aligned with the holder 15, among the electronic components mounted on the control board 13, the electronic components having a component height of a certain amount or more are configured to fit inside the openings 151. At least one of the plurality of electronic components disposed on the second surface of the control board 13 is disposed so as to be exposed from the openings 151. By configuring in this way, while maintaining the rigidity of the holder 15, it is possible to fixedly hold the control board 13 and the card media board 14 in proximity, and miniaturization (thinning) of the imaging device 100 can be realized.

[0037] The card media board 14 has an unmounted surface as the plane on the side facing the control board 13. Thereby, for the mounting component arrangement of the control board 13 configured with a relatively high component mounting density, the mounting components can be arranged without the need to consider collisions with the mounting components of the card media board 14. Also, while ensuring the design freedom of the control board 13, it contributes to ensuring the rigidity of the holder 15 and the close arrangement of the boards.

[0038] The flexible printed circuit board 16 that electrically connects the control board 13 and the card media board 14 forms a flexible portion between the connector 161 and the connector 162. When assembling the boards, when assembling them in the holder 15 in a state where the relative positional relationship between the connector 141 and the connector 132 has slightly changed due to misalignment between the boards or misalignment of component mounting.

[0039] Even if the relative positional relationship between the connector 141 and the connector 132 varies by a certain amount, the flexible portion of the flexible printed circuit board 16 can absorb the amount of variation and stably maintain an electrical connection. Here, the mounting surfaces of the connector 141 and the connector 132 are respectively the surfaces facing the subject side of the imaging device 100. Also, when aligning the boards via the holder 15, the outer shape of the card media board 14 and the connector 132 mounted on the control board 13 are arranged without overlapping each other. In this way, by adopting a configuration in which the step of assembling the boards into the battery box unit 10 is taken after assembling the boards into the holder 15 once, the flexible printed circuit board 16 can smoothly perform the connector fitting operations at both ends from one direction.

[0040] Also, the flexible printed circuit board 16 has a wiring path formed in a short path that covers a part of one surface of the control board 13 and the card media board 14 without any measures such as detouring of the wiring path or bending process, and is compactly laid out. By configuring the flexible printed circuit board 16 simply and compactly in this way, the transmission path for wiring inside the flexible printed circuit board 16 can be made short. Configuring the internal wiring transmission path of the flexible printed circuit board 16 compactly contributes to maintaining the signal quality because the wiring length can be made shorter when forming a high-speed transmission path between the card media board 14 and the control board 13.

[0041] Next, with reference to FIGS. 5(a) and 5(b), the joining structure between the card media substrate 14 and the holder 15 will be described. FIG. 5(a) is an exploded perspective view of the card media substrate 14 and the holder 15. FIG. 5(b) is a perspective view of the card media substrate 14 and the holder 15.

[0042] As described above, the holder 15 is configured to fixedly hold the control board 13 after being partially fixedly held to the card media substrate 14 in advance. A plurality of through holes 142 are formed in the card media substrate 14. A caulking shaft 152 is provided in the holder 15 at a position facing the through holes 142 in a state where the card media substrate 14 and the holder 15 are aligned. When the card media substrate 14 is aligned with the holder 15, the caulking shaft 152 is inserted into the through holes 142, and it is temporarily fixed using a jig and caulking processing is performed in this state.

[0043] The holder 15 is a molded part formed by resin molding, and the caulking shaft 152 is also integrally formed. By heating and pressurizing the caulking shaft 152 through caulking processing, a caulking fixing portion 153 can be formed around the through holes 142. The card media substrate 14 is fixedly held to the holder 15 by the caulking fixing portion 153. In caulking processing, generally, heat sources such as ultrasonic waves, infrared rays, or electricity are used, but fixing and holding may also be performed using other heat sources or processing methods.

[0044] Next, with reference to FIGS. 6(a) and 6(b), the arrangement of the mounting components mounted on the control board 13 and the card media substrate 14 will be described. FIGS. 6(a) and 6(b) are layout diagrams of the main components mounted on the control board 13 and the card media substrate 14 that constitute the substrate unit 11. FIG. 6(a) shows a plan view in the X-Y plane view. FIG. 6(b) is a cross-sectional view taken along line A-A in FIG. 6(a).

[0045] On the surface of the control board 13 where the electronic component 133 is mounted, an I / F cable connector 136 is mounted. The I / F cable connector 136 is, for example, a connector compatible with the HDMI (registered trademark) (High-Definition Multimedia Interface) standard or a connector compatible with the USB (Universal Serial Bus) standard.

[0046] The I / F cable connector 136 is mounted at the board end of the control board 13 and is mounted at a non-overlapping position with respect to the holder 15 that holds the control board 13 when viewed from a predetermined direction (in the X-Y plane view). Since the I / F cable connector 136 has a structure into which a cable plug can be fitted, it has a certain amount of component height. Therefore, the I / F cable connector 136 is mounted at a position that does not overlap with the holder 15 when viewed from the Z-axis direction. Also, in the projection view from the Y-axis direction, the I / F cable connector 136 is configured to partially overlap with the holder 15 in the Z-axis direction.

[0047] With such a configuration, the unit height of the board unit 11 can be suppressed. Also, the I / F cable connector 136 is mounted at a position that does not overlap with each of the card media board 14 and the card connector 143 when viewed from the Z-axis direction. On the other hand, when viewed from a direction orthogonal to the Z-axis direction (X-axis direction, horizontal direction), at least a part of the I / F cable connector 136, the card media board 14, and the card connector 143 are arranged so as to overlap each other. Therefore, the height of the board unit 11 can be suppressed.

[0048] Next, with reference to FIG. 7, the arrangement of each of the board unit 11, the battery box 12, and the lens barrel 20 (each unit component) in the imaging device 100 will be described. FIG. 7 is a cross-sectional view of each unit component in the imaging device 100.

[0049] As described above, the lens barrel 20 and the battery box unit 10 are arranged adjacent to each other in a direction (X-axis direction) orthogonal to the Z-axis. That is, when viewed from the direction (X-axis direction) orthogonal to the Z-axis direction, at least a part of the substrate unit 11 overlaps with the lens barrel 20.

[0050] The battery box 12 is configured such that the battery 60 can be accommodated therein. That is, inside the battery box unit 10, the control board 13 and the card media board 14 in the substrate unit 11 are held so as to overlap each other in the Z-axis direction.

[0051] When viewed from the Z-axis direction, the battery 60 is arranged to be stacked in the Z-axis direction together with the substrate unit 11 at a position partially overlapping the substrate unit 11. When viewed from the Y-axis direction (vertical direction), the lens barrel 20 and these members arranged in a stacked manner (stacked layout members) are arranged to overlap each other along the Z-axis direction.

[0052] In the imaging device 100, the battery box unit 10 undertakes part of the function of the gripping portion by which the user grips the imaging device 100. Therefore, the substrate and the battery are intensively arranged in the gripping portion of the imaging device 100, and when viewed from the Y-axis direction, the gripping portion is configured to overlap the lens barrel 20 along the Z-axis direction. With such a configuration, it becomes unnecessary to arrange a substrate or a fixing member of the substrate on the back surface portion of the lens barrel 20, and the imaging device 100 can be made thinner.

[0053] The control board 13 mounts a video processing IC 134, a memory 135, an audio control IC, a power supply IC, a motor driver IC for driving and controlling the lens barrel 20, and its peripheral elements. Therefore, the control board 13 is constituted by a fine wiring board using a manufacturing method such as a build-up board or a single-layer board.

[0054] On the one hand, by mounting the card connector 143 that occupies a large mounting area on the card media substrate 14, it is possible to secure a mounting area for mounting many ICs on the control substrate 13. Circuit blocks that require fine wiring are mounted on the control substrate 13, and large mounting components that occupy a mounting area are mounted on the card media substrate 14. As a result, the card media substrate 14 can adopt a substrate configured with a relatively simple layer structure such as a double-sided wiring substrate. Consequently, the manufacturing cost of the card media substrate 14 can be suppressed.

[0055] Next, with reference to FIG. 8, the heat dissipation structure in the imaging device 100 will be described. FIG. 8 is an exploded perspective view of the heat dissipation functional components of the imaging device 100. A large amount of current flows through the video processing IC 134 and the memory 135 mounted on the control substrate 13 due to image processing operations and memory control operations of the imaging device 100 and the like. As a result, heat is generated due to the electrical resistance in the video processing IC 134 and the memory 135 (electronic components). If the imaging device 100 continues to operate for a long time without taking measures against the heat generation of these electronic components, it may exceed the upper limit temperature at which the imaging device 100 operates normally, and the function may stop.

[0056] As a measure against heat generation in the video processing IC 134 and the memory 135, the imaging device 100 has a heat dissipation structure that combines a plurality of functional components. First, the imaging device 100 has a heat dissipation sheet (heat dissipation member) 70 that abuts against each of the video processing IC 134 and the memory 135 and transfers heat in the back direction (back side) of the imaging device 100. That is, the substrate unit 11 is fixed to the battery box 12 so that the video processing IC 134 faces the back side of the imaging device 100, and a heat dissipation sheet 70 for dissipating heat from the video processing IC 134 to the back side is arranged.

[0057] The heat dissipation sheet 70 has a certain amount of elasticity and is clamped and fixed between the heat dissipation plate 71 and each electronic component. The heat dissipation sheet 70 is a resin sheet having heat conductivity, and is formed by adding a filler having high heat conductivity to a resin sheet having a certain amount of flexibility with acrylic or silicone resin as the main agent. The heat dissipation plate 71 is made of a metal having high heat conductivity such as copper or aluminum.

[0058] Also, the imaging device 100 has a heat pipe 72. One end of the heat pipe 72 is joined and fixed to the heat dissipation plate 71. The other end of the heat pipe 72 is joined and fixed to the heat dissipation fin 73. Also, a fan motor 74 is disposed at a position adjacent to the heat dissipation fin 73. The fan motor 74 corresponds to the fan 931 in FIG. 1.

[0059] The heat pipe 72 is a heat conduction element that transports heat, has a tubular shape with a capillary structure on its inner wall, and is made of a metal such as copper or aluminum. A small amount of working fluid is enclosed inside the pipe and is enclosed in a reduced pressure state. If the video processing IC 134 or the memory 135 generates heat and the heat dissipation sheet 70 transfers the heat to one end of the heat dissipation plate 71 and the heat pipe 72, the working fluid easily evaporates due to the influence of the reduced pressure environment inside the pipe. The evaporated working fluid moves as a vapor flow to the other end of the unheated heat pipe 72. The vapor that has moved touches the inner wall of the low-temperature pipe and liquefies again. The working fluid that has returned to the liquid state returns to the region where it joins the heat dissipation plate 71 through the capillary structure.

[0060] When the imaging device 100 continues to be driven and the imaging processing IC 134 and the memory 135 continue to generate heat, the working fluid repeats the processes of evaporation, movement, and condensation to perform heat transport. The heat dissipation fins 73 are structures provided with a plurality of metal fins that secure a large surface area to improve the heat dissipation efficiency, and are mainly composed of a metal such as copper or aluminum. Several methods can be selected for the external shape processing method of the heat dissipation fins 73. For example, a method of forming by die-casting in which molten metal is injected into a mold, a method of forming by welding and joining metal fins to a thin plate material, or a method of forming metal fins continuously without welding by bending the thin plate material at regular intervals, etc. can be mentioned.

[0061] The fan motor 74 receives power supply and rotates the blades fixed to the rotating shaft to exhibit a blowing function. By arranging and driving the fan motor 74 at a position adjacent to the heat dissipation fins 73, the heated air staying around the heat dissipation fins 73 can be blown, and a decrease in heat dissipation efficiency can be reduced. The fan motor 74 can select a plurality of blowing structures according to the rotating shaft and the blowing direction. For example, a propeller fan in which the intake direction and the exhaust direction are linearly configured parallel to the rotating shaft, or a blower fan (sirocco fan) in which the intake direction is configured in a direction parallel to the rotating shaft and the exhaust duct is configured in a direction orthogonal to the intake direction, etc. can be mentioned.

[0062] The imaging device 100 uses the heat dissipation sheet 70, the heat dissipation plate 71, the heat pipe 72, the heat dissipation fins 73, and the fan motor 74 to form a heat dissipation structure for the electronic components that are heat sources. As a result, even when the imaging device 100 operates continuously for a long time, it becomes difficult for the operation to stop. The heat dissipation structure composed of these functional components is fixedly held by the battery box unit 10, the lens barrel 20, the chassis 50, and a plurality of screws 17.

[0063] As described above, inside the battery box unit 10, the control board 13 and the card media board 14 are stacked and arranged in the Z-axis direction, and the video processing IC 134 and the memory 135 are mounted on the back side of the imaging device 100. By configuring the battery box unit 10 and the board unit 11 in this way, the heat dissipation sheet 70 only needs to be attached to the package surfaces of the video processing IC 134 and the memory 135 from the back side, and the assembly can be simply performed.

[0064] Thereafter, since the heat sink 71 and the heat pipe 72 can also be easily attached from the back side, they are less likely to have a complicated shape and the processing of each member is easy. If the heat pipe 72 has a complicated shape, it becomes a resistance when the working fluid in the pipe travels through the capillary structure, and the heat dissipation characteristics may deteriorate. Therefore, the arrangement of the functional components of the imaging device 100 also contributes to maintaining the heat dissipation characteristics. Also, the I / F cable connector 136 mounted on the control board 13 is mounted on the surface facing the card media board 14 and is arranged so as not to overlap with the card media board 14 and the holder 15 when viewed from the Z-axis direction.

[0065] With such a configuration, while thinning the board unit 11, the height of the mounted components on the mounting surface of the video processing IC 134 of the control board 13 can be suppressed. Also, it is possible to reduce the occurrence of the heat dissipation sheet 70 and the heat sink 71 coming into contact with other high-profile components during assembly and being unable to achieve a close thermal bond with the heat source. Also, since a larger outer surface area of the heat dissipation sheet 70 and the heat sink 71 can be secured, it is possible to improve the heat dissipation function.

[0066] As described above, the preferred embodiments of the present invention have been described, but the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist thereof.

[0067] For example, in the present embodiment, the control board 13 and the card media board 14 are electrically connected using a flexible board 16, but it is also possible to replace them with a floating connector. That is, one of the first board-to-board connector or the second board-to-board connector may be a floating connector. A floating connector is a board-to-board connection connector in which the board mounting terminal portion forms a movable terminal structure (floating structure). When using a floating connector, first, one floating connector is mounted on the unmounted surface of the card media board 14. Then, a paired floating connector is also mounted on the opposing control board 13 that is aligned via the holder 15.

[0068] With such a configuration, the floating connector can be fitted together with the operation of assembling the control board 13 with respect to the card media board 14 and the holder 15 that are fixedly held in advance. Therefore, it is possible to reduce the number of parts and the man-hours for assembly.

[0069] Although the board unit 11 of the present embodiment has been described as being used in the imaging device 100, it is not limited thereto and can also be applied to optical devices or electronic devices other than imaging devices.

[0070] According to the configuration of the present embodiment, a high-function video processing IC can be mounted on an imaging device such as a compact digital camera without causing the imaging device to be enlarged. Therefore, according to the present embodiment, it is possible to provide a board unit and an imaging device that enable small-sized and high-function processing.

[0071] The disclosure of the present embodiment includes the following configurations. (Configuration 1) A first board, A second board, A holding member that holds the first board and the second board, and The first board and the second board are laminated in a predetermined direction using the holding member. On the first substrate, a first electronic component is arranged on the first surface, and a second electronic component electrically connected to the first electronic component is arranged on the second surface opposite to the first surface. On the second substrate, a first connection member connectable from the outside is arranged. The second substrate is arranged to face the second electronic component and is fixed to the first substrate together with the holding member. The substrate unit is characterized in that a second connection member electrically connectable to the second substrate is arranged on the second surface of the first substrate. (Configuration 2) The first substrate is a control substrate. The first electronic component is a control circuit component. The second electronic component is a passive element electrically connected to the control circuit component. The substrate unit according to Configuration 1, wherein the first connection member is a card connector. (Configuration 3) The passive element is a bypass capacitor for the power supply supplied to the control circuit component. The substrate unit according to Configuration 2, wherein at least a part of the passive element is arranged so as to overlap the outer shape of the control circuit component when viewed from the predetermined direction. (Configuration 4) The second substrate has a third surface on which at least one electronic component is mounted and a fourth surface opposite to the third surface on which no electronic component is mounted. The substrate unit according to Configuration 2 or 3, wherein the second substrate is arranged such that the fourth surface faces the passive element. (Configuration 5) An external interface connector is arranged on the second surface of the control substrate. The substrate unit according to any one of Configurations 2 to 4, wherein the holding member and the external interface connector are arranged so as not to overlap when viewed from the predetermined direction. (Configuration 6) The substrate unit according to Configuration 5, wherein when viewed from a direction orthogonal to the predetermined direction, at least a part of each of the external interface connector, the second substrate, and the card connector is arranged so as to overlap with each other. (Configuration 7) An opening is formed in a part of the region of the holding member that faces the control substrate, The substrate unit according to any one of Configurations 2 to 6, wherein at least one of the plurality of electronic components arranged on the second surface of the control substrate is arranged so as to be exposed from the opening. (Configuration 8) The substrate unit according to any one of Configurations 2 to 7, wherein when viewed from the predetermined direction, at least a part of each of the control circuit component, the passive element, and the card connector is arranged so as to overlap with each other. (Configuration 9) The substrate unit further includes a flexible substrate that electrically connects the control substrate and the second substrate, The substrate unit according to any one of Configurations 2 to 8, wherein when viewed from the predetermined direction, the flexible substrate is arranged at a position that does not overlap with the card connector and is fitted with the second connecting member. (Configuration 10) The second connecting member is a first board-to-board connector, A first board-to-board connector is arranged on the fourth surface of the second substrate on which no electronic component is mounted, The substrate unit according to any one of Configurations 2 to 9, wherein the first board-to-board connector is electrically connected to the second board-to-board connector. (Configuration 11) The substrate unit according to Configuration 10, wherein one of the first board-to-board connector and the second board-to-board connector is a floating connector. (Configuration 12) An imaging device comprising the substrate unit according to any one of Configurations 1 to 11 and an imaging element. (Configuration 13) The imaging device further includes a lens barrel, The imaging device according to Configuration 12, wherein at least a part of the substrate unit overlaps with the lens barrel when viewed from a direction orthogonal to the predetermined direction. (Configuration 14) The imaging device further includes a housing structure capable of accommodating a battery of the imaging device. The imaging device according to Configuration 12 or 13, wherein the substrate unit is fixed to the housing structure. (Configuration 15) The substrate unit is fixed to the housing structure such that the first electronic component faces the back side of the imaging device. The imaging device according to Configuration 14, wherein a heat radiating member for radiating heat from the first electronic component to the back side is provided.

Description of Reference Numerals

[0072] 11 Substrate unit (laminated unit) 13 Control board (first board) 14 Card media board (second board) 15 Holder (holding member) 132 Connector (second connection member) 133 Electronic component (passive element, second electronic component) 134 Video processing IC (control circuit component, first electronic component) 143 Card connector (first connection member)

Claims

1. a first substrate, a second substrate, and a holding member for holding the first substrate and the second substrate, wherein the first substrate and the second substrate are laminated in a predetermined direction using the holding member, wherein a first electronic component is disposed on a first surface of the first substrate, and a second electronic component electrically connected to the first electronic component is disposed on a second surface opposite to the first surface, wherein a first connection member connectable from the outside is disposed on the second substrate, wherein the second substrate is disposed so as to face the second electronic component and is fixed to the first substrate together with the holding member, wherein a second connection member electrically connectable to the second substrate is disposed on the second surface of the first substrate,

2. wherein the first substrate is a control substrate, wherein the first electronic component is a control circuit component, wherein the second electronic component is a passive element electrically connected to the control circuit component, wherein the first connection member is a card connector,

3. wherein the passive element is a bypass capacitor for a power supply supplied to the control circuit component, wherein at least a part of the passive element is disposed so as to overlap the outer shape of the control circuit component when viewed from the predetermined direction,

4. wherein the second substrate has a third surface on which at least one electronic component is mounted and a fourth surface opposite to the third surface on which no electronic component is mounted, wherein the second substrate is disposed so that the fourth surface faces the passive element,

5. wherein an external interface connector is disposed on the second surface of the control substrate, wherein the holding member and the external interface connector are disposed so as not to overlap when viewed from the predetermined direction,

6. wherein at least a part of each of the external interface connector, the second substrate, and the card connector overlaps with each other when viewed from a direction orthogonal to the predetermined direction,

7. wherein an opening is formed in a part of a region of the holding member facing the control substrate, The substrate unit according to claim 2, wherein at least one of the plurality of electronic components arranged on the second surface of the control substrate is arranged so as to be exposed from the opening.

8. The substrate unit according to claim 2, wherein when viewed from the predetermined direction, at least a part of each of the control circuit component, the passive element, and the card connector is arranged so as to overlap with each other.

9. The substrate unit further includes a flexible substrate that electrically connects the control substrate and the second substrate, The substrate unit according to claim 2, wherein when viewed from the predetermined direction, the flexible substrate is arranged at a position that does not overlap with the card connector and is fitted to the second connection member.

10. The second connection member is a first board-to-board connector, A second board-to-board connector is arranged on the fourth surface of the second substrate on which no electronic component is mounted, The substrate unit according to claim 2, wherein the first board-to-board connector is electrically connected to the second board-to-board connector.

11. The substrate unit according to claim 10, wherein one of the first board-to-board connector and the second board-to-board connector is a floating connector.

12. An imaging device, comprising the substrate unit according to any one of claims 1 to 11 and an imaging element.

13. The imaging device further includes a lens barrel, The imaging device according to claim 12, wherein when viewed from a direction orthogonal to the predetermined direction, at least a part of the substrate unit overlaps with the lens barrel.

14. The imaging device further includes a housing structure capable of accommodating a battery of the imaging device, The imaging device according to claim 12, wherein the substrate unit is fixed to the housing structure.

15. The substrate unit is fixed to the housing structure such that the first electronic component faces the back side of the imaging device, The imaging device according to claim 14, wherein a heat dissipation member for dissipating heat from the first electronic component to the back side is provided.

Images